mems technology - DSpace at CUSAT
Transcription
mems technology - DSpace at CUSAT
MEMS TECHNOLOGY SEMINAR REPORT Submitted by ARVIND KUMAR JHA in partial fulfillment for the award of the degree of BACHELOR OF TECHNOLOGY in COMPUTER SCIENCE & ENGINEERING SCHOOL OF ENGINEERING COCHIN UNIVERSITY OF SCIENCE & TECHNOLOGY KOCHI-682022 OCTOBER-2010 Division of Computer Engineering School of Engineering Cochin University of Science & Technology Kochi-682022 CERTIFICATE Certified that this is a bonafied record of the seminar work titled MEMS TECHNOLOGY Done by ARVIND KUMAR JHA of VII semester Computer Science & Engineering in the year 2010 in partial fulfillment of the requirements for the award of Degree of Bachelor of Technology in Computer Science & Engineering of Cochin University of Science & Technology Dr.David Peter S Head of the Division MS. PREETHA M S Seminar Guide Micromechanical System for System-on-Chip Connectivity ABSTRACT Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices . The associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for permanent, semi permanent or temporary interconnection of sub modules in a System-on-Chip implementation. The interconnection of devices using MEMS technology is described with the help of a hearing instrument application and related micropackaging. Division of Computer Engineering ,CUSAT 1 Micromechanical System for System-on-Chip Connectivity CONTENTS 1. INTRODUCTION 1 2. MEMS ACCOUSTICAL SENSOR ARRAY FOR A HEARING INSTRUMENT 5 BEAM FORMING USING MICROPHONE ARRAY 8 3. MEMS MICROPACKAGING SOLUTION 12 4. DIE TESTING CONFIGURATION 18 5. ADVANTAGES AND DISADVANTAGES 20 6. CONCLUSION 29 7. REFERENCES 30 8. BIBLIOGRAPHY 31 Division of Computer Engineering ,CUSAT 2 Micromechanical System for System-on-Chip Connectivity ACKNOWLEDGEMENT We take this occasion to thank God, Almighty for blessing us with his grace and taking our endeavor to a successful culmination. We extend our sincere and heartfelt thanks to our esteemed guide, Ms. PREETHA M.S. for providing us with the right guidance and advice at the crucial junctures and for showing us the right way. We extend our sincere thanks to our respected head of the division Dr. David Peter , for allowing us to use the facilities available. We would also like to thank the our class co-ordinator Mr. Sudheep Elayidom for his kind suggestion towards the initiative of this seminar.We would like to thank the other faculty members also,at this occasion. Last but not least we would like to thank friends for the support and encouragement they have given us during the course of our work. . ARVIND KUMAR JHA Division of Computer Engineering ,CUSAT 3 Micromechanical System for System-on-Chip Connectivity INTRODUCTION MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will b created. This will offer outstanding functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, hydrodynamics, biomedical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outstanding functionality. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal. It is a hearing instrument in which an array of acoustical sensors is used to provide dynamic directional sensitivity that can minimize background noise and reverberation thereby increasing speech intelligibility for the user. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal. Division of Computer Engineering ,CUSAT 4 Micromechanical System for System-on-Chip Connectivity The use of MEMS technology for permanent, semi permanent or temporary interconnection of non-compatible technologies like CMOS, BJT, GaAs, SiGe, and so forth into a System-on-Chip environment can be described using an example application. It is a hearing instrument in which an array of acoustical sensors is used to provide dynamic directional sensitivity that can minimize background noise and reverberation thereby increasing speech intelligibility for the user. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal. Division of Computer Engineering ,CUSAT 5 Micromechanical System for System-on-Chip Connectivity MEMS ACCOUSTICAL SENSOR ARRAY FOR A HEARING INSTRUMENT In this application an array of capacitive type sensors are used in a hearing instrument to provide dynamic directional sensitivity and speaker tracking and can be completely implanted in the ear canal. The directional sensitivity is obtained by the method of beam forming. The microphone array is developed using MEMS technology and which can be used to form beam to provide directional sensitivity. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal. Division of Computer Engineering ,CUSAT 6 Micromechanical System for System-on-Chip Connectivity BEAM FORMING USING MICROPHONE ARRAY The microphone array consists of nine capacitor type microphones arranged in a 3*3 array and utilizes the classical phased array technique for beam forming. In this technique, the relative delay or advance in signal reception is eliminated by applying a delay or advance is that the signal out puts from different microphones can be added to form a beam as shown in figure 1. It is also possible to steer the direction of the beam by providing additional delay factor that is equal to the negative of the relative delay to the out put of each microphone in the array when a signal arrives from that direction. Division of Computer