D-NE920/NE920LS
Transcription
D-NE920/NE920LS SERVICE MANUAL US Model Canadian Model AEP Model UK Model Ver. 1.5 2007.02 D-NE920 E Model D-NE920/NE920LS Australian Model Tourist Model D-NE920 Photo : BLUE Model Name Using Similar Mechanism NEW CD Mechanism Type CDM-3325ERV2 Optical Pick-up Name DAX-25EV SPECIFICATIONS System Compact disc digital audio system Laser diode properties Material: GaAlAs Wavelength: λ = 770 - 800 nm Emission duration: Continuous Laser output: Less than 44.6 µW (This output is the value measured at a distance of 200 mm from the objective lens surface on the optical pick-up block with 7 mm aperture.) Headphones (stereo minijack) Approx. 5 mW + Approx. 5 mW at 16 kΩ (Approx. 1.5 mW + Approx. 1.5 mW at 16 kΩ)* *For the customers in Europe Optical digital output (optical output connector) Output level: –21- –15 dBm Wavelength: 630 - 690 nm at peak level D-A conversion 1-bit quartz time-axis control Power requirements • Sony NH-14WM rechargeable battery: 1.2 V DC × 1 • LR6 (size AA) battery: 1.5 V DC × 1 • AC power adaptor (DC IN 3 V jack) • Rated current: 1 A Frequency response 20 - 20 000 Hz +1 -2 dB (measured by JEITA) Operating temperature 5°C - 35°C (41°F - 95°F) Output (at 3 V input level) Line output (stereo minijack) Output level 0.7 V rms at 47 kΩ Recommended load impedance over 10 kΩ Dimensions (w/h/d) (excluding projecting parts and controls) Approx. 127 × 20.6 × 136.4 mm (5 × 1316 × 5 3 8 in.) Mass (excluding accessories) Approx. 160 g (5.7 oz.) Supplied accessories • AC power adaptor • Charging stand • External battery • Rechargeable battery case with cover • Battery carrying case • Carrying pouch • Earphones • Remote control • CD-ROM (SonicStage) • Operating instructions • Installation/Operating Guide • AC plug adaptor (Supplied with tourist model) US and foreign patents licensed from Dolby Laboratories. Design and specifications are subject to change without notice. PORTABLE CD PLAYER 9-879-269-06 2007B16-1 © 2007.02 Sony Corporation Personal Audio Division Published by Sony Techno Create Corporation D-NE920/NE920LS CAUTION • INVISIBLE LASER RADIATION WHEN OPEN • DO NOT STARE INTO BEAM OR VIEW DIRECTLY WITH OPTICAL INSTRUMENTS • CLASS 1M INVISIBLE LASER RADIATION WHEN OPEN • DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 °C during repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. On AC power adaptor • Use only the AC power adaptor supplied. If your CD player is not supplied with the one, use the AC-E30HG AC power adaptor. Do not use any other AC power adaptor. It may cause a malfunction. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! • Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. • To clean the terminals If the terminals on the charging stand become dirty, the battery may not be charged properly. Clean the terminals with a cotton swab or a dry cloth periodically as illustrated below. Terminals Polarity of the plug • Do not touch the AC power adaptor with wet hands. • Connect the AC power adaptor to an easily accessible AC outlet. Should you notice an abnormality in the AC power adaptor, disconnect it from the AC outlet immediately. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. 2 LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. D-NE920/NE920LS You can play discs on this CD player. Audio CDs: CD-DA format CDs CD-DA (Compact Disc Digital Audio) is a recording standard used for Audio CDs. ATRAC CDs: CD-R/CD-RW on which audio data compressed in the ATRAC3plus format has been recorded by using SonicStage* ATRAC3plus (Adaptive Transform Acoustic Coding3plus) is audio compression technology that satisfies the demand for high sound quality and high compression rates. ATRAC3plus can compress audio files to about 1/20 of their original size at 64 kbps. Bit rates and sampling frequencies this CD player can play are: ATRAC3 ATRAC3plus Bit rates 66/105/132 kbps 48/64/256 kbps Sampling frequencies 44.1 kHz 44.1 kHz Up to 62 characters can be displayed on this CD player. MP3 CDs: CD-R/CD-RW on which audio data compressed in the MP3 format has been recorded by using a software other than SonicStage* Bit rates and sampling frequencies this CD player can play are shown below. Variable Bit Rate (VBR) files can also be played. Bit rates Sampling frequencies MPEG-1 Layer3 32 - 320 kbps 32/44.1/48 kHz MPEG-2 Layer3 8 - 160 kbps 16/22.05/23 kHz MPEG-2.5 Layer3 8 - 160 kbps 8/11.025/12 kHz This CD player conforms to Version 1.0/1.1/2.2/2.3/2.4 of the ID3 tag format. ID3 tag is a format for adding certain information (track name, album name, artist name, etc.) to MP3 files. Up to 64 characters of ID3 tag information can be displayed on this CD player. CD-Extra and Mix-Mode CDs: CD-R/CD-RW on which CD-DA format data and CD-ROM format data are recorded together.* If you cannot play your CD, change the "CD-EXTRA" setting in the OPTION menu. Then you may play your CD. An ATRAC CD on which audio data compressed in the MP3 format has been recorded using software other than SonicStage can also be played. With SonicStage, you cannot create a CD on which mixed format audio data is recorded. * Only ISO 9660 Level 1/2 and Joliet extension format discs can be played. Music discs encoded with copyright protection technologies This product is designed to play back discs that conform to the Compact Disc (CD) standard. Recently, various music discs encoded with copyright protectiontechnologies are marketed by some record companies. Please be aware that among those discs, there are some that do not conform to the CD standard and may not be playable by this product. TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. 3-2. 3-3. 3-4. 3-5. Disassembly Flow ........................................................... Upper Lid Sub Assy ........................................................ SWITCH Board ............................................................... Cabi Mid Sub Assy .......................................................... EGH Board, CD Mechanism Deck (CDM-3325ERV2) .......................................................... 3-6. JACK Board, JACK SUB Board ..................................... 3-7. Turn Table Motor Assy (M901), Sled Motor Assy (M902), Optical Pick-up (DAX-25EV) ......................................... 7 8 9 10 11 12 12 4. ELECTRICAL CHECKING .................................... 13 5. DIAGRAMS 5-1. 5-2. 5-3. 5-4. 5-5. 5-6. 5-7. 5-10. 5-11. Block Diagram ................................................................ Printed Wiring Board – EGH Board (Side A) – ............. Printed Wiring Board – EGH Board (Side B) – ............. Schematic Diagram – EGH Board (1/3) – ...................... Schematic Diagram – EGH Board (2/3) – ...................... Schematic Diagram – EGH Board (3/3) – ...................... Printed Wiring Board – JACK Board (Side A), JACK SUB Board – ................ Printed Wiring Board – JACK Board (Side B) – ............ Schematic Diagram – JACK Board, JACK SUB Board – ............................... Printed Wiring Board – SWITCH Board – .................... Schematic Diagram – SWITCH Board – ....................... 6. EXPLODED VIEWS 5-8. 5-9. 15 16 17 18 19 20 21 22 23 24 25 6-1. Overall Assy .................................................................... 31 6-2. Cabinet (Lower) Section .................................................. 32 6-3. CD Mechanism Section (CDM-3325ERV2) ................... 33 7. ELECTRICAL PARTS LIST .................................. 