D-NE920/NE920LS

Transcription

D-NE920/NE920LS
D-NE920/NE920LS
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
Ver. 1.5 2007.02
D-NE920
E Model
D-NE920/NE920LS
Australian Model
Tourist Model
D-NE920
Photo : BLUE
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM-3325ERV2
Optical Pick-up Name
DAX-25EV
SPECIFICATIONS
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ = 770 - 800 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the objective lens surface on the
optical pick-up block with 7 mm aperture.)
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW at 16 kΩ
(Approx. 1.5 mW + Approx. 1.5 mW at 16 kΩ)*
*For the customers in Europe
Optical digital output (optical output connector)
Output level: –21- –15 dBm
Wavelength: 630 - 690 nm at peak level
D-A conversion
1-bit quartz time-axis control
Power requirements
• Sony NH-14WM rechargeable battery:
1.2 V DC × 1
• LR6 (size AA) battery: 1.5 V DC × 1
• AC power adaptor (DC IN 3 V jack)
• Rated current: 1 A
Frequency response
20 - 20 000 Hz +1
-2 dB (measured by JEITA)
Operating temperature
5°C - 35°C (41°F - 95°F)
Output (at 3 V input level)
Line output (stereo minijack)
Output level 0.7 V rms at 47 kΩ
Recommended load impedance over 10 kΩ
Dimensions (w/h/d) (excluding projecting parts
and controls)
Approx. 127 × 20.6 × 136.4 mm (5 × 1316 × 5 3 8 in.)
Mass (excluding accessories)
Approx. 160 g (5.7 oz.)
Supplied accessories
• AC power adaptor
• Charging stand
• External battery
• Rechargeable battery
case with cover
• Battery carrying case
• Carrying pouch
• Earphones
• Remote control
• CD-ROM (SonicStage)
• Operating instructions
• Installation/Operating Guide
• AC plug adaptor (Supplied with tourist model)
US and foreign patents licensed from Dolby
Laboratories.
Design and specifications are subject to change
without notice.
PORTABLE CD PLAYER
9-879-269-06
2007B16-1
© 2007.02
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
D-NE920/NE920LS
CAUTION
• INVISIBLE LASER RADIATION
WHEN OPEN
• DO NOT STARE INTO BEAM OR
VIEW DIRECTLY WITH OPTICAL
INSTRUMENTS
• CLASS 1M INVISIBLE LASER
RADIATION WHEN OPEN
• DO NOT VIEW DIRECTLY WITH
OPTICAL INSTRUMENTS
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
On AC power adaptor
• Use only the AC power adaptor supplied.
If your CD player is not supplied with the
one, use the AC-E30HG AC power
adaptor. Do not use any other AC power
adaptor. It may cause a malfunction.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• To clean the terminals
If the terminals on the charging stand become
dirty, the battery may not be charged properly.
Clean the terminals with a cotton swab or a
dry cloth periodically as illustrated below.
Terminals
Polarity of the plug
• Do not touch the AC power adaptor with
wet hands.
• Connect the AC power adaptor to an easily
accessible AC outlet. Should you notice an
abnormality in the AC power adaptor,
disconnect it from the AC outlet
immediately.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
2
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
D-NE920/NE920LS
You can play discs on this CD player.
Audio CDs:
CD-DA format CDs
CD-DA (Compact Disc Digital Audio) is a recording standard used for Audio CDs.
ATRAC CDs:
CD-R/CD-RW on which audio data compressed in the ATRAC3plus format
has been recorded by using SonicStage*
ATRAC3plus (Adaptive Transform Acoustic Coding3plus) is audio compression
technology that satisfies the demand for high sound quality and high compression
rates. ATRAC3plus can compress audio files to about 1/20 of their original size at 64
kbps.
Bit rates and sampling frequencies this CD player can play are:
ATRAC3
ATRAC3plus
Bit rates
66/105/132 kbps
48/64/256 kbps
Sampling frequencies
44.1 kHz
44.1 kHz
Up to 62 characters can be displayed on this CD player.
MP3 CDs:
CD-R/CD-RW on which audio data compressed in the MP3 format has
been recorded by using a software other than SonicStage*
Bit rates and sampling frequencies this CD player can play are shown below. Variable
Bit Rate (VBR) files can also be played.
Bit rates
Sampling frequencies
MPEG-1 Layer3
32 - 320 kbps
32/44.1/48 kHz
MPEG-2 Layer3
8 - 160 kbps
16/22.05/23 kHz
MPEG-2.5 Layer3
8 - 160 kbps
8/11.025/12 kHz
This CD player conforms to Version 1.0/1.1/2.2/2.3/2.4 of the ID3 tag format. ID3 tag
is a format for adding certain information (track name, album name, artist name, etc.)
to MP3 files. Up to 64 characters of ID3 tag information can be displayed on this CD
player.
CD-Extra and Mix-Mode CDs:
CD-R/CD-RW on which CD-DA format data and CD-ROM format data are
recorded together.*
If you cannot play your CD, change the "CD-EXTRA" setting in the OPTION menu.
Then you may play your CD.
An ATRAC CD on which audio data compressed in the MP3 format has been recorded
using software other than SonicStage can also be played.
With SonicStage, you cannot create a CD on which mixed format audio data is recorded.
* Only ISO 9660 Level 1/2 and Joliet extension format discs can be played.
Music discs encoded with copyright protection technologies
This product is designed to play back discs that conform to the Compact Disc (CD)
standard. Recently, various music discs encoded with copyright protectiontechnologies
are marketed by some record companies. Please be aware that among those discs,
there are some that do not conform to the CD standard and may not be playable by
this product.
TABLE OF CONTENTS
1.
SERVICING NOTES ................................................ 4
2.
GENERAL ................................................................... 5
3.
DISASSEMBLY
3-1.
3-2.
3-3.
3-4.
3-5.
Disassembly Flow ...........................................................
Upper Lid Sub Assy ........................................................
SWITCH Board ...............................................................
Cabi Mid Sub Assy ..........................................................
EGH Board, CD Mechanism Deck
(CDM-3325ERV2) ..........................................................
3-6. JACK Board, JACK SUB Board .....................................
3-7. Turn Table Motor Assy (M901),
Sled Motor Assy (M902),
Optical Pick-up (DAX-25EV) .........................................
7
8
9
10
11
12
12
4.
ELECTRICAL CHECKING .................................... 13
5.
DIAGRAMS
5-1.
5-2.
5-3.
5-4.
5-5.
5-6.
5-7.
5-10.
5-11.
Block Diagram ................................................................
Printed Wiring Board – EGH Board (Side A) – .............
Printed Wiring Board – EGH Board (Side B) – .............
Schematic Diagram – EGH Board (1/3) – ......................
Schematic Diagram – EGH Board (2/3) – ......................
Schematic Diagram – EGH Board (3/3) – ......................
Printed Wiring Board
– JACK Board (Side A), JACK SUB Board – ................
Printed Wiring Board – JACK Board (Side B) – ............
Schematic Diagram
– JACK Board, JACK SUB Board – ...............................
Printed Wiring Board – SWITCH Board – ....................
Schematic Diagram – SWITCH Board – .......................
6.
EXPLODED VIEWS
5-8.
5-9.
15
16
17
18
19
20
21
22
23
24
25
6-1. Overall Assy .................................................................... 31
6-2. Cabinet (Lower) Section .................................................. 32
6-3. CD Mechanism Section (CDM-3325ERV2) ................... 33
7.
ELECTRICAL PARTS LIST .................................. 34
3
D-NE920/NE920LS
Ver. 1.3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S501. (push switch type)
The following checking method for the laser diode is operable.
• Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S501 with a screwdriver having
a thin tip as shown in Fig.1.
3. Press the u button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power
control circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
lever (lid detection)
S501
JACK BOARD
lever (lid detection)
Fig. 1 Method to push the S501
4
NOTES ON HANDLING OF PATCH
The handling of PATCH is necessary when a mounted EGH board
is exchanged or when EEPROM(IC602) on an EGH board is
exchanged.
Please confirm in each service front office about the infomation on
the handling of PATCH.
D-NE920/NE920LS
SECTION 2
GENERAL
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D-NE920/NE920LS
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6
D-NE920/NE920LS
SECTION 3
DISASSEMBLY
Note: Disassemble the unit in the order as shown below.
3-1. DISASSEMBLY FLOW
SET
3-2. UPPER LID SUB ASSY
(Page 8)
3-4. CABI MID SUB ASSY
(Page 10)
3-3. SWITCH BOARD
(Page 9)
3-5. EGH BOARD,
CD MECHANISM DECK
(CDM-3325ERV2)
(Page 11)
3-6. JACK BOARD, JACK SUB BOARD
(Page 12)
3-7. TURN TABLE MOTOR ASSY(M901),
SLED MOTOR ASSY(M902),
OPTICAL PICK-UP(DAX-25EV)
(Page 12)
7
D-NE920/NE920LS
Note: Follow the disassembly procedure in the numerical order given.
3-2. UPPER LID SUB ASSY
2 two screws
3 bracket (hinge R)
4 bracket (hinge L)
1 Push two knobs and
open the upper lid.
5 Close the cover until the tip of the cover of the
upper lid sub assembly is left open by 5 mm,
then slide the upper lid sub cover assembly in
the direction of the arrow.
8 upper lid sub assy
6
7
8
D-NE920/NE920LS
3-3. SWITCH BOARD
1 six screws
2 upper lid
4 SWITCH board
3 flat cable (CN1002)
5 button
6 upper lid assy
9
D-NE920/NE920LS
3-4. CABI MID SUB ASSY
spring (lock claw)
2 seven screws
1 two screws
open knob (R)
open knob (L)
7 cabi mid sub assy
4 open knob (L)
3 spring (lock claw)
6 spring (upper lid)
5 open knob (R)
battery terminal board (+)
Note: It is recommended to visually check that the battery terminal board (+) is
installed in the specified position after assembling the cabi mid sub assy
because, in some cases, the battery terminal board (+) cannot be housed
when assembling the cabi mid sub assy.
10
D-NE920/NE920LS
3-5. EGH BOARD, CD MECHANISM DECK (CDM-3325ERV2)
7 two insulators
8 CD mechanism deck
(CDM-3325ERV2)
6 EGH board
4 reinforcement
(upper)
7 insulator
5 flexible board (CN604)
1 connector (4pin)
2 connector (2pin)
3 Remove solder of the JACK board.
11
D-NE920/NE920LS
8 shield tape
3-6. JACK BOARD, JACK SUB BOARD
9 Remove solder of the shield tape.
qs battery terminal board (-)
0
qd flat cable
6 Remove solder of the JACK board.
qf JACK board
4 cushion
2 Remove solder of the JACK board.
5 cushion
qa Remove solder of the JACK board.