Engineering ,CUSAT 7 Micromechanical System for System-on-Chip Connectivity Figure 1. Beam pattern of a transducer array: normal beam It is also possible to steer the direction of the beam by providing additional delay factor that is equal to the negative of the relative delay to the out put of each microphone in the array when a signal arrives from that direction. Figure 2. illustrates the beam steering concept. Division of Computer Engineering ,CUSAT 8 Micromechanical System for System-on-Chip Connectivity Figure 2. Beam pattern of a transducer array: steered beam Similarly, it is possible to form multiple beams out of the single array employing different delay factors and use such beams to scan the direction of the potential speaker. This scanning beam can easily realized by continuously steering the beam from top to bottom or from left to right by dynamically changing the steering delay using digital filters. An algorithm will detect a speech signal above some threshold level and will steer the main beam towards that direction. The block diagram for such a system is shown in figure 3. Division of Computer Engineering ,CUSAT 9 Micromechanical System for System-on-Chip Connectivity MEMS Acoustical Array Module MEMS Socket Interface Analog CMOS Signal Conditioning CMOS A/D Converter Digital Digital Array SoC Signal Beamforming Control PCI & Beam Processing Interface Bus Steering Engine Figure 3: Block Diagram of Hearing Aid Instrument To avoid spatial aliasing at all steering angles the spacing d between the microphones of the array is required to be D < πc/ω = πc/2πf = λ/2] Where λ is the wavelength of the incident acoustical signal and f is the frequency in Hz. c is the velocity. If the sensor array is to be inserted inside the ear canal, the spacing between the microphones will be much smaller than the required. This constraint can be overcome by introducing additional delay factor to Division of Computer Engineering ,CUSAT 10 Micromechanical System for System-on-Chip Connectivity compensate for the difference in delay due to the required spacing d and the delay due to physical microphone spacing. Similarly, it is possible to form multiple beams out of the single array employing different delay factors and use such beams to scan the direction of the potential speaker. This scanning beam can easily realized by continuously steering the beam from top to bottom or from left to right by dynamically changing the steering delay using digital filters. An algorithm will detect a speech signal above some threshold level and will steer the main beam towards that direction Division of Computer Engineering ,CUSAT 11 Micromechanical System for System-on-Chip Connectivity MEMS MICROPACKAGING SOLUTION The MEMS technology can be used to create necessary structures for die level integration of MEMS devices or components and CMOS or non-CMOS, like BJT, GaAs, and Silicon-germanium devices. The basic structure of the proposed mechanism is a socket submodule (figure 4) that holds a die or device. The required no of submodules can be stacked vertically or horizontally to realize a completely system in a micropackage. Figure 4a. 3D model of socket submodule Division of Computer Engineering ,CUSAT 12 Micromechanical System for System-on-Chip Connectivity Figure 4b. top view of socket submodule Connectivity between submodules is achieved by means of microbus card (figure 6.) constructed with heat deformed, gold coated polysilicon cantilever microspring contacts and platinum coated microrails fabricated inside an interconnection channel that is presented in each socket submodule. An illustration of the micropackaging system is shown in figure 5. Division of Computer Engineering ,CUSAT 13 Micromechanical System for System-on-Chip Connectivity Figure 5a. Top view of MEMS micropackage Division of Computer Engineering ,CUSAT 14 Micromechanical System for System-on-Chip Connectivity Figure 5a. MEMS micropackaging system: cross section through AA’ Microorganisms and moisture inside the ear canal may contaminate the microsensor array. This can be helped by the submodule type sensor array, which can be removed easily for cleaning or replacement. The submodules are connected by means of a MEMS microbus with gold coated polysilicon cantilever microspring contacts and platinum coated microrails fabricated inside an interconnection channel that is presented in each socket submodule. Figure 6 shows the 3D model of microbus Division of Computer Engineering ,CUSAT 15 Micromechanical System for System-on-Chip Connectivity Figure 6. 