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ISSUE
03
FEATURED TECHNOLOGIES
802.15.4 / SUB-GIG
Bluetooth
Cellular
Wi-Fi
SUPPLIERS
Taking the world wireless
Connectivity Solutions
CSR
Digi
GainSpan
MultiTech
Murata
Panasonic
Silex
TABLE OF CONTENTS
ISSUE 3
802.15.4 / SUB-GIG
DIGI - Digi XLR PRO with Punch2 Technology™ is the Most Reliable Unlicensed 900MHz
Radio in Noisy RF Environments – Capable of 100+mile Range
3
BLUETOOTH
CSR - CSRmeshTM Low Power Wireless Solution Enables the Internet of Things
5
Murata - Murata Type ZY Bluetooth Smart Module
7
Panasonic - PAN1322 Series - All-In-One, Place and Play Bluetooth® Module
8
CELLULAR
Multi-Tech - Fully Certified, Carrier Approved Cellular Connectivity for Your
M2M/IOT Application
10
WI-FI
Gainspan - GS2011M Ultra-Low Power High Speed 802.11B/G/N Module
13
Silex - SX-PCEAN2: 802.11 A/B/G/N Mini PCIE Radio Module
With Industrial Temperature Support
16
GET CONNECTED | ISSUE 3
2
DIGI XLR PRO WITH PUNCH2 TECHNOLOGY™ IS THE
MOST RELIABLE UNLICENSED 900MHZ RADIO IN NOISY
RF ENVIRONMENTS - CAPABLE OF 100+MILE RANGE
The Digi XLR PRO™ is a high performance, industrial grade long-range 900
MHz radio that offers reliable wireless communications for serial and Ethernet
devices over long distances.
Digi’s patent-pending Punch2 Technology™ enables the Digi XLR PRO to
achieve industry-leading range of 100+ miles and interference immunity that
will punch through noisy RF environments. Flexible configuration options,
including XCTU (Digi’s configuration platform), local Web UI or Digi Remote
Device Manager(TM), allow for quick configuration and deployment of multiple
Digi XLR PRO radios in the field. Critical device management features include
over-the-air firmware updates, device status information and centralized
remote management using Digi Remote Device Manager(TM).
APPLICATIONS
• Oil/Gas – Digital Oilfield Automation
• Utilities
• Precision Agriculture
• Digital Signage
FEATURES/BENEFITS
Figure 1: Digi XLR PRO with
Punch2 Technology™
• Patent-pending Punch2
• Flexible data rates of up to 3.2 Mbps
Technology™ enables industry• Simple configuration via XCTU,
leading interference immunity
local WebUI or Digi Remote Device
• Best-in-class range of 1 to 100+ miles
Manager(TM)
LOS
• Scalable device management with
• Industrial aluminum-cast design with
Digi Remote Device Manager(TM)
-40° C to +70° C temperature rating
and Class 1 Division 2 certification
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
DOCUMENTS
XL9-UA
Digi XLR PRO Long-Range 900MHz Modem, Includes Accessories – North
America
PRODUCT BRIEF
XL9-U
Digi XLR PRO Long-Range 900MHz Modem, No Accessories – North America
PRODUCT BRIEF
DOWNLOADABLE EXTRAS
• XLR - White Paper
• Getting Started Guide: XLR Pro
TECHNOLOGY | 802.15.4 / SUB-GIG
• Quick Start Guide: XLR Pro
3
XLR PRO PART SPECIFICATIONS
GENERAL
Dimensions
18 x 13 x 3.8 cm (7.1 x 5 x 1.5 inches)
Ethernet Physical Layer
10/100BASE-T/TX
Ethernet Protocols
UDP/TCP, DHCP Client
PERFORMANCE
Frequency Range
ISM 902 to 928 MHz
RF Data Rate
9.3 kbps to 3.2 Mbps
Transmit Power (Software Selectable)
Up to 30 dBm (highest power level)
Range - Line of Sight
100+ Miles
Receiver Sensitivity
9.4 kbps: -120 dBm; 141 kbps: -112 dBm; 3.2 Mbps: -98 dBm
Receiver Selectivity
141 kbps: 70 dB (below 908 MHz, above 922 MHz) 40 dB (908 MHz to 922 MHz)
Throughput Data Rate (Software Selectable)
460.8 kbps (TCP/UDP Socket); 921.6 kbps (Serial RS-485); 460.8 kbps (Serial RS-232)
NETWORKING AND SECURITY
Modulation
Punch2 Technology™ (Patent pending)
Supported Network Topologies
Point-to-point/point-to-multipoint
