676 Maintenance Manual Volume 2

Transcription

Title
Maintenance
Manual
Volume 2 of 4
Revision B.1
June 25, 1999
4409-106227-001 Standard Paper
4409-106227-002 Clean Room Paper
AvantGaard™ 676 Maintenance Manual
Revision and Change Record
Introduction
The table below summarizes the history of this document. It identifies the issue date, titles and dates of revisions and
changes, and affected pages.
Updating
Procedure
SpeedFam-IPEC Information Development and Delivery Department and SpeedFam-IPEC Engineering are responsible
for the content and accuracy of information in this document. Although effort has been made to create a complete,
accurate, and usable document to support SpeedFam-IPEC AvantGaard™ series equipment, quality improvement is an
ongoing process.
To report any errors or inaccuracies in this manual, or to recommend quality improvement changes, complete the
“Revision / Change Suggestion Form” located at the end of this document and send it to SpeedFam-IPEC Information
Development and Delivery.
06/25/1999
REV.
CHG.
ISSUE DATE
TITLE
A
N/A
05/01/97
A.1
Various
11/01/97
Update Pages - Refer to TSB# 9711HMSA
A.2
Various
02/01/98
A.3
Various
06/05/98
B
Various
03/19/1999
Complete Revision - Refer to TSB# 99676-008
B.1
Various
06/25/1999
Adds Russian Translations to Safety - Chapter 3
ii
AvantGaard™ 676 Chemical Mechanical Planarization System
The graphics in this manual are for reference only and may not match the option configurations on the
equipment at your site. Refer any questions on optional components to SpeedFam-IPEC Technical Support
Services.
Copyright
Information
This document contains information that is proprietary to SpeedFam-IPEC, and may not be duplicated, used, or
disclosed for any purpose without written permission from SpeedFam-IPEC. This document is protected as an
unpublished work under the U.S. Copyright Act of 1976, as well as under all other pertinent domestic and international
intellectual property provisions.
Created May 01, 1997 through March 19, 1999. Copyright SpeedFam-IPEC. All rights reserved.
All trademarks not belonging to SpeedFam-IPEC are referenced for informational purposes only and are the property of
third parties. The proprietary trademarks listed below are property of SpeedFam-IPEC.
SpeedFam-IPEC
AvantGaard™
Verification of Whenever possible and practical, SpeedFam-IPEC technical manuals, or sections of manuals, are validated at the
Technical
factory by actually doing the procedures in the manuals. The validation process consists of doing the actual
Data
maintenance of the equipment precisely in accordance with the procedures specified in the applicable technical
manual. Any required changes or corrections of the technical data, indicated by doing this verification, are then included
into the manual.
The following listed sections of this manual have been verified at the factory on the date(s) indicated.
Technical
Assistance
06/25/1999
Verified Sections
Method
Verification Date
Control Systems
Tool Operation
Simulation
Simulation
May 01, 1997
May 01, 1997
For 24 hour Technical Support, Spare Parts, or Process Engineering, contact SpeedFam-IPEC Technical Support Hot
Line at 1-877-NEED-CMP.
iii
Notes:
06/25/1999
iv
Chapter 11
Troubleshooting and Diagnostics
Contents
This chapter contains the following topics:
Topic
06/25/1999
See Page
Introduction
11-3
Recovering from a Panel Interlock Violation
11-4
Checking the Polish Heads for Leaks
11-5
Detecting Fluid Leaks
11-9
Detecting Purge Blockages
11-10
Detecting Wafer Head Leaks
11-11
Troubleshooting Polish and Wafer Heads
11-13
Troubleshooting the Delta-P System
11-16
Troubleshooting (Fault Isolation) Flowcharts
11-23
Robot Wand Jerking On Rotation
11-54
Luxtron System Does Not Start
11-55
Luxtron System Does Not Stop The Recipe
11-67
No Signal From the Luxtron Current Sensors
11-74
Luxtron Configuration Files
11-81
F76 System Does Not Start
11-87
AvantGaard™ 676 Maintenance Manuall
11-1
Topic
06/25/1999
See Page
F76 System Does Not Stop
11-94
F76 System No Signal From Sensors
11-99
ServSwitch System Troubleshooting
11-110
11-2
Introduction
Overview
Use the troubleshooting (fault isolation) and diagnostic procedures to quickly discover and resolve Tool
problems so down time can be minimized. When the following troubleshooting procedures are correctly
used, most Tool problems can be solved without having to call for additional internal or external help.
This chapter gives basic strategies and procedures for troubleshooting and doing diagnostic work on the
Tool. Procedures are given for recovering from system faults and doing basic troubleshooting procedures
on the Tool.
Process
During all troubleshooting (fault isolation) procedures use a logical system approach, process of
elimination, and the follow the written procedural Steps to determine the cause of Tool problems. During
the fault isolation process, the most effective approach is to use a logical sequence to test one item at a
time to locate and eliminate the problem.
Modular
Systems
Most systems on the Tool are modular. Because of the Tool design, some systems can continue to
function while others are stopped to do component repair and replacement. Many Tool assemblies, like
the electrical panels and pneumatic panels can be completely replaced with new units while repair work is
completed off site on failed components.
06/25/1999
11-3
Recovering from a Panel Interlock Violation
Description Opening any interlocked door will cause a panel interlock violation. All motion in the Tool will be halted
and all air shut off to the Tool.
Recovery
Do the following Steps to recover from an interlock violation.
Step
06/25/1999
Instruction
1
Physically make sure all interlocks are set and the doors and panels are in the correct
locations on the Tool.
2
Push the Panel Reset button located on the front of the Electrical Cabinet. If the Panel Reset
light comes on, all interlock violations have been corrected.
3
Clear all wafers from the heads, spray boxes, and robot.
4
Respond to all messages on the SysCon screen, then re-initialize the Tool.
11-4
Checking the Polish Heads for Leaks
Description A drop in the pressure displayed on the polish transducer could indicate a leak in the system.
Check for
Leaks
Do the following procedure to make sure the Polish Head have no leaks.
Step
1
Instruction
Remove the MP exterior panels and reset the interlocks.
WARNING - MAKE SURE ALL PERSONNEL STAY A SAFE DISTANCE FROM THE TOOL WHEN IT IS IN
SERVICE MODE. SERVICE MODE OPERATIONS EXPOSE PERSONNEL TO INCREASED RISKS AND
MECHANICAL HAZARDS. THE TOOL WILL DO ANY COMMAND GIVEN, REGARDLESS OF THE
CONDITION OF THE TOOL COMPONENTS OR ASSEMBLIES. DAMAGE TO PERSONNEL, EQUIPMENT,
OR PRODUCT IS POSSIBLE UNTIL THE TOOL IS NO LONGER IN SERVICE MODE.
2
Initialize the MP to be tested in Service Mode.
3
Display the Discreet and Analog I/O screens.
4
Toggle vacuum ON, then place a wafer in the wafer head.
5
Direct the wafer head down, then toggle wafer vacuum OFF.
Continued
06/25/1999
on next page
11-5
Checking the Polish Heads for Leaks, continued
Step
Instruction
6
Command 3 PSI on both polish air and wafer air and then enable both in the same order.
7
Use your hand to pinch and hold the polish air supply line to the head, then monitor the
polish transducer for any change in pressure. If the pressure drops, there is a leak
somewhere in the system. If there is a leak, do the procedure Steps on the next page.
Continued
06/25/1999
on next page
11-6
If the
Pressure
Drops
Do the following procedure if the Polish Head leaks.
Step
Instruction
1
Make sure the polish transducer is working correctly by connecting the output of the E/P
regulator directly to the input of the transducer.
2
Use your hand to pinch and hold the E/P output line, then monitor the polish transducer for
any change in pressure.
3
If the displayed pressure does not change, the air leak is most likely in the polish bell
assembly.
4
Direct the MP to apply 1 PSI to the polish pad with the wafer head in the up position. This
will inflate the bladder
5
Spray DI water on the pad and look for bubbles.
6
If no bubbles are detected, stop the flow of polish air, then remove the pad.
7
Apply 0.5 PSI to the bladder and use Snoop leak detection liquid, or equivalent, on and
around the bladder.
8
If no leaks are detected, remove the bladder and troubleshoot for leaks in the polish bell
under the bladder.
Continued
06/25/1999
on next page
11-7
Step
9
06/25/1999
Instruction
Look for liquid in the polish bell when lifting up the bladder.
10
If there are no signs of liquid, then the leak is probably in one of the fittings underneath the
bladder. Refer to Detecting Fluid Leaks.
11
Make sure the two polish air lines are good from the lower pneumatics panel by connecting a
tubing between the polish air input and polish air return lines and repeat the pinch off test
described before.
11-8
Detecting Fluid Leaks
Inspect for Do the following procedure to visually inspect below the Polish head for fluids.
Fluid Leaks
Step
Instruction
06/25/1999
1
Remove the MP Lower Pneumatic panels and visually look for fluids inside the bottom of the
Tool.
2
If there are fluids, determine if leak is coming from the Lower pneumatics panel, or from the
tubes that connect to the bottom of the Polish head.
3
If fluid is leaking past the bladder and back in to the polish air return line, the filter will fill up,
overflow, and fluid will collect in the bottom of the Tool.
4
If there is a leak in the tubes that connect to the Polish head, remove the Polish Bell to gain
access to the tubing connectors.
5
If a leak is suspected inside the polish bell, wipe off the bladder until it is dry. Remove the
bladder and look for fluid under the bladder before it is removed, this will make sure that you
are not dripping fluids into the polish bell. If there is evidence of a leak in this area, you can
look for leaks in the lines by closing off the tubes and manually turning on Purge, DI water,
and Slurry to isolate leak.
11-9
Detecting Purge Blockages
Clearing
Blockages
If you are unable to get fluids out through the bladder fitting, do the following procedure to determine the
cause of blockages.
CAUTION - Do not leave slurry pumps running for a long period of time. You may over
pressurize the lines and possibly cause a tubing line to come off in the Slurry Box.
06/25/1999
Step
Instruction
1
Determine if the blockage affects all fluids, or just the slurry pumps, by enabling the Purge I/
O and making sure DIH2O comes out the center hole. If no water comes out, try slurry 1,
then slurry 2.
2
If there is no fluid flow, remove the bladder. Clean the bladder fitting and the tubing that it
connects to. The beswick fittings for the slurry line can get some build up on the inside and
reduced flow can result.
3
If after doing a Slurry Pump test / calibration procedure you are not able to get good flow
through the bladder fitting, clean out the beswick fittings and lines before and after the fitting.
4
Make sure the rinse lines that go to the 20 holes around the lower V-clamp ring are not
clogged. These lines can become clogged if the bladder is not centered properly during
installation.
11-10
Detecting Wafer Head Leaks
Air Leaks
Refer to Figure 11-1 to locate pneumatics components required to do the procedures in Table 11-1 on
page 11-12.
Figure 11-1. MP Upper Pneumatics Panel
Continued
06/25/1999
on next page
11-11
Detecting Wafer Head Leaks, continued
Table 11-1. Detecting Wafer Head Leaks
Step
06/25/1999
Instruction
1
Write down the Vacuum Switch/Sensor reading in the MP Upper Pneumatics panel with a
wafer installed in the wafer head. -14.8 psi is nominal.
2
Use a 3 foot length of 1/4” air line to route the vacuum to the sensor in the adjacent upper
pneumatics panel and compare readings. The difference in readings should not be greater
than 1 to 2 mm.
3
Disconnect the lines at the vacuum generator marked VACUUM. With the 3 foot air line,
connect the sensor directly to the vacuum source. A large difference between this reading
and the reading in Step 1 shows a vacuum leak.
4
Disconnect the orange air pressure line going from the wafer air solenoid MO28 to the Tfitting and block it. If the vacuum reading improves, then MO8 may be leaking
5
Trace back to the wafer head to locate the leak.
6
Make sure the air lines are not leaking in carrier and polish heads. Pinch off the source and
make sure pressure does not change from the setting listed above.
11-12
Troubleshooting Polish and Wafer Heads
Variable
Speed
Inverter
Each pair of wafer carrier and polish head motors is driven by a Toshiba VF-SX Variable Speed Inverter.
For a more detailed description of the inverter touchpad functions, refer to the Toshiba VF-SX Digital
Inverter Operator Manual that can be requested from SpeedFam-IPEC Customer Service.
To troubleshoot head drive problems, use a functional planarizer as a working standard for comparing
digital readouts and voltage/resistance readings to pinpoint problem areas. When encountering
suspected drive problems, make sure that the 2 breakers below the inverter are on. Snap-off the inverter
lower cover. If neither motor is turning, make sure line voltage is (208 VAC) at the R/L1, S/L2, and T/L3
terminals on the lower terminal strip of the inverter. See Figure 11-2.
E/G
R/L1 S/L2 T/L3 U/T1 V/T2 W/T3
PA
PB
Figure 11-2. Main Circuit Terminals (Three Phase)
Continued
06/25/1999
on next page
11-13
Troubleshooting Polish and Wafer Heads, continued
Connection If only the polish head is turning, or only the wafer head operates, then suspect problems in that head’s
s
gearbox, since both heads operate from the same voltage source
.
From terminals U/T1, V/T2, and W/T3, trace drive voltages through the Harting connectors, and at the
junction box next to the motor. Proper voltages at these locations point to a bad motor or frozen drive.
Refer to Figure 11-4 for a diagram of the Control Circuit Terminal Strip used in the remainder of this
procedure.
RST
AD2
F
CC
R
SS1
ST
SS2
(JOG)
CC
PP
SS3
(EX)
FM
(AM)
CC
RR
IV
CC
CC
FLA
RCH
(UL)
FLB
LOW
(LL)
FLC
P24
Figure 11-3. Toshiba VF-SX Control Circuit Terminal Strip
Continued
06/25/1999
on next page
11-14
Troubleshooting Polish and Wafer Heads, continued
Look at the analog 0-10 DC voltage at the RR terminal below the keypad. This is the control voltage from
the spindle speed I/O channel. If there is no signal when the motor speed is entered onto the Tool screen,
then there is a problem in the planarizer computer, MisticÆ bricks, or cabling.
To isolate control problems from drive problems, start the drive from the touchpad by following the
procedure in Table 11-2 on page 11-23.
06/25/1999
11-15
Troubleshooting the Delta-P System
Contents
To troubleshoot the Delta-P System, use the following pages to pinpoint problem areas in the system so
they can be repaired quickly and the Tool can be returned to Production Mode.
Topic
06/25/1999
See Page
Full Scale Output on Polish Pressure Regulator
11-17
Full Scale Output on Wafer Pressure Regulator
11-18
Full Scale Negative Measurements on P/I Transducers
11-19
Incorrect Delta-P Values After Polish Start-up
11-20
Wafer Loss During Pressure Ramp-Up
11-21
Polish Pressure Does Not Keep Recipe Values
11-22
11-16
Full Scale Output on Polish Pressure Regulator
Overview
A full scale output will take place as the PID tries to increase the I/P, E/P command to reach the target
pressure. If the feedback (Pressure Transducer) is not operating properly, the measured pressure is not
observed to change, so the PID will output full scale to the I/P, E/P.
Connection Look at the connections to the Polish P/I Transducer. Make sure the Polish P/I Transducer is supplying
s
pressure feedback. Do the “Delta-P Polish Test” on page 12-107.
06/25/1999
11-17
Full Scale Output on Wafer Pressure Regulator
Overview
Full scale output will take place as the PID tries to increase the I/P, E/P command to reach the target
pressure. If the feedback (Pressure Transducer) is not operating properly, the measured pressure is not
observed to change. The PID will output full scale to the I/P, E/P.
Connection Look at the connections to the Delta-P P/I Transducer. Make sure the Delta-P P/I Transducer is supplying
s
pressure feedback. Do the “Delta-P Wafer Test” on page 12-113.
06/25/1999
11-18
Full Scale Negative Measurements on P/I Transducers
Overview
The Mystic I/O system will signal an open connection on a 4-20mA current loop input with negative full
scale on the I/O channel.
Connection Make sure the hoses connected to the P/I Transducers are not pressurized. If the measurements are still
s
full scale negative, make sure the electrical connections are good between the P/I to the 676 I/O cabinet.
Do the “Delta-P Polish Test” on page 12-107.
06/25/1999
11-19
Incorrect Delta-P Values After Polish Start-up
Do the “Delta-P Wafer Test” on page 12-113.
06/25/1999
11-20
Wafer Loss During Pressure Ramp-Up
Overview
Loss of a wafer during pressure ramp-up is the result of the interaction of the Polish I/P, E/P and the PID
controller trying to track a reference ramp that has changed too quickly to be tracked smoothly. As the
reference pressure and the measured pressure increases, the I/P, E/P valve opens fully causing a large
pressure surge until the target pressure is reached and is then closed off. A large change in the Polish
Pressure rate, from slow to very fast, then back to very slow, may result making the Delta-P controller
unable to track the pressure. The impact on the Delta-P controller drops the Delta-P measurement to 0
psi.
Decrease
Examine the Inside Diameter (ID) hoses used to pressurize the Polish Bell. Make sure the hoses are
Polish Rate connected correctly. Decrease the Polish pressure rate from 0.5 psi/sec to 0.25 psi/sec. Do the “Delta-P
Polish Test” on page 12-107.
06/25/1999
11-21
Polish Pressure Does Not Keep Recipe Values
Connection Make sure the lines from the Polish I/P, E/P are not crimped and the Polish Bell Bladder has no leaks.
s
Make sure the pressure lines are not disconnected.
Do the “Delta-P Polish Test” on page 12-107.
06/25/1999
11-22
Troubleshooting (Fault Isolation) Flowcharts
Description Use the flowcharts on the following pages to isolate faults in the Tool so they can repaired quickly and the
Tool can be returned to Production Mode.
Table 11-2. Fault Isolation Flowcharts
Name
Number
Page
Problem With Device In Electrical Cabinet
9631-702181
11-25
Tool Points
9631-702182
11-26
Broken Wafer
9631-702183
11-28
Cassette Not Lowering Completely
9631-702184
11-29
Not Chucking
9631-702185
11-30
Cross Slotting
9631-702186
11-31
Delta-P Fluctuates
9631-702187
11-32
Head Up Times Out
9631-702188
11-33
Head Is Knocking
9631-702189
11-34
Incorrect Rate
9631-702190
11-35
Liquid Spills
9631-702191
11-36
MP Does Not Park
9631-702192
11-37
No Pick Off Pad
9631-702193
11-38
Pad Conditioner Problems
9631-702194
11-39
Robot Loses or Slides Wafer Off Wand
9631-702195
11-40
Continued
06/25/1999
on next page
11-23
Troubleshooting (Fault Isolation) Flowcharts, continued
Name
06/25/1999
Number
Page
Wand Vacuum Problems
9631-702196
11-41
Wafer Shows Scratches
9631-702197
11-42
Shield Sensor Alarms
9631-702198
11-43
Unusual Noise
9631-702199
11-44
Wafer Thrown Out of Head
9631-702201
11-45
Cassette Shudders On Rotation
9631-702202
11-46
Brick Power Loss (-4 Error)
9631-702203
11-47
Communication Loss From Computer AC37 Card (-29/-30 Error)(-29/-31
Error)
9631-702204
11-48
Multiple Load Attempts
9631-702205
11-49
Main Cylinder Problems
9631-702206
11-50
Digital Output Failure
9631-702207
11-51
Digital Input Failure
9631-702208
11-52
Analog Output Failure
9631-702209
11-53
11-24
Problem With Device In Electrical Cabinet
9631-702181
PROBLEM WITH DEVICE IN
ELECTRICAL CABINET
PROBLEM WITH DEVICE IN ELECTRICAL CABINET
9631-703019v. 1A 8/1/96
ENGINEERING APPROVAL:______________
Are all cables/wires
to device
connected?
Power
Down
Tool
No
Connect cable/wire to
proper receptical and
power up device
Yes
Does device have
a fuse?
Yes
Is the fuse blown?
Yes
Power
Down
Tool
Replace Fuse
No
No
Is power present at
Input to device?
No
Trace
connection
from the input
to power
source or
previous
device.
Is power present at
output of source?
No
Call engineer
No
Rewire the run
Yes
Power
Down
Tool
Yes
Is continuity
between device
and power source
or prev device
good?
Does
component have
communication
cable?
Yes
Yes
Reseat connection and
power up.
Is device
communicating?
No
Yes
Power
Down
Tool
Is output from
device good?
Power
Down
Tool
No
No
No
Replace Device.
06/25/1999
Call engineer
Replace device or
board.
Call engineer
11-25
Tool Points
9631-702182
TOOL POINTS
TOOL POINTS
Have you
isolated the
problem?
No
Isolate and
trouble-shoot
the problem.
A
Yes
Is it a pick from
cassette
problem?
Yes
Yes
Does the tool
point need to
be changed?
No
Yes
Is it cassette 1?
Fix the
Cassette.
No
Do not perform
the tool point
procedure.
Is it a return to
cassette
problem?
Yes
Do you have a
bent wand?
Yes
Begin the Tool
Point
procedure at
the start.
Yes
Does the tool
point need to
be changed?
No
Yes
No
Is it cassette 1?
Fix the
cassette.
Re-teach pick
from cassette
2.
Re-teach pick
from cassette
1.
Yes
No
Do you need to
teach tool
points?
No
Re-teach
return to
cassette 2.
Re-teach
return to
cassette 1.
Yes
No
No
Has the robot
shifted out of
position?
No
Check robot
and re-teach
all tool points.
Is it an align
wafer problem?
Are alignment
pins bent/
loose/
misaligned?
Yes
Yes
Are the
Pneumatics
correct?
Yes
No
No
Trouble-shoot
the appropriate
pneumatic
panel.
Is it a load
scrub problem?
Yes
Is the spray box
guide
positioned
properly?
No
No
Fix alignment
pins.
Yes
Re-teach
station 2.
Is it station 1?
Re-teach
station 1.
Yes
Is it scrub 1?
No
Re-teach scrub
2.
Yes
No
Fix the guide.
No
Is the robot
wrist
functional?
No
Will you need to
re-teach any
tool points?
Yes
Repair the wrist and reteach all tool points.
Is it an unload
scrub problem?
Yes
Re-teach scrub
1.
Yes
Yes
No
Repair the wrist
and verify tool
points.
Is the spray box
guide
positioned
properly?
No
Yes
Re-align the
guide.
Is it scrub
1?
No
Yes
Re-teach scrub
2.
Re-teach scrub
1.
No
A
Engineer Approval:__________________
9631-703020 V1A 8/1/96
B
9631-703020 V1A 8/1/96 (pg. 2)
Continued
06/25/1999
on next page
11-26
Tool Points, continued
9631702182
B
C
No
Is it a "ghost
wafer"
problem?
No
Yes
Does the tool
point need to
be changed?
No
No
Are you cross
slotting?
Yes
Does the tool
point need to
be changed?
No
No
Is it cassette
1?
Yes
Yes
Fix the
cassette.
Is the
problem in
the spray
box?
Fix the
cassette.
No
Is it a load
problem on
MP1?
Yes
Does the tool
point need to
be changed?
No
No
Is it a load
problem on
MP2?
Yes
No
Is it a load
problem on
MP3?
Yes
06/25/1999
No
Yes
Is it at
cassette 1?
Re-Teach
unload scrub
or inspect
spray box
fixtures.
Yes
Yes
No
Re-teach
Theta cassette
2.
Re-teach
Theta cassette
1.
Re-teach load
on MP1.
Repair wafer
head.
Is it a load
problem on
MP4?
Yes
Is it an unload
problem on
MP1?
Re-teach load
on MP2
Repair wafer
head.
Yes
No
Is it an unload
problem on
MP2?
Yes
is it an unload
problem on
MP3?
Yes
Re-teach load
on MP3.
Is it an unload
problem on
MP4?
Repair wafer
head.
Yes
Re-teach
unload on
MP1.
Yes
Re-teach
unload on
MP2.
Yes
Re-teach
unload on
MP3.
Yes
Re-teach
unload on
MP4.
Repair polish
head.
Does the tool
point need to
be changed?
No
9631-703020 V. 1A 8/1/96 (pg. 3)
Yes
Repair polish
head.
Does the tool
point need to
be changed?
No
Re-teach load
on MP4.
Repair polish
head.
Does the tool
point need to
be changed?
No
Yes
Repair wafer
head.
Does the tool
point need to
be changed?
No
No
Yes
Does the tool
point need to
be changed?
No
No
No
Yes
Does the tool
point need to
be changed?
No
C
Re-teach Delta
R cassette 1.
Yes
Does the tool
point need to
be changed?
No
Re-teach Delta
R cassette 2.
No
Repair polish
head.
9631-703020 V1A 8/1/96 (pg. 4)
11-27
Broken Wafer
9631-702183
Broken Wafer
Page 2
9631-703021 V. 1A 8/1/96
Engineering Approval:_____________
Broken Wafer
9631-703021 V. 1A 8/1/96
Hardware
Operator
Software
Hardware (See Page 2)
Did the boat load
properly?
Is Delta P
positive?
Yes
Check Delta P
software setting.
Perform Leak Down
(S-CM004)
Did the robot run
into something?
Yes
Contact Engineer
Check cassette for
foreign objects and
loose combs
Is wand bent or
damaged?
Yes
Did the wand lose
vacuum?
No
No
No
Yes
Replace wand
No
Yes
Check vacuum
sensors, clean lines,
check tape for
delamination
Yes
Perform leak down test
(S-CM044)
Yes
Clean lines, check
fittings and check flow
rate
Call Engineer
No
Is there a
foreign object
or physical
obstruction
somewhere on
the machine?
Has the recipe
been modified?
Yes
No
Correct recipe
Did the head lose
polish pressure?
No
No
No
No
Is there a
hardware
installation/
setup problem
on the
machine?
Yes
Remove obstruction
Did the wafer load
correctly?
Did the machine
lose slurry flow?
Yes
Yes
Correct the problem
Contact Engineer for
support
No
Yes
No
Lose edge gap?
Yes
Adjust edge gap to
spec
Yes
Adjust guide(s)
Is the tool point
good?
No
Call Engineer
Is problem related
to spray box guide
alignment?
