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TechnologyToday
HIG HL IG HT I N G R A YT H EON’S T E CH NOLOGY
2015 ISSUE 1
A MESSAGE FROM
Mark E. Russell
Vice President of Engineering, Technology and Mission Assurance
Raytheon advanced manufacturing methods and processes are important elements of
our technology development strategy. While much emphasis is placed on new component research and product designs, new manufacturing technologies also significantly
improve the quality, reliability, timeliness and cost effectiveness of our products.
This issue of Technology Today highlights some of the innovative manufacturing
technologies being developed and applied at Raytheon and describes how these technologies improve our product prototyping and manufacturing. Our feature articles
cover a wide range of areas from automated manufacturing, to rapid prototyping,
to advanced manufacturing methods and processes.
In the automated manufacturing area, the Raytheon Redstone Missile Integration
Facility and the Raytheon Advanced Products Center are highlighted as manufacturing and integration facilities that use automation to improve the quality, timeline and
safety for Navy Standard Missile production and production of radar components and
systems, respectively. Additive manufacturing, tailored to Raytheon needs, and our
immersive design centers are also described in this edition, providing examples of
Raytheon’s rapid prototyping and design aid activities. Some of our university partnerships in advanced manufacturing as well as new manufacturing processes for sensors
and devices highlight our ongoing commitment to investigating and implementing
new methods that improve how we build our products and systems.
In our Leaders Corner, the Raytheon Operations Council answers questions about
how the council investigates new and emerging manufacturing methods. Our Eye
on Technology section features the End-to-End Distributed Development System,
a high-fidelity simulation of the Standard Missile-3 and Aegis Weapon System,
and the Special Interest section article describes an important and emerging need
for scalable infrastructure protection capabilities, such as for protecting oil
platforms and refineries.
In our People section, the Raytheon Young Employee Success Network is introduced
as an example of Raytheon’s many Employee Resource Groups that help employees
connect and celebrate their diversity. Finally, the Events section provides an example
of Raytheon’s commitment to supporting science, technology, engineering and mathematics initiatives by highlighting a University of Arizona event to help high school
On the cover: Additively manufactured
tail-fin assembly for Excalibur precision
guided munition
2
2015 ISSUE 1 RAYTHEON TECHNOLOGY TODAY
students build telescopes.
Mark E. Russell
View Technology Today online at:
www.raytheon.com/technology_today
INSIDE THIS ISSUE
Feature: Research
Raytheon Manufacturing Technology: Producing Better Products
Today and Tomorrow
4
Raytheon Missile Facility Modernized by Advanced Technologies
8
Application of Robotics to the Assembly of Missile Seekers
10
Raytheon Advanced Products Center: RF Subsystem Manufacturing
and Integration Excellence
14
Additive Manufacturing at Raytheon
18
Integrated Rapid Prototyping at Raytheon
22
Visual Immersion for Virtual Design and Manufacturing
25
D-RAPCON 3D Virtual Prototyping Environment
28
Chief Technology Officer
Bill Kiczuk
Multilevel Wafer Stacking for 3D Circuit Integration
30
Managing Editor
Tony Pandiscio
Raytheon University Partnerships Help Develop Advanced
Manufacturing Technologies
32
Senior Editors
Tony Curreri
Corey Daniels
Tom Flynn
Eve Hofert
Vertically Integrated HgCdTe-based Sensor Manufacturing
36
Art Director
Susan DeCrosta
Q & A with the Raytheon Operations Council
Technology Today is published
by the Office of Engineering,
Technology and Mission Assurance.
Vice President
Mark E. Russell
Photography and Art
Fran Brophy
John DeAngelis
Daniel Plumpton
Website Design
Nick Miller
Publication Distribution
Rose McGovern
Contributors
Paul Bailey
Peter Kampf
Steve Klepper
Tony Marinilli
Nora Tgavalekos
Raytheon Leaders Corner
38
Eye on Technology
ETEDDS: System of Systems Real-time Simulation Environment
40
eye
Special Interest
Critical Infrastructure Protection
42
People
YESNET
44
Events
Raytheon Team Helps High School Students
Build Telescopes
Patents
46
48
RAYTHEON TECHNOLOGY TODAY 2015 ISSUE 1
3
FEATURE
RAYTHEON MANUFACTURING TECHNOLOGY:
Producing Better Products Today and Tomorrow
Raytheon is leveraging innovations in manufacturing technology to enable
affordable and reliable customer solutions. Our global team utilizes its
Manufacturing Technology Network (MfgTN) and Technology Interest Groups
(TIGs) along with a manufacturing Technology Area Director (TAD) to create
a collaborative roadmap of manufacturing technology.
The MfgTN is an enterprisewide network of
manufacturing subject matter experts (SMEs)
whose purpose is to promote the development,
optimization and proliferation of advanced
manufacturing technologies and to facilitate
communication between all disciplines which
support manufacturing across Raytheon.
The MfgTN promotes common methods in
manufacturing for cost and risk reduction and
effective methods for manufacturing technology transfer across Raytheon businesses. It also
provides a means for technical communication
through the TIGs and an annual manufacturing technology symposium. Eleven TIGs exist
within the MfgTN, covering a wide range of
topics from cleanroom management to advanced manufacturing technologies such
as additive manufacturing.
One of the key leaders within the MfgTN is
the manufacturing TAD. TAD responsibilities include initiating new TIGs when needed
to address new or emerging technology areas
and organizing and coordinating technology
symposia and workshops on important and
4
current manufacturing topics. The TAD is
also responsible for facilitating and developing
companywide integrated technology roadmaps
within the manufacturing domain that identify technology focus areas, gaps and closure
strategies. In addition, the manufacturing TAD
supports research activities such as independent research and development (IRAD)
projects and external technology partnership
activities, including those with universities,
national labs and other companies.
The TAD-facilitated technology roadmaps are
divided into focus areas including automated
manufacturing, rapid prototyping and design
aids and advanced manufacturing methods
and processes. The roadmaps provide a timephased plan for maturing the manufacturing
technology in each area with the goal of improving the quality, reliability, timeliness and
cost effectiveness of our products. This issue
of Technology Today highlights some specific
technologies Raytheon has applied or is investigating in the advanced manufacturing area.
Automated Manufacturing
Automation plays a key role in current and
future product manufacturing at Raytheon.
An example of this can be seen at the Raytheon
Redstone Missile Integration Facility (RRMIF)
where, through the use of automated guided
vehicles (AGVs) and robotic assembly stations,
the company is optimizes manufacturing labor,
improves missile cycle times, and removes
process variations (see Figure 1). Details on
the RRMIF and its extensive use of automated
Figure 1. Raytheon Redstone Missile
Integration Facility makes extensive use
of automated guide vehicles and other
factory automation.
FEATURE
FOR TODAY AND TOMORROW, RAYTHEON
CONTINUES TO RESEARCH AND APPLY
NEW AUTOMATION TECHNOLOGIES
TO MANUFACTURING, ENSURING
AFFORDABLE, QUALITY PRODUCTS
FOR OUR GLOBAL CUSTOMERS.
manufacturing are provided in the feature
article “Raytheon Missile Facility Modernized
by Advanced Technologies.”
featured article highlights an initial implementation of a robotic assembly cell that resulted
in substantial labor savings.
Another example of manufacturing automation at Raytheon is the use of robotics and
automation work cells in the assembly of
missile seekers (see Figure 2). Traditionally,
the manufacture of seekers has relied on skilled
manual labor to execute complex assembly
processes. As you will read in our featured article, “Application of Robotics to the Assembly
of Missile Seekers,” Raytheon employs robotic
manufacturing cells to increase productivity
and remove variation from our processes. Key
benefits include reduced cycle time, assembly costs and work in process inventory. The
The Raytheon Advanced Products Center
(APC) is an award winning site that deploys
a high level of automation to provide enabling
technologies for Raytheon’s product base.
APC is comprised of three main facilities: RF
Microelectronics (RFME), RF Products and
Components (RFPC), and RF Subsystems and
Integration (RFSI). As you will read in the
feature article, “Raytheon Advanced Products
Center – RF Subsystem Manufacturing and
Integration Excellence,” these facilities use a
commercial best practice known as a tiered
accountability system to drive collaboration
and predictability of execution.
Ariz., and Andover, Mass. (see Figure 3), to
increase the speed of making affordability
improvements to our products. In addition,
our IDCs support many other virtual prototyping and manufacturing design activities
including, supplier and customer engagements,
virtual prototyping to validate manufacturing
and assembly processes, human factors analyses, virtual maintainability demonstrations,
facility layouts and virtual training. The
feature article, “Visual Immersion for Virtual
Design and Manufacturing,” highlights our
CAVE IDCs and how Raytheon uses virtual
immersion in its product designs and manufacturing processes.
Another example of the value of three-dimensional (3D) modeling and virtual prototyping
is described in the feature article, “D-RAPCON
For today and tomorrow, Raytheon continues
to research and apply new automation technologies to manufacturing, ensuring affordable,
quality products for our global customers.
Rapid Prototyping and Design Aids
Methods such as rapid prototyping and technologies such as the CAVE Automated Virtual
Environment (CAVE) and next-generation
CAVE2TM enable improvements in production design and product upgrades. Design for
Manufacturability Assessments (DFMAs) can
be run from our CAVE and CAVE2-based
Immersive Design Centers (IDCs) in Tucson,
Figure 2. Robot cell used to automate the
assembly of missile seekers
Figure 3. CAVE2TM Immersive Design
Center is located in Andover, Mass.
5
FEATURE
Raytheon Manufacturing Technology: Producing Better Products Today and Tomorrow
3D Virtual Prototyping Environment.” The
article describes the development of a virtual
prototype for the Deployable Radar Approach
Control (D-RAPCON) system, Raytheon’s
“air traffic control system in a box” (see
Figure 4). The virtual prototype allowed customers and design engineers to move, virtually,
around and inside the shelter to refine system
requirements and the design, all in a virtual
3D environment before any actual hardware
had been built.
Virtual prototyping continues to grow in
importance as a valuable design capability, but
customers still require physical prototype demonstrations and evaluations of new products
prior to committing to full Engineering and
Manufacturing Development (EMD). Rapid
specific types of prototype systems, to quickturn processes that use existing production
capabilities within a larger conventional
manufacturing facility. The feature article,
“Integrated Rapid Prototyping at Raytheon,”
highlights three such Raytheon facilities
including the Rancho Innovations Center
(Rancho Cucamonga, Calif.) that specializes
in the design, fabrication and testing of
microwave systems.
Additive Manufacturing (AM), also referred
to as 3D printing, offers another improvement to rapid prototyping and design aids.
As detailed in the featured article, “Additive
Manufacturing at Raytheon,” the company is
using AM in several areas, including the manufacture of product assembly tools and fixtures,
Advanced Manufacturing Methods
and Processes
New manufacturing technologies must be matured before they can be reliably implemented
as part of a real production process. Raytheon
is focused on increasing the MRLs (manufacturing readiness levels) of new and emerging
manufacturing technologies in parallel with
the technology development. A collaborative
way of achieving this goal is through partnerships with universities and other companies.
The article, “Raytheon University Partnerships
Help Develop Advanced Manufacturing
Technologies,” highlights a few of our collaborations including the partnership with the
University of Massachusetts at Lowell (UML).
The Raytheon-UML partnership is focused
on radar and communications manufactur-
Figure 4. Virtual model of the D-RAPCON
“air traffic control system in a box”
prototype development to support urgent customer needs or early system evaluations is an
important type of prototyping that exists across
Raytheon. These rapid prototyping facilities
vary from self-contained, co-located facilities capable of designing and manufacturing
Figure 6. The Raytheon-UML Research Institute (RURI) is a collaborative partnership
between Raytheon and the University of Massachusetts at Lowell (UML) focused on radar
and communications manufacturing technologies.
unmanned underwater wehicles (see Figure 5),
novel thermal management solutions, and the
manufacture of missile parts. AM can reduce
early production costs and cycle times as well
as create complex geometries not possible
through conventional manufacturing. These
advantages make AM ideal for prototyping
and for low-volume production.
Figure 5. The hull of an unmanned underwater vehicle is additively manufactured
with a complex lattice structure
for strength.
6
ing technologies, with particular emphasis on
printed and flexible electronics, 3D printing
and nanotechnology (see Figure 6). By teaming with universities to understand the basic
science, and with Raytheon providing a realworld application focus, both the university
and Raytheon benefit from the cooperation.
An important advanced manufacturing process
FEATURE
E N G I N E E R I N G P R O F I L E FEATURE
Peter Kampf
being developed at Raytheon, and by others, is the 3D integration of advanced silicon semiconductor wafers and radio frequency (RF) devices.
This complex advanced manufacturing process is detailed in the feature
article, “Multilevel Wafer Stacking for 3D Circuit Integration.” The
direct bond hybridization wafer-level packaging approach is described
including process performance results (see Figure 7). Through this
advanced manufacturing approach, significant benefits in device size,
weight, power and cost can be achieved.
Our last feature article, “Vertically Integrated HgCdTe-based Sensor
Manufacturing,” describes a vertically integrated manufacturing process
for developing mercury cadmium telluride (HgCdTe) focal plane arrays
(FPAs). The process was developed at Raytheon Vision Systems (RVS)
Figure 7. Large format focal plane array developed using the direct
bond hybridization (DBH) process
and starts with the raw materials and extends to the completed FPA
sensor module, providing full end-to-end control of the process. The
approach allows RVS to tailor the HgCdTe material characteristics for
specialized applications, and it provides short-loop feedback in support
of design innovation and material optimization.
Other Manufacturing Research at Raytheon
The advancement of manufacturing technologies continues to play a
key role in the success of our customer’s missions by creating affordable solutions aligned to our product families. This issue of Technology
Today highlights some of our current projects in the area of automation, rapid prototyping, and improvements in manufacturing processes.
There are numerous other ongoing initiatives in other areas, all focused
on improving the manufacturability of our products. •
Peter Kampf
Senior Director,
Enterprise Lean
Manufacturing,
Corporate Operations
Since joining Raytheon
in 1989, Peter Kampf
has continually
engaged in and
worked towards process and engineering
improvement throughout the company. He is
currently senior director of Enterprise Lean
Manufacturing for the
Raytheon Engineering,
Technology and
Mission Assurance
(ET&MA) organization.
Kampf is primarily
responsible for developing and deploying waste elimination processes throughout
the company’s value stream, enabing faster cycle times while
maintaining high product quality and reducing overall
manufacturing costs.
When asked about what excites him about his job, Kampf
states that it is “the challenge of constantly finding and implementing new ways to improve the manufacturing efficiency of our
products. By constantly improving our processes and manufacturing technologies it enables us to affordably provide our
warfighters with the superior capabilities they require to meet
their mission objectives.”
Prior to his role with ET&MA, Kampf was the Business Lean director for Raytheon Integrated Defense Systems (IDS) Operations.
There, he drove product affordability, major improvement initiatives as well as business-wide employee based safety efforts.
Again, he focused on operational excellence, i.e., the mindset and
practice of continuous improvement. When asked about this
mindset, Kampf points to “making a difference for our end customer. I feel I can leverage commercial best practices and innovate
our processes to realize meaningful results.”
His other previous Raytheon experience includes work with the
Trident Missile Guidance Computer program where Kampf acted
in a quality engineering role, reducing product variation and eliminating waste in both automated and manual assembly processes.
He was a lead process engineer for the E-2C Hawkeye Mission
Computer Upgrade program where he indoctrinated lean concepts
into the transition-to-production arena. He also led major facility
transition efforts during the late 1990s where his leadership
resulted in the optimization of product flow, the tripling of manufacturing throughput and bottom-line savings to his customers.
Kampf is a Raytheon Six SigmaTM (R6s) Expert. His experience as
an Expert has been career changing. “This experience,” Kampf
says, “exposed me to many facets of the business and provided
me new tools and methods to help improve product cycle times,
quality and cost. I recommend all Raytheon employees make the
most of applying R6s to their daily efforts.” Kampf is also a current member of the Greater Boston Manufacturing Partnership
(GBMP) and a past board of directors member for the Northeast
Region of the Association for Manufacturing Excellence (AME).
7
FEATURE
RAYTHEON MISSILE FACILITY MODERNIZED
by Advanced Technologies
The Raytheon Redstone
Missile Integration
Facility (RRMIF) is a
55,000-square-foot
manufacturing plant
established in November
of 2012 in Huntsville,
Ala., for the production
of Standard Missile-3
(SM-3) and Standard
Missile-6 (SM-6) interceptors, key components to
the U.S. Navy’s air and
missile defense capability.
The facility stands unique
in its extensive use of
automatic guided vehicles
(AGVs) and a host
of automated systems
designed to ensure the
safe, accurate and reliable
assembly of missiles.
Historically, missile production has been an
arduous, manual process involving heavy
components and energetics, which include propellants, explosives and pyrotechnics. Moving
missile parts or the act of completing a missile
from workstation to workstation (commonly
referred to as “critical lifts”) could require
as many as six or more persons to lift the assembled piece onto a stand and roll it on to the
next position. With the introduction of AGVs,
once inside the loading dock area, workers
are no longer required to handle energetics or
perform the physical tasks associated with the
move. Instead, wireless communications are
used to instruct a laser guided AGV to transfer
the unit from station to station (see Figure 1).
Movement of the hardware in this instance is
completely automated by way of laser guidance that uses a series of emitters and receptor
targets around the factory. As the AGV carries
out the transport, a separate laser sensor
continually monitors proximity to other objects or humans within a specified “safe” zone,
and it will stop movement on the platform if
anything should get too close.
Once at the programmed destination (see
Figure 2), the AGV places the piece onto the
workstation with slow, smooth movements.
Here, further automation guides technicians
in assembling the internal missile components.
Work instructions are integrated into the
automated system, which includes protocols
to verify the technician’s training level for the
task, checking part numbers and assembly
requirements, and ensuring every part is in
the correct position and every screw is tightened to the proper torque.
The innovative automation processes used at
RRMIF were first developed at the Raytheon
Integration and Test Facility (ITF) in Tucson,
Figure 1. An automatic guided vehicle transports missile parts between stations
in the manufacturing facility.
8
FEATURE
Figure 2. Manufacturing engineers work on a Standard Missile.
Ariz. Energetics is the main business of the
assembly and test work performed at ITF and,
for the first time ever, the ITF design team
developed automation processes that met the
strict safety requirements needed to handle
energetics within a secure, closed-area environment. Overcoming the challenges presented to
the automated manufacturing team required a
collaborative partnership with environmental,
health, safety and sustainability; security; and
operations organizations. Machine communications and interaction protocols had to be
met at a systems level to ensure interference
from low-output lasers and wireless communications would not detonate or render inert
energetics or cause unplanned AGV motion.
Ergonomic standards had to be met to eliminate job-related hazards of repetitive motion or
lifting. Developing a no-lift method of material
movement also eliminated the opportunity for
dropped hardware and the potential effect on
energetics. Additionally, the team successfully
used this automation to build a green facility
to help minimize energy consumption. The
facility used a small manufacturing footprint
to maximize floor space utilization and digital
communications and radio frequency identification systems to create a paper-free work
environment. Partnering across Raytheon and
with other automated manufacturing industry
partners, and by employing the latest technological innovations, the manufacturing team
created a new standard in the approach
to energetics production.
Automation systems at RRMIF and ITF have
reduced recurring production costs as well as
costs associated with the transition to production. With these changes, Raytheon has
brought modern manufacturing techniques to
missile production, resulting in weapons that
are safer to produce and more reliable. •
Jeff Hidalgo
OVERCOMING THE
CHALLENGES PRESENTED
TO THE AUTOMATED
MANUFACTURING
TEAM REQUIRED
A COLLABORATIVE
PARTNERSHIP WITH
ENVIRONMENTAL,
HEALTH, SAFETY AND
SUSTAINABILITY;
SECURITY; AND
OPERATIONS
ORGANIZATIONS.
9
FEATURE
APPLICATION OF ROBOTICS
to the Assembly of Missile Seekers
One of Raytheon’s key manufacturing strengths is its
production of missile systems.
Raytheon manufactures missiles for air, land, sea and
space applications, including
interceptors for U.S. ballistic
missile defense. A key part of
these missiles is the seeker, a
device used to sense a target
and guide the missile to the
target location. Optical and
infrared missile seekers are
typically comprised of detectors, optical elements,
electronics and mechanical
assemblies with production
rates ranging from hundreds
to thousands of units per year.
Historically, assembling a missile seeker has
been a labor intensive process, dependent primarily on the skill of highly trained operators.
As build quantities have increased, demand has
grown for greater production capacity, which,
in turn, has increased the need for additional
operators. While some intricate and precise
assemblies continue to require the efforts of
specially trained operators, others are potential
candidates for automation with the opportunity to reduce the demand on our skilled
workforce. One form of automation, the
robotic cell, is particularly effective for missile
seeker type assembly operations. A robotic
cell is a manufacturing cell that uses a robot to
10 2015 ISSUE 1 RAYTHEON TECHNOLOGY TODAY
perform some, if not all, of the assembly task
set for a particular component. The cell
is capable of maneuvering to exacting tolerances with speed and repeatability. It is also
programmable for application to several
different parts or subassemblies.
Raytheon performed trade analyses across
the missile seeker product line to evaluate
candidate assemblies for production by robotic
cells. The suitability of a component for this
type of automation depends on such factors as build quantity, intermittent assembly
schedules, design/automation process compatibility and the use of existing processes that
are highly variable. The impacts of the current
process on human factors such as ergonomics
are also considered. For example, automation
can eliminate tedious and repetitive tasks that
are associated with repetitive motion injuries.
Finally, estimated recurring cost savings from
reduced assembly labor and reduced assembly defects are used to project an automation
return on investment (ROI). Ideal candidates
for robotic assembly are those that best meet
the overall goals of reducing cycle time, as-
Top Lens
sembly costs, work in process (WIP) inventory
and process variation, while at the same time
improving product quality and providing an
acceptable ROI.
Two assemblies, each for an optical seeker
component, were chosen for an initial implementation of the automated robotic cell. The
first assembly to be robotically implemented
was based on a new design, consisting of two
optical lenses bonded into a mechanical housing (see Figure 1). As this was a new design,
robotic cell capabilities could be considered
and the product design optimized for the automated assembly process. The second assembly
was an existing design, consisting of four optical lenses bonded into a mechanical housing.
This assembly had been manufactured by hand
for years, and it required tight tolerances approaching the limits of the robotic cell.
Raytheon developed a custom automation
cell (see Figure 2) capable of fully assembling
both types of seeker components and requiring minimal human attendance. Additionally,
since the cell was purposely designed around
Bottom Lens
Figure 1. The optical seeker component shown in the figure is comprised of a housing
and two lenses.
F
FEATURE
Figure 2. Robotic cell designed to assemble seeker optical components
Figure 3. Multiple robot end effectors are positioned within the robotic work cell.
common assembly process steps, it can later be
applied to additional components. The automation cell utilizes a Fanuc six-axis robot with
the ability to reach specific points and paths in
a very accurate and repeatable way. Assembly
work is performed through the use of “end effectors,” as shown in Figure 3. An end effector
is a selectable tool that attaches to the end of
Figure 4. Vacuum pick-up end effector
removes a lens from the material
kitting tray.
11
FEATURE
Application of Robotics to the Assembly of Missile Seekers
• Confirm the kit is complete with all
necessary parts.
• Ensure all necessary end effectors are properly staged for automated access.
• Provide dispense needle “calibration” (i.e., X,
Y, Z axis offsets for dispense motion).
• Ensure proper alignment between parts
to be bonded.
• Verify assembly materials are dispensed
properly at the beginning and end of
the process.
The application of adhesive onto critical
bonding surfaces is automated through the
use of another custom end effector (see Figure
6). The adhesive dispense process is regulated
through the use of multiple process controls.
These process controls include:
• Checking adhesive expiration date.
• Monitoring a thaw timer for frozen adhesives
to ensure material readiness for application.
• Monitoring material pot life1 to ensure
proper dispense pressure during application.
Figure 5. Vision system calibration of the adhesive dispense tip
the robotic arm to perform a specific task. Different end effectors are exchanged during the
assembly cycle using an automatic robotic tool
changer. The robotic tool changer provides a
powerful common interface between the robot
and multiple custom tools, and provides the
following functions:
vacuum pick-up feature that avoids contact
with the clear aperture of the lens (see Figure
4 on page 11). This ensures the part stays
clean and damage free. Vacuum tools may be
interchanged depending upon the size and geometry of the optical elements being handled.
• A mechanical mount.
The automated cleaning of optical components prior to bonding is performed through
the use of an atmospheric plasma cleaner. The
plasma cleaner produces a high density plasma
“plume” that effectively cleans, activates and
maximizes adhesive wettability of the targeted
component surface. The plasma treatment
provides a superior surface for bonding and
results in optimized bond strength and performance.
• Fluid connections for air, vacuum
and liquids.
• Electrical connections for power, controls
and communications.
• An end effector tool identification capability.
The tool changer is an affordable and mature
device commonly used in the commercial
automation industry.
Several robotic cell automated assembly
capabilities were developed specifically for
use with seeker components. These include
pick-and-place, cleaning, vision inspection,
adhesive dispensing and ultraviolet (UV)
curing operations.
The robotic pick-and-place of the optical
lenses is enabled through the use of a custom
designed end effector, which incorporates a
• Dispense tip cleaning2 .
F
c
Three cameras comprise the vision systems
of the automated robotic assembly cell. One
camera is mounted on a custom end effector,
which moves into position by way of a robot
arm to examine stationary objects. The second
and third stationary cameras examine the
adhesive dispense needle for alignment calibration (see Figure 5). Collectively, these cameras:
• Ensure the correct parts are present for the
assembly step and that the parts are properly
oriented (face up or down, etc.).
Figure 6. Robot dispenses adhesive to secure a lens
into a seeker housing.
FEATURE
Chad Spalt
Operations
New Product
Introduction
(NPI) Manager,
Missile Systems (MS)
Manufacturing
and Test
Engineering
Center
Figure 7. Parts presentation pallets (bottom of photo) allow rapid
change over from one product assembly to another.
The use of UV curable adhesives drastically reduces material curing
times from hours to seconds. The robotic cell uses a custom end
effector with a focused beam of UV light to apply UV energy to the
bond line of the adhesive.
Efficient use of an automated cell supporting multiple products is
dependent on the ability to rapidly change from one product to another
with minimal down time. This product change-over is accomplished
through the use of work cell software programming and parts presentation pallets (see Figure 7) which are designed with kinematic mounts to
quickly and precisely align their location within the automated cell. In
this robotic cell implementation, the changeover from one assembly to
the other is accomplished in less than 5 minutes.
The advancement of the Raytheon automated robotic assembly cell has
led to a more precise, repeatable, flexible and cost-effective process for
assembling optical components. The initial implementation resulted in
significant cycle time reductions and touch labor savings. It also provides a baseline automated assembly capability that can be tailored for
future seeker and other Raytheon product manufacturing. •
Chad Spalt, Contributors: David Stockero,
Bob Monier, Tolga Yazicioglu, Eric Huelsmann,
Jessica Overby, Charles Scott, Bob Munger
and Tony Vulcano
a lens
With more than 28
years of experience
in aerospace manufacturing, Chad Spalt
is a senior principal
engineer in the manufacturing and test
engineering group of
the Raytheon MS
business. In his role
as NPI manager,
Spalt works with
multiple development programs across all MS factories to ensure products
are designed for manufacturability and to meet cost targets. His focus is on applying the NPI process to
introduce quality products in a predictable manner,
ensuring program and factory success. The ultimate
goal is “to get quality products to the customer faster
and for less cost.”
Prior to his current assignment, Spalt was corporate
Technology Area Director (TAD) for manufacturing with
emphasis on additive manufacturing (3D printing). In this
position, he promoted the use of advanced manufacturing technologies and he facilitated collaboration across
all the Raytheon businesses. Prior to that, Spalt served as
operations program manager for the factory modernization project, “Fusion Factory of the Future,” where his
team implemented a new multimillion dollar distributed
electro-optical test system, structured a new process
focused factory value stream, and created an electrooptics product center, co-locating design engineering,
operations, quality and supply chain.
In previous assignments, Spalt was Operations lead for
the quick-turn, low-cost design and fabrication of the
mini-RF space electronics where he led a small, agile
operations team to work up front with Engineering to
influence design producibility and part selection for ease
of assembly and test. He was also Operations lead for the
Project Sheriff directed energy weapon system, taking the
product from concept to delivery in nine months with an
emphasis on using the right part for the application.
“There is a great deal of satisfaction when the team
introduces a new product design that keeps Raytheon
competitive and the supplier of choice,”Spalt notes.“
Our goal is to influence that product design for manufacturability and enable rapid, cost-effective production.
Whether it is designing our products to take full advantage of existing factory capabilities or upgrading our
factory processes to enable future product designs, the
desired end result is the delivery of quality, cost competitive products to our customers.”
1 Pot
2
life is the period of time after mixing during which an adhesive remains suitable for use.
After each dispense, the tip must be cleaned to remove residual material buildup and ensure
smooth or continuous material flow.
13
FEATURE
RAYTHEON ADVANCED PRODUCTS CENTER:
RF Subsystem Manufacturing and Integration Excellence
The Raytheon Advanced Products Center (APC) provides
radio frequency (RF) technology
design, development and manufacturing for the U.S. Department of Defense programs,
producing key products for RF
subsystems, including RF modules, micro-interconnect circuits,
radomes, structural composites
and antennas.
APC provides strategic enabling
technologies for Raytheon’s
critical radar, missile, electronic
warfare and communications
businesses and for other
targeted global markets. The
APC is located in Texas, with
manufacturing facilities in Dallas and McKinney, which were
recognized for manufacturing
excellence: Industry Week Best
Plant (2009), Texas Award for
Performance Excellence (TAPE,
2010), and Association for
Manufacturing Excellence
Plant (2011).
APC is organized and equipped to efficiently
build high- and low-volume products (averaging 150,000–200,000 RF modules per year).
Co-located engineering expertise and optimized
factory design processes combine for very
producible, high-yield designs while internal
prototype and test laboratories facilitate rapid
design development and smooth transition
to production. Three plants comprise APC’s
main manufacturing facilities: 1) RF Microelectronics (RFME), 2) RF Products and Components (RFPC), and 3) RF Subsystems and
Integration (RFSI).
RF Microelectronics Factory
The RFME factory offers state-of-the-art
manufacturing of microwave and millimeter
wave products, including transmit/receive
(T/R) modules, T/R integrated multichannel
modules (TRIMMs), and array panels for air,
space, ground and shipboard applications. Examples of these work cells are shown in Figure
1. The factory has delivered more than 2 million T/R modules and more than half a million
module-less T/R channels for TRIMMs and
panels. Statistical process controls and real-time
Figure 1. APC automated work cells for transmit/receive modules located in the
RF Microelectronics factory.
Shingo Model™ introduces Guiding Principles on which to anchor current initiatives and fill the gaps in efforts towards ideal results and enterprise excellence.
CMMI® (Capability Maturity Model® Integration) models are collections of effective practices that help organizations to improve their processes. A CMMI appraisal evaluates the organizations
capability against the CMMI model at five different levels of maturity.
1The
2
Use of the Shingo Model1 and the Capability
Maturity Model Integration2 (CMMI) assessment in 2014 have furthered this benchmark,
allowing the center to improve resource utilization and support with an overall reduction of
the manufacturing footprint. APC is currently
at CMMI level 3 with manufacturing advancements attributable to a focus on factory efficiencies, collaborative management tools, and
quantitative analysis tools supporting actionable information and continuous improvement.
FEATURE
e
e
Figure 2. APC automated radiator-circulator production line located in the RF Products and Components factory.
performance analysis contribute to the
achievement of high yields with minimal
scrap and rework.
RF Products and Components Factory
The RFPC factory has been operating for more
than three decades, producing high performance, complex radiators, circulators and
interconnect substrates for microwave and
millimeter wave applications. Substrate manufacturing capabilities include thin films, thick
films and polymer on metal circuits. Advanced
production techniques, including metal deposition, wafer bumping and chemical etching as
well as other core processes provide for significantly increased product robustness and yields
with reduced cycle times. Combined with other
optimized core processes, these capabilities
meet the production needs of both current and
next-generation RF products. RFPC has built
over 16 million interconnects and more than
150,000 circulators. Figure 2 shows the APC
automated radiator-circulator production line.
RF Subsystems and Integration Facility
The RFSI facility is home to one of the world’s
largest co-located antenna test ranges (see
Figure 3) and provides a showcase for stateof-the-art missile radome and antenna fabrication equipment and semi-automated processes.
This extensive complex features 15 indoor
and seven outdoor test ranges, serving diverse
component and system level testing needs.