Encryption
128-bit AES
POWER REQUIREMENTS
Supply Voltage
9 V to 26 V
Receive Current
300 mA @ 9 V; 230 mA @ 12 V; 120 mA @ 26 V
Transmit Current
950 mA @ 9 V; 840 mA @ 12 V; 400 mA @ 26 V
ENVIRONMENTAL
Operating Temperature
-40°C to +70°C
REGULATORY APPROVALS
Emissions/Immunity
FCC Part 15B, IC
Hazardous Locations
Class 1 Division 2 Groups A, B, C, D
CONNECTORS
Antenna
RPTNC
Power Supply
Phoenix
Ethernet
(2) RJ45
Serial
(1) RJ45 - RS232/485
Configuration Port
Mini-USB (Coming Soon)
TECHNOLOGY | 802.15.4 / SUB-GIG
4
CSRmeshTM LOW POWER WIRELESS SOLUTION
ENABLES THE INTERNET OF THINGS
CSRmesh is a configuration and control protocol running over Bluetooth® 4.0
devices that enables messages to be sent to individual devices or groups and
relayed over multiple Bluetooth Smart devices thus extending the range of
Bluetooth Smart and turning it into a mesh network for the Internet of Things.
CSRmesh allows developers to network individual or groups of devices,
such as a smartphone or tablet with lighting, heating, security sensors or
appliances and thereby create comprehensive home automation connectivity
solutions.
CSR is actively working with the Bluetooth SIG to standardize the technology
and enable wide participation from many manufacturers.
Figure 1: CSRmesh™
Development Board
APPLICATIONS
• Internet of things
• Wireless lighting and control
• Home automation
• H
eating, ventilation and air
conditioning control and
monitoring
http://www.csr.com/products/technology/csrmesh
BENEFITS
• Simple direct configuration and
• Virtually unlimited number of devices
control from existing Smartphones
can be connected (up to 64,000)
and tablets. Android and iOS devices • Safe and secure message
supported
transmission
• No need for a complicated or
• Robust and failsafe
expensive hub device or access point
• S
ecurity and sensing, door and
window locks/sensors
• Appliances
• Control of home entertainment
FEATURES
• Single-chip µEnergy® radio with
integrated microprocessor and
enhanced memory for greater
application flexibility
• P
rotocol layer that runs on top of
existing CSR Bluetooth 4.0 devices
• E
asy to use and configure from
Smartphone App
• H
igh level security prevents
eavesdropping, man-in-middle and
replay attacks
• A
uthentication mode for enhanced
security
Figure 2: CSRmesh™
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
5
CSRmesh Development Kits introduce a simplified yet comprehensive
development platform for product designers who want to rapidly prototype
networking of Bluetooth Smart products using the CSRmesh protocol.
CSRMESH DEVELOPMENT BOARD FEATURES
Figure 3: CSRMesh
Development Kit
• CSR1010 IC with 64k EEPROM – a
single-chip µEnergy® radio with
integrated microprocessor and
enhanced memory for greater
application flexibility.
• PCB antenna
• 1x RGB LED
• Power switch
• 2x user pushbuttons & 1x user slide
switch
• SPI programming connector
• 2x AA battery holders on reverse
• Pads to connect IO to external
devices
TOOL SELECTOR TABLE
PART NUMBER
DESCRIPTION
Full development kit, 3x target
DK-CSR1010-10184-1A boards, programmer, cables,
batteries
DB-CSR1010-10185-1A
Board only, 1x development
board, batteries
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
DOCUMENTS
PRODUCT BRIEF
PRODUCT BRIEF
6
MURATA TYPE ZY BLUETOOTH SMART MODULE
Murata’s Type ZY Bluetooth SMART Module (part number LBCA2HNZYZ-711)
supports Bluetooth v4.1 BLE standard. All protocol stacks required for
Bluetooth low energy communication are built in, including various healthcare
profiles. It features an onboard PCB Antenna, low current consumption, and
ibeacon support.
