Advancing Technology Through Sample Preparation

Transcription

I N T E R N AT I O N A L
SYMPOSIUM FOR TESTING
A N D FA I L U R E A N A LY S I S
E X P L O R I N G T H E M A N Y FA C E T S
O F FA I L U R E A N A LY S I S
Complex Device Deprocessing
GEORGE R. BROWN CONVENTION CENTER
Follows Physical Profile for:
The X-Prep™ 3D is a specialized CNC-based
milling/grinding/polishing machine designed and
engineered to support electrical and physical
failure analysis techniques through high precision
sample preparation. This easy-to-use, highly
versatile system is capable of working with flat
(2D) and convex/concave (3D) device profiles,
providing unmatched precision and accuracy.

LIT and TDR on Package Devices

SIMS Backside Analysis
HOUSTON, TEXAS USA
NOVEMBER 9 – 13, 2014
 High NA SIL Imaging
X-Ray images
Before
After
Stacked die deprocessing
8-layer die stack processed to die 7
Die 7 & 8 electrically intact
Expose Cu pillars
& solder interconnect
All the Pieces of the
Semiconductor Failure
Analysis Community
Are Coming Together
Unmatched Precision Die & Package Deprocessing
3D profile of a concave device
3D profile of a convex device
www.alliedhightech.com
2376 E. Pacifica Place, Rancho Dominguez, CA 90220 • (800) 675-1118 (US/Canada) • (310) 635-2466 (Worldwide)
Organized By:
GE
KR
USA
CN
AP
DECAPSULATION
AND SAmPLE PrEP
SOLUTIONS
SESAMElaser
TM
Backside / Frontside / Cross Section
SESAMEPLASMA
TM
SESAMEACID
TM
DC believes that applications knowledge
and service support are the most important issues.
We were the first to have found the most reliable recipe
for openings of packages containing both coated and non-coated
COPPER wires using an Automated Decapsulator (SesameACID777).
SESAMEmechanical
TM
And first again now for SILVER wires.
Why? We are a fabless company, and work directly with
the manufacturers to develop the best methods using the four
decapsulation techniques currently available.
Our goal is to help you select the best technique for your next
investment.
With the largest technical network in the world, you can trust
that we are here to help you.
+33 (0) 231 354 354 - [email protected] - www.digit-concept.com
Welcome to the
Sunday, November 9–Thursday, November 13; George R. Brown Convention Center, Houston, Texas USA
REGISTRATION HOURS
Saturday: 5:00 p.m.–7:00 p.m.
Sunday: 7:00 a.m.–5:00 p.m.
Monday: 7:00 a.m.–5:00 p.m.
Tuesday: 7:00 a.m.–5:30 p.m.
Wednesday: 7:00 a.m.–5:00 p.m.
Thursday: 7:00 a.m.–11:00 a.m.
TECHNICAL PROGRAM
Technical Program: Sunday–Thursday. Dedicated Tutorials on Sunday; integrated Tutorials throughout the Technical Program. For
more conference details see pages 6–28.
Policy on Cell Phone Usage: In consideration of fellow event attendees and presenters, we request your cooperation in setting
cellular phones and/or other electronic devices to ‘silent mode’ in the meeting rooms.
Policy on Audio/Video Recording: EDFAS™ prohibits any unauthorized audio or video recording, or still photography of
presentations at ISTFA.
EXPOSITION
Tools of the Trade Tour–Monday (Pre-Registration Required)................................................................................ 5:00 p.m.–6:45 p.m.
Exhibit Hours–Tuesday ............................................................................................................................................ 9:00 a.m.–6:00 p.m.
Lunch.................................................................................................................................................................... 12:00 p.m.–1:30 p.m.
Expo Networking Reception................................................................................................................................ 4:00 p.m.–6:00 p.m.
Exhibit Hours–Wednesday ....................................................................................................................................... 9:30 a.m.–3:30 p.m.
EDFAS General Membership Meeting and Luncheon ......................................................................................... 12:15 p.m.–1:30 p.m.
Exhibitor Dessert Reception, Poster and Video Contest.................................................................................... 1:30 p.m.–3:30 p.m.
GET CONNECTED
Want to be hands free at ISTFA? There’s an app for that! Download the ISTFA 2014 mobile app to view the technical program,
exhibitor information, networking opportunities and attendee survey. Don’t forget to complete the attendee survey on the
mobile app and connect with fellow attendees. Available for apple and android devices - visit the iTunes and Google Play Store to
download it now.
SESSION CHAIR & AUTHORS’ COFFEE/BRIEFING
Please join us for coffee, pastries and a program briefing on the day of your presentation in Meeting Room 320B. The room will
open at 7:00 a.m. to allow you to meet and network with other participants. The program briefing will begin at 7:30 a.m. to
review the program layout, presentation and A/V guidelines, and any final conference details. Poster authors please join us on
Wednesday morning. YOUR ATTENDANCE IS VERY IMPORTANT.
REFRESHMENT BREAKS
Sunday–Monday........................................................................................................................................ Meeting Space Foyer
Tuesday–Wednesday................................................................................................................................. Expo Hall B3
Thursday..................................................................................................................................................... Meeting Space Foyer
CAREER/RESUME BOARDS
Stop by Registration to post job openings, find talented people in the industry or to post a resume on the Career/Resume Board.
CONTENTS
George R. Brown Convention Center Floor Plan ......................... 2 Show Directory............................................................................ 34
2014 Organizing Committee......................................................... 3 Tools of the Trade Tour............................................................... 37
Networking and Membership Lounge Details.............................. 4 Exhibit Hall Floor Plan................................................................ 42
Technical Program Schedule........................................................ 6 Exhibitor List................................................................................ 43
Education Short Courses............................................................ 29 Company Descriptions................................................................ 46
Author Index................................................................................ 30 Product/Services Index............................................................... 56
1
George R. Brown Convention Center Floor Plan
2
ISTFA 2014 Organizing Committee
General Chair
Mr. Dan Bodoh
Freescale Semiconductor
Vice General Chair
Technical Program Chair
Tutorial Chair
Exposition Chair
Dr. James J. Demarest
IBM
Dr. Martin Keim
Mentor Graphics
Ms. Becky Holdford
Texas Instruments, Inc
Mr. Nicholas Antoniou
Revera Inc.
Activities Chairs and Vice Chairs
Dr. Felix Beaudoin
Panel Chair
Global Foundries
Mr. David Grosjean
Panel Vice Chair
Qualcomm
Mr. Rick Livengood
User Group Chair
Intel
Dr. Zhiyong Wang
Ms. Rose Ring
Past Chair
Tutorial & Short Course
Vice Chair, Movie Vice Chair Maxim Integrated
GLOBALFOUNDRIES
Dr. Lihong Cao
International Chair
AMD
Ms. Susan Li
Tutorial & Short Course
Vice Chair
Spansion Inc.
Ms. Efrat Moyal
Publicity Chair
LatticeGear LLC
Mr. Kendall Scott Wills
Dr. Sam Subramanian
Local Arrangements
AV Chair
Freescale Semiconductor Chair
Consultant
Dr. Mayue Xie
Movie Chair & User
Group Vice Chair
Intel
Technical Program Session Chairs
3D Packages
Frank Altmann,
Fraunhofer Institute for
Mechanics of Materials
Yan Li, Intel
Case Studies and the
Failure Analysis Process
Peter Jacob, EMPA
Duebendorf
Zhigang Song, IBM
Circuit Edit
Michael DiBattista,
Qualcomm, Inc
Dane Scott, Intel
Corporation
Defect Characterization Emerging Concepts and Packaging and
and Metrology
Techniques
Assembly Analysis
Terence Kane, IBM
Phil Kaszuba, IBM
Detecting Counterfeit
Devices
Zhigang Song, IBM
Electrical
Characterization and
Nanoprobing
Stefan B. Kaemmer,
Multiprobe
Izak Kapilevich, DCG
Systems
Michael Bruce,
Consultant
Lihong Cao, Advanced
Micro Devices
Huimeng Wu, Carl Zeiss
Microscopy, LLC
Panel Discussion
Microscopy
Felix Beaudoin, Global
Foundries
Carl Nail, Evans
Analytical Group, LLC
Photon-Based
Techniques
Novel ResearchLevel Techniques and
Concepts
Herve Deslandes, DCG
Systems
Michael Bruce,
Consultant
Frank Zachariasse, NXP
Semiconductors
Posters
David Grosjean,
Qualcomm
Martin Versen,
University of Applied
Sciences Rosenheim
Sample Preparation
and Device
Deprocessing
Software-Based
Techniques, Test,
Diagnosis, and Yield
Geir Eide, Mentor
Graphics
Mark E. Kimball, Maxim
Integrated Products, Inc.
Roger Alvis, FEI
Company
Bryan Tracy, Spansion,
Inc.
Huimeng Wu, Carl Zeiss
Microscopy, LLC
Tutorial Session Chairs
Electrical and Yield
Jenny Ma, Intel
Mayue Xie, Intel
Fault Isolation
Gregory M. Johnson,
IBM
Microscopy
Carl Nail, Evans
Analytical Group, LLC
Susan Li, Spansion Inc.
Rose Ring, Global
Foundries
Package and Physical
Analysis Challenges
Robert Champaign,
Raytheon Network Centric
Systems
3
Jake E. Klein, Texas
Instruments
Technology Specific FA
Chris Richardson, Allied
High Tech Products, Inc.
Jeremy A. Walraven,
Sandia National Labs
Monday, November 10th from 7:00 – 9:00 p.m. at the Hilton
Americas – Houston, Americas Ballroom DE
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Tuesday, November 11th from 4:00 – 6:00 p.m. inside Expo Hall B3
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Wednesday, November 12th from 12:15 – 1:30 p.m. inside Expo Hall B3
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
Wednesday, November 12th from 1:30 – 3:30 p.m. inside Expo Hall B3
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4
HOUSTON, TEXAS USA
NOVEMBER 9 – 13, 2014
Analysis Community
Are Coming Together
Membership lounge hours:
Tuesday, November 11
9:00 a.m. – 6:00 p.m.
Networking Reception:
4:00 p.m. – 6:00 p.m.
2014 ISTFA Member Booth Ad.indd 1
Wednesday, November 12
9:30 a.m. – 3:30 p.m.
Exhibitor Dessert Reception, Poster and Video Contest:
1:30 p.m. – 3:30 p.m.
10/22/14 2:28 PM
Technical Program
On behalf of EDFAS, we would like to thank the organizers, session chairs,
and speakers for their time and efforts in creating an outstanding ISTFA
Conference and Exposition
EVERYTHING YOU NEED TO KNOW ABOUT
ISTFA 2014 IS ONLINE!
DON’T FORGET TO DOWNLOAD THE ISTFA MOBILE APP
AND ISTFA ONLINE PROCEEDINGS
Mobile App and Online Proceedings Support
is Available at Registration
A Special Thank You to the
EDFAS Lonestar Chapter for Their Support
6
Technical
Program
Sunday,
November
9, 2014
Time
Room
Session
8:00 a.m. – 11:15 a.m.
310A
Package and Physical Analysis Challenges
8:00 a.m. – 12:15 p.m.
310B
9:00 a.m. – 4:15 p.m.
310C
Fault Isolation
10:00 a.m. – 10:15 a.m.
Meeting Space Foyer
Refreshment Break
11:15 a.m. – 2:15 p.m.
Banners Café
Attendee Luncheon
1:15 p.m. – 6:30 p.m.
310A
Microscopy
2:15 p.m. – 4:15 p.m.
310B
4:15 p.m. – 4:30 p.m.
Meeting Space Foyer
Refreshment Break
8:00 a.m.-12:15 p.m.
Meeting Room: 310 B
Package and Physical Analysis Challenges
8:00 a.m.-11:15 a.m.
Meeting Room: 310 A
Session Chairs:
Dr. Jenny Ma
Intel
Chandler, AZ USA
Session Chair:
Mr. Robert Champaign
Raytheon Network Centric Systems
McKinney, TX USA
Dr. Mayue Xie
Intel
Chandler, AZ USA
Mr. Jake E. Klein
Texas Instruments
Tucson, AZ USA
8:00 a.m.
Chip Scale Packaging and Its Failure Analysis Challenges:
Ms. Susan Li, Spansion Device Analysis Lab, Spansion Inc,
Sunnyvale, CA
8:00 a.m.
Yield Basics for FA: Mr. Dave Albert1 and Mr. Tracy Myers2,
1
Department 06YA, IBM, Hopewell Junction, NY, 2ON
Semiconductor, Gresham, OR
9:00 a.m.
SAM vs X-RAY: Dr. Thomas M. Moore, Waviks, Inc., Dallas, TX
9:00 a.m.
Testing Small Technology Nodes in 2, 2.5, 3, and 5.5D:
Dr. Martin Keim, Silicon Test Solutions, Mentor Graphics,
Wilsonville, OR
10:00 a.m. – 10:15 a.m. • Refreshment Break •
Meeting Space Foyer
Meeting Space Foyer
10:15 a.m.
Flip-Chip and Backside
Techniques: Dr. Edward I. Cole Jr.1, Dr. Daniel L. Barton2 and
Dr. Karoline Bernhard-Hofer3, 1Science and Technology, Sandia
National Laboratories, Albuquerque, NM, 2Sandia National
Laboratories, Albuquerque, NM, 3Infineon, Regensburg,
Germany
10:15 a.m.
The Role of Nanoprobing in Yield and Failure Analysis: Mr.
Randal E. Mulder, Device Analysis Lab, Silicon Labs, Austin, TX
11:15 a.m.
Test Fundamentals and Implementation of Wafer
Level Tester-Based Failure Analysis: Dr. SH Goh,
Technology Development- New Technology Prototyping,
GLOBALFOUNDRIES, Singapore, Singapore
11:15 a.m. – 1:15 p.m. • Attendee Luncheon •Banners Café
12:15 p.m. – 1:15 p.m. • Attendee Luncheon • Banners Café
Programs are tentative: papers, authors, and order of presentations are subject to change.
7
Sunday,
November
9, 2014
Technical
Program
Fault Isolation
9:00 a.m.-4:15 p.m.
Meeting Room: 310 C
Microscopy
1:15 p.m.-6:30 p.m.
Meeting Room: 310 A
Session Chairs:
Mr. Gregory M. Johnson
IBM
Hopewell Junction, NY USA
Session Chairs:
Mr. Carl Nail
Evans Analytical Group, LLC
Irvine, CA USA
Ms. Susan Li
Spansion Inc
Sunnyvale, CA USA
Ms. Rose Ring
GLOBALFOUNDRIES Malta
Stillwater, NY USA
9:00 a.m.
Beam-Based Defect Localization: Dr. Edward I. Cole Jr.,
Science and Technology, Sandia National Laboratories,
Albuquerque, NM
1:15 p.m.
Scanning Electron Microscopy: Dr. William E. Vanderlinde,
Laboratory for Physical Sciences, College Park, MD
2:15 p.m.
Transmission Electron Microscopy: Dr. Sam Subramanian,
Freescale Semiconductor, Inc., Austin, TX
Meeting Space Foyer
10:15 a.m.
Photonic Localization Techniques: Dr. Arkadiusz Glowacki
and Prof. Christian Boit, Semiconductor Devices, Berlin
University of Technology, Berlin, Germany
3:15 p.m.
Ultra-High Resolution in the SEM: Dr. William E.
Vanderlinde, Laboratory for Physical Sciences, College Park,
MD
4:15 p.m. – 4:30 p.m. • Refreshment Break •
Meeting Space Foyer
11:15 a.m.
Laser Induced Techniques for Microelectronic Failure
Analysis: SDL and LADA: Dr. Michael Bruce, Consultant,
Austin, TX
4:30 p.m.
Focused Ion Beam (FIB) for Circuit Edit, Fault Isolation and
Sample Preparation: Mr. Steven B. Herschbein1, Mr. Oleg
Sidorov2, Mr. Chris Scheffler3, Mr. Richard Livengood3 and Dr.
Shida Tan3, 1IBM Systems & Technology, Hopewell Junction, NY,
2
FEI Company, Hillsboro, OR, 3Intel Corporation, Santa Clara, CA
12:15 p.m.
Defect localization by Lock-in-Thermography: Mr. Frank
Altmann, Centre for Applied Microstructure Diagnostics,
Fraunhofer Institute for Mechanics of Materials, Halle, Germany
5:30 p.m.
Materials Characterization for Failure Analysis: Dr. William
E. Vanderlinde, Laboratory for Physical Sciences, College
Park, MD
1:15 p.m. – 2:15 p.m. • Attendee Luncheon • Banners Café
2:15 p.m.
Magnetic Imaging for Die and Package Fault Isolation: Mr.
David Vallett, PeakSource Analytical, LLC, Fairfax, VT
3:15 p.m.
FA Technique Selection for Front End Defect Localization in
Bulk Semiconductor (Si) FA: Mr. Gregory M. Johnson and Mr.
