S3X58-M406 series

Transcription

S3X58-M406 series

®
www.ko-ki.co.jp
Lead free SOLUTIONS you can TRUST
Contents
Features
Specifications
Continual printability
Viscosity variation
Intermittent printability
Ver. 42004.5
Prepared on Mar. 7, 2005
Koki no-clean LEAD FREE solder paste
Hi-performance S3X58-M406 series
Product information
Tack time
Heat slump
Solder balling
Solder beading
0.4mm pitch
Super fine pattern wetting
Voiding
Solder spreading
0.3mm diameter
Copper corrosion
Surface insulation resistance
Voltage applied SIR
Handling guide
This Product Information contains product performance assessed strictly according to our own test procedures
and may not be compatible with results at end-users.
CHALLENGING NEW TECHNOLOGIES
®
S3X58-M406 series
2
Contents
Features
Product Features
Specifications

Solder alloy composition is Sn3Ag0.5Cu.
Sn3Ag0.5Cu
Viscosity variation

Ensures OUTSTANDING continual PRINTABILITY with super fine
pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications and long
Tack time
stencil idle time.
Heat slump
Solder balling

and micro components (<0.25mm dia CSP, 0603 chip).
Solder beading

Voiding
Solder spreading
Copper corrosion
PERFECT MELTING and wetting at super fine pitch (<0.4mm pitch)
Specially formulated flux chemistry ensures extremely LOW VOIDING
with CSPs and broad contact area components.