34 3 D-NE920/NE920LS Ver. 1.3 SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S501. (push switch type) The following checking method for the laser diode is operable. • Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S501 with a screwdriver having a thin tip as shown in Fig.1. 3. Press the u button. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will move up and down 4 times along with inward motion for the focus search. lever (lid detection) S501 JACK BOARD lever (lid detection) Fig. 1 Method to push the S501 4 NOTES ON HANDLING OF PATCH The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH. D-NE920/NE920LS SECTION 2 GENERAL 'UIDETO0ARTSAND #ONTROLS Ȣ This section is extracted from instruction manual. GROUPnBUTTONAPAGE ȣ ¼ÊBUTTONSAPAGE Ȥ GROUPBUTTONAPAGE ȥ/02/PERATIONLAMPAPAGE #$PLAYER Ȧ$30,$ISPLAY-%.5BUTTONAPAGE ȧ3%!2#(BUTTONAPAGE Ȩ ýSTOP#('BUTTONAPAGE ȩ*OGLEVER 6/,6OLUMEnAPAGE b|APAGE úPLAYPAUSEAPAGE Ȫ(/,$SWITCHONTHEBACKOFTHE#$ PLAYERAPAGE ȫ ¦HEADPHONES,).%/54/04)#!, JACKAPAGE Ȭ/0%.SWITCHAPAGE ȭ4ERMINALSFORTHECHARGINGSTANDEXTERNAL BETTERYCASEAPAGE Ȯ/PERATIONDIALAPAGE ȯ6/,6OLUMEnCONTROLAPAGE 2EMOTE Ȱ&UNCTIONBUTTONAPAGE ȱ&UNCTIONDIALAPAGE Ȳ úPLAYPAUSE BUTTONAPAGE ȳ ýSTOPBUTTONAPAGE ȴ#LIPAPAGE 4HISBUTTONHASATACTILEDOT 5 D-NE920/NE920LS #$PLAYERDISPLAY 2EMOTEDISPLAY ȵ#HARACTERINFORMATIONDISPLAYAPAGE ȶ!TRACPLUS-0INDICATORAPAGE ȷ$ISCINDICATORAPAGE ȸ"ATTERYINDICATORAPAGE ȹ0LAYLISTINDICATORAPAGE Ⱥ'ROUPINDICATORAPAGE Ȼ"OOKMARKINDICATORAPAGE XK0LAYMODEINDICATORAPAGE XL4IMERINDICATORAPAGE XM3OUNDINDICATORAPAGE 6 D-NE920/NE920LS SECTION 3 DISASSEMBLY Note: Disassemble the unit in the order as shown below. 3-1. DISASSEMBLY FLOW SET 3-2. UPPER LID SUB ASSY (Page 8) 3-4. CABI MID SUB ASSY (Page 10) 3-3. SWITCH BOARD (Page 9) 3-5. EGH BOARD, CD MECHANISM DECK (CDM-3325ERV2) (Page 11) 3-6. JACK BOARD, JACK SUB BOARD (Page 12) 3-7. TURN TABLE MOTOR ASSY(M901), SLED MOTOR ASSY(M902), OPTICAL PICK-UP(DAX-25EV) (Page 12) 7 D-NE920/NE920LS Note: Follow the disassembly procedure in the numerical order given. 3-2. UPPER LID SUB ASSY 2 two screws 3 bracket (hinge R) 4 bracket (hinge L) 1 Push two knobs and open the upper lid. 5 Close the cover until the tip of the cover of the upper lid sub assembly is left open by 5 mm, then slide the upper lid sub cover assembly in the direction of the arrow. 8 upper lid sub assy 6 7 8 D-NE920/NE920LS 3-3. SWITCH BOARD 1 six screws 2 upper lid 4 SWITCH board 3 flat cable (CN1002) 5 button 6 upper lid assy 9 D-NE920/NE920LS 3-4. CABI MID SUB ASSY spring (lock claw) 2 seven screws 1 two screws open knob (R) open knob (L) 7 cabi mid sub assy 4 open knob (L) 3 spring (lock claw) 6 spring (upper lid) 5 open knob (R) battery terminal board (+) Note: It is recommended to visually check that the battery terminal board (+) is installed in the specified position after assembling the cabi mid sub assy because, in some cases, the battery terminal board (+) cannot be housed when assembling the cabi mid sub assy. 10 D-NE920/NE920LS 3-5. EGH BOARD, CD MECHANISM DECK (CDM-3325ERV2) 7 two insulators 8 CD mechanism deck (CDM-3325ERV2) 6 EGH board 4 reinforcement (upper) 7 insulator 5 flexible board (CN604) 1 connector (4pin) 2 connector (2pin) 3 Remove solder of the JACK board. 11 D-NE920/NE920LS 8 shield tape 3-6. JACK BOARD, JACK SUB BOARD 9 Remove solder of the shield tape. qs battery terminal board (-) 0 qd flat cable 6 Remove solder of the JACK board. qf JACK board 4 cushion 2 Remove solder of the JACK board. 5 cushion qa Remove solder of the JACK board. 7 SUB board (battery terminal board (+)) 3 JACK SUB board 1 cushion 3-7. TURN TABLE MOTOR ASSY (M901), SLED MOTOR ASSY (M902), OPTICAL PICK-UP (DAX-25EV) 1 three screws (B 1.7 × 4) 2 gear cover 4 optical pick-up(DAX-25EV) 3 sled motor assy(M902) 5 three screws (B 1.7 × 4) 6 turn table motor assy(M901) 12 D-NE920/NE920LS SECTION 4 ELECTRICAL CHECKING The CD section adjustments are done automatically in this set. In case of operation check, confirm that RF level. Precautions for Check 1. Perform check in the order given. 2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise indicated. 3. Power supply voltage requirement : DC1.5V in battery terminals. VOLUME button HOLD switch : Minimum : OFF Checking Location: [EGH BOARD] (SIDE B) TP608 (RF) IC604 TP602 (GND A) RF Level Check Condition: • Hold the set in horizontal state. Connection: Oscilloscope (AC range) EGH board TP608 (RF) TP602 (GND A) 2 kΩ + – Procedure: 1. Connect the oscilloscope to the test points TP608 (RF) and TP602 (GND A) on the EGH board. 2. Set a disc. (YEDS-18) 3. Press the u button. 4. Check the oscilloscope waveform is as shown below. A good eye pattern means that the diamond shape (◊) in the center of the waveform can be clearly distinguished. RF Signal reference Waveform (Eye Pattern) VOLT/DIV : 100 mV (With the 10:1 probe in use) TIME/DIV : 500 ns RF level 0.55 to 0.6 Vp-p To watch the eye pattern, set the oscilloscope to AC range and increase the vertical sensitivity of the oscilloscope for easy watching. 5. Stop revolving of the disc motor by pressing the x button. 13 D-NE920/NE920LS Ver. 1.4 SECTION 5 DIAGRAMS NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. Note on Printed Wiring Boards. • X : parts extracted from the component side. • Y : parts extracted from the conductor side. • : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated. • These boards are multi-layer printed board. However, the paterns of intermediate-layer have not been included in the diagram. Note on Schematic Diagrams. • All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • f : internal tolerance. • C : panel designation. Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Note: Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une piéce por tant le numéro spécifié. • A : B+ Line. • Total current is measured with CD installed. • Power voltage is dc 1.5 V and fed with regulated dc power supply from battery terminals. • Voltages and waveforms are dc with respect to ground in playback mode. no mark : CD PLAY ∗ : Impossible to measure • Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances. • Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. • Circled numbers refer to waveforms. • Signal path. J : CD c : DIGITAL OUT • Abbreviation EE : East European model JE : Tourist model KR : Korean model • Waveforms – EGH Board – 1 TP608 (RF) 540 mVp-p 200 mV/DIV, 400 ns/DIV 2 IC603 <z/b> EXTAL 3.0 Vp-p 44.1 ns 1 V/DIV, 20 ns/DIV 14 D-NE920/NE920LS Ver. 1.4 5-1. BLOCK DIAGRAM IC603 SYSTEM CONTROLLER VCC1 DOUT 84 J301 PF6/DBG6/X PLUG DTC 128 IC606 +2V REG VCC3 AOUTL 102 AOUTR 97 2V 106 XTAN SDATA 12 X601 105 EXTAL 22.579MHz SCLK 11 RFOUT 15 75 P17/AIFBCK DETECTOR RF A B E F FE(A) SE(B) 167 FFDR R13 41 168 FRDR F12 43 165 TFDR R12 44 166 TRDR A1-A19 237 M902 SLED M MOTOR 26 FO3 163 SFDR R11 48 164 SRDR F- 28 RO3 T+ 21 FO2 PWM 35 T- 24 RO2 SYNC 33 S+ 13 FO1 COLDST 37 S- 17 RO1 COM U M901 SPINDLE MOTOR V W 26-29, 32-35, 38,39, D0-D15 41,42, 44-47 240 D0-D-15 APWM 34 IC604 S-RAM 12,13, 15,16, SDDQ16 18,19, 21,22, SDDQ1 25-28, 30,31, 34,36, 169 MDP SDA11 171 C176 SDA0 181 PG7 DATA 36 177 PC1/SO0 CLOCK 30 178 PC0/SCK0 12 CPV1 8 CPU1 107 CPW1 11 COM 9 UO 6 VO 4 WO FG 23 214 PD2/INT2/ECIN IC602 EEPROM SCK 6 2,3,5, 6,8,9, 11,12, DQ16 39,40, DQ1 42,43, 45,46, 48,49, IC402 POWER CONTROLLER 19 51,52, 57,58, 60,61, 63,64, 66,67, 69,70, XSDWE SOUDQW XSDCAS XSXCS XSDRAS SDCLK SDCKE SDUDQW 22 A19 31 CE 37 OE 24 . A11 27 A0 32 15 14 16 18 17 35 34 36 33 40 41 42 44 47 45 48 XWE LDQW XCAS XCS XRAS CLK CKE UDQW IC401(2/2) POWER CONTROL 27 VM3 25 VM23 22 VM2 VCC1 DI 5 DO 2 176 PC2/SI0 XCS 1 VCC2 4 PE3 199 AN2 4 VDD D1002 • R-CH is omitted due to same as L-CH. • Signal Path : CD 8 OSC 7 CHV ENA 3 LDR VDD 2 LIQUID CRYSTAL DISPLAY