2013 version_NB3 - ASM Assembly Systems

Transcription

SEMICONDUCTOR EQUIPMENT
http://www.asmpacific.com
ASM Semiconductor Equipment Products
Index
Process
Materials
Handling
Process
Model
AD9312
AD9212
AD8312FC
8” Wafer
Handling
12” Wafer
Handling
AD838FC
Display
Equipment
Flip Chip
12” Wafer
Handling
AD8312 /
AD8312R
ISLinDA
Epoxy DA
8” Wafer
Handling
AD838 /
AD838P
AD838R
Die Attach Equipment
AD838L /
AD838LM
Flex on Glass
(FOG)
COG900 /
COG902 /
COG930
FOG900 /
FOG902 /
FOG930
Panel
Lamination
Touch Panel
Bonding
GEMINI Series
Reflow Oven
Snap Curing
Oven
Process
IS898GA
TWIN833
AD830 Plus /
AD830R Plus
AD210
AD880 Series
Eutectic DA
AD830U /
AD830UR
8” Wafer
Handling
AD211 Plus /
AD212
AD220
Other DA
Epoxy DA
Misc
AD881 Series
6” Wafer
Handling
AD100 Series
AD819-PD /
AD819-LD
CIS Equipment
DI-Wafer Cleaning
System
ISCM868
Camera Module
Auto Focusing &
Electrical-Test
Process
eClip
IS868LA3
Lens Holder Alignment
Ultrasonic
Wedge
Wire Bond
SR902 Series
PC139 Series
COE139 Series
Materials
Handling
Au
Ball Bond
Heavy
Aluminum Wire
Fine
Aluminum Wire
Model
TwinEagle Xtreme GoCu
Harrier Xtreme GoCu
iHawk Xtreme GoCu
Eagle Xtreme GoCu
Eagle Xpress GoCu
iHawk Xpress Opto
iHawk Xtreme
Harrier Xtreme
Xpress-LB
iHawk-V
AL501
TwinPhonon
AB589 Series
SD890A
Lens Holder Attach
Waterless Base
Cleaning System
Thermosonic
Wire Bond
Model
AB530
CMOS
Camera
Module
AOI / FOL
Equipment
PD & LD
Eutectic DA
Strip Form
Substrate
Strip / Reel
Form
Substrate
SD832D
Soft Solder DA
Solder Paste
DA / Clip Attach
Materials
Handling
Au / Cu / CuPd
Ball Bond
Wire Bondiing Equipment
6” Wafer
Handling
TWIN830UR
1
Curing
Oven
TWIN832
Model
STN, CSTN,
TFT and
other types
of Glass
Panel
Chip on Glass
(COG)
Process
MCM12
Materials
Handling
Advanced
Optical
Inspection
(AOI)
4” Wafer
Handling
Strip Form
Substrate
Chip Probing
6” Wafer
Handling
Die Sorting
Map Sorting
ISCM139B
IS600G2
IS300-AF
Materials
Handling
Wafer
Form
Model
ES101
VIM300
CP100
AS899
MS100 Plus
MS109
ASM Semiconductor Equipment Products
Index
Process
Materials
Handling
Glob-top
Glob-top, Dam & Fill
DS86
Strip Form
Substrate
DS830
DS530H
Potting
DS520V
Glob-top
DS830LB
Materials
Handling
Transfer Molding
Strip Form
Substrate
OSPREY
12” Wafer
WLP300
Compression Molding
Transfer Molding
Process
Strip Form
Substrate
Singulation,
Trim &
Form System
Process
Test & Finish
Handling
System
Turret Based Test
Handler
IDEALcompress™
IDEALmold™
Materials
Handling
Model
All kinds of IC and
Power Device
Matrix Leadframes
LS1000
Ball Placement
CSBGA / PBGA,
flex BGA & etc.
BP2000
Tape Sorting
CSBGA, MLP,
QFN, SiP & etc.
CS900
Lead Frame
Cutting
Reel Form
Substrate
LFC130 Series
Process
Materials
Handling
Model
Laser Mark
Handler
SIPLACE SX-Series
SMT
Placement
SMD Components
Bonding
SIPLACE X-Series
SIPLACE Di-Series
SIPLACE CA
IDEALab™
Materials
Handling
Saw and Pick & Place
Mechanical Press
Trim / Form
Model
SMT
Placement
Equipment
Molding
Equipment
Process
Process
Other Equipment
Dispensing
Equipment
Dispensing
+ Testing
+ Compensating
Model
Model
iSAP
Strip Form
Substrate
MPHENIX
MP-TAB
Materials
Handling
Discrete
Package
Model
FT2026
FT2018
Mini-Discrete
FT-Mini
Package
Process
LED Testing,
Sorting &
Taping System
Panel Testing
Testing & Sorting
Taping
Testing & Sorting
Taping
Materials
Handling
MCPCB,
Ceramic
SMD Type
LED
HP LED
Model
PT86
SLS230 Series
SLT400 Plus
IP360 Series
AT410
2
AD9312
12” Thermocompression
Flip Chip System
HIGH
PRECISION
3
TC BONDING
PROCESS
AD9212
12” Dual Head Flip Chip System
HIGH
PRECISION
Features
Features
 Individually controlled dual bond head with shared
 Providing dual flip chip head bonding process
up/down-look inspection
 Equipping with pre-dispensing station for TC NCP
process (option)
 Suitable for 2.5D / 3D IC packaging
 Advanced PR inspection system for high precision
Applications
Applications
 Singulated BGA
 Singulated BGA
 BGA
 BGA
 Ceramic panel
 Ceramic panel
 Singulated substrate on carrier
 Singulated substrate on carrier
 Lead frame
 Lead frame
 And more……
 And more……
*Remark: All performance is package dependent
bonding
 Thin dice handling capability
FLIP CHIP
SOLUTIONS
AD8312FC
12” High Speed Flip Chip System
HIGH
SPEED
HD LF
THIN DIE
HANDLING
AD838FC
8” High Speed Flip Chip System
HIGH
SPEED
FLUX
DISPENSING
Features
Features
 Supporting both flip chip and direct die bonding
 Supporting both flip chip and direct die bonding





