Global Semiconductor Assembly Test Services Market - Trends, Size, Share, Analysis to 2021

Transcription

Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding,
Copper Clip and others
Persistence Market Research
Global Semiconductor Assembly and
Testing Services Market is Expected to
Increase US$ 39,050.7 Mn by 2021 Persistence Market Research
1
Persistence Market Research Released New Market Report “Global Market Study on
Semiconductor Assembly & Testing Services (SATS): To be Driven by Increasing
Demand for High-End Packaging Solutions”, the semiconductor assembly & testing
services market is estimated to be valued at US$ 29,585.9 Mn by the end of 2015 and is
anticipated to expand at a CAGR of 4.7% from 2015 to 2021, to account for US$ 39,050.7 Mn
by 2021.
Semiconductor Assembly and Testing Services (SATS) market are witnessing increased
demand for outsourced SATS services. Presently, around half of the market is exploiting the
Outsourced Semiconductor Assembly and Test (OSAT) services, and the trend is expected to
continue in the long run. With increasing competition from the leading and regional players,
the market is witnessing consolidation. This helps market participants in utilizing resources
of other players to meet increasing technological demands.
Currently, the semiconductor assembly & testing services market across the world is mainly
driven by factors such as increasing demand for mobility and connectivity in the consumer
electronic products. An increasing demand for connected devices worldwide including
smartphones and tablets having connectivity and multimedia capabilities are fuelling the
demand for higher packaging technologies, setting up potential revenue opportunity for the
SATS market. Additional features offered by SATS providers over in-house testing and
packaging capabilities is also one of the primary reasons for the market growth. Additionally,
SATS providers facilitate a more efficient supply chain and in-turn reduces time-to-market for
a product, therefore SATS providers are becoming the primary choice of integrated design
manufacturers.
Increased use of safety systems in the automobile industry is also one of the factors
contributing to the growth of the SATS market. . However, factors such as the high capital
requirement for offering higher end packaging solutions, fluctuations in exchange rates, and
volatility in the market are expected to constrain the growth of the SATS market.
2
On the basis of services, the semiconductor assembly & testing services market has been
segmented into assembly & packaging services and testing services. The assembly &
packaging services segment is expected to account for 79.4% share of the global
Semiconductor assembly & testing services market by 2015 end and is anticipated to
increase at a CAGR of 4.9%, during the forecast period (2015–2021).
The Assembly and Packaging services segment is further classified on the basis of packaging
solutions (interconnecting technologies) which includes copper and gold wire bonding,
copper clip, flip chip, wafer level packaging, and TSV. Copper and gold wire bonding
accounted for the 55.5%share of the assembly and packaging services segment in 2014.
The wafer level packaging (interconnecting technology) segment in the global SATS market
is anticipated to expand at a CAGR of 9.2% during the forecast period.
On the basis of application, the semiconductor assembly & testing services market is
segmented into communications, computing & networking, consumer electronics, industrial
and automotive electronics. Among these, communication segment dominated the market in
2014 and is expected to account for 49.4% share of the global semiconductor assembly &
testing services market by 2015 end. This segment is expected to expand at CAGR of 5.9%
during the forecast period.
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3
Increasing adoption of tablets and wearable devices globally, is expected to drive the market
growth of consumer electronics segment during the forecast period. Consumer electronics
segment is analyzed to increase at a CAGR of 6.6% during the forecast period.
The report provides detailed information about various trends driving each segment and
offers analysis and insights about the potential of the semiconductor assembly & testing
services market in specific regions. On the basis of region, the semiconductor assembly &
testing services market is segmented into six regions; among these, Taiwan is expected to
dominate the market representing 46.5% share by the end of 2015. The market in the region
is analyzed to represent largest market share by 2021 expanding at a CAGR of 5.8% during
the forecast.
For more info: http://www.persistencemarketresearch.com/contact-us.asp
Key players in global semiconductor assembly & testing services market include ASE Group,
Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd.,
Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI),
GlobalFoundries and Chipbond Technology Corporation.