7 SUB board
(battery terminal board (+))
3 JACK SUB board
1 cushion
3-7. TURN TABLE MOTOR ASSY (M901), SLED MOTOR ASSY (M902), OPTICAL PICK-UP (DAX-25EV)
1 three screws
(B 1.7 × 4)
2 gear cover
4 optical pick-up(DAX-25EV)
3 sled motor assy(M902)
5 three screws
(B 1.7 × 4)
6 turn table motor assy(M901)
12
D-NE920/NE920LS
SECTION 4
ELECTRICAL CHECKING
The CD section adjustments are done automatically in this set.
In case of operation check, confirm that RF level.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC1.5V in battery terminals.
VOLUME button
HOLD switch
: Minimum
: OFF
Checking Location:
[EGH BOARD] (SIDE B)
TP608
(RF)
IC604
TP602
(GND A)
RF Level Check
Condition:
• Hold the set in horizontal state.
Connection:
Oscilloscope
(AC range)
EGH board
TP608 (RF)
TP602 (GND A)
2 kΩ
+
–
Procedure:
1. Connect the oscilloscope to the test points TP608 (RF) and
TP602 (GND A) on the EGH board.
2. Set a disc. (YEDS-18)
3. Press the u button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10:1 probe in use)
TIME/DIV : 500 ns
RF level
0.55 to 0.6 Vp-p
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
watching.
5. Stop revolving of the disc motor by pressing the x button.
13
D-NE920/NE920LS
Ver. 1.4
SECTION 5
DIAGRAMS
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
Note on Printed Wiring Boards.
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
(Side B)
Parts face side:
(Side A)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• These boards are multi-layer printed board. However, the paterns
of intermediate-layer have not been included in the diagram.
Note on Schematic Diagrams.
• All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise specified.
•
f
: internal tolerance.
• C : panel designation.
Note:
The components identified by mark 0 or dotted line with mark 0 are
critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque 0 sont critiques pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
• A : B+ Line.
• Total current is measured with CD installed.
• Power voltage is dc 1.5 V and fed with regulated dc power supply
from battery terminals.
• Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
c
: DIGITAL OUT
• Abbreviation
EE
: East European model
JE
: Tourist model
KR
: Korean model
• Waveforms
– EGH Board –
1
TP608 (RF)
540 mVp-p
200 mV/DIV, 400 ns/DIV
2
IC603 <z/b> EXTAL
3.0 Vp-p
44.1 ns
1 V/DIV, 20 ns/DIV
14
D-NE920/NE920LS
Ver. 1.4
5-1. BLOCK DIAGRAM
IC603
SYSTEM CONTROLLER
VCC1
DOUT 84
J301
PF6/DBG6/X PLUG DTC 128
IC606
+2V REG
VCC3
AOUTL 102
AOUTR 97
2V
106 XTAN
SDATA 12
X601
105 EXTAL
22.579MHz
SCLK 11
RFOUT 15
75 P17/AIFBCK
DETECTOR
RF
A
B
E
F
FE(A)
SE(B)
167 FFDR
R13 41
168 FRDR
F12 43
165 TFDR
R12 44
166 TRDR
A1-A19
237
M902
SLED M
MOTOR
26 FO3
163 SFDR
R11 48
164 SRDR
F-
28 RO3
T+
21 FO2
PWM 35
T-
24 RO2
SYNC 33
S+
13 FO1
COLDST 37
S-
17 RO1
COM
U
M901
SPINDLE
MOTOR
V
W
26-29,
32-35,
38,39, D0-D15
41,42,
44-47
240
D0-D-15
APWM 34
IC604
S-RAM
12,13,
15,16,
SDDQ16 18,19,
21,22,
SDDQ1 25-28,
30,31,
34,36,
169 MDP
SDA11
171 C176
SDA0
181 PG7
DATA 36
177 PC1/SO0
CLOCK 30
178 PC0/SCK0
12 CPV1
8 CPU1
107 CPW1
11 COM
9 UO
6 VO
4 WO
FG 23
214 PD2/INT2/ECIN
IC602
EEPROM
SCK 6
2,3,5,
6,8,9,
11,12, DQ16
39,40, DQ1
42,43,
45,46,
48,49,
IC402
POWER
CONTROLLER
19
51,52,
57,58,
60,61,
63,64,
66,67,
69,70,
XSDWE
SOUDQW
XSDCAS
XSXCS
XSDRAS
SDCLK
SDCKE
SDUDQW
22 A19
31 CE
37 OE
24
. A11
27 A0
32
15
14
16
18
17
35
34
36
33
40
41
42
44
47
45
48
XWE
LDQW
XCAS
XCS
XRAS
CLK
CKE
UDQW
IC401(2/2)
POWER CONTROL
27 VM3
25 VM23
22 VM2
VCC1
DI 5
DO 2
176 PC2/SI0
XCS 1
VCC2
4 PE3
199 AN2
4 VDD
D1002
• R-CH is omitted due to same as L-CH.
• Signal Path
: CD
8
OSC
7 CHV
ENA 3
LDR
VDD
2
LIQUID CRYSTAL
DISPLAY MODULE
PC3/XCS0
NRD
NCS1
AN0
184217 2 1 3
XRST 204
PF2/DBG2
76
212
WAKE
IC1001
LCD DRIVER
8
AN7
200 AN1
77 185 197
PG6
FUNCTION
KEY
78
PG5
S1001, 1002, 1004, 1006, 1010
PG4
PE7/XSCS1
PE5/SO1
PE6/SI1
PE4/XSCK1
FUNCTION
KEY
RSTB
CSB
SDO
SDI
SCK
S1007, 1009
SLIDE
SWITCH
P16/AIFLRCK
S1003
ADDSEL0
129 218 238
PD4/INT4
TRACKING
COIL
1,2
5-8,
11-15, A0-A15
17-20,
23-25,
30
255
F11 47
VCC2
IC605
P2ROM
219
F13 42
Q302,303
MUTING CONTROL
7 VDD0
8 VDD0
Q402,403
VDD CONTROLLER
PE2/DTCK
FOCUS
C0IL
IC403
BUFFER
Q304,305
MUTING
CONTROL
JE, KR
89 PAPC
F+
Q406
SWITCH
VG
IC401(1/2)
COIL/MOTOR DRIVER
63 VAPC
PD
RFAC
RFDC
FE(A)
SE(B)
CE(E)
TE(F)
183
182
194
202
132
201
175
Q601
LED DRIVER
LED2
AN6 195
Q405
SWITCH
CINW 53
VIN34 61
VO2 66
VIN12 70
74 VCC1
SW 101
98 VCC1
VM-U 10
VM-VW 7
VIN 105
66 VCC2
97 VCC2
3 VD B
2 VD T
Q404
SWITCH
BATM1 67
PWRSW1 78
5 RSTB
PWRSW2 81
55 CHGWON
Q402
REG
CRF 54
XADEVENT 203
IC401
4
KEY CONTROLLER
38 WAKE
J402
(FOR STAND CHARGER)
Q401
SWITCH
OFF
> HOLD
S501
(OPEN/CLOSE)
: DIGITAL OUT
D-NE920/NE920LS
15
15
W401 RECHARGEABLE
BATTERY
NH-14WM
W402
1PCS. 1.2V
DCIN 64
Q403
CHARGE
SWITCH
32 LATCHB
S502
S501
Q401
SWITCH
J401
(FOR STAND CHARGER)
VIN
ON
1
LED1
D1001
OPR
AN4
LD
Q307
MUTE
OUT1 6
1 MCK
11 EN2
4 EN1
P15
VCC1
3 IN1
R-CH
PG3
LASER
DIODE
151
144
139
140
142
141
PWML 111
PWMR 112
DAMPCLK 109
PJ7/MON7(MON CK) 85
PJ6/MON6(MONDO) 86
P14/AIFPCMD
VCC
R-CH
IC3007
HP AMP
SENB 10
17 RFIN
Q306
MUTE
R-CH
PF7/DBG7/X METAL DTC 127
IC601
RF AMP
OPTICAL PICK-UP
BLOCK
(DAX-25EV)
LINEOUT
(OPTICAL)
CHGSW 49
Q602
SWITCH
39 RMCRB
RS 50
D-NE920/NE920LS
Ver. 1.4
5-2. PRINTED WIRING BOARD – EGH BOARD (SIDE A) –
:Uses unleaded solder.
OPTICAL PICK-UP
BLOCK
(DAX-25EV)
EGH BOARD (SIDE A)
IC606
1
2
4
3
JE, KR
A
IC601
* IC603
*CSP
JACK
BOARD
CN9002
(Page 21)
(Chip Size Package)
* IC605
*CSP
R622
IC3007
3
(Chip Size Package)
IC602
1
IC403
4
5
AEP, UK, EE
EXCEPT
AEP, UK, EE
11
1-863-862- (11)
✩ IC603 (System Controller) on an EGH board can
not be replaced individually.
Replace with an EGH board assembly for service.
• Semiconductor
Location
Ref. No.
Location
IC403
IC601
IC602
IC603
IC605
IC606
IC3007
D-4
C-9
D-8
C-7
C-10
A-7
D-3
Q601
C-5
D-NE920/NE920LS
16
16
★ NOTES ON HANDLING OF PATCH
The handling of PATCH is necessary when a mounted EGH board is exchanged
or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in
each service front office about the infomation on the handling of PATCH.
D-NE920/NE920LS
5-3. PRINTED WIRING BOARD – EGH BOARD (SIDE B) –
:Uses unleaded solder.
(RF)
EGH BOARD (SIDE B)
IC604
* IC401
*CSP
1
5
4
(GND A)
R621
3
IC402
(Chip Size Package)
11
R624
R625
1-863-862- (11)
C631
R616
C617
• Semiconductor
Location
D-NE920/NE920LS
17
17
Ref. No.