Here, products ranging from next-generation
prototypes to high-volume precision subassemblies are designed, built and integrated. RFSI
incorporates advanced manufacturing capabilities, including structural composites fabrication, resin transfer molding, antenna and
electronic assembly, material characterization,
evaporated deposition, and radome and active
electronically steered array (AESA) subsystem
integration and test (see Figure 4).
Collaborative Management in a High
Volume Environment
levels of business execution, from contract
receipt to product delivery. The systems the
APC employs provide real-time business
process execution information and metrics
to all disciplines across the enterprise to facilitate daily monitoring and control business
activities. Factory teams, engineering support
teams, program teams and APC leadership use
these systems for both real-time decision aids
(plan monitoring and action adjustments) and
to analyze and define performance improvement plans (immediate, mid-term and long
term). Figure 5 highlights the more important
tools utilized by APC manufacturing. A daily
tier-structured accountability system envelopes
the usage of these tools. This structured communication approach ensures quick communication flow across the enterprise. Daily
meetings start with operators and end with
the general manager, ensuring the right levels
of the organization are responding to time
critical actions (see Figure 6).
APC has established comprehensive capabilities to monitor, measure and control multiple
15
FEATURE
Raytheon Advanced Product Center – RF Subsystem Manufacturing and Integration Excellence
Figure 3. Indoor and outdoor range facilities at the RF Subsystems and Integration facility
support multiple products.
Manufacturing Improvements Through
Accelerated Quantitative Analysis
Data analysis resulting in actionable information is essential for continuous improvement
within an automated manufacturing environment. APC has adopted an approach to accelerate and simplify the data analysis process with
dynamic data mining and interactive visualizations. This approach enables targeted improvements of incoming supplier components,
improved test verticality and a significant
reduction in root-cause analysis cycle time,
ultimately driving higher yields and
predictability. This lean approach to analyzing
Tool
data greatly increases APC’s responsiveness to
variation across a wide variety of product families, enabling stakeholder understanding and
support for technical and business decisions.
One of the tools utilized by APC for data
analysis is JMP®, a statistical analysis solution
from SAS Institute, Inc. In comparison with the
historical analyses performed by way of spreadsheet applications, APC has shown an improvement in hours, and in some cases days, with
regard to the amount of time spent on similar
tasks using JMP. This gain in efficiency returns
valuable time to technical teams for additional
Functionality
Tier meeting system
Daily communication process starting with operators and ending
with the general manager; the system ensures the correct organizational
levels respond to time critical actions.
Customer requirements system
Translates top-level program delivery requirements into value stream
component delivery requirements.
Capacity database
Models current and forecasted factory and test capacity requirements.
Takt database
Provides real-time information on factory work-in-progress, throughput
and cycle times.
Production interrupt
Process allowing factory personnel the ability to issue a stop-work
and notify key support personnel needed for corrective action.
Improvement suggestion system Repository for improvement ideas generated across the factory workforce.
JMP
Statistical analysis tool for rapid correlation analyses
on a large number of variables.
Figure 5. Key tools utilized across APC manufacturing
Figur
Figure 4. RF radome and AESA subsystems
are assembled at the RF Subsystems and
Integration facility.
or advanced analyses which dig deeper into
supplier component data, and more specifically, its impact on functional performance
observed during module and unit testing.
For example, a recent detailed parametric
analysis performed as part of a gauge repeatability and reproducibility (R&R) study at
a supplier enabled a proactive part binning
scheme, addressing distribution offsets from
monolithic microwave integrated circuit-tomodule performance, and significantly
improving APC product yields.
Additionally, on a separate antenna production
program, JMP provided a statistical analysis
with visuals for all 200 test parameters in less
time than it would have normally taken to
summarize just 30 key performance parameters. The ability to summarize the information on just several normalized capability plots
allowed the discussion to focus quickly on the
highest risk design parameters.
FEATURE
Amanda Rickman
Manufacturing
Technology Area
Director, Corporate
Operations
Tier 3
Senior leadership
reviews production
summary. Tier 3 members
address escalated issues
and systemic trends.
Tier 2
Value stream managers summarize
factory production status. Tier 2 members
resolve or escalate Tier 1 issues.
Tier 1
Factory personnel establish priorities
and alert their team to concerns. Tier 1 team resolves
issues within their control or escalates to Tier 2.
Figure 6. Tiered accountability system
APC partners with Raytheon program teams and critical suppliers to
drive quantitative analysis on parts data and parametric test data and
plans to use the lessons learned in these pilot activities to deploy standardized analysis practices across all factories and programs.
Summary
APC provides Raytheon with state-of-the-art RF design, manufacturing and integration capabilities focused on its three main facilities:
RFME, RFPC and RFSI. During the past 30 years, through innovation
and collaboration with its customers, APC has significantly increased
the performance and reduced the cost, size and weight of its RF
components. APC continues this trend through innovation such as
factory automation, collaborative management techniques and
quantitative analysis tools. •
Ted Jones,
Patrick Wilde and
Leonard Wittenberg
Since May 2015,
Amanda Rickman
has been the
Corporate
Manufacturing
Technology Area
Director (TAD),
responsible for the
collaboration and
innovation of manufacturing across the
enterprise. Several
fields of emphasis
include additive
manufacturing,
advanced testing,
visualization in manufacturing and model based manufacturing. Raytheon’s
Technology Focus Areas (TFAs) as well as the Raytheon
Innovation Challenge (RIC) are fueled by the needs of the
business unit technical directors, which tie directly to
Raytheon’s customer missions. “Our success,” Rickman
states, “as well as that of our customer, depends on our
capacity to deliver effective solutions to technically challenging problems.”
Prior to her current role at Corporate, Rickman spent
14 years as a process engineer for Space and Airborne
Systems (SAS), supporting the Advanced Products Center.
During this time, she took on manufacturing support
roles of increased responsibility, including the development of non-hermetic advanced coatings; capital
coordination; and participation in IPC — Association
Connecting Electronics Industries — and the National
Aerospace and Defense Contractors Accreditation
Program (Nadcap). Her latest role before taking on the
Manufacturing TAD position was section manager for
the Hardware Engineering Center in Dallas.
Some of Rickman’s earliest work at Raytheon began as
a concept, as part of an IRAD (Internal Research and
Development) project. “Being part of a technology leap
from its infancy to qualification to full-scale manufacturing over the course of a decade has been a unique
experience,” Rickman reflects. “Seeing ideas go from
science experiments to viable manufacturing processes
has driven my desire to stay involved in development
and innovation.”
Rickman’s current Manufacturing TAD role keeps her
involved in cutting-edge innovation within the industry
while also allowing her to support the current manufacturing needs in the factories. Something which she is very
keen to do: “Having the opportunity to support both production and IRAD projects early in my career has given
me a larger perspective of the needs of the business.
Understanding that IRAD and other development efforts
feed the factories has helped me to see the entire manufacturing life cycle and allowed me to apply that
knowledge in my current role.”
17
FEATURE
ADDITIVE MANUFACTURING
at Raytheon
Many traditional part
manufacturing processes
are subtractive in nature
where material is removed
to create the final object.
They typically require creation
of new tools and fixtures
which adds development
cost and cycle time and ultimately drives how we design
and build products. Additive Manufacturing (AM) is
a term applied to a group
of manufacturing processes
that create objects by adding
material, usually plastic or
metal, in multiple thin layers where needed to form
the final shape. Also referred
to as 3D printing, AM offers
unique benefits over traditional subtractive manufacturing methods and is shifting
the paradigm from designing
what we can build to building
what we can design.
Some of the key advantages of this technology
are:
• A reduction in early production cost and
cycle time, making AM ideal for prototypes
and small lots and enabling early rapid design
iterations.
• The ability to create complex geometries and
material combinations that are not possible
using conventional manufacturing, potential-
uses a laser or other material consolidation
method. There are many variations of the AM
processes shown in Figure 1, typically with only
minor differences. For example, powder based
fusion (PBF) variations include direct metal
laser melting (DMLM), where metal powder is
used, laser sintering (LS) for plastic powders,
and electron beam melting (EBM), where an
electron beam is used in place of a laser.
Figure 1. Three common additive manufacturing methods
ly allowing new higher performance, lower
cost and weight products.
• The ability to customize parts during production runs with minimal additional cost.
AM technology is decades old but has only
recently matured to a point where significant
numbers of deliverable parts are now being
produced using AM. With potential growth in
virtually every manufacturing sector, the global
market reached $1.6 billion in 2013 from $1.1
billion in 2012 and had a compound annual
growth rate of 44 percent with greater than 20
percent growth in each of the previous three
years.1 There are many different AM types with
three of the most common methods shown in
Figure 1. Nearly all of the AM processes share
the ability to build parts layer by layer, whether
the base material used is a metallic powder
or a plastic filament and whether the printer
Raytheon applies AM throughout the product development cycles, including model and
demonstrator development for early concept
studies, tool and fixture production for product
assembly and integration, early prototype
development for evaluation and field test, rapid
early production cycle support and obsolete
part replacement. Raytheon investments in
new areas of AM research such as printed
electronics and thermal management enable
designs that were not previously possible with
traditional manufacturing techniques. The next
four sections highlight AM applications.
Manufacturing Tools and Fixtures
AM enables rapid development and manufacture of manufacturing aids, tools, assembly
fixtures, potting molds, paint masks, product
guards, testing devices and inspection fixtures.
The unique shapes of these manufacturing
1Wohlers, Terry
et al. “Wohlers Report 2014”, ISBN 978-0-9913332-0-2, 2014
FEATURE
RAYTHEON INVESTMENTS IN NEW AREAS OF AM RESEARCH SUCH AS PRINTED
ELECTRONICS AND THERMAL MANAGEMENT ENABLE DESIGNS THAT WERE
NOT PREVIOUSLY POSSIBLE WITH TRADITIONAL MANUFACTURING TECHNIQUES.
devices make them well suited for AM, and
the fixtures can be easily and quickly modified as the product design evolves. Fixtures are
generated directly from computer-aided design
(CAD) models and allow for complexity that
would previously be very expensive with long
rapidly iterated to the final design, significantly reducing fixture costs.
d.Custom ESD holding fixture fabricated directly from the CAD model to ensure repeatable alignment.
parts associated with the vehicle’s hull,
Raytheon engineers have addressed these
structural challenges by integrating threedimensional lattice structures into the original
part geometries. The result is a part with highly
complex lattice geometries built in a single step
by a single AM manufacturing process. The part
is lighter weight but still structurally equivalent
to the conventionally manufactured version
(see Figure 3).
The parts also have lower cost, reduced
development cycles and reduced lead times
compared to conventionally manufactured
UUV parts. As a result, UUV design and build
times have been reduced from months to weeks
allowing for quicker design iterations and faster
system development.
Missile Production
Figure 2. Examples of additively manufactured tools and fixtures
cycle times by standard tooling methods.
There are also AM materials with static
dissipative properties for making devices that
have applications where an electrostatic discharge (ESD) damages products, impairs their
performance or causes an explosion. Figure 2
shows examples of additively manufactured
tools and fixtures:
a. Custom detailed mask boots are fabricated
directly from the CAD models and replace
time consuming manual tape masking
for paint.
b.Custom semi-rigid cable bending fixtures
created directly from the CAD model ensuredrawing specifications are met.
c. Press-fit fixtures for gasketed electromagnetic
interference (EMI) window installation are
Unmanned Underwater Vehicles
From concept models to deliverable systems,
Raytheon utilizes AM in the development of
unmanned underwater vehicles (UUVs). In
particular, LS, is used by design teams to rapidly
prototype functional vehicles and develop
tooling and fixtures used during assembly, integration and test. LS allows designers to quickly
iterate through complex geometries that would
have been cost and schedule prohibitive under
traditional manufacturing processes. AM technologies also allow engineers to merge complex
structures to reduce part counts, eliminate
hardware, and simplify assembly versus conventional manufacturing methods. Though
UUV parts built with LS from thermoplastic
based powders can be less robust when compared to metal based counterparts, especially
An early opportunity for Raytheon to use AM
for functional parts came in 2007 during the
Excalibur Increment Ib program. Excalibur is
a precision guided munition and the traditional
titanium manufacturing methods typically used
for the tail-fin assembly, including mold design
and fabrication for the metal cast process,
would take too long to produce the minimum
number of parts required for flight testing to
meet the desired early development production
Cut away showing
lattice structure of
additively manufactured
UUV hull
Figure 3. An additively manufactured UUV
hull with an integrated three-dimensional
lattice structure provides equivalent structural strength at a lower weight compared
to conventional UUV hulls made of metal.
19
FEATURE
cycle. As an alternative, the EBM AM process
was evaluated and chosen to quickly manufacture a fully dense titanium tail-fin assembly.
With EBM, part manufacture and final machining of critical interfaces was accomplished
in almost an order of magnitude less time
than using the conventional manufacturing
approach, significantly reducing cycle time and
eliminating the cost of expensive casting molds.
These additively manufactured parts were used
in early engineering flight tests (see Figure
4). While customer requirements resulted in
incorporating an alternative base configuration,
Additive Manufacturing at Raytheon
These nonstructural flight components are very
lightweight and low cost in low volumes.
Thermal Solutions
Raytheon also uses AM to develop new and
improved thermal management solutions for
electronics packaging. The designs leverage the inherent advantages of aluminum
powder bed fusion techniques such as direct
metal laser sintering. Among the advantages
of using AM are greatly decreased cycle time,
improved thermal performance and the ability
to combine multiple parts and scale existing
Additionally, additively manufactured production parts have been used as both structural and
nonstructural components in other munition
demonstations. For one program during prototyping and low rate production, the housings
for the control actuation system (a structural
component) was manufactured by LS and the
guidance electronic unit (GEU) mounts (nonstructural) were stereolithographically fabricated. Similarly, for another program, the harness
guides are manufactured using the LS process.
Cooling
Inlet
Many traditional cold walls used as part of a
thermal management solution utilize a vacuum
brazing approach to assemble multiple complex
pieces. Vacuum brazing has a small vendor
supply base, long cycle times, and the potential for leak paths to occur at braze joints. AM
eliminates these concerns by combining the
multiple parts that would be brazed together
into a single component (see Figure 5).
Building a vacuum brazed cold wall unit takes
months, whereas with AM, an equivalent-functioning part can be built in less than a week.
This greatly reduced lead time enables not only
multiple design cycles but further refinements
to the design based upon first article results.
Also, considering all the precision fabricated
parts, purchased fin stock sections and miscellaneous other parts needed for the brazed design, an additive approach can provide greater
than a 90 percent reduction in part counts. The
Figure 4. The titanium tail-fin assembly for the Excalibur munition was additively
manufactured to support initial product development.
the additively manufactured parts contributed
to a substantial program savings during initial
product development.
designs. In addition, the designer of a thermal
management solution is no longer constrained
to designs that must be manufactured using
traditional machining techniques. In fact, most
CAD-designed topologies can be successfully
built with an additive approach; this is not true
for conventional manufacturing. The result is
that AM provides the engineer enhanced design
flexibility to optimize a system’s thermal management performance.
Cooling
Outlet
Additively manufactured
part contains internal
cooling paths not possible
using conventional
machining methods.
Electronics
Cold Plate
Brazed bottom plate
Brazed fin stock
Traditionally Manufactured Cold Wall (side view)
Additively Manufactured Cold Wall
Figure 5. Cold plate assembly (top left), traditional manufactured multipart cold wall (bottom left), and a single piece additively manufactured cold wall (right)
FEATURE
ENGINEERING PROFILE
Jeff Shubrooks
lower part count contributes directly to a reduced Supply Chain effort and
streamlined logistics for long term product sustainability.
Summary
AM is a constantly evolving field with more applications and materials
being developed daily. The processes are maturing to a point where widespread production adoption will start to occur. Raytheon is committed to
additive manufacturing and its key advantages:
• The ability to customize tools and parts during production runs with
minimal costs.
• A reduction in early production cost and cycle time — enabling early
rapid design iterations.
• An enabler to complex geometries not possible using conventional
manufacturing — enabling potential higher performance, lower cost and
lower-weight products.
Raytheon has already leveraged AM for tooling, prototyping and early
production, and the full potential of AM is currently being explored to
enhance new aerospace and defense system designs. •
Jeff Shubrooks,
Jack Graham,
Curtis Carlsten,
Teresa Clement and
Dave Brandt
RAYTHEON HAS ALREADY
LEVERAGED AM FOR TOOLING,
PROTOTYPING AND EARLY
PRODUCTION, AND THE FULL
POTENTIAL OF AM IS CURRENTLY
BEING EXPLORED TO ENHANCE
NEW AEROSPACE AND DEFENSE
SYSTEM DESIGNS.
Engineering Fellow
With more than
26 years of experience at Raytheon
Company, Jeff
Shubrooks is a
mechanical engineering fellow
focusing on manufacturing capabilities
development within
the Raytheon
Integrated Defense
Systems (IDS)
business. As transition-to-build (TTB)
lead, his primary
goal is to create
links between customer product needs
and manufacturing capabilities while maintaining high
manufacturing readiness levels (MRLs) that enable rapid
response affordable solutions. Shubrooks also leads the
IDS Additive Manufacturing Council and is co-lead for
the AM Core Research Enterprise Campaign.
Shubrooks strongly believes that “without manufacturing
and product technology advancement, we cannot remain
competitive. Both are key to Raytheon’s success.”
Shubrooks recently completed his rotation as the
Corporate Manufacturing Technical Area Director (TAD)
where he was responsible for coordinating Raytheon’s
manufacturing technology development and strategy. In
this role, he served as primary liaison between Corporate
Technology and Research and the Raytheon technical
manufacturing community. Previously, Shubrooks was
manager for Circuit Card Assembly (CCA) New Product
Introduction Engineering where he coordinated the introduction of new programs and technologies into the
Raytheon CCA Center of Excellence (COE).
“Working in the CCA COE enabled me to build relationships across Raytheon,” Shubrooks states. “The
day-to-day competition with outside suppliers really
emphasized the importance of being affordable while
bringing value. In my TAD role I was able to see the full
technical diversity of Raytheon and how manufacturing
could be better tied to Raytheon’s technical needs.”
Shubrooks began his career with Raytheon Company as
a manufacturing engineer for surface mount and printed
circuit assembly. In this position, he helped institute surface mount technology into a production facility,
realizing significant savings from a new automated
soldering process.
21
FEATURE
INTEGRATED RAPID PROTOTYPING
at Raytheon
U.S. Department of Defense (DoD) customers require demonstration and evaluation of
new product functionality and performance
through prototypes, prior to a decision to proceed with the engineering and manufacturing
development (EMD), i.e., prior to the
DoD milestone B decision. According to a
2007 memorandum issued from the office of
the Undersecretary of Defense, “Many troubled
programs share the following common trait.
Program decisions were based largely on paper
proposals that provided inadequate knowledge of technical risk and a weak foundation
for estimating development and procurement
cost. Going forward, all acquisition strategies
must include competitive prototyping before
Milestone B.” Raytheon’s ability to quickly
define prototype requirements and virtually
and physically design, test and manufacture
them supports the DoD prototyping objective.
In addition to supporting milestone B decisions, Raytheon’s integrated rapid prototyping
capability enables early demonstration of new
technology-enabled system concepts to
support early phase DoD requirements and
feasibility studies.
phases, resulting in prototypes with optimum
performance, quality and cost.
Integrated rapid prototyping can be segmented
into three phases: Phase I consists of customer
requirements management capturing customer
needs; Phase II consists of virtual design and
manufacturing; and Phase III consists of physical design and manufacturing (see Figure 1).
Raytheon has invested in capabilities that allow
fast and well integrated execution of all three
•With Phase III, a leading edge additive
manufacturing (AM) capability allows for the
rapid production of prototypes and working
hardware without the need to create costly
and time consuming dies. The virtual design
data can be used to produce additive parts,
improving speed and quality. Examples of
Raytheon’s use of AM are provided in the ar-
Refine and Document
Customer Needs
• With Phase I, Raytheon uses the Dynamic Object Oriented Requirements System (DOORS)
to capture and manage complex customer
requirements. DOORS drives discipline and
flexibility in managing various conflicting
requirements.
• With Phase II, immersive design capability
allows all the key stakeholders such as customers, design engineers and manufacturing
experts to view the design and its manufacturing process in a three-dimensional (3D)
virtual reality, maximizing the discovery of
manufacturing design defects prior to producing a physical prototype. This capability was
highlighted in the Technology and Innovation section of the Nov. 10, 2014 Boston Globe
article titled, “Now Showing Missiles in 3D,”
and is also highlighted in the article, “Visual
Immersion for Virtual Design and Manufacturing,” included in this edition
of Technology Today.
Virtual Design and
Manufacturing
Customer Requirements
Customer
Needs
Many infrastructure capabilities are needed to
rapidly complete the three phases and deliver
the prototypes. For example:
Reqmnt’s
Figure 1. Integrated rapid prototyping phases
Virtually Design and
Analyze
ticle, “Additive Manufacturing at Raytheon,”
included in this edition.
• In addition, other technical capabilities are
needed, such as modeling and simulation,
processes that fast-track decision making
and organizational capabilities that focus
resources.
Across Raytheon, there are many facilities capable of integrated rapid prototyping that leverage the various capabilities noted above. These
facilities vary from self-contained, co-located
facilities capable of designing and manufacturing specific types of prototype systems, to
quick-turn processes that use existing production capabilities within a larger conventional
manufacturing facility.
The following examples collectively highlight
and demonstrate the wide range of integrated
rapid prototyping capabilities at Raytheon;
• The Raytheon Accelerated Product Innovation and Development Shop (RAPIDS), a
proven process, leveraging existing functional
teams and production systems, specializing
in communication, situational awareness and
surveillance systems.
• The “Bike Shop,” a self-contained system prototyping facility, specializing in missile related
products.
• The Rancho Innovations Center (RIC), a selfcontained facility, specializing in designing,
fabricating and testing microwave systems.
Physical Development
and Manufacturing
Design
Develop, Manufacture
and Test
Prototype
,
FEATURE
ENGINEERING PROFILE
Aaron Shin
Raytheon Accelerated Product Innovation and Development Shop
Raytheon uses RAPIDS to successfully deliver prototypes and ultimately
provide low-cost solutions to customers. RAPIDS is a completely scalable
process for executing prototyping programs, ranging from initial concept
prototypes to system prototypes for user evaluation. RAPIDS uses a combination of pre-tailored step-by-step processes and effective governance
led by a dedicated group of individuals named to the RAPIDS board, that
includes key program stakeholders as well as representatives from program management, engineering, manufacturing, quality and supply chain
organizations and other key functional areas. The pre-tailored processes
aligned to different customer needs allow for quick start-up planning as
well as coordinated execution across functions such as engineering, finance,
supply chain and manufacturing. The governance process aligns resources,
resolves issues quickly, and continuously improves the RAPIDS process
through an integration of lessons learned for future programs. Once a
program begins the RAPIDS process, the program manager uses the defined processes to manage the execution of the program and then relies
on the governance process to ensure transparency and accountability
across the different organizations.
In addition to the pre-tailored processes and governance, three additional
practices are essential to the success of RAPIDS:
• Co-locating the engineering, manufacturing and supply chain staff.
• Prototyping within the production environment.
• Assigning dedicated points-of-contact for supply chain and
material handling.
Team co-location enables all stakeholders to collaborate face-to-face
for fast program execution and issue resolution. The integration of the
RAPIDS activities within the production environment enables the planning
and design of artifacts to be used directly for the purpose of transitioning
to a production environment. The dedicated supply chain and material
buyers enable timely material purchases and release in parallel with the
design itself.
A good example of the use of the RAPIDS process is the Raytheon Electronic Data Manager (EDM) system (see Figure 2). The EDM provides
Senior Director,
Corporate Operations
As a senior director
for transition-to-production in the
Engineering,
Technology and
Mission Assurance
organization of
Raytheon Corporate
Operations, Aaron
Shin is responsible for
development and
execution of numerous enterprisewide
initiatives to improve
Raytheon’s overall
product life-cycle
development process
and manufacturing
efficiency. These
efforts include tactical and strategic projects to systematically
improve quality, cost, time to market and customer satisfaction,
while yielding improved return on invested capital.
“These processes and systems,” Shin states, “bring the best-inindustry capabilities to our engineers so that they are able to
design it right the first time by leveraging systematic domain
knowledge of all the subject matter experts, systems that automate time consuming tasks and systems that guide them through
design decisions. All this improves transition to manufacturing
dramatically, reducing cause for rework.” He describes his role as
someone who “enables corporate projects that poka-yoke the
design process to ensure quality and to free up the engineers to
spend more of their time on creative and strategic tasks.” Shin
then noted how “great it is to see collaboration among four businesses and the enthusiastic support of the various team members.
The domain knowledge and expertise of the team members are
unmatched in the industry. We really have world-class talent.”
Shin began his career 23 years prior to joining Raytheon in the
automotive industry, initially at General Motors and then at Ford
Motor Company where he led the engineering team in the redesign of the world’s most successful F150/250 trucks. He was also
program manager for Ranger trucks and brand manager for Ford’s
Explorer series. During this period, Shin served as president of
the Association of Korean-American Professionals in the
Automotive Industry.
“I have held numerous leadership roles in engineering,
manufacturing, marketing, program management, IT (information
technology) and Six Sigma,” Shin says. “Through these experiences, I have learned that we exist to satisfy our customers with
best performing products and services, at optimized cost with best
quality, and meeting customer’s schedule. Companies that do this
best as their competitive advantage will succeed. Thus, all the
enterprise projects I lead are in support of this objective.”
Figure 2. The Raytheon Electronic Data Manager was developed in less
than six months using the Raytheon Accelerated Product Innovation
and Development Shop.
When asked about the key traits which have contributed to his
success, Shin explains that you must “surround yourself with
domain experts, be a change agent, improve your knowledge and
skills continuously, and be part of projects that deliver value to our
customer and Raytheon. Become an expert in your domain both
within the company and within industry. Ask yourself how much
of your daily tasks is reactive or tactical versus strategic.”
23
FEATURE
situational awareness and a tracking capability
to Army Apache helicopter pilots. RAPIDS was
used to create a smaller and lighter version of
the EDM that contains several capability enhancements requested by the pilots. Raytheon
modified the existing software architecture and
performed requirements analysis and trade
studies to select the Army’s preferred hardware platform. The project completed parallel
hardware and software development efforts and
delivered 49 units for deployment in less than
six months.
Integrated Rapid Prototyping at Raytheon
engineering, electrical and mechanical design,
software development, prototype integration
and test, modeling and simulation and prototype manufacturing, which includes the use of
composite materials.
Using these capabilities, the Bike Shop
designed and developed a prototype HybridDefense Reconnaissance Assault (Hy-DRA)
(RF) technology has resulted in the development of many new products such
as the Active Denial System (ADS). ADS
is a nonlethal, directed energy
system used to repel hostile individuals
or crowds without causing permanent
injury. It has been highlighted in a past
“60 Minutes”episode.1 The system has
many variants, including a long-range tube-
Bike Shop
The Bike Shop name is a tribute to Wilbur and
Orville Wright’s bicycle workshop in Dayton,
Ohio. It was there that the Wright brothers
designed and built their first successful aircraft
in 1903. They did it in only nine months with
just three power tools. The Raytheon Bike Shop
is a rapid product development, research and
experimentation center located in Tucson, Ariz.
The Bike Shop provides innovative concept
development, rapid parts fabrication, and rapid
test capabilities. It synergistically combines the
resources of a large company with the agility of
a small well-equipped workforce located in a
strategic off-site facility.
Figure 3. The Hybrid-Defense Reconnaissance Assault (Hy-DRA) vehicle was
developed and tested at the Bike Shop in
180 days.
The Bike Shop, similar to RAPIDS, relies on
co-location of the team, including the customer, and on having a dedicated supply chain and
material handling staff. In addition, the Bike
Shop has dedicated design and manufacturing
subject matter experts, its own dedicated prototype capabilities, and pre-approved external
suppliers for speedy material availability. The
Bike Shop staff members support a wide range
of engineering capabilities, including systems
Figure 4a
Figure 4b
Figure 4. The Active Denial System (ADS) is a nonlethal, directed energy system used to
dispense hostile crowds. A long-range variant is shown in Figure 4a; a more portable
variant is shown in Figure 4b.
vehicle (see Figure 3). The Hy-DRA is a small
and stealthy all-terrain vehicle designed for
special forces missions. The vehicle needed to
travel at speeds greater than 60 miles per hour
(MPH) over diverse terrain, carry multiple
fully-armed soldiers, mount a .50 caliber
machine gun or grenade launcher, and maintain its drivability even if a wheel is shot and
disabled. The Bike Shop team successfully
developed a working prototype in 180 days
and showcased it at the Special Forces Exhibition held in Amman, Jordan.
Rancho Innovations Center
The RIC is a self-contained organization
located in Rancho Cucamonga, Calif. It has
its own dedicated and co-located design, manufacturing, supply chain, contracts and material
handling subject matter experts, specializing in
designing, fabricating and testing high-power
microwave systems and high-power highfrequency (> 70 gigahertz [GHz]) systems. The
RIC focuses on technology development and
prototype building and testing with an emphasis on providing low-cost, no-frills demonstrations of new and innovative technologies.
RIC’s core expertise in 95 GHz radio frequency
based system (see Figure 4a) and a smaller
solid-state version (see Figure 4b). Prototypes
for both variants were designed, integrated and
tested at the RIC.
Summary
In addition to the capabilities highlighted in
this article, Raytheon has other rapid prototyping facilities specializing in microwave circuit
card assemblies, electro-optic/infrared (EO/IR)
sensors and electrical and mechanical
assemblies. Best practices from across all these
facilities are shared via an internal website.
These facilities with their unique and innovative processes help Raytheon to provide
prototypes of optimum performance, quality,
schedule and cost benefits to customer mission
areas. All these capabilities rapidly and costeffectively prototype our systems leading to
better designed and manufactured products.•
Aaron Shin, Brian Kavalar,
Jim Bakarich and Ken Brown
1“The
Pentagon’s Ray Gun” was broadcast on March 2, 2008.
,
n
FEATURE
VISUAL IMMERSION FOR Virtual Design
AND Manufacturing
Raytheon is home to two Immersive
Design Centers (IDCs), one in
Tucson, Ariz., and the newest
located in Andover, Mass. Each IDC
features state-of-the-art CAVE Automatic Virtual Environment (CAVETM)
technology and is chartered to drive
product excellence and accelerate
time to market through use of
immersive visualization and virtual
reality solutions throughout the
product life cycle.
The CAVE is a large-scale virtual
reality environment where teams can
collaborate using three-dimensional
(3D) stereoscopic immersive visualization. Inside the CAVE, up to 20 participants actively support reviews of
models, simulation results and data
sets and collaborate in new ways to
assess, evaluate and create solutions
to nearly any problem in the Raytheon product life cycle.
Three-dimensional visualization “levels the
playing field” by eliminating the need for all
participants to understand two-dimensional
(2D) technical drawings and other specifications to the same technical depth. Using the
CAVE, cross-functional teams communicate
using the common language of visualization,
giving each participant the ability to contribute
to reviews equally. From design and systems
engineers, to customers and suppliers, this
added comprehension enables increased team
participation and communication, better
team alignment, and more informed decisions
(see Figure 1). The models created as part of
standard processes can now be reviewed with a
broader section of stakeholders much earlier in
the product life cycle.
CAVE Technologies
Both CAVEs were custom built and installed
at Raytheon by the Iowa-based supplier,
Mechdyne Corporation. The Tucson IDC is
Figure 1. Raytheon Immersive Design Centers support design for manufacture, facility layout and human factor assessments in a collaborative, interactive, virtual environment.
25
FEATURE
Visual Immersion for Virtual Design and Manufacturing
Figure 2. Fixed CAVE2TM displays, shown at left, are used at the Andover Immersive Design Center (IDC), while the Tucson IDC
is equipped with a configurable FLEXTM CAVE system as shown in the middle and to the right.
equipped with a FLEX™ CAVE, a configurable
system consisting of three wall displays and one
floor screen. Unlike a fixed CAVE display, the
FLEX side walls can be moved independently
to create new formats such as a flat wall display,
angled theater, L-shape, or traditional CAVElike immersive room (see Figure 2, middle and
right). The design uses a cluster of Graphics
Processor Units (GPU) to drive four 3D
megapixel projectors.
At the heart of the IDC in Andover, Mass.
is the first-in-industry CAVE2TM technology. This second-generation CAVE, originally developed at the University of Illinois,
Chicago, delivers a near-seamless, 320-degree, panoramic 2D/3D virtual environment
matching human visual acuity. Seventy-two
46-inch liquid crystal display (LCD) panels
are configured within a 24-foot diameter area
which supports large working meetings offering a wide peripheral perspective view with
high-density, simultaneous display of multiple
media formats (see Figure 2, left).