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Market History:
The semiconductor industry is highly volatile in nature. Leading market participants in this
industry are fabless companies that focus on leveraging their resources in designing and
utilizes its expertise in enhancing the performance of the chipsets or ICs. Thus, most of the
semiconductor assembly, testing, and packaging related services are outsourced by fabless
companies to third party providers known as Outsourced Semiconductor Assembly and Test
Services (OSATS) Providers. Moreover, the shift of semiconductor processing technology to
the larger wafers and smaller feature sizes has increased the cost of building a state-of-theart wafer fabrication factory. High CAPEX involved in wafer fabrication and its associated
packaging and test operations has enforced semiconductor companies to remain fabless and
instead focus on their core business. As a result, SATS providers have witnessed high
demand in the past and are expected to be sole choice for fabless companies during the
foreseeable future.
The global semiconductor assembly & testing services market is anticipated to expand at a
CAGR of 4.7% during the period 2015-2021 to reach US$ 39,050.7 Mn by 2021.
The global semiconductor assembly & testing services market was valued at US$ 28,177.9
Mn in 2014. Increasing adoption of consumer electronics products including tablet PCs,
wearable devices (smart watches, smart glasses, head mounted displays, fitness equipment
etc.), gaming consoles, audio/video devices along with the rising penetration of smartphones
in the communications segment is driving the overall SATS market growth. Additionally,
growing technological advancements in next-generation cars (automotive electronics)
equipped with enhancing car safety and management systems, are also driving the growth
of SATS market.
In 2014, the assembly & packaging services segment was valued at US$ 22,298.9 Mn and is
expected to account for US$ 23,494.8 Mn by the end of 2015. Advanced packaging solutions
such as wafer level packages and flip chip are driving the market growth of packaging
solutions (inter-connecting solutions) segment in the total SATS market.
5
In 2014, wafer level packaging segment was valued at US$ 3,508.9 Mn and is expected to
reach US$ 3,800.6 Mn by the end of 2015. Growing adoption of wearable devices which
mandates high performance with low power and thermal ratings, the demand for wafer-level
packaging inter-connecting solution is expected to grow in the foreseeable future. This
segment is analyzed to expand at a CAGR of 9.2% during the forecast period.
In 2014, consumer electronics application segment was valued at US$ 3,738.5 Mn and is
analyzed to value US$ 3,999.6 Mn by the end of 2015.
Key players in global semiconductor assembly & testing services market include ASE Group,
Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd.,
Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI),
Global Foundries and Chipbond Technology Corporation.
6
Table of Content
1. Global Semiconductor Assembly and Testing Services Market- Executive
Summary
2. Assumptions & Acronyms Used
3. Research Methodology
4. Market Overview
4.1. Introduction
4.1.1. Global Semiconductor Assembly and Testing Services Market Definition
4.1.2. Global Semiconductor Assembly and Testing Services Market Taxonomy
4.2. Global Semiconductor Assembly and Testing Services Market Dynamics
4.2.1. Drivers
4.2.2. Restraints
4.3. Value Chain
4.4. Global Semiconductor Assembly and Testing Services Market Forecast, 2015-2021
4.4.1. Global Semiconductor Assembly and Testing Services Market Size (Value) Forecast
4.4.1.1. Y-o-Y Growth Projections
4.4.1.2. Absolute $ Opportunity