BENEFITS
• Extremely flexible for a variety of
Bluetooth Low Energy Applications
Figure 1: LBCA2HNZYZ-711
• Miniature size (7.4 x 7.0 x 1.0mm)
• Outstanding DC current
consumption (4.5mA) making it
practical to run Bluetooth Low
Energy applications from a tiny coin
cell battery with long life.
FEATURES
• Overall dimensions measure a
tiny 7.4 x 7.0 x 1.0 mm enabling
placement within space critical
devices
• Offers outstanding DC current
consumption (4.5mA)
• Two host interfaces, UART and SPI
• Additional data sensing interfaces
including I2C, GPIOs, ADC, and
quadrature decoder
• Integrated 2.4GHz antenna
contained within the encapsulated
module package.
• Many BLE profiles are available
– standard as well as custom for
customer specific applications.
• The module is certified for the
wireless regulatory domains of FCC
for America, Industry Canada, and
European CE Mark.
Figure 2: Block Diagram
PART SELECTOR TABLE
PART NUMBER
LBCA2HNZYZ-711
DESCRIPTION
Type ZY Bluetooth Smart 4.1 Low Energy Module
APPLICATIONS
• Sensing Nodes
• Health & Fitness
• Medical Devices
• Wearables
DEVELOPMENT KIT
PART NUMBER
LBCA2HNZYZ-TEMP-DK
DESCRIPTION
Type ZY Bluetooth Smart 4.1 Low Energy Module
• Smart Phone Peripherals
• Remote Controls
• Proximity Tags
• Wireless Gadgets
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
7
PANASONIC PAN1322 SERIES
ALL-IN-ONE, PLACE AND PLAY BLUETOOTH® MODULE
Panasonic PAN1322 module features an embedded microcontroller,
Bluetooth 2.1 + EDR stack, serial port profile (SPP), AT command set API and
antenna. This cost engineered solution is based on a single chip solution that
integrates an ARM7TDMI processor with a Bluetooth controller. The BT 2.1
+ EDR stack provides secure, reliable, high speed data connections using
Secure Simple Paring (SSP) eliminating manual password creation. Embedded
serial port profile (SPP) frees application resources while the AT command set
API creates a simple firmware interface using modem commands. An onboard
antenna does away with 2.4GHz RF circuit complexity.
Figure 1: PAN1322 Series
APPLICATIONS
• iOS and Android Devices
• Wireless Sensors
• Cable Replacement
• Industrial
• Medical
• Automotive
FEATURES/SPECS
Created with the design engineer in mind, product design cycles are greatly
reduced using Panasonic’s reference design and design review services.
PCB layouts are simplified using available Gerber files and minimized with
Panasonic’s tiny footprint technology. The module is just 15.6mm x 8.7mm
x 2.8mm and fully shielded to improve immunity. GPIO is exposed using
AT commands. All Panasonic Bluetooth RF modules carry FCC, IC, CE
Bluetooth certifications.
The PAN1322 Series recognizes Apple’s authentication coprocessor and
supports Bluetooth Serial Port Profile (SPP) data communication1 with
Apple’s iPhone and iPad®*. Connectivity also includes Android, smart
phones and all Bluetooth enabled devices2.
Panasonic remains committed to customers as a module manufacturer by
extending product life using legacy footprints and firmware interfaces to
make the PAN1322 Series fully compatible with the module it replaces, the
PAN1321 Series.
• SPP Device A and B, RFCOMM
Profiles
Hardware and firmware prototyping and testing are accelerated using
the EVAL_PAN1322 development kit and SPP Toolbox development
environment.
• Industrial Temperature Range, -40
to +85°C
1. Apple authentication coprocessor and MFI certification is required.
2. Connectivity requires that devices support Bluetooth Serial Port Profile
• No External Components Needed
*Apple iPad and iPhone are trademarks of Apple Inc.
