semiconductor manufacturing equipment

Transcription

semiconductor manufacturing equipment
GoIndustry Group
STATE-OF-THE-ART
SEMICONDUCTOR MANUFACTURING EQUIPMENT
>
KARL
SUSS MA6
MASK
ALIGNER
>
GASONICS L3510
DOWNSTREAM
PHOTORESIST
STRIPPER
KARL SUSS MA150 MASK ALIGNER
BY ORDER OF AMERICAN ELECTRONIC COMPONENTS, INC.
(AECI) REPRESENTING
Formerly Lucent Technologies
Microelectronics Group
2525 North 12th Street, Reading, Pennsylvania
(Approximately 60 Miles
Northwest of Philadelphia)
• WAFER FABRICATION
PHOTOLITHOGRAPHY
PLASMA PROCESSING
WET PROCESSING
DEPOSITION
THERMAL PROCESSING
• METROLOGY/INSPECTION
• LASERS
• ASSEMBLY
• AUTOMATIC TEST EQUIPMENT
• ENVIRONMENTAL
• TEST INSTRUMENTATION
• POLISHING
WEDNESDAY & THURSDAY
NOVEMBER 13 & 14 AT 9:00 A.M.
http://www.michaelfox.com
e-mail: [email protected]
DAVID S. FOX, PA. LIC. NO. AU-002273L, ROBERT D. SHERMAN, PA. LIC. NO. AU-002566L,
GILBERT SCHWARTZMAN, PA. LIC. NO. AU-002428-L
WAFER FABRICATION
PHOTOLITHOGRAPHY
KARL SUSS MA150 Mask Aligner.
KARL SUSS MA6 Mask Aligner.
KARL SUSS RC8 Photoresist Coat/Bake Tool.
C&D SEMICONDUCTOR 8832CTD/8836HPO
2-Track Photoresist Developer.
C&D SEMICONDUCTOR 8826PC/8836HPO
3-Track Photoresist Coater.
C&D SEMICONDUCTOR 8838VP Vapor Prime Tool.
PERKIN-ELMER Micralign 552HTR Projection
Mask Aligner.
PERKIN-ELMER Micralign 552
Projection Mask Aligner.
C&D SEMICONDUCTOR 8826 3-TRACK PHOTORESIST COATER
PLASMA PROCESSING
LAM RESEARCH RAINBOW 4420B
PLASMA ETCHER
LAM 4420B Poly/Nitride Plasma Etcher.
GASONICS L3510 Downstream Photoresist Stripper.
GASONICS Aura 1000 Downstream
Photoresist Stripper.
MARCH AP 1000 Plasma Cleaning System, NEW.
APPLIED MATERIALS P-5000 Plasma Etchers.
(4) APPLIED MATERIALS 8330 and 8110
Plasma Etchers.
METROLINE/IPC 9204 Plasma Barrel Stripper, NEW.
(2) BRANSON/IPC 9104 Plasma Barrel Strippers.
(3) BRANSON/IPC P-2100 Plasma Barrel Strippers.
C&D SEMICONDUCTOR 8832 2-TRACK PHOTORESIST DEVELOPER
C&D SEMICONDUCTOR 8838 2-HEAD VAPOR PRIME TOOL
MARCH AP-1000 PLASMA CLEANER
KARL SUSS MA150 MASK ALIGNER
KARL SUSS RC8 PHOTORESIST COATER
FUSION M-150PC PHOTORESIST STABILIZER SEMITOOL EQUINOX 4-HEAD PLATER
A 10% BUYER’S PREMIUM APPLIES TO ALL ON-SITE PURCHASES
2
STS MULTIPLEX CVD
EDDY E-BEAM EVAPORATOR
VEECO-ION TECH SPECTOR ION BEAM DEPOSITION TOOL
VEECO MS50 LEAK DETECTOR
VEECO-ION TECH SPECTOR CONTROLLER
WAFER FABRICATION, cont.
WET PROCESSING
DEPOSITION
THERMAL PROCESSING
SEMITOOL Equinox 4-Head Wafer Plater.
(2) STS Multiplex CVD PECVD
Tools, NEW.