POWERFUL WETTING with various metals, such as Alloy42 and
Nickel.
Voltage applied SIR
Handling guide
No clean
ROL0
Powder
Type 4
Fine pattern
Idle time
0.4mm pitch > 60 min.
CSP<0.3mm CSP 0.3mm
Tack time
>72 hrs.
High heat
slump resist
Powerful
wetting
Low
beading
Low
voiding
High
reliability
®
S3X58-M406 series
Contents
Features
Specifications
Specifications
Application
Product
Alloy
Viscosity variation
Tack time
Flux
Heat slump
Solder balling
Solder beading
Voltage applied SIR
Handling guide
S3X58-M406L
Product
S3X58-M406
Composition (%)
Sn96.5, Ag3.0, Cu0.5
Melting point (°C)
217 - 218
Shape
Spherical
Particle size (µm)
20 - 38
Halide content (%)
0.0
Flux type
ROL0
Viscosity*
Voiding
Copper corrosion
Printing - Stencil
Flux content (%)
Solder spreading
3
1
(Pa.S)
Copper plate corrosion*
2
11.5± 0.5
11.5 ± 0.5
11.5± 0.5
170 ± 10%
210 ± 10%
230 ± 10%
Passed
Solder spread factor (%)
> 85
Tack time
> 72 hours
Shelf life (below 10°C)
6 months
Other alloy options
1. Viscosity :
2. Copper plate corrosion :
S3X58-M406H
SX58- / TS58- / SXA58-
Malcom spiral type viscometer,PCU-205 at 25ºC 10rpm
In accordance with JIS.
®
S3X58-M406 series
Contents
Features
4
Specifications – Alloy selections
Specifications
S3X 58 – M 406
Viscosity variation
Alloy composition
Flux type
Particle size
Tack time
Flux number
Heat slump
S3X : SnAg3.0Cu0.5
Solder balling
Solder beading
Alloy composition (%)
: SnAg3.5Cu0.7
TS
: SnAg3.5
SXA : SnAg3.5Cu0.5Sb0.2
Voiding
Solder spreading
SX
Particle size (µm)
58
: 20 ~ 38
M
: Low halide, halide free
N
: Nitrogen use
Copper corrosion
Flux type
Voltage applied SIR
Handling guide
Flux number
Solids and solvent used
®
Contents
Features
Specifications
Viscosity variation
S3X58-M406 series
5
Print parameters
• Stencil :
0.12mm thickness, laser cut stencil
• Printer :
Model MK-880SV Minami Kogaku
• Squeegee :
Metal blade, Angle - 60°
• Print speed :
50 mm/sec
• Stencil separation
speed :
10.0 mm/sec
• Atmosphere :
24.5~27.0°C (50~60%RH)
Test patterns
1. QFP pad pattern :
2. MBGA pad pattern :
Width 0.20 mm
Length 1.5 mm Distance 0.2 mm
1) Diameter 0.30 mm
2) Diameter 0.25 mm
*Solder paste tested : S3X58-M406
Tack time
Vertical to squeegee
Parallel to squeegee
0.3mm diameter
0.25mm diameter
Heat slump
Solder balling
Solder beading
1st print
Voiding
Solder spreading
Copper corrosion
1st print
after
200 strokes
Voltage applied SIR
Handling guide
Newly developed additives provide a lubricating effect that greatly improve the paste release properties and
assures excellent print quality even with microBGA, 0603 and super fine pitch components.
®
S3X58-M406 series
Contents
Features
Specifications
6
Viscosity variation in continual printing
•
•
•
•
•
•
Print (knead) solder paste on the sealed-up stencil continually up for 24 hours to observe viscosity variation.
Squeegee :
Metal blades
Squeegee angle :
60°
Squeegee speed :
50mm/sec.
Print stroke :
300mm
Printing environment :
25+/-1°C, 60+/-10%RH
Viscosity variation
300
Tack time
250
Solder balling
Solder beading
Vis c o s ity ( Pa .S)
Heat slump
200
150
S3X58-M406
100
Voiding
Solder spreading
Copper corrosion
Voltage applied SIR
Handling guide
Conventional paste
50
*120 strokes/hour
0
0
500
1000
1500
2000
2500
3000
No. of print strokes (times)
A newly developed flux formula has succeeded to realize consistent long term printability by preventing
excess viscosity drop due to shear thinning and excess increase due to chemical reaction between solder
powder and flux during print rolling
®
Contents
Features
Specifications
Viscosity variation
Tack time
S3X58-M406 series
7
Intermittent printability (Stencil idle time)
• Print solder paste continuously and stop to idle the paste for 60, 90 min. intervals, and resume the printing and
observe the 1st print result to verify intermittent printability.
• Squeegee :
Metal blades
• Squeegee angle :
60°
• Squeegee speed :
50mm/sec.
• Print stroke :
300mm
• Printing environment :
25+/-1°C, 60+/-10%RH
• Test pattern :
QFP pad pattern - Width 0.20 mm Length 1.5 mm Distance 0.2 mm
MBGA pad pattern - Diameter 0.30 mm
1st print
Heat slump
1st print after 60 min.
1st print after 90 min.
Solder balling
Solder beading
0.4mm pitch
QFP pattern
Voiding
Solder spreading
Copper corrosion
0.30mm
diameter
Voltage applied SIR
Handling guide
Unique formulation solvent system assures extremely long stencil idle time, eliminating printing faults
and improving process window and production yields.
®
S3X58-M406 series
Contents
Features
Specifications
Viscosity variation
Tack time
•
•
•
•
•
•
Stencil :
Measurement instrument :
Probe pressure :
Pressurizing time :
Pull speed :
Test method :
0.2mm thick, 0.6mm dia. aperture
Malcom tackimeter FG-1
50gs
0.2mm
10mm/sec.