processes
Up to 100 mm substrate width handling
Flux dipping and dual flux dispensing capability
ASM in-house developed Archerfish dispensing system
In-lining with oven for solder reflow
Optional for thin die handling
processes
 Dual flux dispensing capability
 ASM in-house developed Archerfish dispensing system
 In-lining with oven for reflow process
 Machine cascade for multi-die handling
Applications
Applications
 QFN / DFN
 QFN / DFN
 SOIC
 SOIC
 SO
 SO
 And more……
 And more……
4
AD8312
12” Epoxy Die Attach System
(For Strip Form Substrate Handling)
AD8312R
(For Reel Form Substrate Handling)
HIGH
SPEED
HD LF for
AD8312
12” Thin Die Attach System
THIN DIE
HANDLING
CLASS 100
STANDARD
HD LF
Features
Features
 World’s first 12” dual dispensing die bonding series
 High density lead frame (100 x 300 mm²) handling
 AD8312: High density lead frame (100 x 300 mm²)
 World’s first 12” dual dispensing die bonding series
handling and universal workholder design for various
packages
 AD8312R: strategic designs for handling backside
plated substrates
 In-lining with curing oven (option)
 Individual pick and bond system
Applications
Applications
 Thin die handling capability with patented design
 Panel bonding capability
 Mini-BGA
 PLCC
 Mini-BGA
 PLCC
 Flex BGA
 MEMS
 Flex BGA
 Image sensor
 CSPBGA
 PDIP
 CSPBGA
 And more……
 MLP/QFN
 Smartcard (AD8312R)
 MLP/QFN
 QFP
 And more……
 QFP
 TQFP
5
ISLinDA
 TQFP
12” EPOXY DA
SOLUTIONS
MCM12
12” Multi-Chip System
X-LARGE
SUBSTRATE
HD LF
Features
 Working range up to 330 x 210 mm²
 Up to 14 types of picking tools handling capability
 Up to 5 types of ejecting kits installation
 SMD bonding capability
 Direct die attach / flip chip bonding capability
 Supporting auxiliary dispensing system
Applications
 BGA
 Wafer submount
 MLP/QFN
 Metal can
 And more……
6
AD838
TWIN832
8” Dual Epoxy
Die Attach System
DUAL
WAFERS
AD838P
AD838R
(for High Precision Placement)
(for Reel Form Substrate)
HIGH
SPEED
HD LF
HD LF
for AD838
HIGH
SPEED
HD LF
Features
Features
Features
 Highest throughput per footprint
 AD838: up to 100 mm substrate width
 High density reel form substrate up to
 Single machine for dual dice packages
 AD838P: high precision placement
 High density lead frame (100 x 300 mm²)
 Patented bond head design
 Dual dispensing system
 Dual dispensing system
 Providing graphical SPC data with latest
 Providing graphical SPC data with IQC
handling
 Patented bond head and dispensing
system
IQC system
100 mm width
system
 In-lining with curing oven or pressing
system (option)
Applications
Applications
 SOT
 QFN / DFN
 SOT
 Smartcard
 TQFP
 And more HD
 TQFP
 And more HD
 RFID package
 PLCC
7
Applications
 QFN / DFN
lead frames……
 PLCC
 TSSOP
 TSSOP
 TSOP
 TSOP
 SOIC
 SOIC
lead frames……
 Any reel form substrate
8” EPOXY DA
SOLUTIONS
AD838L
(for Direct Substrate Indexing)
AD838LM
(for Vibration Boat Inputting)
DIRECT CERAMIC
HANDLING
VIBRATION BOAT
FEEDER INPUT
IS898GA
8” Epoxy Glass Attach System
CLASS 100
STANDARD
UV SNAP
CURE
Features
Features
 Direct ceramic substrate indexing
 Various cleaning modules during glass attach process
 Anvil block with clamp force self-compensation design
 Dual glue writing capability
 Panel bonding capability with intelligent global
 Suitable for strip form substrate or boat carrier
substrate alignment
 Dual stamping/ dispensing process
 AD838LM with input vibration boat feeding system
 Supporting glass presentation on mylar / waffle pack
Applications
Applications
 Ceramic
 BT
 MCPCB
 CLCC
 MLP/QFN
 PLCC
 QFP
 Singulated lens holder
 TQFP
 And more……
 UV snap curing system (option)
8
AD830 Plus
TWIN833
6” Dual Epoxy
Die Attach System
DUAL
WAFERS
HD LF
AD830R Plus
HIGH
SPEED
HD LF
OPTICS
ARRAY
Features
Features
 Single machine for dual-die packages
 Highest throughput with smallest footprint
 Optics array system enhancing bonding cycle time
 True color camera with white LED lighting for handling
 8” wafer handling (option)
various materials
 AD830R Plus with reel form substrate handling
 8” wafer handling (option)
Applications
Applications
 SMD LED
 SMD LED
 Pre-molded lead frame
 Chip LED
 EMC lead frame
 Top LED
 High Power LED
 EMC lead frame
 And more HD lead frames……
 Side view LED
 And more……
9
6” EPOXY DA
SOLUTIONS
AD210
X-LARGE
SUBSTRATE
UV SNAP
CURE
Features
 Achieving ±5 µm @ 3 sigma XY placement
AD880 Series
Epoxy Die Attach System
X-LARGE
SUBSTRATE
Features
 Up to 8” x 8” substrate handling
 Up to 8” x 8” bonding area
 DDR rotary bond arm system
 Individual control of pick and bond process
 Dual loading system for automatic materials handling,
substrate & wafer loading (option)
 UV snap curing system (option)
Applications
Applications
 Silicon wafer submount
 Silicon wafer submount
 Large PCB substrate
 PCB
 High precision photonics device
 Ceramic
 And more……
 And more……
10
AD830U
Eutectic Die Attach System
TWIN830UR
AD830UR
Dual Eutectic Die Attach System
HIGH
SPEED
DUAL
WAFERS
Eutectic Die Attach System
HIGH
SPEED
Features
Features
 Single machine for dual dice packages
 Independent temperature control in each heating zone
 Highest throughput per footprint
 Forming gas supply during process
 Dispensing system for flux eutectic (option)
 In-lining with lead frame cutting system and automatic
 AD830UR: in-lining with lead frame cutting system and
wire bonding system
automatic wire bonding system
Applications
Applications
 SOD
 SOD
 SOIC
 SOIC
 SOT
 SOT
 And more……
 And more……
11 *Remark: All performance is package dependent
EUTECTIC DA
SOLUTIONS
AD211 Plus / AD212
AD220
Direct Eutectic
Die Attach System
HEATED
COLLET B/H
PANEL FORM
SUBSTRATE
Direct Eutectic
Die Attach System
X-LARGE
SUBSTRATE
HEATED
COLLET B/H
STRIP FORM
SUBSTRATE
Features
Features
 Direct ceramic substrate handling
 Patented process and designs
 Patented process and modules design
 Individual control pick and bond system
 Individual control pick and bond system
 Up to 300 mm long lead frame handling
 Graphical SPC data with IQC system
 Graphical SPC data with IQC system
 Anti-thermal shock design for eutectic process
 Providing 8 (heating zones) + 3 (cooling zones)
eutectic bonding environment
 AD212: up to 8” x 8” substrate handling
Applications
Applications
 Ceramic based high power LED
 Strip form high power LED
 Silicon based high power LED
 Premold lead frame
12
SD832D
SD890A
Soft Solder
Die Attach System
PATENTED
DESIGN
HD LF
Soft Solder
Die Attach System
LEADING
THROUGHPUT
XY B/H
SHUTTLING
eClip
Clip Bonding System
ALL-IN-ONE
SOLUTION
PATENTED
DESIGN
Features
Features
Features
 Industry’s leading throughput
 Matrix lead frame handling with XY
 All-in-one bonding solution from die
 Up to 100 x 300 mm² HD lead frame




