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Semiconductor and Packaging Report
THE SEMICONDUCTOR AND PACKAGING REPORT Third Quarter • December 2014 Photos Source: Prismark/Binghamton University P rismark’s Semiconductor and Packaging Report is published quarterly and provides semiconductor manufacturers, semiconductor packaging companies and their materials, process, and equipment suppliers with a comprehensive review and analysis of changes in the global semiconductor packaging industry and how these changes will affect their business. CONSULTANTS TO THE ELECTRONICS INDUSTRY BUSINESS OPPORTUNITY FROM TECHNOLOGY AND MARKET CHANGES PRISMARK PARTNERS LLC This material is Prismark Partners LLC 130 Main Street, Cold Spring Harbor, NY 11724 USA · Telephone: 631-367-9187 · Fax: 631-367-9223 · e-mail: [email protected] Visit our website at www.prismark.com 1 TABLE OF CONTENTS – Q3 2014 INTRODUCTION AND BACKGROUND ......................................................................................................... 2 STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND FOUNDRIES. ........................................................................................................................................... 3 PACKAGE SUBSTRATE MARKET OVERVIEW OF SUBSTRATE BASED PACKAGES, INCLUDING EXAMPLE TEARDOWNS, PACKAGE SUBTSRATE FORECASTS, TECHNOLOGY ROADMAPS AND LEADING PLAYERS ..................................................................... 13 COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW PRODUCT OFFERINGS ............................................................................................................................... 29 COMPANY NEWS: IC PACKAGING RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS. ................ 33 COMPANY NEWS: SMARTPHONE INDUSTRY UPDATES – FOCUS ON CHINA RECENT DEVELOPMENTS IN SMARTPHONE GROWTH OF AT LEADING CHINESE PLAYERS. ................................ 37 WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with respect to this information and shall bear no liability whatsoever to the report recipient or to any other party as a result of the use of this report or the information contained herein. All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark. PRISMARK PARTNERS LLC ©PRISMARK PARTNERS LLC SPR Q3 2014 1 TABLE OF CONTENTS – Q2 2014 INTRODUCTION AND BACKGROUND ......................................................................................................... 2 STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND FOUNDRIES. ........................................................................................................................................... 3 IC PACKAGE MARKET UPDATE OVERVIEW OF IC PACKAGE TRENDS, INCLUDING DEVICE FORECASTS, MARKET GROWTH BY PACKAGE TYPE, AND PACKAGE OUTSOURCING TRENDS ........................................................................................................ 10 IMAGE SENSOR PACKAGING SUMMARY OF MARKET SIZE, PLAYERS AND PACKAGE TRENDS WITH IMAGE SENSORS AND CAMERA MODULES.... 17 COMPANY NEWS: IMAGE SENSORS RECENT DEVELOPMENTS IN IMAGE SENSOR DEVICE SUPPLIERS AND RELATED ASSEMBLY PARTNERS ................. 27 COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW PRODUCT OFFERINGS ............................................................................................................................... 31 COMPANY NEWS: IC PACKAGING RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS ................... 34 WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with respect to this information and shall bear no liability whatsoever to the report recipient or to any other party as a result of the use of this report or the information contained herein. All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark. PRISMARK PARTNERS LLC ©PRISMARK PARTNERS LLC SPR Q2 2014 1 TABLE OF CONTENTS – Q1 2014 INTRODUCTION AND BACKGROUND ......................................................................................................... 2 STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND FOUNDRIES. ........................................................................................................................................... 3 WEARABLE ELECTRONICS MUCH HYPE IS SURROUNDING THIS SEGMENT, WITH FEW KILLER PRODUCTS TO DATE. AS WE WAIT THE FOR LONG AWAITED “IWATCH”, WE LOOK AT A FEW PRODUCTS DEFINING THE SEGMENT TODAY .............................. 13 COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW PRODUCT OFFERINGS ............................................................................................................................... 27 COMPANY NEWS: IC PACKAGING RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS. ................ 31 UPDATES ON THE PC AND NOTEBOOK MARKETS SUMMARY OF RECENT TRENDS WITH MAJOR NOTEBOOK AND MOTHERBOARD PLAYERS ................................... 36 WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with respect to this information and shall bear no liability whatsoever to the report recipient or to any other party as a result of the use of this report or the information contained herein. All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark. PRISMARK PARTNERS LLC ©PRISMARK PARTNERS LLC SPR Q1 2014 TABLE OF CONTENTS – Q4 2013 INTRODUCTION AND BACKGROUND ......................................................................................................... 2 STATE OF THE SEMICONDUCTOR AND PACKAGE BUSINESS REVIEW OF THE STATUS OF SEMICONDUCTOR SHIPMENTS; PRISMARK’S GLOBAL ECONOMIC AND ELECTRONICS FORECAST; ACTUAL AND FORECAST SALES OF SEMICONDUCTOR SUPPLIERS, PACKAGE ASSEMBLERS, AND FOUNDRIES. BREAKDOWN OF SEMICONDUCTOR GROWTH BY SEGMENT OUT TO 2018 ......................................... 3 SYSTEM-IN-PACKAGE (SiP) WHILE 2.5D AND 3D PACKAGE APPROACHES CONTINUE TO BE IN DEVELOPMENT, SiP APPROACHES CONTINUE TO BE ADOPTED IN HIGH VOLUMES. THIS CHAPTER IS A REVIEW OF SiP APPROACHES, ADOPTION AND FORECASTS OUT TO 2018 ............................................................................................................................................. 13 COMPANY NEWS: SEMICONDUCTOR AND WAFER FABRICATION NEWS IN THE SEMICONDUCTOR AND FOUNDRY BUSINESSES REGARDING LEADING PLAYERS AND NEW PRODUCT ................................................................................................................................................. OFFERINGS 25 COMPANY NEWS: IC PACKAGING RECENT DEVELOPMENTS IN PACKAGING AT LEADING OSAT AND CAPTIVE ASSEMBLY OPERATIONS. ..................... 27 UPDATES ON THE IC MANUFACTURING INDUSTRY IN CHINA SUMMARY AND MERCHANT IC PACKAGE ASSEMBLY PLAYERS IN MAINLAND CHINA ............................................... 31 WARRANTY DISCLAIMER AND COPYRIGHT NOTIFICATION All information used in the preparation of Prismark Reports is obtained from sources believed to be reliable at the time the information was collected. Prismark Partners LLC, its employees, its agents, and assignees have exercised their best efforts in preparing our reports. Prismark Partners LLC extends no warranties with respect to this information and shall bear no liability whatsoever to the report recipient or to any other party as a result of the use of this report or the information contained herein. All information, including graphics, diagrams, forecasts, and commentary contained in Prismark reports is copyright of Prismark Partners LLC and is for the exclusive internal use of Prismark clients. The material may not be duplicated, distributed, emailed, web posted or copied in any form to external parties without the express permission of Prismark Partners LLC. Please direct inquiries for authorized use to Prismark. PRISMARK PARTNERS LLC ©PRISMARK PARTNERS LLC SPR Q4 2013
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