In accordance with JIS Z 3284
250
Tack time
Heat slump
Solder beading
Voiding
Solder spreading
Copper corrosion
200
Tackiness (gf)
Solder balling
8
Tensile strength = Tack force
150
100
Load
50gf
Pull up at
100mm/sec.
50
0.2 sec.
0
0
10
20
30
40
50
60
70
Time (hr)
Voltage applied SIR
Handling guide
Unique solvent system has succeeded to extend tack time dramatically (>72 hours) helps widen
process window significantly.
®
S3X58-M406 series
Contents
Features
Specifications
Viscosity variation
9
Heat slump
• Stencil thickness :
• Stencil aperture :
0.2mm
Pattern (1) 3.0mm × 0.7mmm
Pattern (2) 3.0mm × 1.5mm
• Spacing between apertures: 0.2mm to 1.2mm
• Heat profile :
180~190ºC × 5 min.
• Test method :
Tack time
Heat slump
Solder balling
0.2
0.3
0.4
0.2
0.5mm
0.3
0.4 0.5mm
Solder beading
3.0mm
Voiding
0.7mm
Solder spreading
Copper corrosion
3.0mm
1.5mm
Voltage applied SIR
Handling guide
Improved heat slump property assures reduced soldering defects, such as solder beading and bridging.
®
Contents
Features
Specifications
Viscosity variation
Tack time
Heat slump
S3X58-M406 series
10
Solder balling (Residue cosmetics)
• Stencil :
0.2mm thick
• Stencil aperture :
6.5mm diameter
• Solder pot temperature : 250ºC
• Test method :
Category 1
2
3
4
Knead the paste for 8 hours on sealed-up
stencil and print it on alumina plate.
Melt it on hot plate after leaving it for a
certain period of time at room
temperature.
8-hour kneading + 1 hour after printing
8-hour kneading + 24-hour after printing
Category 2
Category 2
Solder balling
Solder beading
Voiding
Solder spreading
Copper corrosion
Voltage applied SIR
Handling guide
Almost no solder balling and resistant to ambient temperature and humidity.
®
S3X58-M406 series
Contents
Features
Specifications
Viscosity variation
Solder beading
•
•
•
•
•
Material :
Surface treatment :
Stencil thickness :
Stencil aperture :
Components
3216 capacitor :
2125 resistor :
Total :
• Heat source :
• Zone structure :
• Atmosphere :
11
*Fault finding design
Glass epoxy FR-4
OSP
0.12mm (laser cut)
100% aperture opening to pad
3216
capacitor
30 pcs./board
10 pcs./board
40 chips/board × 5 boards = 200 components
Hot air convection
5 pre-heat zones +2 reflow zones
Air
2125
resistor
Tack time
Heat slump
20
Solder beading
Voiding
Solder spreading
Copper corrosion
No. of solder beads (pc.)
Solder balling
Solder beads per board in average
Peak temp. : 236ºC
Pre-heat :
150~190ºC x 110 sec.
S3X58-M406
15
Conventional paste
10.2
10
5
7.9
3.6
Above 220ºC : 48sec.
DT = 2.5ºC
3
Voltage applied SIR
0
Reflow profile
Initial
After 8-hour kneading
Handling guide
Largely reduces the generation of solder beads by the addition of resin fluidity suppressing effect at high
temperature.
®
S3X58-M406 series
Contents
Features
Specifications
Viscosity variation
•
•
•
•
•
•
•
•
•
Material :
Surface treatment :
Stencil thickness :
Pad size :
Stencil aperture :
Heat source :
Zone structure :
Atmosphere :
Reflow profile :
12
0.30mm / 0.25mm diameter
Glass epoxy FR-4
OSP
0.12mm (laser cut)
0.30, 0.25mm diameter, 0603 chip pattern
Hot air convection
Air
Same as “Solder beading”
0603 chip
Tack time
Heat slump
After 8-hour printing on sealed-up stencil
Solder balling
Solder beading
Voiding
Solder spreading
Copper corrosion
0.3mm diameter
0.25mm diameter
0603 chip pattern
Voltage applied SIR
Handling guide
Larger relative surface areas of solder paste exposed due to miniaturization of components (CSP, 0603
chips), often cause incomplete melting due to excess oxidation during the reflow.
An improved flux formula ensures complete coalescence by minimum deterioration of barrier performances .
®
Contents
Features
Specifications
Viscosity variation
S3X58-M406 series
13
S3X58-M406 series have been formulated with high-heat-resistant chemistry to provide a wide soldering
process window. As TGA curve indicates below, as an example, one of the activator formula for S3X58-M406
series shows very limited weight loss and thus ensures it maintains sufficient activation until soldering is
completed.
Tack time
Heat resistant activation formula
Heat slump
Solder balling
Solder beading
Voiding
Solder spreading
Copper corrosion
Weight loss at 239°C
= 4.08%
Weight loss at 239°C
= 44.12%
Voltage applied SIR
S3X58-M406 series
Conventional solder paste
Handling guide
®
Contents
Features
Specifications
Tack time
14
Voiding
•
•
•
•
•
•
Viscosity variation
S3X58-M406 series
•
•
•
•
Model :
Material :
Surface treatment :
Stencil thickness :
Stencil aperture :
Components
6330 resistor :
Power transistor :
BGA :
Heat source :
Zone structure :
Atmosphere :
Reflow profile :
SPRTP-003 ver. 2
Glass epoxy FR-4
OSP
0.12mm (laser cut)
100% Sn plated
SnPb plated
SnAgCu bumps 1.0mm pitch
Hot air convection