MODULE PC3/XCS0 NRD NCS1 AN0 184217 2 1 3 XRST 204 PF2/DBG2 76 212 WAKE IC1001 LCD DRIVER 8 AN7 200 AN1 77 185 197 PG6 FUNCTION KEY 78 PG5 S1001, 1002, 1004, 1006, 1010 PG4 PE7/XSCS1 PE5/SO1 PE6/SI1 PE4/XSCK1 FUNCTION KEY RSTB CSB SDO SDI SCK S1007, 1009 SLIDE SWITCH P16/AIFLRCK S1003 ADDSEL0 129 218 238 PD4/INT4 TRACKING COIL 1,2 5-8, 11-15, A0-A15 17-20, 23-25, 30 255 F11 47 VCC2 IC605 P2ROM 219 F13 42 Q302,303 MUTING CONTROL 7 VDD0 8 VDD0 Q402,403 VDD CONTROLLER PE2/DTCK FOCUS C0IL IC403 BUFFER Q304,305 MUTING CONTROL JE, KR 89 PAPC F+ Q406 SWITCH VG IC401(1/2) COIL/MOTOR DRIVER 63 VAPC PD RFAC RFDC FE(A) SE(B) CE(E) TE(F) 183 182 194 202 132 201 175 Q601 LED DRIVER LED2 AN6 195 Q405 SWITCH CINW 53 VIN34 61 VO2 66 VIN12 70 74 VCC1 SW 101 98 VCC1 VM-U 10 VM-VW 7 VIN 105 66 VCC2 97 VCC2 3 VD B 2 VD T Q404 SWITCH BATM1 67 PWRSW1 78 5 RSTB PWRSW2 81 55 CHGWON Q402 REG CRF 54 XADEVENT 203 IC401 4 KEY CONTROLLER 38 WAKE J402 (FOR STAND CHARGER) Q401 SWITCH OFF > HOLD S501 (OPEN/CLOSE) : DIGITAL OUT D-NE920/NE920LS 15 15 W401 RECHARGEABLE BATTERY NH-14WM W402 1PCS. 1.2V DCIN 64 Q403 CHARGE SWITCH 32 LATCHB S502 S501 Q401 SWITCH J401 (FOR STAND CHARGER) VIN ON 1 LED1 D1001 OPR AN4 LD Q307 MUTE OUT1 6 1 MCK 11 EN2 4 EN1 P15 VCC1 3 IN1 R-CH PG3 LASER DIODE 151 144 139 140 142 141 PWML 111 PWMR 112 DAMPCLK 109 PJ7/MON7(MON CK) 85 PJ6/MON6(MONDO) 86 P14/AIFPCMD VCC R-CH IC3007 HP AMP SENB 10 17 RFIN Q306 MUTE R-CH PF7/DBG7/X METAL DTC 127 IC601 RF AMP OPTICAL PICK-UP BLOCK (DAX-25EV) LINEOUT (OPTICAL) CHGSW 49 Q602 SWITCH 39 RMCRB RS 50 D-NE920/NE920LS Ver. 1.4 5-2. PRINTED WIRING BOARD – EGH BOARD (SIDE A) – :Uses unleaded solder. OPTICAL PICK-UP BLOCK (DAX-25EV) EGH BOARD (SIDE A) IC606 1 2 4 3 JE, KR A IC601 * IC603 *CSP JACK BOARD CN9002 (Page 21) (Chip Size Package) * IC605 *CSP R622 IC3007 3 (Chip Size Package) IC602 1 IC403 4 5 AEP, UK, EE EXCEPT AEP, UK, EE 11 1-863-862- (11) ✩ IC603 (System Controller) on an EGH board can not be replaced individually. Replace with an EGH board assembly for service. • Semiconductor Location Ref. No. Location IC403 IC601 IC602 IC603 IC605 IC606 IC3007 D-4 C-9 D-8 C-7 C-10 A-7 D-3 Q601 C-5 D-NE920/NE920LS 16 16 ★ NOTES ON HANDLING OF PATCH The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH. D-NE920/NE920LS 5-3. PRINTED WIRING BOARD – EGH BOARD (SIDE B) – :Uses unleaded solder. (RF) EGH BOARD (SIDE B) IC604 * IC401 *CSP 1 5 4 (GND A) R621 3 IC402 (Chip Size Package) 11 R624 R625 1-863-862- (11) C631 R616 C617 • Semiconductor Location D-NE920/NE920LS 17 17 Ref. No. Location D401 D405 C-8 A-8 IC401 IC402 IC604 C-9 C-8 B-3 Q401 Q402 Q403 Q404 Q405 Q406 Q602 D-8 C-6 D-7 B-8 B-8 B-7 C-6 D-NE920/NE920LS 5-4. SCHEMATIC DIAGRAM – EGH BOARD (1/3) – 19 Q405 QS6K1 C431 47 6.3V C450 1 R414 4.7k L409 Q404 QS6K1 L405 R423 4.7k L402 CN9001 50P C423 47 6.3V C439 0.22 C410 0.01 C409 0.01 TP618 C416 0.22 C435 4.7 R405 100k C417 0.22 R401 100k Q401 DTC115TE-TL C415 0.01 R435 47k C402 0.01 C424 0.22 C401 0.1 R402 100k R408 100k D405 MA785-(TX),SO L408 C434 2.2 C432 10 IC401 SC901590VAR2 C418 0.1 R430 1M C419 0.01 R432 1k 23 C420 0.1 20 C421 1 C449 100p R421 100k R431 1M C405 0.047 R417 100 R436 1k R404 1M L406 C447 1 L410 R424 1M L401 R409 47k C444 47 6.3V R437 1k L403 C412 0.1 C408 0.22 C411 0.1 R428 47k C422 1 R427 2.2M R426 47k C413 0.01 C445 0.1 R429 22k C414 4700p C446 1 R446 10k TP403 VCC1 R406 0 L407 R407 0 TP405 VIN C437 47 6.3V C441 0.1 C427 22 6.3V C442 0.1 C426 47 6.3V TP404 P_GND FB402 0 D-NE920/NE920LS 18 18 C443 0.1 C429 22 6.3V C430 47 6.3V C448 0.1 C428 10 6.3V C440 47 6.3V FB401 0H L404 D-NE920/NE920LS • See page 14 for Waveform. • See page 26 for IC Pin Function Description. TP601 OPGSW TP608 RF R624 10k R629 2.2k R623 10k R608 47k Ver. 1.3 R634 10k C649 0.47 C650 4700p RB601 22k C653 0.47 C654 0.1 R637 220k C602 470p R655 100k R649 22k R642 47k R639 47k R610 22k C603 1 C610 1 C626 1 C617 4700p C618 4700p C631 0.1 R616 470k C609 2200p C646 0.1 R620 47k TP627 ADDSEL_1 R609 22k IC606 XC6213B212NR C605 0.22 CN601 15P R618 1k R636 100k C627 22 6.3V R625 10k C607 0.01 C629 0.1 R617 10k R621 1k R603 10 C695 4700p R650 100k R651 100k R601 Q602 220k 2SA1832FV R615 (TH3SONY) 220k C619 4700p TP602 GND_A C608 22p C694 0.1 R628 2.2k R602 10k TP604 OPSTB C601 22 6.3V C648 0.1 C614 0.047 R635 1M 5-5. SCHEMATIC DIAGRAM – EGH BOARD (2/3) – ✩ IC603 (System Controller) on an EGH board can not be replaced individually. Replace with an EGH board assembly for service. C659 0.1 Q601 XP4214-TXE TP621 PD7 TP609 TEST TP630 ADDSEL_0 TP611 PD5 C612 0.1 TP610 PD1 C611 0.01 R653 10k R611 0 C604 0.1 C606 0.01 IC601 CXD9839K-G C613 0.1 X601 22.579MHz R613 0 C680 6p C667 0.1 C681 6p R644 R606 0 47 IC603 CASINO1 C664 47 6.3V 20 C678 22 6.3V C677 0.1 R604 220k EXCEPT AEP, UK, EE TP622 MON1 TP623 MON2 TP624 MON3 TP625 MON4 TP626 MON5 TP607 EXT_FLASH&SRAM_V R622 220k AEP, UK, EE TP629 PI1 R612 100k C676 0.1 TP617 VCC2 TP612 SK TP614 DO TP615 CS TP616 GND TP613 DI C639 0.1 C645 0.22 TP619 AK6510CL-L TP620 IC602 18 ★ NOTES ON HANDLING OF PATCH The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH. D-NE920/NE920LS 19 19 D-NE920/NE920LS Ver. 1.4 5-6. SCHEMATIC DIAGRAM – EGH BOARD (3/3) – • See page 26 for IC Block Diagram. JE, KR C404 100 6.3V R403 100k C403 10 IC604 MSM56X16160F-20T L412 IC605 MR27T1602F FB101 0H D401 RB521S-30FTE61 C103 220 4V IC402 NCP1400ASN22T1G C687 0.1 C102 100 4V R302 100 R418 22k R101 100 IC3007 NJU8713V-TE2 R607 0 Q403 EMT1T2R R419 1k R415 100 R202 100k R411 10k R410 47k R413 10k Q402 EMX1T2R R420 10k C433 0.047 C3089 0.1 C201 1 R412 2.2k C425 1 C438 1 C689 0.1 R102 100k C436 IC403 0.47 LMV301MGX/NOPB Q406 DTA115TE 19 C686 47 6.3V 18 C202 220 4V R619 0H FB201 0H R201 100 D-NE920/NE920LS 20 20 D-NE920/NE920LS 5-7. PRINTED WIRING BOARD – JACK BOARD (SIDE A), JACK SUB BOARD – :Uses unleaded solder. JACK BOARD (SIDE A) S501 (OPEN/CLOSE) • Semiconductor Location J301 2 / LINE OUT (OPTICAL) A EGH BOARD CN9001 (Page 16) M901 SPINDLE MOTOR M902 SLED MOTOR JACK SUB BOARD TP401 TP403 TP402 11 RECHARGEABLE BATTERY NH-14WM 1.2V 1350mAh 1-864-415- (11) J401 (FOR STAND CHARGER) J402 (FOR STAND CHARGER) 11 1-864-414- (11) D-NE920/NE920LS 21 21 Ref. No. Location D401 D402 D901 D902 D903 D905 D906 G-8 F-6 A-3 C-3 C-3 F-5 F-8 Q301 Q302 Q306 B-3 B-4 A-4 D-NE920/NE920LS :Uses unleaded solder. 5-8. PRINTED WIRING BOARD – JACK BOARD (SIDE B) – JACK BOARD (SIDE B) S502 HOLD ON OFF • Semiconductor Location Ref. No. Location D904 E-6 IC401 E-4 Q303 Q304 Q305 Q307 Q401 Q402 Q403 C-6 C-7 C-6 C-7 G-3 F-6 G-2 Q305 R316 B SWITCH BOARD CN1002 (Page 24) IC401 6 1 4 3 11 1-864-414- (11) D-NE920/NE920LS 22 22 D-NE920/NE920LS 5-9. SCHEMATIC DIAGRAM – JACK BOARD, JACK SUB BOARD – CN601 4P CN602 2P TP9034 CN501 15P S501 (OPEN/CLOSE) R501 0 R502 0 TP9005 SL501 IC401 RT8H055C-T1 R503 0 R504 0 CN9002 50P TP9004 S502 R505 0 TP9009 R411 1M FB901 OH TP9007 TP9033 FB902 0H C407 470p TP9032 25 R314 2.2k R316 2.2k TP9003 R102 220 TP9001 R308 1k C304 1 R311 22k TP9008 L201 C103 0.22 R313 22k R312 1M TP9036 L101 FB803 R304 4.7 C301 1 R202 220 C101 2.2 Q305 EMG6 R307 2.2k R303 2.2k Q304 UMD12N-TR C201 2.2 C203 0.22 TP9035 Q307 EMX18 TP9030 TP9038 R315 2.2k FB804 TP9037 C801 220p C305 0.1 C802 220p J301 R203 220k R103 220k FB806 0 FB802 FB805 TP9024 R309 1M TP9041 TP9040 FB801 D903 RSB6.8STE61 D901 MAZZ068H01S0 C904 1 C902 1 D902 RSB6.8STE61 TP901 C302 0.1 TP9042 TP9043 R306 220k Q301 2SD2652T106 TP9044 C306 0.01 TP9046 D904 MA8051-TX R305 220k FB903 0H TP9028 TP9029 Q306 NTHD5904T1 Q302 2SD2652T106 Q401 2SA1602TP-1EF RB301 1.0k R310 1k Q303 UMD2N-TR TP9026 TP9011 TP9012 D402 MA2YD2300LS0 R401 1M J401 TP401 TP9014 TP9015 Q402 2SA1363-T111-1E R402 470k CN401 3P TP9013 TP9016 TP9017 R406 100 TP402 TP403 TP9039 R408 47k TP9019 TP9020 TH401 TP408 LF401 C402 1 C901 1 C409 10 R404 220k C406 0.22 R405 47k R407 0.22 R410 47k TP411 VDR901 FB401 1000P C404 4.7 R403 470k TP410 C403 220 6.3V D906 RSB6.8STE61 TP407 R409 220 Q403 2SD2652T106 D905 MA8051-TX W402 J402 F401 1.4A/ 32V TP409 D401 MA22D2800LS0 W401 FB402 0 D-NE920/NE920LS 23 23 TP9025 18 D-NE920/NE920LS :Uses unleaded solder. 