handling
Patented bond head system
Patented solder writing technology
AB dice handling with rotary collet bond
arm design
Oxygen level control with forming gas
supply




shuttling bond head system
Motorized solder wire feeding and
spanking system
AB dice handling with rotary collet bond
arm design
Automatic die theta alignment
Oxygen level control with forming gas
supply
bonding, clip bonding to reflow process
 Supporting dual dispensing system
 Array clip bonding capability
 Supporting independent temperature
controlling regions for reflow process
 Optional configurations with
 12” wafer handling
 Flip chip bonding
 Multi-die bonding
Applications
Applications
Applications
 High power device
 High power device
 High power discrete package
 TO-220
 TO-220
 DPAK matrix
 SOT
 SOT
 Power SO
 DPAK
 DPAK
 And more……
 DPAK matrix
 DPAK matrix
 PowerSO
 PowerSO
 And more HD high power lead frame……
 And more high power lead frame……
OTHER DA
SOLUTIONS
AD819-PD
Photo Diode Epoxy
Die Attach System
AD881 Series
Flexible Epoxy
Die Attach System
MULTI
WAFER
NON-STOP
OPERATION
AD100 Series
Vertical LED Epoxy
Die Attach System
PATENTED
DESIGN
AD819-LD
Laser Diode Eutectic
Die Attach System
PRECISION
PLACEMENT
METAL CAN
HANDLING
Features
Features
Features
 DDR rotary bond arm system
 Dual stacks loading system
 Carrier free design for materials handling
 AD881 with 8” x 5” dual workholders
 Dual clamps indexing algorithm
 AD819-PD with “Two-in-One stamp and
system
 AD881H with automatic substrate load/
unload system
 AD881M with up to 3 wafers handling
 AD881MH with up to 3 wafers handling
and automatic substrate loading /
unloading system
 Pre-bond and post-bond inspections
simultaneously
 Providing different algorithms for die
alignments
 AD100MM with automatic input magazine
system
 AD819-LD with “Moving Temperature
Applications
Applications
Applications
 Top LED
 Vertical lead frame
 Metal can handling
bond system”
Control Profile” for eutectic process
 AD819-LD with submount and top dice
handling
 Chip LED
 PCB
 Bent lead frame
 And move......
14
IS868LA3
ISCM868
Lens Holder
Attach System
CLASS 10
STANDARD
QUAD-EPOXY
WRITING
DI-Water Cleaning System
PRECISION
PLACEMENT
CLASS 100
STANDARD
ISCM139B
Waterless Base
Cleaning System
DI-WATER
SPRAY
Features
Features
Features
 World’s first quad dispensing system for
 Spraying of DI-water cleaning with dual
 In-lining cleaning system with