Location
D401
D405
C-8
A-8
IC401
IC402
IC604
C-9
C-8
B-3
Q401
Q402
Q403
Q404
Q405
Q406
Q602
D-8
C-6
D-7
B-8
B-8
B-7
C-6
D-NE920/NE920LS
5-4. SCHEMATIC DIAGRAM – EGH BOARD (1/3) –
19
Q405
QS6K1
C431
47
6.3V
C450
1
R414
4.7k
L409
Q404
QS6K1
L405
R423
4.7k
L402
CN9001
50P
C423
47
6.3V
C439
0.22
C410 0.01
C409 0.01
TP618
C416
0.22
C435
4.7
R405
100k
C417
0.22
R401
100k
Q401
DTC115TE-TL
C415 0.01
R435 47k
C402
0.01
C424
0.22
C401 0.1
R402 100k
R408
100k
D405
MA785-(TX),SO
L408
C434
2.2
C432
10
IC401
SC901590VAR2
C418 0.1
R430 1M
C419 0.01
R432 1k
23
C420
0.1
20
C421 1
C449
100p
R421
100k
R431 1M
C405
0.047
R417 100
R436
1k
R404
1M
L406
C447
1
L410
R424 1M
L401
R409
47k
C444
47
6.3V
R437 1k
L403
C412 0.1
C408
0.22
C411 0.1
R428
47k
C422
1
R427
2.2M
R426
47k
C413
0.01
C445
0.1
R429
22k
C414
4700p
C446
1
R446
10k
TP403
VCC1
R406
0
L407
R407
0
TP405
VIN
C437
47
6.3V
C441
0.1
C427
22
6.3V
C442
0.1
C426
47
6.3V
TP404
P_GND
FB402
0
D-NE920/NE920LS
18
18
C443
0.1
C429
22
6.3V
C430
47
6.3V
C448
0.1
C428
10
6.3V
C440
47
6.3V
FB401 0H
L404
D-NE920/NE920LS
• See page 14 for Waveform. • See page 26 for IC Pin Function Description.
TP601
OPGSW
TP608
RF
R624 10k
R629
2.2k
R623
10k
R608 47k
Ver. 1.3
R634
10k
C649
0.47
C650
4700p
RB601
22k
C653
0.47
C654
0.1
R637
220k
C602
470p
R655
100k
R649
22k
R642 47k
R639 47k
R610
22k
C603
1
C610
1
C626 1
C617
4700p
C618
4700p
C631
0.1
R616
470k
C609
2200p
C646
0.1
R620 47k
TP627
ADDSEL_1
R609 22k
IC606
XC6213B212NR
C605
0.22
CN601
15P
R618
1k
R636
100k
C627 22 6.3V
R625
10k
C607
0.01
C629 0.1
R617
10k
R621 1k
R603
10
C695
4700p
R650 100k
R651 100k
R601
Q602
220k 2SA1832FV
R615 (TH3SONY)
220k
C619
4700p
TP602
GND_A
C608 22p
C694 0.1
R628
2.2k
R602 10k
TP604 OPSTB
C601
22
6.3V
C648
0.1
C614 0.047
R635 1M
5-5. SCHEMATIC DIAGRAM – EGH BOARD (2/3) –
✩ IC603 (System Controller) on an EGH board can
not be replaced individually.
Replace with an EGH board assembly for service.
C659
0.1
Q601
XP4214-TXE
TP621
PD7
TP609 TEST
TP630
ADDSEL_0
TP611
PD5
C612 0.1
TP610
PD1
C611
0.01
R653 10k
R611
0
C604
0.1
C606
0.01
IC601
CXD9839K-G
C613
0.1
X601
22.579MHz
R613 0
C680
6p
C667
0.1
C681 6p
R644
R606 0
47
IC603
CASINO1
C664
47
6.3V
20
C678
22
6.3V
C677
0.1
R604 220k
EXCEPT
AEP, UK, EE
TP622 MON1
TP623 MON2
TP624 MON3
TP625 MON4
TP626 MON5
TP607
EXT_FLASH&SRAM_V
R622 220k
AEP, UK, EE
TP629
PI1
R612
100k
C676 0.1
TP617
VCC2
TP612
SK
TP614
DO
TP615
CS
TP616
GND
TP613
DI
C639
0.1
C645
0.22
TP619
AK6510CL-L
TP620
IC602
18
★ NOTES ON HANDLING OF PATCH
The handling of PATCH is necessary when a mounted EGH board is exchanged
or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in
each service front office about the infomation on the handling of PATCH.
D-NE920/NE920LS
19
19
D-NE920/NE920LS
Ver. 1.4
5-6. SCHEMATIC DIAGRAM – EGH BOARD (3/3) –
• See page 26 for IC Block Diagram.
JE, KR
C404
100
6.3V
R403
100k
C403
10
IC604
MSM56X16160F-20T
L412
IC605
MR27T1602F
FB101
0H
D401
RB521S-30FTE61
C103
220
4V
IC402
NCP1400ASN22T1G
C687 0.1
C102
100
4V
R302 100
R418
22k
R101 100
IC3007
NJU8713V-TE2
R607 0
Q403
EMT1T2R
R419
1k
R415
100
R202
100k
R411
10k
R410
47k
R413
10k
Q402
EMX1T2R
R420
10k
C433
0.047
C3089
0.1
C201
1
R412
2.2k
C425 1
C438
1
C689 0.1
R102
100k
C436
IC403
0.47
LMV301MGX/NOPB
Q406
DTA115TE
19
C686
47
6.3V
18
C202
220
4V
R619 0H
FB201
0H
R201
100
D-NE920/NE920LS
20
20
D-NE920/NE920LS
5-7. PRINTED WIRING BOARD – JACK BOARD (SIDE A), JACK SUB BOARD –
:Uses unleaded solder.
JACK BOARD (SIDE A)
S501
(OPEN/CLOSE)
• Semiconductor
Location
J301
2 / LINE OUT
(OPTICAL)
A
EGH BOARD
CN9001
(Page 16)
M901
SPINDLE
MOTOR
M902
SLED
MOTOR
JACK SUB BOARD
TP401
TP403
TP402
11
RECHARGEABLE
BATTERY
NH-14WM
1.2V 1350mAh
1-864-415- (11)
J401
(FOR STAND CHARGER)
J402
(FOR STAND CHARGER)
11
1-864-414- (11)
D-NE920/NE920LS
21
21
Ref. No.
Location
D401
D402
D901
D902
D903
D905
D906
G-8
F-6
A-3
C-3
C-3
F-5
F-8
Q301
Q302
Q306
B-3
B-4
A-4
D-NE920/NE920LS
:Uses unleaded solder.
5-8. PRINTED WIRING BOARD – JACK BOARD (SIDE B) –
JACK BOARD
(SIDE B)
S502
HOLD
ON
OFF
• Semiconductor
Location
Ref. No.
Location
D904
E-6
IC401
E-4
Q303
Q304
Q305
Q307
Q401
Q402
Q403
C-6
C-7
C-6
C-7
G-3
F-6
G-2
Q305
R316
B
SWITCH BOARD
CN1002
(Page 24)
IC401
6
1
4
3
11
1-864-414- (11)
D-NE920/NE920LS
22
22
D-NE920/NE920LS
5-9. SCHEMATIC DIAGRAM – JACK BOARD, JACK SUB BOARD –
CN601 4P
CN602 2P
TP9034
CN501 15P
S501
(OPEN/CLOSE)
R501 0
R502 0
TP9005
SL501
IC401
RT8H055C-T1
R503 0
R504 0
CN9002
50P
TP9004
S502
R505 0
TP9009
R411
1M
FB901 OH
TP9007
TP9033
FB902 0H
C407
470p
TP9032
25
R314 2.2k
R316
2.2k
TP9003
R102 220
TP9001
R308 1k
C304
1
R311
22k
TP9008
L201
C103
0.22
R313
22k
R312
1M
TP9036
L101
FB803
R304
4.7
C301
1
R202 220
C101 2.2
Q305
EMG6
R307 2.2k
R303 2.2k
Q304
UMD12N-TR
C201 2.2
C203
0.22
TP9035
Q307
EMX18
TP9030
TP9038
R315 2.2k
FB804
TP9037
C801
220p
C305
0.1
C802
220p
J301
R203
220k
R103
220k
FB806 0
FB802
FB805
TP9024
R309 1M
TP9041
TP9040
FB801
D903
RSB6.8STE61
D901
MAZZ068H01S0
C904 1
C902
1
D902
RSB6.8STE61
TP901
C302
0.1
TP9042
TP9043
R306
220k
Q301
2SD2652T106
TP9044
C306
0.01
TP9046
D904
MA8051-TX
R305
220k
FB903
0H
TP9028
TP9029
Q306
NTHD5904T1
Q302
2SD2652T106
Q401
2SA1602TP-1EF
RB301
1.0k
R310
1k
Q303
UMD2N-TR
TP9026
TP9011
TP9012
D402
MA2YD2300LS0
R401
1M
J401
TP401
TP9014
TP9015
Q402
2SA1363-T111-1E
R402
470k
CN401
3P
TP9013
TP9016
TP9017
R406 100
TP402
TP403
TP9039
R408 47k
TP9019
TP9020
TH401
TP408
LF401
C402
1
C901
1
C409 10
R404
220k
C406
0.22
R405
47k
R407
0.22
R410
47k
TP411
VDR901
FB401
1000P
C404
4.7
R403 470k
TP410
C403
220 6.3V
D906
RSB6.8STE61
TP407
R409
220
Q403
2SD2652T106
D905
MA8051-TX
W402
J402
F401
1.4A/ 32V
TP409
D401
MA22D2800LS0
W401
FB402
0
D-NE920/NE920LS
23
23
TP9025
18
D-NE920/NE920LS
:Uses unleaded solder.
5-10. PRINTED WIRING BOARD – SWITCH BOARD –
SWITCH BOARD
IC1001
DSPL/MENU
=
LIQUID
CRYSTAL
DISPLAY
OPR
^ (PUSH)
VOL+ (UP)
SEARCH
VOL- (DOWN)
B
+
p /CHG
11
1-864-416- (11)
• Semiconductor
Location
D-NE920/NE920LS
24
24
Ref. No.
D1001
D1002
Location
C-2
B-8
IC1001
B-7
JACK BOARD
CN501
(Page 22)
D-NE920/NE920LS
5-11.
SCHEMATIC DIAGRAM – SWITCH BOARD –
CN1001
26P
CN1002 15P
VDR1001
TP1002
R1011 1k
TP1003
R1012 1k
TP1004
R1013 1k
TP1005
R1014 1k
TP1007
TP1008
C1014
0.1
C1026
0.1
C1011
0.22
R1010 1k
TP1006
R1006 0
C1012
0.22
TP1001
R1119 0
D1001
SML-521MUW
23
R1113
220
R1005
FB
R1114
1k
C1010
0.22
C1002 0.1
R1002
1k
R1007
0
C1008 0.47
R1001
0
D1002
1SS403(TPH3)
C1013
0.01
L1001
TP1009
R1115
4.7k
R1101
10k
R1118
47k
R1102
4.7k
TP1010
C1007 0.22
R1105
2.2k
R1103
2.2k
R1009
0
R1106
4.7k
R1109
1k
S1004
S1006
C1006 0.22
C1005 0.22
IC1001
SM8142BD-G-EL
C1004 0.22
S1010
S1001
S1002
C1003 0.22
R1008
0
R1004
100k
R1104
22k
R1107 10k
R1110
2.2k
R1016
47k
C1025
10
C1001
0.01
S1007
25
25
S1003
R1112
22k
R1108
22k
D-NE920/NE920LS
R1111
2.2k
S1009
D-NE920/NE920LS
• IC Block Diagrams
• IC Pin Function Description
EGH BOARD IC603 CASINO1 (SYSTEM CONTROLLER)
– EGH Board –
Pin No.