5-10. PRINTED WIRING BOARD – SWITCH BOARD – SWITCH BOARD IC1001 DSPL/MENU = LIQUID CRYSTAL DISPLAY OPR ^ (PUSH) VOL+ (UP) SEARCH VOL- (DOWN) B + p /CHG 11 1-864-416- (11) • Semiconductor Location D-NE920/NE920LS 24 24 Ref. No. D1001 D1002 Location C-2 B-8 IC1001 B-7 JACK BOARD CN501 (Page 22) D-NE920/NE920LS 5-11. SCHEMATIC DIAGRAM – SWITCH BOARD – CN1001 26P CN1002 15P VDR1001 TP1002 R1011 1k TP1003 R1012 1k TP1004 R1013 1k TP1005 R1014 1k TP1007 TP1008 C1014 0.1 C1026 0.1 C1011 0.22 R1010 1k TP1006 R1006 0 C1012 0.22 TP1001 R1119 0 D1001 SML-521MUW 23 R1113 220 R1005 FB R1114 1k C1010 0.22 C1002 0.1 R1002 1k R1007 0 C1008 0.47 R1001 0 D1002 1SS403(TPH3) C1013 0.01 L1001 TP1009 R1115 4.7k R1101 10k R1118 47k R1102 4.7k TP1010 C1007 0.22 R1105 2.2k R1103 2.2k R1009 0 R1106 4.7k R1109 1k S1004 S1006 C1006 0.22 C1005 0.22 IC1001 SM8142BD-G-EL C1004 0.22 S1010 S1001 S1002 C1003 0.22 R1008 0 R1004 100k R1104 22k R1107 10k R1110 2.2k R1016 47k C1025 10 C1001 0.01 S1007 25 25 S1003 R1112 22k R1108 22k D-NE920/NE920LS R1111 2.2k S1009 D-NE920/NE920LS • IC Block Diagrams • IC Pin Function Description EGH BOARD IC603 CASINO1 (SYSTEM CONTROLLER) – EGH Board – Pin No. IC402 NCP1400ASN22TIG PE6/SI1 I Status read signal input from LCD driver (not used) PE5/SO1 O Command send signal output to LCD driver (not used) 3 PE4/XSCK1 O Clock signal output to LCD driver (not used) 4 PE3 O Chip select signal output to EEPROM 5 VDIO0 – Power supply terminal (+2.1V) 6 VSS0 – Ground terminal POWER 7 DVDD7 – Power supply terminal (+1.5V) SWITCH 5 LX ERROR AMP DRIVER - 8 PE2/DTCK I LCD indication of remote control signal output PHASE PWM 9 PE1/RxD0 I not used COMPENSATION CONTROLLER 10 PE0/TxD0 O not used 11 EVA – Ground terminal 180 kHz 12 SDDQ16 I/O OSCILLATOR 13 SDDQ15 I/O 14 TAPTDO – 15 SDDQ14 I/O Data bus to SDRAM 16 SDDQ13 I/O Data bus to SDRAM 17 SCANEN – 18 SDDQ12 I/O Data bus to SDRAM 19 SDDQ11 I/O Data bus to SDRAM VOLTAGE SOFT-START REFERENCE NC 3 4 GND RFOUT DETIN CAGCT CAGCT CAGCT IC601 CXD9839K-G 15 14 13 12 11 NC 16 RFIN 17 LOW BOOST AGC RF EQUALIZER SERIAL I/F RF EQUALIZER VDD 18 RF EQUALIZER WOBBLE BPF AMP 2 3 4 5 WBIN WBOUT WCIN WOOUT WPCOU 20 TEST2 – 21 SDDQ10 I/O Data bus to SDRAM 22 SDDQ8 I/O Data bus to SDRAM 23 VDIOSD0 – – 10 SENB Data bus to SDRAM 9 VSS 26 SDDQ6 I/O Data bus to SDRAM 8 VREF 27 SDDQ7 I/O Data bus to SDRAM 28 SDDQ2 I/O Data bus to SDRAM 7 TEST3 – 30 SDDQ4 I/O Data bus to SDRAM XPCLK 31 SDDQ3 I/O Data bus to SDRAM WPOL 32 TEST0 – Ground terminal 33 XSDWE O WE signal output to SDRAM 34 SDDQ1 I/O Data bus to SDRAM 35 TEST1 – 36 SDDQ5 I/O Data bus to SDRAM 37 SDLDQM O UDQM signal output to SDRAM 38 VDIOSD1 – Power supply terminal (+2.1V) BEEP Chip select signal output to SDRAM VDD XCAS signal output to SDRAM O IN2 O XSDCS EN2 XSDCAS 42 VSSO Ground terminal LDQW signal output to SDRAM OUT2 – O VDDO VSS2 11 12 13 14 41 BPZ OUTPUT 1 MCK 2 VSS 3 IN1 EN1 VSSO OUT1 VDDO 4 D-NE920/NE920LS 26 26 Ground terminal SDUDQM 10 OUTPUT CONTROL Ground terminal 39 9 5 Ground terminal 29 8 6 Power supply terminal (+2.1V) I/O 40 7 Ground terminal VSS1 IC3007 NJU8713V-TE2 BPZ OUTPUT Ground terminal SDDQ9 6 1 Data bus to SDRAM not used 25 WOBBLE LPF AMP WLOUT 20 Data bus to SDRAM 24 to each block WOIN 19 Description 2 VLX LIMITER + I/O 1 CE 1 OUT 2 Pin Name 43 TEST5 – not used 44 XSDRAS O XRAS signal output to SDRAM 45 SDCKE O CKE signal output to SDRAM 46 TEST6 – not used 47 SDCLK – Clock signal output to SDRAM 48 SDA13 – not used 49 XTRST – not used 50 SDA12 – not used D-NE920/NE920LS Pin No. Pin Name I/O Description 51 SDA11 O Address bus to SDRAM 52 SDA10 O Address bus to SDRAM 53 VDIOSD2 – Power supply terminal (+2.1V) 54 VSS3 – Ground terminal 55 DVDD0 – Power supply terminal (+1.5V) 56 TMS – not used 57 SDA8 O Address bus to SDRAM 58 SDA9 O Address bus to SDRAM 59 TDO – not used 60 SDA7 O Address bus to SDRAM 61 SDA6 O Address bus to SDRAM 62 TDI – not used 63 SDA4 O Address bus to SDRAM 64 SDA5 O Address bus to SDRAM 65 TEST4 – Ground terminal 66 SDA1 O Address bus to SDRAM 67 SDA2 O Address bus to SDRAM 68 RTCK – not used 69 SDA0 O Address bus to SDRAM 70 SDA3 O Address bus to SDRAM 71 TCK – not used 72 VDIOSD3 – Power supply terminal (+2.1V) 73 VSS4 – Ground terminal 74 VDIO1 – Power supply terminal (+2.1V) 75 PI7/AIFBCK O Latch signal output to RF amplifier (not used) 76 PI6/AIFLRCK O LCD back light on/off signal output (not used) 77 PI5 O Line out/headphone mute control signal output 78 PI4/AIFPCMD O Headphone amplifier chip enable signal output 79 PI3/XBCKO O signal output to outside D/A converter (not used) 80 PI2/LRCKO O signal output to outside D/A converter (not used) 81 PI1 I/O not used 82 PI0/PCMDO O signal output to outside D/A converter (not used) 83 ADCLK I signal output to outside D/A converter (not used) 84 DOUT O Output terminal of digital audio signal 85 PJ7/MON7(MONCK) O Headphone amplifier setting control signal output 86 PJ6/MON6(MONDO) O Headphone amplifier setting control signal output 87 PJ5/MON5 O Headphone amplifier, power control signal output (not used) 88 PJ4/MON4 O SCOR monitor signal output (not used) 89 PJ3/MON3 O GPS monitor signal output (not used) 90 PJ2/MON2 I Sound pressure regulation volume setting signal output (not used) 91 PJ1/MON1 O DFCT monitor signal output (not used) 92 XRST_PWR_O O not used 93 VSS6 – Ground terminal 94 VDIO2 – Power supply terminal (+2.1V) 95 DVDD1 – Power supply terminal (+1.5V) 96 AVDDA1 – Power supply terminal (+2.7V) 97 AOUTR O Built in D/A converter (R-ch) signal output 98 VREFR I Standard voltage terminal (for built in D/A converter R-ch) 99 AVSDA1 – Ground terminal 27 D-NE920/NE920LS Pin No. Pin Name I/O 100 AVSDA0 – Ground terminal 101 VREFL I Standard voltage terminal (for built in D/A converter L-ch) 102 AOUTL O Built in D/A converter (L-ch) signal output 103 AVDDA0 – Power supply terminal (+2.7V) 104 AVSMO – Ground terminal 105 EXTAL O System clock signal output 106 XTAL I System clock signal input 107 AVDMO – Power supply terminal (+2.7V) 108 VDIOFS256 – Power supply terminal (+2.1V) 109 DAMPCLK O Master clock signal output to headphone amplifier 110 VDIOAMP – Power supply terminal (+2.1V) 111 PWML O Audio (L-ch) signal output to headphone amplifier 112 PWMR O Audio (R-ch) signal output to headphone amplifier 113 VSSAMP – Ground terminal 114 VSS7 – Ground terminal 115 AVDPLL0 – Power supply terminal (+2.7V) 116 AVSPLL0 – Ground terminal 117 VDIOPLL0 – Power supply terminal (+2.7V) 118 VSS8 – Ground terminal 28 Description 119 AVSPLL1 – Ground terminal 120 AVDPLL1 – Power supply terminal (+2.7V) 121 VDIOPLL1 – Power supply terminal (+2.7V) 122 VSS9 – Ground terminal 123 XIN – Ground terminal 124 VDIO3 – Power supply terminal (+2.1V) 125 MSDIO I Pull up fixed at “H” 126 DVDD2 – Power supply terminal (+1.5V) 127 PF6/DBG6/X_PLUG_DTC I Line out plug insert detection signal input 128 PF7/DBG7/X_METAL_DTC I Line out plug insert detection signal input 129 ADDR_SEK0 O not used 130 ADDR_SEK1 O not used 131 PF3/DBG3 I not used 132 PF2/DBG2 I Hold switch input terminal 133 PF1/SSCK/DBG1 O not used 134 PF0/SSIO/DBG0 O not used 135 VDIO4 – Power supply terminal (+2.7V) 136 AVSSAD – Ground