CIS bonding process
Strategic module design for FM control
ULPA filter implementation
Multiple rotary clean bath
High resolution up-look and bond optics
air atomizing nozzles
 Programmable motion of swing spray arm
and spinner table
 High speed centrifugal drying
 In-line capability with ASM’s AOI system
and lens holder bonding system
programmable air blowing
 Achieving factory automation by fully
automatic materials handling
 ISCM868 + VIM300 + IS868LA3
Applications
Applications
Applications
 CLCC
 CLCC
 CLCC
 PLCC
 PLCC
 PLCC
 BGA
 BGA
 BGA
 PCB
 PCB
 PCB
 Singulated unit
 And more......
 And more strip form substrate for
 And more......
cleaning process……
IMAGE SENSOR
SOLUTIONS
IS600G2
Active Alignment
Lens Holder Attach System
CLEAN 10
STANDARD
NON-STOP
OPERATION
IS300-AF
Camera Module Auto Focusing &
Electrical-Test System
DUAL SETS OF
TEST STATIONS
Features
Features
 Class 10 cleanliness
 Supporting both FPC type and non-FPC type of CMOS
 Active alignment of camera module
camera module
 Leading throughput among same type of bonders
 Providing open/short test and current test
 Equipping with four dispensing and active alignment
 Dual test charts for auto-focusing (AF) station with
(AA) stations
 Utilization of relay lens for smaller machine footprint
 In-line capability with multiple IS600G2 for mass
production (option)
built-in backlight illumination
 In-line capability with dispensing and UV pre-curing
station (option)
Applications
Applications
 CLCC
 CLCC
 PLCC
 PLCC
 BGA
 BGA
 PCB
 PCB
 And more……
 And more singulated image sensor packages……
16
DISPLAY
SOLUTIONS
COG900 / COG902 / COG930
Chip on Glass (COG)
Bonding System
FOG900 / FOG902 / FOG930
Flex on Glass (FOG)
Bonding System
QUAD-EPOXY
WRITING
FLEX on FILM (FoF)
SOLUTION
GEMINI Series
Panel Lamination System
NAKED EYE
3D SOLUTION
PATENTED
DESIGN
Features
Features
Features
 True colour LED inspection
 True colour LED inspection
 Supporting pre-defined computer aid
 Supporting belt input/output system and
 Supporting belt input/output system and




tray handling system
COG930: up to 13.4” glass handling
COG902 for high speed bonding for
mobile phone application
COG900 for all round COG application
In-line capability with glass edge cleaning
system and FOG system




tray handling system
FOG930: up to 13.4” glass handling
FOG902 for high speed bonding for
mobile phone application
FOG900 for all round FOG application
In-line capability with COG system
dispensing patterns
 Up to 310 x 190 mm glass handling
 Gemini-RTA provides real time alignment
for precision control
 UV line scan cure system covers full area
pre-curing after lamination
Applications
Applications
Applications
 STN
 STN
 Touch panel bonding
 CSTN
 CSTN
 Naked eye 3D application
 TFT
 TFT
 And more types of glass and LSI for
 And more types of glass and LSI for
COG bonding……
FOG bonding……
CURING
SOLUTIONS
SR902 Series
Reflow Oven
CONVECTION +
RADIATION HEATING
PC139 Series
Snap Curing Oven
COE139 Series
Snap Curing Oven
REEL FORM
SUBSTRATE HANDLING
Features
Features
Features
 Independent temperature controlling
 Independent temperature controlling zones
 Sophisticated oxygen level control
 PC139R-5Z: up to 5 temperature
 Independent temperature controlling