Christopher D’Aleo, Physical Failure Analysis, IBM, Hopewell
Junction, NY
Meeting Space Foyer
8
Sunday,
November
9, 2014
Technical
Program
2:15 p.m.-4:15 p.m.
Meeting Room: 310 B
Session Chairs:
Mr. Chris Richardson
Allied High Tech Products, Inc.
Rancho Dominguez, CA USA
Mr. Jeremy A. Walraven
Albuquerque, NM USA
2:15 p.m.
Emerging Failure Modes of Advanced Technology: Mr.
Terence Kane, IBM, Hopewell Junction, NY
3:15 p.m.
Failure Anamnesis (be)for(e) Failure Analysis: Prof. Peter
Jacob, Principal Engineer Microstructure Failure Analysis, Dept.
Electronics/ Metrology - Reliability-Center, EMPA Duebendorf,
Duebendorf, Switzerland
Meeting Space Foyer
TECHNICAL MAGAZINE
EDFAS Member Benefit
EDFA is a quarterly magazine that contains key information dedicated to
meeting the technical and networking needs of electronic device failure
analysis technicians, engineers, and managers.
• Technical articles contributed by experts that cover everything from
operations to analysis techniques
• Trends of failure analysis in the microelectronics industry
• News of the Electronic Device Failure Analysis Society
• Guest columns provide vital perspective into FA topics
FOR ADVERTISING INFORMATION CONTACT:
Kelly Thomas | Global Manager, Sales & Expositions
440.338.1733 | Fax: 614.948.3090 | [email protected]
EDFAS Member Benefit Ad.indd 1
10/21/14 4:03 PM
9
Monday,
November
10, 2014
Technical
Program
Time
Room
Session
8:00 a.m. – 9:40 a.m.
Grand Ballroom B
Plenary Session
9:40 a.m. – 9:55 a.m.
Meeting Space Foyer
Refreshment Break
9:55 a.m. – 11:15 a.m.
Grand Ballroom B
Emerging Concepts and Techniques
11:15 a.m. – 12:05 p.m.
Grand Ballroom B
Novel Research – Level Techniques and Concepts
12:05 p.m. – 1:00 p.m.
Grand Ballroom B
Attendee Luncheon
1:00 p.m. – 2:40 p.m.
310A
3D Packages I
1:00 p.m. – 1:25 p.m.
310B
Detecting Counterfeit Devices
1:25 p.m. – 2:40 p.m.
310B
Photon-Based Techniques I
2:40 p.m. – 2:50 p.m.
Meeting Space Foyer
Refreshment Break
2:50 p.m. – 4:05 p.m.
310A
Packaging and Assembly I
2:50 p.m. – 4:05 p.m.
310B
Photon-Based Techniques II
4:05 p.m. – 6:00 p.m.
310A
Contactless User Group
5:00 p.m. – 6:45 p.m.
Expo Hall B3
Tools of the Trade Tour (Pre-Registration Required)
7:00 p.m. – 9:00 p.m.
Hilton Americas – Houston,
Americas Ballroom DE
ISTFA Social Event
Plenary Session
8:00 a.m.-9:40 a.m.
Meeting Room: Grand Ballroom B
Session Chair:
Dan Bodoh
Freescale Semiconductor
Austin, TX
impossible to do given the state of the art technology of the
time. This talk will take us from its impossible beginning to
its successful conclusion. And as usual the effort was under
scoped—there were far more issues than its being impossible.
Biography: Gene A Frantz is a Professor in the Practice at Rice
University. He took this position after 39 years at Texas Instruments where he retired as TI’s Principal Fellow. For the last 30
years he applied his passion for finding new opportunities and
creating new businesses utilizing TI’s digital signal processing
technology and took a leadership role in starting businesses
within the corporate structure. As a result, he is a recognized
leader in DSP technology both within TI and throughout the
industry.
8:10 a.m. – 8:45 a.m.
Professor Gene Frantz
Rice University
Houston, TX
Frantz is a Fellow of the IEEE, holds 48 patents in the area of
memories, speech, consumer products and DSP, has written
more than 100 Papers and articles and continually presents
at Universities and conferences worldwide. Frantz has been
recognized as an industry expert and has been widely quoted
in the media due to his tremendous knowledge and visionary
view of DSP solutions.
The Speak & Spell™ : The Birth of the Digital Signal
Processor
It was to be a simple educational product to help students
learn to spell. It had one problem standing in its way—It was
continued
10
Monday, November 10, 2014
8:45 a.m. – 8:50 a.m.
ISTFA 2013 Best & Outstanding Paper Awards
9:15 a.m. – 9:40 a.m.
ESREF 2013 Outstanding Paper
Best Paper Winner
Detectability of automotive power MOSFET on-resistance
failure at high current induced by Wafer Fab process excursion: Yann WEBER, Julien GOXE, Maris CASTIGNOLLES, Freescale Semiconducteurs France SAS, Toulouse Product Analysis
Lab, 134 avenue du Général Eisenhower, B.P. 72329, 31023
Toulouse Cedex, France
Two-Photon-Absorption-Enhanced Laser-Assisted Device
Alteration and Single-Event Upsets in 28nm Silicon Integrated Circuits: Dr. Keith A. Serrels1, Mr. Kent Erington2, Mr.
Dan J. Bodoh2, Prof. Derryck T. Reid3, Dr. Carl Farrell3, Mr. Neel
Leslie1, Dr. Ted R. Lundquist1 and Dr. Praveen Vedagarbha1,
1
DCG Systems, Fremont, CA, 2Silicon Systems Diagnostic Center,
Freescale Semiconductor, Austin, TX, 3Institute of Photonics
and Quantum Sciences, Heriot-Watt University, Edinburgh,
United Kingdom.
This paper presents the meaningful consequence of a minor
Wafer Fab process variability, generating on-resistance (RDSon)
drift on low voltage vertical power N-MOSFETs dedicated to
micro-hybrid automotive application. The research challenge
concerned the fact that failure was not detected in production
but at customer level; therefore, it was determinant to understand the root cause of this failure mode to drive corrective
actions in order to secure customer by detecting and delivering correct parts. The originality of that paper concerns the
necessity to use complementary Failure Analysis (FA) investigations, needed to determine the origin of the failure without any
possibilities to perform any fault localization. First, assembly
investigations are presented to discriminate if the failure was
coming from customer or provider. Then, electrical characterizations at high current confirmed the RDSon failure. Thus,
strategic physical destructive FA approaches were combined in
order to discriminate all potential root causes, using physical
step-by-step deprocessing, FIB milling cross-sections and TEM
analysis. Finally, a nanometric layer of oxide residue was identified as the origin of the failure and corresponded to a wafer Fab
process defect, induced by a lack of oxide overetch at spacer
definition process step. These results allowed implementing
corrections and improving test screening to protect customer.
Outstanding Paper Winner
Laser Voltage Imaging and Its Derivatives, Efficient Techniques to Address Defect On 28nm Technology: Mr. Thierry
Parrassin1, Mr. Guillaume Celi1, Dr. Antoine Reverdy2, Sylvain
Dudit1, Michel Vallet1, Dr. Philippe Perdu3 and Prof. Dean Lewis4,
1
ST Microelectronics, Crolles, France, 2Sector Technologies,
Gieres, France, 3Laboratories and Expertise, Quality Assurance,
Centre National d’Etudes Spatiales (CNES), Toulouse, France,
4
IMS laboratory, University of Bordeaux, Talence, France.
8:50 a.m. – 9:15 a.m.
IPFA 2014 Best Paper
Defect localization enhancement using Light Induced CIAFP: N. Dayanand, A.C.T Quah, C.Q.Chen, S.P.Neo, G.B.Ang, M.
Gunawardana, Product Failure Analysis, GLOBALFOUNDRIES
Singapore
This paper describes the effectiveness of coupling Photovoltaic
(PV) Effect with Current Imaging – Atomic Force Microscopy
(CI-AFP) to localize defects that are not detected through
conventional CI-AFP. By operating the p-n junctions of a MOS
transistor as photovoltaic cell, and measuring the photocurrent
to generate a light induced current image, it has widened the
spectrum of defects detectable through CI-AFP. In some cases,
the precision of defect localization can also be improved.
Meeting Space Foyer
11
Emerging Concepts and Techniques
9:55 a.m.-11:15 a.m.
Novel Research-Level Techniques and Concepts
11:15 a.m.-12:05 p.m.
Session Chairs:
Dr. Michael Bruce
Consultant
Austin, TX USA
Session Chairs:
Dr. Michael Bruce
Consultant
Austin, TX USA
Dr. Huimeng Wu
Carl Zeiss Microscopy, LLC
Peabody, MA USA
Dr. Huimeng Wu
Peabody, MA USA
9:55 a.m.
Welcoming Remarks: Michael Keim, Mentor Graphics,
Wilsonville, OR
11:15 a.m.
High-Resolution Backside GMR Magnetic Current Imaging
on a Contour-Milled Globally Ultrathin Die: Mr. David
Vallett1, Mr. Jan Gaudestad2 and Mr. Chris Richardson3,
1
PeakSource Analytical, LLC, Fairfax, VT, 2Magnetic Field
Imaging, Neocera, LLC, Beltsville, MD, 3FA Products &
Applications, Allied High Tech Products, Inc., Rancho
Dominguez, CA
10:00 a.m.
Novel NIR Camera with Extended Sensitivity and Low Noise
for Photon Emission Microscopy of VLSI Circuits: Dr. Andrea
Bahgat Shehata1, Dr. Franco Stellari2, Alan Weger2, Dr. Peilin
Song1, Dr. Herve Deslandes3, Dr. Ted R. Lundquist4 and Dr. Euan
Ramsay3, 1Circuit Test and Diagnostics Technology, IBM T.J.
Watson Research Center, Yorktown Heights, NY, 2IBM Research,
Yorktown Heights, NY, 3DCG Systems, Fremont, CA, 4DCG
Systems, Inc, Fremont, CA
11:40 a.m.
Resolution Improvement through Sparse Image
Reconstruction Techniques for Dark Field Subsurface
Microscopy of Integrated Circuits: Mrs. Tenzile Berkin
Cilingiroglu1, Prof. W. Clem Karl1, Prof. Janusz Konrad1,
Dr. Michael D W Grogan1, Mr. Abdulkadir Yurt2, Mr. Ahmet
Tuysuzoglu1, Prof. Bennett B. Goldberg3 and Prof. M. Selim
Unlu1, 1Electrical and Computer Engineering, Boston University,
Boston, MA, 2Material Science, Boston University, Boston, MA,
3
Physics, Boston University, Boston, MA
10:25 a.m.
Automated Mapping of Very Large Areas of VLSI Circuit
using SIL: Dr. Chung-Ching Lin1 and Dr. Franco Stellari2,
1
IBM T.J. Watson Research Center, Yorktown Heights, NY, 2IBM
Research, Yorktown Heights, NY
10:50 a.m.
Routine Device-Level Atom Probe Analysis: Mr. Daniel F.
Lawrence, Applications, Cameca, Inc., Madison, WI
12:05 p.m. – 1:00 p.m. • Attendee Luncheon • Grand Ballroom B
12
3D Packages I
1:00 p.m.-2:40 p.m.
Meeting Room: 310 A
Detecting Counterfeit Devices
1:00 p.m.-1:25 p.m.
Meeting Room: 310 B
Session Chairs:
Mr. Frank Altmann
Fraunhofer Institute for Mechanics of Materials
Halle, Germany
Session Chair:
Dr. Zhigang Song
IBM Systems & Technology
Dr. Yan Li
Intel
Chandler, AZ USA
1:00 p.m. Advanced Physical Inspection Methods for
Counterfeit Detection: Dr. Sina Shahbazmohamadi,
PhD, Prof. Domenic Forte, PhD and Prof. Mark Tehranipoor,
PhD, Electrical and Computer Engineering, University of
Connecticut/ CHASE Center, Storrs, CT
1:00 p.m.
3D IC/Stacked Device Fault Isolation Using 3D Magnetic
Field Imaging: Dr. Antonio Orozco1, Mr. Nicolas Gagliolo2, Mr.
Christopher Rowlett3, Mr. Enoch Wong2, Mr. Anurag Moghe1,
Mr. Steve Garrahan1, Mr. Jan Gaudestad4, Mr. Alex Jeffers5,
Mr. Keyvan Torkashvan5, Dr. Frederick C. Wellstood5, Dr. A. B.
Cawthorne6 and Dr. Fulvio Infante7, 1Magnetic Field Imaging,
Neocera, Beltsville, MD, 2Neocera, Beltsville, MD, 3Neocera LLC,
Beltsville, MD, 4Magnetic Field Imaging, Neocera, LLC, Beltsville,
MD, 5Department of Physics, Center for Nanophysics and
Advanced Materials, College Park, MD, 6Department of Science
and Mathematics, Trevecca Nazarene University, Nashville, TN,
7
Intraspec Technologies, Toulouse, France
1:25 p.m.
Failure Analysis Work Flow for Electrical Shorts in Triple
Stacked 3D TSV Daisy Chains: Mr. Jan Gaudestad1, Dr.
Antonio Orozco2, Prof. Ingrid De Wolf3, Teng Wang3, Tomas
Weber3, Mr. Ron Kelley4, Troy Morrison4 and Mr. Surendra
Madala4, 1Magnetic Field Imaging, Neocera, LLC, Beltsville, MD,
2
Magnetic Field Imaging, Neocera, Beltsville, MD, 3imec, Leuven,
Belgium, 4FEI, Hillsboro, OR
1:50 p.m.
Short Localization in 2.5D Microchip with Interposer using
Magnetic Current Imaging: Mr. Jan Gaudestad1, Mr. Daniel
Nuez2 and Mr. Phoumra Tan3, 1Magnetic Field Imaging, Neocera,
LLC, Beltsville, MD, 2QNG, Xilinx, San Jose, CA, 3Device Analysis
Lab, Xilinx, Inc, San Jose, CA
2:15 p.m.
Applying Innovative Techniques for Solving FA Challenges
of 3D IC Failures Utilizing Conventional Equipment: Mr.
Phoumra Tan, Device Analysis Lab, Xilinx, Inc, San Jose, CA
Meeting Space Foyer
13
Photon-Based Techniques I
1:25 p.m.-2:40 p.m.
Meeting Room: 310 B
Packaging and Assembly Analysis I
2:50 p.m.-4:05 p.m.
Meeting Room: 310 A
Session Chairs:
Dr. Herve Deslandes
DCG Systems
Fremont, CA USA
Session Chair:
Dr. Lihong Cao
Advanced Micro Devices
Austin, TX USA
Dr. Frank Zachariasse
NXP Semiconductors
Nijmegen, Netherlands
2:50 p.m.
Comparative Study on Decapsulation for Copper and Silver
Wire-Bonded Devices: Mr. Francois Kerisit1,2, Dr. Bernadette
Domengès2 and Mr. Michael Obein1, 1Digit Concept, Secquevilleen-Bessin, France, 2Presto-Engineering Europe, LAMIPS,
CRISMAT – NXP semiconductors - Presto-Engineering Europe
laboratory, CNRS-UMR6508; ENSICAEN, UCBN, CAEN, France
1:25 p.m.
Laser Logic State Imaging (LLSI): Dr. Baohua Niu1, Ms. Grace
Khoo2, Mr. Fernando Chapman3, Mr. Steven Chen4 and Mr.
Dan Bockelman5, 1TMG Labs, Intel Corp., Hillsboro, OR, 2ATM
FA Technology Development, Intel Corp., Hillsboro, OR, 3CQN
QR Product FAFI and Debug, Intel Corp., Hillsboro, OR, 4CQN
QR CPU/SOC FA-FI-DL Group, Intel Corp., Hillsboro, OR, 5PEG
Devices Development Group, Intel Corp., Hillsboro, OR
3:15 p.m.
Laser Focus Depth Adaptation for Decapsulation of Copper
Wirebonded Devices: Ms. H. B. Kor1, Dr. Qing Liu1, Ms. Y. W.
Siah1 and Prof. Chee Lip Gan1,2, 1Temasek Laboratories@NTU,
Nanyang Technological University, Singapore, Singapore,
2
School of Materials Science & Engineering, Nanyang
Technological University, Singapore, Singapore
1:50 p.m.
Root Cause Analysis Techniques Using Picosecond Time
Resolved LADA: Mr. Dan J. Bodoh1, Mr. Kent Erington1, Mr.
Kristofor Dickson1, Mr. George Lange1, Mr. Carey Wu1 and Mr.
Tom Crawford2, 1New Product and Technology Diagnostic
Center, Freescale Semiconductor, Austin, TX, 2DCG Systems,
Fremont, CA
3:40 p.m.
A Sample Preparation on Decapsulation Methodology for
Effective Failure Analysis on Thin Small Leadless (TSLP) Flip
Chip Package with Copper Pillar (CuP) Bump Interconnect
Technology: Mr. HoonYen Gwee, Quality Management
Department/ Failure Analysis, INFINEON TECHNOLOGIES,
Malacca, Malaysia
2:15 p.m.