terminal 137 AVDSAD – Power supply terminal (+2.1V) 138 IGEN I Pull up fixed at “H” 139 FE(A) O RF focus error signal output from pick-up 140 SE(B) O RF sled error signal output from pick-up 141 TE(F) O RF tracking error signal output from pick-up 142 CE(E) O RF select error signal output from pick-up 143 VC – Ground terminal 144 RFDC(RFDCO) I RF signal input from pick-up 145 VSS11 – Ground terminal 146 ASYI I ASY signal input 147 BIAS I Pull up fixed at “H” 148 ASYO O ASY signal output D-NE920/NE920LS Pin No. Pin Name I/O Description 149 AVDASM – Power supply terminal (+2.1V) 150 AVSASM – Ground terminal 151 RFACI I RF signal output from pick-up 152 AVDVCO – Power supply terminal (+2.1V) 153 VCTL I VCT signal input 154 CLTV I Pull up fixed at “H” 155 AVSVCO – Ground terminal 156 VPCO O VPC signal output 157 FILO O FIL signal output 158 FILI I FIL signal input 159 PCO O PC signal output 160 VSS12 – Ground terminal 161 DVDD3 – Power supply terminal (+1.5V) 162 VDIODSP – Power supply terminal (+2.1V) 163 SFDR O Sled servo drive PWM signal output to motor driver 164 SRDR O Sled servo drive control signal output to motor driver 165 TFDR O Tracking servo drive PWM signal output to coil driver (+) 166 TRDR O Tracking servo drive PWM signal output to coil driver (-) 167 FFDR O Focus servo drive PWM signal output to coil driver (+) 168 FRDR O Focus servo drive PWM signal output to coil driver (-) 169 MDP O PWM signal output to motor driver 170 MDS – not used 171 C176 O Data signal output to motor driver 172 VDIOEM0 – Power supply terminal (+2.7V) 173 DVDD4 – Power supply terminal (+1.5V) 174 VSS14 – Ground terminal 175 PC3/XSCS0 O Command latch signal output to power controller 176 PC2/SI0 I Serial data signal input from EEPROM 177 PC1/SO0 O Serial data signal output to power controller/EEPROM 178 PC0/XSCK0 O Clock signal output to power controller/EEPROM 179 VSS15 – Ground terminal 180 VDIO5 – Power supply terminal (+2.1V) 181 PG7 I Reset signal output to power controller 182 PG6 O LED 1 drive control signal output 183 PG5 O LED 2 drive control signal output 184 PG4 O Reset signal output to LCD driver (not used) 185 PG3 O Switching line/headphone signal output (L = headphone) 186 PG2 O LED 3 drive control signal output (not used) 187 PG1 O RF gain control signal output to pick-up 188 PG0 O Standby control signal output to pick-up 189 DVDD5 – Power supply terminal (+1.5V) 190 DVDD6 – Power supply terminal (+1.5V) 191 VSS18 – Ground terminal 192 AVDAD – Power supply terminal (+2.1V) 193 AVSAD – Ground terminal 194 AN7 I Lid upper open/close detection switch input terminal 195 AN6 I Rest of rechargeable battery detection 196 AN5 I Battery voltage detection 197 AN4 I Remote control key signal input 29 D-NE920/NE920LS Pin No. Pin Name I/O Description 198 AN3 I Pull up fixed at “H” 199 AN2 I Key input terminal 200 AN1 I Key input terminal 201 AN0 I DC in voltage detection 202 WAKE I Wake up control signal input 203 XADEVENT O Wake signal output to power controller 204 XRST I System reset input terminal 205 DVDBK0 I Pull up fixed at “H” 206 DVDBK1 I Pull up fixed at “H” 207 VSS19 – Ground terminal 208 VDIO6 – Power supply terminal (+2.1V) 209 PD7/INT7 – not used 210 PD6/INT6 – not used 211 PD5/INT5 O not used 212 PD4/INT4 I External battery detection signal input (“L”: external battery) 213 PD3/INT3 I Pull up fixed at “L” 214 PD2/INT2/ECIN I FG pulse signal input 215 PD1/INT1/T1 O not used 216 PD0/INT0/EC0 I Charging stand detection signal input 217 PE7/ZSCS1 O LCD driver chip select signal output 218 NCS1 O Chip enable signal output to P2ROM 219 to 237 A1 to A19 O Address data signal output to P2ROM 238 NRD O Out enable signal output to P2ROM 239 NWE1 – not used 240 to 255 DQ0 to DQ15 I P2ROM data signal input 256 VDD_FL1 – not used 257 VSS_LF1 – Ground terminal 258 XTAO – not used 259 XTAI – not used 260 MSBS – not used 261 MSSCLK – not used 262 NMSINS – Power supply terminal (+2.1V) 263 to 272 NC – not used 30 D-NE920/NE920LS Ver. 1.4 SECTION 6 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they may have some difference from the original one. • Items marked *“ ” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED) R R Parts of Color Cabinet’s Color 6-1. • Abbreviation AUS : Australian model CND : Canadian model E18 : 100-230 V AC area in E model E33 : 100-240 V AC area in E model EA : Saudi Arabia model EE : East European model HK : Hong Kong model JE : Tourist model KR : Korean model The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. OVERALL ASSY not supplied not supplied 1 not supplied 6 not supplied not supplied 5 not supplied 2 3 6 2 4 cabinet (lower) section Ref. No. 1 1 1 1 1 Part No. Description Remark X-2048-434-1 UPPER LID SUB ASSY (SVX)(SILVER) (US, CND, AEP, UK, EE, E18, E33, JE, HK, AUS) X-2048-435-1 UPPER LID SUB ASSY (SVX)(BLUE)(E18, JE) X-2048-436-1 UPPER LID SUB ASSY (SVX)(WHITE)(E18) X-2048-437-1 UPPER LID SUB ASSY (SVX)(SILVER)(KR) X-2048-439-1 UPPER LID SUB ASSY (SVX)(WHITE)(KR) Ref. No. 2 3 4 5 6 Part No. Description 3-254-022-11 2-188-920-01 2-188-921-01 A-1076-792-A 3-254-014-11 SCREW BLACKET (HINGE L) BLACKET (HINGE R) SWITCH BOARD, COMPLETE SCREW Remark 31 D-NE920/NE920LS Ver. 1.4 6-2. CABINET (LOWER) SECTION 51 59 52 53 59 56 CD mechanism section (CDM-3325ERV2) 57 54 57 57 not supplied 55 58 not supplied 64 63 61 65 60 not supplied not supplied 62 Ref. No. Part No. Description 51 52 53 54 55 2-541-612-11 3-254-058-11 X-2024-372-1 2-187-578-01 2-187-579-01 LID, BATTERY SCREW CABINET (MIDDLE) SUB ASSY KONB, OPEN (L) KONB, OPEN (R) 56 57 58 58 3-258-894-01 3-245-331-01 X-2055-526-3 X-2055-527-3 Remark 58 SPRING (LOCK CLAW) INSULATOR EGH BOARD, COMPLETE (JE, KR) EGH BOARD, COMPLETE (US, CND, HK, E18, E33, AUS) X-2055-528-3 EGH BOARD, COMPLETE (AEP, UK, EE) 59 60 61 62 3-254-029-11 3-254-014-11 3-260-673-01 X-2024-369-1 62 SCREW SCREW SPRING (UPPER LID) CABINET (LOWER) ASSY (SILVER) (US, CND, JE, E33, AUS) X-2024-370-1 CABINET (LOWER) ASSY (BLUE) (US, CND, JE, E33, AUS) Ref. No. 62 62 62 62 62 Part No. Description Remark X-2024-371-1 CABINET (LOWER) ASSY (WHITE) (US, CND, JE, E33, AUS) X-2024-544-2 CABINET (LOWER) ASSY (SILVER)(HK, E18) X-2024-545-2 CABINET (LOWER) ASSY (BLUE)(E18, HK) X-2024-546-2 CABINET (LOWER) ASSY (WHITE)(E18, HK) X-2024-547-1 CABINET (LOWER) ASSY (SILVER) (AEP, UK, EE) 62 62 62 63 63 X-2024-623-1 X-2024-624-1 X-2024-625-1 A-1076-795-A A-1098-012-A 63 A-1098-013-A JACK BOARD, COMPLETE (AEP, UK, EE, HK, E18, E33, AUS) 2-187-574-01 TERMINAL (+), BATTERY 2-187-575-01 TERMINAL (–), BATTERY 64 65 CABINET (LOWER) ASSY (SILVER)(KR) CABINET (LOWER) ASSY (BLUE)(KR) CABINET (LOWER) ASSY (WHITE)(KR) JACK BOARD, COMPLETE (JE, KR) JACK BOARD, COMPLETE (US, CND) NOTES ON HANDLING OF PATCH The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH. 32 D-NE920/NE920LS Ver. 1.4 6-3. CD MECHANISM SECTION (CDM-3325ERV2) 104 M901 105 106 101 107 102 M902 108 103 109 101 110 111 Ref. No. Part No. Description 101 0 102 103 104 105 3-318-203-61 X-3383-995-1 3-221-473-01 3-221-472-01 3-221-474-01 SCREW (B1.7X4), TAPPING OPTICAL PICK-UP (DAX-25EV RP ASSY) COVER, GEAR CHASSIS SPRING, SLED 106 107 A-3331-663-A SCREW (FEED) ASSY 3-221-268-01 GEAR (B) Remark Ref. No. Part No. Description 108 109 110 111 M901 3-221-475-01 3-222-298-01 3-222-299-01 3-348-998-31 A-3608-777-A SHAFT, STANDARD RACK SPRING, RACK RETAINER SCREW (M1.4X2.5), TAPPING, PAN MOTOR ASSY, TURN TABLE (SPINDLE) M902 A-3174-850-A MOTOR ASSY, SLED (SLED) The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Remark Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. 