zones
Combination of convection and radiation
heating modes
SR902L with automatic off-loading system
SR902W for manual loading wafer
substrate for reflow
In-line capability with AD9212 (option)
controlling zones and reel form substrate
handling
 PC139R-10Z: up to 10 temperature
controlling zones and reel form substrate
handling
 In-line capability with AD838R, AD8312R,
etc. (option)
zones
 COE139: strip form substrate handling
 COE139R: reel form substrate handling
 In-line capability with AD830 Plus, and
other die attach system (option)
Applications
Applications
Applications
 Reflowing process for high lead (> 85%
 Smartcard
 SOT
 SOT
 Top LED
 And more strip / reel form substrates......
 And more strip / reel form substrates......
Pb) solder, lead free solder, flux reflow,
etc..
18
TwinEagle Xtreme GoCu
Harrier Xtreme GoCu
Dual Heads
Gold Wire Bonder
PATENTED
TECHNOLOGY
HIGH
RESOLUTION
iHawk Xtreme GoCu
Dual Heads
Wire Bonder
AWRS
LOW LOOP
~ 35 µm
Cu WIRE
BONDING
Ultra High Throughput Discrete /
Opto Wire Bonder
AWRS
HIGHER
UPH
OPTICS PR
SYSTEM
AWRS
Features
Features
Features
 Auto Wire Rethreading System (AWRS)
 Fine pitch capability: 30 µm BPP
 Up to 20% higher UPH compared to
 Simple package conversion with fully
 Bond placement: 2 µm @ 3 sigma
Harrier
 User-friendly, intelligent Windows-based
interface
 Cu wire bonding & Cu BSOB
 Smart Skip – for skipping missing die
 Extensive field knowledge & reliability
proven solutions for 2 N wires, ultra
low-k, 45 nm technology dies
motorized material handling system
 Robust indexer to handle high density
discrete package
Bonding Capabilities
 Bonding method: thermosonic
 Cu wire size: 0.6 mil ~ 2.0 mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead
Eagle Xtreme GoCu
Eagle Xpress GoCu
Model Based
Wire Bonder
AUTO
PR
AUTO
LOOPING
Wider Substrates
Wire Bonder
AWRS
FASTER
THAN Au
AWRS
Features
Features
 Bonding area: 56 x 70 mm @ LF < 80 mm
 Bonding area: 56 x 90 mm @ LF 100 x 300 mm
 Placement accuracy: 2.0 µm @ 3 sigma
 Placement accuracy: 2.0 µm @ 3 sigma
 Eagle Xtreme is upgradable
 Revolutionary auto PRS
 Loop definition
 Cu wire size: 0.6 mil ~ 2.0mils
20
iHawk Xpress Opto
iHawk Xtreme
Wire Bonder
CERAMIC
WIDER
SUBSTRATES
Harrier Xtreme
Wire Bonder
AWRS
Dual Heads
Wire Bonder
AWRS
Features
Features
 Wider bonding area – 56 mm x 90 mm
 Easy conversion from Au to non-Au wire handling
(substrate width < 102 mm)
 Capable of handling 4” x 4” ceramic
substrate
 Optional non-Au wire bonding upgrade
kits (GoCAP)
and vice versa
 Optional non-Au wire bonding upgrade kits
(GoCAP)
 Copper wire bonding: option with
 Cu Wire Bonding: option with conversion kit
conversion kit
LED OPTO
SOLUTIONS
Xpress - LB
iHawk-V
Long Bar Lighting Application
Wire Bonder
720 mm LONG
LEAD FRAME
HIGH
PERFORMANCE
Wire Bonder
AWRS
Features
Features
 High speed wire bonding capability
 Up to 720 mm long magazine application
 Pro-longing MTBA with latest input / output magazine
 Up to 100 mm width lead frame handling
 COB programming feature
handling
 Extended workholder - support up to 2 strips in waiting
 Easy loop control
 Optional non-Au wire bonding upgrade kits (GoCAP)
Applications
 Vertical lead frame
 Cu wire size: 0.7 ~ 2.0 mils
22
AL501
Heavy Aluminum
Wire Bonding System
DUAL
BOND HEAD
PATENTED
DESIGN
TwinPhonon
Dual Head Fine Aluminum
Wire Bonding System
DUAL
ROTARY TABLE
PATENTED
DESIGN
Features
Features
 5 – 20 mil aluminum wire handling
 PATENTED dual workchucks design
 Hybrid wire bonding capability with dual bond
 Achieving “non-stop" operation
heads system
 Implementing linear motor and DDR system
 “Smart BQM” system supervising bonding
quality
 Wire pull testing system integration (option)
 Linear motor with DDR driven rotary worktable
Applications
Applications
 TO-220
 Toy
 DPAK matrix
 Game
 And more power discrete packages……
 Melody
 And more other COB packages……
ALUMINUM
WIRE BONDING
SOLUTIONS
AB589 Series
Rotary Head Fine Aluminum
Wire Bonding System
LARGE
WORKTABLE
ROTARY
BOND HEAD
AB530
Rotary Table Fine Aluminum
Wire Bonding System
HIGH
SPEED
HIGH LEAD
COUNT APP.
Features
Features
 Fine pitch capability for advanced packages
 Fine pitch capability for advanced packages
 High precision rotary bond head design
 Widely implementing linear and DDR motor system
 Patented “PR on the Fly” capability
 Multi-unit / multi-PCB bonding capabilities
 Standard 8” x 6” large effective bonding area
 Supporting various bonding requirements for different
 Supporting universal carrier design for full range
products
application (option)
 Deep access bonding capability (option)
 Automatic material handling capability (option)
Applications
Applications
 Chip-on-board (COB)
 Chip-on-board (COB)
 Multi-die
 Multi-die/multi-PCB
 LED display
 High lead count bonding
 Chip-on-flex (COF)
 And more……
 Chip-on-glass (COG)
 Ceramic
 And more……
24
INSPECTION
SOLUTIONS
ES101
VIM300
CP100
Features
Features
Features
 True colour AOI capability
 True colour AOI capability
 Probing area up to 6” diameter
 Direct foton ring handling
 2D / 3D inspection
 Supporting 2” ISP and PD handling
 Dual wafers loading system
 Dual substrates loading system
 Supporting ESD testing
 Prolonging MTBA with up to 72 ring on
 Individual control dual main stations
 Built-in ASM in-house developed testing
Automatic AOI System
(Wafer Level Inspection)
frame handling
Automatic AOI System
(DIE / WIRE Inspection)
 Supporting X-Y motion
Automatic Chip Probing
System
system
 Defect identification system with laser
marking for rejected units
Applications
Applications
Applications
 Automatic advanced optical inspection
 Die bonded and wire bonded substrate
 Blue LED wafer
system for die, e.g. LED die……
on either substrate / lead frame……
 Green LED wafer
DIE / MAP SORTING
SOLUTIONS
AS899
Die Sorting System
CONVECTION +
RADIATION HEATING
MS100 Plus
Map Sorting System
200
O/P BIN
80 x 80 MM
BINNING AREA
MS109
Map Sorting System
(for 8.8” Picking Area)
8.8”
PICKING AREA
100 x 100 MM
BINNING AREA
Features
Features
Features
 Parallel pick, test and sort process with
 Dual bond arms design
 Dual bond arms design
 Up to 200 output bin frames
 Up to 8.8” picking area
 Up to 80 x 80 mm binning area
 Up to 100 x 100 mm binning area
 Supporting post-sort inspection
 Up to 200 output bin frames handling




rotary turret design
Supporting various types of detectors and
testers integration
Flexible bin block arrangement
Supporting XYZ prober motions
Simple “click & fit” bin block design”
 Supporting post-sort inspection
Applications
Applications
Applications
 Individual LED dice testing and sorting
 Sorting die, e.g. blue LED, white LED,
 Sorting die, e.g. blue LED, white LED,
solution
laser diode, etc. based on wafer map
information
laser diode, etc. based on wafer map
information
26
DS86
Automatic Dispensing System
(With Compensation)
3 – IN – 1
DISPENSING
WHITE LED
APPLICATION
DS830
8 DISPENSING
HEADS CONTROL
Features
Features
 Dispensing + testing + compensating in one pass
 Up to 8 dispensing heads handling capability
 Enhancing production yield
 Automatic encapsulant compensation by inspection
 Automatic materials handling system
 Equipping with integrated sphere for light collection,
optional up to 8” integrated sphere handling
feedback
 Implementing ASM in-house developed Archerfish
dispensing control system
Applications
Applications
 MCPCB
 Photo-coupler
 LED lighting module
 Lead frame based substrate
 And more LED applications……
 And more……
DISPENSING
SOLUTIONS
DS530H
DS520V
DS830LB
(for Horizontal Substrate Applications)
(for Vertical LED Applications)
(for Light Bar Applications)
4 – PUMP
DISPENSING
PHOSPHOR
APPLICATION
NON-STOP
OPERATION
VERTICAL LED
650 MM
EXTRA LONG
Features
Features
Features
 Dual workholders with dual elevators
 Engineered for vertical LED application
 Tailor-made for LED light bar handling
 Up to 18 magazines at once
 Up to 650 mm length of substrate handling




