MRAM : Materials and Devices

MRAM : Materials and Devices
Current--induced Domain Wall Motion
Current
High--speed MRAM
High
N.
N Ishiwata
NEC Corporation
A portion of this study was supported by NEDO.
Page 1
Outline
▐ Introduction
 Positioning and direction of MRAM
 High speed MRAM cell
▐ Domain wall motion cell for high
g speed
p
MRAM
 Device structure and materials
 Writing properties and memory operation
▐ Summary
Page 2
Comparison of novel and conventional memories
MRAM
FeRAM
PRAM
FLASH
SRAM
DRAM
Mechanism
Magnetic
Tunnel
J
Junction
ti
FerroFerroelectric
Phase
change
Floating
gate
Transistor
Capacitor
Non--volatile
Non
○
○
○
○
×
×
Endurance
Unlimited
(>10
( 1015)
Limited
(<10
( 1013)
Limited
(<10
( 109)
Limited
(<10
( 106)
Unlimited
(>10
( 1015)
Unlimited
(>10
( 1015)
Access time
Very Fast
(~10ns)
Fast
(50~100ns)
Medium
(>100ns)
Fast (read)
Slow (write)
Very fast
(~10ns)
Fast
(~50ns)
Refresh
No
No
No
No
No
Yes
Cell size
Medium
Large
Small
Very Small
Large
Small
Low voltage
○
○
○
△
○
○
High
temperature
operation
○
×
×
△
○
△
Application
Work
memory
Work
memory?
Storage
Storage
Work
memory
Work
memory
▐ MRAM has great potential for use as non-volatile working memory.
Page 3
Perfformance
e
Frequency (Hz)
DWM--MRAM cell is located at …
DWM
DWM-MRAM
DWM12 F2
>200 MHz
High-speed
HigheSRAM
1G
eSRAM
100M
eDRAM
eFLASH
DRAM
10M
1st-MRAM
Cost
FLASH
100
10
1
Relative cell size (F2)
▐ 12F2 & 200MHz cell has the features of eSRAM & eDRAM
eDRAM.
▐ Very useful for future high-speed embedded memory in SoC.
Page 4
2Tr--1MTJ cell for high2Tr
high-speed MRAM operation
2Tr--1MTJ cell
2Tr
BL
GND
/BL
Read
MTJ
250 MHz (ASSCC 2007)
WL
Write
3-terminals magnetic element
32 Mbit (ISSCC 2009)
▐ No problem with either write disturbance or read one
֜ Great advantage for high-speed operation
Page 5
1
01
0.1
Low
w cost
Iwritee (mA
A)
Key issue : Reduction of writewrite-current (Iwrite)
Field-writing
SoC
0.2 mA
STT writing
STT-writing
100
W (nm)
1000
▐ <0.2 mA ֜ 2Tr-1MTJ cell has higher cost performance than
conventional memories used in SoC.
▐ Spin-transfer torque switching is promising for lowering
write-current.
Page 6
Spin transfer torque switching
▐ Conventional Spin transfer torque switching
 F.J.Albert
F J Albert et al
al., Appl
Appl. Phys
Phys. Lett
Lett., 77-23
77-23, 3809
3809, 2000
2000.
▐ Current-induced domain wall motion ((DWM))
 A.Yamaguchi et al., Phys. Rev. Lett. 92, 077205, 2004.
• NiFe (in-plane)
 M. Yamanouchi et al., NATURE, 428, P.539, 2004.
• GaMnAs (perpendicular)
Page 7
Positive characteristics of DWM elements
▐ Suitable for 2Tr-1MTJ cell
▐ Scalable write-current
write current & write-speed
write speed
▐ Sufficient thermal stability without write current
increase
▐ Suppression for read disturbance & tunneling
barrier damage in write process
▐ CMOS process compatibility
Page 8
Minimum cell layout for 2Tr2Tr-1MTJ DWM cell
Plan--view
Plan
Cross--sectional
Cross
sectional--view
12 F2
4F
4F
BL
/BL
M5
GND.