The Role of Free Carrier Absorption in LADA: Mr. Kent
Erington, Mr. Dan J. Bodoh, Mr. Kristofor Dickson and Mr.
George Lange, New Product and Technology Diagnostic Center,
Freescale Semiconductor, Austin, TX
Meeting Space Foyer
14
Photon-Based Techniques II
2:50 p.m.-4:05 p.m.
Meeting Room: 310 B
Contactless User Group
4:05 p.m.-6:00 p.m.
Meeting Room: 310 A
Supply Chain Assurance and Device Reliability With a Laser
Confocal Microscope, David Stoker, SRI International
Session Chairs:
Dr. Herve Deslandes
DCG Systems
Fremont, CA USA
On Die Logic Analyzer, Dr. Mike Bruce, Independent Consultant
Dr. Frank Zachariasse
NXP Semiconductors
Nijmegen, Netherlands
Photon for FA, where do we go from here, Dr. Ed Cole, Sandia National Labs
7:00 p.m. – 9:00 p.m. • ISTFA Social Event •
Hilton Americas-Houston Americas Ballroom DE
2:50 p.m.
Improved Lock-In Phase Mapping of Modulated Reflectance
with SIL: Dr. Zhongling Qian, IFAG COM BTS PFS FA 2, Infineon
Technologies AG, Neubiberg, Germany
3:15 p.m.
Visible Light LVP on Ultra-Thinned Substrates: Dr. Joshua
Beutler, Dr. Edward I. Cole Jr., Ms. Mary A. Miller, Mr. Joe
Clement and Mr. Jeff Stevens, Science and Technology, Sandia
National Laboratories, Albuquerque, NM
3:40 p.m.
Introduction of Spectral Mapping through Transmission
Grating, Derivative Technique of Photon Emission: Mr.
Thierry Parrassin1, Sylvain Dudit2, Michel Vallet2, Dr. Antoine
Reverdy3 and Dr. Herve Deslandes4, 1STMicroelectronics,
CROLLES, France, 2ST Microelectronics, Crolles, France, 3Sector
Technologies, Gières, France, 4DCG Systems, Fremont, CA
15
Tuesday, November 11, 2014
Time
Room
Session
8:00 a.m. – 9:40 a.m.
310A
3D Packages II
8:00 a.m. – 9:15 a.m.
310B
Microscopy I
9:00 a.m. – 6:00 p.m.
Expo Hall B3
Exhibits Open
9:40 a.m. – 9:55 a.m.
Expo Hall B3
Refreshment Break
9:55 a.m. – 12:00 p.m.
310A
Packaging and Assembly Analysis II
9:55 a.m. – 12:00 p.m.
310B
Electrical Characterization and Nanoprobing
12:00 p.m. – 1:30 p.m.
Expo Hall B3
Attendee Luncheon
12:20 p.m. – 2:20 p.m.
Expo Hall B3
Nano-Probing User Group
2:20 p.m. – 2:35 p.m.
Expo Hall B3
Refreshment Break
2:35 p.m. – 3:50 p.m.
310A
Packaging and Assembly Analysis III
2:35 p.m. – 4:40 p.m.
310B
Case Studies and the Failure Analysis Process I
4:00 p.m. – 6:00 p.m.
Expo Hall B3
Expo Networking Reception
8:50 a.m.
Advances in FIB-SEM Analysis of TSV and Solder Bumps
- Approaching Higher Precision, Throughput and
Comprehensiveness: Dr. Tomas Hrncir1, Mr. Jiri Dluhos1, Mr.
Lukas Hladik2, Mrs. Efrat Moyal3, Mrs. Janet Teshima3 and Dr.
Jaromir Kopecek4, 1R&D - Physics, TESCAN Brno, Brno, Czech
Republic, 2Application department, TESCAN ORSAY HOLDING,
Brno, Czech Republic, 3LatticeGear, Beaverton, OR, 4Institute of
Physics ASCR, Prague, Czech Republic
3D Packages II
8:00 a.m.-9:40 a.m.
Meeting Room: 310 A
Session Chairs:
Mr. Frank Altmann
Fraunhofer Institute for Mechanics of Materials
Halle, Germany
Dr. Yan Li
Intel
Chandler, AZ USA
9:15 a.m.
A Systematic Method for the Physical Isolation of a Die in a
Stacked-Die Configuration: Ms. Vivian Jang and Mr. Ken C.
Sias, Texas Instruments, Dallas, TX
8:00 a.m.
SAM Assisted Contour Milling: Dr. Christian Hollerith1 and
Mr. Bernd Krueger2, 1Infineon tech. AG, Neubiberg, Germany,
2
Infineon Tech. AG, Neubiberg, Germany
9:40 a.m. – 9:55 a.m. • Refreshment Break • Expo Hall B3
8:25 a.m.
Efficient Non-destructive 3D Defect Localization by Lock-in
Thermography utilizing Multi Harmonics Analysis: Mr. Falk
Naumann, Mr. Rolf Herold and Mr. Frank Altmann, Center for
Applied Microstructure Diagnostics (CAM), Fraunhofer Institute
for Mechanics of Materials, Halle, Germany
16
Microscopy I
8:00 a.m.-9:15 a.m.
Meeting Room: 310 B
Packaging and Assembly Analysis II
9:55 a.m.-12:00 p.m.
Meeting Room: 310 A
Session Chair:
Mr. Carl Nail
Irvine, CA USA
Session Chair:
Dr. Lihong Cao
Austin, TX USA
8:00 a.m.
Evaluation of TEM-Lamella Oxidation: Dr. Thomas Haber1
and Dr. Christian Gspan2, 1Product Reliability, ams AG,
Unterpremstaetten, Austria, 2Institute for Electron Microscopy
and Nano Analysis, Graz University of Technology, Graz, Austria
9:55 a.m.
Reballing+Prepping Micro Devices Less Than 0.5mm Pitch:
Mr. Robert Wettermann, BEST Inc, Rolling Meadows, IL
10:20 a.m.
A Comprehensive Investigation of the Galvanic Corrosion
Induced Ag-Al Bonding Degradation in Microelectronic
Packaging Using Argon Ion Milling, SEM, Dual Beam FIBSEM, STEM and TOF-SIMS: Dr. Yixin Chen, WinTech NanoTechnology Services Pte. Ltd., Singapore, Singapore
8:25 a.m.
Spectrum Sharpening on Rotation Averaged TEM Nano
Beam Electron Diffraction Patterns: Dr. Yongkai Zhou1, Dr.
Younan Hua2 and Mr. Xiaomin Li3, 1Physical Analysis Division,
WinTech Nano-Technology Services Pte. Ltd., Singapore,
Singapore, 2WinTech Nano-Technology Services Pte. Ltd.,
Singapore, Singapore, 3MD, WinTech Nano-Technology Services
Pte. Ltd., Singapore, Singapore
10:45 a.m.
Correlation of Thin Film Measurement Techniques for
Device Packaging Processes: Mr. Juergen Walter, IFAG OP BE
QM FA 6, Infineon Technologies AG, Regensburg, Germany
8:50 a.m.
Automated Defect Analysis in Solar Cells Using EBIC: Dr.
Grigore Moldovan1, Mr. Shark Lotharukpong2 and Prof. Peter
Wilshaw2, 1NanoAnalysis, Oxford Instruments, High Wycombe,
United Kingdom, 2Materials Science, The University of Oxford,
Oxford, United Kingdom
11:10 a.m.
Case Studies on Application of 3D Real Time X-ray for
Flip Chip C4 Package: Dr. Lihong Cao, Quality & Reliability
Engineering, Advanced Micro Devices, Austin, TX
11:35 a.m.
Analysis of Two Electrical Failures Caused By Die Attach of
Exposed Pad Package: Mr. Jinglong Li, Mr. Motohiko Masuda,
Mr. Yi Che and Miao Wu, Product Analysis Laboratory, Freescale
Semiconductor(China) Limited, Tianjin, China
12:00 p.m. – 1:30 p.m. • Attendee Luncheon • Expo Hall B3
17
Electrical Characterization and Nanoprobing
9:55 a.m.-12:00 p.m.
Meeting Room: 310 B
11:10 a.m.
Failure Analysis of Bit Line to SNC Leakage Fail in 2xnm
DRAM Using Nano Probing Technique: Mr. Jaeho Won1, Mr.
Jundong Kim1, Mrs. Jina Kim1, Mrs. Jihye Shin1, Mr. Jihoon
Kim1, Ms. Kyungrim Lee1, Ms. Miae Yoon1, Mr. Jong Hak Lee2, Mr.
Jaeyun Lee2, Mr. Weonjoon Suh1 and Dr. Hyeonsoo Kim1, 1R&D
Division, SK hynix, Icheon-si, South Korea, 2DRAM Development
Division, SK Hynix Semiconductor Inc, Icheon-si, South Korea
Session Chairs:
Dr. Stefan B. Kaemmer
Multiprobe
Santa Barbara, CA USA
11:35 a.m.
Analysis of an Anomalous CMOS Transistor Exhibiting
Drain to Source Leakage –Its Model and Cause: Mr. Yuk
L. Tsang1, Mr. Alex VanVianen2, Xiang-Dong wang3 and N.
David Theodore3, 1Freescale Semiconductor Inc., Austin,
TX, 2Freescale Semiconductor Inc., Tempe, TX, 3Freescale
Semiconductor, Chandler, AZ
Mr. Izak Kapilevich
DCG Systems
Fremont, CA USA
9:55 a.m.
Identification Failure Mechanism of Threshold Voltage Shift
Induced By Dopant Diffuse Via Nano-Probe, Simulation and
Wet Stain Techniques: Ms. May Yang and Mr. Lee JH, Analysis
Lab, Semiconductor Manufacturing International (Beijing)
Corp, Beijing, China
12:00 p.m. – 1:30 p.m. • Attendee Luncheon • Expo Hall B3
Nano-Probing User Group
12:20 p.m.-2:20 p.m.
Meeting Room: Expo Hall B3
10:20 a.m.
Analysis of InGaAs Epi Defects by Conductive AFM: Mr. Aaron
Cordes1, Mr. Tom Dyer2 and Mr. Sean M. Hand3, 1Metrology,
SEMATECH, Albany, NY, 2Atomic Layer Manufacturing,
SEMATECH, Albany, NY, 3Bruker BNS, Santa Barbara, CA
Advanced Probing Tools, Stephan Kleindiek, Kleindiek
Nanotechnik, GmbH
10:45 a.m.
Utilizing Nanoprobing and Circuit Diagnostics to Identify
Key Failure Mechanism of Otherwise Non-Visible Defects
in 20nm Logic Devices: Dr. M. K. Dawood1, Dr. Changqing
Chen2, Mr. P.K. Tan3, Ms. Sabitha James3, Mr. Pariyarathu
Salimon Limin1, H. Tan3, Mr. H.H. Yap4, Mr. G.R. Low3, J. C. Lam5
and Dr. Z.H. Mai5, 1New Technology Prototyping, Technology
Development and Research, Globalfoundries Singapore Pte.
Ltd., Singapore, Singapore, 2Failure Analysis, Product failure
analysis, Globalfoundries Singapore, Singapore, Singapore,
3
Technology Development-New Technology Prototyping,
Globalfoundries Singapore Pte. Ltd., Singapore, Singapore,
4
Global Foundries, Singapore, Singapore, 5Product, Test and
Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd,
Singapore, Singapore
Capacitance Voltage Measurements and Imaging –
10attoFarads and Below, Sean Zumwalt, Multiprobe
Advancements in Nanoprobing, Bob Newton, DCG Nano
Instruments
2:20 p.m.-2:35 p.m. • Refreshment Break • Expo Hall B3
18
Packaging and Assembly Analysis III
2:35 p.m.-3:50 p.m.
Meeting Room: 310 A
Case Studies and the Failure Analysis Process I
2:35 p.m.-4:40 p.m.
Meeting Room: 310 B
Session Chair:
Dr. Lihong Cao
Austin, TX USA
Session Chairs:
Dr. Zhigang Song
Prof. Peter Jacob
EMPA Duebendorf
2:35 p.m.
Feature Based Non-Destructive Fault Isolation in Advanced
IC Packages: Dr. Ka Chung Lee1, Dr. Jesse Alton1, Mr. Martin
Igarashi1 and Mr. Stephane Barbeau2, 1TearView Limited,
Cambridge, United Kingdom, 2IBM Microelectronics, Bromont,
QC, Canada
2:35 p.m.
Understanding the Cu Void Formation by TEM Failure
Analysis: Dr. Binghai Liu1, Dr. Jie Zhu2, Mr. Eddie Er2, Dr. Si
Ping Zhao3, Dr. Jeffrey Lam4, Dr. Changqing Chen5 and Mr.
Mark Najarian6, 1Product, Test and FA, GLOBALFOUNDRIES
Singapore, Singapore, Singapore, 2QRA-FA, GLOBALFOUNDRIES
Singapore, Singapore, Singapore, 3Failure Analysis,
Quality and Customer Enablement (QCE) department,
Globalfoundries Singapore, Singapore, SC, Singapore,
4
GLOBALFOUNDRIES, Singapore, Singapore, 5Failure Analysis,
Product failure analysis, Globalfoundries Singapore, Singapore,
Singapore, 6FEI, SARATOGA SPRINGS, NY
3:00 p.m.
Failure Mechanism Studies and Root Cause Identification
of Non-Stick on Pad on Microchip Al Bondpads: Dr. Younan
Hua, WinTech Nano-Technology Services Pte. Ltd., Singapore,
Singapore
3:25 p.m.
Failure Localization of Intermittent Short Failures Caused
By Vertical Conductive Anodic Filament Formation: Mr.
Daniel Nuez, QNG, Xilinx, San Jose, CA
3:00 p.m.
Failure Analysis Methodology on Systematic Missing Cu in
RAM Due to Cu CMP: Mr. Ang Ghim Boon, Dr. Changqing Chen,
Ms. Hui Peng Ng, Dr. Alfred C.T. Quah, Ms. Angela Teo, Mr. Kim
Hong Yip, Ms. Soh Ping Neo, Dr. Jeffrey Lam and Dr. Zhihong
Mai, Product, Test and Failure Analysis, GLOBALFOUNDRIES
Singapore Pte Ltd, Singapore, Singapore
3:25 p.m.
Identification of Subtle Defect By Means of High Kev SEM
Passive Voltage Contrast: Dr. Sujing Xie1, Ms. Chaoying Chen2,
Mr. Nathan Wang2, Dr. Andrew Komrowski2, Ms. Qindi Wu2
and Mr. Saunil Shah2, 1Product Engineering, Maxim Integrated,
Hillsboro, OR, 2Product Engineering, Maxim Integrated, San
Jose, CA
3:50 p.m.
Inline Defects Overlaying with Functional Failures and
Characterization for Fast Defect Learning and Fast Yield
Improvement: Dr. Zhigang Song, Dr. Oliver D. Patterson and
Dr. Qian Xu, IBM Systems & Technology, Hopewell Junction, NY
4:15 p.m.
Observation of Channel Strain Release in pMOS Device with
Low Idsat Using Energy-Filtered Nano-Beam Diffraction
Technique: Dr. Jie Zhu, QRA-FA, GLOBALFOUNDRIES
Singapore, Singapore, Singapore
19
Wednesday, November 12, 2014
Time
Room
Session
8:00 a.m. – 10:00 a.m.
310A
Technology Specific FA Tutorial
9:00 a.m. –10:00 a.m.
310B
Fault Localization Tutorial
9:30 a.m. – 3:30 p.m.
Expo Hall B3
Exhibits Open
10:00 a.m. – 10:15 a.m.
Expo Hall B3
Refreshment Break
10:15 a.m. – 12:15 p.m.
310A
Panel Discussion – System to Component Level Failure Analysis in Space
& Oil industries
12:15 p.m. – 1:30 p.m.
Expo Hall B3
EDFAS General Membership Meeting and Luncheon
1:30 p.m. – 3:30 p.m.
Expo Hall B3
Exhibitor Dessert Reception, Poster and Video Contest
3:30 p.m. – 4:20 p.m.
310B
Circuit Edit
3:30 p.m. – 5:35 p.m.
310A
Sample Preparation and Device Deprocessing I
4:20 p.m. – 6:00 p.m.
310B
Microscopy II
Technology Specific FA Tutorial
8:00 a.m.-10:00 a.m.
Meeting Room: 310 A
Fault Localization Tutorial
9:00 a.m.-10:00 a.m.
Meeting Room: 310 B
Session Chair:
Mr. Jeremy A. Walraven
Albuquerque, NM USA
Session Chairs:
Mr. Gregory M. Johnson
IBM
Ms. Susan Li
Spansion Inc
Sunnyvale, CA USA
8:00 a.m.
Oil & Gas Microelectronics Failure Analysis: Methodologies
and Selected Case Studies: Mr. John Bescup, Weatherford
Drilling Services, Houston, TX
9:00 a.m.
Fundamentals of Laser Signal Injection Microscopy: Dr.