system
Supporting “Left-in, Left-out; Right-in,
Right-out” operation
Quad-pump dispensing implementation
Phosphor handling capability
Supporting various dispensing
technologies
 Supporting “Left-in, Left-out; Right-in,
Right-out” operation
 Dual pumps implementation (option)
Applications
Applications
Applications
 SMD LED
 Vertical LED
 LED light bar
 Ceramic
 MCPCB
 And more LED applications……
28
OSPREY
Small Lot Molding System
SMALLEST
SIZE MOLDING
WLP300
12” Wafer Level Molding System
12” WAFER LEVEL
MOLDING
Features
Features
 World smallest footprint automatic molding machine
 World’s first 12” automated WLP compression
 Built-in PGS™ molding capability
encapsulation system
 Minimum tooling cost and shortest lead time
 Flexible to handle wafer size ranging from 4” to 12”
 Ideal for small lot, high product mix production
 Equipped with encapsulant weight compensation
 Optional for liquid epoxy, clear silicone and granular
powder handling
Applications
Applications
 BGA
 Wafer level packaging
 QFN
 Wafer level LED
 SOT
 Cu bump pillar WLP
 PDIP
 PoP
MOLDING
SOLUTIONS
IDEALcompress™
IDEALmold™
(Strip Form Substrate Handling)
(Strip / Reel Form Substrate Handling)
Automatic Molding System
Automatic Molding System
FLEXIBLE DISPENSING
CONFIGURATION
IDEALab™
Manual Molding System
PGS™
MOLDING
Features
Features
Features
 Ideal for ECO friendly manufacturing
 Suitable for standalone or in-line
 Manual molding system derived from
 Various dispensing configuration,
including, liquid epoxy, clear silicone,
granular powder dispensing





configuration
Flexible press configuration of 1 to 4
presses
Input and output pattern recognition
features
Vacuum and wedge molding capability
High pre-heat temperature capability
Pinnacle Gating System (PGS™) molding
capability (option)
IDEALmold™
 Mold chase compability with IDEALmold™
 Process parameter portability to
IDEALmold™
 Suitable for R&D
Applications
Applications
Applications
 Up to 150 x 300 mm substrate
 Mini-BGA
 Taped / Tapeless QFN
 Flex BGA
 Mini-BGA
 QFN
 Flex BGA
 PLCC
 SOT
 TSSOP
 Punch type micro QFN
molding
 PoP
30
SINGULATION,
TRIM & FORM
SOLUTIONS
iSAP
Integrated Saw and
Pick & Place System
SMART BLADE
HEIG HT CHECK
PATENTED
DESIGN
MPHENIX
Automatic Trim & Form System
HD IDF LF
MP-TAB Series
Automatic Trim & Form System
AUTO TUBE
LOADER
Features
Features
Features
 Single chuck table with dual chuck tables
 100 x 300 mm high density lead frame
 Cost effective discrete package
speed
 Robust chuck table design for warpage
handling & high saw speed
 Eagle View vision to overcome vision
stoppage during alignment
 Blade height check on each substrate
without affecting cycle time
handling
 High tonnage application
 Vision inspection for orientation and uncut
dam bar
Applications
Applications
Applications
 BGA
 QFP
 SOT
 CSBGA
 TQFP
 SOD
 QFN
 SOIC (IDF)
 QFN
 Micro SD
 QFN
 DFN
 and more......
 and more......
 and more......
singulation platform
 Suitable for ultra high density lead frames
 Modular construction for various
integration
TEST HANDLING
SOLUTIONS
FT2026
Turret-Based Test &
Finish Handler
16 TEST SITES
FT2018
Turret-Based Test &
Finish Handler
iCONTACT
HIGH SPEED
WITH ARC
FT-Mini
Turret-Based Test &
Finish Handler
HIGH
ACCURACY
AUTO UNIT
REPLACEMENT
Features
Features
Features
 26 pick heads for multiple process steps
 Selectable for various onloading /
 iContact for double unit detection & good
 High accuracy for mini package
offloading system
 Supporting various vision inspection
technologies
testing yield
 Vacuum stopper to prevent chipping
 Best fit for small size IC/discrete packages
 Auto reel changer (ARC) (option)
 Vacuum stopper to prevent chipping
Applications
Applications
Applications
 SOIC
 SC70
 SOD923
 TSSOP
 SOT23 / 25 / 26
 SOT113
 QFN / MLP
 SOD123
 DFN1006
 and more......
 QFN (1 – 5 mm)
 DFN0603
 SOIC / MSOP
 and more......
 Best fit for mini-discrete packages
 and more......
32
PT86
SLS230 Series
Features
Features
 Testing packaged LED for both optical & electrical
 Wide range of application
 SLS230: chip LED
 SLS230S: sideview LED
 SLS230T Plus: top LED
Automatic Panel Testing System





