MORES - Indico
Transcription
MORES - Indico
Ralf Röder Hamburg Berlin Erfurt Frankfurt/Main München Miniaturization of Optical Sensor Solutions for Life Science, Health, BioMST and Process Automatization: MORES multi-domain chip stacks lab-on-chip Real Life Business Projekt des TALENT ITNs Ralf Röder September 2013 Research Institute in the field of silicon-based microsystem technology supervisory board scientific advisory board non-profit registered voluntary association since 1993 CiS Research Institut staff (2012): 95 scientists + engineers + 20 skilled workers turnover (2012): 12.5 million EUR 51 % public funding 35 % industrial contract research 21 % production clean rooms 4 inch wafer line test analyzis mounting packaging laboratories & offices design simulation MEMS MOEMS hundred percent subsidiary R&D Concepts Road Maps members (individuals , juristic persons: companies, institutes) Research Institute in the field of silicon-based microsystem technology • Manufacturer of highly sophisticated customised optical sensors, sensor systems and sensor applications: high reliability custom-made chips and hybrids • High specification sensors. • Technology and Know How Transfer Offering the whole product lifecycle: Design to Full-System Assembly. • Own production plant: Highly flexible. (individual items … series production / larger numbers) • Development and application of new technologies & ongoing R&D. • Research and development: Field application and customizing. • Typical public funded research and B2B (R&D, components) (B2C only in exceptional cases). military applications allowed Research Institute MST MEGA trends funding markets know how inhouse technologies technological modules Life Science Medical Optical Microsystems - amos - Silicon Detectors Photo Diodes Arrays APD, GM-APD SiPhotomultiplier Radiation Detectors (HEP, CR, X-RAY) Photo Diode Green Solutions Process Measurement MORES AMOS -Polarization - Fluoriszenz Bio MST Analytics Micromechanical Sensors & Modules piezoresistive capacitive High end preasure Sensors Force Sensors Cantilever micro-mechanical components interposer Impedimetric Sensors Layer Analysis Microclimatic Event Switches Bizeps Services, Know How and Equipment Competenz in Silicon Services, Know How and Equipment Simulation & Design Wafer • Layout – CAD-Software • FEM-Simulation tools for electrical, optical, mechanical and thermal calculations e.g. ANSYS, COMSOL, ATLAS, ATHENA, TESCA • SPICE-Simulations (HSPICE, CADENCE pSPICE) • 4“ Wafer line, front and backside processing • Spray-Coating for 3D-MEMS/MOEMS • 3D plasma and wet structuring MEMS/MOEMS • High temperature processes • LP/PE-CVD, Magnetron sputtering •Si-direct bonding, anodic bonding Test & Analytics Assembly and packaging • 8“wafer prober, 4“& 6“ front & backside wafer prober • Automatic die bonder, fine placer for flip-chip assembly • Automatic ultra-sonic and thermosonic wire bonder • Semiautomatic wire bonder • Screenprinter and SMD-mounter • Vapor-phase, hot bar, vacuum & laser soldering • Automatic dispenser • Opto-wafer-prober (e.g. OBIC) • SIMS-analysis, SEM including EDX, AFM, FIB • Optical and mechanical profilometer • Climate & temperature shock test, Pressure cooker • CV, TVS, UBR, pin-hole, lifetime Location / Network (selected) MORES® Technologie Plattform 3D Micro / Nano (Technologiemodule 3D-Strukturierung) Through-Silicon Via (TSV) (Durchkontaktierung von Siliziumwafern) Chip-Stacking # Chip-in-Chip (VCSEL-Chip in Si Cavity) MORES™ - an example of product driven technology platform - open platform Open for interfaces Filter Detection Transducer Signalpreprocessing Open for components Spray coating Technology platform of hybrid integration Chip-in-Chip Solgel layer Si- wafer Sensitive layer Lowered Bond pads 2D/3D- array FlipChip LED/VCSEL TSV UBM MCM Open for diversifaction Photodiodes SPM EPoSS Annual Forum 2013 Cork, Ireland, 26th September 2013 A.Steinke, A.Albrecht, O.Brodersen, Th.Ortlepp Global purposes & R&D priorities • • Improvement of the consistency of leading research, industrial orientated R&D and realization of the solutions samples prototypes production (small and midle sized series or/and technology transfer to foundries with capabilities to realize mass production) to improve unique features / goals: • Concentration of existing activities • Selection of new innovative goals (leading projects) + + + • according to the development aims / specifications of our customers technology scouting technology and Know-how transfer application-specific respectively custom-specific solutions (customizing) especially for Small & Medium enterprices (SME) economic efficiency producibility quality assurance Extension of the technology platforms available for R&D and prototyping Silicon-based sensor and Nano / Micro solutions Polylithic 3D-integration Silicon used for system platforms (LoC, interposer, board …) and Silicon packaging with additional functions (filters, overload protection,…) MORES Technology Platform & Product / Solutions Advantages Disadvantages • very high flexibility • high costs for mass production • micro-optical components • micro-mechanical components •… • sensing elements / devices • aditional functionality • packageing • cooling •… • batch processing of 3D MST • cost eficency for individual solutions and small series • faster R&D process time to market • exclusive solutions using technology platforms Aims / Goals Diversifikation What ideas / concepts may be handled using the existing resources? Still be served? What new resources should have to develop or establish ? • evaluate market potentials • scouting of performance aims based on custom requirements • technology scouting Road Map process * develoüp technology conzeptions Concentration Focusing of the resources . What expertise is still needed? What resources should be outsourced? • use of synergies • Technology and product transfer • economic efficiency of very specialized / individual solutions, small series Contact CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Konrad-Zuse-Straße 14 99099 Erfurt [email protected] www.cismst.de Ralf Röder Technologieentwicklung [email protected] Tel.: +49 361 6631 461 Mobil: +49 171 4085 429 Dr. Tobias Wittig Arbeitsgruppenleiter Siliziumdetektoren twittig@cismst. de Tel.: +49 361 6631 419 Present Solutions • • • • • Nivellierungssensor / leveling sensor eLiSe • Interview partner CiS: Dr. Brodersen ([email protected]) Sartorius: Herr Esser ([email protected]) Im-Ohr-Sensorsystem (Herz-Kreislauf-Diagnostik, Pulsoximetrie im äußeren Gehörgang) / In-ear sensor system • Interview partner CiS: Dr. Ortlepp ([email protected]) … Streulichtsensor zur Bestimmung der Partikelkonzentration in Flüssigkeiten Scattered light sensor for determining the particle concentration in liquids • Interview partner CiS: Dr. Müller ([email protected]) … Fluoreszenzsensor / fluorescence sensor FLORES -Interview partner CiS: Dr. Winzer ([email protected]) Prof. Mathis ([email protected])