docSICONNEX HEAdquArtErS
download 
Report Transcription
SICONNEX HEAdquArtErS
www.siconnex.com Customized solutions | Siconnex is a global, leading equipment manufacturer for the semiconductor and related industries. Siconnex provides surface preparation equipment and processes, including WET BATCHSPRAY (Etch, Clean, Resist Strip) systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries. The Siconnex BATCHSPRAY® technology helps to make innovations such as smartphones, solar panels and power electronics more affordable and accessible to consumers and businesses around the world. Siconnex systems are leading when an extremely small footprint, safety, full automation, high throughput and economical resource consumption is important. MEMBER ISO 9001 Siconnex Headquarters Salzburg/Austria Siconnex is an internationally active, high-tech company providing systems for Siconnex BATCHSPRAY® process solutions to the semiconductor and related industries. Founded in 2002, Siconnex has its headquarters in Hof bei Salzburg, Austria, and operates via a global customer support network with subsidiaries in Europe, Asia and America. Technology Cleaning and etching tasks with hazardous wet chemicals are performed safely and efficiently within a completely closed system. All processes from chemical to final rinsing and drying are fully automated, ETCH RESIST STRIP CLEAN ensuring repeatable processes and uniformities below 1%. Siconnex BATCHSPRAY® systems support a wide range of applications from mass production to R&D and prototyping. Process chemicals are stored and temperature controlled in a encapsulated compartment. The chemicals are sprayed into a closed process chamber via pump and filter. Various nozzles ensure a uniform spray pattern. Wafers rotate during chemical spraying to ensure best results with regard to uniformity. The chemicals can either be recirculated or used once only. The process chamber houses either 1 carrier with 25 wafers or 2 carriers with 50 wafers in the manual load system. Siconnex Autoload Systems houses 1 to 4 process chambers and achieve throughputs up to 400 wph. Siconnex BATCHSPRAY® technology reduces the relevant cost of ownership figures by 80% compared with a wet bench. Important financial aspects like footprint costs, waferscrap, process media costs and operator costs can be greatly reduced by using Siconnex BATCHSPRAY® technology. Focus and Passion Siconnex is 100% focussed on its BATCHSPRAY® technology. This guarantees constant improvement and the highest quality standards. Siconnex Process Laboratory All applications are approved in the Siconnex own Process Laboratory in Salzburg, Austria. Our BATCHSPRAY® systems are delivered with a proven recipe to ensure a smooth and fast start-up. To achieve constant process innovation Siconnex puts a lot of effort into R&D. Therefore we work together with various institutes, customers and chemical suppliers all over the world. Save Resources Products & Applications Advantages Etch etal Etch (Al, Cu, Ti, Au, Ni,...) M with End Point Detection Advantages Automated dry in – dry out 80 % less DI water Automated dry in – dry out 80 % less DI water 5 processes in one sequence 80 % less waste Fresh and reclaim chemistry 80 % less waste Repeatable process control Encapsulated system Repeatable process control Encapsulated system Footprint 1.2 m x 2 m Operator safe Footprint 1m x 1.6m Operator safe Clean RESIST STRIP Clean RESIST STRIP SicOzoneTM Clean SicOzoneTM Strip Polymer Clean Positive Resist Strip Positive and Negative Resist Strip Etch Residue Clean III/V Etch (GaAs, AlGaAs, InGaP,...) icOzoneTM + Ultra Diluted Clean S Applications Negative Resist Strip Implanted Photo Resist Strip Post Ash Residue Clean Oxide Etch Contact Cleans Metal Lift Off Enhanced Strip Freckle Etch Organic Removal & Clean Resist Rework Silicon Etch Etch Residue Clean Ge Etch Post Ash Residue Clean Nitride Etch HF Last Backside Etch Prediffusion Cleans UBM Etch Field Cleans (Organic & Inorganic Cleans) Glass Etch RESIST Developing Photoresist Developing Products & Applications Advantages D ry in - dry out process F ully automated SMIF, FOUP and standard roboter loading carrier compatible Flush mounting possible Throughput of up to 400 wph due to fully enclosed design Footprint < 9m² Etch etal Etch (Al, Cu, Ti, Au, Ni,...) M with End Point Detection Clean RESIST STRIP SicOzoneTM Clean SicOzoneTM Strip SicOzoneTM + Ultra Diluted Clean Applications Positive and Negative Resist Strip III/V Etch (GaAs, AlGaAs, InGaP,...) Oxide Etch Contact Cleans Enhanced Strip Freckle Etch Organic Removal & Clean Resist Rework Silicon Etch Etch Residue Clean Ge Etch Post Ash Residue Clean Nitride Etch HF Last Backside Etch Prediffusion Cleans UBM Etch Field Cleans (Organic & Inorganic Cleans) Glass Etch Implanted Photo Resist Strip EQUIPMENT Technology Roadmap 2002 2005 2007 2013 2014 Sept. 2015 Sept. 2016 Company Foundation BATCHSPRAY Acid for etching & stripping BATCHSPRAY Solvent for cleaning & stripping BATCHSPRAY ACID AUTOLOAD 200 mm for ozone cleaning & stripping with 4 chambers, high throughput application BATCHSPRAY Acid 200/300 mm for etching, ozone cleaning & stripping BATCHSPRAY ACID AUTOLOAD 200/300 mm for etching, ozone cleaning & stripping with 2 chamber application BATCHSPRAY SOLVENT AUTOLOAD 200/300 mm for cleaning & resist stripping PROCESS 2002 Metal Etch Polymer Clean Oxide Etch Resis Development Glass Etch etc. Solvent Resist Strip SicOzoneTM Resist Strip SicOzoneTM Clean SicOzone TM Resist Strip Metal Etch 300 mm Metal Etch 300 mm Polymer Clean Oxide Etch Oxide Etch Resist Developing Glass Etch etc. Glass Etch etc. Solvent Resist Strip SicOzoneTM Resist Strip SicOzoneTM Resist Strip SicOzone TM Clean SicOzoneTM Clean Siconnex Local / Sales / Service / Spare Parts Siconnex Headquarters: Local service and process support Customized project support plan SICONNEX Austria Local spare parts availability Regular annual preventive maintenance plan Gewerbestrasse 2 5322 Hof bei Salzburg Tel: +43 6229 36646-0 Fax: +43 6229 36646-146 E-Mail: [email protected] SICONNEX Offices: SICONNEX France SICONNEX Malaysia 83 Rue Roger du Marais 8 38430 Moirans Tel: +33 631 30 55 54 E-Mail: [email protected] No. 1-04-15 e-Gate Lebuh Tunku Kudin 2 11700 Gelugor Penang Tel: +6 012 4256568 E-Mail: [email protected] SICONNEX America SICONNEX Singapore 10460 Roosevelt Blvd. N #113 St. Petersburg, FL 33716 E-Mail: [email protected] 4 Battery Road Bank of China Building #25-01 Singapore 049908 Tel: +65 838 88 977 E-Mail: [email protected] Siconnex Representations: Russia Ostec Enterprise Ltd. Andrey Khoklun 5/2, Moldavskaya Street, Moscow 121467 Russian Federation Tel: +7 495 788 4444 E-Mail: [email protected]