properties
Back-side probing capability
Co-operating with dual workholders and dual materials
handling system
Simple conversion with universal workholder design
Built-in ASM in-house developed testing system
Integrated sphere for light collection, up to 8” ISP
(option)
Automatic LED (SMD) Sorting
System
 Anti-bin mixing design with digital labeling design
 Compatible to integrate with various types of detectors
and testers
 Supporting 256 output bins
Applications
Applications
 MCPCB
 SLS230: chip LED, e.g. 0402, 0603, 0605, 0805,
 Ceramic LED substrate
1206, etc.
 SLS230S: sideview LED, e.g. 008, 010, 020, 215,
335, etc.
 SLS230T Plus: top LED, e.g. 3528, 5050, 5252, 5450,
5630, 6045, 7020, 7474, etc.
TEST, SORT & TAPE
SOLUTIONS
IP360 Series
SLT400 Plus
AT410
Features
Features
Features
 One-stop solution from test, sort and
 Applicable to wide range of top LED,
 Applicable for ceramic or silicon sawn
Automatic LED Sorting System
output with good traceability
 Materials handling
 Input system: wafer frame / bowl feeding
system
 Output system: tape-and-reel output, bin
frames and / or bins
 Wafer barcode scanning, unit map, label
printing and output file generation
package for good traceability of devices
(option)
Automatic LED (SMD) Taping
System






