SolderQuik® BGA Preforms - Reballing Quick

Transcription

SolderQuik® BGA Preforms - Reballing Quick
SolderQuik® BGA Preforms - Reballing Quick Guide
1. Insert preform with
logo side down
4. Insert BGA
Copyright © 1998-2007 Winslow Automation, Inc.
2. Check alignment
5. Reflow
3. Apply paste flux
evenly
6. Moisten & remove paper
SolderQuik® is a registered trademark of Winslow Automation, Inc.
SM-4051A