R. Aaron Falk, OptoMetrix, Quantum Focus Instruments,
Newcastle, WA
20
Panel Discussion: System to Component Level Failure
Analysis in Space & Oil industries
10:15 a.m.-12:15 p.m.
Meeting Room: 310 A
Exhibitor Dessert Reception, Poster and Video Contest
1:30 p.m.-3:30 p.m.
Session Chairs:
Mr. David Grosjean
Qualcomm
Andover, MA USA
Panel Moderator:
Felix Beaudoin
Global Foundries
Panelists:
Bobby Hooghan, Weatherford Laboratories
Ted Kolasa, Orbital Sciences Corporation
John Martin, MARTIN COMPANY
Philippe Perdu, CNES
Dr. Martin Versen
University of Applied Sciences Rosenheim
Rosenheim, Germany
Advanced Fault Localization Technique on e-Fuse Read
Failure: Mr. Hung Chin Chen1, Chih Yang Tsai2, Mr. Shih-Yuan
Liu2, Mr. Jian-Chang Lin2 and Mr. Yu-Pang Chang2, 1Product
Engineer Department, United Microelectronics Corporation,
Ltd., Tainan County, Taiwan, 2Failure Analysis Dept, PED, UMC,
Tainan County, Taiwan
Panel Description: Electronic components and systems used
in space and oil industries have to withstand usually harsh
environments such as extreme temperature, humidity, corrosive environments, mechanical shock and vibration, radiation,
or high E and B-fields. Reliability of those components is critical
since they cannot be replaced and/or can cause catastrophic
consequence in case of malfunction. Failures at component
and system level either resulting from reliability tests or final
assembly tests must be thoroughly investigated prior to
deployment. The panel presentations will discuss the present
methodologies and techniques for performing comprehensive
failure analysis of integrated electrical systems followed by a
panel discussion highlighting the challenges of achieving root
cause identification especially when only one unique fail device
is available.
Application of Soft Defect Localization (SDL) for SRAM Soft
Failure Debug: Dr. SeungJe Moon1, Boon Lian Yeoh1, Dr. SH
Goh1, Shaalini CHITHAMBARAM1, Dr. Alfred C.T. Quah2 and Dr.
Jeffrey Lam1, 1Technology Development- New Technology
Prototyping, GLOBALFOUNDRIES, Singapore, Singapore,
2
Product, Test and Failure Analysis, GLOBALFOUNDRIES
Applications and Techniques for 2D Picosecond Imaging for
Circuit Analysis: Dr. Franco Stellari1, Dr. Peilin Song2 and Mr.
Alan J. Weger3, 1IBM Research, Yorktown Heights, NY, 2Circuit
Test and Diagnostics Technology, IBM T.J. Watson Research
Center, Yorktown Heights, NY, 3Optical Communication and
High Speed Test, IBM T.J. Watson Research Center, Yorktown
Heights, NY
EDFAS General Membership Meeting and Luncheon
12:15 p.m.-1:30 p.m.
Join us to hear the President report on the current status of
and future vision for EDFAS; to meet the new EDFAS Officers
and Board members; and to congratulate the 2014 Photo
Contest winners. We look forward to seeing you there!
The meeting is open to all EDFAS members, exhibitors and
interested prospective members. One ticket is included with
full conference and exhibitor registrations.
Applications of AFP Nanoprobing for Localization of
Implant Related Issues: Mr. Dayanand Nagalingam, Mr. Tao
Xie, Dr. Alfred C.T. Quah, Ms. Soh Ping Neo, Ms. Hui Peng Ng,
Mr. Ghim Boon Ang, Mr. Kim Hong Yip, Dr. Z.H. Mai and J. C.
Lam, Product, Test and Failure Analysis, GLOBALFOUNDRIES
Automatic Emission Spots Identification in Static and
Dynamic Imaging by Research of Local Maxima: Mr. Anthony
Boscaro1, Dr. Philippe Perdu2, Sabir Jacquir3, Mr. Samuel
Chef3, Mr. Kevin Sanchez2 and Stephane Binczak3, 1Centre
National d’Etudes Spatiales, Toulouse, France, 2Laboratories
and Expertise, Quality Assurance, Centre National d’Etudes
Spatiales (CNES), Toulouse, France, 3LE2I, University of
Burgundy, Dijon, France
continued
21
Auto-Metrology on TEM Images of FinFET: Dr. Sajal Biring1
and Dr. C H Chu2, 1R&D, Materials Analysis Technology Inc.,
Hsinchu, Taiwan, 2Surface Analysis and R&D, Materials Analysis
Technology Inc., Hsinchu, Taiwan
Metal Bridge Defects Localization By a Tiny Leakage
Between One of Bridged Signals and VDD (GND): Mr. Chunlei
Wu, Product Analysis Laboratory, Freescale Semiconductor
(China) Limited, Tianjin, China
Characterization and Simulation of a Body Biased Structure
in Triple-Well Technology Under Pulsed Photoelectric Laser
Stimulation: Mr. Nicolas Borrel1, Mr. Clement Champeix1, Mrs.
Edith Kussener2, Mr. Wenceslas Rahajandraibe2, Mr. Mathieu
Lisart1, Mr. Jean-Max Dutertre3 and Mr. Alexandre Sarafianos1,
1
STMicroelectronics, Rousset, France, 2IM2NP-UMR CNRS 7334
/ Aix-Marseille University, Marseille, France, 3Ecole Nationale
Supérieure des Mines de St-Etienne, CMP-GC, Gardanne, France
Quantitative Analysis of Heterogeneous Materials by SEM/
EDS by Use of Rapid Phase Decomposition: Mr. John F.
Konopka, Thermo Fisher Scientific, Madison, WI
Safe Decapsulation Techniques Using Viton Caulk: Mr.
Kristopher D. Staller, Tucson Device Analysis Operations
Laboratory, Texas Instruments, Tucson, AZ
Sample Preparation for High Numerical Aperture Solid
Immersion Lens Laser Imaging: Mr. Maozhe Samuel Wei1 and
Mr. Soon Huat Lim2, 1Advanced Micro Devices (Singapore)
Pte Ltd, Singapore, Singapore, 2Device Analysis Laboratory,
Advanced Micro Devices Pte Ltd, SIngapore, Singapore
Continuous Wave 1064nm Laser for Laser Voltage Imaging
and Probing Applications: Mr. Venkat Ravikumar1, S.L. Phoa1,
Prasad Sabbineni2 and Dr. Dmitry Skvortsov2,3, 1Advanced
Micro Devices - Singapore Pte Ltd, Singapore, Singapore, 2DCG
Systems, Fremont, CA, 3DCG Systems, Inc, Fremont, CA
Static Fault Isolation on The Functional Failure of An Digital
IC Device: Dr. Changqing Chen, Failure Analysis, Product
failure analysis, Product, test and failure analysis Dept. (PTF
Singapore), Globalfoundries Singapore, Singapore, Singapore
Development of DPA(Distractive Physical Analysis) for Cu
wire device: Mr. Hirofumi Tateyama, Reliability Analysis
Division, Oki Engineering Co., Ltd., Nerima-ku,Tokyo, Japan
TDR Analysis on Short Transmission Lines: Mr. Nicholas
Konkol and Mr. Colin Stark, MSECE, GPAC, Intel Corporation,
Hillsboro, OR
Ex Situ Lift Out of PFIB Prepared Site Specific Specimens:
Dr. Lucille A. Giannuzzi1, Dr. Lisa Chan2 and Dr. Jon M. Hiller2,
1
EXpressLO LLC, Fort Myers, FL, 2Tescan USA, Inc., Cranberry
Township, PA
Test Circuit Conditioning for Soft Defect Localization: Mr.
Kristopher D. Staller, Tucson Device Analysis Operations
Laboratory, Texas Instruments, Tucson, AZ
Failure Analysis Methodology on Resistive Open Defects:
Dr. Alfred C.T. Quah, Mr. Ghim Boon Ang, Mr. Dayanand
NAGALINGAM, Ms. Magdeliza Gunawardana, Mrs. Ng Hui
Peng, Soh Ping NEO, Dr. Z.H. Mai and J. C. Lam, Product, Test
and Failure Analysis, GLOBALFOUNDRIES Singapore Pte Ltd,
To Eliminate Curtain Effect of FIB TEM Samples by a
Combination of Sample Dicing and Backside Milling: Dr.
Jian-Shing Luo and Ms. Hsiu-Ting Lee, Physical Failure Analysis
Department, Inotera Memories, Inc., Taoyuan, Taiwan
Integrated ESD Robustness through Device Analysis of
Ultra-Small Low Voltage Power MOSFETs: Mr. Ian Kearney1
and Mr. Hank Sung2, 1Texas Instruments, Bethlehem, PA, 2Texas
Instruments, Dallas, TX
Ultra-Low Voltage TRE Measurements from 32 nm SOI
CMOS Integrated Circuits: Dr. Andrea Bahgat Shehata1, Dr.
Franco Stellari2, Alan Weger2, Dr. Peilin Song1, Dr. Vikas Anant3,
Kristen Sunter4, Dr. Karl Berggren4, Dr. Ted R. Lundquist5 and
Dr. Euan Ramsay5, 1Circuit Test and Diagnostics Technology,
IBM T.J. Watson Research Center, Yorktown Heights, NY, 2IBM
Research, Yorktown Heights, NY, 3Photon Spot, Monrovia, CA,
4
Research Laboratory of Electronics, Massachusetts Institute of
Technology, Cambridge, MA, 5DCG Systems, Inc, Fremont, CA
Marginal Failure Diagnosed with LADA: Case Studies: Mr.
Sukho Lee1, Mr. Keonil Kim1, Mr. Yunwoo Lee1, Mr. Euncheol
Lee1, Mr. Yojoung Kim1 and Mr. Izak Kapilevich2, 1Product &
Test Engineering Team, Samsung Electronics co. Ltd, Young-in,
South Korea, 2DCG Systems, Fremont, CA
Memory Address Verification Using NIR Laser: Mr. Wilson
Lee Cheng Hoe, Failure Engineer, Qualcomm, Singapore,
Singapore
Visit Expo Hall B3 to view this year’s posters,
watch videos and to cast your vote!
22
Circuit Edit
3:30 p.m.-4:20 p.m.
Meeting Room: 310 B
Sample Preparation and Device Deprocessing I
3:30 p.m.-5:35 p.m.
Meeting Room: 310 A
Session Chairs:
Dr. Michael DiBattista
Qualcomm Technologies, Inc.
San Diego, CA USA
Session Chairs:
Mr. Roger Alvis
FEI Company
Hillsboro, OR USA
Mr. Dane Scott
Intel Corporation
Folsom, CA USA
Mr. Bryan Tracy
Spansion, LCC
Sunnyvale, CA USA
3:30 p.m.
Using Energy Dispersive Spectroscopy (EDS) to Determine
the Resistance of FIB Jumpers for Circuit Edit: Dr. Michael
DiBattista1, Mr. Hasan Faraby2, Mr. Corey Senowitz1 and Dr.
Prabhakar Bandaru3, 1Qualcomm Technologies, Inc., San Diego,
CA, 2Department of Electrical and Computer Engineering,
University of California, San Diego, La Jolla, CA, 3Department
of Mechanical and Aerospace Engineering, University of
California, San Diego, La Jolla, CA
3:30 p.m.
Basic Decapsulate Tool Function Develop for Cu Wire
Bonding IC and the Real Usage on Function Extended
Basic EMMI for Dynamic EFA: Ms. Yoyo Wen1 and Ms. May
Yang2, 1SMIC, Beijing, BC, China, 2Analysis Lab, Semiconductor
Manufacturing International (Beijing) Corp, Beijing, China
3:55 p.m.
Effective and Efficient FEOL Defects Localization/ Inspection
By Selective Mechanical/Chemical Deprocessing: Mrs. Ng
Hui Peng, Ms. Angela Teo, Mr. Ang Ghim Boon, Mr. Kim Hong
Yip, Dr. Chang Qing Chen, Dr. Alfred C.T. Quah, Mr. Tam Yong
Seng, Dr. Jeffrey Lam and Dr. Zhihong Mai, Product, Test
3:55 p.m.
New Ion Source for High Precision FIB Nanomachining
and Circuit Edit: Dr. Adam V. Steele1, Dr. Brenton Knuffman1
and Dr. Jabez J. McClelland2, 1zeroK NanoTech Corporation,
Montgomery Village, MD, 2National Institute of Standards and
Technology, Gaithersburg, MD
4:20 p.m.
Site-Specific, Wide Field-of-View Cross-Sectional Sample
Preparation, Imaging and Analysis in a Plasma Ion Source
Microscope: Mr. Roger Alvis and Mr. Ron Kelley, FEI Company,
Hillsboro, OR
4:45 p.m.
microPREP - A Novel Laser Tool for High-Throughput
Sample Preparation: Prof. Thomas Höche, Center for Applied
Microstructure Diagnostics, Fraunhofer IWM Halle, Halle,
Germany
continued
23
Microscopy II
4:20 p.m.-6:00 p.m.
Meeting Room: 310 B
5:10 p.m.
Application of Fast Laser Deprocessing Techniques in
Physical Failure Analysis on SRAM Memory of Advance
Technology: Mr. H.H. Yap1, P. K. Tan2, Mr. G.R. Low3, Dr.
M. K. Dawood3, Mr. Hua Feng4, Mr. Y.Z. Zhao1, Mr. R. He3, H.
Tan3, Dr. Yamin Huang5, Dr. Dandan Wang6, Mr. Y. Zhou1, Mr.
Pariyarathu Salimon Limin3, Ms. Sabitha James3, Dr. Jeffrey
Lam7 and Dr. Z.H. Mai8, 1Technology Development- New
Technology Prototyping, Global Foundries, Singapore,
Singapore, 2Technology Development, Globalfoundries
Singapore Pte Ltd., Singapore, Singapore, 3Technology
Development-New Technology Prototyping, Globalfoundries
Singapore Pte. Ltd., Singapore, Singapore, 4TD-NTP-PSE,
GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore, Singapore,
5
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore,
6
GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore, Singapore,
7
GLOBALFOUNDRIES, Singapore, Singapore, 8Product, Test
Session Chair:
Mr. Carl Nail
Irvine, CA USA
4:20 p.m.
Evaluation of Power SiC-MOSFET Using Super-HigherOrder Scanning Nonlinear Dielectric Microscopy: Imaging
of Carrier Distribution and Depletion Layer: Mr. Norimichi
Chinone1, Dr. Takashi Nakamura2 and Prof. Yasuo Cho1,
1
Research Institute of Electrical Communication, Tohoku
University, Sendai, Japan, 2Power Electronics R&D Unit, ROHM
Co., Ltd., Kyoto, Japan
4:45 p.m.
Imaging Performance of aSIL Microscopy on Subsurface
Imaging of SOI Chips: Ms. Aydan Uyar1, Mr. Abdulkadir Yurt2,
Mrs. Tenzile Berkin Cilingiroglu1, Prof. Bennett B. Goldberg3 and
Prof. M. Selim Ünlü1, 1Electrical and Computer Engineering,
Boston University, Boston, MA, 2Material Science, Boston
University, Boston, MA, 3Physics, Boston University, Boston, MA
5:10 p.m.
Methods to Reconstruct SEM and Optical Probe Tips using
a FIB Tool: Mr. Walter Lepuschenko and David Goulet, IBM
Microelectronics, Essex Junction, VT
5:35 p.m.
Near-Field Scanning Optical Microscopy for Through-Silicon
Imaging and Fault Isolation of Integrated Circuits: Dr. Rajiv
Giridharagopal, Dr. Travis M. Eiles and Dr. Baohua Niu, TMG
Labs, Intel Corp., Hillsboro, OR
24
Thursday, November 13, 2014
Time
Room
Session
8:00 a.m. – 9:40 a.m.
310A
Sample Preparation and Device Deprocessing II
8:00 a.m. – 9:40 a.m.
310B
Case Studies and the Failure Analysis Process II
9:40 a.m. – 9:50 a.m.
Meeting Space Foyer
Refreshment Break
9:50 a.m. – 11:55 a.m.
310A
Sample Preparation and Device Deprocessing III
9:50 a.m. – 11:30 a.m.
310B
Defect Characterization and Metrology
11:55 a.m. – 1:00 p.m.
Grand Ballroom B
Attendee Luncheon
12:20 p.m. – 2:20 p.m.
Grand Ballroom B
Sample Prep/3D Package Prep User Group
2:20 p.m. – 2:30 p.m.
Meeting Space Foyer
Refreshment Break
2:30 p.m. – 3:20 p.m.
310A
Sample Preparation and Device Deprocessing IV
2:30 p.m. – 3:45 p.m.
310B
Software-Based Techniques, Test, Diagnostics, and Yield
3:45 p.m. – 5:45 p.m.
Grand Ballroom B
FIB User Group
Sample Preparation and Device Deprocessing II
8:00 a.m.-9:40 a.m.
Meeting Room: 310 A
Case Studies and the Failure Analysis Process II
8:00 a.m.-9:40 a.m.