4.5. Global Semiconductor Assembly and Testing Services Market Trends
4.6. Global Semiconductor Assembly and Testing Services Market Snapshot (2014)
4.6.1. Market Share By Services
4.6.2. Market Share By Packaging Solutions
4.6.3. Market Share By Applications
4.6.4. Market Share By Regions
5. Global Semiconductor Assembly and Testing Services Market Analysis, By
Services
5.1. Introduction
5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services
5.2.1. Assembly & Packaging services (Interconnecting technologies)
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5.2.1.1.1. Copper and gold wire bonding
5.2.1.1.2. Copper clip
5.2.1.1.3. Flip Chip
5.2.1.1.4. Wafer Level Packaging
5.2.1.1.5. TSV
5.2.2. Testing Services
5.3. Basis Point Share (BPS) Analysis, By Services
5.4. Y-o-Y Growth Comparison, By Services
5.5. Market Absolute $ Opportunity, By Services
5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By
Services
5.7. Qualitative Analysis
Packaging Solutions
6.1. Introduction
6.2. Global Semiconductor Assembly and Testing Services Market Forecast By Packaging
Solutions
6.2.1. Copper/gold Wire Bonding
6.2.2. Copper Clip
6.2.3. Flip Chip
6.2.4. Wafer Level Packaging
6.2.5. 3D TSV
6.3. Basis Point Share (BPS) Analysis, By Packaging Solutions
6.4. Y-o-Y Growth Comparison, By Packaging Solutions
6.5. Absolute $ Opportunity, By Packaging Solutions
Packaging Solutions
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Applications
7.1. Introduction
7.2. Global Semiconductor Assembly and Testing Services Market Forecast By Applications
7.2.1. Communications
7.2.2. Computing & Networking
7.2.3. Consumer Electronics
7.2.4. Industrial
7.2.5. Automotive Electronics
7.3. Basis Point Share (BPS) Analysis, By Applications
7.4. Y-o-Y Growth Comparison, By Applications
7.5. Absolute $ Opportunity
Packaging Solutions
Region
8.1. Introduction
8.2. Global Semiconductor Assembly and Testing Services Market Forecast By Region
8.2.1. North America Market Value Forecast
8.2.2. Asia Pacific (Excluding Taiwan) Market Value Forecast
8.2.3. Taiwan Market Value Forecast
8.2.4. Europe Market Value Forecast
8.2.5. Middle East & Africa Market Value Forecast
8.2.6. Latin America Market Value Forecast
8.3. Y-o-Y Growth Projections, By Region
8.4. Basis Point Share (BPS) Analysis, By Region
8.5. Market Attractiveness Analysis, By Region
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9. North America North America Semiconductor Assembly and Testing Services
Market Analysis
9.1. Market overview
9.2. Introduction
9.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
9.3. North America Semiconductor Assembly and Testing Services Market Forecast
9.3.1. Market Value Forecast By Services
9.3.1.1. Assembly & Packaging services
9.3.1.2. Testing services
9.3.1.2.1. Y-o-Y Growth Comparison, By Services
9.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
9.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
9.3.2.1. Copper/gold wire bonding
9.3.2.2. Copper Clip
9.3.2.3. Flip Chip
9.3.2.4. Wafer level Packaging
9.3.2.5. 3D TSV
9.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
9.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
9.3.3. Market Value Forecast By Applications
9.3.3.1. Communications
9.3.3.2. Computing and Networking
9.3.3.3. Consumer Electronics
9.3.3.4. Industrial
9.3.3.5. Automotive Electronics
9.3.3.5.1. Y-o-Y Growth Comparison, By Applications
9.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
9.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
9.3.4.1. By Services
9.3.4.2. By Packaging Solutions
9.3.4.3. By Applications
9.3.5. Drivers & Restraints: Impact Analysis
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10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services