• Bluetooth Version 2.1 + EDR
• Onboard Voltage Regulator,
VIN=2.7 to 3.6 V
• Integrated ARM7RDMI 32-Bit
Processor w/Patchable EEPROM
• 3.25 MBaud UART
• GPIO w/Interrupt and Wake-Up
Capabilities
EEPROM
VDD1
Ceramic
Antenna
I2C
VDD_UART
PMB8754
BlueMoon
UniCellular
UART
GPIO
VSUPPLY
Balun
Filter /
Matching
Voltage
Regulator
Crystal
26 MHz
Figure 2: Block Diagram
TECHNOLOGY
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| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
8
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
DATASHEET URL
DEV. TOOLS
ENW-89841A3KF
PAN1322 Bluetooth Module, SPP,
Integrated Antenna
http://na.industrial.panasonic.com/sites/default/pidsa/files/downloads/files/panasonic_
pan1322_datasheet.pdf
YES
EVAL_PAN1322
PAN1322 Evaluation Kit
http://na.industrial.panasonic.com/products/
wireless-connectivity/evaluation-kits/pan1322evaluation-kit
YES
Figure 3: Development Tools
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
9
FULLY CERTIFIED, CARRIER APPROVED
CELLULAR CONNECTIVITY FOR YOUR M2M/IOT
APPLICATION
The SocketModem® Cell embedded cellular modem is ideal for customers
looking to add cellular communications to their device or solution. This
carrier approved and end-device certified embedded cellular modem
offers a universal socket footprint that assures a seamless migration to
future technologies. This design approach spans across all major cellular
technologies, and provides a long solution lifecycle reducing redesign time
and costs.
Figure 1: SocketModem Cell
MTSMC-H5
APPLICATIONS
•
•
•
•
Asset Tracking
ATM terminals
Data collection
Industrial and medical remote
monitoring systems
• Remote diagnostics
•
•
•
•
•
Remote metering
Security systems
Lighting solutions
Vending/gaming machines
Other devices requiring cellular
connectivity
FEATURES
• HSPA+, EV-DO Rev A, GPRS Class 10
and CDMA2000 1xRTT models
• LTE models – engineering samples
available now
• Universal Socket connectivity
• Serial or USB interfaces
• Serial interface supports speeds up
to 921.6K bps
• USB 2.0 HS compliant (HSPA+ and
EV-DO models only)
• Two-year warranty
BENEFITS
Figure 2: SocketModem Cell
Pin-out Diagram
• Interchangeable communications
• Partnerships with leading telecom
devices for easy migration and
operators, regulatory agencies and
upgrades without a redesign
service enablement providers in
the wireless ecosystem to meet any
• Wide selection of cellular
Machine-to-Machine challenge
technologies and models to optimize
deployment needs
• Fully certified, carrier approved as
an end-device for use in the U.S.,
• 5-7 year product lifecycle
Canada and European Union
TECHNOLOGY
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TECHNOLOGY
| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
10
PART SPECIFICATIONS
MODEL
MTSMC-H5
MTSMC-EV3
MTSMC-G2/G3
MTSMC-C2
Technical Specifications
Performance
HSPA+
Frequency Band
EV-DO Rev A
GPRS Class 10
CDMA2000 1xRTT
3G: 850/900/1700
800/1900 MHz
(AWS)/1900/2100 MHz
2G: 850/900/1800/1900
MHz
850/900/1800/1900
MHz
800/1900 MHz
USB
USB 2.0 High Speed
USB 2.0 High Speed
N/A
N/A
TCP/IP Functions
FTP, SMTP, TCP, UDP,
SSL, & HTTP
FTP, SMTP, TCP, & UDP G2 Models: FTP, HTTP,
POP3, SMTP, TCP Client & Server, & UDP
Client
G3 Model: FTP, SMTP,
TCP, & UDP
FTP, SMTP, TCP, & UDP
Power Draw*
5VDC; 19mA sleep,
28mA idle, 397mA
maximum
5VDC; 22mA sleep,
34mA idle, 423mA
maximum
G2 Models: 5VDC,
15mA sleep, 113mA
typical, 240mA maximum
G3 Model: 5VDC,
32mA sleep, 54mA
idel, 358mA maximum
5VDC; 32mA sleep,
45mA idle, 552mA
maximum
Input Power
3.3V – 5VDC
3.3V – 5VDC
G2 Models: 5VDC
G3 Model: 3.3V–5VDC
3.3V – 5VDC
Connectors
Antenna: 2 UFL
Up to 2 UFL
(Cellular & Rx Diversity) (Cellular & Rx Diversity)
Mini SIM: 1.8V & 3V
Antenna: 1 UFL
Mini SIM: 1.8V & 3V
Antenna: 1 UFL
Physical Description
Physical Dimensions
3.15” x 1.375” (80.010 mm x 34.925 mm)
Environmental
Operating Temperature
-35° to +85°C
-40° to +85°C
Storage Temperature
-40° to +85°C
-40° to +85°C
-40° to +85°C
Humidity
Relative humidity 20% to 90% non-condensing
Certifications
EMC & Radio
Compliance
See datasheet
Safety
See datasheet
Network
Carrier
PTCRB
AT&T, Aeris, T-Mobile
N/A
G2 Models: PTCRB
G3 Model: Uses a GCF
certified module
N/A
Verizon, Aeris
G2 Models: AT&T,
Aeris, T-Mobile
Verizon, Aeris, Sprint
*See device guides for additional information
TECHNOLOGY
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| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
11
DEVELOPMENT TOOLS:
MultiTech’s Universal Socket developer’s kit allows you to plug in the
communications device and use it for testing, programming and evaluation.