Both Andover and Tucson systems can display
3D immersive models, 2D content, or a combination thereof and will also accommodate
connection to users’ laptops.
Figure 3. The Rapidly Operational Virtual
Reality system extends immersive, collaborative viewing to participants at remote
locations.
The IDC provides Raytheon with several exciting synergistic capabilities including motion
capture and 3D laser scanning. The powerful
combination of an inertial motion capture
suit and head-mounted-display adds realism
and accuracy to human factor assessments,
training and simulations with virtual reality
and augmented reality environments. Inertial
sensors in the suit provide movement data
which projects a virtual avatar into a
computer-aided design (CAD) model
where other team members can view the
3D virtual environment and conduct
user experience reviews.
Multisite Collaboration
CAVEs support remote connectivity between
sites for simultaneous visualization and
concurrent interaction with 2D/3D models
within each virtual environment. This capability allows Raytheon to leverage cross-business
tools between organizations and establishes
a framework for enterprise, supply chain and
customer collaboration.
Raytheon also utilizes two Rapidly Operational Virtual Reality (ROVR™) systems (see Figure 3), more commonly referred to as mobile
CAVEs. These mobile units are self-contained
visualization systems with rear projection
screens which can easily display 3D imagery in
a small space requirement. The rear projection
technology allows full view of objects on any
light-colored, flat wall surface without creating the shadows otherwise common with rear
projection systems.
FEATURE
ENGINEERING PROFILE
Laura Vogt
Section Head,
Immersive Design
Center
With more than 12
years at Raytheon
Missile Systems,
Laura Vogt is the
current section head
for the Immersive
Design Center (IDC)
and its CAVE
Automatic Virtual
Environment
(CAVETM), a largescale 3D virtual
reality technology
for engineers, operators, suppliers and
customers to collaborate on models,
simulations and data.
A ROVR can be transported in a light-duty truck to suppliers or
customers and set up without tools in less than one hour, enabling 3D
immersion at remote locations and facilitating real-time collaboration
with design teams at Raytheon. This capability further enables collaboration on design with stakeholders, including suppliers and customers,
early in the product life cycle.
Creating Value to Programs
The Immersive Design Center’s focus on applying the technology
to Raytheon’s programs adds value through targeted use cases and
proven visualization and collaboration methodologies. Today, the IDCs
are used to support design for manufacture and assembly reviews,
failure review board analyses, human factors assessments, facility
layouts and training. As Raytheon continues to drive model based
definition practices, the role of immersive design environments will
continue to expand, enabling teams to better leverage the value inherent
in our CAD models. By immersing engineers, operators, suppliers and
customers together in the virtual environment, we can improve teamwork and information absorption, accelerate learning, and generate early,
virtual prototyping opportunities. •
Laura Vogt
With regard to her current success with CAVE technology: “We have been able to bring the early upfront
project visualization to the customer,” Vogt stated,
“both domestic and international. If a picture is worth
a thousand words then a 3D model is a set of encyclopedias. Anytime a person is given that much immediate
understanding and knowledge, the possibilities are endless. The playing field is now leveled and the confusion
of language disappears. Speed, affordability, camaraderie are all fantastic results from this capability.”
Throughout her Raytheon career, Vogt has worked to
help shape external customer, industry and DoD policy
around advanced manufacturing techniques and model
based manufacturing initiatives. She has led several
strategic development initiatives for the Manufacturing
Innovation Directorate to increase the affordability and
responsiveness of manufacturing capabilities. Previous
to her role with the IDC, she led the collaboration and
organization of the annual Raytheon Missile Systems
Strategic Dialogue. Vogt also worked as a project lead
for the former iFUZION Center for Innovation, interfacing
with senior management and engineers involved in
emerging programs at Raytheon to develop collaborative
methods and innovative solutions in the areas of strategic planning, product design and process improvement.
When asked to describe what excites her most about
her work, Vogt responded by saying, “First and foremost,
serving my country in whatever way I can. I’ve shook
hands with warfighters and saw the utmost appreciation
for the fact that we helped to save lives and bring them
home safely. It’s a duty that I’m honored to help supply. I
also enjoy the challenge that each year brings me. It
helps me grow as a person but ultimately it’s
for our soldiers.”
RAYTHEON TECHNOLOGY TODAY 2015 ISSUE 1 27
FEATURE
D-RAPCON 3D
Virtual Prototyping Environment
Creating a virtual three-dimensional (3D) environment to represent a proposed new system enables
engineers and customers to visualize a finished product. Such a virtual environment was developed
for the Deployable Radar Approach Control (D-RAPCON) system. D-RAPCON is Raytheon’s “air traffic
control system in a box” and brings instant air traffic control to the battlefield or disaster site. It is a
fully deployable system consisting of primary and secondary air traffic control (ATC) radars integrated
with a rapid set-up radar antenna, a self-contained operations center, an ATC voice communications
system and secure networked data communications.
Early in the proposal process, Raytheon
engineers were looking for a cost-effective
way to demonstrate the “look and feel” of the
proposed system to their potential customer.
The Raytheon Interactive Multimedia Training
group based in El Paso, Texas, demonstrated a
virtual environment developed for the Patriot
Air Defense System to engineers from the DRAPCON team. That demonstration resulted
in initial funding for a virtual D-RAPCON
prototype consisting of an interactive “firstcut” 3D model of the interior and exterior
portions of the operations shelter (see Figure
1). This first version of the virtual prototype
allowed the user to move around and inside
the shelter, open doors, turn on lights, and
begin to “unpack” the equipment inside, all
Figure 1. Using the D-RAPCON 3D virtual
prototype, the proposed operations shelter
can be viewed and evaluated prior to finalizing the design.
in a virtual 3D environment before any actual
hardware had been built. It made evident that a
virtual prototype could effectively portray not
only portability and ease of deployment, but
also size and, to some extent, capabilities of the
system.
Over a period of a few months, the 3D virtual
prototype development team created the remaining elements of the system and added the
capability to handle user interaction. All major
components, including shelters, radar, power
units, and environmental units became accessible to the user for viewing and evaluation
(see Figure 2).
Model Development
3D Studio Max®, part of the Autodesk® suite
of design software, was used for development,
rendering, and compositing of the virtual DRAPCON system as well as eventual animation of major items and interiors. Existing
Figure 2. The D-RAPCON virtual prototype includes all major system components
that can be “virtually” deployed in different environments, e.g., the tropical setting
shown above.
FEATURE
THE VIRTUAL PROTOTYPE PROVIDES A MECHANISM TO ADDRESS CUSTOMER
CONCERNS AND MITIGATE PERCEIVED DESIGN RISKS EARLY IN THE
DEVELOPMENT PROCESS VERSUS LATER AFTER DESIGNS ARE
COMPLETE AND CHANGES ARE MORE COSTLY.
system CAD drawings were imported by the
tool wherever possible to reduce drawing time
while imported photographs of an expandable Girchner shelter provided appropriate
dimensions, textures and relative sizing for the
operations shelter. The Unity 3D® game engine
was used to incorporate interactive elements
which allowed the user to move in and around
the virtual environment. A “first person” environment was featured to give the demonstrator
a look similar to that of a video game, both
familiar to computer “gamers” and simple for
new users to learn.
Engineering Collaboration
The 3D virtual prototype team worked with
system design engineers throughout the
modeling phase to ensure system fidelity and
accuracy. Continual reviews of updated system
exteriors and interiors by the engineers provided insight into system design, ergonomics
and functional layout.
The virtual prototype allowed engineers to
move about the deployed system in a variety
of environments, including desert, tropical and
snow covered terrain, both during the day and
at night. The virtual prototype also demonstrated how the actual system was designed to
store the system components inside the collapsed shelter during shipping and deployment
to a site and, using a computer mouse, allowed
the user to “virtually” unpack and setup the
racks of equipment, displays, consoles and
chairs. The user was then able to “walk” from
one unit to another, move inside, open equipment racks, and manipulate controls and
indicators.
Occasionally, movement within the 3D virtual
environment would trigger additional system
design reviews. For example, while reviewing
the layout in a night environment, an engineer
“walked” out of the shelter and left the door
open. As he rotated the view looking back at
the shelter from the outside, he realized the
interior light was still on. This prompted a
quick design review ensuring the system automatically switched to blackout lights when any
exterior door was opened.
Mobile Capability
The D-RAPCON team required a mobile
prototyping and demonstration capability to
present the system to potential customers during office visits and at trade shows. The Unity
3D game engine’s multiplatform capability
enabled repurposing of the simulated system
environment to run on mobile devices such
as the iPad, iPhone and Android-based tablets
(see Figure 3).
Figure 3. A mobile D-RAPCON demonstration capability was developed from the
baseline 3D virtual prototype, e.g., the figure shows a D-RAPCON system in an Arctic
environment viewed on an iPad.
Further enhancements to the mobile 3D virtual
prototype enabled an example maintenance
training lesson to be demonstrated as it actually would be viewed on an iPad. Users could
follow instructions on the screen to run diagnostic tests, select and use tools, and remove
and replace components (see Figure 4).
Figure 4. A screenshot from an iPad-based
D-RAPCON maintenance training lesson
developed from the baseline 3D virtual
prototype.
Summary
The virtual prototype provides a mechanism
to address customer concerns and mitigate
perceived design risks early in the development
process versus later after designs are complete
and changes are more costly. It also provides
a foundation for meeting future system training requirements. Although virtual prototype
development in support of a proposed system
is not new, the availability of gaming tools
for this application provides both a novel and
cost-effective implementation approach.
As both virtual prototype development tools
and developers improve, the ability to quickly
and inexpensively create virtual system environments prior to, or concurrent with, early
system concept and proposal activities will
become the norm. The models created during
the concept development and proposal activities can then be updated and repurposed to
support follow-on system design and training
tasks. As Raytheon experience grows with these
virtual prototyping technologies, we continue
to discover new and better ways to apply the
technology to help improve our products and
make them more cost effective. •
Terry L. Stroud, Ph.D.
29
FEATURE
MULTILEVEL WAFER STACKING
for 3D Circuit Integration
Three-dimensional (3D) integration of
advanced silicon and radio frequency (RF)
devices enables simpler and more reliable
systems at a significantly lower cost. Raytheon
offers a suite of available wafer level packaging technologies and processes in this area,
including;
• Wafer-to-wafer bonding of silicon wafers
with electrical interconnection.
• Fine pitch interconnection between bonded
wafers using direct bond hybridization
(DBH) (3 micron [µm] interconnect on
6 µm pitch).
• Integration of DBH with through-wafer via
technologies to produce advanced 3D silicon
devices.
• Wafer-to-wafer bonding for 200 millimeter
(mm) low loss fused silica and silicon
structures.
• Processing of dimensions appropriate
for high frequency 3D devices.
• High reliability bump bonding.
• Die-to-wafer bonding for tiles and other
large die with fine pitch interconnect.
By maturing and leveraging these technologies
and processes into manufacturing capabilities, Raytheon can supply a wide portfolio of
programs with more reliable and lower cost
hardware than is available using standard twodimensional (2D) approaches.
Today
For many applications, the preferred approach
to connecting the wafers is the DBH process.
With DBH, the wafers are bonded using a lowtemperature hydrophilic oxide bond and the
electrical interconnection is formed by metal
posts that are planarized to the oxide surface.
Figure 1 is an example cross-section from a
scanning electron microscope (SEM) showing
a DBH-bonded Si:PiN (silicon P-intrinsic-N)
detector array stacked on a complementary
metal oxide semiconductor (CMOS) readout
integrated circuit (ROIC).
atomic force microscope is used to perform
metrology since nanometer scale tolerances are
required. The CMP polishing process is significantly more difficult with 20 µm diameter posts
than it is with the smaller 3 µm posts. Once the
surfaces are planar, a combination of plasma
and wet surface preparations are performed
to achieve a good surface energy, after which
the two wafers are very carefully aligned and
brought into contact. Figure 2 shows the EV
Group (EVG) wafer bond cluster tool used for
final surface preparation, cleaning, alignment
and bonding.
Although the process used to produce this
appears quite simple and elegant, it has many
subtleties. The interconnect posts are formed
on the two wafers by electroplating on a seed
metal layer through a plating mold made of
patterned photoresist. Once the posts are
plated, the photoresist and plating seed layers
are removed and the interconnect posts are
buried in the bonding oxide layer. For high frequency devices, a thicker seed layer is utilized
that can be used to form low-loss transmission
lines. This structure is buried in silicon dioxide
(SiO2) bonding oxide which is then polished
using a chemical-mechanical planarization
(CMP) process to reveal the interconnect posts
and planarize them with the oxide surface. For
a good bond with effective interconnect, the
surface must be very smooth and the interconnect plugs must be extremely planar. An
If the surfaces are very smooth and have the
correct surface energy, they will grab and pull
together. Once bonded, the wafers are checked
for voids in the interface using an acoustic
microscope. Raytheon Vision Systems has performed extensive work to increase the strength
of the bond, as measured by the bond energy
shown in Figure 3, and improve yield.
Alignment is verified using an infrared (IR)
microscope and is approximately 1–1.5 µm
across the 200 mm bond length for processed
silicon wafer pairs. Figure 4 shows acoustic
microscope images from a recent build of various format 8 µm pitch Si:PiN focal plane array
(FPA) builds. These sonoscans show very few
voids, which appear as white circles. In these
images, the only voids that are apparent are
over the bond pads and test structures around
2500
Oxide Bond Si PIN Detector
2300
Smoothed Data Shown
2100
Direct Bond Posts
1900
Wafer-to-Wafer
Bond Energy
(miJ/m2)
1700
1500
1300
Raytheon normalized
1100
900
700
Time
CMOS ROIC
Figure 1. Cross-sectional scanning electron
microscope image of a sensor chip
assembly integrated using direct bond
hybridization
Figure 2. EV Group wafer bond cluster tool
is used to bond the wafers together.
Figure 3. Over time, Raytheon Vision Systems
has significantly improved the wafer-to-wafer
bond strength as measured by the increasing
bond energy with time.
s
er
FEATURE
RAYTHEON IS ALSO DEVELOPING 3D DEVICES THAT USE
DIFFERENT SUBSTRATE MATERIALS, SUCH AS FUSED SILICA,
SILICON GERMANIUM (SiGe), METAL ALLOYS AND CERAMICS.
the perimeter of the wafer pairs as well as in the
edge bead exclusion area.
The final step, if everything measures within
the established process parameters, is to anneal
the parts. During this anneal, the oxide bond
energy rapidly increases as the oxide starts to
form covalent bonds at the interface. Concurrently, the difference in coefficient of thermal
expansion between the bonding oxide and
the metal interconnect posts creates enough
force to break through the native oxide on
the interconnect posts and form an electrical
connection.
1K x 1KFPA Format
Typical interconnect operability for this
process is greater than 0.9999. The completed
structure becomes a solid block of material
that has no known fatigue issues due to stresses
from packaging or temperature cycling. As
part of the qualification process, sample daisy
chain test structures were subjected to a series
of tests ranging from hundreds of thermal
shock cycles (room temperature to liquid
nitrogen) to JEDEC1 temperature cycle testing.
Sensor chip assemblies (SCAs) developed using this process have successfully passed flight
qualifications for shock, vibration, temperature cycling and 1,000 hour burn-in, with no
failures or degradation.
5K x 5KFPA Format
8K x 8KFPA Format
K = Thousands of pixels; FPA = Focal Plane Array
Figure 4. Sample acoustic microscope images of various format focal plane arrays built using direct bond hybridization show very few voids (white circles).
One of the biggest advantages of using the
DBH technique is that these process steps can
be performed at the wafer level to improve
uniformity, increase yield and decrease cost.
An example of a complete hybridized FPA is
shown in Figure 5a and a diced example of a
larger die is shown in Figure 5b.
The Future
The current state for these technologies encompasses a wide range of maturity. The baseline DBH process flow is being exercised on
a variety of programs to develop large format
digital FPAs for visible and near-IR imaging. In
these programs, small volumes of wafer pairs
(2–10 per month) are hybridized, packaged
and tested. Development of 3D structures is
taking a similar path. Development of larger
geometries required for high frequency structures, is also progressing though many of the
processes are more challenging than those with
smaller structures. In addition, processes are
being developed where features can be etched
into the surfaces before bonding, resulting in
embedded cavities that can later be connected
via etching for applications such as microfluidic cooling or microelectromechanical systems
(MEMs) packaging.
Raytheon is also developing 3D devices that
use different substrate materials, such as fused
silica, silicon germanium (SiGe), metal alloys
and ceramics. These materials place additional
constraints on the thermal budget, making
that aspect of the process more difficult, but
with the potential advantage of enabling the
integration of truly novel and highly integrated
structures that provide significant size, weight,
power and cost benefits for the final system. •
John Drab
5a. Completed wafer-level focal plane array includes
hybridized detector, backside passivation, anti-reflective
(AR) coating and bond pads opened
5b. Already diced large format Si:PiN focal plane array
Figure 5. The figure shows examples of hybridized focal plane arrays developed using
the direct bond hybridization process.
1The JEDEC Solid State Technology Council, originally the Joint
Electron Device Engineering Council, is a group that develops
open standards for the microelectronics industry such as test
methods and device interface standards.
31
FEATURE
RAYTHEON UNIVERSITY PARTNERSHIPS HELP DEVELOP
Advanced Manufacturing Technologies
Advanced manufacturing by
definition depends on the use
of technology to improve processes, products and systems.
Next-generation manufacturing
technologies and concepts are
being developed at universities
throughout the world. Through
multiple partnering efforts at
leading universities, Raytheon is
developing innovative manufacturing technologies that will be key
enablers for current and future
Raytheon systems.
Raytheon has adopted a strategic
NASCENT Center for Nanomanufacturing
at UT Austin
The Nanomanufacturing Systems for Mobile
Computing and Mobile Energy Technologies
(NASCENT) Center was established by the
National Science Foundation (NSF) at UT
Austin in 2012. Raytheon is an industry member
of the center, which also includes research
groups from the University of New Mexico
and the University of California, Berkeley.
The NASCENT Center has three major
research thrusts:
• Patterning: top-down fabrication of nanoscale structures with exquisite control of feature size and shape (see Figure 1).
• Functional materials: processable materials
for devices and machines, including directed
self-assembly of block co-polymers and
nanoparticles.
• Metrology and yield enhancement: sub-wavelength optical nanometrology for real-time
nanomanufacturing feedback and fault diagnostics, validated uncertainty quantification
(UQ) models for scale-up and process control.
NASCENT develops systems for nanomanufacturing and metrology to support the transition
of nanotechnologies from research and development (R&D) to industry environments.
Nanoimprint lithography is among the key
technologies being matured within the center.
This technology is ideal for generating features
in the approximately 10–100 nanometer (nm)
regime and may also be of interest for metamaterial microlens fabrication, three-dimensional
(3D) integration, and focal plane array technologies. NASCENT is incorporating the use
of roll-to-roll printing and transfer, along with
two-dimensional (2D) and 3D nano-fabrication
methods to ensure technologies are well suited
for production-type activities.
Raytheon is working with Professor S. V.
Sreenivasan, NASCENT codirector, to use
Jet-Flash Imprint Lithography (J-FIL) to demonstrate features on gallium nitride (GaN) that are
representative of radio frequency (RF) transistor
devices. Specifically, the team is interested in
pursuing multi-tiered structures, and single-step
printing of 300 millimeter (mm) GaN wafers.
approach to university partnerships that includes membership in
university consortia and sponsor-
F
r
f
ship of student capstone projects,
in addition to Raytheon-funded
directed research. Some of our key
efforts in advanced manufacturing are being matured through
partnerships with the University
of Texas at Austin (UT Austin),
the University of Massachusetts
at Lowell (UML), and Worcester
Polytechnic Institute (WPI).
Figure 1. Patterning and high-speed roll-to-roll assembly methods are focus areas
at the Nanonmanufacturing Systems for Mobil Computing and Mobile Energy
Technologies Center.
OP
-
-
n
nre
or
ep
FEATURE
Raytheon-UML Research Institute
Raytheon has recently established a joint research facility with UML (see
Figure 2). The Raytheon-UML Research Institute (RURI) is focused on
advancing radar and communications technologies with particular emphasis on flexible and conformal electronics, 3D printing and nanotechnology.
RURI’s state-of-the-art laboratories and classrooms serve as a launchpad
for collaboration and learning among UML faculty and students and
Raytheon employees. It benefits both organizations in the pursuit of
federal research funding and provides UML students with opportunities
for research projects and employment at Raytheon.
“The creation of the RURI presents a tangible opportunity to advance
the research and the learning of technologies under development for
students and employees alike and will inspire future engineers and drive
innovation,” said Paul Ferraro, vice president of Advanced Technology
Programs at Raytheon Integrated Defense Systems.
“We look forward to bringing the expertise of our top-notch faculty
together with researchers from Raytheon. This new partnership is just one
example of how UMass Lowell is leading the way in collaborating with
industry to power innovation and the economy in Massachusetts and
beyond,” said UMass President Marty Meehan. “This institute will also
provide our students with the kind of real-world experience that is one of
the hallmarks of a UML education.”
“As a co-directed,
co-located research
environment, the RURI
signifies a unique opportunity for Raytheon’s
university partnerships,”
said Mark E. Russell,
Raytheon vice president of Engineering,
Technology and
Mission Assurance.
Photo courtesy of UML
“The RURI will serve
Figure 2. The new RURI lab focuses on
as an extension of our
radar and communications technologies
for UML and Raytheon.
current research capabilities and represents a
resource across the Raytheon enterprise for the study of advanced materials and flexible circuit technologies, such as printable electronics and
nanotechnology.”
The institute leverages UML’s strengths in printed electronics and nanotechnology that align with Raytheon’s strategic technology needs including
high-frequency printed conformal antennas, carbon-based transistors and
photonic devices. Initial research is focused on future technologies for
radar and communication systems and could expand into other areas as
needed. Efforts are currently underway to characterize RF performance
and optimize printing processes for conductive inks on flexible substrates
(see Figure 3). Additionally, design and fabrication of tunable devices is
Craig Armiento,
Ph.D.
Co-Director, Raytheon-UML
Research Institute
Since 2011, Craig
Armiento has held the
dual role of engineering
fellow in Raytheon
Integrated Defense
Systems (IDS) and
professor in the
Electrical and Computer
Engineering (ECE)
department at the
University of
Massachusetts at Lowell
(UML). Armiento is
co-director of the
Raytheon-UML Research
Institute (RURI), which
was formally established
in 2014. At UML, he serves as director of the Printed
Electronics Research Collaborative (PERC), which is working
to develop
the supply chain for printed electronics. He is also the director
of the UML Center for Photonics, Electromagnetics and
Nanoelectronics (CPEN).
“I came to Raytheon IDS in September 2011 on a one semester sabbatical,” Armiento begins. “My goal was to apply
additive manufacturing to the development of printed,
flexible electronics that could be employed in future Raytheon
systems. I wanted to develop a joint research partnership
between the university and Raytheon that was different from
the standard interactions with academia. The interest in
developing a joint research partnership has been made
practical by continuing to stay at Raytheon as a part-time
contributor after my sabbatical ended. The ability to
continually interact with Raytheon engineers and leadership
has been instrumental in establishing, nurturing and managing the Raytheon-UML research partnership.”
Armiento served as the UML ECE Department Chair from
2005 to 2011. His areas of expertise include printed
electronics and antennas, photonic devices, printable
electronic materials, advanced packaging, hybrid integration
and radio frequency identification. Prior to joining the faculty
at UML, Armiento worked for more than 20 years in the
research and development industry, leading research projects
at GTE Laboratories (now Verizon) on projects such as
Fiber-to-the-Home (now FiOS), silicon waferboard optoelectronic hybrid integration, optoelectronic device fabrication
and gallium arsenide integrated circuits (GaAs ICs). He was
also director of Optical Networking at Lightchip Optical
Networks Inc.
When asked how his role supports Raytheon and the missions
of its customers, Armiento noted: “As a result of collaboration
with my Raytheon colleagues, we have created the RaytheonUML Research Institute. The institute, which is located on the
UML campus, provides Raytheon with access to campus
technologies and expertise that can be applied to existing
research and development projects and new pursuits. RURI is
now established as a resource for printed electronics that
Raytheon engineers and scientists can use (along with UML
faculty and students) to test out additive methods of developing flexible electronic systems.”
33
FEATURE
Raytheon University Partnerships Help Develop Advanced Manufacturing Technologies
being pursued to support RF metamaterial
applications. This effort involves development
of dielectric materials, numerical simulations,
RF characterizations and optimization of
printing techniques.
than 30 members takes an “application-driven
design” approach, focusing on fundamental,
general interest research that addresses welldefined industrial needs and new technologies.
The interdisciplinary iMdc integrates fun-
Photo courtesy of UML
Figure 3. Printing of metamaterial structures on flexible substrate at RURI
The RURI is located in the Mark and Elisia
Saab Emerging Technologies and Innovation
Center, an 84,000-square-foot research facility
on the UML campus that is home to cuttingedge research in a variety of science and
engineering disciplines. The center — one of
nine new buildings opened by the university
since 2009 — was constructed to provide not
only UML faculty and students with the most
advanced research facility of its kind north of
Boston, but to also support collaboration
with businesses from startups to world
leaders like Raytheon.
damental knowledge from materials science,
mechanical engineering, manufacturing, and
other disciplines to develop and optimize
materials-process-performance correlations
and compatibilities using a unique combination of experimental work, analytical methods,
and multiscale computational models and
design tools.
The iMdc research portfolio includes a
suite of advanced investigations on additive
manufacturing of structural metallic materials fabricated by both laser and electron
beam techniques; studies on the relationships between processing and fatigue crack
growth behavior and mechanisms in coldspray materials; and development of light
metals for dynamic properties and fatigue
and high temperature performance. The
iMdc has also been funded by the National
Science Foundation (NSF) to investigate
novel manufacturing of metal matrix nanoceramic composites via liquid metal processing.
Multiple iMdc projects focus on friction
stir welding, including an effort co-chaired
by Raytheon to develop processes for friction stir welding of dissimilar materials and
creation of nano-composites using this process.
Raytheon’s specific efforts within the iMdc
are focused on leveraging friction stir welding
for thermal management applications, and
complementing and expanding its activities
in the area of additive manufacturing. Adding
to its portfolio and the materials characterization and evaluation capabilities, iMdc recently
acquired a most advanced digital imaging
correlation system (through an NSF-Major
Research Instrumentation grant) and complementary non-destructive damage detection
and monitoring instrumentation (through a
Defense University Research Instrumentation
Program-Army Research Office grant). The
iMdc research programs support the center’s
objective to increase performance and reliability of high-integrity materials and structures,
benefiting manufacturers, industry suppliers
and materials producers.
The building’s fourth floor is specially
equipped to house the institute, which is
codirected by Dr. Christopher McCarroll of
Raytheon and UML Professor Craig Armiento,
Ph.D., a faculty member in electrical and computer engineering in the university’s Francis
College of Engineering.
Integrative Materials Design Center
at Worcester Polytechnic Institute
Raytheon has recently joined the Integrative
Materials Design Center (iMdc) Consortium,
located at WPI. The center’s mission is to
advance reliable and sustainable design and
manufacturing for high-performance materials, processes and components. This industrygovernment-university alliance with more
Figure 4. The nanocomposite optical ceramic missile dome shown on the left is stronger than
traditional sapphire missile domes while still transparent to infrared frequency
radiation as shown on the right.
FEATURE
Other Nanotechnology-based Advanced Manufacturing
at Raytheon
NASCENT, RURI and iMdc are just some of the latest examples of
Raytheon’s partnerships with industry and academia to develop nanotechnology and advanced manufacturing processes. Raytheon has long
maintained a diverse portfolio of partnerships to advance materials technologies and develop manufacturing capabilities that support transition
to industry. In 2007, Raytheon was awarded a multiyear Navy contract
to develop an improved composite material for infrared windows and
missile domes. This objective was to significantly enhance materials and
manufacturing processes compared to those currently in use for windows
and aerodynamically shaped domes in the 3–5 micron mid-wave infrared band. The program was successful in developing improved infrared
transparent missile domes capable of higher speed operation and greater
particle impact resistance than sapphire, the incumbent material (see
Figure 4). Raytheon partnered with Rutgers University, the University of
Connecticut, the University of California-Davis, and three small businesses on the effort.
The success of this program was noted by the Navy technical team, headed
by Daniel C. Harris, senior scientist in the Chemistry and Materials
Division at the Naval Air Warfare Center at China Lake, Calif., as being
one of the first real applications of nanotechnology with a significant
impact. He observed, “Durable sensor windows made from the NCOC
[nanocomposite optical ceramics] material should be an enabling technology for improved endoatmospheric missile defense, for ship self defense,
and for time-critical strike missions.”
Building off successes like our nanocomposite missile domes, Raytheon
continues to broaden the technical network outside of Raytheon.
Partnering with small businesses and universities is a key strategy towards
keeping technology innovation moving forward, and involvement in
the early stages helps guide the technology toward end solutions that are
impactful for Raytheon systems. •
Mary Herndon and Erik Nordhausen
THIS INDUSTRY-UNIVERSITYGOVERNMENT ALLIANCE TAKES AN
“APPLICATION-DRIVEN DESIGN” APPROACH,
FOCUSING ON FUNDAMENTAL, GENERAL
INTEREST RESEARCH THAT ADDRESSES
WELL-DEFINED INDUSTRIAL NEEDS.
Chris McCarroll,
Ph.D.
Co-Director,
Raytheon-UML Research
Institute
With more than
30 years of experience in
the fields of
semiconductor and electromagnetic technology,
Chris McCarroll is a
director of engineering
for Raytheon Integrated
Defense Systems (IDS)
and the technical director for the Above Water
Sensors (AWS) business
area. In his AWS role, he
helps lead several new
radar system pursuits,
including the modernization of the SPS-49 radar system, the upgrade of the TARTAR
family of X-band continuous wave illuminators, and future
developments for the SPY-3 Multifunction Radar. McCarroll also
serves as co-director for the Raytheon-UMass Lowell Research
Institute (RURI) where he helps lead operations and research
for the institute, including research projects, faculty and students. He is directly involved with institute proposals for CRAD
(contract research and development) funding and other grants.
“Throughout my career, I have helped develop future technologies for the military,” McCarroll relates, when discussing his
current role. “My deep interest in semiconductor physics came
through exposure to classes, faculty and research at UMass
which led to my first job in industry. The exposure to how this
very small technology can enable advanced systems, like the
SBX and SPY-3 radars, drove me to deeply understand electromagnetics and eventually help in the design of these systems.”
Prior to his current roles, McCarroll was acting director for the
IDS Electrical Design Directorate, Technical Area Director for
Multifunction Radio Frequency Systems at Raytheon Corporate,
department manager for the Monolithic Microwave Integrated
Circuit and Module Design Group, and section manager of the
Solid-State Electronics group. “My career path has always been
driven by my curiosity of physics, doing challenging research
and advancing technologies with that research,” McCarroll
states. “I made it to the position of engineering director
because I like working with teams (getting more done with
many minds) and helping fellow employees get educated and
progress in their careers.”
Another, rather unique position of note in McCarroll’s career
was his three-year appointment as principal engineer for the
Hobart-class Air Warfare Destroyer Combat System at Raytheon
Australia where he was in charge of systems integration, test
and modeling throughout the design phase of the program.
Also while in Australia, he started research work with the
universities and was instrumental in establishing a Weather
Radar Research Center at the University of Adelaide in South
Australia. He also won an Australian Research Council Linkage
Grant for research in the areas of networked radars, severe
weather and bushfire detection and surveillance.
35
FEATURE
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VERTICALLY INTEGRATED HgCdTe-BASED
Sensor Manufacturing
Mercury cadmium telluride (HgCdTe) is the most
versatile and widely-used material for infrared
(IR) sensors. Yet, no commercial vendor satisfies
the defense industry’s needs for this material.
Raytheon Vision Systems (RVS) has established a
vertically-integrated capability for HgCdTe-based
technology that begins with the raw materials
and extends to the completed infrared (IR) focal
plane array (FPA) sensor module, providing full
end-to-end control of the process. In particular,
the vertically integrated approach allows RVS to
tailor the HgCdTe material characteristics for any
specialized application, and it provides short-loop
feedback in support of design innovation and
material optimization.