IC402 NCP1400ASN22TIG
PE6/SI1
I
Status read signal input from LCD driver (not used)
PE5/SO1
O
Command send signal output to LCD driver (not used)
3
PE4/XSCK1
O
Clock signal output to LCD driver (not used)
4
PE3
O
Chip select signal output to EEPROM
5
VDIO0
–
Power supply terminal (+2.1V)
6
VSS0
–
Ground terminal
POWER
7
DVDD7
–
Power supply terminal (+1.5V)
SWITCH
5
LX
ERROR
AMP
DRIVER
-
8
PE2/DTCK
I
LCD indication of remote control signal output
PHASE
PWM
9
PE1/RxD0
I
not used
COMPENSATION
CONTROLLER
10
PE0/TxD0
O
not used
11
EVA
–
Ground terminal
180 kHz
12
SDDQ16
I/O
OSCILLATOR
13
SDDQ15
I/O
14
TAPTDO
–
15
SDDQ14
I/O
Data bus to SDRAM
16
SDDQ13
I/O
Data bus to SDRAM
17
SCANEN
–
18
SDDQ12
I/O
Data bus to SDRAM
19
SDDQ11
I/O
Data bus to SDRAM
VOLTAGE
SOFT-START
REFERENCE
NC 3
4
GND
RFOUT
DETIN
CAGCT
CAGCT
CAGCT
IC601 CXD9839K-G
15
14
13
12
11
NC 16
RFIN 17
LOW
BOOST
AGC
RF
EQUALIZER
SERIAL
I/F
RF
EQUALIZER
VDD 18
RF
EQUALIZER
WOBBLE
BPF AMP
2
3
4
5
WBIN
WBOUT
WCIN
WOOUT
WPCOU
20
TEST2
–
21
SDDQ10
I/O
Data bus to SDRAM
22
SDDQ8
I/O
Data bus to SDRAM
23
VDIOSD0
–
–
10 SENB
Data bus to SDRAM
9
VSS
26
SDDQ6
I/O
Data bus to SDRAM
8
VREF
27
SDDQ7
I/O
Data bus to SDRAM
28
SDDQ2
I/O
Data bus to SDRAM
7
TEST3
–
30
SDDQ4
I/O
Data bus to SDRAM
XPCLK
31
SDDQ3
I/O
Data bus to SDRAM
WPOL
32
TEST0
–
Ground terminal
33
XSDWE
O
WE signal output to SDRAM
34
SDDQ1
I/O
Data bus to SDRAM
35
TEST1
–
36
SDDQ5
I/O
Data bus to SDRAM
37
SDLDQM
O
UDQM signal output to SDRAM
38
VDIOSD1
–
Power supply terminal (+2.1V)
BEEP
Chip select signal output to SDRAM
VDD
XCAS signal output to SDRAM
O
IN2
O
XSDCS
EN2
XSDCAS
42
VSSO
Ground terminal
LDQW signal output to SDRAM
OUT2
–
O
VDDO
VSS2
11
12
13
14
41
BPZ
OUTPUT
1
MCK
2
VSS
3
IN1
EN1
VSSO
OUT1
VDDO
4
D-NE920/NE920LS
26
26
Ground terminal
SDUDQM
10
OUTPUT
CONTROL
Ground terminal
39
9
5
Ground terminal
29
8
6
Power supply terminal (+2.1V)
I/O
40
7
Ground terminal
VSS1
IC3007 NJU8713V-TE2
BPZ
OUTPUT
Ground terminal
SDDQ9
6
1
Data bus to SDRAM
not used
25
WOBBLE
LPF AMP
WLOUT 20
Data bus to SDRAM
24
to each block
WOIN 19
Description
2
VLX LIMITER
+
I/O
1
CE 1
OUT 2
Pin Name
43
TEST5
–
not used
44
XSDRAS
O
XRAS signal output to SDRAM
45
SDCKE
O
CKE signal output to SDRAM
46
TEST6
–
not used
47
SDCLK
–
Clock signal output to SDRAM
48
SDA13
–
not used
49
XTRST
–
not used
50
SDA12
–
not used
D-NE920/NE920LS
Pin No.
Pin Name
I/O
Description
51
SDA11
O
Address bus to SDRAM
52
SDA10
O
Address bus to SDRAM
53
VDIOSD2
–
Power supply terminal (+2.1V)
54
VSS3
–
Ground terminal
55
DVDD0
–
Power supply terminal (+1.5V)
56
TMS
–
not used
57
SDA8
O
Address bus to SDRAM
58
SDA9
O
Address bus to SDRAM
59
TDO
–
not used
60
SDA7
O
Address bus to SDRAM
61
SDA6
O
Address bus to SDRAM
62
TDI
–
not used
63
SDA4
O
Address bus to SDRAM
64
SDA5
O
Address bus to SDRAM
65
TEST4
–
Ground terminal
66
SDA1
O
Address bus to SDRAM
67
SDA2
O
Address bus to SDRAM
68
RTCK
–
not used
69
SDA0
O
Address bus to SDRAM
70
SDA3
O
Address bus to SDRAM
71
TCK
–
not used
72
VDIOSD3
–
Power supply terminal (+2.1V)
73
VSS4
–
Ground terminal
74
VDIO1
–
Power supply terminal (+2.1V)
75
PI7/AIFBCK
O
Latch signal output to RF amplifier (not used)
76
PI6/AIFLRCK
O
LCD back light on/off signal output (not used)
77
PI5
O
Line out/headphone mute control signal output
78
PI4/AIFPCMD
O
Headphone amplifier chip enable signal output
79
PI3/XBCKO
O
signal output to outside D/A converter (not used)
80
PI2/LRCKO
O
signal output to outside D/A converter (not used)
81
PI1
I/O
not used
82
PI0/PCMDO
O
signal output to outside D/A converter (not used)
83
ADCLK
I
signal output to outside D/A converter (not used)
84
DOUT
O
Output terminal of digital audio signal
85
PJ7/MON7(MONCK)
O
Headphone amplifier setting control signal output
86
PJ6/MON6(MONDO)
O
Headphone amplifier setting control signal output
87
PJ5/MON5
O
Headphone amplifier, power control signal output (not used)
88
PJ4/MON4
O
SCOR monitor signal output (not used)
89
PJ3/MON3
O
GPS monitor signal output (not used)
90
PJ2/MON2
I
Sound pressure regulation volume setting signal output (not used)
91
PJ1/MON1
O
DFCT monitor signal output (not used)
92
XRST_PWR_O
O
not used
93
VSS6
–
Ground terminal
94
VDIO2
–
Power supply terminal (+2.1V)
95
DVDD1
–
Power supply terminal (+1.5V)
96
AVDDA1
–
Power supply terminal (+2.7V)
97
AOUTR
O
Built in D/A converter (R-ch) signal output
98
VREFR
I
Standard voltage terminal (for built in D/A converter R-ch)
99
AVSDA1
–
Ground terminal
27
D-NE920/NE920LS
Pin No.
Pin Name
I/O
100
AVSDA0
–
Ground terminal
101
VREFL
I
Standard voltage terminal (for built in D/A converter L-ch)
102
AOUTL
O
Built in D/A converter (L-ch) signal output
103
AVDDA0
–
Power supply terminal (+2.7V)
104
AVSMO
–
Ground terminal
105
EXTAL
O
System clock signal output
106
XTAL
I
System clock signal input
107
AVDMO
–
Power supply terminal (+2.7V)
108
VDIOFS256
–
Power supply terminal (+2.1V)
109
DAMPCLK
O
Master clock signal output to headphone amplifier
110
VDIOAMP
–
Power supply terminal (+2.1V)
111
PWML
O
Audio (L-ch) signal output to headphone amplifier
112
PWMR
O
Audio (R-ch) signal output to headphone amplifier
113
VSSAMP
–
Ground terminal
114
VSS7
–
Ground terminal
115
AVDPLL0
–
Power supply terminal (+2.7V)
116
AVSPLL0
–
Ground terminal
117
VDIOPLL0
–
Power supply terminal (+2.7V)
118
VSS8
–
Ground terminal
28
Description
119
AVSPLL1
–
Ground terminal
120
AVDPLL1
–
Power supply terminal (+2.7V)
121
VDIOPLL1
–
Power supply terminal (+2.7V)
122
VSS9
–
Ground terminal
123
XIN
–
Ground terminal
124
VDIO3
–
Power supply terminal (+2.1V)
125
MSDIO
I
Pull up fixed at “H”
126
DVDD2
–
Power supply terminal (+1.5V)
127
PF6/DBG6/X_PLUG_DTC
I
Line out plug insert detection signal input
128
PF7/DBG7/X_METAL_DTC
I
Line out plug insert detection signal input
129
ADDR_SEK0
O
not used
130
ADDR_SEK1
O
not used
131
PF3/DBG3
I
not used
132
PF2/DBG2
I
Hold switch input terminal
133
PF1/SSCK/DBG1
O
not used
134
PF0/SSIO/DBG0
O
not used
135
VDIO4
–
Power supply terminal (+2.7V)
136
AVSSAD
–
Ground terminal
137
AVDSAD
–
Power supply terminal (+2.1V)
138
IGEN
I
Pull up fixed at “H”
139
FE(A)
O
RF focus error signal output from pick-up
140
SE(B)
O
RF sled error signal output from pick-up
141
TE(F)
O
RF tracking error signal output from pick-up
142
CE(E)
O
RF select error signal output from pick-up
143
VC
–
Ground terminal
144
RFDC(RFDCO)
I
RF signal input from pick-up
145
VSS11
–
Ground terminal
146
ASYI
I
ASY signal input
147
BIAS
I
Pull up fixed at “H”
148
ASYO
O
ASY signal output
D-NE920/NE920LS
Pin No.
