fastFilm™27D

fastFilm™ 27D Low Loss Non-Reinforced Film
fastFilm™27D
is a low loss flexible laminate constructed
with non-reinforced high temperature polymer chemistry to provide excellent
thermal, mechanical, electrical and moisture resistant properties. The low
dissipation factor, thermal stability and smooth surface profile minimizes
insertion loss at higher frequencies and temperatures, yielding exceptional
low loss circuit performance. fastFilm™27D has been designed with ductility
for applications requiring a tighter bend radius or a fold.
Benefits & Applications:
• High freq. alternative to polyimide
• Exceptionally low loss
• Low Dk
• Superior peel strength
• High temperature performance
• Low moisture absorption
• No adhesive
As an alternative to polyimide, fastFilm™27D offers an effective solution in
high frequency applications. Polyimide suffers from atmospheric moisture
absorption of 2 wt % which renders this material as lossy as FR-4 and
unsuitable for high frequency applications. Some polyimides also employ
lossy adhesives for copper adhesion that are not temperature resistant or low
loss at high frequencies. The electrical properties of fastFilm™27D have been
designed to be independent of frequency.
• Medical
• Military / Avionics
• Consumer electronics
• Fiber optic modules
• Telecommunications
• Double sided, multilayer & rigid
flex circuits
• Automotive
fastFilm™27D eliminates skew in long differential transmission lines as an
alternative to coaxial cable. This material is ideal for flex-to-install applications.
For stripline applications, fastFilm™ can be combined with a number of bond
plies (prepregs).
Lamination Sequential DK (10 DF (10 PTFE Type Solder
Temp.
Lamination GHz)
GHz) Processing Resistant
Bonding Ply
Resin
Remelts
Primary Advantage
HT-1.5
Thermoplastic
205° C
230° C
No
2.35
0.0025
Yes
No
Best Ductility
FR-25-0021-45F
Thermosetting
No
215° C
Yes
2.42
0.0013
Yes
Yes
Best Electrical Properties
FR-27-0040-43F
Thermosetting
No
215° C
Yes
2.68
0.0018
Yes
Yes
Best Electrical Properties
For building stripline circuits with fastFilm™, it is recommended that the least amount of copper be removed from each layer.
Solid copper planes will help stabilize the thin copper clad laminates and yield the best predictability/consistency of the
movement of the inner layers after etching and lamination. It is not recommended to bake the cores in a high temperature
process after etching, as this will lead to unwanted shrinkage which is not necessary moving forward to lamination.
fastFilmTM 27D
Loss Tangent (DF)
fastFilm27D
0.0015
0.0020
0.0013
0.0015
0.0011
0.0010
0.0005
Loss Tangent (Df)
0.0009
0.0007
0.0005
0.0000
35
0
2
4
6
8
10
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
[email protected]
37
In-plane X
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
[email protected]
38
39
40
41
42
Frequency (GHz)
Frequency (GHz)
North & South America
36
12
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
[email protected]
An ISO 9001 Registered Company
www.taconic-add.com
In-Plane Y
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-8718-9678
[email protected]
fastFilm™ 27D Typical Values
Property
Test Method
Unit
Value
Unit
Value
Dk @ 10 GHz
IPC-650 2.5.5.5.1 (modified)
2.65
2.65
Df @ 10 GHz
IPC-650 2.5.5.5.1 (modified)
0.0010
0.0010
Df @ 40 GHz
IPC-650 2.5.5.5.1 (modified)
0.0018
0.0018
Moisture Absorption
IPC-650 2.6.2.1
Dielectric Strength
ASTM D 149
Volume Resistivity
IPC-650, 2.5.17.1 (Humidity Conditioning) Mohms/cm
Surface Resistivity
IPC-650, 2.5.17.1 (Humidity Conditioning)
Flexural Strength (MD)
%
0.03
Kv/mm
51.18
1.60 x 10
Mohms/cm
1.60 x 108
Mohms
9.20 x 108
Mohms
9.20 x 108
ASTM D 790
kpsi
6.05
N/mm2
30.47
Flexural Strength (CD)
ASTM D 790
kpsi
4.77
N/mm
30.06
Flexural Modulus (MD)*
ASTM D 790
kpsi
(a) 0.24
(b) 0.063
N/mm2
2,813.06
Flexural Modulus (CD)*
ASTM D 790
kpsi
(a) 0.23
(b) 0.035
N/mm2
2,764.80
Tensile Strength (x)
ASTM D 902
psi
1,572
N/mm2
11
Tensile Strength (y)
ASTM D 902
psi
1,538
N/mm
11
Tensile Modulus (x)
ASTM D 902
kpsi
209
2
N/mm
1,441
Tensile Modulus (y)
ASTM D 902
kpsi
203
N/mm2
1,400
Elongation at Break (x)
ASTM D 902
%
7.20
%
7.20
Elongation at Break (y)
ASTM D 902
%
20.20
%
20.2
Thermal Conductivity
ASTM F 433/ASTM 1530-06
W/M*K
0.34
W/M*K
0.34
g/cm
2.08
g/cm
2.08
Density (Specific Gravity)
%
0.03
V/mil
1300
8
3
2
2
3
Peel Strength (CVH)
IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)
lbs./inch
10
N/mm
1.7
Peel Strength (CV1)
IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)
lbs./inch
16
N/mm
2.7
Flexural Fatigue & Ductility**
0.250 mm Mandrel
IPC 2.4.3.1
Cycles
443
Cycles
443
0.199 mm Mandrel
IPC 2.4.3.1
Cycles
143
Cycles
143
0.125 mm Mandrel
IPC 2.4.3.1
Cycles
212
Cycles
212
0.075 mm Mandrel
IPC 2.4.3.1
Cycles
73
Cycles
73
CTE (X axis) (50 to 250 ºC)
IPC-650 2.4.41/TMA
ppm/ºC
29
ppm/ºC
29
CTE (Y axis) (50 to 250 ºC)
IPC-650 2.4.41/TMA
ppm/ºC
28
ppm/ºC
28
CTE (Z axis) (50 to 250 ºC)
IPC-650 2.4.41/TMA
ppm/ºC
112
ppm/ºC
112
* (a)/(b) FF-27D does not show a linear flexural stress/strain curve. FF-27D shows two regimes that are approximately linear
(a) 0 - 1% strain (b) 2 - 5% strain
** RH copper, double sided, 4 mil dielectric, 5.4 mil total thickness with copper, 8 oz. weight, cycles to failure
All reported values are typical and should not be used for specification purposes. In all instances, the user shall determine suitability in any
given application.
Moisture Absorption
1.020
Typical Thicknesses
1.015
1.010
1.005
1.000
0.995
0.990
Normalized
Dk @10 GHz
0.985
0.980
-40
-20
0
20
40
.002"
.06 mm
.003"
.08 mm
.005"
.13 mm
60
Temperature (C)
fastFilmTM 27D Dk vs. Temperature
% moisture absorption (23 °C/24 hrs.)
An example of our part number is: FF-27D-00225-CE1/CE1 - 18" x 24" (457 mm x 610 mm)
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