HgCdTe, Near Universal IR Sensor Material
HgCdTe is a narrow-gap semiconductor whose
wavelength sensitivity is tuned by adjusting the
relative amounts of Hg and Cd in its chemical
composition. Figure 1 shows a unit cell of the
crystal structure and summarizes the characteristics that make this material advantageous
and widely adaptable for IR detection. The
material is grown epitaxially1 upon substrates
of cadmium zinc telluride (CdZnTe). Also, in
a multilayer structure, each HgCdTe layer is
epitaxial with respect to the previous layer, taking advantage of the fortuitously small change
in lattice parameter with composition. Figure
2 illustrates RVS’s dual-band HgCdTe FPA
Advantages of using HgCdTe material
for IR detection
l Narrow band gap semi-conductor to match IR photon energies
l Band gap is adjustable
by varying Hg/Cd proportions
l Strong IR absorption coefficient
Te atoms
l High mobility of charge carriers
and long lifetime of minority
Hg atoms
carriers
l Wide range of controllable doping, both
p- and n-type
l Minimal change of lattice parameter with respect
to Hg/Cd composition, permitting complex layer
structures with minimal stress
l Existence of mature growth methods, substrates
and processing
Figure 1. Advantages of using HgCdTe
material for IR detection
technology. The first layer is the n-type band-12
absorber the second layer is a p-type cap, and
the third is the n-type band-2 absorber. The
photocurrents from the two bands are read out
sequentially by switching the bias voltage applied to the top of the mesa. The many details
of this design have been optimized through
repeated iterations of a cycle of numerical
modeling, HgCdTe layer growth, and device
testing. The development process would have
been longer and more challenging without a
vertically integrated manufacturing approach.
HgCdTe has proven to be broadly applicable at
wavelengths ranging from less than 2 microns
(µm) to more than 16 µm, in an impressive variety of device architectures. High-performance
IR sensors are by far the dominant application
for HgCdTe, and the principal users are government agencies. Serving many Department of
Defense (DoD) and civil customers, RVS
has built photoconductive, photovoltaic, dualband, avalanche, heterodyne and hyperspectral
detectors in HgCdTe, and array pixel counts up
to 4,000 × 4,000 have been produced. Most designs are intended for the atmospheric windows
at 3–5 µm or 8–12 µm wavelengths.
Vertically Integrated Approach
The detector branch of the HgCdTe vertical
integration process, shown on the left side of
Figure 3, begins with the growth of CdZnTe
boules for substrates. By growing its own
semiconductor materials, RVS takes vertical
integration to its deepest level and sets itself
apart from the majority of wafer processing
enterprises. Although component manufacturers using other semiconductors commonly rely
on vendor-supplied wafers, RVS recognized at
the beginning that this would not be optimum
for developing HgCdTe-based components.
In the early years (from 1978 to 1998), inhouse growth was motivated by the rapidly
developing state of the technology, and by the
extremely close connection between material characteristics and device performance.
Innovations and progress were dependent on
frequent adjustments to the material growth
parameters. More recently, in-house growth
has enabled RVS the ability to maintain the
1 Epitaxial
highest material quality, and to customize
the layer structures for multiple applications.
Because HgCdTe material is critical to many
of our principal product lines, and comparable
material is not available externally, RVS continues to supply its own wafers.
Boule growth starts with the raw materials,
polycrystalline ultrapure CdTe and ZnTe,
loaded into a carbon-coated quartz crucible.
The crucible is mounted into an evacuated
quartz ampoule, which is placed in a cylindrical
furnace. Large-crystal boules are produced by
mixing and melting the ingredients, followed
by recrystallizing with the vertical gradient
freeze method. Standard boule diameters are
92 and 125 millimeter (mm).
The boule substrate material is then sawn into
slices, diced into squares, and polished to prepare the surface for epitaxial growth. Typical
substrate sizes are 6 centimeters (cm) × 6 cm,
although sizes up to 8 cm × 8 cm have been
produced.
The HgCdTe layers are grown on top of the
substrate by molecular beam epitaxy (MBE),
which employs molecular beams to deposit material on the substrate in an ultrahigh
vacuum chamber. The composition of a layer
is determined by the fluxes of the beams, which
in turn are controlled by the temperatures of
the sources from which material is evaporating. Spectroscopic ellipsometry (SE) provides
feedback to control the composition, while
the temperature of the substrate is held at the
optimum value with high precision. Dopant
Unit Cell
Indium Bump
Contact
N-type Band-2 Absorber
P-Type Cap Layer
N-type Band-1 Absorber
CdZnTe Substrate
Shorter
Wavelength
Longer
Wavelength
Figure 2. Schematic cross-section of the
Raytheon single-contact, single-mesa
dual-band HgCdTe detector architecture
means that the crystal structure of the layer is aligned to that of the substrate.
1 and band 2 are the two ranges of IR wavelengths in which the device is sensitive, typically 3–5 µm and 8–12 µm, respectively.
Each band requires its own IR-absorbing layer.
2Band
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FEATURE
sources emit indium for n-type and arsenic
for p-type doping during growth. Shutters in
front of the sources are used to turn the beams
on and off. The entire growth procedure is
automated, with each step being programmed
in advance.
An alternative technique is to use a silicon (Si)
wafer as the substrate. The tradeoff in using
Si is between creating a larger wafer with a
lower cost substrate and accepting a higher
defect density in the HgCdTe material due to
the layer/substrate lattice mismatch. A special
sequence of buffer layers between the Si and the
HgCdTe has been developed to mitigate this
problem. The selection of substrate depends
on the specific application and both substrates
continue to be used at RVS.
After growing the HgCdTe layers, the wafers
are nondestructively evaluated against multiple
quality specifications. They are then conveyed
to the FPA processing line, where the sensing
elements (pixels) are formed by photolithographic steps, including mesa etching, surface
passivation, metal contact deposition, and
indium bump formation. After wafer dicing,
the FPAs are ready for mating to the readout
integrated circuits (ROICs).
The ROIC branch of the process is shown in
the lower right of Figure 3. The ROICs are
designed and modeled at RVS using the latest
software tools. For each pixel on the detector
array, there is a corresponding unit cell on the
ROIC to collect the photocurrent and process
the signal. Each design is delivered to a silicon
foundry for fabrication. RVS then receives and
screens the ROIC wafers, after which they are
diced and ready for mating with the FPA.
The FPA and ROIC process branches converge
at the hybridization step, where the HgCdTe
array and the ROIC die are mated together, as
shown in the center of Figure 3. The industry’s
most advanced flip-chip bonders, utilizing laser
alignment and submicron-scale motion control, bring the two chips together. The indium
bumps on all of the pixels form the mechanical
bonds that join the pair of chips securely. FPAs
with a pixel pitch as small as 10 µm are routinely aligned and hybridized with high yield. Next,
each FPA with attached ROIC is tested according to a defined protocol, and if performance
meets requirements, it is installed in a sensor
module. Associated packaging and electronics
are designed and assembled at RVS to complete
the integrated manufacturing process.
Product Unique Electronics Integration and Packaging
FLIR Engine
Dewar Assembly
Forward Looking Infrared (FLIR) Sensor
Screen Test FPA Hybrid Assembly
Dice Wafer,
Test Sister Dies
Fab Detector Arrays on
MBE-Grown Wafer
HgCdTe
Array
Hybridize Detector to ROIC
Hybridization Process
Silicon
ROIC
HgCdTe Layer Growth by Molecular Beam Epitaxy (MBE)
Apply Indium Bumps, Dice and Inspect
Single-Crystal CdZnTe
Substrates
CdZnTe Boule
Screen Test Dies
Bridgman Furnace
Crystal Growth Crucible
Ultrapure Polycrystalline
ZnTe
Ultrapure Polycrystalline
CdTe
Detector Process
Silicon ROIC Wafers from Foundry
Readout Integrated Circuit (ROIC) Process
Figure 3. Process flow for vertically integrated HgCdTe focal plane array manufacturing
Summary
The vertically integrated manufacturing process
developed at RVS continues to be the foundation of our strong position in the IR sensor
market. Because device performance depends
critically on material characteristics, and since
no external supply of HgCdTe wafers will meet
our needs, the ability to supply our sensor
fabrication line with material grown in-house
has been a vital part of a complete, vertically
integrated process. •
David R. Rhiger, Ph.D.
37
LEADERS CORNER
THE RAYTHEON OPERATIONS COUNCIL
Barbara Borgonovi
Jason Elwood
Kimberly Ernzen
Vice President, Operations
Space and Airborne Systems
Integrated Defense Systems
Missile Systems
Technology Today spoke with Operations Council members about how Raytheon
manufacturing research and technology is
managed and the roles and responsibilities
of its leaders.
Council’s regular cadence. At every meeting,
the Manufacturing Technical Area Director
(TAD) presents the latest knowledge gained
on new and potentially applicable manufacturing technologies, including topics on
additive manufacturing, model based manufacturing, advanced testing, visualization for
manufacturing and rapid development and
prototyping. One particular focus this year
has been to drive the maturity of our immersive design capabilities by actively supporting
our Raytheon immersive design centers and
the CAVE Automatic Virtual Environment
(CAVE) technologies implemented in
those centers.
manufacturing, continuous improvement
and coproduction/codevelopment strategies.
The role provides leadership and direction to achieve best-in-class safety, quality,
productivity and cost performance. The
operations vice president initiates and leads
enterprise initiatives within the business such
as implementing common test architectures,
establishing tiered accountability processes
and executing real estate consolidations. The
operations vice president reports directly to
the business president and is also a member
of the corporate-level Operations Council. At
the business-level, the operations vice president is responsible for day-to-day operations
of factories, laboratories and manpower
facilities associated with the business and
establishing and maintaining the processes
and manufacturing technologies needed to
meet product deliveries.
Technology Today: What is the Operations Council?
Jason Elwood: The Operations Council is a
group led by the vice president of corporate operations with the vice presidents of
operations from each Raytheon business as
members. The council develops the strategy
for operations, ensuring it supports global
growth, provides competitive advantage,
and creates enterprise collaboration. The
council identifies relevant best practices
from within Raytheon and from commercial
industries and disseminates them throughout
the company to drive competitiveness. An
example of this approach is the tiered accountability manufacturing system taken from
commercial lean manufacturing practices and
implemented in our processes and factories
to ensure alignment and accountability of
the manufacturing team.
The Operations Council also reviews and
directs all company real estate actions including manufacturing factories, laboratories and
office footprints. This oversight ensures our
process capabilities mature in the most effective and efficient way.
T.T.: How does the Operations Council
support advanced manufacturing?
Mark Kampf: Review of new and emerging advanced manufacturing processes and
technologies is a key part of the Operations
T.T.: What excites you about advanced
manufacturing?
Barbara Borgonovi: I find the speed which
advanced manufacturing technologies are
advancing very exciting. These new technologies enable us to provide our customers with
the superior capabilities they require to meet
their mission objectives, at lower costs, shorter
timelines and with higher reliability. Virtual
prototyping, additive manufacturing and the
evolving use of robotics and automation in
manufacturing facilities are just a few of the
exciting fast-paced technology areas being
used by Raytheon to improve product development and manufacturing.
T.T.: What is the role of a business operations vice president and what are your
day-to-day responsibilities?
J.E.: The business operations vice president
is responsible for leading, developing and
executing, at the business level, enterprisewide
T.T.: How do operations’ teams collaborate across the business?
B.B.: Collaboration has become a significant
foundation of our culture. Raytheon has
shifted from just sharing best practices to
working together and defining a single solution that works across the entire company.
Developing these solutions requires a collaborative team from across the entire company;
engineering, operations and supply chain
work together as a single architecture team
with representatives from all the businesses
focused on a specific new process or technology introduction. Teams are being formed to
drive identical solutions for factory automation to assure the best use of our resources.
Cross-functional teams were created to take
THE COUNCIL IDENTIFIES RELEVANT BEST PRACTICES
FROM WITHIN RAYTHEON AND FROM COMMERCIAL
INDUSTRIES AND DISSEMINATES THEM THROUGHOUT
THE COMPANY TO DRIVE COMPETITIVENESS.
Mark Kampf
Intelligence, Information and Services
ownership and governance of Raytheon’s enterprise resource planning solution, the PRISM
(Process Re-invention Integrating Systems for
Manufacturing) system. PRISM integrates supply chain, operations and other processes and
workflows in a single business solution
to facilitate a seamless flow of information
across Raytheon. The PRISM team is driving
toward using identical processes and governance model across all Raytheon and is
creating a single information repository for
all Raytheon businesses.
Raytheon operations has the vast resources
of a large corporation yet we strive to maintain
the collaborative environment of a small agile
company that can efficiently gain enterprisewide advantage of new manufacturing
capabilities being developed in the
individual businesses.
T.T.: How do you find and nurture innovation in manufacturing?
M.K.: Innovation is intentional as much as
it is inspirational. It begins when we bring
together the best talent and capabilities to
evaluate a need or solve a problem. Sometimes
the best isn’t always resident in your business.
Innovations are often born from collaboration, and then nurtured by continuing to work
across business and functional boundaries.
While we often think in terms of products,
manufacturing innovations can also be process.
Even small innovations add value. Engaged
employees finding better ways to do their daily
jobs naturally supports a workplace culture
that truly values innovation. From small ideas,
big ideas are born. You find manufacturing
innovation by building a culture open to seeing
new ways, and you nurture that innovation by
building on collaborative solutions.
T.T.: How does Raytheon keep informed
about the latest manufacturing methods
and equipment and how do they decide
what and when new methods are introduced?
Kimberly Ernzen: Raytheon is very focused on
exploration, development and application of
new manufacturing technologies and employs
multiple mechanisms to ensure that we utilize
technologies for exceptional performance and
affordability. Raytheon manufacturing is structured to gather innovation within each business, across the company and across industry.
Within the businesses, we capture the knowledge and creativity of our employees by sponsoring innovative ideas and embracing projects
that are potentially disruptive. We actively
partner with other nonmanufacturing research
projects to concurrently develop emerging
manufacturing ideas and capabilities such as
additive manufacturing, making sure that we
search technologies that provide competitive
advantage to our products. Additionally, we
have dedicated technology development teams
in automation, robotics, digital manufacturing
and analytics within operations that work to
continually improve and evolve our plan for
the Raytheon“factory of future.”
Raytheon also has corporate technology working groups that manage and coordinate innovation across the broad portfolio of products that
we manufacture. We have teams and interest
groups that share and develop technology
roadmaps specifically for manufacturing. These
groups meet, share and harvest diverse technol-
ogies and methods which include model-based
manufacturing, advanced immersive visualization and design technologies, materials research
and additive manufacturing. We have a strong
process within Raytheon to support the incubation of new manufacturing capabilities, but
also recognize the extraordinary value that academia, suppliers, small businesses, consortiums
and customers provide. We maintain active relationships and projects with dozens of groups
that promote manufacturing technologies and
are constantly reviewing the emerging technologies and processes being developed outside
of Raytheon for applicability to improving our
manufacturing capabilities.
T.T.: How does an employee or outside
business provide ideas and suggestions to
Raytheon Operations?
K.E.: A key way to offer ideas and suggestions
to Raytheon Operations is through the Total
Employee Engagement Process. In all factories,
Operations uses the tiered accountability and
escalation process to capture ideas and suggestions. Every day in the manufacturing work
cell, the team collects ideas from all interested
parties and assigns a closure mechanism. So far
this year, we’ve collected more than 5,500 ideas
and suggestions and all are geared at process
improvement and affordability.
Outside businesses can provide ideas to operations through our Manufacturing Technology
Network and our TAD. The TAD’s role is to
go out and engage with academia, industry,
and peer groups to bring the best ideas back
to Raytheon and incorporate them into our
manufacturing technology roadmaps. •
39
eye
ON TECHNOLOGY
ETEDDS: SYSTEM OF SYSTEMS
Real-time Simulation Environment
The End-to-End Distributed
Development System (ETEDDS)
was developed as a collaborative
effort between Raytheon Missile
F
Systems and Lockheed Martin to
perform high-fidelity system level
simulation testing of the Standard
Missile-3 (SM-3) and Aegis Weapon
System. The combined weapon
system provides sea-based protection against ballistic missile attacks.
There is a critical need for testing
of the entire weapon system to
find potential integration issues
and other issues prior to expensive
flight testing. In addition, the capability to perform high-fidelity system
simulation helps reduce the need
for live-fire testing by permitting
system performance evaluation
over a broad range of scenarios
and threats, with the results validated against the more limited
live-fire test data.
Figure 1. ETEDDS allows models of different fidelity to be integrated into one simulation.
Reproducing and combining each contractor’s
validated models in a collocated laboratory is
one method of integration testing, and it is an
extremely costly one at that. ETEDDS provides
a cost-effective integration approach using an
infrastructure to integrate multiple simulated
systems in geographically different locations
(each contractor uses their own existing facilities). Simulation models of varying levels of
fidelity can be selected to best represent test
objectives (see Figure 1). For example, lower
fidelity models (digital simulations) may be
used for the initial integration of algorithms
under development, while high-fidelity models
(Computer in the Loop [CIL] and Hardware
in the Loop [HIL]) may be used to test an integrated system performing a flight test scenario
prior to the live fire field test.
ETEDDS Architecture
ETEDDS is a suite of software based on a
technology called High Level Architecture
(HLA) — a simulation interoperability
standard originally developed by the U.S.
Department of Defense. HLA is primarily used
to define an interface for multiple heterogeneous systems to allow communications and
an exchange of information.
One benefit of using HLA is systems retain their
proprietary nature when connected. Raytheon
can connect with its partners, subcontractors and competitors in this manner. In HLA
terminology, the components of a simulation
are called “federates,” and the collection of
multiple federates is called a “federation.” The
primary federates within ETEDDS interface
directly with the SM-3 missile, the SM-3 kinetic
weapon (KW) and the Aegis Weapon System
(AWS). Other federates route threat information, collect data, visualize scenes, control
simulation components, store information in
a database, and analyze data (see Figure 2).
Managing a large simulation federation can be
challenging, but ETEDDS contains an application that allows a user to launch, control and
monitor the federation from a single access
point. This reduces the number of staff needed
to operate a simulation with multiple components. Operators can also detect anomalies
easily due to the ability to see the entire missile engagement in a 3D visualization and to
quickly analyze data (see Figure 3).
Having simulation components separated by
large distances does present some challenges,
especially regarding network latency. ETEDDS
r
c
Figure 2. ETEDDS architecture allows multiple systems to be connected together and tested.
has devised technology and methodologies
to mitigate network latency issues and yet allow the connected components to operate in
real-time.
ETEDDS Uses
ETEDDS produces a complete set of data
for analyzing individual missile and overall
system performance by collecting the tactical communication between the launch ship
and the missile along with detailed subsystem
in-flight performance data. ETEDDS also tests
algorithms under development that may affect
systems performance, and it provides a visual
representation of the simulation, simplifying
and accelerating the assessment of key system
attributes.
ETEDDS also plays an important role in flight
test preparation for the SM-3 program to help
prevent interface errors and to mitigate other
live test risks. Simulated target trajectories
based on the flight test scenario definition are
fed to the ETEDDS simulation to exercise tactical missile and ship hardware and software in
a flight test configuration. In 2008, Raytheon
engineers used ETEDDS to rapidly test modifications to a special SM-3 missile tailored to
destroy a damaged satellite in a decaying orbit.
The dead satellite was traveling 17,000 miles
per hour and the team had a 15-second window on each of a total of seven days to shoot
down the satellite. Mission preparation was
completed in just three weeks; the successful
intercept took just one shot.
Figure 3. ETEDDS has a rich tool set for visualization (left), simulation control (right back),
and analysis (right front).
ETEDDS has been in existence for over 10
years and has supported more than 15 flight
tests during that time. It has served a dual
purpose — to integrate the system for the
flight tests and to visualize the test event in
real time during flights. ETEDDS is a proven
and mature tool suite developed by Raytheon
and Lockheed Martin to meet today’s system
integration and test needs, and it stands ready
to meet the demands of tomorrow. •
David H. Stone,
Brian D. McCarty and Nick Garbarino
ETEDDS ALSO PLAYS
AN IMPORTANT ROLE
IN FLIGHT TEST PREPARATION FOR THE SM-3
PROGRAM TO HELP
PREVENT INTERFACE ERRORS AND TO MITIGATE
OTHER LIVE TEST RISKS.
41
SPECIAL INTEREST
CRITICAL INFRASTRUCTURE PROTECTION
Introduction
Security and protection of national
infrastructure has long been on the agenda
of many government organizations. In the
past the emphasis was on nuclear plants
and military bases, with appropriate security
measures implemented. As the rapidly
increasing world population demands more
energy and resources, however, the threatened
critical infrastructure includes oil and gas
plants, pipelines, desalinization plants,
power distrbution, busy ports and key
airports (see Figure 1).
Industries are responding to these threats. For
example, the energy industry is working with
a combination of large defense organizations
and small high-tech businesses to develop
security measures and products that protect
their assets. Small, commercial, high-tech
businesses are being supported through oil
and gas contracts, and investments in their
technology are being made by national oil
companies. One of the largest oil and gas projects currently under way and valued at over
AUS $12 billion is being undertaken by
a consortium led by Shell. The project
Figure 1. Critical infrastructure are assets that, if damaged, cause significant impact to the
country’s economy and populace.
These new infrastructure targets pose a number of security and protection issues to the
governments and commercial organizations
that own and operate them. Often originally
built without considering security, these
infrastructure elements are more vulnerable
to physical and cyberthreats than military
bases and nuclear plants. The destruction or
even disabling of a small proportion of these
national sensitive sites can cause exponential
economic and social consequences, not only
for that nation but also for the global market
that depends on that resource.
In addition to the rising number of infrastructure targets within the modern world, there
has also been a steady increase in the breadth
of threats. The threat of conventional war and
one nation’s forces attacking another nation’s
facilities has been augmented by an increase
in terrorist and guerrilla groups who use ingenious low-cost tactics to achieve maximum
impact and disruption.
involves a floating liquid natural gas vessel that will operate off the northwest coast
of Australia. At over 500 meters long and
displacing some 600,000 tons, this behemoth
will be monitored using only two 360 degree
cameras in the current design, providing some
awareness but few protection measures.
In contrast, the increase in piracy around
the Horn of Africa presents a different set of
challenges and requires different solutions.
These customers need a total security solution
that rapidly adapts to a changing world and
protects against the full range of criminal
and terrorist activities, and filling this need
requires integration of multiple different levels
of protection. These customers require an
experienced integrator having proven protection systems and a product base knowledge
that can be used to provide a proven, layered
protection solution. In addition to security
experience, the lead integrator also needs an
extensive background in communications
and network capabilities, the ability to offer
multiple levels of actionable response and
command and control (C2) capabilities to
generate and integrate situational awareness
information and seamlessly execute an appropriate response to the threat.
Key Technologies
The technologies used in a layered protection
system range from commercial capabilities
from vendors and Raytheon products to
extensive defense systems from key companies
across the globe. For example, point-access
solutions for providing secure personnel access and intrusion detection are well-known
commercial capabilities with thousands of
players across the globe. A full layered protection solution must however include additional
capabilities including proven C2 and reliable
communications to provide a shared situational awareness and the ability to provide an
integrated response to threats. Although the
types of threats may be different depending
on the specific asset to be protected and its
location, the goal is still the same: detect early,
assess effectively and respond effectively.
As depicted in Figure 2, the best protection solution requires a broad reach across different
companies and products, driven by the risk
analysis and integration expertise of a major
contractor such as Raytheon. Commercial
point-access solutions, for example, might
use fiber-optic fence sensors and buried radio
frequency induction sensors to provide improved capabilities over the older mechanical
fence sensors. Camera technologies continue
to evolve as higher resolution and uncooled
operation increase their capabilities (e.g.,
resolution and range) and ease of use. Radar
systems complement the passive camera
systems by providing longer-range detection
of potential threats with ability to spin for full
coverage around the protected site. Newer
active electronic scanned arrays provide
more sophisticated capabilities for detection
and tracking. The integrated operation of
both camera and radar systems can increase
the probability of early threat detection and
improve false alarm rate versus using just one
type of system alone.
C2 is the key to managing the awareness of
these complex environments and executing
SPECIAL INTEREST
Sensors
Command and Control
Level 1- Passive Protection: Situational awareness
with sensing, monitoring, cybersecurity, controls
and barriers through commercial systems
Nonlethals
Level 2- Nonlethal Engagement: Integration of
C2, comms, sensors and layered nonlethal
effectors to determine intent and deter threats
Existing Forces
Cyber
Existing Industry
Communications
Level 3- Local Area Defense: Limited area coverage
with fully capable defense system, including
combat capability and lethal effectors
Weapons
Level 4- Broad Area Defense: Extensive layered
protection over an area, integrated with other
national defenses for a spectrum of threat types
Figure 2. Elements of a protection system. The technology components of a layered solution are diverse and must work together to
provide seamless asset protection.
appropriate protection measures. For example,
an aquatic environment contains swimmers,
rafts, small boats, airborne traffic and other
platforms that for the most part have no hostile
intent. The C2 solution, typically hosted in an
operational center, is designed to enable rapid
assessment of these platforms by identifying those that potentially intend to harm the
protected facilities and then to provide alerts
to the impacted teams. The security force
needs awareness, clear communications and
decision-making capabilities that avoid the
wrong response to commercial operations and
accelerate response when indications show
hostile activity.
The total protection solution, including the
use of nonlethal and potentially lethal effectors
for deterrence to the threat, leverages integrated technologies from all the multiple domains
shown in Figure 2 to enable the country’s
existing security forces to protect their
important assets.
Solving the Customer’s Problem
Development of a protection capability starts
with understanding what type and level of security is needed and then developing a concept
of operations (CONOPS) for how the capability will be established, used, and maintained.
The CONOPS describes the system solution
in terms of the customer needs it will fulfill, its
relationship to existing systems or procedures,
and the ways it will be used. It is tailored for
unique requirements and customer user communities and describes how the technological,
physical and human components are combined
Figure 3. The type and level of protection drives the choice of and
mix of technologies used in each protective layer.
into an overall solution. It is tailored to the
specific threats and balanced against the
available resources and the operational environment. The CONOPS helps drive a full
solution that includes products and technologies, and also encompasses recommended
changes in operations, personnel, processes
and infrastructure.
An organizational evaluation is performed
early in the critical infrastructure protection
(CIP) development process, working directly
with the customer’s planners and leadership to
develop a detailed understanding of the asset
to be protected, the regional threats as well as
the needed level of protection (see Figure 3).
The planning process takes into account the
fact that there are baseline, or foundational,
requirements that must always be met at the
onset of the planning effort to ensure the success of the mission. Also to support CONOPS
development, modeling and simulation is
used to analyze the performance of a variety
of possible protection capabilities integrated
in different ways and compared against one
another in different operational concepts and
constructs against varying types and levels of
threat. These performance assessments help the
integrator and customer identify which changes
would bring the best value for protecting the
customer’s resources.
The specific protection needs are driven by
the desired level of threat deterrence, the
severity of the threat environment and
the vulnerability of the customer’s critical
infrastructure to the threats. Using the con-
ceptual framework of Figure 3, the customer’s
protection needs are assessed and a layered,
affordable CIP solution is developed that
provides the appropriate level of protection
ranging from passive protection measures only
to a full area defense of multiple assets using
both non-lethal and lethal methods.
The complete CIP solution, including results
of the organizational assessment, M&S
analyses, and CONOPS development, provides
the customer a recommended architecture
of processes, sensors, software, information
technology and tactical infrastructure with a
staged implementation approach at a pace that
can be absorbed by the security forces and at
which funds are available. This solution is then
iterated based on customer feedback, until
a baseline solution is selected and follow-on
development phases begin.
Due to the complexities and variety of today’s
threats, fully integrated, multilayered CIP solutions are more often required versus simpler
single technology solutions to protect
a nation’s critical infrastructure. These solutions often employ a variety of products and
capabilities under one operating system, enabling a small number of security personnel to
counter a variety of threats from a number of
different sources. Examples of this type of capability are evident around the world where small
onshore control centers cover the protection,
security and situational awareness of entire
oilfields operating multiple offshore assets. •
J. Bryan Lail,
Joel Holyoak, Ph.D.,
and James Norwood
43
PEOPLE
YESNET
Raytheon’s Young Employee
Success Network (YESNET) is an
Employee Resource Group that
fosters a culture that is welcoming, supportive and inclusive of
early-career employees. It assists
new hires with a smooth transition into their work environment by
providing networking and professional development opportunities to
support their growth at Raytheon.
YESNET’s membership exceeds
6,000 employees and spans more
than 25 Raytheon worksites across
the U.S. YESNET provides professional development activities such
as technical seminars, near term
career planning and mentoring
partnerships, as well as opportunities for community outreach,
professional networking, and channels for technological innovation
within the company.
In November 2014, YESNET celebrated
the conclusion of its second ever global
service campaign benefiting Wounded
Warrior Project® (WWP®). Annually, the
#YESNETforWWP campaign unites YESNET
chapters across the U.S. with a globalized
vision to raise awareness and support for our
nation’s wounded warriors. In 2014, YESNET
shattered previous records, donating more
than $36,000 to WWP. YESNET chapters
across the country creatively appealed to local
communities to raise support for WWP by
partnering with local businesses and planning exciting networking opportunities for
Raytheon employees and leaders. The 2014
effort also generated more than 600 volunteer
YESNET members show their team spirit
and temporary tattoos.
hours during the three-month campaign,
which lasted from July to October. YESNET
is continuing its partnership with WWP in
2015 with multiple fundraising events including food truck sales, bowling and poker nights,
and even a learn-to-paint event.
YESNET serves as a valuable resource of innovation within Raytheon. Members of YESNET
hail from diverse educational backgrounds
and experiences and are eager to contribute
their ideas to the company. Through various Invention Conventions and enterprise
Innovation Challenges, YESNET champions
members’ exciting new concepts from infancy through demonstration. This campaign
strengthens the bond between the individual
YESNET chapters as they collaborate in a common cause on a national stage. With coaching
and support from YESNET leaders, engineers
flourish as they develop their remarkable ideas
and present concepts to Advanced Technology,
Business Development, and other company
leaders. YESNET facilitates opportunities and
relationships that empower its members
to maintain an innovative mindset throughout
their careers at Raytheon.
By offering localized and enterprise community outreach opportunities, personal and
professional growth through networking,
mentoring and technical interchange events,
as well as coaching and sponsorship through
ENGINEERING PROFILE
Krista Gumiela
Senior Systems
Engineer
With Raytheon since
February 2010,
Krista Gumiela is
currently the spacecraft control
component integration and test lead
for the Mission
Management
Command and
Control (M2C2)
program, providing
continuous integration expertise for
next generation
M2C2 software.
Additionally, she’s
held the position of
Raytheon Young Employee Success Network (YESNET)
President for the past two and a half years where she
fosters and supports Raytheon’s young workforce.
company innovation challenges, YESNET provides a voice and serves as
an unmatched resource for Raytheon employees to engage and grow within
the company. YESNET allows energetic, enthusiastic young professionals
to thrive at Raytheon. •
Krista Gumiela
YESNET supports the recruitment and development of
young Raytheon professionals and new hires by providing
opportunities for networking with peers and upper
management, social activities, community outreach, and
seminars for personal and professional growth. Gumiela
looks to “shape tomorrow’s defense and intelligence landscape,” while concurrently helping “Raytheon’s young
talent develop into our company’s future leaders.”
“I have been incredibly lucky,” Gumiela explains, “Through
YESNET, I’ve leveraged a nationwide network to collaborate
and connect with people with all types of knowledge and
backgrounds, offering all kinds of opportunities and
experiences. Couple that network with the enthusiasm
of a yes, and attitude, and opportunity isn’t knocking on
my door – it’s smashing it open.”
Prior to her current role, Gumiela was a systems engineer
for the Advanced Targeting Forward Looking Infrared
(ATFLIR) program. Serving as a mechanical resource on
the ATFLIR Reliability team, she supported the production,
field maintenance and returns programs, identifying product
failure trends, investigating root causes and providing
corrective actions on production line and field use. She
presented at the 2011 Raytheon Systems Engineering and
Architecture Symposium on Dynamic Modeling of a System,
which earned an Invention Disclosure award from Raytheon
Space and Airborne Systems.
Before joining Raytheon, Gumiela served internships
at Alliant Techsystems (ATK) in advanced technology
process engineering and Johnson Controls in automative
electronics. She holds a Bachelor of Science degree in
mechanical engineering and is in the process of earning
a Master of Science degree in aerospace engineering,
both from Purdue University.
Iraq war veteran Jeremiah Pauley inspires the audience by telling his war
experiences at the Raytheon YESNET for Wounded Warrior Project 2015
kickoff event in El Segundo, Calif.