No
Adjust tool point
06/25/1999
11-28
Cassette Not Lowering Completely
9631-702184
CASSETTE NOT LOWERING
COMPLETELY
Air pressure O.K.?
No
Yes
Is needle valve
functioning and
adjust properly?
Is air line pinched?
No
Is air line leaking?
Yes
Yes
Straighten tube and
dress it properly
Replace tube or fitting
No
Adjust or replace valve
as required
Yes
Remove obstruction
Yes
Inspect cylinder for
corrosion
Yes
Remove lower needle
valve and dry out
cylinder
No
Call Engineer
Yes
Is something
obstructing the
movement of the
cylinder?
No
Did failure occur
gradually?
No
Is water in the
cylinder?
No
Contact Engineer
9631-703022 V1A 8/1/96
06/25/1999
11-29
Not Chucking
9631-702185
NOT CHUCKING
NOT CHUCKING
IS WAFER ON
WAND?
No
SEE "PHANTOM"
WAFER.
IS VACUUM ON
UPPER HEAD?
No
FIX VACUUM
PROBLEM.
Yes
REPLACE SENSOR.
No
CALL ENGINEER.
Yes
CALL ENGINEER.
No
CALL ENGINEER.
Yes
ADJUST TOOLPOINT.
Yes
No
DID WAFER
SLIP?
Yes
SEE "WAFER SLIPS".
IS VACUUM
SENSOR
DEFECTIVE?
No
No
IS V-BAND
CLAMP
TIGHT?
No
DOES SIGNAL
GO TO I/O?
TIGHTEN.
Yes
NO
IS WEAR RING
LOOSE?
YES
Yes
TIGHTEN.
Yes
IS I/O BLOCK
DEFECTIVE?
No
No
ARE O-RING’S
WORN?
YES
Yes
REPLACE.
DOES SIGNAL
GO TO
COMPUTER?
Yes
No
ARE THE
DF200 HOLES
PLUGGED?
Yes
CLEAN OUT OR
DRILL OUT.
DOES
TOOLPOINT
NEED
ADJUSTMENT?
No
CALL ENGINEER.
Engineering Approval:__________________
9631-703023 V1A 8/1/96
06/25/1999
11-30
Cross Slotting
9631-702186
Cross Slotting
9631-703024 V. 1A 8/1/96
Engineer Approval:_____________
Are machine
toolpoints at
cassette
functional?
No
Cross Slotting
Page 2
9631-703024 V. 1A 8/1/96
Engineering Approval:__________
Adjust toolpoints
Cont. From Page 1
Yes
Is the wand
mechanical setup
(I.E. cant) correct?
No
Adjust wand setup
Operator
interferred?
Yes
Did the wafer slide
off the polish pad?
Yes
No
Is wafer releasing
from the wafer
head?
Is wand striking
the wafer?
Yes
Is pad
delaminated?
proper air and
water flow
through pad?
No
No
Yes
No
Adjust Z movement
to contact wafer
Change polish pad
Check polish head
pneumatic and
water systems
Yes
Contact
Engineer
Yes
Keep clear of system
during operation
No
Is cassette seated
correctly?
No
Is cassette
properly loaded?
Yes
Check wafer comb in
bottom of cassette and
cassette guides on
elevator
No
No
Check upper head
pneumatics
Yes
Reseat boat
Yes
Was wafer placed
in spray box
wrong?
Yes
Did wafer slide
on wand?
Yes
No
See page 2
Clean robot
pneumatic lines
No
Is wand bent?
Yes
Replace wand. Verify
toolpoints.
Is cassette
damaged?
Yes
Replace cassette
No
Is spray box
guide adjusted
properly?
No
Yes
Call Engineer for
support
No
Contact Engineer
Align spray box
guide. Adjust tool
points as required.
06/25/1999
11-31
Delta-P Fluctuates
9631-702187
DELTA P
FLUCTUATES
∆ P FLUCTUATES
EDGE GAP OK?
IS FLUCTUATION
MORE THAN + .05
PSI?
No
ADJUST EDGE GAP
Yes
Yes
V-BAND CLAMP
TIGHT?
No
TIGHTEN.
Yes
IS VERTICAL
RUNOUT ON
WAFER AND
POLISH HEADS
OK?
No
MAKE
ADJUSTMENTS
Yes
PERFORM LEAK
DOWN TEST. BOTH
UPPER AND LOWER
HEAD.
WAS LEAK
DETECTED?
CHECK CYLINDER
FOR SHAVINGS.
Yes
REPAIR LEAK.
ARE SHAVINGS
PRESENT?
Yes
REPLACE CYLINDER.
No
No
CHECK ALL
TRANSDUCER LINES
FOR FLUID.
(UPPER AND LOWER
PNEUMATIC
PANELS.)
FLUID IN LINES?
CALL ENGINEER.
No
CHECK EDGE GAP.
Yes
DRAIN FLUIDS.
Engineer Approval:________________________
9631-703025 V1A 8/1/96
06/25/1999
11-32
Head Up Times Out
9631-702188
HEAD UP TIMES OUT
HEAD UP TIMES OUT
IS SENSOR
MALFUNCTIONING?
Yes
REPLACE SENSOR.
No
IS SENSOR IN
POSITION?
No
ADJUST SENSOR.
No
REMOVE AIR FROM
HEAD, CONTACT
ENGINEER.
Yes
DOES HEAD
MOVE?
Yes
DOES HEAD TIME
OUT WITH AIR
FROM ANOTHER
CYLINDER?
Yes
No
IS CYLINDER
KEYSTOCK
BINDING?
No
IS NYLATRON
KEY BINDING?
Yes
Yes
REPLACE CYLINDER.
REPLACE KEY.
No
CALL ENGINEER.
INITIALIZE HEAD.
No
IS AIR
PRESSURE O.K.?
No
CHECK MAIN
AIR VALVE.
IS MAIN AIR
VALVE
FUNCTIONING?
IS HEAD
INITIALIZED?
Yes
No
Yes
REPLACE VALVE.
FIND AND SECURE
PNEUMATIC LEAK.
Yes
IS HEAD UP
VALVE O.K.?
Yes
CALL ENGINEER.
No
REPLACE VALVE.
Engineer Approval:____________________
9631-703026
Rev. 1A
8/1/96
06/25/1999
11-33
Head Is Knocking
9631-702189
WAFER HEAD IS "KNOCKING"
iS THERE
PROPER SLURRY
FLOW TO THE
HEAD?
No
CORRECT SLURRY
FLOW PROBLEM.
Yes
IS WEAR RING
OUT OF SPEC
FOR WAFER
RECESS OR
INSIDE
DIAMETER?
Yes
REPLACE WEAR
RING.
IS BACKING
PLATE
CENTERED IN
WEAR RING?
No
CENTER BACKING
PLATE.
ARE UPPER AND
LOWER V-BAND
CLAMPS TIGHT?
No
TIGHTEN CLAMPS
No
TORQUE SCREWS
TO TORQUE SPEC
No
Yes
ARE WEAR RING
SCREWS
PROPERLY
TORQUED?
Yes
CONTACT
ENGINEER.
9631-703027
Rev. 1A 8/1/96
06/25/1999
11-34
Incorrect Rate
9631-702190
Incorrect Rate
Page 2
9631-703028 V. 1A 8/1/96
Engineering Approval:___________
Incorrect Rate
9631-703028 V. 1A 8/1/96
Engineering Approval:____________
Old pad?
Yes
Replace polish pad
Yes
Investigate pad lot
status
Cont. From Page 1, A
Cont. From Page 1, B
No
Possible bad pad
lot?
Is pump running
intermittently?
Yes
Check electrical
cabinet
Is it a bad pump?
No
Is pad conditioner
making proper
(sufficient) contact
with pad?
Yes
Replace pump
Yes
Replace relay
No
No
No
Adjust conditioner
brush
Is there a slurry
dilution problem on
the tool?
Yes
Yes
Verify operation of DI
water valves
Is it a bad relay?
No
Correct recipe
selected?
No
No
Select proper recipe
Call Engineer
Is the slurry supply
on?
Yes
Is recipe corrupt?
Yes
Fix it
No
Contact facilities
No
Go to manual on the
proper MP. Turn on
"priming".
Yes
No
Proper slurry
delivery to pad?
No
Go to service mode,
turn on slurry pump.
set flow rate.
Is there a slurry
leak?
Is pump running?
Yes
Watch for intermittent I/O
or pump operation
Yes
Yes
No
Check calibration
Yes
Contact facilities
Yes
No
Fix leak
See page 2/A
Is it a bad motor?
06/25/1999
Is slurry visible on
pad?
Yes
Replace motor
Is it a slurry
chemistry
problem?
No
No
See page 2/B
Call Engineer
11-35
Liquid Spills
9631-702191
LIQUID SPILLS
9631-703029 V. 1A 8/1/96
Engineering Approval:________________
LIQUID SPILLS
IS SPILL WATER?
Yes
IS LEAK DUE TO
SPLASH?
Yes
FIX SOURCE OF
SPLASHING
No
Yes
IS LEAK FAST?
(MIN.)
Yes
START AT HIGH
PRESSURE DIH2O
INPUT. CHECK FOR
LEAKY FITTINGS TO
EACH HEAD. FIND
LEAK.
SECURE LEAK OR
REPLACE
CONNECTIONS
No
IS LEAK UNDER
CASSETTE?
No
No
CHECK LINES TO
POLISH BELL AND
CONDITIONING ARM
Yes
CHECK FOR
DRAINAGE LEAK AND
OVERFLOW.
IS SPILL
SLURRY?
No
Yes
IS SLURRY
BRIGHT COLOR?
Yes
IS SPILL IPA?
SECURE LEAK OR
REPLACE FITTINGS
No
IS SPILL KOH?
Yes
Yes
CLEAN UP.
CLEAN UP.
SLURRY IS LEAKING
FROM INPUT LINE TO
POLISH BELL.
No
CALL ENGINEER.
FIND LEAK, SECURE
OR REPLACE
FITTINGS
No
LEAK IS
OCCURING
DURING POLISH.
06/25/1999
CHECK POLISH
HEAD SEALS AND
FLUID WASTE DRAIN
SYSTEM
11-36
MP Does Not Park
9631-702192
Lower MP Does Not Park
9631-703030 v. 1A 8/1/96
Engineering Approval:___________
Does the sensor
respond?
No
Adjust or replace
sensor
No
Align or tighten sensor
Yes
Is sensor in the
right position?
Lower MP Does Not Park
9631-703030 V. 1A 8/1/96
Page 2
Yes
Is optic line
severed?
Yes
Replace optic line
Continued from Page 1
No
Does motor turn?
Yes
Does park position
and align hole
coincide?
Yes
Is alignment pin
missing?
Did problem come
on gradually?
Yes
Yes
Lift off polish bell,
inspect for slurry
accumulation or foreign
object
No
Check bearing under
polish bell for
mechanical
interference, binding,
no lubrication
Replace pin
No
No
No
No
Check that alignment
pin is in correct place
Call engineer
Does polish bell
move by hand?
Yes
Does motor have
power?
No
Check electrical
connections
Call engineer
Yes
Does motor have
transmision fluid?
No
Replace motor
Yes
See next page
06/25/1999
11-37
No Pick Off Pad
9631-702193
NO PICK OFF PAD
NO PICK OFF PAD.
IS HEAD PARKED
CORRECTLY?
No
SEE "NO PARK".
Yes
IS PAD
DELAMINATING?
Yes
REPLACE PAD.
No
CHECK/ ADJUST
FLOWS
No
PROPER AIR AND
DI FLOW THRU
PAD?
YES
DOES WAND
STAKE
CORRECTLY?
No
IS WAND BENT?
Yes
Yes
REPLACE WAND.
VERIFY TOOL
POINTS.
No
IS KICK TAPE
THE CAUSE?
Yes
RETAPE WAND.
Yes
ADJUST TOOL
POINT.
Yes
CALL ENGINEER.
No
IS TOOL POINT
HIGH?
No
IS WAND
VACUUM AND
VACUUM
SENSING
SYSTEM
FUNCTIONING?
No
CORRECT VACUUM
SYSTEM PROBLEM
06/25/1999
Engineering Approval:_____________________
9631-703031 V1A 8/1/96
11-38
Pad Conditioner Problems
9631-702194
PAD CONDITIONER PROBLEMS
PAD CONDITIONER
PROBLEMS
IS ARM
STICKING?
Yes
NEW PAD?
No
Yes
Yes
HAS CURVATURE
BEEN SET?
IS DOWN
FORCE TOO
GREAT?
Yes
No
CONTACT
ENGINEER.
No
Yes
RAN BREAK-IN
WAFERS?
SET CURVATURE SO
BRUSH HAS EVEN
CONTACT ACROSS
PAD.
LESSEN DOWN
FORCE.
No
No
RUN BREAK-IN
WAFERS. THEN
MAKE ASSESSMENT.
ARM CONTACTS
PAD?
Yes
CONTACT
ENGINEER.
Yes
HARD STOP SET
TOO HIGH?
No
HAS CURVATURE
BEEN SET?
Yes
LOWER HARD STOP.
No
No
SET CURVATURE.
DOWN FORCE
TOO LIGHT?
Yes
INCREASE DOWN
FORCE.
No
IS PIVOT PIN
DIRTY?
No
IS MP HEAD
PARKING
CORRECTLY?
Yes
Yes
CLEAN PIVOT PIN.
CALL ENGINEER.
No
CORRECT PARKING
PROBLEM
9631-703032 V1A 8/1/96
06/25/1999
11-39
Robot Loses or Slides Wafer Off Wand
9631-702195
ROBOT LOSES OR SLIDES WAFER OFF WAND
9631-703033 V. 1A 8/1/96
HALT MACHINE,
RETRIEVE WAFER(S)
INSPECT WAND
IS TAPE
INTEGRITY
GOOD?
No
RETAPE WAND
Yes
RETAPE WAND
No
BURR ON END?
No
SEE WAND VACUUM
TFC 9631-702916
06/25/1999
11-40
9631-702196
9631-703034 V.1A 8/1/96
Engineering Approval:____________
Wand Vacuum Problem
9631-703034 V.1A 8/1/96
Page 2
Select Paddle 1 from
C2C I/O
Cont. from page 2
Put wafer on wand,
plug paddle vac 1 hole
on pick side of paddle
Is vacuum above
10 psi?
Is vacuum above
10 psi?
Yes
No
Are tool points
accurate?
Yes
No
Disconnect airline to
vacuum sensor. Plug
line w/ finger, wait 20
seconds. (This will
blow water into scrub)
Reconnect tubing
Is tape on wand
good?
No
Retape wand and leak
test
Yes
Adjust theta and delta r
movements
Is wand bent?
Yes
Plug paddle vac 1 hole
on pick side of paddle.
No
Yes
Reinitialize system
No
vacuum sensor. Plug
line w/ finger. Immerse
wand in DI water for 5
sec. (This will flush
system)
With needle nose
pliers, pinch off airline
above reservoir.
Check reading.
Go to page 2
Remove DI water,
allow system to dry for
10 seconds.
Is vacuum above
10 psi?
Replace wand, verify
tool points
Reconnect line. Plug
paddle vac 1 hole on
pick side of paddle.
Is vacuum above
10 psi?
No
vacuum sensor. Plug
line w/ finger, wait 20
seconds (this will blow
water into scrub)
Reconnect.
Plug paddle vacuum 1
hole on pick side of
paddle.
Yes
Is vacuum sensor
good?
No
Replace sensor
Yes
Remove wrist housing
cover. Gently remove
2 reservoirs. Inspect
for debris inside.
Clean channel from
wand through reservoir
No
Check air connection
on Vacuum generator
on C2C panel
No
Reinitialize system
Is vacuum above
10 psi?
Yes
Yes
Reinitialize system
Reconnect airline,
replace housing cover.
Pinch off line on top of
robot with needle nose
pliers. Check sensor
reading.
No
Are air fittings on
the wand leaking?
Is vacuum above
10 psi?
Yes
Replace fittings
Yes
See page 2
No
Clean line from top of
robot to reservoir
Repeat for Paddle 2 if necessary
06/25/1999
11-41
Wafer Shows Scratches
9631-702197
WAFER SHOWS SCRATCHES
9631-703035 v. 1A 8/1/96
WAFER SHOWS
SCRATCHES
DOES SCRATCH
RADIATE FROM
CENTER?
Yes
No
DOES WAND
HAVE BURR?
Yes
REMOVE BURR OR
RETAPE WAND
No
IS SCRATCH IN
CENTER?
Yes
LOOK FOR WAFER
SLIPPING/ROTATING
ON WAND
No
IS WAND BENT?
Yes
REPLACE WAND
No
CALL ENGINEER
No
SCRATCH NOT
FROM TOOL
No
IS IT A GROOVE
OR
SPIROGRAPH?
No
SCRATCH NOT
FROM MP
IS TOOL POINT
REPEATABLE?
Yes
Yes
CHECK POLISH PAD FOR
PARTICLES/REPLACE
POLISH PAD
DO RETURN
WAFERS TOUCH
IN CASSETTE?
Yes
DOES PROBLEM
EXIST WITH
DIFFERENT
CASSETTE?
No
DISCARD CASSETTE
Yes
CALL ENGINEER
06/25/1999
11-42
Shield Sensor Alarms
9631-702198
SHIELD SENSOR ALARMS
SHIELD SENSOR
ALARMS
SHIELD SEATED
PROPERLY?
No
ADJUST SHIELD
PROPERLY ON
GUIDES. REINITIALIZE.
Yes
SENSOR LOOSE
IN HOUSING?
Yes
MAKE SURE SENSOR
IS ADJUSTED
PROPERLY. THEN
TIGHTEN SET SCREW.
RE-INITIALIZE.
No
IS SHIELD
JUMPING ON THE
WAY DOWN?
Yes
IS SENSOR TOO
TIGHT?
Yes
ADJUST SENSOR.
No
ADJUST SENSOR.
No
ARE I/O’S
TRIPPING?
Yes
CALL ENGINEER.
No
REWIRE AND
REPLACE SENSOR.
9631-703036 V1A 8/1/96
06/25/1999
11-43
Unusual Noise
9631-702199
UNUSUAL NOISE
UNUSUAL NOISE
GRINDING NOISE
WHEN
POLISHING?
Yes
IDENTIFY LOCATION OF
NOISE, REPLACE
BEARING IN THAT AREA.
No
SQUEAKING
NOISE WHEN
POLISHING?
ENOUGH
SLURRY?
Yes
Yes
EDGE GAP
GOOD?
No
Yes
No
KNOCKING
NOISE WHEN
POLISHING?
Yes
SEE "HEAD
KNOCKING".
IS SLURRY
FLOWING TO
HEAD?
No
No
CHECK FOR LEAKS
AND OBSTRUCTION.
No
CHECK/CALIBRATE
PUMP FLOW. RUN
MACHINE.
ADJUST EDGE GAP.
RUN MACHINE.
CONTACT ENGINEER
FOR SUPPORT.
Yes
No
APPROXIMATE LOCATION,
DESCRIBE SOUND, AND
THEN CONTACT ENGINEER.
IS FLOW RATE
GOOD?
Yes
CONTACT ENGINEER
FOR SUPPORT.
9631-703037 V1A 8/1/96
06/25/1999
11-44
Wafer Thrown Out of Head
9631-702201
WAFER THROWN
OUT OF HEAD
WAFER THROWN
OUT OF HEAD.
STOP HEAD
INVOLVED. FINISH
RUN ON OTHER
HEADS.
PERFORM
WHATEVER CLEANUP AND
REPLACEMENT IS
REQUIRED ON
AFFECTED HEAD.
WEAR RING
WORN?
REPLACE.
Yes
No
DELTA P
POSITIVE OR
OUT OF SPEC?
No
EXCESSIVE
DELTA P
FLUCTUATION?
Yes
Yes
DETERMINE WHY
DELTA P IS OUT OF
SPEC.
REFER TO DELTA P
FLUCTUATION STFC007
No
EDGE GAP
CORRECT.
No
ADJUST EDGE GAP.
Yes
CALL ENGINEER.
9631-703039 V1A 8/1/96
06/25/1999
11-45
Cassette Shudders On Rotation
9631-702202
CASSETTE ROTATION
SHUDDERING
9631-703040 V. 1A 8/1/96
CASSETTE
SHUDDERING
DURING ROTATION
IS SPEED VERY
SLOW?
Yes
ADJUST TO NORMAL
OPERATING SPEED
CONTINUES TO
SHUDDER?
No
RESET TOOL FOR
OPERATION
No
Yes
REMOVE BOTH TUBE
INPUTS TO
CYLINDER
Yes
CYCLE ROTATION
ON/OFF ~5 TIMES TO
PURGE TUBES
REPLACE TUBES
ONTO CYLINDER
CONTINUES TO
SHUDDER?
No
Yes
OPEN VALVE TO
FULL OPEN
POSITION, CYCLE
SEVERAL TIMES,
ADJUST VALVES
BACK TO NORMAL
OPERATIONAL
SPEED
CONTINUES TO
SHUDDER?
No
RESET TOOL FOR
OPERATION
Yes
RESET TOOL FOR
OPERATION
06/25/1999
11-46
Brick Power Loss (-4 Error)
9631-702203
Brick Power Loss (-4 error)
9631-703041 V.1A 8/1/96
Engineering Approval:________________
Determine panel which
has fault based on
computer and rack
address.
Verify that panel’s
breakers are on as well
as C2C and EP panel’s
breakers on.
Measure voltages at
test points of each
brick on affected panel.
(24 ± .5)
Replace G4REG.
No
Are measurements
within spec?
Yes
Is 24 VDC LED on
G4REG lit?
Yes
Is 5 VDC LED on
G4REG lit?
Is FUSE BAD LED
on?
No
No
No
Yes
Confirm good
connections at brick of
I200 and ICOM.
Verify 24 VDC at brick
by checking test points
on brick. If present,
replace G4REG.
Replace 1 A fuse on
G4REG.
Are measurements
within spec?
No
Change DC/DC
converters.
Yes
Call IPEC
06/25/1999
11-47
Communication Loss From Computer AC37 Card (-29/-30 Error)(-29/-31 Error)
9631-702204
Communication Loss from Computer AC37 Card to
Brick (-29/-31 error)
9631-703042 V.1A 8/2/96
Communication Loss from Computer AC37 Card to
Brick (-29/-30 error)
9631-703042 V.1A 8/1/96
Engineering Approval:_______________
Engineering Approval:_______________
COM loss from host to
I/O Brick.
Check connections to
communication
interface.
Does RECV LED
flash on bricks?
Determine Panel which
has fault based on
computer and rack
address.
No
Does XMT LED
flash on AC37
Card?
No
Yes
Yes
Does XMIT LED
flash on addressed
brick?
Yes
No
Check brick setup.
Possibilities:
1. Wrong baud, protocol, or
data verification setting.
2. Incorrectly terminated.
a. Is terminator card installed
@G4RCOMMKIT of MP
and/or @ PC2 of C2C/
PC1/PC2?
b. Is loop back jumper
installed on last brain
board of ribbon cable?
Verify:
Wrong port address.
Wrong card
configuration for port.
Broken communication
wires. Check
connections to
communications
interface boards.
Is 24 VDC LED on
G4REG lit?
No
Verify 24 VDC at brick by
checking test points on brick. If
present, replace G4REG.
Yes
Is 5 VDC LED on
G4REG lit?
No
Is FUSE BAD LED
on?
Yes
Are the switches
on the
G4RCOMMKIT
enabled?
No
No
Yes
Replace 1 A fuse on
G4REG.
Replace G4REG.
Switch to Enabled.
Yes
Is the brain board
RUN LED on?
No
Verify brain board is
properly seated. If
seated OK, replace
brain board.
Yes
Remove power and
verify EPROM and
CPU are seated
properly. If seated
OK, replace
brainboard.
Yes
Is brain board RUN
LED flashing?
No
Call IPEC
06/25/1999
See Next Page
11-48
Multiple Load Attempts
9631-702205
MULTIPLE WAFER HEAD LOAD ATTEMPTS
page 2
9631-703043 V.1A 8/1/96
ENGINEERING APPROVAL:_____________
MULTIPLE WAFER HEAD
LOAD ATTEMPTS
CONTINUED FROM
PREVIOUS PAGE
9631-703043 V.1A 8/1/96
IS THE LOAD
MISSED ALL THE
TIME?
Yes
IS THE WAND
BENT?
Yes
DOES IT MISS
THE LOAD ONLY
ON ONE MP?
REPLACE THE
WAND.
Yes
IS THE DF200
CLOGGED?
Yes
CLEAN OUT/
CHANGE OUT.
Yes
SEE HEAD PARKING
TFC
Yes
ADJUST EDGE GAP
Yes
CHANGE THE WEAR
RING
No
No
IS THE ROBOT
BELT LOOSE?
Yes
IS THE MP
UPPER HEAD
PARKING
PROPERLY?
CONTACT ENGINEER
No
No
IS THE EDGE
GAP OUT?
ARE THE ROBOT
MOUNTING
SCREWS
LOOSE?
Yes
CONTACT
ENGINEER.
No
IS THE NEW
WEAR RING
BAD?
No
No
No
IS THE
TOOLPTS.DAT
FILE BAD?
Yes
COPY THE
TOOLPTS.SAV.
IS THE LOWER
CARRIER O-RING
UNDERSIZED?
IS THE WAFER
HEAD LEAKING?
Yes
No
Yes
TROUBLESHOOT
AND REPAIR LEAK
No
CALL GAARD
ENGINEER.
IS THE LOAD
MISSED ONLY ON
ONE SIDE OF
THE TOOL?
Yes
THIS MAY BE AN
ALIGNMENT
STATION PROBLEM.
CHANGE THE ORING
ARE THE
ALIGNMENT PINS
BENT?
ARE THE
CARRIER GUIDE
PINS WORN?
Yes
CHANGE OUT
WAFER HEAD
No
Yes
REPLACE
ALIGNMENT PINS.
IS THE CYLINDER
BAD?
Yes
CHANGE THE
CYLINDER
No
No
SEE NEXT PAGE
06/25/1999
ADJUST ALIGNMENT
PIN STATION TOOL
POINTS.
No
CONTACT ENGINEER
11-49
Main Cylinder Problems
9631-702206
POLISH CYLINDER PROBLEMS
9631-703044 V.1A 8/1/96
ENGINEERING APPROVAL:_____________
Does cylinder cycle
properly under
manual control?