Meeting Room: 310 B
Session Chairs:
Mr. Roger Alvis
FEI Company
Hillsboro, OR USA
Session Chairs:
Prof. Peter Jacob
EMPA Duebendorf
Mr. Bryan Tracy
Spansion, LCC
Sunnyvale, CA USA
Dr. Zhigang Song
8:00 a.m.
Application of Automated FIB for TEM Sample Preparation
in Semiconductor Failure Analysis: Dr. Jie Zhu1, Dr. Si Ping
Zhao1 and Mr. Mark Najarian2, 1QRA-FA, GLOBALFOUNDRIES
Singapore, Singapore, Singapore, 2FEI, SARATOGA SPRINGS, NY
8:00 a.m.
Incorporating a Compact Scan Diagnostic System Enhances
the Failure Analysis Flow: Mr. Rommel Estores1, Pascal
Vercruysse1, Karl Villareal1, Mr. Eric Barbian2, Mr. Ralph Sanchez3
and Mr. Rich Ackerman3, 1Failure Analysis, ON Semiconductor,
Oudenaarde, Belgium, 2ON Semiconductor, Phoenix, AZ,
3
Teseda, Portland, OR
8:25 a.m.
Development of Productive Polishing TEM Sample Preparation
Methodology: Dr. Huisheng Yu, Mrs. Shuqing Duan, Ming
Li, Qihua Zhang and Wei-Ting Kary Chien, Semiconductor
Manufacturing International (Shanghai) Corp., Shanghai, China
8:25 a.m.
Determination of the Source of an Electrical Over Stress
Event to a Digital Variable Gain Amplifier Module: Ms. Thiri
Htun1 and Mr. Steve Brockett2, 1Quality and Reliability, TriQuint
Semiconductor, San Jose, CA, 2Quality and Reliability, TriQuint
Semiconductor, Inc., Hillsboro, OR
8:50 a.m.
Optimization of TEM Sample Preparation to Reduce the
Overlapping of TEM Images: Mrs. Shuqing Duan, Liu Chen,
Dr. Huisheng Yu, Ming Li, Qihua Zhang and Wei-Ting Kary Chien,
Semiconductor Manufacturing International (Shanghai) Corp.,
Shanghai, China
8:50 a.m.
Temperature-Dependent Logic Failure in a GaAs Power
Amplifier-Duplexer Module Caused by a Subtle Parasitic
Schottky Diode: Dr. Rose Emergo1, Mr. Steve Brockett2 and Mr.
Pat Hamilton3, 1Quality and Reliability, TriQuint, Hillsboro, OR,
2
Quality and Reliability, TriQuint Semiconductor, Inc., Hillsboro,
OR, 3Test & Front End Process, TriQuint, Hillsboro, OR
9:15 a.m.
Delayering on Advanced Process Technologies using FIB:
Dr. David Donnet, Mr. Oleg Sidorov, Dr. Chad Rue and Mr. Peter
Carleson, FEI Company, Hillsboro, OR
Meeting Space Foyer
continued
25
Sample Preparation and Device Deprocessing III
9:50 a.m.-11:55 a.m.
Meeting Room: 310 A
9:15 a.m.
Debugging Phase Locked Loop Failures in Integrated
Circuit Products: Dr. SH Goh, Technology Development- New
Technology Prototyping, GLOBALFOUNDRIES, Singapore,
Singapore
Session Chairs:
Mr. Bryan Tracy
Spansion, LCC
Sunnyvale, CA USA
Meeting Space Foyer
Mr. Roger Alvis
FEI Company
Hillsboro, OR USA
9:50 a.m.
A Novel Method for the Specified Site Planar View TEM
Sample Preparation: Mrs. Shuqing Duan, Yanli Zhao and Ming
Li, Semiconductor Manufacturing International (Shanghai)
Corp., Shanghai, China
10:15 a.m.
Investigation of Protection Layer Materials for Ex-situ
‘lift-out’ TEM sample Preparation Technique with FIB for
14nm FinFET: Mr. Hua Feng1, Mr. G.R. Low2, Mr. P.K. Tan2, Mr.
Y.Z. Zhao3, Mr. H.H. Yap3, Dr. M. K. Dawood2, Mr. Y. Zhou3, Dr.
Anyan Du4, Dr. Changqing Chen5, H. Tan2, Dr. Yamin Huang6,
Dr. Dandan Wang7, Dr. Jeffrey Lam2 and Dr. Z.H. Mai8, 1TDNTP-PSE, GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore,
Singapore, 2Technology Development-New Technology
Prototyping, Globalfoundries Singapore Pte. Ltd., Singapore,
Singapore, 3Technology Development- New Technology
Prototyping, Global Foundries, Singapore, Singapore, 4QRA-FA,
GLOBALFOUNDRIES Singapore, Singapore, Singapore, 5Failure
Analysis, Product failure analysis, Globalfoundries Singapore,
Singapore, Singapore, 6GLOBALFOUNDRIES Singapore Pte Ltd,
Singapore, Singapore, 7GLOBALFOUNDRIES Singapore Pte.
Ltd, Singapore, Singapore, 8Product, Test and Failure Analysis,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
10:40 a.m.
Application of Passive Voltage Contrast (PVC) to DualBeam
Focused Ion Beam (FIB) Based Sample Preparation for the
Scanning/Transmission Electron Microscope (S/TEM): Mr.
Corey Senowitz, Ms. Theresa Graupera, Mr. Don Lyons, Mr.
Hieu Nguyen, Ms. Ruby Vollrath and Dr. Michael DiBattista,
Qualcomm Technologies, Inc., San Diego, CA
11:05 a.m.
Tri-Directional TEM Failure Analysis on Sample Prepared
By in-Situ Lift-out FIB and Flipstage: Dr. Jie Zhu, Elizabeth
Sebastian, QRA-FA, GLOBALFOUNDRIES Singapore, Singapore,
Singapore
11:30 a.m.
Will Tomorrow’s Failure Analysis Lab Operate more like
Today’s Fab?: Mr. Todd J. Templeton, Electronics Business
Unit, FEI Company, Hillsboro, OR
11:55 a.m. – 1:00 p.m. • Attendee Luncheon • Grand Ballroom B
26
Defect Characterization and Metrology
9:50 a.m.-11:30 a.m.
Meeting Room: 310 B
Sample Prep/3D Package Prep User Group
12:30 p.m.-2:20 p.m.
Session Chairs:
Mr. Terence Kane
IBM
Re-Packaging Challenges for FA, Monte Drennan, Priority
Packaging, Inc.
Sample Preparation for Enhanced LIT Isolation, Eddy Chua
Bok Khoon, Infineon
Mr. Phil Kaszuba
IBM Systems and Technology
Essex Junction, VT USA
Advancements in Sample Preparation, Chris Richardson,
Milli-to-Nano, Helios PFIB Dual Beam, a Single-Tool
Workflow for EFI-to-PFA, Roger Alvis, FEI Corporation
9:50 a.m.
Localization of Weak Points in Thin Dielectric Layers By
Electron Beam Absorbed Current (EBAC) Imaging: Mr.
Jörg Jatzkowski, Mr. Michél Simon-Najasek and Mr. Frank
Altmann, Center for Applied Microstructure Diagnostics (CAM),
Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Meeting Space Foyer
Sample Preparation and Device Deprocessing IV
2:30 p.m.-3:20 p.m.
Meeting Room: 310 A
10:15 a.m.
Al-Cu Alloy Films Characterization & Studies using TOFSIMS, XPS, AFM, EBSD and TEM: Mr. Jingjing Shao, Surface
Group, Wintech Nano-Technology Services Pte. Ltd, Singapore,
Singapore
Session Chairs:
Mr. Bryan Tracy
Spansion, LCC
Sunnyvale, CA USA
10:40 a.m.
Advanced Failure Analysis on Silicon Pipeline Defects and
Dislocations in Automotive Mixed-Mode Devices: Dr. Yann
Weber1, Mr. Julien Goxe1, Dr. Stephane alves1, Mr. Thomas
zirilli1, Dr. Marie Castignolles1, Dr. Sam Subramanian2, Dr.
Yuk Tsang2 and Mr. Keith Harber2, 1Quality Labs, Freescale
Semiconducteurs France SAS, Toulouse, France, 2Freescale
Semiconductor, Inc., Austin, TX
Mr. Roger Alvis
FEI Company
Hillsboro, OR USA
2:30 p.m.
TEM Sample Preparation Methods for MEMS Floating
Structure Analysis: Dr. Huisheng Yu, Shuqing Duan and Ming
Li, Semiconductor Manufacturing International (Shanghai)
Corp., Shanghai, China
11:05 a.m.
Foil Capacitor Characterization and Failure Analysis with
Special Respect to Noise Filter Applications: Prof. Peter
Jacob, Principal Engineer Microstructure Failure Analysis, Dept.
Electronics/ Metrology - Reliability-Center, EMPA Duebendorf
(50%, 1993-today, Main Affiliation), Duebendorf, Switzerland
2:55 p.m.
Cross-Section Sample Preparation Method for Imaging
Dopant Related Anomalies Using Scanning Probe Microscopy
Techniques: Dr. Sam Subramanian, Mrs. Khiem ly and Mr. Tony
Chrastecky, Freescale Semiconductor Inc., Austin, TX
11:55 a.m. – 1:00 p.m. • Attendee Luncheon • Grand Ballroom B
27
Software-Based Techniques, Test, Diagnosis, and Yield
2:30 p.m.-3:45 p.m.
Meeting Room: 310 B
FIB User Group
3:45 p.m.-5:45 p.m.
Session Chairs:
Mr. Geir Eide
Mentor Graphics
Wilsonville, OR USA
Enabling EFI, EFA and PFA with Plasma FIB - Large Area
sampling for X-ray Tomography and Batch Lamella Preparation, Ron Kelly, FEI Company
Elimination of ESD damage during FIB operations, Valery
Ray, NISP Lab, University of Maryland
Mr. Mark E. Kimball
Maxim Integrated Products, Inc.
Hillsboro, OR USA
FIB line resistivity calculations, there’s an app for that,
Michael DiBattista, Qualcomm Incorporated
2:30 p.m.
Design Debug for Intermittent Power up Failure in
Analog/Mixed Signal Device: Mr. Sagar Karki, DDAO, Texas
Instruments Corporation, Dallas, TX
2:55 p.m.
A Case Study on the Benefits of Functional Memory Access
During ATE Test and Electrical Fault Isolation Techniques
for Embedded SRAM: Mr. Corey Goodrich, SBDAO, Texas
Instruments, Dallas, TX
3:20 p.m.
Introduction to Verification and Test Using a 4-bit
Arithmetic Logic Unit Including a Failure Module in a
Xilinx XC9572XL CPLD: Dr. Martin Versen1 and Mr. Michael
Hayn2, 1Faculty of Engineering, University of Applied Sciences
Rosenheim, Rosenheim, Germany, 2University of Applied
Sciences Rosenheim, Rosenheim, Germany
2015
I N T E R N AT I O N A L S Y M P O S I U M F O R
T E S T I N G A N D F A I L U R E A N A LY S I S
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NOVEMBER 1–5, 2015
OREGON CONVENTION CENTER • PORTLAND, OR, USA
C A L L F O R PA P E R S
ABSTRACT DEADLINE: APRIL 17, 2015
Sponsored By:
ISTFA 2015 CFP for 2014 Final Program.indd 1
10/13/14 1:22 PM
28
Education Short Courses
Full Day Course Price*
EDFAS Member - $499
EDFSD Non-Member - $625
Student - $199
Education Short Courses will be held
at the Hilton Americas – Houston on
Saturday, November 8, 2014.
Half Day Course Pricing*
EDFAS Member - $249
EDFSD Non-Member - $375
Student - $99
AS6171 Counterfeit Electronics Detection Test Techniques and Implementation
Instructor: Bhanu Sood
Time: 8:30 a.m. – 12:30 p.m.
Room: 337 B
Course Description: This short course being offered at ISTFA 2014 begins with a brief introduction to the electronic parts supply
chain, the sources of authorized and unauthorized parts and overview of the diverse counterfeit part creation techniques. The
tools, techniques and procedures for the non-destructive, destructive and analytical technique that are part of AS6171 will be
discussed. Also included are discussions of minimum level of inspection, sampling plan based on tier level of accepted risk, and
reject criteria. Attendees will also get an overview of the certification and training requirements for each AS6171 inspection technique. In the end, authentication tools (such as DNA marking, dye pigments and barcodes) will be discussed.
Fault Isolation
Instructor: David Vallett
Time: 8:30 a.m. – 4:30 p.m.
Room: 338
Course Description: Technology development, yield learning, and reliability engineering are critical to the microelectronics and
now nanoelectronics business. All are highly dependent on fault isolation and failure analysis. With higher density packaging,
transistor counts into the billions, scaling below 22 nanometers, and new materials however, analysis of root cause of failures is
becoming exceedingly challenging. This course examines both traditional and recently developed tools and techniques for isolating defects on simple and advanced ICs and microelectronic devices.
Packaging FA
Instructor: Becky Holdford
Time: 8:30 a.m. – 4:30 p.m.
Room: 337 A
Course Description: The course will teach the basics of package failure analysis including common package construction, the
most common fault isolation tools/techniques, common fail modes/mechanisms, die access techniques for plastic and hermetic
packages, and some case studies.
