PCB Depaneling Laser System LPKF MicroLine 350Ci
Transcription
PCB Depaneling Laser System LPKF MicroLine 350Ci
PCB Depaneling Laser System LPKF MicroLine 350Ci ■ Depaneling without mechanical stress ■ Dust free environment ■ Cut intricate shapes ■ More usable space for component placement ■ Superior throughput Lase r cu t Stress-free cutting and improved productivity: Introducing laser technology for depaneling Depaneling of modern HD circuit boards can be frustrating. Avoiding damaging small, sensitive components, maintaining the close tolerances required by densely packed boards and avoiding the pollution caused by mechanical routers are all part of the challenge. The LPKF MicroLine 350Ci meets these challenges by using laser technology for depaneling and routing. Non-contact cutting with a laser means no mechanical stress on the boards or components, no debris, and no extra cost for tooling. The high positioning accuracy of the 350Ci allows for component placement closer to the edge of a board. The laser beam is able to cut intricate shapes and also increases the net usable area on the panels. Produce more challenging designs The MicroLine 350Ci will cut intricate shapes without any mechanical impact on the circuit. PCB designers will enjoy the liberty to place components closer to the edge of the board or to utilize more intricate shapes to better fit the form factor of the final product. Cutting arbitrary shapes with High productivity smallest tool diameters The superior cutting speed of the MicroLine 350Ci provides better overall productivity than traditional depaneling methods, especially with thinner materials. Superior quality and instant turnaround Laser cutting is significantly more precise than other depaneling methods. It doesn’t generate any debris or dust that could affect sensitive electronic components. The system works straight from CAD data and does not require specific tooling, so even small quantities can be produced instantly. Feed Rate (millimeter per sec.) Maximum Cutting Speed FR4 400 350 300 250 200 150 100 50 0.5 1 Material Thickness (millimeter) 1.5 LPKF MicroLine 350Ci – Integrate Tomorrow’s Technology in Today’s Production Line The dual camera system provides instant fiducial recognition on the entire working area for optimal productivity. The integrated dust and fume extraction provides a clean working environment for guaranteed superior production quality. The cartridge loading system accommodates custom holding fixtures for maximum efficiency. Compact and easy to integrate With its small footprint the LPKF MicroLine 350Ci can be easily integrated into an existing PCB assembly line or used as a stand-alone system. The software features extensive laser control functions combined with an easy-to-use GUI for day-to-day operation. LPKF has been providing prototyping and production equipment to the electronic industry for almost 30 years. Our systems are designed with superior precision, minimum maintenance requirements and maximum uptime in mind. LPKF provides a directly employed worldwide service staff supporting you every step of the way. The intuitive CAM software is easy to use and compatible with all industry standards including Gerber, ODB++, DXF, Excellon, HP-GL, and others. Specifications LPKF MicroLine 350Ci Working area 17.3" x 12.2" (440 mm x 310 mm); z-axis: 1.2" (30 mm) Overall accuracy ±20 µm Laser source CO2 laser Laser safety Class 1 Machine Dimensions (W/H/D) W 50" (1,264 mm) x H 66" (1,670 mm) x D 80" (2,023 mm) Weight approx. 3527 lbs. (1,600 kg) Facility connections Power 3 phase 400 V + N + PE, 50/60 Hz, 32 A, power consumption 8 kVA Chiller DI water, 2.5 kVA, min. 7 l/min, 23 °C ±1 °C Fume extraction 150 CFM (250 m3/h)@80” w.c. (20,000 pa), 3 psi (0.2 bar), carbon filtration required Air 90 psi (6 bar) Applications Semiautomatic depanelization of populated circuit boards. Materials FR4 (G10), FR3, FR2, Polyester, Polyimid, PMMA, Polyamid, Prepreg Maximum material thickness 0.8” (2 mm) Maximum component height top side 1.2” (30 mm) bottom side 0.6” (15 mm) LPKF Laser & Electronics 28220 SW Boberg Rd. Wilsonville, OR 97070 USA Phone (503) 454-4200 Toll-free 1-800-345-LPKF (5753) [email protected] www.lpkfusa.com custom designed loading station available LPKF-Distributor LPKF AG, 117562-1005-EN Automated material handling
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