products guide

Transcription

products guide

EMBEDDED CREATORS
PRODUCTS
GUIDE
PR ODUCT S GUIDE
INDEX
Qseven®
QuadMo747-Z5xxp.10
QuadMo747-EXTREME p.11
QuadMo747-E6xxp.12
QuadMo747-GSeries p.13
QuadMo747-x2000p.14
QuadMo747-X/OMAP3 p.15
QuadMo747-X/i.MX51 p.16
QuadMo747-X/i.MX6 p.17
QuadMo747-X/T20p.18
QuadMo747-X/T30p.19
Cross Platform Development Kit
p.23
Cross Platform Starter Kit
p.24
SECOCQ7-pITXp.25
SECOCQ7-pITX-Xboard p.26
SECOCQ7-mITX2.0p.27
SECOCQ7-microp.28
SECOCQ7-MXMp.29
CARMA DevKitp.30
p.31
NVIDIA® Kayla GPU DevKit
µQseven
μQ7-OMAP5p.20
μQ7-T30p.21
μQ7-i.MX6p.22
COM EXPRESS™
SECOMExp-iCOREp.41
SECOMExp-iCore-XT p.42
SECOMExp-iCore/E4690
p.43
SECOMExp-IONp.44
SECOMExp-GSeriesp.45
SECOMExp-RSeriesp.46
SECOMExp-x2000p.47
SECOCExp-mITXp.48
SBC
SECOnITX-IONp.53
SECOpITX-x2000p.54
SECOμSBC-i.MX6p.55
SECOμSBC-T30p.56
SECOpITX-GXp.57
ETX® 3.0 / XTX™
SECOME-945/N270p.61
SECOMX-945/N270p.63
SECOCX-mITXp.64
Company
Milestones
SECO, world-leading company in electronic embedded
solutions, over its 30 years of experience has shown the
ability to adapt its know-how to new, challenging customers’
needs, and to provide cutting edge solutions to its partners.
On the strength of its know-how and in contrast with
recent outsourcing policy, SECO has always set the entire
production cycle in Italy, from the development stage to
mass distribution.
Thanks to new, innovative solutions and great research and
design activities together with the partnership with major
scientific Universities and worldwide leading companies,
SECO went International becoming a global market-leading
company providing solutions to modern challenges.
1979 SECO Elettronica Snc is set up
1989 SECO introduces its first personal computers onto the Italian market, obtaining the BEST DESIGN award at the SMAU trade show, a success achieved also in 1999 with the introduction of the all-in-one Ellipse Personal Computer
1995 SECO founds PSM (Professional Surface Mounting), which becomes its production unit
2003 Thanks to the constant growth of PSM, the company moves into new facilities (2.000 sqm) and is ISO 9001:2000 certified
2004 While awaiting the introduction of the new “RoHS, WEE and Green” regulations, the company invests in a new SMT line for Lead Free production
2006 / 2007 SECO invests in a new premises (1.200 sqm) designed for the complete systems assembly by PSM
2008 SECO, congatec and MSC found the new embedded standard: Qseven® and the Qseven Consortium
2009 SECO celebrates its 30th Anniversary with a new company logo
2010 SECO proposes some modifications to Qseven pinout, aimed at allowing the integration of the new features for ARM architecture
2011 At the Supercomputing Conference in Seattle (USA), the BSC (Barcelona Supercomputing Center) announces the first cluster in the world based on 256 ARM units, GPU-assisted, featuring a low power consumption HPC powered by SECO technology
2012 •
SECO Inc. in Boston (USA) is set up
•
SECO is one of the founding members of SGET (Standardization Group for Embedded Technologies)
•
SECO launches CARMA, the first energy-efficient platform for HPC in the world
Our Partners
Over the years, SECO has established and consolidated relationships with major international companies in the electronics industry as well as centers of
excellence, universities and research institutes that support the company’s direct and dynamic vision for continued research regarding to new technologies to be
integrated with its increasingly complex projects.
Technological Partners
OS Supported
Consortium
• AMD
• Freescale™
• Intel®
• Microsoft® Windows Embedded®
• NVIDIA®
• Samsung
• Texas Instruments®
• Microsoft® Windows Embedded®
• Linux
• Android
• SGET (Standardization Group for Embedded Technologies)
• Qseven Consortium
• PCI Industrial Computer Manufacturers Group (PICMG)
• PC/104 Consortium
• ETX Industrial Group
• XTX Consortium
• SFF-SIG
• HDMI Licensing
• SD Association
Areas of Application
• Automation • Automotive • Avionics • Biomedical • Defence • Digital signage - Infotainment • Domotics • Ehealth - Teleassistance • Energy • Gaming Our Strategy
• Handheld electronics • Home entertainment • Industrial • Measuring instrument • Robotics • Surveillance • Telco • Transportation • Wellness
• Wireless Technologies
• Advanced Innovation
• Development of High Performance Product Lines
• Power Consumption Reduction
• Focus on Quality and Reliability
• Maximum Integration
• Customization of Hardware, Firmware and Software Products
• Long Term and Highly Qualified Technical Support
Qseven STANDARD
®
Benefits:
Module-Based Application
Low Power Consumption
Interchangeability Among Architectures
Low Impact on OS Migration
Upgradable Solutions
Reduced Time to Market
Fields of Application:
Industrial: automation and monitoring
Data acquisition
Medical: data acquisition
Portable devices
Telecommunication
Automotive - Transport: detection systems
Retail Industry: point of sales and kiosks
Multimedia
HMI
Gaming
Digital Signage
Qseven® Compact & Cost Efficient
Qseven® standard has shown itself, as the most compact
& cost efficient Computer On Module of the embedded
market.
The design flexibility of Qseven® architecture is the same
of the other COMs like ETX®, XTX™ or COM Express™:
replacing the board it is possible to diversify the product
range through the use of different architectures.
Qseven® standard features PCI Express®,ExpressCard®,
Serial ATA®, Secure Digital I/O interface, DisplayPort™
(or TMDS or SDVO) interfaces, USB 2.0, High Definition
Digital Audio, LPC interface, Gigabit Ethernet, LVDS Display
interface.
All the signals arrive to the carrier through a 230 pins MXM
connector.
SECO provides complete system solutions with Qseven®.
SECO is one of the founding
members of SGET.
Qseven® STANDARD Rev. 2.0 specification
Mechanic and Cooling
Compact size
• Quadratic 7 cm (~2,76” x ~2,76”)
• Rev. 2.0 allows for a microQseven Size
4 x 7 cm (~2,76” x 1,57”)
• Solid mechanical mounting
• Cost efficient direct edge connector
• Rugged 1.2 mm PCB thickness
Cooling interface
• Top edge defined for heat transfer
• Heat transfer from CPU, Chipset and
DRAM enhanced via copper layers
• Heatspreader defined for high power
versions (max. 12 W)
Changes for Rev. 2.0 (Sep. 2012)
Signals Added to Qseven Pinout
• 2x USB 3.0
• 4 Wire SDIO Bus on LPC
• I2S interface shared with HDA
• UART Interface
• eDP (embedded Display Port) shared with LVDS
• I2C clock on SM-Bus
• One-Wire-Bus
MXM Connector
MXM2 edge connector
• Multiple Sources Speedtech, Lotes,
Aces and Yamaichi (automotive
certified)
• 230 positions, .020” pitch, SMT
• 5.5 and 7.8 mm height versions
• Certified for rugged mobile applications
and for high speed serial buses
(PEG bus)
• Low cost connector
• 30µ gold plated versions for industrial
applications
• Automotive certified (Yamaichi)
Updates
• MXM Connectors from Yamaichi (Automotive
specified), Foxconn, Aces
• Shared DisplayPort
• HDMI hotplug detection
Qseven®
QuadMo747-Z5xx
Highlights
Computer on Module with Intel®
Atom™ Z5xx series – US15W Chipset
• Small and Powerful enough to enable Internet experience
• Power-efficient ideal for mobile devices
• Passive cooling for fan less applications
• Extensive connectivity for a turn-key legacy free solution
Technical features
μSSD SLOT on board
10
X86
CPUIntel® Atom™ Z5xx series 1.1 GHz and 1,6 GHz
ChipsetIntel® System Controller Hub US15W
DRAM
Up to 1GB DDR2 400/533MHz
CACHE512KB L2
Graphic Interface
integrated Intel® GMA500 Graphic accelerator
LVDS
Single Channel 18/24 Bit LVDS Transmitter
Resolution up to 1366 x 768
SDVO Interface
PCI-e ports
Up to 2 x PCI Express x 1 ports
USB
8x USB 2.0 ports
ETHERNET
Gigabit Ethernet port (optional)
SD I/O
1 x 8-bit interface + 1 x μSD slot onboard
Mass Storage
Onboard Flash Disk up to 8GB
1 x S-ATA channel
AudioHD Audio Interface
Interface Buses
I2C Bus
LPC BUS for legacy peripherals
SM Bus
Power management signals
Thermal cooling interface
Power supply
+5VDC ± 5%
TDP
Typical 5W with Intel® Atom™ Z510
Dimensions
70x70 mm (2.76” x 2.76”)
Qseven®
QuadMo747-EXTREME
Computer on Module with Intel® Atom™ Z5xxPT series – US15WPT
Chipset, specifically designed for industrial temperature range
Highlights
• Full BOM certified for the Extended Temperature Range (-40°C; +85°C)
• Low power consumption module ideal for industrial, automotive, defense and security
applications
Technical features
Industrial Temperature Range, -40°C ÷ +85°C
Bill of Material specifically selected for Industrial Temperature Range
CPUIntel® Atom™ Z510PT@ 1,1GHz
Intel® Atom™ Z520PT@ 1,33 GHz
ChipsetIntel® SCH US15WPT
DRAM
up to 1GB DDR2 400/533MHz
CACHE512KB L2
Graphic Interface
LVDS
SDVO interface
PCI-e ports
1 x PCI Express x1 ports
USB
8x USB 2.0 ports
ETHERNET
SD I/O
1 x 4-bit interface
Mass Storage
1 x S-ATA channel
Interface Buses
I2C Bus
SM Bus
Power supply +5VDC ± 5%
Dimensions
70x70 mm (2.76” x 2.76”)
X86
11
Qseven®
QuadMo747-E6xx
Computer on Module with Intel®
Atom™ E6xx series CPU+ EG20T Chipset
Highlights
• Intel® Atom™ Processor E6xx series & Intel® EG20 Platform Controller Hub chipset
• Available with full BOM certified for the extended temperature range of -25°C to +85°C
• Integrated Intel® 3D Graphic with 50% performance enhancement
• With CAN Bus
Technical features
CPU Intel® Atom™ E620/E620T @ 600MHz, 3.3W TDP
Intel® Atom™ E640/E640T @ 1.0GHz 3.6W TDP
Platform Controller HubIntel® PCH EG20T
Memory
up to 2GB DDR2 onboard
Graphic Interface
integrated Intel® 2D and 3D graphic controller
Dual independent display support
MPEG2, MPEG4, H.264, DivX HW video decoding
Display
LVDS Single Channel 18/24 Bit interface
SDVO Interface
Maximum resolution 1280x768 on LVDS
Maximum resolution 1920x1080 on SDVO
PCI Express
2x PCI-E x1 lanes
USB
6 x USB 2.0 ports + 1 x USB client
Mass Storage
Optional onboard SATA Flash Disk up to 32GB
Up to 2 x S-ATA Channels
2 x Express Card interface
ETHERNET
Gigabit Ethernet Interface
SD / MMC / SDIO interface
CAN BUS Interface
Expansion Bus I2C, SM Bus, LPC, SPI
FAN Management Interface
Power supply +5VDC AT/ATX mode
Dimensions
70x70 mm (2.76” x 2.76”)
12
X86
Qseven®
QuadMo747-GSeries
Computer on Module with the new AMD Embedded
G-Series Platform
Highlights
• The AMD APU Architecture that combines a low power CPU and a
discrete-level GPU into a single embedded Accelerated Processing Unit (APU)
• Single and Dual x86 cores up to 9W TDP
• HW decode support for H.264, VC-1, MPEG2, WMV, DivX, Adobe Flash
• Ideal for low power designes in embedded applications such as Digital Signage,
xSTB, IP-TV,Thin Clients, Info Kiosks, POS, Gaming
Technical features
APU
AMD T56N, Dual Core @ 1.65 GHz, TDP 18W
AMD T44R, Single Core @ 1.2 GHz, TDP 9W
AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W
AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W
AMD T16R, Single Core @615MHz, TDP 4.5W
Controller Hub
AMD A55E Controller Hub
Memory
Up to 4GB DDR3 / LVDDR3-1066 soldered onboard
Graphics
integrated AMD GPU Radeon™:
HD6320 - AMD T56N
HD6290 - AMD T40N
HD6250 - AMD T44R, T40E, T40R and T16R
Dual display support
DirectX® 11, OpenGL 4.0, OpenCL™ 1.1 supported
Display
Single/Dual Channel 18/24 Bit LVDS Interface
HDMI interface
Additional VGA Interface
Max Resolutions:
LVDS Interface, up to 1920x1200
HDMI, up to 1920x1200
VGA, up to 1920x1200 (up to 2048x1536 with T56N)
Mass Storage
2 x external S-ATA channels
SATA Flash Disk soldered onboard, up to 32GB
SD Memory Card interface
USB
8x USB 2.0 ports
PCI-e ports
4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4)
2 x Express Card Interface
ETHERNET
Gigabit Ethernet port
Interface Bus I2C Bus
SM Bus
Thermal / FAN management
Power supply +5VDC ± 5% and +5VSB (optional)
Dimensions
70x70 mm (2.76” x 2.76”)
X86
13
Qseven®
QuadMo747-x2000
Qseven® Rel. 2.0 Compliant Module with Intel® Atom™
