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2006 IEEE MTT-S International
Microwave Symposium
San Francisco, CA • June 11–16, 2006
Photo Courtesy of San Francisco Convention & Visitors Bureau
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www.ims2006.org
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IMS 2006 SYMPOSIUM WEEK AT A GLANCE
Activity
IMS
Location
Tutorials
Workshops
Plenary Session
Technical Sessions
Interactive Forum
Student Paper Judging/Contest
Panel Sessions
Maxwell Rump Session
EXHIBITS Exhibition
RFIC
Workshops
Plenary Session & Reception
Technical Sessions
Panel Sessions
Interactive Forum
ARFTG Conference/Exhibits
Workshops
SOCIAL Attendee’s Breakfast
Hospitality Suite
RFIC Reception
MJ Reception
Industry Reception
MTT Awards Banquet
Student Awards Luncheon
Speakers Breakfast
ARFTG Breakfast
ARFTG Awards Lunch
WIE Reception
Student’s Reception
Ham Radio Social
Moscone
Moscone
Moscone
Moscone
Moscone
Moscone
Moscone
Marriott
Moscone
Moscone
Moscone
Moscone
Moscone
Moscone
Renaissance Parc 55
Moscone
Moscone
Marriott
Moscone
Yerba Buena Gardens
Marriott
Marriott
Marriott
Moscone
Renaissance Parc 55
Renaissance Parc 55
Marriott
Marriott
Marriott
SUN/11
M N A
MON/12
E M N A
TUE/13
E M N A
WED/14
E M N A
THU/15
E M N A
FRI/16
E M N A
E
IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM 2006/MICROWAVE WEEK
MORNING
8:00–9:40 AM
10:10–11:50 AM
LUNCHTIME
12:00–1:15 PM
AFTERNOON
1:20–3:00 PM
Sat., June 10,
2006
EVENING
3:30–5:00 PM
Sunday,
June 11, 2006
Registration 7 AM to 6 PM
TSA: CMOS RFIC Design – Fundamental Building Blocks
TSC: Introduction to UHF RFID: Readers, Tags and ICs
TSD: Measurements Basics for Nonlinear HF Components
WSA: Challenges of System Integration in Wireless and Nano-scale ERA
WSB: RFICs for Ultra-wideband Systems
WSC: Advanced Power Amplifier ICs for High Efficiency Mobile Transmitters
WSD: Multi-chip Radio Module (MCRM) Design Methodology and Tools, and Manufacturing Issues for Cellular Applications
WSE: Noise Measurements and Modeling for CMOS
WSF: Substrate Effects in Si RFIC Interconnect
WSG: Ultra Low Power Transceiver Design
WSI: Three-dimensional Integration and Packaging
WSH: Radio Transceivers for 3G/HSDPA and WiMAX User …
WSJ: Advances in Multi-mode Multi-band Radio Transceivers
WSK: Quality of Automotive RF Systems
WSL: Memory Effects in Power Amplifiers
WSM: Advances in GaN HEMT Device Technology, Modeling and Applications
WSN: New Advances in Oscillator Design
WSO: Si Bipolar and CMOS mm-wave ICs – From Processes to Circuit Design and System Architectures
Monday,
June 12, 2006
Registration 2 to 6 PM
RFIC Symposium 8 AM to 5 PM
TMA: High Speed Digital Signal Integrity
TMB: Practical Methods for Determining the Accuracy…
TMC: Introduction of MEMs Resonators and Filters
WMA: UWB for Wireless Communications, Local Positioning and Sensing
WMB: Switching Mode Amplifiers with Applications to Wireless Transmitter Design
WMC: Noise in SiGe and III-V HBTs and Circuits: …
WMD: Passive and Active Differential Measurements: …
4G: Do We Really Need 1 Gbits/s?
WME: Microwave Component Design using Space…
WMF: Active Antennas: Performance …
WMG: Frequency Agile Radio: Systems and Technologies
WMH: High Efficiency Power Amplifiers for…
WMI: New CMOS Compatible Technologies for Enabling…
WMJ: Electronic Equalization Multigigabit Communications WMK: Practical RF and Microwave Multiplexer Design
RFIC Symposium 8 AM to 5 PM
IMS Exhibition 9 AM to 5 PM
Tuesday,
June 13, 2006
TU1A: Microwave Photonics
TU1B: RF MEMs Tunable
Components
TU1C: Frequency Domain
Techniques
TU1D: Low Noise Components
and Receivers
Panel Session
TU2A: Plenary Session
SoC vs. SiP: Dollars & Sense
TU1E: Microwaves in Support
of Societal Security (FS)
RFIC Plenary Session
5:30 to 7:00 PM
Moscone
RFIC Reception
7:00 to 9:00 PM
Moscone
Microwave Journal/
MTT-S Reception
6:00 to 8:00 PM
Yerba Buena
Gardens
Maxwell Rump Session
7:00 to 8:30 PM
RTUIF: INTERACTIVE FORUM 1:30 TO 4:30 PM
Marriott
TU3A: Synthesis and Design
TU4A: Practical Realization
Women in Engineering
Techniques for Microwave Filters
of Microwave Filters
Reception
and Diplexers
8:00 to 10:00 PM
TU3B: Applications in RF MEMs
TU4B: MEMs Switch and Packaging
Marriott
Technology
TU4C: Applications of Time-Domain Student Reception
TU3C: Progress in Time Domain
6:30
to 9:00 PM
Modeling
Techniques
Marriott
TU3D: Antenna Technologies
TU4D: System Architectures
Ham Radio Social
for Emerging Wireless Applications
and Technologies for Emerging
8:30 to 10:00 PM
Wireless Applications
Marriott
TU3E: Magnetic Resonance
TU4E: TeraHertz Integrated
Imaging (FS)
Circuits (FS)
Wednesday,
June 14, 2006
WE1A: Planar Filters
with Extended Stopband
WE1B: Acoustic Filters and
Applications
WE1C: Signal Generation
for System Applications
WE1D: Integrated Coaxial and
Metamaterial Transmission Lines
WE1E: Beamforming Arrays
WE1F: Nonlinear Measurementbased Modeling
WE1G: Multi-GHz ICs for
Communication and Instrumentation
WE2A: Multiband and Broadband
Planar Filters
WE2B: Ferrite and Ferroelectric
Devices
WE2C: Low Phase Noise Oscillators
WE2D: Electromagnetic Bandgap
and Synthesized Structures
WE2E: Phased and Retrodirective
Arrays
WE2F: Nonlinear Circuit Analysis
and System Simulation
WE2G: Vibrating MEMs (FS)
Panel Sessions
Dueling Dualities: How to Best Marry
Time-domain System-level
Verification with Frequency-domain
RF Circuit Simulations?
Technology Roadmap
for Wireless Infrastructure
WEIF: INTERACTIVE FORUM 1:30 TO 4:30 PM
WE3A: Miniature Filters and
WE4A: Physical Nonlinear Device
Multiplexers
Modeling
WE3B: GaN for Microwave PA
WE4B: Advances in Power Amplifier
Applications
Devices and Architecture for…
WE3C: Device Technologies for
WE4C: Innovations in Technology
Signal Generation
at HF Through UHF
WE3D: Advances in Integrated
WE4D: Advances in Tunable and
Filters
Metamaterial Filters
WE3E: Advanced Techniques for
WE4E: Organic Millimeter-wave
Wireless Communication
Packaging
WE3F: State-of-the-Art Active
WE4F: Innovative mm/Terahertz
Comp. for Emerging mm-wave App.
Circuit Elements
WE3G: 4 GHz for 4G (FS)
WE4G: 50 Years of Microwaves
in the San Francisco Bay Area (SS)
Industry-hosted
Cocktail Reception
5:45 to 7:15 PM
Marriott
Awards Banquet
7:30 to 10:00 PM
Marriott
Thursday,
June 15, 2006
TH1A: High-Frequency Effects and
Novel Structures
TH1B: High Voltage Power
Amplifiers and Mixers
TH2A: Analysis and Applications of
Guided-wave and Periodic Structures
TH2B: Microwave and Millimeterwave Transceiver and Frequency
Conversion MMICs
TH1C: Solid State High Power
TH2C: Efficiency Enhancement and
Amplifiers
Linearization Technology
TH1D: New Developments in Passive
TH2D: Couplers and Baluns
Components
TH1E: Advances in Wideband
TH2E: Sensors and Sensor Systems
Communication and Radar Systems
TH1F: Microwave CAD with Neural
TH2F: Effective CAD Techniques
Networks and Fuzzy Logic
for Modeling and Design
TH1G: Nonlinear Measurement and
TH2G: Materials Measurement
Component Characterization
Techniques
Panel Session
Delivering Winning Presentations:
A Critical Skill for Engineers
THIF: INTERACTIVE FORUM 1:30 TO 4:30 PM
TH3A: Metamaterials – Theory and
Applications
TH3B: Novel Components and ICs
for Wideband Amplifiers
and Control Circuits
TH3C: Frequency Conversion and
Control Circuits
TH3D: Compact Dividers
and Couplers
TH3E: Biological Effects
and Medical Applications
TH3F: Advanced Linear Modeling
Techniques
TH3G: Novel Approaches
in Packaging Technology
Friday,
June 16, 2006
Registration 7 AM to 9 AM
ARFTG Conference and Exhibition 7 AM to 5 PM – Renaissance Parc 55 Hotel
TFA: Techniques of Frequency Synthesis
TFB: Fundamentals of HF Through UHF Design
TFC: Low Cost Microwave Photonic Component…
TFD: Ferrite Devices for Low Frequency Applications
TFE: Microwave and Millimeter-wave Packaging 101
WFA: High Power Amplifier Reliability and Thermal Issues
WFB: Technology and Applications of Wireless Sensor Network
WFC: New Optical Approaches for Microwave…
WFD: How Accurate are Your THz Measurements
WFE: Advanced Methods for EM Computing
FS: Focused Session
SS: Special Session
TABLE OF CONTENTS
INTERNATIONAL MICROWAVE SYMPOSIUM
General Chairman’s Message
Plenary Sessions
Technical Sessions
Tuesday
Wednesday
Thursday
Panel Sessions
Monday, Tuesday, Wednesday
Thursday
Interactive Forum
Wednesday
Thursday
Special & Focused Sessions
Tuesday
Wednesday
Workshops & Tutorials
Sunday
Monday
Friday
Rump Session
Social Events
RFIC SYMPOSIUM
Chairman’s Message
Plenary Sessions
Technical Sessions
Monday
Tuesday
Interactive Forum
Tuesday
2
2
28
36
46
45
53
6
14
15
76
C3
ARFTG MICROWAVE MEASUREMENT CONFERENCE
Chairman’s Message
6
Technical Sessions
Friday
61
44
52
34
35
For updates and additional information:
17
22
56
53
71
www.ims2006.org
CONTENTS (LISTED ALPHABETICALLY)
Panel Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45, 53
Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Print on Demand Service . . . . . . . . . . . . . . . . . . . . . . . . . .7
Registration Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Registration Information . . . . . . . . . . . . . . . . . . . . . . . . .13
RFIC Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . .6
RFIC Symposium . . . . . . . . . . . . . . . . . . . . . . . . . . . .14, 76
San Francisco Information . . . . . . . . . . . . . . . . . . . . . . .70
Social Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Special Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
Student Paper Competition . . . . . . . . . . . . . . . . . . . . . . .27
Technical Program Chairs’ Message . . . . . . . . . . . . . . . . .3
Technical Program Committee . . . . . . . . . . . . . . . . . . . .68
Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . .28, 36, 46
Tutorials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17, 22, 56
Visa Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17, 23, 58
Additional Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Administrative Committee . . . . . . . . . . . . . . . . . . . . . . . .65
ARFTG Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . .6
ARFTG Microwave Measurement Conference . . . . . . .61
Awards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Exhibition Invitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Exhibitors and Exhibition Hours . . . . . . . . . . . . . . . . . .64
Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Focused Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . .34, 35
Future IMS Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
General Chairman’s Message . . . . . . . . . . . . . . . . . . . . . .2
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Guest Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Historical Exhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Hotel Map and Information . . . . . . . . . . . . . . . . . . . . . . .12
Housing Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
IEEE MTT-S Membership Information . . . . . . . . . . . . . .8
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . .44, 52
Moscone Convention Center . . . . . . . . . . . . . . . . . . . . . .75
1
AN INVITATION TO MICROWAVE WEEK 2006
Welcome to San Francisco and the 2006 IEEE MTT-S International Microwave Symposium. The San Francisco Bay Area,
with Silicon Valley and the many innovative
local RF, microwave & wireless organizations, and as the gateway to the Pacific Rim,
has historically been in the forefront of
technology, hence our theme of “Bridge to
the Future.” During “Microwave Week,”
with the IMS, RFIC and ARFTG conferences, there will be over 1000 technical presentations in the form of plenaries, technical sessions, special/focused sessions,
John Barr poster sessions, panel sessions, and workshops plus a student paper contest and historical exhibits.
These will provide many opportunities to network and interact
Steve Rosenau
Finance Chair
with the leading professionals in the field. Add to all of this the
largest vendor (500+) exhibition in the industry and you’ll have
a busy but a “must-not-miss” week. While you’re here for IMS
2006, Northern California is a wonderful place to visit and the
weather in June is quite pleasant. See the Golden Gate Bridge,
Fisherman’s Wharf, China Town, Golden Gate Park, Coit Tower,
Muir Woods, the Wine Country, the Pacific coast, Alcatraz and
Treasure Islands and take a ride on the SF Cable Cars. These are
just some of many exciting activities you can do on your own or
as a part of our guest program.
Come join us as we create the “Bridge to the Future.”
John Barr
General Chair
2006 International Microwave Symposium
Simon Wood
Symposium Secretary
Steve Brozovich
Local Arrangements Chair
Elsie Cabera
Conference Management
PLENARY SESSIONS
WiMAX and the Future of Mobile Wireless Broadband
Ron Resnick, President and Chairman, WiMAX Forum
The talk will cover the deployment of WiMAX and what WiMAX Forum
is doing to accelerate the adoption of broadband globally. We will also
address the unique opportunity for WiMAX to harness the power of mobility and broadband, and the role of WiMAX in overcoming the Digital
Divide and delivering Personal Broadband WiMAX, 3G and 4G WiMAX.
The talk will conclude with the trends in Europe and Asia and WiMAX
Forum plans for 2006 and beyond.
Nanotechnology: Hype or New Horizons?
Richard White, Professor, University of California at Berkeley
Nanostructures having dimensions below 100 nanometers — 1/1000th
the diameter of a human hair — exhibit exciting new phenomena. A host
of studies show the novel electrical, optical, mechanical, chemical and
biological properties of tiny structures such as nanotubes, nanowires and
quantum dots. Applications range from nanomotors, tiny logic circuits
made with nanotubes, and very high density information storage media,
to commercially available liquid-repellent fabrics. We’ll look at some of
these, as well as possible health concerns raised by such tiny components.
About Ron Resnick
Ron currently serves as President and Chairman
of the WiMAX Forum and is Director of Marketing
in Intel’s Broadband Wireless Division. In June
2002, Ron launched and became General Manager of Intel’s Broadband Wireless Access business
focused on the wireless Metropolitan Area Network (“last mile”) market segment. Ron joined
Intel in April of 2000 here, as Director of New
Business Development for Intel’s Corporate Technology Group, he managed technology commercialization efforts within Intel’s labs. He concurrently served as a staff
member of Intel’s New Business Initiatives, an internal venture fund established to attract and incubate new business efforts internal to Intel.
Before coming to Intel, Resnick served in executive Marketing and
Business Development positions, most recently as VP of Marketing of a
computer peripherals company, ThrustMaster. He is a member of the Association of Corporate Growth and Board member of the Wireless Communications Association. He also served as a pilot in the US Air Force.
He earned a BS in Electrical Engineering from Rutgers University.
About Richard White
Richard M. White is a professor in the electrical
and computer sciences department and a founding co-director of the Berkeley Sensor & Actuator
Center at the University of California at Berkeley.
Dr. White is a member of the National Academy
of Engineering and an IEEE and AAAS Fellow. He
has co-authored three books — a text for freshmen, a book on solar cells and the reference book
“Acoustic Wave Sensors.” He has received numerous awards for his contributions to ultrasonics
from the IEEE and the Ultrasonics, Ferroelectrics, and Frequency Control Society. Dr. White earned a BS, MS and PhD in engineering science
and applied physics from Harvard University.
2
IMS2006 TECHNICAL PROGRAM
On behalf of the Technical Activities Committee, we extend a
warm welcome to the 2006 International Microwave Symposium.
The 230 members of the Technical Program
Committee are delighted to offer you a
wide-ranging technical program which we
hope you will find stimulating. This year
there were 980 submissions. After careful
review, the committee selected 364 papers
for oral presentations, and 137 for the Interactive Forum.
There will be an exceptionally comprehensive program of workshops, organized
Paul Khanna by Edmar Camargo and his team, special
sessions organized by Jay Banwait, and lunchtime panel sessions
organized by Alfy Riddle. There are 42 workshops on Sunday,
Monday and Friday, and five focused sessions and a special session to celebrate “50 Years of Microwaves in the Bay Area.” Panel sessions are on Monday, Tuesday, Wednesday and Thursday
at noon and are open to all registered for the IMS, with lunch
available at an extra charge. A Rump Session, marking the 175th
anniversary of the birth of James Clerk Maxwell, will be held on
Tuesday evening. There have been 22 papers nominated for the
final of the Student Paper Contest this year; the winners will be
announced and presented with their prizes at the Awards Lunch
on Thursday, June 15. We thank Bob Owens and Rick Branner
who organized the competition.
Our thanks go also to Jeff Pond (software), Jon Hacker (paper
management), Tim Lee (server) and Larry Whicker (administration) for their work in managing the paper submission and review process and to
the volunteers of the San Francisco Steering Committee for the arrangements that
make this symposium possible. This exceptional technical program would not be possible without the time and efforts of the
reviewers and, more importantly, the technical papers and workshop material submitted by the professional community.
Roger D. Pollard We hope that you will find Microwave Week
in San Francisco professionally rewarding and technically inspiring as well as thoroughly enjoyable.
APS (Paul) Khanna and Roger D. Pollard
IMS2006 TPC Co-Chairs
IMS2006 PROGRAM GUIDE
IMS2006 PUBLICATIONS
We, the IMS2006 Steering Committee, prepared this program
guide to assist you during your visit to San Francisco, California
for the 2006 IEEE MTT-S Intermational Microwave Symposium. It was our goal to provide you with accurate information on all
the technical and socical program listings
and schedules. However, events and schedules can change, after the printed version
goes to press. Updates and corrections will
be made available in the registration area
during the conference and at the IMS2006
web site (www.ims2006.org) Enjoy your
Ken Wong visit to San Francisco and IMS2006.
Ken Wong and Tom Brinkotter
IMS2006 Publicity Committee
IMS2006 registrants will have a CDROM available with all the
technical session presentations. We are not publishing any
paper copy of the symposium digest. The
CDROM will contain all IMS2006 technical
papers as well as the 67th ARFTG. Instructions for how to order a paper copy of the
digest will be available on-site at the symposium. Additionally, there will be a new look
for the abstract book. Instead of one large
book, 3 pocket-sized daily journals will be
handed out making it easier to carry and
use for efficient navigation of sessions and
Jim Sowers activities. These journals will contain technical session information, brief summaries of the symposium
technical papers for the given day, and other information to enhance your symposium experience. We hope that the availability
of the CDROM and abstract books will help you enjoy the symposium technical sessions.
Jim Sowers, Publications Chair
Michael Thorburn, Publications Vice-Chair
IMS2006 WEBSITE
The Technical Program section of the website provides a complete, electronic version of the technical program for the conference in addition to proposal and workshop information, copies of
the calls for papers and a summary of important deadlines related to the technical program. The Exhibition Details page contains a list of exhibitors, a floor-plan of the IMS2006 exhibition
area and information for those interested in becoming exhibitors. The Social Program provides information about events
and outings to insure you relax and enjoy your time away from
the technical sessions. Finally, the Information for Authors section of the website is home to detailed instructions on preparing
abstracts and final submissions as well as helpful tips on how to
prepare an effective presentation.
As IMS2006 approaches, and during the conference, please
continue to check the website for important updates and the latest conference information. We hope the website helps you prepare for and enjoy IMS2006.
Daniel McCormick
IMS2006 Web Master
The IMS2006 website is located at http://www.ims2006.org. As
in previous years the website provides important information to
conference attendees. On the IMS2006
homepage you will find the latest news related to IMS2006 and direct links to pertinent information. In addition, the homepage
hosts a welcome message from our conference chairman, a list of conference sponsors
and a summary of important dates. The remainder of the website is categorized into
six areas for ease of navigation. The six areas are directly accessible from anywhere
Daniel McCormick on the site via active buttons on the top portion of the website. The general information section lists the
steering committee positions, members and contact information.
The Attendee Information page contains important registration
information and details about the conference venue as well as
links to help you plan your trip, reserve a hotel room, and learn
about the San Francisco Bay Area prior to your visit. There is
also a link to a message group specifically for student attendees.
3
IMS2006 UNIVERSITY LIAISON ACTIVITIES
IMS2006 INTERACTIVE FORUM
This year’s International Microwave Symposium will once
again have up to ten booths in the symposium exhibit hall devoted to publicizing university programs. Universities with regional, national, and international audiences are contacted in early
February to gauge interest in this important
educational outreach activity. Stop by the
booths, talk with the students and faculty,
and view the latest research being done at
these universities. The IMS2006 will have
student volunteers assisting the Steering
Committee during the conference. A numAnh-Vu Pham ber of graduate and undergraduate students
from local universities in the Northern California have been invited to assist the symposium. All of the booths will display interesting information on current projects, and students will staff
them. Spend a few moments chatting with these students. You
will find their youthful enthusiasm bodes well for the future of
the MTT society. Also, starting this IMS 2006, a web site (http://
groups.yahoo.com/group/ims2006students/) has been created to
help students attend the conference and network with IMS attendees.
The Interactive Forum (IF) is the International Microwave
Symposium’s name for what is commonly called a poster session.
The IF provides an opportunity for presenters to engage in discussions with symposium attendees in a lively and personal way
not available from the front of a lecture hall
and this is quite interactive between presenter and attendees. Each IF session will
be organized to present approximately 70
papers each, and an additional special Student Paper session is planned for this year’s
symposium. Every IMS technical specialty
Sushil Kumar will be represented at the IFs. Space will be
provided for all IMS authors to discuss and answer questions on
their papers in a space adjacent to the IF area associated with
their technical interest. All IMS attendees are invited to attend
the IF sessions.
Sushil Kumar
IMS2006 Interactive Forum Chair
SOCIAL EVENTS
STUDENT RECEPTION: All students are invited to attend the
student reception in the Marriot Hotel on Tuesday, June 13 from
6:30 to 9:00 PM. The student reception will be held in conjunction with the Maxwell Rump Session.
Anh-Vu Pham
IMS2006 Student Activities Chair
STUDENT TRAVEL GRANT
All student and early career partcipants are eligible to apply
for travel grants. See http://www.ims2006.org/ims2006_
attendeeinfo.htm for more details.
IMS2006 WORKSHOPS AND TUTORIALS
ments in one of the workshops. This wide range of workshop options should bring significant interest from attendees coming
from industry and academia. The RF integrated circuit workshops are concentrated on Sunday to avoid overlap with the
RFIC conference on Monday and the Measurement workshops
are distributed on Sunday and Monday avoiding conflict with
ARFTG, which takes place on Friday. More details on the workshops are found on the next pages.
The microwave engineers looking into broadening their basic
knowledge spectrum or simply looking for updating their background will find all that in this year’s offering of workshops. It is
42 workshops distributed along the beginning and end of Microwave Week. The range of topics is very broad, covering microwave active and passive components design, emerging new
wireless communication systems, sensors, manufacturing and
semiconductor technologies such as SiGe, CMOS, GaN from HF,
VHF up to TeraHertz frequencies. The highlight this year comes
from a live demonstration of non-linear S-parameter measure-
Edmar Carmargo
Workshops and
Tutorials Chair
Edmar Carmargo
IMS2006 Workshop Chair
Brad Nelson
Sunday Workshops
and Tutorials
Wayne Kennan
Monday Workshops
and Tutorials
4
Toshi Moriuchi
Friday Workshops
and Tutorials
IMS2006 FOCUSED AND SPECIAL SESSIONS
IMS2006 PANEL SESSIONS
This year’s contributions to the focused and special sessions
cover a broad range of topics that promise a number of interesting papers. The focused sessions will highlight the activity at the forefront of Microwave Theory and Techniques in both
hardware development and its application.
The five focused sessions planned for this
year are:
✗ Microwaves in Support of Societal
Security
✗ 4 GHz for Mobile Communications
✗ Magnetic Resonance Imaging
Jay Banwait ✗ Vibrating RF MEMS
✗ THz Integrated Circuits
Our one special session this year will celebrate 50 Years of Microwaves in the San Francisco Bay Area.
Jay Banwait
IMS2006 Special and Focused Session Chair
Our symposium this year will feature 5 lunchtime panel sessions. Two of these are sponsored by RFIC and two are sponsored by IMS2006. Experts from industry
and academia will discuss trends and requirements in various areas.
Monday, June 12, 2006
✗ 4G: Do We Really Need 1 Gbits/s?
Tuesday, June 13, 2006
✗ SoC vs. SiP: Dollars & Sense
Wednesday, June 14, 2006
✗ Dueling Dualities: How to Best Marry
Time-domain System-level Verification
Alfie Riddle
with Frequency-domain RF Circuit
Simulations?
✗ RF PA Technology Roadmap for Wireless Infrastructure
Thursday, June 15, 2006
✗ Delivering Winning Presentations: A Critical Skill for
Engineers
IMS2006 RUMP SESSION
Our symposium this year will feature an evening Rump session on the life of James Clerk Maxwell. James Rautio will talk on
“The Life of James Clerk Maxwell.”
Alfie Riddle
IMS2006 Panel and Rump Session Chair
IMS2006 PAPER SUBMISSIONS
For the second year running we have used an all-volunteer
technical paper handling system to manage the tremendous
number of papers submitted to the symposium. We hope that the consistency in how
papers are submitted and processed from
one year to the next helps to provide a convenient format for the novice author as well
as the experienced veteran. For that reason,
we have tried to keep all of the good aspects from last year while adding some improvements. We have worked hard to make
it as robust and intuitive as possible while
Jon Hacker retaining the flexibility to handle the complexities of the conference with its 32 technical program committees and more than 230 reviewers. This year we received
over 980 paper submissions, with more than half received on the
final day, a true test of the systems stability and robustness.
Without the efforts of a paid team, we have had to rely heavily
on the skilled help of our dedicated IMS volunteers. We are especially thankful to Jeff Pond, the author of the system code,
who has worked hard to integrate our requests for new features
while keeping the system bug free. We are also indebted to Chad
Deckman who built and managed our wireless network for the
TPC meetings, and Tim Lee the MTT Society web master. Hosting the software on the permanent MTT Society web server
makes using the system from year to year straightforward, and
hopefully eliminates the past ritual of changing the submission
and review software every few years. We hope that your experience with the paper submission process was pleasant, and we
look forward to welcoming you to San Francisco.
Jon Hacker
IMS Electronic Paper Manager
2006 EXHIBITION
The exhibition that is part of Microwave Week gives you the
opportunity to visit displays from more than 400 companies
that will be showing the latest products and
services available to our industry. The exhibition will be held in Halls A, B and C on the
lower level of the Moscone Center, adjacent
to the registration area. The Historical Exhibit will be held on the show floor. The exhibition is open from 9:00 AM to 5:00 PM on
Tuesday and Wednesday and from 9:00 AM
to 3:00 PM on Thursday. (Please note that
children under the age of 14 will not be adHarlan Howe, Jr. mitted to the exhibition hall at any time.) I
hope that you will take advantage of this unique opportunity to
visit the largest group of microwave exhibitors at any show in
the world.
Harlan Howe, Jr.
Exhibition Manager
5
MESSAGE FROM THE RFIC CHAIRMAN
Welcome to the 2006 RFIC Symposium! Again this year, the
RFIC Symposium continues to build upon its heritage as one of
the foremost IEEE technical conferences
dedicated to the latest innovations in RFIC
development of wireless and wire line communication ICs with an exciting technical
program. Running in conjunction with the
International Microwave Symposium and
Exhibition, the RFIC Symposium adds to
the excitement of the microwave week with
three days focused exclusively on RFIC
technology and innovation. The symposium
Stefan Heinen begins on Sunday, June 11, with tutorials
and workshops focused on RF technology, design and systems.
The RFIC Plenary Session begins at 5:30 PM on Sunday, June
11, following the workshops. It will be held in the Moscone Convention Center and opens the formal technical program. The
Plenary Session will feature three distinguished speakers from
industry, Mr. Stefan Wolff from Infineon Technologies, Dr. Arogyaswami Paulraj from Beceem Communications and Mr. Kent
Heath from Freescale Semiconductor. These three renowned
guests will share their views on the future direction of wireless
and mobile communications ICs and systems. The RFIC reception begins immediately after the plenary, making Sunday
evening a highlight of both technical activity and social festivities. This highly attended, enjoyable social event allows attendees to meet with old friends, catch up on the latest events and
interact with professionals in the wireless community.
The technical program continues on Monday and Tuesday
with oral paper presentations, panel sessions and an interactive
forum. A Panel Session during lunch on Monday features a distinguished list of panelists discussing the subject “4G: Do We
Really Need 1 Gbits/s?.” On Tuesday, a lunch Panel Session titled, “SoC vs. SiP: Dollars & Sense” includes another distinguished set of panelists discussing this high interest topic. The
interactive forum begins on Tuesday afternoon and is an excellent opportunity for attendees to meet authors and discuss their
presentations in detail. The RFIC Symposium concludes on
Tuesday allowing participants to attend the IMS and ARFTG as
well as plenty of time to visit the exhibit hall.
Stefan Heinen
General Chairman
2006 RFIC Symposium
MESSAGE FROM THE 67TH ARFTG CONFERENCE CHAIRMAN
An important part of all ARFTG Conferences is the opportunity to interact one-on-one with colleagues, experts and vendors
in the RF and microwave test and measurement community. Starting with the continental breakfast in the exhibition area, continuing through the two exhibition/interactive forum sessions and the luncheon, there
will be ample opportunity for discussion
with others facing similar challenges.
Whether your interest is in global manufacturing test or one-of-a-kind metrology measurement, complex system design or simple
Ken Wong circuit modeling, small signal S-parameter
or large-signal non-linear measurements, phase noise or noise
figure, DC or lightwave, frequency domain or time domain, you
will find an interested party and most likely an expert among the
ARFTG Conference attendees.
So, come and join us. You’ll find that the atmosphere is informal, open and friendly.
Ken Wong
67th ARFTG Microwave Measurement Conference Chair
The 67th ARFTG Microwave Measurement Conference will be
held at the Renaissance Parc 55 Hotel on Friday, June 16, 2006,
the anchor event of microwave week. The conference will include technical presentations, an interactive forum, and an exhibition. The conference theme is “Measurements and Design of
High Power Devices and Systems” with papers focusing on:
✗ Measurements and Design and Measurements of High Power
Devices and Systems (< 10 Watts)
✗ High Power Devices On-wafer Characterization and Tests
✗ Nonlinear Measurements
✗ Large-signal Measurements
✗ Other Areas of Automated RF Measurements.
Also, be sure to check for any joint ARFTG/IMS workshops being held. This year ARFTG is co-sponsoring and co-organizing
two workshops: “Practical Methods for Determining the Accuracy of Measurements – A Review of Techniques Both Old and
New” and “High Speed Digital Signal Integrity Workshop.” The
measurement accuracy workshop will present industrial and
metrology laboratory examples of measurement uncertainty
analysis methods and practices. The high speed digital signal integrity workshop will present the latest advances in high speed
digital interconnect design tools and measurement methods, key
technology advances that are critical to high speed computer design.
6
ADDITIONAL MEETINGS (CHECK WWW.IMS2006.ORG FOR UPDATES)
Saturday, June 10
10:00 AM–12:00 PM
1:00 PM–3:00 PM
3:00 PM–5:00 PM
5:00 PM–7:30 PM
7:30 PM–11:30 PM
Sunday, June 11
7:00 AM–9:00 AM
7:00 AM–8:30 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
8:00 AM–5:00 PM
12:00 PM–1:00 PM
12:00 PM–1:00 PM
7:00 PM–9:00 PM
Monday, June 12
7:00 AM–9:00 AM
7:00 AM–8:00 AM
7:00 AM–5:00 PM
12:00 PM–1:00 PM
12:00 PM–1:00 PM
6:00 PM–8:00 PM
Tuesday, June 13 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
12:00 PM–1:30 PM
12:00 PM–2:00 PM
1:30 PM–4:00 PM
1:30 PM–4:00 PM
4:30 PM–8:30 PM
8:00 PM–10:00 PM
8:30 PM–10:00 PM
6:30 PM–9:00 PM
7:00 PM–8:30 PM
Wednesday, June 14 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
12:00 PM–2:00 PM
5:45 PM–7:15 PM
7:30 PM–10:00 PM
Thursday, June 15 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
12:00 PM–2:00 PM
12:00 PM–2:00 PM
Friday, June 16
7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–1:00 PM
12:00 PM–1:00 PM
AdCom Budget Committee
AdCom Long Range Planning
Speakers’ Preparation
AdCom Reception and Dinner
AdCom Meeting
Speakers’ Breakfast
AdCom Breakfast
Workshops Breakfast
AdCom Meeting
AdCom Lunch
Workshops Lunch
RFIC Reception
Workshops Breakfast
Workshops Lunch
TMTT & MWCL Editor’s Luncheon
Microwave Journal Reception
Attendees’ Breakfast
TCC Meeting
2006 RFIC TPC Lunch
Student Paper Competition
Student Paper Competition Judging
Chapter Chairs’ Reception and Meeting
Women in Engineering Reception
Ham Radio Social
Students Reception
Maxwell’s Rump Session
2007 IMS TPC Lunch
Industry–hosted Cocktail Reception
MTT-S Awards Banquet
2006/2007 IMS Steering Committee Lunch
Students Awards Luncheon
Workshops Breakfast
Workshops Lunch
Marriott
Marriott
Moscone
Marriott
Marriott
Moscone
Marriott
Moscone
Moscone
Marriott
Marriott
Moscone
Moscone
Moscone
Moscone
Moscone
Moscone
Marriott
Yerba Buena Gardens
Moscone
Moscone
Moscone
Marriott
Marriott
Moscone
Moscone
Marriott
Marriott
Marriott
Marriott
Marriott
Moscone
Moscone
Moscone
Marriott
Marriott
Marriott
Moscone
Moscone
Moscone
Marriott
Marriott
Moscone
Moscone
Moscone
Moscone
PRINT-ON-DEMAND SERVICE — NEW FOR 2006!!!
IMS2006 is offering a Print-on-Demand (POD) service for its attendees. Although we do not offer a printed digest, attendees may
order copies of specific papers online and have the prints ready
for pickup at the conference. You will be able to access this serv-
ice from the Internet during pre-registration as well as at the conference. The service will be accessible through the IMS2006 website, www.ims2006.org. The Steering Committee hopes that this
new service will add to your symposium experience.
7
2006 IEEE MICROWAVE THEORY AND TECHNIQUES SOCIETY MEMBERSHIP
The IEEE (Eye-triple-E) is a non-profit, technical professional association of more than 380,000 individual members in 150 countries.
The full name is the Institute of Electrical and Electronics Engineers, Inc., although the organization is most popularly known and referred to by the letters I-E-E-E. Through its members, the IEEE is a leading authority in technical areas ranging from computer engineering, biomedical technology and telecommunications, to electric power, aerospace and consumer electronics, among others.
The IEEE Microwave Theory and Techniques Society (MTT-S) is a transnational society with more than 11,000 members and
110 chapters worldwide. Our society promotes the advancement of microwave theory and its applications, usually at frequencies from
200 MHz to 1 THz and beyond. As we enter into an exciting future our mission is to continue to understand and influence microwave
technology.
The benefits of IEEE membership include these offerings:
• Conference registration discounted rates (save $180 on IMS-2006 registration)
• Membership in one or more of 37 IEEE Societies and four Technical Councils
• Subscriptions to online reference materials through IEEE Xplore and IEEE Member Digital Library
• Free IEEE Email Alias including virus scanning and optional spam filtering
• Get the IEEE Financial Advantage – negotiated exclusively for IEEE members
• More than 1,150 student branches at universities worldwide
To Join IEEE or renew your membership, please go to http://www.ieee.org/services/join/
Send email to [email protected], or call 1 (800) 678-IEEE.
IEEE MEMBERSHIP DUES (STANDARD RATES SHOWN, PROVISIONAL RATES AVAILABLE)
Residence
Member
Full Year
Member
Half Year*
Student
Full Year
Student
Half Year*
$156.00
$142.33
$151.85
$130.00
$123.00
$124.00
$78.00
$71.17
$75.93
$65.00
$61.50
$62.00
$30.00
$32.10
$34.15
$25.00
$25.00
$25.00
$15.00
$16.05
$17.08
$12.50
$12.50
$12.50
$114.00
$17.00
$17.00
$14.00
United States
Canada (incl. GST)
Canada (incl. HST)
Africa, Europe, Middle East
Latin America
Asia, Pacific
SOCIETY DUES
Microwave Theory and Techniques
PUBLICATIONS
Microwave (society magazine)
MTT CD-ROM Collection
Microwave and Wireless Components Letters
Transactions on Microwave Theory and Techniques
n/c
$116.00
$116.00
$124.00
n/c
$18.00
$18.00
$112.00
VISA INFORMATION: TEMPORARY VISITORS TO THE US
quired. If more than one person is included in the passport, each person
desiring a visa must make a separate application;
To avoid frustrations and disappointments
• Advance planning by travelers is essential. Review your visa status
and find out if you need a US visa or a visa renewal.
• Plan to submit your visa application well in advance of your departure
date. Contact your nearest US embassy or consulate for a current time
estimate and recommendations.
• Visit the embassy or consular section website where you will apply for
your visa to find out how to schedule an interview appointment, pay fees
and any other instructions. An interview is required as a standard part of
visa processing for most visa applicants.
• Applicants must now also have two index finger-scans collected as
part of the visa application process. These finger-scans are normally collected by the consular officer at the visa interview window, but in some
countries they are collected prior to the visa interview.
Please note that this information is given in good faith, but that the
regulations may change and the only authoritative sources of
information are the US Government websites at http://www.
unitedstatesvisas.gov/ and http://travel.state.gov/visa/visa_1750.html.
The US has updated its visa policies to increase security. It will likely
take you longer to get a visa than it used to, and you will find that a few
new security measures have been put into place. For details that may
apply specifically to your country, see information posted by your nearest US Consulate or Embassy.
Citizens of certain countries, traveling for visitor visa purposes for 90
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Since October 2004, visa waiver travelers from ALL VWP countries
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from the data page. A passport with a validity date at least six months
beyond the applicant’s intended period of stay in the United States is re-
8
Advance Conference Registration
IEEE MTT-S MICROWAVE WEEK EVENTS
June 11–16, 2006 ✦ San Francisco, CA ✦ IMS ✦ RFIC ✦ ARFTG
Each registrant must submit a separate form. A copy may be used.
Registration deadlines: May 5, 2006 for advance fax or mail; May 12, 2006 for advance Website.
30% higher on-site fees apply thereafter.
On-line
www.mtt-sregistration.com
Fax (Credit Card only)
781-769-5037
Do NOT mail hard copy if Faxed
Mail (Check or Credit Card)
MTT-S Registration
685 Canton St.
Norwood, MA 02062
For information or handicap special needs only (phone registration is not available) (781) 769-9750.
NAME
Last
First
AFFILIATION
Company, Etc.
Mail Stop
ADDRESS
Street
City
State/Prov.
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e-mail Address
■ Yes, I would like to receive information by e-mail from IEEE/MTT-S
US/CANADA TEL.
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INT'L TEL.
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No
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*Must be given and valid IEEE card presented at Symposium to qualify for member
discount. An invalid number will void this registration.
Name of Guest
Yes
Yes
No
No
For a complimentary badge for plenary session and exhibits
To register, check ✓ the appropriate boxes and enter corresponding fees in the Remittance column.
ONLY PAID ATTENDEES WILL BE ADMITTED TO THE WORKSHOPS AND TECHNICAL SESSIONS.
WORKSHOPS AND TUTORIALS For paid attendees only.
(SEE BACK OF THIS PAGE FOR TITLES.)
STUDENT/RETIREE/
IEEE MEMBER
NON-MEMBER
LIFE MEMBER
If you are not an IEEE Member and wish to take advantage of IEEE Member
registration rates, you may, before mailing or faxing this form to enter your registration, call IEEE at 800-678-IEEE or go to http://www.ieee.org/services/join/ and
become an IEEE Member.
Full Day
$155
$225
Half Day
$105
$175
ALL Workshop
CD-ROM* $340
$500
(includes one workshop or tutorial–to be selected on-site)
INTERNATIONAL MICROWAVE SYMPOSIUM (Tue., Wed. & Thur.)
(Includes abstract books and exhibits)
All IMS Sessions (with IMS CD ROM)
All IMS Sessions (no IMS CD ROM)
Single-Day Registration (with IMS CD ROM)
Student, Retiree, Life Member (with IMS CD ROM)
RFIC SYMPOSIUM (Mon. & Tue.)
IEEE
MEMBER
$370
$320
$190
$160
NONMEMBER
$550
$490
$270
$120
REMITTANCE
$ _____________
$ _____________
$ _____________
$ _____________
$195
$280
$ _____________
$250
$470
$ _____________
MEMBER
NONMEMBER
$180
$120
$280
$120
SUNDAY
WSA
WSB
WSC
WSD
WSE
WSF
WSG
WSH
WSI
WSJ
WSK
WSL
WSM
WSN
WSO
(Includes exhibits, RFIC Sessions & Reception, RFIC Digest & CD ROM.)
RFIC Reception Only
ARFTG – MICROWAVE MEASUREMENT
CONFERENCE (Fri.)
(Includes exhibits, breakfast, lunch, Digest & ARFTG Exhibition.
Member rates available to ARFTG or IEEE members.)
Student, Retiree, Life Member
ADDITIONAL DIGESTS AND CD ROMS
$ ______________
$ ______________
(For pickup on-site only. After the Symposium, Digests and CD ROMs will be available from the IEEE.)
IMS and ARFTG CD ROM
Qty. ___ @ $150
$100
$ _____________
RFIC Digest
Qty. ___ @ $150
$175
$ _____________
RFIC CD-ROM
Qty. ___ @ $150
$100
$ _____________
$150
$ _____________
ARFTG Digest
Qty. ___ @ $130
$190
$ _____________
ARFTG Archive CD-ROM
Qty. ___ @ $165
ALL PANEL SESSIONS OPEN TO ALL ATTENDEES.