45
EVENTS
RAYTHEON TEAM HELPS HIGH SCHOOL STUDENTS
Build Telescopes
Raytheon employee helps high school student build a Galileoscope.
MathMovesU® (MMU) is an initiative
founded by Raytheon in 2005. The program’s
main goal is to support and promote interest in science, technology, engineering and
mathematics (STEM). MMU reaches out to
children of all ages around the world through
interactive museum exhibits, sponsorships,
a virtual thrill ride at Walt Disney World®,
scholarships, and through special events where
Raytheon employees have a chance to reach
out to their community and get involved on
a personal level.
As part of National Engineers WeekTM,
Raytheon teamed up with the National
Optical Astronomy Observatory (NOAO) and
the University of Arizona for a one day MMU
event teaching local high school students
about astronomy and helping them build their
own Galileoscopes. Members of Raytheon’s
Engineering Leadership Development
Program (ELDP) took part in the event to
help teach and promote STEM interest
among local Tucson high school students.
The ELDP is comprised of early career engineers from all across Raytheon. The program
participants are chosen through nomination,
performance evaluation, level of education
and college grade point average. The ELDP
is a two-year program consisting of several
week-long leadership training sessions that focus on building skills important to Raytheon
success such as effective communication,
business acumen and development, and innovation and creativity. ELDP participants have
the chance to network with leadership across
Raytheon, take part in both sides of mentorship, rotate positions across different sites,
and have an active involvement in community
service and STEM activities.
The Tucson MMU day community service
event was held at the University of Arizona
where local high school students were separated into groups each led by a member of the
ELDP with guidance from several members
of the NOAO. The students filed into the auditorium where there was an ELDP member at
each table waiting to greet them with a smile
and their own Galileoscope kit. The NOAO
developed Galileoscopes to provide an easy
and cost effective way for students to have
their own personal telescope to learn about
astronomy and science, like Galileo himself.
The students were able to experience a real
life engineering design process by making
their own Galileoscopes through step-by-step
instructions and help from their ELDP mentor. During each step, the NOAO facilitator
briefed the group on a different fact about
the history of Galileo, physics, astronomy
and optics.
EVENTS
S
Student tests the finished Galileoscope.
For many of the early career Raytheon volunteers, it was an exciting opportunity to share
their interest of math and science to help foster
interest among local high school students. As
ELDP volunteer Lester McCoy described the
experience, “It was a lot of fun getting to build
telescopes with the students and share our passion for math and science with them.”
The day concluded with a panel discussion of
Raytheon employees and University of Arizona
students and faculty. The high school students
asked the panel great questions on pursuing
STEM careers, and then finished the day by
packing up their new Galileoscopes and saying
goodbye to their event mentors.
Brendan Dessanti,
Kristen Koblis,
Nina Phanthanousy and
Ryan White
A student and a volunteer work together to assemble a Galileoscope.
47
United States
FEATURE
Patents
Issued to Raytheon
At Raytheon, we encourage people to work on
technological challenges that keep America
strong and develop innovative commercial
products. Part of that process is identifying and
protecting our intellectual property (IP). Once
again, the U.S. Patent Office has recognized our
engineers and technologists for their contributions in their fields of interest. We congratulate
our inventors who were awarded patents
from July 2013 through December 2014.
JAYSON KAHLE BOPP
8477504 Systems and methods for blind-mate
connector alignment
MICHAEL C. BARR, LOWELL A. BELLIS, ROBERT C. HON,
CYNDI H. KESLER, CARL KIRKCONNELL
8490414 Cryocooler with moving piston and moving cylinder
SCOTT R. CHEYNE, PAUL A. DANELLO,
JOSEPH R. ELLSWORTH, THOMAS J. TELLINGHUISEN
8508943 Cooling active circuits
KERRIN A. RUMMEL, RICHARD M. WEBER,
WILLIAM G. WYATT
8490418 Method and apparatus for cooling electronics with
a coolant at a subambient pressure
LOWELL A. BELLIS, ROBERT C. HON, CARL KIRKCONNELL,
JULIAN A. SHRAGO
8491281 Long life seal and alignment system for small
cryocoolers
CLAYTON DAVIS, BENJAMIN DOLGIN
8510048 Method for detecting underground tunnels
CHRISTOPHER GINTZ, GRAHAM GINTZ, JERRY M. GRIMM,
TIMOTHY J. IMHOLT, JAMES A. PRUETT
8491292 Aligning nanomaterial in a nanomaterial composite
NEIL R. NELSON, STEVEN R. WILKINSON
8493123 Synchronization of remote clocks
DAVID JAMES GETTY
8493437 Methods and systems for marking stereo pairs
of images
JERRY BURCHFIEL
8494534 Spectrum-adaptive networking
DAVID G. MANZI, STEVEN E. SHIELDS,
JAMES A. WURZBACH
8477894 Method and system for communication channel
characterization
GEOFFREY D. ASHTON
8494689 Autonomous coordination of agents
IAN S. ROBINSON, ANTHONY SOMMESE
8478061 System and method for reducing dimensionality
of hyperspectral images
RUDY A. EISENTRAUT
8497456 Guided munitions including interlocking dome covers
and methods for equipping guided munitions with the same
CHRISTOPHER J. GRAHAM, JANE M. ORSULAK,
JASON J. RUBIN
8478455 Vehicle control station with back-up VSM
for remotely controlling an unmanned vehicle and method
DANIEL W. BRUNTON, MICHAEL P. SCHAUB,
BRIAN S. SCOTT
8497457 Flight vehicles with improved pointing devices
for optical systems
DONALD E. CROFT, JEFFERY P. SOWERS,
KARL F. SPIESSBACH
8478456 Variable bandwidth control actuation methods
and apparatus
WILLIAM P. HAROKOPUS, DARRELL W. MILLER
8497812 Composite radome and radiator structure
FRANK N. CHEUNG
8495335 Data translation system and method
DOUGLAS E. LAPP, THOMAS R. WOODALL
8478997 Multi-level security software architecture
MARK A. GLOUDEMANS, DAVID E. MUSSMANN,
MARTIN STERN, THOMAS E. YOUNG
8498350 Communication system incorporating physical layer
waveform structure
LUCIAN A. BRASIER, LAUREN M. GARCIA, JAMES E. LEWIS,
WAID A. PAINE, THOMAS H. TAYLOR
8480409 Method for RF connector grounding
DEREK BASSETT, GERALD E. KAAS
8498760 System and method for simultaneously processing
telemetry data
JOHN P. HIGBY
8481851 Variable-length lightning strike down-conductor
DELMAR L. BARKER, MICHAEL J. BROYLES,
DARRICK M. BUBAN
8499908 Non-Newtonian fluid (NNF) filled cable and method
LARRY L. LAI, JOSE MELENDEZ, DEVON J. PRICE
8482477 Foam layer transmission line structures
ANTHONY K. TYREE
8502126 System and method for navigating an object
MICHAEL USHINSKY
8483248 Laser crystal components joined with thermal
management devices
ERIC R. GROVER, DAVID W. HOLSTEEN,
MELISSA L. HOUGHTON, RONALD D. LEWIS
8483336 System and method for extraction
of communication interference
,
PAUL A. HERZIG, ROBERT ROEDER, THOMAS WELLER
8485722 Subsurface temperature measurement system
STEPHEN JACOBSEN, DAVID MARCEAU, FRASER M. SMITH
8486735 Method and device for incremental wavelength
variation to analyze tissue
BRIAN L. BISWELL
8487226 Deconfliction of guided airborne weapons
fired in a salvo
MARK S. HAUHE, CLIFTON QUAN
8487823 Switchable microwave fluidic polarizer
LACY G. COOK
8488237 Wide spectral coverage Ross-corrected
Cassegrain-like telescope
JOHN T. GEISS, MICHAEL J. HIRSCH
8489522 Pattern learning system
MICHAEL P. EASTON, KENT P. PFLIBSEN,
CASEY T. STREUBER
8502128 Dual-mode electro-optic sensor and method of using
target designation as a guide star for wavefront error estimation
DAVID J. KATZ, STEPHEN R. REID
8503593 Waveform generator in a multi-chip system (highspeed, two-chip, arbitrary waveform generator)
ROBERT HARROVER, JOHN S. LEAR, JOHN E. STEM,
KENNETH W. WRIGHT
8504636 Monitoring communications using a unified
communications protocol
STEPHEN J. SCHILLER, JOHN F. SILNY
8507843 Method and system for spectral calibration of a remote
sensing sensor and a synthetic target having a tunable spectral
composition
LACY G. COOK
8507866 Cold-shielded infrared dispersive spectrometer
with all ambient optics
CLIFTON QUAN, MICHAEL D. WABS
8508408 Method and apparatus for reconfiguring a photonic
TR beacon
MICHAEL ALEXANDER, QUANG DAO,
MARK J. KUCKELMAN, JEFFERY JAY LOGAN
8510823 System and method for testing functionality of a
firewall
MONTY D. MCDOUGAL, MATTHEW RICHARD
8510841 Detecting malware using patterns
IAN S. ROBINSON
8511614 Optimal space situational awareness system
RONALD J. BUTTE
8511618 Pressure-based separation apparatuses
STEPHEN H. BLACK, ANDREW D. PORTNOY,
ALAN G. SILVER
8511823 Imaging system
BLAISE ROBITAILLE
8511870 Method and apparatus for generating monochromatic
or polychromatic radiation
CHRIS E. GESWENDER, CESAR SANCHEZ,
MATTHEW A. ZAMORA
8513581 Multi-caliber fuze kit and methods for same
ROBERT W. BYREN, DARIN S. WILLIAMS
8514284 Textured pattern sensing and detection, and using a
charge-scavenging photodiode array for the same
BRADLEY FLANDERS, IAN S. ROBINSON
8515179 System and method for hyperspectral image
compression
VICTOR KHITROV, DAVID A. ROCKWELL
8515220 Optical fiber coupler for coupling signal beams into a
non-circularly shaped optical beam
WILLIAM J. COTTRELL, NATHAN G. KENNEDY
8515222 Methods and apparatus for a fiber optic display screen
having an adjustable size
PETER ROZITIS
8515228 Method and apparatus for accurately positioning
an optical fiber end
JOHN J. COOGAN, PAUL M. INGRAM JR.,
JOSEPH C. LANDRY, PAUL D. SHOCKLEE
8515716 Remote material identification process performance
prediction tool
DAVID STALLARD
8515749 Speech-to-speech translation
SAMUEL S. BLACKMAN, STEPHEN A. CAPPARELLI,
DOUGLAS E. CARROLL, RACHEL B. NORMAN,
STEFAN SCHWOEGLER
8515881 Multiple hypothesis tracking
THOMAS R. WOODALL
8516268 Secure field-programmable gate array (FPGA)
architecture
SUZANNE P. HASSELL, JUAN E. SANDOVAL,
ARMANDO J. SANTOS, NICHOLAS I. SAPANKEVYCH
8516596 Cyber attack analysis
STEPHEN JACOBSEN, BRIAN MACLEAN, MARC OLIVIER
8516918 A biomimetic mechanical joint
ERIC J. GRIFFIN, EVAN H. GRIFFIN
8518137 Miniature active standoff chamber
PAUL A. MEREMS
8519312 Missile with shroud that separates in flight
CHRIS E. GESWENDER, CHARLES SCARBOROUGH,
PAUL VESTY
8519313 Projectile navigation enhancement method
MARTIN S. DENHAM
8519879 Precision charge-dump circuit
ROBERT H. DENNIS JR., AMANDA GRAVANDA,
ELI HOLZMAN, ROBERT E. MORRIS, PETER D. PATALANO,
AARON J. STEIN, JOHN STEPHENS, HAROLD L. WIECK
8522426 Vent blocking on vented ball grid arrays to provide a
cleaner solution barrier
NATE B. HERSE
8537559 Compliant insert for electronics assemblies
BRANDON CROW, ARTHUR M. NEWMAN
8553933 Edge diversity object detection
MARK A. HARRIS
8537657 Cross domain modulation scheme for a wireless
communication link
STEVEN J. MANSON
8554016 Image registration system and method for registering
images for deformable surfaces
JOSEPH C. DIMARE, CAMERON B. GODDARD,
MATTHEW D. THOREN
8522511 Methods and apparatus for mast system with enhanced
load bearing
GARY I. ASNIS
8538071 System and method for target separation of closely
spaced targets in automatic target recognition
ROBERT BELVIN, MICHAEL DAILY, HOWARD NEELY
8554710 Converting video metadata to propositional graphs
for use in an analogical reasoning system
DANIEL W. OTTS
8538167 Designating corridors to provide estimates of structures
JAMES BARGER, RONALD COLEMAN, JOHN STANLEY
8555726 Acoustic sensors for detecting shooter locations
from an aircraft
ANDREW L. MARTIN, ALLEN M. SCHWARTZ
8527675 System and method for implementing a secure
processor data bus
DELMER D. FISHER
8528478 Safe arming system and method
BRIAN J. GOWLER, THOMAS P. MCCREERY,
TERRY M. SANDERSON, DAVID R. SAR
8528863 Multi-layer metal/shape memory polymer roll-up wing
structures for fitment-constrained air vehicles
DOUGLAS BROWN, GEOFF HARRIS, DANIEL MITCHELL
8529991 Method and apparatus for cutting a part without
damaging a coating thereon
JOHN F. BUGGE, MATTHEW B. CASTOR,
JEFFERY P. SOWERS
8530809 Ring gear control actuation system for air-breathing
rocket motors
ERNEST D. FASSE, FREDERICK B. KOEHLER,
PETER V. MESSINA
8531657 Micro-radian class line-of-sight and centration
stabilization system
PAUL B. HAFELI, ELI HOLZMAN, ROBERT M. STERNS
8531821 System for securing a semiconductor device
to a printed circuit board
VITALIY M. KAGANOVICH
8532367 System and method for 3D wireframe reconstruction
from video
JOHN J. COOGAN, PAUL M. INGRAM JR.,
JOSEPH C. LANDRY, PAUL D. SHOCKLEE
8532958 Remote identification of non-Lambertian materials
AARON FOULK, THEODORE VORNBROCK
8534124 Sensor housing apparatus
WILLIAM D. BEAIR, ERIC GILLEY, MICHAEL RAY WILLIAMS
8534533 Solder paste transfer process
SUSAN B. SPENCER
8534851 Multiple path substantially symmetric three-mirror
anastigmat
FRANCIS J. MORRIS
8535797 Method for fabricating electrical circuitry
on ultra-thin plastic films
LACY G. COOK, PHILIP T. SHIMON
8536503 Faceted retro-mirror for line-of-sight jitter sensing
SCOTT RITTER
8536988 Self-organizing extensible distributed sensor
array architecture
SCOTT T. JOHNSON, CLIFTON QUAN,
DAVID E. ROBERTS, ROHN SAUER
8537059 Cooling system for panel array antenna
CHARLES A. HALL, THEODORE N. TAHMISIAN JR.
8537067 Small aperture interrogator antenna system employing
sum difference azimuth discrimination techniques
WILLIAM F. CALL, YUEH-CHI CHANG,
JOHN J. HANLIN, LARRY C. MARTIN
8537068 Method and apparatus for tri-band feed with
pseudo-monopulse tracking
MICHAEL K. BURKLAND
8537377 Absolute position encoder
SCOTT R. CHEYNE, JOSEPH R. ELLSWORTH,
MICHAEL P. MARTINEZ, JEFFREY PAQUETTE,
MICHAEL RICHARD TRAHAN
8537552 Heat sink interface having three-dimensional
tolerance compensation
IAN S. ROBINSON
8538195 Hyperspectral image dimension reduction system and
method
JAMES J. RICHARDSON
8538675 Non-kinematic behavioral mapping
MICHAEL S. SCHWERER
8541720 Apparatus for remotely measuring surface temperature
using embedded components
JEAN-PAUL BULOT, MATTHEW J. KLOTZ
8543009 Method and apparatus for synthesizing ultra-wide
bandwidth waveforms
DOUGLAS CARROLL, RUSSELL W. GOFF,
JAMIL R. HASHIMI, STEPHEN P. JOHNSON,
FRED G. THOUROT, JOANNE E. WOOD
8543255 Apparatus and method for controlling
an unmanned vehicle
DAVID A. LANCE, PATRIC M. MCGUIRE,
STEVEN T. SIDDENS
8543990 Methods and apparatus for testing software with
real-time source data from a projectile
DONALD P. COX
8545761 Chemical and biological sensor
RICHARD DRYER
8546736 Modular guided projectile
SHAHROKH HASHEMI-YEGANEH, HEE KYUNG KIM,
ROBERT W. LADERA, CLIFTON QUAN,
ALBERTO F. VISCARRA, FANGCHOU YANG
8547280 Systems and methods for exciting long slot radiators
of an RF antenna
FRANK KASTENHOLZ, GREGORY LAUER, LAURA MA,
WALTER C. MILLIKEN, GREGORY TROXEL
8547846 Method and apparatus providing precedence drop
quality of service (PDQoS) with class-based latency differentiation
DAVID CYGANSKI, ROY E. JOHNSON, JAMES M. MCGRATH,
PAVAN K. REDDY, NICHOLAS SHERWOOD,
NAVID YAZDANI
8549135 Method and apparatus for performing quality
of service in secure networks
DAMIAN C. ATHEY, ROBERT P. JOHNSON,
OSCAR K. OHANIAN, THOMAS A. OLDEN
8550005 Non-lethal delivery canister, threat mitigation system,
and methods for mitigating bomber and perpetrator threats
MICHAEL S. BIELAS, JAMES A. EBEL,
ANDREW B. FACCIANO, ROBERT J. LAPORTE,
EDWARD C. SCHLATTER, PHILIP C. THERIAULT
8552350 Mitigation of drift effects in secondary inertial
measurements of an isolated detector assembly
CHRIS E. GESWENDER, MATTHEW A. ZAMORA
8552351 Projectile with deployable control surfaces
ANDREW K. BROWN, KENNETH W. BROWN,
DARIN M. GRITTERS, THOMAS A. HANFT,
PATRICK J. KOCUREK, MICHAEL A. MOORE
8552813 High frequency, high bandwidth, low loss microstrip
to waveguide transition
ANTHONY KOPA
8552896 Digital-to-analog converter (DAC)
ERIC N. BOE, MICHAEL Y. JIN
8552905 Automated layout of beams
JOHN F. SILNY
8553225 Bandwidth tunable spectroscopic device
DAVID G. GARRETT, TODD A. ISAAC
8555766 Safe and arm system for a robot
DELMAR L. BARKER, KENNETH L. MOORE,
WILLIAM RICHARD OWENS
8555768 Shock wave barrier using multi-dimensional
periodic structures
ANDREW L. BULLARD
8556533 Multi-stage flexural pivot
RONALD L. RONCONE
8558152 Lens concentrator system for semi-active laser
target designation
CHRIS E. GESWENDER
8558153 Projectile with inertial sensors oriented
for enhanced failure detection
STEPHEN JACOBSEN, MARC OLIVIER,
SHANE OLSEN
8558489 Micro motor
LARRY J. JOHNSON, NICHOLAS W. KNIZE, ROBERTO RETA
8558847 Displaying situational information based on
geospatial data
PAUL M. INGRAM JR., JOSEPH C. LANDRY
8558884 In-scene determination of aerosol parameters
from imagery
JUSTIN GORDON ADAMS WEHNER
8559113 Multi-spectral super-pixel filters and methods
of formation
JESSE H. BLAKE, MATTHEW GLENN MURPHY,
JAMES L. PORTER
8559191 Multi-purpose mounting devices for mounting electrical
packages to airborne objects
MARK E. BEHRENS, DANIEL A. COLICA,
KENNETH W. VIRGIL
8560105 Automated logistics support system incorporating
a product integrity analysis system
ALEXANDER A. BETIN, DAVID A. ROCKWELL,
VLADIMIR V. SHKUNOV
8565272 Method and apparatus for generation and amplification
of light in a semi-guiding high aspect ratio core fiber
MATTHEW T. CASHEN, TODD O. CLATTERBUCK,
STEVEN R. WILKINSON
8565609 Distribution system for optical reference
BARBARA J. BLYTH, DAVID SEIBECKER
8566271 Raytheon advanced information fusion (RAIF)
with evidential reasoner (RDSER)
WASEEM NAQVI
8566314 System and related techniques for detecting
and classifying features within data
KEITH GUINN
8567049 Metal foil interconnection of electrical devices
JOSEPH ACORACI, DAVID J. IRWIN, MICHAEL C. WERNIG
8567077 Laser tracker system and technique for antenna
boresight alignment
RICHARD J. WRIGHT
8567725 Orbital debris mitigation system and method
JONATHAN J. CARR
8567872 Grinder bit
GARY H. JOHNSON, THOMAS H. LIND,
RONALD L. RONCONE, JOHN A. THOMAS
8567969 Bi-polymer infrared optics for high-g applications
49
JOSE E. CHIRIVELLA, ANTON VANDERWYST
8569668 Active vortex control system (AVOCS) and method
for isolation of sensitive components from external environments
DELMAR L. BARKER, WILLIAM RICHARD OWENS,
ABRAM YOUNG
8569696 Imaging system and method using a photonic band
gap array
GEORGE F. BARSON, MATTHEW D. BROWN,
WILLIAM P. HULL JR., JOSHUA LAMB,
STEVEN P. MCFARLANE, THOMAS H. TAYLOR,
JAMES S. WILSON, KARL L. WORTHEN
8570237 Multi-band electronically scanned array antenna
ROBERT K. BRATTON, EMMANUEL FIERRO,
KELVIN L. KEELS, LYALE F. MARR
8570675 Kinematic optical device mount
JAYSON KAHLE BOPP
8570717 Center instrument pedestal display
JAMES J. DWULIT, BRADLEY FLANDERS,
IAN S. ROBINSON, C. RALPH WATERS
8571325 Detection of targets from hyperspectral imagery
STEPHEN JACOBSEN, MARC OLIVIER
8571711 Modular robotic crawler
TROY ROCKWOOD
8572733 System and method for active data collection
in a network security system
TERRY M. SANDERSON
8573535 Shape-change material and method
THOMAS K. DOUGHERTY, STEVEN E. LAU,
CINDY W. MA, STEPHEN L. SCHRADER,
CHRISTOPHER T. SNIVELY, WILLIAM J. WOLFGONG
8575238 X-ray opaque coating
WILLIAM E. HOKE, THOMAS E. KAZIOR,
JEFFREY R. LAROCHE
8575666 Method and structure having monolithic
heterogeneous integration of compound semiconductors
with elemental semiconductor
MARK L. VALENTINE
8576110 Fast ray trace to identify radar multipaths
IAN S. ROBINSON
8577183 Resolution on demand
ADRIAN A. ABRANTES, DAVID A. DENSLOW,
DARYL J. DOUGLAS, ZHEN-QI GAN,
KYLE S. MILLER, RICHARD PINGOL,
NICHOLAS SUN, ROBERT A. SYKES
8577905 System, method and logic for optimized
geospatial data delivery
MICHAEL R. JOHNSON, BRUCE E. PEOPLES,
MICHAEL M. SMITH
8577924 Determining base attributes for terms
W. HOWARD POISL, BYRON B. TAYLOR
8581161 Seeker with a molded dichroic mirror
PAUL A. DRAKE, RICHARD N. MULLINS
8581191 Stabilization of coldshield bodies
WILLIAM J. DAVIS, ROBERT B. HALLOCK,
JAMES A. ROBBINS
8581406 Flip chip mounted monolithic microwave
integrated circuit (MMIC) structure
SERGEY MAKAROV, PATRICK MORRISON,
ANGELO M. PUZELLA
8581801 Droopy bowtie radiator with integrated balun
FRANK B. JAWORSKI
8582104 Optical device for detection of an agent
BRANDON CROW,
ARTHUR M. NEWMAN
8582884 Approximation of an imaged object from edges
detected from the underlying image
MICHAEL R. HLAVEK, ROY P. MCMAHON,
ANDREW L. NELSON
8584568 Bomb rack lock
ROBERT L. KESSELRING
8586901 Method for compensating for boresight error
in missiles with composite radomes and guidance section
with boresight error compensation
STEPHEN H. BLACK, ROBERT F. BURKHOLDER,
MICHAEL A. GRITZ, BORYS PAWEL KOLASA
8586926 Antenna-coupled antenna arrays
JOHN W. HAUFF
8587386 High isolation waveguide switch
ERWIN W. BATHRICK, CHRISTOPHER G. HOFF
8587617 Apparatus and method for map zooming
ERIC SABOL
8588853 Femtocell configuration
KAICHIANG CHANG, WILLIAM KENNEDY
8604976 Broad beam antenna design for a tilted phased
array with platform motion
DARIN S. WILLIAMS
8605161 Intra-frame optical-stabilization with intentional
inter-frame scene motion
ROBIN A. REEDER, DAVID A. ROCKWELL,
VLADIMIR V. SHKUNOV
8606062 Apparatus and method for mode control in a
semi-guiding amplifier medium
ERIC SABOL
8606322 Portable cellular base station configuration
GABRIEL D. COMI
8589119 System and method for distributed processing
SAAD KARIM, RICHARD J. KENEFIC, DAVID W. SHIN
8606838 Method and apparatus for configurable sample rate
conversion in teleoperated devices
CASEY T. STREUBER
8593622 Serially addressed sub-pupil screen for in situ electrooptical sensor wavefront measurement
JEFFERY THOMAS ANDERSON, KURT M. BEUTEL,
DAVID C. PENNY
8607429 Circuit card assembly extraction tool and methods
thereof
8594475 Methods and apparatus for a decoupled fiber optic
display
ROY P. MCMAHON
8608111 Decoupling mechanism for a store
ROBIN A. REEDER, DAVID A. ROCKWELL,
VLADIMIR V. SHKUNOV
8594476 Apparatus and method for mode control in semiguiding amplifier media
KIRK FISHER, EVELYN W. KAPUSTA, IRL W. SMITH
8594511 Method and apparatus for maintaining a coherent
combined beam during arbitrary steering
JERRY HINSON
8594602 Fast cross-pole corrector
HERBERT LANDAU, KENRIC P. NELSON,
BRIAN J. SCANNELL
8595177 Risk management for object identification
MICHAEL DEAN
8595222 Methods and apparatus for representing, using and
displaying time-varying information on the semantic web
JOSHUA EDMISON, JOHN-FRANCIS MERGEN
8595738 Energy-aware computing environment scheduler
JOSH KARLIN, GREGORY LAUER, DAVID MANKINS,
CRAIG PARTRIDGE, WILLIAM STRAYER
8595818 Systems and methods for decoy routing and covert
channel bonding
DANIEL CHASMAN, STEPHEN D. HAIGHT,
DANIEL V. MACINNIS
8596040 Rocket multi-nozzle grid assembly and methods for
maintaining pressure and thrust profiles with the same
MICHAEL P. EASTON, PAGE E. KING, CASEY T. STREUBER
8598502 Motionless focus evaluation test station for electrooptic (EO) sensors
KUANG-YUH WU
8599095 Broadband ballistic resistant radome
MARC BERTE, KENT P. PFLIBSEN, DARIN S. WILLIAMS
8599497 Wide angle thin-profile zoom
CARL F. COTNER
8600055 Methods and system using stealth noise modulation
JONATHAN COMEAU, MATTHEW A. MORTON
8600329 Interference signal canceller
ORION PARROTT, PETER G. SARGENT
8601500 Platform-independent signal processing
THOMAS L. CHEN, WILLIAM SHANE POWELL
8601587 System, method, and software for cyber threat analysis
8602606 Methods and apparatus to receive light from a laser
via air for a fiber optic display
DOUGLAS W. ARENT, CHARLES M. CIANY,
CLIFFORD M. CURTIS, THOMAS B. PEDERSON,
THOMAS E. WOOD
8604969 System and method of using image grids in detection
of discrete objects
STEPHEN H. BLACK, THOMAS ALLAN KOCIAN
8608894 Wafer level packaged focal plane array
MATTHEW JONAS, ALAN R. LEVY,
JOHN F. MCGEE III, TODD E. SESSLER
8610062 Apparatus and method for multi-spectral imaging
SETH A. BERMAN, ROGER L. CLARK,
ROBERT E. KOZLOWSKI, GARY K. MONTRESS
8610517 Surface acoustic wave resonator mounting
with low acceleration sensitivity
CHET L. RICHARDS
8610708 Method and apparatus for three-dimensional image
reconstruction
DAVE S. DOUGLAS, VITALIY M. KAGANOVICH,
ARTHUR M. NEWMAN, NICHOLAS SUN
8611600 Three-frame difference moving target acquisition
system and method for target track identification
STEPHEN JACOBSEN, DAVID WELLS
8614768 Miniaturized imaging device including grin lens
optically coupled to SSID
SAMI DAOUD
8616130 Liners for warheads and warheads having
improved liners
ROBERT D. TRAVIS
8616818 Gripping washer having one or more deformable
gripping tabs and method for reducing foreign object debris
CHERYL K. ENDO, JAMES F. KEATING, WILLIAM B. NOBLE,
KIM L. VALENZUELA
8618898 System for transferring power and/or data through
a non-ferrous skin of a vehicle
DALE M. RICKMAN
8620034 System and method for biometric identification using
ultraviolet (UV) image data
ERIC P. LAM, CHRISTOPHER A. LEDDY,
STEPHEN R. NASH, HARRISON A. PARKS
8620086 System and method for image registration based on
variable region of interest
SAIKAT GUHA
8620166 Holevo capacity achieving joint detection receiver
MONTY D. MCDOUGAL, JASON E. OSTERMANN,
BRIAN N. SMITH
8621223 Data security method and system
CHRISTOPHER JACOB REIMER
8621759 Method and system for attenuating a wavelength
shifting source
CHARLES B. BRADLEY II
8624577 Identifying a cable path using light emitting diodes
KENNETH A. ESSENWANGER
8624688 Wideband, differential signal balun for rejecting
common mode electromagnetic fields
STEPHEN M. PALIK
8625005 First-in-first-out (FIFO) buffered median scene
non-uniformity correction method
FRANK KASTENHOLZ, LAURA MA, WALTER C. MILLIKEN,
GREGORY TROXEL
8625605 Non-uniform per-packet priority marker for use
with adaptive protocols
BRANDON W. BLACKBURN, DAVID CHICHESTER,
ALAN HUNT
8625744 Apparatus and methods for real-time detection
of explosives devices
SHANE A. GRIFFIN, ETHAN PHELPS, PRAKRUTI PRATIVADI,
MICHAEL S. SCHMIDT
8625905 Classification of target objects in motion
JOHN F. SILNY, MARK R. SKIDMORE
8626189 Position optimization
JASON R. CLINTON, BRADLEY T. FORD,
MORGAN J. GREENWOOD, MONTY D. MCDOUGAL,
WILLIAM P. SMELSER
8627404 Detecting addition of a file to a computer system
and initiating remote analysis of the file for malware
TIMOTHY J. IMHOLT, JAMES A. PRUETT
8628746 System and method for dispersing nanostructures in a
composite material
CODY B. MOODY, FRANCIS J. MORRIS,
,
BRANDON W. PILLANS
8629360 RF micro-electro-mechanical system (MEMS)
capacitive switch
BRIAN KEITH MCCOMAS, KENT P. PFLIBSEN,
LEONARD D. VANCE
8629387 Multi-layer sensor chip assembly and method for
imaging generating image data with a frame-sum mode and
a time-delay integration mode
CHARLES CHANDLER, ROGER CONRAD,
ROBERT A. DEATON
8630601 Active channelized integrated antenna system
MICHAEL BRENNAN, BENJAMIN DOLGIN,
LUIS GIRALDO, JOHN HILL III, DAVID KOCH,
MARK A. LOMBARDO, JORAM SHENHAR
8636448 Drilling apparatus, method and system
TIMOTHY J. IMHOLT
8636972 Making a nanomaterial composite
PAUL A. DRAKE, MARK T. LUKE, RICHARD N. MULLINS
8637824 Cold shield for a cold stage
DALE ROBERTSON
8638066 Battery optimization and protection in a low power
energy environment
PAUL DRYER
8638253 Vibrating radar sensor
CHRISTOPHER SAMIOS
8639278 Systems and methods for connecting radio systems
ROBERT C. HON, JOHN F. SILNY
8639388 Time domain vibration reduction and control
CHRISTOPHER R. ECK, MICHAEL J. HIRSCH,
HECTOR ORTIZ PENA
8639396 Cooperative control of unmanned aerial vehicles
for tracking targets
RICHARD J. ERNST, MATTHEW J. HICKS,
JASON E. OSTERMANN, MATT A. POWERS,
HERBERT T. RIGGS III, JAMES H. SWEDBERG
8640189 Communicating results of validation services
RANDY S. JENNINGS, MONTY D. MCDOUGAL,
WILLIAM E. STERNS
8640246 Distributed malware detection
PETER LUKENS
8640468 Isothermal gas supply and method for minimizing the
temperature excursion of a gas mixture released therefrom
RICHARD DRYER, CHRIS E. GESWENDER
8640589 Projectile modification method
STEPHEN JACOBSEN, SHANE OLSEN
8640723 First-stage pilot valve
CESAR SANCHEZ, TERRY M. SANDERSON
8632073 Methods and apparatus for a seal
PHILIP C. THERIAULT
8641318 System and method for joining brittle material pieces
BRIAN J. ZELINSKI
8632633 In-situ growth of engineered defects in graphene
by epitaxial reproduction
CHRISTOPHER L. HERNANDEZ, JASON R. PETTY,
NICHOLAS B. SACCKETTI, LAWRENCE A. WESTHOVEN JR.