* Separate Registration Required
29
Author Index
A
Ackerman, R...............................25
Albert, D........................................7
Altmann, F......................... 8, 16, 27
Alton, J........................................19
Alves, S........................................27
Alvis, R................................... 23, 27
Anant, V.......................................22
Ang, G.B........................... 11, 21, 22
B
Bandaru, P..................................23
Barbeau, S..................................19
Barbian, E...................................25
Barton, D.L....................................7
Berggren, K.................................22
Bernhard-Hofer, K........................7
Bescup, J.....................................20
Beutler, J.....................................15
Binczak, S...................................21
Biring, S.......................................22
Bockelman, D.............................14
Bodoh, D.J............................ 11, 14
Boit, C...........................................8
Boon, A.G.............................. 19, 23
Borrel, N......................................22
Boscaro, A...................................21
Brockett, S..................................25
Bruce, M.................................. 8, 15
C
Cao, L..........................................17
Carleson, P..................................25
Castignolles, M..................... 11, 27
Cawthorne, A.B...........................13
Celi, G..........................................11
Champeix, C................................22
Chan, L........................................22
Chang, Y.-P..................................21
Chapman, F.................................14
Che, Y...........................................17
Chef, S.........................................21
Chen, C.Q.......11, 18, 19, 22, 23, 26
Chen, H.C....................................21
Chen, L........................................25
Chen, S........................................14
Chen, Y.........................................17
Chien, W.-T.K...............................25
Chinone, N..................................24
Chithambaram, S.......................21
Cho, Y...........................................24
Chrastecky, T...............................27
Chu, C.H......................................22
Cilingiroglu, T.B.................... 12, 24
Clement, J...................................15
Cole, Jr., E.I......................... 7, 8, 15
Cordes, A.....................................18
Crawford, T..................................14
D
D’Aleo, C........................................8
Dawood, M.K................... 18, 24, 26
Dayanand, N...............................11
Deslandes, H......................... 12, 15
deWolf, I......................................13
DiBattista, M................... 23, 26, 28
Dickson, K...................................14
Dluhos, J.....................................16
Domengès, B...............................14
Donnet, D....................................25
Drennan, M.................................27
Du, A............................................26
Duan, S............................ 25, 26, 27
Dudit, S................................. 11, 15
Dutertre, J.-M..............................22
Dyer, T..........................................18
Hollerith, C..................................16
Hooghan, B.................................21
Hrncir, T.......................................16
Htun, T.........................................25
Hua, Y.................................... 17, 19
Huang, Y................................ 24, 26
I
Igarashi, M...................................19
Infante, F.....................................13
J
Jacob, P................................... 9, 27
Jacquir, S....................................21
James, S................................ 18, 24
Jatzkowski, J..............................27
Jeffers, A.....................................13
JH, L............................................18
Johnson, G.M................................8
E
Eiles, T.M.....................................24
Emergo, R...................................25
Er, E.............................................19
Erington, K............................ 11, 14
Estores, R....................................25
K
Kane, T..........................................9
Kapilevich, I................................22
Karki, S........................................28
Karl, W.C......................................12
Kearney, I....................................22
Keim, M.........................................7
Kelley, R................................ 13, 23
Kelly, R........................................28
Kerisit, F......................................14
Khoo, G.......................................14
Khoon, E.C.B...............................27
Kim, H.........................................18
Kim, J..........................................18
Kim, K..........................................22
Kim, Y...........................................22
Kleindiek, S.................................18
Knuffman, B................................23
Kolasa, T......................................21
Komrowski, A..............................19
Konkol, N....................................22
Konopka, J.F...............................22
Konrad, J.....................................12
Kopecek, J..................................16
Kor, H.B.......................................14
Krueger, B...................................16
Kussener, E.................................22
F
Falk, R.A......................................20
Faraby, H.....................................23
Farrell, C......................................11
Feng, H.................................. 24, 26
Forte, D.......................................13
Frantz, G......................................10
G
Gagliolo, N..................................13
Gan, C.L.......................................14
Garrahan, S.................................13
Gaudestad, J......................... 12, 13
Giannuzzi, L.A.............................22
Giridharagopal, R.......................24
Glowacki, A...................................8
Goh, S.H............................ 7, 21, 26
Goldberg, B.B........................ 12, 24
Goodrich, C.................................28
Goulet, D.....................................24
Goxe, J................................... 11, 27
Graupera, T.................................26
Grogan, M.D.W............................12
Gspan, C......................................17
Gunawardana, M.................. 11, 22
Gwee, H.Y.....................................14
L
H
Lam, J.C... 18, 19, 21, 22, 23, 24, 26
Lange, G......................................14
Lawrence, D.F.............................12
Lee, E...........................................22
Lee, H.-T......................................22
Lee, J.H.......................................18
Lee, K...........................................18
Lee, S...........................................22
Lee, Y...........................................22
Lepuschenko, W.........................24
Leslie, N.......................................11
Lewis, D.......................................11
Li, J..............................................17
Haber, T.......................................17
Hamilton, P.................................25
Hand, S.M....................................18
Harber, K.....................................27
Hayn, M.......................................28
He, R............................................24
Herold, R.....................................16
Herschbein, S.B............................8
Hiller, J.M....................................22
Hladik, L......................................16
Höche, T......................................23
Hoe, W.L.C...................................22
30
Li, M................................. 25, 26, 27
Li, S................................................7
Li, X..............................................17
Lim, S.H.......................................22
Limin, P.S.............................. 18, 24
Lin, C.-C.......................................12
Lin, J.-C.......................................21
Lisart, M......................................22
Liu, B...........................................19
Liu, Q...........................................14
Liu, S.-Y........................................21
Livengood, R.................................8
Lotharukpong, S.........................17
Low, G.R.......................... 18, 24, 26
Lundquist, T.R................. 11, 12, 22
Luo, J.-S......................................22
Ly, K.............................................27
Lyons, D.......................................26
M
Madala, S....................................13
Mai, Z.H.... 18, 19, 21, 22, 23, 24, 26
Martin, J......................................21
Masuda, M...................................17
McClelland, J.J............................23
Miller, M.A....................................15
Moghe, A.....................................13
Moon, S.J....................................21
Moore, T.M....................................7
Morrison, T..................................13
Moyal, E.......................................16
Mulder, R.E....................................7
Myers, T.........................................7
N
Nagalingam, D...................... 21, 22
Najarian, M........................... 19, 25
Nakamura, T...............................24
Naumann, F................................16
Neo, S.P..................... 11, 19, 21, 22
Newton, B...................................18
Ng, H.P................................... 19, 21
Nguyen, H...................................26
Niu, B..................................... 14, 24
Nuez, D.................................. 13, 19
O
Obein, M......................................14
Orozco, A.....................................13
P
Parrassin, T............................ 11, 15
Patterson, O.D............................19
Peng, N.H.............................. 22, 23
Perdu, P................................. 11, 21
Phoa, S.L.....................................22
Q
Qian, Z.........................................15
Quah, A.C.T...........11, 19, 21, 22, 23
R
Rahajandraibe, W.......................22
Ramsay, E............................. 12, 22
Author Index
Ravikumar, V...............................22
Ray, V...........................................28
Reid, D.T......................................11
Reverdy, A............................. 11, 15
Richardson, C....................... 12, 27
Rowlett, C...................................13
Rue, C..........................................25
S
Sabbineni, P................................22
Sanchez, K..................................21
Sanchez, R..................................25
Sarafianos, A...............................22
Scheffler, C....................................8
Sebastian, E................................26
Seng, T.Y......................................23
Senowitz, C........................... 23, 26
Serrels, K.A..................................11
Shah, S........................................19
Shahbazmohamadi, S................13
Shao, J........................................27
Shehata, A.B......................... 12, 22
Shin, J.........................................18
Siah, Y.W......................................14
Sias, K.C......................................16
Sidorov, O............................... 8, 25
Simon-Najasek, M......................27
Skvortsov, D................................22
Song, P............................ 12, 21, 22
Song, Z........................................19
Staller, K.D..................................22
Stark, C........................................22
Steele, A.V....................................23
Stellari, F......................... 12, 21, 22
Stevens, J....................................15
Stoker, D......................................15
Subramanian, S...................... 8, 27
Suh, W.........................................18
Sung, H........................................22
Sunter, K.....................................22
V
T
W
Vallet, M................................ 11, 15
Vallett, D................................. 8, 12
Vanderlinde, W.E..........................8
VanVianen, A...............................18
Vedagarbha, P.............................11
Vercruysse, P...............................25
Versen, M.....................................28
Villareal, K...................................25
Vollrath, R...................................26
Tan, H.............................. 18, 24, 26
Tan, P...........................................13
Tan, P.K........................... 18, 24, 26
Tan, S............................................8
Tateyama, H................................22
Tehranipoor, M...........................13
Templeton, T.J............................26
Teo, A..................................... 19, 23
Teshima, J...................................16
Theodore, N.D............................18
Torkashvan, K.............................13
Tsai, C.Y........................................21
Tsang, Y.L.............................. 18, 27
Tuysuzoglu, A..............................12
Walter, J......................................17
Wang, D................................. 24, 26
Wang, T........................................13
Wang, X.-D...................................18
Want, N.......................................19
Weber, T......................................13
Weber, Y................................. 11, 27
Weger, A................................ 12, 22
Weger, A.J....................................21
Wei, M.S.......................................22
Wellstood, F.C.............................13
Wen, Y..........................................23
Wettermann, R...........................17
Wilshaw, P...................................17
Won, J.........................................18
Wong, E.......................................13
Wu, C..................................... 14, 22
U
Ünlü, S................................... 12, 24
Uyar, A.........................................24
31
Wu, M..........................................17
Wu, Q...........................................19
X
Xie, S............................................19
Xu, Q............................................19
Y
Yang, M.................................. 18, 23
Yap, M.H.......................... 18, 24, 26
Yeoh, B.L.....................................21
Yip, K.H............................ 19, 21, 23
Yoon, M........................................18
Yu, H...................................... 25, 27
Yurt, A.................................... 12, 24
Z
Zhang, Q.....................................25
Zhao, S.P............................... 19, 25
Zhao, Y.Z............................... 24, 26
Zhou, Y............................ 17, 24, 26
Zhu, J.............................. 19, 25, 26
Zie, T............................................21
Zirilli, T........................................27
Zumwalt, S..................................18
Notes
32
Notes
33
Show Directory
EXHIBIT HOURS
Expo Hall B3
Tuesday, November 11, 2014– 9:00 a.m. – 6:00 p.m.
Refreshment Break - 9:40 a.m. – 9:55 a.m.
Lunch – 12:00 p.m. – 1:30 p.m.
Refreshment Break – 2:20 p.m. – 2:35 p.m.
Expo Networking Reception – 4:00 p.m. – 6:00 p.m.
Wednesday, November 12, 2014– 9:30 a.m. - 3:30 p.m.
Refreshment Break - 10:00 a.m. – 10:15 a.m.
EDFAS General Membership Meeting and Luncheon – 12:15 p.m. – 1:30 p.m.
Exhibitor Dessert Reception, Poster, and Video Contest – 1:30 p.m. – 3:30 p.m.
Because there may have been some late changes in booth assignments, some exhibitors may have
a different booth number than was shown on their invitations and advertising. Please check this
Directory for the most-up-to-date listings, as well as onsite signage.
Reasonable precautions have been taken to avoid errors and omissions from this Directory, but ASM
International does not guarantee listings herein and shall not be responsible for errors or omission in
this Directory.
34
SPONSORS
Thank You To Our 2014 Sponsors!
Corporate Sponsor:
Sponsors:
Media Sponsor:
EDFA eNews
35
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Removes hydrocarbons in-situ from SEMs,
FIBs, TEMs and other analytical tools —
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Before cleaning
After GV10X cleaning
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Exclusive 5 mTorr plasma and >20W power generates greater
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species, sputtering or heat.
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See us at Booth #508
1 (415) 566-5774
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www.ibssgroup.com
10/10/14 4:32:34 PM
Tools of the Trade Tour
What: Demonstrations of the latest products and services. Learn useful information
and see firsthand the latest tools in the industry. Take part in the parallel
technical session and see equipment in action right on the show floor…
Where: Expo Show Floor—Expo Hall B3
When: Monday, November 10th
Time: 5:00-6:45 p.m.
Scheduled Tours:
Bruker Optics
Checkpoint Technologies, LLC
E.A. Fischione Instruments, Inc.
HiLevel Technology, Inc.
Hitachi High Technologies America, Inc.
LatticeGear LLC
Mentor Graphics
RKD Engineering
SPI Supplies
ULTRA TEC Manufacturing, Inc.
Varioscale, Inc.
(Must Pre-Register to Attend – Space is Limited – First Come, First Served)
Booth #: 309
Product Name: X-Prep Mechanical Milling Machine
Product Description: Automated, 5-axis mechanical milling machine for failure analysis (backside/frontside thinning and
delayering), die extraction, materials research, and more.
Overview of Demonstration: Tour attendees will be able to see a demonstration of the X-Prep removing a specific amount of
material from the backside of a chip package. The X-Prep is not new – but has exciting new milling capabilities such as 3D contouring
and removal of +/- 5 µm remaining silicon thickness for SIL requirements. These capabilities have been unavailable on most milling
machines in our industry!
Bruker Corporation
Booth #: 403
Product Name: NEW: LUMOS—Stand Alone FT-IR Microscope with Full Automation
Product Description: LUMOS is a stand-alone FT-IR microscope with full automation. It is designed
to combine best performance for visible inspection and infrared spectral analysis with a simple and
easy-to-use interface. Due to the motorization of all moveable components inside the LUMOS, the
system provides a high degree of automation. The intuitive software of the LUMOS guides the operator step by step through the
process of data acquisition. The user interface presents only those options which may be applied next.
Overview of Demonstration: In this demonstration we will show the high performance and ease of use the Lumos FTIR Microscope
can add to your Laboratory. The system utilizes many automated features that we will demonstrate including, discrete point
analysis, line mapping, and large area chemical images using Reflection, Transmission and even ATR Mapping. The high quality
visual observation of the Lumos will also be on display, using the high resolution Digital camera that can take individual snap shots,
automated digital zoom, or large area visual images. By utilizing various visual techniques, like bright-field and visual polarization,
we will display the best way to collect and archive images with your Spectrum.
37
OptiFIB
Booth #: 203
Product Name: InfraScan™ ES-LW
Product Description: Checkpoint Technologies, LLC, designs and manufactures optical failure
analysis tools for the semiconductor industry. Checkpoint’s new InfraScan™ ES-LW, meets the
demands of lower power IC designs and architectures. Smaller geometries and lower voltages
IC’s require emission tools that see emissions further into the infrared regime than the traditional
InGaAs cameras.
Booth #: 224
Product Name: Model 1080 PicoMill™ TEM specimen preparation system
Product Description:The Model 1080 PicoMill™ TEM specimen preparation system combines an
ultra-low energy, inert gas ion source and a scanning electron column with multiple detectors to
yield optimal TEM specimen preparation.
Overview of Demonstration: Do TEM specimen preparation First Time Right. Join us for
a demonstration of the new Fischione Instruments Model 1080 PicoMill™ TEM specimen
preparation system. Experience firsthand the fully integrated solution for producing the highest
quality specimens possible for TEM imaging and analysis. The PicoMill system allows you to do TEM specimen preparation First
Time Right.
Booth #: 310
Booth #: 119
Product Name: The Hitachi SU5000 Field Emission Scanning Electron Microscope
Product Description: The SU5000, featuring a novel and revolutionary user interface called
the EM WIZARD, provides even novice users with optimum levels of resolution, repeatability,
and throughput. The advent of our new Automatic Axis Adjustment Technology restores the microscope to its “best condition” on
demand, yielding on-demand image optimization optimizing performance on the fly!
Overview of Demonstration: Hitachi is pleased to participate in this year’s Tools Tour at ISTFA 2014. Visitors to the booth can catch
a firsthand look at this game-changing revolutionary software interface (EM WIZARD) and its patented technology on Hitachi’s
latest addition to its product portfolio, the SU5000 FE-SEM, equipped with the innovations in field emission imaging our customers
have come to expect. Expert or Novice, the SU-5000 and the EM Wizard puts Hitachi’s superior nano-scale imaging capabilities at
everyone’s fingertips. The robust “draw-out” specimen chamber of the SU5000 accommodates large specimens (~200 mmf, ~80
mmH), and the instrument’s rapid sample exchange allows its user to go from evacuation to observation in 3 minutes or less! An
on-site applications engineer will be available for demonstrations and to answer specific questions.
LatticeGear, LLC.
Booth: 521
Product Name: LatticeAx 300, Large Sample Platform for LatticeAx, Small Sample
Cleaver
Cleaving Tools
Product Description: The LatticeAx 300 is LatticeGear’s highest performance
www.latticegear.com
cleaving system. The Ax is integrated with a vision package with 5 μm optical
resolution cleaves with ±10μm accuracy in <5 minutes. NEW Large Sample
Platform for the LatticeAx and Small Sample Cleaver accessories expand cleaving to full 300 mm wafers and samples as small as 4
mm.
Overview of Demonstration: LatticeGear has the tools for those needing a simple, quick and accurate way to cleave SMALL samples
LARGE wafers at low cost. The LatticeAx 300 will be demonstrated cleaving large wafer pieces and very small samples using the NEW
accessories.
39
Revolutionary SEM Control
Debuted from Hitachi
EM Wizard Changes the Game
SEM operation, as you currently know it, is about to
change. Groundbreaking computer-assisted technology
from Hitachi, referred to as EM Wizard, offers a new
level of SEM operation and control. Expert or novice,
the result is now the same: Highest quality nano-scale
images at everyone’s fingertips!
Schedule a demo of the all new
Hitachi SU5000 FE‑SEM and
experience EM Wizard at:
Booth #119
Many More Exiciting New Products from Hitachi
•
Ion Milling Systems—Enhanced gun design for faster milling
without compromising sample integrity. New cryo system
available!
•
Tabletop SEM—World’s most popular tabletop SEM, the TM
Series, now with a NEW Ultra Variable Detector!
•
Atomic Force Microscope—Environmental control SPM for
measurement conditions including air, vacuum, and liquids.
IM4000Plus Cryo
AFM5300E
Inspire Innovation through Collaboration
*Hitachi is a registered trademark of Hitachi, Ltd. All other trademarks are property of respective owners. Copyright © 2014 Hitachi High Technologies America, Inc. All rights reserved.
2014-10Oct-ISTFA-SU5000.indd 1
www.hitachi-hta.com
800-548-9001
10/12/2014 1:53:43 PM
Mentor Graphics Corporation
Booth #: 117
Product Name: Tessent Diagnosis
Product Description: The Tessent Diagnosis software accelerates defect
identification in digital semiconductor devices. New for 2014 is cell-aware
technology that that enables diagnosis at transistor level. Failure analysis
engineers will now know in advance what to look for in PFA.
Overview of Demonstration: Attendees will be introduced to the diagnosis flow and see how Tessent Diagnosis software can be
used to identify several types of defects in digital semiconductor devices based on design and failure data. The focus will be on the
new transistor level (cell-aware) capability.
RKD Engineering
Booth #: 417
SPI Supplies
Booth #: 316
Product Name: Plasma Prep Reactive Ion Etcher
Product Description: The Plasma Prep RIE is a tabletop anisotropic plasma etcher designed
for package removal and sample preparation. Featuring 200 watts of continuous power,
the RF based system has a 10 inch diameter chamber. With a touchpad screen and dual gas
inputs, it is designed to work with a number of gasses.
Overview of Demonstration: We will be demonstrating the use of the system, as well describing the situations and applications it
is designed to handle.
ULTRA TEC Manufacturing, Inc.
Booth #: 109
Product Name: PEEC for ASAP-1 IPS
Product Description (50 words or less): PEEC for ASAP-1 IPS is a patent pending system upgrade
that uses electronic data, gathered from the polishing tip, to provide REALTIME through-silicon
characterization of the device under test (DUT) – thus achieving a specific remaining silicon
thickness (RST) in the low single digits, and below.
Overview of Demonstration: PEEC is suitable for dies which have already been thinned below 20 microns and offers PARAMETRIC,
PLOT and OSCILLOSCOPE modes to achieve a higher level of confidence than traditional “cut-image-then-cut-some-more”
techniques, by removing the need to continually transfer the part between polisher and microscope.
Varioscale, Inc
Booth #: 717
Product Name: VarioMill
Product description: VarioMill: Adaptive 5-axis CNC Tool that Grinds and Polishes advanced
package ICs. Continuous, sub-micron, 5-axis motion provides ultra-precise preparation
for CE and FA. In-situ measurement tracks shape and thickness as the curved part surface
changes during thinning. Automatic tool exchange enables multi-step processing from
rapid grind to final optical polish.