BOX LUNCHES
Monday
Tuesday
Wednesday
Thursday
$20
$20
$20
$20
$ _____________
$ _____________
$ _____________
$ _____________
$75
$ _____________
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Morning)
(Afternoon)
(Afternoon)
(Morning)
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Afternoon)
(Full Day)
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
MONDAY
WMA
WMB
WMC
WMD
WME
WMF
WMG
WMH
WMI
WMJ
WMK
TMA
TMB
TMC
(Full Day)
(Full Day)
(Morning)
(Afternoon)
(Full Day)
(Afternoon)
(Full Day)
(Morning)
(Afternoon)
(Morning)
(Full Day)
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$105
$180
$225
FRIDAY
WFA
WFB
WFC
WFD
WFE
(Full Day)
(Full Day)
(Morning)
(Morning)
(Full Day)
$____
$____
$____
$____
$____
TFA
TFB
TFC
TFD
TFE
(Morning)
(Full Day)
(Morning)
(Morning)
(Morning)
$____
$____
$____
$____
$____
(Full Day) $____
(Full Day) $____
(Afternoon) $____
TSA (Full Day) $____
TSC (Morning) $____
TSD (Full Day) $____
WORKSHOP TOTAL $ ________
Full day and morning workshop or tutorial fees include a CD-ROM of the material for one
workshop, continental breakfast, lunch and refreshment breaks. Afternoon workshop or tutorial
fees include a CD-ROM of the material for one workshop, lunch and afternoon refreshments.
Presenter notes and individual workshop CD-ROMs are available at the workshop.
*(All Workshop CD-ROM, purchased separately) includes material of all workshops and tutorials.
GUEST PROGRAMS
TOTAL
Golf Outing (transportation not included)
____ @$85
$________
NOTE: All workshops and tutorials include box lunches
AWARDS BANQUET (Wed. Eve.)
Qty. ___ @
$160
For all other guest program registration go to:
www.signaturesf.com/ieee
The only acceptable forms of payment are check, money order, MasterCard, VISA or American Express.
Make your check or money order (US $ ONLY on a US Bank or Traveler’s Check) payable to: IEEE/MTT-S
MasterCard
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Card #
Signature__________________________________________
(Signature must accompany credit card payment)
TOTAL REMITTANCE $ _________________
INDIVIDUAL PAYMENT MUST ACCOMPANY FORM
Exp. Date
Written requests for refunds will be honored if received by May 5, 2006.
9
FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2006.ORG
TUTORIALS
Sunday
Monday
Friday
June 16, 2006
Monday
June 12, 2006
Sunday
June 11, 2006
Friday
TSA
TSC
TSD
TMA
TMB
TMC
TFA
TFB
TFC
TFD
TFE
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
WSA
WSB
WSC
WSD
WSE
WSF
WSG
WSH
WSI
WSJ
WSK
WSL
WSM
WSN
WSO
WMA
WMB
WMC
WMD
WME
WMF
WMG
WMH
WMI
WMJ
WMK
WFA
WFB
WFC
WFD
WFE
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–5:00 PM
CMOS RFIC Design – Fundamental Building Blocks
Introduction to UHF RFID: Readers, Tags and ICs
Measurements Basics for Nonlinear HF Components
High Speed Digital Signal Integrity
Practical Methods for Determining the Accuracy of Measurements – A Review of Techniques Both Old and New
Introduction to MEMs Resonators and Filters
Techniques of Frequency Synthesis
Fundamentals of HF Through UHF Design
Low-cost Microwave Photonic Component Technologies to Address Emerging Applications
Ferrite Devices for Low Frequency Applications
Microwave and Millimeter-wave Packaging
TUTWORKSHOPS
Challenges of System Integration in Wireless and Nano-scale ERA
RFICs for Ultra-wideband Systems
Advanced Power Amplifier ICs for High Efficiency Mobile Transmitters
Multi-chip Radio Module (MCRM) Design Methodology and Tools, and Manufacturing Issues for Cellular Appl.
Noise Measurements and Modeling for CMOS
Substrate Effects in Si RFIC Interconnect
Ultra Low Power Transceiver Design
Radio Transceivers for 3G/HSDPA and WiMAX User Equipment: System Architecture and Design Guidelines
Three-dimensional Integration and Packaging
Advances in Multi-mode Multi-band Radio Transceivers
Quality of Automotive RF Systems
Memory Effects in Power Amplifiers
Advances in GaN HEMT Device Technology, Modeling and Applications
New Advances in Oscillator Design
Si Bipolar and CMSO mm-wave ICs – From Processes to Circuit Design and System Architectures
UWB for Wireless Communications, Local Positioning and Sensing
Switching Mode Amplifiers with Applications to Wireless Transmitter Design
Noise in SiGe and III-V HBTs and Circuits: Opportunities and Challenges
Passive and Active Differential Measurements: State-of-the-Art and Applications
Microwave Component Design Using Space Mapping Technology
Active Antennas: Performance and Design
Frequency Agile Radio: Systems and Technologies
High Efficiency Power Amplifiers for Space and Terrestrial Applications
New CMOS Compatible Technologies for Enabling Cost-effective Base Stations in HFR Systems
Electronic Equalization for Multigigabit Communications
Practical RF and Microwave Multiplexer Design
High Power Amplifier Reliability and Thermal Issues
Technology and Applications of Wireless Sensor Network
New Optical Approaches for Microwave, High-speed Signal Transmission
How Accurate are Your THz Measurements?
Advanced Methods for EM Computing
PANEL SESSIONS
Monday
Tuesday
Wednesday
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
Thursday
12:00 PM–1:20 PM
12:00 PM–1:20 PM
4G: Do We Really Need 1 Gbits/s?
SoC vs. SiP: Dollars & Sense
Dueling Dualities: How to Best Marry Time-domain System-level Verification with Frequency-domain
RF Circuit Simulations?
RF PA Technology Roadmap for Wireless Infrastructure
Delivering Winning Presentations: A Critical Skill for Engineers
7:00 PM–7:30 PM
7:30 PM–8:30 PM
Rump Reception
The Life of James Clerk Maxwell
RUMP SESSIONS
Tuesday
SOCIAL EVENTS
Sunday
Monday
Tuesday
Tuesday
Tuesday
Wednesday
Wednesday
7:00 PM–9:00 PM
5:30
–7:30
6:00 PM
PM8:00PM
PM
6:30 PM–9:00 PM
8:00 PM–10:00 PM
8:30 PM–10:00 PM
5:45 PM–7:15 PM
7:30 PM–10:00 PM
RFIC Reception
Microwave Journal Reception
Student Reception
Women in Engineering Reception
Ham Radio Social
Industry Reception
Award Banquet
GUEST PROGRAM
Sunday
Monday
Monday
Monday
Tuesday
Tuesday
Wednesday
Thursday
Friday
12:00 PM–4:00 PM
8:00 AM
10:00 AM–2:00 PM
10:00 AM–2:00 PM
10:00 AM–2:00 PM
10:00 AM–6:00 PM
10:00 AM–2:00 PM
10:00 AM–5:00 PM
7:00 AM–9:00 PM
(check http://www.signaturesf.com/ieee for latest program details)
Muir Woods, Sausalito & Golden Gate Bridge
IMS 06 Golf Outing
Alcatraz, Fisherman’s Wharf & Pier 39
San Francisco City Tour
Walking Tour of Chinatown
Monterey, Carmel & Pebble Beach
Golden Gate Park, Japanese Tea Gardens & New de Young Museum
Wine Country Tour
Yosemite National Park
10
ATTENDEE HOUSING
2006 IEEE MTT-S INT’L
MICROWAVE SYMPOSIUM
ATTENDEE
JUNE 11–16, 2006 • SAN FRANCISCO, CA
MTT-S • ARFTG • RFIC
2006ATIMS
use code
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1s
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SQUARE
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C. Magnin
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3
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PLAZA
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3rd
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on
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Courtesy of
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12
REGISTRATION
REQUIREMENTS
ON-SITE ARFTG REGISTRATION
Registration fees are required of all participants, including
session chairs, authors, and workshop and panel session organizers and speakers.
Late on-site ARFTG registration will be available at the Renaissance Parc 55 Hotel on Friday from 7:00 to 9:00 AM. If at all possible, please preregister earlier in the week to reduce the on-site
workload.
ADVANCE REGISTRATION
ON-SITE REGISTRATION FEES
All registrants who select the IEEE member rates will be
required to produce their current IEEE membership cards
upon check-in at the conference. Registrants who do not
have their current IEEE membership cards at check-in will
be charged non-member rates.
Reduced rates are offered for advance registration when received by May 5, 2006. A registration form is available on page 9
of this program. Each registrant must submit a separate form,
with payment, to the address shown at the bottom of the registration form. If using a credit card, then fax and online registration is available. When mailing, please mail early to ensure receipt by the deadline; otherwise, on-site fees will apply.
Individual remittance must accompany the registration form
and is payable in US dollars only, using personal check drawn
on a US bank, traveler’s check, international money order or
credit card (MasterCard, VISA or American Express). Personal
checks must be encoded at the bottom with the bank number,
account number and check number. Bank drafts, wire transfers
and cash are unacceptable and will be returned. Government or
company purchase orders will not be accepted and will be returned.
IEEE
NonMember Member
Int’l Microwave Symposium
All IMS Sessions
$480
$720
(Includes Exhibits, Abstract Books and IMS CD ROM)
All IMS Sessions
$415
$610
(Includes Exhibits, Abstract Books no IMS CD ROM)
Single Day
$250
$350
Student, Retiree, Life Member
$75
$150
RFIC SYMPOSIUM (Mon. & Tue.)
$250
$360
$60
$80
(Includes Exhibits, RFIC Sessions & Reception,
RFIC Digest and CD ROM)
RFIC Reception Only
ARFTG Conference (Fri.)
(Includes Exhibits, Breakfast, Lunch, Digest and ARFTG Exhibition.
Member rates available to ARFTG or IEEE members.)
ARFTG Conference
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GUEST REGISTRATION
$235
$150
$365
$150
Additional Digests and CD ROMs (on-site pickup only)
To preregister your guest, include his or her name on your
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also will be available.
IMS and ARFTG CD ROM
RFIC Digest
RFIC CD ROM
ARFTG Digest
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STUDENTS, RETIREES AND LIFE MEMBERS
Students, retirees and IEEE Life Members receive a substantial discount on the IMS registration fee. To qualify as a student,
a registrant must be either a student member of IEEE or a fulltime student carrying a course load of at least nine credit hours.
ARFTG also provides discounts for students and retirees.
$65
$75
$65
$60
$65
$25
$130
$90
$130
$85
$90
$25
Awards Banquet (Wed. Evening)
$70
$90
Exhibits Only
$20
$20
Optional Box Lunches
PRESS REGISTRATION
Guest Program (See page 72 or go to
Credentialed press representatives are welcome to register
on-site only at the Exhibitor Counter, without cost and thereby
have access to technical sessions and exhibits. Digests are not
included. The Press Room is located in Room 258.
www.signaturesf.com/ieee for complete information.)
IMS 06 Golf Outing
$95.00
Workshops/
Tutorials
ON-SITE REGISTRATION
IEEE
Member
Full Day
$200
Half Day
$150
All Workshop CD
plus 1 workshop $440
On-site registration for all Microwave Week events will be
available at the Moscone Convention Center. Registration hours
are:
Saturday, June 10 2:00 PM–6:00 PM
Sunday, June 11 7:00 AM–6:00 PM
Monday, June 12 7:00 AM–5:00 PM
Tuesday, June 13 7:00 AM–5:00 PM
Wednesday, June 14 7:00 AM–5:00 PM
Thursday, June 15 7:00 AM–3:00 PM
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REFUND POLICY
Written requests received by May 5, 2006 will be honored.
Refund requests postmarked after this date and on-site
refunds will be granted ONLY if an event is cancelled.
This policy applies to registrations for the symposium sessions,
workshops, tutorials, digests, extra CD-ROMS, panel sessions,
awards banquet and guest programs. Please state the pre-registrant’s name and provide a mailing address for the refund
check; if registration was paid by credit card, refund will be
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requests to: MTT-S Registration, 685 Canton St., Norwood, MA
02062.
ON-SITE WORKSHOP REGISTRATION
On-site registration on Saturday and Sunday is available to
everyone. On-site registration for Friday’s workshops will be
available from 7:00 to 9:00 AM on Friday for those who have not
previously registered.
13
2006 IEEE RADIO FREQUENCY INTEGRATED CIRCUIT
(RFIC) SYMPOSIUM
RFIC STEERING COMMITTEE
Stefan Heinen, General Chair
Luciano Bogoline, TPC Co-Chair
Jenshan Lin, TPC Co-Chair
David Ngo, Digest & CD ROM
Derek Shaeffer, Transactions
Tina Quach, Finance
Jacques C. Rudell, Publicity
Albert Jerng, Invited Papers
Yann Deval, Special Sessions
Albert Wang, Secretary
Lary Kushner, Workshops
Noriharu Suematsu, Student Papers
Takao Inoue, Web Master
Larry Whicker, Conference Coordinator
Rob Shaver, Paper Submissions Chair
On behalf of the Technical Program Committee, welcome to the 2006 IEEE Radio
Frequency Integrated Circuits (RFIC) Symposium. The RFIC Symposium is a leading edge IEEE technical conference dedicated to the advancement of integrated circuits and subsystems for RF, wireless, broadband communications and
many other emerging applications. The RFIC Symposium
will be held in San Francisco, CA, from June 11–13,
2006. The RFIC activities begin on Sunday, June 11 with
workshops and tutorials addressing RF technology, design and integration, at both system and circuit level.
The Plenary Session will be held on Sunday evening,
right after the workshops. Three students will be recognized for their work as part of the best student paper
competition. Then, three leading experts will share their
own views during the Sunday evening plenary session:
Stefan Wolff, Vice President RF-Engines, Infineon TechLuciano Boglione
nologies, will talk about “RF-modems, The Real Application for RF CMOS”; then, Kent Heath, Director, Cellular Operations, Radio Products Division, Freescale Semiconductors, will discuss “Architectural Implications of
Multimode, Multiband Cellular Radios”; finally, Arogyaswami Paulraj, Founder and Chief Technology Officer, Beceem Communications, Professor, Stanford University, will speak about “Multiple Antenna Technology
in Mobile Broadband — New Challenges for RF Designers.” The RFIC reception will follow the plenary session
to allow for everyone to relax and discuss the industry
outlook among friends. The regular technical program
begins on Monday and Tuesday featuring invited and
submitted technical papers. A panel session entitled “4G:
Do We Really Need 1 Gbits/s?” will take place during
lunch on Monday and have panelists from both industry
and academia offer their views on the challenges ahead.
Another panel session on Tuesday, “SoC vs. SiP: Dollars
& Sense,” is posed to allow for many interactive discusJenshan Lin
sions with the audience! The interactive forum on Tuesday afternoon also gives attendees a further opportunity to meet one-on-one with authors. In all, the RFIC
2006 Symposium features 20 technical sessions, an interactive forum, 128 presentations, 13 workshops and tutorials, and 2 panel sessions. The interest in RFIC
technology, and the venue offered by the Symposium to showcase the latest advancements, continues to be the venue of choice for both industry and academia to
meet, discuss results and exchange ideas. The 2006 Technical Program Committee
keeps working diligently toward the goal of strengthening the technical quality and
scope of the program, while maintaining and improving the legacy left by the previous Symposia. This would not be possible without keeping the interest of professionals like you and gaining the trust of all the authors who submitted their work to
the RFIC Symposium.
We hope you enjoy the 2006 RFIC Symposium!
Advisory Board
Fazal Ali, Natalino Camilleri,
Eliot Cohen, Reynold Kagiwada,
Sayfe Kiaei, Mahesh Kumar,
Louis Liu, Steve Lloyd,
Dave Lovelace, Vijay Nair,
Kenneth O
Executive Committee
Natilino Camilleri, Sayfe Kiaei,
Dave Lovelace, Steve Lloyd,
Joseph Staudinger
RFIC TECHNICAL PROGRAM COMMITTEE
Albert Jerng, MIT
Reynold Kagiwada, Northrop Grumman
Space Technology
Sayfe Kiaei, Connection One,
Arizona State University
Bumman Kim, Postech
Kevin Kobayashi, Sirenza Microdevices
Kevin Kornegay, Cornell University
Mahesh Kumar, Lockheed Martin
Larry Kushner, Kenet Inc.
Ting-Ping Liu, Winbond Electronics
(Shanghai)
Louis Liu, Northrop Grumman Corp.
Stephen Lloyd,
Beceem Communications, Inc.
David Lovelace,
PropheSi Technologies Inc.
Kevin McCarthy,
University College Cork
Srenik Mehta,
Atheros Communications
Jyoti Mondal,
Freescale Semiconductor Inc.
Vijay Nair, Intel Corp.
David Ngo, RF Micro Devices Inc.
Dan Nobbe, Peregrine Semiconductor
Allen Podell, Allen Podell
Tina Quach,
Luciano Boglione and Jenshan Lin
Technical Program Committee Co-Chairs
2006 IEEE RFIC Symposium
Sanjay Raman, Virginia Tech
Madhukar Reddy, Maxlinear
Bill Redman-White,
Philips Semiconductors/
Southampton University
Eli Reese, TriQuint Semiconductor
Leonard Reynolds,
RF Micro Devices, Inc
Francis Rotella, Fujitsu Laboratories of
America Inc.
Jacques Rudell, Berkana Wireless Inc.
Derek Shaeffer,
Aspendos Communications Inc.
Marko Sokolich, HRL Laboratories LLC
Joseph Staudinger,
Noriharu Suematsu,
Mitsubishi Electric
Bruce Thompson, Motorola Labs
Freek van Straten,
Philips Semiconductors
Albert Wang,
Illinois Institute of Technology
Huei Wang, National Taiwan University
Patrick Yue,
Carnegie Mellon University
RFIC PLENARY SESSIONS
RF-Modems the Real Application for RF CMOS
Stefan Wolff, Vice President, Infineon Technologies
About Kent Heath:
Over the last decade wireless connectivity has become an integral and essential part of our life. The
plain mobile phone of the early nineties has evolved in mobile multimedia terminal. Consumers are demanding cell phones providing a comprehensive set of advanced features enabling voice, data and video
services. Handset manufacturers have to accommodate their products to fast changing market requirements. The semiconductor supplier has to provide a cost effective and flexible platform, which enables
the handset manufacturers to differentiate their products quickly and still maintain a low development
effort.
The vast majority of today’s cell phones require at least a multiband radio. In the near future multimode
multiband 2G and 3G operation will be a part of the main stream products including wireless LAN, Bluetooth®, GPS and DVB-H as well. Infineon Technologies has focussed its RF expertise on providing the next
wave of highly integrated, high performance and easy to use RF CMOS radio subsystems. Infineon Technologies demonstrates the maturity of RF CMOS with respect to RF performance by producing for .g. a six-band
WCDMA/UMTS transceiver. The RF CMOS capability enabled the world’s first single chip cell phone: EGoldRadio. RF-modems will be the next leap in the integration level. These RF-SoCs will simplify the handset development process by separating the radio hardware as well as the protocol stack from the application layer.
Kent Heath is the director of cellular operations for Freescale’s Radio Products Division. He joined Freescale Semiconductor in March of 2004 as director of the Analog Cellular IC business unit and was division strategy manager for the Radio Products Division based in Tempe, Arizona. He has responsibility for power management and user interface ICs, RF transceivers, power amplifiers, RF subsystems and
DVB-H components targeted for the cellular handset market. Prior to joining
Freescale, Kent was at Skyworks Semiconductor as senior director of strategy and
business development for the RF Solutions Division from 2000–04, as director of
Motorola Semiconductor’s Wireless Subscriber Systems Group (WSSG) in Japan
from 1997–2000 and at other engineering management positions at Xerox, Genisco Technology, and LectroMagnetics Inc., before going to work for Motorola in 1991. Kent is a BSEE and MBA graduate from
Southern Methodist University in Dallas. He has been a member of Semiconductor Industry Association
in Japan (SIAJ), the Society of Mechanical Engineers (SME), and has been an active member of the Institute of Electrical and Electronic Engineers (IEEE) for over 20 years.
Multiple Antenna Technology in Mobile Broadband — New Challenges for RF Designers
Arogyaswami Paulraj, Founder and Chief Technology Officer, Beceem Communications
About Stefan Wolff:
Stefan Wolff is Vice President of Infineon Technologies overseeing the company’s
Cellular RF Engine business unit. Since the early nineties he has been involved in
RF IC business. After his studies he started his career at Robert Bosch Group as an
RF Engineer for Mobile Phones. Later he joined Siemens Semiconductor, where he
was responsible for the marketing of RF ICs. Prior to joining Infineon Technologies,
Mr. Wolff was heading the San Diego RF Design Centre of Siemens Mobile Phones.
Architectural Implications of Multimode, Multiband Cellular Radios
Kent Heath, Director, Radio Products Division, Freescale Semiconductors
With the industry trending toward high levels of integration and multiple radio technologies in a single RF lineup, Mr. Heath will present how the industry is addressing these issues. Combinations of System-on-Chip(SoC)- and System-in-Package(SiP)-level integration may be employed to meet the accelerating cost and size reduction needs of OEMs and carriers.
In the RF realm there are proponents of various technological approaches to these industry challenges. Different groups favor various approaches ranging from elaborate III-V technologies to SiGebased methodologies, BiCMOS nodes and RFCMOS-based solutions. Some of these technologies are being
proposed as single-chip solutions while many are leaning toward combinational approaches using various
platforms for SiP-level integration. Mr. Heath will address the various approaches available and the potential implications to the mobile communications industry.
Multiple antenna wireless has emerged as a key technology that significantly improves coverage and
throughput. Multiple input–multiple output (MIMO) is a configuration that uses multiple antennas at
both ends of the link. This talk focuses on MIMO in mobile broadband. We begin with a survey of mobile
broadband applications, markets and standards with special reference to multiple antenna technology.
We describe the typical design of a next generation mobile broadband system that uses MIMO-OFDMA
and highlight design areas that are impacted by MIMO. We then quantify the performance enhancement
offered by multiple antennas in mobile broadband. Finally, we discuss RF design challenges related to
multiple antennas at both terminals and base stations. We address mutual coupling and its impact of RF
performance, transmit-receive RF calibration necessary for the transmitter to learn the channel, RF power drain and power management by controlling the number of active RF chains, and PAPR reduction. We
end with a survey of emerging multiple antenna RF products.
About Arogyaswami Paulraj
Dr. Arogyaswami Paulraj is a founder and Chief Technology Officer for Beceem
Communications. He is also a Professor at the Dept. of Elect. Engineering, Stanford
University, where he supervises the Smart Antennas Research Group. This group
works on applications of space-time wireless communications and has developed
many key fundamentals in this new field as well as helped shape a worldwide research and development focus onto this technology. Paulraj has won several awards
for his engineering and research contributions. Most recently he was awarded the
IEEE SP Society Technical Achievement Award 2003. He is the author of over 300
research papers, a textbook on wireless communications and holds 24 patents.
Paulraj is a Fellow of the IEEE and a Member of the Indian National Academy of Engineering.
14
2006 RFIC TECHNICAL PROGRAM — MONDAY, JUNE 12, 2006
RMO1A Cellular ICs I – Moscone 307–310
Chair: F. Ali, Qualcomm • Co-chair: D. Belot, ST Microelectronics
8:00 AM: RMO1A-1: Student Paper: Tri-mode Integrated Receiver for GPS, GSM 1800 and
WCDMA
N. Darbanian, S. Farahani, Freescale Semiconductor Inc.; S. Kiaei, B. Bakkaloglu, Arizona
State University; M.H. Smith, Amalfi Semiconductor Inc.
8:20 AM: RMO1A-2: A Low Power Low Noise Figure GPS/GALILEO Front-End for Handheld
Applications in a 0.35 μm SiGe Process
R. Berenguer, J. Mendizabal, U. Alvarado, D. Valderas, Centro de Estudios e Investigaciones
de Gipuzcoa (CEIT); A. García-Alonso, TECNUN – University of Navarra
8:40 AM: RMO1A-3: A WCDMA, GSM/GPRS/EDGE Receiver Front End without Interstage
SAW Filter
N. Yanduru, S. Bhagavatheeswaran, C.-C. Chen, F. Dulger, S.J. Fang, D. Griffith, Y.-C. Ho,
K. Mun, Low Radio Design, Wireless Terminal Business Unit, Texas Instruments, Dallas, TX
9:00 AM: RMO1A-4: A 1-to-4 Channel Receiver for WCDMA Base Station Applications
T. Tikka, J. Mustola, V. Saari, J. Ryynanen, M. Hotti, K. Halonen, Electronic Circuit Design
Laboratory, Helsinki University of Technology; J. Jussila, Nokia Research Center
9:20 AM: RMO1A-5: Evolution of a Software-Defined Radio Receiver’s RF Front-End
A.A. Abidi, University of California, Los Angeles
RMO1B Frequency Generation – Moscone 305
Chair: T.-P. Liu, Winbond Electronics – China
Co-chair: S. Dow, ON Semiconductor
8:00 AM: RMO1B-1: Taming Electrical Solitons: A New Direction in Picosecond Electronics
D.S. Ricketts, X. Li, D. Ham Harvard University, Cambridge, MA
8:20 AM: RMO1B-2: A 5 GHz Above-IC FBAR Low Phase Noise Balanced Oscillator
M. Aissi, E. Tournier, R. Plana, LAAS-CNRS; M.-A, Dubois, CESM; C. Billard, CEA-LETI
8:40 AM: RMO1B-3: A 17 dBm 64 GHz Voltage Controlled Oscillator with Power Amplifier in
a 0.13 μm SiGe BiCMOS Technology
B. Welch, U. Pfeiffer, IBM Thomas J. Watson Research Center
9:00 AM: RMO1B-4: Student Paper: Differential VCO and Passive Frequency Doubler in 0.18
μm CMOS for 24 GHz Applications
D. Ozis, N.M. Neihart, D.J. Allstot, University of Washington, Seattle, WA
9:20 AM: RMO1B-5: Student Paper: A 2.4 GHz Sub-mW Frequency Source with
Current-Reused Frequency Multiplier
T. Song, H.-S. Oh, S. Hong, Korea Advanced Institute of Science and Technology (KAIST);
E. Yoon, University of Minnesota
RMO1C UWB LNAs – Moscone 306
Chair: A. Jerng, MIT • Co-chair: K. Ashby, Microtune
8:00 AM: RMO1C-1: Student Paper: A 1.2 V Reactive-Feedback 3.1–10.6 GHz Ultrawideband
Low Noise Amplifier in 0.13 μm CMOS
M.T. Reiha, J.R. Long, Delft University of Technology; J.J. Pekarik, IBM Microelectronics
8:20 AM: RMO1C-2: Student Paper: A 1.8-3.1 dB Noise Figure (3-10 GHz) SiGe HBT LNA for
UWB Applications
Y. Lu, R. Krithivasan, W.-M.L. Kuo, J.D. Cressler, School of Electrical and Computer
Engineering, Georgia Institute of Technology
8:40 AM: RMO1C-3: Student Paper: A CMOS 3.1–10.6 GHz UWB LNA Employing
Stagger-compensated Series Peaking
S. Shekhar, D.J. Allstot, University of Washington, Seattle; X. Li, Qualcomm Inc.
9:00 AM: RMO1C-4: Student Paper: 3~11 GHz CMOS UWB LNA Using Dual Feedback for
Broadband Matching
C.T. Fu, C.N. Kuo, National Chiao-Tung University, Hsinchu, Taiwan
9:20 AM: RMO1C-5: A SiGe Low-Noise Amplifier for 3.1–10.6 GHz Ultra-Wideband Wireless
Receivers
B. Shi, Y.W. Chia, Institute for Infocomm Research
RMO1D RFIC Technology – Moscone 304
Chair: E. Reese, Triquint Semiconductor • Co-chair: A. Gupta, Anadigics
8:00 AM: RMO1D-1: DC/DC Converter Controlled Power Amplifier Module for WCDMA
Applications
J. Lee, E. Spears, RF Micro Devices, Phoenix, AZ; J. Potts, RF Micro Devices, Greensboro, NC
8:20 AM: RMO1D-2: Student Paper: Coupling Effects of Dual SiGe Power Amplifiers for
802.11n MIMO Applications
W.-C. Hua, P.-T. Lin, C.-P. Lin, C.-Y. Lin, H.-L. Chang, C.W. Liu, National Taiwan University,
Taipei, Taiwan; T.-Y. Yang, G.-K. Ma, Industrial Technology Research Institute, Hsinchu,
Taiwan
8:40 AM: RMO1D-3: Student Paper: Integrated Transformer Baluns for RF Low Noise and
Power Amplifiers
H. Gan, S.S. Wong, Stanford University
9:00 AM: RMO1D-4: RF Components with High Reliability and Low Loss by Partial Trench
Isolation of SOI-CMOS Technology
A. Furukawa, T. Ohnakado, Y. Kagawa, K. Shintani, K. Nishikawa, S. Yamakawa, M. Takeda,
Mitsubishi Electric Corp.; Y. Hirano, T. Ikeda, T. Ipposhi, S. Maegawa, H.Arima, Renesas
Technology Corp.
9:20 AM: RMO1D-5: Silicon Full Integrated LNA, Filter and Antenna System Beyond 40 GHz
for MMW Wireless Communication Links in Advanced CMOS
S. Montusclat, F. Gianesello, D. Gloria, STMicroelectronics, FTM Crolles R&D, Q-TPS Lab
RMO2A WLAN & MIMO – Moscone 307–310
Chair: S. Meta, Atheros Communications
Co-chair: G. Chang, Maxlinear Inc.
10:10 AM: RMO2A-1: A Fully-Integrated Dual-Band MIMO Transceiver IC
P-B. Leong, S.W. Son, M. Tsai, L. Tse, Marvell Semiconductor
10:30 AM: RMO2A-2: A Low-power Full-band 802.11abg CMOS Transceiver with On-chip PA
S.C. Yen, Y.Y. Lin, T.M. Chen, Y.M. Chiu, B.I. Chang, K.U. Chan, Y.H. Lin, M.C. Huang,
J.Z. Huang, C.H. Lu, W.S. Wang, C.S. Hu, C.C. Lee, Realtek Semiconductor Corp.
10:50 AM: RMO2A-3: Student Paper: An Area-Efficient 5 GHz Multiple Receiver RFIC for
MIMO WLAN Applications
L. Khuon, C.G. Sodini, Massachusetts Institute of Technology
11:10 AM: RMO2A-4: A Compact High Rejection 2.4 GHz WLAN Front-End Module Enables
Multi-Radio Co-existence Up to 2.17 GHz
C.-W.P. Huang, W. Vaillancourt, A. Parolin, C. Zelley, Z. Gu, SiGe Semiconductor
11:30 AM: RMO2A-5: MBOA/WiMedia UWB Transceiver Design in 0.13 μm CMOS
C. Sandner, S. Derksen, D. Draxelmayr, S. Ek, S. Marsili, D. Matveev, K. Mertens,
M. Punzenberger, C. Reindl, R. Salerno, A. Wiesbauer, Z. Zhang, Infineon Austria; V. Filimon,
H. Paule, M. Tiebout, Infineon Germany; G. Leach, I. Winter, Riverbeck, UK
RMO2B VCOs and Dividers – Moscone 305
Chair: D. Nobbe, Peregrine Semiconductor • Co-chair: Y. Deval, IXL Lab
10:10 AM: RMO2B-1: VCO Phase Noise and Sideband Spurs due to Substrate Noise Generated
by On-chip Digital Circuits
M.A. Méndez, J.F. Osorio, D. Mateo, X. Aragonés, J.L. González, Electronic Engineering
Department, Universitat Politècnica de Catalunya, Barcelona, Spain
10:30 AM: RMO2B-2: Student Paper: AM-FM Conversion by the Active Devices in
MOS LC-VCOs and its Effect on the Optimal Amplitude
B. Soltanian, P. Kinget, Columbia University in the City of New York
10:50 AM: RMO2B-3: Fully-Integrated Multi-Standard VCOs with Switched LC Tank and
Power Controlled by Body Voltage in 130 nm CMOS/SOI
L.Geynet, E. De Foucauld, P. Vincent, EA-Leti, Grenoble Cedex 9, France; G. Jacquemod,
LEAT, Valbonne, France
11:10 AM: RMO2B-4: Student Paper: A 5 GHz CMOS Low Phase Noise Transformer Power
Combining VCO
P. Lai, S.I. Long, University of California at Santa Barbara
11:30 AM: RMO2B-5: Student Paper: A Double-Balanced Injection-Locked Frequency
Divider for Tunable Dual-Phase Signal Generation
L. Zhang, H. Wu, Department of Electrical and Computer Engineering, University of
Rochester, Rochester, NY
RMO2C Next Generation LNAs – Moscone 306
Chair: B. Floyd, IBM Research
Co-chair: L. Reynolds, RF Micro Devices
10:10 AM: RMO2C-1: 31–34 GHz Low Noise Amplifier with On-chip Microstrip Lines and
Inter-stage Matching in 90 nm Baseline CMOS
M.A.T. Sanduleanu, Philips Research Eindhoven; G. Zhang, J.R. Long, Electronics Research
Laboratory/Delft University of Technology
10:30 AM: RMO2C-2: Student Paper: 60 GHz PA and LNA in 90 nm RF-CMOS
T. Yao, M. Gordon, K. Yau, S.P. Voinigescu, University of Toronto; M.T. Yang, TSMC
10:50 AM: RMO2C-3: Student Paper: A 800 μmW 26 GHz CMOS Tuned Amplifier
Y. Su, K.K. O, Silicon Microwave Integrated Circuits and Systems Research Group, Dept. of
E.C.E, University of Florida
11:10 AM: RMO2C-4: A 27.7 dBm OIP3 SiGe HBT Cascode LNA Using IM3 Cancellation
Technique
S. Ock, S. Hong, S. Han, Future Communications IC Inc.; J. Lee, McKinsey & Company
11:30 AM: RMO2C-5: A Wideband Noise-Canceling CMOS LNA Exploiting a Transformer
S.C. Blaakmeer, E.A.M. Klumperink, B. Nauta, University of Twente, IC-Design Group, The
Netherlands; D.M.W. Leenaerts, Philips Research Laboratories, The Netherlands
RMO2D WLAN Power Amplifiers – Moscone 304
Chair: T. Quach, Freescale Semiconductor
Co-chair: N. Suematsu, Mitsubishi Electric
10:10 AM: RMO2D-1: Student Paper: A Fully-Integrated +23 dBm CMOS Triple Cascode
Linear Power Amplifier with Inner-Parallel Power Control Scheme
C-K. Kim, H-S. Oh, Korea Advanced Institute of Science and Technology (KAIST); C-S. Kim,
H-K. Yu, Electronics and Telecommunications Research Institute (ETRI)
10:30 AM: RMO2D-2: Student Paper: A Dynamic Supply CMOS RF Power Amplifier for 2.4
GHz and 5.2 GHz Frequency Bands
P. Augusto, D. Fabbro, C. Meinen, M. Kayal, Electronics Laboratory (LEG), EPFL, Lausanne,
Switzerland; K. Kobayashi, Y. Watanabe, Fujitsu Laboratories Ltd., Kawasaki, Japan
10:50 AM: RMO2D-3: Impedance Optimization of Linearizer to Suppress Intermodulation
Distortion in 2.45 GHz SiGe WLAN Power Amplifier
J.H. Kim, K.Y. Kim, S.H. Won, J.J. Lee, S.T. Kim, C.S. Park, Information and Communications
University; Y.H. Park, Y.K. Jung, Samsung Electro-Mechanics Co., Ltd.
11:10 AM: RMO2D-4: Fully Integrated Doherty Power Amplifiers for 5 GHz Wireless-LANs
D. Yu, B. Kim, Pohang University of Science and Technology (Postech)
11:30 AM: RMO2D-5: Student Paper: A 5.8 GHz, 47% Efficiency, Linear Outphase Power
Amplifier with Fully Integrated Power Combiner
A. Pham, C.G. Sodini, Microsystems Technology Laboratory, MIT, Cambridge, MA
15
2006 RFIC TECHNICAL PROGRAM — MONDAY, JUNE 12, 2006
RMO3A Cellular ICs II – Moscone 307–310
Chair: J.P. Mondal, Freescale Semiconductor • Co-chair: A. Hanke, Infineon
1:20 PM: RMO3A-1: A Single-chip 0.13 μm CMOS UMTS W-CDMA Multi-band Transceiver
R. Koller, D. Pimingsdorfer, Danube Integrated Circuit Engineering (DICE) GmbH, Linz,
Austria; T. Ruehlicke, B. Adler, Infineon Technologies AG, Munich, Germany
1:40 PM: RMO3A-2: A Low Voltage (1.8 V) Operation Triple Band WCDMA Transceiver IC
H. Tomiyama, C. Nishi, N. Ozawa, Y. Kamikubo, H. Honda, H. Fujita, Y. Kondo, H. Iizuka,
T. Takahashi, System LSI Business Group, Semiconductor Business Unit, Sony Corp.
2:00 PM: RMO3A-3: Fully Integrated CMOS GPS Receiver for System-on-Chip Solutions
C. Grewing, B. Bokinge, W. Einerman, A. Emericks, D. Theil, S. van Waasen, Infineon
Technologies Sweden AB, Design Center Stockholm
2:20 PM: RMO3A-4: High Performance Crest Factor Reduction Processor for W-CDMA and
OFDM Applications
A. Wegener, Texas Instruments
2:40 PM: RMO3A-5: GSM/GPRS Single-Chip in 130 nm CMOS: Challenges on RF for SoC
Integration
D. Seippel, M. Hammes, A. Hanke, J. Kissing, Infineon Technologies
RMO3B PLLs and Synthesizers – Moscone 305
Chair: B. Bakkalogu, Arizona State Univ. • Co-chair: S. Raman, Virginia Tech
1:20 PM: RMO3B-1: A Low-Power FSK Modulator using Fractional-N Synthesizer for Wireless
Sensor Network Application
D.L. Yan, T.H. Teo, B. Zhao, Y.B. Choi, W.G. Yeoh, Institute of Microelectronics, Singapore
1:40 PM: RMO3B-2: A –85 dBc Reference Spur Quadratude 1–2.5 GHz Dual-path Sampled
Loop Filter CMOS PLL with sub-1° rms Phase Noise
A. Maxim, M. Gheorghe, Crystal Semiconductor Inc.
2:00 PM: RMO3B-3: Student Paper: A Low Power Bandpass Sigma-Delta Modulator
Injection Locked Synthesizer
H.H. Chung, U. Lyles, T. Copani, B. Bakkaloglu, S. Kiaei, Connection One, Arizona State
University, Goldwater Center, Tempe, Arizona
2:20 PM: RMO3B-4: Student Paper: A Carrier Frequency Generator for Multi-Band UWB
Radios
C. Mishra, A. Valdes-Garcia, E. Sánchez-Sinencio, J. Silva-Martinez, Analog and Mixed Signal
Center, Electrical and Computer Engineering Department, Texas A&M University, College
Station, TX.
2:40 PM: RMO3B-5: A Dual Band Quad Mode Frequency Synthesizer
W.-Z. Chen, D.-Y. Yu, National Chiao-Tung University
RMO3C Silicon-based Millimeter-wave Front Ends – Moscone 306
Chair: G. Boeck, TU Berlin • Co-chair: R. Kagiwada, Northrop Grumman
1:20 PM: RMO3C-1: CMOS Transceivers for the 60 GHz Band
B. Razavi, UCLA
1:40 PM: RMO3C-2: Student Paper: A Highly Linear SiGe Double-Balanced Mixer for 77
GHz Automotive Radar Applications
B. Dehlink, S. Trotta, A.L. Scholtz, Technical University of Vienna; H.-P. Forstner, H. Knapp,
K. Aufinger, T.F. Meister, J. Boeck, Infineon AG; H.-D. Wohlmuth, now with Frequentis GmbH
2:00 PM: RMO3C-3: A 28 GHz Sub-harmonic Mixer Using LO Doubler in 0.18 μm CMOS
Technology
T.-Y. Yang, H.-K. Chiou, National Central University, Jhongli, Taiwan, R.O.C.
2:20 PM: RMO3C-4: Student Paper: A Compact 35–65 GHz Up-conversion Mixer with
Integrated Broadband Transformers in 0.18 μm SiGe BiCMOS Technology
P.-C. Huang, R.-C. Liu, J.-H. Tsai, H.-Y. Chang, H. Wang Department of Electrical Engineering
and Graduate Institute of Communication Engineering; J. Yeh, C.-Y. Lee, J. Chern, Taiwan
Semiconductor Manufacturing Co.
2:40 PM: RMO3C-5: 1 to 20 GHz CMOS Distributed Mixer using Asymmetric Coplanar Strip
Transmission Lines
N. Garg, Frontier Silicon Limited, Cambridge, UK; L.B. Lok, I.D. Robertson, Institute of
Microwaves and Photonics, University of Leeds, UK; M. Chongcheawchamnan, A. Worapishet,
Mahanakorn University of Technology, Bangkok, Thailand
RMO3D Passive Components and Matching Advances – Moscone 304
Chair: J. Staudinger, Freescale Semic. • Co-chair: F. Rotella, Fujitsu Lab
1:20 PM: RMO3D-1: Student Paper: An Analytical Approach to Parameter Extraction for
On-Chip Spiral Inductors with Double-p Equivalent Circuit
J.X. Lu, F.Y. Huang, Y.S. Chi, Southeast University
1:40 PM: RMO3D-2: High Coupling Transformer in CMOS Technology
H.-M. Hsu, M.-M. Hsieh, C.-W. Tseng, K.-X. Huang, Department of Electrical Engineering,
National Chung-Hsing University, Taichung, Taiwan, R.O.C
2:00 PM: RMO3D-3: Student Paper: Characterization of Si-Based Monolithic Transformers
with Patterned Ground Shield
O. El-Gharniti, E. Kerhervé, J. B. Bégueret, IXL Laboratory at Talence, France
2:20 PM: RMO3D-4: Design of Coplaner Waveguide On-chip Impedance-Matching Circuit for
Wireless Reciever Front-End
R.K. Pokharel, H. Kanaya, F. Koga, Z. Arima, S. Kim, Y. Yoshida, Department of Electronics,
Faculty of Information Science and Electrical Engineering, Kyushu University
2:40 PM: RMO3D-5: Novel 3 Port Characterisation and De-embedding for High Performance
On-Silicon Ka-Band Balun
J.A. O’Sullivan, K.G. McCarthy, P.J. Murphy, Department of Electrical and Electronic
Engineering, University College Cork, Cork, Ireland
RMO4A Wireless Remote Sensing & RFID – Moscone 307-310
Chair: N. Camilleri, Alien Technology • Co-chair: S. Lloyd, Beceem Comm.