Cedar View family Processors and Intel® NM10
Express Chipset
Highlights
• Qseven® Rel. 2.0 compliant
• Based on the new Intel® Atom™ Cedar View dual core N2000 and D2000 CPU families at a 64-bit
instruction set and Hyper Threading for an impressive performance/power consumption ratio
• Up to 4GB DDR3/LPDDR3 RAM
• Multi video interfaces: HDMI/DisplayPort; LVDS; embedded DP; VGA (opt. external adapter)
Technical features
CPU Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP
Intel® Atom™ N2800 @1.86GHz, 1MB Cache, 6.5W TDP
Chipset Intel® NM10 Express Chipset
Memory up to 4GB DDR3 / LPDDR3 1066MHz Soldered onboard
(up to 2GB with N2600)
Graphics Integrated Intel® HD Graphics controller
Video interfaces HDMI or Display Port interface
18/24 bit single channel LVDS interface (18bit with N2xxx CPUs)
Embedded Display Port (eDP) interface
Additional VGA interface (optional external adapter is required)
Resolutions
N2xxx CPUs
D2550CPU
HDMI & CRT
Up to 19200x1200
Up to 1920x1200
LVDS interface
Up to 1366x768
Up to 1440x900
Display Port
Up to 1600x1200
Up to 2560x1600
eDP
Up to 1366x768
Up to 1920x1080
Mass Storage Up to 2 x external S-ATA channels
Optional SATA Flash Disk soldered on board, up to 128GB
Optional SD / SDI/O Interface
USB Up to 8 x USB 2.0 ports
Ethernet Gigabit Ethernet interface
Audio HD Audio Interface
PCI-express 3 x PCI-e x1 ports
LPC BUS
SM Bus
Optional UART Interface
Optional SPI interface
FAN connector
Dimensions 70 x 70 mm (2,76” x 2,76”)
14
X86
Qseven®
QuadMo747-X/OMAP3
Computer on Module based on the Texas Instruments®
OMAP™ 37xx Family
Highlights
• Very low power consumption
• 3D graphics acceleration to support display and gaming effects
• Ideal for multimedia devices
• Available in Extended Temperature Version
Technical features
OMAP 3
Processors
TM
Applications Processor
Texas Instruments® OMAP™ 37xx Family
AM3703 (Cortex™ A8, up to 1 GHz core)
DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
SGX™ Graphics Accelerator + Up to 800MHz
TMS320C64x+™ DSP Core)
Memory
Mobile DDR 128 / 256MB / 512 MB onboard
Flash Disk 256 MB / 512MB / 1GB NAND Flash
eMMC soldered onboard up to 16GB
LVDS
Single/Dual Channel 18/24 Bit
resolution up to 1366 x 768
ETHERNET
10/100 Base-T interface
USB
1x USB OTG
2x USB 2.0 Host
SERIAL PORTS
2 x COM ports
CAN interface
MMC/HC MMC/SD/SDHC/SDIO interface
Audio
AC’97 Audio Interface
Video Input Port / Camera Connector
LPC Bus
SM Bus
SPI interface
I2C bus
JTAG
Temperature 0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)
Dimensions 70x70 mm (2.76” x 2.76”)
Compliant to Qseven® Specifications Rel.1.20
ARM
15
Qseven®
QuadMo747-X/i.MX51
Highlights
Computer on Module based on the Freescale i.MX51
Family
™
• Design approved for Motor Sport Applications
• Hardware acceleration enables very low power consumption for video and graphics
• High level of integration reduces overall system BOM
• Very high-performance processing and multimedia capabilities
• Available in Extreme Version
Technical features
Applications Processor
Freescale™ i.MX51 Family:
Freescale™ i.MX513 @ 800MHz
Freescale™ i.MX515 @ 800MHz, with OpenGL ES 2.0 3D graphics accelerator and OpenVG 1.1 2D graphics accelerator integrated
Memory
DDR2 256 MB / 512MB onboard
Mass Storage
Up to 4GB NAND Flash
eMMC soldered onboard
MMC / SD / SDHC / SDIO interface
μSD Card Slot onboard
VIDEO
LVDS Single/Dual Channel 18/24 Bit interface
DVI Single Link interface (optional)
ETHERNET 10/100 Base-T interface
USB 1x USB OTG
4x USB 2.0 Host
SERIAL PORTS 2 x COM ports
CAN interface (optional)
Audio AC’97 / I2S Audio Interface
4-Wire Touch Screen Interface
LPC Bus
SM Bus
SPI / One Wire interface
I2C bus
Integrated Security Features (i.MX515 only)
i.MX51
16
ARM
Qseven®
Highlights
QuadMo747-X/i.MX6
Computer on Module with Freescale™ i.MX6 Processor
• The first scalable multi-core ARM® Cortex™-A9 architecture in Qseven® standard
modular solution
• Combines and emphasizes high-graphics performance with power-efficient
processing capabilities
• OpenGL (FULL) and OpenES 2.0 3D Graphics and up to 4 independent displays (only
up to 2 displays with i.MX6DL and i.MX6S)
• Flexible solution enables multi-display platforms to mobile fanless applications
• Available full BOM in Industrial Temperature range (-40°C; +85°C)
Technical features
i.MX6Dual/ 6Quad
Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors:
Single core (i.MX6S) up to 1GHz
Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz
Quad Core (i.MX6Q) up to 1.2GHz clock
Memory up to 4GB DDR3 onboard (up to 2GB with i.MX6S)
Graphics integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™
(OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 4 independent displays (only up to 2 displays with
i.MX6DL and i.MX6S)
HDMI interface
1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface
Resolution LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q)
MMC/SD/SDIO interface
1 x µSD card slot onboard
PCI-Express 1 x PCI-Express x1 lane
USB 1x USB OTG
4x USB 2.0 Host
Audio AC97 Audio Interface
Serial ports 2 x serial ports
CAN Bus interface
Interfaces LPC BUS for legacy peripherals
SM Bus
SPI
I2C bus
Also available in industrial temperature range, -40°C ÷ +85°C
ARM
17
Qseven®
QuadMo747-X/T20
Highlights
®
®
Computer on Module with NVIDIA Tegra T20 Processor
• Dual Core System on Chip for Mobile Devices
• Ideal for Web Browsing and Video HD applications
• Support for Flash Technology
• High performance 3D acceleration with high framerates
Technical features
Qseven® Standard Features
ProcessorNVIDIA® Tegra® T290 w/ Dual ARM® CORTEX -A9 MPCore™ CPU, 1.0GHz per core
Memory
Graphic Interface
embedded NVIDIA® ULP GeForce® GPU
Integrated High Definition Audio-Video Processor
Display LVDS Single/Dual Channel 18/24 Bit interface
HDMI Interface
Video Resolution Up to 1080p on HDMI
Up to 1680 x 1050 on LVDS
PCI Express 2x PCI-E x1 lanes (Relaxed Ordering Mode only)
USB
6 x USB 2.0 ports
Mass Storage
On board IDE Flash Disk up to 2GB
eMMC, up to 16GB, soldered onboard
2 x S-ATA Channels
ETHERNET
10/100 Mbps Ethernet Interface
Audio
AC ‘97 Audio Interface
MMC / SDIO interface
4 bit SD/MMC interface
CAN Bus Interface
Thermal Cooling Interface
Dimensions
70x70 mm (2.76” x 2.76”)
QuadMo747-X/T20 Specific Features
One-Wire Interface
JTAG interface
Serial ports
2x RS-232 ports
18
ARM
Qseven®
QuadMo747-X/T30
Computer on Module with NVIDIA® Tegra® T30
Processor
Highlights
• A Quad-Core ARM® Cortex™-A9 Low Power CPU for powerful graphics and Extreme
Multitasking
• Graphics engine powered by the 12 cores-ULP GeForce GPU with Dedicated
Processors for 1080p Video Playback
• Capable of reproducing High Resolution 3D Videos
Technical features
NVIDIA® Tegra® T30 w/ Quad ARM® CORTEX -A9
MPCore™ CPU, 1.3 GHz per core
Memory up to 2GB DDR3L onboard
Graphic Interface embedded NVIDIA® ULP GeForce® GPU
HDMI 1.4a Interface
PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with
support for 2 x PCI-e x 1 devices)
USB
6 x USB 2.0 ports
Mass Storage eMMC, up to 32GB, soldered onboard
1 x S-ATA Channels
microSD Slot onboard
ETHERNET Gigabit Ethernet Interface
Serial ports 2 serial ports (Tx, Rx signals)
CAN Bus Interface
Processor Video Input Port / Camera Connector
One Wire Interface
+5VDC AT/ATX mode
Power supply Dimensions 70x70 mm (2.76” x 2.76”)
ARM
19
µQseven
μQ7-OMAP5
μQseven Rel. 2.0 Compliant Module with
Texas Instruments OMAP™ 5 Processor
Highlights
• ARM® Cortex™-A15-based module in Qseven® standard
• Energy-efficient architecture in only 7x4 cm (2.76”x1.57”)
• Able to drive multiple displays in HD resolution
• Dedicated graphics cores and integrated DSP @ 466 MHz
Technical features
Applications Processor Texas Instruments® OMAP™5430 processor:
2x ARM Cortex-A15 MPCore, up to 1.7GHz per
core for symmetric multiprocessing + 2x ARM
Cortex–M4 cores for low-power offload and
real-time responsiveness
Memory up to 2GB LPDDR2 PoP
Integrated Graphics Image signal processor (ISP)
IVA HD video accelerator
miniC64x DSP core @ 466MHz
PowerVR™ SGX544-MP2 3D graphics
Supports up to three independent displays
Video interfaces HDMI interface, resolution up to 1080p60
18/24 bit single/dual channel LVDS interface
Mass Storage eMMC soldered onboard
2 x SD/MMC interfaces
SATA interface
USB 1x USB OTG LS/FS/HS/SS (USB 3.0)
2x USB 2.0 host
Networking 10/100Mbps Ethernet interface
WiFi 802.11 b/g/n
Bluetooth 2.1
Audio I2S / AC’97 Audio Interface
1 x CAN Bus port
Camera interface Dedicated connector for serial/parallel camera
Other interfaces SPI
2 x I2C bus
3 x PWM Channels
1 x Capture input
GPIO
Qseven® Power management Compliant
40x70 mm (μQseven, 1.57” x 2.76”)
Dimensions OMAP 5
Processors
TM
20
ARM
µQseven
μQ7-T30
μQseven Rel. 2.0 Compliant Module with NVIDIA® Tegra®
T30 Processor
Highlights
• µQseven module based on the Tegra® 3 SoC, for an energy-efficient and cost effective
solution in only 7x4 cm (2.76”x1.57”)
• Quad-Core ARM® Cortex™-A9 Low Power CPU for powerful graphics and extreme
multitasking in mobile applications
• Graphics engine powered by the 12 cores-ULP GeForce GPU with Dedicated Processors
for 1080p Video Playback
• Capable of reproducing high res. 3D Video
• Designed for digital signage applications
Technical features
Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™-A9 MPCore™ CPU, 1.3 GHz per core
Integrated Graphics embedded NVIDIA® ULP GeForce® GPU
Video interfaces LVDS Single/Dual Channel 18/24 Bit interface
HDMI interface
DSI interface
Resolution up to 1080p on HDMI
up to 1600x1200 on LVDS
2 x SD/SDIO/MMC 4-bit interface
SATA interface
USB 3 x USB 2.0 host
PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices)
Networking Gigabit Ethernet Interface
I2C bus
2 x PWM Channels
SM Bus
Qseven® Power management Compliant
40x70 mm (μQseven, 1.57” x 2.76” )
Dimensions ARM
21
µQseven
Highlights
μQ7-i.MX6
μQseven Rel. 2.0 Compliant Module with Freescale™
i.MX6 Processor
• µQseven module based on the ARM® Cortex™-A9 i.MX6 SoC, a fully
scalable solution from a high performance Quad Core CPU to an
energy-efficient and cost-effective Solo Core solution
• OpenGL/ES 2.0 3D Graphics and up to 4 independent displays
• A flexible solution, suitable for high end, multi display solutions as well as
energy-saving smart portable devices
• Available full BOM in Industrial Temperature range (-40°C; +85°C)
Technical features
Graphics Integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S)
HDMI interface
Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
2 x MMC/SD/SDIO interface
PCI-Express
1 x PCI-Express x1 lane
USB 1x USB OTG
4x USB 2.0 Host
Audio
I2S / AC’97 Audio Interface
CAN Bus interface
Interfaces SM Bus
SPI
I2C bus
Dimensions 40x70 mm (μQseven, 1.57” x 2.76”)
i.MX6Dual/ 6Quad
22
ARM
DEVELOPMENT
KIT
Cross Platform Development Kit
Development kit for Qseven philosophy, compatible with both
x86 and ARM Qseven® modules. Compliant to Qseven®
specifications rel. 1.20
• Schematics
• BOM
• Design Review
DEVELOPMENT KIT CONTENTS
The Development kit contains the following material:
• Cross Platform Carrier Board
• LVDS Display (7” - 800x480 and/or 10” – 1024x768, at choice)
• 4-wire T/S, already assembled on LCD display
• LVDS to TTL 24-bit display converter
• TTL to RS-232 Transceiver board
• 19VDC Notebook Power Adapter, with Power Cords for
connection to EU CEE 7/16, US NEMA 1-15, UK BS
1363A, JP JIS8303
• FFC cable for interconnection of Cross Platform Carrier
Board to ARM Qseven® module camera connector
• USB 2.0 Plug “A” – Plug “mini B” for USB client connection
• Connection cables for adapter boards included in the kit
• Connection cable for LVDS display
• 4-Wire Touch Screen cable adapter
Since the Cross Platform can be used with any SECO Qseven
CPU Module, the Development Kit DOESN’T CONTAIN any
Qseven® module. The module has to be purchased separately.
