Recent Developments in Active Implants

Recent Developments in Active Implants
Innovation of interconnections for Active Implant Applications
Valtronic’s Overview
1) Introduction of Valtronic:
from Micro-technology to Medtech
2) Active Implants:
application of miniaturized assembly technologies
3) From industry to Medtech:
adaptation to specific constrains
30 Years in Micro Technology
1990
Electronic Module for Discovery Space Shuttle
1995
Chip for Formula One race
2000
World's smallest hearing aid
2006
World's smallest implantable pulse generator
2006
Retinal Implant for the Blind
2009
"Smart Pill" Wireless Motility Capsule
Smart Implants
What Do We Mean By Smart?
An implant that is able to provide in-vivo diagnostic biofeedback
and/or treat a patient according to specific conditions
Microsystem measuring and transmitting
diagnostic data during or after implantation
Needs to function in an autonomous way
during the lifespan of a product which
varies from six months to over fifty years
Monitoring Diabetics
Acquires, processes and analyzes brain activity
Implantable EEG Recorder
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Minimal Power Consumption – no battery
Tiny antenna and extreme miniaturization (COC, COB and 01005 SMD)
Assembled in a RF transparent, bio-compatible material housing
Measures 4mm thick x 17 mm diameter
Treating Glaucoma
Allows ophthalmologists to observe the behavior of intraocular
pressure continuously, particularly during while sleeping
Built-in flexible electronics, silicone,
ultrasonic flip-chip process and clean
manufacturing
Preventing Heart Failure
Stimulate/pace the heart through wireless transmission of energy
Implantable leadless cardiac pacing
device for treatment of heart rhythm
management
Six-layer flex board, 2mil lines and
spaces, ENEPIG process.
Smart Implant Challenges
Packaging /
enclosure
Reliable Processes
& Technology
Powering &
Autonomy
Detection &
Sensing
&
Memory
Interaction
Communication
Design Constraint Trends in Stimulation Field
More specific stimulation features:
 More electrodes & leads
 Innovative electrode design
 Channel modulation
Device as minimally invasive as possible:
 Smaller Implant size
 Smaller and reliable interconnections
Application of micro-technology assembly
to Active implant device
• Long term reliability of assembly
• Extreme miniaturization
• High computation power at low power
Miniaturization of micro-elecronics
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Wire-bonding with over molding
Ultrasonic Flip-Chip
Miniaturization - Wire-Bonding with Over Molding
Chip on Board
1.- Glue on substrate (FR4, Flex, G10 etc.)
2.- Die attach
Internal electronic of a
cochlear implant
3.- Wire bonding & testing
Chip-on-board assembly with 0201
components
Product lifetime 75 years!
.
4.- Coating & testing
Miniaturization - Ultrasonic Flip Chip Bonding
Assembly of flexible electronics in a silicone rubber lens
 Clean manufacturing
 10x faster than glued flip-chip
 Lowest total cost of ownership
Allows ophthalmologists to observe the
behavior of intraocular pressure during
sleep.
Ultrasonic Flip Chip
PCB track
PCB
DIE
PCB
Temperature + Pressure + Ultrasonic Power
DIE
PCB
Underfill of non-conductive adhesive
DIE
PCB
High Density Ultra-Sonic Flip-Chip Process
Gold Bumping
Dispensing
Ultrasonic Flip-Chip
Applied to active Implant interconnection lead
High density Ultra-Sonic Flip-Chip Process
Process Characteristics:
High Density Ultra-Sonic Flip-Chip Process
High Density Ultra-Sonic Flip-Chip
process
Innovative Interconnection Technology means:
 Reducing the required volume for the implants
 Allowing innovative electrodes design
 Ensuring the liability for long term implantation
How to get from Industry to Medtech?
• Apply and adapt known technologies to “new” fields
• Adaptation to constrains :
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QA structure (ISO13485)
EU/US regulation and norms application
Clean Manufacturing
Verified and validated processes
Culture change
Organization and business model adaptation
Develop bridging technologies
Valtronic Core Competencies
Contract Manufacturing & Engineering service for Medtechs’
 SMT Fine pitch to 01005
 3D chip-scale Wire bonding
to 55µ density
 Flip-chip <100µ pitch, HDI
flex circuitry
 5 axis CNC Machining,
thread cutting, HSM
 PEEK, Titanium, Pe-Hd,
Chrome Cobalt, POM…
 World-wide Supply Chain
 DFM & DOE
 Final packaging, sterilization
& labeling
 Project management
Valtronic at a Glance Today
Valtronic is a full-service provider of Engineering, Design and Contract
Manufacturing services.
We provide solutions ranging from micro-electronic and mechanical
parts to the design for manufacturing of complete devices.
Engineering Staff
70
Production Staff
480
Manufacturing Area
13’000 m2 of which 540 m2 clean room
(Class ISO 7 & 10K)
Served Markets
Medical Devices (70%) and Select Industrial
Dr. Peter Ruppersberg, CEO
No. of Class 3 Projects
22 projects in development, clinical trials or production
(active implant)
In conclusion
The initial core competences in “Ultra-miniaturized”
assembly technologies are adapted to be the driver
bringing a high added-value to the Medtec world.
Thank you for your attention
Route de Bonport 2 ~ 1343 Les Charbonnières ~ Switzerland ~
www.valtronic.com ~ +41 21 841 01 11