Advanced Packaging Lithography Microlithographic Polymer Films Enabling Fine Pitch Wafer Bumping

Transcription

Advanced Packaging Lithography Microlithographic Polymer Films Enabling Fine Pitch Wafer Bumping
Advanced Packaging Lithography
Enabling Fine Pitch Wafer Bumping
Microlithographic Polymer Films
Microlithographic Polymer Films (MPF) are designed for advanced semiconductor packaging applications, including flip chip, backside wafer coating and other wafer level packaging
and MEMS applications.
MPF brings the most advanced, negative photoresist formulations for excellent productivity,
lower environmental footprint, simple processing and high yields. MPF allows solvent free,
aqueous-based developer and remover processing, without jeopardizing cleanliness and
resolution.
Properties and Benefits
•
•
•
•
•
Storage and shelf life
• long shelf life under ambient conditions
• does not require cold or freezing storage
• ready to use
• double plastic wrap under clean room environment
Three-ply composite/processing protection
• no operator exposure to solvents or polymer components
• polyester coversheet reduces photomask contamination
Thickness uniformity
• no edge bead
• fewer process steps
• increased wafer real estate utilization
Easy application/low waste
• lower environmental impact
• no solvents
• high throughput
• low sensitivity to wafer surface contamination
Conformation and bridging
• application flexibility
• thickness uniformity
For more information on Microlithographic Polymer Films or
other DuPont Semiconductor Materials Solutions, please
contact your local representative:
Americas/Europe
DuPont Electronic Technologies
Pedro D. Jorge
14 TW Alexander Drive
Research Triangle Park, NC 27709
Tel: 570 268 3176
[email protected]
Asia
DuPont Taiwan
MPF conforms over existing structures without
compromising photoresist thickness
Tony Lieu
45 Hsing-Pont Road
Taoyuan 330 Taiwan
Tel: 886 3 377 3608
[email protected]
Japan
DuPont Japan
Hidehiro Yamada
19-2 Kiyohara Kohgyo Danchi
Utsunomiya Tochigi 321 3231
Japan
Tel: 81 28 667 6938
[email protected]
MPF bridges over pre-etched trenches without compromising photoresist thickness
One DuPont: Your Source for Semiconductor Materials
www.semiconductor.dupont.com
www.dupont.com/pcm/icp
©2005 DuPont. All rights reserved. The DuPont Oval Logo, DuPont™, and The miracles of science™ are registered trademarks or trademarks of E.I. du Pont
de Nemours and Company or its affiliates.
NO PART OF THIS MATERIAL MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM OR TRANSMITTED IN ANY FORM OR BY ANY MEANS ELECTRONIC,
MECHANICAL, PHOTOCOPYING, RECORDING OR OTHERWISE WITHOUT THE PRIOR WRITTEN PERMISSION OF DUPONT.
H-10758 6/05