Pin Name
I/O
Description
149
AVDASM
–
Power supply terminal (+2.1V)
150
AVSASM
–
Ground terminal
151
RFACI
I
RF signal output from pick-up
152
AVDVCO
–
Power supply terminal (+2.1V)
153
VCTL
I
VCT signal input
154
CLTV
I
Pull up fixed at “H”
155
AVSVCO
–
Ground terminal
156
VPCO
O
VPC signal output
157
FILO
O
FIL signal output
158
FILI
I
FIL signal input
159
PCO
O
PC signal output
160
VSS12
–
Ground terminal
161
DVDD3
–
Power supply terminal (+1.5V)
162
VDIODSP
–
Power supply terminal (+2.1V)
163
SFDR
O
Sled servo drive PWM signal output to motor driver
164
SRDR
O
Sled servo drive control signal output to motor driver
165
TFDR
O
Tracking servo drive PWM signal output to coil driver (+)
166
TRDR
O
Tracking servo drive PWM signal output to coil driver (-)
167
FFDR
O
Focus servo drive PWM signal output to coil driver (+)
168
FRDR
O
Focus servo drive PWM signal output to coil driver (-)
169
MDP
O
PWM signal output to motor driver
170
MDS
–
not used
171
C176
O
Data signal output to motor driver
172
VDIOEM0
–
Power supply terminal (+2.7V)
173
DVDD4
–
Power supply terminal (+1.5V)
174
VSS14
–
Ground terminal
175
PC3/XSCS0
O
Command latch signal output to power controller
176
PC2/SI0
I
Serial data signal input from EEPROM
177
PC1/SO0
O
Serial data signal output to power controller/EEPROM
178
PC0/XSCK0
O
Clock signal output to power controller/EEPROM
179
VSS15
–
Ground terminal
180
VDIO5
–
Power supply terminal (+2.1V)
181
PG7
I
Reset signal output to power controller
182
PG6
O
LED 1 drive control signal output
183
PG5
O
LED 2 drive control signal output
184
PG4
O
Reset signal output to LCD driver (not used)
185
PG3
O
Switching line/headphone signal output (L = headphone)
186
PG2
O
LED 3 drive control signal output (not used)
187
PG1
O
RF gain control signal output to pick-up
188
PG0
O
Standby control signal output to pick-up
189
DVDD5
–
Power supply terminal (+1.5V)
190
DVDD6
–
Power supply terminal (+1.5V)
191
VSS18
–
Ground terminal
192
AVDAD
–
Power supply terminal (+2.1V)
193
AVSAD
–
Ground terminal
194
AN7
I
Lid upper open/close detection switch input terminal
195
AN6
I
Rest of rechargeable battery detection
196
AN5
I
Battery voltage detection
197
AN4
I
Remote control key signal input
29
D-NE920/NE920LS
Pin No.
Pin Name
I/O
Description
198
AN3
I
Pull up fixed at “H”
199
AN2
I
Key input terminal
200
AN1
I
Key input terminal
201
AN0
I
DC in voltage detection
202
WAKE
I
Wake up control signal input
203
XADEVENT
O
Wake signal output to power controller
204
XRST
I
System reset input terminal
205
DVDBK0
I
Pull up fixed at “H”
206
DVDBK1
I
Pull up fixed at “H”
207
VSS19
–
Ground terminal
208
VDIO6
–
Power supply terminal (+2.1V)
209
PD7/INT7
–
not used
210
PD6/INT6
–
not used
211
PD5/INT5
O
not used
212
PD4/INT4
I
External battery detection signal input (“L”: external battery)
213
PD3/INT3
I
Pull up fixed at “L”
214
PD2/INT2/ECIN
I
FG pulse signal input
215
PD1/INT1/T1
O
not used
216
PD0/INT0/EC0
I
Charging stand detection signal input
217
PE7/ZSCS1
O
LCD driver chip select signal output
218
NCS1
O
Chip enable signal output to P2ROM
219 to 237
A1 to A19
O
Address data signal output to P2ROM
238
NRD
O
Out enable signal output to P2ROM
239
NWE1
–
not used
240 to 255
DQ0 to DQ15
I
P2ROM data signal input
256
VDD_FL1
–
not used
257
VSS_LF1
–
Ground terminal
258
XTAO
–
not used
259
XTAI
–
not used
260
MSBS
–
not used
261
MSSCLK
–
not used
262
NMSINS
–
Power supply terminal (+2.1V)
263 to 272
NC
–
not used
30
D-NE920/NE920LS
Ver. 1.4
SECTION 6
EXPLODED VIEWS
NOTE:
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked *“ ” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• The mechanical parts with no reference
number in the exploded views are not supplied.
• Color Indication of Appearance Parts Example:
KNOB, BALANCE (WHITE) . . . (RED)
R
R
Parts of Color Cabinet’s Color
6-1.
•
Abbreviation
AUS : Australian model
CND : Canadian model
E18
: 100-230 V AC area in E model
E33
: 100-240 V AC area in E model
EA
: Saudi Arabia model
EE
: East European model
HK
: Hong Kong model
JE
: Tourist model
KR
: Korean model
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.
OVERALL ASSY
not supplied
not supplied
1
not supplied
6
not supplied
not supplied
5
not
supplied
2
3
6
2
4
cabinet (lower) section
Ref. No.
1
1
1
1
1
Part No.
Description
Remark
X-2048-434-1 UPPER LID SUB ASSY (SVX)(SILVER)
(US, CND, AEP, UK, EE, E18, E33, JE, HK, AUS)
X-2048-435-1 UPPER LID SUB ASSY (SVX)(BLUE)(E18, JE)
X-2048-436-1 UPPER LID SUB ASSY (SVX)(WHITE)(E18)
X-2048-437-1 UPPER LID SUB ASSY (SVX)(SILVER)(KR)
X-2048-439-1 UPPER LID SUB ASSY (SVX)(WHITE)(KR)
Ref. No.
2
3
4
5
6
Part No.
Description
3-254-022-11
2-188-920-01
2-188-921-01
A-1076-792-A
3-254-014-11
SCREW
BLACKET (HINGE L)
BLACKET (HINGE R)
SWITCH BOARD, COMPLETE
SCREW
Remark
31
D-NE920/NE920LS
Ver. 1.4
6-2.
CABINET (LOWER) SECTION
51
59
52
53
59
56
CD mechanism section
(CDM-3325ERV2)
57
54
57
57
not supplied
55
58
not supplied
64
63
61
65
60
not supplied
not supplied
62
Ref. No.
Part No.
Description
51
52
53
54
55
2-541-612-11
3-254-058-11
X-2024-372-1
2-187-578-01
2-187-579-01
LID, BATTERY
SCREW
CABINET (MIDDLE) SUB ASSY
KONB, OPEN (L)
KONB, OPEN (R)
56
57
58
58
3-258-894-01
3-245-331-01
X-2055-526-3
X-2055-527-3
Remark
58
SPRING (LOCK CLAW)
INSULATOR
EGH BOARD, COMPLETE (JE, KR)
EGH BOARD, COMPLETE
(US, CND, HK, E18, E33, AUS)
X-2055-528-3 EGH BOARD, COMPLETE (AEP, UK, EE)
59
60
61
62
3-254-029-11
3-254-014-11
3-260-673-01
X-2024-369-1
62
SCREW
SCREW
SPRING (UPPER LID)
CABINET (LOWER) ASSY (SILVER)
(US, CND, JE, E33, AUS)
X-2024-370-1 CABINET (LOWER) ASSY (BLUE)
(US, CND, JE, E33, AUS)
Ref. No.
62
62
62
62
62
Part No.
Description
Remark
X-2024-371-1 CABINET (LOWER) ASSY (WHITE)
(US, CND, JE, E33, AUS)
X-2024-544-2 CABINET (LOWER) ASSY (SILVER)(HK, E18)
X-2024-545-2 CABINET (LOWER) ASSY (BLUE)(E18, HK)
X-2024-546-2 CABINET (LOWER) ASSY (WHITE)(E18, HK)
X-2024-547-1 CABINET (LOWER) ASSY (SILVER)
(AEP, UK, EE)
62
62
62
63
63
X-2024-623-1
X-2024-624-1
X-2024-625-1
A-1076-795-A
A-1098-012-A
63
A-1098-013-A JACK BOARD, COMPLETE
(AEP, UK, EE, HK, E18, E33, AUS)
2-187-574-01 TERMINAL (+), BATTERY
2-187-575-01 TERMINAL (–), BATTERY
64
65
CABINET (LOWER) ASSY (SILVER)(KR)
CABINET (LOWER) ASSY (BLUE)(KR)
CABINET (LOWER) ASSY (WHITE)(KR)
JACK BOARD, COMPLETE (JE, KR)
JACK BOARD, COMPLETE (US, CND)
NOTES ON HANDLING OF PATCH
The handling of PATCH is necessary when a mounted EGH board is exchanged or when EEPROM(IC602) on an EGH
board is exchanged. Please confirm in each service front office about the infomation on the handling of PATCH.
32
D-NE920/NE920LS
Ver. 1.4
6-3.
CD MECHANISM SECTION (CDM-3325ERV2)
104
M901
105
106
101
107
102
M902
108
103
109
101
110
111
Ref. No.
Part No.
Description
101
0 102
103
104
105
3-318-203-61
X-3383-995-1
3-221-473-01
3-221-472-01
3-221-474-01
SCREW (B1.7X4), TAPPING
OPTICAL PICK-UP (DAX-25EV RP ASSY)
COVER, GEAR
CHASSIS
SPRING, SLED
106
107
A-3331-663-A SCREW (FEED) ASSY
3-221-268-01 GEAR (B)
Remark
Ref. No.
Part No.
Description
108
109
110
111
M901
3-221-475-01
3-222-298-01
3-222-299-01
3-348-998-31
A-3608-777-A
SHAFT, STANDARD
RACK
SPRING, RACK RETAINER
SCREW (M1.4X2.5), TAPPING, PAN
MOTOR ASSY, TURN TABLE (SPINDLE)
M902
A-3174-850-A MOTOR ASSY, SLED (SLED)
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Remark
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
33
D-NE920/NE920LSW-E53
Ver. 1.4
EGH
SECTION 7
ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the parts
list may be different from the parts specified in the
diagrams or the components used on the set.
• -XX and -X mean standardized parts, so they may
have some difference from the original one.
• Items marked *“ ” are not stocked since they are
seldom required for routine service.
Some delay should be anticipated when ordering
these items.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
•
•
•
•
Ref. No.
Part No.
