Maxim Titov, CEA Saclay, IRFU/SPP (on behalf of the IN2P3 and

Medipix 2
MAPS
Ingrid
Maxim Titov, CEA Saclay, IRFU/SPP
(on behalf of the IN2P3 and IRFU communities)
OUTLINE OF THE TALK:
 R&D Instrumentation and Organization in France
 French Participation in International R&D Projects
 State-of-the-art of Detector Technologies R&D
 Microelectronics
andInstrumentattion
Mechanics R&D
Summary of Detector
 R&D
for sLHC
andEuropean
LC Detectors
Participation
in the
 Summary and Outlook
RESTRICTED ECFA VISIT TO FRANCE,
PARIS, March 15, 2013
50 µm thin-Si
Erice, 25 January 2013
Statement i): The success of particle physics experiments, such as those required
for the high-luminosity LHC, relies on innovative instrumentation, state-of-the-art
infrastructures and large-scale data-intensive computing.
 Detector R&D programmes should be supported strongly at CERN, national
institutes, laboratories and universities. Infrastructure and engineering
capabilities for the R&D programme and construction of large detectors, as well
as infrastructures for data analysis, data preservation and distributed dataintensive computing should be maintained and further developed.
Very important statement for the Instrumentation Community and the HEP
field in general  its successful implementation is of a prime importance
 A constant investment in detector R&D is needed to retain the
viability of the field
 Need to retain the technical expertise to maintain current projects and
mount new projects.
C de La Taille, Journée Instrumentation IN2P3, 27 Nov. 2012
 R&D instrumentation
– Photodetectors (PM, SiPM, MCCP…)
– Gaseous detectors (RPCs, Micromegas, RD51…)
– Semiconductor detectors (Ge, Si, MAPS…)
– Cryo detectors (CMB, Edelweiss, 2Beta…)
– Radiodetection (MHz, GHz…)
– Microelectronics (ASICs)
– DAQ (NARVAL, FASTER, xTCA, …)
– R&D mechanics (cooling, composites…)
 R&D organization
– Transversal thematic networks
– Share expertise and tools
– Target next generation experiments
 Poles, Platforms and Networks
Impossible to present Trends and Instrumentation R&D in France in 20 min 
Apologies to Non-Collider Experiments Detector R&D (not mentioned in the talk)
Human Resources: IN2P3 (564 FTE, 112 PhD/Postdoc); Irfu (117 FTE,15 PhD/Postdoc)
Budget: IN2P3: 4.6 MEUR; Irfu: 3.3 MEUR
R&D represents: 11%(15%) of the total activities in IN2P3 (Irfu)
The sharing of R&D resources are summarized by:
 Activities: Detector Instrumentation, Mechanics, Electronics, …
 Detector Technologies: Semiconductor Detectors, Gaseous Detectors
Scintillators and Photodetectors, Bolometers, …
Survey for the Prospective IN2P3 - Irfu 2012, WG14 Summary, Giens, April 2-5, 2012
 Total budget for France : 4550 k€ over a total AIDA budget of 26000 k€ (17.5 %)
 Manpower: ~ 300 persons/month over 4 years of the project  ~ 25-30 FTE.
 French contributions:
 Scientific coordination (L. Serin);
 ILC related: Software (PFA), Detector R&D (TPC with MM); Electronics (new
generation chips for ECAL/HCAL), DAQ (ILC test-beams);
 Micro-electronics and 3D TSV interconnection : participation to IP blocks in
65 nm technology, analoque Bi-CMOS submission second sets of IP blocks:
 CPPM / Bonn: Interconnection of the ATLAS FEI4 chips using bump bonding and
L. Serin
TSV from IZMs (large diameter TSV)
 IPHC+IRFU with INFN : Interconnection of 3D chips from Tezzaron to edgeless
and/or CMOS sensors using advanced interconnection (TMICRO or others)
 LAL+LPNHE +LAPP/MPP : Readout ASICs in 65nm technology interconnected using
the CEA-LETI or EMFT process.
