Semiconductor and Packaging Report

Transcription

Semiconductor and Packaging Report
THE SEMICONDUCTOR AND PACKAGING REPORT
Third Quarter • December 2014
Photos Source: Prismark/Binghamton University
P
rismark’s Semiconductor and Packaging Report is published quarterly and
provides semiconductor manufacturers, semiconductor packaging companies and
their materials, process, and equipment suppliers with a comprehensive review
and analysis of changes in the global semiconductor packaging industry and how
these changes will affect their business.
CONSULTANTS TO THE ELECTRONICS INDUSTRY
BUSINESS OPPORTUNITY FROM TECHNOLOGY AND
MARKET CHANGES
PRISMARK PARTNERS LLC
This material is  Prismark Partners LLC
130 Main Street, Cold Spring Harbor, NY 11724 USA · Telephone: 631-367-9187 · Fax: 631-367-9223 · e-mail: [email protected]
Visit our website at
www.prismark.com
1
TABLE OF CONTENTS – Q3 2014
INTRODUCTION AND BACKGROUND .........................................................................................................
2
STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS
REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS
FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND
FOUNDRIES. ...........................................................................................................................................
3
PACKAGE SUBSTRATE MARKET
OVERVIEW OF SUBSTRATE BASED PACKAGES, INCLUDING EXAMPLE TEARDOWNS, PACKAGE SUBTSRATE
FORECASTS, TECHNOLOGY ROADMAPS AND LEADING PLAYERS .....................................................................
13
COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION
NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW
PRODUCT OFFERINGS ...............................................................................................................................
29
COMPANY NEWS: IC PACKAGING
RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS. ................
33
COMPANY NEWS: SMARTPHONE INDUSTRY UPDATES – FOCUS ON CHINA
RECENT DEVELOPMENTS IN SMARTPHONE GROWTH OF AT LEADING CHINESE PLAYERS. ................................
37
WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION
All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable
at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees
have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with
respect to this information and shall bear no liability whatsoever to the report recipient or to any other party
as a result of the use of this report or the information contained herein.
All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is
copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material
may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the
express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark.
PRISMARK
PARTNERS LLC
©PRISMARK PARTNERS LLC
SPR Q3 2014
1
TABLE OF CONTENTS – Q2 2014
INTRODUCTION AND BACKGROUND .........................................................................................................
2
STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS
REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS
FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND
FOUNDRIES. ...........................................................................................................................................
3
IC PACKAGE MARKET UPDATE
OVERVIEW OF IC PACKAGE TRENDS, INCLUDING DEVICE FORECASTS, MARKET GROWTH BY PACKAGE TYPE,
AND PACKAGE OUTSOURCING TRENDS ........................................................................................................
10
IMAGE SENSOR PACKAGING
SUMMARY OF MARKET SIZE, PLAYERS AND PACKAGE TRENDS WITH IMAGE SENSORS AND CAMERA MODULES....
17
COMPANY NEWS: IMAGE SENSORS
RECENT DEVELOPMENTS IN IMAGE SENSOR DEVICE SUPPLIERS AND RELATED ASSEMBLY PARTNERS .................
27
COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION
NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW
PRODUCT OFFERINGS ...............................................................................................................................
31
COMPANY NEWS: IC PACKAGING
RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS ...................
34
WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION
All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable
at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees
have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with
respect to this information and shall bear no liability whatsoever to the report recipient or to any other party
as a result of the use of this report or the information contained herein.
All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is
copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material
may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the
express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark.
PRISMARK
PARTNERS LLC
©PRISMARK PARTNERS LLC
SPR Q2 2014
1
TABLE OF CONTENTS – Q1 2014
INTRODUCTION AND BACKGROUND .........................................................................................................
2
STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS
REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS
FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND
FOUNDRIES. ...........................................................................................................................................
3
WEARABLE ELECTRONICS
MUCH HYPE IS SURROUNDING THIS SEGMENT, WITH FEW KILLER PRODUCTS TO DATE. AS WE WAIT THE FOR
LONG AWAITED “IWATCH”, WE LOOK AT A FEW PRODUCTS DEFINING THE SEGMENT TODAY ..............................
13
COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION
NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW
PRODUCT OFFERINGS ...............................................................................................................................
27
COMPANY NEWS: IC PACKAGING
RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS. ................
31
UPDATES ON THE PC AND NOTEBOOK MARKETS
SUMMARY OF RECENT TRENDS WITH MAJOR NOTEBOOK AND MOTHERBOARD PLAYERS ...................................
36
WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION
All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable
at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees
have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with
respect to this information and shall bear no liability whatsoever to the report recipient or to any other party
as a result of the use of this report or the information contained herein.
All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is
copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material
may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the
express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark.
PRISMARK
PARTNERS LLC
©PRISMARK PARTNERS LLC
SPR Q1 2014
TABLE OF CONTENTS – Q4 2013
INTRODUCTION AND BACKGROUND .........................................................................................................
2
STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS
REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS
FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND
FOUNDRIES.
BREAKDOWN OF SEMICONDUCTOR GROWTH BY SEGMENT OUT TO 2018 .........................................
3
SYSTEM-IN-PACKAGE (SiP)
WHILE 2.5D AND 3D PACKAGE APPROACHES CONTINUE TO BE IN DEVELOPMENT, SiP APPROACHES CONTINUE TO
BE ADOPTED IN HIGH VOLUMES. THIS CHAPTER IS A REVIEW OF SiP APPROACHES, ADOPTION AND FORECASTS
OUT TO 2018 .............................................................................................................................................
13
COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION
NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW PRODUCT
.................................................................................................................................................
OFFERINGS
25
COMPANY NEWS: IC PACKAGING
RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS. .....................
27
UPDATES ON THE IC MANUFACTURING INDUSTRY IN CHINA
SUMMARY AND MERCHANT IC PACKAGE ASSEMBLY PLAYERS IN MAINLAND CHINA ...............................................
31
WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION
All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable at
the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees have
exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with
respect to this information and shall bear no liability whatsoever to the report recipient or to any other party
as a result of the use of this report or the information contained herein.
All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is
copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material may
not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the
express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark.
PRISMARK
PARTNERS LLC
©PRISMARK PARTNERS LLC
SPR Q4 2013