Yes
Cycle head to look for
intermittent operation
Are metal filings
present?
Yes
Replace cylinder
No
No
Is cylinder valve
functioning
properly?
No
Inspect/ replace valve
Yes
Replace cylinder
Yes
Troubleshoot
pneumatic panels for
air leaks, component
failure or intermittent
function
Call engineer
Yes
Remove exhaust line
from cylinder
Is air flowing from
the cylinder
exhaust port or
around the shaft at
the top of the
cylinder? (Check in
both up and down
positions)
No
Jumper opposite
pneumatic panel to
cylinder
Does cylinder cycle
from another
panel?
No
Remove bolts on black
collar and raise
cylinder
06/25/1999
11-50
Digital Output Failure
9631-702207
Failure of Digital Output
9631-703045 V.1A 8/1/96
Engineering Approval:_________________
Is fuse on module
good?
No
Replace 4A fuse
No
Check output wiring.
Check output
device(s).
No
See "Communication
loss from Computer
AC37 Card to Brick"
No
Replace brain board.
Yes
Does voltage
transition on
output?
Yes
Is communications
established to
brick?
Yes
Does output LED
turn on/off?
Yes
Check output device.
Change output module
and/or brain board
06/25/1999
11-51
Digital Input Failure
9631-702208
Failure of Digital Input
9631-703046 V.1A 8/1/96
Simulate input
condition
Does voltage
transition on input?
No
Check input wiring.
Check power supply
from input device(s).
No
See "Communication
loss from computer
AC37 card to brick".
Yes
Is communications
established to
brick?
Yes
Change input module
and/or brain board.
06/25/1999
11-52
Analog Output Failure
9631-702209
Failure of Analog Output
9631-703047 V.1A 8/1/96
Is communications
established to
brick?
No
See "Communications
loss from computer
AC37 card to brick".
No
Disconnect external
wiring to output.
Yes
Connect meter to test
points next to analog
module. For current
output, put current
meter in series with
output.
Does meter
change with
change of value in
software?
Yes
Tool output device not
functional, check
device.
Does meter
change with
change of value in
software?
No
Change brain board
and/or output module.
Yes
Output wired wrong
(probably shorted) or
input device not
matched to module.
06/25/1999
11-53
Robot Wand Jerking On Rotation
Table 11-3. Robot Wand Jerking On Rotation
Step
06/25/1999
Instruction
1
Remove the robot wrist cover.
2
Make sure the O-ring belts in the wrist are not worn or broken. Replace if worn or broken.
3
Make sure the motor and connector in the wrist are not damaged.
4
Make sure the vacuum tubing in the wrist is connected and not damaged.
5
Make sure the wrist assembly bearings are Ok.
6
Repair any problems.
7
Make sure all is clear to place back together (no interference or wires binding).
8
Replace the robot wrist cover.
9
Run verification.
11-54
Luxtron System Does Not Start
Table 11-4. The Luxtron System Does Not Start
Step
Instruction
1
Display Service Mode on the MP that is not starting. Select I/O from top menu, then open
digitals. See page 6-27 for a description of the Luxtron Endpoint Detection System.
2
Energize DOCHAN11.
If the Luxtron starts, the problem is in the 676. Go to Step 3.
If the Luxtron does not start in Service Mode, the problem is either in the cabling, or the
Luxtron unit. Go to Step 5.
Continued
06/25/1999
on next page
11-55
Luxtron System Does Not Start, continued
Step
Instruction
3
Start the Tool in Production Mode and try running the recipe. Make sure the recipe has an
endpoint step declared, the Luxtron will not start without it. If it does and the Luxtron still
does not start, Version 3.01G or newer software needs to be reloaded on the Tool. Go to
Step 4.
4
Consult SpeedFam-IPEC Software Engineering on loading process.
Luxtron DM Unit
Figure 11-4. Luxtron DM Unit
Continued
06/25/1999
on next page
11-56
Step
Instruction
5
If the Luxtron did not start in Service Mode, the problem is in the cabling, or the Luxtron unit.
To make sure cabling is Ok, first look at the Opto Card assembly in the Electrical Cabinet to
make sure the last light is ON. See Figure 11-5. If the light is ON, go to Step 6. If the light is
not ON, replace the relay, then start over at Step 1. See “Schem, Luxtron 676 / 776 (1 of 4)”
on page E-54.
Start Relay and Light
Figure 11-5. Luxtron Opto Card
Continued
06/25/1999
on next page
11-57
Step
Instruction
6
Unplug the cable from the back of the Luxtron 9325RTC and use a voltmeter to make sure all
of the pins are working correctly. See Figure 11-6. If so, problem is in Luxtron, go to Step 7.
If not, replace the bad cable, then start again at Step 1.
Wafer Motor Current Sensors
Polish Motor Current Sensors
Figure 11-6. Luxtron 9325RTC
Continued
06/25/1999
on next page
11-58
06/25/1999
11-59
06/25/1999
Step
Instruction
7
It may be necessary to log in while working with the Luxtron; log in is “1234”. Make sure the
files in the Luxtron Base configuration are correct: Exit any applications. From the Windows
desktop choose “My Computer” then from each proceeding pop up menu choose “C:”,
“Program Files”, “Luxtron”, and “Optima9300”. From this menu click on “BSCFG” for the
base configuration. The base configuration should appear as it does in the Luxtron
Configuration Files section of this manual on page 11-81. If it does not, refer to the Luxtron
manual to assist in changing it. Close all of the pop up menus that have been opened.
Change the I/O configuration. From “Programs” on lower left corner of screen choose
“Optima” and then “Config9300”. When opened, the I/O configuration will not be fully
expanded. To expand the I/O double click on each of the channels, this will show the Analog
inputs associated with each channel. To see the digital I/O choose “View” from the top menu
and “I/O ports” beneath the menu. Double click each channel to see digital I/O associated.
Compare each with the correct setups in the Luxtron Configuration Files section of this
manual on page 11-81. If they match, then the I/O is set. If not, they must be configured.
Refer to Chapter 11 of the Luxtron manual under oem_maun.als on the CD for configuration
details and the Luxtron Configuration Files section of this manual on page 11-81. After
completed exit and all changes will take effect. Make sure the recipe is running. From
“Programs” on lower left corner of screen choose “Optima” and then “Optima9300”. The
recipe's name will appear in the top left corner of each MP screen. Open the recipe in
“Recipe Editor” according to Luxtron manual. Make sure “Wait for Trigger” is checked. If it
is not, then check it, save it, save it to RTC, and “Select to Run” it on the MP in question. If
anything has been changed on this Step, start again at Step 1, otherwise go to Step 8.
11-60
Step
8
06/25/1999
Instruction
Contact SpeedFam-IPEC Technical Support Hot Line at 1-800-WSI-KARE.
11-61
Luxtron System Does Not Stop The Recipe
Table 11-5. The Luxtron System Does Not Stop The Recipe
Step
1
Instruction
It may be necessary to log in while working with the Luxtron; log in is “1234”.
Look at the files in the Luxtron Base configuration: Exit any applications. From the Windows
details and the Luxtron Configuration Files section of this manual on page 11-81. After
completed exit and all changes will take effect.
Continued
06/25/1999
on next page
11-62
Luxtron System Does Not Stop The Recipe, continued
Step
Instruction
2
Display Service Mode on the MP that is not stopping. Select I/O from top menu, then open
Digitals. Energize DOCHAN11. The Luxtron starts. From the DM Unit on the MP that is
running, click the picture of steps on the left side. This will cause a stop signal pulse of 3
seconds. Watch DIEP_DETECT on service screen to see if it energizes.
• If it energizes, go to Step 3.
• If it did not, go to Step 5.
3
Make sure the recipe has an endpoint step declared, the Luxtron will not start or stop the
676 without it. Start in Production Mode, then run the recipe. If the recipe has an endpoint
step declared, and the Luxtron still does not stop, then version 3.01G or newer software
needs to be reloaded on the Tool. Go to Step 4.
4
Consult SpeedFam-IPEC software on loading process.
Continued
06/25/1999
on next page
11-63
Luxtron System Does Not Stop The Recipe, continued
Step
Instruction
5
Disconnect digital I/O cable from Luxtron 9300RTC. See Figure 11-7. Short pins 4 and 5.
This should cause the DIEP_DETECT light to come ON. If it does not, replace the cable, go
back to Step 3. If the light does come ON, go to Step 6. See “Schem, Luxtron 676 / 776 (1
of 4)” on page E-54.
6
Wafer Motor Current Sensors
Polish Motor Current Sensors
06/25/1999
11-64
No Signal From the Luxtron Current Sensors
Table 11-6. Luxtron System No Signal From The Current Sensor
Step
1
Instruction
Make sure the sensor plugs are correctly plugged in to the Luxtron 9325RTC. See Figure
11-8.
Wafer Motor Current
Sensor Plugs
Continued
06/25/1999
on next page
11-65
No Signal From the Luxtron Current Sensors, continued
Step
2
Instruction
Make sure the sensor is on first leg of the wiring to the motors, and the sensor arrow is
pointing away from the breaker and towards the motor. See Figure 11-9. The arrow
indicates direction of current. If the sensors are connected correctly, do Step 3. If the
sensor location is changed, try running after the changes.
Polish Head Current Sensor
Wafer Head Current Sensor
Figure 11-9. Luxtron Current Sensors
Continued
06/25/1999
on next page
11-66
Step
3
Instruction
It may be necessary to log in while working with the Luxtron; log in is “1234”.
Look at the files in the Luxtron Base configuration: Exit any applications. From the Windows
details and the Luxtron Configuration Files section of this manual on page 11-81. After the
configuration is completed, exit and all changes will take effect. If anything has been
changed on this Step, go to Step 4, otherwise go to Step 3.
Continued
06/25/1999
on next page
11-67
Step
06/25/1999
Instruction
4
Replace the cable and then try running.
5
Run a recipe after all changes are complete.
6
11-68
Luxtron Configuration Files
I/O Port
Channel 1
Channel
Assignment Tile 4 Connector 1 Input B Start H->L *-------
Tile 4 Connector 1 Relay Output B End of Step L->H Pulse 3.00 *------Channel 2
Tile 4 Connector 2 Input B Start H->L *------Tile 4 Connector 2 Relay Output B End of Step L->H Pulse 3.00 *------Channel 3
Tile 4 Connector 3 Input B Start H->L *------Tile 4 Connector 3 Relay Output B End of Step L->H Pulse 3.00 *------Channel 4
Tile 4 Connector 4 Input B Start H->L *------Tile 4 Connector 4 Relay Output B End of Step L->H Pulse 3.00 *------Continued
06/25/1999
on next page
11-69
Luxtron Configuration Files, continued
Sensor
Channel 1
Channel
Assignment A - Tile 2 Connector 1
B - EMPTY
C - EMPTY
Channel 2
A - Tile 2 Connector 2
B - EMPTY
C - EMPTY
Channel 3
B - EMPTY
C - EMPTY
Channel 4
06/25/1999
11-70
B - EMPTY
C - EMPTY
Continued
06/25/1999
on next page
11-71
Base
BASE CONFIGURATION FILE
Configurati
on File
Tile 1 123
Tile 2 123
Tile 3 Empty
Tile 4 177
Tile 5 Empty
Tile 6 Empty
Tile 7 Empty
Tile 8 Empty
Driver 402
Driver 601
Task 803
Continued
06/25/1999
on next page
11-72
Digital
Cable
Pinout
06/25/1999
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
NC
RELAY A NO
RELAY A COM
RELAY B NO
RELAY B COM
+12 VDC
GROUND
OPTO IN A +
OPTO IN B +
OPTO IN A OPTO IN B OPTO OUT A +
OPTO OUT A OPTO OUT B +
OPTO OUT B -
11-73
F76 System Does Not Start
Table 11-7. The F76 System Does Not Start
06/25/1999
Step
Instruction
1
Display Service Mode on the MP that is not starting. Select I/O from the top menu, then
open Digitals. See figure page 6-31 for a description of the F76 Endpoint Detection System.
2
Energize DOCHAN11. Set AOSPINDLE_SPEED to 1000. Energize
DOSPINDLE_ENABLE.
If the F76 starts, then the problem is in the 676 Tool. Go to Step 3.
If the F76 did not start in Service Mode, the problem is either in the cabling, or the F76 unit.
Go to Step 5. See “Schem, F76 676 (1 of 6)” on page E-58.
3
Try running a typical recipe in Production Mode. Make sure the recipe has an endpoint step
declared. The F76 will not start without an endpoint step declared. If it does have an
endpoint declared and the F76 still does not start, then version 3.01G software must be
reloaded on the Tool. Go to Step 4.
4
Contact SpeedFam-IPEC Software Engineering on the process to reload the 3.01G
software.
11-74
F76 System Does Not Start, continued
Step
Instruction
5
If the F76 did not start in Service Mode, the problem is either in the cabling, or the F76 unit.
To make sure cabling is correct, first look at Opto Card assembly behind door to make sure
the start relay light is ON, and the sync relay light is pulsing. Refer to Figure 11-10. If the
start relay light is ON, go to Step 6. If not, replace the problem relay, then start again at Step
1.
Stop Relay
Sync Relay
Start Relay
Stop Relay Light
Start Relay Light
Sync Relay Light
Figure 11-10. Filmetrics Relay
Continued
06/25/1999
on next page
11-75
Step
Instruction
6
Unplug the start pin cables from the back of the F76 computer. See Figure 11-11. Use a
voltmeter to make sure contacts are closed across the start pin cables. If there is closed
contact across all pins, the problem is in F76 computer, go to Step 7. If not, replace the bad
cable and start again at Step 1. See “Schem, F76 676 (1 of 6)” on page E-58. and See “F76
Cable Information” on page 11-106.
F76 Computer
Figure 11-11. F76 Computer
Continued
06/25/1999
on next page
11-76
06/25/1999
Step
Instruction
7
Make sure the head being debugged has “Start Active” checked. If it does not, check it, then
start again at Step 1. If it does, and all of the cabling is correct and working properly, the
problem is in the Filmetrics computer software or hardware.
8
Contact SpeedFam-IPEC about sending computer in for evaluation at 1-800-WSI-KARE.
11-77
F76 System Does Not Stop
Table 11-8. The F76 System Does Not Stop
Step
Instruction
1
Make sure the head being debugged has “Stop Active” checked. If it does not, check it, then
do Step 2. If it does, start at Step 2.
Continued
06/25/1999
on next page
11-78
F76 System Does Not Stop, continued
Step
Instruction
2
Display Service Mode on the MP that is not stopping. Select I/O from top menu, and open
digitals. Energize DOCHAN11. Set AOSPINDLE_SPEED to 1000. Energize
DOSPINDLE_ENABLE. Display the F76 screen make threshold 0 and over polish 0. This
should then energize DIEP_DETECT on the 676.
If it energizes, go to Step 3.
If it did not, go to Step 5.
3
Start the MP in Production Mode and try running the recipe. Make sure the recipe has an
endpoint step declared. The F76 will not start or stop the 676 without an endpoint step
declared. If it does and the F76 still does not stop, then version 3.01G software needs to be
reloaded on the Tool. Do Step 4.
4
Call SpeedFam-IPEC software for loading process at 1-800-WSI-KARE.
Continued
06/25/1999
on next page
11-79
Step
Instruction
5
Unplug stop pin cables from the back of the F76 computer. Using a voltmeter make sure
contacts are closed across stop pin cables. If there is closed contact across all pins, the
problem is in the F76 computer, go to Step 6. If not, replace the bad cable, then start again
at Step 1. See “Schem, F76 676 (1 of 6)” on page E-58. and See “F76 Cable Information” on
page 11-106.
F76 Computer
Figure 11-12. F76 Computer
Continued
06/25/1999
on next page
11-80
Step
6
06/25/1999
Instruction
Contact SpeedFam-IPEC about sending computer in for evaluation at 1-800-WSI-KARE.
11-81
F76 System No Signal From Sensors
Table 11-9. F76 System No Signal From Sensors
Step
Instruction
1
Make sure fiber optic end in polish pad is clean. See Figure 11-13. If the fiber optic end is
not clean, do the “Clean Fiber In Pad” on page 12-7 procedure.
2
Make sure the fiber optic cables are connected on the bulkhead by the polish head. See
Figure 11-13.
Fiber optic end in Polish
Pad (Not Shown)
Fiber Optic Cables
Bulkhead Connection
Figure 11-13. F76 Fiber Optic End In Polish Pad
Continued
06/25/1999
on next page
11-82
F76 System No Signal From Sensors, continued
Step
Instruction
3
Make sure the fiber optic connection on the light source inside the Electrical Cabinet is
connected. See Figure 11-14.
4
Make sure light source lamp works by positioning the test switch mounted on the bottom of
light source to ON. See Figure 11-14. If the light source does not work, inspect light source
lamp. If the light source lamp is bad, do the “Replace F76 Lamps” on page 13-155
procedure.
Light Source
Test Switch
Fiber Optic Connections
Figure 11-14. F76 Light Source
Continued
06/25/1999
on next page
11-83
Step
Instruction
5
Make sure the fiber optic connections on the optical bench inside the Electrical Cabinet are
connected. See Figure 11-15.
Fiber Optic Connection
Figure 11-15. F76 Spectrometer (Optical Board)
Continued
06/25/1999
on next page
11-84
06/25/1999
Step
Instruction
6
Make sure light is coming from fiber optic end in polish pad. See Figure 11-13 on page 1199. If no light is coming from fiber optic end, the fiber optic cable(s) may be bad. To inspect
the cables, disconnect each fiber optic cable from both ends and shine a flashlight into the
cable. Make sure light shines at the other end of cable. If no light shines through the cable,
then the cable is bad and must be replaced.
7
Inspect both fiber optic cables from drain deck bulkhead to fiber optic end in polish pad. See
Figure 11-13 on page 11-99. Disconnect fiber optic cables from bulkhead and make sure
light shines from fiber optic ends in polish pad. If no light shines through, replace the
cable(s). See “Replace F76 Fiber Optic Sensor” on page 13-165.
8
Make sure light shines through fiber optic cable from light source to drain deck bulkhead. If
no light shines through, replace the cable.
9
Make sure light shines through fiber optic cable from bulkhead to Spectrometer (Optical
Board). If no light shines through, replace the cable.
10
Make sure wiring is correct for F76 system. See “Schem, F76 676 (1 of 6)” on page E-58.
11
F76 Computer or Spectrometer (Optical Board) may be bad. Contact SpeedFam-IPEC at
1-800-WSI-KARE.
11-85
F76 Cable Information
Double
Parallel
Cable (P1)
06/25/1999
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
NC
STOP 1 +5V
STOP 2 +5V
STOP 3 +5V
STOP 4 +5V
NC
NC
NC
NC
SYNC 4 +
NC
SYNC 3 +
SYNC 2 +
NC
SYNC 1 +
NC
NC
NC
NC
NC
SYNC 1 SYNC 2 SYNC 3 SYNC 4 NC
11-86
F76 Cable Information, continued
Double
Parallel
Cable (P2)
06/25/1999
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
NC
NC
NC
NC
NC
NC
NC
NC
NC
SYNC 4 +
NC
START 3 +
START 2 +
NC
START 1 +
NC
NC
NC
NC
NC
START 1 START 2 START 3 START 4 NC
11-87
ServSwitch System Troubleshooting
8Ch
ServSwitch
Table 11-10. Troubleshooting the 8Ch ServSwitch (Computers 1-8)
Step
Instruction
1
Disconnect the amplifier from the 8Ch ServSwitch Mon/Key/Mouse port and connect a 1’
test output cable P/N 0325-738360. Connect a monitor, keyboard and a serial mouse to the
cable.
2
Go to a DOS window on one of the computers and enter <CTRL> followed by <I>; make
sure the ServSwitch is reporting U48P firmware. If any other firmware is reported, replace
the 8Ch ServSwitch with a new unit.
ServSwitch
Continued
06/25/1999
on next page
11-88
ServSwitch System Troubleshooting, continued
Step
Instruction
3
Make sure the ServSwitch is properly operating by cycling through the computers and the
Mon/Key/Mouse operation is correct.
4
If the operation of the 8Ch ServSwitch fails, reset the switch to the factory defaults by turning
it OFF, then while holding the <-> switch turn the ServSwitch ON and wait until Ch8 is
selected before letting go of the <-> switch. Disable the screen saver by entering <CTRL>
V000 <ENTER>, then <CTRL> K to save it.
5
If the problem still exists on one Channel, go to section on See “Troubleshooting Single
Computer Problems” on page 11-115.
6
If the ServSwitch operation fails on more than one channel, replace with a new unit. Make
sure to disable the screen saver on the new unit.
Make sure the commands are entered in less than 2 seconds after the <CTRL> command.
Use the command <CTRL> R to reset the keyboard & mouse operation (keyboard LED’s will
blink).
The ServSwitch system is all low voltage except for the two 17VAC transformers input side; hot
swapping, disconnecting and reconnecting these low voltage components can be done while the
676 is powered up.
Continued
06/25/1999
on next page
11-89
Step
Instruction
7
• Use <CTRL> + to go up a channel. <CTRL> - to go down a channel.
• Use <CTRL> <ESC> through the pop-up channel menu.
• Use the + and - switches on the 4-channel ServSwitch-Ultra (on Tools with a cutoff in the
panel for access) to switch between channels.
If the “num-lock” is ON, push the <function> key at the same time while selecting the number of
the channel.
06/25/1999
11-90
Ultra
Firmware
and
Configurati
on
Single
Computer
Problems
Table 11-11. 4Ch ServSwitch-Ultra Firmware and Configuration
Step
Instruction
1
Make sure U48P firmware on the 4Ch ServSwitch-Ultra as indicated on the top of
configuration table <CTRL> <F12>; if that is not the case, replace the unit and make sure
the problem is corrected.
2
Make sure the proper configuration of the master 4Ch ServSwitch-Ultra per the installation
instructions 4606-740171 rev-B, section 8.22. Change any parameters that are different.
Table 11-12. Troubleshooting Single Computer Problems
Step
Instruction
1
Make sure of proper connections between the failed computer and the failed switch. If
connections related to the mouse or keyboard are repaired, exit to DOS and reboot
<CTRL><ALT><DEL>.
2
If a mouse cursor is not present on the screen, make sure the cable between the ServSwitch
and the computer serial port is not disconnected. Reboot the computer after fixing the
problem to allow proper simulation and detection.
3
If the keyboard does not operate, make sure the cable between the ServSwitch and the
computer keyboard port is not disconnected. Reboot the computer after fixing the problem
to allow proper simulation and detection.
If a mouse cursor is on the screen, this is an indication of proper simulation by the ServSwitch
i.e. proper cable connection between the ServSwitch and the computer serial port.
06/25/1999
11-91
Step
Instruction
4
If the problem still exists, swap the failed computer cable connection at the ServSwitch with
a working channel (i.e. If Ch2 failed and Ch3 worked, swap Ch2 and Ch3). Reboot the
failed computer.
5
If swapping the cables fixed the problem on the failed computer but caused a loss of
operation on the swapped and previously working computer, the ServSwitch has a bad
channel regardless of which computer is connected. Replace the ServSwitch and make
sure configuration parameters operation.
6
If the problem moved with the cable, replace the cable. If the problem is keyboard related,
replace the keyboard adapter cable first. Reboot the computer after fixing the problem to
allow for detection.
7
If the problem still exists, it is “most likely” in the computer (H/W or S/W drivers). Computer
replacement is probably the best solution. To be 100% sure that the failure is caused by the
computer and not by the ServSwitch system or wiring, connect a test monitor, keyboard and
mouse directly to that suspect computer and reboot, the problem should still exist.
Continued
06/25/1999
on next page
11-92
4Ch
ServSwitchUltra
Table 11-13. Troubleshooting Ch1 on 4Ch ServSwitch-Ultra
Step
Instruction
1
If the problem exists only on one Channel, See “Troubleshooting Single Computer Problems”
on page 11-115.
2
If the problem exists only on computers 1 through 8, connected to the slave 8Ch ServSwitch
and See “Troubleshooting the 8Ch ServSwitch (Computers 1-8)” on page 11-121.
3
If the problem exists on all the computers, disconnect the Mon/Key/Mouse cable from the
companion and connect to a test monitor, keyboard and mouse (or connect directly to the
Tool chase side station). Do this to isolate the companion system.
Continued
06/25/1999
on next page
11-93
Step
Instruction
4
Improper operation in this test setup is an indication of a failed 4Ch ServSwitch-Ultra.
Replace the 4Ch ServSwitch-Ultra in this case, then make sure it operates correctly after
configuring the parameters.
5
Proper operation in this test setup is an indication of a problem with the companion system;
troubleshoot the companion system using the appropriate schematic.
Continued
06/25/1999
on next page
11-94
Ch1 on 4Ch
ServSwitchUltra
Table 11-14. Troubleshooting Ch1 on the 4Ch ServSwitch-Ultra
Step
Instruction
1
If a problem with the video, keyboard or mouse exists on “ALL” the slave computers (1-8), it
is possible that it is related to Ch1 of the ServSwitch-Ultra.
2
Use one of the slave computers with the problem (for example, select Ch5 by entering
<CTRL> 5).
3
Move the extender cable and amplifier from the 4Ch ServSwitch-Ultra Ch1 to Ch2.
4
Display Ch9 by entering <CTRL> 9.
5
If the problem goes away, replace the 4Ch ServSwitch-Ultra.
6
If there is still a problem, See “Troubleshooting the Extender Coax Cable” on page 11-122.
Continued
06/25/1999
on next page
11-95
8Ch
ServSwitch
06/25/1999
Table 11-15. Troubleshooting the 8Ch ServSwitch (Computers 1-8)
Step
Instruction
1
Disconnect the amplifier from the 8Ch ServSwitch Mon/Key/Mouse port and connect a 1’ test
output cable P/N 0325-738360. Connect a monitor, a keyboard and a serial mouse to the
cable.
2
Display a DOS window on one of the computers and enter <CTRL> followed by <I>. MAke
sure the ServSwitch is reporting U48P firmware. If any other firmware is reported, replace
the 8Ch ServSwitch with a new unit.
