SMT Tutorial Nr. 18 Nürnberg, 05.06.2008

Transcription

Neue Fertigungsverfahren für ferrokeramische
Planarspulen in LTCC Technologie
SMT Tutorial 18:
„ Neue Fertigungsverfahren für Ferrokeramische
Planarspulen in LTCC Technologie “
Franz Bechtold
www.via-electronic.de
.
SMT Tutorial Nr. 18
Nürnberg, 05.06.2008
Franz Bechtold
Progress has been made in the development of advanced ceramic (dielectric and ferrite) materials compatible
with low temperature process and existing LTCC materials. Especially for large value capacitors and magnetic
embedded devices high-K dielectric tapes and inks, magnetic tapes and metallic inks have been investigated.
The realisation of multilayer inductors and capacitors as embedded passive structures with LTCC-technology is
promising significant advantages with respect to miniaturisation, multi-functionality and costs.
Different module demonstrators will be presented in order to compare the new LTCC technology with the
conventional one, and evaluate its benefits in terms of cost, size and functionality (embedded RF filters,
miniaturized circulators and isolators).
They relate to key elements of RF communication (Vsat transmitter (30GHz) power stage module) and AC-DC,
DC-DC and DC-AC power supply equipment in different applications like power stations for mobile
communication equipments for the operation of powerful lamps in the car.
Specific details are described covering the complete development chain from the material development and
LTCC processing up to the demonstrators manufactured and their characteristics achieved.
A preview is given to the potential impact of introducing nanomaterials into the LTCC process.
SMT Tutorial Nr. 18
Franz Bechtold
•
Allgemeine Anforderungen
•
Prozessfluß bis zum LTCC integrierten Bauelement
•
Hoch permeable Ni-Cu-Zn Ferrite für integrierte Induktivitäten
•
Anforderungen an die Metallisierung
•
Verfügbare Fertigungsverfahren und deren Adaption
•
Verfahren zur Erzeugung planarer Mikroinduktivitäten hoher Güte
•
Industrialisierung des Verfahrens
•
Ausblick
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Need:
Need:
System in Package Solutions
SMT Tutorial Nr. 18
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Need
Monolithic integrated components in LTCC
SMT Tutorial Nr. 18
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• Material development
• Process integration
• Component integration
• Microsystem integration
SMT Tutorial Nr. 18
Franz Bechtold
Power transformer
Ferritic ltcc inductor
L/C Bandpass
Monolihic Integrated Passive
components R-C-L
new dielectric and ferroelectric
materials and new manufacturing
processes
LC phase shifter
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Franz Bechtold
Integrated resistor
Material Development
Optimization of the sintering density
S c h w i n d u n g s v e r h a l te n i n A b h ä n g ig k e i t v o n d e r A u f h e iz g e s c h w i n d ig k e it
0
Schwin dung [%]
-5
-10
-15
F er r it -T a p e 0 8
-20
2 K / m i n ( RT - 9 0 0 ° C)
H e r a eu s - T a p e C T 7 0 0
He r a e u s- T a p e C T 70 0
0
100
20 0
300
2 K / m in ( RT - 9 0 0 ° C)
1 0 K / m in ( 5 0 0 - 9 0 0 ° C)
4 00
500
6 00
T e m p e r a t u r [ °C ]
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700
8 00
900
100 0
C T7 00 _ W FF 0 8_ T
• Material Development
• Characterisation of tapes and inks
R i n g e a u s N i - C u -Zn -Fe rr i t ( 9 0 0 °C /2 h )
Anfangspermeabilität µi
1500
1000
500
N C Z 0 9 -1 Tc = 1 1 9 °C
N C Z 0 9 -5 Tc = 1 2 5 °C
N C Z 0 9 -7 Tc = 1 1 8 °C
NC Z 0 9 -2 Tc = 1 1 7 °C
NC Z 0 9 -6 Tc = 1 2 6 °C
NC Z 0 9 -8 Tc = 1 2 1 °C
0
20
30
40
50
60
70
80
Te m p e ra tu r i n °C
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90
100
110
120
130
• Realisation
• Screen printed inductors
Toroidal coil, 80µm conductor
90µm Vias
Helical coil, 80µm conductor
90µm vias
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• Integrated Inductor Design
• Schematic of different multilayer inductors
Via
Via
Kontakte
Kontakte
Lage 1 Ferrit
Lage 2 Ferrit
Lage 1 Ferrit
Lage 3 Ferrit, ohne
Vias
Lage 2 Ferrit
Leiterbahn
Leiterba
hn
Via
Vi
a
Kontakte
Lage 1 Ferrit
Lage 1 Ferrit
Lage 2 Ferrit
Lage 3 Ferrit
Lage 4 Ferrit
Leiterbah
n
SMT Tutorial Nr. 18
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Kontakt
e
Lage 2 Ferrit, ohne
Vias
Leiterbah
n
• Inductor SMT Component Design
• Schematic of different multilayer inductors
Variante 1
Variante 2
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Variante 3
Characterization
Inductivities achieved
SMT type multilayer component
Maximum Value: 2 to 3 mH
Average Value: 200 to 800 µH
Integrated type multilayer modules:
Average 40 to 90 µH