Air
Same as “Solder beading”
Power transistor (SnPb)
Heat slump
Power transistor
6330 resistor
BGA
6330 chip resistor (100Sn)
BGA (Sn3Ag0.5Cu)
Solder balling
Solder beading
Initial
Voiding
Solder spreading
Copper corrosion
After 8-hour
kneading on
sealed-up
stencil
Voltage applied SIR
Handling guide
Voiding with various components has been drastically reduced and offers consistent level of
voiding even after continual print for more than 4 hours.
®
S3X58-M406 series
Contents
Features
Specifications
Solder spreading
•
•
•
•
Material pieces :
Stencil thickness :
Stencil aperture :
Heat source & temp.:
Copper, Alloy 42, Nickel (*Pre-conditioning - IPA cleaning only)
0.2mm (laser cut)
6.5mm diameter
Hot plate-150ºC for 60sec. + Solder bath 240+/-2ºC for 5sec.
Viscosity variation
15
Copper plate
Alloy 42
Nickel
Category 1
Category 2
Category 2
Tack time
Heat slump
Solder balling
Solder beading
Voiding
Solder spreading
Copper corrosion
Voltage applied SIR
* Definition
Category
Category
Category
Category
1:
2:
3:
4:
Solder has spread more than the area where solder paste was printed.
Solder has spread whole area where solder pasted was printed.
Solder has partially spread.
Solder spread is less than the area where solder paste was printed.
Handling guide
Excellent spreading regardless of the kinds of the metal plate.
®
S3X58-M406 series
Contents
Features
Specifications
40mm
Copper corrosion
• Test conditions :
• Test method :
16
40±2ºC 90~95%RH for 72 hours
JIS Z 3197
Solder paste
Plate A
6mm
Plate B
38mm
Viscosity variation
Copper Plate A
Copper Plate B
Tack time
Heat slump
Solder balling
× 30
Solder beading
Voiding
Solder spreading
Copper corrosion
× 100
Voltage applied SIR
Handling guide
No evidence of corrosion can be observed.
®
S3X58-M406 series
Contents
Features
Specifications
17
•
•
•
•
•
Test conditions :
Stencil thickness :
Comb type electrode :
Measurement voltage :
Test method :
85±2ºC × 85%RH for 1008 hours
100 micron
JIS type-II
DC100V
JIS Z 3197
Viscosity variation
SIR GRAPH
Heat slump
1.00E+17
Solder balling
1.00E+16
Solder beading
Voiding
Solder spreading
Copper corrosion
Insulation resistance (Ω)
Tack time
1.00E+18
1.00E+15
1.00E+14
1.00E+13
1.00E+12
1.00E+11
1.00E+10
Voltage applied SIR
1.00E+09
Handling guide
0
100
200
336
400
500
600
700
800
900
1008
Time (hour)
®
S3X58-M406 series
Contents
Features
Specifications
18
Voltage applied surface insulation resistance
•
•
•
•
•
•
Test conditions :
Stencil thickness :
Comb type electrode :
Measurement voltage :
Voltage applied :
Test method :
85±2ºC × 85%RH for 1008 hours
100 micron
JIS type-II
DC100V
DC50V
JIS Z 3197
Viscosity variation
SIR GRAPH
Heat slump
1.00E+15
Solder balling
1.00E+14
Solder beading
Voiding
Solder spreading
Copper corrosion
Voltage applied SIR
Handling guide
Insulation resistance (Ω)
Tack time
1.00E+16
× 50 magnification
1.00E+13
1.00E+12
× 140 magnification
1.00E+11
1.00E+10
1.00E+09
1.00E+08
1.00E+07
0
100
200
336
400
500
600
700
800
900
1008
Time (hour)
No evidence of electromigration can be observed.
®
S3X58-M406 series
Contents
Features
Specifications
Viscosity variation
Tack time
Heat slump
Solder balling
Solder beading
Voiding
Solder spreading
Copper corrosion
19
Handling guide
1. Printing
1) Recommended printing parameters
(1) Squeegee
1. Kind
: Flat
2. Material
: Rubber or metal blade
3. Angle
: 60~70°(rubber) or metal blade
4. Pressure
: Lowest
5. Squeegee speed : 10~80mm/sec.
(2) Stencil
1. Thickness
:
2. Type :
:
3. Separation speed :
4. Snap-off distance :
(3) Ambiance
1. Temperature
2. Humidity
3. Air draft
2. Shelf life
1) 0 ~ 10°C
2) At 20~30°C
200~120µm for 0.65~0.4mm pitch pattern
Laser or electroform
0.5~3.0mm/sec.
0~0.5mm
: 25 ± 5°C
: 40~60%RH
: Air draft in the printer badly affects stencil life and tack performance of solder
pastes.
: 6 months from manufacturing date
: 1 month from manufacturing date
Voltage applied SIR
Handling guide
* Manufacturing date can be obtained from the lot number
ex.
Lot No. 4 07 21 2
No. of lot :
Date
:
Month
:
Year
:
2nd
21st
July
2004
®
S3X58-M406 series
Contents
Features
20
Handling guide - Recommended reflow profile
Specifications
Viscosity variation
Tack time
Peak temp.
235~250ºC
(ºC)
250
Pre-heat temp.
110~190ºC 60~120sec.
200
Heat slump
Solder balling
Solder beading
Over 220ºC > 30 sec.
150
100
Voiding
Ramp-up temp.
1.0~3.0ºC /sec.
50
Solder spreading
Copper corrosion
60
90
180
240
300
(sec.)
Voltage applied SIR
Handling guide
Excess pre-heating (time & temperature) may cause too much oxidation.
Relatively short and low pre-heat may be recommendable, especially for fine pitch/micro
pattern components .

S3X58-M406 series

Transcription

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