3
Make sure the 8Ch ServSwitch switches correctly by cycling through the computers and
doing the Mon/Key/Mouse operation.
4
If the operation of the 8CH ServSwitch fails, reset the switch to the factory defaults by turning
it OFF, then, while holding the <-> switch, turn the ServSwitch ON and wait until Ch8 is
selected before letting go of the <-> switch. Disable the screen saver by entering <CTRL>
V000 <ENTER> <CTRL> K. Make sure it operates correctly.
5
If the problem still exists on only on one Channel, See “Troubleshooting Single Computer
Problems” on page 11-115.
6
If the ServSwitch operation fails on more than one channel, replace with a new unit. Make
sure to disable the screen saver on the new unit.
11-96
Extender
Coax Cable
06/25/1999
Table 11-16. Troubleshooting the Extender Coax Cable
Step
Instruction
1
Remove the 4Ch ServSwitch-Ultra along with its amplifier and take it to the Electrical Cabinet
location.
2
Disconnect the Extender Coax Cable which run through the fab communication or I/O
conduit from the Extender Amplifier which is connected to the 8Ch ServSwitch.
3
Connect a new TEST Extender Coax Cable to the 8Ch ServSwitch via the Extender
Amplifier.
4
Connect the TEST Extender Coax Cable to the 4Ch ServSwitch via the Extender Amplifier.
5
Connect a TEST Output Cable (0325-738360) to the Mon/Key/Mouse port on the 4Ch
ServSwitch-Ultra (if a spare output test cable is not available, use the one normally
connected to the 4Ch Ultra). Connect a monitor, a keyboard and a serial mouse to the
Output cable.
6
Proper operation via the test coax cable is an indication that the original cable through the
conduit is bad and need repair or replacement; if soldering repair is required, make sure that
the field service engineer has previous experience with fine soldering since that coax cable
is a bundle of 28AWG.
7
If there is the test coax cable is not operating correctly, then one or two of the Extender
Amplifiers is bad, See “Troubleshooting the Extender Amplifiers” on page 11-124.
11-97
Extender
Amplifiers
06/25/1999
Table 11-17. Troubleshooting the Extender Amplifiers
Step
Instruction
1
If a batch of bad Extender Amplifiers was manufactured with a 1000W resistor instead of a
100W resistor causing a weakening of the mouse and keyboard signal, do the following
Steps.
2
Disconnect the extender amplifiers from the coax extender cable and from the 4Ch & the
8Ch ServSwitches.
3
Make sure both amplifiers have the SpeedFam-IPEC’s QA sticker; this will indicate that the
amplifier did function on the SpeedFam-IPEC QA test station.
4
Make sure that each amplifier has 100±5 Ohms between pin 11 (ServSwitch side) & pin 11
(cable side); If the resistance test fails, replace the amplifier.
5
If this does not fix the Extender Amplifiers (unrelated to the resistor issue), get a new pair of
amplifiers. Make sure the new amplifiers have SpeedFam-IPEC's QA sticker.
6
Replace one of the suspect Extender Amplifiers with the new unit.
7
If the replacement on one side doesn't fix the problem, replace the amplifier at the other end
of the cable.
8
If the second replacement doesn't fix the problem, repeat this test with a new pair of
amplifiers.
11-98
Keyboard
Does Not
Work
Table 11-18. Keyboard Does Not Work In Windows But Works In DOS
Step
1
Dark Yellow
Video
06/25/1999
Instruction
Swap the amplifiers one at a time with new ones.
Table 11-19. Dark Yellow Video on one of the Computers (running Windows 95, ex: SYSCON)
Step
Instruction
1
Click on the START button. Click on SETTINGS. Click on CONTROL PANEL.
2
Double click on DISPLAY. Click on SETTINGS. Make sure the settings are at 256 colors,
1280 X 1024 pixels, small fonts. Click on APPLY. A message will pop “WINDOWS NEED
TO REBOOT”; Click YES.
3
Repeat the above Steps for the next part.
Click on CHANGE DISPLAY TYPE. Make sure the adapter file is “Cirrus Logic 5429/30/34
and the Monitor Type is SUPER VGA 1280 X 1024; If different, click on CHANGE, select
SHOW ALL DEVICES, make the changes then click OK.
4
Click CLOSE. Click APPLY, then reboot Windows to display the video under the new
settings.
5
If this does not solve the problem, go to START, then go to RUN, then add the following line
to the beginning of the Autoexec.bat file:
C:\WINDOWS\VGAUTIL\clmode.exe T640=72 T800=75 T1024=60 T1280=60
11-99
No Video
Table 11-20. No Video
Step
1
Chase-Side
Mouse
06/25/1999
Instruction
Make sure both ServSwitches are powered and the amplifiers and 100ft coax cable are all
connected.
Table 11-21. Chase-side Mouse Works When the A/B Switch Set to Bay Side (Companion Problem)
Step
Instruction
1
Make sure the dip switches on the Bay side PC Companion are set to switches 1 & 2 and are
ON, and switches 3 through 8 are OFF. If a change has to be made, cycle the power so the
change will take effect.
11-100
Chapter 12
Preventive Maintenance
Contents
Topic
06/25/1999
See Page
Maintenance Tools Required
12-2
Maintenance Preparation
12-3
Daily Preventive Maintenance (F76 Equipped Tool Only)
12-4
Weekly Preventive Maintenance
12-11
Monthly Preventive Maintenance
12-52
Quarterly Preventive Maintenance
12-92
Semi-Annual Preventive Maintenance
12-130
Annual Preventive Maintenance
12-147
12-1
Maintenance Tools Required
Tool List
The following tools are required to do the various preventive and corrective maintenance procedures on
the AvantGaard™ 676. Some are specialized tools, designed and manufactured specifically for the
AvantGaard™ 676. Contact your SpeedFam-IPEC representative to make arrangements for getting
these tools. Specialized tools are identified with an asterisk (*).
• Parallels and edge gap ring*, or Edge Gap Tool Accessory Kit, P/N 2850-738850*
• Wafer backing plate hole punch, P/N 2100-718344*
• Standard set of allen wrenches, 050-5/16 (inch based)
• Complete set of flat blade and Phillips screwdrivers
• Toothbrush or other soft bristled brush
• Calibrated Height Block
• Pad Assembly Special Allen Wrench
• Recess depth micrometer
• Omega differential pressure gauge
• DF-200 wafer pad trimming tool
• Torque wrench
• Wago® terminal tool
• Pliers
• Rubber mallet
• Crescent wrench
•
Continued
06/25/1999
on next page
12-2
Maintenance Tools Required, continued
•
•
•
•
•
06/25/1999
Digital multimeter
Tubing cutters
Diagonal cutters
Metric allen wrench set
Razor blades
12-3
Maintenance Preparation
Introduction The Tool must be prepared for maintenance before service access and manual control of the Tool
systems. Most service tasks require access to components and areas protected by safety interlocks. The
interlocks must be disabled, and all necessary access doors opened before doing any maintenance tasks.
Procedure
Step
Instruction
1
Make sure the Tool is idle, has finished its last wafer batch, all process wafers are
removed from Tool, and that permission (scheduled or otherwise) for the maintenance
activity has been given.
2
Open all access doors and remove exterior panels as required. Position the bypass key
switch to ON, if so equipped, before opening the doors.
Init.
WARNING - KEEP AWAY FROM THE DOWNWARD PATH OF THE WAFER HEAD. AFTER THE
INTERLOCK SWITCHES ARE BYPASSED, THE TOOL WILL BE ABLE TO OPERATE WITH ACCESS DOORS
OPEN! THE SHIELD INTERLOCK IS THE LAST SAFETY DEVICE WHICH PROTECTS PERSONNEL FROM
POSSIBLE HAZARDS RELATING TO MOVEMENT OF THE POLISH AND WAFER HEADS. THE HEADS ARE
CAPABLE OF EXERTING EXTREME AND POTENTIALLY LETHAL FORCE.
3
06/25/1999
Bypass the interlock switch (for each access door opened) by pulling the switch out
(toward you) fully. The Tool is now ready to be manually operated and serviced, and can
be accessed (in necessary areas) without stopping the Tool due to an interlock violation.
12-4
Daily PM’s
Table 12-1 lists the Daily Preventive Maintenance procedures.
Table 12-1. Daily Preventive Maintenance Procedures
Procedure
06/25/1999
Page
Prepare Tool For Daily PM
12-5
Clean Fiber In Pad
12-7
Clean Robot Pneumatic Lines (Gencobot® and Hine®)
12-16
12-5
Prepare Tool
For Daily PM
Daily PM procedures are usually done by the Tool operator.
Step
1
Instruction
Init.
Make sure the Tool has F76 End Point (EP) detection system. See Figure 12-1, and
page 6-31 for a description of the F76 Endpoint Detection System.
Daily preventive maintenance is required only for Tools that have the F76 End Point (EP)
detection system. See page 6-30 for an introduction to the F76 End Point (EP) detection system.
F76 Computer
Fiber Optic Cables
Figure 12-1. F76 End Point (EP) Detection System
Continued
06/25/1999
on next page
12-6
Daily Preventive Maintenance (F76 Equipped Tool Only), continued
Step
Instruction
Init.
2
Get approval from the shift lead person to do the daily PM procedures.
3
Make sure the Tool is idle, has finished its last wafer batch, all process wafers are
removed from Tool and all wafer heads are in the up position.
4
Open the access doors and remove the exterior panels, as required, to work on all four
polish heads.
Continued
06/25/1999
on next page
12-7
Clean Fiber In
Pad
Put on a full set of customer approved personal protective equipment (PPE) (acid gear) before doing this
procedure.
Figure 12-2. Clean Fiber In Pad (F76 Only)
Continued
06/25/1999
on next page
12-8
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Use the DI water sprayer to soak the pad area
around the fiber optic cable.
2
Use a soft bristled brush to gently brush the end
of the fiber optic cable.
3
Flush surface with DI water to remove slurry
particles from pad.
4
Flush and brush the end of the fiber optic cables
on the polish heads for one minute each.
Continued
06/25/1999
on next page
12-9
Inspect
Put on a full set of customer approved personal protective equipment (PPE) (acid gear) before doing this
Fiber
procedure.
Connection
s
Figure 12-3. Inspect Fiber Connections (F76 Only)
Continued
06/25/1999
on next page
12-10
Step
06/25/1999
MP 1
MP 2
MP 3
MP 4
Instruction
1
Visually inspect the fiber connection at the drain
deck on each of the polish heads.
2
Hand tighten any connections that are loose at
the drain deck.
3
Remove the V-band clamp and lift pad backer out.
4
Use the pad backer allen wrench to make sure the
clamping block is tight on the side of the pad
backer.
5
Reconnect the pad backer with the V-band.
12-11
Weekly
PM’s
Table 12-2 lists the Weekly Preventive Maintenance procedures.
Table 12-2. Weekly Preventive Maintenance Procedures
Procedure
06/25/1999
Page
Prepare Tool For Weekly PM
12-12
Clean Tool Surfaces and Basin Drains
12-14
Clean Robot Pneumatic Lines (Gencobot® and Hine®)
12-16
Clean Wafer Carrier (DF-200) and Check Shield Interlocks
12-20
Inspect Pneumatics Panel and PIAB TRAPS
12-22
Replace Aluminum Robot Paddle Side 2 Tape (Tier 3 Only)
12-24
Replace Ceramic Robot Paddle Tape (Tier 3 Only)
12-29
Inspect Wet Cassette
12-34
Inspect Wafer Recess
12-36
Inspect Wafer Head Anti-Rotation V-Block
12-38
Qualify
12-40
Initialize Tool For Production
12-41
Check Di Water Calibration
12-42
Pad Break-in / Vendor Qualification
12-44
Check OFA Readings
12-45
Check Dp Fluctuations
12-47
12-12
Prepare Tool
For Weekly PM
Weekly PM procedures are usually done by the Tool operator.
Figure 12-4. Prepare Tool For Weekly PM
Continued
06/25/1999
on next page
12-13
Weekly Preventive Maintenance, continued
.
Step
Instruction
Init.
1
Get approval from the shift lead person to do the weekly PM procedures.
2
Do all Daily Preventive Maintenance (F76 Equipped Tool Only) procedures, if required.
3
Make sure at least 1 liter of a customer approved cleaning solution is available.
4
Do the “Shutdown and Power Up” procedure on page 13-132, to power down the Tool.
5
Remove the C2C upper and lower exterior panels, and MP exterior panels. Use the
appropriate customer specific instructions to store the panels.
6
Remove the clear Polycarbonate doors. Use the appropriate customer specific
instructions to store the doors.
7
Pull out (bypass) all panel and door interlock switches.
Continued
06/25/1999
on next page
12-14
Clean Tool
Surfaces and
Basin Drains
Step
Instruction
Init.
1
Put on a full set of customer approved personal protective equipment (PPE) (acid gear).
2
Use a customer approved cleaning solution and a scrub brush to thoroughly clean the
polish basins, pad rings, V-band clamps, slurry basin splash rings, and polish bell. Do not
get any cleaning solution on the polish pad, wafer carrier film, or plastic shield.
Continued
06/25/1999
on next page
12-15
Clean Tool
Surfaces
and Basin
Drains
Step
Instruction
3
After cleaning, thoroughly rinse all cleaned surfaces with DI water. Make sure the polish
bell is rinsed.
Remove basin drains, rinse out contaminates, replace if fouled or damaged. Wipe down
with a customer approved cleaning solution.
4
Init.
5
Wipe down the slurry shields, C2C deck, and robot with DI water.
6
Wipe down the plexiglas doors and windows with DI water.
7
Wipe down the exterior of the Tool with DI water.
8
Remove lower pneumatic panels, inspect for leaks from drain lines, diverter valves, DI
lines, slurry lines.
9
Wipe up any standing liquids or liquid stains from the bottom of the Tool.
10
If there is a leak, write down the observations then do the “Repair Fluid Leak” procedure
on page 13-12.
11
Replace the lower pneumatic panels.
12
Return Tool to Service Mode.
Continued
06/25/1999
on next page
12-16
Clean Robot
Pneumatic
Lines
(Gencobot®
and Hine®)
Step
Instruction
Init.
1
Fill a 250 ml syringe with 150 ml of a customer approved cleaning solution and a second
250 ml syringe with 200 ml of DI water.
2
Unplug the 1/8” lines from the robot paddle, then direct them so they will drip into a
beaker, or onto wipes.
1/8” Lines from Robot Paddle
Continued
06/25/1999
on next page
12-17
Step
Instruction
Init.
3
Unplug the vacuum lines at the vacuum generator and connect the cleaning solution filled
syringe to them. Inject cleaning solution into the line until it comes out the other end of the
line. Let the cleaning solution set in the line for 30 seconds, then withdraw it back in the
syringe.
Vacuum Lines
Continued
06/25/1999
on next page
12-18
Step
Instruction
Init.
4
Connect the DI water filled syringe and rinse the lines thoroughly.
5
Repeat Steps 1 through 4 for the second line.
6
Reconnect lines to vacuum generators and to the robot paddle.
7
Fill a 250 ml beaker (kimax #14000, or similar) with 150 ml of DI water.
8
Unplug the 2 green vacuum generator exhaust lines of the C2C upper pneumatics panel
and place the wipes under the lines to capture any exhausted fluids coming out of these
lines.
9
From the C2C Discreet I/O window, enable Paddle vacuum 1 and Paddle vacuum 2.
10
Making sure the robot servos are disabled, position the beaker with the DI water under
the robot paddle. Raise the beaker to submerge the paddle tip. Allow the robot to draw
DI water for a count of 4 seconds then lower the beaker. Repeat this process until the
robot has drawn at least 100 ml of DI water.
Continued
06/25/1999
on next page
12-19
Step
Instruction
Init.
11
From the I/O screen, stop off vacuum 1 and vacuum 2. Start air 1 and air 2. This will blow
the DI water out of the channels. Let the air blow for at least 20 seconds before doing the
next step.
12
From the I/O screen, make sure that “Paddle air 1” and “Paddle air 2” are OFF. Start
“Paddle vacuum 1 and 2”.
13
Place wafer on paddle and make sure the vacuum is in limits. (10 + psi)
14
Make sure the paddle air is in limits. (7 psi)
15
Dispose of waste cleaning solution into one of the MP drain basins.
Continued
06/25/1999
on next page
12-20
Clean Wafer
Carrier (DF200) and Check
Shield
Interlocks
Step
Instruction
Init.
1
From MP I/O dialog box, lower the wafer head.
2
Lift the slurry shields and make sure the MP I/O dialog box for the three input channel
switches are correct.
Continued
06/25/1999
on next page
12-21
Step
Instruction
Init.
3
Remove the V-band clamp.
4
Use the controls in the MP Discrete I/O dialog box to raise the head, leaving the wafer
carrier on polish pad. Move the wafer head from the polish pad to a workbench, or
suitable work area.
5
Use a pin vice and drill bit to clean out the df-200 holes. Make sure all the holes are
cleared and the proper size.
6
Wipe down the df-200 with 70% IPA / DI water and a texwipe, inspect for slick spots and
air bubbles. If the df-200 is worn or has slick spots, replace. Rebuild lower wafer carrier.
7
Do the “Inspect Wafer Recess” on page 12-36.
8
Wipe down the inside of the upper and lower wafer carrier with a mixture of 70% IPA /
30% DI water.
9
Use the controls in the MP I/O dialog box to start wafer vacuum and wafer vacuum
enable.
10
Reseat the wafer carrier to wafer head with a wafer chucked.
11
Use the controls in the MP I/O window to lower the head.
Continued
06/25/1999
on next page
12-22
Step
Instruction
Init.
12
Re-install the V-band clamp.
13
Use the controls in the MP I/O window to disable wafer vacuum and wafer vacuum
enable. Set the Analog I/O wafer pressure at 3000. Start wafer air, then cycle the
cylinder head up. Remove the dummy wafer.
14
Repeat this procedure on the other three MP’s.
Continued
06/25/1999
on next page
12-23
Inspect
Pneumatics
Panel and
PIAB TRAPS
Step
Instruction
Init.
1
Inspect upper and lower pneumatics panels for tubes and wires that are chafing, kinked,
or pinched.
Continued
06/25/1999
on next page
12-24
Step
Instruction
Init.
2
Make sure fasteners and components are tight.
3
Remove the piab trap bowls, then replace the filter. Clean the bowl with DI water, if
necessary. Do not use any other cleaning solution to clean the piab trap bowls.
4
Repeat Steps 1 - 3 on the other three MP’s.
Continued
06/25/1999
on next page
12-25
Replace
Aluminum
Robot Paddle
Side 2 Tape
(Tier 3 Only)
This procedure must be completed by a warranty certified tier 3 technician.
Continued
06/25/1999
on next page
12-26
.
Step
1
Instruction
Init.
Inspect the paddle tape and reject any pieces with obvious flaws.
Flaws include: dirty edges, dry adhesive (looks like large bubbles between the tape and backing),
and mis-cut pieces.
2
Start Tool in Service Mode, de-servo (svfa) the robot from the Serial I/O window.
3
Remove old tape with a new razor blade.
4
Clean the entire paddle with DI water and IPA.
5
Inspect paddle for scratches in the paint or burrs that may cause vacuum leaks. Replace
paddle with any scratches and burrs not in limits.
Continued
06/25/1999
on next page
12-27
CAUTION - Use caution when taping paddle on wrist. Tool points may be affected if paddle
is bent or damaged during procedure.
Step
6
Instruction
Init.
Starting with the device end of the paddle, apply the long strip of die cut tape to the
channel, making sure the tape lines up with the vacuum and vacuum sense holes.
Make sure the tape is lying flat on the channel and does not overlap the channel edges.
7
Use your fingers to gently push the tape down and smooth out any bubbles.
Be careful not to push the tape into the channels. This will cause leaks.
Continued
06/25/1999
on next page
12-28
CAUTION - The tape must be aligned at the paddle groove with no overlapping. Overlapping
the tape could cause wafer damage.
Step
Instruction
Init.
8
Working back from the groove on the device end of the paddle, apply the round piece of
tape and smooth gently with your fingers and the alignment tool.
9
Use your fingers to work any air bubbles out with gentle outward movements.
CAUTION - Make sure the paddle is adequately supported when pressing on the paddle
tape. Tool Points may be affected if paddle is bent or damaged during procedure.
10
Use a small straight blade screwdriver to push forcibly on the second layer of tape,
sealing off any unwanted air escape channels.
11
Apply the third layer of tape. Use your fingers to work any air bubbles out with gentle
outward movements.
Continued
06/25/1999
on next page
12-29
Step
Instruction
Init.
12
Inspect new tape for burrs or delamination. Use a new razor to scrape the tape edges to
make sure the vacuum seal on the wafer is good.
13
Position a dummy wafer on the paddle to test the vacuum. Vacuum should be at least 0.01 and not more than -0.14 psig.
14
Lift the wafer 1/16 inch away from the paddle and watch for a drop in vacuum. If vacuum
drops below -0.10, repeat Steps 12 through 14 until vacuum drop is in limits.
15
Move the vacuum and vacuum sensor lines, from the wrist to the paddle, in a back and
forth motion watching for vacuum drop. If vacuum drops when lines are moved, re-seat
the tubing in the fitting.
16
Remove the dummy wafer from the paddle.
17
Do the “Shutdown and Power Up” procedure on page 13-132, to power down the Tool
then start it in Production Mode.
18
Successfully run 25 dummy wafers to complete qualification.
19
Make sure the r Tool Point in the cassette, and the z Tool Point on the MP load and
unload are in limits.
A SurfScan® must be run on the Tool if the tape is changed on the paddle.
Continued
06/25/1999
on next page
12-30
Step
20
Instruction
Init.
If all Tool Points are in limits, go to qualification after 25 wafers.
Continued
06/25/1999
on next page
12-31
Replace
Ceramic Robot
Paddle Tape
(Tier 3 Only)
This procedure must be completed by a warranty certified tier 3 technician
Continued
06/25/1999
on next page
12-32
Step
Instruction
Init.
1
Start the Tool in Service Mode, then de-servo (svfa) the robot from the Serial I/O window.
2
Remove the paddle from the Tool.
3
Inspect the paddle tape and reject any pieces with obvious flaws.
Flaws include: dirty edges, dry adhesive (looks like large bubbles between the tape and backing),
and mis-cut pieces.
4
Remove old tape with a new razor blade.
5
Clean the entire paddle with IPA.
6
Inspect paddle for scratches or burrs that may cause vacuum leaks. Replace paddle with
any scratches or burrs not in limits.
Continued
06/25/1999
on next page
12-33
Step
7
Instruction
Init.
Starting with the device end of the paddle, apply the round piece of die cut tape to the
channel, making sure the tape lines up with the vacuum and vacuum sense holes.
Make sure the tape is lying flat on the channel and does not overlap the channel edges.
8
Use your fingers to gently push the tape down and smooth out any bubbles.
Be careful not to push the tape into the channels. This will cause leaks.
9
10
Inspect new tape for burrs or delamination. Shave edges of tape with a clean razor
blade.
Repeat Steps 3 through 9, for the other side of the paddle.
Continued
06/25/1999
on next page
12-34
Step
Instruction
Init.
11
Position the adapter plate so the bottom side is up.
12
Insert four O-rings into the recessed holes on the adapter plate.
13
Position a gasket on the adapter plate, making sure holes are aligned.
14
Position the taped paddle on the gasket, making sure the holes are aligned.
15
Position the second gasket on the paddle, making sure the holes are aligned.
16
Position the load distribution plate on the second gasket, making sure all holes are
aligned.
17
Use four 4-40 screws to secure the load distribution plate, gaskets and paddle to the
adapter plate. Tighten to four inch-pounds torque.
18
Turn assembly over and insert the connectors. Tighten to four inch-pounds torque.
19
Install Beswick fittings.
20
Use four 10-32 X 0.625 SS-SHCS to attach the paddle to the wrist mounting block.
21
Connect tubing to appropriate fittings.
Continued
06/25/1999
on next page
12-35
Step
Instruction
22
Activate wafer vacuum.
23
Position dummy wafer on the paddle to test the vacuum. Vacuum should be at least 10.5
psig.
24
Pinch off the vacuum supply tube by hand for 60 seconds and observe vacuum. Reading
should remain stable. If vacuum drops below 10 psig, repeat Steps 6 through 8 until
vacuum drop is in limits.
25
Move the vacuum and vacuum sensor lines, from the wrist to the paddle, in a back and
forth motion watching for vacuum drop. If vacuum drops when lines are moved, re-seat
the tubing in the fitting.
26
Remove the dummy wafer from the paddle.
27
Do the “Shutdown and Power Up” procedure on page 13-132, to power down the Tool,
then start it in Production Mode.
28
Successfully run 25 dummy wafers to complete qualification.
29
Make sure the r Tool Point in the cassette, and the z Tool Point on the MP load and
unload are within limits.
Init.
Surfscans® must be run on the Tool if tape is changed on the paddle.
06/25/1999
12-36
Step
30
Instruction
Init.
If all Tool Points are acceptable, go to qualification after 25 wafers.
Continued
06/25/1999
on next page
12-37
Inspect Wet
Cassette
Step
Instruction
1
Remove stainless steel cover.
2
Visually inspect area under wet cassettes for leaks and standing fluids.
Init.
Continued
06/25/1999
on next page
12-38
Step
Instruction
Init.
3
Wipe away any residue or water under wet cassettes.
4
From the C2C I/O window raise cassette #1, then rotate it back and forth to make sure it
operates correctly. Write down the observations in the summary if problem is observed,
then refer to the appropriate procedure to correct it.
5
Rotate cassette #1 into proper load position and lower cassette #1 into the basin. Repeat
procedure for cassette #2.
6
Inspect wet cassette base plates for scratch marks. Scratches indicate the fasteners on
the bottom of the pivot bearings are backing out and the assembly needs to be removed
to re-tighten them.
Continued
06/25/1999
on next page
12-39
Inspect Wafer
Recess
MP 1
MP 2
MP 3
MP 4
Step
Instruction
1
Turn wafer carrier over so df-200 is up.
2
Position a dummy wafer in the carrier head.
3
Use a depth micrometer to measure the
wafer recess at eight points around the
wafer (between the screws).
4
The value should be 0.015” and 0.024”.