Qseven®
Highlights
• Qseven® development board with a wide range of interfaces
• Available with complete BOM and schematics
Technical features of SECOCQ7-Xboard
The Chameleon
Philosophy
Supported Modules
All Qseven® CPU Modules
Expansion Slots
1 x PCI Express x 1 Slot
miniPCI express Slot
Mass Storage
2 x S-ATA connectors
Hard Disk Power Connector
2 x SD/MMC slots
SDI/O Internal Header
I/O
6 x USB 2.0 standard “A” connector
USB Client connector
4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface)
1 x CAN Interface
4 x GPI/O
3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard)
Internal FPGA, with possibility of defining up to 64 User I/O’s
JTAG connection
LPC Bus interface
SPI interface
I2C applications included: EEPROM, Light Sensor, I/O Extender,
SIM Card slot
A/D Converter
Audio
Triple Audio Jack
2 x S/P-DIF connectors (In & Out)
AC’97 and HD Audio Codecs integrated, jumper selectable
Direct Digital Audio Interface
Video
VGA DB-15HD + DVI-D Single Link connector
LVDS LCD and Backlight connector, with voltage selection
Video Camera Interface, NTSC/PAL/SECAM video decoder integrated
Power+5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application
Smart Battery Management
Li-ION Single Cell Battery Management
FAN
3 pin Header, +5/+12V configurable with Tachometric signal
Temperature
Operating: 0° … +60°C
Storage: -20° … +80°C
Dimensions
270 x 170 mm (10,63” x 6,69”)
23
Qseven
®
DEVELOPMENT
KIT
Cross Platform Starter Kit
Carrier Board for Qseven® QuadMo747 modules on picoITX
Form Factor
The Chameleon
Philosophy
Technical features of SECOCQ7-pITX-Xboard
• Schematics
• BOM
• Design Review
CROSS PLATFORM STARTER KIT CONTAINS:
• 1x SECOCQ7-pITX-Xboard
• 1x Notebook Power Adapter, with power cord and adapters for use in Europe,
UK, USA and Japan
• 1x TTL to RS-232 serial converter
• Connection cables
• Quick start guide
The Development Kit DOES NOT CONTAIN any Qseven® module. The module has to be purchased separately.
24
Supported Modules
All Qseven® Rel.1.20 Embedded Computer Modules
Expansion Slots
1 x miniPCI Express slot
SIM Card slot for miniPCI Express modems
Mass Storage
1 x S-ATA connector
μSD Card Slot
I/OUp to 7x USB ports (1 x USB client)
1 x Gigabit/FastEthernet connector
1 x optional additional FastEthernet port
8 x GPIO on 10-Pin Header Connector
1 x RS-232 (RS-422 / RS-485 configurable)
1 x TTL-level serial port
CAN Interface
4-Wire Touch Screen controller integrated
SM Bus Pin Header
I2C Bus, SPI interface
Audio AC’97 and HD Audio Codec, jumper selectable
Line In, Mic In on internal pin headers
Earphone pin header
Video LVDS Interface, 34 pin 2mm pin header
Backlight Connector, 6 pin, 2mm Pin Header
HDMI Connector
CMOS Battery
On Board rechargeable Lithium Battery for
CMOS Backup and RTC
Power12V Power jack
Internal Pin Header for Power, Lid, Sleep and Reset Button
Power On Status LED
Temperature Operating: 0° ÷ +60°C
Available in extreme version, -40°C ÷ +85°C
Dimensions100 x 72 mm (3,94” x 2,83”)
Qseven® specifications rel.1.20 compliant
CARRIER
BOARD
SECOCQ7-pITX
Carrier Board for Qseven® QuadMo747 modules on picoITX
Form Factor
Qseven®
Highlights
• Pico ITX standard form factor Qseven® carrier board
• Optimized for x86 modules SDVO to VGA output
Technical features
Expansion Slots
1 x miniPCI Express (alternative to 1GbE)
Mass Storage interface
1 x SD Card Slot
I/O
2 x Double USB on the Front Panel
1 x USB Client on the Front Panel
1 x USB internal
2 x GbE on Front Panel (1 alternative to miniPCI Express Slot)
2 x Serial Ports (1 x RS232 full modem, RS-485 configurable, 1x TX/RX signals at TTL level)
9 x GPIO on 10 Pin Header Connector
Audio
Line In – Mic In on 8 Pin Connector
Hearphone on 5pin Header
Speaker on 5pin Header
Video
Analog VGA on 12 Pin Header
LVDS Interface, 34 pin 2mm pin header
CMOS Battery
On Board Lithium Battery for CMOS Backup and RTC
Smart Battery Connector
Power
12V Power jack
5 Pin Header for Power and Reset Button
Optional 12V Micro- Fit jack
Temperature
Operating: 0° ÷ +60°C
Storage: -20° ÷ +80°C
Dimensions
100 x 72 mm (3,94” x 2,83”)
25
Qseven
®
CARRIER
BOARD
SECOCQ7-pITX-Xboard
Highlights
Carrier Board for Qseven® QuadMo747 modules on
picoITX Form Factor
• Pico ITX standard form factor Qseven® carrier board
• Cross Platform (ARM and x86) compatibility
• Also available in industrial temperature range
Technical features
The Chameleon
Philosophy
B901
SECOCQ7-pITX-Xboard
is available also as boxed solution
26
Expansion Slots 1 x miniPCI Express slot
Mass Storage 1 x S-ATA connector
μSD Card Slot
I/O Up to 7x USB ports (1 x USB client)
CAN Interface
SM Bus Pin Header
Earphone pin header
HDMI Connector
CMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTC
Power 12V Power jack
Power On Status LED
Dimensions 100 x 72 mm (3,94” x 2,83”)
Qseven® specifications rel. 1.20 compliant
CARRIER
BOARD
SECOCQ7-mITX2.0
mini-ITX form factor Carrier Board for Qseven® modules
Rel. 2.0 compliant
Qseven®
Highlights
• Mini ITX standard form factor Qseven® Rev.2.0 carrier board
• PCI Express x4 connector
• USB 3.0
Technical features
Compliant to Qseven® Specifications rel. 2.0
1 x mSATA slot
1 x SD/MMC/SDIO Card Slot
Video 1 x Dual Channel 24 bit LVDS / Dual embedded Display
port (eDP) connector
Backlight Connector
8-pin socket for external DID EEPROM
1 x HDMI connector
Audio HD Audio Codec
Standard triple audio Stereo Jack
S/P-DIF Out 3 Pin Header for Digital Audio
Internal Pin Header for I2S Audio interface
Internal Pin Header for 2nd Line In + 2nd Mic In
USB 2 x USB 2.0 ports + 1 x USB 3.0 port on the front side
Factory options:
1 additional USB 3.0 port on front side
or
1 x USB Client on front side + 2 x USB 2.0 internal ports
PCI Express PCI Express x4 interface on PCI-e x16 slot
Ethernet 1 x Gigabit Ethernet RJ-45 connector
Serial ports 1 x RS-232 DB-9 male connector
1 x CAN Bus DB-9 connector
I/O SPI and LPC internal connectors
1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Thermal Management, Watch Dog)
I2C EEPROM Socket
Camera Interface connectors
CMOS Battery On Board Lithium Battery for CMOS Backup and RTC
Power ATX Standard power Connector (AT mode config.)
FAN 3 pin Header, with fan speed control, +12V or +5V
Temperature Operating: 0° … +60°C
Storage: -20° … +80°C
Dimensions 170 x 170 mm (6,7” x 6,7”)
27
Qseven
®
SECOCQ7-micro
CARRIER
BOARD
Micro carrier Board Rel. 2.0 compliant for µQseven modules
Highlights
• Qseven® Rel.2.0 compliant carrier board optimized for µQseven modules
• Extremely small and cost effective micro
• Optional Wi-Fi module
Technical features
Supported Modules μQseven Embedded Computer Modules
SATA Power 2-pin connector
μSD Card Slot
I/O: Up to 4x USB ports (1 x USB client)
Optional WiFI module
1 x RS-232 Serial port
I2C Bus
Audio Audio interface pin header
HDMI Connector
CMOS Battery Internal connector for cabled rechargeable Lithium Battery for CMOS Backup and RTC
Internal Pin Header for Power, Sleep and Reset Button
Power On Status LED
Dimensions 90 x 50 mm (3,54” x 1,97”)
28
CARRIER
BOARD
SECOCQ7-MXM
The Qseven® Carrier Board SECOCQ7-MXM is the only Carrier Board
available in the market able to expand the capabilities offered by
Qseven® CPU modules with advanced graphical performances given by
MXM Graphic cards.
Qseven®
Highlights
• Cross Platform (ARM and x86) compatibility
• MXM 3.0 connector for mobile GPUs
• Multi display outputs (3x HDMI; 1x LVDS)
Technical features
Qseven® Modules offering HDMI and PCI
Express x 4 / x1 interfaces
MXM 3.0 compliant Graphic cards, both Type “A” and Type “B”
1 x S-ATA connector
μSD Card Slot
PCI-e x4 link between MXM 3.0 and Q7 modules
Video
HDMI connection from Qseven® module
Dual HDMI connection derived from Display
Ports #A and #C of MXM Graphic Cards
LVDS connection from Qseven® module
Ethernet
1 Ethernet port directly managed by Qseven®
CPU module
1 x optional embedded PCI-e Gigabit Ethernet
controller on the Carrier Board
USB
2 x USB 2.0 standard ports
Internal Pin header for 2 additional USB 2.0 ports
1 USB On-The Go port
Audio
Embedded AC’97 or HD Audio Codec
CMOS Battery
Power
19VDC Power input
Temperature
Dimensions
200 x 140 mm (7.87” x 5.51”)
Supported Modules
Mass Storage interface 29
CARMA DevKit
SOFTWARE
DEVELOPMENT
KIT
CARMA DevKit
The CUDA® on ARM DevKit, codename CARMA, is a GPU computing development kit created to support the growing
demand for energy-efficient computing initiatives around the world. Powered by an NVIDIA® Tegra® 3 quad-core ARM-based
processor and an NVIDIA® CUDA®-enabled GPU, the CARMA DevKit supports energy-efficient HPC projects using ARM-based
GPU computing.