3:30 PM: RMO4A-1: A Fully Integrated 2.4 GHz CMOS RF Transceiver for IEEE 802.15.4
I-J. Kwon, Y-S. Eo, K-D. Choi, H-B. Lee, Samsung Advanced Institute of Technology, Yongin-si,
Korea; S-S. Song, K-R. Lee, KAIST, Daejeon, Korea
3:50 PM: RMO4A-2: Student Paper: An Energy Efficient OOK Transceiver for Wireless
Sensor Networks
D.C. Daly, A.P. Chandrakasan, Massachusetts Institute of Technology
4:10 PM: RMO4A-3: Student Paper: A 8.0 mW 1 Mbps ASK Transmitter for Wireless Capsule
Endoscope Applications
H. Shuguang, C. Baoyong, W. Zhihua, Department of Electronic Engineering, Tsinghua
University, Beijing, China
4:30 PM: RMO4A-4: A 2.45 GHz RFID Tag with On-Chip Antenna
W.G. Yeoh, Y.B. Choi, L.H. Guo, A.P. Popov, K.Y. Tham, B. Zhao, X. Chen, Institute of
Microelectronics, Singapore
4:50 PM: RMO4A-5: Design of Multistage Rectifiers with Low-Cost Impedance Matching for
Passive RFID Tags
R. Barnett, J. Liu, University of Texas at Dallas; S. Lazar, Texas Instruments
RMO4B UWB Transcever ICs - Moscone 305
Chair: C. Rudell, Intel • Co-chair: A. Wang, Illinois Institute of Technology
3:30 PM: RMO4B-1: A 0.18 μm CMOS Receiver for 3.1 to 10.6 GHz MB-OFDM UWB
Communication Systems
Y.-H. Chen, C.-W. Wang, C.-F. Lee, J.-L. Liu, T.-Y. Yang, G.-K. Ma, Industrial Technology
Research Institute; C.-F. Liao, C.-F. Liang, S.-I. Liu, National Taiwan University
3:50 PM: RMO4B-2: A Fully Integrated 3-band OFDM UWB Transceiver in 0.25 μm SiGe
BiCMOS
J. Bergervoet, H. Kundur, D.M.W. Leenaerts, R.C.H. van de Beek, R. Roovers, G. van der
Weide, Philips Research, Eindhoven, the Netherlands; H. Waite, S. Aggarwal, Philips
Semiconductors, San Jose, CA
4:10 PM: RMO4B-3: A Novel Low Power UWB Transmitter IC
G.D. Lime, Y. Zheng, W.G. Yeoh, Institute of Microelectronics in Singapore; Y. Lian, G.D. Lim,
National University of Singapore in Singapore
4:30 PM: RMO4B-4: Student Paper: A Schottky Barrier Diode Ultra-Wideband Amplitude
Modulation (AM) Detector in Foundry CMOS Technology
S. Sankaran, K.K. O, SIMICS, Dept. of Electrical and Computer Engineering, Univ. of Florida
4:50 PM: RMO4B-5: An Analog Correlator with Dynamic Bias Control for Pulse Based UWB
Receiver in 0.18 μm CMOS Technology
S. Dan, S.R. Karri, K. Wong, F. Lin, X. Chen, Institute of Microelectronics, Singapore
RMO4C CMOS Front-Ends – Moscone 306
Chair: W.Y. Ali-Ahmad, American Univ. of Beirut • Co-chair: F. Henkel, IMST
3:30 PM: RMO4C-1: Fully Integrated Receiver Front-Ends for Cell-Phones in Deep-Submicron
CMOS
F. Svelto, Dipartimento di Elettronica, Università degli Studi di Pavia
3:50 PM: RMO4C-2: Student Paper: A Low-Noise 40 GS/s Continuous-Time Bandpass ADC
Centered at 2 GHz
T. Chalvatzis, S.P. Voinigescu, The Edward S. Rogers Sr. Department of Electrical and
Computer Engineering, University of Toronto
4:10 PM: RMO4C-3: Student Paper: A Novel IP2 Calibration Method for Low-Voltage
Downconversion Mixers
K. Dufrene, R. Weigel, University of Erlangen-Nuremberg, Institute for Elect. Engineering
4:30 PM: RMO4C-4: Student Paper: A 2.4 GHz Sub-mW CMOS Current-Reused Receiver
Front-End for Wireless Sensor Network
T. Song, H.-S. Oh, S. Hong, Korea Advanced Institute of Science and Technology (KAIST);
E. Yoon, University of Minnesota
4:50 PM: RMO4C-5: A Transformer-based 1.8–1.9 GHz Low-IF Receiver for 1 V in 0.13 μm
CMOS
C. Hermann, H. Klar, Technical University of Berlin; C. Muenker, Infineon Technologies AG
RMO4D Avanced Noise Characterization and Modeling – Moscone 304
Chair: Y. Cheng, Siliconinx Inc. • Co-chair: L. Liu, Northrop Grumman Corp.
3:30 PM: RMO4D-1: Student Paper: An Analytical Method to Determine MOSFET’s High
Frequency Noise Parameters from 50 Ohm Noise Figure Measurements
S. Asgaran, M.J. Deen, C-H. Chen, McMaster University, Department of Electrical and
Computer Engineering
3:50 PM: RMO4D-2: Reverse Noise Measurement and Use in Device Characterization
J. Randa, D.K. Walker, National Institute of Standards and Technology; T. McKay, J. Tao,
G.A. Rezvani, RF Micro Devices; S. Sweeney, L. Wagner, D. Greenberg, IBM
4:10 PM: RMO4D-3: 65 nm 160 GHz RF n-MOSFET Intrinsic Noise Extraction and Modeling
using Lossy Substrate De-embedding Method
J.C. Guo, Y.M. Lin, Department of Electronics Engineering, National Chiao-Tung University
4:30 PM: RMO4D-4: A 0.18 μm Dual-Gate CMOS Model for the Design of 2.4 GHz Low Noise
Amplifier
K.-H. Liang, Y.-J. Chan, Department of Electrical Engineering, National Central University,
Taiwan R.O.C.
4:50 PM: RMO4D-5: Student Paper: Power Supply Rejection for Common-source Linear RF
Amplifiers: Theory and Measurements
J.T. Stauth, S.R. Sanders, Department of Electrical Engineering and Computer Science,
University of California, Berkeley
[Tuesday Sessions continued on page 76]
16
_________________________________________________________________________________________________
SUNDAY TUTORIALS
This tutorial will start with an overall introduction into radio frequency
identification. After a bit of history, we will introduce the key architectural choices
of active vs. passive tags, and low, high, or ultra-high frequency operation, and the
resulting tradeoffs. We will then focus on UHF passive tags, providing an overview
of the EPCglobal communications protocols and estimates of link budgets and
range. With this background, the second talk will discuss reader radio architecture
and chip design issues, including modulation approaches, phase noise limitations
and dynamic range requirements for homodyne architectures, and listen-before-talk
alternatives. The third talk will provide a discussion of the corresponding issues for
tag IC design, and we will finish with an overview of the peculiar problems
encountered in fabricating antennas for passive tags.
These tutorials are targeted for people who are new to microwave design or new to
specific technical areas. Each starts with basics to help you “impedance match” into
the topic and help you understand papers on these topics later in Microwave Week.
TSA: CMOS RFIC DESIGN – FUNDAMENTAL BUILDING BLOCKS
Date and Time:
Location:
Sunday, June 11; 8:00 AM–5:00 PM
Moscone Convention Center, 103
Topics and Speakers:
xCMOS Low Noise Amplifiers and Mixers, John Long, Delft University of
Technology
xDesign of CMOS Down-Conversion Mixers, Francesco Svelto, University of
Pavia, Italy
xFrequency Synthesizers, Michael Perrott, Broadcom Inc.
xReceiver Architectures, Hooman Darabi, Broadcom Inc.
xPolar CMOS Transmitters, John Groe, Sequoia Comm.
xScaling CMOS to Microwave and mm-Wave Frequencies, Ali Niknejad, UC
Berkeley
Organizers:
Yann Deval, University of Bordeaux, IXLlab
Sayfe Kiaei, Arizona State University
Bertan Bakkaloglu, Arizona State University, Connection
One
Sponsors:
MTT-23 RFIC
TSD: MEASUREMENTS BASICS FOR NONLINEAR HF COMPONENTS
Date and Time:
Location:
Speakers and Topics:
xDescribe the Non-linearity, Alain Barel and Yves Rolain, ELEC, Vrije
Universiteit Brussel
xLinearization Techniques, Ludwig De Locht, IMEC
x S-parameters and Beyond, Doug Rytting
xBeyond Port Match, Gary Simpson, Maury Microwave
xLarge Signal Analyzer Techniques, Frans Verbeyst, NMDG Engineering
BVBA
This workshop will focus on the development of RF CMOS Circuits for multi-GHz
wireless applications. The workshop will focus on the design of fundamental building
blocks encountered in RF transceivers including multi-mode receivers, receiver and
transmitter blocks. Advantages and drawbacks of CMOS RF technologies are discussed.
With the recent advances in sub-micron CMOS RF technologies, MOS transistors are
capable of operating at RF and micro-wave frequencies of several GHz. RF CMOS offer
several potential advantages relative to other technologies in terms of power, size, cost,
and ease of manufacturing. However, there are constraints in RF CMOS in terms of
noise, self gain, passive integration, isolation, etc.
Date and Time: Sunday June 11; 8:00 AM–12:00 PM
Location: Moscone Convention Center, 306
xIntroduction to RFID, Daniel M. Dobkin, Enigmatics
xReader Architectures and Integrated RFID Reader Design, Michael O’Neal,
WJ Communications
xUHF Passive Tag IC Design, Roger Stewart, AWID
xUHF Passive Tag Antenna Design, Daniel Deavours, University of Kansas
Daniel M. Dobkin, Enigmatics
Sponsors:
MTT-20 Wireless Communications
Organizers:
Yves Rolain, ELEC, Vrije Universiteit Brussel
Marc Vanden Bossche, NMDG Eng. BVBA
Sponsors:
MTT-11 Microwave Measurements IMS2006
Do you sometimes feel like a stranger in a nonlinear world? That the nonlinear
behaviorof components and systems is too complicated to understand? Are you hesitant
to get involved in nonlinear measurements? If the answer is yes, then this tutorial will put
you on track, not only by explaining the pros and cons of known techniques, but also by
showing the potential of some new techniques living amongst academic researchers. As
such, based on simple cases and backed up by live demos, this tutorial wants to bridge the
gap between the scientific community and the practicing engineer. The workshop takes
you on a journey in a 3D world, moving along each of its axes: from linear to nonlinear,
from static to dynamic, from matched to mismatched. Indeed, during the last years, there
is an increasing need in the RF and microwave community to do a better job in
measuring, modeling and testing the nonlinear behavior of devices and systems. As a
result, the scientific community has moved forward in a quest for more complete and
accurate models based on ditto measurements. This workshop reaches a helping hand to
the practicing engineer to bridge the chasm between what is possible and what is applied
at the workbench. Topics to be discussed: A bouquet of definitions: linear, nonlinear,
static, pseudo-static, memory effects, Established figures of merit, such as 1 dB
compression, TOI, AM/AM–AM/PM. A static matched view on a dynamic mismatched
world, S-parameter measurements as the unified and complete figure of merit for linear
HF dynamic systems, Newer types of instruments as vehicle to travel from linear to
nonlinear, from static to dynamic, from matched to mismatched, The bumpy road
“beyond S-parameters”: scattering functions, nonlinear time series and a plethora of
linearization techniques, from different tastes of hot S-parameters to a best linear
approximation under realistic excitation conditions, Applying linear design techniques in
a nonlinear, dynamic and mismatched environment. All concepts are backed up by live
demos
on
amplifiers
and
mixers.
TSC: INTRODUCTION TO UHF RFID: READERS, TAGS AND ICS
Organizer:
_________________________________________________________________________________________________
SUNDAY WORKSHOPS
_________________________________________________________________________________________________
WSA: CHALLENGES OF SYSTEM INTEGRATION IN WIRELESS AND
NANO-SCALE ERA
Organizers:
Date and Time: Sunday, June 11, 8:00 AM–5:00 PM
Location: Moscone Convention Center, 301
xFoundry Solutions for RF SoC Design, Albert Yen, UMC
xEDA Challenges for RF SoC Design, Scott Wedge, Synopsys
xRF/Analog Mixed Signal SoC Simulation Challenges and Solutions,
Charles Gore, Mentor Graphics
xRadios for Next Generation Wireless Networks, Reza Rofougaran,
Broadcom
xElectrical Signal Integrity Analysis in Mixed-Signal and RF ICs,
François Clement, CWS
xPower Performance Exploration For a Low Rate Pulsed UWB Receiver,
G. Gielen, KUL
xDesign Flow for Mixed Signal SoC and SiP Integration,
François Lemery, STM
xA 60 GHz Wireless SoC in CMOS, Luiz M Franca Neto, Intel
Yuhua Cheng, Siliconlinx Inc.
Didier Belot, ST Microelectronics
Jean Baptiste Begueret, IXL Laboratory
Sponsor: MTT-23 RFIC
17
As the semiconductor industry continually drives our life into 21st century with increased
productivity and improved convenience throughout the economy, the IC industry is
heavily investing in developing a technology platform for RF system integration in nanoscale and wireless era, in order to support the significantly increased demand for
compact, low cost, and low power wireless products. Because both design and
manufacturing technologies become much more complex in the nano-scale and RF world
for RF system implementation, the challenges in designing and manufacturing chips with
higher yields become much bigger than ever. These changes bring a new way of thinking
in design and manufacturing. With a lot of fundamentals to be understood and a lot of
technical barriers to be overcome, this workshop will bring the experts from foundries,
EDA vendors and design companies to review the technology trends, challenges and
opportunities in the development of an advanced platform technology for system
implementation. A lot of details in advanced process technologies, device modeling,
EDA design tools, design methodologies, system architecture and integration, packaging
and testing will be addressed. The outcome will be greatly beneficial to the RF IC
designers and technology platform developers in both industry and universities.
SUNDAY
SUNDAY WORKSHOPS
WSB: RFICS FOR ULTRA-WIDEBAND SYSTEMS
Date and Time: Sunday, June 11; 8:00 AM–5:00 PM
Location:
Moscone Convention Center, 202/210
✗ Low Noise Receivers, Domine Leenaerts, Philips Res.
✗ Transmitter/Pulse Generator Circuits, Cam Ngyuen,
Texas A&M
✗ Frequency Synthesizers for High Data UWB Systems,
Edgar Sanchez-Sinencio, Texas A&M
✗ Distributed Circuits, Payam Heydari, UC Irvine
✗ RFICs for Position Location/RFID, Robert Wiegel,
Tech. University Erlangen
✗ UWB Radar Sensor chipsets, Ian Gresham, M/A-COM
✗ UWB High-speed Personal Area Network System Standards
and RFIC Design Implications, Roberto Aiello, Staccato
Organizers:
Sanjay Raman, Virginia Tech., Electrical
and Computer Engineering
A. Wang, Illinois Institute of Technology
Sponsors:
MTT-23 RFIC
WSD: MULTI-CHIP RADIO MODULE (MCRM) DESIGN
METHODOLOGY AND TOOLS AND MANUFACTURING ISSUES
FOR CELLULAR APPLICATIONS
Location:
✗ A Comprehensive Wireless Design Flow Enabling Design
Productivity, J. Hartung, R.A. Mullen, Cadence
✗ Wireless System Simulation Using Agilent EDA Tools,
Chris Mueth, Agilent Technologies
✗ Wireless Module Design: Multi-medium Concurrent
Engineering of System, Circuit and Layout Using the AWR
Design Environment, M. Heimlich, AWR
✗ Electromagnetic Simulation of Passive Components for RF
Module Design Using Ansoft Simulation Tools Integrated to
Layout, Matt Commens, Ansoft
✗ Precision Electromagnetic Analysis in a Multi-Chip
Environment, Jim Rautio, Sonnet
✗ Successful Simulation Approaches for RF Module Design –
Leveraging EM, SI, RF, SPICE and AMS Technologies in the
Flow, Scott W. Wedge, Synopsys
✗ RF Module Design Methodology and Flow – Conception to
Production, Checks and Balances, Jyoti Mondal, Morgan
Fitzgibbon, Dermott Okeefe, Dan Saunders and
Curt Hufford, Freescale Semiconductors
✗ Design and Verification for RF Systems Methodology, Flow
and Simulation, Martin Barnasconi, Jan Niehof, Philips
✗ SiP Module Assembly for Cellular Application, Jaesun An,
Jongho Han, ASE-Kr
✗ Challenge and Methodology for Cellular Applications,
System and IC Co-Design, Kyutae Lim, Georgia Institute
of Technology
✗ RF Module Assembly and Technology Integration,
Eric Gongora, Stats Chippac
✗ Surface Finish and Maintaining 3 Sigma Design Tolerances
on Critical Parameters for High Yield Radio Module
Fabrication, Eric Lao, Unimicron
✗ Critical RF Module Assembly Rules, David Bolognia,
AMKOR
Organizers:
Jyoti Prakash Mondal, Freescale
Jan Niehof, Philips Research Lab
Didier Belot, ST Microelectronics
Sponsors:
MTT-23 RFIC
This workshop will focus on RFIC design and implementations for Ultra-wideband
system applications, such as high-speed personal area networks, sensor networks,
RFID, radar systems, etc. Topics will include low-noise receivers, transmitters/pulsegenerators, distributed circuits, baseband/signal-processing circuits, and system level
issues for proposed UWB standards and other applications such as RFID and radar sensors. Particular attention will be focused on silicon-based IC implementations, and
progress towards single-chip solutions. Attendees will be exposed to current issues facing RF/mixed-signal IC designers in the UWB space, and state-of-the-art IC implementations of UWB transmit, receive and back-end functions.
WSC: ADVANCED POWER AMPLIFIER ICS
HIGH EFFICIENCY MOBILE TRANSMITTERS
Location:
Moscone Convention Center, 202/210 252/260
FOR
Topics and Speakers
✗ Market Trends and Key Specifications of Cellular
Transmitters, Eddie Spears and David Ngo, RFMD
✗ Market Trends and Key Specifications of Cellular, WLAN
and WiMAX Transmitters, Ken Weller, Skyworks
✗ Polar Transmitter ICs for GSM/EDGE, Joe Staudinger,
Freescale; Tirdad Sowlati, Skyworks; Alex Hietala,
RFMD
✗ Amplifier ICs Using Analog Pre-distortion, Steve Kenney,
Georgia Tech.
✗ Doherty and Vector Summing PA Techniques,
Bob Stengel, Motorola
✗ PA Supply Modulation ICs, Larry Larson, UCSD
✗ Issues in Applying Digital Pre-distortion to Cellular Handset
PAs, Claudio Rey, Freescale
✗ CMOS-based PAs, Ichiro Aoki and Scott Kee,
Axiom Microdevices Inc.
Organizers:
N. Camilleri, Alien Technology
J. Staudinger, Freescale
Sponsors:
MTT-23 RFIC
MultiChip Radio Modules (MCRM) are becoming omnipresent parts in any handset
for wireless and cellular applications. MCRM operates mostly in mixed signal environments and serves multiple functions. For example, an MCRM with DIGRF interface not
only has transceiver function, it does the necessary control functions for power amplifier module as well as provides digital interface for the base band module. It saves space
on board and lowers component counts. To customers, it is equivalent to lower cost and
smaller size for cellular handsets. Presently three main modules (MCRM, PA and Base
Band) cover all the necessary electrical functions in a cellular handset. Future MCRMs
are likely to integrate more functions like PA. Designing low cost MCRM in ever shrinking size poses formidable challenges. Material properties and process tolerances need
to be well defined. Keeping proper electrical isolation between various signals becomes
quite messy. Tools to predict various coupling mechanisms need to be accurate. On top
of it the modules need to be mechanically robust and RoHS compliant under various
stress conditions. This also adds further constraint to the size and electrical performance of the module. This workshop will be divided into two sessions. The morning session will present a comprehensive tool set that is currently available to design MCRM.
Goal is top system level module simulation with various chips inside. Not all the available tools will be discussed due to time constraint. Audience is welcome to discuss
more. The afternoon session will have presentations from module design community,
module substrate vendors, manufacturers and assembly houses; that will address various technology options (wire bond and flip chip), signal isolation issues, material properties, IC-substrate interface etc. Objective is to address the main issues and solutions
for designing MCRMs, starting from design tools, SiP, SoC verification, design methodology to finished MCRM product. It is a vast topic. This workshop will capture at least
some of the main challenges and proposed solutions.
Advancements in wireless transmitters have continued to focus on improving transmitter efficiency, at acceptable levels of linearity, while driving down both hardware
cost and size. In addition, more spectrally efficient modulation techniques are being
adopted to support the ever growing demands for high-speed data centric services. As
such, it becomes ever more difficult to efficiently and cost-effectively amplify and transmit signals with wider instantaneous bandwidths and higher peak-to-average power ratios. This workshop will be both tutorial and advanced in nature. To begin, an overview
of key transmitter requirements and specifications for a number of existing and emerging wireless systems will be reviewed. Secondly, a number of presentations will focus on
some of the innovative developments occurring at the integrated circuit, system, and
device technology levels. These include both stand-alone power amplifiers ICs, as well
as more integrated transmitter architectures, and linearization systems. Selected examples will be presented for cellular and wireless data applications. Lastly, the intriguing possibility of implementing CMOS based power amplifiers will be examined.
WSE: NOISE MEASUREMENTS AND MODELING FOR CMOS
Location:
18
✗ Noise Parameter Characterization Techniques for CMOS
Devices, Ali Boudiaf, Maury Microwave
✗ On-Wafer Noise-Parameter Measurement and Uncertainty
Analysis at NIST, James Randa, NIST
✗ Alternative Parameter Sets and Insights into MOS Thermal
Noise Behavior, Thomas McKay and G. Ali Rezvani,
RF Micro Devices
✗ The Evolving Understanding of Noise Physics in Scaled
Technologies and the Implications for Device Modeling and
Data Interpretation, David Greenberg, IBM
✗ Modeling of RF Noise in MOSFETS with Industry Standard
Models, James Victory, Jazz Semiconductor
✗ Modeling of Noise in Three Terminal Microwave Devices
(FETs, HBTs) as Applied to CMOS Devices, Marian
Pospieszalski, National Radio Astronomy Observatory
✗ RF Noise Characterization and Modeling of Deep-submicron
CMOS, A.J. Scholten, Philips Research Laboratories
Eindhoven
✗ RF Noise Modeling of MOSFETs Including Gate Current
Effects, M. Jamal Deen, McMaster University
Organizers:
Jim Randa, NIST
Tom McKay, RF Micro Devices
Sponsors:
MTT-14 Microwave Low-Noise Techniques
MTT-11 Microwave Measurements
MTT-23 RFIC
✗ Ultra Low-Power Radio Design for Wireless Sensor Networks,
Christian C. Enz, Swiss Federal Institute of Technology
✗ Low Power Frequency Synthesizers Architectures,
Franck Badets, ST-Microelectronics
✗ Ultra-Low Power ZIGBEE Transceivers, Shahin Farahani,
Freescale Inc.
✗ Low Power Ultra-wideband Transceivers,
Hossien Hashemi, University of Southern California
✗ Low Power Transmit Architectures, Bertan Bakkaloglu,
Shahin Talei, Sayfe Kiaei, Connection One
Organizers:
Sayfe Kiaei, Arizona State University
Yann Deval, University of Bordeaux, IXLlab
Sponsors:
MTT-23 RFIC
This workshop will address design and development of ultra-low power transceiver
systems. The workshop will focus on several key low power systems and will examine
the tradeoffs among these transceiver: Wirenet, ZIGBEE, and Ultra-Wide Band Transceivers. The market of low power, low data rate RF sensors and RF networks is growing
fast. These networks require ultra low power transceivers and the battery life is critical
in these systems. The workshop will address design methodologies and advanced technologies dedicated to the design of low power transceivers, based on practical examples, for the attendees to be able to develop their own products at the end.
WSH: RADIO TRANSCEIVERS FOR 3G/HSDPA AND WIMAX
USER EQUIPMENT: SYSTEM ARCHITECTURE AND DESIGN
GUIDELINES
Date and Time: Sunday, June 11; 1:00 PM–5:00 PM
Location:
✗ 802.16e WiMAX Key System and Circuit Design Issues,
S. Lloyd and L. Jalloul, Beceem Communications Inc.
✗ 3G/HSDPA Radio Transceiver Chipset: Design Issues and
Challenges, A. Bellaouar, Sirific Wireless Corp.
✗ RF System Issues and RF Impairments Compensation in
WiMAX Radios, D. Schmidt, Intel Co.
✗ PA Linearization Techniques and Design Issues for WiMAX
OFDM-based Applications, D. Kimball, UC San Diego
✗ RF System Issues and RF Impairments Compensation in
3G/HSDPA Radios, W. Ali-Ahmad, AUB/MAXIM Int. Prod.
Organizers:
W. Ali-Ahmad, AUB/MAXIM Integrated Prod.
Sponsors:
MTT-23 RFIC
CMOS technology, driven by a 30 years trend of increasing functionality of digital integrated circuits, continues to gain favor for an increasing range of low-noise radio-frequency applications. At the same time, noise figure continues to decrease with transistor gate length, challenging our ability to measure and extract intrinsic parameters.
Moreover, future devices may bring into play new physical effects with unforeseen impact, increasing the need for characterization methods relying on few assumptions,
valid at the specific frequencies of interest. This workshop will cover the current status
and challenges in the measurement and modeling of the noise properties of CMOS devices, particularly at frequencies in the low microwave range. We will review present
noise-parameter measurement methods, their capabilities, and their limitations for
CMOS transistors. The modeling implications of measurement data will be discussed,
along with possible new directions in relating noise measurements to models. Different
approaches to the modeling of the noise properties of these devices will be presented,
as will methods for the extraction of model parameters from measurement data. It is
hoped that the workshop will stimulate and provide a basis for further improvements in
the measurement and modeling of noise in CMOS devices, particularly at frequencies
around 1–10 GHz.
WSF: SUBSTRATE EFFECTS IN SI RFIC INTERCONNECT
Location:
✗ Physical Considerations in Modeling Interconnect Near
Silicon Substrate, J. Dunn, Applied Wave Research
✗ Modeling of Interconnects and Spiral Inductors in Silicon
RFICs, A. Weisshaar, Oregon State University
✗ Simulation and Modeling Strategies in a Silicon World,
B. Brim, Ansoft Corp.
✗ Simulation and Modeling of Substrate Coupling, M. Steer,
North Carolina State University
✗ RF CMOS Design – Living with the Substrate, D. Allstot,
University of Washington
Organizer:
J. Dunn, Applied Wave Research
Sponsors:
MTT-23 RFIC
As we move into the era of merged fixed and mobile wireless broadband networks,
two standards are competing to service that huge market: 3GPP/HSDPA and WiMAX
802.16d/e. Many established and start-up companies are already working on developing
radio chipsets and user equipment to handle the future market demand for mobile
wireless broadband systems. These wideband and mobile systems impose tough performance requirements on the radio in order to maintain a high Quality-of-Service (QoS).
This half-day workshop will present and discuss the different radio chipset architectures, key system issues, and circuit design challenges, related to the design of 3G/HSDPA and WiMAX radio transceiver chipsets. In addition, the workshop will stress on the
importance of use of baseband DSP compensation of RF system impairments in these
future broadband applications.
WSI: THREE-DIMENSIONAL INTEGRATION AND PACKAGING
Location:
✗ Compact and High Density Hermetic Modules for
Microwave and Millimeter Wave Applications, A. Pham,
University of California
✗ Packaging and Transitions for Intelligent RF Microsystems,
Katherine Herrick, Raytheon Co.
✗ Emerging Technologies for Low Temperature Cofired
Ceramics, William Chappell, Purdue University
✗ Wafer-Scale Packaged RF-MEMS Switches,
Jeremy Muldavin, Lincoln Labs
✗ 3D Packaging Technologies for Gigabit/s Millimeter-wave
Radio, Stephane Pinel, Georgia Institute of Technology
Organizers:
Linda B. Katehi, Purdue University
Joy Laskar, Georgia Institute of Technology
Silicon RFIC technology normally requires that there be a lossy silicon substrate.
Substrate effects make it more difficult to develop accurate passive component and interconnect models. The substrate creates a number of problems for the designer: eddy
current losses, coupling between digital and analog blocks, poorly defined signal path
return and ground. In this workshop, we will examine how substrate issues are being
addressed by CAD support modeling experts and high speed IC design engineers. Time
is allocated for attendees to share their own insights and experiences.
WSG: ULTRA LOW POWER TRANSCEIVER DESIGN
Location:
19
SUNDAY
SUNDAY WORKSHOPS
Sponsors:
xDevelopment Quality of Automotive RF Systems (Radar),
A. Jenkins, M/A-COM-Tyco Electronics
xDevelopment Quality of Automotive RF Systems (Communication),
Maja Sliskovic, Harman Becker
xEvaluation of GPS Receivers, Jade Morton, Miami Univ.
xTest antennas and beam forming, Carsten Metz, Lucent
xQuality Protection of Infotainment Systems in the Automotive Industry,
J.-F. Luy, Daimler Chrysler
xMobile GSM Tests, Matthias Weber, Willtek
xHighly Reproducible Car Antenna Measurements Under Production
Conditions, A. Gruhle, Daimler Chrysler
xDielectric Properties of Car Body Parts, U Siart, P. Russer, Technical
University Munich
MTT-21 RF MEMS
MTT-12 Microwave and Millimeter-wave
Packaging and Manufacturing
This workshop will review the major advanced packaging process technologies
emerging for MEMS and RF/mm-W electronics and the issues that effect cost and
performances for those technologies. Technologies such as LTCC, HDI, thin film and
emerging approaches such as LCP organic laminates and molding will be explained and
reviewed. LCP has recently been used to develop low-cost microwave/millimeter wave
hermetic shield air-cavity packages for electronics, optoelectronics, and MEMS. The
advantages of 3D integration will be illustrated through examples where it enables real
estate saving, performances enhancement, cost reduction. In addition, the integration of
embedded passive components within the package structure has become a primary area of
interest because of its potential to integrate multiple functions (including the antenna) at
no additional cost. A special emphasis will be made on how these packages can be
optimized up to the millimeter-wave frequencies and can replace bulky and expensive
existing techniques. A multi-functional system with a wide range of operating
frequencies requires high- Q passive components and interconnects which allow for high
performance; including low noise, reduced coupling and reduced out-of-band
interference. In addition to high performance, advanced system applications require light
weight and low-cost. On-wafer three-dimensional packaging and integration, as well as
embedded high-Q passives, have the potential to provide high-density with highperformance, a combination that could not achieved in the past using traditional
technologies. This workshop will address novel approaches to three dimensional
integration and packaging of circuits that include RF MEMS in addition to other
components.
WSJ: ADVANCES IN MULTI-MODE MULTI-BAND RADIO
TRANSCEIVERS
xSystem Requirements for Multi-mode Multi-band Transceivers, E.
Niehenke, Niehenke Consulting
xSemiconductor Technology Considerations for Implementing RFIC
Transceivers, T. O’Connell, IBM Systems and Technology Group
xIs Direct Conversion the Answer?, E. Nash, Analog Devices
xAll-Digital Frequency Synthesizer-based Transmitter and Direct
Sampling Receiver for Mobile Phones, B. Staszewski, Texas Instruments
xMulti-Standard RFIC Transmitter Technology, L. Larson, UCSD Center
for Wireless Communications
x Challenges in Future Multiradio Transmitters, E. Järvinen, Nokia Corp.
xSoftware Radio Receiver Design, R. Hinkling, TechnoConcepts Inc.
xDiversity Receivers for Multi-mode Handsets, K. Sahota, P. Gudem,
Qualcomm Inc.
xMulti-Mode Polar Transmitters, John Groe, Sequoia Communications
Organizers:
E. Niehenke, Niehenke Consulting
U. Dhaliwal, ST Microelectronics Inc.
S. Heinen, RWTH Aachen University
Sponsors:
MTT-6 Microwave and Millimeter-Wave IC’s
MTT-23 RFIC
J.-F. Luy, Daimler Chrysler,
Ian Gresham, Tyco Electronics
Sponsors:
MTT-9 Digital Signal Processing
Automotive applications have become an important area for RF technologies. Cars
are equipped with wireless communication systems, navigation and information systems
and keyless-go technologies. Far-range radar systems have been on the market for several
years and the past few months have seen the first 24 GHz radar systems commercially
available in cars. The specific operating conditions of RF systems in cars require
increased efforts in the diagnosis and analysis of these systems during development,
production and service. We will also discuss data fusion and redundancy (between
multiple sensors and sensor technologies); signal processing and target
detection/tracking; and intended operational applications e.g. reverse aid vs. blind-spot
vs. Stop and Go - all of which require different levels/measures of quality. Special
attention has to be paid to quality monitoring of these systems during their integration in
the vehicles. Therefore this workshop addresses the measurement and analysis techniques
of automotive RF systems during their development and during their integration in the
vehicles. Speakers from industry and university cover these aspects.
___________________________________________________________________
Date and Time:
Location:
Organizers:
___________________________________________________________________
WSL: MEMORY EFFECTS IN POWER AMPLIFIERS
Date and Time:
Location:
xPower Amplifier Memory Origins and Impact on Intermodulation
Distortion, Nuno Borges Carvalho, Jose Carlos Pedro, Universidade de
Aveiro
xMeasurement and Quantification of Power Amplifier Memory Effects,
Steve Kenney, Georgia Inst. of Tech.
xMeasurement Identification of Memory Effects, Kate Remley, National
Institute of Standards and Technology
xWaveform and Memory Effect Evaluation, Paul Draxler and Peter
Asbeck, QUALCOMM Inc. and UC San Diego
xModeling and Measurement of Nonlinear Memory Effects in Wireless
Communication Systems, Kevin Gard, Michael Steer and Khaled
Gharaibeh, N. Carolina State Univ.
xNonlinear Behavioural Models with Memory: Formulation, Identification
and Implementation, David E. Root, David Sharrit and Jan Verspecht,
Agilent Technologies
xIntegral Modeling of Multiple-time Scale Dynamics in Power Amplifiers,
Edouard Ngoya, Arnaud Soury, Christophe Maziere, Jean Michel
Nebus, IRCOM-UMR and Xpedion Design Systems Inc.
xVolterra Series-based RF Power Amplifier Behavioural Modeling,
Anding Zhu and Thomas J. Brazil, University College Dublin
xModeling of Memory Effects from Large-signal Measurements, D.
Schreurs, Katholic University Leuven
There is a gradual evolution toward integration of multifunction, multistandards in
radio transceivers for wireless communications. Minimizing part count and cost is
paramount. There are planned future services and evolved products, which contain both
Cellular Communication and Wireless Connectivity features with Global and Nomadic
roaming for voice and data. This workshop will first address the key requirements for
each system. The suitability of the different transmitter and receiver types will be
considered for the various systems highlighting their strong and weak points. Techniques
to generate an all-digital transmitter frequency synthesizer, as well digital receiver
reception will be reported. The goal is to find common transceiver architectures that are
flexible whilst meeting the requirements of such systems. Recent advances in
semiconductors, transceiver architecture, and state-of-the-art designs will be presented.
Performance of each design will be highlighted with techniques to overcome their
possible weak points.
___________________________________________________________________
Organizers:
N.B. Carvalho, Universidade de Aveiro,
K.A. Remley, National Institute of Standards and Tech
D. Schreurs, Katholic University Leuven
Sponsors:
MTT-1 Computer-Aided Design
WSK: QUALITY OF AUTOMOTIVE RF SYSTEMS
The nonlinearity of microwave power amplifiers is a drawback for wireless system
engineers, since it can degrade the overall communication path. In order to overcome that
problem, RF engineers often utilize linearization schemes. If the power amplifier exhibits
a low-frequency change in its response, then the degradation of the linearization scheme
may become a serious problem. Methods to characterize these so-called long-term
memory effects-both through measurement and simulation and appropriate
Date and Time: Sunday, June 11, 8:00 AM–5:00 PM
Location: Moscone Convention Center, 250/262
20
✗ From VCO Design to Synthesizer Design – A Comparison of
Technologies and Architectures, R. Follmann and
D. Koether, IMST, Germany
✗ Above-IC Technology on 90 nm CMOS: A Good Match for
High Performance VCOs, G. Carchon and W. De Raedt,
IMEC, Belgium
✗ Device and Noise Modeling for Oscillators, S. Maas,
University College Dublin, Ireland
✗ On Nonlinear Analysis and Design, M. Odyniec, HRL
✗ CAD Based Elimination of Spurious in Oscillator Design,
Norbert H.L. Koster and A. Beyer, Duisburg-Essen Univ.
Organizers:
Dominique Schreurs, K.U. Leuven
Adalbert Beyer, Duisburg-Essen University
Stephen Maas, University College, Dublin
Sponsors:
MTT-22 Signal Generation and Frequency Conv.
WSM: ADVANCES IN GAN HEMT DEVICE TECHNOLOGY,
MODELING AND APPLICATIONS
Location:
✗ Advanced High-Speed GaN HFET Devices for Broadband
Communication MMICs, R. Quay, IAF Freiburg, Germany
✗ GaN HFETs for Highly Linear L-band Power Amplifiers,
J. Wurfl, FBH Berlin, Germany
✗ Sources of Nonlinearities in the RF Operation of AlGaN/GaN
HFETs, R. Trew, N. Carolina State University
✗ High Power Microwave Switching Using GaN-AlGaN MOS
Heterostructures, A. Kahn, S. Carolina University
✗ Development of Models for Large RF Power Transistors
Including Temperature, Memory and Packaging Effects,
A. Szymakowski, ITHE RWTH Aachen, Germany
✗ Ion Implanted AlGaN/GaN Power HEMT Technology,
E. Morvan, Alcatel-Thales Lab, France
✗ GaN HEMT MMIC Technology: GaAs/GaN Foundry
Approach, A. Bettidi, Selex Sistemi Integrati, Italy
✗ GaN HFET Devices: Thermal and Electronic Issues,
M. Uren, QinetiQ Ltd.
✗ High Efficiency, High Linearity GaN HEMT Amplifiers for
WiMax Applications, S. Wood, CREE
✗ GaN HEMTs for W-CDMA and WiMax Base Station
Applications, Y. Tateno, Eudyna Devices Inc., Japan
✗ WiMax High Power Amplifier Design Focusing on Linear
Efficiency with GaN, S. Cho, RFHIC BD
Organizers:
F. Sullivan, Raytheon Co.
R. Jansen, Aachen University of Technology
Sponsors:
Integrated Circuits
Solid-State Devices
Due to the fast evolutions in wireless, mobile, and broadband telecommunication
systems, the need for precise and high-performance oscillator designs becomes more
imperative. This workshop presents an overview on the latest developments in the multilayered design process of oscillators. The first part of the workshop concentrates on
circuit realization: progresses in semiconductor processing with the specific aim to enhance oscillator performance are presented. In the second part of the workshop, the focus is on design related aspects: important advances in device and noise modeling, as
well as in analysis techniques and design methods are covered.
WSO: SI BIPOLAR AND CMOS MM-WAVE ICS – FROM
PROCESSES TO CIRCUIT DESIGN AND SYSTEM ARCHITECTURES
Location:
✗ Millimeter Wave ICs for System Applications: Design
Methodology and Challenges, Debabani Choudhury, Intel
✗ From Transmission Lines to Transceivers: Silicon Millimeterwave ICs for 60 GHz and Beyond, Brian A. Floyd, IBM
✗ SiGe BiCMOS mm-wave SoC Transceiver Design,
Noyan Kinayman, M/A-COM Strategic Res. and Dev.
✗ Design Techniques in Millimeter-wave Range Using
Conventional SiGeC BiCMOS Technology,
Sebastien Pruvost, STMicroelectronics
✗ Extending RF-CMOS to mm-wave Applications,
John J. Pekarik, IBM Semiconductor Res. and Dev. Ctr.
✗ Perspectives of Downscaled CMOS for RFIC and mm-wave
Applications, Stefaan Decoutere, IMEC, Belgium
✗ 0–60 GHz in Three Years: mm-Wave CMOS Research at
BWRC, Ali M. Niknejad, UC at Berkeley, CA
✗ Analog Integrated Circuits on VLSI SOI CMOS for HighSpeed Wireless Communication up to 60 GHz,
Frank Ellinger, ETH/IBM, Electronics Lab.
✗ Design Techniques for mm-wave CMOS Circuits,
Herbert Zirath, Charlmers University of Technology
✗ CMOS mm-wave IC Designs: VCOs and Amplifiers,
Huei Wang, National Taiwan University
This workshop will address the current state of GaN wide bandgap HEMT technology. Rapid progress has been made in growth and device technology as well as in the
field of modeling and simulation. A major effort is being made to advance GaN HEMT
technology for applications in high power applications in the microwave region. This
workshop will address the applications in power generation and amplification.
While the growth technology is moving to larger diameter substrates and the device
processing is becoming mature several technical challenges still exist. Achieving repeatability and a high degree of reliability is being addressed. Issues associated with
micropipes, surface traps, dislocations and surface passivation are just a few of the
technology challenges. SiC and sapphire are still the dominant substrate types, but alternative substrate materials such as Si are gaining importance.
Regarding design issues, there is much interest in the development and improvement of lumped and distributed transistor models suitable for modeling of GaN-based
devices. As high power applications also imply higher power losses and thus higher
temperature levels, the implementation of thermal effects into existing and future transistor models becomes a crucial topic. Besides the challenge of coupled electro-thermal
models, further topics associated with both the device and circuit will be addressed.
The quality of increasingly sophisticated models and their effect on the accuracy of circuit simulations needs to be accounted for.
The workshop will combine international academic and industry specialists to cover
the outlined spectrum of technology as well as design-oriented GaN device and circuit
issues.
Organizers:
Sponsors:
Hiroshi Kondoh, Hitachi Central Res Lab.
Luciano Boglione, IECi
MTT-23 RFIC
MTT-6 Microwave and Millimeter-Wave ICs
IMS2006
This workshop will concentrate on the efforts currently under way in the mm-wave
arena to enable silicon-based applications. The potential advantages of the silicon technology are obvious: more integration and lower costs. However, the challenges that silicon brings about cannot be underestimated: circuit designers must develop new skills
to cope with a lossy substrate coupled with intrinsic device limitations. While the SiGe
bipolar device is emerging as a feasible solution to the design of mm-wave circuits, pure
CMOS solutions are also being considered as commercial 0.13 and 0.09 μm CMOS
processes are paving the way to even more exciting opportunities.
This full day workshop will be structured in 2 parts: Part I will focus on SiGe bipolar
designs with the intent of discussing the technical and practical challenges that designers face in the mm-wave range as they reach higher and higher frequencies of operation. Part II will look into the current and future status of pure CMOS technologies and
review the related state-of-the-art results. The business challenges related to mm-wave
applications will also be considered during these presentations.
WSN: NEW ADVANCES IN OSCILLATOR DESIGN
Location:
21
SUNDAY
SUNDAY WORKSHOPS
ways to incorporate these data into the design process are not yet fully understood.
This workshop is devoted to providing a better understanding of these problems, from
the accurate measurement of memory effects, to incorporation of memory effects in
modeling, to the improvement of linearization schemes for resolving inaccuracies in design due to dynamic nonlinear power amplifiers. This workshop will address issues related to memory effects in a clear way appropriate for those who wish to understand
the current state-of-the-art in both characterization and design. It will answer questions such as: What are the origins of memory effects? How are they manifested? How
are they quantified? Are there special measurement techniques and stimulus signals
that can uncover memory effects accurately and reliably? How can designers incorporate memory effects into behavioural models and linearization schemes?