Write down the measurements on a Weekly
PM record form. Depth variations should be
less than 0.002” TIR.
Continued
06/25/1999
on next page
12-40
MP 1
MP 2
MP 3
MP 4
Step
Instruction
5
If the values are out of limits, do the
“Rebuild Wafer Carrier Assembly”
procedure on page 13-138, to rebuild the
wafer carrier and change the pbt wear ring.
6
Repeat Steps 1-5 for each MP.
Continued
06/25/1999
on next page
12-41
Inspect Wafer
Head AntiRotation VBlock
Do the following procedure if the Tool has been upgraded with the Anti-Rotation V-Block (RFK, Edgegap
Stability).
Step
1
Instruction
Init.
Lower the Wafer Head.
Continued
06/25/1999
on next page
12-42
Step
Instruction
2
Remove the four SHCS (two on top and two on bottom next to wafer head).
3
Inspect the V-Block for wear. Replace as needed.
4
Use Krytox® to lubricate all contact parts, if necessary.
5
Replace the four SHCS.
Init.
Continued
06/25/1999
on next page
12-43
Qualify
Inspect for, and remove, any debris or tools that have been left during service.
Continued
06/25/1999
on next page
12-44
Initialize
Tool For
Production
Step
Instruction
Init.
1
2
Wipe off all standing DI water and slurry from inside the Tool.
3
Inspect inside the Tool to make sure all tools and dummy wafers have been removed.
4
Reinstall all pneumatic panels.
5
Reinstall all clear Polycarbonate doors.
On Tools that do not have panel cut- outs for gauge readings, do Step 5 of procedure after
completing pad break in / vendor qualification.
6
Do the “Shutdown and Power Up” procedure on page 13-132, to power up the Tool and
re-initialize the Tool in Production Mode.
Continued
06/25/1999
on next page
12-45
Check Di Water
Calibration
Step
1
Instruction
Init.
Locate the DI water gauges under lower C2C pneumatics panel. See figure below.
Continued
06/25/1999
on next page
12-46
Step
Instruction
Init.
2
Start “pump” - “DI H2O” from the SysCon manual control icon on any one of the four
MP’s.
3
Look at DI water high water pressure gauge with DI water running on one MP. DI high
water gauge should display 30 but not greater than 40 psig. Write down the reading on
the Weekly PM record form. If out of adjustment adjust following DI water calibration
procedure. Do not exceed 45 psig at no flow.
4
From the MP manual control icon, turn DI H2O pump off.
5
From C2C maintenance control icon click on Slurry Flush - Start Flushing.
6
Look at DI water low pressure gauge with “slurry flush on.” Gauge should display at least
10, but not greater than 15 psig. Do not exceed 30 psig at no flow. Write down the
reading on the Weekly PM record form. If out of limits, use the DI water calibration
procedure to adjust.
Any adjustments to DI water low pressure gauge will require the calibration of all slurry pumps.
7
From the SysCon C2C manual control icon, disable Slurry Flush.
Continued
06/25/1999
on next page
12-47
Pad Break-in /
Vendor
Qualification
Step
Instruction
Init.
1
Load 8 dummy wafers, 4 rate wafers, and 4 Surfscan® wafers in a wafer cassette.
2
Load wafer cassette, and run Start All on break-in recipe.
3
Watch the Tool to make sure it operates correctly.
4
Visually make sure the Tool Points are in the correct positions. Write down any Tool
Points out of limits in the summary. To correct any Tool Points that are out of limits, refer
to the “Setting Gencobot Robot Tool Points” procedure on page 14-117 or the “Setting
Hine® Robot Tool Points” procedure on page 14-150.
Continued
06/25/1999
on next page
12-48
Check OFA
Readings
Step
Instruction
Init.
1
With Tool running vendor qualification, make sure OFA incoming air is > 90 psi. Write
down the actual reading on a Weekly PM record form.
2
Make sure the incoming air is clean, Oil Free air, filtered to 0.02mm and dried to a dew
point of at least -80 degrees C in accordance with SEMI F29.
3
Make sure the OFA line pressure on the C2C lower pneumatic panel is > 90 psi. Write
down the actual reading on the Weekly PM record form.
4
At each MP, make sure the upper pneumatics panel air E/P is 25 +5 psi. Write down the
actual reading on the Weekly PM record form.
Continued
06/25/1999
on next page
12-49
Step
Instruction
Init.
5
At each MP, make sure the lower pneumatics panel air pressure is 90 +5 psi, and the E/P
reg. in is 25 +5 psi. Write down the actual readings on the Weekly PM record form.
6
If necessary, adjust air regulators using the proper checklist. Do not adjust the E/P
regulator without recalibrating the P/I transducer. Refer to “Pad Conditioner Sensor
Verification” procedure on page 14-87.
Continued
06/25/1999
on next page
12-50
Check ∆p
Fluctuations
Step
1
Instruction
Init.
With vendor qualification running, watch ∆p for excessive fluctuation. Write down the
range on the Weekly PM record form.
Continued
06/25/1999
on next page
12-51
Step
Instruction
Init.
2
If ∆p fluctuates greater than (+ 0.05) refer to the ∆p flowchart for correction.
3
At successful completion of 8 break-in wafers, give control of the Tool to customer to run
the 4 rate wafers in slots 22 - 25
4
Write down the time the Tool completes the qualification and is put back into Production
Mode on the Weekly PM record form.
Continued
06/25/1999
on next page
12-52
Weekly PM
Certification
Name
MP S/N
Date
Start Time
Est. Time 3 Hours
Finish Time
Actual Time
Was the PM started at its CEPT scheduled time?
If not, when did it start?
Was the MP qualified before the PM?
Did the MP qualify in 1 hour after the PM?
YES / NO
___________
YES / NO
YES / NO
I certify that this weekly PM was done to all customer and SpeedFam-IPEC weekly PM standards and that
all data points that are written down are true and accurate.
SpeedFam-IPEC Signature __________________ Date__________
Customer Signature ______________ Date__________
Engineer Approval _______________ Date__________
Continued
06/25/1999
on next page
12-53
Weekly
Record
Form
Wafer Recess Record
READING
ACCEPTABLE
LIMITS
MP #1
MP #2
MP #3
MP #4
0.015” to
0.024” (0.002”
TIR Variation)
Average of
Reading 1-8
Record of OFA In Readings
Item
Acceptable Limits
OFA in
>90 psi
C2C supply
>90 psi
Initial
Adjusted
Record of E/P In Readings
MP #
Pressure
Lower Line P.
Lower E/P
Upper E/P
80 PSI
25 PSI
25 PSI
MP1
MP2
MP3
MP4
06/25/1999
12-54
Record of Di Gauge Readings
Item
Acceptable Limits
DI in
+ 40 psig
DI high
30 to 40 psig
DI low
10 to 15 psig
Initial
Adjusted
Record of ∆p Fluctuation
06/25/1999
MP#
Acceptable Limits
MP1
(+ 0.05)
MP2
(+ 0.05)
MP3
(+ 0.05)
MP4
(+ 0.05)
∆p Low
∆p High
12-55
Monthly
PM’s
Table 12-3 lists the Monthly Preventive Maintenance procedures.
Table 12-3. Monthly Preventive Maintenance Procedures
Procedure
Page
Prepare Tool For Monthly PM
12-54
Clean Pad Conditioner Arms
12-56
Inspect Rotary Union
12-57
Inspect Upper Drive Shaft
12-58
Inspect Main Cylinder
12-60
Inspect Paddle 2 Vacuum Generators
12-62
Replace Slurry Filters
12-64
Replace Slurry Pump 1 and 2 Tubing
12-65
Check Edge Gap
12-66
Check MP Leak Down Test Values
12-68
Check P/I Transducer
12-70
Check Slurry Pump 1 and 2 Values
12-72
Defrag Computer Hard Drives
12-75
Defrag F76 Computer Hard Drive
12-77
Delta-P Performance Test
12-79
Continued
06/25/1999
on next page
12-56
Monthly Preventive Maintenance, continued
Procedure
Page
Change F76 Lamps
12-82
Replace F76 Cables
12-83
Qualify
12-84
Vendor Qualification
12-85
Tool Points
12-87
Continued
06/25/1999
on next page
12-57
Prepare Tool
For Monthly
PM
Step
Instruction
Init.
1
Do all Weekly Preventive Maintenance procedures.
2
Get approval from the shift lead person to do the monthly PM procedures.
3
4
Use the “Shutdown and Power Up” procedure on page 13-132, to power down the Tool.
5
Remove the C2C upper and lower exterior panels and MP exterior panels. Use the
6
Continued
06/25/1999
on next page
12-58
Step
7
Instruction
Init.
Interlock Switch
Continued
06/25/1999
on next page
12-59
Clean Pad
Conditioner
Arms
Step
Cond 1
Cond 2
Instruction
1
Do not remove conditioner arms from Tool.
2
Thoroughly rinse the arms with DI water.
3
Wipe down with clean room wipes.
Continued
06/25/1999
on next page
12-60
Inspect Rotary
Union
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Visually inspect the rotary union and tubing for
any wear, nicks, pinching or twisting.
2
Use a ladder, as required, to reach the rotary
union, then physically turn the rotary union
through the full range of motion to make sure it
moves freely. Replace the rotary union if it does
not move freely or it is damaged
Continued
06/25/1999
on next page
12-61
Inspect Upper
Drive Shaft
Step
1
MP 1
MP 2
MP 3
MP 4
Instruction
Make sure shaft is lubricated.
Continued
06/25/1999
on next page
12-62
Step
2
3
MP 1
MP 2
MP 3
MP 4
Instruction
Inspect for metal shavings where shaft comes out
of the motor. If there are shavings on the motor,
replace the Nylatron® key.
Inspect the Nylatron® key for wear, gouges, or
compression marks. If the Nylatron® key shows
wear, gouges, or compression marks, replace the
key.
Continued
06/25/1999
on next page
12-63
Inspect Main
Cylinder
Step
1
MP 1
MP 2
MP 3
MP 4
Instruction
From the MP Operations dialog box, select wafer
head “down” and “up”. Cycle the head three
times.
Continued
06/25/1999
on next page
12-64
Step
MP 1
MP 2
MP 3
MP 4
Instruction
2
Observe cylinder motion. Make sure cylinder
travels full stroke and that the cylinder has smooth
motion and does not jerk.
3
Wipe outside cylinder to remove any lubricant
residue with clean room wipe. Do not use IPA.
4
If the cylinder jerks or cylinder travel is short, write
down the observations on the summary page.
Complete the PM and report findings to the Tool
owner.
Continued
06/25/1999
on next page
12-65
Inspect Paddle
2 Vacuum
Generators
Make sure facility air to the Tool is OFF before starting this procedure.
Step
1
Instruction
Init.
Remove paddle vacuum 2 tubing from generator and mac valve.
Continued
06/25/1999
on next page
12-66
Step
Instruction
2
Remove the generator and mac valve from the Tool.
3
Inspect for chemical build-up (slurry and DI water).
4
Replace generator and mac valve as necessary.
Init.
Continued
06/25/1999
on next page
12-67
Replace Slurry
Filters
Do CM-46 “Replace Slurry Filter” on page 13-145.
Do not replace slurry filter #3 unless slurry # 3 is being used in process.
Continued
06/25/1999
on next page
12-68
Replace Slurry
Pump 1 and 2
Tubing
Do CM-46 “Replace Slurry Pump Tubing” on page 13-142.
Continued
06/25/1999
on next page
12-69
Check Edge
Gap
If the optional Edge Gap Tool Accessory Kit, P/N 2850-738850, is available, use the Edge Gap Tool
Procedure, P/N 4606-738828, supplied with the Tool. If the Edge Gap Tool is not available, do the
following procedure.
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
From the MP Operations dialog box, enable
carrier vacuum.
2
From the MP Operations dialog box, command
the wafer head “down”.
Continued
06/25/1999
on next page
12-70
Step
MP 1
MP 2
MP 3
MP 4
Instruction
3
Remove the lower wafer carrier assembly. Raise
the wafer head by commanding wafer head “up”.
4
Place gap ring on polish head, set parallels to
0.765”.
5
Lower wafer head (minus lower wafer carrier),
then insert the parallels between the heads.
6
If parallels do not fit between heads, or fit is too
loose, adjust the edge gap.
Continued
06/25/1999
on next page
12-71
Check MP Leak
Down Test
Values
Step
1
MP 1
MP 2
MP 3
MP 4
Instruction
Install omega meter in the lower pneumatics
panel at the quick disconnect fitting. Omega
gauge should read 3 psi (+ 0.02)
Continued
06/25/1999
on next page
12-72
Step
MP 1
MP 2
MP 3
MP 4
Instruction
2
Pinch off air at outlet of E/P. Observe leak rate.
Rate should be less than 0.03 psi/30 sec.
3
Pinch off air after omega meter. Value on omega
gauge should not increase.
4
Repeat Steps 1-3 on wafer air from the upper
pneumatic panel. Leak rate should be less than
0.3 psi/30 sec. Wafer pressure should not
increase more than 0.02 psi.
5
Correct any leaks which may include rebuilding
the lower wafer carrier.
6
Write down the readings on the Monthly PM
record form.
Continued
06/25/1999
on next page
12-73
Check P/I
Transducer
Step
1
MP 1
MP 2
MP 3
MP 4
Instruction
With wafer still in head and head down from
previous procedure, set polish air at 1.0 psi in the
MP functions dialog box, then push “on”. Set
wafer air at 1.0 psi and push “On”.
Continued
06/25/1999
on next page
12-74
When changing or activating polish and wafer air pressure, it is important to increase the polish
air first. Increasing the polish air first makes sure the wafer stays seated in the carrier. When
decreasing pressures, decrease the wafer air first.
Step
06/25/1999
MP 1
MP 2
MP 3
MP 4
Instruction
2
Write down the P/I transducer value for wafer and
polish heads on the Monthly PM record form from
the MP status window for 1 psi. Transducer value
should read 1000 (± 20)
3
From the MP operations dialog box, set polish
pressure and wafer pressure at 4 psi.
4
Write down the P/I transducer value on the
Monthly PM record form from the MP status
window for 4 psi. Transducer value should read
4000 (± 20).
12-75
5
If P/I transducer values are out of limits,
recalibrate.
6
Remove the omega meter and reconnect the
tubing quick connect.
7
Write down the P/I transducer value for wafer and
polish heads on the Monthly PM record form from
the MP status window for 1 psi. Transducer value
should read 1000 (± 20)
Continued
06/25/1999
on next page
12-76
Check Slurry
Pump 1 and 2
Values
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Cover grating under slurry pumps with clean room
wipes to catch any slurry that might spill during
calibration.
2
Starting with Pump 1 on MP 1, have your assistant
open the line out quick disconnect and place the
hose end into a graduated cylinder. Have the
assistant hold the graduated cylinder and hose
until the end of the calibration.
3
Make sure the C2C system has been initialized.
4
From the MP1 functions dialog box send the value
210 ml/min for pump 1. Stop the pumps.
5
With a stop watch ready, start the pumps.
6
At the one minute mark stop the pumps.
7
Flow should be evaluated on the average of two 1
minute flow tests.
Continued
06/25/1999
on next page
12-77
Step
MP 1
MP 2
MP 3
MP 4
Instruction
8
Flow into graduated cylinder should read 210 ml +
5%. If flow is out of limits, refer to Step 14.
9
Write down the readings for pump # 1 on the
Monthly PM record form.
10
Have the assistant hook up the slurry out lines,
then dispose of the slurry in an acid approved wet
station.
Continued
06/25/1999
on next page
12-78
Step
MP 1
MP 2
MP 3
MP 4
Instruction
11
Repeat Steps 1 - 10 for slurry pump 2 using the
test values 200 ml/min. If out of calibration refer
to Step 14.
12
Write down the values for pump 2 on the Monthly
PM record form.
Continued
06/25/1999
on next page
12-79
Step
MP 1
MP 2
MP 3
MP 4
Instruction
13
Repeat Steps 1 - 12 for the other 3 MP’s. Write
down the data on the Monthly PM record form.
14
If any of the pump calibrations are out of limits,
first replace slurry pump hose, then re calibrate
slurry pump.
15
Cover grating under slurry pumps with clean room
wipes to catch any slurry that might spill during
calibration.
16
Starting with pump 1 MP1 have your assistant
open the line out quick disconnect and place the
hose end into a graduated cylinder. Make sure
the assistant holds the graduated cylinder and
hose until the end of the calibration.
Continued
06/25/1999
on next page
12-80
Defrag
Computer Hard
Drives
Step
1
C
D
M
N
O
P
Instruction
Exit Windows® on the SysCon computer.
Continued
06/25/1999
on next page
12-81
Step
C
D
M
N
O
P
Instruction
2
At c:\ type “defrag”.
3
Follow messages on the screen and proceed with
optimization recommended.
4
If any problems are found by the program, and it
asks if you want to save information, answer yes
and continue.
5
Once the program is finished running, change
drive designators from c: to d:\. Repeat Steps 2 4.
6
Once the program is finished, reboot the SysCon
computer and make sure the computer is
operating correctly.
7
Repeat Steps 1 - 6 for each computer.
Continued
06/25/1999
on next page
12-82
Defrag F76
Computer Hard
Drive
This procedure is for Tools equipped with a F76 End Point (EP) detection system. See page 6-31 for a
description of the F76 Endpoint Detection System
Step
1
Instruction
Init.
Select the F76 computer selection number 7 using the video switch box.
Continued
06/25/1999
on next page
12-83
Step
Instruction
Init.
2
Restart computer in MS-DOS mode.
3
At c:\ type “defrag”.
4
Follow messages on the screen and proceed with optimization recommended.
5
If any problems are found by the program, and it asks if you want to save information,
answer yes and continue.
6
When the program is finished, reboot the computer and make sure the computer is
operating correctly.
Continued
06/25/1999
on next page
12-84
Delta-P
Performance
Test
Do this procedure for each MP.
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Start Tool in Service Mode. Select the MP.
Activate main air (Domain_Air) from the Discrete
I/O screen.
2
Activate wafer vacuum (DoWafer_vacuum and
DoWafer-vac-enable). Load a wafer in the wafer
head. Lower the head, then disable the wafer
vacuum.
Continued
06/25/1999
on next page
12-85
Step
3
MP 1
MP 2
MP 3
MP 4
Instruction
Disconnect the pressure line from both of the P/I
transducers and leave open to atmosphere.
Continued
06/25/1999
on next page
12-86
Step
MP 1
MP 2
MP 3
MP 4
Instruction
4
Make sure the values displayed for the aiUpper
and aiPolish_Transducer are 0 + 50 counts for
both.
5
Reconnect the tubing to both P/I transducers.
6
With the wafer still in the head and the head
down, display the Analog I/O screen, input 3000
counts into aoWafer and aoPolish_Pressure.
If the values are not in limits, refer to “Pad Conditioner Sensor Verification” procedure on page
14-87.
7
Activate polish and wafer air digital outputs.
Continued
06/25/1999
on next page
12-87
Step
8
MP 1
MP 2
MP 3
MP 4
Instruction
Make sure the values displayed for the
aiUpper_Transducer is in the limits of 0 + 300
counts and the value for the aiPolish_Transducer
is in the limits of 3000 + 150 counts.
If the values are not in limits, refer to “Pad Conditioner Sensor Verification” procedure on page
14-87.
9
06/25/1999
Disable polish and wafer air digital outputs. Set
the pressure to zero counts for aoWafer and
aoPolish_Pressure, then raise the head.
12-88
Change F76
Lamps
For Tools equipped with a F76 Endpoint (EP) detection system, do CM-50 “Replace F76 Lamps” on page
13-155. See page 6-31 for a description of the F76 Endpoint Detection System.
Continued
06/25/1999
on next page
12-89
Replace F76
Cables
For Tools equipped with a F76 Endpoint (EP) detection system, do CM-55 “Replace F76 Fiber Optic
Cables” on page 13-177. See page 6-31 for a description of the F76 Endpoint Detection System.
Continued
06/25/1999
on next page
12-90
Qualify
Inspect for, and remove, any debris or tools that have been left during service.
Continued
06/25/1999
on next page
12-91
Vendor
Qualification
Continued
06/25/1999
on next page
12-92
Step
Instruction
Init.
1
Load 8 dummy wafers, 4 rate wafers, and 4 Surfscan® wafers in a wafer cassette.
2
Load the wafer cassette and run Start All on the break-in recipe.
3
4
Points out of limits in the summary. To correct any deviations, refer to the “Setting
Gencobot Robot Tool Points” procedure on page 14-117.
Continued
06/25/1999
on next page
12-93
Tool Points
Step
Instruction
1
While running vendor qualification wafers, observe robot location during run.
2
Make sure wafers are removed from cassette by robot correctly.
Init.
Continued
06/25/1999
on next page
12-94
Step
Instruction
Init.
3
Make sure the wafer aligns properly on the alignment pins.
4
Look at wafers loading into each head:
• Is wafer loading too long/ short? (+ or - r)
• Is wafer loading too much left or right? (+ or - t)
5
Inspect load / unload in Spray Box.
6
Make sure the wafers return to the cassette.
7
Once observations are noted, call a Level 3 technician to make changes to the toolpts.dat
file, as necessary.
Continued
06/25/1999
on next page
12-95
Monthly PM
Certification
Name
MP S/N
Date
Start Time
Est. Time 9 Hours
Finish Time
Actual Time
YES / NO
___________
YES / NO
YES / NO
I certify that this monthly PM was done to all customer and SpeedFam-IPEC monthly PM standards and
that all data points that are written down are true and accurate.
Continued
06/25/1999
on next page
12-96
Monthly
Wafer
Recess
Record
Reading
Average of reading 1-8
Record Of
Leak Down
Readings
MP #
Acceptable Limits
MP #1
MP #2
MP #4
0.015” to 0.024” (0.002” tir
variation)
Wafer Limits
Wafer Head
Polish Limits
MP #1
(0.30psi/30 sec)
(0.03 psi/30 sec)
MP #2
(0.30psi/30 sec)
(0.03 psi/30 sec)
MP #3
(0.30psi/30 sec)
(0.03 psi/30 sec)
MP #4
(0.30psi/30 sec)
(0.03 psi/30 sec)
Record Of
P/I
Verification
Readings
MP #3
Polish Bell
MP #
Wafer P/I PSI
Wafer P/I 4 PSI
Wafer P/I PSI
Wafer P/I 4 PSI
Limits
1000 (±20)
4000 (±20)
1000 (±20)
4000 (±20)
MP#1
MP #2
MP #3
MP #4
Continued
06/25/1999
on next page
12-97
Record Of
Slurry
Pump Rate
Of Flow
Pump #1
MP #1
MP #2
MP #3
MP #4
210 Ml./min + 5%
210 Ml./min + 5%
210 Ml./min + 5%
210 Ml./min + 5%
200 Ml/min + 5%
200 Ml/min + 5%
200 Ml/min + 5%
200 Ml/min + 5%
8 Ml/min + 5%
8 Ml/min + 5%
8 Ml/min + 5%
8 Ml/min + 5%
Initial
Adjusted
Pump #2
Initial
Adjusted
Pump #2
Initial
Adjusted
06/25/1999
12-98
Quarterly
PM’s
Table 12-4 lists the Quarterly Preventive Maintenance procedures.
Table 12-4. Quarterly Preventive Maintenance Procedures
Procedure
Page
Prepare Tool For Quarterly PM
12-93
Inspect Leak Detect Sensors
12-95
Inspect Spray Box
12-97
Rebuild and Inspect Polish Bell
12-99
Write Down and Adjust DC Bus Voltages
12-105
Delta-P Polish Test
12-107
Delta-P Wafer Test
12-113
Qualify
12-119
Endpoint Checklist
12-121
Hine® Robot Z-axis Drive Belt and Drive Motor Inspection
12-126
Continued
06/25/1999
on next page
12-99
Prepare Tool
For Quarterly
PM
Step
1
Instruction
Init.
Do all the Monthly Preventive Maintenance procedures.
Continued
06/25/1999
on next page
12-100
Quarterly Preventive Maintenance, continued
Step
Instruction
Init.
2
Get approval from the shift lead person to do the quarterly PM procedures.
3
4
5
6
7
Continued
06/25/1999
on next page
12-101
Inspect Leak
Detect Sensors
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
From the MP Discrete I/O window find the input
marked leak detect sensor (channel 01).
2
Locate leak detect sensor in bottom of MP slurry
module. I/O should be positioned to OFF when
dry.
Continued
06/25/1999
on next page
12-102
Step
MP 1
MP 2
MP 3
MP 4
Instruction
3
Flood sensor with DI water. When level covers
50% of the nose, the I/O should come ON.
4
Drain area. Sensor should go OFF. Wipe down
to clean area.
5
Repeat Steps 1 - 4 on other MP’s
6
If leak detect sensor fails to respond, write down
the findings in the Quarterly PM record form.
Continued
06/25/1999
on next page
12-103
Inspect Spray
Box
C2C
Step
1
Instruction
Place a dummy wafer in Spray Box sides 1 and 2.
Continued
06/25/1999
on next page
12-104
C2C
Step
Instruction
2
From the C2C Manual dialog box, enable Spray 1 jets.
3
Inspect adjustment of spray nozzles for an excess of spray leaving the Spray
Boxes. Adjust nozzles, if necessary.
4
Repeat Step 3 for Spray 2.
Continued
06/25/1999
on next page
12-105
Rebuild and
Inspect Polish
Bell
• Replace polish bladder
• Inspect lower motor belt
Clean all removed stainless steel parts with 6% IPA/DI water solution.
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Raise wet cassette lift towers, remove Spray Box
cover and drain deck (being careful not to disturb
the paddle position sensors) and lower wet
cassette lift towers.
2
Do the example Lockout / Tagout Procedure given
in Chapter 3, or a site approved lockout / tagout
procedure that is in compliance with OSHA 1910147, or other applicable regulations.
Continued
06/25/1999
on next page
12-106
Step
MP 1
MP 2
MP 3
MP 4
Instruction
3
Remove V-band clamp, upper clamp ring, polish
pad, and slurry mesh. Set aside to reinstall later.
4
Remove the 20 screws holding the bladder
retaining ring using a reverse star pattern.
5
Remove the bladder retaining ring and bladder.