3D model of MEMS microbus card Division of Computer Engineering ,CUSAT 16 Micromechanical System for System-on-Chip Connectivity DIE TESTING CONFIGURATION The concept of socket submodules and connectivity can also be used in a die testing platform. The establishment of temporary connectivity for testing a die without exposing the die to otherwise harmful energy sources or contaminations during the test cycles is a major technological challenge. The MEMS submodule can be reconfigured to establish temporary connectivity for die testing with out exposing the die to any contamination while carrying out necessary test procedures. Figure 7 illustrates the die testing configuration using MEMS socket type structures. Figure 7. MEMS die testing configuration Division of Computer Engineering ,CUSAT 17 Micromechanical System for System-on-Chip Connectivity In this set up, two different type of MEMS sockets are used: a fixed one connected permanently to a Tester-on-Chip (ToC),which is a die testing SoC using an enabling gold–to-gold thermo sonic bonding technology and a removable socket that acts a die specific carrier. The contact springs on both sides of the removable socket undergo deformation due to a compression mass on the top of the die and generate the necessary contact force. The removable MEMS socket can be redesigned to connect a die that is larger than the ToC. This makes the system a flexible one. The major design objectives of contact spring mechanism is to develop a proper –contact force, lowcontact resistance, small area, and short contact path while having the ability to tolerate some torsional misalignment. Another important requirement is to maintain the contact surface that will remain reasonably flat even under torsional deformation to realize a higher contact area. Based on these constraints designs two of contact springs are given in figure 8. Division of Computer Engineering ,CUSAT 18 Micromechanical System for System-on-Chip Connectivity Figure 8. Two types of micro spring contacts The concept of socket submodules and connectivity can also be used in a die testing platform. The establishment of temporary connectivity for testing a die without exposing the die to otherwise harmful energy sources or contaminations during the test cycles is a major technological challenge. The MEMS submodule can be reconfigured to establish temporary connectivity for die testing with out exposing the die to any contamination while carrying out necessary test procedures. Division of Computer Engineering ,CUSAT 19 Micromechanical System for System-on-Chip Connectivity The micromachining technology that emerged in the late 1980s can provide micron-sized sensors and actuators. These micro transducers are able to be integrated with signal conditioning and processing circuitry to form micro-electro-mechanical-systems (MEMS) that can perform real-time distributed control. This capability opens up a new territory for flow control research. On the other hand, surface effects dominate the fluid flowing through these miniature mechanical devices because of the large surface-to-volume ratio in micron-scale configurations. We need to reexamine the surface forces in the momentum equation. Owing to their smallness, gas flows experience large Knudsen numbers, and therefore boundary conditions need to be modified. Besides being an enabling technology, MEMS also provide many challenges for fundamental flow-science research. Division of Computer Engineering ,CUSAT 20 Micromechanical System for System-on-Chip Connectivity Microvision's MEMS scanning mirror is a silicon device at the center of which is a tiny mirror. This mirror is connected to small flextures allowing it to oscillate. The 2D MEMS scanner oscillates vertically and horizontally to capture (imaging) or reproduce (display) an image pixel-by-pixel. 2D MEMS scanners are used in the PicoP display engine that powers Wearable Displays, Vehicle DisplaysPicProjector Displays.A1D MEMS scanner,as used in the ROV Scanner, oscillates along one axis only and is useto capture a bar code image. Division of Computer Engineering ,CUSAT 21 Micromechanical System for System-on-Chip Connectivity The 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011) is one of the premier annual events reporting research results on every aspect of microsystems technology. This Conference reflects the rapid proliferation of the commitment and success of the microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors. MEMS 2011 will be held in Cancun, Mexico on January 23 - 27, 2011 at the Hilton Cancun Golf and Spa Resort. Division of Computer Engineering ,CUSAT 22 Micromechanical System for System-on-Chip Connectivity APPLICATIONS The applications of MEMS devices are manifold but due to their size and supporting functions they are hardly ever noticed by the average end-user. The first applications for MEMS devices in the 1990s were inkjet-printer nozzles followed by ESP (Electronic-stability-program) for the automotive market and acceleration sensors actuating the airbags in cars. At present a new mid-range car contains something like 40 MEMS sensors upwards, for Tire-Pressure-Monitoring, various sensors for airbags, driver presence detection etc. Also in the last 5 years MEMS devices have started to penetrate the consumer-product markets with gyroscopes in digital cameras and navigation systems, acceleration sensors in game console controllers and mobile phones. This trend of consumer electronics driving the MEMS market is expected to continue with the sensors increasingly being used for assisted living and identification applications. Division of Computer Engineering ,CUSAT 23 Micromechanical System for System-on-Chip Connectivity DIFFERENCES BETWEEN THE MICRO- AND THE MACRO-WORLD Imagine you have a box filled with several glass marbles. Now you give the box a good shake and place it on a table. When opening the box now, where would you expect to find the marbles? Well, our everyday experience tells us, they will be on the bottom of the box. Now imagine we use the same box but