(4) MRL Coyote 430, 8", 4-tube,
(3) LPCVD, (1) Oxidation.
VEECO/ION TECH Spector
3-Target Ion-Assisted PVD Tool.
TEMPRESS 81103, 8", 3-tube,
LPCVD Furnace.
EDDY C36A E-Beam Evaporator.
AG ASSOCIATES 4108 Rapid Thermal
Processor.
SEMITOOL Equinox Single-Head Wafer Plater.
FSI Mercury Spray Acid Tool.
UNIVERSAL PLASTICS/AKRION UP-V2
Solvent and Acid Wet Stations,
w/robotics, NEW.
REYNOLDS TECH LCD-25-PVDF Auto Gold
Etch Tool.
REYNOLDS TECH LCD-25-PVDF
Auto Chrome Etch Tool.
(37) SEMITOOL Mdls. 8300, 870S, 860F,
860S, 870D, 260S Spin Rinser Dryers.
SEMITOOL SSTF2211270F
SPRAY SOLVENT TOOL
VERTEQ 1600-55
Spin Rinser Dryers, numerous.
SPUTTERED FILMS 18"
PVD Tool.
VARIAN 3190 and 3180
PVD Tools.
VARIAN 160-10 Ion Implanter.
AG ASSOCIATES 4100 Rapid Thermal
Processor.
AG ASSOCIATED 610 Rapid
Thermal Processor.
(3) BRUCE BDF-41 Diffusion Furnaces.
(2) ALCATEL ASM180T
Leak Detectors.
(2) BRUCE BDF-4 Diffusion Furnaces.
VEECO MS50 Leak Detector.
(3) BRUCE BDF-8 Diffusion Furnaces.
SOME ITEMS SUBJECT TO PRIOR SALE
3
METROLOGY/INSPECTION
KLA/TENCOR 5200 Overlay Registration Tool.
KLA/TENCOR Surfscan 6220 Wafer
Surface Inspection Tool.
KLA/TENCOR Surfscan 7700 Wafer
Surface Inspection Tool.
KLA/TENCOR P-10 Profilometer.
KLA/TENCOR Omnimap NC110.
NANOMETRICS Nanospec/AFT 9100
Film Thickness Measurement Tool.
(2) NANOMETRICS Nanospec/AFT 4000 Film
Thickness Measurement Tools.
(2) NANOMETRICS Nanospec/AFT 210UV Film
Thickness Measurement Tools.
SCI Film Tek 4000-A Reflectometer, NEW.
FLEXUS 2320I Film Stress Tester.
TENCOR P-10 PROFILOMETER
FSM Film Stress Tester.
(4) ZEISS Axiotron Microscopes.
(2) ZEISS Universal Microscopes.
NIKON Optiphot 66 Nomarski Microscope.
(20) NIKON Optiphot 66 Microscopes.
NIKON Metaphot Microscope.
KLA/TENCOR SURFSCAN 6220
WILD M8, M420 Stereo Microscopes.
LEITZ Miniload 2 Microhardness Tester.
LASERS
EO TECHNICS CSM2000 Laser Wafer Marker.
WILD STEREO MICROSCOPES
LUMONICS Lightwriter WAMS-50 Laser
Marking Tool.
(6) ESI 80 Laser Memory Repair Tools.
AOI FX 5050 Fiber Optics Laser Welder, w/NEC
FX-1801 Laser.
NANOMETRICS NANOSPEC/AFT 9100 FILM
THICKNESS MEASUREMENT TOOL
ZEISS UNIVERSAL MICROSCOPES
NIKON MEASURING MICROSCOPE
SCI FILM TEK 4000-A
4
SOME ITEMS SUBJECT TO PRIOR SALE
LEITZ MINILOAD 2 MICROHARDNESS TESTER
ASSEMBLY
(41) K&S 1488L Turbo Plus Ball Bonders.
(3) K&S 1419-3 Ball Bonders.
(22) KAIJO FB-118A Ball Bonders.
(4) ESEC 3018 Ball Bonders.
(2) ASYMTEK Millennium Glue Dispensers.
WEST-BOND 7476-E79 Manual
Wedge Bonder.
(2) LAURIER DS-4000 Speed Star Pick and
Place Tools.
