FactSheet Service and Prototyping

Prototyping and Development Services
Fact Sheet
Technology
Being a Nanotechnology lab we offer you our research competencies and prototyping services in the field
of micro- and nanotechnology for applications in microelectronics, photonics and biotechnology. AMO is
equipped with a high quality R&D infrastructure meeting cross-industry specifications by means of:
■ Nanoimprint technology
■Electron beam lithography
■i-line optical lithography
■Pattern transfer and thin film deposition
■NanoCMOS & Nanophotonic process libraries
AMO provides you with:
■ a flexible and powerful infrastructure for Micro- and Nanostructuring
■a technology platform in the area of Nanophotonics and NanoCMOS
■services from prototyping development to small scale production
■as well as the development of individual solutions
>>> Core Competencies
>>> Get Access
>>> Our Strengths
■individual service
■ from ultra-high accuracy
■to volume production
■flexible
■short turnaround
■IP protection
■Nanoimprint
■ Nanophotonics
■NanoBio
■NanoElectronics
■Micro- and Nano
Please contact us for further information.
■ Contact: Dipl.-Ing. Herbert Kleinjans ■ [email protected]
AMO
AMO GmbH
Otto-Blumenthal-Straße 25 ■ D-52074 Aachen ■ Germany
Phone +49 241 88 67-125 ■ Fax +49 241 88 67-571
[email protected] ■ www.amo.de
Foundry Service, Production Service
Fact Sheet
Equipment
Description:
AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m²: Nanolab AMICA. Here, high end fabrication
equipment for semiconductor technology is operated in a highly flexible way to enable high quality nanofabrication, quick
process changes and unconventional solutions.
Lithography
■ Vistec 5200 e-beam system:
20/50/100 kV , sub 10 nm resolution, from samples of
10x10mm up to 8“ substrates
Sputtering /Evaporators
■ Von Ardenne CS730 Cluster system: 6” DC and RF sputtering. Materials: W, Ni, Ti, TiN, Al, AlSi, AlCr, SiO2, Ta2O5,
Al2O3, HfO2 , etc.
■ Canon FPA 3000 i5r i-line Stepper with 0,5 µm resolution
■ Pfeiffer Vacuum Classic 580: 6” e-beam and resistive
evaporator. Materials: Al, Cr, Si02,Ti, Ta2O5 , etc.
■ EVG 420: 6” semi-automatic Maskaligner
■ EVG 150: 4”- 8” automatic resist coater and developer
■ Süss MA8 Gen3 SCIL: 2“-8“ UV-Nanoimprint Lithography
■ EVG 770: 4“ - 8“ UV-Nanoimprint Step&Repeat Lithography
■ EVG 620 Soft UV Nanoimprint prototype:
4”- 6” flexible template size, sub 50 nm resolution
■ 2 experimental Interference Lithogarphy systems:
180 nm - 2.5 µm pitch, up to 8” substrates
Wet Processing
■ ARIAS Wet benches:
single wafer and batch cleaning and resist processes
■ SCFluids Super Critical Dryer:
CO2, semi-automatic, up to 6” substrates
Furnaces
■ Four 6” - 8“ Centrotherm Furnaces:
Oxidation, POCl3-Diffusion and Annealing
■ Jipelec JetFirst: 6” Rapid Thermal Annealing system
CVD (Chemical Vapour Deposition)
■ Centrotherm 6” LPCVD furnaces:
Polysilicon, Silicon Nitride and LTO (low temp. SiO2)
Atomic Layer Deposition
■ 2 Oxford FlexAL Plasma assisted ALD
Materials: AlN, Al2O3, TaN, TiN
Etchers
■ Oxford PlasmaLab 100: 3 automatic chamber systems,
6” - 8“ chlorine, fluorine and bromine based chemistry
■ Tepla Semi 300: Microwave Plasma Etcher, batch and
single wafer processes, 02 and CF4 processes
Metrology
■ Zeiss Supra 60 VP, EDX
High resolution SEM with automated CD control module
■ Veeco (DI) Dimension 3100 SPM:
high resolution STM, AFM, MFM, up to 6” substrates
■ Veeco DekTak³ST surface profiler
■ Leica INM 100 and INM 300 optical microscopes
■ Philips PQ Ruby Ellipsometer
Electrical Testing
■ High end Parameter analyser for small signal DC nanoelectronic device testing
Optical Testing
■ Silicon Photonics device testing @1300 nm @1550 nm,
tunable laser, fiber & butt coupled
■ Contact: Dipl.-Ing. Herbert Kleinjans ■ [email protected]
AMO
AMO GmbH
Otto-Blumenthal-Straße 25 ■ D-52074 Aachen ■ Germany
Phone +49 241 88 67-125 ■ Fax +49 241 88 67-571
[email protected] ■ www.amo.de