replace the glass marbles by tiny ones with a diameter of several micrometer (the thousandth part of a millimetre). Now we close the box again and give it a good shake. When opening the box now, where would you expect to find the marbles? On the bottom again? This is where our macro-world experience mislead us. The marbles would be equally distributed on each surface of the inside of the box, sticking to bottom, side-walls and the lid. This is due to the fact that when reducing the size of a body to micro-dimensions the gravitational force becomes more and more unimportant compared to other forces acting on the body. More specific, the gravitational force being a volumetric force scales with L3, whereas surface forces like the electrostatic force scale with L2. This means when reducing the dimensions of a body by a factor of 1000, the gravitational force is reduced by a factor of 1000-3 = 10-9 whereas the electrostatic force is reduced by 10-6. Therefore, the weight of a body can be neglected in almost all instances Division of Computer Engineering ,CUSAT 24 Micromechanical System for System-on-Chip Connectivity when dealing with MEMS devices, except in special devices such as accelerometers. The other major differences when dealing with the world of MEMS are Surface tensions, which causes surfaces to stick together and is a common critical failure for MEMS devices. Mixing of fluids is very difficult on a micro-scale as most fluid flows are laminar rather than turbulent. Special designs are required to mix two substances. The stability of manufactured structures. When looking at MEMS devices often they look as if they can impossibly survive, such as bridges which are just 0.5 um thick, 40 um wide and 1000um long. (In the macro world this would equal an unsupported bridge 0.5 m thick, 40 m wide and 1 kilometer long, which would collapse at once due to its weight). Division of Computer Engineering ,CUSAT 25 Micromechanical System for System-on-Chip Connectivity MANUFACTURE PROCESSES Most of the MEMS manufacturing technologies where originally developed from existing semiconductor manufacturing processes. Over the last 20 years, these have been adopted to meet the specific needs of MEMS devices. In general MEMS manufacturing technologies can be divided into these categories: Bulk micromachining, the first MEMS manufacture technology, in which the Silicon wafer is etched to create structures such as groves , bridges and apertures with near 90 degree sidewall angles. Surface micromachining, which uses predominantly additive processes using the Silicon wafer as substrate. Devices formed using surface micromachining tend to be considerably thinner than bulk or HAR devices. High aspect ratio micromachining (HAR) combines some of the aspects of both surface and bulk micromachining . A process which is commonly associated with this technology is the DRIE-process (Deep Reactive Ion Etching), w hich allows for silicon structures with extremely high aspect ratios through thick layers of Silicon Division of Computer Engineering ,CUSAT 26 Micromechanical System for System-on-Chip Connectivity (hundreds of nanometers up to hundreds of micrometers). This is achieved through a cycled etch process in which the deposition of a passivation material on the sidewalls of the etched material and the actual etching process alternate. Specialised processes for niche applications. Division of Computer Engineering ,CUSAT 27 Micromechanical System for System-on-Chip Connectivity ADVANTAGES AND DISADVANTAGES ADVANTAGES High efficiency Cost effective Flexible High accuracy precision DIS ADVANTAGES Complex design Complex fabrication procedures Division of Computer Engineering ,CUSAT 28 Micromechanical System for System-on-Chip Connectivity CONCLUSION MEMS technology offers wide range application in fields like biomedical, aerodynamics, thermodynamics and telecommunication and so forth. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non compatible technologies, with a SoC environment. The MEMS technology allows permanent, semi permanent and temporary connectivity. The integration of MEMS to present technology will give way to cutting edge technology that will give outstanding functionality and far reaching efficiency regarding space, accuracy precision, cost, and will wide range applications. Describing typical application of MEMS in a hearing instrument application the flexibility and design challenges and various innovative features of MEMS technology is made to understand. In the hearing aid instrument microphone arrays are used to produce directional sensitivity and improve speech intelligibility. The various components and necessary signal conditioning algorithms are implemented in a custom micropackaging that can be implanted inside the ear canal is described. Division of Computer Engineering ,CUSAT 29 Micromechanical System for System-on-Chip Connectivity REFERENCES 1. Sazzadur Choudhury,M. Ahmadi, and W.C. Miller , Micromechanical system for System-on-Chip Connectivity’, IEEE Circuits and Sytems, September 2002 2. New battery may jump-start MEMS usage, ISA InTech April 2002 Division of Computer Engineering ,CUSAT 30 Micromechanical System for System-on-Chip Connectivity BIBLIOGRAPHY 1. www.darpa.mil 2. www.sanyo.co.jp Division of Computer Engineering ,CUSAT 31