MONDAY
MONDAY TUTORIALS
TMA: HIGH SPEED DIGITAL SIGNAL INTEGRITY
Date & Time: Monday, June 12; 8:00 AM–5:00 PM
MosconeConvention
ConventionCenter,
Center,
222/224/226
Location:
Moscone
222
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VAccurate Calibration and Measurement of Non-Insertable
Fixture in FPGA and ASIC Device Characterization,
Fixture
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Hong Shi,
Altera
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Agilent
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Agilent Backplane Ethernet,
✗ Greg
The State
of IEEE 802.3ap
John
D’ambrosia,
Tyco
VThe
State
of IEEE 802.3ap
Backplane Ethernet,
✗ John
Practical
Design Considerations
for 10 to 25 Gbps
D’ambrosia,
Tyco
Backplane
Copper
Serial Links,forRavi
Rambus
VPractical
Design
Considerations
10 toKollipara,
25 Gbps Backplane
✗ Copper
Opening
Closed
Eyes:
Analysis
and
Equalization
of
HighSerial Links, Ravi Kollipara, Rambus
on Buses
and Backplanes,
VAData-Rate
Co-DesignSignals
Methodology
of Signal
Integrity and Power Integrity.
Ransom Stephens, Teraspeed Consulting Group
M. Wang & W. Ryu, Intel Corp, Folsom, CA
Organizers:
TomRuttan,
Ruttan,
Intel
Corp.
Organizers: Tom
Intel
Corp.
Mike
Resso,
Agilent
Technologies
Mike
Resso,
Agilent
Technologies
Sponsors:
67th
ARFTG
Conference
67th
ARFTG
Conference
Sponsors:
MTT-11
Microwave
Measurements
MTT-11
Microwave
Measurements
MTT-12
Microwave
and Millimeter-wave
MTT-12
Microwave
and Millimeter-wave
Packaging
and Manufacturing
andPackaging
Manufacturing
✗ Analysis of Accuracy in Noise Figure Measurements,
J.M. Collantes, University of the Basque Country
✗ Covariance-based Uncertainty Analysis of the NIST Electrooptic Sampling System: Introducing a New Paradigm for
Electrical Waveform Measurement, D. Williams, National
Institute of Science and Technology (NIST)
✗ Accommodating Component Uncertainties into Subsystem
and System-level Specifications, B. Szendrenyi, Agilent
✗ Using an Excel Workbook to Perform Uncertainty
Calculations on the Fly, D. Lewis, Boeing
✗ Managing Uncertainty Budgets and Using ‘Buffer Zones’ in
Specifications, B. Szendrenyi, Agilent Technologies
This full day signal integrity workshop will address high speed signal integrity design,
modeling and measurement for computer and communication systems. Advanced tools
are now required to validate compliance to data transmission including differential insertion loss, mixed mode analysis and eye diagram analysis. New and innovative techniques
will be discussed in multiple technical papers by a wide variety of experts. Learn the latest development techniques to achieve your design and time to market goals.
The participants in this workshop will be exposed to an overview of computer backplane architecture and design to familiarize the MTT attendees with this topic, the language of high speed digital design, the meaning of signal integrity, frequency domain
and time domain measurement techniques, modeling tools and best design practices.
Topics covered by the presentations will include the following:
✗ Overview of high speed digital systems and the key issues facing today’s
designers.
✗ Modeling techniques for high speed channels.
✗ Design concepts and techniques for digital board level systems.
✗ Frequency and time domain measurement methods and results.
✗ The State of IEEE 802.3ap Backplane Ethernet.
✗ New techniques for improving high speed digital interconnect
performance.
TMC: INTRODUCTION TO MEMS RESONATORS AND FILTERS
Date & Time: Monday, June 12; 1:00 PM–5:00 PM
Location:
Moscone Convention Center, 224/226 103
Topics & Speakers:
✗VKey
KeySystem
SystemOpportunities
Applicationsfor
forVibrating
ResonantMEMS
Filters,
Resonators,
Clark
T.C.
Nguyen,
University
of
Michigan
Clark T.C. Nguyen, University of Michigan
✗VFundamentals
FundamentalsofofMEMS
MEMS
Resonator
Operation
Design,
Resonator
Operation
andand
Design,
Farrokh Ayazi, Georgia Institute of Technology
Farrokh Ayazi, Georgia Institute of Technology
✗ Integrated Resonators for Frequency References,
VIntegrated
for Frequency References,
Wan-ThaiResonators
Hsu, Discera
Hsu,
Discera RFICs, H. Hashemi, USC
✗ Wan-Thai
Concurrent
Multiband
Filter
Technologies,
Wolfgang
Till,Till,
✗VAlternative
AlternativeAcoustic
Acoustic
Filter
Technologies,
Wolfgang
EPCOS
EPCOS
and
Concepts
in Micromechanical
Resonators
✗VRecent
RecentTrends
Trends
and
Concepts
in Micromechanical
Resonators
and Filters,
Gianluca
Piazza,
and
Filters, Gianluca
Piazza,
University
of Pennsylvania
University of Pennsylvania
Organizers:
A. Morris, wiSpry, Inc.
F. Ayazi, Georgia Tech
Sponsors:
MTT-21, RF MEMs
Organizers:
N. Ridler, National Physical Lab (NPL)
B. Szendrenyi, Agilent Technologies
D. Lewis, Boeing
Sponsors:
MTT-11, Microwave Measurements
MTT-16, Microwave Systems
67th ARFTG Conference
This workshop will present a review of methods for evaluating uncertainty in RF and
microwave measurements. The review will concentrate on the practical aspects of evaluating measurement errors and establishing uncertainty, and so will give practical examples demonstrating evaluation methods. Issues that are specific to RF and microwave measurements will also be covered during the workshop. The topics covered by
this workshop will include:
✗ How to identify key sources of errors in measurements
✗ Examples of uncertainty budgets
✗ Uncertainty representations for vector quantities
✗ Monte Carlo and other methods for propagating uncertainty
✗ Using results – e.g., for verifying accuracy, determining specification
compliance, etc.
Ample time during the day will be reserved for discussions. Workshop attendees are
encouraged to distribute on-the-spot hard copies of selected relevant information intended to enrich the discussions. Brief ad-hoc presentations from the floor are also
planned to take place during a ‘Panel Session’ towards the end of the day. Interested
ad-hoc presenters are advised to contact the organizers in advance of the workshop.
TMB: PRACTICAL METHODS FOR DETERMINING
THE ACCURACY OF MEASUREMENTS –
A REVIEW OF TECHNIQUES BOTH OLD AND NEW
Location:
Moscone Convention Center, 200 202/210
Topics & Speakers:
✗ A Review of Methods for Establishing the Accuracy of
Measurements, N. Ridler, National Physical Lab (NPL)
✗ Applying the Guide to the Expression of Uncertainty in
Measurement (GUM) to Power Meter Measurements,
K. Wong, Agilent Technologies
✗ Old and New Accuracy Estimations of S-Parameter
Measurements with the Ripple-Test, H. Heuermann,
University of Applied Science Aachen
✗ Industrial Examples of How to Evaluate Uncertainty,
F. Blanchett
C.
Arnaud, ST Microelectronics
✗ Determining Uncertainty the Easy Way – Using Random
Numbers, a Computer, and Some Intelligent Guesses,
N. Ridler, National Physical Laboratory (NPL)
High performance RF and microwave systems depend on strongly frequency selective elements for frequency stability and selectivity. The required high Qs have historically been provided by quartz resonators and SAW devices. To overcome the difficulties
these technologies face in multi-frequency applications and in integration with other
radio components, RF-MEMS resonators have seen intense development in recent
years. Diverse technical approaches for their implementation have been investigated.
Some technologies have advanced to high volume products while others are still in the
research stage.
This half-day tutorial will begin with a review of key applications for RF-MEMS resonators. A broad introduction to MEMS resonator design approaches will follow including performance constraints such as damping and material properties. Attractive resonator materials and manufacturing processes will then be explored including considerations for integration with other technologies. Technical challenges such as
electro-mechanical coupling, noise, precision, aging and temperature stability will be
explored and possible solutions presented. The design and performance of filters based
on MEMS resonators will be addressed. A rich variation in MEMS technologies will be
compared and contrasted with competing technologies. Both industrial and academic
perspectives will be presented.
22
MONDAY WORKSHOPS
WMA: UWB FOR WIRELESS COMMUNICATIONS,
LOCAL POSITIONING AND SENSING
Topics & Speakers:
VUWB
From
Characteristics
to Performance,
✗
UWBAntennas:
Antennas:
From
Characteristics
to Performance,
Christophe
Roblin,
ENSTA
Christophe
Roblin,
ENSTA
✗
SystemAspects
Aspects
Integrated
UWB
Antenna
Channel
VSystem
ofof
Integrated
UWB
Antenna
andand
Channel
Modelling,Werner
Werner
Sörgel,
University
of Karlsruhe
Modelling,
Sörgel,
University
of Karlsruhe
✗
AntennaArrays
Arrays
UWB
Indoor
Positioning
in Non-line
VAntenna
forfor
UWB
Indoor
Positioning
in Non-line
of of
Sight
Environments,
T.
Kaiser,
University
of
Duisburg
Sight Environments, T. Kaiser, University of Duisburg
✗
TOA Chaotic
Based Location
Using Low
Cost, for
Low
Complexity
VDirect
Communications
System
Location
Impulse Radio UWB Sensors, Ian
Oppermann,
Nokia
To
be
Confirmed
Sensing, Chang-Ho Lee, Georgia Institute of Technology
✗ Direct Chaotic Communications System for Location
VUWB
Transceiver
Architecture
for Robust
Location
Sensing,
Chang-Ho
Lee, Georgia
Institute
of Technology
Determination,
Rolf
Krämer,
IHP
✗ UWB Transceiver Architecture for Robust Location
VADetermination,
100 Mb/s Pulse Rolf
BasedKrämer,
UWB System,
IHP David Wentzloff,
Massachusetts
Institute
of
Technology
✗ A 100 Mb/s Pulse Based UWB System, David Wentzloff,
VHigh-Resolution
Based
Subsurface
MassachusettsPulse
Institute
ofUWB
Technology
✗ interrogation,
High-Resolution
Pulse
Based UWB
Subsurface
Erwin
Schimbaeck,
University
of Linz
Interrogation,
Erwin
Schimbaeck,
University
VM-Sequence
Based
UWB-Sensors:
Principles
and of Linz
✗ Application,
M-Sequence
Based UWB-Sensors:
Principles and
Juergen
Sachs, TU Ilmenau
Application,
Juergen
Sachs, TUforIlmenau
VConcepts
and RF
Design Challenges
WiMedia/ Multi-Band
✗ OFDM-based
Concepts and
Circuits
for Multi-band
OFDM-based
UWB
UWB
Communication
Systems;
Part 1: Andreas
Communication Systems; Part 1: Andreas Springer, Univ.
Springer, Univ. of Linz; Part 2: Christoph Sandner, Infineon
of Linz; Part 2: Christoph Sandner, Infineon
Organizers:
R. Knöchel, University of Kiel
J. Sachs, Technical University of Ilmenau
A. Stelzer, University of Linz
R. Weigel, University of Erlangen
Sponsor:
MTT-2, Microwave Acoustics
MTT-8, Filter and Passive Components
MTT-9, Digital Signal Processing
MTT-20, Wireless Communications
Organizers:
Organizers:
Sponsor:
Sponsor:
The wireless and satellite communications communities have
always been looking for power efficient amplification systems.
Recent advances in semiconductor process technologies are
making the design of highly efficient switching mode RF power
amplifiers a feasible solution for such applications. For that, the
design of such power amplifiers has to be considered closely together with the system architecture in order to ensure optimal
system level performances. This implies the use of adequate system architectures that convert the analog baseband information
to architecture dependent amplifier driving signals. This full day
workshop consists in two parts. In the first one, the principles
and design techniques of switching mode amplifiers operating in
class D, E, F and their subclasses will be presented along with
practical realizations. The second part will be devoted to the use
of such amplifiers in designing highly efficient and innovative
wireless transmitters based on sigma-delta, EE&R, and LINC architectures.
The origins of modern ultra-wideband technologies (UWB)
date back to the late 1960s. Since then the UWB application
range has been extended tremendously. At the beginning radar
technology pioneered a basic understanding of non-sinusoidal
signals and the development of working systems. Later, ground
penetrating radar (GPR) became popular opening the way for
detecting hidden objects. Applications never thought before became possible: discovery of underground water resources, landmine detection, detection of cracks in rocks, etc. Nowadays
UWB radar technology is further developed for imaging systems
which can reveal hidden objects or subjects. UWB wireless communications follows completely different technical approaches
in the sense that in radar the transmitted signal is known whereas it is largely unknown in communications. The microwave system and circuit issues, however, are very similar in both applications since wideband microwave signals are used in either technique. In future an abundant deployment of microwave systems
and devices communicating or sensing with such wideband signals will become common, penetrating our daily life at home, in
industry and in logistics — just to mention a few example areas.
The workshop will include an overview of the current status
and future trends of UWB system applications. Some emphasis
will be given on research trends in Europe. Modern UWB system
techniques and their microwave components and circuits will be
reviewed for communication, local positioning, and sensing, respectively.
WMC: NOISE IN SIGE AND III-V HBTS AND CIRCUITS:
OPPORTUNITIES AND CHALLENGES
Location:
Topics & Speakers:
VRF Noise in SiGe HBT- Modeling and Measurement, G. Niu,
✗ RF Noise in SiGe HBT- Modeling and Measurement, G. Niu,
Auburn University
Auburn University
VLow
Noise
Circuit
Design
SiGe Technology
at 60LAAS-CNRS
GHz and
✗ Phase
Noise
in SiGe
HBTinAmplifiers,
O. Llopis,
B.A. Floyd,
T.J. Watson
Center
✗ Above,
Low Noise
CircuitIBM
Design
in SiGeResearch
Technology
at 60 GHz and
VPhase
Noise
inFloyd,
SiGe HBT
Amplifiers,
O. Llopis,
LAAS-CNRS
Above,
B.A.
IBM
T.J. Watson
Research
Center
VNoise
HBTs,
M. M.
Rudolph,
✗ NoiseModeling
ModelingofofGaAs
GaAs
HBTs,
Rudolph,
Ferdinand-Braun-Institut
für Hochfrequenztechnik
für Hochfrequenztechnik
✗ HighFrequency
Frequency
Noise
investigation
in HBTs
using
Compact
VHigh
Noise
investigation
in HBTs
using
Compact
ModelApproach,
Approach,P.P.
Sakalas,
Dresden
University
of
Model
Sakalas,
Dresden
University
of
Technology
Technology
✗ NoiseininIII/V-HBT
III/V-HBT
Circuits,
G. Boeck,
Technische
VNoise
Circuits,
G. Boeck,
Technische
Universität Berlin
Universität Berlin
Organizers:
P. Sakalas, Dresden University of Technology
F. Danneville, IEMN, UMR CNRS
WMB: SWITCHING MODE AMPLIFIERS WITH APPLICATIONS
TO WIRELESS TRANSMITTER DESIGN
Location:
F. Ghannouchi, University of Calgary
B. Kim, Pohang
University
F. Ghannouchi,
University
of Calgary of Science
B. Kim, Pohang University of Science
MTT-5, Microwave High-Power Techniques
MTT-5, Microwave High-Power Techniques
Sponsor:
MTT-14 Microwave Low Noise Techniques
Boosted by modern material band-gap engineering, the Bipolar Transistor, first discovered in 1948, continues to evolve into
23
MONDAY
Location:
Topics & Speakers:
VRF/Microwave
Power
Amplifiers,
Classes D,
E, DE, F2,
✗ RF/Microwave
Power
Amplifiers,
Classes
D,F3
E,and
DE,S, F2, F3
N.O.
Design
Automation
Inc.Automation Inc.
andSokal,
S, N.O.
Sokal,
Design
VStability
of Switch-Mode
Amplifiers.,California Institute of
✗ Class Analysis
E/F Amplifiers,
D. Rutledge,
D.Technology
Rutledge, California Institute of Technology
VHigh
Efficiency
PowerPower
Amplifiers:
Class F and
Beyond,
✗ High
Efficiency
Amplifiers:
Class
F and Beyond,
M.M.
Campovecchio,,P.
Bouysse,
J. M.
Nebus, and R.de
Quere,
IRCOM –
Campovecchio,
IRCOM
– Université
Limoges
de Limoges
✗Université
Practical
Aspects in Designing MMIC Switching Mode
VPractical
Aspects
Designing
MMIC
Switching Mode
Amplifiers, of
Amplifiers,
R.inNegra,
R.M.
Ghannouchi,
University
R.Calgary,
Negra, F.M.
Ghannouchi,
University
of
Calgary,
W. Baechtold, ETH Zurich
Baechtold, ETH Zurich
✗W.Harmonically
Tuned Switching Mode Amplifiers for Base
VHarmonically Tuned Switching Mode Amplifiers for Base Station
Station Applications, J.H. Kim, Kwangwoon University,
Applications, J.H. Kim, Kwangwoon University, S.P. Stapleton, Simon
S.P. Stapleton, Simon Fraser University
Fraser University
✗
Transmitters Based on Switching Mode Amplifiers,
V3G & 4G Handset Transmitters Based on Switching Mode Amplifiers,
B. Kim, Pohang University of Science
B. Kim, Y. Woo, H. Kim, J. Choi, and J. Yang, Pohang University of
✗ Science
Improved LINC Transmission Using Quadrature Outphasing
Technique
Class D Using
Amplifiers,
G.A.Outphasing
Hegazi,
VImproved
LINCand
Transmission
Quadrature
Rockwell
Collins
Technique
and
Class D Amplifiers, G.A. Hegazi, Rockwell Collins
✗ Bandwidth
and
Time
Synchronization
of Polar
VDC-DC
Converter
Loop
Bandwidth
Analysis for Analysis
Use in Dynamic
Drain
Power
Amplifiers,
J.F.
Sevic,
Microwave
Power
Control
of a Polar
EDGE
PA, J.F.Maury
Sevic, Maury
Microwave
✗ Envelope
Elimination
and Restoration
Technology
for High
VEnvelope
Elimination
and Restoration
Technology
for High Efficiency
Efficiency
Base Station
Applications,
P. Asbeck,
Base
Station Applications,
P. Asbeck,
L. Larson,
D.Kimball,
of California
F.University
Wang, J. Jeong,
P. Draxler and C. Hsia, University of California
MONDAY
MONDAY WORKSHOPS
✗ Efficient
of PassiveFilters
Waveguide
Devices
Using
VEfficient
CADCAD
ToolsTools
of Waveguide
Using Space
Mapping
Space Mapping
Technology,Universidad
V.E. Boria-Esbert,
Technology,
V.E. Boria-Esbert,
Politécnica de
Universidad Politécnica de Valencia
Valencia
✗ Space-mapping
Microwave
Switches
and Multiplexers,
VSpace-mapping
for for
Microwave
Switches
and Multiplexers,
Ming
Ming
Yu,Yu,
ComCom
Dev Dev
✗ Intrinsic
Space-Mapping
Technique
in LTCC
RF Component
VLTCC
RF Component
Design by
Space Mapping
Technology,
Design,
Ke-Li Wu,
Chinese
University
of Hong Kong
Ke-Li
Wu, Chinese
University
of Hong
Kong
advanced forms like the Heterostructure Bipolar Transistor
(HBTs). Today, III-V HBTs feature ft and fmax higher than 500
GHz while the ft/fmax of SiGe HBTs can reach the sub-millimetric wave range (< 300 GHz). These outstanding cut-off frequencies allow the use of HBTs in many microwave (and millimetric)
applications, many of which require an accurate knowledge of
the HBT’s noise properties.
In this workshop, we will present the latest and most advanced noise research in SiGe and III-V HBT technologies, including measurements and modeling of 1/f noise, RF noise of
single HBTs, and phase noise (as well as its relation to device 1/f
noise). Moreover, the workshop will include contributions focusing on the state-of-the-art design of low noise circuits in millimetric wave range.
Topics & Speakers:
✗ Differential Parameters, Moving from the Linear to the
Nonlinear Application: Test Set Introduction and Calibration
Technologies, V. Teppati, Politecnico di Torino
Digital Backplane
andand
Bus Bus
Multiport
✗ Digital
BackplaneInterconnections
Interconnections
Multiport
Differential
Characterization,
Tom Ruttan,
IntelIntel
Differential Characterization,
E. Fledell,
Tom Ruttan,
✗ Large-signal Characterization and Modeling of Single-ended
and Differential RF and MW Power Transistors, Dave
Hartskeerl, Philips Research Laboratories
Differential
Characteristics:
✗ Non-linear
VCO Pulling
Effects inDevice
Flip-Chip
Balanced Transmitters,
Roberto Antonicelli,
ST Microelectronics
Measurements
and Models,
Joel Dunsmore, Agilent
✗ VCO
Non-linear
Device Balanced
Characteristics:
PullingDifferential
Effects in Flip-Chip
Transmitters,
Measurements
and
Models,
Joel
Dunsmore, Agilent
Roberto Antonicelli, ST Microelectronics
Organizers:
Andrea Ferrero, Politecnico di Torino
Sponsor:
J.W. Bandler, Bandler Corp.
Sponsors:
MTT-8 Filter and Passive Components
MTT-15 Microwave Field Theory
The space mapping approach to engineering model enhancement and design optimization intelligently aligns companion
“coarse” (ideal or low-fidelity) and “fine” (practical or high-fidelity) models of different complexities. Examples include fullwave electromagnetic (fine) simulations with empirical circuittheory based (coarse or surrogate) simulations, or an engineering device under test coupled with a suitable simulation
surrogate. The space mapping methodology has been adopted in
diverse design applications: electronic components, magnetic
systems, civil and mechanical engineering structures including
automotive crashworthiness design.
The first half of the workshop will be tutorial, devoted to introducing and explaining the essential simplicity of the space
mapping technique, and how existing CAD tools can take advantage of it. Progress in the development of advanced algorithms
and user-friendly software engines will be presented. The second half of the workshop will allow state-of-the-art microwave
practitioners to review their achievements.
WMD: PASSIVE AND ACTIVE DIFFERENTIAL MEASUREMENTS:
STATE-OF-THE-ART AND APPLICATIONS
Location:
Organizer:
WMF: ACTIVE ANTENNAS: PERFORMANCE AND DESIGN
Location:
Moscone Convention Center, 212 104
Topics & Speakers:
Differential measurements have become a valuable tool for a
huge class of problems, from backplane design and interconnection to differential high power amplifier characterization. Beginning with the introduction of differential S-parameters ten years
ago, both instrumentation and their applications have advanced
dramatically and new possibilities of differential technologies are
being investigated.
In this half day workshop, the attendees will receive a wide
perspective of the latest differential measurement technologies
and their application - innovative non linear differential test sets
and their new characterization capabilities, the latest on differential buses and interconnection solutions, and the design improvements that can be attained in wireless applications using
differential topologies.
Integrated
Antennas,
✗ Active
Contactless
Feeding
of Active Integrated Antennas,
P. Gardner, University of Birmingham
✗ Antenna-Electronics Integration for Wireless Sensor
Nodes/Networks, W. De Raedt, IMEC
✗ Slot Antenna With Integrated Front End for Millimeter-wave
Applications, W. Heinrich, Ferdinand-Braun-Institut
✗ On-chip Antennas on Silicon Substrates, K.K. O,
University of Florida
WME: MICROWAVE COMPONENT DESIGN USING SPACE
MAPPING TECHNOLOGY
This half-day workshop will provide an overview on the status
in the field of active antennas and a forum for discussing the advantages and limitations of integrating antenna and electronics.
Typical applications are systems where miniaturization and simple assembly is a must, such as RFID tags and wireless sensor
networks. A further field is spatial power combining, for which
integration of antenna and front-end saves space and reduces interconnect parasitics. Finally, wireless inter-chip data communications offer interesting horizons for future high-speed systems.
The speakers will present examples for these applications as
well as discuss limitations on efficiency, size, cost and performance that guide design choices in each case. They will give
their views on where the technology is going and the basic bottlenecks that limit widespread use. Attendees at this half day
workshop will come away with an appreciation of the latest technology in this area of research.
Location:
Topics & Speakers:
RF Design
✗ RF
DesignClosure-Companion
Closure-companionModeling
Modelingand
andTuning
Tuning
Methods, J.C.
Rautio,
Sonnet
Software
Inc.
J.C. Rautio, Sonnet Software Inc.
✗ Space Mapping Technology: What it Is and Why it Works,
✗ The Optimization of Engineering Designs Using Space
Mapping, S. Koziel, McMaster Univ.
✗ Space Mapping: an Introduction and Motivation,
K. Madsen, Technical University of Denmark
✗ More Efficient EM Simulation and Optimization Using Port
Tuning, D. Swanson, M/A-COM
✗ ANN Based Microwave Component Modeling Using Space
Mapping Technology, Q.J. Zhang, Carleton University
24
Organizers:
Robert W. Jackson, UMass Amherst
Wolfgang Heinrich, Ferdinand-Braun-Institut
Andreas Weisshaar, Oregon State University
Sponsors:
MTT-12 Microwave and Millimeter-Wave
Packaging and Manufacturing
WMG: FREQUENCY AGILE RADIO: SYSTEMS AND TECHNOLOGIES
Location:
as low-cost non-vacuum (wet-chemical) derived BST thick- and
thin films. Due to decisive improvements in quality factor or figure-of-merit, these approaches will promote real industrial
breakthroughs, enabling a new generation of high-performance,
cost-effective tunable RF components with low power consumption, suited in low-voltage, battery-powered applications. The
workshop will end with K- and Ka-band reflectarray antennas,
using broadband slow-wave phase shifters based on thin ferroelectric films and with microstrip patch array antennas employed in future automotive radar systems operating in the 7677 GHz frequency band, using RF-MEMS beam switching or
beam steering.
Topics & Speakers:
VFrequency
Agile
RF Front-End
ConceptsConcepts
for Cellularfor
Radios
from aRadios
✗ Frequency
Agile
RF Front-End
Cellular
System
Perspective,
Linus
Maurer,
DICE
from a System Perspective, Linus Maurer, DICE
VDevelopment
of Wideband
RF Reconfigurable
CMOS Circuits,
✗ Development
of Wideband
RF Reconfigurable
CMOS
C-H.
Lee,
R.
Mukhopadhyay,
K.
Lim,
H.
Kim,
and
Joy Laskar,
Circuits, Joy Laskar, Georgia Tech; Samsung
North
Georgia
Tech;Design
SamsungCenter
NorthAmerica Design Center
America
VRFFront-end
of Mobile
PhonesPhones
– From Single
Components
✗ RFFront-end
of Mobile
– From
Single Components
to Integrated Reconfigurable Systems, Anton Leidl, EPCOS AG
to Integrated Reconfigurable Systems, Anton Leidl,
VAdvanced Tunable Passives for Frequency-Agile Radios, Andre Giere,
EPCOS AG
P. Scheele, and R. Jakoby, Darmstadt University of Technology
✗ Advanced Tunable Passives for Frequency-Agile Radios,
VBST Technology for RF Front Ends,
Andre Giere, Darmstadt University of Technology
Robert York, University of California Santa Barbara
✗ BST Technology for RF Front Ends, Robert York,
VParallel-Plate Ferroelectric Varactors in Tunable Microwave Devices,
University of California Santa Barbara
Spartak Gevorgian, A. Vorobiev, D. Kuylenstierna & J. Berge,
✗ Chalmers
Parallel-Plate
Varactors
UniversityFerroelectric
of Technology, and
Ericssonin
ABTunable Microwave
Devices,
Spartak
Gevorgian,
Chalmers
University
of
VPower Handling Capability of Ferroelectric Film Varactors
and Tunable
Technology,
and
Microwave
Devices,
T. Ericsson
Samoilova,AB
A. Gagarin, O. Soldatenkov,
✗ A.Ferroelectric
films onAndrey
microwaves:
Ivanov, A. Mikhailov,
Kozyrev,properties
Electrotech. and
University St.
applications, Andrey Kozyrev, Electrotech. University St.
Petersburg
Petersburg
VSlow-Wave
Phase Shifters Based on Thin Ferroelectric Films for
✗ Reflectarray
Broadband
Slow-Wave
Phase
Shifters Based
Thin
Antennas,
Robert
R. Romanofsky,
NASA on
Glenn
Research
Ferroelectric Films for Reflectarray Antennas,
Center
Robert
R. Romanofsky,
NASA Glenn
Research
VBeam
Steering
with RF-MEMS in W-band
Automotive
Radar Center
Systems,
✗ Beam
Steering
withand
RF-MEMS
in W-band
Automotive Radar
Joerg
Schoebel,
T. Buck,
M. Schneider,
TU Braunschweig
WMH: HIGH EFFICIENCY POWER AMPLIFIERS
FOR SPACE AND TERRESTRIAL APPLICATIONS
Location:
Topics & Speakers:
EfficiencyofMMIC
✗VHigh
Comparison
High Power
PowerAmplifiers,
Transistor Technologies for High
Jim
Schellenberg,
TrexTracking
Enterprises
Efficiency
Envelope
Power Amplifiers,
VHEMT
HBT MMIC
Power Amplifiers,
AaronSan
Oki,Diego
NGC
Peterand
Asbeck,
University
of California,
Efficiency
Amplifiers
Based Amplifiers,
on EnvelopeAaron
Tracking,
✗VHigh
HEMT
and HBT
MMIC Power
Oki, NGC
University
of California,
San Diego
✗ Peter
High Asbeck,
Efficiency
MMIC Power
Amplifiers,
Jim Power,
Schellenberg,
Trex Enterprises
VHigh
High Efficiency
Space Traveling Wave Tube
✗ Amplifiers,
High Power,
High
Efficiency
SpaceResearch
Traveling
Wave Tube
R.N.
Simons,
NASA Glenn
Center
Amplifiers,
R.N.for
Simons,
Glenn Research
VPower
Amplifiers
SatelliteNASA
and Wireless
Networks –Center
✗ APower
forRamesh
SatelliteGupta,
and Wireless
Networks –
SystemAmplifiers
Perspective,
Comcast
A
System
Perspective,
Ramesh
Gupta,
Comcast
VHigh Efficiency, Low Noise Power Combining
✗ High Efficiency, Low Noise Circuit Level Power Combining
Techniques, Bob York, Univ. of CA, Santa Barbara
Techniques, Bob York, Univ. of CA, Santa Barbara
VSpatial
Power Combining
Techniques,
Mike Delisio,
✗ Quasi-optical
Power Combining
Techniques,
Mike Delisio,
Wavestream
Corp.
Wavestream Corp.
Systems, Joerg Schoebel, TU Braunschweig
Organizers:
Rolf Jakoby, Darmstadt Univ. of Technology
Sponsors:
Sponsors:
MTT-6,
Microwave
and Millimeter-Wave
Integrated
MTT-6,
Microwave
and Millimeter-Wave
Circuits
Integrated
Circuits
MTT-19, Microwave Technology Business Issues
MTT-19, Microwave Technology Business Issues
Moscone Convention Center, 212 103
Organizers: Clemens
Rolf Ruppel,
Jakoby,
Darmstadt
Univ. of Technology
EPCOS
AG
Clemens
EPCOS AG
Robert
Weigel,Ruppel,
Univ. of Erlangen-Nuernberg
Robert Weigel, Univ. of Erlangen-Nuernberg
Organizers:
Organizers:
Sponsor:
Sponsor:
Future implementation of frequency-agile reconfigurable RF
Front-End modules in next-generation multi-frequency and multi-standard (-service) mobile devices as well as RFID and miniaturized radar-sensor systems at micro- and millimeter waves is
limited by the availability of tunable/switchable RF components
that have high performance at a cost that is attractive for low- as
well as for high-volume production. Therefore, the objective of
this workshop is to highlight current research and development
efforts to create reconfigurable RF-circuits for future wireless
systems, using new design approaches, novel tunable non-linear
dielectrics, semiconductors, RF-MEMS, and other emerging
technologies.
In the first part of the workshop, the focus will be on novel
transceiver concepts for multi-mode/multi-band/multi-service
cellular systems. This approach relies on the use of digital signal
processing capabilities implemented locally on the RFIC. The
utilization of such digital signal processing capabilities is in line
with the ongoing trend toward RF-CMOS in the cellular area,
which makes the proposed architecture extremely attractive in
terms of power consumption and costs. Thus, this extension of
conventional analog RF front-end architectures can be seen as a
first step towards frequency-agile RF transceivers, which will
prevail in the short and medium term. Moreover, an overview
will be given of RF- Front-End concepts in mobile phones from
single components to integrated reconfigurable systems including important integration steps and technologies. With sophisticated tunable devices like Barium Strontium Titanate (BST) varactors, innovative concepts for tunable and reconfigurable RFFront-Ends give the potential for new features and improved
performance. The next part of the workshop will deal with various novel tunable RF devices based on ferroelectrics, using different processing technologies for epitaxially deposited as well
Kavita
Goverdhanam,
RF Micro
Devices
Kavita
Goverdhanam,
RF Micro
Devices
R.N.
Simons,
NASA
Glenn
Research
R.N.
Simons,
NASA
Glenn
Research
Center Center
MTT-6
Microwave
and
Millimeter-Wave
MTT-6
Microwave
and
Millimeter-Wave
Integrated
Circuits
Integrated
Circuits
High power and high efficiency amplifiers are vital for satellite
borne communications, navigation and imaging applications. In
addition, high efficiency amplifiers are also essential for terrestrial mobile applications. In this workshop, various topics that
address these aspects for a wide range of frequencies covering a
range of applications will be presented. Emphasis will be placed
on device technology overview, Microwave Monolithic Integrated
Circuit (MMIC) power amplifiers, power combining techniques
and system level design. Considerations for optimal efficiency
and low noise performance will be discussed. Packaging to ensure thermal reliability is a very important aspect for these applications and this will be addressed as well.
WMI:
NEWCMOS
CMOSC
COMPATIBLE
OMPATIBLE TECHNOLOGIES
FOR H
YBRID
FIBER
TECHNOLOGIES
FOR
ENABLING
WMI:
NEW
COST-EFFECTIVERADIO
BASEBASE
STATIONS
IN HFR SYSTEMS
STATIONS
Location:
Topics & Speakers:
VTechnologies
forfor
Enabling
Next
Generation
Hybrid
FiberFiber
✗ Technologies
Enabling
Next
Generation
Hybrid
Radio
Systems,
D.
Novak,
Pharad,
LLC,
A.
Nirmalathas,
Radio Systems, D. Novak, Pharad, LLC, A. Nirmalathas,
The
University
of Melbourne
The
University
of Melbourne
✗ SiliconPhotonics:
Photonics:
Integration
Challenges
with
CMOS
VSilicon
Integration
Challenges
with
CMOS
Processing
forPaniccia,
High Volume
Manufacturing, M. Paniccia,
Processing
, M.
Intel Corp.
Intel Enhancement
Corp.
VSpeed
of Photodiodes in Standard CMOS,
Speed
Enhancement
of Photodiodes in Standard
CMOS,
✗ B.
Recent
High Speed
Nauta,Advances
UniversityinofCMOS-compatible
Twente
Photodetectors,
B. Nauta,
University of Twente
B.
Nauta, University
of Twente
VNext Generation Full CMOS Radios, A. Rofougaran,
✗ Next Generation Full CMOS Radios, A. Rofougaran,
Broadcom
Corp.
Broadcom
Corp.
VRecent
Progress
in in
Millimeter-wave
CMOS
Radios,
✗ Recent
Progress
Millimeter-wave
CMOS
Radios,
S.S.
Emami,
SiBeam
Emami,
SiBeam
25
MONDAY
MONDAY WORKSHOPS
MONDAY WORKSHOPS
MONDAY
✗ Novel Integratable CMOS-compatible Antennas,
R. Waterhouse, Pharad LLC
Organizers:
Dalma Novak, Pharad LLC
A. Nirmalathas, The University of Melbourne
Rod Waterhouse, Pharad LLC
Sponsors:
MTT-3, Microwave Photonics
signers have several equalization techniques at their disposal,
and there is a rich set of tradeoffs that can be considered. The
most important and attractive aspects of electronic equalization
compared to optical compensation, which is the most common
technique to deal with transmission impairments, are: adaptive
operation, no additional loss, high functionality and reproducibility, and small size. Moreover, electronic equalizers can be integrated with existing transceiver electronics. Although planned
workshop presentations focus primarily on the high-speed optical communication domain (both 10 and 40 Gbit/s), backplanes
are another class of systems which, with increasing bit rates,
must account for the additional complexity of crosstalk from adjacent signals. Some of the presented methods and solutions apply also to this domain.
This workshop will present the outline and requirements of
multigigabit systems, followed by discussions of analog filter approaches, DACs and DSP methodologies. The first three presentations will give a general picture of the multigigabit equalization
domain including electronic equalization methods, circuits and
systems, and classification of equalization strategies in function
of distortions to be corrected. The final two presentations will
give more detailed examples of electronic equalization in highspeed communication systems.
An essential technology for the integration of broadband wireless and optical access is hybrid fiber radio (HFR), which enables a flexible access network infrastructure capable of offering
broadband wireless connectivity to a range of services and applications. Key to hybrid fiber radio systems finding wide-scale deployment, is the development of cost-effective and compact base
station (BS) architectures, which provide an efficient transfer of
signal power between the optical and wireless domains.
This half-day workshop will break new ground in bringing together presentations on the state-of-the-art in the development
of CMOS compatible RF, digital and photonic technologies. Participants will obtain an overview of the latest CMOS-compatible
technologies that will enable the realization of low cost HFR BS’s
built on a common material platform. Speakers from industry
and academia will present recent progress in the development of
CMOS-compatible optical and electronic components including
silicon photonic and opto-electronic devices; CMOS radio operating at microwave and millimeter-wave frequencies; and high
performance antenna structures realized on silicon substrates.
WMK: PRACTICAL RF AND MICROWAVE MULTIPLEXER DESIGN
Date & Time: Monday, June 12, 8:00 AM–5:00 PM
Location:
Topics & Speakers:
WMJ: ELECTRONIC EQUALIZATION FOR MULTIGIGABIT
COMMUNICATIONS
Location:
✗ MultiplexerFundamentals
Fundamentals
and
Manifold
Miniaturization
VMultiplexer
and
Manifold
Miniaturization
withSemi-Lumped
Semi-Lumped
Elements,
Matthaei,
with
Elements,
G. G.
Matthaei,
STC STC
✗ Singly-terminatedSynthesis
Coupled-resonator
Synthesis
and
VSingly-terminated
, H.C. Bell, HF
Plus
Channel
Adding/Dropping
Multiplexers,
H.C.
Bell,
VAnalytic Design of Contiguous and Non-contiguous HF Plus
✗ Multiplexers,
Analytic Design
of Contiguous
and Non-contiguous
R. Levy,
R. Levy Associates
Multiplexers, R. Levy, R. Levy Associates
VWideband Planar Multiplexers, R. Levy, R. Levy Assoc.
✗ Wideband Planar Multiplexers, R. Levy, R. Levy Assoc.
VCommon
Design,
✗ CommonJunction
Junctionand
andManifold
Manifold
Design, A. Morini,
A.U.Morini,
U.
Politecnica
della
Marche
Politecnica della Marche
VHigh
inin
Multiplexers,
✗ HighPower
PowerHandling
Handling
Multiplexers, S.J. Fiedziuszko,
S.J.
Fiedziuszko,
Lockeed
MartinLockeed Martin
✗ Spacecraft
Output
Multiplexers,
S. Holme,
Space
VSpacecraft
Output
Multiplexers,
S. Holme,
Space
Systems/Loral
Systems/Loral
VDesign
of Multiplexers with Many Channels,
✗ M.
Design
of Multiplexers
with Many Channels, M. Yu, Com
Yu, Com
Dev
Dev
Moscone Convention Center, 224/226 104
Topics & Speakers:
✗ Overview of Multigigabit Electronic Equalization, J. Sitch,
Nortel
✗ Comparative Analysis of Analog and Digital Equalizers for
10 and 40 Gb/s Optical Transmission, B. Franz, Alcatel
✗ Receive-side and Transmit-side Digital Signal Processing
and its Impact on Optical Networking, P. Winzer, Lucent
✗ Electronic Dispersion Compensation in Optical
Communications Using Digital Signal Processing, R. Killey,
University College London
✗ 10 Gb/s Adaptive Equalization for Optical Fiber and High
Speed Interconnect Applications, S. Bhoja, Broadcom
Organizers:
Sponsor:
Moscone Convention Center 102
A. Konczykowska, Alcatel-Thales III-V Lab
JP Mattia, Tarkus Consulting
Organizers:
H.C. Bell, HF Plus
R. Levy, R. Levy Associates
Sponsors:
MTT-8 Filters and Passive Components
This workshop follows last year’s workshop on practical filter
design. Multiplexers are complex structures used extensively in
broadcast and communications systems. This workshop will
bring the fundamentals and real-world solutions to the practicing RF and microwave engineer in a way that will enhance understanding and communicate useful techniques. The information obtained from this workshop will provide the skills to create
working designs or excellent starting points for further optimization using circuit and EM simulators.
MTT-3, Microwave Photonics
MTT-9, Digital Signal Processing
As transmission systems at multigigabit data rates continue to
evolve, there is increased usage of equalization to improve performance. Equalization provides a means of both reversing systemic distortion and optimizing noise performance. Continuous
progress in integrated circuit technology opens the way to electronic equalization and compensation at very high speeds. De-
26
IMS2006 MTT-S STUDENT PAPER COMPETITION Moscone 103/104
Twenty two student paper finalists were selected. The finalists will be given complimentary registration for IMS2006, complimentary tickets to the MTT-S Awards Banquet, and some
travel subsidies sponsored by the IEEE and the National Science
Foundation. The student finalists will present their papers at
their appropriate regular sessions, and also make special presentations at the Interactive Forum on Tuesday, June 13, from 1:30
to 4:30 PM. All symposium participants are welcome and encouraged to visit the student papers during the Interactive Forum, at
which time they will also be evaluated by a group of judges. Six
top papers and four honorable mentions will be selected to receive cash awards, certificates, and gifts. These will be announced and presented during the Student Awards Luncheon
on Thursday, June 15. We are very pleased to announce the finalists for the IMS2006 Student Paper Competition:
A longstanding tradition of the International Microwave Symposium is the Student Paper Competition. Each year, the papers
that represent the research accomplishments of individual students undergo an arduous review process to identify and acknowledge the best and brightest students in our microwave
community. The high standards of reviewers and judges ensure
that the best papers of the Student Paper Competition also rank
among the best papers of the Symposium.
This year we received 169 submissions for the Student Paper
Competition. Approximately 50% of these papers were accepted
for presentation, and then given additional detailed scrutiny by
the subcommittees of the TPC to select a group of finalists. A
step in this process included ranking student paper nominations
relative to all other accepted papers. Although no surprise, many
of the student paper finalists were ranked by their reviewing
subcommittee as the best paper they reviewed.
SeriesSteerable
Switch with
Nanometer
Wide Gaps
in Array
Suspended
Coplanar
AMEMS
Frequency
Multi-Mode
Parasitic
Patch
for Passive
RFID
Applications
Waveguide Transmission Lines
Dyadic Green’s
Green’s Function for a Right/Left-Handed
Waveguide
Dyadic
Right/Left-HandedRectangular
Rectangular
Waveguide
I.A. Eshrah,
Eshrah,A.A.
A.A.Kishk,
Kishk,University
University
of Mississippi,
of Mississippi,
USAUSA
Model
Order Reduction
Reductionfor
foraaField
FieldAveraging
AveragingFinite-Volume
Finite-VolumeScheme
Scheme
Model Order
K. Krohne,
R.R.