CARMA specs:
• Energy-efficient Tegra® 3 quad-core ARM A9 processor with
2 GB processor memory
• NVIDIA® Quadro® 1000M GPU with 96 CUDA® cores and
2GB DDR3 memory
• 270 single precision GFlops performance
• 4x PCIe Gen1 link connecting processor to GPU
• 1 Gigabit Ethernet network support
• Direct attach storage support with SATA port
• HDMI
• USB ports
PACKAGE CONTENT
• QuadMo747-X/T30- Qseven® 1.2 specs module, NVIDIA® TEGRA® 3 with 2 GB RAM
and 4GB eMMC
• NVIDIA® Quadro® 1000M
• CARMA carrier board
• Power supply
• Cable kit
30
SOFTWARE
DEVELOPMENT
KIT
Qseven®
NVIDIA® Kayla GPU DevKit
SECO mITX GPU DevKit (P/N SECO_mITX_GPU_DEVKIT)
NVIDIA® Tegra® 3 SoC on Qseven provided in a standard PC form factor, supporting NVIDIA Graphics Drivers and CUDA 5.0 Toolkit
PRODUCT SPECS:
• Energy-efficient Tegra® 3 quadcore A9 processor with 2 GB
processor memory
• x16 PCIe mechanical connector (x4 electrical)
• 1 Gbps Ethernet network support
• Direct attach storage support with SATA port
• HDMI
• USB Ports
• Camera Interface Connectors
• ATX Standard Power connector (AT mode)
PACKAGE CONTENT
• QuadMo747-X/T30 - Qseven v1.2 module, NVIDIA® Tegra® 3 with 2 GB RAM and 4 GB eMMC
• SECO mITX Carrier Board
• Cable Kit
31
32
Qseven®
Technical features
QuadMo747-Z5xx
QuadMo747-EXTREME
CPUIntel® Atom™ Z5xx series 1.1 GHz and 1,6 GHz
ChipsetIntel® System Controller Hub US15W
DRAM
Up to 1GB DDR2 400/533MHz
CACHE512KB L2
Graphic Interface
LVDS
SDVO Interface
PCI-e ports
Up to 2 x PCI Express x 1 ports
USB
8x USB 2.0 ports
ETHERNET
SD I/O
1 x 8-bit interface + 1 x μSD slot onboard
Mass Storage
1 x S-ATA channel
Interface Buses
I2C Bus
SM Bus
TDP
Typical 5W with Intel® Atom™ Z510
Dimensions
70x70 mm (2.76” x 2.76”)
Industrial Temperature Range, -40°C ÷ +85°C
Bill of Material specifically selected for Industrial Temperature Range
CPUIntel® Atom™ Z510PT@ 1,1GHz
Intel® Atom™ Z520PT@ 1,33 GHz
ChipsetIntel® SCH US15WPT
DRAM
up to 1GB DDR2 400/533MHz
CACHE512KB L2
Graphic Interface
LVDS
SDVO interface
PCI-e ports
1 x PCI Express x1 ports
USB
8x USB 2.0 ports
ETHERNET
SD I/O
1 x 4-bit interface
Mass Storage
1 x S-ATA channel
Interface Buses I2C Bus
SM Bus
Dimensions
70x70 mm (2.76” x 2.76”)
QuadMo747-E6xx
CPU Intel® Atom™ E620/E620T @ 600MHz, 3.3W TDP
Platform Controller Hub
Intel® PCH EG20T
Memory
Graphic Interface
integrated Intel® 2D and 3D graphic controller
MPEG2, MPEG4, H.264, DivX HW video decoding
Display
LVDS Single Channel 18/24 Bit interface
SDVO Interface
Maximum resolution 1280x768 on LVDS
Maximum resolution 1920x1080 on SDVO
PCI Express
2x PCI-E x1 lanes
USB
6 x USB 2.0 ports + 1 x USB client
Mass Storage
Optional onboard SATA Flash Disk up to 32GB
Up to 2 x S-ATA Channels
2 x Express Card interface
ETHERNET
SD / MMC / SDIO interface
CAN BUS Interface
FAN Management Interface
Power supply+5VDC AT/ATX mode
Dimensions
70x70 mm (2.76” x 2.76”)
X86
33
Qseven®
Technical features
QuadMo747-GSeries
APU
AMD T44R, Single Core @ 1.2 GHz, TDP 9W
AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W
AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W
Controller Hub
AMD A55E Controller Hub
Memory
Up to 2GB DDR3 / LVDDR3-1066 soldered onboard
Graphics
HD6320 - AMD T56N
HD6290 - AMD T40N
Dual display support
®
DirectX 11, OpenGL 4.0, OpenCL™ 1.1 supported
Display
Single/Dual Channel 18/24 Bit LVDS Interface
HDMI interface
Additional VGA Interface
Max Resolutions:
LVDS Interface, up to 1920x1200
HDMI, up to 1920x1200
VGA, up to 1920x1200 (up to 2048x1536 with T56N)
Mass Storage
2 x external S-ATA channels
SATA Flash Disk soldered onboard, up to 32GB
SD Memory Card interface
USB
8x USB 2.0 ports
PCI-e ports
4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4)
2 x Express Card Interface
ETHERNET
Interface BusI2C Bus
SM Bus
Power supply+5VDC ± 5% and +5VSB (optional)
Dimensions
70x70 mm (2.76” x 2.76”)
34
X86
QuadMo747-x2000
CPU Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP
Memory up to 4GB DDR3 / LPDDR3 1066MHz Soldered onboard
Video interfaces HDMI or Display Port interface
18/24 bit single channel LVDS interface (18bit with N2xxx CPUs)
Embedded Display Port (eDP) interface
Additional VGA interface (optional external adapter is required)
Resolutions
N2xxx CPUs
D2550CPU
HDMI & CRT
Up to 19200x1200
Up to 1920x1200
LVDS interface
Up to 1366x768
Up to 1440x900
Display Port
Up to 1600x1200
Up to 2560x1600
eDP
Up to 1366x768
Up to 1920x1080
Mass Storage Up to 2 x external S-ATA channels
Optional SATA Flash Disk soldered on board, up to 128GB
Optional SD / SDI/O Interface
USB Up to 8 x USB 2.0 ports
PCI-express 3 x PCI-e x1 ports
LPC BUS
SM Bus
Optional UART Interface
Optional SPI interface
FAN connector
Dimensions 70 x 70 mm (2,76” x 2,76”)
Qseven®
Technical features
QuadMo747-X/OMAP3
QuadMo747-X/i.MX51
QuadMo747-X/i.MX6
OMAP 3
Processors
TM
i.MX51
Applications Processor Texas Instruments® OMAP™ 37xx Family
AM3703 (Cortex™ A8 up to 1 GHz core)
DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
SGX™ Graphics Accelerator + Up to 800MHz
TMS320C64x+™ DSP Core)
Memory
Mobile DDR 128 / 256MB / 512 MB onboard
Flash Disk
256 MB / 512MB / 1GB NAND Flash
eMMC soldered onboard up to 16GB
LVDS
Single/Dual Channel 18/24 Bit
USB
1x USB OTG
2x USB 2.0 Host
SERIAL PORTS
2 x COM ports
CAN interface
MMC/HC MMC/SD/SDHC/SDIO interface
Audio
AC’97 Audio Interface
LPC Bus
SM Bus
SPI interface
I2C bus
JTAG
Dimensions
70x70 mm (2.76” x 2.76”)
i.MX6Dual/ 6Quad
Applications Processor Freescale™ i.MX51 Family:
Freescale™ i.MX513 @ 800MHz
Freescale™ i.MX515 @ 800MHz, with Quad Core (i.MX6Q) up to 1.2GHz clock
OpenGL ES 2.0 3D graphics accelerator Memory up to 4GB DDR3 onboard (up to 2GB with i.MX6S)
and OpenVG 1.1 2D graphics accelerator integrated
Graphics integrated graphics, each processor provides up to 3 separated Memory
DDR2 256 MB / 512MB onboard
accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™
Mass Storage
Up to 4GB NAND Flash
(OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 4 independent displays (only up to 2 displays with
MMC / SD / SDHC / SDIO interface
i.MX6DL and i.MX6S)
μSD Card Slot onboard
HDMI interface
VIDEO
LVDS Single/Dual Channel 18/24 Bit interface
DVI Single Link interface (optional)
Resolution LVDS, up to 1920x1200
HDMI, up to 1080p
USB 1x USB OTG
4x USB 2.0 Host
MMC/SD/SDIO interface
SERIAL PORTS 2 x COM ports
1 x µSD card slot onboard
CAN interface (optional)
PCI-Express 1 x PCI-Express x1 lane
Audio AC’97 / I2S Audio Interface
USB 1x USB OTG
4x USB 2.0 Host
4-Wire Touch Screen Interface
LPC Bus
Audio AC97 Audio Interface
SM Bus
SPI / One Wire interface
I2C bus
CAN Bus interface
Integrated Security Features (i.MX515 only)
Interfaces LPC BUS for legacy peripherals
SM Bus
SPI
I2C bus
®
Compliant to Qseven Specifications Rel.1.20
Also available in industrial temperature range, -40°C ÷ +85°C
ARM
35
Qseven®
Technical features
QuadMo747-X/T20
QuadMo747-X/T30
®
®
®
ProcessorNVIDIA Tegra T290 w/ Dual ARM CORTEX -A9 MPCore CPU, 1.0GHz per core
Memory
Graphic Interface
embedded NVIDIA® ULP GeForce® GPU
HDMI Interface
PCI Express 2x PCI-E x1 lanes (Relaxed Ordering Mode only)
USB
6 x USB 2.0 ports
Mass Storage
On board IDE Flash Disk up to 2GB
eMMC, up to 16GB, soldered onboard
2 x S-ATA Channels
ETHERNET
10/100 Mbps Ethernet Interface
Audio
AC ‘97 Audio Interface
MMC / SDIO interface
Expansion Bus
I2C, SM Bus, LPC, SPI
CAN Bus Interface
Dimensions
70x70 mm (2.76” x 2.76”)
QuadMo747-X/T20 Specific Features
One-Wire Interface
JTAG interface
Serial ports
2x RS-232 ports
36
ARM
NVIDIA® Tegra® T30 w/ Quad ARM® CORTEX -A9
MPCore™ CPU, 1.3 GHz per core
Graphic Interface embedded NVIDIA® ULP GeForce® GPU
HDMI 1.4a Interface
USB
6 x USB 2.0 ports
1 x S-ATA Channels
microSD Slot onboard
ETHERNET
Serial ports 2 serial ports (Tx, Rx signals)
CAN Bus Interface
Processor Qseven® Standard Features
™
One Wire Interface
+5VDC AT/ATX mode
Power supply Dimensions 70x70 mm (2.76” x 2.76”)
Qseven®
Technical features
μQ7-OMAP5
μQ7-T30
μQ7-i.MX6
OMAP 5
Processors
TM
i.MX6Dual/ 6Quad
Applications Processor Texas Instruments® OMAP™5430 processor:
2x ARM Cortex-A15 MPCore, up to 1.7GHz per
core for symmetric multiprocessing + 2x ARM
Cortex–M4 cores for low-power offload and
real-time responsiveness
Memory up to 2GB LPDDR2 PoP
Integrated Graphics Image signal processor (ISP)
IVA HD video accelerator
miniC64x DSP core @ 466MHz
PowerVR™ SGX544-MP2 3D graphics
Supports up to three independent displays
Video interfaces HDMI interface, resolution up to 1080p60
18/24 bit single/dual channel LVDS interface
2 x SD/MMC interfaces
SATA interface
USB 1x USB OTG LS/FS/HS/SS (USB 3.0)
2x USB 2.0 host
Networking 10/100Mbps Ethernet interface
WiFi 802.11 b/g/n
Bluetooth 2.1
Audio I2S / AC’97 Audio Interface
1 x CAN Bus port
Camera interface Dedicated connector for serial/parallel camera
2 x I2C bus
3 x PWM Channels
1 x Capture input
GPIO
®
Qseven Power management Compliant
40x70 mm (μQseven, 1.57” x 2.76”)
Dimensions NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™-A9 MPCore™
CPU, 1.3 GHz per core
Integrated Graphics embedded NVIDIA® ULP GeForce® GPU
Integrated High Definition Audio-VideoProcessor
Video interfaces LVDS Single/Dual Channel 18/24 Bit interface
HDMI interface
DSI interface
Resolution up to 1080p on HDMI
up to 1600x1200 on LVDS
2 x SD/SDIO/MMC 4-bit interface
SATA interface
USB 3 x USB 2.0 host
Networking Gigabit Ethernet Interface
I2C bus
2 x PWM Channels
SM Bus
Processor Qseven® Power management Compliant
Graphics Integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S)
HDMI interface
Resolution
HDMI, up to 1080p
2 x MMC/SD/SDIO interface