Abbreviation
AUS : Australian model
CND : Canadian model
E18
: 100-230 V AC area in E model
E33
: 100-240 V AC area in E model
EA
: Saudi Arabia model
EE
: East European model
HK
: Hong Kong model
JE
: Tourist model
KR
: Korean model
Accessories are given in the last of this parts
list.
CAPACITORS
uF: µF
COILS
uH: µH
Description
Remark
X-2055-526-3 EGH BOARD, COMPLETE (JE, KR)
X-2055-527-3 EGH BOARD, COMPLETE
(US, CND, HK, E18, E33, AUS)
X-2055-528-3 EGH BOARD, COMPLETE (AEP, UK, EE)
**************************************
< CAPACITOR >
C102
C103
C201
C202
C401
1-100-661-11
1-137-859-11
1-125-837-91
1-137-859-11
1-100-506-91
TANTAL. CHIP
TANTAL. CHIP
CERAMIC CHIP
TANTAL. CHIP
CERAMIC CHIP
100uF
220uF
1uF
220uF
1uF
20%
20%
10%
20%
20%
4V
4V
6.3V
4V
6.3V
C402
C403
C404
C405
C408
1-164-943-11
1-137-710-11
1-100-875-91
1-119-923-11
1-165-887-91
CERAMIC CHIP
CERAMIC CHIP
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
0.01uF
10uF
100uF
0.047uF
0.22uF
10%
20%
20%
10%
10%
16V
6.3V
6.3V
10V
6.3V
C409
C410
C411
C412
C413
1-164-943-11
1-164-943-11
1-125-777-11
1-125-777-11
1-164-943-11
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.01uF
0.01uF
0.1uF
0.1uF
0.01uF
10%
10%
10%
10%
10%
16V
16V
10V
10V
16V
C414
C415
C416
C417
C418
1-164-941-11
1-164-943-11
1-127-715-91
1-127-715-91
1-125-777-11
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.0047uF
0.01uF
0.22uF
0.22uF
0.1uF
10%
10%
10%
10%
10%
16V
16V
16V
16V
10V
C419
C420
C421
C422
C423
1-164-943-11
1-125-777-11
1-125-837-91
1-125-837-91
1-100-539-91
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
TANTAL. CHIP
0.01uF
0.1uF
1uF
1uF
47uF
10%
10%
10%
10%
20%
16V
10V
6.3V
6.3V
6.3V
C424
C425
C426
C427
C428
1-127-715-91
1-100-506-91
1-100-539-91
1-119-750-11
1-135-259-11
CERAMIC CHIP
CERAMIC CHIP
TANTAL. CHIP
TANTAL. CHIP
TANTAL. CHIP
0.22uF
1uF
47uF
22uF
10uF
10%
20%
20%
20%
20%
16V
6.3V
6.3V
6.3V
6.3V
C429
C430
C431
C432
C433
1-119-750-11
1-100-539-91
1-100-662-11
1-137-710-11
1-119-923-11
TANTAL. CHIP
TANTAL. CHIP
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
22uF
47uF
47uF
10uF
0.047uF
20%
20%
20%
20%
10%
6.3V
6.3V
6.3V
6.3V
10V
C434
C435
1-125-838-11 CERAMIC CHIP
1-100-507-91 CERAMIC CHIP
2.2uF
4.7uF
10%
20%
6.3V
6.3V
34
Ref. No.
Part No.
•
SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. .
uPA. . : µPA. .
uPB. . : µPB. .
uPC. . : µPC. .
uPD. . : µPD. .
When indicating parts by reference number,
please include the board name.
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.
Description
Remark
C436
C437
C438
1-100-415-11 CERAMIC CHIP
1-100-539-91 TANTAL. CHIP
1-100-506-91 CERAMIC CHIP
0.47uF
47uF
1uF
10%
20%
20%
6.3V
6.3V
6.3V
C439
C440
C441
C442
C443
1-165-887-91
1-100-539-91
1-125-777-11
1-125-777-11
1-125-777-11
CERAMIC CHIP
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.22uF
47uF
0.1uF
0.1uF
0.1uF
10%
20%
10%
10%
10%
6.3V
6.3V
10V
10V
10V
C444
C445
C446
C447
C448
1-100-539-91
1-125-777-11
1-125-837-91
1-100-506-91
1-125-777-11
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
47uF
0.1uF
1uF
1uF
0.1uF
20%
10%
10%
20%
10%
6.3V
10V
6.3V
6.3V
10V
C449
C450
C601
C602
C603
1-164-931-11
1-125-837-91
1-119-750-11
1-112-063-11
1-100-506-91
CERAMIC CHIP
CERAMIC CHIP
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
100PF
1uF
22uF
470PF
1uF
10%
10%
20%
10%
20%
50V
6.3V
6.3V
50V
6.3V
C604
C605
C606
C607
C608
1-125-777-11
1-127-715-91
1-164-943-11
1-164-943-11
1-164-858-11
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.1uF
0.22uF
0.01uF
0.01uF
22PF
10%
10%
10%
10%
5%
10V
16V
16V
16V
50V
C609
C610
C611
C612
C613
1-164-939-11
1-100-506-91
1-164-943-11
1-125-777-11
1-125-777-11
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.0022uF
1uF
0.01uF
0.1uF
0.1uF
10%
20%
10%
10%
10%
50V
6.3V
16V
10V
10V
C614
C617
C618
C619
C626
1-119-923-11
1-164-941-11
1-164-941-11
1-164-941-11
1-100-506-91
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.047uF
0.0047uF
0.0047uF
0.0047uF
1uF
10%
10%
10%
10%
20%
10V
16V
16V
16V
6.3V
C627
C629
C631
C639
C645
1-119-750-11
1-107-820-11
1-107-820-11
1-107-820-11
1-165-887-91
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
22uF
0.1uF
0.1uF
0.1uF
0.22uF
20%
10%
6.3V
16V
16V
16V
6.3V
C646
C648
C649
1-107-820-11 CERAMIC CHIP
1-125-777-11 CERAMIC CHIP
1-100-415-11 CERAMIC CHIP
0.1uF
0.1uF
0.47uF
10%
10%
16V
10V
6.3V
NOTES ON HANDLING OF PATCH
The handling of PATCH is necessary when a mounted EGH board is exchanged or when
EEPROM(IC602) on an EGH board is exchanged.
Please confirm in each service front office about the infomation on the handling of PATCH.
D-NE920/NE920LS
Ver. 1.4
EGH
Ref. No.
Part No.
Description
Remark
C650
C653
1-164-941-11 CERAMIC CHIP
1-100-415-11 CERAMIC CHIP
0.0047uF 10%
0.47uF
10%
16V
6.3V
C654
C659
C664
C667
C676
1-125-777-11
1-107-820-11
1-100-539-91
1-107-820-11
1-107-820-11
CERAMIC CHIP
CERAMIC CHIP
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
0.1uF
0.1uF
47uF
0.1uF
0.1uF
10V
16V
6.3V
16V
16V
C677
C678
C680
C681
C686
1-107-820-11
1-119-750-11
1-164-846-11
1-164-846-11
1-100-539-91
CERAMIC CHIP
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
TANTAL. CHIP
0.1uF
22uF
6PF
6PF
47uF
C687
C689
1-107-820-11 CERAMIC CHIP
1-107-820-11 CERAMIC CHIP
0.1uF
0.1uF
C694
C695
C3089
1-125-777-11 CERAMIC CHIP 0.1uF
1-100-945-11 CAP, CHIP CERAMIC
1-125-777-11 CERAMIC CHIP 0.1uF
10%
20%
20%
0.5PF
0.5PF
20%
16V
16V
(JE, KR)
10%
10V
4700PF B
10%
10V
< CONNECTOR >
CN601 1-818-130-11 CONNECTOR, FFC/FPC (ZIF) 15P
CN9001 1-818-842-11 CONNECTOR, BOARD TO BOARD 50P
< DIODE >
D401
D405
6-500-540-01 DIODE RB521S-30FTE61
8-719-071-87 DIODE MA785-(TX), SO
< FERRITE BEAD >
FB101
FB201
FB401
FB402
1-400-808-21
1-400-808-21
1-400-461-21
1-216-864-11
INDUCTOR (EMI FERRITE) (1608)
INDUCTOR (EMI FERRITE) (1608)
FERRITE, EMI (SMD) (1005)
SHORT CHIP
0
< IC >
IC401
IC402
IC403
IC601
★ IC602
6-706-457-01
6-707-209-01
6-703-652-01
6-707-088-01
6-702-355-01
IC
IC
IC
IC
IC
SC901590VAR2
NCP1400ASN22T1G
LMV301MGX/NOPB
CXD9839K-G
AK6510CL-L
✩ IC603
IC604
IC605
IC606
IC3007
not supplied
6-706-995-01
6-804-719-01
6-707-398-01
6-703-631-01
MOUNTED PC BOARD (CASINO1)
IC MSM56X16160F-20T
IC MR27T1602F (JE, KR)
IC XC6213B212NR
IC NJU8713V-TE2
< COIL >
L401
L402
L403
L404
L405
1-456-894-21
1-400-850-21
1-419-646-21
1-469-967-21
1-400-850-21
INDUCTOR
INDUCTOR
INDUCTOR
INDUCTOR
INDUCTOR
47uH
47uH
47uH
10uH
47uH
L406
L407
L408
L409
L410
1-456-218-21
1-400-145-21
1-400-145-21
1-428-912-21
1-400-317-21
INDUCTOR
INDUCTOR
INDUCTOR
INDUCTOR
INDUCTOR
22uH
47uH
47uH
10uH
100uH
L412
1-456-894-21 INDUCTOR
47uH
16V
6.3V
50V
50V
6.3V
Ref. No.
Part No.