Vahldieck,
ETH
Zurich,
Zurich,
Switzerland
K.
Krohne,D.D.Baumann,
Baumann,
Vahldieck,
ETH
Zurich,
Zurich,
Switzerland
Finite-Volume Maxwellian Absorber on Unstructured Grid
Finite-Volume
Maxwellian Absorber on Unstructured Grid
K. Sankaran, C. Fumeaux, R. Vahldieck, ETH Zurich, Zurich, Switzerland
K. Sankaran,
C. Fumeaux,
Vahldieck,
ETH Zurich,
Zurich,
Switzerland
Automated
Microwave
FilterR.
Tuning
by Extracting
Human
Experience
in
Automated
Microwave
Filter
Tuning
by Controllers
Extracting Human Experience in
Terms
of Linguistic
Rules
Using
Fuzzy
Terms
of Linguistic
Rules Using
FuzzyofControllers
V. Miraftab,
R. R. Mansour,
University
Waterloo, Waterloo, Canada
Linear
Temperature
Dependent
Small Signal
ModelWaterloo,
for InGaP/GaAs
V. Miraftab,
R. R. Mansour,
University
of Waterloo,
Canada DHBTs
Using
LinearIC-CAP
Temperature Dependent Small Signal Model for InGaP/GaAs DHBTs
S. Chitrashekaraiah, V.T. Vo, A.A. Rezazadeh, The University of Manchester,
Using
IC-CAP
Manchester, United Kingdom
S. Chitrashekaraiah, V.T. Vo, A.A. Rezazadeh, The University of Manchester,
A Novel Approach for Effective Import of Nonlinear Device Characteristics
United
Kingdom
intoManchester,
CAD for Large
Signal
Power Amplifier Design
A Novel
Import
of Nonlinear
Device
H. Qi,Approach
J. Benedikt,for
P. Effective
Tasker, Cardiff
University,
Cardiff,
UK Characteristics
into
CAD of
forMerit
Largefor
Signal
Power Amplifier
Design
A
Figure
the Evaluation
of Long
Term Memory Effects in RF Power
Amplifiers
H. Qi, J. Benedikt, P. Tasker, Cardiff University, Cardiff, UK
N.B.
J.C. Pedro,
Inst. TelecomunicaAǍes
–Univ. in
Aveiro,
J.P. Martins,
A Figure
of Merit
forCarvalho,
the Evaluation
of Long
Term Memory Effects
RF Power
Aveiro, Portugal
Amplifiers
Characterization of a Multilayered Negative-Refractive-Index TransmissionJ.P. Martins, N.B. Carvalho, J.C. Pedro, Inst. TelecomunicaÃμes – Univ.
Line (NRI-TL) Metamaterial
Aveiro,
Aveiro, Portugal
A.K. Iyer, G.V. Eleftheriades, University of Toronto, Toronto, Canada
Characterization
of Compact
a Multilayered
Negative-Refractive-Index
TransmissionSimple-Design
and
MIM CRLH
Microstrip 3 dB
Line (NRI-TL)Coupler
Metamaterial
Coupled-Line
A.K.
G.V.C.Eleftheriades,
University de
of Montreal,
Toronto, Montreal,
Toronto, Canada
Canada
H.V. Iyer,
Nguyen,
Caloz, Ecole Polytechnique
Ridge
Waveguide
Stripline
Resonator
Filters
and Multiplexers
Simple-Design
andCoupled
Compact
MIM CRLH
Microstrip
3 dB
Y. Zhang, J.A.
Ruiz-Cruz, K.A. Zaki, University of Maryland, College Park, USA
Coupled-Line
Coupler
A Hybrid
Approach
to Synthesizing
Microwave
H.V. Nguyen,
C. Caloz,
Ecole Polytechnique
de Coupled-Resonator
Montreal, Montreal,Filters
Canada
W. Meng, K. Wu, the Chinese University of Hong Kong, Hong Kong
Ridge
Waveguide
Coupled
Stripline
Resonator
Filters
and
Multiplexers
Metamaterial Transmission Line Based Bandstop and Bandpass Filter
Y. Zhang,
J.A.Broadband
Ruiz-Cruz, Phase
K.A. Zaki,
University of Maryland, College Park, USA
Designs
Using
Cancellation
A Hybrid
Approach
Microwave
Coupled-Resonator Filters
C. Lee, K.
M. Leong,to
T. Synthesizing
Itoh, UCLA, Los
Angeles, USA
MEMS
Series
Nanometer
Wide
GapsKong,
in Suspended
Coplanar
W. Meng,
K.Switch
Wu, thewith
Chinese
University
of Hong
Hong Kong
Waveguide
Transmission
Lines
Metamaterial
Transmission
Line Based Bandstop and Bandpass Filter
T. Ketterl, T. Weller, B. Rossie, University of South Florida, St. Petersburg,
Designs Using Broadband Phase Cancellation
USA, University of South Florida, Tampa, USA
C. Lee, K. M. Leong, T. Itoh, UCLA, Los Angeles, USA
G.M.
Coutts, R.R.
Mansour,
S.K. Chaudhuri,
University
Waterloo,St.
Waterloo,
T. Ketterl,
T. Weller,
B. Rossie,
University
of SouthofFlorida,
Petersburg,
Canada
USA, University of South Florida, Tampa, USA
Applications
T. Wu, C. Meng, G. Huang, National Chiao Tung University, Hsinchu, ROC,
G.M. Coutts,
R.R. Mansour,
S.K. Hsinchu,
Chaudhuri,
National
Nano Device
Laboratories,
ROCUniversity of Waterloo, Waterloo,
Canada
A Low
Phase Noise Microwave Oscillator with a Miniaturized LTCC Resonator
for
SIP Design
A High
2LO-RF Isolation GaInP/GaAs HBT Sub-Harmonic Gilbert Mixer Using
S. Abielmona,
L. Roy, Carleton University, Ottawa, Canada
Three-Level
Topology
Antenna
for Short
RangeChiao
High Tung
SpeedUniversity,
Wireless Systems
T. Wu,Requirments
C. Meng, G. Huang,
National
Hsinchu,Operating
ROC,
at Millimeter-Wave Frequenices
National
Nano
Device
Laboratories,
Hsinchu,
ROC
R.M. Emrick, J.L. Volakis, Motorola Labs, Tempe, USA, ElectroScience Lab,
A Ohio
Low State
PhaseUniversity,
Noise Microwave
with a Miniaturized LTCC Resonator
Columbus,Oscillator
USA
SIP Design
Afor
Detailed
Investigation of UTC Traveling Wave Photodetectors
D.
R. Vahldieck,
Swiss Federal
InstituteOttawa,
of Technology,
Zurich, Switzerland
S.Pasalic,
Abielmona,
L. Roy, Carleton
University,
Canada
Development
of Thin-Film
Liquid
Crystal
Polymer
Surface Mount
Antenna Requirments
for Short
Range
High
Speed Wireless
SystemsPackages
Operating
for
Ka-band Applications
at Millimeter-Wave
Frequenices
K. Aihara, A. Pham, University of California at Davis, Davis, USA
R.M. Emrick, J.L. Volakis, Motorola Labs, Tempe, USA, ElectroScience Lab,
A New Low Loss Rotman Lens Design for Multibeam Phased Arrays
Ohio State University, Columbus, USA
L. Schulwitz, A. Mortazawi, University of Michigan, Ann Arbor, USA
A Detailed Investigation
of UTC
Traveling Wave
Photodetectors
Fabrication
of a Miniaturized
Spectrometer
Based
on MMIC Technology to
D. Pasalic,
R. Tropospheric
Vahldieck, Swiss
Federal
Institute
Retrieve
the 3-D
Water
Vapor
Field of Technology, Zurich,
F.Switzerland
Iturbide-Sanchez, S. C. Reising, R. W. Jackson, University of Massachusetts,
Amherst, USA, Colorado State University, Fort Collins, USA
Development
of Thin-Film Liquid Crystal Polymer Surface Mount Packages
Transmitter
Cancellation in Monostatic FMCW Radar
for Ka-band Noise
Applications
K. Lin, Y.E. Wang, University of California, Los Angeles, USA
K. Aihara, A. Pham, University of California at Davis, Davis, USA
An Improved Highly-Linear Low-Power Down-Conversion Micromixer for 77
A New
Low Loss Rotman
for Multibeam Phased Arrays
GHz
Automotive
Radar inLens
SiGeDesign
Technology
Schulwitz,
A. Mortazawi,
ofBrandenburg,
Michigan, Ann
Arbor,Germany
USA
L.L.Wang,
R. Kraemer,
TechnicalUniversity
University of
Cottbvus,
Fabrication of a Miniaturized Spectrometer Based on MMIC Technology to
Retrieve the 3-D Tropospheric Water Vapor Field
F. Iturbide-Sanchez, S. C. Reising, R. W. Jackson, University of Rick Branner
Bob Owens
Massachusetts, Amherst, USA, Colorado State University, Fort Collins,
USA
Co-Chairs, Student Paper Competition
Transmitter Noise Cancellation in Monostatic
FMCW Radar
K. Lin, Y.E. Wang, University of California, Los Angeles, USA
Rick Branner
Bob Owens
Co-Chairs, Student Paper Competition
STUDENT HIGH EFFICIENCY
POWER
AMPLIFIERPOWER
DESIGNAMPLIFIER
COMPETITION
Tuesday
1:30 PM Moscone103/104
STUDENT HIGH
EFFICIENCY
DESIGN
COMPETITION
The Second Student High Efficiency Power Amplifier Design
Competition will be held at IMS2006. The contest will take place
in the Interactive Forum (IF) area. The amplifiers will be tested
to verify their performance on Tuesday afternoon starting at
1:00 PM, and will be on display during the IF session hours. The
contest is open to all students and graduate students registered
at an educational establishment. The competitors are required
to design, construct, and measure a high efficiency power amplifier, at a frequency of their choice above 1 GHz but less than 20
GHz, and having an output power level of at least 5 watts, but
less than 100 watts into a 50 ohm load. The winner will be
judged on the design, which demonstrates the highest power
added efficiency (PAE). The winner will receive a prize of $1000
and will be invited to submit a paper describing the design for
the MTT Microwaves Magazine.
Contestants must notify the MTT-5 committee by e-mailing to
Kiki Ikossi [email protected] of their intention to compete in the
contest before April 1, 2006. This notification should include information on the University or educational affiliation of the entry, the faculty advisor and the PA’s approximate power level, dc
voltage requiremetns and frequency of operation. (Questions
about the contest can also be addressed.)
27
TUESDAY
A High 2LO-RF Isolation GaInP/GaAs HBT Sub-Harmonic Gilbert Mixer
A Frequency
Steerable
Multi-Mode Parasitic Patch Array for Passive RFID
Using
Three-Level
Topology
TUESDAY, JUNE 13, 2006
TU1B RF MEMS Tunable Components
Chair: Y. Kwon
Co-chair: R. Reid
MOSCONE 200/212
TU1C Frequency Domain Techniques
Chair: L. Perregrini
Co-chair: A. Beyer
MOSCONE 220/226
8:00–9:40 AM
TU1D Low Noise Components
and Receivers
Chair: S. Kumar
Co-chair: P. Smith
MOSCONE 301
TU1A-1: A Detailed Investigation of UTC
Traveling Wave Photodetectors
D. Pasalic, R. Vahldieck, Swiss Federal
Institute of Technology, Zurich, Switzerland
TU1B-1: High Power High Reliability High-Q
Switched RF MEMS Capacitors
A. Grichener, D. Mercier, University of
Michigan; G.M. Rebeiz, University of
California – San Diego, La Jolla
TU1C-1: Krylov Model Order Reduction of
Finite Element Models of Electromagnetic
Structures with Frequency-Dependent
Material Properties
H. Wu, A. Cangellaris
TU1D-1: Ultra-Low-Power Wideband High
Gain InAs/AlSb HEMT Low-Noise Amplifier
B. Y. Ma, J. B. Hacker, J. Bergman, G. Nagy,
G. Sullivan, P. Chen, B. Brar, Rockwell
Scientific Co.
TU1A-2: An LTCC-based Wireless Transceiver
with Integrated Optical Interface
L. Pergola, R. Vahldieck, Swiss Federal
Institute of Technology Zurich; R. Gindera,
D. Jaeger, Universitaet Duisburg-Essen
TU1B-2: RF-MEMS Switched Varactor for
High Power Applications
C. Palego, A. Pothier, A. Crunteanu,
P. Blondy, XLIM; C. Cibert, C. Champeaux,
P. Tristant, A. Catherinot, SCPTS;
T. Gasseling, AMCAD Engineering
TU1C-2: A Discrete Complex Image Method
without the Quasi-Static and Surface Wave
Extraction in Multi-layered Media
M. Yuan, T.K. Sarkar, Syracuse University
TU1D-2: Very Compact High-gain
Broadband Low-Noise Amplifier in InP
HEMT Technology
S. Masuda, T. Ohki, T. Hirose, Fujitsu
Laboratories Ltd.
TU1A-3: Miniaturized Optical Delay Lines
Using Photonic Crystals
M. Fakharzadeh Jahromi, O. Ramahi,
S. Chaudhuri, A. Safavi-Naeini, University of
Waterloo
TU1B-3: A Robust RF MEMS Variable
Capacitor with Piezoelectric and
Electrostatic Actuation
T. Ikehashi, T. Ohguro, E. Ogawa,
H. Yamazaki, K. Kojima, M. Matsuo,
K. Ishimaru, H. Ishiuchi, Toshiba Corp.
TU1C-3: Model Order Reduction for a Field
Averaging Finite-Volume Scheme
K. Krohne, D. Baumann, R. Vahldieck, ETH
Zurich
TU1D-3: Full Ka-band High Performance InP
MMIC LNA Module
Y. Tang, N. Wadefalk, M.A. Morgan,
S. Weinreb, California Institute of Technology
TU1A-5: Adaptive Electronic Linearization
of a Coherent Heterodyne Optical Receiver
J. Basak, B. Jalali, University of California,
Los Angeles
TU1B-4: Multi-Bit Distributed MEMS
Inductors
S. Balachandran, T.M. Weller, University of
South Florida; B. Lakshminarayanan,
University of California, San Diego
TU1C-4: Parameterized Model Order
Reduction Techniques for Finite Element
Based Full Wave Analysis
M.K. Sampath, A. Dounavis, University of
Western Ontario; R. Khazaka, McGill
University
TU1D-4: A Compact W-band Dual-Channel
Receiver Module
A. Tessmann, M. Kuri, M. Riessle, H. Massler,
M. Zink, W. Reinert, W. Bronner, A. Leuther,
Fraunhofer IAF
TU1A-6: Gigabit Transmission in 60 GHz
Band Using Optical Frequency
Up-Conversion by Semiconductor Optical
Amplifier and Photodiode Configuration
J. Seo, W. Choi, Yonsei University
TU1B-5: Temperature Acceleration of
Dielectric-Charging Effects in RF MEMS
Capacitive Switches
X. Yuan, J.C. Hwang, Lehigh University;
D. Forehand, C.L. Goldsmith, MEMtronics
Corp.
TU1C-5: Direct Determination of Multi-mode
Equivalent Circuit Models for
Discontinuities in Substrate Integrated
Waveguide Technology
M. Bozzi, L. Perregrini, University of Pavia;
K. Wu, Ecole Polytechnique de Montreal
TU1D-5: Planar Polarimetry Receivers for
Large Imaging Arrays at Q-band
P. Kangaslahti, T. Gaier, M. Seiffert,
S. Weinreb, D. Harding, D. Dawson, M. Soria,
C. Lawrence, Jet Propulsion Laboratory
TU1A-4: A Novel Class E Analog Fiber Optic
Link with RF Power Gain and High DC-RF
Conversion Efficiency
W.D. Jemison, Lafayette College; A. Paolella,
Artisan Laboratories Inc.
9:30 AM
9:20 AM
9:10 AM
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
TU1A Microwave Photonics
Chair: D. Novak
Co-chair: D. Guckenberger
MOSCONE 303
IEEE MTT-S IMS TECHNICAL SESSIONS
TU1A-7: Full-duplex
DOCSIS/wirelessDOCSIS Small-Scale Field
Trial Employing Hybrid Fibre Radio
Systems
H. Pfrommer, M. Piqueras, V. Polo, J. Marti,
Universidad Politecnica de Valencia
28
TU1E-1: Advances in Millimeter-wave
Imaging and Radar Systems for Civil
Applications
D.R. Vizard, Farran Technology Ltd.; R. Doyle,
Smiths Detection
8:10 AM
8:00 AM
TU1E Microwaves in Support
of Societal Security
Focused Session
Chair: E. C. Niehenke
Co-chair: K. D. Breuer
MOSCONE 300
TU1E-3: Analysis of an X-band
Retrodirective Noise Correlating Radar for
Large Caliber Bullet and Projectile Detection
E.B. Brown, Physical Domains LLC;
E.R. Brown, University of California, Santa
Barbara
TU1E-4: Development of an UWB Indoor 3D
Positioning Radar with Millimeter Accuracy
C. Zhang, A.E. Fathy, University of Tennessee;
M.J. Kuhn, B.C. Merkl, M.R. Mahfouz,
University of Tennessee
9:30 AM
9:20 AM
9:10 AM
9:00 AM
8:50 AM
8:40 AM
8:30 AM
TUESDAY
8:20 AM
TU1E-2: Passive Millimeter-wave Imaging
L. Yujiri, Northrop Grumman Corp.
29
TU3B Applications in RF MEMs
Chair: J. Ebel
Co-chair: C. Nordquist
MOSCONE 200/212
TU3C Progress in Time Domain
Modeling
Chair: A. Elsherbeni
Co-chair: Z. D. Chen
MOSCONE 220/226
1:20–3:00 PM
TU3D Antenna Technologies for
Emerging Wireless Applications
Chair: N. Buris
Co-chair: V. Nair
MOSCONE 301
TU3A-1: Synthesis of Diplexers Based on the
Evaluation of Suitable Characteristic
Polynomials
G. Macchiarella, Politecnico di Milano;
S. Tamiazzo, Andrew Telecommunication
Products
TU3B-1: A 55 GHz Bandpass Filter Realized
with Integrated TEM Transmission Lines
J.R. Reid, R.T. Webster, Air Force Research
Lab, Hanscom AFB
TU3C-1: Cells with Tensor Properties for
Conformal TLM Boundary Modeling
H. Du, P. So, W.J. Hoefer, University of
Victoria
TU3D-1: A Novel Reconfigurable Mini-Maze
Antenna for Multi-Service Wireless
Universal Receiver Using RF MEMs
S. Yang, A.E. Fathy, S. El-Ghazaly, University
of Tennessee, Knxville; H.K. Pan, N.K. Vijay,
Intel Corp.
TU3A-2: New Dual-Mode Circular Cavity
Pseudo-Elliptic Filters
S. Amari, Royal Miliraty College;
U. Rosenberg, Marconi Communications
TU3B-2: A Plastic W-band MEMS Tunable
Filter
F. N. Sammoura, L. Lin, University of
California, Berkeley
TU3C-2: A Hybrid Method Combining TLM
and MoM Method for Efficient Analysis of
Scattering Problems
R. Khlifi, P. Russer, TUM Muenchen
TU3D-2: A Frequency Steerable Multi-Mode
Parasitic Patch Array for Passive RFID
Applications
G.M. Coutts, R.R. Mansour, S.K. Chaudhuri,
University of Waterloo
TU3A-3: A Hybrid Approach to Synthesizing
Microwave Coupled-Resonator Filters
W. Meng, K. Wu, The Chinese University of
Hong Kong
TU3B-3: Monolithic RF MEMS Switch Matrix
Integration
M. Daneshmand, R.R. Mansour, University of
Waterloo
TU3C-3: TLM-based Self-adjoint Sensitivities
of S-parameters with Time-domain
Electromagnetic Solvers
Y. Li, N.K. Nikolova, M.H. Bakr, McMaster
University
TU3D-3: A Triple-Frequency Circularly
Polarized Microstrip Patch Antenna
J.H. Qiu, H.M. Li, C.T. Yang, W. Li, Harbin
Institute of Technology
TU3A-4: Direct Synthesis of Cascaded
Singlets and Triplets by Non-Resonating
Node Suppression
S. Amari, Royal Military College, Kingston,
Canada
TU3B-4: C-type and R-type RF MEMS
Switches for Redundancy Switch Matrix
Applications
M. Daneshmand, R.R. Mansour, University of
Waterloo
TU3C-4: Finite-Volume Maxwellian Absorber
on Unstructured Grid
K. Sankaran, C. Fumeaux, R. Vahldieck, ETH
Zurich
TU3D-4: Wall-Hanging Type of
Self-Complementary Spiral Patch Antenna
for Indoor Reception of Digital Terrestrial
Broadcasting
F. Kuroki, H. Ohta, Kure Coll. of Tech.;
M. Yamaguchi, E. Suematsu, Sharp Co.
TU3B-5: V-band Single-Platform Beam
Steering Transmitters Using
Micromachining Technology
S. Lee, J. Kim, J. Kim, Y. Kim, Y. Kwon, Seoul
National University; C. Cheon, University of
Seoul
2:50 PM
2:40 PM
2:30 PM
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
TU3A Synthesis and Design
Techniques for Microwave Filters
and Diplexers
Chair: V. Boria
Co-chair: C. Bell
MOSCONE 303
TU3D-5: Quad Band CEIFS Antenna for
Mobile Communication
J. Thakur, J. Park, Kookmin University
TU3A-5: Polarization-Preserving
Quadruple-Ridge Waveguide Filter and
Four-fold Symmetric Transformer
F.M. Vanin, K. Zaki, Univ of Maryland; E.J.
Wollack, NASA/Goddard Space Flight Center,
Greenbelt; D. Schmitt, ESA/European Space
Research and Technology Centre
TU3B-6: A Wide Tuning Range MEMS
Switched Patch Antenna
P. Blondy, D. Bouyge, A. Crunteanu,
A. Pothier, XLIM
30
TU3C-5: Dispersion-Error Optimized ADI
FDTD
I. Ahmed, Z.D. Chen, Dalhousie University
TU3D-6: SIW Fed Dielectric Resonator
Antennas (SIW-DRA)
Z. Hao, W. Hong, A. Chen, J. Chen, State Key
Lab of Millimeterwave; K. Wu, Poly-Grames
Research Center
TU3C-6: A Simplified Conformal (SC)
Method for Modeling Curved Boundaries in
FDTD Without Time Step Reduction
R. Schuhmann, T. Weiland, Technische
Universitaet Darmstadt; I.A. Zagorodnov,
DESY
TU3D-7: A Dielectric-filled Cavity-backed
Dipole Antenna for Microwave/
Millimeter-wave Applications
Z. Sun, P. Fay, University of Notre Dame
TU3E Magnetic Resonance Imaging
Focused Session
Chair: A. Gopinath
Co-chair: A. Rosen
MOSCONE 300
See page 45 for Tuesday Panel Sessions
TUESDAY
TU3E-2: RF Systems for High-Field MRI:
Problems and Possible Solutions Based on
Computational Electromagnetics
T.S. Ibrahim, R. Abraham, L. Tang, D.
Abraham, The University of Oklahoma
1:50 PM
1:40 PM
1:30 PM
1:20 PM
TU3E-1: Current and Future Trends in
Magnetic Resonance Imaging (MRI)
J. T. Vaughan, University of Minnesota
2:10 PM
2:00 PM
TU3E-3: Modeling of Static, Switched, and
RF Fields in the Body for MRI
C.M. Collins, Penn State College of Medicine
TU3E-5: SAR Evaluation in Pregnant
Woman Models Radiated from MRI Birdcage
Coil
J. Chen, University of Houston
2:50 PM
2:40 PM
2:30 PM
2:20 PM
TU3E-4: Current and Future MRI Systems
G. McKinnon, GE Healthcare
31
TU4B MEMs Switch
and Packaging Technology
Chair: R. Mansour
Co-chair: C. Goldsmith
MOSCONE 200/212
TU4C Applications
of Time-Domain Techniques
Chair: M.M. Tentzeris
Co-chair: L. Roselli
MOSCONE 220/226
3:30–5:00 PM
TU4D System Architectures
and Technologies for Emerging
Wireless Applications
Chair: M. Megahed
Co-chair: D.
D. Choudhury
Choudhuri
MOSCONE 301
TU4A-1: Sidewall-Couped Dielectric-Loaded
Dual Mode Caivity Filter with Coupling
from Non-adjacent modes into Adjacent
Cavities
R.V. Snyder, S. Shin, RS Microwave
TU4B-1: MEMS Series Switch with
Nanometer Wide Gaps in Suspended
Coplanar Waveguide Transmission Lines
T. Ketterl, B. Rossie, University of South
Florida, St. Petersburg; T. Weller, University
of South Florida, Tampa
TU4C-1: UWB System Coverage 2D TLM
Power Flow (TLMPF)
M.N. de Sousa, J.W. Vital, P. Russer,
Technische Univesitt Munchen; L. de
Menezes, Universidade de Braslia
TU4D-1: Radio-over-Fiber Architecture for
Simultaneous Feeding of 5.5 and 41 GHz
WiFi or WiMAX Access Networks
H. Pfrommer, M. Piqueras, V. Polo, J. Herrera,
A. Martinez, J. Marti, Universidad Politecnica
de Valencia
TU4A-2: Dielectric Resonator Filters
Fabricated from High-K Ceramic Substrates
R. Zhang, R.R. Mansour, University of
Waterloo
TU4B-2: A Latching Capacitive RF MEMS
Switch in a Thin Film Package
J.L. Ebel, R. Cortez, K.D. Leedy, R.E.
Strawser, Air Force Research Lab, Wright
Patterson AFB
TU4C-2: Soil Moisture and Surface
Roughness Effects in Ground Penetrating
Radar Detection of Land Mines
C.M. Rappaport, Northeastern University
TU4D-2: WCDMA PCS Handset Front End
Module
G. Zhang, S. Chang, A. Wang, Skyworks
Solutions Inc.
TU4C-3: Analytical and Experimental
Examination of Defrosting Spots of Heated
Frozen Material in a Microwave Oven
S. Watanabe, Y. Kakuta, O. Hashimoto,
Aoyama Gakuin University
4:00 PM
3:50 PM
3:40 PM
3:30 PM
TU4A Practical Realization
of Microwave Filters
Chair: M Yu
Co-chair: H. Yao
MOSCONE 303
TU4B-3: Electrostatic Liquid-Metal
Capacitive Shunt MEMS Switch
C. Chen, D. Peroulis, Purdue University
TU4D-3: RF Front-end for Impulse UWB
Y. Zhao, J. Frigon, K. Wu, R. G. Bosisio, PolyGRAMES research centre, Montreal, Canada
4:10 PM
TU4A-3: Base Station Filters without Irises
K.D. Pance, M/A-COM Inc.
TU4A-4: An Experimental Investigation on
Passive Intermodulation at Rectangular
Waveguide Interfaces
C. Vicente, Universidad Politecnica de
Valencia; D. Wolk, Tesat-Spacecom;
H.L. Hartnagel, Technische Universiaet
Darmstadt; D. Raboso, Euro Space Agency
TU4A-5: Investigation of Multipaction
Phenomena in Inductively Coupled Passive
Waveguide Components for Space
Applications.
F.D. Quesada Pereira, D. Caete Rebenaque,
J. Pascual Garca, A. lvarez Melcn, Tech Univ.
of Cartagena; V.E. Boria Esbert, Tech Univ. of
Valencia; B. Gimeno Martnez, University of
Valencia
5:00 PM
4:50 PM
4:40 PM
4:30 PM
4:20 PM
TU4C-4: Hybrid Electrical/Mechanical Opt.
Technique Using Time-Domain Modeling,
Finite Element Method and Statistical Tools
for Composite Smart Structures
D. Staiculescu, C. You, M.M. Tentzeris,
Georgia Inst. of Tech.; L.J. Martin, Motorola;
W. Hwang, Pohang Univ. of Science and Tech.
TU4A-6: Design, Construction and
Experimental Characterization of a
Broadband Highly Selective Filter in
Waveguide Technology in Ka Band
R. Barrio-Garrido, M. Salazar-Palma, Univ.
Carlos III de Madrid; S. Llorente-Romano,
Univ. Politecnica de Madrid; A. OnoroNavarro, I. Hidalgo-Carpintero, Alcatel Alenia
Space
TU4B-4: Wafer-Scale Packaged RF-MEMS
Switches
J.B. Muldavin, C. Bozler, C. Keast, MIT
Lincoln Lab
TU4D-4: Wideband OFDM Transmitter for
Wireless Communications
J. Kiivnen, J. Lindeberg, J. Pirkkalaniemi,
O. Vnnen, M. Varonen, V. Golikov, P.
Juurakko, P. Vainikainen, K. Halonen, TKK
TU4D-5: An RF Chipset for Impulse Radio
UWB Using 0.13 μm InP-HEMT Technology.
Y. Kawano, Y. Nakasha, K. Yokoo, S. Masuda,
T. Takahashi, T. Hirose, Y. Oishi, Fujitsu
Laboratories Ltd.; K. Hamaguchi, National
Institute of Information Communication
Technology
TU4C-5: Metallic and Superconducting
Rectangular Cavity Resonators in TLM
N. Fichtner, P. Russer, TU Muenchen
TU4B-5: Development of Multilayer Organic
Modules for Hermetic Packaging of RF
MEMS Circuits
M.J. Chen, A. Pham, University of California,
Davis; C. Kapusta, J. Iannotti, W. Kornrumpf,
N.A. Evers, General Electric Global Research;
J. Maciel, Radant MEMS; N. Karabudak,
Lockheed Martin
32
TU4C-6: FDTD Analysis of EBG Structures
with Macromodel Cloning
J. Podwalski, P. Sypek, L. Kulas,
M. Mrozowski, Gdansk Univ. of Technology
TU4D-6: A Fully-Integrated UWB CMOS LNA
Using Network Synthesis Approach
Y. Huang, Y.E. Chen, National Taiwan
University
TU4D-7: Eigenvalue Analysis of Close
Coupled 13.56 MHz RFID-Labels
H. Witschnig, E. Merlin, Philips Austria;
E. Sonnleitner, J. Bruckbauer,
Fachhochschule Hagenberg
TU4E-1: Frequency Limits of Bipolar
Integrated Circuits
M. Rodwell, Z. Griffith, N. Parthasarathy,
U. Singisetti, V. Paidi, University of California,
Santa Barbara; M. Urteaga, R. Pierson,
P. Rowell, B. Brar, Rockwell Scientific
3:40 PM
3:30 PM
TU4E TeraHertz Integrated Circuits
Focused Session
Chair: P.H. Siegel
Co-chair: J. Wiltse
MOSCONE 300
TU4E-3: Ultra-High-Speed Low-Noise
InP-HEMT Technology
K. Shinohara, P.S. Chen, H. Kazemi, B. Brar,
Rockwell Scientific Co.; I. Watanabe,
T. Matsui, Nat’l Inst. Information & Comm.
Tech.; Y. Yamashita, A. Endoh, K. Hikosaka,
T. Mimura, Fujitsu Labs; S. Hiyamizu, Osaka U
TU4E-4: Waveguide Packaged Monolithic
THz Multiplier Circuits
I. Mehdi, G. Chattopadhyay, E. Schlecht,
J. Ward, J. Gill, F. Maiwald, JPL; A. Maestrini,
University of Paris
TU4E-5: A Terahertz Transistor Based on
Geometrical Deflection of Ballistic Current
Q. Diduck, M. Margala, M.J. Feldman,
University of Rochester
5:00 PM
4:50 PM
4:40 PM
4:30 PM
4:20 PM
4:10 PM
4:00 PM
TUESDAY
3:50 PM
TU4E-2: Towards Terahertz MMIC
Amplifiers: Present Status and Trends
L.A. Samoska, Jet Propulsion Lab
33
TUESDAY FOCUSED SESSIONS
TU1E: MICROWAVES IN SUPPORT OF SOCIETAL SECURITY
Date & Time: Tuesday, June 13; 8:00 AM
TU4E: TERAHERTZ INTEGRATED CIRCUITS
Date & Time: Tuesday, June 13, 3:30 PM
Location:
Moscone Convention Center, Room 300
Location:
Chair:
E.C. Niehenke, Niehenke Consulting
Chair:
P.H. Siegel, Caltech and Jet Propulsion Lab
Co-Chair:
K.D. Breuer, ITT Avionics
Co-Chair:
J. Wiltse, Georgia Tech
Microwaves and millimeter waves play a key role in support of
societal security. Threat detection, counter threat techniques,
and first response technology to man made as well as natural
disasters will be considered. This session will present communication systems for first responders, and detection technology
that is under development to protect societies against threats as
experienced by multiple nations from terrorists and comm. Passive millimeter wave imaging, millimeter wave frequency modulated continuous wave radar, microwave radar, and ultra wide
band sensors will be presented.
This focus session surveys state-of-the-art terahertz semiconductor device technology and circuit implementation. These
push today’s design and fabrication techniques to the limit, with
broad implications for future components and instruments. The
session highlights current thinking and development paths for
more traditional two- and three-terminal solid-state structures,
i.e. Schottky diodes, HBT and HEMT transistors, as well as introducing a novel device concept: the ballistic transistor.
TU3E: MAGNETIC RESONANCE IMAGING
Date & Time: Tuesday, June 13; 1:20 PM
Location:
Chair:
A. Gopinath, University of Minnesota
Co-Chair:
A. Rosen, Drexel University
Magnetic Resonance Imaging MRI) is widely used in medical
diagnostic procedures, which uses RF techniques for imaging.
MRI systems resemble a radar system interfaced with a superconducting magnet. This focus session on MRI has four invited
talks and one contributed paper. Current and future trends of
MRI are discussed. The role of modeling of static, switched and
RF magnetic fields in the human body will be outlined. As the
static magnetic field increases, to improve the signal to noise ratio, the RF frequency increases and the penetration of these RF
fields decreases. This is a major problem for the high field MRI
systems and proposed solutions are discussed. Current and future MRI systems will also be outlined. A specific study of the
heating effects of MRI in a pregnant woman will also be presented.
34
WEDNESDAY FOCUSED SESSIONS
Date & Time:
WE2G: VIBRATING MEMS
Wednesday, June 14; 10:10 AM
Location:
Moscone Convention Center, Rooom 300
Chair:
C.T.C. Nguyen, University of Michigan
Co-Chair:
J. Banwait, Northrop Grumman
WEDNESDAY SPECIAL SESSION
Recent advances in vibrating RF MEMS technology that have
yielded on-chip resonators operating past GHz frequencies with
Q’s in excess of 10,000 might soon provide methods for achieving completely monolithic versions of communication transceivers and the ultra-stable timing and frequency references on
which they depend. By allowing the use of a nearly unlimited
number of on-chip high-Q passives, they might also enable a paradigm-shift in transceiver design where the advantages of high-Q
are emphasized, rather than suppressed, with potential for enhanced bandwidth efficiency. This Focused Session aims to introduce the IMS audience to vibrating RF MEMS technology via
presentations on both technology and applications by leaders in
the field.
Date & Time:
WE3G: 4 GHZ FOR 4G?
Wednesday June 14; 1:20 PM
Location:
Chair:
F. Ivanek, Stanford University
Co-Chair:
G. Heiter, Heiter Microwave Consulting
Date & Time:
WE4G: 50 YEARS OF MICROWAVES
IN THE SAN FRANCISCO BAY AREA
Wednesday, June 14; 3:30 PM
Location:
Chair:
E.J. Crescenzi, Jr.,
Central Coast Microwave Design
Co-Chair:
The past 50 years has included remarkable developments and
commercial enterprises in microwave technology. The companies and institutions of the San Francisco Bay Area (and the socalled ‘Silicon Valley’) have earned an international reputation
for technical innovation and entrepreneurial spirit. The speakers
will review four of the major areas of development and commercialization in the Bay Area, including microwave semiconductors, metrology, telecommunications and defense electronics. In
addition, the session takes a look forward to what might be in
store for the greater Bay Area. We also recognize 50 years of
service by our Santa Clara Valley MTT-S Chapter.
Beyond 3G(B3G) spectrum requirements will necessarily follow the pattern established in the transition from 1G to 2G and
3G: up in frequency. Japan and Korea have already proposed in
the ITU-R the mobile and nomadic usage of 4 GHz bands that
were extensively used for point-to-point microwave links until
fiber optic systems prevailed in long-distance communications.
1 Gb/s feasibility in a 100 MHz channel in a 4 GHz band has been
recently demonstrated in Japan. And in the early 1990s AT&T
Bell Laboratories conducted mobile field trials in the 6 GHz common carrier band, which demonstrated mobile service feasibility.
These and other related developments further stimulate interest
in using frequency spectrum in the 4 GHz range for 4G applications.
[see page 45 for Wednesday Panel Sessions]
35
8:00–9:40 AM
WE1A Planar Filters
with Extended Stopband
Chair: R. Chen
Co-chair: K. Zaki
MOSCONE 303
WE1B Acoustic Filters
and Applications
Chair: C. Ruppel
Co-chair: R. Weigel
MOSCONE 304
WE1C Signal Generation
for System Applications
Chair: S. Wetenkamp
Co-chair: J.-C. Nallatamby
MOSCONE 305
WE1D Integrated Coaxial and
Chair: G.V. Eleftheriades
Co-chair: C. Buntschuh
MOSCONE 306
WE1A-1: Periodic Stepped-Impedance
Resonator (PSIR) Bandpass Filters with
Multispurious Suppression
Y. Chiou, M. Wu, J. Kuo, National Chiao Tung
University
WE1B-1: Design of a High Integrated
Triplexer using LTCC Technology
M. Buchsbaum, E. Leitgeb, Graz University of
Technology; C. Korden, H. Faulhaber, Epcos
OHG
WE1C-1: PLL Architecture for 77-GHz FMCW
Radar Systems with Highly Linear UltraWideband Frequency Sweeps
A. Stelzer, University of Linz; C. Wagner,
H. Jaeger, Danube Integrated Circuit
Engineering
WE1D-1: Low-Loss Single and Differential
Semi-Coaxial Interconnects in Standard
CMOS Process
J.D. Jin, S.S. Hsu, National Tsing Hua
University; M.T. Yang, S. Liu, Taiwan
Semiconductor Manufacturing Co.
WE1A-2: Broad-Band Bandpass and
Bandstop Filters with Sharp Cut-off
Frequencies Based on Series CPW structures
A. Liu, A. Yu, Nanyang Technological
University; Si Q. Zhang, Institute of
Microelectronics
WE1B-2: SAW Substrate for Duplexer with
Excellent Temp. Characteristics and Large
Reflection Coefficient Realized by using Flat
SiO2 Film and Thick Heavy Metal Film
M. Kadota, T. Nakao, N. Taniguchi, E. Takata,
M. Mimura, K. Nishiyama, T. Hada,
T. Komura, Murata MFG. Co., Ltd.
WE1C-2: Ultra-Linear Superwideband Chirp
Generator using Digital Compensation
M.Z. Straayer, A.V. Messier, W.G. Lyons, MIT
Lincoln Lab
WE1D-2: Integrated Micro Coaxial Air-Lines
with Perforations
S.P. Natarajan, T.M. Weller, A.M. Hoff,
University of South Florida, Tampa
WE1A-3: Microstrip Open-Loop Ring
Bandpass Filter Using Open Stubs for
Harmonic Suppression
W. Tu, H. Li, K.A. Michalski, K. Chang, Texas
A&M University
WE1B-3: Design and Industrialisation of
Solidly-Mounted BAW Filters
J. Lobeek, B. Smolders, Philips
Semiconductors
WE1C-3: Reconfigurable Pico-Pulse
Generator for UWB Applications
C. Zhang, A.E. Fathy, University of Tennessee
WE1D-3: Characterization of a Multilayered
Negative-Refractive-Index
Transmission-Line (NRI-TL) Metamaterial
A.K. Iyer, G.V. Eleftheriades, University of
Toronto
WE1A-4: Dual Quarter-Wavelength Hairpin
Bandpass Filter with Multiple Transmission
Zeros
S. Lin, C. Wang, C. Chen, National Taiwan
University; Y. Lin, National Central University
WE1B-4: Ohmic Effects in BAW Resonators
R. Thalhammer, G. Fattinger, M. Handtmann,
S. Marksteiner, Infineon Technologies
WE1C-4: 4.2 mW CMOS Frequency
Synthesizer for 2.4 GHz ZigBee Application
with Fast Settling Time Performance
S. Shin, K. Lee, KAIST; S. Kang, UCSC
WE1D-4: Active Left-Handed Transmission
Line Media
A.B. Kozyrev, H. Kim, D.W. van der Weide,
University of Wisconsin-Madison
WE1B-5: Appropriate Methods to Suppress
Spurious FBAR Modes in Volume
Production
A. Link, R. Weigel, University ErlangenNuremb; E. Schmidhammer, H. Heinze,
B. Bader, M. Mayer, EPCOS
WE1C-5: Fractional-N Direct Digital
Frequency Synthesis with a 1 Bit Output
J. Rode, A. Swaminathan, I. Galton,
P.M. Asbeck, University of California, San
Diego
WE1D-5: Double Negative Medium Composed
from Split-Ring Resonators Only
E. Semouchkina, S. Mudunuri,
G.B. Semouchkin, R. Mittra, Penn State
University
9:30 AM
9:20 AM
9:10 AM
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
WEDNESDAY, JUNE 14, 2006
WE1A-5: A Parallel-Coupled Microstrip
Bandpass Filter With Suppression of Both
the 2nd and the 3rd Harmonic Responses
S. Hong, K. Chang, Texas A&M University
WE1A-6: Compact Composite Right/Lefthanded Coplanar Waveguide Filters with
Arbitrary Passband and Stopband
Responses
S. Mao, M. Wu, National Taipei University of
Technology
WE1A-7: Miniaturization and Harmonic
Suppression Open-loop Resonator Bandpass
Filter with Capacitive Terminations
M. Qi, X. Sun, Shanghai Institute of
Microsystem and Information Technology,
Chinese Academy of Science; J. Gu, C. Wang,
Z. Zhang, Graduate School of Chinese
Academy of Science
36
WE1F Nonlinear
Measurement-based Modeling
Chair: D.E. Root
Co-chair:
MOSCONE 302
WE1G Multi-GHz ICs for
Communication and Instrumentation
Chair: H. Boss
Co-chair: K.C. Wang
MOSCONE 300
WE1E-1: A New Compact LTCC Butler
Matrix for Phased Array Applications
G. Tudosie, H. Barth, R. Vahldieck, ETH
Zurich
WE1F-1: Measurement-Based Non-QuasiStatic Large-Signal FET Model Using
Artificial Neural Networks
J. Xu, D. Gunyan, M. Iwamoto, A. Cognata,
D. Root, Agilent Technologies
WE1G-1: A Reconfigurable 0.18-um CMOS
Equalizer IC with an Improved Tunable
Delay-Line for 10 Gb/sec Backplane Serial
I/O Links
F. Bien, H. Kim, Y. Hur, M. Maeng, J. Laskar,
Georgia Institute of Technology; E. Gebara,
Quellan, Inc.