33 D-NE920/NE920LSW-E53 Ver. 1.4 EGH SECTION 7 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX and -X mean standardized parts, so they may have some difference from the original one. • Items marked *“ ” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable • • • • Ref. No. Part No. Abbreviation AUS : Australian model CND : Canadian model E18 : 100-230 V AC area in E model E33 : 100-240 V AC area in E model EA : Saudi Arabia model EE : East European model HK : Hong Kong model JE : Tourist model KR : Korean model Accessories are given in the last of this parts list. CAPACITORS uF: µF COILS uH: µH Description Remark X-2055-526-3 EGH BOARD, COMPLETE (JE, KR) X-2055-527-3 EGH BOARD, COMPLETE (US, CND, HK, E18, E33, AUS) X-2055-528-3 EGH BOARD, COMPLETE (AEP, UK, EE) ************************************** < CAPACITOR > C102 C103 C201 C202 C401 1-100-661-11 1-137-859-11 1-125-837-91 1-137-859-11 1-100-506-91 TANTAL. CHIP TANTAL. CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP 100uF 220uF 1uF 220uF 1uF 20% 20% 10% 20% 20% 4V 4V 6.3V 4V 6.3V C402 C403 C404 C405 C408 1-164-943-11 1-137-710-11 1-100-875-91 1-119-923-11 1-165-887-91 CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP 0.01uF 10uF 100uF 0.047uF 0.22uF 10% 20% 20% 10% 10% 16V 6.3V 6.3V 10V 6.3V C409 C410 C411 C412 C413 1-164-943-11 1-164-943-11 1-125-777-11 1-125-777-11 1-164-943-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.01uF 0.01uF 0.1uF 0.1uF 0.01uF 10% 10% 10% 10% 10% 16V 16V 10V 10V 16V C414 C415 C416 C417 C418 1-164-941-11 1-164-943-11 1-127-715-91 1-127-715-91 1-125-777-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.0047uF 0.01uF 0.22uF 0.22uF 0.1uF 10% 10% 10% 10% 10% 16V 16V 16V 16V 10V C419 C420 C421 C422 C423 1-164-943-11 1-125-777-11 1-125-837-91 1-125-837-91 1-100-539-91 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP 0.01uF 0.1uF 1uF 1uF 47uF 10% 10% 10% 10% 20% 16V 10V 6.3V 6.3V 6.3V C424 C425 C426 C427 C428 1-127-715-91 1-100-506-91 1-100-539-91 1-119-750-11 1-135-259-11 CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP TANTAL. CHIP TANTAL. CHIP 0.22uF 1uF 47uF 22uF 10uF 10% 20% 20% 20% 20% 16V 6.3V 6.3V 6.3V 6.3V C429 C430 C431 C432 C433 1-119-750-11 1-100-539-91 1-100-662-11 1-137-710-11 1-119-923-11 TANTAL. CHIP TANTAL. CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP 22uF 47uF 47uF 10uF 0.047uF 20% 20% 20% 20% 10% 6.3V 6.3V 6.3V 6.3V 10V C434 C435 1-125-838-11 CERAMIC CHIP 1-100-507-91 CERAMIC CHIP 2.2uF 4.7uF 10% 20% 6.3V 6.3V 34 Ref. No. Part No. • SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. . When indicating parts by reference number, please include the board name. The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. Description Remark C436 C437 C438 1-100-415-11 CERAMIC CHIP 1-100-539-91 TANTAL. CHIP 1-100-506-91 CERAMIC CHIP 0.47uF 47uF 1uF 10% 20% 20% 6.3V 6.3V 6.3V C439 C440 C441 C442 C443 1-165-887-91 1-100-539-91 1-125-777-11 1-125-777-11 1-125-777-11 CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.22uF 47uF 0.1uF 0.1uF 0.1uF 10% 20% 10% 10% 10% 6.3V 6.3V 10V 10V 10V C444 C445 C446 C447 C448 1-100-539-91 1-125-777-11 1-125-837-91 1-100-506-91 1-125-777-11 TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 47uF 0.1uF 1uF 1uF 0.1uF 20% 10% 10% 20% 10% 6.3V 10V 6.3V 6.3V 10V C449 C450 C601 C602 C603 1-164-931-11 1-125-837-91 1-119-750-11 1-112-063-11 1-100-506-91 CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP 100PF 1uF 22uF 470PF 1uF 10% 10% 20% 10% 20% 50V 6.3V 6.3V 50V 6.3V C604 C605 C606 C607 C608 1-125-777-11 1-127-715-91 1-164-943-11 1-164-943-11 1-164-858-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.1uF 0.22uF 0.01uF 0.01uF 22PF 10% 10% 10% 10% 5% 10V 16V 16V 16V 50V C609 C610 C611 C612 C613 1-164-939-11 1-100-506-91 1-164-943-11 1-125-777-11 1-125-777-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.0022uF 1uF 0.01uF 0.1uF 0.1uF 10% 20% 10% 10% 10% 50V 6.3V 16V 10V 10V C614 C617 C618 C619 C626 1-119-923-11 1-164-941-11 1-164-941-11 1-164-941-11 1-100-506-91 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.047uF 0.0047uF 0.0047uF 0.0047uF 1uF 10% 10% 10% 10% 20% 10V 16V 16V 16V 6.3V C627 C629 C631 C639 C645 1-119-750-11 1-107-820-11 1-107-820-11 1-107-820-11 1-165-887-91 TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 22uF 0.1uF 0.1uF 0.1uF 0.22uF 20% 10% 6.3V 16V 16V 16V 6.3V C646 C648 C649 1-107-820-11 CERAMIC CHIP 1-125-777-11 CERAMIC CHIP 1-100-415-11 CERAMIC CHIP 0.1uF 0.1uF 0.47uF 10% 10% 16V 10V 6.3V NOTES ON HANDLING OF PATCH The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH. D-NE920/NE920LS Ver. 1.4 EGH Ref. No. Part No. Description Remark C650 C653 1-164-941-11 CERAMIC CHIP 1-100-415-11 CERAMIC CHIP 0.0047uF 10% 0.47uF 10% 16V 6.3V C654 C659 C664 C667 C676 1-125-777-11 1-107-820-11 1-100-539-91 1-107-820-11 1-107-820-11 CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP 0.1uF 0.1uF 47uF 0.1uF 0.1uF 10V 16V 6.3V 16V 16V C677 C678 C680 C681 C686 1-107-820-11 1-119-750-11 1-164-846-11 1-164-846-11 1-100-539-91 CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP 0.1uF 22uF 6PF 6PF 47uF C687 C689 1-107-820-11 CERAMIC CHIP 1-107-820-11 CERAMIC CHIP 0.1uF 0.1uF C694 C695 C3089 1-125-777-11 CERAMIC CHIP 0.1uF 1-100-945-11 CAP, CHIP CERAMIC 1-125-777-11 CERAMIC CHIP 0.1uF 10% 20% 20% 0.5PF 0.5PF 20% 16V 16V (JE, KR) 10% 10V 4700PF B 10% 10V < CONNECTOR > CN601 1-818-130-11 CONNECTOR, FFC/FPC (ZIF) 15P CN9001 1-818-842-11 CONNECTOR, BOARD TO BOARD 50P < DIODE > D401 D405 6-500-540-01 DIODE RB521S-30FTE61 8-719-071-87 DIODE MA785-(TX), SO < FERRITE BEAD > FB101 FB201 FB401 FB402 1-400-808-21 1-400-808-21 1-400-461-21 1-216-864-11 INDUCTOR (EMI FERRITE) (1608) INDUCTOR (EMI FERRITE) (1608) FERRITE, EMI (SMD) (1005) SHORT CHIP 0 < IC > IC401 IC402 IC403 IC601 ★ IC602 6-706-457-01 6-707-209-01 6-703-652-01 6-707-088-01 6-702-355-01 IC IC IC IC IC SC901590VAR2 NCP1400ASN22T1G LMV301MGX/NOPB CXD9839K-G AK6510CL-L ✩ IC603 IC604 IC605 IC606 IC3007 not supplied 6-706-995-01 6-804-719-01 6-707-398-01 6-703-631-01 MOUNTED PC BOARD (CASINO1) IC MSM56X16160F-20T IC MR27T1602F (JE, KR) IC XC6213B212NR IC NJU8713V-TE2 < COIL > L401 L402 L403 L404 L405 1-456-894-21 1-400-850-21 1-419-646-21 1-469-967-21 1-400-850-21 INDUCTOR INDUCTOR INDUCTOR INDUCTOR INDUCTOR 47uH 47uH 47uH 10uH 47uH L406 L407 L408 L409 L410 1-456-218-21 1-400-145-21 1-400-145-21 1-428-912-21 1-400-317-21 INDUCTOR INDUCTOR INDUCTOR INDUCTOR INDUCTOR 22uH 47uH 47uH 10uH 100uH L412 1-456-894-21 INDUCTOR 47uH 16V 6.3V 50V 50V 6.3V Ref. No. Part No. Description Remark < TRANSISTOR > Q401 Q402 Q403 Q404 Q405 6-551-139-01 8-729-053-52 8-729-053-54 6-551-140-01 6-551-140-01 TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR Q406 Q601 Q602 6-551-279-01 TRANSISTOR 8-729-427-49 TRANSISTOR 6-550-232-01 TRANSISTOR DTC115TE-TL EMX1T2R EMT1T2R QS6K1 QS6K1 DTA115TE XP4214-TXE 2SA1832FV (TH3SONY) < RESISTOR > R101 R102 R201 R202 R302 1-218-941-81 1-218-977-11 1-218-941-81 1-218-977-11 1-218-941-81 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 100 100K 100 100K 100 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R401 R402 R403 R404 R405 1-218-977-11 1-218-977-11 1-218-977-11 1-218-989-11 1-218-977-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 100K 100K 100K 1M 100K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R406 R407 R408 R409 R410 1-216-864-11 1-218-990-11 1-218-977-11 1-218-973-11 1-218-973-11 SHORT CHIP SHORT CHIP RES-CHIP RES-CHIP RES-CHIP 0 0 100K 47K 47K 5% 5% 5% 1/16W 1/16W 1/16W R411 R412 R413 R414 R415 1-218-965-11 1-218-957-11 1-218-965-11 1-218-961-11 1-218-941-81 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 10K 2.2K 10K 4.7K 100 