3F
M6
Memory
element
Tr1
Tr2
WL
Gnd.
BL
/BL
M4
n+
n+
Criterion: Iwrite < 0.2 mA
▐ 12F2  0.1
0 1 m2 @ 90
90-nm
nm rule
▐ 12F2 is possible only when the write-current is < 0.2 mA
Page 9
Device structure for minimum cell layout
Gnd.
Reference
layer
Fixed
region
“0”-state
Tunnel
barrier
Free
layer
Pinning
y
layer
Data
region
i
WL
BL
Tr1
Tr2
e
“1”-write
“1”-state
DW
/BL
DW
Pinning sites
Page 10
DW
e-
“0”-write
What kind of material should be chosen ?
St bl
Stable
IMA
10
In-plane magnetic anisotropy
DW
PMA
1
Perpendicular magnetic anisotropy
0.1
01
1-D model
10
100
Critical field, Hc (Oe)
Small
S
sity,
Critica
al curren
nt dens
jc (x108 A
A/cm2)
LLG (3(3-D) Simulation
DW
1000
Tatara et al. JPSJ, 75, 064708, 2006.
Suzuki et al. JAP, 103, 113913, 2008.
▐ Using PMA, much smaller cell area with much better stability
can be achieved.
Page 11
DWM materials
Material
Anisotropy
Temp.
(K)
Minimum
Jth (A/m2)
Pinning
field (Oe)
Velocity
(m/sec )
(m/sec.)
[Co/Ni]N
Perpendicular
R.T.
0.3x1012
200
60
[Co/Pt]N
Perpendicular
R.T.
1.8x1012
500
-
CoCrPt
Perpendicular
R.T.
1.0x1012
500
-
GaMnAs
Perpendicular
100
8.0x108
40
22
NiFe
In-plane
In
plane
R.T.
1.0x1012
5
110
▐ Co/Ni is the best material for DWM, because of its small
Jth with large pinning field and high velocity.
Page 12
Write--current, Iwrite
Write
1.2
Iwritee (mA)
1.0
Fi d
Fixed
0.8
Fi
Fixed
d
W
0.6
0.4
[Co/Ni]
0.2
02
0.0
DWM
0
100
200
W (nm)
▐ At less than 100 nm width,, the write-current becomes less
than 0.2 mA. ֜ The most important criterion is satisfied.
Page 13
Write--time, twrite
Write
Swittching
p
probab
ility
Proba
ability
Fi
d
Fixed
Fi
d
Fixed
200 nm
1.0
10 ns
5 ns
3 ns
133 nm
0.5
DW
V
VDWM > 50 m/s
0.0
0
100
200
Voltage
(mV)
Pulse
Voltage
(mV)
twrite < 2 ns
@ ℓ ~ 90 nm
>200 MHz
▐ More than 200 MHz operation is promising.
Page 14
DWM
Memory operation : 4 Kbit array
4 Kbit array
MRAM
Frequency (%)
CMOS
-I
60
40
+I
R0
R1
20
0
RMTJ (a.u.)
▐ The two resistance states of the MTJ are clearly separated.
▐ The change of resistance is consistent with current direction.
Page 15
Rmtj
RMTJ (a.u.)
(a.u.)))
Repeat test for write and read operation
R1
R0
0101…
1
0000…
51
1111…
101
00001111…
151
# of W/R
▐ Good reproducible switching and overwrite properties
are confirmed
confirmed.
Page 16
Summary
▐ DWM MRAM with 2Tr-1MTJ high-speed cell
 12 F2 (0.1 m2 @ 90 nm rule), >200
200 MHz
 Scalable write-current & write-speed with sufficient
thermal stability
 4 kbit memory array operation has been
demonstrated
▐ Co/Ni multilayer film with perpendicular
magnetic anisotropy is the answer for DWM
MRAM
Page 17
Th k you
Thank
y
Page 18