The kit includes one development board, universal power supply, antennas,
cables and software.
Ordering Part Number: MTSMI-UDK
MultiTech’s SocketModem® Shield™ is a rapid prototyping and
development tool for cellular connectivity. It gives access to MultiTech’s extensive line of fully-certified cellular SocketModem’s through
an Arduino Shield interface, the de facto standard for accessory cards in the
microcontroller development community. This product also comes with an
mbed compatible software library for even faster development. Please visit
MultiTech’s mbed page for more information.
Ordering Part Number: MTSAS-DK
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
MTSMC-H5
HSPA+ Embedded Modem (Serial Interface) – Global
MTSMC-H5-U
HSPA+ Embedded Modem (USB Interface) – Global
MTSMC-EV3-N3
EV-DO Embedded Modem (Serial Interface) for Verizon Networks
MTSMC-EV3-U-N3
EV-DO Embedded Modem (USB Interface) for Verizon Networks
MTSMC-EV3-N16
EV-DO Embedded Modem (Serial Interface) for Aeris Networks
MTSMC-EV3-U-N16
EV-DO Embedded Modem (USB Interface) for Aeris Networks
MTSMC-G2
850/1900 MHz GSM/GPRS Embedded Modem – Global
MTSMC-G2-ED
900/1800 MHz GSM/GPRS Embedded Modem – Global
MTSMC-G2-V
850/1900 MHz GSM/GPRS Embedded Modem w/Voice – Global
MTSMC-G2-V-ED
900/1800 MHz GSM/GPRS Embedded Modem w/Voice – Global
MTSMC-G3-EU
850/900/1800/1900 MHz GSM/GPRS Embedded Modem – Euro/GB
MTSMC-C2-N2
CDMA2000 1xRTT Embedded Modem (Serial Interface) for Sprint Networks
MTSMC-C2-N3
CDMA2000 1xRTT Embedded Modem (Serial Interface) for Verizon Networks
MTSMC-C2-N16
CDMA2000 1xRTT Embedded Modem (Serial Interface) for Aeris Networks
For information on models for regions not shown above, contact your Future representative.
TECHNOLOGY
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| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
12
GS2011M ULTRA-LOW POWER HIGH SPEED
802.11B/G/N MODULE
The GS2011M is an ultra-low power module that provides a high speed
serial interface connection to an embedded design built on an 8/16/32-bit
microcontroller. The SDIO interface can be clocked at up to 40MHz.
FEATURES
• Power source:
- 3.3V main supply
- 3.3V I/O
- 1.6V to 3.6V Battery
•
Certification: FCC, IC, CE/ETSI,
•
TELEC, Wi-Fi
•
I/O interfaces : SPI, UART, SDIO,
I2C, I2S, GPIO, ADC, JTAG, PWM
•
Industrial Grade
•
IEEE 802.11 b/g/n connectivity with
PHY rates up to 72 Mbps
•
Limited AP, Wi-Fi Direct with
concurrent mode, WPS 2.0
•
UART, SPI, SDIO interface to
microcontroller
•
27 configurable I/O
•
Interface clock rate: 40MHz on
SDIO, 30MHz on SPI (master),
10MHz on SPI (slave), and 921k
baud on UART
The module is IEEE 802.11b/g/n compliant, and meets worldwide regulatory
and Wi-Fi Alliance certification requirements. It includes two analog to digital
converter (ADC) pins for connecting energy measurement and other sensors.
It runs the full Wi-Fi and TCP/IP networking stacks on module, completely
offloading the host microcontroller. The module supports a complete suite
of security protocols, also without tasking the host microcontroller, including
WPA/WPA2-Enteprise and Personal security modes, legacy WEP encryption,
and upper layer security protocols such as TLS/SSL and HTTPs. Alternatively,
it can be run self-contained without a host.