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R417 R418 R419 R420 R421 1-218-941-81 1-218-969-11 1-218-953-11 1-218-965-11 1-218-977-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 100 22K 1K 10K 100K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R423 R424 R426 R427 R428 1-218-961-11 1-218-989-11 1-218-973-11 1-220-804-11 1-218-973-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 4.7K 1M 47K 2.2M 47K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R429 R430 R431 R432 R435 1-218-969-11 1-218-989-11 1-218-989-11 1-218-953-11 1-218-973-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 22K 1M 1M 1K 47K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R436 R437 R446 R601 R602 1-218-953-11 1-218-953-11 1-218-965-11 1-218-981-11 1-208-911-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP METAL CHIP 1K 1K 10K 220K 10K 5% 5% 5% 5% 0.5% 1/16W 1/16W 1/16W 1/16W 1/16W R603 R604 1-218-929-11 RES-CHIP 1-218-981-11 RES-CHIP 10 220K R606 R607 R608 1-218-990-11 SHORT CHIP 1-218-990-11 SHORT CHIP 1-218-973-11 RES-CHIP 0 0 47K ★ NOTES ON HANDLING OF PATCH The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH. 5% 1/16W 5% 1/16W (EXCEPT AEP, UK, EE) 5% 1/16W ✩ IC603 (System Controller) on an EGH board can not be replaced individually. Replace with an EGH board assembly for service. 35 D-NE920/NE920LS Ver. 1.4 EGH JACK Ref. No. Part No. Description R609 R610 R611 R612 R613 1-218-969-11 1-218-969-11 1-218-990-11 1-218-977-11 1-218-990-11 RES-CHIP RES-CHIP SHORT CHIP RES-CHIP SHORT CHIP Remark R615 R616 R617 R618 R619 1-218-981-11 1-218-985-11 1-218-965-11 1-218-953-11 1-400-461-21 RES-CHIP 220K RES-CHIP 470K RES-CHIP 10K RES-CHIP 1K FERRITE, EMI (SMD) (1005) R620 R621 R622 1-218-973-11 RES-CHIP 1-218-953-11 RES-CHIP 1-218-981-11 RES-CHIP 47K 1K 220K R623 R624 1-208-911-11 METAL CHIP 1-208-911-11 METAL CHIP 10K 10K 1/16W 1/16W 1/16W (AEP, UK, EE) 0.5% 1/16W 0.5% 1/16W R625 R628 R629 R634 R635 1-208-911-11 1-218-957-11 1-218-957-11 1-218-965-11 1-218-989-11 METAL CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 10K 2.2K 2.2K 10K 1M 0.5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R636 R637 R639 R642 R644 1-218-977-11 1-218-981-11 1-218-973-11 1-218-973-11 1-218-937-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 100K 220K 47K 47K 47 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R649 R650 R651 R653 R655 1-218-969-11 1-218-977-11 1-218-977-11 1-218-965-11 1-218-977-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 22K 100K 100K 10K 100K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W 22K 22K 0 100K 0 5% 5% 1/16W 1/16W 5% 1/16W 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 5% 5% 5% Ref. No. Part No. Description C403 C404 C406 C407 C409 1-128-829-91 1-127-760-11 1-127-715-91 1-164-935-11 1-137-710-11 TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 220uF 4.7uF 0.22uF 470PF 10uF 20% 10% 10% 10% 20% 6.3V 6.3V 16V 50V 6.3V Remark C801 C802 C901 C902 C904 1-164-933-11 1-164-933-11 1-115-156-11 1-125-837-91 1-125-837-91 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 220PF 220PF 1uF 1uF 1uF 10% 10% 50V 50V 10V 6.3V 6.3V 10% 10% < CONNECTOR > CN401 CN501 CN601 CN602 CN9002 1-770-620-21 1-818-130-11 1-785-877-21 1-784-342-21 1-818-843-11 PIN, CONNECTOR 3P CONNECTOR, FFC/FPC (ZIF) 15P HOUSING, CONNECTOR 4P HOUSING, CONNECTOR 2P CONNECTOR, BOARD TO BOARD 50P < DIODE > D401 D402 D901 D902 D903 6-500-483-01 8-719-085-43 8-719-077-43 8-719-083-04 8-719-083-04 DIODE DIODE DIODE DIODE DIODE MA22D2800LS0 MA2YD2300LS0 MAZZ068H01S0 RSB6.8STE61 RSB6.8STE61 D904 D905 D906 8-719-422-37 DIODE MA8051-TX 8-719-422-37 DIODE MA8051-TX 8-719-083-04 DIODE RSB6.8STE61 < FUSE > 0 F401 1-576-406-21 FUSE, MICRO (1608) 1.4A/32V < FERRITE BEAD > < COMPOSITION CIRCUIT BLOCK > RB601 1-233-969-11 RES, NETWORK (CHIP TYPE) 22K < VIBRATOR > X601 1-813-314-11 VIBRATOR, CRYSTAL 22.579MHz ************************************************************ A-1076-795-A JACK BOARD, COMPLETE (JE, KR) A-1098-012-A JACK BOARD, COMPLETE (US, CND) A-1098-013-A JACK BOARD, COMPLETE (AEP, UK, EE, HK, E18, E33, AUS) ************************************** FB401 FB402 FB801 FB802 FB803 1-162-964-11 1-216-864-11 1-414-813-11 1-414-813-11 1-414-813-11 CERAMIC CHIP 0.001uF 10% SHORT CHIP 0 FERRITE, EMI (SMD) (2012) FERRITE, EMI (SMD) (2012) FERRITE, EMI (SMD) (2012) FB804 FB805 FB806 FB901 FB902 1-414-813-11 1-414-813-11 1-216-295-91 1-414-760-21 1-414-760-21 FERRITE, EMI (SMD) (2012) FERRITE, EMI (SMD) (2012) SHORT CHIP 0 FERRITE, EMI (SMD) (1608) FERRITE, EMI (SMD) (1608) FB903 1-414-760-21 FERRITE, EMI (SMD) (1608) 50V < IC > 2-187-574-01 TERMINAL (+), BATTERY 2-187-575-01 TERMINAL (-), BATTERY IC401 6-707-315-01 IC RT8H055C-T1 < CAPACITOR > < JACK > C101 C103 C201 C203 C301 1-165-884-91 1-127-715-91 1-165-884-91 1-127-715-91 1-125-837-91 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 2.2uF 0.22uF 2.2uF 0.22uF 1uF 10% 10% 10% 10% 10% 6.3V 16V 6.3V 16V 6.3V C302 C304 C305 C306 C402 1-125-777-11 1-125-837-91 1-125-777-11 1-162-970-11 1-115-156-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.1uF 1uF 0.1uF 0.01uF 1uF 10% 10% 10% 10% 10V 6.3V 10V 25V 10V J301 J402 < COIL > L101 L201 1-400-849-21 INDUCTOR, CHIP 100uH (2518) 1-400-849-21 INDUCTOR, CHIP 100uH (2518) < LINE FILTER > LF401 36 1-818-840-21 JACK (i / LINE OUT (OPTICAL)) 1-818-841-11 JACK, DC 1-416-405-21 FILTER, CHIP EMI (COMMON MODE) The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. D-NE920/NE920LS JACK Ref. No. Part No. Description Remark Ref. No. Part No. JACK SUB SWITCH Description Remark < VARISTOR > < TRANSISTOR > Q301 Q302 Q303 Q304 Q305 6-550-364-01 6-550-364-01 6-550-375-01 8-729-047-48 6-551-132-01 TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR 2SD2652T106 2SD2652T106 UMD2N-TR UMD12N-TR EMG6 Q306 Q307 Q401 Q402 Q403 6-550-527-01 6-551-186-01 8-729-602-36 6-550-760-01 6-550-364-01 TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR NTHD5904T1 EMX18 2SA1602TP-1EF 2SA1363-T111-1E 2SD2652T106 VDR901 1-801-862-11 VARISTOR, CHIP (1608) ************************************************************ JACK SUB BOARD *************** < JACK > J401 1-818-841-11 JACK, DC ************************************************************ A-1076-792-A SWITCH BOARD, COMPLETE *********************** < RESISTOR > R102 R103 R202 R203 R303 1-218-945-11 1-218-981-11 1-218-945-11 1-218-981-11 1-218-957-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 220 220K 220 220K 2.2K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R304 R305 R306 R307 R308 1-220-803-81 1-218-981-11 1-218-981-11 1-218-957-11 1-218-953-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 4.7 220K 220K 2.2K 1K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R309 R310 R311 R312 R313 1-218-989-11 1-218-953-11 1-218-969-11 1-218-989-11 1-218-969-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 1M 1K 22K 1M 22K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R314 R315 R316 R401 R402 1-218-957-11 1-218-957-11 1-218-957-11 1-218-989-11 1-218-985-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP RES-CHIP 2.2K 2.2K 2.2K 1M 470K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W R403 R404 R405 R406 R407 1-218-985-11 1-208-943-11 1-208-927-11 1-218-941-81 1-245-927-21 RES-CHIP METAL CHIP METAL CHIP RES-CHIP METAL CHIP 470K 220K 47K 100 0.22 5% 0.5% 0.5% 5% 1% 1/16W 1/16W 1/16W 1/16W 1/5W R408 R409 R410 R411 R501 1-218-973-11 1-218-945-11 1-218-973-11 1-218-989-11 1-400-461-21 RES-CHIP 47K RES-CHIP 220 RES-CHIP 47K RES-CHIP 1M FERRITE, EMI (SMD) (1005) 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W R502 R503 R504 R505 