PCI-Express
1 x PCI-Express x1 lane
USB 1x USB OTG
4x USB 2.0 Host
Audio
I2S / AC’97 Audio Interface
CAN Bus interface
Interfaces SM Bus
SPI
I2C bus
ARM
37
Qseven®
Technical features
SECOCQ7-Xboard
CARRIER
BOARD
Supported Modules
All Qseven® CPU Modules
Expansion Slots
1 x PCI Express x 1 Slot
miniPCI express Slot
Mass Storage
Hard Disk Power Connector
2 x SD/MMC slots
SDI/O Internal Header
I/O
6 x USB 2.0 standard “A” connector
USB Client connector
4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface)
1 x CAN Interface
4 x GPI/O
3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard)
Internal FPGA, with possibility of defining up to 64 User I/O’s
JTAG connection
LPC Bus interface
SPI interface
I2C applications included: EEPROM, Light Sensor, I/O Extender,
SIM Card slot
A/D Converter
Audio
Triple Audio Jack
2 x S/P-DIF connectors (In & Out)
AC’97 and HD Audio Codecs integrated, jumper selectable
Direct Digital Audio Interface
Video
VGA DB-15HD + DVI-D Single Link connector
LVDS LCD and Backlight connector, with voltage selection
Video Camera Interface, NTSC/PAL/SECAM video decoder integrated
Power+5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application
Smart Battery Management
Li-ION Single Cell Battery Management
FAN
Temperature
Storage: -20° … +80°C
Dimensions
270 x 170 mm (10,63” x 6,69”)
38
SECOCQ7-pITX
CARRIER
BOARD
Expansion Slots
1 x miniPCI Express (alternative to 1GbE)
1 x SD Card Slot
I/O
2 x Double USB on the Front Panel
1 x USB Client on the Front Panel
1 x USB internal
2 x GbE on Front Panel (1 alternative to miniPCI Express Slot)
2 x Serial Ports (1 x RS232 full modem, RS-485 configurable, 1x TX/RX signals at TTL level)
9 x GPIO on 10 Pin Header Connector
Audio
Line In – Mic In on 8 Pin Connector
Hearphone on 5pin Header
Speaker on 5pin Header
Video
Analog VGA on 12 Pin Header
LVDS Interface, 34 pin 2mm pin header
CMOS Battery
Smart Battery Connector
Power
12V Power jack
5 Pin Header for Power and Reset Button
Optional 12V Micro- Fit jack
Temperature
Storage: -20° ÷ +80°C
Dimensions
100 x 72 mm (3,94” x 2,83”)
SECOCQ7-pITX-Xboard
CARRIER
BOARD
Expansion Slots 1 x miniPCI Express slot
μSD Card Slot
I/O Up to 7x USB ports (1 x USB client)
CAN Interface
SM Bus Pin Header
Earphone pin header
HDMI Connector
CMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTC
Power On Status LED
Dimensions 100 x 72 mm (3,94” x 2,83”)
Qseven®
Technical features
SECOCQ7-mITX2.0
CARRIER
BOARD
Compliant to Qseven® Specifications rel. 2.0
1 x mSATA slot
1 x SD/MMC/SDIO Card Slot
Video 1 x Dual Channel 24 bit LVDS / Dual embedded Display
port (eDP) connector
Backlight Connector
8-pin socket for external DID EEPROM
1 x HDMI connector
Standard triple audio Stereo Jack
S/P-DIF Out 3 Pin Header for Digital Audio
Internal Pin Header for I2S Audio interface
Internal Pin Header for 2nd Line In + 2nd Mic In
USB 2 x USB 2.0 ports + 1 x USB 3.0 port on the front side
Factory options:
1 additional USB 3.0 port on front side
or
1 x USB Client on front side + 2 x USB 2.0 internal ports
PCI Express PCI Express x4 interface on PCI-e x16 slot
Ethernet 1 x Gigabit Ethernet RJ-45 connector
Serial ports 1 x RS-232 DB-9 male connector
1 x CAN Bus DB-9 connector
I/O SPI and LPC internal connectors
1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Thermal Management, Watch Dog)
I2C EEPROM Socket
Camera Interface connectors
CMOS Battery On Board Lithium Battery for CMOS Backup and RTC
Power ATX Standard power Connector (AT mode config.)
FAN 3 pin Header, with fan speed control, +12V or +5V
Temperature Operating: 0° … +60°C
Storage: -20° … +80°C
Dimensions 170 x 170 mm (6,7” x 6,7”)
SECOCQ7-micro
CARRIER
BOARD
Supported Modules μQseven Embedded Computer Modules
SATA Power 2-pin connector
μSD Card Slot
I/O: Up to 4x USB ports (1 x USB client)
Optional WiFI module
1 x RS-232 Serial port
I2C Bus
Audio Audio interface pin header
HDMI Connector
CMOS Battery Internal connector for cabled rechargeable Lithium Battery for CMOS Backup and RTC
Internal Pin Header for Power, Sleep and Reset Button
Power On Status LED
Dimensions 90 x 50 mm (3,54” x 1,97”)
SECOCQ7-MXM
CARRIER
BOARD
Supported Modules
Qseven® Modules offering HDMI and PCI
Express x 4 / x1 interfaces
MXM 3.0 compliant Graphic cards, both Type “A”
and Type “B”
Mass Storage interface 1 x S-ATA connector
μSD Card Slot
PCI-e x4 link between MXM 3.0 and Q7 modules
Video
HDMI connection from Qseven® module
Dual HDMI connection derived from Display
Ports #A and #C of MXM Graphic Cards
LVDS connection from Qseven® module
Ethernet
1 Ethernet port directly managed by Qseven®
CPU module
1 x optional embedded PCI-e Gigabit Ethernet
controller on the Carrier Board
USB
2 x USB 2.0 standard ports
Internal Pin header for 2 additional USB 2.0 ports
1 USB On-The Go port
Audio
Embedded AC’97 or HD Audio Codec
CMOS Battery
Power
19VDC Power input
Temperature
Dimensions
200 x 140 mm (7.87” x 5.51”)
39
COM EXPRESS
™
Benefits:
FAST Development
Flexibility
Innovative and Upgradable
Easy Cabling
Industrial: automation and monitoring; data acquisition
Medical: data acquisition; test and monitoring appliances
Telecommunication
Automotive – Transport: detection systems
Multimedia
Gaming Machines
High – End Bandwidth For High – End Performances
COM (Computer on Module) Express™ is a standard form
factor introduced in 2005 by PICMG. This standard is
an answer to the market request for more performance
combined with more flexibility adopting the latest technology
improvements available from CPUs and Chipsets.
The COM Express™ module is available in 2 formats: the Basic,
with dimensions of 125 x 95 mm, which is
suited for highly power sensitive devices, and the Compact,
with dimensions of 95x95 mm, which is a good
trade-off between performance and small size.
COM Express™ is also designed to accomodate next
generations of PCI Express and Serial ATA interfaces, doubling
the data rates of actual generation.
COM EXPRESS™
SECOMExp-iCORE
COM-Express™ Module with Intel® Core™ i3 / i5 / i7 / Celeron®
Processor and Intel® HM55 Express Chipset with Dual
Channel Memory
Highlights
• COM EXPRESS TYPE II (Basic)
• Intel Core i3, i5, i7 CPUs integrated
• Intel Turbo Boost Technology
• Multiple Display Inteface Supported
Technical features
CPUIntel® Core™ i3-330E @ 2.13GHz, 3MB Cache, 35W TDP
Intel® Core™ i5-520E/[email protected], 3MB Cache, 35W TDP
Intel® Core™ i7-660UE @ 1.33GHz, 4MB Cache, 18W TDP
Intel® Core™ i7-620LE @ 2GHz, 4MB Cache, 25W TDP
Intel® Core™ i7-610E @ 2.53GHz, 4MB Cache, 35W TDP
Intel® Celeron® U3405@ 1.06GHz, 2MB Cache, 18W TDP
Intel® Celeron® P4505@ 1.86GHz, 2MB Cache, 35W TDP
ChipsetIntel® HM55 Express Chipset
Memory
up to 8GB of 1066MHz DDR3 on two SO-DIMMs
Supporting dual channel
Graphics
integrated Intel® HD graphics controller
with dual independent display support
LVDS
Single/Dual Channel 18/24 Bit LVDS Transmitter
Resolutions
Up to 2048 x 1536 on CRT interface
Up to 1920 x 1200 on LVDS interface
PEG
PCI Express Graphics x16 interface
Mass Storage
1 x P-ATA channel
4 x S-ATA channels
USB
8x USB 2.0 ports
PCI-e ports
4x PCI Express x1 ports
ETHERNET
Audio
HD Audio Interface
Interface Bus
PCI Bus
SM Bus
Power supply+12VDC and +5VSB for ATX mode
Dimensions 125x95 mm (COM Express Basic)
41
COM EXPRESS™
SECOMExp-iCore-XT
Industrial temperature range COM-Express™ Module with Intel®Core™
i7-660UE Processor and Intel® HM55 Express Chipset with Dual
Channel Memory
Highlights
• COM EXPRESS TYPE II (Basic)
• Intel Core i3, i5, i7 CPUs integrated
• Intel Turbo Boost Technology
• Multiple Display Inteface Supported
• Temperature range: -40°C ÷ +85°C
Technical features
TEMPERATURE RANGE: -40°C ÷ +85°C
CPU Intel® Core™ i7-660UE @ 1GHz, 4MB Cache
Chipset Intel® HM55 Express Chipset
Memory 1066MHz DDR3 selected modules on two SO-DIMMs
FSB 100MHz
Graphics integrated Intel® HD graphics controller
LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter
Resolutions Up to 2048 x 1536 on CRT interface
Up to 2560 x 1600 @ 60Hz with Display Port
Up to 1920 x 1200 @ 60Hz using HDMI/DVI
PEG PCI Express Graphics x16 interface
Multiplexed with HDMI, DVI and Display Port
Mass Storage 1 x P-ATA channel
4 x S-ATA channels
USB
8x USB 2.0 ports
PCI-e ports 4x PCI Express x1 ports
ETHERNET Gigabit Ethernet port
Interface Bus PCI Bus
SM Bus
Power supply +12VDC and +5VSB for ATX mode
42
COM EXPRESS™
Highlights
®
COM-Express™ Module Extension (DVI) with Intel Core™
i7 / Celeron® Processor and Intel® HM55 Express Chipset
with AMD Radeon™ Graphics E4690 Discrete GPU on board
• COM EXPRESS™ TYPE II (Basic) with Intel Core i3, i5, i7 CPUs
• Graphic Controller AMD Radeon Graphics™ E4690 Integrated on board
• The most powerful graphics COM express solution available in the market
• High res multi display support
• Suitable for medical, gaming, digital signage and parallel processing applications
Technical features
CPU Intel® Core™ [email protected], 4MB Cache, 18W TDP
Intel® Core™ i7-620LE@2GHz, 4MB Cache, 25W TDP
Intel® Celeron® [email protected], 2MB Cache, 18W TDP
Memory up to 4GB of 1066MHz DDR3 SO-DIMMs
Graphics AMD Radeon™ Graphics E4690 Discrete GPU on board
with 512MB 128-bit GDDR3 dedicated memory;
Up to 3 independent displays using ad-hoc Carrier board
CRT, Dual LVDS, DVI/HDMI interfaces
HDMI max resolution 1080p
CRT, max pixel clock 400MHz
E4690 24-bit dual channel LVDS interface, max. resolution 2048 x 1536
CPU’s LVDS interface, max resolution 1600 x 1200 (available only on ad-hoc Carrier boards)
USB 8 x USB 2.0 ports
PCIe Ports 6 x PCI Express ports
ETHERNET Gigabit Ethernet interface
SATA interface 4 x Serial ATA ports