For ease of provisioning, the module can be set up simply and easily from a
smartphone or laptop through the innovative Limited AP mode or with Wi-Fi
Protected Setup (WPS).
The GS2011M is available with an u.FL connector to add an external antenna
for max performance or a ceramic chip for convenience while saving space.
US/Canada (FCC/IC), Europe (CE/ETSI), Japan (TELEC), and Wi-Fi certified.
APPLICATIONS
• Healthcare and fitness
• Commercial Building Automation
• Smart Energy
• Consumer Electronics
• Industrial Controls
BENEFITS
• Adds low power, high speed Wi-Fi and Internet connectivity to any device with
a microcontroller and serial host interface
• C
ertified module reduces development time, testing, and certification,
accelerating time to market
•
xtensive networking stack and
E
services
• E
asy upgrade path: footprint and pin compatible with GS1011M and GS1500M
modules
•
ecurity: 802.11i, WPA/2–Personal
S
and Enterprise, legacy WEP, TLS
• Full offload solution minimizes load on host processor
• Easy smartphone provisioning with Limited AP or Wi-Fi Protected Setup (WPS)
• U
ltra low power consumption through dynamic power management modes
and on module DC to DC regulator
• Extended range
TECHNOLOGY
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| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
13
Figure 2: GS2011M System Block Diagram
Figure 3: GS2011M Block Diagram
GS2011M MODULE SPECIFICATIONS
Backwards compatibility
Pin compatible to GS1011MIE, GS1011MIP, GS1011MEE, GS1011MEP and GS1500M. Same
size and footprint as GS1011MIE and GS1011MIP
Radio Protocol
IEEE 802.11b/g/n
Pin Count
49 pins
RF Output Power (Typical)
+17 dBm (802.11b 1Mbps), +15dBm (802.11g 6Mbps), +14dBm (802.11n MCS0)
Rx Sensitivity
-91 dBm (802.11b 1Mbps), -88 dBm (802.11g 6Mbps), -88 dBm (802.11n MCS0)
Wake From Standby Time
1.25 millisecond
RF Operating Frequency
2.4 - 2.495 GHz
Supported Data Rates
72, 65, 58, 43, 29, 22, 14, 7 Mbps (802.11n), 54, 48, 36, 24, 18, 12, 9, 6 Mbps (802.11g) 11, 5.5,
2, 1 Mbps (802.11b)
Antenna
External Antenna (u.FL connector) or Ceramic Chip
Operating Temperature
-40° to +85°C
Security Protocols
WPA/WPA2 - Personal, WPA/WPA2 - Enterprise (PEAP, EAP-FAST, EAP-TLS, EAP-TTLS),
WEP, TLS/SSL Client and Server, HTTPs
Networking Protocols
TCP, UDP, IPv4, IPv6, TLS Client and Server, SNTP client, DHCP Client and Server v4, DHCP
Client and Server v6, DNS Client and Server, HTTP Client and Server, XML Parser
Certifications and Compliance
FCC, IC, TELEC, CE/ETSI, RoHS, Wi-Fi CERTIFIED
I/O Interfaces
SPI, UART, SDIO, I2C, I2S,GPIO (27), ADC (2), JTAG, PWM (3), RTC (3)
Host Connections
SPI, UART, SDIO
Internal Flash
4 MB
Outline Dimensions
22.8 mm x 32.5 mm x 3.63 mm (shield)
I/O Voltage
3.3V
Operating Voltage
2.7-3.6V
VBAT
1.6-3.6V
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| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
14
PART SELECTOR TABLE
PART NUMBER
ANTENNA OPTION
DOCUMENTS
GS2011MIE
External (u.FL)
http://www.gainspan.com/docs2/GS2011M-PB-new.pdf
GS2011MIZ
Ceramic Chip
http://www.gainspan.com/docs2/GS2011M-PB-new.pdf
The GainSpan GS2011M Evaluation Boards (EVB) provide a quick, easy,
and cost-effective platform for customers to add Wi-Fi capabilities to their
products with minor impact on the host microcontroller firmware. Users can
use the Serial-to-WiFi software packaged with the EVB to build a hosted
application or program the board with custom binaries built using the
GainSpan SDK Builder or GS2000 SDK.