1-400-461-21 1-400-461-21 1-400-461-21 1-400-461-21 FERRITE, EMI (SMD) (1005) FERRITE, EMI (SMD) (1005) FERRITE, EMI (SMD) (1005) FERRITE, EMI (SMD) (1005) 1-805-687-11 1-805-700-11 1-829-898-11 2-187-673-01 DISPLAY PANEL, LIQUID CRYSTAL ELEMENT, EL INDICATOR CABLE, FLEXIBLE FLAT (15 CORE) SHEET (LCD), ADHESIVE < CAPACITOR > C1001 C1002 C1003 C1004 C1005 1-162-970-11 1-100-996-21 1-127-715-91 1-127-715-91 1-127-715-91 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.01uF 0.1uF 0.22uF 0.22uF 0.22uF 10% 10% 10% 10% 10% 25V 250V 16V 16V 16V C1006 C1007 C1008 C1010 C1011 1-127-715-91 1-127-715-91 1-117-863-11 1-127-715-91 1-127-715-91 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.22uF 0.22uF 0.47uF 0.22uF 0.22uF 10% 10% 10% 10% 10% 16V 16V 6.3V 16V 16V C1012 C1013 C1014 C1025 C1026 1-127-715-91 1-162-970-11 1-164-156-11 1-137-710-11 1-164-156-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.22uF 0.01uF 0.1uF 10uF 0.1uF 10% 10% 16V 25V 25V 6.3V 25V 20% < CONNECTOR > CN1001 1-818-806-21 CONNECTOR, FFC/FPC (ZIF) 26P * CN1002 1-815-832-21 CONNECTOR, FFC/FPC (ZIF) 15P < DIODE > D1001 D1002 6-500-781-01 DIODE SML-521MUW 8-719-052-12 DIODE 1SS403 (TPH3) < IC > < COMPOSITION CIRCUIT BLOCK > RB301 1-233-787-11 RES, NETWORK 8-759-830-70 IC SM8142BD-G-EL < COIL > L1001 1-400-776-11 INDUCTOR 1.0K (1608) < SWITCH > S501 S502 IC1001 1-762-805-41 SWITCH, PUSH (1 KEY) 1-572-922-11 SWITCH, SLIDE (HOLD .) 220uH < RESISTOR > R1001 R1002 R1004 R1005 R1006 1-216-864-11 1-216-821-11 1-216-845-11 1-414-760-21 1-216-864-11 SHORT CHIP 0 METAL CHIP 1K 5% METAL CHIP 100K 5% FERRITE, EMI (SMD) (1608) SHORT CHIP 0 R1007 R1008 1-216-864-11 SHORT CHIP 1-216-864-11 SHORT CHIP 1/10W 1/10W < THERMISTOR > TH401 1-805-719-11 THERMISTOR, POSITIVE 0 0 37 D-NE920/NE920LS Ver. 1.5 SWITCH Ref. No. Part No. Description Remark R1009 R1010 R1011 1-216-864-11 SHORT CHIP 1-216-821-11 METAL CHIP 1-216-821-11 METAL CHIP 0 1K 1K 5% 5% 1/10W 1/10W R1012 R1013 R1014 R1016 R1101 1-216-821-11 1-216-821-11 1-216-821-11 1-216-841-11 1-216-833-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 1K 1K 1K 47K 10K 5% 5% 5% 5% 5% 1/10W 1/10W 1/10W 1/10W 1/10W R1102 R1103 R1104 R1105 R1106 1-216-829-11 1-216-825-11 1-216-837-11 1-216-825-11 1-216-829-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 4.7K 2.2K 22K 2.2K 4.7K 5% 5% 5% 5% 5% 1/10W 1/10W 1/10W 1/10W 1/10W R1107 R1108 R1109 R1110 R1111 1-216-833-11 1-216-837-11 1-216-821-11 1-216-825-11 1-216-825-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 10K 22K 1K 2.2K 2.2K 5% 5% 5% 5% 5% 1/10W 1/10W 1/10W 1/10W 1/10W R1112 R1113 R1114 R1115 R1118 1-216-837-11 1-216-813-11 1-216-821-11 1-216-829-11 1-216-841-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 22K 220 1K 4.7K 47K 5% 5% 5% 5% 5% 1/10W 1/10W 1/10W 1/10W 1/10W R1119 1-216-864-11 SHORT CHIP 0 < SWITCH > S1001 S1002 S1003 S1004 S1006 1-771-105-11 1-771-105-11 1-786-777-21 1-786-675-11 1-786-675-11 SWITCH, TACTILE ( –) SWITCH, TACTILE ( +) SWITCH, LEVER (SLIDE) (u / VOL + / VOL –) TACTILE SWITCH (.) TACTILE SWITCH (>) S1007 S1009 S1010 1-771-105-11 SWITCH, TACTILE (x / CHG) 1-771-105-11 SWITCH, TACTILE (DSPL/MENU) 1-771-105-11 SWITCH, TACTILE (SEARCH) < VARISTOR > VDR1001 1-801-862-11 VARISTOR, CHIP (1608) ************************************************************ MISCELLANEOUS ************** 0 102 M901 M902 X-3383-995-1 OPTICAL PICK-UP (DAX-25EV RP ASSY) A-3608-777-A MOTOR ASSY, TURN TABLE (SPINDLE) A-3174-850-A MOTOR ASSY, SLED (SLED) ACCESSORIES ************ 0 1-569-007-12 ADAPTOR, CONVERSION 2P (JE, E33) 2-318-333-11 MANUAL, INSTRUCTION (ENGLISH) (EXCEPT KR) 2-318-333-21 MANUAL, INSTRUCTION (SPANISH, PORTUGUESE, FRENCH) (CND, AEP, E33) 2-318-333-31 MANUAL, INSTRUCTION (DUTCH, GERMAN, ITALISH) (AEP) 2-318-333-41 MANUAL, INSTRUCTION (SWEDISH, FINNISH) (AEP) Ref. No. Part No. Description 2-318-452-11 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (ENGLISH) (E18, HK, JE, AUS) 2-318-452-21 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (SPANISH) (AEP) 2-318-452-31 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (PORTUGUESE) (AEP) 2-318-452-41 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (FRENCH) (AEP) 2-318-452-51 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (DUTCH, GERMAN, ITALISH) (AEP) 2-318-452-61 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (SWEDISH, FINNISH) (AEP) 2-318-452-71 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (HUNGARIAN, RUSSIAN, POLISH) (EE) 2-318-452-81 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (CZECH, SLOVAK) (EE) 2-318-454-11 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (KOREAN) (JE, KR) 2-318-454-21 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (TRADITIONAL CHINESE) (HK, JE) 2-318-454-31 MANUAL, INSTRUCTION (INSTALL OPERATION GUIDE) (SIMPLIFIED CHINESE) (E18, JE) 2-590-334-11 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (ENGLISH)(US,AEP,UK,EE,CND,E33) 2-590-334-21 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (SPANISH)(AEP,E33) 2-590-334-31 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (PORTUGUESE)(AEP,E33) 2-590-334-41 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (FRENCH)(AEP,CND) 2-590-334-51 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (DUTCH, GERMAN, ITALISH)(AEP) 2-590-334-61 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (SWEDISH, FINNISH)(AEP) 2-590-334-71 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (HUNGARIAN, RUSSIAN, POLISH)(EE) 2-590-334-81 MANUAL, INSTRUCTION (SS2.3 INSTALL OPERATION GUIDE) (CZECH, SLOVAK)(EE) X-2024-753-1 CD-ROM (APPLICATION) ASSY (SS2.1) (SonicStage) (E18, HK, JE, AUS) The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. 38 Remark 2-318-333-51 MANUAL, INSTRUCTION (HUNGARIAN, RUSSIAN, POLISH) (EE) 2-318-333-61 MANUAL, INSTRUCTION (CZECH, SLOVAK) (EE) 2-318-333-71 MANUAL, INSTRUCTION (KOREAN) (JE, KR) 2-318-333-81 MANUAL, INSTRUCTION (TRADITIONAL CHINESE) (HK, JE) 2-318-333-91 MANUAL, INSTRUCTION (SIMPLIFIED CHINESE) (E18, JE) Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. D-NE920/NE920LS Ver. 1.4 Ref. No. Part No. 01 01 01 01 X-2050-857-1 CD-ROM (APPLICATION) ASSY (SS2.3) (SonicStage) (US, CND, AEP, UK, EE, E33) 1-478-846-21 ADAPTOR, AC (AC-ES3010K2) (US, CND) 1-478-847-21 ADAPTOR, AC (AC-ES3010K2) (KR) 1-478-848-21 ADAPTOR, AC (AC-ES3010K2) (AEP, EE, E18) 1-478-849-21 ADAPTOR, AC (AC-ES3010K2) (UK, HK) 01 01 2 3 4 1-478-850-21 1-478-853-22 A-1077-866-A 2-187-958-01 A-1074-427-A 5 Description Remark ADAPTOR, AC (AC-ES3010K2) (AUS) ADAPTOR, AC (AC-ES3010K2) (JE, E33) BCA-DNE820/SM (CHARGING STAND) COVER, BATTERY CASE (External battery cover) EBP-J101//M (EXTERNAL BATTERY CASE) 1-756-120-51 BATTERY, NICKEL HYDROGEN (Rechargeable battery) (US, CND) 1-756-120-61 BATTERY, NICKEL HYDROGEN (Rechargeable battery) (EXCEPT US, CND) 3-008-521-01 CASE, CHARGE (Battery carrying case) 3-235-292-01 POUCH, CARRYING 8-912-735-90 HEADPHONE MDR-E0931SP/B SET (HK, E18, JE, KR, AUS) 5 6 7 8 8 8-912-742-91 EARPHONES MDR-E0931SPB9 SET (US, CND, AEP, UK, EE, E33) A-1071-445-A RM-MC55ELK/SM (JE, KR) A-1071-446-A RM-MC53EL/SM (EXCEPT JE,KR) 9 9 1 2 4 5 3 7 6 8 9 39 D-NE920/NE920LS REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision 1.0 2004.11 New 1.1 2005.01 Addition of Canadian model and E33 (100-240V AC area in E model) model 1.2 2005.06 Addition of Australian model for D-NE920 1.3 2005.11 Change of the Parts No. of EGH BOARD, COMPLETE (SPM-05135) Addition of the notes on handling of PATCH (SPM-05181) 1.4 2006.05 Deletion of Chinese model (SPM-06063) 1.5 2007.02 Deletion of DC PLUG (SPM-07016)
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