Description
Remark
< TRANSISTOR >
Q401
Q402
Q403
Q404
Q405
6-551-139-01
8-729-053-52
8-729-053-54
6-551-140-01
6-551-140-01
TRANSISTOR
TRANSISTOR
TRANSISTOR
TRANSISTOR
TRANSISTOR
Q406
Q601
Q602
6-551-279-01 TRANSISTOR
8-729-427-49 TRANSISTOR
6-550-232-01 TRANSISTOR
DTC115TE-TL
EMX1T2R
EMT1T2R
QS6K1
QS6K1
DTA115TE
XP4214-TXE
2SA1832FV (TH3SONY)
< RESISTOR >
R101
R102
R201
R202
R302
1-218-941-81
1-218-977-11
1-218-941-81
1-218-977-11
1-218-941-81
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
100
100K
100
100K
100
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R401
R402
R403
R404
R405
1-218-977-11
1-218-977-11
1-218-977-11
1-218-989-11
1-218-977-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
100K
100K
100K
1M
100K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R406
R407
R408
R409
R410
1-216-864-11
1-218-990-11
1-218-977-11
1-218-973-11
1-218-973-11
SHORT CHIP
SHORT CHIP
RES-CHIP
RES-CHIP
RES-CHIP
0
0
100K
47K
47K
5%
5%
5%
1/16W
1/16W
1/16W
R411
R412
R413
R414
R415
1-218-965-11
1-218-957-11
1-218-965-11
1-218-961-11
1-218-941-81
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
10K
2.2K
10K
4.7K
100
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R417
R418
R419
R420
R421
1-218-941-81
1-218-969-11
1-218-953-11
1-218-965-11
1-218-977-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
100
22K
1K
10K
100K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R423
R424
R426
R427
R428
1-218-961-11
1-218-989-11
1-218-973-11
1-220-804-11
1-218-973-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
4.7K
1M
47K
2.2M
47K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R429
R430
R431
R432
R435
1-218-969-11
1-218-989-11
1-218-989-11
1-218-953-11
1-218-973-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
22K
1M
1M
1K
47K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R436
R437
R446
R601
R602
1-218-953-11
1-218-953-11
1-218-965-11
1-218-981-11
1-208-911-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
METAL CHIP
1K
1K
10K
220K
10K
5%
5%
5%
5%
0.5%
1/16W
1/16W
1/16W
1/16W
1/16W
R603
R604
1-218-929-11 RES-CHIP
1-218-981-11 RES-CHIP
10
220K
R606
R607
R608
1-218-990-11 SHORT CHIP
1-218-990-11 SHORT CHIP
1-218-973-11 RES-CHIP
0
0
47K
★ NOTES ON HANDLING OF PATCH
The handling of PATCH is necessary when a mounted EGH board is exchanged
or when EEPROM(IC602) on an EGH board is exchanged. Please confirm in
each service front office about the infomation on the handling of PATCH.
5%
1/16W
5%
1/16W
(EXCEPT AEP, UK, EE)
5%
1/16W
✩ IC603 (System Controller) on an EGH board can
not be replaced individually.
Replace with an EGH board assembly for service.
35
D-NE920/NE920LS
Ver. 1.4
EGH JACK
Ref. No.
Part No.
Description
R609
R610
R611
R612
R613
1-218-969-11
1-218-969-11
1-218-990-11
1-218-977-11
1-218-990-11
RES-CHIP
RES-CHIP
SHORT CHIP
RES-CHIP
SHORT CHIP
Remark
R615
R616
R617
R618
R619
1-218-981-11
1-218-985-11
1-218-965-11
1-218-953-11
1-400-461-21
RES-CHIP
220K
RES-CHIP
470K
RES-CHIP
10K
RES-CHIP
1K
FERRITE, EMI (SMD) (1005)
R620
R621
R622
1-218-973-11 RES-CHIP
1-218-953-11 RES-CHIP
1-218-981-11 RES-CHIP
47K
1K
220K
R623
R624
1-208-911-11 METAL CHIP
1-208-911-11 METAL CHIP
10K
10K
1/16W
1/16W
1/16W
(AEP, UK, EE)
0.5%
1/16W
0.5%
1/16W
R625
R628
R629
R634
R635
1-208-911-11
1-218-957-11
1-218-957-11
1-218-965-11
1-218-989-11
METAL CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
10K
2.2K
2.2K
10K
1M
0.5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R636
R637
R639
R642
R644
1-218-977-11
1-218-981-11
1-218-973-11
1-218-973-11
1-218-937-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
100K
220K
47K
47K
47
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R649
R650
R651
R653
R655
1-218-969-11
1-218-977-11
1-218-977-11
1-218-965-11
1-218-977-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
22K
100K
100K
10K
100K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
22K
22K
0
100K
0
5%
5%
1/16W
1/16W
5%
1/16W
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
5%
5%
5%
Ref. No.
Part No.
Description
C403
C404
C406
C407
C409
1-128-829-91
1-127-760-11
1-127-715-91
1-164-935-11
1-137-710-11
TANTAL. CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
220uF
4.7uF
0.22uF
470PF
10uF
20%
10%
10%
10%
20%
6.3V
6.3V
16V
50V
6.3V
Remark
C801
C802
C901
C902
C904
1-164-933-11
1-164-933-11
1-115-156-11
1-125-837-91
1-125-837-91
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
220PF
220PF
1uF
1uF
1uF
10%
10%
50V
50V
10V
6.3V
6.3V
10%
10%
< CONNECTOR >
CN401
CN501
CN601
CN602
CN9002
1-770-620-21
1-818-130-11
1-785-877-21
1-784-342-21
1-818-843-11
PIN, CONNECTOR 3P
CONNECTOR, FFC/FPC (ZIF) 15P
HOUSING, CONNECTOR 4P
HOUSING, CONNECTOR 2P
CONNECTOR, BOARD TO BOARD 50P
< DIODE >
D401
D402
D901
D902
D903
6-500-483-01
8-719-085-43
8-719-077-43
8-719-083-04
8-719-083-04
DIODE
DIODE
DIODE
DIODE
DIODE
MA22D2800LS0
MA2YD2300LS0
MAZZ068H01S0
RSB6.8STE61
RSB6.8STE61
D904
D905
D906
8-719-422-37 DIODE MA8051-TX
8-719-422-37 DIODE MA8051-TX
8-719-083-04 DIODE RSB6.8STE61
< FUSE >
0 F401
1-576-406-21 FUSE, MICRO (1608) 1.4A/32V
< FERRITE BEAD >
< COMPOSITION CIRCUIT BLOCK >
RB601
1-233-969-11 RES, NETWORK (CHIP TYPE) 22K
< VIBRATOR >
X601
1-813-314-11 VIBRATOR, CRYSTAL 22.579MHz
************************************************************
A-1076-795-A JACK BOARD, COMPLETE (JE, KR)
A-1098-012-A JACK BOARD, COMPLETE (US, CND)
A-1098-013-A JACK BOARD, COMPLETE
(AEP, UK, EE, HK, E18, E33, AUS)
**************************************
FB401
FB402
FB801
FB802
FB803
1-162-964-11
1-216-864-11
1-414-813-11
1-414-813-11
1-414-813-11
CERAMIC CHIP 0.001uF 10%
SHORT CHIP
0
FERRITE, EMI (SMD) (2012)
FERRITE, EMI (SMD) (2012)
FERRITE, EMI (SMD) (2012)
FB804
FB805
FB806
FB901
FB902
1-414-813-11
1-414-813-11
1-216-295-91
1-414-760-21
1-414-760-21
FERRITE, EMI (SMD) (2012)
FERRITE, EMI (SMD) (2012)
SHORT CHIP
0
FERRITE, EMI (SMD) (1608)
FERRITE, EMI (SMD) (1608)
FB903
1-414-760-21 FERRITE, EMI (SMD) (1608)
50V
< IC >
2-187-574-01 TERMINAL (+), BATTERY
2-187-575-01 TERMINAL (-), BATTERY
IC401
6-707-315-01 IC RT8H055C-T1
< CAPACITOR >
< JACK >
C101
C103
C201
C203
C301
1-165-884-91
1-127-715-91
1-165-884-91
1-127-715-91
1-125-837-91
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
2.2uF
0.22uF
2.2uF
0.22uF
1uF
10%
10%
10%
10%
10%
6.3V
16V
6.3V
16V
6.3V
C302
C304
C305
C306
C402
1-125-777-11
1-125-837-91
1-125-777-11
1-162-970-11
1-115-156-11
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.1uF
1uF
0.1uF
0.01uF
1uF
10%
10%
10%
10%
10V
6.3V
10V
25V
10V
J301
J402
< COIL >
L101
L201
1-400-849-21 INDUCTOR, CHIP 100uH (2518)
1-400-849-21 INDUCTOR, CHIP 100uH (2518)
< LINE FILTER >
LF401
36
1-818-840-21 JACK (i / LINE OUT (OPTICAL))
1-818-841-11 JACK, DC
1-416-405-21 FILTER, CHIP EMI (COMMON MODE)
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
D-NE920/NE920LS
JACK
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
JACK SUB
SWITCH
Description
Remark
< VARISTOR >
< TRANSISTOR >
Q301
Q302
Q303
Q304
Q305
6-550-364-01
6-550-364-01
6-550-375-01
8-729-047-48
6-551-132-01
TRANSISTOR
TRANSISTOR
TRANSISTOR
TRANSISTOR
TRANSISTOR
2SD2652T106
2SD2652T106
UMD2N-TR
UMD12N-TR
EMG6
Q306
Q307
Q401
Q402
Q403
6-550-527-01
6-551-186-01
8-729-602-36
6-550-760-01
6-550-364-01
TRANSISTOR
TRANSISTOR
TRANSISTOR
TRANSISTOR
TRANSISTOR
NTHD5904T1
EMX18
2SA1602TP-1EF
2SA1363-T111-1E
2SD2652T106
VDR901 1-801-862-11 VARISTOR, CHIP
(1608)
************************************************************
JACK SUB BOARD
***************
< JACK >
J401
1-818-841-11 JACK, DC
************************************************************
A-1076-792-A SWITCH BOARD, COMPLETE
***********************
< RESISTOR >
R102
R103
R202
R203
R303
1-218-945-11
1-218-981-11
1-218-945-11
1-218-981-11
1-218-957-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
220
220K
220
220K
2.2K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R304
R305
R306
R307
R308
1-220-803-81
1-218-981-11
1-218-981-11
1-218-957-11
1-218-953-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
4.7
220K
220K
2.2K
1K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R309
R310
R311
R312
R313
1-218-989-11
1-218-953-11
1-218-969-11
1-218-989-11
1-218-969-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
1M
1K
22K
1M
22K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R314
R315
R316
R401
R402
1-218-957-11
1-218-957-11
1-218-957-11
1-218-989-11
1-218-985-11
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
RES-CHIP
2.2K
2.2K
2.2K
1M
470K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
R403
R404
R405
R406
R407
1-218-985-11
1-208-943-11
1-208-927-11
1-218-941-81
1-245-927-21
RES-CHIP
METAL CHIP
METAL CHIP
RES-CHIP
METAL CHIP
470K
220K
47K
100
0.22
5%
0.5%
0.5%
5%
1%
1/16W
1/16W
1/16W
1/16W
1/5W
R408
R409
R410
R411
R501
1-218-973-11
1-218-945-11
1-218-973-11
1-218-989-11
1-400-461-21
RES-CHIP
47K
RES-CHIP
220
RES-CHIP
47K
RES-CHIP
1M
FERRITE, EMI (SMD) (1005)
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
R502
R503
R504
R505
1-400-461-21
1-400-461-21
1-400-461-21
1-400-461-21
FERRITE, EMI (SMD) (1005)
FERRITE, EMI (SMD) (1005)
FERRITE, EMI (SMD) (1005)
FERRITE, EMI (SMD) (1005)
1-805-687-11
1-805-700-11
1-829-898-11
2-187-673-01
DISPLAY PANEL, LIQUID CRYSTAL
ELEMENT, EL INDICATOR
CABLE, FLEXIBLE FLAT (15 CORE)
SHEET (LCD), ADHESIVE
< CAPACITOR >
C1001
C1002
C1003
C1004
C1005
1-162-970-11
1-100-996-21
1-127-715-91
1-127-715-91
1-127-715-91
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.01uF
0.1uF
0.22uF
0.22uF
0.22uF
10%
10%
10%
10%
10%
25V
250V
16V
16V
16V
C1006
C1007
C1008
C1010
C1011
1-127-715-91
1-127-715-91
1-117-863-11
1-127-715-91
1-127-715-91
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.22uF
0.22uF
0.47uF
0.22uF
0.22uF
10%
10%
10%
10%
10%
16V
16V
6.3V
16V
16V
C1012
C1013
C1014
C1025
C1026
1-127-715-91
1-162-970-11
1-164-156-11
1-137-710-11
1-164-156-11
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
CERAMIC CHIP
0.22uF
0.01uF
0.1uF
10uF
0.1uF
10%
10%
16V
25V
25V
6.3V
25V
20%
< CONNECTOR >
CN1001 1-818-806-21 CONNECTOR, FFC/FPC (ZIF) 26P
* CN1002 1-815-832-21 CONNECTOR, FFC/FPC (ZIF) 15P
< DIODE >
D1001
D1002
6-500-781-01 DIODE SML-521MUW
8-719-052-12 DIODE 1SS403 (TPH3)
< IC >
< COMPOSITION CIRCUIT BLOCK >
RB301
1-233-787-11 RES, NETWORK
8-759-830-70 IC SM8142BD-G-EL
< COIL >
L1001
1-400-776-11 INDUCTOR
1.0K (1608)
< SWITCH >
S501
S502
IC1001
1-762-805-41 SWITCH, PUSH (1 KEY)
1-572-922-11 SWITCH, SLIDE (HOLD .)