LPNHE +LAPP/GLA/LIV/MPP : Interconnection of ATLAS FEI4 to sensors using
TSV-SLID and ICV (high density TSVs) from EMFT
HGF Network: All 9 Helmholtz Association (HGF) Research Centers in « Structure
of Matter » in GERMANY + 11 University Partners + Associated Laboratories
Enable future detector technologies for “structure of matter” research, for other fields
or for society at large:
 Identify, develop, exploit underpinning technologies
 Identify new concepts or systems
 Spin-offs, industry contacts, outreach
Associated Labs
From France:
agreement is
being signed
6 R&D Collaborations at CERN: RD18 (Crystal Clear), RD39 (Cryogenic), RD42
(Diamond), RD50 (Silicon), RD51 (MPGD), RD52 (Dual-Readout Calorimetry)
 RD18 - 3 (IRFU,CPPM, Lyon)
 RD50 – 1 (LPNHE),
 RD51 – 8 (IPNO, LAPP, IRFU,
SUBATECH, IPNL, LAL,
LLR, LPSC)
 RD?? - FE pixel chip (65 nm) for
sLHC (CPPM, LPNHE)  LHCC
Worldwide Collaboration for R&D
developments of MPGD 
RD51 (80 institutes, 450 people):
 Large Scale R&D program to
advance MPGD Technologies
 Access to MPGD “know- how”
 Foster Industrial Production
This talk summarizes state-of-the-art for several detector technologies
with particular emphasizes (large French contibutions) on:
 Vertex & Tracking with Solid State and Gaseous Detectors
 Scintillators and Photo-Detectors
 Calorimetry and Muon Systems
 R &D developments for future experiments at the High Energy Frontier:
sLHC and Linear Colliders
 see more details in talks D. Contardo (sLHC) and M. Winter (LC)
Main Technologies undergoing important R&D with implications in France
(different materials and configurations, many detection mechanisms):
Materials & Sensors:
 Si edgeless, active edge (LAL, LPNHE)
 Si Rad Hard (LAL, LPNHE)
 Si for SiW calorimetry (LLR, LPNHE)
 Diamond (IPHC, LPC Caen, LAL)
 CdTe (CPPM, IRFU)
 Germanium : IPNO, IRFU
 Flexible sensors: IPHC
Integrated Sensors & FEE:
 Pixels CMOS (IPHC, IRFU )
 Pixels hybrides (CPPM, LAL, LPNHE)
 Strips (IPHC, IRFU, IPNO)
 SiPM (LAL)
 EBCMOS, CMOS amplifier (IPNL)
 APD for Space Instr. (APC)
 Diamond Strips : FASTER (LPC Caen)
From Microelectronics to Nanoelectronics:
Detectors are more and more based on semi-conductor technology
 from vertex elements (20 µm feature size) to Si-calorimetry (ILC)
 Radiation hardness improvements demand newer technologies
 Improved functionality can only be achieved with higher integration
 Power dissipation and material budget must be reduced
TODAY: Pixels
50 – 100s µm
TODAY: Monolithic
25 – 50 µm
Integrated sensor &
electronics: Less X0,
no bonding, low noise
TOMORROW: 3D
Detectors (25–50 µm)
Lower Vdep (power)
Faster charge collection
Day After Tomorrow:
3D TSV (< 20 µm)
3D vertical
Integration (TSV)
Motivation to develop new Pixel Detectors:
Trends and Perspectives:
 Decrease fabrication cost
 Develop thinner pixel systems
 Easy fabrication of large area devices
 Integrate More (= denser) Intelligence
 Improve rad. hardness (p-type bulk)
 Reduce the thickness to 50 µm
 From 6” to 8” and 12” wafers
 R&D on SLID/TSV interconnect.
