Introduction to JTAG / boundary scan-based testing for 3D integrated

Transcription

Introduction to JTAG / boundary scan-based
testing for 3D integrated systems
(C) 2011 - GOEPEL Electronics - www.goepelusa.com
Who is GOEPEL ?
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© 2011 GOEPEL electronics
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JTAG/Boundary Scan,
Automotive Test Solutions, Functional Test,
AOI/AXI, Digital Image Processing
JTAG/Boundary Scan - www.goepelusa.com
2
Outline
• JTAG / boundary-scan applications
• Ways to test mixed-signal PCBA with JTAG / bscan
• Example: 3-D stacked, mixed-signal dies
3
Benefits of JTAG / boundary scan
• Test for manufacturing defects
at board and system level
• Access to on-chip test / debug / emulation resources
• In-system programming
• Efficient ATPG tools, pin level diagnostics
• Deterministic (predictive) test coverage
• Standardized:
IEEE 1149.1, 1149.4, 1149.6, 1149.7,
1500, 1532, P1149.8.1, P1687, P1838, ...
4
What is Boundary Scan ?
A little bit of history (and outlook) ...
5
Basics of IEEE 1149.1
IEEE 1149.1 specifies ...
• Test resources to be
implemented in devices
Digital
Core
Logic
• Boundary Scan
Description
Language (BSDL)
ID Reg
/TRST
TDI
TCK
TMS
IR
BP
TAP
Controller
TDO
6
JTAG / boundary scan applications
7
Outline
• Board level JTAG / boundary-scan applications
8
Ways to test mixed-signal PCBA w/ bscan
• Combine bscan (digital) w/ functional test (analog)
• Combine bscan (digital) w/ ICT / FPT (analog)
• Utilize mixed-signal I/O modules, controlled by the
boundary scan test system
• IEEE 1149.4 enabled devices
• ADC/DAC with IEEE 1149.1 access
PCBA = Printed circuit board assembly
ICT = In-circuit tester
FPT = Flying probe tester
ADC = Analog/Digital converter
DAC = Digital/Analog converter
UUT = Unit under test
bscan - boundary scan
• Loop-back on UUT (DAC to ADC loop-backs)
IEEE 1149.1 / boundary scan = simple, embedded, standardized
access to internal device structures
9
Boundary scan and ICT / FPT
Probes can be used to
provide access with digital
test resources and with
analog test resources
10
Mixed-signal test principle with IEEE 1149.1
Analog to Digital Converter:
Provide analog stimulus with tester channel
or measure circuit nodes
Read digital output with BScan
11
Digital to Analog Converter:
Provide digital stimulus with BScan
Measure analog output with tester channel
or functional test equipment
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13
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JTAG / boundary-scan systems
SCANFLEX® TAP Transceiver
2 ... 8 programmable TAP’s
32 dynamic digital I/O
3 static digital I/O
2 analog I/O
3 trigger lines
SFX I/O module slot
SFX/LS port
various form factors for
stand-alone systems and
for 3rd party ATE integration
SCANFLEX® I/O module
Several types, such as:
digital I/O (96 channels)
differential I/O (50 pairs)
mixed signal I/O
Useful for
analog measurement
mixed-signal
IEEE 1149.4 TAP
tests
VarioCORE modules
Custom designs
SFX/carrier
SCANFLEX® Controller
SYSTEM CASCON software
PCI, PCI Express, USB, LAN, FireWire,
PXI, PXI Express, VXI, LXI
Three performance classes A, B, and C
Up to 80 MHz TCK
HYSCAN™ support
SPACE™ II chip set
2 SFX/LS ports
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JTAG / boundary-scan systems
CION I/O modules
Useful for
mixed-signal tests
Several types, such as:
digital I/O (96 channels)
mixed-signal I/O (96 or 192 digital I/O, 1149.6 I/O,
analog I/O, relays, opto-coupled, I/O, and more)
DIMM interface modules
PCI interface modules
Scan chain controlled
ScanBoosterTM Controller
PCI, USB, Cables PCI Express
Low-cost controller
Up to 16 MHz TCK
2 programmable TAP’s
32 dynamic digital I/O
3 static digital I/O
2 analog I/O
3 trigger lines
fixture integrated
TIC modules
SYSTEM CASCON software
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PCBA vs. SOC / SIP / MCM / 3D Stacked Die
Multi-die IC level test access problem similar to PCBA
Similar test strategy, just at different scale
18
Outline
• JTAG / boundary-scan applications
19
Observations
• Test bus access: pins to bottom die, from there through stacked
interconnects; need special DFT with layout requirements
(where to place TSVs for inter-die test bus signal interconnects)
• IEEE 1149.1 focuses on die to die (chip to chip) interconnects
• IEEE 1500 for core level boundary scan
• IEEE P1687 will offer standardized access to embedded
instruments, incl. IEEE 1500, BIST, BERT, etc.
• IEEE 1149.7 offers attractive test bus signal network between
cores and dies
• IEEE P1838 to standardize 3D stacked die test
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3D stacked dies
This and the following
slides are just
examples of boundary
scan configurations others are possible.
This is a conceptual
drawing and does not
represent an actual
implementation!
Die-to-Die
interconnects
Number of pins,
boundary scan cells,
analog or digital
logic, and size of
chips, TSVs, and
solder balls are not
in scale (e.g. test
logic is very small
compared to
functional logic, and
the number of pins
and boundary scan
cells is much higher
than illustrated here).
Power
Analog I/O
21
3D stacked dies
Please note that this
is a conceptual
represent an actual
implementation!
Die-to-Die
interconnects
Number of pins,
analog or digital
logic, and size of
chips, TSVs, and
in scale (e.g. test
logic is very small
compared to
the number of pins
and boundary scan
cells is much higher
22
3D stacked dies
is a conceptual
represent an actual
implementation
(e.g. TBIC circuitry is
missing)!
Die-to-Die
interconnects
Number of pins,
analog or digital
logic, and size of
chips, TSVs, and
in scale (e.g. test
logic is very small
compared to
the number of pins,
boundary scan cells
and ABMʼs is
typically much higher
23
3D stacked dies
Mixed-signal die
is a conceptual
represent an actual
implementation
(e.g. TBIC circuitry is
missing)!
Die-to-Die
interconnects
Number of pins,
analog or digital
logic, and size of
chips, TSVs, and
in scale (e.g. test
logic is very small
compared to
the number of pins,
boundary scan cells
and ABMʼs is
typically much higher
24
Summary
• IEEE 1149.1 has been created for digital test, but ...
• ... what about analog / mixed-signal circuitry?
• Along came IEEE 1149.4, specifying mixed-signal boundary scan
resources, but are there any insertion tools for 1149.4 features?
• Mixed-signal tests based on IEEE 1149.1 are possible
using A/D converters and mixed signal tester resources
• IEEE P1687 will offer new possibilities
• IEEE 1581 may help for non-boundary scan chips / dies
(e.g. stacked memory dies without wrapper boundary register)
25
Contact info, upcoming sessions
June 6, 2011 at 12:30 PM EDT:
Commercial testing of next generation circuits and systems,
Scott Bulbrook, DA-Integrated
June 20, 2011 at 12:30 PM EDT:
Research frontiers in DFT and BIST,
Steve Sunter, Mentor Graphics
Heiko Ehrenberg
GOEPEL Electronics
+1 512 501 6535
www.goepelusa.com
[email protected]
26

Introduction to JTAG / boundary scan-based testing for 3D integrated

Transcription

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