WE1E-2: A New Low Loss Rotman Lens
Design for Multibeam Phased Arrays
L. Schulwitz, A. Mortazawi, University of
Michigan
WE1F-2: Single Function Drain Current
Model for MESFET/HEMT Devices Including
Pulsed Dynamic Behavior
G.R. Rafael-Valdivia, R.G. Brady, T.J. Brazil,
University College Dublin
WE1G-2: Performance Improvement of a 40
Gb/s PLL Clock Recovery Module Using New
Frequency Acquisition and Clock Hold
Circuits
H. Park, D. Woo, K.W. Kim, Kyungpook
National University; J. Kim, Satrec Initiative;
S. Lim, ETRI
WE1E-3: Millimeter-wave Beam-Steering
Using an Array of Reconfigurable AntennaFilter-Antenna Elements
C. Cheng, A. Abbaspour-Tamijani, C. Birtcher,
Arizona State University
WE1F-3: A Novel Approach for Effective
Import of Nonlinear Device Characteristics
into CAD for Large Signal Power Amplifier
Design
H. Qi, J. Benedikt, P. Tasker, Cardiff
University
WE1G-3: Novel DAC Design Method Based on
Microwave Circuit Principles
K. Sun, D. van der Weide, University of
Wisconsin
WE1F-4: Full-Spectrum Behavioral Model
for Linearized Sub-Harmonic Mixer
Extracted by Large-Signal Vectorial
Measurements
A. Cidronali, R. Fagotti, G. Loglio, I. Magrini,
G. Manes, University of Florence
WE1G-4: A High Speed Low-Power
Accumulator for Direct Digital Frequency
Synthesizer
Y. Kim, S. Kang, University of California,
Santa Cruz
WE1F-5: A Kautz-Volterra Behavioral Model
for RF Power Amplifiers
M. Isaksson, D. Rnnow, University of Gvle
WE1G-5: An Ultra Low-Power Static
Frequency Divider in an InGaAs/InP DHBT
Technology
Z. Griffith, M. Rodwell, University of
California, Santa Barbara; M. Urteaga,
P. Rowell, R. Pierson, B. Brar, Rockwell
Scientific Corp.
9:10 AM
9:20 AM
9:30 AM
WE1E-5: 2-D Frequency-Controlled BeamSteering by a Leaky/Guided-Wave
Transmission Line Array
C.A. Allen, K.M. Leong, T. Itoh, University of
California, Los Angeles
WE1E-6: A Sparse Ka-Band Digital
Beamforming Integrated Receiver Array
D.S. Goshi, K.M. Leong, T. Itoh, University of
California, Los Angeles; B. Houshmand, BAE
Systems
WE1E-7: A Dual Band Reconfigurable Power
Divider for WLAN Applications
R. Vincenti Gatti, A. Ocera, L. Marcaccioli,
R. Sorrentino, University of Perugia
37
WEDNESDAY
WE1E-4: A Full Duplex, Single-FrequencyControlled Phased Array
J.D. Roque, G.S. Shiroma, W.A. Shiroma,
University of Hawaii at Manoa
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
WE1E Beam-forming Arrays
Chair: Z. Popovic
Co-chair: J. Modelski
MOSCONE 301
WE2B Ferrite and Ferroelectric
Devices
Chair: S. Gevorgian
Co-chair: J. D. Adams
MOSCONE 304
WE2C Low Phase Noise Oscillators
Chair: T. Ohira
Co-chair: T. Ruttan
MOSCONE 305
10:10–11:50 AM
WE2D Electromagnetic Bandgap
and Synthesized Structures
Chair: K. Wu
Co-chair: G. E. Ponchak
MOSCONE 306
WE2A-1: A Parallel Doubly Coupled DualBand Bandpsss Filter
C. Rao, T. Wong, M. Ho, National Changhua
University of Education
WE2B-1: A Duplexing Ferrite AdjustablePhase Power Divider
C.R. Boyd, Jr., Microwave Applications Group
WE2C-1: A 30 GHz Low-Phase-Noise 0.35 m
CMOS Push-Push Oscillator Using
Micromachined Inductors
T. Wang, R. Liu, H. Chang, J. Tsai, L. Lu,
H. Wang, National Taiwan University
WE2D-1: Compact On-Chip ThreeDimensional Electromagnetic Bandgap
Structure
L.L. Leung, K.J. Chen, Hong Kong University
of Science and Technology
WE2A-2: Coupling-Matrix Design of
Dual/Triple-Band Uni-Planar Filters
M. Mokhtaari, J. Bornemann, University of
Victoria; S. Amari, Royal Military College of
Canada
WE2B-2: Low Loss Lumped Element Isolator
Using Gyrator Circuit With Two
Asymmetrical Electrodes
T. Hasegawa, T. Okada, Murata
Manufacturing Co., Ltd.
WE2C-2: Low Phase Noise sub-1 V Supply 12
and 18 GHz VCOs in 90 nm CMOS
H. Jacobsson, M. Bao, L. Aspemyr, Ericsson
AB; A. Mercha, G. Carchon, IMEC
WE2D-2: Design and Package-level
Implementation of Multiband
Electromagnetic Band-Gap Structures
T. Kamgaing, Intel Corp.
WE2C-3: A Novel Low Phase Noise
Multiple-device Oscillator Based on the
Extended Resonance Technique
J. Choi, A. Mortazawi, Radiation Lab
WE2D-3: A Small Electromagnetic Bandgap
Structure
R.B. Waterhouse, D. Novak, Pharad
WE2C-4: A Novel Miniature YIG Tuned
Oscillator Achieves Octave Tuning
Bandwidth with Ultra low Phase Noise in
X and Ku Bands
R. Parrott, Vida Products; A.A. Sweet, Santa
Clara University
WE2D-4: A W-band Quasi-TEM Waveguide
Using Electromagnetic Crystal (EMXT)
Surfaces
H. Xin, T. Chen, University of Arizona
WE2C-5: Low Phase Noise Oscillator Using
Microstrip Square Open Loop Resonator
E. Park, C. Seo, Soognsil University
WE2D-5: Ultra-Wideband Multilayer
Substrate Integrated Folded Waveguides
B. Sanz Izquierdo, P.R. Young, University of
Kent
WE2B-3: Time Domain Analysis and Design
of Lumped Element Circulators
R. Stonies, D. Teufer, D. Schulz, University of
Dortmund
WE2A-3: Dual Band Filter with Split-ring
Resonators
A. Garcia-Lamperez, Universidad Politcnica
de Madrid; M. Salazar-Palma, Universidad
Carlos III de Madrid
11:10 AM
WE2A-4: Novel in-line Beeline Compact
Microstrip Resonant Cell
F. Zhang, J. Gu, X. Sun, Shanghai Institute of
Microsystem and Information Technology;
L. Shi, C. Li, Wuhan University
WE2B-6: A Miniature Low-Loss Slow-Wave
Tunable Ferroelectric BandPass Filter From
11-14 GHz.
J. Papapolymerou, C. Lugo, Georgia Institute
of Technology; Z. Zhao, S. Wang, A. Hunt,
nGimat
WE2B-7: A Linearity Improvement
Technique for Thin-film Barium Strontium
Titanate Capacitors
J. Fu, X.A. Zhu, D. Chen, J.D. Phillips,
A. Mortazawi, University of Michigan
11:20 AM
11:30 AM
11:40 AM
WE2B-4: On the Left Handed Ferrite
Circulator
K. Okubo, Okayama Prefectural University;
M. Tsutsumi, Fukui University of Technology
WE2B-5: Discrete Barium Strontium
Titanate (BST) Thin-Film Interdigital
Varactors on Alumina: Design, Fabrication,
Characterization and Applications
J. Nath, W.M. Fathelbab, K.G. Gard,
M.B. Steer, P.G. Lam, D. Ghosh, S.M. Aygun,
J. Maria, A.I. Kingon, NC State University
11:00 AM
10:50 AM
10:40 AM
10:30 AM
10:20 AM
10:10 AM
WE2A Multiband and Broadband
Planar Filters
Chair: R. Sorrentino
Co-chair: T. Nishikawa
MOSCONE 303
WE2A-5: Compact Microstrip Quasi-Elliptic
Bandpass Filter Using Open-Loop
Dumbbell-Shaped Defected Ground
Structure
S.W. Ting, K.W. Tam, R. Martins, University of
Macau
WE2B-8: Tunable Power Amplifier Using
Thin-Film BST Capacitors
H. Katta, H. Kurioka, Y. Yashima, Kyocera
Corp.
WE2A-6: Bandpass Filters on a Modified
Multilayer Coplanar Line
A. Balalem, E.K. Hamad, A.S. Omar,
University of Magdeburg; J. Machac, Czech
Technical University;
WE2C-6: A Low Phase Noise Microwave
Oscillator with a Miniaturized LTCC
Resonator for SIP Design
S. Abielmona, L. Roy, Carleton University
38
WE2F
Nonlinear
Circuit
Analysis
WE2F
Physical
Nonlinear
and
SystemModeling
Simulation
Device
Chair: K.A. Remley
Chair: D. Woodard
Co-chair: E. NGOYA
MOSCONE 302
WE2G Vibrating MEMs
Focused Session
Chair: C.T.C. Nguyen
Co-chair: J. Banwait
MOSCONE 300
WE2E-1: T/R- Modules Technological and
Technical Trends for Phased Array Antennas
Y. Mancuso, P. Gremillet, P. Lacomme, Thales
Airborne Systems
WE2F-1: RF Breakdown and Large-Signal
Modeling of AlGaN/GaN HFET’s
R.J. Trew, Y. Liu, W. Kuang, H. Yin,
G.L. Bilbro, North Carolina State University;
J.B. Shealy, R. Vetury, P.M. Garber,
M.J. Poulton, RF Micro Devices
WE2G-1: Aluminum Nitride Contour-Mode
Vibrating RF MEMS
P.J. Stephanou, A.P. Pisano, University of
California Berkeley; G. Piazza, University of
Pennsylvania
WE2E-2: High Performance/Low Cost
Multi-domain Application T/R Modules
Based on a “Re-use Core-module” Concept
A. Cetronio, M. Cicolani, S. Maccaroni,
L. Marescialli, Selex Sistemi Integrati spa
WE2F-2: A Nonlinear Drain Resistance
Model for a High Power Millimeter-wave
PHEMT
A. Inoue, H. Amasuga, S. Goto, T. Kunii,
T. Oku, T. Ishikawa, Mitsubishi Electric Co.;
M.F. Wong, J.A. del Alamo, Massachusetts
WE2G-2: Next Generation Quartz Oscillators
and Filters for VHF-UHF Systems
R.L. Kubena, F.P. Stratton, D.T. Chang,
R.J. Joyce, T.Y. Hsu, M.K. Lim, R.T. McCloskey
WE2E-3: A Frequency Agile
Phase-Conjugating Active Antenna for
Full-Duplex Retrodirective Arrays
J. A. Garcia, L. Cabria, A. Mediavilla,
University of Cantabria
WE2F-3: Compact Electrothermal Modeling
of an X-band MMIC.
S. Luniya, S. Melamed, W. R. Davis, M. Steer,
NC State Univ.; W. Batty, Filtronic Compound
Semiconductors Ltd.; V. Caccamesi,
M. Garcia, Raytheon; C. Christoffersen,
Lakehead Univ.
WE2G-3: Vibrating RF MEMS for Timing and
Frequency References
W. Hsu, Discera
WE2F-4: Large-Signal Modeling of HighSpeed InP DHBTs using Electromagnetic
Simulation Based De-embedding
T.K. Johansen, V. Krozer, J. Vikjaer, Tech.
Univ. Denmark; A. Konczykowska, M. Riet,
Alcatel-Thales
WE2G-4: High Aspect-Ratio SOI Vibrating
Micromechanical Resonators and Filters
F. Ayazi, Georgia Institute of Technology
WE2E-5: A V-band MMIC Self Oscillating
Mixer Active Integrated Antenna Using a
Push-Pull Patch Antenna
W. Choi, Y. Kwon, Seoul National University;
C. Cheon, University of Seoul
WE2E-6: 2-D Quasi-Optical Power
Combining Oscillator Arrays at D-Band
R. Judaschke, Physikalisch-Technische
Bundesanstalt; T. Magath, Panasonic
Electronic Devices GmbH; K. Schnemann,
Technische Univ Hamburg-Harburg
WE2F-5: A Non-Linear Noise Model of
Bipolar Transistor for the Phase-Noise
Performance Analysis of Microwave
Oscillators
C. Florian, P.A. Traverso, F. Filicori,
University of Bologna; M. Borgarino,
University of Modena and Reggio Emilia
11:40 AM
WE2E-7: Reconfigurable Microstrip
Antennas in Millimeter-waves
M. Caillet, O. Lafond, M. Himdi, Rennes
Institute of Electronics and
Telecommunications
39
WEDNESDAY
WE2E-4: A Scheme for Hardware Reduction
in Wireless Retrodirective Transponders
D.S. Goshi, K.M. Leong, T. Itoh, University of
11:30 AM
11:20 AM
11:10 AM
11:00 AM
10:50 AM
10:40 AM
10:30 AM
10:20 AM
10:10 AM
WE2E Phased and Retrodirective
Arrays
Chair: J. Navarro
Co-chair: A. Mortazawi
MOSCONE 301
1:20–3:00 PM
WE3A Miniature Filters
and Multiplexers
Chair: C. Wang
Co-chair: R.R. Mansour
MOSCONE 303
WE3B GaN for Microwave
PA Applications
Chair: A. Platzker
Co-chair: L. de Vreede
MOSCONE 304
WE3C Device Technologies
for Signal Generation
Chair: J. Kuno
Co-chair: D. Elad
MOSCONE 305
WE3D Advances in Integrated Filters
Chair: I. Hunter
Co-chair: Y. Kotsuka
MOSCONE 306
WE3A-1: Ridge Waveguide Coupled Stripline
Resonator Filters and Multiplexers
Y. Zhang, J.A. Ruiz-Cruz, K.A. Zaki, University
of Maryland, College Park
WE3B-1: A GaN HFET Device Technology on
3 SiC Substrates for Wireless Infrastructure
Applications
B.M. Green, H.S. Henry, J. Selbee,
R. Lawrence, K.E. Moore, J. Abdou,
M.G. Miller, Freescale Semiconductor
WE3C-1: W-band Oscillator on Metamorphic
HEMT
P.L. Kirby, J. Papapolymerou, Georgia
Institute of Technology; K.J. Herrick, R.W.
Alm, N.A. Luque, Raytheon Co.; A. Rodrguez,
L.P. Dunleavy, Univ. of S. Florida, Tampa
WE3D-1: LTCC Millimeter-wave Device
Combining Filtering and Radiating
Functions for Q Band Applications
L. Rigaudeau, D. Baillargeat, S. Verdeyme,
M. Thevenot, IRCOM
WE3A-2: Highly Miniaturized Multilayer
Superconducting Filter
P.D. Laforge, R.R. Mansour, University of
Waterloo
WE3B-2: AlGaN/GaN HFETs on Si Substrates
for WiMAX Applications
R. Therrien, S. Singhal, W. Nagy, J. Marquart,
A. Chaudhari, K. Dinh, J.W. Johnson,
A.W. Hanson, J. Riddle, P. Rajagapol,
B. Preskenis, O. Zhitova, J. Williamson,
I.C. Kizilyalli, K. Linthicum, Nitronex Corp.
WE3C-2: A 45 GHz Quadrature Voltage
Controlled Oscillator with a Reflection-Type
IQ Modulator in 0.13 μm CMOS Technology
H. Chang, Y. Cho, M. Lei, C. Lin, T. Huang,
H. Wang, National Taiwan University
WE3D-2: Miniaturized Multilayer Bandpass
Filter with Multiple Transmission Zeros
A. Kundu, N. Mellen, TDK R&D Corp.
WE3A-3: Design of Ring-Manifold Microwave
Multiplexers
M. Zewani, I.C. Hunter, The University of
Leeds
WE3B-3: Performance and RF Reliability of
GaN-on-SiC HEMTs using Dual-Gate
Architectures
R. Vetury, J.B. Shealy, D.S. Green, J.D. Brown,
J. McKenna, K. Leverich, P.M. Garber,
M.J. Poulton, RF Micro Devices
WE3C-3: Low Voltage Low Power K-band
Balanced RTD-based MMIC VCO
S. Choi, K. Yang, KAIST
WE3D-3: Piezoelectric Tuned LTCC Bandpass
Filters
M. Al-Ahmad, P. Russer, University of Munich;
R. Matz, Siemens AG
WE3B-4: A 45% Drain Efficiency, –50 dBc
ACLR GaN HEMT Class-E Amplifier with
DPD for W-CDMA Base Station
N. Ui, S. Sano, Eudyna Devices Inc.
2:40 PM
2:50 PM
WE3D-4: A Band Pass Filter Integrated
Switch Using MESFET and Its Power
Analysis
J. Lee, Z. Tsai, H. Wang, National Taiwan
University
WE3A-4: Ultra-Selective
Constant-Bandwidth Electromechanically
Tunable HTS Filters
G. Tsuzuki, M. Hernandez, E.M. Prophet,
S. Jimenez, B.A. Willemsen, Superconductor
Technologies
WE3C-4: Design of a X-band GaN Oscillator:
From the Low Freq. Noise Device Charact.
and Large Signal Modeling to Circuit Design
G. Soubercaze-Pun, J. Tartarin, L. Bary,
J. Rayssac, J. Graffeuil, Laas, CNRS; E.
Morvan, S. Delage, Tiger,Alcatel-Thales;
B. Grimbert, J. De Jaeger, Tiger.Iemn
WE3B-5: A 500 W Push-Pull AlGaN/GaN
HEMT Amplifier for L-Band High Power
Application
A. Maekawa, T. Yamamoto, E. Mitani, S. Sano,
Eudyna Devices Inc.
2:30 PM
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
WE3A-5: On-chip Third-order Bandpass
Filters for 24 and 77 GHz Car Radar
E. van der Heijden, M. Notten, G. Dolmans,
H. Veenstra, R. Pijper, Philips Research
WE3B-6: 20 W GaN HPAs for Next
Generation X-band T/R-Modules
P. Schuh, R. Leberer, H. Sledzik, M.
Oppermann, B. Adelseck, H. Brugger, EADS
Deutschland GmbH; R. Behtash, H. Leier,
DaimlerChrysler AG; R. Quay, R. Kiefer,
Frauhofer Inst. for Ap. Solid State Physics
WE3A-6: Combined Low-Pass and Bandpass
Filter Response Using Microstrip Dual Mode
Resonators
M.H. Awida, A.M. Safwat, H. El-Hennawy, Ain
Shams University; A. Balalem, A.S. Omar,
University of Magdeburg
WE3B-7: 4 W Ka-band AlGaN/GaN Power
Amplifier MMIC
A.M. Darwish, B. Huebschman, E. Viveiros,
H.A. Hung, Army Research Lab; K. Boutros,
B. Luo, Rockwell Scientific Co.
WE3D-5: A CMOS Miniaturized C-band
Active Bandpass Filter
C.K. Tzuang, H.S. Wu, National Taiwan Univ.;
H.H. Wu, National Chiao Tung Univ.; J. Chen,
CMSC Inc.
WE3C-5: Power Combining Tunnel Diode
Oscillators using Metamaterial
Transmission Line at Infinite Wavelength
Frequency
A. Dupuy, K.M. Leong, T. Itoh, University of
40
WE3D-6: Silicon Integrated 2 GHz Fully
Differential Tunable Recursive Filter for
MMIC Three Branch Channelized Bandpass
Filter Design
S. Darfeuille, Z. Sassi, B. Barelaud, L.
Billonnet, B. Jarry, IRCOM UMR CNRS; R.
Gomez-Garcia, ETSI Telecom; P. Gamand,
H. Marie, Philips Semiconductor
WE3F State-of-the-Art Active
Components for Emerging
Chair: R. Emrick
Co-chair: E. Bryerton
MOSCONE 302
WE3G 4 GHz for 4G?
Focused Session
Chair: F. Ivanek
Co-chair: G. Heiter
MOSCONE 300
WE3E-1: On the Spectral Regrowth in Polar
Transmitters
G. Strasser, B. Lindner, LCM GmbH;
L. Maurer, DICE; G. Hueber, A. Springer,
Johannes Kepler Univ.
WE3F-1: A 20 mW G-band Monolithic Driver
Amplifier Using 0.07 m InP HEMT
P. Huang, R. Lai, R. Grundbacher, B. Gorospe,
Northrop Grumman
WE3G-1: 4 GHz for 4G: Why, How and When?
WE3E-2: Class-E Power Amplifier in a Polar
GSM/EDGE Transmitter
N. Lopez, X. Jiang, D. Maksimovic, Z. Popovic,
University of Colorado
WE3F-2: 0.4 V, 5.6 mW InP HEMT V-band
Low-Noise Amplifier MMIC
K. Nishikawa, I. Toyoda, NTT Corp., Yokosuka;
T. Enoki, S. Sugitani, NTT Corp., Atsugi
WE3G-2: Propagation Modeling and Other
Challenges for Non-Line-Of-Sight Wireless
Systems in the 4-6 GHz Bands
T.M. Willis, AT&T Labs; L.J. Greenstein,
WINLAB - Rutgers Univ.
WE3F-3: A Novel Non-Uniform Distributed
Amplifier/Attenuator for Millimetre-wave
Transmitter MMICs
S. J. Mahon, Mimix Broadband
WE3F-4: Submicron InP D-HBT Single-stage
Distributed amplifier with 17 dB Gain and
Over 110 GHz Bandwidth
Y. Baeyens, N. Weimann, V. Houtsma, J.
Weiner, Y. Yang, J. Frackoviak, A. Tate, P.
Roux, Y. Chen, Lucent Technologies/Bell-Labs
2:20 PM
2:30 PM
WE3E-4: A Multi-Mode Capable Receive DigitalFront-End for Cellular Terminal RFICs
G. Hueber, R. Hagelauer, Res Inst for Integ.
Ckts.; L. Maurer, Danube Integ. Ckts. Eng.;
G. Strasser, Linz Center of Competence in
Mechatronics; K. Chabrak, Inst for Tech
Electronics; R. Stuhlberger, Inst for Commun
& Infor Eng.
2:40 PM
WE3E-5: Digital Implementation of
Bandpass Pulse-Width Modulator
S. Rosnell, J. Varis, J.O. Maunuksela, Nokia
2:50 PM
WE3G-3: Challenge for Refarming the 4–5
GHz Bands in Japan Toward use for
Broadband Mobile Wireless Access
A. Hashimoto, NTT DoCoMo Inc., Tokyo,
Japan
WE3G-4: 4G, Solution for Convergence?
J. Choi, LG Electronics
WE3F-5: Quadrature Subharmonic Coupled
Oscillators for a 60 GHz Scalable Phased
Array
J.F. Buckwalter, A. Babakhani, A. Komijani,
A. Hajimiri, California Institute of Technology
WE3F-6: Sb-Heterostructure Low Noise
W-band Detector Diode Sensitivity
Measurements
H.P. Moyer, R.L. Bowen, J.N. Schulman,
D.H. Chow, S. Thomas, J.J. Lynch,
K.S. Holabird, HRL Labs
WE3E-6: Single-Chip 60 GHz Transmitter
and Receiver MMICs in a GaAs mHEMT
Technology
S.E. Gunnarsson, C. Krnfelt, H. Zirath,
R. Kozhuharov, D. Kuylenstierna, C. Fager,
Microwave Electronics Lab.; A. Alping,
MHSERC
41
WEDNESDAY
WE3E-3: Highly Efficient Multimode RF
Transmitter Using the Hybrid Quadrature
Polar Modulation Scheme
J. Jau, Y. Chen, S. Hsiao, T. Horng, National
SunYat-Sen Univ.; J. Li, Industrial Technology
Research Inst.
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
WE3E Advanced Techniques
for Wireless Communication
Chair: A. Omarburg
Co-chair: J. Luy, Daimler
MOSCONE 301
3:30–5:00 PM
WE4A
Circuit Analysis
WE4ANonlinear
Physical Nonlinear
Device
Modeling
and System
Simulation
Chair: K.A.
D. Woodard
Chair:
Remley
Co-chair:
Co-chair:
E. NGOYA
M
OSCONE 303
MOSCONE
303
WE4B Advances in Power Amplifier
Devices and Architechture for
Chair: J.L. Heaton
Co-chair: V. B. Krishnamurthy
MOSCONE 304
WE4A-1: A Formal Procedure for Microwave
Power Amplifier Behavioral Modeling
J.C. Pedro, P.M. Lavrador, N. B. Carvalho,
Inst. de Telecomunicacoes - Univ. Aveiro
WE4B-1: Linearity Improvement of HBTbased Doherty Amplifiers using a Simple
Analytical Model
Y. Zhao, P. Asbeck, University of California,
San Diego; A. Metzger, P. Zampardi, Skyworks
Inc.; M. Iwamoto, Agilent
WE4C-1: Broadband Class-E Power
Amplifier for HF and VHF
F.H. Raab, Green Mountain Radio Research
Co.
WE4D-1: New Methods of Constructing
Computer Controllable Metamaterial and its
Microwave Absorber Application
Y. Kotsuka, S. Sugiyama, Tokai University
WE4A-2: Behavioral Modeling of RF Power
Amplifiers Using Adaptive Recursive
Polynomial Functions
J.P. Dooley, B. O’Brien, T.J. Brazil, University
College Dublin
WE4B-2: 28 V High-Linearity and Rugged
InGaP/GaAs Power HBT
N.L. Wang, W. Ma, S. Xu, E. Camargo, X. Sun,
P. Hu, Z. Tang, H. Chau, A. Chen, WJ
Communications; C. Lee, National Chao Tung
University
WE4C-2: Improvement of Class E Amplifier
with Inductive Clamp Circuit Topology and
Its Applications
A. Eroglu, A. Radomski, D. Lincoln, Y. Chawla,
MKS Instruments
WE4D-2: Dual-band Bandpass and Bandstop
Filters Using Composite Right/Left-Handed
C. Tseng, T. Itoh, University of California, Los
Angeles
WE4B-3: A 2.4 GHz CMOS Doherty Power
Amplifier with an Integrated Adaptive Bias
Circuit
C. Liu, T. Luo, Y.E. Chen, NTU; D. Heo, WSU
WE4C-3: Contributions to Adjacent Channel
Power in Microwave and Wireless Systems
by PIN Diodes
R.H. Caverly, J.C. Peyton Jones, Villanova
University
WE4B-4: RF LDMOS Power Amplifier
Integrated Circuits for Cellular Wireless
Basestation Applications
C.D. Shih, J. Sjstrm, R. Bagger, P. Andersson,
Y. Yu, G. Ma, Q. Chen, T. Aberg, Infineon
Technologies
WE4C-4: An Eight Channel Interference
Cancellation System
S.J. Nightingale, G.S. Sodhi, J.E. Austin, ERA
Technology Ltd.
WE4D-3: Metamaterial Transmission Line
Based Bandstop and Bandpass Filter
Designs Using Broadband Phase
Cancellation
C. Lee, K.M. Leong, T. Itoh, University of
WE4B-5: Optimized Closed Loop Polar
GSM/GPRS/EDGE Transmitter
G.B. Norris, R. Alford, J. Gehman, B. Gilsdorf,
S. Hoggarth, G. Kurtzman, R. Meador,
D. Newman, D. Peckham, R. Sherman,
J. Staudinger, G. Sadowniczak, K. Traylor,
Freescale Semiconductor
WE4C-5: Reduction of In-band
Intermodulation Distortion Products in
Radio Frequency Power Amplifiers with
Digital Predistortion Linearization
M.J. Franco, A. Guida, Linearizer Technology,
Inc.; A. Katz, The College of New Jersey;
P. Herczfeld, Drexel University
WE4D-4: Limitations and Solutions of
Resonant-Type Metamaterial Transmission
Lines for Filter Applications: the Hybrid
Approach
J. Bonache, M. Gil, I. Gil, J. Garcia-Garcia,
F. Martin, Universitat Autnoma de Barcelona
WE4C Innovations in Technology
at HF through UHF
Chair: J. Walker
Co-chair: D. Rutledge
MOSCONE 305
WE4D Advances in Tunable
and Metamaterial Filters
Chair: H. Dayal
Co-chair: D. Yang
MOSCONE 306
WE4A-3: Application of an Envelope-Domain
Time-Series Model of an RF Power Amplifier
to the Development of a Digital pre-Distorter
System
J. Wood, M.F. Lefevre, D. Runton, Freescale
Semiconductor, Inc.
WE4A-4: Domain-Decomposition Harmonic
Balance with Block-Wise Constant Spectrum
V. Rizzoli, E. Montanari, D. Masotti, A.
Lipparini, F. Mastri, University of Bologna
5:00 PM
4:50 PM
4:40 PM
4:30 PM
4:20 PM
4:10 PM
4:00 PM
3:50 PM
3:40 PM
3:30 PM
WE4A-5: VCO Linearization Using Harmonic
Balance
J. Dominguez, S. Sancho, A. Suarez,
University of Cantabria
WE4A-6: Device Analysis of Linearity in RF
Power Devices by Harmonic Balance Device
Simulation
O.G. Tornblad, Infineon Technologies North
America, Morgan Hill; G. Ma, Infineon
Technologies North America, Tempe;
R.W. Dutton, Stanford University
WE4D-5: A Novel Reconfigurable Filter Using
Periodic Structures
M.F. Karim, L.A. Qun, A.A. Alphones, Y.A. Bin,
Nanyang Technological University
WE4B-6: A 3 W Q-Bband GaAs pHEMT Power
Amplifier MMIC For High Temperature
Operation
F.Y. Colomb, A. Platzker, Raytheon
WE4A-7: An Analysis of Cross-modulation
Distortion in Ultra Wideband OFDM
Receivers
M. Ranjan, L. Larson, University of California,
San Diego
42
WE4C-6: High Frequency Differential
Passive FET Direct Conversion
Mixer/Modulator
R.L. Campbell, Cascade Microtech
WE4D-6: Reconfigurable Planar SIW Cavity
Resonator and Filter
B. Potelon, E. Rius, C. Quendo, G. Tann,
E. Fourn, Ubo; J.C. Bohorquez, C. Person,
Lest-enst-bretagne
WE4F Innovative
Millimetre/Terahertz Circuit
Elements
Chair: J. Cunningham
Co-chair: E. Niehenke
MOSCONE 302
WE4G 50 Years of Microwaves in the
San Francisco Bay Area
Special Session
Chair: E.J. Crescenzi
Co-chair: F. Ivanek
MOSCONE 300
WE4E-1: Development of High-Performance
W-band Integrated Passives on MCM-D
Technology considering Flip-Chip
Interconnection
S. Song, H. Kim, D. Kim, K. Seo, Seoul
National University; C. Yoo, S. Choi, Korea
Electronics Technology Institute
WE4F-1: Surface-Wave Propagation on a
Single Metal Wire or Rod at Millimeter-wave
and Terahertz Frequencies
J.C. Wiltse, Georgia Institute of Technology
WE4G-1: Invited: The Bay Area Microwave
Corporate Tree
R.B. Gold, InnoCal Venture Capital
WE4E-2: Development of Thin-Film Liquid
Crystal Polymer Surface Mount Packages for
Ka-band Applications
K. Aihara, A. Pham, University of California at
Davis
WE4F-2: Antenna Requirments for Short
Range High Speed Wireless Systems
Operating at Millimeter-wave Frequenices
R.M. Emrick, Motorola Labs; J.L. Volakis,
ElectroScience Lab, Ohio State Univ.
WE4G-2: Invited: 50 Years or More on RF
and Microwave Measurements
S.F. Adam, Adam Microwave Consulting Inc.
WE4E-3: DC-50 GHz Low Loss Thermally
Enhanced Low Cost LCP Package Process
Utilizing Mico Via Technology
Z.E. Aboush, J. Benedikt, P.J. Tasker, Cardiff
University; J. Priday, Labtech Ltd.
WE4F-3: V-band Integrated Filter and
Antenna for LTCC Front-End Modules
J. Lee, S. Pinel, J. Laskar, M.M. Tentzeris,
Georgia Institute of Technology; N. Kidera,
Asahi Glass Co.
WE4G-3: Invited: 50 Years of Microwave
Communications Systems Development in
the Bay Area
WE4E-4: Millimeter-wave Low-Loss
Integrated Waveguide on Liquid Crystal
Polymer Substrate
K. Yang, S. Pinel, I. Kim, J. Laskar, Georgia
WE4F-4: High Isolation Substrate Integrated
Waveguide Passive Front-End for
Millimeter-wave Systems
D. Deslandes, K. Wu, Ecole Polytechnique of
Montreal
WE4G-4: Invited: Bay Area Microwave
Technology for Defense Developments in the
Cold War Years
E.J. Crescenzi, Jr., Central Coast Microwave
Design
WE4F-5: Design of Wide-Band Branch-Line
Coupler in the G-Frequency Band
G. Prigen, INPT; E. Rius, LEST; H. Happy,
K. Blary, S. Lepilliet, IEMN
WE4G-5: Invited: The Entrepreneurial
Climate in the Bay Area An Optimistic View
of the Future
D. Lockie, GigaBeam Corp.
5:00 PM
4:50 PM
4:40 PM
4:30 PM
43
WEDNESDAY
4:20 PM
4:10 PM
4:00 PM
3:50 PM
3:40 PM
3:30 PM
WE4E Organic Millimeterwave
Packaging
Chair: R.F. Drayton
Co-chair: M. Gouker
MOSCONE 301
WEDNESDAY, JUNE 14, 2006 • WEIF INTERACTIVE FORUM • 1:30–4:30 PM
WEDNESDAY
CHAIR: SUSHIL KUMAR, AVAGO TECHNOLOGIES • CO-CHAIR: KOHEI FUJII, AVAGO TECHNOLOGIES • MOSCONE GATEWAY BALLROOM
WEPA-1: Effects of Wall Perturbations on TM Modes in Arbitrarily-Shaped Cylindrical Wave
Guides
B.E. Spielman, Washington University in St. Louis
WEPA-2: A Novel Composite Right/Left-Handed Transmission Line Composed of Cylindrical
Left-Handed Unit Cells
Y. Horii, T. Hayashi, Kansai University; Y. Iida, Kansai University
WEPA-3: Analysis of Propagation Eigenmode for Stripline Based on Planar Circuit Equations
and Lateral Equivalent Network
A. Hirota, T. Hiraoka, J. Hsu, Kanagawa University
WEPA-4: Circular NRD Guide for Millimeter-wave Integrated Circuits
D. Li, K. Wu, Ecole Polytechnique de Montreal; F. Boone, University of Sherbrooke
WEPA-5: Application of FDFD Algorithm Combined with Shift-and-Invert Arnoldi Technique in
Bilateral Interdigital Coplanar Waveguide Slow Wave Structure
F. Xu, L. Li, K. Wu, Ecole Polytechnique; S. Delprat, M. Chaker, Institut National de la Recherche
Scientique
WEPA-6: A Novel RLC Ladder Model for the Equivalent Impedance of Single Metal Nanoparticle
in Electromagnetic Field
M. Alam, Y. Massoud, Rice University
WEPB-1: Efficient Pole Expansion of the Generalized Impedance Matrix Representation for
Planar Waveguide Junctions
F.E. Mira-Prez, V.E. Boria-Esbert, S. Cogollos, Universidad Politcnica de Valencia; A.A. San
Blas-Oltra, Universidad Miguel Hernndez de Elche; B. Gimeno-Martnez, Universidad de Valencia;
M. Bressan, L. Perregrini, Universidad de Pavia
WEPB-2: 3D Analysis of Ferroelectric Thin-film Planar Microwave Sevices using Method of Line:
Application to the Dynamic Characterisation of Ferroelectric Layers
S. Courrges, S. Giraud, D. Cros, V. Madrangeas, M. Aubourg, XLIM
WEPB-3: Derivation of Multi-grid Discrete and Analytic Greens Functions Free of Poles in Terms
of Transverse Waves
S. Wane, H. Baudrand, RCEM; D. Bajon, Supaero
WEPB-4: Multipactor Analysis in Coaxial Waveguides for Satellite Applications using FrequencyDomain Methods
A.M. Perez, C. Vicente, V. Boria, Univ. Politecnica de Valencia; C. Tienda, R. Barco, Univ. de
Malaga; A. Coves, G. Torregrosa, Univ. Miguel Hernandez; B. Gimeno, Univ. de Valencia;
D. Raboso, European Space Agency
WEPB-5: Integral-Equation Method for the S-Domain Modeling of Rectangular Waveguide with
Dielectric Insets (2D case)
M. Bressan, G. Conciauro, W.Y. Eyssa, University of Pavia
WEPB-6: Domain Decomposition and Distributed Analysis for Large Microwave Structures
M.C. Longtin, D. Sun, J. Silvestro, Z. Cendes, Ansoft Corp.
WEPB-7: Fast Multipole Method based Model Order Reduction for Large Scattering Problems
D. Lukashevich, Infineon Technologies AG; O. Tuncer, P. Russer, Munich University of Tech.
WEPB-8: Analyzing Commercial Mobile Phones by a Domain Decomposition Approach
S. Lee, K. Zhao, J. Lee, The Ohio State University; U. Navsariwala, Motorola Labs.
WEPC-1: Numerical Error Analysis and Control in a Dynamically Adaptive Mesh Refinement
(AMR) — FDTD Technique
Y. Liu, C.D. Sarris, University of Toronto
WEPC-2: Stable and Efficient Time-Domain Simulation of Metamaterials with an Extended
Equivalent Circuit (EEC) Graded Mesh FDTD
A. Rennings, Duisburg-Essen Univ.; C. Caloz, Ecole Polytechnique de Montreal; I. Wolff, IMST GmbH
WEPC-3: Accelerated Implementation of the S-MRTD Technique Using Graphics Processor Units
G.S. Baron, C.D. Sarris, University of Toronto
WEPC-4: A TLM Node for the Diffraction by 3D-Dielectric Corners Based on the Simultaneous
Transverse Resonance Method
L. Pierantoni, A. Massaro, T. Rozzi, Universit Politecnica delle Marche
WEPD-1: New Technique for Efficient Computation of Electromagnetic Coupling
D. McPhee, M.C. Yagoub, University of Ottawa
WEPD-2: Optimization of Spiral Inductor on Silicon using Space Mapping
W. Yu, McMaster University; J.W. Bandler, Bandler Corp.
WEPD-3: RF Power Amplifier Behavioral Modeling using a Globally Recurrent Neural Network
B. O’Brien, J.P. Dooley, T.J. Brazil, University College Dublin
WEPE-1: Linear Temperature Dependent Small Signal Model for InGaP/GaAs DHBTs Using IC-CAP
S. Chitrashekaraiah, V.T. Vo, A.A. Rezazadeh, The University of Manchester
WEPE-2: A Reliable Low Gate Bias Model Extraction Procedure for AlGaN/GaN HEMTs
G. Chen, V. Kumar, R. Schwindt, I. Adesida, University of Illinois at UIUC, Urbana
WEPF-1: A Small-Signal Parameter Based Metric for Nonlinear Models of Electron Devices
G. Vannini, University of Ferrara; A. Santarelli, P.A. Traverso, F. Filicori, University of Bologna;
A. Raffo, CoRiTel
WEPG-1: A Two-Kernel Nonlinear Impulse Response Model for Handling Long Term Memory
Effects in RF and Microwave Solid State Circuits
A. Soury, Xpedion Design Systems; E. Ngoya, IRCOM - University of Limoges
WEPG-2: A Figure of Merit for the Evaluation of Long Term Memory Effects in RF Power Amplifiers
J.P. Martins, N.B. Carvalho, J.C. Pedro, Inst. Telecomunicaes - Univ. Aveiro
WEPG-3: Simplified Volterra Series Based Behavioral Modeling of RF Power Amplifiers Using
Deviation-Reduction
A. Zhu, J. Dooley, T.J. Brazil, University College Dublin
WEPG-4: Behavioral Modeling of Quadrature Modulators for Characterization of Nonlinear
Distortion
M. Li, K.G. Gard, M. B. Steer, North Carolina State Univ.; L. Hoover, Polyphase Microwave Inc.
WEPG-5: Identification of RF Power Amplifier Memory Effect Origins using Third-Order
Intermodulation Distortion Amplitude and Phase Asymmetry
J.S. Kenney, P. Fedorenko, Georgia Institute of Technology
WEPG-6: Optimized Design of Retro-Directive Arrays Based on Self-Oscillating Mixers using
Harmonic Balance and Conversion Matrix Techniques
A. Collado, A. Georgiadis, A. Suarez, University of Cantabria
WEPG-7: Phenomenological Modeling of Passive Intermodulation (PIM) Due to Electron
Tunneling at Metallic Contacts
J.A. Russer, A. Ramachandran, A.C. Cangellaris, University of Illinois at Urbana-Champaign;
P. Russer, Technische Universitt Munchen
WEPI-1: Quasi-Static Analysis of a New Wide Band Directional Coupler Using CPW Multilayer
Technology
M. Nedil, T.A. Denidni, Inrs-Emt
WEPI-2: An Embedded Suspended Micromachined Solenoid Inductor
I. Zine-El-Abidine, M. Okoniewski, Univ. of Calgary; J.G. McRory, Telecom. Research Labs
WEPI-3: A 800 to 3200 MHz Wideband CPW Balun Using Multistage Wilkinson Structure
J. Lim, S. Oh, J. Koo, D. Ahn, Soonchunhyang University; U. Park, ETRI, Yuseong-Gu; Y. Jeong,
Chonbuk National University, Duckjin-Gu
WEPI-4: Effects of a Lumped Element on DGS with Islands
J. Kim, J. Lim, K. Kim, D. Ahn, B407 Sanhakhyubdongkwan
WEPI-5: Multisection Vialess Baluns with Coupled-Line Impedance Transformers
S. Sun, L. Zhu, Nanyang Technological University; K. Ang, DSO National Labs
WEPI-6: Decade Bandwidth Planar MMIC Balun
D.E. Meharry, BAE Systems Electronics & Integrated Solutions
WEPI-7: Design of Novel Highly Integrated Passive Devices for Digital Broadcasting Satellite
802.11 Home Networking Solution in Liquid Crystal Polymer (LCP) Based Organic Substrates
V. Govind, P. Monajemi, L. Carastro, S. Lapushin, C. Russel, S. Dalmia, J. Vickers, G. White,
Jacket Micro Devices; V. Sundaram, Georgia Institute of Technology
WEPI-8: Microwave Group Delay Adjuster
S. Park, Y. Jeong, Chonbuk National University; J. Yun, Electronics and Telecommunication
Research Institute; C. Kim, Sewon Teletech Inc.