(4) LAURIER DS-3000 Pick-and-Place Tools.
SEMICONDUCTOR EQUIPMENT CORP.
860 Eutectic Die Bonder.
DISCO DAD-321 Dicing Saw.
DISCO DFD S/8 Dual-Spindle Dicing Saw.
ASSEMBLY TECHNOLOGIES 1100
Dicing Saw.
LAURIER DS-4000 SPEED STAR PICK & PLACE TOOL
DYNATEX DX-3 WAFER SCRIBER/BREAKER
TECA-PRINT ICS2300 Auto Pad Printer.
TECA-PRINT ICS2200 Auto Pad Printer.
(2) FICO TFM2A Auto Trim and
Form Presses.
SEMICONDUCTOR TECHNOLOGIES 4070
Lead Inspection Tool.
VIKING 1042 Pick and Place Tool.
DYNATEX GST-150 Wafer Scriber/Breaker.
(3) DYNATEX DX-III Wafer Scriber/Breakers.
LOOMIS 38LD Wafer Scriber.
SEC 860 EUTECTIC DIE BONDER
LAURIER DS-3000 PICK & PLACE TOOL
DYNATEX GST-150 WAFER SCRIBER/BREAKER
K&S 8028 AUTO WIRE BONDER
K&S 982-2 DICING SAW
5
AUTOMATIC TEST
EQUIPMENT
<
LTX FUSION
SOC TESTERS
(2) LTX Fusion System
on Chip Testers.
(2) TERADYNE A580
Analog Testers.
(2) LTX Synchromaster
HT Testers.
(33) PWS P5 Probers.
(2) AETRIUM 5050
IC Handlers.
(2) ASECO S-170-D
IC Handlers.
(2) ASECO S-150
IC Handlers.
(5) ADVANTEST
T3340
Memory Testers.
DELTA DESIGN Turbo
Flex IC Handler.
ELECTROGLAS
4090u Prober.
SCHLUMBERGER 1DS5000 HX E-Beam Prober.
(2) ELECTROGLAS
2001CXE Probers.
SCHLUMBERGER IDSP2X Focused Ion Beam
Milling/Deposition
System.
ELECTROGLAS
2001X Prober.
ENVIRONMENTAL
ELECTROGLAS 4090u WAFER PROBERS
(2) THERMOTRON
SE-600-3-3
Temperature
Chambers, NEW.
(2) THERMOTRON
SE-600-5-5
Temperature
Chambers, NEW.
THERMOTRON
F-32-CHV-15-15
Temperature
Chamber.
TENNEY JR. TEMP. CHAMBERS
(3) AEHR TEST Max 2
Burn-In Ovens.
(2) AEHR TEST ATS12100 Burn -In Ovens.
TABAI ESPEC ECT2
Temperature Chamber.
(8) TENNEY Jr.
Temperature
Chambers.
BLUE-M, several
various models.
INSTRUMENTATION
HEWLETTPACKARD and
TEKTRONIX
Oscilloscopes, Power
Supplies and
Analyzers.
(2) AGILENT 86142B
Optical Spectrum
Analyzers, NEW.
(8) AGILENT 86141B
Optical Spectrum
Analyzers, NEW.
BUEHLER FIBRPOL POLISHERS
(5) AGILENT 86140B
Optical Spectrum
Analyzers, NEW.
(2) HEWLETTPACKARD 70951B
Optical Spectrum
Analyzers.
(5) HEWLETTPACKARD 8153A
Lightwave Multimeters.
(8) HEWLETTPACKARD 8156A
Optical Attenuators.
(20) KEITHLEY 2510
Source Meters, NEW.
(20) KEITHLEY 2000
Multimeters, NEW.
(10) ILX Lightwave
LDT-5910B
Temperature
Controllers, NEW.
(2) TEKTRONIX 576
Curve Tracers.
(20) IOTECH Extender
488 Interface Busses.
POLISHING
LOGITECH IWBT2 WAFER BONDER
(2) AEHR TEST 12100 BURN-IN OVENS
(4) LOGITECH PM528
Wafer Polishers.
(3) BUEHLER Fibrpol
Polishing Machines.