Overview of demonstration: We will be showing video clips of the tool in operation performing 5-axis CNC grinding, in situ
measurement with adaptive shape feedback, as well as tool exchange and polishing.
41
Exhibit Hall Floor Plan
42
Exhibit List
COMPANY
BOOTH #
Advanced Circuit Engineers, LLC...............................................719
Keysight Technologies...............................................................308
Agilent Technologies..................................................................610
Allied High Tech Products, Inc...................................................309
Angstrom Scientific Inc..............................................................220
Applied Beam.............................................................................616
Bruker Optics..............................................................................403
BSET EQ......................................................................................211
CAMECA Instruments, Inc...........................................................621
Carl Zeiss Microscopy, LLC.........................................................524
Carl Zeiss Microscopy, LLC.........................................................525
Checkpoint Technologies, LLC..................................................203
DCG Systems...............................................................................509
Digit Concept..............................................................................427
E.A. Fischione Instruments, Inc.................................................224
Ebatco.........................................................................................607
EDAX Inc......................................................................................724
Electron Microscopy Sciences...................................................527
Evans Analytical Group..............................................................304
EXpressLO LLC............................................................................608
FA Instruments Inc.....................................................................209
FEI Company...............................................................................402
Fraunhofer CAM .........................................................................518
Gatan, Inc....................................................................................204
Hadland Technologies...............................................................713
Hamamatsu Corporation...........................................................103
HDI Solutions - Hitachi...............................................................727
HiLevel Technology, Inc.............................................................310
Hitachi High Technologies America, Inc....................................119
HORIBA Scientific.......................................................................617
IEEE Reliability Society..............................................................718
Hysitron, Inc...............................................................................302
IR Labs........................................................................................627
ibss Group, Inc............................................................................218
JEOL USA, Inc.............................................................................213
JG & A Metrology Center............................................................619
Keyence Corporation.................................................................116
LatticeGear LLC..........................................................................521
Left Coast Instruments...............................................................417
COMPANY
BOOTH #
Leica Microsystems....................................................................609
Materials Analysis Technology, Inc............................................504
Meiji Techno America.................................................................613
Mentor Graphics.........................................................................117
Micromanipulator......................................................................721
MultiProbe, Inc...........................................................................303
Nanolab Technologies...............................................................421
Nanosurf Inc...............................................................................125
Neocera, LLC...............................................................................612
Nisene Technology Group..........................................................118
NIST/CNST...................................................................................625
Nordson DAGE............................................................................113
OKOS ..........................................................................................425
Olympus......................................................................................517
Oxford Instruments America.....................................................217
Precision Surfaces International...............................................126
Quantum Focus Instruments.....................................................110
Quartz Imaging Corp..................................................................225
RKD Engineering.........................................................................417
Sage Analytical Lab, LLC............................................................716
Robson Technologies, Inc..........................................................505
SAMCO, Inc. ................................................................................516
SEMICAPS....................................................................................424
South Bay Technology...............................................................720
Semitracks, Inc...........................................................................725
Sonoscan, Inc.............................................................................520
SPI Supplies................................................................................316
Synopsys Inc. .............................................................................519
Ted Pella, Inc..............................................................................127
TeraView.....................................................................................503
TMC Ametek................................................................................726
Tescan USA Inc...........................................................................325
Trion Technology........................................................................202
ULTRA TEC Manufacturing, Inc..................................................109
Varioscale, Inc. ...........................................................................717
WinTech Nano-Technology Services Pte. Ltd. ..........................124
XEI Scientific, Inc........................................................................327
YXLON Feinfocus.........................................................................502
Zurich Instruments AG...............................................................611
43
Picoammeter/Electrometer
Reinvented.
CONFIDENTLY MEASURE DOWN TO 0.01 fA AND UP TO 10 PΩ
The Keysight B2980A Series brings you features that will boost
measurement condence and unveil insights. Previously hidden
true signals now can be detected thanks to battery operation
for AC power line noise free measurement. Critical measurement
phenomenon won’t be overlooked, thanks to real-time histograms
and time-domain displays. And with setup integrity checker
software you can easily isolate issues. So start taking sensitive
measurements condently with the world’s most precise and
accurate graphical picoammeters/electrometers.
Keysight B2980A Series Picoammeters/Electrometers
Battery option models: yes
Real-time histogram and time domain viewer
Current measure: 0.01 fA - 20 mA
Resistance measurement: Up to 10 PΩ
Voltage source: Up to ±1000 V
Reading rate: Up to 20,000 rdg/s
See more details with histogram view.
View a video demo and more.
www.keysight.com/nd/b2980a_info
USA: 800 829 4444
CAN: 877 894 4414
Scan to view video demo.
© Keysight Technologies, Inc. 2014
Company Descriptions
Advanced Circuit Engineers, LLC
Booth #719
www.acellc.net
DCG Systems
Booth #509
DCG’s high-performance systems address critical issues in
semiconductor failure analysis, yield ramp, design debug and
transistor characterization, empowering innovation for IDMs, wafer
foundries and fabless chip companies worldwide.
www.dcgsystems.com
Agilent Technologies
Booth # 610
Agilent Technologies, a leader in chemical and materials testing,
provides a wide range of non-destructive testing solutions for
polymers and advanced materials. Agilent’s bench, microscopy, and
handheld FTIR solutions allows for the identification, contamination
analysis, or degradation determination of materials at the sample site.
www.agilent.com
Booth # 224
E.A. Fischione Instruments, Inc. designs, manufactures, distributes,
and services advanced microscopy and nanotechnology devices
for the global scientific community. Products include specimen
preparation devices, imaging detectors, and specimen holders for
electronics, energy, industrial, life sciences, and research.
www.fischione.com
Angstrom Scientific Inc.
Booth #220
Angstrom Scientific, Inc. is pleased to feature Kleindiek nanomanipulators and probe stations. In addition, we distribute Hitachi
TM3030 Tabletop SEMs, DENSsolutions In-Situ TEM holders, and
NanoMegas Precession Electron Diffraction systems, as well as
other principals in the electron microscopy market.
www.angstrom.us
Ebatco
Booth # 607
Ebatco is a leading service lab that provides failure analysis for
electronics, IC, and semiconductor industrial customers. Ebatco
specializes in working with surfaces, interfaces, ultra-thin films,
small volumes and miniaturized devices. Contact us for nanoscale
analyses, material characterization, surface contamination issues,
failure mode and root cause determination.
www.ebatco.com
Applied Beam
Booth #616
Bruker Corporation
Booth # 403
Bruker is a performance leader in life science and analytical systems.
For over 50 years, Bruker has provided the best technological solutions
for each analytical task. Trusted solutions include Optical and X-Ray
Spectroscopy and Microanalysis in key applications: life science &
materials research, nanotechnology, clinical research and more.
www.bruker.com
EDAX Inc
Booth #724
EDAX is a leading provider of materials characterization
encompassing Energy Dispersive Spectrometry (EDS), Wavelength
Dis¬persive Spectrometry (WDS), Electron Backscatter Diffraction
(EBSD) and Micro X-ray Fluorescence (XRF). The company designs,
manufactures, distributes and services hardware/software
solutions for a broad range of industries.
www.edax.com
Bset Eq
Booth # 211
BSET EQ manufactures gas plasma systems and develops key process
technologies used throughout the industries. Semiconductor related
applications include plasma cleaning, package decapsulation or
delayering for failure analysis, wafer level etching, and ashing or
descum processes in single wafer or batch processes.
http://www.bsetplasmas.com
CAMECA Instruments, Inc.
Booth #621
www.cameca.com
Electron Microscopy Sciences
Booth # 125
Electron microscopy sciences will have on display their complete
line of accessories, chemicals, supplies and equipment for all
fields of microscopy, biological research and general laboratory
requirements. As well as our full line of tools, tweezers and
dissecting equipment
www.emsdiasum.com
Booth # 524
As the world’s only manufacturer of light, X-ray and electron/ion
microscopes, ZEISS offers tailor-made microscope systems for
industry, materials research and academia. A well-trained sales
force, an extensive support infrastructure and a responsive service
team enable customers to use their ZEISS microscope systems to
their full potential.
www.zeiss.com/microscopy
Evans Analytical Group
Booth # 915
EAG is the leading commercial service organization uniquely
bringing the broadest set of Electrical Test, Failure Analysis,
Reliability and Materials Analysis expertise to a range of markets
and technologies. EAG can help reduce cycle time and cost of New
Microelectronic Product introduction and support your test and
analysis needs.
www.eag.com/mte
Booth #203
Checkpoint Technologies designs and builds industry lead-ing tools
and solutions for laser scanning, photon emission and laser probing
applications. Its proprietary SIL technology enables failure analysis
and debugging of the smallest IC structures. Its optics are designed
for applications at 32 nm and beyond with voltages as low as 600mV
www.checkpointtechnologies.com
EXpressLO LLC
Booth #608
Offers expert lift-out specimen preparation instrumenta-tion and
training with the new patent pending EXpressLO(TM) solution,
method, and grids. EXpressLO(TM) negates the need for a carbon
film, allowing for plasma cleaning, further FIB milling, and routine
backside manipulation for curtain-free FIB milling.
www.EXpressLO.com
46
Realtime_Convergence.indd 1
9/12/14 3:11 PM
Booth #310
HiLevel Technology, Inc. is a privately-held company headquartered in Irvine, California. We have been building world-class
test equipment since 1979. Our goal has always been to offer
the best systems at the most affordable cost, and to provide
unsurpassed support. HiLevel is classified as “small business”, and
the advantages of this tight-knit are reflected in our swift response
to customer needs.
www.hilevel.com
FA Instruments Inc.
Booth #209
FA Instruments provides solutions for FA with SIFT (Stim-ulus
Induced Fault Test) and TOFSIFT (Time of Flight SIFT). We are
innovators improving on traditional tools such as OBIRCH @
1240nm and Emission Microscopy, including a wide range of lab
services on our equipment. www.fainstruments.com for more info
and access to past publications/patents.
www.fainstruments.com
FEI Company
Booth # 402
Get accurate, high-quality answers in the lab or in the fab for
optimizing IC design and production ramp. Industry-leading FEI
sample preparation, imaging and analysis solutions combined with
in-depth application expertise help you successfully perform electrical
fault isolation and failure analysis, design improvements, reduce
yield loss, and accelerate time-to-market for electronic devices.
www.fei.com
Booth # 119
Hitachi High Technologies America provides technologically
advanced imaging solutions to the materials science, biological
research, and academic and industrial manufacturing sectors. Our
innovative and reliability-proven instrumentation includes SEM,
analytical and biological TEM, dedicated STEM, FIB, Ion Milling
instrumentation, Atomic Force and Scanning Probe microscopes,
tabletop microscopes, and microanalysis sample prep systems.
www.hitachi-hta.com
Fraunhofer CAM
Booth # 518
Based on twenty years of experience in microstructure diagnostics
and material assessment for semiconductor technologies,
microelectronic components, microsystems and nano-structured
materials, Fraunhofer CAM is tying the entire flow from nondestructive defect localization to high precision target preparation
right up to cutting edge nanoanalytics supplemented by micromechanical testing and numerical simulation.
http://www.cam.fraunhofer.de/
HORIBA Scientific
Booth #617
www.horiba.com/scientific
ibss Group, Inc.
Booth #218
ibss Group, Inc. developed and produced the GV10x, a new paradigm
in situ downstream plasma asher. Competitively priced, the GV10x
Downstream Asher reduces carbon and hydrocarbon contamination
10 to 20 times more effectively than traditional methods, at vacuum
pressure safe for TEM operation.
www.ibssgroup.com
Gatan, Inc.
Booth # 204 Gatan designs and manufactures instruments and
products for advanced microelectronics testing and analysis in
electron microscopy. Gatan’s products are used in a broad range
of failure analysis applications, including those for semiconductors
(micro- and nano-electronics), nano-materials, and optoelectronic
devices.
www.gatan.com
IEEE Reliability Society
Booth # 718
The Reliability Society is a technical Society within the IEEE, the
world’s leading association for the advancement of technology.
We are a volunteer group of professionals engaged in assuring
reliability in the engineering disciplines of hardware, software, and
human factors. The RS is focused on the broad aspects of reliability.
rs.ieee.org
Hadland Technologies
Booth #713
Hadland Technologies provides high-quality, 3-D inspection
services using X-ray computed tomography for use in research
and development, failure analysis, and academia. X-ray CT is
a nondestructive technique useful for material segmentation,
porosity/inclusion analysis, geometric measurement, and defect
detection. The company has over 20 years of experience in
microfocus X-ray technology.
www.hadtek.com
IR Labs
Booth # 627
IRLabs is a subsidiary of Infrared Laboratories; a premier designer,
supplier, and integrator of cryogenic systems, Infrared Detectors, IR
and NIR low light level imaging for astronomy, aerospace, IR and
Photon Emission Microscopes for semiconductor applications,
founded 1967.
irlabs.com
Hamamatsu Corporation
Booth # 103
Hamamatsu Corporation is the North American subsidiary of
Hamamatsu Photonics K.K. (Japan), a leading manufacturer of
devices for the generation and measurement of infrared, visible, UV
light, and x-rays. We offer specialized systems for semiconductor
failure analysis and other applications. We also offer photomultiplier
tubes, photodiodes, image sensors, cameras, and light sources.
www.hamamatsu.com
JEOL USA, Inc
Booth # 213
High resolution electron microscopes and tools for failure
analysis, materials research, product inspection, nanotech and
semiconductor R&D. Research-grade LV and FE-SEMs for nano
observation/analysis; TEMs for atomic level resolution imaging &
high speed mapping; Surface analyzers for characterization; New
benchtop EDXRF spectrometer for elemental composition; SEM and
TEM sample prep.
www.jeolusa.com
HDI Solutions – Hitachi
Booth #727
www.hdi-solutions.com
48
Fault Isolation Precision ITRS 2011
Line-width resolution < 100 nm
14 nm technology node qualified
SEMICAPS Aplanatic SIL - being used by
a leading manufacturer for the 14 nm
technology node
Resolution of better than 200 nm pitch
(100 nm linewidth)
SIL for imaging silicon wafer with a full
backside thickness of up to 800 μm
SIL can be used for both inverted and
upright systems
World’s Best Aplanatic SIL
Click and move feature
JG & A Metrology Center
Booth #619
www.jgarantmc.com
Meiji Techno America Microscopes
Booth # 613
Meiji Techno Co., Ltd. is the third-largest manufacturer of optical
microscopes in Japan. Meiji Products come Limited Lifetime
Warranty and is 100% MADE IN JAPAN. Meiji microscopes are built like
a tank. Meiji Techno America has 80 different models that can easily
be outfitted with a variety of cameras.
www.meijitechno.com
Keyence Corporation
Booth #116
With over 20 years of development experience, Keyence
Corporation is the world leader in digital microscopes and video
microscopy systems. Offering four different microscope models
for both industrial and life science research, these all-in-one
units are designed to overcome the inadequacies of conventional
microscopes and measurement systems.
www.keyence.com/usa.jsp
Mentor Graphics
Booth #117
Software based yield inprovement. Mentor Graphics pro-vides
comprehensive solutions for yield analysis, diagnosis, debug and
characterization. For more information about how to leverage
diagnosis of DFT based product test results to accelerate failure
analysis and understand the cause of systematic yield, visit Mentor
Graphics.
www.mentor.com
Keysight Technologies
Booth # 308
Keysight Technologies, Inc. is a global electronic measurement
technology and market leader helping to transform its customers’
measurement experience. Keysight provides electronic
measurement instruments and systems and related software,
software design tools and services used in the design, development,
manufacture, installation, deployment and operation of electronic
equipment.
www.keysight.com
Micromanipulator
Booth #721
The first name in analytical probing, Micromanipulator delivers the
tools and life cycle support the semiconductor industry depends on.
Micromanipulator invented analytical probing in 1956. Since then
we’ve established a significant global presence with a substantial
product installation base.
LatticeGear, LLC.
Booth # 521
LatticeGear provides sample preparation solutions that offer high
productivity and throughput enabling customers to obtain superior
SEM and analytical results. Its cleaving tools and accessories
offer a low cost of ownership with a high return on investment
for semiconductor, solar and general materials laboratories.
LatticeGear’s flagship product is the LatticeAx cleaving system.
www.latticegear.com
MultiProbe
Booth # 303
Hyperion, the world’s most advanced nanoprober, is an essential
electrical fault localization tool for today’s most demanding FA labs.
