Extraction and Simulation of Complex Silicon Interposer Structures
Transcription
Extraction and Simulation of Complex Silicon Interposer Structures
Extraction and simulation of complex silicon interposer structures with measurement correlation 11/15/2012 Sooyong Kim Area Technical Manager 1 © 2012 ANSYS, Inc. November 19, 2012 Apache Design,a asubsidiary subsidiary of of ANSYS Apache Design, Project Background • Interest in tool arose from experience supporting electrical power distribution in 3D IBM interposer module – Simple model (two pins) vs. entire interposer – Difficulties in model extraction (Several tools) – Large run times/capacity issues even for simple models – No direct IR drop data across interposer – No direct dynamic simulations – Strategic tool for future 3D designs • Redhawk from Apache team in Ansys for interposer/chip carrier electrical analysis & 3D modules – IR drop (DC analysis/ EM analysis) – Dynamic (Transient analysis) – Power model extraction (SPICE parasitic model, CPM ) – Point to point resistance Check 2 2 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Apache Power and Noise Platforms PowerTheater / PowerArtist RPM (RTL Power Model) Activity, cycle-to-cycle Block power Totem RedHawk CMM (Custom Macro Model) Hierarchical model IP protection 3 © 2012 ANSYS, Inc. November 19, 2012 Sentinel CPM (Chip Power Model) Distributed RLC, current Power, signal, EMI, thermal Apache Design, a subsidiary of ANSYS Chip/Chip Carrier/Package Software Tool A Tool C Tool B • Apache software addresses entire module (Tool A) • Packaging level software (Tool B) • Chip level software (Tool C) 4 4 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Initial Test Cases • Hendrix (200mm) and Beyonce (300mm) silicon interposer test vehicles • Same design – different cross section & TSVs • Four identical quadrants for 4 chips 5 5 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Beyonce Design (Top Right) & Pins For Measurements 3 1 5 6 6 © 2012 ANSYS, Inc. 2 4 November 19, 2012 Apache Design, a subsidiary of ANSYS Beyonce DC resistance measurements* E D A B C interposer position A B C D E 1 0.737 0.725 0.646 0.710 0.673 Tool used Tool # cal date cal due Keithley 2700 1076534 2012-04-03 2013-04-03 tested net (ohm) 3 2 2.000 0.213 2.028 0.214 2.059 0.221 2.060 0.218 0.227 2.083 4 2.079 2.127 2.150 2.150 2.183 5 0.786 0.805 0.859 0.815 0.830 * From J. Audet Tested interposer location 7 7 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Redhawk to Measurements Comparison 8 8 Redhawk (Ohms) Measured (Ohms) Difference (Ohms) 0.566 0.673 - 0.107 1.879 2.083 - 0.204 0.336 0.227 +0.109 1.976 2.183 - 0.207 0.884 0.830 +0.054 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Redhawk Dynamic Simulations PAD current at VDD • No need for separate tool for static vs. dynamic • Graph shows effect of having decaps vs no caps on interposer • Die Power Model ( CPM ) created , open spice format 9 9 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Pad voltage at VDD 10 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Hendrix Small Test Case Details • Results for dynamic simulation • Name and size of gds/lef file: hendrix_vdd_grn.gds (28KBytes), hendrix_3_18_09.def (8.3MBytes) • Machine run: bucksport (Linux64) in IBM EFK • Linux OS: Redhat v5.2 • Processor: AMD Opteron 252 - 2 2.6 GHz • Total physical memory: 10G • Run time used by Redhawk: 8 mins 0 secs. • Memory used by Redhawk: 1.324 GBytes • Diskspace used by Redhawk: 362 Mbytes • Improvement in model size/run time vs. existing 8 mins vs. 1 week runtime 11 11 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Hendrix/Beyonce Large Test Case Details • Results for dynamic simulation – (static simulation a bit smaller than this) • Name and Size of gds file: hendrix_mike.gds (2.48M), hendrix_3_18_09.def (3G) • Machine run: ae256 Linux64 in Ansys CA • Linux OS: Redhat v5.2 • Processor: AMD Opteron 6128HE 4 – 2.0GHz • Total Physical memory: 256G • Run time used by Redhawk: 45 hrs 42 mins 20 secs • Memory used by Redhawk: 48.2G • Diskspace used by Redhawk: 14G – Beyonce test case (a bit larger): 69G memory and 68 hrs run time • Tool can handle large data volumes but large run times/memory requirements 12 12 © 2012 ANSYS, Inc. November 19, 2012 Static DC/EM analysis Dynamic analysis CPM ( Chip Power model generation ) in one shot Apache Design, a subsidiary of ANSYS Simplified User Experience Multi-pane, Multi-canvas Based Power Analysis 13 13 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Enabling 3D/2.5D Designs Shared P/G network and SSN in multiple designs Needs simultaneous multi-die simulation for shared noise Concurrent analysis: (a) Full-layout visibility of all IC / interposer (b) hierarchical capacity 14 © 2012 ANSYS, Inc. November 19, 2012 Model based analysis: (a) Inclusion of CPM for some dies (b) Interposer modeling Apache Design, a subsidiary of ANSYS Model Based CPS Convergence Global PDN view R Metal Leaf Tx On die Decap SoC Designers view in RedHawk On die Decap PCB Designers view in Sentinel R PCB VRM On Board decap PCB/Pkg RLC, S parameter From Sentinel C4 PG Bump R Pkg From RedHawk L PKG C Pkg L Metal C Metal CPM R Pkg C4 PG Bump C Metal R Metal Leaf Tx L Metal C4 PG Bump L PCB C Pkg R PCB VRM On Board decap Only Common reference point 15 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS What is CPM? Chip on-die Power Grid RLC Apache Transistor current/cap/ESR Open SPICE netlist format Multi-domain, distributed model DC to multi-GHz validity Advanced chip excitation modes Silicon correlated Package/Board Model System Houses ASIC Vendors Chip Power Model Apache Ecosystem 16 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS What is CPM? CHIP DATA Layout Library (Early to Sign-off) CHIP ANALYSIS Dynamic VCD Static Dynamic VectorLess Chip Power Model 17 © 2012 ANSYS, Inc. November 19, 2012 Modes Static (Iavg, R) Frequency domain (RLC) Time-domain (I(t), RLC) Apache Design, a subsidiary of ANSYS CPM Benefits Against Traditional Models Traditional die model Apache Traditional CPM™ Die Model Chip Parasitics Chip Current RedHawk (SoC) 18 © 2012 ANSYS, Inc. Layout Library Chip Power Model RLC reduction: billions of parasitics to thousands of Spice elements Single Lumped Model November 19, 2012 Distributed with full couplings Apache Design, a subsidiary of ANSYS Multi-die Analysis Framework Memory Logic Silicon Interposer 19 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS Apache Design Inc. ( Subsidiary of Ansys ) www.apache-da.com www.ansys.com 20 © 2012 ANSYS, Inc. November 19, 2012 Apache Design, a subsidiary of ANSYS