Disconnect the bladder tubing at the bladder
fitting. Set aside to replace later.
Continued
on next page
7
06/25/1999
12-107
Step
MP 1
MP 2
MP 3
MP 4
Instruction
6
Loosen 8 screws in polish bell, loosen drive shaft
setscrew.
7
Remove all four screws attaching the drive shaft
to the polish bell. Disconnect tubing at slurry box,
then remove the drive shaft from polish bell.
8
Lift bell from the top of the wave generator making
sure not to damage tubing.
Continued
06/25/1999
on next page
12-108
Step
9
MP 1
MP 2
MP 3
MP 4
Instruction
Loosen the motor and remove the lower motor
belt.
Continued
06/25/1999
on next page
12-109
Step
MP 1
MP 2
MP 3
MP 4
Instruction
10
Inspect motor belt for cracks, gouges, and debris.
Replace as necessary.
11
During the reassembly process, do the following
for all fasteners below the 20 screw lower clamp
ring:
• Chase all threads with a #10-32 bottom tap.
• Remove residual Loctite® from fasteners (or
replace fasteners).
• Use low-strength purple grade thread locker
on all fasteners.
• Install fasteners hand tight, making sure
components are seated flat.
• Use a calibrated right-angle “click-type”
adjustable torque wrench (armstrong #64-007
or equivalent) to tighten fasteners.
• Use a progressive sequence starting with 15
inch-pounds, then 25 inch-pounds, and finally
32 inch-pounds, to tighten the fasteners in a
star pattern. Make sure all fasteners after tight
at each stage.
Continued
06/25/1999
on next page
12-110
If the polish head leaks after assembly, it may be necessary to tighten the 8 polish bell fasteners.
Tighten these fasteners to 48 inch-pounds torque.
Continued
06/25/1999
on next page
12-111
Step
MP 1
MP 2
MP 3
MP 4
Instruction
12
Make sure the belt has the correct tension by
pinching the center of the belts with your finger
and thumb. There should be less than 5/8”
deflection. Tighten the belt if it is not in limits.
13
Replace polish bell and drive shaft. Make sure
bell is seated all the way down and is even all the
way around.
14
Install 8 screws. Tighten to 32 inch-pounds
torque.
15
Reconnect tubing.
16
Install the new bladder and bladder clamp ring
making sure bladder is aligned with rinse holes.
(Use a small allen wrench inserted in rinse holes
to inspect alignment).
Continued
06/25/1999
on next page
12-112
Step
MP 1
MP 2
MP 3
MP 4
Instruction
17
Reinstall the 20 retaining screws. Tighten to eight
inch-pounds torque, in a star pattern.
18
From the MP Discrete I/O window, start the purge
and rinse. Flow on the head should be 2” in
height. If holes are restricted remove the 20 bolts
and realign the bladder to the rinse holes.
19
From the MP Discrete I/O window stop the purge
and rinse.
20
Replace the slurry mesh.
21
Reinstall the polish pad, upper V-band clamp ring,
and V-band clamp.
Continued
06/25/1999
on next page
12-113
Write Down
and Adjust DC
Bus Voltages
Continued
06/25/1999
on next page
12-114
Step
EP
C2C
MP 1
MP 2
MP 3
MP 4
Instruction
1
Measure 24v DC down leg of circuit breaker
on lines (+)“2101” and (-) “com”. Adjust if
necessary using the voltage adjustment
checklist. Write down the voltages on the
Quarterly PM record form.
2
Measure 12VDC down leg of circuit breaker
on lines (+)“1201” and (-) “com”. Adjust if
Continued
06/25/1999
on next page
12-115
Step
EP
C2C
MP 1
MP 2
MP 3
MP 4
Instruction
3
Measure 5VDC down leg of circuit breaker
on (+) “5001” and (-) “com”. Adjust if
4
Measure the -12v at the C2C terminal
block. If out of adjustment adjust using the
voltage adjustment checklist. Write down
the voltages on the Quarterly PM record
form.
5
If any of the above voltages are out of
limits, follow site safety procedures for
adjusting high voltage power supplies.
Continued
06/25/1999
on next page
12-116
Delta-P Polish
Test
While doing the following Steps, write down the Delta-P Polish Test measurements in Table 12-5.
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Start the Tool in Service Mode. Select the MP.
2
Enable Main Air and Wafer Vacuum from the
Discrete
I/O screen.
3
Load a wafer in the wafer head, lower the head,
then disable the Wafer Vacuum.
4
Enable Polish and Wafer Air digital outputs.
Continued
06/25/1999
on next page
12-117
Step
5
MP 1
MP 2
MP 3
MP 4
Instruction
Disconnect the pressure line from the output of
the polish I/P, E/P, then connect a Fluke gauge to
the output of the Polish I/P, E/P.
Continued
06/25/1999
on next page
12-118
Step
MP 1
MP 2
MP 3
MP 4
Instruction
6
Set the Polish Pressure to 1000 (1.0 psi) on the
Analog I/O screen. Set the Wafer Pressure to 0 (0
psi).
7
Make sure the value displayed on the Fluke
Gauge is in the limits of 1.0 +0.15 psi. Write down
the value on Table 12-5.
If the value displayed on the Fluke Gauge is not in the limits of 1.0 + 0.15 psi, the Polish I/P, E/P
requires re-calibration. Refer to “Pad Conditioner Sensor Verification” procedure on page 14-87.
Continued
06/25/1999
on next page
12-119
Step
MP 1
MP 2
MP 3
MP 4
Instruction
8
Set the Polish Pressure to 6000 (6.0 psi) on the
Analog I/O screen. Set the Wafer Pressure to 0
(0 psi).
9
10
Reset the Polish Pressure to 1000 (1.0 psi) on the
Analog I/O screen.
11
Connect the output of the Polish I/P, E/P to the
Polish Bell pressure line.
12
Tee in the Fluke Gauge to the input of the Polish
Transducer (P/I).
13
Compare the pressure displayed on the Fluke
Gauge to the pressure of the Polish P/I.
14
Make sure the values agree within the limits of +
0.05 psi. Write down the value in Table 12-5.
Continued
06/25/1999
on next page
12-120
Step
15
MP 1
MP 2
MP 3
MP 4
Instruction
Gauge is 1 +0.15 psi. Write down the value in
Table 12-5.
If the value displayed on the Fluke Gauge is not in the limits of 1.0 + 0.15 psi, but was in limits in
Step 7, then inspect for a leak in the system from the Polish I/P, E/P output to the Polish P/I input.
If both values are not in limits, the Polish P/I requires re-calibration. Refer to the “Pad Conditioner
Sensor Verification” procedure on page 14-87.
Continued
06/25/1999
on next page
12-121
Step
MP 1
MP 2
MP 3
MP 4
Instruction
16
Reset the Polish Pressure to 6000 (6.0 psi) on the
Analog I/O screen.
17
Compare the pressure displayed on the Fluke
Gauge to the pressure of the Polish P/I.
18
Make sure the values agree within the limits of +
0.05 psi. Write down the value in Table 12-5.
19
Gauge is in the limits of 6 +0.15 psi. Write down
the value in Table 12-5.
If the value displayed on the Fluke Gauge is not in the limits of 6.0 + 0.15 psi but was in limits in
Step 7, then inspect for a leak in the system from the Polish I/P, E/P output to the Polish P/I input.
If both values are not in limits, the Polish P/I requires re-calibration. Refer to “Pad Conditioner
Sensor Verification” procedure on page 14-87.
Continued
06/25/1999
on next page
12-122
Measured
Values
Write down the measurements of the Delta-P Polish Test in Table 12-5.
Table 12-5. Delta-P Polish Test
Polish Pressure P/I
(aoPolish_Pressure)
Polish Pressure P/I
(aoPolish_Transducer)
Fluke Pressure Gauge
1000 (1.0 psi)
6000 (6.0 psi)
1000 (1.0 psi)
6000 (6.0 psi)
06/25/1999
12-123
Delta-P Wafer
Test
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Start Tool in Service Mode. Select the MP.
2
Enable Main Air and Wafer Vacuum from the
Discrete
I/O screen.
3
Load a wafer in the wafer head, lower the head,
then disable the Wafer Vacuum.
4
Make sure Wafer and Polish Pressure is set at 0
(0.0 psi).
Continued
06/25/1999
on next page
12-124
Step
5
MP 1
MP 2
MP 3
MP 4
Instruction
Disconnect the pressure line at the output of the
Wafer I/P, E/P. Connect the Fluke gauge to the
output of the Wafer I/P, E/P.
Continued
06/25/1999
on next page
12-125
Step
MP 1
MP 2
MP 3
MP 4
Instruction
6
Enable Polish and Wafer Air digital outputs.
7
Set the Wafer Pressure to 1000 (1.0 psi) on the
Analog I/O screen.
8
If the value displayed on the Fluke Gauge is not in the limits of 1.0 +0.15 psi, the Wafer I/P, E/P
requires re-calibration. Refer to “Pad Conditioner Sensor Verification” procedure on page 14-87.
9
10
Set the Wafer Pressure to 6000 (6.0 psi) on the
Analog I/O screen.
Make sure the value displayed on the Fluke gauge
is in the limits of 6.0 +0.15 psi. Write down the
value on Table 12-6.
If the Fluke and Wafer I/P, E/P values are not in limits, the Wafer E/P requires re-calibration. Refer
to “Pad Conditioner Sensor Verification” procedure on page 14-87.
Continued
06/25/1999
on next page
12-126
Step
MP 1
MP 2
MP 3
MP 4
Instruction
11
Reset the Wafer Pressure to 0 (0.0 psi) on the
Analog
I/O screen. Reconnect the output of the Wafer I/P,
E/P to the appropriate pressure line.
12
Disconnect the low and high pressure inputs to
the Delta-P P/I Transducer.
13
Make sure the Delta-P pressure value displayed
on the Analog I/O screen is in the limits of 0 + 50
(0.00 + 0.05 psi). Write down the value in Table
12-6.
If the value displayed is not in limits, the Delta-P P/I requires re-calibration. Refer to “Pad
Conditioner Sensor Verification” procedure on page 14-87.
Continued
06/25/1999
on next page
12-127
Step
MP 1
MP 2
MP 3
MP 4
Instruction
14
Reconnect the high pressure line input to the
Delta-P P/I.
15
Tee in the Fluke Gauge at the high pressure
inputs to the Delta-P P/I.
16
Keep the low pressure input to the Delta-P P/I
disconnected and open to the atmosphere.
17
Set the polish pressure to 3000 (3.0 psi) in the
Analog I/O screen. Set the wafer pressure to 0
(0.0 psi).
Continued
06/25/1999
on next page
12-128
Step
MP 1
MP 2
MP 3
MP 4
Instruction
18
Make sure the pressure value displayed on the
Fluke Gauge and the pressure value displayed on
the Delta-P P/I agree in the limits of +0.05 psi (50
counts). Write down the value on Table 12-6.
19
the value in Table 12-6.
If the value displayed on the Fluke Gauge is not in limits of 3.0 +0.15 psi, then inspect for a leak
from the Polish I/P, E/P output to the Delta-P P/I input.
If both values are not in the limits, the Delta-P P/I Transducer requires re-calibration. Refer to
“Pad Conditioner Sensor Verification” procedure on page 14-87.
20
Restore connection of air lines and return the Tool
to normal operating conditions.
Continued
06/25/1999
on next page
12-129
Record of
Delta-P
Wafer Test
Write down the measurements of the Delta-P Wafer Test in Table 12-6.
Table 12-6. Delta-P Wafer Test
Polish Pressure
E/P
(aoPolish_Pressu
re)
Wafer Pressure E/P
(aoWafer_Pressure)
0 (0.0 psi)
1000 (1.0 psi)
0 (0.0 psi)
6000 (6.0 psi)
0 (0.0 psi)
0 (0.0 psi)
3000 (3.0 psi)
0 (0.0 psi)
Polish Pressure P/I
(aiPolish_Transduce
r)
Delta-P Pressure P/I
(aiDeltaP)
Fluke Gauge
Continued
06/25/1999
on next page
12-130
Qualify
Inspect for, and remove, any debris or tools left during service.
Step
1
Instruction
Init.
Load a wafer cassette with 25 cycle wafers and a second wafer cassette with 8 break in
wafers, 4 Surfscan® wafers, and 4 rate wafers.
Continued
06/25/1999
on next page
12-131
\
Step
Instruction
Init.
2
Load the wafer cassettes and run with a vendor qualification recipe.
3
4
Gencobot Robot Tool Points” procedure on page 14-117. or “Setting Hine® Robot Tool
Points” on page 14-150.
Continued
06/25/1999
on next page
12-132
Endpoint
Checklist
For use on systems with Tungsten endpoint only. For each head, the following should occur:
Event
Display / Response
Power up or reboot endpoint computer.
ENDPOINT program should appear with 4 graphs
entitled MP1, MP2, MP3, AND MP4. The message
line at the bottom of the screen should be blank.
Continued
06/25/1999
on next page
12-133
Run 1 wafer with 4500 Ý of W* on each head of the MP using r94ep.rcp. For each head, the following
should occur:
Event
Display / Response
As the robot loads the first wafer, the C2C activates “Starting collection” should appear at the bottom of
“lot running” signal.
the endpoint screen.
Motors start running, causing motor current to rise
above 0.
“Chamber x, process started” should appear at the
bottom of the endpoint screen.
60 seconds after process starts.
Motor current appears on the ep screen.
During the w polish step (Step 10).
“Chamber x endpoint trigger found” should appear
at the bottom of the endpoint screen at the time of
endpoint “knee”. After the overpolish, the endpoint
system should activate the “EP detected” signal,
causing the MP to stop Step 10 and begin Step 11
before the Step 10 timer expires.
When the wafer finishes.
The wafer should be unloaded without any alarms.
When the lot finishes, C2C de-activates “lot
running” signal.
“Data saved to local drive” should appear at the
Continued
06/25/1999
on next page
12-134
Run 1 wafer with no W on each head of the MP using r94ep.rcp. For each head, the following should
occur:
Event
Display / Response
As robot loads first wafer, C2C activates “lot
running” signal.
“Starting collection” should appear at the bottom of
the endpoint screen.
Motors start running, causing motor current to rise
above 0.
“Chamber x, process started” should appear at the
60 seconds after process starts.
Motor current appears on the ep screen.
During w polish step (Step 10).
The endpoint trace should be flat, causing no
endpoint to be found. The “chamber x endpoint
trigger found” message should not appear. Recipe
Step 10 should time out as specified in the recipe.
When the wafer finishes.
“Mplx: no endpoint detected” alarm should be
issued.
When the lot finishes, C2C de-activates “lot
running” signal.
“Data saved to local drive” should appear at the
bottom of endpoint screen.
The blank test wafers with 4500 Ý of W can be approximated by polishing the standard W rate
monitor for 45 sec.
Continued
06/25/1999
on next page
12-135
Quarterly
Record of
DC Bus
Voltages
Test, adjust if required, then write down the voltages at each of the locations shown in Table 12-7.
Continued
06/25/1999
on next page
12-136
Table 12-7. DC Bus Voltages
MP 1
MP 2
MP 3
MP 4
MP 5
MP 6
24V DC
INITIAL
ADJUSTED
12V DC
INITIAL
ADJUSTED
5V DC
INITIAL
ADJUSTED
-12V DC
INITIAL
ADJUSTED
Continued
06/25/1999
on next page
12-137
Hine® Robot Zaxis Drive Belt
and Drive
Motor
Inspection
Step
1
Instruction
Init.
Disconnect robot power supply cable.
DANGER - DO NOT CONTACT ANY CABLES OR WIRES WHEN THE ROBOT COVERS ARE REMOVED.
W
WARNING
2
Remove the covers on the base of the robot.
3
Use a high intensity light to look at the Z-axis drive belt and make sure there are no signs
of excessive wear.
4
Look for damage or excessive wear to the teeth of the belt and reinforcing material in the
belt backing. Replace the belt if it is damaged, or has excessive wear. Refer to the
Original Equipment Manufacturer (OEM) Manuals on the 676 CD-ROM in the
Oem_manu.als\Hine subdirectory.
Continued
06/25/1999
on next page
12-138
Step
5
Instruction
Init.
Make sure robot is free of obstructions, then reconnect the power supply cable to the
robot.
Continued
06/25/1999
on next page
12-139
WARNING - KEEP ALL HANDS AND TOOLS AWAY FROM THE INSIDE OF THE ROBOT DURING ROBOT
MOTION. DRIVE BELTS AND MOTORS PRESENT A PINCH HAZARD.
Step
Instruction
Init.
6
Use the teach pendant to manually actuate the Z-axis drive belt so the entire length of the
belt can be examined. Replace belt if it is worn excessively. Refer to the Original
Equipment Manufacturer (OEM) Manuals on the 676 CD-ROM, in the
Oem_manu.als\Hine subdirectory.
CAUTION - Do not remove the motor brushes. The brush retaining springs or brush contact
can be easily damaged by improper re-installation of the brushes.
7
Make sure the Z-axis drive motor brush holder is not damaged. If damage exists, replace
plastic brush holder.
8
Make sure the Z-axis motor is not running rough or unusually noisy. Replace motor, if
required. Look at the Original Equipment Manufacturer (OEM) Manuals on the 676 CDROM in the Oem_manu.als\Hine subdirectory.
Continued
06/25/1999
on next page
12-140
Step
9
Instruction
Init.
Disconnect robot power supply cable.
10
Make sure all cable connectors are seated and secure and that no wires will be pinched
when covers are installed.
11
Replace robot covers and reconnect robot power supply cable.
Continued
06/25/1999
on next page
12-141
Quarterly
PM
Name
Certification
MP S/N
Date
Start Time
Est. Time 16 Hours
Finish Time
Actual Time
YES / NO
___________
YES / NO
YES / NO
I certify that this quarterly PM was done to all customer and SpeedFam-IPEC quarterly PM standards and
that all data points that are written down are true and accurate.
06/25/1999
12-142
SemiAnnual
PM’s
Table 12-8 lists the Semi-Annual Preventive Maintenance procedures.
Table 12-8. Semi Annual Preventive Maintenance Procedures
Procedure
06/25/1999
Page
Prepare Tool For Semi-Annual PM
12-131
Sensor Array Check
12-133
Replace Conditioner Brushes
12-135
Replace O-Rings In Robot Wrist (Gencobot®)
12-137
Write Down and Adjust Motor Speed
12-139
Replace F76 SMA Connector O-Rings and Gasket
12-141
Qualify
12-143
12-143
Prepare Tool
For SemiAnnual PM
Continued
06/25/1999
on next page
12-144
Semi-Annual Preventive Maintenance, continued
Step
Instruction
Init.
1
Do all Quarterly Preventive Maintenance procedures.
2
Get approval from the shift lead person to do the semi-annual PM procedures.
3
4
5
6
7
Continued
06/25/1999
on next page
12-145
Sensor Array
Check
Step
1
Array 1
Array 2
Instruction
Load wafer cassette, with 25 wafers, in carrier 1.
Continued
06/25/1999
on next page
12-146
Step
Array 1
Array 2
Instruction
2
Lower wafer sensor array 1.
3
Make sure operation of wafer sensor array is smooth.
4
Visually look at alignment of sensor flags against
wafer. Wafers should be centered between flags.
5
Make sure all 25 wafer inputs are registering in the
C2C Discrete I/O dialog box.
6
Roll wafers side to side to make sure array is always
sensing the wafers.
7
Raise array, make sure operation is smooth.
8
Repeat for array 2.
Continued
06/25/1999
on next page
12-147
Replace
Conditioner
Brushes
Step
1
Brush 1
Brush 2
Instruction
Remove the four screws connecting the brush to the
conditioner arm.
Continued
06/25/1999
on next page
12-148
CAUTION - Do not adjust curvature setscrews.
Step
Brush 1
Brush 2
Instruction
2
Position a new brush in the conditioner arm slot.
3
Tighten the four screws.
4
Test brush.
Continued
06/25/1999
on next page
12-149
Replace
O-Rings In
Robot Wrist
(Gencobot®)
Step
1
Instruction
Init.
Continued
06/25/1999
on next page
12-150
Step
Instruction
Init.
2
Remove both covers on the robot wrist.
3
Disconnect vacuum sense and source lines, then mark tubing.
4
Remove old O-rings.
5
Make sure the setscrews on the pulleys are tight and motor and shaft pulleys are aligned
in the same plane.
6
Install new O-rings.
7
Inspect material condition of the inside of the wrist. Make sure no wires or tubing is
pinched or broken.
8
Replace tubing.
9
Start the Tool in Service Mode.
10
Make sure the paddle does not leak.
11
Replace covers on the robot wrist. Make sure their are no leaks.
12
Go to electrical zero to eliminate stray messages, then do the “Shutdown and Power Up”
procedure on page 13-132, to power up the Tool. and re-initialize for production.
13
Run vendor qualification.
Continued
06/25/1999
on next page
12-151
Write Down
and Adjust
Motor Speed
Step
1
MP 1
MP 2
MP 3
MP 4
Instruction
From the MP Functions dialog box, send the orbit
rpm set at 60 rpm.
Continued
06/25/1999
on next page
12-152
Step
MP 1
MP 2
MP 3
MP 4
Instruction
2
Click the orbit rpm ON button to start the spindle.
3
Use a rotating sensor of tachometer on the edge
of the polish pad clamp ring to make sure the
speed settings are correct. Write down the actual
results for each head. Use caution when working
around open orbiting MP!
4
From the MP functions dialog box, set the orbit
rpm at 100 rpm. Write down the actual results for
each head.
5
each head.
6
each head.
Continued
06/25/1999
on next page
12-153
Step
7
8
MP 1
MP 2
MP 3
MP 4
Instruction
each head.
If the actual spindle speed was more than 3% from the rpm set point in Steps 4 through 6, do
the “Toshiba Programming Procedure” procedure on page 14-17.
Continued
06/25/1999
on next page
12-154
Replace F76
SMA
Connector
O-Rings and
Gasket
Do this procedure for Tools equipped with a F76 End Point (EP) detection system. See page 6-31 for a
description of the F76 Endpoint Detection System.
Step
1
MP 1
MP 2
MP 3
MP 4
Instruction
Disconnect fibers from SMA connectors on drain
deck.
Figure 12-5. Replacing F76 SMA Connector O-Rings and Gasket
Continued
06/25/1999
on next page
12-155
Step
MP 1
MP 2
MP 3
MP 4
Instruction
2
Using an allen wrench, remove four screws that
hold the SMA plate.
3
Lift the SMA plate up.
4
Disconnect fibers from SMA connector on bottom
side of the SMA plate. Be careful not to drop the
fibers into the deck.
5
Replace 1/16” thick gasket with new one.
6
Use a crescent wrench to loosen SMA connectors
on plate.
7
Replace O-rings and retighten the SMA
connectors to the plate.
Continued
06/25/1999
on next page
12-156
Step
MP 1
MP 2
MP 3
MP 4
Instruction
8
Reconnect fibers to SMA connector on bottom
side of SMA plate.
9
Put the SMA plate back into the drain deck.
10
Using an allen wrench, tighten the four screws
that hold the plate.
11
Reconnect fibers to SMA connectors on drain
deck.
Continued
06/25/1999
on next page
12-157
Qualify
Step
1
Instruction
Init.
Load 50 cycle wafers.
Continued
06/25/1999
on next page
12-158
Step
Instruction
Init.
2
Load wafer cassettes and run with vendor qualification recipe.
3
4
Gencobot Robot Tool Points” procedure on page 14-117.
5
Run weekly qualification.
Continued
06/25/1999
on next page
12-159
SemiAnnual PM
Name
Certification
MP S/N
Date
Start Time
Est. Time 13 Hours
Finish Time
Actual Time
YES / NO
___________
YES / NO
YES / NO
I certify that this semi-annual PM was done to all customer and SpeedFam-IPEC semi-annual PM
standards and that all data points that are written down are true and accurate.
Continued
06/25/1999
on next page
12-160
Motor
Speed
Speed RPM
MP #1
MP #2
MP #3
MP #4
60
100
180
280
300
06/25/1999
12-161
Annual
PM’s
Table 12-9 lists the Annual Preventive Maintenance procedures.
Before making any repairs, inform Eng. Tech. of necessary repairs. Refer to proper checklists or
flowcharts when making repairs. Write down any adjustments, out of limit conditions, or
discrepancies identified during the annual PM procedures.
Table 12-9. Annual Preventive Maintenance Procedures
Procedure
Page
Prepare Tool For Annual PM
12-148
Electrical Cabinet Check
12-150
Interconnect Box Inspection
12-152
Wafer Head Annual Maintenance
12-154
Repair and Replace
12-157
Wet Cassette Slow Fill Rate Inspection
12-163
Replace Slurry Pump Motors
12-165
Robot Lubrication (Gencobot® and Hine®)
12-167
Clean Work Area
12-170
Vendor Qualification
12-170
Continued
06/25/1999
on next page
12-162
Prepare Tool
For Annual PM
To be supervised by a level 3 technician.
Continued
06/25/1999
on next page
12-163
Annual Preventive Maintenance, continued
Step
Instruction
Init.
1
Do all Semi-Annual Preventive Maintenance procedures.
2
Get approval from the shift lead person to do the annual PM procedures.
3
4
5
6
7
Continued
06/25/1999
on next page
12-164
Electrical
Cabinet Check
Step
Instruction
Init.
1
Make sure the low voltage swing panel door interlock switches operate correctly. Adjust if
necessary.
Continued
06/25/1999
on next page
12-165
Step
Instruction
Init.
2
Visually inspect the swing panel assemblies for evidence of overheating (burned wires or
boards).
3
Make sure the low voltage swing panels, door, and latches operate correctly.
4
Make sure ground bonding clamps are in place and not damaged.
Continued
06/25/1999
on next page
12-166
Interconnect
Box Inspection
Step
Instruction
1
Do the example Lockout / Tagout Procedure given in Chapter 3, or a site approved
lockout / tagout procedure that is in compliance with OSHA 1910-147, or other applicable
regulations.
2
Remove the six screws from the interconnect box covers, then remove the covers.
Interconnect
Box No. 2
Init.
Interconnect
Box No. 1
Continued
06/25/1999
on next page
12-167
Step
Instruction
Init.