sideview LED and chip LED
High throughput PPH: 45,000 +
Built-in ASM in-house developed
checking system
For checking Vf, Ir & POL and optical
parameters
Advanced in-pocket inspection system
Automatic repick package to ensure
good package in pocket
Supporting automatic reel change
capability (option)
Automatic LED Taping System
package
 All in one solution for inspection, checking
& taping
 High throughput
 8,000+ PPH*
 Up to 8” picking area
 Advanced inspection capability
 Package surface inspection
 Up-look inspection
 In-pocket inspection
 Automatic repick package to ensure good
package in pocket
Applications
Applications
Applications
 Ceramic based molded LED
 Chip LED
 Ceramic based molded LED
 Silicon based molded LED
 Top LED
 Silicon based molded LED
 Molded LED with lens
 Sideview LED
 Molded LED with lens
 And more……
34
LS1000
BP2000
Features
Features
 Laser handling for mold body mark or 2D mark
 High flexibility in material handling (e.g. strip, JEDEC
Laser Mark Handler
 Experience with various third party laser gun integration
 In-line capability with trim/form system or standalone
system
Ball Placement System
tray, carrier..)
 Fully modular design/construction
 Fine pitch capability: Ø0.2 mm/0.4 mm
Applications
Applications
 All kinds of IC and power device lead
 CSBGA / PBGA
frames
 Flex BGA
 And more……
OTHER
SOLUTIONS
CS900
LFC130 Series
Features
Features
 Pick and Place (PnP) from wafer ring to tube/tray
 LFC130: standalone cutting system
offload
 100% 4S-inspection + mark inspection without UPH
deduction
 LFC130NU-P / LFC130NU-S: in-line capability with
Applications
Applications
 CSBGA
 Precision cutting reel form lead frame
High Speed Tape Sorting
System
 MLP
Lead Frame Cutter System
other ASM die bonding systems, e.g. AD830UR,
Twin830UR, etc.
 High throughput: up to 6 cutting cycles per minute
 Reliable cutting system with excellent accuracy and burr
control
into strip form
 QFN
 SiP
 And more……
36
SIPLACE SX-Series
SIPLACE X-Series
Features
Features
 High flexibility – a revolutionary placement solution that
 New generation of the high speed SIPLACE X-Series sets
New Dimension of Flexibility and
Maximum Speed
scales flexibility across the entire line
 Capacity on demand – machine’s performance adjusted
to the orders thanks to replaceable gantries and
intelligent placement heads
 Equipping with the SIPLACE MultiStar head – a wide
range of components can be handled
 State-of-the art software – fast and easy to use SIPLACE
station software
The Ultimate High-end SMT Solution
for High Volume Production
new industry record
 Excellent price-performance and
floorspace-performance ratio
 Features like SIPLACE Smart Pin Support, barcode
reading and gantry exchange add more flexibility to the
line
 Low dpm rate with set-up verification and sophfisticated
sensors
Facts and Figures
Facts and Figures
 Placement performance: up to 60,000 cph (benchmark)
 Placement heads
 SIPLACE SpeedStar
 SIPLACE MultiStar
 SIPLACE TwinStar
 Placement heads
 SIPLACE SpeedStar
 SIPLACE MultiStar
 SIPLACE TwinStar
 Component spectrum: 01005 – 200 mm x 110 mm
PLACEMENT
SOLUTIONS
SIPLACE Di-Series
SIPLACE CA
Features
Features
 An extremely powerful placement machine with
 With the groundbreaking SIPLACE solution, the parallel
maximal four gantries
 The high-speed SIPLACE Di-Series combines proven
technology with high-tech innovations, thus guarantees
fast return on investment
 With the digital SIPLACE Vision System even 01005
components can be placed with the highest accuracy
 Flexible SIPLACE Software with advanced functions
placement of bare dies and SMD components in single
pass mode during the same process, was made possible
 The SIPLACE CA with integrated wafer feeder, can
place bare dies directly from wafers via the “die attach”
or “flip chip” processes. In addition, the SMT placement
process is supported and can be implement on demand
 Dual conveyor system allows simultaneously assembly
of two various products in asynchronous mode
Facts and Figures
Facts and Figures
 Placement performance:
 Flip Chip: 9,000 per SWS
 Die Attach: 6,000 per SWS
 SMD: 20.250 per head
High-Tech Innovations at an
Attractive Price-performance Ratio
 Placement heads
 SIPLACE 12-Nozzle Collect&Place
 SIPLACE 6-Nozzle Collect&Place
 SIPLACE Pick&Place
Direct placement of dies
along with the SMD components
 SIPLACE Wafer System
 Horizontal system
 Automatic wafer exchange
 Wafer size: 4” – 12”
38
China 中國
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
2/F, No. 55 Zu Chong Zhi Road Lot 1505
Shanghai Zhangjiang Hi-Tech Park
Shanghai 201203, China
Tel : 86-21-5080 5465
Fax : 86-21-5080 5467
Room 704~706, Da An Building B
No. 41 You Yi Road, He Xi District
Tianjin 300211, China
Tel : 86-22-5881 3008
Fax : 86-22-5881 3009
Room D348, Chengdu Hi-Tech Zone
Innovation Service Centre
Chengdu 611731, China
Tel : 86-28-8784 6551
Fax : 86-28-8784 6562
Room B, 31/F, Bi Li Da Building
No. 22 Lv Ling Road
Xiamen 361009, China
Tel : 86-592-550 9125
Fax : 86-592-550 9121
Room 05-03/06, Block A
No. 5 Xing Han Street
Suzhou Industrial Park
Suzhou 215021, China
Tel : 86-512-6762 6278
Fax : 86-512-6762 6378
Room 7-11, 4th Floor, Block A
Tai'an Square, Dongshen Road
Zhang Mu Tou Town
Dongguan 523620, China
Tel : 86-769-8712 5600
Fax : 86-769-8712 5601
East Wing, 4/F, Block 2
CATIC (Zhonghang) Shahe Industrial Zone
Qiao Xiang Road, Nanshan District
Shenzhen 518053, China
Tel : 86-755-8830 8533
Fax : 86-755-8344 6245
Room 1402-4
Jiangxin Guoji Jiayuan Yinzuo
No. 85 Jiefangxi Road, Qingyunpu District
Nanchang 330002, China
Tel : 86-791-8820 1517
Fax : 86-791-8820 7178
Hong Kong 香港
Japan 日本
Korea 韓國
ASM Pacific (Hong Kong) Ltd
4/F Watson Centre, 16-22 Kung Yip Street
Kwai Chung, Hong Kong
Tel : 852-2619 2000
Fax : 852-2619 2118/9
ASM Assembly Technology Co Ltd
5F, Tachikawa F-Bldg, 1-7-18
Nishiki-Cho, Tachikawa-Shi
Tokyo 190-0022, Japan
Tel : 81-42-521 7751
Fax : 81-42-521 7750
ASM Pacific (Hong Kong) Limited
Korea Branch
4F, 628-6, Deungchon-dong
Kangseo-gu, Seoul 157-030, Korea
Tel : 82-2-2659 4174
Fax : 82-2-2659 4216
ASM Pacific (Hong Kong) Limited
Korea Branch
Room 501, 5/F, Hi-Tech Center
958-14 Daechon-Dong, Buk-Gu
Gwangju 500-470, Korea
Tel : 82-62-973 4174
Fax : 82-62-973 4216
ASM Pacific (Holding) Limited
Taiwan Branch
10F, No. 530, Sec. 2, Chung Shan Road
Chung Ho Dist, New Taipei City, Taiwan
Tel : 886-2-2227 3388
Fax : 886-2-2227 3399
Taiwan Branch
1F, No. 7, Lane 91, Dongmei Road
Hsinchu, Taiwan
Tel : 886-3-573 3750
Fax : 886-3-573 3551
Taiwan Branch
8F-1, No. 135, Sec 2
Chung Shan Road, Tantzu
Taichung, Taiwan
Tel : 886-4-2535 6390
Fax : 886-4-2535 6820
ASM Assembly Equipment Malaysia
Sdn Bhd
24A, Jalan Medan Ipoh 1B
Medan Ipoh Bistarli
31400 Ipoh Perak, Malaysia
Tel : 605-542 3991
Fax : 605-542 3992
Sdn Bhd
B-1-12, Jalan SS6/20, Dataran Glomac
Pusat Bandar Kelana Jaya
47301 Petaling Jaya, Malaysia
Tel : 603-7806 4942
Fax : 603-7806 4943
Sdn Bhd
1, Tingkat Satu, Jalan Warisan 1
Taman Warisan Jalan Junid
84000, Muar, Johor, Malaysia
Tel : 606-951 5713
Fax : 606-951 5786
Taiwan 台灣
Taiwan Branch
No. 4-2, East 3 Road Street
N.E.P.Z. Kaohsiung, Taiwan
Tel : 886-7-367 6300
Fax : 886-7-367 6399
Malaysia 馬來西亞
Sdn Bhd
Bayan Point, Block A, No. 15-1-23, 15-1-24
Medan Kampung Relau
11900 Penang, Malaysia
Tel : 604-644 9490
Fax : 604-645 1294
Philippines 菲律賓
Singapore 新加坡
Thailand 泰國
Germany 德國
Edgeward Development Limited
Philippines Branch
7th Floor, NOL Tower, Commerce Avenue
Madrigal Business Park
Barangay Ayala Alabang
Muntinlupa City, Philippines 1770
Tel : 63-2-850 4543
Fax : 63-2-850 4547
ASM Technology Singapore Pte Ltd
ASM Assembly Equipment Bangkok
Ltd
ASM Assembly Systems GMBH & Co. KG
ASMPT Europe
51/3, Vibhavadi Tower, 18/2 Floor
Ngamwongwan Road, Ladyao,
Chathuchak, Bangkok 10900
Thailand
Tel : 66-2-941 3181/2
Fax : 66-2-941 3183
Rupert-Mayer-Street 44
81379 Munich
Germany
Tel : 49-89-20800-20900
Fax : 49-89-20800-41868
Email : [email protected]
2 Yishun Avenue 7
Singapore 768924
Tel : 65-6752 6311
Fax : 65-6758 2287
U.S.A. 美國
ASM Pacific Assembly Products Inc.
3440 East University Drive, Phoenix
Arizona 85034-7200
U.S.A.
Tel : 1-602-437 4760
Fax : 1-602-437 4630
ASM Pacific Assembly Products Inc.
(Western Regional Office)
97 East Brokaw Road, Suite 100
San Jose, California 95112-4209
U.S.A.
Tel : 1-408-451 0800
Fax : 1-408-451 0808
http://www.asmpacific.com
NB3

2013 version_NB3 - ASM Assembly Systems

Transcription

Similar documents

led packaging - ASM Assembly Systems

catalog - Big Rock Alpaca Farm