Figure 4: GS2011M/GS2100M EVB
EVALUATION BOARD FEATURES
• Supports highly integrated 802.11b/g/n GS2011M and GS2100M Wi-Fi modules
• S
upports multiple serial ports o UART: up to 921 Kbps o SPI: up to 30MHz (master mode) 10MHz (slave mode) o SDIO: up
to 40MHz
• High resolution sensing and energy measurements for smart energy applications
• Temperature and light sensors for quick development of sensor applications
• C
omes programmed with Serial-to-WiFi software including full Wi-Fi stack - Wi-Fi security (WEP, WPA/2), WPS and
networking stack including TCP/UDP/IP, DNS, DHCP, HTTP/s, DTLS, CoAP, TLS/SSL
• Push button for WPS, Alarms, Factory Restore, and Reset
• JTAG interface for software development
• Daughter card connector for connection to
• Evaluation Board Product Brief:
https://s3.amazonaws.com/site_support/uploads/document_upload/GS2K_BM_EVB_PB_000102.pdf
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
15
SX-PCEAN2: 802.11 A/B/G/N MINI PCIE RADIO
MODULE WITH INDUSTRIAL TEMPERATURE
SUPPORT
The SX-PCEAN2 is the next generation dual-band 802.11 a/b/g/n PCIe
module with industrial temperature support which is designed for devices that
require wireless connectivity in a small form factor combined with high data
throughput, at extreme temperatures.
The SX-PCEAN2 is powered by Qualcomm Atheros radio chip and features
2x2 MIMO technology for higher throughput performance, reliability and
range.
Figure 1: SX-PCEAN2
BENEFITS
• MIMO System: 2x2 stream system
and 40MHz channel width provides
a strong and
• Data Rates: MIMO architecture
allows link speeds up to 300Mbps.
• Industrial Temperature: Industrial
grade module supports extended
temperature range from -40°C to
+85°C.
APPLICATIONS
The SX-PCEAN2 is designed to meet the demanding performance requirements of
critical embedded applications.
•
•
•
•
•
Medical devices
Security Systems
Industrial
Digital Signs
Set-Top/ Net-Top Box
•
•
•
•
Embedded Industrial applications
Tablet PC
Handheld devices
Thin Client devices and many more
FEATURES
• Premium Quality: With in-house
manufacturing capability, each
card is individually tested and
inspected to ensure the industry’s
highest quality resulting greater
performance and reliability.
Product Name
SX-PCEAN2c / SX-PCEAN2i
Radio Chipset
AR9582 [commercial] / AR9592 [Industrial]
Radio Specifications
802.11a/b/g/n
Security
Open System, WEP, WPA, WPA2. 80.211x
• Modes of Operation: SX-PCEAN2
supports access point, adhoc and
client modes.
Interface
PCI Express mini card edge
Operating Voltage
3.3 V
Humidity
20 ~ 80% RH
• Wi-Fi Protected Setup: WPS 2.0
implementation making it easy to
add new devices to an existing
network without entering long
passphrases.
Operating Temperature
SX-PCEAN2c: 0°C to +60°C
SX-PCEAN2i: -40°C to +85°C
Storage Temperature
-40°C to +85°C
Dimensions
29.85 × 26.80 x 3.45 mm
• Certifications: Modular
certi¬fications for FCC and TELEC.
Weight
3.3 g
MTBF
90,000 hours
• Driver Support: Silex Linux driver
with WEP, TKIP, AES encryption,
IEEE 802.11e (QoS), IEEE 802.1X,
and hidden SSID support. Open
Source driver option as well.
Evaluation Platform
Freescale i.MX6
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
16
Figure 2: Hardware Block Diagram
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
SX-PCEAN2c
IEEE 802.11a/b/g/n commercial temperature dual band PCI Express Half-Mini Card.
SX-PCEAN2c-SP
Sample Pack. IEEE 802.11a/b/g/n commercial temperature dual band PCI Express Half-Mini
Card. Individually packaged with 2 antennas & cables.
SX-PCEAN2i
IEEE 802.11a/b/g/n dual band PCI Express Half-Mini Card with industrial temperature
support.
SX-PCEAN2-SP
Sample Pack. IEEE 802.11a/b/g/n dual band PCI Express Half-Mini Card with industrial
temperature support. Individually packaged with 2 antennas & cables
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
17