LPC Expansion Bus for legacy peripherals
I2C Bus
SM Bus
WDT & Real Time Clock
Power supply +12VDC and +5VSB (optional)
Dimensions 125x95 mm (COM Express Basic Form factor)
43
COM EXPRESS™
SECOMExp-ION
COM-Express™ Module with Intel® Celeron® T3100 /
Intel® Atom™ N270 CPU and NVIDIA® ION Chipset with Dual
Channel Memory
Highlights
• NVIDIA® CUDA™ technology
• Full HD video decode and display with true-fidelity
• 10x Faster Graphics and Video Transcoding 1
• Low TDP for thin thermal solution
Technical features
CPUIntel® Celeron® T3100 @ 1,9GHz, 1MB L2
Cache, 800MHz FSB, Dual Core, 64-bit
Instruction Set
Intel® Atom™ N270 @ 1,6GHz, 512KB L2
Cache, 533 MHz FSB, HyperThreading, 32-bit
Instruction Set
ChipsetNVIDIA® MMP9 Embedded ION® Chipset
Memory
up to 4GB of 1066MHz DDR3 on two SO-DIMMs supporting dual channel
Graphics
integrated NVIDIA® GeForce 9400 Graphic Controller,
with 16 graphic/computational cores
LVDS
Resolutions
PEG
Mass Storage
1 x P-ATA channel
4 x S-ATA channels
USB
8x USB 2.0 ports
PCI-e ports
ETHERNET
Audio
HD Audio Interface
Interface Bus
PCI Bus
SM Bus
I2C Bus
Power consumption
~ 11W during ACPI O.S. Idle Status
17W average, 20W peak during stress test
(with 4GB DDR3)
Operating temperature -25°C ÷ +70°C with finned heatsink
Dimensions
125x95 mm (COM Express Basic)
44
COM EXPRESS™
SECOMExp-GSeries
COM-Express™ Module with AMD Embedded G-Series Platform
Highlights
• Able to drive two independent displays using the LVDS / HDMI / DisplayPort interfaces
• An excellent solution for high performance, low power applications
• DirectX® 11 support, OpenGL 3.2 and OpenCL™ support
Technical features
APU AMD T56N, Dual Core @ 1,65GHz, TDP18W
AMD T48N, Dual Core @ 1,4GHz, TDP18W
AMD T40E, Dual Core @ 1,0GHz, TDP6.4W
AMD T52R, Single Core @ 1,5GHz, TDP18W
AMD T40R, Single Core @ 1,0GHz, TDP5.5W
Controller Hub AMD A55E Controller Hub
Memory up to 8GB of 1033MHz DDR3 on two SO-DIMMs
Graphics integrated AMD GPU Radeon™:
HD6320 - AMD T56N
HD6310 - AMD T52R and T48N
HD6290 - AMD T40N
Video Outputs Dual DisplayPort or HDMI interface
18/24 Bit Single/Dual Channel LVDS (alternative to second
DisplayPort / HDMI interface)
CRT interface
Max Resolutions LVDS Interface, up to 1920x1200
HDMI, up to 1920 x 1200
Display Port: Up to 2560 x 1600 – AMD T56N, T48N, T52R
Up to 1920 x 1200 – AMD T40N, T44R, T40E, T40R
CRT:
Up to 2048 x 1536 – AMD T56N, T48N and T52R
USB 8x USB 2.0 ports
PCI Bus
2x ExpressCard interfaces
PATA One Ultra DMA 133/100/66/33 Port
SATA Four Serial ATA ports
Interface Bus LPC expansion BUS for legacy peripherals
I2C Bus
SM Bus
4x GPI, 4xGPO
WatchDog Timer
Fan/Thermal Management
Power Management
Real time Clock
Power supply
+12VDC and +5VSB for ATX mode
COM Express Basic Form factor, Type II, Extension HDMI/DisplayPort
45
COM EXPRESS™
Highlights
SECOMExp-RSeries
COM-Express™ Type 6 Module based on the AMD
Embedded R-Series Platform
• Latest AMD R-series APU (CPU+GPU) architecture
• Up to 4 independent displays, up to 2560x1600 resolution
• Designed for digital signage, gaming and multimedia applications
Technical features
APU AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W
AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W
AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W
AMD R-252F, Dual Core @ 2.4 GHz, TDP 17W
Controller Hub AMD A70M Controller Hub
Graphics
HD7620G - AMD R-460L
HD7500G - AMD R-260H
HD7400G - AMD R-252F
4 independent display support
Video Outputs 3 x Digital Display Interfaces
18/24 Bit Single/Dual Channel LVDS
CRT interface
CRT interface, up to 1920x1600
Digital Display interfaces, up to 2560x1600
4 x USB 3.0 ports
2x Express Card interfaces
1 x PCI-e x8 (PEG) interface
Serial ports 2 x TX/RX ports @ TTL Level, optional
Disk Interface 4 x SATA 6Gb/s ports
I2C Bus
SM Bus
4x GPI, 4xGPO
WatchDog Timer
SPI Interface
Power Management
Optional Trusted Platform Module (TPM)
Real Time Clock
COM Express Basic Form factor, Type 6
46
COM EXPRESS™
Highlights
SECOMExp-x2000
COM-Express™ Module with Intel® Atom™ Cedar View family
Processors and Intel® NM10 Express Chipset
• COM Express Type II (Compact) based on Intel® Atom™ Cedar View CPU family
• A native dual core multi Threads solution with optimal performance/power consumption ratio
• New SGX535 graphics engine, DirectX 10.1 and OpenGL 3.0 support
• Hardware accelerated video decoding for MPEG-2, MPEG-4 part 2, VC1, WMV9 and
all important H.264
Technical features
CPU Intel® Atom™ D2550 @ 1.86GHz, 1MB Cache, 10W TDP
Intel® Atom™ N2800 @ 1.86GHz, 1MB Cache, 6.5W TDP
Chipset
Intel® NM10 Express Chipset
Memory up to 4GB of 1066MHz DDR3 SO-DIMM
Video Outputs CRT interface
Up to 2 x HDMI / Display Port interface
Native Single Channel 18/24 bit LVDS interface OR
DP to Single/Dual Channel 18/24bit LVDS bridge
Resolutions CRT Interface, up to 1920 x 1200
HDMI/DVI, up to 1920 x 1200
Display Port:
Up to 1600 x 1200 with N2xx CPU’s
Native LVDS:
Up to 1440 x 900 with D2550
DP-to-LVDS bridge: Up to 1600 x 1200 with N2xx CPU’s
Up to 1920 x 1200 with D2550
Mass Storage 2 x S-ATA channels
PCI-e ports Up to 3 x PCI Express x1 ports
2 x Express Card Interfaces
LPC Bus, I2C Bus, SM Bus
SPI interface
4 x GPI, 4 x GPO
Watch Dog Timer
FAN management
Dimensions 95x95 mm (COM Express Compact)
47
COM EXPRESS
™
SECOCExp-mITX
CARRIER
BOARD
Carrier Board for COM-Express™ modules TYPE II (Basic)
on miniITX form factor
Highlights
• General Purpose For COM EXPRESS™ TYPE II (Basic)
• Mini ITX form factor
• Extensive Connectivity
Technical features
Supported Modules
All COM Express™ TYPE II Embedded Computer Modules
Expansion Slots
1 x PCI
1 x PCI Express x16
2 x miniPCI Express (one connected to SIM Card Slot)
Up to 2 Gigabit Ethernet ports on front panel connector
1 x P-ATA 44 pin connector
1 x Compact Flash Socket
1 x SD Card Slot
I/O
4 x USB on the Front Panel
1 x USB internal connector
2 x Serial Ports (1 x DB-9 male connector on Front Panel,
1 x 10 pin Header Connector)
1 x LPT 26-pin Box header
PS/2 Keyboard and Mouse Connector
LPC Bus interface
1 x 40 pin connector for additional feature
AudioHD Audio Codec
2 x triple audio connector for 7.1 Surround audio
1 x Toslink Fiber Optical SP/DIF connector
Video
Analogic VGA DB-15HD connector on Front Panel
LVDS Interface, 34 pin 2mm pitch header
Backlight Connector, 10 pin 2.54mm pitch header
TV Out connector (6 pin 2mm pitch header)
CMOS Battery
On Board Lithium Battery for CMOS Backup and
Real Time Clock
Power
ATX Standard power Connector, 20 + 4 poles, AT mode configurable
FAN
Temperature
Storage: -20° … +80°C
Dimensions
170 x 170 mm (6,7” x 6,7”)
48
48
COM EXPRESS™
Technical features
SECOMExp-iCORE
SECOMExp-iCore-XT
®
CPU
Intel Core™ i3-330E @ 2.13GHz, 3MB Cache, 35W TDP
®
Intel Core™ i5-520E/[email protected], 3MB Cache, 35W TDP
®
Intel Core™ i7-660UE @ 1.33GHz, 4MB Cache, 18W TDP
®
Intel Core™ i7-620LE @ 2GHz, 4MB Cache, 25W TDP
®
Intel Core™ i7-610E @ 2.53GHz, 4MB Cache, 35W TDP
®
Intel Celeron® U3405@ 1.06GHz, 2MB Cache, 18W TDP
®
Intel Celeron® P4505@ 1.86GHz, 2MB Cache, 35W TDP
®
ChipsetIntel HM55 Express Chipset
Memory
up to 8GB of 1066MHz DDR3 on two SO-DIMMs
Graphics
integrated Intel® HD graphics controller
with dual independent display support
LVDS
Resolutions
Up to 1920 x 1200 on LVDS interface
PEG
Mass Storage
1 x P-ATA channel
4 x S-ATA channels
USB
8x USB 2.0 ports
PCI-e ports
ETHERNET
Audio
HD Audio Interface
Interface Bus
PCI Bus
SM Bus
TEMPERATURE RANGE: -40°C ÷ +85°C
CPU Intel® Core™ i7-660UE @ 1GHz, 4MB Cache
Memory 1066MHz DDR3 selected modules on two SO-DIMMs
FSB 100MHz
LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter
Resolutions Up to 2048 x 1536 on CRT interface
Up to 2560 x 1600 @ 60Hz with Display Port
Up to 1920 x 1200 @ 60Hz using HDMI/DVI
PEG PCI Express Graphics x16 interface
Multiplexed with HDMI, DVI and Display Port
Mass Storage 1 x P-ATA channel
4 x S-ATA channels
USB
8x USB 2.0 ports
SM Bus
49
COM EXPRESS™
Technical features
SECOMExp-GSeries
®
CPU Intel Core™ [email protected], 4MB Cache, 18W TDP
®
Intel Core™ i7-620LE@2GHz, 4MB Cache, 25W TDP
®
®
Intel Celeron [email protected], 2MB Cache, 18W TDP
®
Chipset Intel HM55 Express Chipset
Memory up to 4GB of 1066MHz DDR3 SO-DIMMs
Graphics AMD Radeon™ Graphics E4690 Discrete GPU on board
with 512MB 128-bit GDDR3 dedicated memory;
Up to 3 independent displays using ad-hoc Carrier board
CRT, Dual LVDS, DVI/HDMI interfaces
HDMI max resolution 1080p
CRT, max pixel clock 400MHz
E4690 24-bit dual channel LVDS interface, max. resolution 2048 x 1536
CPU’s LVDS interface, max resolution 1600 x 1200 (available only on ad-hoc Carrier boards)
PCIe Ports 6 x PCI Express ports
SATA interface 4 x Serial ATA ports
LPC Expansion Bus for legacy peripherals
I2C Bus
SM Bus
WDT & Real Time Clock
Dimensions 125x95 mm (COM Express Basic Form factor)
50
SECOMExp-ION
®
®
CPUIntel Celeron T3100 @ 1,9GHz, 1MB L2
Cache, 800MHz FSB, Dual Core, 64-bit
Instruction Set
®
Intel Atom™ N270 @ 1,6GHz, 512KB L2
Cache, 533 MHz FSB, HyperThreading, 32-bit
Instruction Set
®
®
ChipsetNVIDIA MMP9 Embedded ION Chipset
Memory
up to 4GB of 1066MHz DDR3 on two SO-DIMMs supporting dual channel
®
Graphics
integrated NVIDIA GeForce 9400 Graphic Controller, with 16 graphic/computational cores
LVDS
Resolutions
PEG
Mass Storage
1 x P-ATA channel
4 x S-ATA channels
USB
8x USB 2.0 ports
PCI-e ports
ETHERNET
Audio
HD Audio Interface
Interface Bus
PCI Bus
SM Bus
I2C Bus
Power consumption
~ 11W during ACPI O.S. Idle Status
17W average, 20W peak during stress test
(with 4GB DDR3)
Operating temperature -25°C ÷ +70°C with finned heatsink
Dimensions
125x95 mm (COM Express Basic)