WEPI-9: Characteristics of a Rotated Butterfly Radial Stub
R.K. Joshi, A.R. Harish, Indian Institute of Technology Kanpur
WEPI-10: A Novel Design of Broadband Waveguide Directional Couplers and 3 dB Hybrids
R. Monje, V. Belitsky, V. Vassilev, Chalmers University of Technology
WEPI-11: CAD of Wideband Orthomode Transducers Based on the Boifot Junction
J.A. Ruiz-Cruz, J.R. Montejo-Garai, J.M. Rebollar, Universidad Politecnica de Madrid;
C.E. Montesano, M.J. Martin, M. Naranjo-Masi, Eads-Casa
WEPI-12: A Passive Circulator with High Isolation using a Directional Coupler for RFID
W. Kim, M. Lee, Univ. of Seoul; J. Kim, H. Lim, J. Yu, KAIST; B. Jang, J. Park, Kookmin Univ.
WEPJ-1: New Reduced-Size Step-Impedance Dual-Band Filters with Enhanced Bandwidth and
Stopband Performance
M. Mokhtaari, J. Bornemann, University of Victoria; S. Amari, Royal Military College of Canada
WEPJ-2: Miniaturized Microstrip Quasi-Elliptical Bandpass Filters Using Slotted Resonators
C.F. Chen, T.Y. Huang, R.B. Wu, National Taiwan University
WEPJ-3: Compact, Coupled Strip-line Broad-Band Bandpass Filters
Y. Zhang, K.A. Zaki, University of Maryland, College Park
WEPJ-4: Dual-Band Ultra-Wideband Bandpass Filter
K. Li, D. Kurita, T. Matsui, NICT
WEPJ-5: A Miniaturized High Temperature Superconducting Bandpass Filter Using CPW
Quarter-Wavelength Spiral Resonators
Z. Ma, T. Kawaguchi, Y. Kobayashi, Saitama Univ.; D. Koizumi, K. Satoh, S. Narahashi, NTT DoCoMo,
WEPJ-6: 7 GHz-Band Quasi-Elliptic Function Narrow-Band Superconducting Filter on Sapphire
Substrate.
H. Kayano, N. Shiokawa, M. Yamazaki, T. Watanabe, F. Aiga, T. Hashimoto, Corporate Research &
Development Center
WEPJ-7: Design of Cross-Coupled Quarter-Wave SIR Filters with Plural Transmission Zeros
C. Hsu , J. Kuo, National Chiao Tung University
WEPJ-8: A Compact Step-Impedance Combline Filter With Symmetric Insertion-Loss Response
and Wide Stopband Range
Y. Chen, S. Chang, C. Chang, T. Hong, W. Lo, National Chung Cheng University
WEPJ-9: Cascadable Lossy Passive Biquad Bandstop Filter
D.R. Jachowski, Naval Research Lab
WEPK-1: Advanced Receive/Transmit Diplexer Design For Emerging mm-Wave Access Radio
Applications
U. Rosenberg, J. Ebinger, Marconi Communications GmbH; S. Amari, Royal Military College
WEPK-2: Chebyshev Synthesis for Multi-Band Microwave Filters
F. Seyfert, P. Lenoir, V. Lunot, INRIA;S. Bila, IRCOM; R.J. Cameron, COMDEV
WEPK-3: Ridge Waveguide Divider Junctions for Wide-band Multiplexer Applications
Y. Zhang, J.A. Ruiz-Cruz, K.A. Zaki, University of Maryland, College Park
WEPK-4: A Compact Multi-Layered Ultra-Wideband Bandpass Filter With Plural Transmission
Zeros and Improved Out-of-Passbands
A. Tanaka, Y. Horii, Kansai University
WEPK-5: Microwave Breakdown in RF Devices Containing Sharp Corners
T. Olsson, Powerwave Tech Sweden AB; U. Jordan, D. Anderson, M. Lisak, Chalmers Univ. of
Tech.; D.S Dorozhkina, V.E. Semenov, Inst. of Appl. Physics; J. Puech, Centre Nat’l d’Etudes
Spatiales; I.M. Nefedov, I.A. Shereshevskii, Inst. of Physics of Micrestructures
WEPK-6: Design of Ku-band Filter based on Substrate-Integrated Circular Cavities (SICCs)
B. Potelon, J. Bohorquez, J. Favennec, C. Quendo, E. Rius, C. Person, Lest
WEPK-7: Efficient and Accurate Consideration of Ohmic Losses in Waveguide Diplexers and
Multiplexers
M. Taroncher, J. Hueso, S. Cogollos, A. Vidal, V.E. Boria, Universidad Politcnica de Valencia;
B. Gimeno, Universidad de Valencia
WEPK-8: A Novel Tuning Structure for Bandstop Filter
Y. Liu, W. Dou, Southeast University; L. Yu, Saigew Microwave Co., Ltd;
WEPL-1: Implementation of Second-order Ku-band Chip Filter on Si Substrate with Commercial
0.18 μm CMOS Technology
Y. Chiang, H. Chiu, W. Hsieh, Chang Gung University
WEPL-2: Self Adaptive Microwave Filters
S. Middleditch, I.C. Hunter, R.D. Pollard, The University of Leeds
WEPL-3: The Stacking of Integrated Passive Devices, Substrates, and RFICs to Make Ultra-thin
Modules using Organic Liquid Crystalline Polymer (LCP) Technology
J. Dekosky, S. Lapushin, S. Dalmia, W. Czakon, G. White, Jacket Micro Devices
WEPL-4: Compact Left-handed Dual Mode Notch Bandstop Filter
W. Tong, Z. Hu, The University of Manchester
WEPM-1: Microwave Nonlinear Directional Coupler Based on Ferrite Film
A.B. Ustinov, M.A. Timofeeva, B.A. Kalinikos, Saint Petersburg Electrotechnical University
WEPM-2: Microwave Ferroelectric Phase Shifters Based on the Periodical Structures
A.B. Kozyrev, O.Y. Buslov, V.N. Keis, A.V. Tumarkin, I.V. Kotelnikov, St. Petersburg State
Electrotechnical University
WEPM-3: Power Handling Capability of Ferroelectric Film Varactors and Tunable Microwave
Devices
T. Samoilova, A. Ivanov, A. Kozyrev, O. Soldatenkov, Electrotechnical University; M. Zelner,
I. Koutsaroff, T. Bernacki, A. Cervin-Lawry, Gennum Corp.
WEPM-4: Design of Duplexer Inserts for Mobile Phone Module Applications
F.M. Pitschi, J.E. Kiwitt, RK.C. Wagner, EPCOS AG; A. Fleckenstein, W. Menzel, University of Ulm;
R.D. Koch, . Weigel, University of Erlangen-Nuremberg
WEPN-1: Force Coupled Elecrostatic RF MEMS SP3T Switch
C. Kim, Y. Hong, S. Lee, S. Kwon, I. Song, Samsung Advanced Institute of Technology
WEPN-2: Fabrication and Performance of Piezoelectric MEMS Tunable Capacitors Constructed
with AlN Bimorph Structure
T. Nagano, M. Nishigaki, K. Abe, K. Itaya T. Kawakubo, Toshiba Corp.
WEPN-3: Micromachined Millimeter-wave Ridge Waveguide Filter with Embedded MEMS Tuning
Elements
W.D. Yan, R.R. Mansour, University of Waterloo
44
PANEL SESSIONS
Our symposium this year will feature 5 lunchtime panel sessions. Two of these are sponsored by RFIC and three are sponsored by
IMS2006. Experts from industry and academia will discuss trends and requirements in various areas.
Date & Time:
Organizers:
4G: DO WE REALLY NEED 1 GBITS/S?
Monday, June 12, 2006; 12:00 PM–1:20 PM
DUELING DUALITIES: HOW TO BEST MARRY TIME-DOMAIN
SYSTEM-LEVEL VERIFICATION WITH FREQUENCY-DOMAIN
RF CIRCUIT SIMULATIONS?
Date & Time: Wednesday, June 14, 2006; 12:00 PM–1:20 PM
Chris Rudell, Intel
Yann Deval, IXL Lab
Stefan Heinen, RWTH Aachen University
Room: 103
Sponsor:
MTT-23 RFIC
Panel:
Bernd Adler, Infineon
David Ched, Spreadtrum
Barry Davis, Intel
Steve Lloyd, Beceem
Bill McFarland, Atheros
The RF community is currently running after high bit rates in
wireless communications. Looking for hundreds of megabit per
seconds large bandwidths are needed, while there is not that
much available. Thus future applications are pushed towards
higher frequencies. Specific modulation schemes are needed too
which, in return, make the design of RF system more and more
complex. But is the consumers’ demand on high bit rate applications a reality? Is wireless communications at 1-gigabit-per-second a mass market requirement, or are there only a very few
number of potential customers, making the effort to develop
such applications a waste of time — and money? Are there that
many phone users looking for high-resolution TV programs on a
tiny screen, or do they just want to talk in their handset? Are we
making things harder just for the fun of it? To answer these
questions and others, panelists from semiconductor, data links
and cell phone companies will present their views and will debate with the attendees.
Date & Time:
Organizers:
Organizer:
Colin Warwick, The MathWorks, Inc.
Sponsor:
MTT-1, IMS
Panel:
Ashok Bindera, RF Design Magazine
Marc Petersen, Agilent Technologies
Juergen Hartung, Cadence Design Systems
Colin Warwick, The MathWorks Inc.
Rick Roberts, Harris Corp.
Yasunori Miyahara, Matsushita Electric,
Network Development Center
TBD, RF Micro Devices
Meeting spec is not enough. The real question teams want to
answer before committing to a tape-out is, “Will this RF circuit
work in the target system?” where the target system is typically
a complicated signal processing or communication system, including both hardware and embedded software.
System-level test harnesses can be built, but are generally
time-domain baseband-complex models where transient behavior is important. Circuit simulators on the other hand tend to be
frequency-domain, passband, and steady-state. Time-domain
and frequency-domain are theoretically a duality, but as a practical matter, merging these domains is tricky. How best to bring
these two domains together, and eliminate those sleepless nights
after tape-out?
The panel will discuss pros and cons of various methods that
enable system-level verification of RF circuits. For example,
what methods offer a useful trade-off between fidelity and
speed?
SOC VS. SIP: DOLLARS & SENSE
Tuesday June 13, 2006; 12:00 PM–1:20 PM
Fazal Ali, QUALCOMM
Mike Golio, HVVi
MTT-23 RFIC
Panel:
Bill Krenik, Texas Instruments
Patrice Gamand, Philips
Andreia Cathelin, ST Microelectronic
Aravind Loke, Skyworks
Jeanne Pavio, Rockwell Collins
Tom Gregorich, Qualcomm
Participant, AMKOR
RF PA TECHNOLOGY ROADMAP
WIRELESS INFRASTRUCTURE
Wednesday, June 14, 2006; 12:00 PM–1:20 PM
FOR
Date & Time:
Room: 102
Sponsor:
Room: 102
Recent years have seen dramatic miniaturization in the implementation of radio, microprocessor, memory and signal processing functions on mobile handsets. This increase in levels of integration is driven by the reduction in size, weight and cost as well
as improvements in reliability realized in the resulting integrated
radio. But these advantages are accompanied by engineering
challenges related to all aspects of design, manufacturing and
test.
Two distinct approaches: System on a Chip (SoC) and System
in a Package (SiP) have evolved in addressing the mobile phone
real-estate to support additional non-voice features.
The objective of this panel session is to compare the potential
of each of these technologies to achieve size, weight and cost improvements. The participants will also discuss the relative merits
and challenges these approaches offer in the area of design,
manufacturing and test of integrated handset radios.
Organizers:
Carlo Poledrelli, Philips Semiconductors
Yuichi Hasegawa, Eudyna
Sponsor:
IMS
Panelists:
Mark Murphy, Philips Semiconductors
John Gajadharsing, Philips Semiconductors
Shigeru Nakagjima, Eudyna
William Pribble, Cree
Walter Nagy, Nitronex
Room: 307/310
The panel will address the following subjects related to wireless infrastructure: updates on latest performance of LDMOS
transistors, future trends in LDMOS technology and product development, advances in GaN technology, maturity level of GaN
technology and updates on latest performance of GaN HEMTs.
The goal for the panelist will be to answer some fundamental
questions:
“has LDMOS technology really reached it’s saturation limit?”
“when can we expect reliable products in GaN technology for
wireless infrastructure?”
“how long will LDMOS hold against GaN?”
[Continued on page 53]
45
THURSDAY, JUNE 15, 2006
TH1B High Voltage Power Amplifiers
and Mixers
Chair: D.Hornbuckle
Co-chair: H. Huang
MOSCONE 304
TH1C Solid State High Power
Amplifiers
Chair: J. Komiak
Co-chair: K. Ikossi
MOSCONE 305
8:00–9:40 AM
TH1D New Developments in Passive
Components
Chair: J. Owens
Co-chair: J. Taub
MOSCONE 306
TH1A-1: Confined Planar Helix: A Novel
Waveguide Structure
S. Aditya, Q.H. Pham, M. Tan, R. Nair,
Nanyang Technological University
TH1B-1: Ultra-Broadband GaAs HIFET
MMIC PA
A.K. Ezzeddine, H.C. Huang, AMCOM
Communications, Inc.
TH1C-1: A 330 W Distortion-Cancelled
Doherty 28 V GaAs HJFET Amplifier with
42% Efficiency for W-CDMA Base Stations
I. Takenaka, K. Ishikura, H. Takahashi,
T. Ueda, K. Hasegawa, T. Kurihara, K. Asano,
NEC Compound Semiconductor Devices Ltd.
TH1D-1: Electromagnetic Investigation on
RF Spiral Inductors with Inhomogeneous
Patterned Deep-trench Isolation
S. Wane, D. Bajon, Supaero
TH1A-2: Sommerfeld Wires at Terahertz
Frequencies
M. Wchter, M. Nagel, H. Kurz, RWTH Aachen
TH1B-2: Linear Broadband GaN MMICs for
Ku-band Applications
P. Schuh, R. Leberer, H. Sledzik, D. Schmidt,
M. Oppermann, B. Adelseck, H. Brugger, EADS
Deutschland GmbH; R. Quay, F. van Raay,
M. Seelmann-Eggebert, R. Kiefer, W. Bronner,
Frauhoer Inst of App. Solid State Physics
TH1C-2: A High Power Asymmetric Doherty
Amplifier with Improved Linear Dynamic
Range
J.Y. Lee, J.Y. Kim, J.H. Kim, Kwangwoon
University; K.J. Cho, S.P. Stapleton, Simon
Fraser University
TH1D-2: Miniature CPW Inductors for 3-D
MMICs
V.T. Vo, L. Krishnamurthy, Q. Sun,
A.A. Rezazadeh, The University of Manchester
TH1A-3: Low Profile Slotted Flat Waveguide
Leaky Wave Antenna
J. Zehentner, J. Machac, P. Zabloudil, Czech
Technical University in Prague
TH1B-3: Linearity and Efficiency
Performance of GaN HEMTs with Digital
Pre-Distortion Correction
M.J. Poulton, W.K. Leverich, J.B. Shealy,
R. Vetury, J.D. Brown, D.S. Green, S.R. Gibb,
RF Micro Devices
TH1C-3: High Linearity 60 W Doherty
Amplifier for 1.8 GHz W-CDMA
T. Yamamoto, T. Kitahara, S. Hiura, Toshiba
Corp., Corporate Manufacturing Engineering
Center
TH1D-3: 3-D Integrated Inductors and
Transformers on Liquid Crystal Polymer
Substrate
D. Weon, L.P. Katehi, S. Mohammadi, Purdue
University
8:40 AM
D. Jackson, University of Houston
8:50 AM
___________________________________
TH1A-4: Effects of Dielectric and Conductor
Losses on the Current Spectrum Excited by a
Gap Voltage Source on a Printed-Circuit Line
J. Bernal, F. Mesa, University of Seville;
TH1A-4: Effects of Dielectric and Conductor
Losses on the Current Spectrum Excited by a
Gap Voltage Source on a Printed-Circuit
Line
J. Bernal, F. Mesa, University of Seville;
D. Jackson, University of Houston
9:00 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
TH1A High-Frequency Effects and
Novel Structures
Chair: J. Zehentner
Co-chair: Z.J. Cendes
MOSCONE 303
___________________________________
TH1A-5: Time-Domain Pulse Propagation on
a Microstrip Transmission Line Excited by
a Gap Voltage Source
W.L. Langston, J.T. Williams, D.R. Jackson,
University of Houston; F. Mesa, University of
TH1C-4: Efficiency Enhancement of 250 W
Doherty Power Amplifiers Using Virtual
Open Stub Techniques for UHF-band OFDM
Applications
K. Horiguchi, S. Ishizaka, M. Nakayama,
R. Hayashi, Y. Isota, T. Takagi, Mitsubishi
Electric; T. Okano, Japan Broadcasting Corp.
TH1B-4: AlGaN/GaN Dual-Gate HEMT
Mixers for 24 GHz Pulse-Modulation
K. Shiojima, T. Makimura, T. Kosugi,
T. Suemitsu, N. Shigekawa, M. Hiroki,
H. Yokoyama, NTT Corp.
TH1D-4: Miniaturized Resonator Using a
Truncated Planar Mbius Strip
M.J. Kim, C.S. Cho, Hakuk Avaiton University;
J. Kim, Kangwon National University
TH1C-5: 370 W Output Power GaN-FET
Amplifier with Low Distortion for W-CDMA
Base Stations
A. Wakejima, K. Matsunaga, Y. Okamoto, K.
Ota, Y. Ando, T. Nakayama, H. Miyamoto, The
R&D Association for Future Electron Devices
TH1D-5: Novel Ka-band IR Controlled
Dielectric Image Guide Components
S. Lin, S. Gigoyan, J. Wilson, A.E. Fathy, The
University of Tennessee
TH1C-6: A 6 to 16 GHz Linearized GaN Power
Amplifier
M.V. Kubak, Linearizer Technology Inc.; A.
Katz, The College of New Jersey; G.C.
DelSalvo, Northrop Grumman Corp.
TH1D-6: Modeling, Design, Fabrication and
Performance of Rectangular Micro-Coaxial
Lines and Components
D.S. Filipovic, Z.B. Popovic, K.J Vanhille, M.
Lukic, S. Rondineau, M.Buck, Univ of CO; G.
Potvin, D. Fontaine, BAE Systems; C. Nichols,
D. Sherrer, S. Zhou, W. Houck, D. Fleming,
Rohm & Hass; W. Wilkins, V. Sokolov, E.
Daniel, Mayo Clinic; J. Evans, DARPA
9:10 AM
Seville
TH1A-5: Time-Domain Pulse Propagation on
a Microstrip Transmission Line Excited by
a Gap Voltage Source
W.L. Langston, J.T. Williams, D.R. Jackson,
University of Houston; F. Mesa, University of
Seville
TH1B-5: High-Voltage CMOS Compatible SOI
MESFET Characterization and Spice Model
Extraction
A. Balijepalli, J. Ervin, P. Joshi, J. Yang,
Y. Cao, T. Thornton, Arizona State University
________________________
9:30 AM
9:20 AM
TH1A-6: Modeling Large Screens via
Homogenization with the Finite Element
Method
I. Bardi, M. Vogel, Z. J. Cendes, Ansoft Corp.
TH1B-6: Integrated Raman IR
Thermography on AlGaN/GaN Transistors
M. Kuball, A. Sarua, H. Ji, University of
Bristol; M.J. Uren, R.S. Balmer, T. Martin,
QinetiQ Ltd.
TH1A-6: Modeling Large Screens via
Homogenization with the Finite Element
Method
I. Bardi, M. Vogel, Z. J. Cendes, Ansoft Corp.
TH1C-7: X-band High-Power Microstrip
AlGaN/GaN HEMT Amplifier MMICs
F. van Raay, R. Quay, Fraunhofer Institute of
Applied Solid-State Physics
46
TH1F Microwave CAD with Neural
Networks and Fuzzy Logic
Chair: A. K. Sharma
Co-chair: Q.J. Zhang
MOSCONE 302
TH1G Nonlinear Measurement
and Component Characterization
Techniques
Chair: D. Schreurs
Co-chair: A. Ferrero
MOSCONE 300
TH1E-1: Low-Cost Ka-band Transmitter for
VSAT Applications
G. Gauthier, Thales Airborne Systems;
J. Bertinet, Thales Microelectronics;
J. Schroth, EADS Deutschland GmbH
TH1F-1: Efficient Harmonic Balance
Simulation of Nonlinear Microwave Circuits
with Dynamic Neural Models
Y. Cao, L. Zhang, J. Xu, Q. Zhang, Carleton
University
TH1G-1: Fine Frequency Grid Phase
Calibration Setup for the Large Signal
Network Analyzer
L. Gomme, A. Barel, Y. Rolain, F. Verbeyst,
Vrije Universiteit Brussel
TH1E-2: Tx Leakage Cancellers for 24 GHz
and 77 GHz Vehicular Radar Applications
C. Kim, J. Kim, J. Oum, J. Yang, S. Hong,
KAIST; D. Kim, J. Choi, S. Kwon, SAIT;
S. Jeon, J. Park, Knowledge*on
TH1F-2: A Multilayered Shielded Microwave
Circuit Design Method Based on Genetic
Algorithms and Neural Networks
J. Pascual-Garcia, F. Quesada-Pereira,
D. Caete-Rebenaque, J.L. Gomez-Tornero,
A. Alvarez-Melcon, Technical University of
Cartagena
TH1G-2: Accurate Phase Measurements of
Broadband Multitone Signals using a
Specific Configuration of a Large Signal
Network Analyzer
M. El Yaagoubi, G. Neveux, D. Barataud,
J. Nebus, University of Limoges IRCOM;
J. Verspecht, BVBA
TH1F-3: Effective Design of Cross-coupled
Filter using Neural Networks and Coupling
Matrix
Y. Wang, M. Yu, COM DEV Ltd; H. Kabir,
Q. Zhang, Carleton University
TH1G-3: A Novel Load-Pull Setup Allowing
the Intermodulation Measurement of Power
Transistors under Pulsed DC and Pulsed RF
Conditions
H. Bousbia, D. Barataud, G. Neveux, J. Nebus,
J. Teyssier; T. Gasseling, AMCAD Engineering
TH1E-3: Transmitter Noise Cancellation in
Monostatic FMCW Radar
K. Lin, Y.E. Wang, University of California,
Los Angeles
TH1E-4: Superregenerative Incoherent UWB
Pulse Radar System
T. Wuchenauer, M. Nalezinski, Siemens AG;
W. Menzel, University of Ulm
THURSDAY
9:10 AM
TH1G-5: Improvement of Oscilloscope Based
RF Measurements by Statistical Averaging
Techniques
C. Fager, K. Andersson, Chalmers University
of Technology
TH1E-5: Receiver and Synchronization for
UWB Impulse Radio Signals
N. Deparis, A. Boe, C. Loyez, N. Rolland,
P. Rolland, Iemn Ircica
TH1F-5: Automated Microwave Filter
Tuning by Extracting Human Experience in
Terms of Linguistic Rules Using Fuzzy
Controllers
V. Miraftab, R. R. Mansour, University of
Waterloo
9:20 AM
9:30 AM
TH1G-4: A Novel Active
Differential/Common-Mode Load for True
Mixed-Mode Load-Pull Systems
A. Ferrero, V. Teppati, Politecnico di Torino
TH1F-4: Systematic Design and Yield
Optimization of RF and Millimeter-wave
Oscillators using Neuro-Genetic Algorithm
P. Sen, R. Mukhopadhyay, S. Sarkar, S. Pinel,
J. Laskar, Georgia Electronic Design Center;
R.J. Pratap, Intel Corp.; C.H. Lee, Samsung
RFIC Design Center, at Georgia Tech.
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
TH1E Advances in Wideband
Communication and Radar Systems
Chair: R. Knoechel
Co-chair: W.G. Lyons
MOSCONE 301
TH1E-6: Effects of Systematic FMCW Radar
Sweep Nonlinearity on Bias and Variance of
Target Range Estimation
S. Scheiblhofer, S. Schuster, A. Stelzer,
Johannes Kepler University
47
TH2C Efficiency Enhancement and
Linearization Technology
Chair: J. Schellenberg
Co-chair: F. Ghannouchi
MOSCONE 305
10:10–11:50 AM
TH2A Analysis and Applications of
Guided-Wave and Periodic Structures
Chair: T. K. Sarkar
Co-chair: K. Chang
MOSCONE 303
TH2B Microwave and
Millimeter-Wave Transceiver and
Frequency Conversion MMICs
Chair: P. Watson
Co-chair: D. Meharry
MOSCONE 304
TH2D Couplers and Baluns
Chair: P. Russer
MOSCONE 306
TH2A-1: Modal Analysis of Arbitrary-shaped
2D Periodic Structures Printed on a
Grounded Dielectric Slab: Real and Complex
Solutions
P. Baccarelli, S. Paulotto, C. Di Nallo, La
Sapienza University of Rome
TH2B-1: 65 GHz Doppler Radar Transceiver
with On-Chip Antenna in 0.18 μm SiGe
BiCMOS
T. Yao, L. Tchoketch-Kebir, O. Yuryevich,
M. Gordon, S. P. Voinigescu, University of
Toronto
TH2C-1: Multi-Port Amplifier Operation for
Ka-band Space Telecommunication
Applications
A. Mallet, J. Sombrin, R. Rodriguez, CNES;
A. Anakabe, University of Basque Country;
F. Coromina, ESA/Estec
TH2D-1: Millimeter-Wave Lange and
Ring-Hybrid Couplers in a Silicon
Technology for E-Band
M.K. Chirala, Texas A&M University;
B.A. Floyd, IBM T.J. Watson Research Center
TH2A-2: Periodic Defects in 3D
Electromagnetic Band-Gap Media
F. Frezza, L. Pajewski, G. Schettini, La
Sapienza University
TH2B-2: MMIC and Module Design and
Performance for Millimetric Transceiver
Front-ends for Transport Applications
J.R. Powell, P.D. Munday, A.W. Tang, QinetiQ
Ltd.; R. Hunt, D.J. Gunton, BAE Systems ATC
TH2C-2: DVB-T Power Amplifiers Modelling
and Compensation
C. Raynal, D. Masse, P. Kasser, TDF; J. Cancs,
V. Meghdadi, Universit de Limoges
TH2D-2: A 10–40 GHz 7 dB Directional
Coupler in Digital CMOS Technology
Y. Zhu, H. Wu, University of Rochester
TH2C-3: Memory Correction of a Doherty
Power Amplifier with a WCDMA Input using
Digital Predistortion
R.N. Braithwaite, Powerwave Technologies
TH2D-3: A $180^\circ$ Hybrid Based on
Coupled Asymmetrical Artificial
Transmission Lines
Z. Liu, R.M. Weikle, University of Virginia
TH2B-3: Up- and Downconverter MMICs for
60 GHz Broad-Band Telecommunication
M. Varonen, M. Krkkinen, J. Riska,
P. Kangaslahti, K.A. Halonen, Helsinki
University of Technology
TH2C-4: Feedforward Amplifier using Equal
Group-Delay Signal Canceller
Y. Jeong, Chonbuk National University;
D. Ahn, Soonchunhyang University; C. Kim,
Sewon Teletech Inc.; I. Jang, Sogang
University
TH2D-4: Dual-band Rat-Race Coupler with
Bandwidth Enhancement
C.P. Kong, K.K. Cheng, The Chinese
University of Hong Kong
TH2A-4: Investigation on the Dispersion
Relation of a 3D LC-based Metamaterial
with an Omnidirectional Left-Handed
Frequency Band
M. Zedler, P. Russer, Lehrstuhl f. HF-Technik
TH2B-4: A High 2LO-RF Isolation
GaInP/GaAs HBT Sub-Harmonic Gilbert
Mixer Using Three-Level Topology
T. Wu, C. Meng, National Chiao Tung
University; G. Huang, National Nano Device
Labs
TH2C-5: High Efficiency Envelope Tracking
LDMOS Power Amplifier for WCDMA
P.J. Draxler, QUALCOMM Inc.; D. Kimball, C.
Hsia, J. Jeong, P.M. Asbeck, University of
Califorrnia, San Diego; S. Lanfranco, Nokia
Corp.; J. van de Sluis, Philips Semiconductor
TH2D-5: Bandpass Directional Couplers
with Electromagnetically-Coupled
Resonators
H. Uchida, N. Yoneda, Y. Konishi, S. Makino,
Mitsubishi Electric Corp.
TH2A-5: Excitation of an Open Cavity via
HE11 Excited Single Mode Optical Fiber for
a Fabry-Perot Interferometer
M.A. Salem, E. Niver, K.K. Chin, New Jersey
Instiutte of Technology
TH2A-6: Tunable Omnidirectional
Resonance in Metal-Dielectric-Metal
Structures and Tunable Frequency Selective
Plasmonic Waveguides
A. Hosseini, Y. Massoud, Rice University
TH2B-5: Broadband Gilbert Micromixer
With an LO Marchand Balun and a TIA
Output Buffer
S. Tseng, C. Meng, C. Chang, C. Wu, National
Chiao Tung University; G. Hung, National
Nano Device Labs
TH2A-7: Solution of Dispersion Equation by
a Derivative Free Quadrature Method
K. Du, R. Mittra, The Pennsylvania State
University
TH2B-6: A Ka-band, Low Power Dissipation,
High Spectral Purity GaAs pHEMT MMIC x4
Multiplier
P. Sandhiya, J.G. Mayock, C. Buck, Filtronic
Compound Semiconductor Ltd.
11:40 AM
11:30 AM
11:10 AM
TH2A-3: A New 2D FDTD Method for Solving
3D Guided-wave Structures
S. Luo, Z. Chen, Dalhousie University
11:20 AM
11:00 AM
10:50 AM
10:40 AM
10:30 AM
10:20 AM
10:10 AM
TH2D-6: Design of Miniaturized LTCC
Baluns
Y. Guo, Z. Zhang, L. Ong, Institute for
Infocomm Research
TH2C-6: A Low Distortion 25 W Class-F
Power Amplifier Using Internally Harmonic
Tuned FET Architecture for 3.5 GHz OFDM
Applications
S. Goto, T. Kunii, K. Izawa, A. Inoue,
M. Kohno, T. Oku* T. Ishikawa, Mitsubishi
Electric Corp.; T. Oue, Wave Technology Inc.
TH2A-8: Multi-element Variable-length
Cylindrical Posts in Rectangular Waveguide
J. Roelvink, A. Williamson, The University of
Auckland
TH2D-7: Novel Broadband Planar Balun
Using Multiple Coupled Lines
Y. Chen, Industrial Technology Research
Institute
TH2C-7: A 71.9% Power-Added-Efficiency
Inverse Class-F LDMOS Power Amplifier
C. Duperrier, F. Temcamani, ENSEA and
UCP; S. Allam-Ouyahia, C. Tolant,
P. Eudeline, Thales Air Defence
48
TH2F Effective CAD Techniques
for Modeling and Design
Chair: J.E. Rayas-Sanchez
Co-chair: P.J. Draxler
MOSCONE 302
TH2G Materials Measurement
Chair: M. Janezic
Co-chair: B. Szendrenyi
MOSCONE 300
TH2E-1: Accuracy of A Low-Power Ka-band
Non-Contact Heartbeat Detector Measured
from Four Sides of a Human Body
Y. Xiao, C. Li, J. Lin, University of Florida
TH2F-1: EM-Based Statistical Analysis and
Yield Estimation Using Linear-Input and
Neural-Output Space Mapping
J.E. Rayas-Snchez, V. Gutirrez-Ayala, ITESO
TH2G-1: A Microfabricated Near-Field
Scanned Microwave Probe for Non-Contact
Dielectric Constant Metrology of Low-k
Films
V.V. Talanov, A. Scherz, A.R. Schwartz,
Neocera Inc.
TH2E-2: A High Precision Wideband Local
Positioning System at 24 GHz
C. Meier, A. Terzis, DaimlerChrysler
Research; S. Lindenmeier, University of the
Bundeswehr
TH2F-2: Space Mapping Optimization
Algorithms for Engineering Design
S. Koziel, McMaster University; K. Madsen,
Technical University of Denmark;
TH2G-2: Measurements and Analysis of
Microwave Nonlinearities in Ferroelectric
Thin Film Transmission Lines
J. Mateu, J.C. Booth, S.A. Schima, National
Institute of Standards and Technology;
C. Collado, D. Seron, J.M. O’Callaghan,
Universitat Politecnica de Catalunya
TH2F-3: Antenna Design through Space
Mapping Optimization
J. Zhu, N. Nikolova, S. Koziel, McMaster
University; J.W. Bandler, Bandler Corp.
TH2G-3: Dual-Band Permittivity
Measurement of Thin Dielectric Layers with
a Simple Planar Device
A. Ocera, M. Dionigi, E. Fratticcioli,
R. Sorrentino, University of Perugia
TH2F-4: Rational Function Fitting of
Electromagnetic Transfer Functions from
Frequency-Domain and Time-Domain Data
S. Moon, A.C. Cangellaris, University of
Illinois at Urbana-Champaign
TH2G-4: A New Cavity Perturbation
Technique for Accurate Measurement of
Dielectric Parameters
M. Lin, M.N. Afsar, Tufts University
TH2E-3: A Self-Calibrating Low-Cost Sensor
System for Moisture Monitoring of Buildings
T. Sokoll, A.F. Jacob, Tech. Univ. HamburgHarburg
TH2F-5: Sparse Macromodeling for
Nonlinear Networks
M. Ma, R. Khazaka, McGill University
11:20 AM
TH2G-5: Sensitivity Analysis and
Experimental Investigation of Microstrip
Resonator Technique for the In-process
Moisture/Permittivity Measurement of
Petrochemicals and Emulsions of Crude Oil
and Water
K.K. Joshi, Sir Parshurambhau College;
R.D. Pollard, The University of Leeds
11:40 AM
11:30 AM
TH2E-5: A Multi-Channel Radiometer with
Focal Plane Array Antenna for W-band
Passive Millimeter-wave Imaging
J. Richter, L. Schmidt, University of Erlangen;
D. Noetel, F. Kloeppel, J. Huck, H. Essen,
Research Establishment for Applied Science
FGAN
49
THURSDAY
TH2E-4: Design Consideration of UHF RFID
Tag for Increased Reading Range
J. Lee, H. Kwon, B. Lee, Kyung Hee University
11:10 AM
11:00 AM
10:50 AM
10:40 AM
10:30 AM
10:20 AM
10:10 AM
TH2E Sensors and Sensor Systems
Chair: P. Staecker
Co-chair: G. Hopkins
MOSCONE 301
1:20–3:00 PM
TH3B Novel Components
and ICs for Wideband Amplifiers
Chair: Z. Bardai
Co-chair: C.P. Wen
MOSCONE 304
TH3C Frequency Conversion
Chair: B. Nelson
Co-chair: K. Itoh
MOSCONE 305
TH3D Compact Dividers and Couplers
Chair: M. Salazar-Palma
Co-chair: M. D. Abouzahra
MOSCONE 306
TH3A-1: Propagation Features of
Metamaterial NRD Waveguides
P. Baccarelli, P. Burghignoli, F. Frezza,
A. Galli, P. Lampariello, S. Paulotto, La
Sapienza University of Rome
TH3B-1: A DC-43 GHz Bandwidth 30 dB Gain
Amplifier
Z. Lao, K. Guinn, J. Jensen, S. Thomas,
C. Fields, M. Sokolich, HRL Labs
TH3C-1: A 0-20 dB Step Linearized
Attenuator with GaAs-HBT Compatible,
AC-Coupled, Stack Type Base-Collector Diode
Switches
K. Yamamoto, M. Miyashita, T. Moriwaki,
S. Suzuki, N. Ogawa, T. Shimura, Mitsubishi
Electric Corp.
TH3D-1: A Semi-Lumped Miniaturized
Spurious Less Frequency Tunable Three-port
Divider\Combiner with 20 dB Isolation
Between Output Ports
A. Perrier, University of Savoie; O. Exshaw,
J. Duchamp, P. Ferrari, INP of Grenoble
TH3A-2: Leaky-Wave Steering in a
Two-Dimensional Metamaterial Using Wave
Interaction Excitation
A. Lai, K.M. Leong, T. Itoh, University of
TH3B-2: A High Linearity 5 Bit, X-band SiGe
HBT Phase Shifter
J.P. Comeau, M.A. Morton, J.D. Cresser,
J. Papapolymerou, Georgia Institute of
Technology; M. Mitchell, Georgia Tech.
Research Institute
TH3C-2: Highly Integrated 60 GHz band x12
Multiplier MMIC
M. Ito, S. Kishimoto, T. Morimoto, Y. Hamada,
K. Maruhashi, NEC Corp.
TH3D-2: A New Leaky-Wave Directional
Coupler in Hybrid Dielectric-Waveguide
Printed Circuit Technology
J.L. Gmez-Tornero, S. Martnez-Lpez, D.
Caete-Rebenaque, J. Pascual-Garca, A. lvarezMelcn, Technical University of Cartagena
TH3C-3: A 60 GHz Band Compact IQ
Modulator MMIC for Ultra High Speed
Wireless Communications
Y. Hamada, K. Maruhashi, M. Ito, S.
Kishimoto, T. Morimoto, K. Ohata, NEC Corp.
TH3D-3: Design of Cruciform Directional
Couplers in E-Plane Rectangular Waveguide
M. Kishihara, K. Yamane, Okayama
Prefectural University; I. Ohta, University of
Hyogo
TH3C-4: A Low Flicker Noise CMOS Mixer
Using Two Resonating Inductors for Direct
Conversion Receivers
J. Park, C. Lee, J. Laskar, Georgia Institute of
Technology; B. Kim, Sungkyunkwan
University
TH3D-4: Design of Various Compact
Branch-Line Couplers by Using Artificial
Transmission Lines
K. Chang, K. Nam, J. Kim, Chung Ang Univ.
TH3B-3: A Closed-Loop Power Control
Circuit for UWB 24 GHz Automotive Radar
Transmitter
Y. Lu, I. Gresham, A. Jenkins, M/A-COM Inc.
TH3A-3: Wave Channelling in Higher Order
Anisotropic Tunable Meshes with Capacitive
Control
E.P. Brennan, A.G. Schuchinsky, V.F. Fusco,
Queen’s University Belfast
TH3B-4: A Compact Over-Voltage Protection
Circuit for HBT Power Amplifiers
Y. Ma, H. Zhang, G.P. Li, Rockwell Scientific
Co.
TH3A-4: Simple Analytical Dispersion
Equations for the Shielded Sievenpiper
Structure
F. Elek, G.V. Eleftheriades, University of
Toronto
TH3B-5: A Millimeter-wave Low-Loss and
High-Power Switch MMIC using Multiple
FET Resonators
M. Hangai, T. Nishino, K. Miyaguchi,
M. Hieda, K. Endo, M. Miyazaki, Mitsubishi
Electric Corp.
TH3D-5: Ultra Compact 24 GHz MMIC Quasilumped Quadrature Coupler
H.I. Cantu, V.F. Fusco, Queen’s University
Belfast
2:30 PM
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
TH3A Metamaterials –
Theory and Applications
Chair: I. Wolff
Co-chair: A.A. Oliner
MOSCONE 303
TH3B-6: Vertical Tapered Solenoidal
Inductor with Zero Spacing
K. Kang, L.W. Li, K. Mouthaan, National
University of Singapore; J.L. Shi, S.C. Rustagi,
Inst. of Microelectronics; W.Y. Yin, Shanghai
Jiao Tong University; S. Zouhdi, LGEP Suplec,
Gif-Sur-Yvette
TH3A-6: Dyadic Green’s Function for a
Right/Left-Handed Rectangular Waveguide
I.A. Eshrah, A.A. Kishk, University of
Mississippi
TH3B-7: K-band Carbon Nanotube FET
Operation
H. Zhang, A.A. Pesetski, J.E. Baumgardner,
J. Murduck, J.X. Przybysz, J.D. Adam,
Northrop Grumman
2:50 PM
2:40 PM
TH3A-5: Characteristics of Microstrip Lines
through a Metalized EBG Substrate
H. Yang, C. Zhou, Univ. of Illinois at Chicago
50
TH3C-5: A New Regenerative Divider by Four
in SiGe Bipolar Technology up to 150 GHz
S. Trotta, Infineon AG
TH3D-6: Simple-Design and Compact MIM
CRLH Microstrip 3 dB Coupled-Line Coupler
H.V. Nguyen, C. Caloz, Ecole Polytechnique de
Montreal
1:20 PM
TH3F Advanced Linear Modeling
Techniques
Chair: J. Atherton
Co-chair: W. Struble
MOSCONE 302
TH3G Novel Approaches in Packaging
Technology
Chair: K. Goverdhanam
Co-chair: E. Strid
MOSCONE 300
TH3E-1: Wireless Intracranial Pressure
Monitoring Through Scalp at Microwave
Frequencies; Preliminary Animal Study
M. Tofighi, Penn State University, Capital
College; U. Kawoos, A. Rosen, Drexel
University; F. Kralick, Hahnemann University
Hospital
TH3F-1: Space-Mapping-Based Modeling
Utilizing Parameter Extraction with
Variable Weight Coefficients and a Data
Base
S. Koziel, McMaster University; J.W. Bandler,
Bandler Corp.
TH3G-1: A 24 GHz Active Antenna in
Flip-Chip Technology with Integrated
Frontend
P.K. Talukder, M. Neuner, C. Meliani,
F.J. Schmckle, W. Heinrich,
TH3E-2: First Results of a Long-Term
Epidemiological Study on Low-Level
Microwave Exposure on Rats
D. Adang, Defense, Brussels; A. Vander Vorst,
Universit Catholique de Louvain (UCL)
TH3F-2: An Automated Algorithm for
Broadband Modeling of High Frequency
Microwave Devices
D. Paul, M.S. Nakhla, R. Achar, Carleton
University; A. Weisshaar, Oregon State
University
TH3G-2: A Practical Method for Modeling
PCB Transmission Lines with Conductor
Surface Roughness and Wideband Dielectric
Properties
T. Liang, Intel Corp., Hudson; S. Hall,
H. Heck, G. Brist, Intel Corp., Hillsboro
TH3F-3: Broadband Single-Stage Models for
Microwave Band-Pass Filters
Y. Tsai, T. Horng, National Sun Yat-Sen
University
TH3G-3: Non-hermetic Microwave
Packaging: A Reality for Space Application
P. Monfraix, L. Garcia, T. Ihorai, J. Fritsch,
R. Barbaste, C. Drevon, J. Cayrou, J. Cazaux,
Alcatel Alenia Space France
TH3E-3: Myoglobin as a Case Study for
Molecular Simulations in the Presence of a
Microwave Electromagnetic Field
F. Apollonio, M. Liberti, G. D’Inzeo, ICEmB at
La Sapienza, Univ. of Rome; M. D’Abramo,
A. Amadei, Univ. of Rome Tor Vergata;
A. Di Nola, Univ of Rome La Sapienza
TH3E-4: Broadband Permittivity
Measurements of Liquid and Biological
Samples using Microfluidic Channels
J.C. Booth, J. Mateu, M. Janezic,
J. Baker-Jarvis, J. Beall, National Institute of
Standards and Technology
TH3G-4: Selective Laser Sintering of
Multilayer, Multimaterial Circuit
Components
H.H. Sigmarsson, W.J. Chappell, Purdue
University; E.C. Kinzel, X. Xu, Purdue
University
THURSDAY
TH3E-5: SAR and Temperature Elevations in
Pacemaker Holders Exposed to EM Fields
Produced by MRI Apparatus
S. Pisa, G. Calcagnini, M. Cavagnaro,
E. Piuzzi, M. Triventi, P. Bernardi, University
of Rome La Sapienza
TH3E-6: A Comparative Study of
Multi-Channel RF Coil Arrays for HighField Brain Magnetic Resonance Imaging
S. Wang, J.H. Duyn, National Institute of
Health; P.J. Ledden, Nova Medical Inc.
