Architectural Overview of the Apple A4 APL0398 ARM

Architectural Overview of the
Apple A4 APL0398 ARM Application Processor
found on the iPad
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April 2010
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Report ID#: MKT-24018-2010
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
Device Summary
Manufacturer
Apple
Part Number
APL0398
Description
ARM Applications Processor
Package Type
531 PoP (Package on Package)
Package Markings (top)
(Apple logo) A4 K4X2G643GE-JGCB APL0398
339S0084 YNJ222PE 1001 N25VCOO 1004
Die Markings
APL0398B01
Die Size
7.3mm x 7.3mm = 53.3 mm²
Number of Metal Levels
9
Number of Poly Levels
1
Foundry
Samsung
Interconnect Level (Width / Pitch (µm))
Metal Level - M1
0.09 / 0.14 (Measured (X-Section))
Metal Level - M2
0.09/ 0.14 (Measured (X-Section))
Metal Level - M3
0.1 / 0.14 (Measured (X-Section))
Metal Level – M4
0.09 / 0.14 (Measured (X-Section))
Metal Level – M5
0.1 / 0.14 (Measured (X-Section))
Metal Level – M6
0.11 / 0.15 (Measured (X-Section))
Metal Level – M7
1.54 / 2.4 (Measured (X-Section))
Metal Level – M8
1.54 / 2.4 (Measured (X-Section))
Metal Level – M9
6.39 / 12.75 (Measured (X-Section))
Poly Layer - P1
0.05 / Not Specified (Measured (X-Section))
Process Type
CMOS (Copper)
Process Generation
0.045 µm
Feature Measured to Determine
Process Generation
Gate Length (Logic, SEM)
Transistor Gate Length
0.05 µm
Cell Size
0.382 um²
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
1.0 Introduction
The Samsung APL0398 is the applications processor extracted from the Apple iPad tablet
computer. It is packaged with DRAM in a package on package (POP) architecture where the
package markings identify the packaged processor and memory as A4. The processor is
manufactured with a 45 nm, 9 metal, single poly, CMOS process.
Information available to the public on the APL0398 is scarce, however, speculation on the
internet suggests the SoC (system on a chip) includes:



32-bit ARM Cortex A8 or A9 processor core;
Integrated GPU;
Memory controller.
The device has approximately 2503 KB of embedded memory divided among two SRAM cell
structures, as well as ROM. There are embedded blocks of 6T AND 8T SRAM.
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
2.0 Architectural Overview
This section contains an overview of the package and die including images of the package and
package markings, x-ray, die and die markings.
2.1
Package Overview
The Apple APL0398 is packaged inside a 531-pin BGA that is configured as a package on
package (PoP) with memory adjoining the processor. There are 316 additional solderballs
between the two packages in the stack. Photographs 2.1.1 through 2.1.4 are the package top,
bottom and X-ray images. Markings on the top of the memory package were:
(Apple logo) A4
K4X2G643GE-JGCB
APL0398 339S0084
YNJ222PE
N25VCOO 1004
Photograph 2.1.1: Package top.
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Photograph 2.1.2: Package bottom.
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
Pin 1 Indicator Photograph 2.1.3: Package X-ray.
Photograph 2.1.4: Package X-ray, side view.
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
2.2
Die Overview
The Apple APL0398 measures 7.3 mm x 7.3 mm, has a total die area of 53.3 mm2 and is
presented in Photograph 2.2.1. The die contains the following markings (Photograph 2.2.2):
APL0398B01
Photograph 2.2.1: Die photograph.
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
Photograph 2.2.2: Die markings.
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
2.3
Process Generation
The APL0398 is manufactured with a nine metal, single poly CMOS process. The minimum
observed feature was a logic gate that measured 50 nm. Photograph 2.3.1 is a SEM cross-section
image of the minimum observed feature.
In consideration of the minimum gate length, high density 6T SRAM cell area, and the minimum
metal layer widths and pitches, we believe the device is fabricated at the 45 nm process node.
The foundry is likely Samsung.
Photograph 2.3.1: SEM cross section through the minimum
observed transistor (glass etch).
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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad
Report ID#: MKT-24018-2010
3.0 Functional Overview
3.1
Device Functionality
Although there is lots of speculation regarding the iPad applications processor in various
websites on the internet, Apple has been very successful in maintaining an air of secrecy around
the functions embedded in the device. Many believe the chip to be the first design of the recently
acquired PA1,2, although at least one dissenting website3 believes the design team to be from
Intensity.
Most speculate the inclusion of an ARM core; specifically the Cortex A8 or A9 based on the
high processing frequency. In the past, Apple has included the ARM logo in the packaging
marks of the processors used in various generations of the iPhone or iPod. There are no ARM
markings found on the package or die of this device.
Other websites speculate on the integration of a GPU4 (graphics processor unit).
A memory controller is also believed to be integrated into the device.
Until Apple discloses the processor features, or extensive reverse engineering is performed,
much of the above will remain speculation.
1
http://www.brightsideofnews.com/news/2010/1/27/apple-a4-soc-unveiled---its-an-arm-cpu-andthe-gpu!.aspx
2
http://www.tomshardware.com/news/apple-ipad-iphone-ipod,9522.html
3
http://spectrum.ieee.org/semiconductors/processors/evidence-for-intrinsity-in-the-ipad
4
http://www.tipb.com/2010/01/28/apple-a4-ipad-chipset-arm-multicore-cortex-a9-mali-50-gpu/
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