APU AMD T56N, Dual Core @ 1,65GHz, TDP18W
AMD T40E, Dual Core @ 1,0GHz, TDP6.4W
AMD T40R, Single Core @ 1,0GHz, TDP5.5W
Controller Hub AMD A55E Controller Hub
Graphics integrated AMD GPU Radeon™:
HD6320 - AMD T56N
HD6310 - AMD T52R and T48N
HD6290 - AMD T40N
®
DirectX 11, OpenGL 4.0, OpenCL™ 1.1 supported
Video Outputs Dual DisplayPort or HDMI interface
18/24 Bit Single/Dual Channel LVDS (alternative to second DisplayPort / HDMI interface)
CRT interface
HDMI, up to 1920 x 1200
Display Port:Up to 2560 x 1600 – AMD T56N, T48N, T52R
CRT:
Up to 2048 x 1536 – AMD T56N, T48N and T52R
PCI Bus
2x ExpressCard interfaces
PATA One Ultra DMA 133/100/66/33 Port
SATA Four Serial ATA ports
I2C Bus
SM Bus
4x GPI, 4xGPO
WatchDog Timer
Power Management
Real time Clock
Power supply
+12VDC and +5VSB for ATX mode
COM Express Basic Form factor, Type II, Extension HDMI/DisplayPort
COM EXPRESS™
Technical features
SECOMExp-RSeries
SECOMExp-x2000
SECOCExp-mITX
CARRIER
BOARD
APU AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W
AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W
AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W
AMD R-252F, Dual Core @ 2.4 GHz, TDP 17W
Controller Hub AMD A70M Controller Hub
Graphics
HD7500G - AMD R-260H
HD7400G - AMD R-252F
4 independent display support
Video Outputs 3 x Digital Display Interfaces
18/24 Bit Single/Dual Channel LVDS
CRT interface
CRT interface, up to 1920x1600
Digital Display interfaces, up to 2560x1600
4 x USB 3.0 ports
2x Express Card interfaces
1 x PCI-e x8 (PEG) interface
Serial ports 2 x TX/RX ports @ TTL Level, optional
Disk Interface 4 x SATA 6Gb/s ports
I2C Bus
SM Bus
4x GPI, 4xGPO
WatchDog Timer
SPI Interface
Power Management
Optional Trusted Platform Module (TPM)
Real Time Clock
COM Express Basic Form factor, Type 6
CPU Intel® Atom™ D2550 @ 1.86GHz, 1MB Cache, 10W TDP
Chipset
Intel® NM10 Express Chipset
Memory up to 4GB of 1066MHz DDR3 SO-DIMM
Video Outputs CRT interface
Up to 2 x HDMI / Display Port interface
Native Single Channel 18/24 bit LVDS interface OR
DP to Single/Dual Channel 18/24bit LVDS bridge
Resolutions CRT Interface, up to 1920 x 1200
HDMI/DVI, up to 1920 x 1200
Display Port: Up to 1600 x 1200 with N2xx CPU’s
Native LVDS: Up to 1366 x 768 with N2xx CPU’s
Up to 1440 x 900 with D2550
DP-to-LVDS bridge: Up to 1600 x 1200 with N2xx CPU’s
Up to 1920 x 1200 with D2550
Mass Storage 2 x S-ATA channels
PCI-e ports Up to 3 x PCI Express x1 ports
2 x Express Card Interfaces
LPC Bus, I2C Bus, SM Bus
SPI interface
4 x GPI, 4 x GPO
Watch Dog Timer
FAN management
Dimensions 95x95 mm (COM Express Compact)
Supported Modules
All COM Express™ Type II Embedded Computer Modules
Expansion Slots
1 x PCI
1 x PCI Express x16
2 x miniPCI Express (one connected to SIM Card Slot)
Up to 2 Gigabit Ethernet ports on front panel connector
1 x P-ATA 44 pin connector
1 x Compact Flash Socket
1 x SD Card Slot
I/O
4 x USB on the Front Panel
1 x USB internal connector
2 x Serial Ports (1 x DB-9 male connector on Front Panel,
1 x 10 pin Header Connector)
1 x LPT 26-pin Box header
PS/2 Keyboard and Mouse Connector
LPC Bus interface
1 x 40 pin connector for additional feature
AudioHD Audio Codec
2 x triple audio connector for 7.1 Surround audio
1 x Toslink Fiber Optical SP/DIF connector
Video
Analogic VGA DB-15HD connector on Front Panel
LVDS Interface, 34 pin 2mm pitch header
Backlight Connector, 10 pin 2.54mm pitch header
TV Out connector (6 pin 2mm pitch header)
CMOS Battery
On Board Lithium Battery for CMOS Backup and
Real Time Clock
Power
ATX Standard power Connector, 20 + 4 poles, AT mode configurable
FAN
Temperature
Storage: -20° … +80°C
Dimensions
170 x 170 mm (6,7” x 6,7”)
51
SBC
Benefits:
Compact Dimensions
Rugged Solution
Cost Effective
Digital Signage: kiosks, info-point, panel PC
Security: video surveillance, networking control
Clever Turn-key Solutions
SECO’s Embedded Single Board Computer product line includes
a wide range of standard architectures such as nITX and pITX.
Typical fields of application are gaming (slot or video poker
machines), digital signage (kiosks or info-point devices) and
industrial (processes control machines).
SECO SBCs are providing all the required I/O’s for most industrial
applications such as on-board digital and analog I/O, on board
bootable flash.
SECO’s Single board computers are compact and with a high
level of integration. Together with their low power consumption
they become the obvious choice for a wide range of applications.
Plug-cards such as DIMMs or storage units, cables and display
interfaces along with pre-loaded operating systems complete the
offer of SECO’s turn-key solutions with long term availability.
SBC
SECOnITX-ION
Single Board Computer with Intel® Celeron® T3100 or
Intel® Atom™ N270 CPU and NVIDIA® MMP9
Embedded ION™ Chipset on nano-ITX form factor
Highlights
• Highly-integrated compact board
• Low Power Consumption and low heat dissipation
• NVIDIA GeForce 9400 graphics
Technical features
ProcessorIntel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache,
800MHz FSB, Dual Core, 64-bit Instruction Set
Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache,
533 MHz FSB, HyperThreading, 32-bit Instruction Set
ChipsetNVIDIA® MMP9 Embedded ION™
Memory up to 4GB DDR3 on a SO-DIMM socket
Graphic Controller integrated controller NVIDIA® GeForce 9400M
16x graphics cores
max analog resolution 2048 x 1536
max digital resolution 2560 x 1600
Video DVI Interface
LVDS Interface
HDMI Interface
CRT Interface
Mass Storage Interface 2x SATA
Compact Flash Socket
USB 4 x USB 2.0 ports (standard connector)
2 x USB 2.0 ports (internal Pin Headers)
ETHERNET Gigabit Ethernet Connector
Audio dual jack for HD Audio
Expansion Slots 1x miniPCI Express connector
1 x Serial Port (RS-232 / RS-485 configurable)
SM Bus Pin Header
GPIO Pin Header
FAN 3 pin Headers for CPU and Chipset temperature, with Tachometric signal
Power supply+12VDC connector, AT/ATX mode
Dimensions 120x120 mm (4.72” x 4.72”)
53
SBC
SECOpITX-x2000
Single Board Computer with Intel® Atom™ Cedar View family
Processors and Intel® NM10 Express Chipset in Pico-ITX
form factor
Highlights
• Space and power saving SBC with the long term support of the embedded market
• Based on Intel® Atom™ Cedar View dual core N2000 and D2000 CPU family at 64-bit
instruction set and Hyper Threading for impressive performance/power consumption ratio
• Suitable for fanless and low cost applications
Technical features
Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP
Memory up to 4GB DDR3 1066MHz SO-DIMM
Video interfaces HDMI Connector
18/24 bit single channel LVDS internal connector
VGA interface (optional external adapter is required)
Resolutions Up to 1920x1200 on HDMI and CRT
Up to 1366 x 768 on LVDS interface with N2xx CPUs
Up to 1440x 900 on LVDS interface with D2550 CPUs
Mass Storage 2 x standard S-ATA connector
I/O 2 x standard USB 2.0 ports
4 x internal USB 2.0 ports
FAN connector
Ethernet up to 2 x Gigabit Ethernet connector
LineOut, Mic In internal connector
Power supply +12VDC Power Jack
CPU RTC battery with lead cable and connector
Dimensions 100 x 72 mm (3,93” x 2,83”)
54
SBC
SECOµSBC-i.MX6
Single Board Computer with Freescale™ i.MX6 Processor
Highlights
• The power of the Freescale™ i.MX6 SoC in a credit card sized SBC
• Scalable multi-core ARM® Cortex™-A9 architecture
• It combines and emphasizes the high-graphics performance with the power-efficient
processing capabilities
• Flexible solution suitable for the digital signage applications. A multi-display platform for
mobile fanless applications
• Best benefit-cost ratio
Technical features
Processor Memory Graphics Video interfaces Resolutions Mass Storage I/O Ethernet Audio i.MX6Dual/ 6Quad
Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors:
Single core i.MX6S up to 1GHz
up to 2GB DDR3 onboard (up to 1GB with i.MX6S)
integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 3 independent displays (up to 2 displays with i.MX6DL and i.MX6S)
HDMI Connector
HDMI, up to 1080p
mSATA Half-Size slot (shared with miniPCI-Express)
3 x standard USB 2.0 ports
1 x USB OTG
Internal USB for optional WiFi module
miniPCI-Express Half-Size slot (shared with mSATA)
Gigabit Ethernet connector
AC’97 Audio Codec
1 x RS-232 serial port
+12VDC Power Jack
Serial ports Power supply
RTC battery with lead cable and connector
80 x 67 mm (3,15” x 2,64”)
Dimensions 55
SBC
SECOµSBC-T30
Highlights
®
®
Single Board Computer with NVIDIA Tegra T30 Processor
• The power of the Nvidia® Tegra® 3 SoC in a credit card sized SBC
• Impressive graphics capabilities
• Quad-Core A9 ARM® Cortex™-A9 Low Power CPU for high graphics and mobile applications
• Graphics engine powered by the 12 cores ULP GeForce GPU
• Extreme multitasking, 1080p Video Playback dedicated Processors and able to play high res
3D video
• A cost effective solution suitable for digital signage apps where a compact size and a low
power consumption is necessary
Technical features
Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™ -A9 MPCore™ CPU, 1.3 GHz per core
Graphics embedded NVIDIA® ULP GeForce® GPU
Supports up to 2 independent displays
Dual Channel 18/24 bit LVDS interface
Resolutions LVDS, up to 1920x1080
HDMI, up to 1080p
1 x USB OTG
Ethernet Gigabit Ethernet connector
Serial ports 1 x RS-232 serial port
Dimensions 80 x 67 mm (3,15” x 2,64”)
56
SBC
Highlights
SECOpITX-GX
Single Board Computer with the brand new AMD Embedded
G-Series SOC in Pico-ITX form factor
• The smallest standard SBC in the market in Pico-ITX form factor
• Connectivity oriented
• Dual LAN (WiFi+Bluetooth opt.)