3
Make sure interior and exterior cord grips are tight. Repair or replace any loose cord
grips.
4
Make sure wires are not exposed at entrance and exit of all cordgrips. Repair or replace
any exposed wires at the cord grips.
5
Make sure the connector screws are tight. Tighten any loose screws.
6
Make sure the terminal board wires are secure. Repair any connections that are not
secure.
7
Make sure the ground wire connection is secure. Repair any connections that are not
secure.
8
Make sure block is not fatigued at ribbon connector. Replace block if there is evidence of
fatigue.
9
Make sure fluids are not inside the interconnect boxes. Repair any leaking seals and
clean if there is any evidence of leakage.
10
Use the six screws removed previously to replace the cover.
Continued
06/25/1999
on next page
12-168
Wafer Head
Annual
Maintenance
06/25/1999
Step
Instruction
1
2
Remove lower wafer carrier assembly.
3
Remove the snap ring from the end of the drive shaft.
4
Remove the eight inner fasteners in the wafer carrier mount - lower cylinder on Delrin®
support (two wear rings can be used).
5
Remove the eight fasteners from cylinder mount ring (black collar on top of the
assembly).
6
Raise the cylinder.
7
Remove the drive shaft from the wafer head.
8
Move the head assembly to a work station so it can be rebuilt.
9
Remove the 12 outer fasteners in the wafer carrier mount, then lift the carrier mount off.
10
Remove the inside clamp ring (eight fasteners).
11
Remove the bearing.
12
Pull the outside clamp ring and inspect seal for cracks and heat damage.
Init.
12-169
Figure 12-6. Wafer Head - Exploded View
Continued
06/25/1999
on next page
12-170
Step
Instruction
Init.
13
Write down the observations and anomalies. Clean with wipe. Do not use IPA, or other
solvent on bearing surfaces. Replace seal if needed.
14
Replace all O-rings and fasteners.
15
Install top clamp, new bearing and secure with inside clamp ring (eight fasteners, tighten
to 60 inch-pounds torque). Use purple Loctite®.
16
Install the wafer carrier mount with 12 outside screws (No Loctite®, tighten to 32 inchpounds torque).
17
Replace the O-rings on the drive shaft.
18
Place head assembly in position, then insert drive shaft.
19
Carefully lower the cylinder, then re-install the fasteners in the black ring. Tighten to 32
inch-pounds torque.
20
Raise the head, then reinstall the eight fasteners in the drive collar (Inner circle of carrier
mount). Tighten to 32 inch-pounds torque. Make sure the torque on the outer bolt circle
is correct, then make sure the inner circle is still tight.
21
Replace snap ring on end of drive shaft.
22
Replace lower wafer carrier, then do the “Leak Down Test Procedure” procedure on page
14-70.
Continued
06/25/1999
on next page
12-171
Repair and
Replace
• Replace both bearings in polish head
• Replace polish bladder
• Inspect lower motor belt
Clean all removed stainless steel parts with 6% IPA / DI water solution.
Step
MP 1
MP 2
MP 3
MP 4
Instruction
1
Raise wet cassette lift towers, remove spray box
cover and drain deck (being careful not to disturb
the paddle position sensors) and lower wet
cassette lift towers.
2
Do the example Lockout / Tagout Procedure given
in Chapter 3, or a site approved lockout / tagout
procedure that is in compliance with OSHA 1910147, or other applicable regulations.
3
Remove V-band clamp, upper clamp ring, polish
pad, and slurry mesh. Set aside to reinstall later.
Continued
06/25/1999
on next page
12-172
Step
MP 1
MP 2
MP 3
MP 4
Instruction
4
Remove the 20 screws holding the bladder
retaining ring using a reverse star pattern.
5
Remove the bladder retaining ring and bladder.
Disconnect the bladder tubing at the bladder
fitting. Set aside to replace later.
6
Loosen 8 screws in polish bell, loosen drive shaft
set screw.
Continued
06/25/1999
on next page
12-173
Step
MP 1
MP 2
MP 3
MP 4
Instruction
7
Remove all four screws attaching the driveshaft to
the polish bell. Disconnect the tubing at the slurry
box, then remove the driveshaft from the polish
bell.
8
Lift the bell from the top of the wave generator
making sure not to damage the tubing.
Continued
06/25/1999
on next page
12-174
Step
9
MP 1
MP 2
MP 3
MP 4
Instruction
Inspect the top of the wave generator for
corrosion, wear marks, metal shavings and
residue. Replace any units
10
Remove the 12 screws in the clamp ring, then
remove and discard the bearing.
11
Remove the eight bolts, then remove the wave
generator.
12
Loosen the motor and remove the lower motor
belt and drive spool and pulley.
13
Inspect motor belt for cracks, gouges, and debris.
Replace as necessary.
14
Remove and discard lower bearing.
15
Insert new lower bearing.
Make sure arrows on bearings are facing “up” (towards the top of the Tool) when installed.
Continued
06/25/1999
on next page
12-175
Step
16
MP 1
MP 2
MP 3
MP 4
Instruction
During the reassembly process, do the following
for all fasteners below the 20 screw lower clamp
ring:
• Chase all threads with a #10-32 bottom tap.
• Remove residual Loctite® from fasteners (or
replace fasteners).
• Use low-strength purple grade thread locker
on all fasteners.
• Install fasteners hand tight, making sure
components are seated flat.
• Use a calibrated right-angle “click-type”
adjustable torque wrench (armstrong #64-007
or equivalent) to tighten fasteners.
• Use a progressive sequence starting with 15
inch pounds, then 25 inch pounds, and finally
32 inch pounds, to tighten the fasteners in a
star pattern. Recheck all fasteners after
tightening at each stage.
If the polish head leaks after assembly, it may be necessary to tighten the 8 polish bell fasteners.
Tighten these fasteners to 48 inch pounds torque.
06/25/1999
12-176
Step
17
MP 1
MP 2
MP 3
MP 4
Instruction
Replace wave generator, drive spool, pulley, and
lower motor belt.
Continued
06/25/1999
on next page
12-177
Step
MP 1
MP 2
MP 3
MP 4
Instruction
18
Verify belt tension by pinching belt in center with
finger and thumb. Should be less than 5/8”
deflection.
19
Insert new upper bearing. Make sure O-ring is
under clamp ring and slinger is installed.
20
Install new polish bell assembly and replace drive
shaft. Make sure bell is seated all the way down
and is even all the way around.
21
Install 8 screws. Tighten to 32 inch-pounds
torque.
22
Reconnect tubing.
Continued
06/25/1999
on next page
12-178
Step
MP 1
MP 2
MP 3
MP 4
Instruction
23
Install the new bladder and bladder retaining ring
making sure bladder is aligned with rinse holes.
(Use a small allen wrench inserted in rinse holes
to check alignment).
24
Reinstall the 20 retaining screws. Tighten to 8
inch pounds torque, in a star pattern.
25
From the MP discrete I/O window, start the purge
and rinse. Flow on the head should be 2” in
height. If holes are restricted remove the 20 bolts
and realign the bladder to the rinse holes.
Continued
06/25/1999
on next page
12-179
Step
MP 1
MP 2
MP 3
MP 4
Instruction
26
From the MP discrete I/O window turn off purge
and rinse.
27
Replace the slurry mesh.
28
Reinstall the polish pad, upper V-band clamp ring,
and V-band clamp.
29
When polish head maintenance is completed, do the
“Leak Down Test Procedure” procedure on page 14-70
Continued
06/25/1999
on next page
12-180
Wet Cassette
Slow Fill Rate
Inspection
Step
1
Instruction
Init.
Remove cassette (if any) from wet basin.
Continued
06/25/1999
on next page
12-181
Step
Instruction
Init.
2
Command start quick dump from SysCon screen on cassette being measured. Empty the
basin.
3
Place a standard clean room ruler with inch marks on the Delrin® wafer comb.
4
Command stop quick dump from SysCon screen on cassette being measured.
Immediately begin timing the slow fill rate/by-pass rate.
5
Observe rate of increase on the ruler. Rate should be approximately 1 + 1/8 inch per
minute.
6
Total time for slow fill rate should be 9 + 1 minute.
7
Adjust rate, if necessary.
Continued
06/25/1999
on next page
12-182
Replace Slurry
Pump Motors
Step
Instruction
Init.
1
Do the example Lockout / Tagout Procedure given in Chapter 3, or a site approved lockout
/ tagout procedure that is in compliance with OSHA 1910-147, or other applicable
regulations.
2
Remove the four knurled head retainer bolts on pump #1. Refer to Pump #2 shown
below.
Polish Head
Retainer Bolts
Continued
06/25/1999
on next page
12-183
Step
Instruction
Init.
3
Remove the pump head and gasket.
4
Visually inspect the pump impeller key and the motor keyway for wear. Replace the key if
worn.
5
Remove the four pump motor retaining bolts, then slide the motor out of the slurry box.
6
Repeat Steps 2 through 5 for pump #2 and motor.
7
Do Steps 5 through 2 (in reverse order) to install the new motors and pumps.
8
Make sure all gaskets are in place.
Continued
06/25/1999
on next page
12-184
Robot
Lubrication
(Gencobot®
and Hine®)
Step
Instruction
Init.
1
Raise the arm up to the top of its travel.
2
Open the low voltage swing panel on the right side of the Electrical Cabinet.
3
Position the power switch for the robot controller (lower right side of Electrical Cabinet) to
OFF.
4
Remove the ten screws securing the cover, then remove the main robot cable from top of
robot.
Continued
06/25/1999
on next page
12-185
Step
5
Instruction
Init.
Remove the robot cover. See figure below. Arm not shown in up position.
Continued
06/25/1999
on next page
12-186
Step
Instruction
Init.
6
Clean lead screw and ball spline completely with swabs and IPA to remove old lubricant.
7
Use a clean room swab to lightly apply a thin layer of grease to the exposed lead screw
and ball spline surfaces.
8
Visually inspect all wires and tubes in robot body.
9
Cycle the robot two or three times to make sure the lubrication (grease) is spread out
evenly.
10
Replace robot cover.
11
Replace main robot cable to top of robot.
12
Position the robot controller power switch to ON, then latch the swing panel.
13
Do the “Shutdown and Power Up” procedure on page 13-132, to power up the Tool.
Continued
06/25/1999
on next page
12-187
Clean Work
Area
Vendor
Qualification
Inspect for, and remove, any debris or tools left during service.
Step
Instruction
Init.
1
Use the vendor qualification recipe to run 100 Surfscan® wafers.
2
Watch tool for proper operation.
3
Gencobot Robot Tool Points” procedure on page 14-117. or the “Setting Hine® Robot Tool
Points” procedure on page 14-150.
Continued
06/25/1999
on next page
12-188
Annual PM
Certification
Name
MP S/N
Date
Start Time
Est. Time 18 hours
Finish Time
Actual Time
YES / NO
___________
YES / NO
YES / NO
I certify that this annual PM was done to all customer and SpeedFam-IPEC annual PM standards and that
all data points that are written down are true and accurate.
06/25/1999
12-189
Notes:
06/25/1999
12-190
Chapter 13
Corrective Maintenance
Contents
Topic
06/25/1999
See Page
Corrective Maintenance Procedures
13-2
Maintenance Process
13-5
13-1
Corrective Maintenance Procedures
Corrective The following table contains the names of all the corrective maintenance procedures currently available
Maintenanc for the 676.
e
Topic
See Page
Procedures
CM-1 Replace Electrical Cabinet Monitor
13-6
CM-2 Replace Diverter Valve
13-8
CM-3 Repair Fluid Leak
13-12
CM-4 Replace Nylatron® Key
13-14
CM-5 Adjust / Replacement Spray Nozzle
13-17
CM-6 Replace Main Cylinder
13-19
CM-7 Replace Operator Door
13-25
CM-8 Replace / Reposition Wafer Sensor Array
13-27
CM-9 Replace Interlock Switch
13-31
CM-10 Replace Head Up Valve
13-33
CM-11 Replace Upper Motor
13-36
CM-12 Replace Lower Polish Drive Motor
13-42
CM-13 Rebuild Upper Wafer Head Assembly
13-46
CM-14 Replace Metal Oxide Varistors (MOV)
13-49
CM-15 Replace Fan / Cover
13-51
CM-16 Replace Upper Wafer Head Assembly
13-53
Continued
06/25/1999
on next page
13-2
Corrective Maintenance Procedures, continued
Topic
See Page
CM-17 Replace Wand
13-57
CM-18 Replace Robot Wrist
13-61
CM-19 Assemble / Install SMC Vacuum Switch
13-65
CM-20 Replace MP Shield Sensor
13-68
CM-21 Clear Robot Pneumatic Lines
13-72
CM-22 Clean Robot Wrist Reservoirs
13-76
CM-23 Replace Robot Drive Belt
13-79
CM-24 Replace Wafer Head V-Band Clamps
13-82
CM-25 Defrag the MP Computer
13-85
CM-26 Replace E/P Regulator
13-87
CM-27 Replace Robot Controller 6 1/4A Fuses
13-91
CM-28 Replace Turck Block
13-95
CM-29 Replace Cassette Rotation Sensors
13-98
CM-30 Replace Spray Shield Lift Jack Assembly
13-100
CM-31 Replace the Robot
13-102
CM-33 Replace Bay Monitor
13-109
CM-34 Restore SysCon Computer
13-111
Continued
06/25/1999
on next page
13-3
Topic
See Page
CM-35 Set Up SysCon Network Card Netbeui Protocol
13-113
CM-36 Adjust Sensor Height
13-115
CM-37 Replace Pad Conditioner
13-117
CM-38 Replace Pad Conditioner HV Panel
13-121
CM-39 Add New User To Login File
13-123
CM-40 Deleting User From Login File
13-125
CM-41 Change Polish Pads
13-127
CM-42 Shutdown and Power Up
13-132
CM-43 Virus Scanning Procedure
13-135
CM-44 Rebuild Wafer Carrier Assembly
13-138
CM-45 Replace Slurry Pump Tubing
13-142
CM-46 Replace Slurry Filter
13-145
CM-47 Computer File Maintenance
13-147
CM-48 Replace Upper Pneumatic Piab Trap
13-150
CM-49 Replace Wet Cassette Rotation Cylinder
13-152
CM-50 Replace F76 Lamps
13-155
CM-51 Replace F76 Computer Card
13-160
Continued
06/25/1999
on next page
13-4
Topic
06/25/1999
See Page
CM-52 Replace F76 Fiber Optic Sensor
13-165
CM-53 Reload F76 Software
13-169
CM-54 Replace F76 Spectrometer Box
13-171
CM-55 Replace F76 Fiber Optic Cables
13-177
CM-56 Replace F76 Fiber Power Supply
13-183
13-5
Maintenance Process
Typical
Process
06/25/1999
Table 13-1. Maintenance Checklist Process
Step
Instruction
1
Get the appropriate checklist from this Maintenance manual, the SpeedFam-IPEC Site /
Warranty Coordinator, Customer Tool Owner, or other approved source.
2
Write the following information on the checklist:
* Name (printed)
* Date
* MP Serial Number
3
Read each procedure completely before beginning.
4
Gather all necessary parts and tools required for the procedure.
5
As each section of a procedure is completed, check off the appropriate square for the
section worked on (i.e.: MP1, MP2, etc.)
6
Write down the actual time it took to complete the procedure on the bottom of the checklist,
and initial that time.
7
Take the checklist to the Tool owner, or equivalent, to have it signed.
13-6
CM-1. Replace Electrical Cabinet Monitor
Procedure
Used to remove and replace the monitor in the Electrical Cabinet Control Station.
Special Tools/ Screwdriver set
Consumables Allen wrench set
Diverter Valve
Teflon® Tape
Reference
Documents
N/A
Level Of
Training
Level Three required.
Continued
06/25/1999
on next page
13-7
CM-1. Replace Electrical Cabinet Monitor, continued
Disassembl
y
Step
Instruction
1
Remove the four screws securing the SysCon computer.
2
Have an assistant raise the front of the SysCon computer up until there is enough
clearance to remove the monitor.
3
As soon as the monitor has cleared, set the SysCon computer down and attach one
screw on each side.
4
Disconnect the video cable and power cable.
Init.
Assembly
Step
06/25/1999
Instruction
1
Get a replacement monitor.
2
Connect the video and power cables to the new monitor, then remove the one screw on
each side of the SysCon computer.
3
Lift the front of the SysCon computer, then install the monitor.
4
Replace the four screws securing the SysCon computer.
Init.
13-8
CM-2. Replace Diverter Valve
Procedure
Used to remove and replace the bay or chase side Diverter Valves.
Special Tools/ Cutting Tool
Consumables Tubing
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-9
CM-2. Replace Diverter Valve, continued
Disassembl
y
Step
Instruction
Init.
1
Close the DI water supply / return valves to the Tool.
2
De-energize the Tool.
3
Remove the lower stainless steel panel to get access to the bay side diverter valves or
remove the deck to get access to the chase side diverter valves.
4
Remove pneumatic tubing lines from the fittings (two on the top and two on the side).
Use an open ended wrench to push down on the collar on the John Guest fittings while removing
the tubing.
5
Remove the four drain lines.
Continued
06/25/1999
on next page
13-10
Step
Instruction
Init.
6
Remove the four phillips head screws holding the diverter valve sensors in place.
7
Remove the four hex screws from the diverter valve manifold.
8
Slide the manifold / diverter valve assembly out of the frame.
9
Slide the diverter valve off of the manifold fitting.
Continued
06/25/1999
on next page
13-11
Assembly
Step
06/25/1999
Instruction
1
Slide the replacement diverter valve onto the manifold.
2
Slide the manifold / diverter valve assembly into the frame.
3
Replace the four diverter valve sensor screws.
4
Replace the four drain lines.
5
Replace the pneumatic lines to the fittings.
6
Open the DI water return / supply valves to the Tool.
7
Replace any panels that were removed.
8
Re-energize the Tool.
9
Initialize MPX through SysCon / service.
10
Make sure the delta valve is operating correctly.
11
Return the Tool to Production Mode.
Init.
13-12
CM-3. Repair Fluid Leak
Procedure
Used to find and repair fluid leaks in lower area of the Tool.
Special Tools/ Cutting tool
Consumables Tubing
Reference
Documents
N/A
Level Of
Training
Level Two required.
Continued
06/25/1999
on next page
13-13
CM-3. Repair Fluid Leak, continued
Procedure
Step
Instruction
Init.
1
2
Remove stainless steel panels on lower half of Tool.
3
Look for spills or leaks.
4
Examine all tubes / pipes and fittings in the area of the leak or spill. If cracked or severed
tubes / pipes are found, stop that specific liquid flow and repair / replace that segment.
5
If no cracked or severed tubes / pipes are found, re-seat all the fittings to the tubes.
6
Clean up any spills or leaks and inspect again.
7
Once repair / replacement is complete, start liquid flow to inspect for any more leaks.
Continued
06/25/1999
on next page
13-14
CM-4. Replace Nylatron® Key
Procedure
Used to remove and replace the Nylatron Key on the Wafer Head driveshaft.
Hoist
Shaft key
Foam swabs
Blue Loctite®
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-15
CM-4. Replace Nylatron® Key, continued
Step
Instruction
Init.
1
With the wafer head in the up position, (top open), do the example Lockout / Tagout
Procedure given in Chapter 3, or a site approved lockout / tagout procedure that is in
compliance with OSHA 1910-147, or other applicable regulations.
2
Remove the rotary union.
3
Disconnect sensor mounting bracket and place on frame out of the way.
4
Remove the drive shaft sensing collar.
5
Remove the four 3/8 inch motor mounting bolts.
6
Use the hoist to lift the motor to a height approximately three inches above the exposed
shaft key. It is not necessary to remove the motor completely from the shaft.
7
Remove the key from the shaft using a pair of needle nose pliers.
Continued
06/25/1999
on next page
13-16
Assembly
Step
Instruction
Init.
1
Make sure the new key will properly fit into the keyway of the shaft and will properly fit
through the full length of the motor / gearbox’s keyway.
2
Inspect the shaft for any damage. If the shaft is damaged, stop and take immediate action
to correct the problem.
3
Clean the shaft, keyway and the new key with a 6% IPA / DI water solution.
Continued
06/25/1999
on next page
13-17
Step
06/25/1999
Instruction
4
Apply a small amount of blue Loctite® to the new key and the shaft keyway.
5
Insert the new key into the keyway.
6
Wipe off any excess Loctite® from the key and the keyway.
7
Apply a liberal amount of lubricant to the shaft in the keyway gearbox area.
8
Align the motor / gearbox keyway with the key on the shaft and gently lower the motor.
9
Reinstall four 3/8 inch motor mounting bolts. Leave the bolts loose.
10
Install the drive shaft sensing collar.
11
Install the sensor mounting bracket.
12
Install the rotary union.
13
Do the “Shutdown and Power Up” on page 13-132, to power down the Tool in Service
Mode.
Init.
13-18
CM-5. Adjust / Replacement Spray Nozzle
Procedure
Used to adjust / replace the spray nozzles in the Wafer Head Spray Shield.
Special
Tools/
Consumabl
es
Allen wrench set
Screwdriver set
Teflon® tape
Spray nozzle
Reference N/A
Documents
Level Of
Training
Level Two required.
Continued
06/25/1999
on next page
13-19
CM-5. Adjust / Replacement Spray Nozzle, continued
Disassembl
y
Step
Instruction
1
Remove spray shield.
2
If nozzle is aimed the wrong direction, turn it until it is pointing in the same direction as all
the others (never loosen it - turn in opposite direction of travel - to align a nozzle always
tighten).
3
To replace a nozzle, remove defective nozzle.
Init.
Assembly
Step
06/25/1999
Instruction
1
Clean nozzle if possible, otherwise replace.
2
When re-installing use new Teflon® tape and tighten slowly. Make sure it is aimed at the
same direction as all the others.
3
Inspect fittings for leaks.
Init.
13-20
CM-6. Replace Main Cylinder
Procedure
Used to remove and replace the Wafer Head Main Cylinder.
Hoist
Cylinder
Krytox®
Foam swabs
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-21
CM-6. Replace Main Cylinder, continued
Disassembl
y
Step
Instruction
Init.
1
regulations.
2
Mark OD of jacking tower ring and mark for orientation.
3
Remove lower wafer carrier.
4
Raise wafer head and remove center retaining ring on bottom of shaft.
5
Remove the eight screws in the center of the wafer head.
6
Lower the wafer head onto two wear rings placed on top of polish head for support.
7
Unscrew the eight 10/32” screws from the coupling ring and manually retract air cylinder
leaving the wafer head assembly on the Delrin® plate. Label and remove the air lines and
plug the ports.
8
9
Disconnect the sensor mounting bracket and place on the frame out of the way.
Continued
06/25/1999
on next page
13-22
Step
Instruction
Init.
10
Remove the wafer head sensor collar.
11
Manually raise the shaft, remove O-ring, drive collar, keystock, and upper retaining ring.
12
Remove shaft from drive assembly by lifting up and out of motor. Remove wafer head
and place on cart.
Continued
06/25/1999
on next page
13-23
Disassembl
y
Step
Instruction
Init.
13
Remove the four 3/8” motor mounting bolts.
14
Remove motor using the lift hoist, and place it on the robot plate covered with clean room
wipes.
CAUTION - To avoid possible damage or injury, do not remove the bolts from the jacking
tower covers while cylinder is mounted to the Tool.
15
Remove the six bolts on the jacking tower ring.
16
Remove entire air cylinder and jacking tower ring assembly using the lift hoist. Rest
assembly on a cart.
17
Remove the black coupling ring from the old cylinder and install on the new cylinder,
Loctite® the bolts in place.
Continued
06/25/1999
on next page
13-24
Step
Instruction
Init.
18
Remove flow control valve / relief valve assembly from cylinder using an open end 3/4
inch wrench at coupling near jacking tower ring.
19
Remove top air connection from cylinder using an open end 3/4 inch wrench.
20
Remove the three bolts holding the jacking tower ring to the old cylinder. Do not back
brass jacking towers out of position. Install jacking tower ring on new cylinder. Replace
flow control valve / relief valve assembly and top air connection onto new cylinder.
Continued
06/25/1999
on next page
13-25
Assembly
Step
Instruction
Init.
1
Clean the cylinder with IPA.
2
Re-lubricate the cylinder with Krytox® before installing.
3
Move new air cylinder into place using the lift hoist.
4
Center the jacking tower ring using alignment markings drawn on the upper plate in Step
2 of disassembly procedure on page 13-20.
5
Reconnect the air supply and manually raise and lower the cylinder to make sure
operation is correct. (Use caution to see that the spray ring is properly aligned and out of
the way).
6
Bolt down the jacking tower ring with the bolts from Step 15 of the disassembly procedure
on page 13-21.
Make sure the coupling ring O-ring is properly seated then tighten the eight bolts in an even star
pattern. Loctite® bolts in place (purple).
Continued
06/25/1999
on next page
13-26
Assembly
Step
Instruction
Init.
7
Use a lift hoist to place the motor down on air cylinder. Position the motor so it is toward
the robot.
8
Replace the four 3/8” motor mounting bolts. Do not tighten at this time.
9
Position wafer head under cylinder and slide shaft down through the drive assembly.
10
Replace upper retaining ring, drive collar, keystock, and O-ring onto shaft.
11
Lower cylinder manually onto wafer head and align hoes in black coupling ring with holes
on wafer head. Replace the eight 10/32” screws in black coupling ring.
12
Manually raise and lower wafer head to make sure shaft is align with motor. Tighten the
four 3/4” motor mounting bolts.
13
Replace the wafer head sensor collar.
14
Reconnect sensor mounting bracket.
15
Replace rotary union.
16
Raise wafer head. Replace eight screws in center of wafer head and replace retaining
ring.
Continued
06/25/1999
on next page
13-27
Assembly
Step
17
Instruction
Init.
Replace lower wafer carrier.
06/25/1999
18
Power up the Tool in Service Mode.
19
Reinitialize head.
20
Make sure the up / down sensors are operating correctly. Adjust if necessary.
21
Make sure the edge gap is correct, then do the “Leak Down Test Procedure” on page 1470.
22
Make sure the load Tool Point is correct.