8642965 Stray light baffle for a seeker or other sensor system
and a method for making the same
DAVID A. ROCKWELL, VLADIMIR V. SHKUNOV,
FRIEDRICH STROHKENDL
8643942 Compensation of thermally induced refractive index
distortions in an optical gain medium or other optical element
RONALD J. BUTTE
8632642 Adjustable explosive output
DAVID FUCIARELLI, DAVID L. II, DEEPAK KHOSLA
8634982 System and method for resource allocation
and management
WILLIAM E. STERNS
8635079 System and method for sharing malware analysis results
DOUGLAS G. DALY, JAMES J. HIROSHIGE,
CHARLES A. LIVINGSTON, WILLIAM RUDNISKY
8635622 Method and system for resource management
using fuzzy logic timeline filling
RANDY S. JENNINGS, JESSE J. LEE,
MONTY D. MCDOUGAL, MATTHEW RICHARD,
WILLIAM E. STERNS
8635700 Detecting malware using stored patterns
MARK A. ANGELOFF, ROY P. MCMAHON
8635937 Systems and methods for launching munitions
ERIC J. GRIFFIN, JOHN D. ISKER,
WILLIAM B. KING, CHAUNCHY F. MCKEARN
8635938 Retractable rotary turret
GARY SCHWARTZ, RICHARD M. WEBER
8636051 Free air stream heat exchanger design
JEREMY C. DANFORTH, RICHARD D. LOEHR,
KEVIN P. MURPHY
8636247 Closed gas generator and micro power unit
including the same
PREMKUMAR NATARAJAN, ROHIT PRASAD,
RICHARD SCHWARTZ, KRISHNAKUMAR SUBRAMANIAN
8644611 Segmental rescoring in text recognition
SARA R. LEMLEY, JUAN E. SANDOVAL,
NICHOLAS I. SAPANKEVYCH
8645305 Assigning sensors to paths
ROBERT J. BENNETT, MICHAEL D. ERNEST,
FRANK L. SHACKLEE
8646374 Weapon station and associated method
DELMAR L. BARKER, JOHN WARREN BECK,
WILLIAM RICHARD OWENS
8647436 Carbon ion beam growth of isotopically-enriched
graphene and isotope-junctions
JAMES M. IRION II, KEVIN W. OMMODT,
RICHARD T. REMSKI
8648757 End-loaded topology for d-plane polarization
improvement
RICHARD S. JOHNSON
8648758 Wideband cavity-backed slot antenna
JASON G. MILNE, ALLEN WANG, FANGCHOU YANG
8648759 Variable height radiating aperture
ANGEL CRESPO, JAMES MASON, RAFAEL R. QUINTERO,
JOSEPH A. ROBSON, JONATHAN J. SCHMIDT,
JAMES S. WILSON
8651023 Hermetic covering system and method for a projectile
RICHARD M. WEBER, WILLIAM G. WYATT
8651172 System and method for separating components
of a fluid coolant for cooling a structure
HARRY A. ANDREAS, SHAUN L. CHAMPION,
KARRIE D. DOOLEY, PHILIP H. IVES, NORMAN C. LEE
8653377 Microelectronic assemblies
WILLIAM J. SCHMITT, JOHN VONG, RONALD O. WHITE
8653427 Digital semi-active laser receiver tracking of multiple
line-of-sight (LOS) objects
STEPHEN H. BLACK, MICHAEL A. GRITZ,
ADAM M. KENNEDY
8653467 Multichip packaging for imaging system
WILLIAM J. DAVIS, WARD G. FILLMORE,
ROBERT B. HALLOCK, JASON G. MILNE,
SUSAN C. TRULLI, YIWEN ZHANG
8653673 Method for packaging semiconductors at a wafer level
TIFFANY E. CASSIDY, DAVID D. HESTON, JON MOONEY,
CLAIRE E. MOONEY
8653907 Resonated bypass capacitor for enhanced performance
of a microwave circuit
SAMUEL S. BLACKMAN, KEIAN CHRISTOPHER,
ROBERT DEMPSTER, ROBERT A. ROSEN
8654005 Methods for resolving radar ambiguities
using multiple hypothesis tracking
A. VINCENT MRSTIK
8654016 Methods and apparatus for determining
parameters of an array
SCOTT E. ADCOOK, STAN W. LIVINGSTON
8654031 Plug-in antenna
DAVID MANOOGIAN, HENRY J. NIZKO,
MARK E. RUSSELL, MAURICE J. TOOLIN,
JONATHAN H. WALZER, WALTER G. WOODINGTON
8654197 System and method for occupancy detection
ERIC J. GRIFFIN, JOHN D. ISKER, WILLIAM B. KING,
CHAUNCHY F. MCKEARN
8654314 Rapidly deployable high power laser beam
delivery system
MICKY HARRIS, JEONG-GYUN SHIN
8654555 ROIC control signal generator
PAYAM SAISAN
8655079 Reducing false alarms in identifying whether
a candidate image is from an object class
8655091 Basis vector spectral image compression
THOMAS BROSKI, KEVIN L. LAUGHLIN
8655261 RF redirection module and system incorporating
the RF redirection module
JOHN R. MANNAS
8655619 System, method and software for estimating
a peak acceleration of an optical system
SANKARANARAYAN ANANTHAKRISHNAN
8655640 Automatic word alignment
ROSS E. TYLER
8655811 Method and system for data stream identification by
evaluation of the most efficient path through a transformation tree
DONALD R. KRETZ, BRUCE E. PEOPLES,
WILLIAM D. PHILLIPS, JUSTIN W. TOENNIES
8655882 Method and system for ontology candidate selection,
comparison and alignment
KENNETH D. CAREY, GREGORY LEEDBERG,
GEORGE W. SPENCER JR.
8655954 System and method for collaborative messaging
and data distribution
DANIEL GREGORY, JOHN-FRANCIS MERGEN
8657235 Space debris removal using upper atmosphere
ERIK T. DALE
8658955 Optical assembly including a heat shield to axially
restrain an energy collection system, and method
BRANDON W. BLACKBURN, KEVIN PERRY
8658978 Methods and apparatus for a radiation monitor
51
DALE M. RICKMAN
8659390 Method and system for generating a biometric
query plan
BEHZAD MOSLEHI, GREGORY RUDERMAN,
TERRY A. TRACY
8659422 Condition, health and usage monitoring system
WILLIAM CONEY, MICHAEL GOLDSMITH,
PETER KRUMHANSL, JASON MCKENNA, RICHARD MULLEN
8659424 Subsurface intrusion detection system
VERNON R. GOODMAN
8659747 Determining thresholds to filter noise in GmAPD
LADAR data
ROBERT W. BYREN, ROBIN A. REEDER
8660324 Textured pattern sensing using partial-coherence
speckle interferometry
8660360 System and method for reduced incremental
spectral clustering
WILLIAM T. BENGTSON, KEITH T. HAYATA
8660786 Positioning module
RYAN A. EGBERT, CHRISTOPHER L. HERNANDEZ
8662455 Spring clip retention systems suitable for usage within
vehicles and guided munitions
BRIAN GAUME, PATRICK E. MCCORMACK, JON E. PEOBLE
8662892 Universal hands-on trainer (UHOT)
JEFFREY SAUNDERS
8665013 Monolithic integrated circuit chip integrating
multiple devices
STAN W. LIVINGSTON
8665173 Continuous current rod antenna
DARIN S. WILLIAMS
8665334 Blur-calibration system for electro-optical sensors
and method using a moving multi-target constellation
KENRIC P. NELSON, ARJANG J. NOUSHIN
8681038 Radar data processing
JERRY M. GRIMM, JAMES A. PRUETT
8698508 Method and apparatus for detecting radome damage
JAMES J. HIROSHIGE, RANDALL R. ROJAS
8681041 System, method and filter for target tracking
in Cartesian space
BRANDON H. ALLEN, KEVIN W. CHEN,
WILLIAM P. HAROKOPUS, KERRIN A. RUMMEL,
GARY L. SEIFERMAN, RICHARD M. WEBER
8698691 Internal cooling system for a radome
ROBERT S. ISOM
8681064 Resistive frequency selective surface circuit for reducing
coupling and electromagnetic interference in radar antenna arrays
STEVEN D. JACOB, GERALD W. MEYER,
FARES NAJJAR, RICHARD D. ROSS
8681468 Method of controlling solenoid valve
JOHN T. CREWS
8682037 Method and system for thinning a point cloud
JAYSON KAHLE BOPP, SARAH L. PALMER
8701953 Electronic flight bag mounting system
LANCE R. REIDHEAD, RIC ROMERO
8683555 Systems and methods to prevent denial
of service attacks
ALEXANDER A. BETIN, DAVID A. ROCKWELL
VLADIMIR V. SHKUNOV
8705918 Multi-sectional fiber laser system with mode selection
LUKE M. FLAHERTY, RANDAL E. KNAR
8683681 Room temperature low contact pressure method
JOHN R. GOULDING
8706298 Temporal tracking robot control system
JOHN F. BUGGE, JOHN WILLEMS
8686328 Resettable missile control fin lock assembly
JOSEPH A. TURNER
8706854 System and method for organizing, managing and
running enterprisewide scans
JAMES F. ASBROCK, BRYAN W. KEAN, KANON LIU
8686766 Read out integrated circuit
BRENT MCCLEARY
8686892 Synthetic aperture radar chip level cross-range
streak detector
TIEN M. NGUYEN, JAMES C. THI
8687679 Datalink system architecture using OTS/COTS modem
for MIMO multipath sensing networks
HOWARD C. CHOE
8687844 Visual detection system for identifying objects within a
region of interest
ROBERT CAVALLERI, THOMAS A. OLDEN
8667776 Pellet-loaded multiple impulse rocket motor
HOWARD C. CHOE
8688614 Information processing system
GARY A. FRAZIER, BENJAMIN M. HOWE
8668384 System and method for detecting the temperature of an
electrophoretic display device
RICHARD A. MCGRAIL
8689942 Energy storage and release system
ERIC J. BEUVILLE, EDWARD P. SMITH,
GREGORY M. VENZOR
8669588 Epitaxially-grown position sensitive detector
ANTHONY PAUL BATA, KEN CRISMON,
RANDY LYLE ENGLE, DAVID KRAMER
8670374 Wireless mesh network with dynamic back off and
method of operation
BRADLEY FLANDERS, ERIC P. FRANS, IAN S. ROBINSON
8670628 Multiply adaptive spatial spectral exploitation
DAVID A. ROCKWELL, VLADIMIR V. SHKUNOV
8675694 Multi-media raman resonators and related system
and method
8675989 Optimized orthonormal system and method for
reducing dimensionality of hyperspectral images
JASON R. COFFMAN, LEE SOLOMON
8676406 Unmanned aerial vehicle control using a gamepad
JAIME ROBLEDO
8678756 System and method for re-building a pump
LUKE M. FLAHERTY, RANDAL E. KNAR,
TIFFANIE RANDALL
8680187 Water immiscible rosin mildly activated flux
DAVID M. DORIA
8681037 Performance model for synthetic aperture radar
automatic target recognition and method thereof
DOUGLAS J. ELIASON, KEVIN R. GREENWOOD,
SHAWN A. MILLER, MARK A. SCOTT
8701561 Projectile that includes a sensor to obtain
environmental data during launch from a cannon
JAMES N. HEAD, ERIC M. PALMER, ALADIN SAYED,
R. AILEEN YINGST
8682522 Systems and methods for triaging a plurality
of targets with a robotic vehicle
RYAN WERNICKE
8665600 Single sided feed circuit providing dual polarization
DEVON G. CROWE, DAVID G. JENKINS,
MEAD MASON JORDAN
8669460 System and methods for optimal light collection array
BRADLEY M. BIGGS, TIM B. BONBRAKE,
GEORGE D. BUDY, CHRISTOPHER M. SCHOTT
8701557 Shock hardened initiator and initiator assembly
STEPHEN JACOBSEN, FRASER M. SMITH
8690762 Transparent endoscope head defining a focal length
GEOFF HARRIS, DANIEL MITCHELL
8691064 Sputter-enhanced evaporative deposition apparatus
and method
EDWARD P. SMITH
8691614 Direct readout focal plane array
DAVID G. JENKINS, KENNETH G. PRESTON,
ARON TRAYLOR
8692172 Cold shield apparatus and methods
GARY D. COLEMAN, C. THOMAS HASTINGS JR.,
JAMES MCSPADDEN, WILLIAM J. MINISCALCO,
JOHN F. SILNY
8693947 Extensible high bandwidth global space
communication network
MICHAEL HOWARD, ALEXANDRO NIJAMKIN
8694446 Contingency planning system and method
ROBERT P. JOHNSON, THOMAS A. OLDEN
8695578 System and method for delivering a projectile
toward a target
JONATHAN PHILIP NIKKEL, ANTHONY K. TYREE
8698059 Deployable lifting surface for air vehicle
MARY K. HERNDON, RALPH KORENSTEIN,
CHAE DEOK LEE
8698161 Semiconductor structures having directly bonded
diamond heat sinks and methods for making such structures
WILLIAM E. HOKE, DANIEL P. RESLER
8698200 Gallium nitride for liquid crystal electrodes
CHRIS E. GESWENDER
8704699 Dipole based decoy system
GERALD L. BICKLE, SUSAN J. SILVER
8707277 Systems, methods, and language for SCA CORBA
descriptor files
GABOR DEVENYI
8707810 Leadscrew drive with annular-shell leadscrew
GARY A. FRAZIER
8708919 System and method for remotely sensing vital signs
ANDREAS HAMPP, BENGI HANYALOGLU,
SEAN F. HARRIS, TALIEH H. SADIGHI
8709949 System and method for removing oxide from
a sensor clip assembly
ZACHARY M. GAUBERT, LOREN W. RAPOPORT
8710794 Method and apparatus for a battery docking connector
having reserve power for hot battery swap
GENE GOLDSTEIN, MATTHEW P. ROSINSKI,
MICHAEL W. WHITT
8711030 Single-pass Barankin estimation of scatterer
height from SAR data
STEVEN J. MANSON, TARA L. TRUMBULL
8711210 Facial recognition using a sphericity metric
GLENN COLLINS, DALE FLOWERS, ANDREW VENNEMAN
8711910 Opportunistic modem
ALAN CURTIS, PAUL J. REMINGTON, ISTVAN VER
8712070 Simultaneous enhancement of transmission loss
and absorption coefficient using activated cavities
CONRAD STENTON
8713845 Method and apparatus for efficiently
collecting radiation
JAMES H. DUPONT, SEAN WHITMARSH
8713912 Solid propellant rocket motors employing tungsten
alloy burst discs and methods for the manufacture thereof
JACK W. REANY, TERRY M. SANDERSON
8714476 Aircraft wing with flexible skins
LACY G. COOK
8714760 All reflective real pupil telecentric imager
ROBERT E. MUNGER
8714859 Clamping assembly that acts as an interface between
two components
JAMES T. ERDMANN, MICHAEL E. GIBSON
8714919 Inlet and exhaust system
HOWARD M. DE RUYTER
8716651 Calibration system for detector
BRANDON W. BLACKBURN, BRUCE W. CHIGNOLA,
ANTHONY G. GALAITSIS, BERNARD HARRIS,
MICHAEL V. HYNES, ERIK D. JOHNSON
8716670 Methods and apparatus for integrated neutron/gamma
detector
AMIN G. JAFFER
8730092 Multistatic target detection and geolocation
MILAN CHUKEL, THOMAS G. LAVEDAS, CRAIG E. MATTER
8717242 Method for controlling far field radiation
from an antenna
RAYMOND A. MAGON, ROBERT MARCHANT,
JOHN F. MASIYOWSKI, MICHAEL O. TIERNEY
8730871 System and method for providing voice communications
over a multi-level secure network
JAMES A. CARR, JOHN A. CROCKETT JR.,
THOMAS C. DA VEIGA, JOHN HADDEN IV, ROHN SAUER,
STEVEN E. BRADSHAW, LONNY R. WALKER,
ROBERT G. YACCARINO
8717243 Low profile cavity backed long slot array antenna
with integrated circulators
STEPHEN JACOBSEN, DAVID MARCEAU
8717428 Light diffusion apparatus
KIRK A. MILLER
8717692 Optical switching system
DAVID G. MANZI
8718119 Spread-carrier self-detecting code receiver with
summed delay processing and methods for signal acquisition and
detection
DARIN S. WILLIAMS
8730518 Application of color imagery to a rewritable
color surface
ROBERT W. BYREN, DAVID FILGAS, WILLIAM B. KING
8731013 Linear adaptive optics system in low power beam path
and method
STEPHEN JACOBSEN, BRIAN MACLEAN, MARC OLIVIER
8731716 Control logic for biomimetic joint actuators
LOWELL A. BELLIS, ROBERT C. HON, CYNDI H. KESLER
8733112 Stirling cycle cryogenic cooler with dual coil single
magnetic circuit motor
RICHARD C. HUSSEY, MICHAEL A. LEAL,
KENNETH G. PRESTON, RONDELL J. WILSON
8735788 Propulsion and maneuvering system with axial
thrusters and method for axial divert attitude and control
STEVEN T. CUMMINGS, THOMAS KURIEN
8718323 Batch detection association for enhanced target
discrimination in dense detection environments
STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH,
ADAM M. KENNEDY, THOMAS ALLAN KOCIAN
8736045 Integrated bondline spacers for wafer level packaged
circuit devices
THOMAS E. WOOD, PAUL R. WORK
8719065 System and method for maximizing the value of
allocation of processes to resources within an operational system
MICHAEL G. ADLERSTEIN
8737838 Embedded optical waveguide feed structure for radio
frequency antenna arrays
GERALD L. BICKLE, SUSAN J. SILVER
8719813 Optimized SCA CORBA descriptor for SCA CORBA
descriptor files
DARIN S. WILLIAMS
8738678 Methods and systems for determining an enhanced
rank order value of a data set
REX L. HAZELET, DAVID C. HOLBROOK, ADAM D. MIELKE
8719824 Dynamically configurable command and control
systems and methods
RICHARD AMES
88739676 Vertical occupant blast isolation system
STEPHEN JACOBSEN, TOMASZ J. PETELENZ,
STEVEN N. PETERSON
8721559 Non-invasive method and device for measuring
cardiac output
PAUL DRYER, DALE ROBERTSON,
STEVEN WEEKS
8742976 Power management for a radar system
and ad hoc node device
JOHN S. BRYAN, BRETT E. MEYER
8745174 Thin client for mapping system
RIGEL QUINN WOIDA-O’BRIEN
8755023 Grey-scale holographic structure and system
for generating a millimeter-wave collimated wavefront
in a compact range
JOHN F. MCGEE III
8756391 Multi-level security computing system
DEREK L. BUDISALICH, GEORGE D. BUDY,
ERIK A. FJERSTAD
8757065 Methods and apparatus for integrated locked
thruster mechanism
LEO LUDWICK, CRAIG H. MCCORDIC
8757246 Heat sink and method of making same
ROBERT S. BRINKERHOFF, JAMES M. COOK,
MICHAEL J. MAHNKEN
8757486 Methods and apparatus for intercepting a projectile
8757601 Damped split beam structural member with
segmented beam parts
LACY G. COOK, BRYCE WHEELER
8759735 Multi-function airborne sensor system
IAN S. ROBINSON
8759773 Infrared spectrometer with enhanced readout speed
JAVIER GARAY, QING JIANG, JON N. LEONARD,
CENGIZ OZKAN, HAO XIN
8759811 Particle encapsulated nanoswitch
TAMRAT AKALE
8760243 Tunable bandpass filter
JEFFREY J. BECKER, JAMES E. HENRY, LEE M. SAVAGE,
DAVID WILSON
8761233 Wideband low latency repeater and methods
JONATHAN HABIF
8761606 Systems and methods for quantum illumination
detection for optical communications and target detection
GLENN R. KAUFMAN
8762734 Biometric pressure grip
FREDERICK B. KOEHLER, WARD D. LYMAN
8764286 Shape memory thermal sensors
RANDALL S. BROOKS, JONATHAN D. GODING
8745385 System and method for protecting data with multiple
independent levels of security
THOMAS BRENNAN, LARRY L. LAI, KYLE W MAXHIMER,
CLIFTON QUAN, ROBERT BRETT WILLIAMS,
FANGCHOU YANG
8766875 Lightweight stiffener with integrated RF cavity-backed
radiator for flexible RF emitters
LARRY M. TICHAUER
8747328 Continuous blood pressure monitoring
JEAN-PAUL BULOT, ROBERT J. CODA, MATTHEW J. KLOTZ
8767187 Doppler compensation for a coherent ladar
KENT P. PFLIBSEN, CASEY T. STREUBER
8748801 Discrete wavefront sampling using a variable
transmission filter
DAVID D. CROUCH
8767192 Active retrodirective antenna array with a virtual
beacon
ZHEN-QI GAN
8725649 System and method to protect computer software
from unauthorized use
RONALD G. HEGG, WILLIAM B. KING,
CHAUNCHY F. MCKEARN, PETER V. MESSINA
8748857 System for automatic alignment, stabilization,
and focus for an off-axis telescope using biased angle sensors
LLOYD J. LEWINS, KENNETH E. PRAGER, PHILIP T. SHIMON
8767193 Doppler tracking in presence of vehicle velocity
uncertainty
SAAD KARIM, RICHARD J. KENEFIC, DAVID W. SHIN
8726063 Systems and methods providing output sample
frequency determinism by calculating a delay with a wall clock
and using a timer to compensate for the delay
DARIN S. WILLIAMS
8749640 Blur-calibration system for electro-optical sensors and
method using a moving multi-focal multi-target constellation
CARLOS R. COSTAS, CHRISTOPHER R. ECK
8722375 Algal cell lysis and lipid extraction using
electromagnetic radiation-excitable metallic nanoparticles
THOMAS G. LAVEDAS
8723649 Antenna for protecting radio frequency communications
JONATHAN COMEAU, MATTHEW A. MORTON,
EDWARD WADE THOENES
8724739 Variable phase shifter-attenuator
PAUL H. GROBERT, WILLIAM K. WALLACE
8724760 GPS aided open loop coherent timing
8727079 Structural member with clamping pressure mechanism
GARY L. FOX, JUSTIN C. JENIA, CHRISTOPHER E. TOAL
8727279 Method and system for controlling swaying of an object
MICHAEL S. ALKEMA, JAMES A. EBEL,
ANDREW B. FACCIANO, MIKE J. SAXTON,
ROBERT D. TRAVIS
8729443 Projectile and method that include speed adjusting
guidance and propulsion systems
JONATHAN FISHER, STEPHEN MILLIGAN, JASON REDI,
DANIEL SUMOROK, STEVEN WEEKS
8730088 Radar coherent processing interval scheduling
via ad hoc network
HARSHA MODUR SATHYENDRA, BRYAN D. STEPHAN
8730091 Target identification for a radar image
MARTIN S. DENHAM
8750060 Repair device and method for integrated circuit
structured arrays
JOHN J. LIPASEK, SCOTT A. SCHILLING,
ROBERT SEDLMEYER
8752066 Implementing a middleware component using
factory patterns
WILLIAM J. DAVIS, PAUL DUVAL, KAMAL TABATABAIE
8754421 Method for processing semiconductors using a
combination of electron beam and optical lithography
JAMES D. KUENEMAN, ROBERT MAUSS, JEFF L. VOLLIN
8754619 Multiphase power converter
MICHAEL R. PATRIZI
8754697 Hybrid dual mode frequency synthesizer circuit
JOHN T. CREWS, VERNON R. GOODMAN
8768068 Automated building detecting
RICHARD AMES, CRAIG L. WITTMAN
8770110 Selectable yield warhead and method
WILLIAM D. BEAIR, ERIC GILLEY, MICHAEL RAY WILLIAMS
8770462 Solder paste transfer process
EDUARDO M. CHUMBES, WILLIAM E. HOKE,
KEVIN MCCARTHY, KAMAL TABATABAIE
8772786 Gallium nitride devices having low ohmic contact
resistance
BORIS S. JACOBSON, EDWARD JUNG
8773231 Multiphase power converters involving controllable
inductors
WASSIM S. HABIB, TONI S. HABIB
8773264 Intrusion detection and tracking system and related
techniques
SALVATORE BELLOFIORE, DAVID J. KNAPP,
ALPHONSO A. SAMUEL, GLAFKOS K. STRATIS
8773300 Antenna/optics system and method
53
ROBERT D. STULTZ
8774235 System and method for suppressing parasitics in an
optical device
JOHN S. LEAR, JOHN E. STEM, KENNETH W. WRIGHT
8775529 Bridging communications between communication
services using different protocols
WALID A. AL-MASYABI, ROBERT J BORK,
MATTHEW E. BROWN
8775651 System and method for dynamic adaptation service
of an enterprise service bus over a communication platform
MONTY D. MCDOUGAL
8776242 Providing a malware analysis using a secure malware
detection process
JOHN P. HIGBY
8776968 Cable reel axle shaft with integrated radio frequency
rotary coupling
STEPHEN R. CHRISTENSEN
8779278 Air supported photovoltaic system
MARTIN S. DENHAM
8779342 Compact digital pixel for a focal plane array
ROBERT W. BYREN
8780182 Imaging system and method using partial-coherence
speckle interference tomography
PAUL A. DANELLO, MICHAEL D. GOULET,
RICHARD A. STANDER
8780561 Conduction cooling of multi-channel flip chip based
panel array circuits
ANDREW KENT, THOMAS OHKI
8780616 Magnetic memory system and methods in various
modes of operation
MATTHEW T. CASHEN, TODD O. CLATTERBUCK,
GABRIEL PRICE, JEFFREY L. SABALA,
STEVEN R. WILKINSON
8780948 Precision photonic oscillator and method for generating
an ultra-stable frequency reference using a two-photon rubidium
transition
DAVID M. DORIA
8781992 System and method for scaled multinomial-dirichlet
bayesian evidence fusion
8783185 Liquid missile projectile for being launched from a
launching device
HARRY MARR, RALSTON S. ROBERTSON, RONAK D. SHAH
8791849 Digital clock update methodology for multi-nyquist
constructive intereference to boost signal power in radio frequency
transmission
ROBERT W. BYREN, CHUNGTE CHEN, LACY G. COOK,
WILLIAM B. KING
8792163 Low order adaptive optics by translating secondary
mirror of off-aperture telescope
BOGART VARGAS
8793792 Time-key hopping
8794262 Quantum fluid transfer system
GERALD L. BICKLE
8813092 Corba embedded inter-orb protocol (EIOP)
DAVID H. ALTMAN
8797741 Maintaining thermal uniformity in micro-channel cold
plates with two-phase flows
NABIN C. PANDA, CARL W. TOWNSEND,
8814149 Humidity generator
JERRY M. GRIMM, RAYMOND SAMANIEGO
8798359 Systems and methods for image sharpening
JOSE M. GUTIERREZ, WILLIAM T. JENNINGS
8798385 Suppressing interference in imaging systems
SALLY A. CHAMBLESS, ANTHONY J. DELROCCO,
8798989 Automated content generation
SAMUEL S. BLACKMAN STEPHEN A. CAPPARELLI,
DOUGLAS E. CARROLL, RACHEL B. NORMAN,
STEFAN SCHWOEGLER
8799189 Multiple hypothesis tracking
MICHAEL K. BURKLAND, ROBERT RINKER,
DARRELL R. ROGERS, BYRON B TAYLOR,
CHRISTOPHER THOMAS
8800870 Short-wave infrared based scope
TERYN DALBELLO, JOHN M. HITNER, JUSTIN C. JENIA,
MICHAEL A. LEAL, PHILIP W. PAGLIARA
8800913 Methods and apparatus for a tandem divert and
attitude control system
LACY G. COOK
8801202 Pointable optical system with coude optics having a
short on-gimbal path length
PREMJEET CHAHAL, FRANCIS J. MORRIS
8803314 Hermetic packaging of integrated circuit components
LEONARD D. VANCE
8783622 Methods and apparatus for a grappling device
DAMON C. TURNER, BRETT J. YOUNG
8803731 Target-tracking radar and method for responding to
fluctuations in target SNR
RICHARD S. JOHNSON
8786509 Multi polarization conformal channel monopole
antenna
WILLIAM E. STERNS
8787567 System and method for decrypting files
PETER A. KRUMHANSL, DAVID H. WHITTEMORE
8804463 Seismic source/receiver probe for shallow seismic
surveying
VERNON R. GOODMAN, REBEKAH MONTGOMERY,
STEVEN B. SEIDA
8805075 Method and apparatus for identifying a vibrometry
spectrum in imaging applications
8805115 Correction of variable offsets relying upon scene
GABRIEL PRICE, STEVEN R. WILKINSON
8787767 High-speed low-jitter communication system
DOUGLAS E. FULLMER, DANIEL A. HANEVICH,
STEVEN L. KAUFMAN, LEE M. SAVAGE, JACK E. WHITE
8805297 Band stitching electronic circuits and techniques
JEAN-PAUL BULOT, MATTHEW J. KLOTZ
8787768 Method and apparatus for synthesizing and correcting
phase distortions in ultra-wide bandwidth optical waveforms
AARON ADLER, JACOB BEAL, NOAH JUSTIN DAVIDSOHN,
RONALD WEISS, FUSUN YAMAN SIRIN
8809057 Methods of evaluating gene expression levels
EMERALD J. ADAIR, GRAY FOWLER
8789268 System for forming a frequency selective pattern
DAVID H. ALTMAN, STEVEN D. BERNSTEIN,
ROBERT P. MOLFINO, ERIK F. NORDHAUSEN,
STEVEN B. WAKEFIELD
8809208 Nano-tube thermal interface structure
FREDERICK B. KOEHLER, WARD D. LYMAN
8789366 Shape memory stored energy assemblies and methods
for using the same
KALIN SPARIOSU
8790440 Forming spherical semiconductive nanoparticles
BENJAMIN L. CANNON, BYRON B. TAYLOR
8810468 Beam shaping of RF feed energy for reflector-based
antennas
QIN JIANG, TROY ROCKWOOD
8811156 Compressing n-dimensional data
MARTIN S. DENHAM
8803555 Apparatus and method for decoding an address in two
stages
GREGARY B. PRINCE
8786472 Low complexity non-integer adaptive sample rate
conversion
SCOTT R. CHEYNE, JOSEPH R. ELLSWORTH,
MICHAEL P. MARTINEZ, CRAIG H. MCCORDIC,
JEFFREY PAQUETTE
8810448 Modular architecture for scalable phased array radars
PAUL H. BARTON, RAYMOND R. BESHEARS,
BERNARD D. HEER, CARL KIRKCONNELL,
ROBERT R. OGDEN, BRADLEY A. ROSS
8794016 Monitoring the health of a cyrocooler
MICHAEL S. CHERRY, JACK W. REANY,
TERRY M. SANDERSON
8783604 Aircraft wing with knuckled rib structure
MICHAEL WEBB, AARON WHITE
8786277 Environmental noise reduction for magnetometry
STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH,
THOMAS ALLAN KOCIAN
8809784 Incident radiation detector packaging
THOMAS A. OLDEN, WALTER WRIGGLESWORTH
8809689 Systems and methods for composite structures with
embedded interconnects
STEVEN B SEIDA
8811720 3D visualization of light detection and ranging data
JOHN P. BETTENCOURT
8816184 Thermoelectric bias voltage generator
DANIEL P. JONES
8816220 Enclosure cooling apparatus
KYLE DAVID ANDRINGA, RICHARD E. HINDMAN,
DARRELL B. RIDGELY
8816260 Flight-control system for canard-controlled flight
vehicles and methods for adaptively limiting acceleration
JESSE H. BLAKE, MATTHEW GLENN MURPHY,
8816261 Bang-bang control using tangentially mounted surfaces
BRETT J. YOUNG, JASON A. JOHNSON
8816895 Target-tracking radar classifier with glint detection and
method for target classification using measured target epsilon and
target glint information
THEAGENIS J. ABATZOGLOU,
JOHAN ENMANUEL GONZALEZ, JOEL K. MCWILLIAMS,
RAYMOND SAMANIEGO
8816896 On-board INS quadratic correction method using
maximum likelihood motion estimation of ground scatterers
from radar data
THEAGENIS J. ABATZOGLOU, KENNETH HO, LEO H. HUI
8816899 Enhanced target detection using dispersive vs nondispersive scatterer signal processing
DONALD F. KING
8817136 Image processing utilizing spatially-displaced
image data
DAVID G. ANTHONY, ROBERT STEIN
8817352 Optical switching assembly with over-center lock
JERRY R. HINSON
8817913 Digital filter-decimator-tuner
CHET L. RICHARDS
8818133 Point cloud construction with unposed camera
JAMES E. HARDIN, JEREMY H. HOCHSTEDLER,
BRIAN W. SNODGRASS
8818284 Dynamic spectrum access for networked radios
DOUGLAS P. GUGLER, PATRICK S. LEWIS
8818295 High and low speed serial interface multiplexing circuit
SARA R. LEMLEY, JUAN E. SANDOVAL,
NICHOLAS I. SAPANKEVYCH
8818712 Maritime path determination