Wire Chambers, TPC, RPC  MPGD (GEM, Micromegas)  InGrid (3D)
YESTERDAY:
INTEGRATION
TODAY:
INTEGRATION
FUTURE:
Micromegas:
Ingrid
 High rate capability ~106 Hz/mm2
 Spatial res. ~ 30-50 µm (TRACKING)
 Time res. ~ 3-5 ns (TRIGGER)
Advances in photolithography  MPGDs
R&D Activities in France:
 MWPC (GANIL CAEN, IPNO)
 RPC (IPNL, LLR, LPC)
 MPGD (IRFU, CENBG Bordeaux,
GANIL, CAEN, IPNO, LAPP, LLR,
LPC CAEN, LPSC, Subatech)
 InGrid (IRFU, LAL)
MPGDs Trends and Perspectives:
 Precise, large area detectors (> 1 m2)
for hadronic high-rate environments:




PCB technology
Cost, robustness and uniformity
Small dead area
Versatile geometry (e.g. cylindrical)
 CERN Workshop Upgrade  (Large
areas MPGDs up to 2 m2 achievable)
 Industrial Transfer (“Industrial Friendly
Technology”)
Crucial to identify hadrons & decay products in B-physics experiments
Small Surfaces (Vacuum of Solid State):
Large Surfaces (Gas: MPGD +CsI)
MCP
MaPMT:
PMT
Large area vacuum or solid state γ-detectors  no cost effective industrial solution
Sustained R&D:
 LAPPD Consortium
(Large Area Picosecond PhotoDetector):
 R&D to produce large surface,
low cost γ-detector with a sophisticated
“home-made” MCP-PM
Study of Scintillator
Materials:
 New Industrial
Scintillators (CeBr3, CLYC,
SrI2(Eu), … )
 Liquid (Nuclear Physics)
 Plastics (dose monitoring
- readout by CCD)
 Inorganic
FUTURE: MCPPMT (8”x8”)
Motivation :
 Continuous increase of chip
complexity (SoC, 3D…)
 Minimize interface problems
Microelectronics Network:
 Improved exchange of information
 ASICs expertize, sharing of well
proven blocks
 Concetrate on novel aspects
NETWORK:
16 IN2P3 &
IRFU
15 IN2P3 Laboratories + IRFU
Main R&D Topics:
Cooling Systems:
 R&D Materials (composites, …)
 Cooling Systems (fluid circuits,
interconnections, …)
 Integration Systems (multi-detector
systems, interfaces, micromechanics)
R&D Materials: Composites
Integration Aspects & Systems:
Vertex
(pixel)
ATLAS
Si Tracker
Gas / Fiber CALO
Tracker
MUON
DAQ/
Trigger
LAL,LPC,
LPSC,
LPNHE,
CPPM, IRFU
IRFU
LAPP
IRFU (MM
forward tr.)
LLR, IPNL,
IPHC, IRFU
IPNL
LLR, IPHC,
IPNL
LPC (fiber
tracker)
LAL, LAPP
CPPM, LAL,
LAPP, LPNHE
CMS
IPNL, IPHC
LHCb
ALICE
IPHC, IRFU
IPHC
LC
IPHC, IRFU
LPNHE
(until 2011)
LAPP, LAL,
CPPM, LPC
IPNL, IPNO,
LPC,
Subatech,
IRFU
IRFU (TPC
MM)
LLR, LAL,
LPSC,LPC
LPNHE,
IPNL, LAPP
CMOS sensors expected to provide an attractive trade-off between granularity,
material budget, radiation tolerance, speed and power dissipation
Main objective: ILC
 MAPS applied to hadron experiments with intermediate requirements
EUDET 2006/2010
Beam Telescope
(~ 12 cm2)
 EUDET (R&D for ILC, EU project)
 STAR (Heavy Ion physics)
STAR 2012
Solenoidal Tracker at RHIC
(~ 1600 cm2)
 CBM (Heavy Ion physics)
 ILC (Particle physics)
 HadronPhysics2 (generic R&D, EU
project)
ILC >2020
Internatinal Linear Collider
(~ 3000 cm2)
 AIDA (generic R&D, EU project)
 FIRST (Hadron therapy)
 ALICE/LHC (Heavy Ion physics)
CBM 2017
Compressed Baryonic Matter
( ~ 500 cm2)
 EIC (Hadronic physics)
 CLIC (Particle physics)
 SuperB (Particle physics)
Spinoffs: Interdisciplinary Applications, biomedical, …
Integration of Functionality (the path to fully exploit CMOS potential):
Pixels & Trackers exploit New Concepts (trigger at L1):
Key technology: Through Silicon Via (TSV)  trigger