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•Drawbacks
– Silver Migration
– Coil Q
– Low Curie Temperature
– Hysteresis
– Low current load capacity
– Magnetic losses above 1 Mhz
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Design of Test structures
(Simulation and Design: IZM)
Designversion with
150um
2.984
compensated topology
Front End
5.338
5.679
8.055
8.397
9.951
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Teststructures (Simulation and Design IZM Berlin)
Layout of front end and backend inductivities using commercial
Heraeus ferrit material, µ=400 bzw. µ=200
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Structures (Backend) for the measurement and compensation of
VIA resistivity
4-Pointmeasurement in a
chain of 6 Vias
connected to GND,
Daisy-chain test
structures having 8
blocks with 6 Vias
each
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Franz Bechtold
Test structures
Measurement of the conductivity
(Backend)
Measurement of Break down
Voltage and dielectric constant
(Front end)
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Front end and Back end
Design and realisation
SMT Tutorial Nr. 18
Franz Bechtold
Front end and Back end
Design and realisation
Ag-Viafill Heraeus TC7301
Ag-Conductor Heraeus TC7303
Dried conductor thickness:
30..35µm,
Fired conductor thicknes:
20(..25)µm
Backend: 12 and 14 layers
Front end: 32 Layers
SMT Tutorial Nr. 18
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35µm
B
Magnetic Simulation and
CAD construction
Deckel (mit S ägemarken)
I
Zwischenlage
2 S pulenlagen
I
B
C AD-Darstellung
B auelement
L age 2
2 Z wischenlagen
L age 1
B
I
I
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• Construction and realisation of the
embossing tool (University of Ilmenau)
Size: 24 x 24 cm
• Layout: Testlayout, 65 x 65 mm2
• Pressure: applied by uniaxial press
Lid of the tool
LTCC sheet
Si – tool
Bottom of the tool
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Realisation of test components
(Unversity of Ilmenau)
Ferrite tape with embossed and screen printed coil structure
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Characterization
16
1kHz
Induktivität
[µH]
100kHz
8
4
0
0
0.2
0.4
0.6
[A]
1
Strom
X-ray photography (8Windings in 2 layers, Inductivity in correlation of the current
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Embedded Ferrite tape in
Standard LTCC
Cross section of a ferritic tape laminated to standard LTCC
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Stapelstifte 1 mm Durchmesser 8x
Industrialisation
Klebepunkte
Werkzeugaufnahme,
First Design:
•11 coil types
• single throttles double compensated throttles
• line width 200µm – 1,60 mm
• line distance 200 µm
• Number of windings: 1; 2; 4; 6; 10
• Coil size : 10 x 10 x (<) 1 mm3
133x133mm
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Franz Bechtold
Optimised Design:
•11 coil types
• single throttles double compensated throttles
• line width 200; 300; 400 µm
• line distance 200 µm
• Number of windings: 4; 5; 6; 10
• Coil size : 10 x 10 x 1 mm3 and 27x27x1mm
Industrialisation
• 5 inch Ni-Embossing tool for 5 inch ferrite tape sheets (45 µm embossed depth)
SMT Tutorial Nr. 18
Franz Bechtold
Industrialisation
Screen printed coils in embossed Ferrite and standard LTCC Tape
Materials: Heraeus AHT 98-029, Heraeus standard CT 700, Heraeus Ag TC 7302
• 3 layer construction, 1st Layout
SMT Tutorial Nr. 18
Franz Bechtold
Standard lamination process
LTCC Multilayer
Ferrit AHT98
Left: before sintering
Right: after sintering
Conductor thicknes 35 µm
LTCC Multilayer
Standard CT 700
SMT Tutorial Nr. 18
Franz Bechtold
Optimized lamination process
LTCC Multilayer
Ferrit AHT98
LTCC Multilayer
Standard CT 700
SMT Tutorial Nr. 18
Franz Bechtold
Development of a new Generation of Ferrite tape
based on nanodisperse powder (HITK)
BET = 9,8 m2/g
SMT Tutorial Nr. 18
Franz Bechtold
WNS_Pulver
Sintering behaviour
of standard and
nanodispersive
materials
SMT Tutorial Nr. 18
Franz Bechtold
SK_Nano_Konv_do
t
From ceramic powders to ceramic based Microsystems and devices
Dedicated to Grow:
A local Network of Industries, R&D Institutes and Universities, for the
Development and Realisation of Ceramic Based Microelelectronic Devices
and Microsystems
SMT Tutorial Nr. 18
Franz Bechtold
BMBF Verbundvorhaben 02PI1040
Projektträger des BMBF für Produktion und Fertigungstechnologien
(PTF) FZ Karlsruhe Aussenstelle Dresden
Mikrofun
Serientaugliche Fertigungsverfahren für
mikrostrukturierte Induktivitäten mit erweitertem
Funktions- und Parameterbereich
SMT Tutorial Nr. 18
Franz Bechtold

SMT Tutorial Nr. 18 Nürnberg, 05.06.2008

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