LOGITECH PM4
Wafer Polisher.
LOGITECH
and CRANE
Conditioning Rings.
LOGITECH IWBT2
Wafer Substrate Bonder.
CRANE Lapmaster 12
Polishing Machine.
LOGITECH and
CRANE Wafer
Fixtures.
FACILITIES
KINETIC SYSTEMS
Vibraplane Isolation
Tables, numerous.
TENNEY & BLUE M ENVIRONMENTAL CHAMBERS
NESLAB HX-75 CHILLERS
6
TERRA
UNIVERSAL
Dessicator Boxes,
numerous.
NEWPORT
RESEARCH Optical
Benches and Isolation
Tables, numerous.
BOEKEL
Dessicator Boxes,
numerous.
(17) NESLAB HX-75
Recirculating Chillers.
METRO Racks,
numerous.
INTERNATIONAL LOCATIONS TO BE SOLD BY VIDEO FROM READING, PA SITE
• SINGAPORE •
(14) K&S 1488L Turbo Plus Wire Bonders, w/K&S
2929 MHS, 870 PRS REV.1. 65 -0-08, 7-11-9 -04A
OPERATING SYSTEM.
(2) SEMITOOL 870S Spin Rinse Dryers.
SEMITOOL 8300 Spin Rinsers Dryer.
Custom-Made Machined Mold Press Components.
(4) ESEC 3018 Wire Bonders.
(2) FICO TFM2A Trim and Form Presses.
(1 OF 14) K&S 1488L TURBO
PLUS WIRE BONDERS
BLUE M ELECTRIC DCA-256CY
Oven, s/n DC4699.
(4) FUJI ELECTRIC
FDP -723M RF Preheaters.
(2) BLUE M ELECTRIC
MP-1406KY Ovens.
EVER TECHNOLOGIES
FP -330A BQFP Lead
Conditioning,
s/n ETS -A780.
TRIGON Sigma 101NS IC Handler. (2) BLUE M ELECTRIC
MP-246 -EY Ovens.
TRIGON Sigma 102NS IC Handler.
BLUE M ELECTRIC
MP-246SRY Ovens.
(2) TRIGON Sigma 101
IC Handlers.
KELVINATOR UC109-2 Low
Temperature Freezer.
(4) ADVANTEST T3340
SANYO MDF-435
Memory Testers.
Industrial Freezer.
(22) KAIJO FB-118A
(3) OLYMPUS SZ40 Microscopes.
Wire Bonders.
(5) DELTA DESIGN 1210 Ovens.
BLUE M ELECTRIC MP-256RY-HP
Oven, s/n Y10E223515YE.
(7) BLUE M ELECTRIC
DCA -256RY-MP Ovens.
OLYMPUS SZ30 Microscopes.
(3) KINERGY Robotic Lead
Frame Loaders.
(2) RVSI SYSTEMATION ST-50
Tape and Reel Machines,
s/n’s 75110, 7590.
TECA-PRINT ICS-2200 Pad Printer.
(1 OF 2) FICO TFM2A TRIM & FORM PRESSES
AESCO S-170-D
IC HANDLER
• BANGKOK, THAILAND •
(2) ASECO S-150 Handlers.
TECA-PRINT ICS-2300 Pad Printer.
(2) LTX SYNCHOMASTER-HT Testers, w/Sparc
Ultra NIC upgrades.
(1 OF 2) LTX SYNCHROMASTER HT TESTERS
(2) AETRIUM 4098 Handlers.
(20) K&S 1488L Turbo Plus Wire Bonders,
w/Flex Line III MATERIAL HANDLING SYSTEM.
ICE 5T Trim and Form Press.
FICO TFM2A TRIM & FORM PRESS
(3) AETRIUM 5050 IC Handlers.
(2) ASECO S-170-D IC Handlers.
EO TECHNICS CSM 2000 Laser Wafer Marker.
TECA-PRINT ICS-2300 PAD PRINTER
(3) AST 960
Marking Machines.
AMERICAN TECH
MANUFACTURING
AT -1045FP Lead
Conditioning Tool.
ICE SP -5T Auto Trim and
Form Press.
