Advanced Packaging Lithography Microlithographic Polymer Films Enabling Fine Pitch Wafer Bumping
Transcription
Advanced Packaging Lithography Microlithographic Polymer Films Enabling Fine Pitch Wafer Bumping
Advanced Packaging Lithography Enabling Fine Pitch Wafer Bumping Microlithographic Polymer Films Microlithographic Polymer Films (MPF) are designed for advanced semiconductor packaging applications, including flip chip, backside wafer coating and other wafer level packaging and MEMS applications. MPF brings the most advanced, negative photoresist formulations for excellent productivity, lower environmental footprint, simple processing and high yields. MPF allows solvent free, aqueous-based developer and remover processing, without jeopardizing cleanliness and resolution. Properties and Benefits • • • • • Storage and shelf life • long shelf life under ambient conditions • does not require cold or freezing storage • ready to use • double plastic wrap under clean room environment Three-ply composite/processing protection • no operator exposure to solvents or polymer components • polyester coversheet reduces photomask contamination Thickness uniformity • no edge bead • fewer process steps • increased wafer real estate utilization Easy application/low waste • lower environmental impact • no solvents • high throughput • low sensitivity to wafer surface contamination Conformation and bridging • application flexibility • thickness uniformity For more information on Microlithographic Polymer Films or other DuPont Semiconductor Materials Solutions, please contact your local representative: Americas/Europe DuPont Electronic Technologies Pedro D. Jorge 14 TW Alexander Drive Research Triangle Park, NC 27709 Tel: 570 268 3176 [email protected] Asia DuPont Taiwan MPF conforms over existing structures without compromising photoresist thickness Tony Lieu 45 Hsing-Pont Road Taoyuan 330 Taiwan Tel: 886 3 377 3608 [email protected] Japan DuPont Japan Hidehiro Yamada 19-2 Kiyohara Kohgyo Danchi Utsunomiya Tochigi 321 3231 Japan Tel: 81 28 667 6938 [email protected] MPF bridges over pre-etched trenches without compromising photoresist thickness One DuPont: Your Source for Semiconductor Materials www.semiconductor.dupont.com www.dupont.com/pcm/icp ©2005 DuPont. All rights reserved. The DuPont Oval Logo, DuPont™, and The miracles of science™ are registered trademarks or trademarks of E.I. du Pont de Nemours and Company or its affiliates. NO PART OF THIS MATERIAL MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM OR TRANSMITTED IN ANY FORM OR BY ANY MEANS ELECTRONIC, MECHANICAL, PHOTOCOPYING, RECORDING OR OTHERWISE WITHOUT THE PRIOR WRITTEN PERMISSION OF DUPONT. H-10758 6/05