logic, power, cooling inside the integrated chip layers
 Vertically Integrated 3D Si-sensor (initiated by ILC
R&D)  multiple thin Si-processing layers,implementing
analog and digital signal processing, stacked on top of
sensor layer
Interest in France
exists
 3DIT expected to be very beneficial for CMOS sensors:
Combine different fabrication processes -> choose the
best ones for each tier/application
 Split signal collection and processing on different tiers
Large TPC Prototype (LCTPC) @ DESY): Space resolution, field calibration …
PAD READOUT with AFTER (3* 7 cm2)
PIXEL READOUT with TIMEPIX (55*55 mm2)
Endplate with 7 Resistive MM in 1T magnet: Octopuce Board (2*4 “InGrid”: 3*6 cm2)
12000
channels
5 GeV
electron beam
4 chips
5 GeV
electron beam
Future plans: 100 “InGrid” Chips Detector
Spinoffs: T2K TPC with MM pads; “InGrid” proposed for tracking in CAST
“Resistive Bulk MM” Technology:
 Spark neutralization & suppression
 Resistive strip parallel to readout strips
Today:
MDT chambers
(drift tubes) +
The ATLAS Small Wheel Upgrade:
 TODAY: MDT + CSC+TGC
 Replace muon chambers with
Resistive MM (Trigger & Tracking)
 2017-2018: TGC + MM
128 μM chambers (0.5 to 2.5 m2)
1000 m2, 2M readout channels
TGCs for 2nd
coordinate (not
visible)
CSC chambers
Industrialization & Spinoff
(in collaboration with RD51):
Develop large-area MM (0.5 m2)
with Industry (ELVIA, France) for
Muon Tomography Densitometry
(GEOAZUR NICE and LSBB)
Pioneering work: develop technologies to improve substantially jet energy resolution
 Essential to disentangle hadronic decays of W and Z bosons
 Ground Breaking Technology: SiPPM, MPPC
 CALICE: Scintillator stack readout by SiPMs
 First large scale use of SIPMs (8000 ch.)
 Particle
Flow
Technique
Future: Step from first prototypes
to full calorimeter systems
 R&D oriented towards LC but
major synergies with other projects
Prototype for
PET Applications:
3x3 array of LYSO
crystals with
SiPMs (300 ps
time resolution):
TRECAM (Tumor Resection CAMera):
miniaturized gamma-camera for breast
cancer surgery  Industrial transfer
49 x 49 mm2 field of
view LaBr3:Ce
crystal optically
coupled to a
multi-anode
photomultiplier
@IMNC ORSAY
tube
LC Event at 2012 IEEE NSS/MIC in Anaheim:
http://www.desy.de/~nss2012/2012LCevent.html
 Instrumentation - is at the Heart of the Particle Physics –
is driven by the advances in technologies
 Most R&D in IN2P3 and IRFU carried out in truly international
collaborations  expertise of both institutions in Detector,
Electronics and Engineering Domains are essential for many
leading international projects and have numerious spin-offs
 Visibility and investments into high-level instrumentation R&D
research is vital for the success of the field  transmit accumulated
expertise to future generations of experiments at the energy frontier
This summary based on contributions from many people:
P. Allport, D. Attie, S. Barsuk, U. Bassler, J.-C. Brient, G. Calderini, F. Cavalier,
D. Contardo, C. De La Taille, E. Delagnes, R. Le Gac, E. Kajfasz, Y. Karyotakis,
B. Mansoulie, S. Monteil, N. Neyroud, R. Poeschl, C. Royon, A. Rozanov,
L. Serin, A. Stocchi, P. Verdier, M. Winter …  THANK YOU
and results presented at: Journées prospective IN2P3 – Irfu, April 2-5, 2012
Journée Instrumentation IN2P3, 27 Nov. 2012