220uH
< RESISTOR >
R1001
R1002
R1004
R1005
R1006
1-216-864-11
1-216-821-11
1-216-845-11
1-414-760-21
1-216-864-11
SHORT CHIP
0
METAL CHIP
1K
5%
METAL CHIP
100K
5%
FERRITE, EMI (SMD) (1608)
SHORT CHIP
0
R1007
R1008
1-216-864-11 SHORT CHIP
1-216-864-11 SHORT CHIP
1/10W
1/10W
< THERMISTOR >
TH401
1-805-719-11 THERMISTOR, POSITIVE
0
0
37
D-NE920/NE920LS
Ver. 1.5
SWITCH
Ref. No.
Part No.
Description
Remark
R1009
R1010
R1011
1-216-864-11 SHORT CHIP
1-216-821-11 METAL CHIP
1-216-821-11 METAL CHIP
0
1K
1K
5%
5%
1/10W
1/10W
R1012
R1013
R1014
R1016
R1101
1-216-821-11
1-216-821-11
1-216-821-11
1-216-841-11
1-216-833-11
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
1K
1K
1K
47K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R1102
R1103
R1104
R1105
R1106
1-216-829-11
1-216-825-11
1-216-837-11
1-216-825-11
1-216-829-11
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
4.7K
2.2K
22K
2.2K
4.7K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R1107
R1108
R1109
R1110
R1111
1-216-833-11
1-216-837-11
1-216-821-11
1-216-825-11
1-216-825-11
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
10K
22K
1K
2.2K
2.2K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R1112
R1113
R1114
R1115
R1118
1-216-837-11
1-216-813-11
1-216-821-11
1-216-829-11
1-216-841-11
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
METAL CHIP
22K
220
1K
4.7K
47K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R1119
1-216-864-11 SHORT CHIP
0
< SWITCH >
S1001
S1002
S1003
S1004
S1006
1-771-105-11
1-771-105-11
1-786-777-21
1-786-675-11
1-786-675-11
SWITCH, TACTILE (
–)
SWITCH, TACTILE (
+)
SWITCH, LEVER (SLIDE) (u / VOL + / VOL –)
TACTILE SWITCH (.)
TACTILE SWITCH (>)
S1007
S1009
S1010
1-771-105-11 SWITCH, TACTILE (x / CHG)
1-771-105-11 SWITCH, TACTILE (DSPL/MENU)
1-771-105-11 SWITCH, TACTILE (SEARCH)
< VARISTOR >
VDR1001 1-801-862-11 VARISTOR, CHIP
(1608)
************************************************************
MISCELLANEOUS
**************
0 102
M901
M902
X-3383-995-1 OPTICAL PICK-UP (DAX-25EV RP ASSY)
A-3608-777-A MOTOR ASSY, TURN TABLE (SPINDLE)
A-3174-850-A MOTOR ASSY, SLED (SLED)
ACCESSORIES
************
0
1-569-007-12 ADAPTOR, CONVERSION 2P (JE, E33)
2-318-333-11 MANUAL, INSTRUCTION (ENGLISH)
(EXCEPT KR)
2-318-333-21 MANUAL, INSTRUCTION
(SPANISH, PORTUGUESE, FRENCH) (CND, AEP, E33)
2-318-333-31 MANUAL, INSTRUCTION
(DUTCH, GERMAN, ITALISH) (AEP)
2-318-333-41 MANUAL, INSTRUCTION (SWEDISH, FINNISH)
(AEP)
Ref. No.
Part No.
Description
2-318-452-11 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE)
(ENGLISH) (E18, HK, JE, AUS)
2-318-452-21 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE) (SPANISH) (AEP)
2-318-452-31 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE) (PORTUGUESE) (AEP)
2-318-452-41 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE) (FRENCH) (AEP)
2-318-452-51 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE)
(DUTCH, GERMAN, ITALISH) (AEP)
2-318-452-61 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE) (SWEDISH, FINNISH) (AEP)
2-318-452-71 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE)
(HUNGARIAN, RUSSIAN, POLISH) (EE)
2-318-452-81 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE) (CZECH, SLOVAK) (EE)
2-318-454-11 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE) (KOREAN) (JE, KR)
2-318-454-21 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE)
(TRADITIONAL CHINESE) (HK, JE)
2-318-454-31 MANUAL, INSTRUCTION
(INSTALL OPERATION GUIDE)
(SIMPLIFIED CHINESE) (E18, JE)
2-590-334-11 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(ENGLISH)(US,AEP,UK,EE,CND,E33)
2-590-334-21 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(SPANISH)(AEP,E33)
2-590-334-31 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(PORTUGUESE)(AEP,E33)
2-590-334-41 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(FRENCH)(AEP,CND)
2-590-334-51 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(DUTCH, GERMAN, ITALISH)(AEP)
2-590-334-61 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(SWEDISH, FINNISH)(AEP)
2-590-334-71 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(HUNGARIAN, RUSSIAN, POLISH)(EE)
2-590-334-81 MANUAL, INSTRUCTION
(SS2.3 INSTALL OPERATION GUIDE)
(CZECH, SLOVAK)(EE)
X-2024-753-1 CD-ROM (APPLICATION) ASSY (SS2.1)
(SonicStage) (E18, HK, JE, AUS)
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
38
Remark
2-318-333-51 MANUAL, INSTRUCTION
(HUNGARIAN, RUSSIAN, POLISH) (EE)
2-318-333-61 MANUAL, INSTRUCTION (CZECH, SLOVAK)
(EE)
2-318-333-71 MANUAL, INSTRUCTION (KOREAN) (JE, KR)
2-318-333-81 MANUAL, INSTRUCTION
(TRADITIONAL CHINESE) (HK, JE)
2-318-333-91 MANUAL, INSTRUCTION
(SIMPLIFIED CHINESE) (E18, JE)
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
D-NE920/NE920LS
Ver. 1.4
Ref. No.
Part No.
01
01
01
01
X-2050-857-1 CD-ROM (APPLICATION) ASSY (SS2.3)
(SonicStage) (US, CND, AEP, UK, EE, E33)
1-478-846-21 ADAPTOR, AC (AC-ES3010K2) (US, CND)
1-478-847-21 ADAPTOR, AC (AC-ES3010K2) (KR)
1-478-848-21 ADAPTOR, AC (AC-ES3010K2) (AEP, EE, E18)
1-478-849-21 ADAPTOR, AC (AC-ES3010K2) (UK, HK)
01
01
2
3
4
1-478-850-21
1-478-853-22
A-1077-866-A
2-187-958-01
A-1074-427-A
5
Description
Remark
ADAPTOR, AC (AC-ES3010K2) (AUS)
ADAPTOR, AC (AC-ES3010K2) (JE, E33)
BCA-DNE820/SM (CHARGING STAND)
COVER, BATTERY CASE (External battery cover)
EBP-J101//M (EXTERNAL BATTERY CASE)
1-756-120-51 BATTERY, NICKEL HYDROGEN
(Rechargeable battery) (US, CND)
1-756-120-61 BATTERY, NICKEL HYDROGEN
(Rechargeable battery) (EXCEPT US, CND)
3-008-521-01 CASE, CHARGE (Battery carrying case)
3-235-292-01 POUCH, CARRYING
8-912-735-90 HEADPHONE MDR-E0931SP/B SET
(HK, E18, JE, KR, AUS)
5
6
7
8
8
8-912-742-91 EARPHONES MDR-E0931SPB9 SET
(US, CND, AEP, UK, EE, E33)
A-1071-445-A RM-MC55ELK/SM (JE, KR)
A-1071-446-A RM-MC53EL/SM (EXCEPT JE,KR)
9
9
1
2
4
5
3
7
6
8
9
39
D-NE920/NE920LS
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver.
Date
Description of Revision
1.0
2004.11
New
1.1
2005.01
Addition of Canadian model and E33 (100-240V AC area in E model)
model
1.2
2005.06
Addition of Australian model for D-NE920
1.3
2005.11
Change of the Parts No. of EGH BOARD, COMPLETE
(SPM-05135)
Addition of the notes on handling of PATCH
(SPM-05181)
1.4
2006.05
Deletion of Chinese model
(SPM-06063)
1.5
2007.02
Deletion of DC PLUG
(SPM-07016)

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