ROBERT T. NARUMI, PARVIZ SAGHIZADEH
8818741 Method of detecting changes in integrated circuits
using thermally imaged test patterns
JACKSON Y. CHIA, HOWARD K. LUU
8819507 Field programmable gate arrays with built-in self test
mechanisms
ALEXANDRA CINTRON-APONTE, JOSE R. VAZQUEZ
8820390 Methods and composition for boride distribution in
metal matrix composite
BRIAN W. JOHANSEN
8821095 Screw assembly and method for component stacking
tolerance control
WILLIAM E. HOKE
8823146 Semiconductor structure having silicon devices,
column III-nitride devices, and column iii-non-nitride or column
II–VI devices
BUU DIEP, ROLAND GOOCH, THOMAS ALLAN KOCIAN
8844793 Reducing formation of oxide on solder
OLEG BROVKO, ALISON KIM, TUAN V. NGUYEN,
TRUNG T. NGUYEN
8823573 System and method for reconstruction of sparse
frequency spectrum from ambiguous under-sampled time
domain data
SAIKAT GUHA
8849124 Boundless reading of information bits with a single
photon
LACY G. COOK
8824055 Refractive optics with broad spectral coverage
LEONARD D. VANCE
8825399 System and method of passive and autonomous
navigation of space vehicles using an extended Kalman filter
THOMAS A. OLDEN, WALTER WRIGGLESWORTH
8826640 Flight vehicles including electrically-interconnective
support structures and methods for the manufacture thereof
8828028 Suture device and method for closing a planar opening
ROBERT RINKER
8829404 Multi-mode seekers including focal plane array
assemblies operable in semi-active laser and image guidance
modes
YUEH-CHI CHANG
8830139 Integrated window for a conformal hybrid EO/RF
aperture
MICHAEL R. HLAVEK, ROY P. MCMAHON,
ANDREW L. NELSON
8833225 Bomb rack lock
BENJAMIN J. VENEMA
8833231 Unmanned range-programmable airburst weapon
system for automated tracking and prosecution of close-in targets
JAMES A. PRUETT, GARY SCHWARTZ, WILLIAM G. WYATT
8833438 Multi-orientation single or two phase coldplate with
positive flow characteristics
TONI S. HABIB, WASSIM S. HABIB, TEH-KUANG LUNG
8836344 Intrusion detection and tracking system
JULIA KARL, LLOYD J. LEWINS, HARRY MARR,
KENNETH E. PRAGER, MICHAEL VAHEY
8836372 Minimizing power consumption in asynchronous
dataflow architectures
NEIL R. NELSON, STEVEN R. WILKINSON,
8836405 System and method for synchronizing a local clock
with a remote clock
TONY M. PONSFORD, PETER SCARLETT,
GREGORY WESTFALL
8836570 Systems and methods for extending maritime domain
awareness by sharing radar tracks between vessels
MARTIN STERN
8837652 Receiver synchronization in radio communication
systems employing transmit diversity
CHRISTOPHER T. HIGGINS, JAMES J. RICHARDSON,
JOSEPH SILVA
8838362 Low-drain, self-contained monitoring device
TERESA R. BIEDA, MATTHEW J. HICKS
8838951 Automated workflow generation
DARIN J. DERITA, RANDY S. JENNINGS,
JESSE J. LEE, MONTY D. MCDOUGAL, WILLIAM E .STERNS
8839434 Multi-nodal malware analysis
DAVID A. HULL
8848290 Thermal wake control
8849457 Contact displacement actuator system
RICARDO J. RODRIGUEZ, MARK VOLPE
8850043 Network security using trust validation
DANIEL SIEVENPIPER, MICHAEL WECHSBERG,
FANGCHOU YANG
8853528 Radio frequency transparent photovoltaic cell
JOHN P. BETTENCOURT, KELLY P. IP, VALERY S. KAPER,
JEFFREY R. LAROCHE, KAMAL TABATABAIE
8853745 Silicon based opto-electric circuits
JOHN P. HARRELL, GEOFFREY LONG,
MICHAEL L. MENENDEZ
8853906 Optical element switching system using a halbach array
JOHN P. BETTENCOURT, FRANK J. DECARO,
JOHN C. TREMBLAY
8854140 Current mirror with saturated semiconductor resistor
GREGORY M. FAGERLUND, KAREN A. RAPOZA,
JACK J. SCHUSS, THOMAS V. SIKINA
8866686 Methods and apparatus for super-element phased
array radiator
FRANCOIS Y. COLOMB, MATTHEW C. TYHACH
8867226 Monolithic microwave integrated circuits (MMICs)
having conductor-backed coplanar waveguides and method of
designing such MMICs
FRANK N. CHEUNG
8868881 Data translation system and method
JEFFREY H. KOESSLER, PAUL A. MEREMS,
TIMOTHY A. MURPHY, DENNIS E. ROSSMEIER,
ZACHARY WILLIAMSON
8869671 Aircraft device deployment system with spring-driven
mechanical linkage
MICHAEL K. BURKLAND
8872111 Infrared spatial modulator for scene-based nonuniformity image correction and systems and methods related
thereto
DAVID CURE, PAUL A. HERZIG, SERGIO MELAIS,
TOM WELLER
8872725 Electronically-tunable flexible low profile microwave
antenna
JAYSON KAHLE BOPP, MARTIN G. FIX, JOHN BEDINGER
8854829 Standoff mounting system
ANDREW BRUINSMA, ERIC KURT MOORE
8872766 System and method for operating a helmet
mounted display
JOHN BEDINGER, MICHAEL A. MOORE, JOHN R. MOORE
8857050 Methods of making an environment protection
coating system
KAISER SIDDIQUI
8874288 Adding weather icon to electronic flight strips
JOHN R. MOORE, RANDALL W. ZYWICKI
8861106 Variable monochromatic uniform calibration source
PRADEEP NATARAJAN, PREMKUMAR NATARAJAN,
ROHIT PRASAD, SHIV VITALADEVUNI
8861872 Image analysis using coefficient distributions with
selective basis feature representation
MONTY D. MCDOUGAL
8875220 Proxy-based network access protection
WILLIAM E. STERNS
8875293 System, method, and logic for classifying
communications
JAMES J. RICHARDSON
8862395 Coded marker navigation system and method
ROBERT D. TRAVIS
8878110 Projectile that includes propulsion system and launch
motor on opposing sides of payload and method
JOSEPH T. DEMARCO
8862925 Pseudo synchronous serial interface synchronization
method
PETER FISHER-EXT, SUSAN N. GOTTSCHLICH,
TIMOTHY J. IMHOLT
8878138 Multi-sensor neutron source location system
NICHOLAS A. ALMONTE, WILLIAM STUBBS
8863015 Multi-monitor multi-JVM JAVA GUI infrastructure
with layout via XML
JOEL C. BLUMKE, CHRISTIAN MALDONADO-ECHEV,
CHRISTIAN MALDONADO-ECHEV, RAY S. SKAGGS,
LAWRENCE W. TIFFIN
8878575 Noise reduction for non-linear transmission line (NLTL)
frequency multiplier
RAYMOND A. MAGON, ROBERT MARCHANT,
JOHN F. MASIYOWSKI, MICHAEL O. TIERNEY
8863270 User interface for providing voice communications over
a multi-level secure network
JEFFREY C. BROWN, KEVIN L . CARIKER, MICHAEL K. DALY,
DARIN J. DERITA, RANDY S. JENNINGS, JESSE J. LEE,
MONTY D. MCDOUGAL, BRIAN N. SMITH,
WILLIAM E. STERNS
8863279 System and method for malware detection
KEVIN P. BOWEN, KENNETH C. HOLMBOE,
WILLIAM E. KOMM
8863520 Method and apparatus for an external combustion
engine having a steam generator
KURT P. STIFFEL
8863520 Method and apparatus for an external combustion
engine having a steam generator
DAVID H. ALTMAN, SCOTT R. CHEYNE, ANURAG GUPTA
8839519 Method of making cold chassis for electronic modules
FREDERICK B. KOEHLER, JACK W. REANY,
TERRY M. SANDERSON
8864065 Chord-expanding air vehicle wings
ERIC C. FEST, PAGE E KING, MICHAEL P. SCHAUB
8842216 Movable pixelated filter array
CHRIS E. GESWENDER
8866057 Fin deployment method and apparatus
BRADLEY FLANDERS, IAN S. ROBINSON,
8842937 Spectral image dimensionality reduction system
and method
ROBERTO W. ALM
8866291 Flip-chip mounted microstrip monolithic microwave
integrated circuits (MMICs)
JOHN P. PEHOWICH, GREGARY B. PRINCE,
GEORGE M. VACHULA
8843156 Discovering and preventing a communications
disruption in a mobile environment
STEVEN COTTEN, LUIS GIRALDO, AARON A. RENNER
8866618 Mine personnel carrier integrated information display
CHRISTOPHER B. GROUNDS, DENNIS MIN
8878686 Maintainer spotlighting
DOUGLAS M. KAVNER, JAMES J. RICHARDSON
8878927 Method and apparatus for generating infrastructurebased basic safety message data
CHAD E. BOYACK, REAGAN BRANSTETTER,
BRENDON R. HOLT, KEVIN R. HOPKINS
8879254 Methods and apparatus for compact active cooling
TIMOTHY T. PETERSON
8879793 Synthetic aperture radar map aperture annealing and
interpolation
BRIG ELLIOTT
8880896 Systems and methods for medium access control with
key agreement
PETER C. COLBY, PETER FISHER-EXT, TIMOTHY J. IMHOLT
8884234 Portable directional device for locating neutron emitting
sources
BRYAN FAST, DAVID D. HESTON, JON MOONEY
8884700 Integrated circuit chip temperature sensor
LESLIE A. PRIEBE, RAYMOND SAMANIEGO,
ENRIQUE A. SANTIAGO, JOHN L. TOMICH
8884805 Systems and methods for mapping the crust
of the Earth
55
HYONG E. BANG, JERRY M. GRIMM, LESLIE A. PRIEBE,
RAYMOND SAMANIEGO, JOHN L. TOMICH
8884806 Subterranean radar system and method
JASON J. BRAUN, TODD LOVELL, ERIC KURT MOORE,
JAMES A. NEGRO, MICHAEL RAY
8902085 Integrated 3D audiovisual threat cueing system
STEPHEN H. BLACK, ROBERT F. BURKHOLDER,
MICHAEL A. GRITZ, BORYS PAWEL KOLASA
8884815 Antenna-coupled imager having pixels with integrated
lenslets
LACY G. COOK
8902498 Broad spectral telescope
RICHARD A. POISEL
8884820 Receiving station and methods for determining an
angle-of-arrival of short-duration signals using surface-acousticwave (SAW) devices
TIMOTHY E. CABER
8885044 Methods and apparatus for detecting a target
PHILIP C. THERIAULT
8885263 Optical zoom lens system
PATRICK M. PETERSON
8885798 Systems and methods for presenting end to end calls
and associated information
VERNON R. GOODMAN
8885883 Enhancing GMAPD ladar images using 3-D wallis
statistical differencing
SAADYA. MAHMOOD
8886137 Frequency tunable transmit/receive (TX/RX) antenna
switch
LUKE M. FLAHERTY, RANDAL E. KNAR, TIFFANIE RANDALL
8887981 Temporary adhesive for component bonding
MARTIN S. DENHAM
8890052 Shift register with two-phase non-overlapping clocks
8890072 Advance spatial and spectral target generation for
hardware in the loop systems
GARY F. WAHLQUIST, KUANG-YUH WU
8890745 RF gun barrel detection system
GLENN COLVIN JR., STEPHEN JACOBSEN,
JOHN MCCULLOUGH, FRASER M. SMITH
8892258 Variable strength magnetic end effector for lift systems
CHRISTOPHER KOLLER, GARY SMITH,
MICHAEL STAHLBERG, JOSEPH. WHITE
8893130 Task scheduling method and system
DAVID W. HOMES
8893593 Tool for deforming threads at a particular location on a
fastener
RYAN J. KOLLER, W. ROYCE ROYCE TAYLOR IV
8893761 Method and apparatus to improve reel feeder efficiency
ABBAS TORABI
8895925 Electromagnetic interference protection structure
KENNETH W. BROWN, JAMES R. GALLIVAN,
WILKIE M. PHILLIPS, DAVID R. SAR
8896701 Infrared concealed object detection enhanced with
closed-loop control of illumination by.mmw energy
LEE M. SAVAGE, RONAK D. SHAH
8903029 Monobit receiver spurious harmonics control method
and system
CHRISTOPHER T. HIGGINS, JAMES J. RICHARDSON
8903640 Communication based vehicle-pedestrian collision
warning system
JAMES A. COVELLO, TORMOD FRETHEIM,
DAVID LARACUENTE
8903654 Non-causal attitude estimation for real-time motion
compensation of sensed images on a moving platform
8917375 Grey-scale holographic structure and system for
generating a millimeter-wave collimated wavefront in a compact
range
RICHARD H. BELANSKY, RICHARD P. HSIA,
HAROLD A. PRATT, CECIL VERGEL DE DIOS
8917996 Simplified serial data over optical fiber for remote
receiver/sensor applications
CHRIS E. GESWENDER, RICK WILLIAMS
8919256 Obturator ring with interlocking segments
DANIEL GREGORY, JOHN-FRANCIS MERGEN
8919702 Space debris removal using upper atmosphere
GREGORY L. KLOTZ, KELLY L. LEE, GEOFFREY LONG,
ANJALI RANGASWAMY
8919724 Mount for cryogenic fast switching mechanism
JOHN C. BODENSCHATZ, ROGER L. BRANSON,
CHERYL R. ERICKSON, TIMOTHY N. JAHREN,
JOHN J. LIPASEK, PAULA C. MOSS
8904338 Predicting performance of a software project
ETHAN S HEINRICH, STEPHEN E. SOX,
ALBERTO F. VISCARRA, JENNIFER WENSEL
8920091 Fastener with bilateral seal for liquid immersion
cooling applications
CASEY T. STREUBER
8907288 Digitally scanned multi-cell electro-optic sensor
CHRISTOPHER R. KOONTZ, JASON G. MILNE, TSE E. WONG
8921992 Stacked wafer with coolant channels
ERNEST P. CARAMANIS, ROGER L. CLARK
8907734 Passive and active suppression of vibration induced
phase noise in oscillators
MICHAEL J. BIANCHINI, DAVID D. COFFIN, TERRY J. KIRN
8907842 Method and apparatus for attenuating a transmitted
feedthrough signal
MARCUS A. EVANS, DEBBIE A. WALKER
8909914 Controller and a method for controlling a boot process
SHANNON V. DAVIDSON, ANTHONY RICHOUX
8910175 System and method for topology-aware job scheduling
and backfilling in an HPC environment
DONALD P. COX, BRADLEY M. GAUL, MICHAEL J. HOLT,
ROBERT W. KNOX, SCOTT G. MARTIN, DARREN C. SMITH,
MICHAEL D. STOKES, DEREK S. WALL
8910557 Payload deployment system and method
MICHAEL L. BREST, ERIC J. GRIFFIN,
KENNETH L. MCALLISTER, JEFFREY P. YANEVICH
8911163 Variable aperture mechanism for cryogenic
environment, and method
MARC BERTE
8912493 High resolution thermography
SCOTT E. ADCOOK
8912950 Interference mitigation in through the wall radar
THEAGENIS J. ABATZOGLOU, TIMOTHY CAMPBELL
8912951 Moving target detection using a two-dimensional
folding approach
STEPHEN J. SCHILLER, JOHN F. SILNY
8913243 Polarimetric calibration of a remote sensor
ROBERT T. NARUMI
8922401 Methods and apparatus for interference canceling data
conversion
RUSSELL W. LAI, JEFFERY JAY LOGAN, RYAN D. RETTING,
WILLIAM RUDNISKY, ROBERT E. VITALI
8922419 Jam assignment manager
IAN S. ROBINSON
8923401 Hybrid motion image compression
MICHAEL GEILE
8923437 Non-contiguous spectral-band modulator and method
for non-contiguous spectral-band modulation
CHET L. RICHARDS
8923558 Moving object detection using stereo rectified images
acquired from a moving aircraft
JAR J. LEE, VICTOR S. REINHARDT, FANGCHOU YANG
8923924 Embedded element electronically steerable antenna for
improved operating bandwidth
International Patents
Issued to Raytheon
Titles are those on the U.S.-filed patents; actual
titles on foreign counterparts are sometimes modified
and not recorded. While we strive to list current international patents, many foreign patents issue much later
than corresponding U.S. patents and may not yet
be reflected.
DAVID A. ROCKWELL, VLADIMIR V. SHKUNO
8896910 Compact raman generator with synchronized pulses
ABDULLAH EROGLU, ROBERT J. SMITH
8913693 Quadrature modulator balancing system
JAMES J. DWULIT, BRADLEY FLANDERS, IAN S. ROBINSON,
C. RALPH WATERS
COREY J. COLLARD, VERNON R. GOODMAN
8913784 Noise reduction in light detection and ranging based
imaging
AUSTRALIA
JAMES J. DWULIT, BRADLEY FLANDERS, IAN S. ROBINSON,
C. RALPH WATERS
GARY D. COLEMAN, C. THOMAS THOMAS HASTINGS JR.,
JOHN F. SILNY, DUANE SMITH
8913894 High-bandwidth optical communications relay
architecture
ANDREW B. FACCIANO, RICHARD A. MCCLAIN JR.,
ROBERT T. MOORE, CRAIG SEASLY, RAYMOND J. SPALL
2007354665 Detachable aerodynamic missile stabilizing system
STEPHEN R. PECK, SHUWU WU
8898011 Method for maintaining integrity against erroneous
ephemeris for a differential GPS based navigation solution
supporting fast system startup
GREGORY HERSH, IRVIN C. SCHICK
8898279 Connectivity service-level guarantee-monitoring
and claim validation systems and methods
JAMES L. JACOBS
8898736 System to establish trustworthiness of
autonomous agent
WILLIAM L. GILMORE, JESSE J. LEE, MONTY D. MCDOUGAL
8914882 Intrusion prevention system (IPS) mode for a malware
detection system
RICHARD DRYER, CHRIS E. GESWENDER, PAUL VESTY
8916810 Steerable spin-stabilized projectile
CHRISTOPHER M. PILCHER, RAYMOND SAMANIEGO,
JOHN L. TOMICH
8917199 Subterranean image generating device and associated
method
ANDREW B. FACCIANO, CHIN SHIAU
2007343894 Scalable electronics architecture
MICHAEL G. ADLERSTEIN, FRANCOIS Y. COLOMB
2008266189 Microwave integrated circuit package and method
for forming such package
THOMAS FARLEY, TINA A. OBERAI, JERRY L. PIPPINS JR.,
RICARDO J. RODRIGUEZ, NOAH Z. STAHL, DANIEL TEIJIDO,
JAY J. VISARIA
2009274429 Secure email messaging system
DARRYN A. JOHNNIE, SUNG I. PARK
2009282319 Multicasting in a network using neighbor
information
WENDY BARTLETT, RANDALL S. BROOKS, NOAH Z. STAHL
2009322747 Secure document management
ANTHONY J. DELROCCO, DANIEL TEIJIDO
2009322886 Multi-level secure information retrieval system
SUNG I. PARK, DENH T. SY
2009338150 Communication scheduling of network nodes
using a cluster coeffient
THOMAS FARLEY, RICARDO J. RODRIGUEZ,
CHARLES B. BRADLEY II
2010202516 System and method for dynamic multi-attribute
authentication
ROBERTO W. ALM, DONALD A. BOZZA,
PATRICIA S. DUPUIS, JOHN B. FRANCIS,
KENNETH S. KOMISAREK, JOSEPH LICCIARDELLO,
ANGELO M. PUZELLA
2010229122 Panel array
SCOTT R. CHEYNE, JEFFREY PAQUETTE
2010229171 An electrical connector to connect circuit cards
SCOTT R. CHEYNE, JOHN D. WALKER, DIMITRY ZARKH,
JEFFREY PAQUETTE
2010229178 Busbar connector
2010229186 Translating hinge
PETER R. DRAKE, YUCHOI F. LOK
2010236234 Methods and apparatus for integration of
distributed sensors and area surveillance radar to mitigate
blind spots
RICHARD M. LLOYD
2011233654 Multi-point time spacing kinetic energy rod
warhead and system
RANDY C. BARNHART
2575184 Data handling in a distributed communication network
of making same
STEPHEN JACOBSEN, JAMES H. ROONEY III,
FRASER M. SMITH
2011256820 Vessel hull robot navigation subsystem
EDWARD KITCHEN, DARIN S. WILLIAMS
2580543 FLIR-to-missile boresight correlation and non-uniformity
compensation of the missile seeker
JEROME H. POZGAY
2011238848 RF feed network for modular active aperture
electronically steered arrays
ABHIJIT SINHA, ZHEN DING, MOHAMAD FAROOQ,
THIA KIRUBARAJAN
2585023 Track quality based multi-target tracker
DAVID J. KATZ, STEPHEN R. REID
2011271382 Waveform generator in a multi-chip system
WILLIAM SULIGA, DAVID VICKERMAN, STEVEN COTTEN,
JOHN HILL III, DONALD GRINDSTAFF, JORAM SHENHAR,
BRETT GOLDSTEIN, BENJAMIN DOLGIN
2591691 Centralizer-based survey and navigation device
and method
GARY SCHWARTZ, RICHARD M. WEBER
2012200764 Free air stream heat exchanger design
WILLIAM P. HULL JR., ROBERT E. LEONI, JAMES S. WILSON
2012202384 Performance optimization of power amplifier
BENJAMIN DOLGIN, MICHAEL MILLSPAUGH,
LUIS GIRALDO, EDWARD DEZELICK, JOHN RYAN
2012258363 Controlled impact rescue tool impact element
AUSTRIA
QUENTON JONES, MARTIN STEVENS
2146223 Secondary radar message decoding
NEAL M. CONRARDY, RICHARD DRYER
2593222 Methods and apparatus for selectable velocity
projectile system
OLIVER HUBBARD, JIAN WANG
2593436 Dual beam radar system
HAMID GHADAKI, REZA DIZAJI
2603315 A classification system for radar and sonar applications
YANMIN ZHANG, STEPHEN SCHILLER, CLIFTON QUAN
2605975 Microwave attenuator circuit
BELGIUM
IKE CHANG, IRWIN NEWBERG
2606401 Antenna transceiver system
KELVIN CHENG
2010236845 Data diode system
MORRIS E. FINNEBURGH, WILLIAM G. WYATT
2615281 Method and system for cryogenic cooling
RANDALL S. BROOKS, DANIEL TEIJIDO,
SYLVIA A. TRAXLER, RICARDO J. RODRIGUEZ
2010245198 Method and system for adjudicating text against
a defined policy (general adjudicator method)
MICHAEL A. MOORE, JOHN BEDINGER,
KAMAL TABATABAIE, ROBERT B. HALLOCK
2385546 Passivation layer for a circuit device and method
of manufacture
TIMOTHY D. SMITH, NINA L. STEWART
2615503 Dynamic system and method of establishing
communication with objects
MICHAEL RAKIJAS
2010246338 Method and apparatus for bounded time
delay estimation
JEONG-GYUN SHIN
2387825 High speed serializer
RANDALL S. BROOKS, DANIEL TEIJIDO
2010254178 Enabling multi-level security in a single-level
security computing system
CANADA
THOMAS H. POWELL, CORNELIA F. RIVERS
2010256578 Identification friend or foe (IFF) system
SHANNON DAVIDSON
2503781 On-demand instantiation in a high performance
computer (HPC) system
BENJAMIN DOLGIN, MICHAEL SHORE, STEVEN COTTEN
2633529 Positioning system and method
KEVIN L. JOHNSON, JOHN N. CARBONE,
KENNETH J. MAGNES, ASHLEY C. MORT,
CHRISTOPHER E. KLINE
2657638 Geographical information display system and method
CHRISTOPHER A. TOMLINSON, JEFFREY DECKER,
QINGCE BIAN, WILLIAM PRICE, ERIC R. DAVIS,
BRADLEY HUANG, GILES D. JONES, PETER WALLRICH
2676187 Military training device
DELMER D. FISHER
PHILLIP ROSENGARD, MARWAN KRUNZ
2508895 Method and system for encapsulating variable-size
packets
MARK W. BIGGS, TIMOTHY R. SCHEMPP,
GREGORY S. UM
2010289870 Single frequency user ionosphere system
and technique
MICHAEL BRENNAN, BENJAMIN DOLGIN, LUIS GIRALDO,
JOHN HILL III, DAVID KOCH, MARK A. LOMBARDO,
JORAM SHENHAR
2536237 Drilling apparatus, method and system
MICHAEL BRENNAN, STEVEN COTTEN, BENJAMIN DOLGIN,
JORGE GUTIERREZ, WILLIAM SULIGA, JOHN WITZEL
2010289879 Search and rescue using ultraviolet radiation
ELI BROOKNER, FRITZ STEUDEL, DAVID MANOOGIAN
2541435 Multiple radar combining for increased range, radar
sensitivity and angle accuracy
JOHN A. WHEELER, BRIAN A. ADAMS,
MATTHEW R. YEAGER, CHRISTOPHER HECHT
2700805 Unmanned vehicle simulation system
BRIAN RICHARD BOULE, JONATHAN T. LONGLEY,
JAMES H. ROONEY III
2010296034 Hull robot garage
RANDY C. BARNHART, MELINDA C. MILANI,
DONALD V. SCHNAIDT, JEFFREY SCHREIBER
2562506 Data monitoring and recovery
YUCHOI F. LOK, PETER R. DRAKE
2723682 Methods and apparatus for detection/classification
of radar targets including birds and other hazards
DELMER D. FISHER, ROBERT W. PLUMMER,
BRADY A. PLUMMER
2010325104 Detonation control system
RICHARD T. KARON, MICHAEL E. LEVESQUE
2565515 Event alert system and method
SUNG I. PARK, DENH T. SY
2748360 Communication scheduling of network nodes using
a cluster coeffienct
KENN S. BATES, GENE P. COCHRAN
2010326276 System and method for using an optical isolator
in laser testing
PHILLIP A. COX, JAMES FLORENCE
2569721 Electronic sight for firearm, and method
of operating same
ARNOLD W. NOVICK
2010326314 System and method for discriminating a subsurface
target in the water from a surface target in the water
RANDY C. BARNHART, DONALD V. SCHNAIDT,
MELINDA C. MILANI, STEVEN TALCOTT,
CRAIG S. KLOOSTERMAN
HECTOR M. REYES JR., DONALD P. GRAHAM,
MICHAEL CRIST, MARY HEWITT
2011202824 Systems and methods for detecting and geolocating hazardous refuse
ROBERT ALLISON, RON K. NAKAHIRA, JOON PARK,
BRIAN H. TRAN
2579572 Micro-electrical-mechanical device and method
JOHN M. BRANNING JR., ROBERT A. LEMIRE
2011221348 Systems and methods for collision avoidance
in unmanned aerial vehicles
DONALD V. SCHNAIDT, STEVEN TALCOTT,
CRAIG S. KLOOSTERMAN, RANDY C. BARNHART,
MELINDA C. MILANI
CRAIG S. KLOOSTERMAN, DONALD V. SCHNAIDT,
STEVEN TALCOTT, MELINDA C. MILANI,
MIRON CATOIU
2676680 RF re-entrant combiner
MICHAEL G. ADLERSTEIN, FRANCOIS Y. COLOMB
2689346 Microwave integrated circuit package and method
for forming such package
DONALD A. BOZZA, JOHN B. FRANCIS,
PATRICIA S. DUPUIS, ANGELO M. PUZELLA,
ROBERTO W. ALM
2753518 Panel array
DIMITRY ZARKH, JOHN D. WALKER, JEFFREY PAQUETTE,
SCOTT R. CHEYNE
PETER R. DRAKE, YUCHOI F. LOK
2759012 Methods and apparatus for integration of distributed
sensors and airport surveillance radar to mitigate blind spots
57
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60200504507863 Pressure control valve having intrinsic
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261896 Method and apparatus for energy and data retention in
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IRELAND
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ROBERT B. HALLOCK, JOHN BEDINGER
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ISRAEL
EMERALD J. ADAIR, GRAY FOWLER, MICHAEL M. LIGGETT
182655 Improved phthalonitrile composites
NEAL M. CONRARDY, RICHARD DRYER
184398 Methods and apparatus for selectable velocity
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185241 Kinetic energy rod warhead with projectile spacing
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ANTHONY O. LEE, CHRISTOPHER ROTH,
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194821 Adjustable optical mounting
DAVID J. KNAPP, DEAN MARSHALL
194822 Refractive compact range
ROBERT C. GIBBONS
JAMES L. FULCOMER
197045 Data encoder
JOSEPH B. LAIL
197092 Methods and apparatus for information
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CHRISTOPHER HIRSCHI, STEPHEN JACOBSEN,
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198670 Conformable track assembly for a robotic crawler
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RALPH PENSEL, MARC OLIVIER, STEPHEN JACOBSEN
198713 Unmanned ground robotic vehicle having an alternatively
extendible and retractable sensing appendage
DAVID J. CANICH, KENNETH W. BROWN, RUSSELL BERG
198754 Multifunctional radio frequency directed energy system
RAFAEL R. QUINTERO, JAMES S. WILSON, ANGEL CRESPO,
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199490 Method and apparatus for effecting high-frequency
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200143 System and method for image registration based
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200318 Manual human interfaces to electronics
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200702 System and method for capturing image data over
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DAVID A. LANCE, STEVEN T. SIDDENS
201518 Methods and apparatus for fire control during launch
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201698 Methods and apparatus for testing software with
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ROHN SAUER
204091 Compact continuous ground plane system
LACY G. COOK, ANDREW LEWANSKI, SUSAN B. SPENCER
204224 Beam-steering apparatus having 5 degrees
of freedom of line-of-sight steering
RICHARD D. YOUNG, MARK E. STADING,
SHAUN L. CHAMPION, PHILIP H. IVES, NICK J. ROSIK,
THO X. NGUYEN, REZA TAYRANI
204261 Wireless temperature sensor network
ETHAN S. HEINRICH, SAMUEL D. TONOMURA
204263 System for improving flip chip performance
MARK S. HAUHE, CLIFTON QUAN,
MARK E. STADING, ADAM C. VON,
CHAIM WARZMAN, RICHARD D. YOUNG
204309 Transmit/receive module communication and control
architecture for active array
CLIFTON QUAN, MARK S. HAUHE
204310 Switchable 0/180 degree phase shifter on flexible
coplanar strip transmission line
FANGCHOU YANG, MARK S. HAUHE, ROHN SAUER,
GREGG M. TANAKAYA, CLIFTON QUAN
204311 Light weight stowable phased array lens
antenna assembly
TAMRAT AKALE
204691 Tunable bandpass filter
CHRISTOPHER J. GRAHAM, MATTHEW R. YEAGER,
JOHN A. WHEELER
205027 Unmanned vehicle route management system
DAVID CHANG, TERENCE DE LYON, DANIEL GREGOIRE,
DEBORAH KIRBY, JEFFERY J. PUSCHELL,
FREDERIC STRATTON
205132 Multi-band sub-wavelength IR detector having frequency
selective slots and method of making the same
JAMES F. ASBROCK, KANON LIU
205373 Low noise, low power and high bandwidth capacitive
feedback trans-impedance amplifier with differential FET input
and bipolar emitter follower feedback
MONICO A. ORTIZ, LEONARD P. CHEN, MICKY HARRIS,
KENTON VEEDER
206522 System and method for analog-to-digital conversion
(pipelined single-slope analog-to-digital conversion)
WILLIAM A. KASTENDIECK, JAMES A. PRUETT,
JOHN S. REED, PAUL E. SCHLITTLER,
ZACHARY SCOTT ZUTAVERN
207357 Vibration isolation system
HEE KYUNG KYUNG KIM, ALBERTO F. VISCARRA,
DEREK PRUDEN, FANGCHOU YANG, CLIFTON QUAN
207627 Systems and methods for assembling lightweight
RF antenna structures
MARSHALL BRINN, JAMES BARGER,
STEPHEN D. MILLIGAN, RICHARD MULLEN
208798 A method for disambiguating a projectile trajectory
from shockwave-only signals
WILLIAM G. WYATT
211812 Sensing and estimating in-leakage air in a sub-ambient
cooling system
LACY G. COOK, ERIC M. MOSKUN
212967 Wide field of view LWIR high speed imager
JASON PETERMEIER, GEORGE RADTKE, TOMEK P. RYS
213030 Pressurized rotary actuator
KENTON VEEDER
213925 Time-frequency fusion digital pixel sensor
ROBERT A. LEMIRE, JOHN M. BRANNING JR.