Market Analysis
10.2. Introduction
10.2.1. Y-o-Y Growth Projections, By Country
10.2.2. Basis Point Share (BPS) Analysis, By Country
10.3. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market
Forecast
10.3.1. Market Value Forecast By Country
10.3.1.1. China Absolute $ Opportunity
10.3.1.2. Japan Absolute $ Opportunity
10.3.1.3. Singapore Absolute $ Opportunity
10.3.1.4. Thailand Absolute $ Opportunity
10.3.1.5. Philippines Absolute $ Opportunity
10.3.1.5.1. Y-o-Y Growth Comparison, By Countries
10.3.1.5.2. Basis Point Share (BPS) Analysis, By Countries
10.3.3.3. Flip Chip
10.3.3.5. 3D TSV
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10.3.4.4. Industrial
10.3.5.1. By countries
11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
11.2. Introduction
11.3. Taiwan Semiconductor Assembly and Testing Services Market Forecast
11.3.2.3. Flip Chip
11.3.2.5. 3D TSV
12
12. Europe Semiconductor Assembly and Testing Services Market Analysis
12.2. Introduction
12.3. Europe Semiconductor Assembly and Testing Services Market Forecast
12.3.2.3. Flip Chip
12.3.2.5. 3D TSV
13
13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services
Market Analysis
13.2. Introduction
13.3. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market
Forecast
13.3.2.3. Flip Chip
13.3.2.5. 3D TSV
14
14. Latin America Semiconductor Assembly and Testing Services Market Analysis
14.2. Introduction
14.3. Latin America Semiconductor Assembly and Testing Services Market Forecast
14.3.2.3. Flip Chip
14.3.2.5. 3D TSV
15
15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
15.4.1. ASE Group
15.4.1.1. Revenue
15.4.1.2. Products/Brand Offerings
15.4.1.3. Company Highlights
15.4.2. Amkor Technology Inc.
15.4.3. STATS chipPAC Ltd. (JCET)
15.4.4. Powertech Technology Inc.
15.4.5. Silicon Precision Industries Company Ltd.
15.4.6. CORWIL Technology Corp.
15.4.7. Chipbond Technology Corporation
15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
15.4.9. GlobalFoundries Inc.
16
List of Tables
Table 1: Global Semiconductor Assembly and Testing Services Market Value Forecast By
Services (US$ Mn)
Table 2: Global Semiconductor Assembly and Testing Services Market Value Forecast By
Packaging Solutions (US$ Mn)
Table 3: Global Semiconductor Assembly and Testing Services Market Size Forecast By
Applications (US$ Mn)
Table 4: Global Semiconductor Assembly and Testing Services Market Size Forecast By
Geography (US$ Mn)
Table 5: North America Semiconductor Assembly and Testing Services Market Value Forecast
By Services (US$ Mn)
By Packaging Solutions (US$ Mn)
By Applications (US$ Mn)
Table 8: APAC Semiconductor Assembly and Testing Services Market Value Forecast By
Country (US$ Mn)
Services (US$ Mn)
Table 12: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By
Services (US$ Mn)
Table 15: Europe Semiconductor Assembly and Testing Services Market Value Forecast By
Services (US$ Mn)
17
Application (US$ Mn)
Table 18: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value
Forecast By Services (US$ Mn)
Forecast by Packaging solutions (US$ Mn)
Forecast By Application (US$ Mn)
Table 21: Latin America Semiconductor Assembly and Testing Services Market Value Forecast
By Services (US$ Mn)
By Packaging Solutions (US$ Mn)
By Application (US$ Mn)
List of Figures
Figure 1: Global Semiconductor Assembly and Testing Services Market Incremental
Opportunity, 2014–2021
Figure 2: Global Semiconductor Assembly and Testing Services Market Revenue by Services,
2014
Figure 3: Global Semiconductor Assembly and Testing Services Market Revenue By
Application, 2014
Figure 4: Global Semiconductor Market Absolute $ Opportunity, 2014–2021
Figure 5: Global Semiconductor Market Y-o-Y Growth, 2014–2021
Figure 6: Global Semiconductor Assembly and Testing Services Market Absolute $
Figure 7: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth, 2014–
2021
Figure 8: Global Semiconductor Assembly and Testing Services Market – Scenario Forecast
Figure 9: Market value of IoT devices, 2013 – 2020
18
Figure 10: Fluctuation in exchange rates, 2010–2015 (US$/NT$)
Figure 11: Global Semiconductor Assembly and Testing Services Market Value Share & BPS
Analysis By Services, 2014 & 2021
Figure 12: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Comparison by Services, 2014–2021
Figure 13: Global Assembly & Packaging Services Segment Absolute $ Opportunity, 2014–
2021