(2) DUSAN 5500 Presses.
(2) ICE SP -5T Manual Trim
and Form Presses.
KAI N WAH Hydraulic
Press System.
SEMITOOL 8300 & 870S SPIN RINSE DRYERS
7
TERMS OF SALE
NO WARRANTIES: Every item and lot in the “Auction” is sold: (a) “AS IS,
WHERE IS, AND WITHOUT RECOURSE,” and (b) with no warranties,
guarantees or representation of any kind or variety, whether expressed,
implied or otherwise.
MACHINERY: A 10% buyer’s premium applies to the purchase price of all
on-site purchases. A 13.5% buyer’s premium applies for all on-line purchases.
Cash or certified funds required in full at the time and place of auction.
Non-certified checks will NOT be accepted unless accompanied by a valid
bank letter of guarantee, which must be in the following format: This bank
guarantees payment to Michael Fox International from (name of customer)
on account #_________ up to the amount of $______. This letter is valid for
purchases at the auction held at Agere Systems on Wednesday and Thursday,
November 13 and 14.
AUCTION SITE
INSPECTION
Monday and Tuesday, November 11 and 12 from 10:00 A.M. to 4:00 P.M. or
by appointment.
AIRPORT
DIRECTIONS
From the Philadelphia International Airport: I-95 South to I-476 North for
approximately 15 miles to I-76 West for approximately 4 miles to the
Pennsylvania Turnpike. Take the Pennsylvania Turnpike west to I-176 North.
Drive approximately 17 miles to Route 422 West. Drive approximately 5 miles
to Route 12 East. Drive approximately 2.5 miles to the 11th Street exit.
Turn left onto North 11th Street. Turn right onto Agere Way to auction site.
AIRPORT & TRANSPORTATION
The area is served by the Reading Municipal Airport, approximately 5 miles
northwest of the auction site and the Philadelphia International Airport,
approximately 60 miles southeast of the auction site.
OVERNIGHT ACCOMMODATIONS
Hampton Inn..............................................................................(610) 374-8100
Homewood Suites .....................................................................(610) 736-3100
Sheraton.....................................................................................(610) 376-3811
INFORMATION PROVIDED IS BELIEVED TO BE ACCURATE,
BUT IS NOT GUARANTEED
LEASING INFORMATION
PRE-APPROVED LEASE/FINANCE CREDIT LINE AVAILABLE
In order to establish a lease/finance credit line for qualified purchasers that can be used for purchases at this
or future Michael Fox International auctions, please contact...
Horizon-Keystone Leasing Services
John Messersmith
Phone (800) 514-2323 • Fax (800) 606-0037
The auction bidder must provide Michael Fox International, Inc. with a letter from the lease/finance company in the
following format: The lease finance company ________ guarantees payment to Michael Fox International, Inc. on a
non-contingent basis for purchases at the auction of Agere Systems on November 13 and 14.
STATE-OF-THE-ART SEMICONDUCTOR MANUFACTURING EQUIPMENT
FIRST CLASS MAIL
POSTMASTER: Dated Material.
Please Deliver Promptly.
EXECUTIVE OFFICES
11425 CRONHILL DRIVE, OWINGS MILLS, MARYLAND 21117
(410) 654-7500 • (800) 722-3334 • Fax (410) 654-5876
NORTH AMERICAN OFFICES
CALIFORNIA, CANADA, FLORIDA, ILLINOIS, MARYLAND, MASSACHUSETTS, MICHIGAN, NEW YORK, PENNSYLVANIA, TEXAS
INTERNATIONAL OFFICES INCLUDING
UNITED KINGDOM, AUSTRIA, BELGIUM, GERMANY, POLAND, TURKEY, CHINA,
INDONESIA, KOREA, PHILIPPINES, SINGAPORE, MALAYSIA, THAILAND
www.industrialauctioneers.org
http://www.michaelfox.com
e-mail: info@ michaelfox.com
WEDNESDAY & THURSDAY
NOVEMBER 13 & 14
9:00 A.M. EACH DAY
READING, PENNSYLVANIA
IP-2145131
Presorted
First Class Mail
U.S. Postage
PAID
Eugene, Oregon
Permit No. 305