DAVID D. CROUCH
215535 Switched-beam wireless power transmission system and
method of wirelessly transmitting power from a retrodirective array
to an array of wireless power receivers on a single movable object
ANTHONY SOMMESE, IAN S. ROBINSON
216091 Adaptive spatial-spectral processing (ASSP)
IAN S. ROBINSON, ANTHONY SOMMESE
216235 System and method for reducing dimensionality
of hyperspectral images
ITALY
MICHELLE K. ESTAPHAN OWEN, FREDERICK FRODYMA,
GUY RAILEY, DANIEL VICCIONE
1588186 Sonar array system
ROBERT ALLISON, BRIAN H. TRAN, RON K. NAKAHIRA,
JOON PARK
of making same
ROBERT D. TRAVIS
RUSSELL BERG, KENNETH W. BROWN,
DAVID D. CROUCH, KEITH G KATO, REID F. LOWELL
ROBERT W. BYREN
MATTHEW C. SMITH
BRYAN BERLIN, KIM L. CHRISTIANSON
208888 Methods and apparatus for high-impulse fuze booster
for insensitive munitions
RALPH PENSEL, MARC OLIVIER, STEPHEN JACOBSEN
198713 Unmanned ground robotic vehicle having an alternatively
extendible and retractable sensing appendage
2100203 Electronic cooling unit for vehicle with a hear exchanger
in a vertical duct
CINDY W. MA, DEREK PRUDEN, KEVIN C. ROLSTON,
ALBERTO F. VISCARRA
210536 Adhesive reinforced open hole interconnect
RALPH PENSEL, FRASER M. SMITH, MARC OLIVIER,
STEPHEN JACOBSEN
203227 Serpentine robotic crawler having a continuous track
(single track serpentine crawler (supertrack)
JAMES SMALL
211172 Optical magnetron for high efficiency production
of optical radiation
CARY C. KYHL
211472 Temperature tolerant cover layer construction
2268996 Methods and apparatus for guidance of ordnance
delivery device
JAMES S. WILSON
cooling channel
WILLIAM G. WYATT
2338013 Sensing and estimating in-leakage air in a sub-ambient
cooling system
PATRICIA S. DUPUIS, ANGELO M. PUZELLA,
JOSEPH LICCIARDELLO, JOHN B. FRANCIS,
MICHAEL C. FALLICA, JOSEPH M. CROWDER
ANGELO M. PUZELLA
2412056 Panel array
DANIEL P. JONES
JOHN FRASCHILLA, ERIC N. BOE, WILLIAM L. LEWIS
STEPHEN JACOBSEN
JAPAN
5307242 Modular solid-state millimeter wave (MMW) RF
power source
control thrusters
LOWELL A. BELLIS, ROBERT C. HON
5313237 Cryocooler split flexure suspension system and method
TERRY M. SANDERSON
5318973 Shape-change material and method
FRASER M. SMITH, SHAYNE ZURN
5320493 Multi-cell electronic circuit array and method
of manufacturing
BRUCE W. CHIGNOLA, GARO K. DAKESSIAN,
BORIS S. JACOBSON, DENNIS R. KLING, KEVIN E. MARTIN,
EBERHARDT PRAEGER, WILLIAM WESOLOWSKI
5323314 Electrical transformer
STEPHEN JACOBSEN
5331102 Variable primitive mapping for a robotic crawler
K. BUELL, JIYUN C. IMHOLT, MATTHEW A. MORTON
5340392 Multilayer metamaterial isolator
THEODORE B. BAILEY
5340725 Methods and apparatus for presenting images
WILLIAM J. DAVIS, WARD G. FILLMORE,
SCOTT MACDONALD
5346372 Method for packaging semiconductors at a wafer level
CHRISTOPHER FLETCHER, FRANK B. JAWORSKI
5356328 Integrate detect and display
RICHARD M. LLOYD
5357205 Warhead with aligned projectiles
MICHAEL R. JOHNSON, BRUCE E. PEOPLES
5361708 Multilingual data querying
KENNETH W. BROWN, ANDREW K. BROWN,
DARIN M. GRITTERS, MICHAEL J. SOTELO, THANH TA
5362120 Low loss broadband planar transmission line to
waveguide transition
JONATHAN D. GORDON, REZA TAYRANI
5362884 Broadband microwave amplifier
STEVEN COTTEN, BENJAMIN DOLGIN, BRETT GOLDSTEIN,
DONALD GRINDSTAFF, JOHN HILL III,
MICHAEL SHELKIN, JORAM SHENHAR,
WILLIAM SULIGA, DAVID VICKERMAN, JOHN WITZEL
5362994 Centralizer-based survey and navigation device
and method
BARRY J. LILES, COLIN S. WHELAN
5364087 Method and structure for reducing cracks in a
dielectric layer in contact with metal
ANGELO M. PUZELLA
5367904 Panel array
MARK A. HARRIS
5372934 Space vehicle having a payload-centric configuration
GEORGE A. BLAHA, STEVEN T. CUMMINGS,
LARRY L. STERN
5378229 Multiple sensor processing
RICHARD JANIK, DORON STRASSMAN
5378527 Multi-stage hyper-velocity kinetic energy missile
STEPHEN JACOBSEN, DAVID MARCEAU, FRASER M. SMITH
5383672 A mini-scope for multi-directional imaging
TIMOTHY J. GLAHN, ROBERT G. KURTZ JR.
5395661 Passive conductive cooling module
LOWELL A. BELLIS, ROBERT C. HON, CYNDI H. KESLER
5399379 Stirling cycle cryogenic cooler with dual coil single
magnetic circuit motor
STEPHEN JACOBSEN
5399910 Versatile endless track for lightweight mobile robots
JOHN M. BERGERON, CARL E. BUCZALA,
JONATHAN T. LONGLEY, STEPHEN V. OLIZAROWICZ,
SHELLEY L. ROSENBAUM LIPMAN, KJETIL SEVRE,
VIDAR SKJELSTAD, JOSEPH C. SPICER, CORRINE ST. JEAN
5400071 Computing vehicle with integrated operator workspace
HAROLD FENGER, MARK S. HAUHE, CLIFTON QUAN,
KEVIN C. ROLSTON, TSE E. WONG
5425822 Circuit board assembly and method of attaching
a chip to a circuit board with a fillet bond not covering RF traces
NEIL R. NELSON, STEVEN R. WILKINSON
TIFFANY E. CASSIDY, DAVID D. HESTON,
CLAIRE E. MOONEY, JON MOONEY
5432329 Resonated bypass capacitor for enhanced
performance of a microwave circuit
GARY A. FRAZIER, ROGER LAKE
5450064 Optical digital-to-analog converter
MICHAEL C. BARR, LOWELL A. BELLIS,
ROBERT C. HON, CYNDI H. KESLER, CARL KIRKCONNELL
5450390 Cryocooler with moving piston and moving cylinder
INUKA D. DISSANAYAKE, DONALD M. HUGHES
5450606 Method and apparatus for an ionizer
JOHN BEDINGER, ROBERT B. HALLOCK,
MICHAEL A. MOORE, KAMAL TABATABAIE
of manufacture
5460335 Fluid control system having selective recruitable
actuators
KIM L. CHRISTIANSON, HENRI Y. KIM , TRAVIS P. WALTER
5461530 Low collateral damage forward firing warhead with
fragment pattern control device
ANDREW B. FACCIANO, RICHARD A. MCCLAIN JR.,
ROBERT T. MOORE, CRAIG SEASLY, RAYMOND J. SPALL
5474560 Detachable aerodynamic missile stabilizing system
KENNETH W. BROWN
5474931 Directed energy beam virtual fence
STEPHEN JACOBSEN, DAVID MARCEAU,
DAVID MARKUS, SHAYNE ZURN
5478890 Electrical microfilament to circuit interface
FRASER M. SMITH, SHAYNE ZURN
5478891 Multi-cell electronic circuit array and method
of manufacturing
JAMES SMALL
5479338 Method and apparatus for inflight refueling
PATRICK HOGAN, RALPH KORENSTEIN,
JOHN MCCLOY, CHARLES WILLINGHAM JR.
5479363 Treatment method for optically transmissive bodies
BARBARA E. PAUPLIS
5480339 Calibration method for receive only phased
array radar antenna
GARY L. FOX, JUSTIN C. JENIA, CHRISTOPHER E. TOAL
5405468 Method and system for controlling swaying of an object
HOWARD C. CHOE
5484453 Multiple operating mode optical instrument
STEVEN N. PETERSON
5406211 Non-invasive method and device for measuring
cardiac output
5485706 First-stage pilot valve
STEPHEN JACOBSEN
HANSFORD CUTLIP, NELSON WALLACE
5420251 Scanning solar diffuser relative reflectance monitor
JAR J. LEE, STAN W. LIVINGSTON, DENNIS T. NAGATA
5420654 Wide band long slot array antenna using simple
balun-less feed elements
KERRIN A. RUMMEL, RICHARD M. WEBER,
WILLIAM G. WYATT
5422379 Method and apparatus for cooling electronics with
a coolant at a subambient pressure
STEVEN D. BERNSTEIN, RALPH KORENSTEIN,
STEPHEN J. PEREIRA
5486610 Fabricating a gallium nitride device with a diamond
layer
CHRISTOPHER HIRSCHI, STEPHEN JACOBSEN,
BRIAN MACLEAN, RALPH PENSEL
5495786 Conformable track assembly for a robotic crawler
MARK W. REDEKOPP
5502836 Systems and methods for mapping state elements
of digital circuits for equivalence verification
ROBERT D. TRAVIS
63
ANGELO M. PUZELLA
2412056 Panel array
REZA TAYRANI
BRIAN MACLEAN, MARC OLIVIER, STEPHEN JACOBSEN
5607629 Biomimetic mechanical joint
HOWARD M. DE RUYTER
5518940 Calibration system for detector
STEPHEN JACOBSEN, DAVID MARCEAU
5613059 Grin lens miscroscope system
STEPHEN JACOBSEN
JEFFERY THOMAS ANDERSON, KURT M. BEUTEL,
DAVID C. PENNY
JOHN P. BETTENCOURT, KELLY P. IP,
VALERY S. KAPER, JEFFREY R. LAROCHE,
KAMAL TABATABAIE
5523477 Silicon based opto-electric circuits
5619159 Circuit card assembly extraction tool and methods
thereof (methods and apparatus for a circuit card assembly
extraction tool)
KIM L. CHRISTIANSON, BRYAN BERLIN
NEW ZEALAND
5623386 Methods and apparatus for high-impulse fuze booster
for insensitive munitions
RANDALL S. BROOKS, LLOYD DEAN
590305 Secure network portal
CHADWICK B. MARTIN, KENNETH E. SCHMIDT
5547274 Optically measurable mounting structure
JOSEPH M. ANDERSON, TODD HATCH
5623530 Broadband/multi-band horn antenna with compact
integrated feed (broadband and multi-band quad ridge waveguide
horn antenna with compact integrated feed)
THOMAS FARLEY, TINA A. OBERAI,
JERRY L. PIPPINS JR., RICARDO J. RODRIGUEZ,
NOAH Z. STAHL, DANIEL TEIJIDO, JAY J. VISARIA
590433 Secure email messaging system
DAVID C. FISHER
5628222 Scheduler
KELVIN CHENG
STEVEN D. BERNSTEIN, ERIK F. NORDHAUSEN,
ROBERT P. MOLFINO, STEVEN B. WAKEFIELD,
DAVID H. ALTMAN
RANDALL S. BROOKS, DANIEL TEIJIDO
595860 Enabling multi-level security in a single-level
security computing system
5628312 Nano-tube thermal interface structure
MICHAEL BRENNAN, STEVEN COTTEN,
BENJAMIN DOLGIN, JORGE GUTIERREZ,
WILLIAM SULIGA, JOHN WITZEL
598847 Search and rescue using ultraviolet radiation
DONALD R. HOUSER, ROBERT J. SCHALLER,
WILLIAM J. SCHMITT, MICHAEL SNYDER,
ANTHONY K. TYREE
5551169 All-digital line-of-sight (LOS) processor architecture
STEPHEN J. PEREIRA
5554784 Fabricating a gallium nitride layer with diamond layers
ABRAM YOUNG
5558821 Frequency modulation structure and method
utilizing frozen shockwave
JAMES H. DUPONT, HENRI Y. KIM, TRAVIS P. WALTER
5559187 Dual-mass forward and side firing fragmentation
warhead
DAVID E. BOSSERT, RAY SAMPSON, JEFFREY N. ZERBE
5561866 Methods and apparatus for marine deployment
BRIAN GAHAN, ALLEN L. KELLY, DERRICK J. ROCKOSI,
RICHARD GENTILMAN, WILLIAM C. STRAUSS,
CHRISTOPHER K. SOLECKI
5631907 Fused silica body with vitreous silica inner layer,
and method for making same
FRANK C. LAM
5635106 System and method for divert and attitude control
in flight vehicles
STEPHEN H. BLACK, ALAN G. SILVER,
ANDREW D. PORTNOY
KIUCHUL HWANG
5562925 Field effect transistor
HOWARD R. KORNSTEIN, JONATHAN T. LONGLEY,
JEREMY C. HERMANN, JOEL N. HARRIS,
JAMES H. ROONEY III, WEN-TE WU
5638615 Hull robot drive system
STEPHEN JACOBSEN, DAVID MARCEAU,
DAVID MARKUS, SHAYNE ZURN
5562983 Ultra-high density connector
RICHARD D. LOEHR
5642538 Hydroxyl amine based staged combustion hybrid
rocket motor
KELVIN CHENG
ROBERT C. GIBBONS
SHANNON V. DAVIDSON
5570095 Fault tolerance and recovery in a high performance
computing (HPC) system
SHAHED REZA, EDWARD SWIDERSKI, ROBERTO W. ALM
5658826 Monolithic microwave integrated circuit
LEO H. HUI, KWANG CHO
5579384 Efficient autofocus method for swath SAR
WILLIAM C. STRAUSS, CHRISTOPHER K. SOLECKI,
KEVIN M. CHAPLA, ALLEN L. KELLY
5579759 Apparatus for producing a vitreous inner layer on
a fused silica body, and method of operating same
JEROME H. POZGAY
JEFFREY M. PETERSON, CHRISTOPHER FLETCHER,
KENTON VEEDER
5587899 Method of preparing detectors for oxide bonding to
readout integrated chips
VALERY S. KAPER, MICHAEL G. ADLERSTEIN
5665274 Phased array radar systems and subassemblies
thereof (master-slave TR phase array element)
STAN SZAPIEL, CATHERINE GREENHALGH, DONALD DENIS
5665775 Extended depth of field imaging
JUSTIN GORDON ADAMS WEHNER, SCOTT M. JOHNSON
5669555 Multi-band, reduced-volume radiation detectors and
methods of information
MALAYSIA
SHANNON DAVIDSON, ANTHONY RICHOUX
150399 System and method for topology-aware job
scheduling and backfilling in an HPC environment (HPC)
VLADIMIR V. SHKUNOV, DAVID A. ROCKWELL
5589001 Monolithic signal coupler for high-aspect ratio
solid-state gain media
SHANNON DAVIDSON
151525 On-demand instantiation in a high performance
computer (HPC) system
5596027 Transparent endoscope head defining a focal length
NETHERLANDS
KAMAL TABATABAIE, MICHAEL S. DAVIS,
JEFFREY R. LAROCHE, VALERY S. KAPER,
JOHN P. BETTENCOURT
5603882 Electrical contracts for cmos devices and III–V devices
formed on a silicon substrate (CMOS VLSI compatible interconnects
for heterogeneous integration of iii-v devices onto si)
ROBERT ALLISON, BRIAN H. TRAN, RON K. NAKAHIRA,
JOON PARK
of making same
BOGART VARGAS
603473 Time-key hopping
NORWAY
YUEH-CHI CHANG, COURT ROSSMAN
333541 Low radar cross section radome
MARY O’NEILL, WILLIAM H. WELLMAN
334240 Multicolor staring missile sensor system
POLAND
RUSSIAN FEDERATION
JAMES BARGER, MARSHALL BRINN,
STEPHEN D. MILLIGAN, RICHARD MULLEN
locations
RICHARD MULLEN
2512128 Disambiguating shooter locations with
shockwave-only location
SINGAPORE
ALLEN L. KELLY, KEVIN M. CHAPLA
DOUGLAS R. GENTRY, SUSAN M. ESHELMAN,
MONTE R. SANCHEZ, THOMAS A. HANFT, S RAJENDRAN
101447325 Heterogeneous chip integration with low loss
interconnection through adaptive patterning
JOHN P. BETTENCOURT, VALERY S. KAPER
101453854 Digital-to-analog converter (DAC) having high
dynamic range
STEVEN COTTEN, BENJAMIN DOLGIN, MICHAEL SHORE
KAMAL TABATABAIE, JOHN BEDINGER,
ROBERT B. HALLOCK, THOMAS E. KAZIOR,
MICHAEL A. MOORE
of manufacture
FRANCIS J. MORRIS
101460384 Method for fabricating electrical circuitry
on ultra-thin plastic films
CHRISTOPHER A. TOMLINSON, ERIC R. DAVIS,
JEFFREY DECKER, BRADLEY HUANG, PETER WALLRICH,
WILLIAM PRICE, GILES D. JONES, QINGCE BIAN
JAMES D. HILL, KEVIN W. OMMODT, JOEL C. ROPER
1365346 Method and apparatus for doubling the capacity
of a lens-based switched beam antenna system
MIKEL J. WHITE
1374855 Broadband linearization by elimination of harmonics
and intermodulation in amplifiers
PATRICK M. KILGORE
1379075 System and method for adaptive non-uniformity
compensation for a focal plane array
EDWARD SWIDERSKI, ROBERTO W. ALM, SHAHED REZA
BRIAN GAHAN, RICHARD GENTILMAN, ALLEN L. KELLY,
DERRICK J. ROCKOSI, CHRISTOPHER K. SOLECKI,
WILLIAM C. STRAUSS
1387828 Fused silica body with vitreous silica inner layer,
and method for making same
101470392 Method and structure for reducing cracks in
a dielectric layer in contact with metal
WILLIAM E. HOKE, JEFFREY R. LAROCHE
1393684 Semiconductor structure having silicon CMOS
transistors with column III–V transistors on a common substrate
RICHARD MULLEN
locations with shockwave-only location
ANTHONY L. VICICH, JAYSON KAHLE BOPP,
MARTIN G. FIX, CHARLES K. ROGERS
SPAIN
SOUTH KOREA (REPUBLIC OF KOREA)
DOUGLAS R. GENTRY, SUSAN M. ESHELMAN,
MONTE R. SANCHEZ, THOMAS A. HANFT, S. RAJENDRAN
101447325 Heterogeneous chip integration with low loss
interconnection through adaptive patterning
SAMUEL D. TONOMURA
1723689 Periodic interleaved star with vias electromagnetic
bandgap structure for microstrip and flip chip on board applications
BRIAN H. TRAN, ROBERT ALLISON, JOON PARK,
RON K. NAKAHIRA
of making same
REZA TAYRANI
MICHAEL A. MOORE, ROBERT B. HALLOCK,
KAMAL TABATABAIE, JOHN BEDINGER
of manufacture
JEONG-GYUN SHIN
WILLIAM L. LEWIS, ERIC N. BOE, JOHN FRASCHILLA
AARON J. STEIN, PAUL B. HAFELI, MICHAEL VARGAS,
ELI HOLZMAN
182898 Method for gold removal from electronic components
ALLEN L. KELLY, KEVIN M. CHAPLA
SAMUEL D. TONOMURA
1721497 Improved flip chip MMIC on board performance using
periodic electromagnetic bandgap structures
2082259 Methods and apparatus for providing target altitude
estimation in a two-dimensional radar system
SWITZERLAND
2100203 Electronic cooling unit for vehicle with a heat exchanger
in a vertical duct
TAIWAN
JOHN P. BETTENCOURT, VALERY S. KAPER
101453854 Digital-to-analog converter (DAC) having high
dynamic range
RAYMOND SAMANIEGO
STEVEN COTTEN, BENJAMIN DOLGIN, MICHAEL SHORE
JAMES S. WILSON
2317601 Integrated antenna structure with an embedded cooling
channel
JOEL N. HARRIS, JEREMY C. HERMANN,
HOWARD R. KORNSTEIN, JONATHAN T. LONGLEY,
JAMES H. ROONEY III, WEN-TE WU
I400179 Hull robot drive system
KAMAL TABATABAIE, JOHN BEDINGER,
ROBERT B. HALLOCK, THOMAS E. KAZIOR,
MICHAEL A. MOORE
of manufacture
FRANCIS J. MORRIS
101460384 Method for fabricating electrical circuitry on ultrathin plastic films
CHRISTOPHER A. TOMLINSON, ERIC R. DAVIS,
JEFFREY DECKER, BRADLEY HUANG, PETER WALLRICH,
WILLIAM PRICE, GILES D. JONES, QINGCE BIAN
WILLIAM G. WYATT
JAMES W. MCCOOL
ROBERT P. ENZMANN, FRITZ STEUDEL, GEORGE THOME
I400469 System and method for coherently combining
a plurality of radars
MICHAEL G. ADLERSTEIN, KIUCHUL HWANG
I404204 Monolithic integrated circuit having enhancement mode/
depletion mode filed effect transistors and field effect transistors
ROBERT A. LINDQUIST JR., ISTVAN RODRIGUEZ
I411223 Radio frequency modulator
TIMOTHY J. GLAHN, ROBERT G. KURTZ JR.
I411382 Passive conductive cooling module
MICHAEL R. JOHNSON, BRUCE E. PEOPLES
I417747 Enhancing multilingual data querying
EDWARD SWIDERSKI, ROBERTO W. ALM, SHAHED REZA
2428323T3 Rotating screen dual reflector antenna
JOHN C. TREMBLAY, COLIN S. WHELAN
I420806 Impedance matching circuit
101470392 Method and structure for reducing cracks
in a dielectric layer in contact with metal
or stabilization
ROBERT A. LINDQUIST JR., ISTVAN RODRIGUEZ
1283533 Radio frequency modulator
SCOTT E. ADCOOK, STAN W. LIVINGSTON
1322968 Plug-in antenna
RON K. NAKAHIRA, BRIAN H. TRAN, JOON PARK,
ROBERT ALLISON
of making same
MARK W. REDEKOPP
1331270 Systems and methods for mapping state elements
of digital circuits for equivalence verification
KENNETH W. BROWN
1332487 Spatially-fed high-power amplifier
with shaped reflectors
DAVID D. HESTON, JON MOONEY
1335085 Method system for high power switching
SWEDEN
ARTHUR SCHNEIDER
SCOTT H. ALLEN, JONATHAN T. LONGLEY,
JAMES H. ROONEY III
I421196 Hull robot steering system
LORA J. CLARK, JEAN HAGAR, DARRELL K. HENSON,
WARREN J. KLINE, DIANE M. MCCREA,
CHARISSE A. MCLORREN
I423135 System and method for schedule quality assessment
CHRISTOPHER FLETCHER, FRANK B. JAWORSKI
I423660 Integrate detect and display
K. BUELL, JIYUN C. IMHOLT, MATTHEW A. MORTON
I424616 Multilayer metamaterial isolator
STEPHEN JACOBSEN, JAMES H. ROONEY III,
FRASER M. SMITH
I424939 Vessel hull robot navigation subsystem
RAYMOND D. EPPICH
I429921 Method for characterizing dielectric loss tangent
65
ROBERT B. HALLOCK, KAMAL TABATABAIE
I430444 Atomic layer deposition in the formation
of gate structures for iii-v semiconductor
ROBERTO W. ALM, SHAHED REZA, EDWARD SWIDERSKI
I433292 Monolithic microwave integrated circuit
ANGELO M. PUZELLA
I433390 Panel array
MICHAEL G. ADLERSTEIN
I433466 Frequency agile phase locked loop system
I437780 An electrical connector to connect circuit cards
STEPHEN HERSHEY
445354 Multiple-transceiver distributed dynamic channel
selection in a communication network
WILLIAM E. HOKE, THEODORE KENNEDY
445949 Method for continuous, in situ evaluation of entire wafers
for macroscopic features during epitaxial growth
JON MOONEY, DAVID D. HESTON
448073 Method and system for high power switching
BRUCE E. PEOPLES, MICHAEL R. JOHNSON
453610 Multilingual data querying (semantic reverse query
expander)
JEROME H. POZGAY
STEPHEN J. PEREIRA
461563 Fabricating a gallium nitride layer with diamond layers
JOHN D. WALKER, JEFFREY PAQUETTE, SCOTT R. CHEYNE,
DIMITRY ZARKH
TURKEY
JAYSON KAHLE BOPP, MARTIN G. FIX,
CHARLES K. ROGERS, ANTHONY L. VICICH
2100203 Electronic cooling unit for vehicle with a heat
exchanger in a vertical duct
or stabilization
ELI BROOKNER
1676150 Efficient technique for estimating elevation angle
when using a broad beam for search in a radar
MICHAEL USHINSKY, RICHARD GENTILMAN,
ALEXANDER A. BETIN, PATRICK HOGAN,
RANDAL W. TUSTISON
of manufacturing
KENNETH W. BROWN
1764915 Spatially-fed high-power amplifier with shaped
reflectors
ROBERT J. CODA, FRANK N. CHEUNG
GARY F. WAHLQUIST
2076730 Dynamic armor
2082259 Methods and apparatus for providing target altitude
estimation in a two-dimensional radar system
SHAWN O’BRIEN, KENNETH O’CONNOR, ROBERT ROEDER
MATTHEW C. SMITH
JAMES BALLEW
STEPHEN JACOBSEN, MICHAEL MORRISON, SHANE OLSEN
1828621 Pressure control valve having intrinsic mechanical
feedback system
BRIAN H. TRAN, RON K. NAKAHIRA, JOON PARK,
ROBERT ALLISON
of making same
JONATHAN LYNCH
1867006 Millimeter-wave transreflector and system
for generating a collimated coherent wavefront
REZA TAYRANI
1946350 Optical fiber assembly wrapped across gimbal axes
RODNEY H. KREBS
ARTHUR SCHNEIDER
WILLIAM S. PETERSON
2062006 Delayed tail fin deployment mechanism and method
JAMES BARGER, MARSHALL BRINN, STEPHEN D. MILLIGAN
1784656 Self-calibrating shooter estimation
MATTHEW PETER
DANIEL J. MOSIER
2060008 Discrete state-space filter and method for processing
asynchronously sampled data
2100203 Electronic cooling unit for vehicle with a heat exchanger
in a vertical duct
ERIC P. LAM, CHRISTOPHER A. LEDDY, STEPHEN R. NASH
ROBERT W. BYREN
UNITED KINGDOM
CHRISTIAN HEMMI
DANIEL T. MCGRATH
1502323 Reflect array antenna with asymmetrically switched
antenna elements
STAN W. LIVINGSTON, JAR J. LEE, CLIFTON QUAN
2047562 Space-fed array operable in a reflective mode and in a
feed-through mode
KEITH BROCK
2002532 Hollow core electric motor
GILBERT M. SHOWS
of an antenna beam
TIMOTHY G. BRAUER, KENNETH COLSON
2132517 Explosive device detection system and method
target recognition
EDGAR R. MELKERS
for a projectile
RICHARD L. SCOTT, TERRANCE ECK, ERIC E-LEE CHANG
2165148 Gun sight mounting device (weapon sight mount
vibration isolator)
JAMES SMALL
2185416 Method and system for inflight refueling of unmanned
aerial vehicles
ROBERT D. TRAVIS
2193325 Methods and apparatus for a control surface restraint
and release system
RICHARD C. VERA
2215422 System and method for adjusting a direction of fire
ROBERT D. TRAVIS
2215424 Methods and apparatus for deploying control
surfaces sequentially
FRANK N. CHEUNG, RICHARD CHIN, HECTOR Q. GONZALEZ
zoom
JAMES D. STREETER, MATTHEW A. ZAMORA,
MATTHEW EISENBACHER, CHRIS E. GESWENDER,
JASON J. FINK
2276998 Methods and apparatus for air brake retention and
deployment
LACY G. COOK
2277073 All-reflective, wide-field-of-view, inverse-telephoto
optical system with external posterior aperture stop and long back
focal length
TERRY M. SANDERSON
2406051 Method of manufacture of one-piece composite
parts with a polymer form that transitions between its glassy
and elastomeric states
2304384 Methods and apparatus for non-axisymmetric radome
2304464 Inverse synthetic aperture radar imaging processing
DANIEL P. JONES
MONTY D. MCDOUGAL
2511017 Providing a malware analysis using a secure malware
detection process
JESSE J. LEE, WILLIAM E. STERNS, RANDY S. JENNINGS,
MONTY D. MCDOUGAL, MATTHEW RICHARD,
CHRISTINA N. FOWLER
2511690 Detecting malware using stored patterns
of service attacks
RAYMOND SAMANIEGO
ERIC N. BOE, WILLIAM L. LEWIS, JOHN FRASCHILLA
JAMES S. WILSON
cooling channel
TR beacon
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RF power source
BENJAMIN WU, STEPHEN R. PECK, SHUWU WU
positioning system (DGPS)-based real time attitude determination
(RTAD)
fuze module
GARY A. FRAZIER
JOHN P. HARRELL, MICHAEL L. MENENDEZ,
GEOFFREY LONG
LACY G. COOK
KEVIN R. GREENWOOD, JAMES D. STREETER
or stabilization
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a charge-scavenging photodiode array for the same
WILLIAM G. WYATT
2338013 Sensing and estimating in-leakage air in a
sub-ambient cooling system
LACY G. COOK
MICHAEL C. FALLICA, JOSEPH M. CROWDER,
JOHN B. FRANCIS, PATRICIA S. DUPUIS,
ANGELO M. PUZELLA, JOSEPH LICCIARDELLO
JAMES W. MCCOOL
DOUGLAS CARROLL, RUSSELL W. GOFF, JAMIL R. HASHIMI,
STEPHEN P. JOHNSON, FRED G. THOUROT,
JOANNE E. WOOD
2362951 Apparatus and method for controlling an unmanned
vehicle
RICHARD S. JOHNSON
2369680 Multi polarization conformal channel monopole
antenna
ROBERT W. BYREN
MICHAEL A. MOORE, ROBERT B. HALLOCK,
KAMAL TABATABAIE, JOHN BEDINGER
of manufacture
JEONG-GYUN SHIN
RICHARD D. LOEHR, WILLIAM N. PATTERSON,
JAMES H. DUPONT
2391593 Buoyancy dissipator and method to deter an
errant vessel
DAVID T. WINSLOW
MENA J. GHEBRANIOUS
STEPHEN JACOBSEN
ROBERT A. KUEHN, MITCHELL O’NEAL PERLEY,
RICHARD A. SCHMIDT
CHING-JU J. YOUNG
control thrusters
STEVE E. HUETTNER
STEPHEN JACOBSEN
ANTHONY J. DELROCCO, DANIEL TEIJIDO
2477682 Multi-level secure information retrieval system
MICHAEL VARGAS
ROBERT D. TRAVIS
DELMER D. FISHER
VICTOR D. KRUPPA, RICHARD A. SCHMIDT
2491528 System for maintaining an even temperature
distribution across a laser detector
DARIN S. WILLIAMS
2494519 Methods and systems for processing data using
non-linear slope compensation
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