medea+ 2t103 foremost

MEDEA+ 2T103 FOREMOST
European cooperation ensures global leadership
in microelectronics
Co-operation between semiconductor manfucturers, materials and equipment suppliers, and researchers
has ensured that the european microelectronics industry can continue to maintain its global position in
consumer electronics product design and manufacture. development of innovative higher performance but
less power hungry chips is a particular benefit for mobile phone and multimedea equipment producers.
Mass production of globally competitive
Initial work had been carried out in the EU
industrial
electronics equipment relies heavily on the
Sixth Framework Program (FP6) NANOCMOS
Louis
performance and availability of the latest
project, which screened appropriate materials,
STMicroelectronics.
microelectronics
EUREKA
device and interconnect architectures for
MEDEA+ microelectronics Cluster FOREMOST
45 nm CMOS logic. Complementary metal-
The consortium consisted of chipmakers,
project ensured that the advanced process
oxide-semiconductor (CMOS) technology is
materials and equipment producers, academia
modules and chip architectures required for
the dominant process for integrated circuit
and research institutes. A particular focus
full 45nm node CMOS logic and 50nm DRAM
manufacture worldwide and is used in
came from chipmakers Qimonda/Infineon
memory technologies are now being applied
microprocessors, microcontrollers, memory
in Dresden, Germany and the then Crolles 2
in European wafer-fabrication plants. This
devices and other digital logic circuits.
Alliance of Freescale, NXP Semiconductors
devices.
The
project enabled key European players in
facilities,”
Carbonero
of
explains
project
Jean-
coordinator
and STMicroelectronics in France, with the
semiconductor manufacturing to develop
these advanced technologies in line with
market demands, thus safeguarding and
boosting the position of Europe’s chipmakers
as well as their equipment and materials
suppliers on the world stage. The 45nm
technology developed in the first phase has
already become the core process worldwide
for mobile phone applications. Project results
We aimed at developing advanced process modules and
transistors architectures, and integrating them in a complete
process flow to demonstrate a full CMOS 45nm process
technology.
Jean-Louis Carbonero - STMicroelectronics, France
are also paving the way for future 32/28nm
nodes.
Strong support from national public
authorities
There is constant pressure from the consumer
FOREMOST was setup within EUREKA with
electronics market, particularly in mobile
strong support from the national public
devices, for ever smaller components offering
authorities in France, Germany and the
FOREMOST targeted the 45nm node for
ever greater performance while reducing
Netherlands, among others. “We aimed at
CMOS logic, dynamic RAM (DRAM) and non-
power
chip
developing advanced process modules and
volatile flash memory. Work was split into
production moving fast to the 45nm node – a
transistors architectures, and integrating
two phases: development and qualification
measure of circuit detail – Europe needed to
them
to
of the low power CMOS 45nm platform and
ensure it could mass produce semiconductors
demonstrate a full CMOS 45nm process
DRAM technology steps; and integration
to this new world standard.
technology
of improved solutions into main core low
aim of developing world-class production
standards at these centres to compete with
requirements.
With
global
in
a
complete
in
process
European
Doing business through technology
flow
manufacturing
the largest players around the world.
MEDEA+ 2T103 FOREMOST
power technology and in full DRAM process
partners have been able to join the worldwide
and IBS has increased its commercial network
integration.
IBM 32 nm CMOS foundation with promising
and extended it to Asia and the USA. Recent
chip fabrication activity in both Crolles and
financial investments and a partnership
Rapid transfer to industrial production
Dresden.
deal with a big equipment manufacturer
FOREMOST was highly successful with rapid
Research institutes CEA-LETI and Fraunhofer
transfer of the architectures and process
CNT were able to confirm their leading
modules developed into full-scale industrial
positions in electron-beam direct writing,
Tool-manufacturer
production at the chipmakers involved. As
applying
lithographic-writing
benefited from FOREMOST. For example
a result, STMicroelectronics was one of the
techniques for 200- and 300-mm wafers in
both AIXTRON and ASM are now marketing
first chipmakers worldwide able to offer 45
partnership with electron beam lithography
new systems and tools to underpin chip
nm low-power technology and the even more
specialist Vistec Electron Beam. In addition,
fabrication. And project participation has
highly integrated CMOS 40nm low-power
CEA-LETI has pushed development of the
enabled materials suppliers SAFC Hitech
process.
back-end-of-the-line
process
and Air Liquide to maintain their global
as one of the most mature technologies
leadership positions through their precursor
“This activity should lead to about 500 direct
to be established as a standard within
qualification conducted with the support
jobs in Crolles after production ramp-up of
STMicroelectronics. This process is now
of LMGP. UJF/LTM also anticipated advance
our CMOS 45nm/40nm technologies from
used by most major companies involved
gate-stack etching with narrow dimension
2010 on,” says Carbonero. “This will allow the
in interconnect development. CEA-LETI is
control.
major European mobile phone manufacturers
playing an important role in the IBM CMOS
to serve the market with advanced products
research consortium at Fishkill & Albany in
at the same time as their worldwide
the USA.
supported the building and sales of the first
advanced
chip-flow
high productivity PULSION tools.
partners
have
also
This activity should lead to about 500 direct jobs
in Crolles after production ramp-up of the CMOS
45nm/40nm LP technologies from 2010 on.
also
to
FOREMOST,
Thanks
mobile phone companies are expected to
Services (IBS) has been able to enter the
Overall, the strong international co-operation
use these processes. There is also interest
microelectronics equipment market with its
established in this EUREKA project has
for consumer electronics applications such
PULSION plasma immersion ion implanter
provided European electronics companies
as printers and set-top boxes, thanks to the
(PIII) tool, which offers high process stability
with early access to innovative world-class
lower cost and early availability.
at ultra low energy. IBS has already made
technology. It has also ensured that European
qualification
materials and equipment manufacturers can
demonstrations
Ion
at
Beam
Maintaining and expanding world leadership
competitors.” All major multimedia and
major
The success of FOREMOST is also paving the
customers and a PULSION tool has been
way for the development of 32/28 nm node
installed at CEA-LETI. Some 20% of low energy
technologies. As a result, several project
implanters could be plasma-immersion tools
Project participants:
Belgium (phase 1 only), France,
Germany, Greece (phase 1 only), Israel,
Italy, the Netherlands (phase 1 only),
United Kingdom
expand their worldwide markets.
Contact
STMicroelectronics
850, rue Jean Monnet
F-38926 Crolles
France
Jean-Louis Carbonero
Tel. +33 4 76 92 64 29
Mob. +33 6 72 81 84 43
Email: [email protected]
www.eurekanetwork.org
EUREKA is one of the leading platforms for R&D-performing entrepreneurs in Europe. Founded in 1985, EUREKA now unites 39 member
countries. Together, they promote international, market-oriented research and innovation through the support they offer to enterprises,
universities and research institutes. Results stemming from EUREKA projects are everywhere: gsm mobile phone technology; navigation
systems; smartcards to support mobile and electronic commerce; film special effects software for cinema; state-of-the-art medical
devices and technologies to monitor and limit environmental pollution.