23
13-28
CM-7. Replace Operator Door
Procedure
Used to remove and replace the Operator’s Tool Access Door.
Special Tools/
Consumables
Reference
Documents
N/A
Level Of
Training
Level
Continued
06/25/1999
on next page
13-29
CM-7. Replace Operator Door, continued
Disassembl
y
Step
Instruction
1
2
Remove front stainless steel upper panel.
3
Supporting the window, remove four screws from cylinder arm that secures plexiglas door.
Step
Instruction
Init.
Assembly
06/25/1999
1
Install new door with 4 screws to cylinder arm.
2
Reinstall the front stainless steel upper panel.
3
Start Tool in Production Mode.
Init.
13-30
CM-8. Replace / Reposition Wafer Sensor Array
Procedure
Used to remove and or replace the Wafer Sensor Array.
Consumables Sensor array
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-31
CM-8. Replace / Reposition Wafer Sensor Array, continued
Procedure
Step
Instruction
1
Start Tool in Service Mode.
2
Lower the sensor array in question.
3
Raise operator door.
4
Separate the track up to the ribbon cable plug and disconnect the plug.
5
Remove half of the sensor array support bracket.
6
Remove sensor array.
Init.
Continued
06/25/1999
on next page
13-32
Assembly
Step
Instruction
Init.
1
Install new sensor array and replace sensor array bracket half.
2
Snap separated track back into place.
3
Raise sensor array up.
4
Break magnetic connection.
5
Hold array up and raise corresponding cassette. Load a full cassette of wafers.
Continued
06/25/1999
on next page
13-33
Step
06/25/1999
Instruction
6
Make sure wafer I/O’s are reading in C2C Discrete window.
7
Position array so wafers are centered between array teeth, (i.e. slot k25 corresponds to
wafer #25) and adjust cylinder stops so bottom of array is approximately 1/8” above
wafers.
8
Lighten all loose screws, while keeping array level and centered with the cassette of
wafers.
9
Make sure the cylinder stops are positioned correctly. Adjust as required.
10
Lower sensor array I/O and raise it to reconnect magnetic bond.
11
Cycle cassette and array to test.
12
Return Tool to Production Mode.
Init.
13-34
CM-9. Replace Interlock Switch
Procedure
Used to remove and replace an Interlock Switch.
Special Tools/
Consumables
Screwdriver set
Allen Wrench set
Interlock switch
Reference
Documents
N/A
Level Of
Training
Level Two required.
Continued
06/25/1999
on next page
13-35
CM-9. Replace Interlock Switch, continued
Disassembl
y
Step
Instruction
1
Power system down. Make sure main disconnect is OFF.
2
Remove the two attaching screws from the switch.
3
Remove highest number wire from switch and attach to the corresponding numbered
connector on new switch.
4
Remove lowest number wire and attach to com connector on new switch.
Init.
Assembly
Step
06/25/1999
Instruction
5
Re-attach new switch to Tool and make sure switch activation pin is moving freely.
6
Attach pin spacer and screw if used.
7
Re-install stainless steel panel.
8
Power up the Tool, then make sure the interlocks operate correctly.
Init.
13-36
CM-10. Replace Head Up Valve
Procedure
Used to remove and replace a Head Up Valve.
Special Tools/ Allen wrench set
Consumables Wago® tool
End wrench set
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-37
CM-10. Replace Head Up Valve, continued
Disassembl
y
Step
Instruction
Init.
1
De-energize the head (this will turn off air and all excess air will bleed out at piloted
SMC’s).
2
Using a Wago® tool, disconnect wires on solenoid from terminal block.
3
Disconnect all tubes from the valve quick disconnects.
4
Remove the two screws holding the valve body to the panel.
5
Remove head up valve.
6
Remove fittings.
Continued
06/25/1999
on next page
13-38
CM-10. Replace Head Up Valve, continued
Assembly
Step
06/25/1999
Instruction
1
Replace fittings on new valve.
2
Crimp new mov onto leads of new valves.
3
Bolt valve to panel.
4
Place tubing into quick connects.
5
With leak detector, make sure all fittings just replaced and system tubing out to head are
not leaking.
Init.
13-39
CM-11. Replace Upper Motor
Procedure
Used to remove and replace a Wafer Head Motor.
Special Tools/ 7/16 socket
Consumables Head socket
3/4 inch socket
Head wrench
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-40
CM-11. Replace Upper Motor, continued
Disassembl
y
Step
Instruction
Init.
1
regulations.
2
Remove the lower wafer carrier.
3
Raise the wafer head and remove the center retaining ring on the bottom of the shaft.
4
Remove the eight screws in the center of the wafer head.
5
Lower the wafer head onto two wear rings placed on top of polish head for support.
6
Unscrew the eight 10/32 inch screws from the black coupling ring and manually retract air
cylinder leaving the wafer head assembly on the wear rings. Label and remove air lines
from cylinder and plug ports.
7
Manually raise the shaft and remove the O-ring, drive collar, keystock, and upper retaining
ring.
Continued
06/25/1999
on next page
13-41
Step
Instruction
Init.
8
9
Disconnect the sensor mounting bracket and place on the frame out of the way.
10
Remove the wafer head sensor collar.
11
Remove shaft from drive assembly by lifting up and out of motor.
12
Take off the electrical cover.
13
Tag all connections on both sides, and label new motor wires like the old ones.
14
Disconnect all wires.
15
Disconnect reducer coupling at rear of motor.
16
Cut compression fitting from clear tubing, remove white hose clamp and pull tubing from
motor housing.
17
Remove the four 3/8 inch motor mounting bolts.
18
With the hoist, lift the motor.
Continued
06/25/1999
on next page
13-42
Assembly
Step
Instruction
Init.
1
Hoist the new motor and place it on top of the cylinder.
2
Rotate the motor so the motor is pointing approximately toward the robot.
3
Secure the motor to the cylinder with the four 3/8 inch motor mounting bolts. Leave the
bolts loose.
4
Slide the shaft down through the drive assembly.
5
Replace upper retaining ring, drive collar, keystock, and O-ring onto shaft.
6
Lower cylinder manually onto wafer head and align holes in black coupling ring with holes
in wafer head. Replace the eight 10/32 inch screws in black coupling ring.
7
Manually raise and lower the wafer head to make sure the shaft and motor are in
alignment. Tighten the four 3/8 inch motor mounting bolts.
8
Make the electrical connections following the tags made in Step 13 of disassembly
procedure on page 13-34.
Continued
06/25/1999
on next page
13-43
Step
9
Instruction
Init.
Seal the connections with silicon tape and electrical tape.
10
Replace the electrical cover.
11
Install the wafer head sensor collar.
12
Install the sensor mounting bracket.
13
Install the rotary union. Route hose through motor housing. Replace white hose clamp
and install new compression fitting.
14
Power up the Tool in Service Mode
Continued
06/25/1999
on next page
13-44
Step
06/25/1999
Instruction
15
Make sure the operation of up, down, and align sensors is correct. Adjust if necessary.
16
In the MP service window select spindle_enable and command a speed of 30 rpm.
Watch the wafer head turn (view looking up at the wafer head). The head should turn
clockwise.
17
If the head does not turn clockwise, inspect wiring connections.
18
Do the “Leak Down Test Procedure” on page 14-70.
19
Init.
13-45
CM-12. Replace Lower Polish Drive Motor
Procedure
Used to remove and replace a Polish Drive Motor.
Special Tools/ 7/16” socket
Consumables 3/4” socket
Motor
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-46
CM-12. Replace Lower Polish Drive Motor, continued
Disassembl
y
Step
Instruction
Init.
1
Do the example Lockout / Tagout Procedure given in Chapter 3, or a site approved lockout
/ tagout procedure that is in compliance with OSHA 1910-147, or other applicable
regulations.
2
Remove the splash deck.
3
Loosen the lower motor mounting bolts.
4
Position the lower pneumatic panels out of the way (off to the side).
Continued
06/25/1999
on next page
13-47
Step
Instruction
5
Slide the lower motor outboard, to loosen the drive belt.
6
Remove the drive belt.
7
Disconnect the pad conditioner main connector.
8
Unscrew the “t” conduit from the frame (the MP cable attach).
9
Use the hoist to attach the lower motor lifting tool to the hoist chain.
Init.
10
Position the fork end of the tool underneath the drive pulley.
11
Use the tool as a lever to push down and lift the motor, then remove the bolts.
12
Lift the motor and swing it out of the frame.
13
Disconnect the electrical cable from the motor. Tag all wires as you remove them.
Continued
06/25/1999
on next page
13-48
Assembly
06/25/1999
Step
Instruction
1
Reconnect the electrical cable to the motor.
2
Using hoist, attach lower motor lifting tool to hoist chain.
3
Position the fork end of the tool underneath the drive pulley.
4
Use the tool as a lever and pull up until the motor is moved into position, then reinstall the
bolts.
5
Replace the drive belt.
6
Tighten the lower motor mounting bolts.
7
Replace the deck.
8
Reconnect power to the machine.
9
Start the Tool, then display the MP service screen. Select “spindle_enable” at 30 rpm and
look at the direction the polish head orbits (view looking down on the head). If the head
does not orbit clockwise, inspect the wire connections.
Init.
13-49
CM-13. Rebuild Upper Wafer Head Assembly
Procedure
Used to rebuild a Wafer Head Assembly.
Special Tools/
Consumables
Allen wrench set
Snap ring pliers
Bearing
Seal
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-50
CM-13. Rebuild Upper Wafer Head Assembly, continued
Disassembl
y
Step
Instruction
Init.
1
Do the disassembly instructions in “Replace Upper Wafer Head Assembly” on page 1353.
2
Remove the eight 10-32 screws holding the clamp ring to the carrier mount.
3
Remove the six 10-32 screws holding the bearing clamp ring to the wafer head bell.
4
Remove the Kaydon bearing from the clamp ring.
5
Pull the top clamp ring from the seal.
6
Remove the wafer head seal from the wafer head bell.
7
Inspect parts for wear or damage, replace as necessary.
Continued
06/25/1999
on next page
13-51
CM-13. Rebuild Upper Wafer Head Assembly, continued
Assembly
Use purple Loctite® on all fasteners above the wafer head mount.
Step
06/25/1999
Instruction
1
Install the wafer head seal into the wafer head bell.
2
Push the top clamp ring into the seal.
3
Place the Kaydon bearing into the clamp ring.
4
Place the wafer head clamp ring inside the bearing.
5
Fasten the bearing clamp ring to the wafer head bell with the 10/32” stainless steel
screws. Tighten to 25, then 32 inch pounds torque.
6
Attach the wafer carrier mount to the bottom clamp ring with 10/32” stainless steel socket
head screws. Tighten to 32 inch pounds torque.
7
Replace upper wafer head assembly.
Init.
13-52
CM-14. Replace Metal Oxide Varistors (MOV)
Procedure
Used to remove and replace the MOV’s on the Upper and Lower Pneumatic Panels. (Lower shown
below)
Special Tools/ Wago® tool
Consumables Wago® crimping tool
Allen wrench set
MOV’s
Ferrules
Shrink wrap
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-53
CM-14. Replace Metal Oxide Varistors (MOV), continued
Replaceme
nt
Step
Instruction
Init.
1
Remove the exterior panels from the MP upper and lower pneumatic panels, as required.
2
Turn off breaker to the computer on the MP you are working on.
3
Locate solenoid electrical inputs.
4
Open Wago® terminal with Wago® tool and remove each input line and mark line with
proper number for replacement.
5
Clip crimped ferrule off of line and restrip wire.
6
Slip shrink wrap on MOV.
7
Slip ferrule over MOV and stripped wire and crimp with Wago® crimper.
8
With Wago® tool open Wago® terminal, reinstall ferrule.
9
When all solenoids have been done, replace upper and lower panels.
Continued
06/25/1999
on next page
13-54
CM-15. Replace Fan / Cover
Procedure
Used to remove and install a new fan.
Special Tools/ Screw driver set
Consumables Snap ring tool
IPA
Wipes
Reference
Documents
N/A
Level Of
Training
Level Two required.
Continued
06/25/1999
on next page
13-55
CM-15. Replace Fan / Cover, continued
Removal
Step
Instruction
1
Remove three phillips head screws retaining fan covers.
2
Remove fan retaining nut and remove fan.
3
Clean cover and fan with IPA.
Init.
Installation
Step
06/25/1999
Instruction
1
Replace fan
2
Attach fan retaining nut and insert fan.
3
Replace screws to retain fan covers.
Init.
13-56
CM-16. Replace Upper Wafer Head Assembly
Procedure
Used to remove and rebuild the Upper Wafer Head Assembly.
Special Tools/ Allen wrench set
Consumables Snap ring pliers
14” x 14” Delrin® plate
New upper carrier assembly
New O-rings
New snap ring part number 3100-125 SS
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-57
CM-16. Replace Upper Wafer Head Assembly, continued
Removal
Step
Instruction
Init.
1
Start affected MP(s) in Service Mode.
2
Remove the lower wafer carrier and V-band clamp.
3
Remove the six screws on wafer carrier mount (inner screw pattern).
4
Raise the cylinder.
5
regulations.
Continued
06/25/1999
on next page
13-58
Step
Instruction
Init.
6
Cover polish head assembly with 14” by 14” Delrin® plate to protect polish pad.
7
Remove lower snap ring from end of shaft.
8
Using main air mac valve and cylinder air mac valve, manually lower the upper wafer
head until it just rests on the Delrin® plate. (Caution: do not apply unnecessary downforce to the polish head).
Continued
06/25/1999
on next page
13-59
Step
9
Assembly
Instruction
Init.
Remove the eight 10/32” screws from the coupling ring.
10
Manually raise the cylinder.
11
Pull the drive shaft out of the upper wafer head assembly using care not to lose the key.
12
Lift up the drive shaft and the spray ring and remove the upper wafer head assembly.
Refer to Rebuild Upper Wafer Head Assembly, as necessary.
Step
Instruction
Init.
1
Lift the drive shaft and spray ring and place a new or rebuilt upper wafer carrier assembly
on the Delrin® plate.
2
Align the new upper wafer carrier and the spray ring using the drive shaft as a guide.
3
Lubricate and install new O-ring on the end of the drive shaft.
4
Install the drive shaft into the upper wafer carrier assembly, making sure key and keyway
are in the proper alignment and the top clamp O-ring is in place.
5
Manually lower the cylinder. Use caution to make sure the spray ring it properly aligned
and out of the way. Do not apply unnecessary down force to the polish head.
Continued
06/25/1999
on next page
13-60
Step
Instruction
Init.
6
Align the bolt holes in the upper wafer carrier assembly with the holes in the coupling ring,
then replace the eight 10/32” screws. Make sure that the coupling ring O-ring is properly
seated and tighten the eight bolts in an even star pattern.
7
Manually raise the cylinder with the new upper wafer carrier attached.
8
Replace the screws holding the drive collar to the wafer carrier mount.
9
Replace the lower snap ring on the end of the drive shaft.
Continued
06/25/1999
on next page
13-61
Step
06/25/1999
Instruction
10
Power up the Tool, then start the MPs in the Service Mode.
11
Replace the lower wafer carrier.
12
Make sure edge gap is correct.
13
Do the “Leak Down Test Procedure” on page 14-70.
14
Return the MPs to Production Mode and make sure Tool Points are correct.
Init.
13-62
CM-17. Replace Wand
Procedure
Used to remove and replace the robot wand (paddle).
Special Tools/
Consumables
Allen wrench set
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-63
CM-17. Replace Wand, continued
Disassembl
y
Step
1
Instruction
Init.
Make sure Tool is in idle condition.
06/25/1999
2
Reboot the C2C computer to come on in Service Mode.
3
Make sure the wand (paddle) alignment station Tool Points have been taught and
measure paddle position before continuing. Do “Tool Points Procedure - Gencobot
Robot” on page 14-134 or “Hine® Tool Point Process” on page 14-151.
4
Drive robot to access through chase side doors.
5
Remove the four pneumatic lines from the paddle. Make sure the lines are labeled for
correct orientation.
6
Remove the old / damaged paddle.
13-64
Assembly
Step
Instruction
Init.
1
Secure the new paddle onto the robot wrist.
2
Connect the four pneumatic lines to the correct location.
3
From the task list, highlight “rtest_robot”, then click “View” on the task menu.
4
From the task list, highlight “rtest_robot”, then select “run” from the task menu and step
through the task.
5
Select “paddle Alignment Test” from the options and continue stepping to make sure the
alignment reading is correct.
6
The message window will display “paddle alignment within specification” or “paddle
alignment Is out of specification”.
7
If not in specification, make adjustments (use Steps 14 and 15), then test again.
Continued
06/25/1999
on next page
13-65
Step
06/25/1999
Instruction
8
Adjust two top setscrews of paddle leveling screws (evenly - assume paddle is down).
9
If reading is out of limits, adjust the paddle setscrews, as required.
10
Re-run alignment test.
11
When alignment matches tolerance, make sure Tool Points are correct through
“rtest_robot”.
12
Exit “rtest_robot”.
13
Start Tool in Production Mode.
14
Run vendor qualification.
Init.
13-66
CM-18. Replace Robot Wrist
Procedure
Used to remove and replace robot wrist.
Special Tools/ Torpedo Level
Robot wrist assembly
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-67
CM-18. Replace Robot Wrist, continued
Removal
Step
Instruction
Init.
1
Power down the Tool.
2
Remove the paddle and block in one piece by loosening the three setscrews, rotating the
shaft, and disconnectiong the four vacuum lines.
3
Remove the robot wrist covers. Label and disconnect the four wiring connectors.
Do not pull on wires coming from top cover label.
Continued
06/25/1999
on next page
13-68
Step
Instruction
4
Disconnect vacuum tubing at wrist reservoirs and label orientation.
5
Disconnect the electrical connector for the vacuum sensors.
6
Remove the four screws that hold the wrist to the arm and feed the tubing and connectors
through the hole.
Step
Instruction
Init.
Installation
1
Init.
Install the new robot wrist by doing Removal Steps 3-6 in reverse order.
Make sure the paddle is installed in the proper up / down position.
06/25/1999
2
Power up the Tool. Start the C2C system in Service Mode, then display the Serial I/O
screen.
3
Manually rotate the wand to vertical and horizontal positions to make sure sensors
operate correctly.
4
Position an electronic level across the top of the end effector wrist.
13-69
Step
06/25/1999
Instruction
5
Extend the robot out toward the chase side; then between alignment pins 1 & 2; then
toward the operator side; then between alignment pins 3 &4. The level should display
0.0 to 0.2 in all positions.
6
Initialize and home the robot from the C2C serial port; “SVNA” then “HOM” then “SVFA”.
7
Make sure the reservoirs are installed correctly.
8
Remove window of paddle sensors.
9
Make sure sensor adjustments read, P1=-14.8; P2=-5.0; P3=0.0; P4=0.0.
10
Make sure drive and driven pulley set-screws are tight then command SVNA.
11
Select HOM, open operator door, then command \MVAT,18000\MVAR,9000\MVAZ,
13500.
12
Place an electronic level on face of end effector wrist and adjust to 45.3 ± 0.1 degrees.
13
Install window.
14
Do not adjust paddle stop setscrews after this Step.
15
Complete “Setting Gencobot Robot Tool Points” on page 14-117.
Init.
13-70
CM-19. Assemble / Install SMC Vacuum Switch
Procedure
Used to assemble and install SMC Vacuum Switch.
Special Tools/ Allen wrenches
Consumables Crimper
Small slot screwdriver
Beswick elbow 1/8”
Wago® ferrules
SMC vacuum switch
Cable M030
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-71
CM-19. Assemble / Install SMC Vacuum Switch, continued
Assembly
Step
Instruction
1
Tap four holes in SMC (6/32”).
2
Install four standoffs.
3
Install two din-clips with 6/32” x 1/2” bh long side down in bottom holes.
4
Install 1/8” beswick elbow.
5
Install cable id m030.
6
Terminate cable (10” long) to turck connector:
• 1 - RED
• 2 - (BLANK)
• 3 - BLACK
• 4 - WHITE
• YELLOW TRIM BACK.
• TERMINATE WITH orange WAGO® FERRULES.
Init.
Continued
06/25/1999
on next page
13-72
Installation
Step
Instruction
1
Remove omron sensor.
2
Make extra space in din rail where omron was located.
Init.
Continued
06/25/1999
on next page
13-73
Step
06/25/1999
Instruction
3
Clip SMC onto rail, fittings down.
4
Reroute yellow vacuum line to sensor.
5
Plug in to turck block.
6
Set SMC to psi, channels 1, 2 positive logic with the following values:
• P1 = -14.8
• P2 = -10.0
• P3 = 0
• P4 = 0
Init.
13-74
CM-20. Replace MP Shield Sensor
Procedure
Used to remove and replace MP Shield Sensor.
Special Tools/ Wire stripper
Consumables Crimper
Allen wrench set
Ferrules sensor
Reference
Documents
N/A
Level Of
Training
Level Two required.
Continued
06/25/1999
on next page
13-75
CM-20. Replace MP Shield Sensor, continued
Removal
Step
1
Instruction
Init.
Start the MP in Service Mode.
Continued
06/25/1999
on next page
13-76
Step
Instruction
Init.
2
At Discrete I/O window, make sure sensor is faulty by status of shield tripped 1-2-3. (“x”
displays when sensor is active).
CAUTION - Do not place too much down force against sensor.
3
Disconnect sensor from MP shield.
4
Disconnect sensor from turck block.
5
Gently remove sensor / cable from Tool.
6
Disconnect turck connector end of cable to note wiring configuration.
• BRN -1
• BLK 4
• BLU - 3
Continued
06/25/1999
on next page
13-77
\
Installation
Step
06/25/1999
Instruction
1
Re-install sensor.
2
Route cable from sensor to turck block.
3
Connect cable.
4
Dress wiring appropriately using tie wraps.
5
At Discrete I/O, make sure sensor operation is correct.
6
Command “top up / down” 25 times to make sure it will travel smoothly, with no binding
and no false alarms.
7
Return to Production Mode.
8
Do vendor qualification.
Init.
13-78
CM-21. Clear Robot Pneumatic Lines
Procedure
Used to clear any blockages in the robot pneumatic lines.
Special Tools/ 250 ml syringe
Consumables
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-79
CM-21. Clear Robot Pneumatic Lines, continued
Procedure
Step
Instruction
Init.
1
Make sure the Tool is idle, and the C2C is in Service Mode.
2
Prepare for handling customer approved cleaning solution.
3
Fill a 250 ml syringe with 150 ml of customer approved cleaning solution and a second
250 ml syringe with 200 ml of DI water.
4
Open the rear process access doors. Silence the alarm.
5
Unplug the 1/8” lines from the robot paddle and direct them so that they will drip into a
beaker or onto wipes.
6
Unplug the vacuum lines at the vacuum generator and connect the cleaning solution filled
syringe to them. Inject cleaning solution into the line until it comes out the other end of the
line. Let the cleaning solution set in the line for 30 seconds and then withdraw it back into
the syringe.
Continued
06/25/1999
on next page
13-80
Step
Instruction
7
Connect the DI water filled syringe and rinse the lines thoroughly.
8
Repeat the procedure for second line.
9
Reconnect lines to vacuum generators and to the robot paddle.
Init.
10
Fill a 250 ml beaker (kimax #14000, or similar) with 150 ml of DI water.
11
Unplug the 2 green vacuum generator exhaust lines of the C2C upper pneumatics panel
and place the wipes under the lines to capture any exhausted fluids coming out of these
lines.
12
Enable paddle 1 and 2 vacuum.
13
Position the beaker with the DI water under the robot arm, then raise the beaker to
submerge the paddle tip. Allow the robot to draw DI water for a count of 4 seconds then
lower the beaker. Repeat this process until the robot has consumed at least 100 ml of DI
water.
Continued
06/25/1999
on next page
13-81
Step
Instruction
Init.
14
From the I/O screen, disable vac 1 and vac 2. Enable air 1 and air 2 to blow any DI water
out of the channels. Let the air blow for at least 20 seconds before doing the next step.
Remove the wrist reservoir covers and drain any excess water not purged from the wrist.
15
Test the pressure drop in the vacuum lines to make sure they are clear enough for reliable
operation by teeing in the “omega meter”. Repeat the test for the other lines after
reconfiguring.
Continued
06/25/1999
on next page
13-82
Step
06/25/1999
Instruction
16
From the I/O screen make sure that “paddle air 1” and “paddle air 2” are positioned to
OFF. Position “paddle vac 1 and 2” to ON.
17
If the pressure in the vacuum sensor is less than or equal to 58 cm (or 11.2 psi) at sea
level then the lines are clear enough to safely handle wafers. Remove “omega meter”
and clean up area. Turn off “paddle vac 1 and 2”. If the pressure is higher than 58 cm (or
11.2 psi) then the restriction must be in the paddle. Remove the fittings and clean them.
Inspect the paddle channels for blockage and then repeat the pressure drop test.
18
Close the rear access door and return to Production Mode.
Init.
13-83
CM-22. Clean Robot Wrist Reservoirs
Procedure
Used to clean Robot Wrist Reservoirs.
Special Tools/ Allen wrenches
Consumables
Reference
Documents
N/A
Level Of
Training
Continued
06/25/1999
on next page
13-84
Revision / Change Suggestion Form
To submit a suggested change or amendment to this document, please print out this form, fill in all the requested
information, then mail or fax to:
SpeedFam-IPEC
305 North 54th Street
Chandler, AZ USA 85226-2416
Attn: Information Development and Delivery
FAX: 1.480.705.2523
or submit the request to your Field Service Representative.
Item
Information / Change
Document Title:
AvantGaard™ 676 Maintenance Manual Rev B.1
Chapter/Page:
Information as
presently written:
(Use additional
pages, as needed,
or attach copy of
actual page)
This form is also available in MSWord electronic format in the Maint sub-directory on the 676 CD as
REVFORM.DOC.
Continued on next page
06/25/1999
R/CSF-1
Revision / Change Suggestion Form
Revision / Change Suggestion Form, continued
Suggested
Revision/Change:
(Use additional
pages, as needed)
Suggested by:
Address / Phone
Number
Please copy both sides of this form, as necessary.
06/25/1999
R/CSF-2

676 Maintenance Manual Volume 2

Transcription

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