• Multidisplay support (LVDS - HDMI - eDP - VGA)
• USB 3.0 support
Technical features
AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25W
AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W
AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W
AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W
Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V
Memory
(DDR3-1333MHz @1.5V with GX-210HA)
Embedded AMD HD RADEON GPUs
HD8400E @600MHz (GX-420CA), HD8330E @500Mhz (GX-415GA)
Graphics
HD8280E @450MHz (GX-217GA), HD8210E @300Mhz (GX-210HA)
HDMI Connector
Video interfaces 18 bit single channel LVDS or embedded Display Port internal connector
VGA interface (requires external optional Video Adapter)
Up to 1920x1200 on HDMI
Up to 2048x1536 on CRT
Resolutions
Up to 2560 x1600 with embedded Display Port (eDP)
Up to 1440 x 900 on LVDS 18bit interface (up to 1920x1200
through external adapter)
2 x standard S-ATA connectors
Mass Storage
microSD Card Slot
2 x standard USB 3.0 Type A connectors
I/O
Half miniPCI-e slot
FAN connector
Front Header Expansion connector
SOC
N
O
CO
N
I
M
O
S
G
Ethernet
Audio
Power supply
Up to 2 x Gigabit Ethernet connector
HD Audio Codec
+12VDC Power Jack
Dimensions
100 x 72 mm (3,93” x 2,83”)
57
SBC
Technical features
SECOnITX-ION
ProcessorIntel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache,
800MHz FSB, Dual Core, 64-bit Instruction Set
Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache,
533 MHz FSB, HyperThreading, 32-bit Instruction Set
ChipsetNVIDIA® MMP9 Embedded ION™
Memory
up to 4GB DDR3 on a SO-DIMM socket
Graphic Controller
integrated controller NVIDIA® GeForce 9400M
16x graphics cores
max analog resolution 2048 x 1536
max digital resolution 2560 x 1600
Video
DVI Interface
LVDS Interface
HDMI Interface
CRT Interface
Compact Flash Socket
USB
4 x USB 2.0 ports (standard connector)
2 x USB 2.0 ports (internal Pin Headers)
ETHERNET
Gigabit Ethernet Connector
Audio
dual jack for HD Audio
Expansion Slots
1x miniPCI Express connector
1 x Serial Port (RS-232 / RS-485 configurable)
SM Bus Pin Header
GPIO Pin Header
FAN
3 pin Headers for CPU and Chipset temperature, with Tachometric signal
Power supply+12VDC connector, AT/ATX mode
Dimensions
120x120 mm (4.72” x 4.72”)
58
SECOpITX-x2000
Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP
Memory up to 4GB DDR3 1066MHz SO-DIMM
18/24 bit single channel LVDS internal connector
VGA interface (optional external adapter is required)
Resolutions Up to 1920x1200 on HDMI and CRT
Up to 1366 x 768 on LVDS interface with N2xx CPUs
Up to 1440x 900 on LVDS interface with D2550 CPUs
Mass Storage 2 x standard S-ATA connector
FAN connector
Ethernet up to 2 x Gigabit Ethernet connector
CPU RTC battery with lead cable and connector
100 x 72 mm (3,93” x 2,83”)
Dimensions SBC
Technical features
SECOµSBC-i.MX6
SECOµSBC-T30
SECOpITX-GX
N
O
O
S
G
IN
M
O
C
i.MX6Dual/ 6Quad
Processor Memory Graphics Video interfaces Resolutions Mass Storage I/O Ethernet Audio Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors:
Single core i.MX6S up to 1GHz
up to 2GB DDR3 onboard (up to 1GB with i.MX6S)
integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 3 independent displays (up to 2 displays with
i.MX6DL and i.MX6S)
HDMI Connector
HDMI, up to 1080p
3 x standard USB 2.0 ports
1 x USB OTG
Gigabit Ethernet connector
AC’97 Audio Codec
1 x RS-232 serial port
+12VDC Power Jack
Serial ports Power supply
80 x 67 mm (3,15” x 2,64”)
Dimensions Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™ -A9 MPCore™ CPU, 1.3 GHz per core
Graphics embedded NVIDIA® ULP GeForce® GPU
Supports up to 2 independent displays
Dual Channel 18/24 bit LVDS interface
Resolutions LVDS, up to 1920x1080
HDMI, up to 1080p
1 x USB OTG
Ethernet Gigabit Ethernet connector
Serial ports 1 x RS-232 serial port
Dimensions 80 x 67 mm (3,15” x 2,64”)
AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25W
AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W
AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W
AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W
Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V
Memory
(DDR3-1333MHz @1.5V with GX-210HA)
Embedded AMD HD RADEON GPUs
HD8400E @600MHz (GX-420CA), HD8330E @500Mhz (GX-415GA)
Graphics
HD8280E @450MHz (GX-217GA), HD8210E @300Mhz (GX-210HA)
HDMI Connector
Video interfaces 18 bit single channel LVDS or embedded Display Port internal connector
VGA interface (requires external optional Video Adapter)
Up to 1920x1200 on HDMI
Up to 2048x1536 on CRT
Resolutions
Up to 2560 x1600 with embedded Display Port (eDP)
Up to 1440 x 900 on LVDS 18bit interface (up to 1920x1200
through external adapter)
2 x standard S-ATA connectors
Mass Storage
microSD Card Slot
2 x standard USB 3.0 Type A connectors
I/O
Half miniPCI-e slot
FAN connector
Front Header Expansion connector
SOC
Ethernet
Audio
Power supply
Up to 2 x Gigabit Ethernet connector
HD Audio Codec
+12VDC Power Jack
Dimensions
100 x 72 mm (3,93” x 2,83”)
59
ETX 3.0
®
Benefits:
FAST Development
Flexibility
Easy Cabling
Telecommunication
Multimedia - Gaming Machines
60
Winning Formula
The ETX® (Embedded Technology eXtended) architecture is
based upon 2 elements: the ETX® CPU Module and the ETX®
Baseboard.
The ETX® CPU modules have a compact size ( 95x114mm) and 4 standard high density connectors through which ISA
bus, PCI bus and the most common I/O signals in a PC are
conveyed to the ETX® Baseboard. The connectors are placed
on the baseboard which is generally designed on customer’s
requirements. About the ETX® baseboards, SECO provides
solutions off-the-shelf but also offers its know-how for the design
of custom baseboards.
This solution enables the customer to maintain the same
mechanics or the chassis where the embedded CPU system
is positioned and diversify or update the performances of
the product simply changing the ETX® CPU module. Another
possibility is to offer a wider range of final products offering
different performances simply using different CPU modules,
avoiding additional design costs.
The thermal dissipation of the system strictly depends on the
mechanics of the final system and the mounted CPU: from the
standard heat spreader kit through heat sinks, fans or heat pipes.
Flexible and tailored solutions are the benefits of an ETX® system.
ETX ® 3.0
SECOME-945/N270
ETX® Module with Intel® Atom™ N270 and
945GME – ICH7-M DH Express Chipset
Highlights
• ETX® 3.0 compliant
• Cost Sensitive Module
• Low Power Consumption
• Available in Extended Temperature Version
Technical features
CPUIntel® Atom™ N270 1,6GHz with TDP 2.5W
ChipsetIntel® 82945GME + Intel® 82801GHM (ICH7M-DH)
Memory
up to 2GB of 533/667MHz DDR2 of SO-DIMMs
FSB533MHz
GraphicsIntel® Graphics Media Accelerator 950
Resolutions
Up to 2048 x 1536 QXGA 75Hz
Dual display supported
LVDS
18 or 24 bit, single or dual channel interface
USB
4x USB 2.0 ports
Expansion bus
ISA Bus, PCI bus
ETHERNET
10/100Mbps Ethernet port, Realtek RTL8103E
PATA
One Ultra ATA/100/66/33 Port
SATA
Up to 2x S-ATA connectors on ETX® module
Serial Ports
2x (TTL level signals)
Parallel Port 1x (optionally, shared with Floppy Disk Drive Port)
Audio
AC’97 Internal Audio Codec VIA VT1613
Watch Dog Timer
Real time Clock
Temperature, Fan Speed and Voltage Monitoring
Power supply
+5VDC (+5VSB needed for ATX mode)
Temperature
Operating: -20°C ÷ +70° C
Dimensions
114x95 mm (4.5” x 3.7”)
61
XTX
™
Benefits:
FAST Development
High-speed buses support
Flexibility
Telecommunication
Multimedia
Gaming Machines
62
EXpress Technology for ETX®
The XTX™ (EXpress Technology for ETX® ) architecture is based,
like the one of ETX®, on 2 elements: the XTX™ CPU Module and
the XTX Baseboard.
XTX™ was developed as an evolution of the ETX® standard, with
the same form factor of 95x114mm and the same 4 standard
high-density connectors through which the signals are conveyed
to the Baseboard, but adding new features.
Following the trend of the new I/O technologies, XTX® removes
the ISA signals, a bus less and less used in modern embedded
applications, and adds the new high-speed serial buses like PCI
Express™ and Serial ATA®.
The philosophy of the XTX™ architecture remains the same of
the ETX®: flexibility in offering different performances in the final
application and/or easy upgrade of performances simply using
different CPU modules, avoiding additional design costs.
The thermal dissipation of the system strictly depends on the
mechanics of the final system and the CPU mounted and implies
the same solutions of the ETX® systems.
SECO provides its know-how in developing and manufacturing
Baseboards also for the XTX™ standard, in order to supply to
the customer a complete embedded PC system, for fastest and
easiest integration on the customer’s site.
XTX™
SECOMX-945/N270
XTX™ Module with Intel® Atom™ N270 and
945GME – ICH7-M DH Express Chipset
Highlights
• Cost effective
• Low Power Consumption
• Available in Extended Temperature
Technical features
CPUIntel® Atom™ N270 1,6GHz with TDP 2.5W
ChipsetIntel® 82945GME + Intel® 82801GHM (ICH7M-DH)
Memory
up to 2GB of 533/667MHz DDR2 of SO-DIMMs
FSB533MHz
GraphicsIntel® Graphics Media Accelerator 950
Resolutions
Up to 2048 x 1536 QXGA 75Hz
Dual display supported
LVDS
18 or 24 bit, single or dual channel interface
USB
6x USB 2.0 ports
Expansion bus
PCI bus, 4x PCI Express x1 ports
ETHERNET
10/100Mbps Ethernet port, Realtek RTL8103E
PATA
One Ultra ATA/100/66/33 Port
SATA
Up to 2x S-ATA ports
Serial Ports
2x (TTL level signals)
Parallel Port
1x (optionally, shared with Floppy Disk Drive Port)
Audio
AC’97 Internal Audio Codec VIA VT1613
Watch Dog Timer
Real time Clock
Temperature, Fan Speed and Voltage Monitoring
Power supply
+5VDC (+5VSB needed for ATX mode)
Temperature
Operating: -20°C ÷ +70° C
Dimensions
114x95 mm (4.5” x 3.7”)
63
Qseven
XTX
™
®
SECOCX-mITX
CARRIER
BOARD
Carrier Board for XTX™ modules on mini ITX standard
Highlights
• General Purpose for XTX CPU modules
• Mini ITX form factor
• Extensive Connectivity
Technical features
Suppored Module All XTX™ Embedded Computer Modules
Expansion Slots 1x PCI
2x PCI Express x 1
1x miniPCI Express
1x Gigabit Ethernet on front panel connector
1x Fast Ethernet on front panel connector
1x PATA
1x Compact Flash Socket
1x SD Card Slot
I/O 4x USB on the Front Panel
2x Serial Ports (1x Front Panel Connector,
1x 10 Pin Header Connector)
1x LPT
PS/2 Keyboard and Mouse
LPC Bus Interface
1x 40 Pin Connector for Additional Features
Sound Line In
Line Out
Mic In on the Front Panel
Video
Analog VGA on the Front Panel
LVDS Interface, 34 Pin 2 mm Header
Backlight Connector, 10 Pin 2.54 mm Header
TV Out (CN13)
CMOS Battery On Board Lithium Battery for CMOS backup and real time clock
Power ATX Standard Power Conn. (AT Mode Config.)
FAN 3 Pin Header
12 V and Tacho Signal
Temperature Operating: 0 .. +60°C
Storage: -20 .. +80°C
Dimensions 170 x 170 mm (6,7”x6,7”)
64
Italy
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settore8.it
SECO s.r.l.
Via Calamandrei, 91
52100 Arezzo - ITALY
Ph +39 0575 26979
Fax +39 0575 350210
[email protected]
www.seco.com
207

products guide

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