Proven at 10nm, Hyperion is capable of detecting defects invisible
to other fault isolation techniques (with superior SCM, C-V, Pulsed IV
and PicoCurrent measurements) while enhancing throughput and
ease of use.
www.multiprobe.com
Left Coast Instruments
Booth #417
Left Coast Instruments exclusively offers the entire RKD Engineering
product line worldwide. Our network of representatives and
international distributors are highly knowledgeable in all aspects of
these products and their applications.
www.leftcoastinstruments.com
Nanolab Technologies
Booth #421
Nanolab Technologies’ new analytical lab provides opti-mum
performance for all analytical services including: TEM/STEM/
EELS;SEM;EDS;XPS;DBFIB;CIRCUIT EDIT FIB;FA (electrical and
physical); CSAM;2 AND 3D XRAY, etc.
www.nanolab1.com
Leica Microsystems
Booth # 609
Leica Microsystems’ focus is to support our customers’ pursuit of
the highest quality end result. Leica Microsystems provide the best
and most innovative imaging systems to see, measure, and analyze
the microstructures in routine and research industrial applications,
materials science, quality control, forensic science investigation,
and educational applications.
http://www.leica-microsystems.com/
Nanosurf Inc.
Booth #125
www.nanosurf.com
Nisene Technology Group
Booth #118
Nisene Technology Group is committed to providing innovative, high-quality products that address the changing needs
of failure analysis professionals. Our mission is to continue to
provide products and services that meet the requirements of
our customers, and to offer fast, precise, reproducible sand safe
package deprocessing.
www.nisene.com
Materials Analysis Technology, Inc.
Booth #504
MA-tek is a world leading laboratory in Materials Analysis (MA). MAtek has successfully expanded to provide Failure Analysis(FA) and
Reliability Test(RT) services as well. Up to now, MA-tek has set up 5
laboratories and 1 sales office worldwide, providing around-theclock services in logistic support and technical services.
www.ma-tek.com
NIST/CNST
Booth #625
www.nist.gov/cnst
50
QuantumScope
TM
Failure Analysis Microscopes
emmiTM Photoemission, XIVATM LSIM, and Thermal-HS Infrared
Hot Spot Detection integrated into a core microscope solution
µK hot spot sensitivity
common on Thermal-HS
Direct lens-to-sensor coupling allows installation of MWIR
Thermal-HS hot spot detection on same microscope as
NIR techniques XIVATM LSIM and emmiTM photoemission.
Unique design allows overlay of highest resolution possible
reference images to highest sensitivity data images for all
techniques.
Thermal-HS Hot Spot
detection sensitivity
driven by QFI’s unique
Modulation Mode and
new Pulse Sampling
Thermography (PST)
Mechanical Platform Solutions — LabWalkerTM portable, probe station, ATE docking
QFI QuantumScopeTM is
the most sensitive and
efficient F.A. microscope
available for detecting:
Portable LabWalkerTM creates
bridge between applications
and labs.











ohmic shorts
impedance issues
leakage currents
leaky capacitors
oxide defects
damaged junctions
resistive vias
CMOS latch up
ESD damage
dynamic failures
speed path issues
Quantum Focus Instruments Corporation
QuantumScopeTM in probe
station configuration offers
ultimate F.A. lab efficiency.
2385 La Mirada Drive • Vista CA 92081
Phone: +1 (760) 599-1122
Fax: +1 (760) 599-1242
e-mail: [email protected]
http://www.quantumfocus.com
Quartz Imaging Corporation
Booth # 225
Quartz Imaging Corp. provides Specialized Solutions for Electronic
Device Labs & Analysis. Quartz FA-LIMS is the only Laboratory
Information Management System build specifically for Failure
Analysis and Material Characterization Labs. RE-LIMS is designed
for Reliability and QA Labs. PCI-AM version 2.0 Automated
Measurement software is designed for semiconductor features.
www.quartzimaging.com
Neocera, LLC
Booth # 612
Magma Electrical Fault Isolation is a dual magnetic field imaging
system that can find Shorts, Leakages (Magnetic Current Imaging)
& Opens (Space Domain Reflectometry) with a sensitivity of 500nA
and with a front side die resolution of less than 500nm; making it
the best nondestructive 3D Fault Isolation tool.
www.neocera.com
Nordson DAGE
Booth # 113
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN)
manufactures and supports a complete range of award winning
X-ray inspection systems and bondtesters for the PCBA and
Semiconductor industries which are recognized as the Industry
Standard. The excellence of their engineered products is at the core
of their success.
www.nordsondage.com
RKD Engineering Corporation
Booth # 417
RKD Engineering Corporation designs and manufactures
Semeconductor Test Equipment. Elite Etch, Elite Etch-Cu, Elite
Etch Cu ESD, MicroMill, NanoPrep w/MountPlate, basic kit and
one device kit, MountPlate, NanoMill, UltraPrepII with pneumatic
backlash compensation Includes MountPlate,basic kit and one
device kit UtraPrepII w/MountPlate basic kit and one device kit.
Warranties provided.
www.rkdengineering.com
OKOS
Booth #425
Providing comprehensive solutions for integrity assessment and
failure analysis of Semiconductor Packages, OKOS is a premier
manufacturer of custom designed and precision engineered
systems and components for Scanning Acoustic Microscopy.
Robson Technologies, Inc.
Booth #505
Robson Technologies Inc. specializes in the design, manu-facture,
and assembly of customizable hardware for testing IC packages,
SoC modules, PCBs, and other electronics. Our parts are used for
most test applications in labs worldwide. Test sockets, DUT boards,
test fix¬tures, and peripherals all work together to provide a turnkey solution.
www.testfixtures.com
Olympus
Booth # 517
Olympus Scientific Solutions Americas, a part of the global Olympus
life science and industrial instrumentation business, delivers
solutions for clinical, educational, and research microscopes,
nondestructive testing equipment, and analytical instruments.
Designed to contribute to the safety, security, quality and
productivity of society, Olympus strives to enhance people’s lives
every day.
https://www.olympus-ims.com
Sage Analytical Lab
Booth # 716
Sage Analytical Lab is a world-class laboratory dedicated to
providing the best-in-class analytical techniques using state of
the art equipment for analyzing/diagnosing all levels of failures
in today’s advanced electronic devices. With decades of collective
practical expertise, we provide advanced procedures and methods
to analyze and expose various failure sites.
http://sagefalab.com/
Oxford Instruments America
Booth #217
Oxford Instruments provides leading-edge tools that enable
sample manipulation and materials characterization. Used on SEM,
TEM & FIB systems, our EDS, WDS and EBSD microanalysis tools are
used for failure analysis across a wide range of applications. Our
OmniProbe tools are used for nanomanipulation, fabrication and
sample lift-out.
www.oxford-instruments.com
Samco Inc.
Booth # 516
SAMCO provides a wide selection of etching systems for deprocessing semiconductor and related devices. We offer a variety
of cost-effective RIE and ICP etching systems for removal of
passivation, ILD and metal layers in packaged devices, individual
die, as well as for full 200 or 300 mm wafers.
www.samcointl.com
Precision Surfaces International
Booth #126
Quantum Focus Instruments Corporation
Booth # 110
QFI manufactures Failure Analysis (FA) and Temperature
Measurement Microscope Systems. Our modular QuantumScope
FA microscopes offer emmi photoemission, XIVA Laser Signal
Injection, and Thermal-HS MWIR hot spot detection. Temperature
measurement techniques include MWIR (InfraScope) and
thermoreflectance (T°Imager). QFI systems have earned a strong
reputation for flexibility, sensitivity, accuracy, and durability.
www.quantumfocus.com
SEMICAPS
Booth # 424
SEMICAPS is a developer and manufacturer of world-leading
fault localization and defect characterization equipment for the
semiconductor industry. With the semiconductor technology node
progressing towards 22 nm and 14 nm, more demand is anticipated
for our leading edge machines to help customers analyze their
advance node products.
www.semicaps.com
52
Distributed in the US by:
ProbeWorkstation
Extreme precision, virtually no drift
Ultra-compact, load-lockable platform with up to 27 axes
The high-end solution for in situ electrical probing on 14 nm
... and beyond!
See us at ISTFA
Booth 220!
Semitracks, Inc.
Booth # 725
Semitracks provides education and training to the semiconductor
and electronics industry. We provide basic courses up through
complex in-depth courses and consulting on a variety of topics from
processing to packaging to reliability to test and FA. We also provide
online training, custom websites, and webinars in these same areas.
http://www.semitracks.com
TESCAN USA Inc.
Booth # 325
TESCAN USA is a leading supplier in North America of Scanning
Electron Microscopes and Focused Ion Beam workstations. The
quality, performance and reliability of our products are the
foundation of our business, serving customers in academia,
industry and the government sector.
www.tescan-usa.com
Sonoscan, Inc.
Booth # 520
Sonoscan® is a leader and innovator in Acoustic Microscopy
(AM) technology. Sonoscan manufactures acoustic microscope
instruments and provides laboratory services to nondestructively
inspect and analyze materials, devices, components and products.
Sonoscan’s C-SAM® systems provide unmatched accuracy for
the inspection of products for hidden internal defects, such as
delamination, etc.
www.sonoscan.com
TMC Ametek
Booth #726
www.techmfg.com
Trion Technology
Booth # 202 Trion Technology is an original equipment
manufacturer of a wide variety of Plasma Etch (Reactive Ion Etch),
Strip, and Plasma Enhanced Chemical Vapor Deposition tools for
the Failure Analysis, Compound Semiconductor, MEMS and OptoElectronic markets.
http://www.triontech.com
South Bay Technology
Booth #720
www.southbaytech.com
ULTRA TEC
Booth # 109 Manufacturer and Worldwide supplier of SAMPLE
PREPARATION equipment & CONSUMABLES. Our ASAP-1 Selected
Area Preparation equipment has become the the de-facto standard
for BACKSIDE PREPARATION and MECHANICAL DECAPSULATION.
ULTRAPOL Advance offers a clear technical advantage for IC DEPROCESSING & CROSS-SECTION POLISHING.
See more at www.ultratecusa.com
SPI Supplies
Booth #316
Celebrating 40 years of excellence and innovation, SPI Supplies
is a worldwide leading manufacturer and distributor of sample
preparation equipment and consumable supply items for routine
operation of microscopy laboratories. The Plasma Prep III Low
Temperature Plasma Etcher offers a bench top solution for etching,
cleaning and preparation needs.
www.2spi.com
Varioscale, Inc. Booth #717
www.varioscale.com
Synopsys Inc.
Booth #519
Synopsys provides products and services that accelerate innovation
in the global electronics market. As a leader in electronic design
automation (EDA) and semiconductor intellectual property (IP),
Synopsys’ comprehensive, integrated portfolio of system-level,
IP, implementation, verification, manufacturing, optical and fieldprogrammable gate array (FPGA) solutions help address the key
challenges designers face such as power and yield management,
system-to-silicon verification and time-to-results.
www.synopsys.com
WinTech Nano-Technology Services Pte. Ltd. Booth #124
www.wintech-nano.com
XEI Scientific, Inc.
Booth #327
XEI Scientific, Inc. manufactures and sells anti-contamination
systems for the Electron Microscope Community. The Evactron(R)
De-Contaminator line was introduced in 1999 and provides a
faster and more complete cleaning process, solving hydrocarbon
contamination problems in electron microscopes and other high
vacuum systems.
www.evactron.com
Ted Pella, Inc.
Booth #127
Ted Pella, Inc. is the premier manufacturer and distributor of
consumable and specimen preparation equipment for electron
microscopy, AFM and FIB. Ted Pella, Inc. also offers the most
comprehensive selection of specimen mounts and holders for SEM
and FIB systems. Distributors for the complete line of compact
desktop Cressington EM coating systems.
www.tedpella.com
Yxlon FeinFocus
Booth #502
YXLON is the leading supplier of industrial X-Ray inspection and
CT solutions for the non-destructive testing of materials and
electronics. The Y.Cheetah and Y.Cougar combine proprietary
FeinFocus technology with advanced high-speed flat panel detector
technology. Within seconds, the systems adapt between inspection
tasks-failure analysis, research and development, process control
and product testing including QuickScan mode.
www.yxlon.com
TeraView
Booth #503
TeraView LTD is the world’s leading supplier of terahertz based
equipment such as imaging, spectroscopy, and time domain
reflectometry (TDR) systems; based in Cambridge, UK. The EOTPR
2000 was jointly developed with Intel to address the increasing
challenges in isolating faults in advanced IC packages using the
concept of THz based TDR technology.
Zurich Instruments AG
Booth #611
www.zhinst.com
54
300μm
0.2μm
Highest Productivity Failure Analysis
and Circuit Edit Solutions
• Highest Throughput TEM Workflows
• Highest Performance DualBeam Platforms
• 14nm Circuit Edit Solutions
• Revolutionary new Plasma FIB DualBeam
Discover more at FEI.com/Electronics
Products/Services Index
Laser Signal Injection Microscopy
Hamamatsu Corporation .................................................... 103
Analytical Probe Stations (instruments, equipment,
accessories)
Agilent Technologies ........................................................... 610
Electron Microscopy Sciences ............................................. 125
Evans Analytical Group ....................................................... 915
Fraunhofer CAM ................................................................... 518
JEOL USA, Inc ....................................................................... 213
Keysight Technologies ......................................................... 308
Meiji Techno America Microscopes ..................................... 613
MultiProbe ........................................................................... 303
Nordson DAGE ...................................................................... 113
Sage Analytical Lab ............................................................. 716
SEMICAPS ............................................................................. 424
ULTRA TEC ............................................................................ 109
Microanalysis and Digital Imaging Systems for Materials
Analysis
Asylum Research, an Oxford Instruments company .......... 217
E.A. Fischione Instruments, Inc. .......................................... 224
FEI Company ........................................................................ 402
Gatan, Inc. ............................................................................ 204
JEOL USA, Inc ....................................................................... 213
Leica Microsystems .............................................................. 609
MultiProbe ........................................................................... 303
Nordson DAGE ...................................................................... 113
Olympus ............................................................................... 517
Quartz Imaging Corporation ............................................... 225
TESCAN USA Inc. .................................................................. 325
ULTRA TEC ............................................................................ 109
Yxlon FeinFocus ................................................................... 502
Failure Analysis Laser Cutter: Micro Electronics Laser
ULTRA TEC ............................................................................ 109
Failure Analysis Test Sockets
Microhardness Testing
Ebatco .................................................................................. 607
Nordson DAGE ...................................................................... 113
FTIR Equipment
Bruker Corporation .............................................................. 403
ULTRA TEC ............................................................................ 109
Microscopes (scanning electron, acoustic, confocal, upright,
inverted & stereo)
Asylum Research, an Oxford Instruments company .......... 217
Carl Zeiss Microscopy, LLC .................................................. 524
FEI Company ........................................................................ 402
Fraunhofer CAM ................................................................... 518
Hitachi High Technologies America, Inc. ............................ 119
JEOL USA, Inc ....................................................................... 213
MultiProbe ........................................................................... 303
Neocera, LLC 612
Olympus ............................................................................... 517
Sonoscan, Inc. ...................................................................... 520
TESCAN USA Inc. .................................................................. 325
ULTRA TEC ............................................................................ 109
Image Analysis Systems & Software
Carl Zeiss Microscopy, LLC .................................................. 524
Gatan, Inc. ............................................................................ 204
IR Labs .................................................................................. 627
JEOL USA, Inc ....................................................................... 213
MultiProbe ........................................................................... 303
Neocera, LLC ........................................................................ 612
Nordson DAGE ...................................................................... 113
Olympus ............................................................................... 517
Quartz Imaging Corporation ............................................... 225
Semitracks, Inc. ................................................................... 725
Sonoscan, Inc. ...................................................................... 520
ULTRA TEC ............................................................................ 109
Yxlon FeinFocus ................................................................... 502
Infrared Thermal Imaging Systems: Thermal Inducing
Systems
IR Labs .................................................................................. 627
MultiProbe ........................................................................... 303
ULTRA TEC ............................................................................ 109
Professional Society/Trade Association PublisherScanning
IEEE Reliability Society ........................................................ 718
Specialized Objectives
Olympus ............................................................................... 517
ULTRA TEC ............................................................................ 109
56
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Products/Services Index
Specimen Preparation Equipment
FEI Company ........................................................................ 402
Fraunhofer CAM ................................................................... 518
Gatan, Inc. ............................................................................ 204
JEOL USA, Inc ....................................................................... 213
LatticeGear, LLC. .................................................................. 521
MultiProbe ........................................................................... 303
RKD Engineering Corporation ............................................. 417
Samco Inc. ............................................................................ 516
ULTRA TEC ............................................................................ 109
Fraunhofer CAM ................................................................... 518
JEOL USA, Inc ....................................................................... 213
Olympus ............................................................................... 517
Sonoscan, Inc. ...................................................................... 520
Trion Technology ................................................................. 202
ULTRA TEC ............................................................................ 109
Testing Labs
Ebatco .................................................................................. 607
Fraunhofer CAM ................................................................... 518
MultiProbe ........................................................................... 303
SEMICAPS ............................................................................. 424
Sonoscan, Inc. ...................................................................... 520
Yxlon FeinFocus ................................................................... 502
Surface Analysis Systems and Services
Ebatco .................................................................................. 607
FEI Company ........................................................................ 402
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59
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Complex Device Deprocessing
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The X-Prep™ 3D is a specialized CNC-based
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Organized By:

Advancing Technology Through Sample Preparation

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