Figure 14: Global Testing services Segment Absolute $ Opportunity, 2014–2021
Figure 15: Global Semiconductor Assembly and Testing Services Market Attractiveness by
Services, 2015–2021
Analysis By Packaging Solutions, 2014 & 2021
Comparison by Packaging Solutions, 2014–2021
Figure 18: Global Copper Wire & Gold Wire Bonding Segment Absolute $ Opportunity, 2014–
2021
Figure 19: Global Copper Clip Segment Absolute $ Opportunity, 2014–2021
Figure 20: Global Flip Chip Segment Absolute $ Opportunity, 2014–2021
Figure 21: Global Wafer Level Packaging Segment Absolute $ Opportunity, 2014–2021
Figure 22: Global TSV Segment Absolute $ Opportunity, 2014–2021
Packaging Solutions, 2015–2021
Analysis by Application, 2014 & 2021
Comparison by Application, 2014–2021
Figure 26: Global Communications Segment Absolute $ Opportunity, 2014–2021
Figure 27: Global Computing & Networking Segment Absolute $ Opportunity, 2014–2021
Figure 28: Global Consumer electronics Segment Absolute $ Opportunity, 2014–2021
Figure 29: Global Industrial Segment Absolute $ Opportunity, 2014–2021
Figure 30: Global Automotive electronics Segment Absolute $ Opportunity, 2014–2021
Application, 2015–2021
19
Analysis By Geography, 2014 & 2021
Comparison by Geography, 2014–2021
Geography, 2015–2021
Figure 35: North America Semiconductor Assembly and Testing Services Market Absolute $
Figure 36: North America Semiconductor Assembly and Testing Services Market Value Share
& BPS Analysis By Services, 2014 & 2021
Figure 37: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Figure
38:
North
America
Semiconductor
Assembly
and
Testing
Services
Market
Attractiveness by Services, 2015–2021
& BPS Analysis By Packaging Solutions, 2014 & 2021
Figure
41:
North
America
Semiconductor
Assembly
and
Testing
Services
Market
Attractiveness by Packaging Solutions, 2015–2021
& BPS Analysis By Application, 2014 & 2021
Figure
44:
North
America
Semiconductor
Assembly
and
Testing
Services
Market
Attractiveness by Applications, 2015–2021
Figure 45: APAC Semiconductor Assembly and Testing Services Market Absolute $
Figure 46: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS
Analysis By countries, 2014 & 2021
Comparison By countries, 2014–2021
20
Figure
48:
North
America
Semiconductor
Assembly
and
Testing
Services
Market
Attractiveness By countries, 2015–2021
Figure
51:
North
America
Semiconductor
Assembly
and
Testing
Services
Market
Figure
54:
North
America
Semiconductor
Assembly
and
Testing
Services
Market
Figure 56: APAC Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Figure 57: APAC Semiconductor Assembly and Testing Services Market Attractiveness by
Applications, 2015–2021
Figure 58: Taiwan Semiconductor Assembly and Testing Services Market Absolute $
Figure 59: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS
Figure 60: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Figure 61: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by
21
Figure 68: Europe Semiconductor Assembly and Testing Services Market Absolute $
Figure 69: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS
Figure 70: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Figure 71: Europe Semiconductor Assembly and Testing Services Market Attractiveness by
Figure 73: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Figure 78: MEA Semiconductor Assembly and Testing Services Market Absolute $
Figure 79: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS
Figure 80: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth
22
Figure 81: MEA Semiconductor Assembly and Testing Services Market Attractiveness by
Figure 88: Latin America Semiconductor Assembly and Testing Services Market Absolute $
Figure 89: Latin America Semiconductor Assembly and Testing Services Market Value Share
& BPS Analysis By Services, 2014 & 2021
Figure 90: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth
Figure
91:
Latin
America
Semiconductor
Assembly
and
Testing
Services
Market
Figure
94:
Latin
America
Semiconductor
Assembly
and
Testing
Services
Market
& BPS Analysis By Application, 2014 & 2021
23
Figure
97:
Latin
America
Semiconductor
Assembly
and
Testing
Services
Market
Attractiveness by Applications, 2015–2021
Figure 98: Market Share Analysis (%), 2014
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Global Semiconductor Assembly Test Services Market - Trends, Size, Share, Analysis to 2021

Transcription

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