2:50 PM
2:40 PM
2:30 PM
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
TH3E Biological Effects and Medical
Applications
Chair: J. Pribetich
Co-chair: M.-R. Tofighi
MOSCONE 301
51
THURSDAY, JUNE 15, 2006 • THIF INTERACTIVE FORUM • 1:30–4:30 PM
CHAIR: BALVINDER BISLA, INTEL • CO-CHAIR: MOHAMED SAYED, MICROWAVE & MMW SOLUTIONS • MCC
GATEWAY103/104
BALLROOM
MOSCONE
THPA-1: Impact of Device Scaling on Phase Noise in SiGe HBTs UWB VCOs
U.L. Rohde, A.K. Poddar, Synergy Microwave Corp.
THPA-2: Analysis of an Active Capacitance Circuit and Its Application to VCO
S. Cho, Y. Cho, H. Back, S. Yun, Sogang University
THPA-3: 24 GHz Low Power VCOs and Analog Frequency Dividers
C. Meliani, F. Lenk, W. Heinrich, Ferdinand-Braun-Institut fuer Hoechstfrequenztechnik (FBH)
THPA-4: A Novel Harmonic Noise Frequency Filtering VCO for Optimizing Phase Noise
J. Yoon, S. Lee, A. Koh, B. Shrestha, G.P. Kennedy, N. Kim, RFIC Research and Education Center;
S. Cheon, Knowledge*on Inc.
THPA-5: 4 GHz Low Phase Noise Transformer-Based Top-Series GaInP/GaAs HBT QVCO
C. Meng, S. Tseng, Y. Chang, J. Su, National Chiao Tung University; G. Huang, National Nano
Device Labs
THPA-6: A 2 GHz Oscillator Based on a Solidly Mounted Thin Film Bulk Acoustic Wave Resonator
M. Norling, S. Gevorgian, Chalmers Univ. of Technology; J. Enlund, I. Katardjiev, Uppsala Univ.
THPA-7: Requirements for Time-to-Digital Converters in the Context of Digital-PLL-based
Frequency Synthesis and GSM Modulation
U. Vollenbruch, Linz Center of Mechatronics GmbH; Y. Liu, T. Bauernfeind, T. Pittorino,
University of Linz; V. Neubauer, T. Mayer, L. Maurer, DICE GmbH & Co KG
THPA-8: Continuous Tunable Phase Shifter Based on Injection Locked Local Oscillators at 30 GHz
H. Grubinger, H. Barth, R. Vahldieck, ETH Zurich; G. von Bueren, ETH Zurich
THPB-1: Novel Design Methodology for High Efficiency Class E Microwave Frequency Triplers
E. Sandhiya, D. Denis, I. Hunter, Institute of Microwaves and Photonics
THPB-2: Si-based 60 GHz 2X Subharmonic Mixer for Multi-Gigabit Wireless Personal Area
Network Application
S. Sarkar, P. Sen, S. Pinel, J. Laskar, Georgia Electronic Design Center;C.H. Lee, Samsung RFIC
Design Center at Georgia Tech.
THPB-3: An Improved Highly-Linear Low-Power Down-Conversion Micromixer for 77 GHz
Automotive Radar in SiGe Technology
L. Wang, IHP Microelectronics; R. Kraemer, University of Cottbus
THPC-1: A High Gain Doherty Amplifier using Embedded Drivers
J. Ghim, J. Kim, Kwangwoon University; K. Cho, S.P. Stapleton, Simon Fraser University
THPD-1: New Voltage Limiting Concept for Avalanche Breakdown Protection
L. Ruijs, R. Mahmoudi, A.V. Roermund, Eindhoven, University of Technology; A.V. Bezooijen,
THPD-2: A Compact 16 Watt X-Band GaN-MMIC Power Amplifier
H. Klockenhoff, R. Behtash, J. Wrfl, W. Heinrich, G. Trnkle, Ferdinand-Braun-Institut (FBH)
THPD-3: A Novel Method for Even Odd Parametric Oscillation Stability Analysis of a Microwave
Power Amplifier.
D. Elad, R. Shaulsky, B. Mezhebovsky, Rafael — Armament Development Authority Ltd.
THPD-4: Single Supply 1 W Ku-band Power Amplifier Based on 0.25 μm E-mode PHEMT
K. Fujii, H. Morkner, Avago Technologies
THPD-5: A 0.9-5 GHz Wide-Range 1W-Class Reconfigurable Power Amplifier Employing RF-MEMS
Switches
A. Fukuda, T. Furuta, H. Okazaki, S. Narahashi, NTT DoCoMo, Inc.
THPD-6: A 1/2 Watt High Linearity and Wide Bandwidth PHEMT Driver Amplifier MMIC for
S. Chen, S. Nayak, TriQuint Semiconductor Texas
THPD-7: Ultra Compact X-band GaInP/GaAs HBT MMIC Amplifiers: 11 W, 42% of PAE on 13 mm
and 8.7 W, 38% of PAE on 9 mm
S. Piotrowicz, E. Chartier, J. Jacquet, D. Floriot, Alcatel-Thales 3-5 Lab; J. Obregon, IRCOM;
P. Dueme, J. Delaire, Y. Mancuso, Thales Airbornes Systems
THPD-8: Additive Phase Noise in Linear and High Efficiency X-band Power Amplifiers
J. Breitbarth, N. Wang, S. Pajic, Z. Popovic, University of Colorado, Boulder
THPD-9: A Fully Integrated 26.5 dBm CMOS Power Amplifier for IEEE 802.11a WLAN Standard
with On-chip Power Inductors
H. Solar, R. Berenguer, I. Adin, U. Alvarado, I. Cendoya, Centro de Estudios e Investigaciones
Tecnicas de Guipuzcoa
THPE-1: Effect of Envelope Detectors and Filters on a Digitally Controlled RF Predistortion System
I. Teikari, K. Halonen, Helsinki University of Technology
THPE-2: MILC: A Modified Implementation of the LINC Concept
G. Poitau, WaveSat Inc.; A.B. Kouki, Ecole de Tehcnologie Superieure
THPE-3: Improvement of Power Amplifier Efficiency by Reactive Chireix Combining, Power Back
Off and Differential Phase Adjustment.
W. Gerhard, R. Knoechel, University of Kiel
THPE-4: Two-Tier Push-Pull RF Power Amplifier For Base Station Applications
D.H. Patel, E.A. Elsharawy, Arizona State University; D.W. Beishline, Freescale Semiconductor
THPE-5: 40 W Gallium-Nitride Microwave Doherty Power Amplifier
K. Cho, W. Kim, S.P. Stapleton, Simon Fraser University; J. Kim, Kwangwoon University
THPF-1: A Highly Survivable 3-7 GHz GaN Low-Noise Amplifier
M. Rudolph, R. Behtash, J. Wrfl, W. Heinrich, G. Trnkle, Ferdinand-Braun-Institut (FBH);
K. Hirche, Tesat-Spacecom GmbH & Co.
THPF-2: Plastic Packaged High Linearity Low Noise Amplifier for 13-30 GHz Multi-band Telecom
Applications
E. Byk, P. Quentin, M. Camiade, S. Tranchant, United Monolithic Semiconductors
THPF-3: Development of Cryogenic IF Low-Noise 4-12 GHz Amplifiers for ALMA Radio Astronomy
Receivers
I. Lpez-Fernndez, J. Gallego Puyol, C. Diez Gonzlez, A. Barcia Cancio, Observatorio Astronomico
Nacional
THPG-1: Advantages of GaSb/AlSb LO Phonon Depopulation Terahertz Quantum Cascade Laser
on GaAs Substrate
H. Yasuda, I. Hosako, M. Patrashin, Nat’l Institute of Inform. and Comm. Technology
THPG-2: Silicon Micromachined W-band Folded and Straight Waveguides using DRIE Technique
Y. Li, P.L. Kirby, J. Papapolymerou, Georgia Institute of Technology
THPG-3: A Non-Contacting Tunable Waveguide Backshort for Terahertz Applications
H. Xu, Z. Liu, C.H. Smith, J.L. Hesler, B.S. Deaver, R.M. Weikle, University of Virginia,
Charlottesville
THPG-4: A Compact 600 GHz Electronically Tunable Vector Measurement System for
Submillimeter-wave Imaging
R.J. Dengler, F. Maiwald, P.H. Siegel, Jet Propulsion Laboratory
THPG-5: 65 nm RFCMOS Technologies with Bulk and HR SOI Substrate for Millimeter-wave
Passives and Circuits Characterized up to 220 GHz
F. Gianesello, D. Gloria, S. Montusclat, C. Raynaud, S. Boret, C. Clement, F. Saguin, P. Scheer,
STMicroelectronics; G. Dambrine, S. Lepilliet, IEMN, Villeneuve dAscq; P. Benech, J. Fournier,
IMEP
THPG-6: On-Wafer Vector Network Analyzer Measurements in the 220-325 GHz Frequency Band
A.K. Fung, D.E. Dawson, L.A. Samoska, K.A. Lee, JPL; C. Oleson, Oleson Microwave Labs; G. Boll,
GGB Industries
THPH-1: A Fast Electro-Optical Amplified Switch using a Resistive Combiner for Multi-Pulse
Injection
E. Conforti, State University of Campinas - Unicamp, Campinas; C.M. Gallep, State University of
Campinas – Unicamp, Limeira
THPH-2: Ultra-broadband Photonic Patch Antenna
E.R. Lopez, L.A. Bui, K. Ghorbani, W.S. Rowe, A. Mitchell, RMIT University
THPH-3: Coherent, Phase Modulated (PM) Fiber-optic Link Design
Y. Li, P. Herczfeld, A. Rosen, Drexel Univ.; W. Jemison, Lafayette College
THPH-4: Self-Phase Modulation Dependent Dispersion Mitigation in High Power SSB and
DSB+Dispersion Compensated Modulated Radio-over-Fiber Links
P.C. Won, W. Zhang, J.A. Williams, Photonics Research Group
THPI-1: Modified Rational Function Modeling Technique for High Speed Circuits
R.X. Zeng, The MathWorks, Inc.; J.H. Sinsky, Bell Labs, Lucent Technologies
THPI-2: Extension of Two Signal Dynamic Range of Wideband Digital Receiver using Kaiser
Window and Compensation Method
H. Chen, Wright State University; K. George, Wright State University
THPJ-1: Macro-Modeling of High Speed Digital Board to Package Interconnections
J. Kim, J. Du, J. Yook, Advanced Computational Electromagnetics Lab.; Y. Kim, H. Kim, K. Park,
J. Kih, Signal Integrity Part
THPK-1: A Proposal for Standard to Compare Q-factor Evaluation Accuracy of Microwave
Resonator
T. Miura, University of Manchester
THPK-2: A Calibrated Microwave Directional Bridge for Remote Network Analysis through
Optical Fiber
T.S. Marshall, R. Van Tuyl, Agilent Technologies Inc.
THPK-3: The Thru-Reflection-unequal-Line (TRuL) Calibration Method with Asymmetric
R Calibrator for Multi-port Scattering Matrix Measurement
H. Lu, Y. Chou, National Taiwan University
THPK-4: SSB Noise-Figure Measurements of Frequency Translating Devices
N. Otegi, N. Garmendia, J. Collantes, University of the Basque Country; M. Sayed, Microwave
& MillimeterWave Solutions
THPK-5: Transient Analysis of Pulse Propagation on Planar Ultra-wideband Antenna by Using
Transient Electro-optic Near-field Mapping System
K. Oh, J. Song, Gwangju Institute of Science and Technology
THPL-1: Analysis of Complex Permittivity of Liposome for Its Biochemical Dynamics up to
30 GHz Range
M. Noda, M. Okuyama, T. Shimanouchi, R. Kuboi, Osaka University; H. Suzuki, Keycom Co.
THPL-2: SAR and Averaged Power Density Near a UMTS Base Station Antenna
F. Lacroux, A. Cortel-Carrasco, A. Gati, M. Wong, J. Wiart, France Telecom R&D
THPM-1: Real-Time Microwave Signal Processing Using Microstrip Technology
J.D. Schwartz, D.V. Plant, McGill University; J. Azaa, Institut National de la Recherche
Scientifique
THPN-1: UWB Radar Calibration using Wiener Filters for Spike Reduction
S. Hantscher, B. Etzlinger, A. Reisenzahn, C.G. Diskus, Johannes-Kepler-University
THPN-2: New Millimeter-wave Six-port Heterodyne Receiver Architecture
S.O. Tatu, T.A. Denidni, Institut National de la Recherche Scientifique
THPN-3: Deterministic UWB Wave Propagation Modeling for Localization Applications based on
3D Ray Tracing
C. Sturm, W. Soergel, W. Wiesbeck, Universitt Karlsruhe
THPN-4: An Ultra Wideband Transmit/Receive Module Operating from 10 to 35 GHz for Phased
Array Applications
S. Hong, K. Chang, Texas A&M University; M.R. Coutant, TriQuint Semiconductor
THPP-1: An X-band CMOS Multifunction-Chip FMCW Radar
C.C. Tzuang, H. Wu, S. Wang, S. Lee, C. Chen, C. Hsu, K. Tsai, National Taiwan University;
C. Chang, National Chiao Tung University; J. Chen, CMS, Inc.
THPP-2: Fabrication of a Miniaturized Spectrometer Based on MMIC Technology to Retrieve the
3-D Tropospheric Water Vapor Field
F. Iturbide-Sanchez, R.W. Jackson, University of Massachusetts, Amherst; S.C. Reising, Colorado
State University
THPQ-1: Capacitively Coupled Bandstop Filter with Integrated Antenna
W.S. Lee, W.G. Lim, K.S. Son, J.H. Kim, H.S. Lim, J. Yu, KAIST
THPQ-2: A Novel Antenna for Ultra Wide Band (UWB) Intelligent Antenna Systems
B. Biscontini, S. Hamid, F. Demmel, P. Russer, TU Muenchen
THPQ-3: A Coaxial Antenna for Microwave Assisted Soil Decontamination
M. Pauli, T. Kayser, J. Feiler, W. Wiesbeck, Universitaet Karlsruhe
THPQ-4: Wide Bandwidth Stacked Patch Antenna on Fourteen Layers Microwave Board
K. Ma, K.T. Chan, MEDs Technologies Pte Ltd.; S. Xiao, J. Ma, Univ. of Electronic Science and
Technology of China; K.S. Yeo, M.A. Do, Nanyang Technological Univ.
THPQ-5: Radio-over-Fiber Multi-service mm-wave Interconnection with Photonic Up-conversion,
Dual Band Remote Delivery and Photonic Envelope Detection
M. Piqueras, B. Vidal, H. Pfrommer, V. Polo, A. Ramirez, D. Zorrilla, J. Marti, Universidad
Politcnica de Valencia
THPR-1: 5.8 GHz ETC SiGe-MMIC Transceiver having Improved PA-VCO Isolation with Thin
Silicon Substrate
S. Shinjo, K. Tsutsumi, K. Nakajima, H. Ueda, K. Mori, N. Suematsu, Mitsubishi Electric Corp.,
Kamakura; M. Hieda, J. Koide, Mitsubishi Electric Corp., Amagasaki; M. Inoue, Mitsubishi
Electric Eng. Corp., Himeji
THPR-2: DC-RF Performance Improvement for Strained 0.13 μm MOSFETs Mounted on a
Flexible Plastic Substrate
H.L. Kao, A. Chin, C.C. Liao, Y.Y. Tseng, Nat’l Chiao-Tung Univ.; S.P. McAlister, National Research
Council of Canada; C.C. Chi, National Tsing Hua Univ.
THPR-3: The Analysis of Power and Linearity Characteristics of SiGe HBTs at Low Temperatures
M. Hsieh, Y. Hsin, K. Liang, Y. Chan, National Central University; D. Tang, C. Lee, TSMC, Hsin-Chu
THPR-4: A Low Power/Low Noise MMIC Amplifier for Phased-Array Applications using InAs/InSb
HEMT
W.R. Deal, R. Tsai, M.D. Lange, A. Gutierrez, Northrop Grumman Space Technology; J.B. Boos,
B.R. Bennett, Naval Research Lab
THPR-5: Single-Walled Carbon Nanotube Mixer
L. Rabieirad, S. Mohammadi, Purdue University
52
PANEL SESSIONS (cont)
RUMP SESSION
DELIVERING WINNING PRESENTATIONS:
A CRITICAL SKILL FOR ENGINEERS
Date & Time: Thursday, June 15; 12:00 PM to 1:20 PM Rm 102
Organizers:
Jean-luc Doumont, Principiae
Brenda Huettner, Microwaves101
Panel:
Jean-luc Doumont, Principiae
Brenda Huettner, Microwaves101
Richard Mateosian, IEEE Micro Review
Editor
Sponsor:
IEEE Professional Communication Society
Date & Time:
Tuesday, June 13, 2006; 7:00 PM to 8:30 PM
Location:
Marriott Salon 7
Our symposium this year will feature an evening Rump session on the life of James Clerk Maxwell. James Rautio will talk on
“The Life of James Clerk Maxwell.” This event will be hosted by
Sonnet Software and CST.
James Clerk Maxwell stands shoulder to shoulder with Newton and Einstein, yet even those of us who have spent decades
working with Maxwell’s equations are almost totally unfamiliar
with his life and times.
Tuesday, June 13, 2006 marks the 175th birth anniversary of
James Clerk Maxwell, the founder of our field of electromagnetics. Join us as we celebrate the birth of one of the most influential and far-reaching natural philosophers and get an understanding of James Maxwell from the viewpoint of a curious microwave engineer.
What was Maxwell like as an infant? What was the tragedy at
eight years old that profoundly influenced his life? When did he
publish his first papers, and what were they about? What did
Maxwell have to do with the rings of Saturn? Why did he lose his
job as a professor? What was his wife like? What is Maxwell’s
legacy to us?
These questions and more will be answered during this presentation. James Rautio will explore and provide insight into
Maxwell the person in order to add an extra dimension to those
four simple equations we have studied ever since.
Complimentary food, drinks and cake will be served immediately before the presentation. Everyone is welcome to attend.
Effective oral presentations are a key to success for engineers,
scientists, and other technical professionals, all the more so in
today’s highly competitive global marketplace. Oral presentations can have more impact than written documents or electronic exchanges, offering a richer rapport with the audience, and
enhanced nonverbal communication. Yet many speakers lack the
reference points needed to tackle the task effectively, and IMS
attendees are most likely no exception. Systematic as they otherwise can be in their work, they go at it intuitively, sometimes
haphazardly, with much good will but too seldom good results.
In line with IEEE’s current efforts to help members develop professional skills, and the increasing demand in the marketplace
for engineering information to be delivered via oral presentations, the IEEE Professional Communication Society (PCS) is
delighted to sponsor this session on how to prepare and deliver
winning presentations.
53
Date & Time:
STUDENT RECEPTION
Location:
Marriott
Date & Time:
HAM RADIO SOCIAL
Location:
Marriott
Date & Time:
WOMEN IN ENGINEERING SOCIAL
Location:
Marriott
Salon 4/5
Salon 6
Salon 1/2
NOTES
54
NOTES
55
FRIDAY TUTORIALS
TFA: TECHNIQUES OF FREQUENCY SYNTHESIS
Date & Time: Friday, June 16; 8:00 AM–12:00 PM
TFB: FUNDAMENTALS OF HF THROUGH UHF DESIGN
Location:
Location:
Topics & Speakers:
VFrequency Synthesis Techniques, Lama Dayaratna,
✗ Frequency Synthesis Techniques, Lama Dayaratna,
Lockheed
Martin
Commercial
SpaceSpace Systems
Lockheed
Martin
Commercial
VFrequency
Synthesizer
System
Design
andand
Optimization,
✗ Frequency Synthesizer System
Design
Optimization,
Cicero
Vaucher,
Philips
Research
Cicero Vaucher, Philips Research
Synthesizers,
✗VNon-Ideal
Non-Idealbehavior
behaviorininFrequency
Frequency
Synthesizers,
Peter
Radio
LabsLabs and Analog Devices
PeterWhite,
White,
Radio
✗VImprovements
Improvementsand
andIntegration
IntegrationofofPLL
PLL
Technologies,
Technologies,
RonReedy,
Reedy,
Peregrine
Semiconductor
Ron
Peregrine
Semiconductor
✗VFrequency
FrequencySynthesizer
Synthesizer
Packaging
Techniques
High
Packaging
Techniques
for for
High
ReliabilityApplications,
Applications,
Mitch
Hirokawa,
Lockheed
Reliability
Mitch
Hirokawa,
Lockheed
Martin
Commercial
Space
Systems
Martin
Commercial
Space
Organizers:
Sponsors:
Topics & Speakers:
R. Caverly,
Villanova
University
✗VRF
RFSystems,
Systems,
R. Caverly,
Villanova
University
VHF
Propagation,
E.
Johnson,
New
State Univ.
✗ HF Propagation, E. Johnson,Mexico
New Mexico
State Univ.
at RF,
W. Cantrell,
Motorola
✗VComponent
ComponentIssues
Issues
at RF,
W. Cantrell,
Motorola
andand
Matching,
H.C.H.C.
Bell, HF
PlusHF Plus
✗VRF
RFFiltering
Filtering
Matching,
Bell,
RFRF
Diodes,
R. Caverly,
Villanova
UniversityUniversity
✗VHigh
HighPower
Power
Diodes,
R. Caverly,
Villanova
RFRF
Semiconductor
Transistors,
J. Walker,
✗VHigh
HighPower
Power
Semiconductor
Transistors,
J. Walker,
Semelab
Semelab
plc plc
✗VRF
RFAmplifiers
Amplifiers,
F. Raab, Green
Mountain
Radio Research
& Transmitters,
F. Raab,
Green Mountain
✗ Radio
RF Oscillators,
Research R. Campbell, Cascade Microtech
VRF Oscillators, R. Campbell, Cascade Microtech
R. Caverly, Villanova University
Organizers: R. Caverly, Villanova University
Sponsors:
MTT-17,
HF-VHF-UHF
Technology
Sponsors:
MTT-17,
HF-VHF-UHF
Technology
Organizers:
Lama Dayaratna, Lockheed Martin
Commercial Space Systems
The workshop will present material covering issues of circuit
and system design primarily for frequencies below 1000 MHz
(UHF). The workshop will be geared for engineers either entering the RF field or for engineers “retooling” for design work in
this frequency range. The workshop topics range from an introduction of HF through UHF systems to high power components
and high power filtering, propagation and active devices seen in
such applications as transmitters, high power amplifiers, oscillators and control devices.
MTT-22 Signal Generation
and Frequency Conversion
The objective of this workshop is to provide a state of the art
review of frequency synthesizer design with special reference to
low noise techniques. This workshop is designed to be rigorous
where appropriate, while remaining accessible to engineers
without a specific background in phase locked loop design.
Technological achievements during the last decade or so in
communications have resulted widespread use of frequency synthesizer techniques. New manufacturing technologies have also
been developed to reduce the cost of such circuits. The objective of this workshop is to provide a state-of-the-art review of
frequency synthesizer techniques and applications from a design
and development perspective. Intended for RF and microwave
engineers, the workshop details out the design and development
of phase-locked loops and frequency synthesis techniques. Topics include PLL basics, VCOs, phase detectors, open and close
loop characterization, loop filter design optimizations, phase
noise analysis, frequency synthesis techniques, and fractional-N
PLL synthesis. Examples will be given including real time presentations to a variety of problems relevant to the design of frequency synthesizer circuitry. Recent developments of phaselocked loop technologies will be presented. New emerging technologies will also be addressed. The application of PLLs in
RF/microwave systems will also be highlighted by a series of presentations by industry experts. Examples will be given including
real-time presentations to a variety of problems relevant to the
design of phase-locked loop circuits.
TFC: LOW COST MICROWAVE PHOTONIC COMPONENT
TECHNOLOGIES TO ADDRESS EMERGING APPLICATIONS
Location:
Topics & Speakers:
FRIDAY
in in
Radio-astronomy
✗VApplications
ApplicationsofofMicrowave
MicrowavePhotonics
Photonics
Radio-astronomy
andSpace
SpaceCommunications,
Communications,Larry
Larry
D’Addario,
and
D’Addario,
Jet Jet
Propulsion
Laboratory
andShillue,
Bill Shillue,
National
Propulsion
Laboratory
and Bill
National
Radio Radio
Astronomy
Observatory
Astronomy
Observatory
✗VLow-cost
Low-costOpto-electronic
Opto-electronicOscillators
Oscillators
Applications
forfor
Applications
Requiring
RF
Signal
Sources
with
Very
High
Spectral
Purity,
Requiring RF Signal Sources with Very High Spectral
Purity,
Lute Maleki, OEWaves Inc.
Lute Maleki, OEWaves Inc.
✗ VCSELs for Microwave Fiber Optic Links, Anders Larsson,
VVCSELs
Microwave Fiber
Optic
Links,
Anders
Larsson,
Johanfor
Gustavsson,
Peter
Modh,
Asa
Haglund
and
Johan
Gustavsson,
Peter
Modh,
Asa
Haglund
and
Emma Söderberg, Chalmers University of Technology
Carlsson,Fibre
Chalmers
University
of Technology
✗ C.
Multimode
Radio
Links, Richard
Penty, Ian White
VMultimode
FibreUniversity
Radio Links,of
Richard
Penty, Ian White
and Xin Qian,
Cambridge
Xin Qian,
University of Cambridge
✗ and
High-speed
Electro-optic
Modulators and Other Low-cost
VHigh-speed
Modulatorsinand
Other Materials,
Low-cost
Microwave Electro-optic
Photonic Components
Polymer
Larry Dalton,
University
of Washington
University
Microwave
Photonic
Components
in Polymer and
Materials,
of Southern
Larry
Dalton,California
University of Washington and University of
✗ Southern
Recent Advances
California in Silicon Photonics: Opportunities,
Challenges
and Applications,
Mario Opportunities,
Paniccia, Intel Corp.
VRecent Advances
in Silicon Photonics:
Challenges and
Applications,
Mario
Paniccia,ofIntel
Corp.
Organizers:
Stavros
Iezekiel,
University
Leeds
Edward Ackerman, Photonic Systems, USA
Organizers: Stavros Iezekiel, University of Leeds
Sponsors:
MTT-3 Microwave Photonics
Edward Ackerman, Photonic Systems, USA
Sponsors:
56
FRIDAY TUTORIALS
Developers of photonic technologies arrive each year at the
IMS asking, “What RF systems can advantageously leverage photonics?” and are greeted by microwave engineers asking, “What
are you photonics people doing to reduce the cost of your components?” This workshop addresses both questions.
Applications that will benefit from lower-cost photonic components include wireless systems, RF links for retrieving signals
from radio-telescopes in remote locations, and optoelectronic
oscillators for generation of RF signals with unprecedented
spectral purity. This workshop begins with a review of how photonic components with sufficiently high performance and low
cost can be used in two of these application areas.
To address these needs for high-performance, low-cost photonic components, several approaches are being pursued. Vertical-cavity surface-emitting lasers enable inexpensive on-wafer
testing and optical coupling-especially to multi-mode fibers. Additionally, high-performance components are being developed in
polymers and in silicon to enable manufacturing and integration
at a much lower cost than that which results from the inorganic
and III-V materials (such as, respectively, lithium niobate and InGaAsP) historically used by photonic component designers.
vers for advances in ferrite device performance. However, there
is a significant and increasing interest in low frequency (< 2
GHz) ferrite circulators and isolators for applications covering
the range from high power (> 20 kW) isolators for material and
food processing to low power (a few watts), very compact, low
cost circulators for communications applications. The workshop
will address the design and fabrication of isolators and circulators for frequencies below 2 GHz. Topics will include high-power
isolators and circulators for industrial and particle accelerator
applications, low-power circulators for communication applications, lumped element circulator design, selection and design of
ferrite materials for low frequency device operation, and a potential new approach to generation of microwave signals using
polarized spin current injection into magnetic multi layers. Questions of power handling capability and miniaturization will be
covered in detail.
TFE: MICROWAVE AND MILLIMETER-WAVE PACKAGING 101
Location:
Topics & Speakers:
TFD: FERRITE DEVICES FOR LOW FREQUENCY APPLICATIONS
Location:
Performance
andand
Materials
Issues,
✗VTransmission
TransmissionLines:
Lines:
Performance
Materials
Issues,
S.Joy
Pinel,
Georgia
InstituteInstitute
of Technology
Laskar,
Georgia
of Technology
✗VDie
DieAttach:
Attach:Mechanical,
Mechanical,
Thermal
Electrical
Thermal
andand
Electrical
Performance,
Performance,
JeanneCollins
Pavio,Inc.
Rockwell Collins Inc.
Jeanne
Pavio, Rockwell
✗VFirst
FirstLevel
Level
Interconnects:
Wire
Bonds,
Interconnects:
Wire
Bonds,
Flip Flip
Chip,Chip,
etc., etc.,
WolfgangHeinrich,
Heinrich,
Wolfgang
✗VSecond
SecondLevel
LevelInterconnects:
Interconnects:
BGA,
Leadless, Glass Packs,
BGA,
Leadless
etc., Rick Sturdivant, Microwave Packaging Technology
Rick Sturdivant, Microwave Packaging Technology Inc.
Inc.
Materials:
LTCC, Coupling, Ground Planes,
✗VPackaging
Board Level
Design:HTCC,
Transitions,
Bill
Minehan,
Adtech
Ceramics
Inc. Inc.
Paul Garland, Kyocera America
Advances
In Materials
andLTCC,
Processing:
LCP,
✗VNew
Packaging
Materials:
HTCC,
Bill Minehan,
Adtech
John
Roman,
RJR Polymers Inc.
Ceramics
Inc.
✗ New Advances In Materials and Processing: LCP,
John Roman,
RJR Polymers
Inc. Packaging Technology
Organizers:
Rick Sturdivant,
Microwave
Inc.
Organizers:
Rick Sturdivant, Microwave Packaging
Technology Inc.
Sponsors:
MTT-12,
Microwave
and Millimeter-wave
Paul Garland,
Kyocera
America Inc.Packaging
Topics & Speakers:
VImpact on the Magnetic Circuit of Ferrite Devices by
✗ Impact on the Magnetic Circuit of Ferrite Devices by
Neodymium
toto
Use
Them,
NeodymiumBoron
BoronMagnets
Magnets- and
- andHow
How
Use
Them,
W.J.
TheThe
Ferrite
Company
W.J.Alton,
Alton,
Ferrite
Company
Low
Frequency
Circulators,
U. Hoeppe
✗VFerrimagnetics
Ferrimagneticsforfor
Low
Frequency
Circulators,
U. Hoeppe,
&
C. Weil, Advanced
Ferrite Technology
Advanced
Ferrite Technology
forfor
High
Power
Applications,
✗VLow
LowFrequency
FrequencyCirculators
Circulators
High
Power
Applications,
B. Elsharawy,
Arizona State
University
K.M.
Gaukel, B. Elsharawy,
Arizona
State University
✗VCompact
CompactVHF/UHF
VHF/UHF
Lumped
Element
Circulators,
Lumped
Element
Circulators,
A.G.Schuchinsky,
Schuchinsky,
Queen’s
University
A.G.
Queen’s
University
✗VAtomic
AtomicDesign
Designand
andEngineering
Engineering
Spinel
Ferrites
ofof
Spinel
Ferrites
for for
RF RF
and
Microwave
Device
Applications,
V.
Harris,
and Microwave Device Applications, V. Harris,
Northeastern University
Northeastern University
✗ Microwave Generation Induced by Spin Polarized Direct
VMicrowave
Induced by A.
Spin
Polarized
Direct
Current inGeneration
Magnetic Multilayers,
Slavin,
Oakland
Current
in
Magnetic
Multilayers,
A.
Slavin,
Oakland
University
University
Organizers:
Organizers:
Sponsors:
Sponsors:
Sponsors:
Douglas
Adam,
Northrop
Grumman
Douglas
Adam,
Northrop
Grumman
Lionel
Davis,
University
of Manchester
Lionel
Davis,
University
of Manchester
Rodica
Ramer,
Univ.
of New
Rodica
Ramer,
Univ.
of New
SouthSouth
Wales Wales
MTT-13
Microwave
Ferrites
andand
Ferroelectrics
MTT-13
Microwave
Ferrites
Ferroelectrics
MTT-12, Microwave and Millimeter-wave
Packaging
Packaging of most microwave and millimeter-wave devices is a
challenging task. The use of new materials and interconnect
methods can further complicate the design. This tutorial workshop is an opportunity for the attendees to review the issues and
increase their design capability on this important issue.
Increasing operating frequency and bandwidth required for
defense applications have long been considered as the main dri-
57
FRIDAY WORKSHOPS
WFA: HIGH POWER AMPLIFIER RELIABILITY
AND THERMAL ISSUES
WFB: TECHNOLOGY AND APPLICATIONS
OF WIRELESS SENSOR NETWORK
Location:
Location:
Topics & Speakers:
Topics & Speakers:
VThermal
Analysis
and and
Reliability
Predictions,
Bruce Kopp,
✗ Reliability
Testing
Junction
Temperature
Measurements,
DPM
Consulting Eli Reese, TriQuint Semiconductor
✗ Thermal
and Reliability
Predictions,
Bruce Kopp,
VHot
ElectronAnalysis
Effects, Power
Slump, Droop,
J C M Hwang,
DPM
Consulting
Lehigh University
✗ Hot Electron
Effects,
Power
Droop, J C M Hwang,
VHydrogen
Sensitivity
Testing
andSlump,
Mitigation,
Lehigh University
Tony Immorlica, BAE Systems
✗ Hydrogen Sensitivity Testing and Mitigation,
VBase Station Technology, Chuck Weitzel, Freescale
Tony Immorlica, BAE Systems
✗ Semiconductor
Base Station Technology, Chuck Weitzel, Freescale
VTWTA
vs. SSPA Reliability, Eric Nicol, Boeing Satellite
Semiconductor
Systems
✗ TWTA vs. SSPA Reliability, Eric Nicol, Boeing Satellite
VSpace
Device and Power Amplifier Reliability and
Systems
✗ Qualification,
Space Device
and Power
Amplifier
Reliability
Shabbir
Moochalla,
Lockheed
Martinand
Qualification, Shabbir Moochalla, Lockheed Martin
VWireless
Mesh
Networks:
AnAn
Introduction,
D. Sexton,
GE GE
✗ Wireless
Mesh
Networks:
Introduction,
D. Sexton,
VNanosensors
for Wirless
Networks,
Maracas, Motorola
Motorola
✗ Sensor Networks
for Wireless,
G.G.Maracas,
VSmart
Applications
in Wireless
Sensor
Networks,
✗ SmartAntennas
Antennas
Applications
in Wireless
Sensor
Networks,
El-Ghazaly,
University
of Tennessee
S.S.El-Ghazaly,
University
of Tennessee
✗ The DOE
Industrial
W. Manges,
VWireless
in the
ExtremeWireless
- Robust,Program,
Secure, Scaleable,
W. Oak
Ridge
National
Laboratory
Manges, T. Kuruganti, Oak Ridge National Laboratory
✗ ApplicationofofWireless
Wireless
Sensor
Networks,
G. Manes,
VApplication
Sensor
Networks,
G. Manes,
University
of
Florence
and
L.
Nachman,
Intel Corp.
University of Florence and L. Nachman, Intel Corp.
✗ Resolving the High Bandwidth, Low Power Dilemma,
VDo We Trust the Outputs from Sensor Networks? ,
D. Culler, University of California
Physical
Laboratory
✗ D.
DoAdamson,
We TrustNational
the Outputs
from
Sensor Networks? ,
VUtilizing
a Wireless
Sensor Network
Gauge an Abstract
D. Adamson,
National
PhysicaltoLaboratory
Quantity,
Paul
Bowman,
BT
✗ Utilizing a Wireless Sensor Network to Gauge an Abstract
Quantity, Paul Bowman, BT
Organizers: D. Adamson, National Physical Laboratory
Organizers:
D. Adamson, National Physical Laboratory
Kate Remley, US Dept. of Commerce
Kate Remley, US Dept. of Commerce
V.K.
Nair,
IntelIntel
Corp.Corp.
V.K.
Nair,
A.E.
Fathy,
University
of Tennessee
A.E.
Fathy,
University
of Tennessee
W.W.
Manges,
Oak
Ridge
National
Laboratory
Manges, Oak Ridge
National
Laboratory
Sponsors:
Sponsors:
MTT-20
Wireless Measurements
Communications
MTT-11
Microwave
Sensor networks represent a significant improvement over
traditional sensors, which transmit toward central node time series of fused information gathered from network periphery by
using multi-hop communication schemes. These factors enable a
considerable reduction of the power consumption, prioritizing
the in-site rather centralized elaboration from one perspective
and reducing the coverage distance from another. Application
spans from military to security, detection and reconnaissance of
chemical and biologic risks; fire and flood detection; health applications, monitoring human physiological data, tacking doctors
and patient in hospital and recently, precision agriculture. In this
workshop we discuss techniques for design and deployment for
personal, commercial, and harsh industrial communication systems. In addition, verification of these wireless sensor networks,
appropriate measurement techniques, and methods of determining the confidence in the output(s) from these systems will be
addressed.
Organizers:
Jim Komiak, Bae Systems
Al Katz, Linearizer Technology
Sponsors:
MTT-5 Microwave High Power Techniques
MTT-16 Microwave Systems
Commercial and military aerospace and terrestrial systems require high power amplifiers with ever increasing performance,
but also with high reliability. Higher output power levels and
thermal loads require careful characterization and analysis to
mitigate failure modes and attain the required levels of availability and quality of service. Recent power amplifier workshops
have focused on techniques to improve the linearity or efficiency. This workshop has a different focus. It will address reliability
and thermal issues in depth with content of importance and interest to the microwave community. This workshop will provide
both tutorial information and the latest developments in this vital area. With a focus on testing and prediction, measurement
and analysis, failure mechanisms and their mitigation, this workshop brings together some of the leading experts in microwave
power amplifier reliability. The topics will include determination
of device lifetime and thermal management with emphasis on
design choices (materials, dimensions, pitch, derating) to improve reliability. Practical commercial and military hardware examples will also be presented.
58
FRIDAY WORKSHOPS
WFC: NEW OPTICAL APPROACHES FOR MICROWAVE,
HIGH-SPEED SIGNAL TRANSMISSION
Location:
WFD: HOW ACCURATE ARE YOUR THZ MEASUREMENTS?
Location:
Topics & Speakers:
Topics & Speakers:
✗ The Current State of THz Metrology and Traceability,
NPL
David Adamson, Richard
Dudley, NPL
✗ The Current State of THz Metrology and Traceability,
Eyal Gerecht, NIST
✗ Characterization of Optical Components with a 100–800
GHz Vector Network Analyzer, Axel Murk, IAP,
University of Bern
✗ Aspects of THz Calibration, Daniel Mittleman, Rice
University
✗ THz Radiometer Calibration, Paul Stek, JPL
✗ THz Waveguide Standards, John Ward, JPL
✗ High Performance Coherent Fiber-Optic Link,
Peter Herczfeld et al., Drexel University
✗ Recent Advances in Microwave Signal Processing: The
LABELS Project, Jose Capmany, Polytechnic University
of Valencia
✗ Novel Techniques for Enabling High Performance Optical
Links for Fiber Radio Communications, Dalma Novak et
al., University of Melbourne
✗ Novel Lithium-Niobate Based Optical Devices for
Microwave/Millimeter-wave Photonics, Masayuki Izutsu
et al., National Institute of Information and
Communications Technology
✗ Radio-over-Fiber Multi-service MM-wave Interconnection
with Photonic Up-conversion, Dual Band Remote Delivery
and Photonic Envelope Detection, Javier Marti et al.,
Polytechnic University of Valencia
✗ All-optical A/D Conversion Based upon Nonlinear Fiberoptic Switch and its Applications, Ken-Ichi Kitayama et
al., Osaka University
✗ High Speed InP Transistors for Microwave Photonic Signal
Transmission, Woo-Young Choi, Yonsei University
✗ Combined Optical-Wireless Indoor Communications System,
Tibor Berceli, Budapest University of Technology and
Economics
Organizers:
Tibor Berceli, Budapest University of
Technology and Economics
Peter R. Herczfeld, Drexel University
Sponsors:
Organizers:
David Adamson, National Physical
Laboratory
Richard Dudley, National Physical
Laboratory
Sponsors:
MTT-4 Terahertz Technology
To effect an efficient transition from laboratory to the commercial environment, THz systems require accurate and repeatable measurements. At present, measurement systems operating
in the THz band have limited uncertainty and verification methods available. The objective of this workshop is to present current THz metrology solutions and to identify, discuss and plan
future developments and requirements. Topics will include the
availability of THz metrology from the world’s leading standards
laboratories (NPL and NIST) and THz measurement systems
specialists. In addition, we will discuss situations where improved measurements would provide market or application benefits.
The optical technology offers advantageous new approaches
for the transmission of microwave, high speed signals. The optical fiber signal transmission has a very low loss (0.2 dB/km) and
a very wide bandwidth. It is capable to transmit any kind of modulation format. Its properties can be well utilized mainly in mobile networks both for outdoor and indoor systems. The workshop presents an overview of these new methods in the framework of invited talks presented by experts in the field.
In the program several new approaches will be presented
which offer more advantageous transmission properties. Complete systems will be reported like coherent optical transmission,
routing high-speed packet switched signals, distribution system
with both wireless and wireline nodes, combined wireless-optical
indoor system. Some other presentations will cover new results
on components for advanced systems. The speakers come from
four continents: America, Europe, Asia and Australia. Their
achievements are complementary.
59
FRIDAY WORKSHOPS
✗ fREEDA Electromagnetic and Mixed-physics Simulation
Framework, Michael Steer, North Carolina State
University
✗ GRID Computing Electromagnetic Simulation Framework,
Luciano Tarricone, Universita’ di Lecce
WFE: ADVANCED METHODS FOR EM COMPUTING
Location:
Topics & Speakers:
✗ Full-wave Hybrid Differential-integral Approachs for The
Investigation of Multilayer Structures, Damienne Bajon,
Ecole Nationale Supérieure de l’Aéronautique et de
l’Espace, and Sidina Wane, Ecole Nationale Supérieure
de l’Electronique, l’Electrotechnique, d’Informatique,
d’Hydraulique et des Télécommunications
✗ State-space- and Network Methods Applied to
Electromagnetic Modeling, Andreas Cangellaris,
University of Illinois at Urbana-Champaign and
Peter Russer, Munich University of Technology
✗ Fast Solvers for Transient Electromagnetic Modeling in
Multiscale Structures, Eric Michielssen, University of
Michigan
✗ The Transmission Line Matrix Multipole Expansion
(TLM-ME) Method, Petr Lorenz, Munich University of
Technology
✗ Finite Element-based Domain Decomposition Methods for
Large-scale Electromagnetic Modeling and Their
Applications to RF/microwave System Design, Jin-Fa Lee,
Ohio State University
✗ Geometry-matched, Local-time Stepping Procedure for
Efficient Finite-Volume Time-Domain (FVTD) Simulation,
Ruediger Vahldieck, ETH Zurich
✗ FDTD-based Large-scale Simulation of High-speed
Integrated Circuits, Raj Mittra, The Pennsylvania State
University
✗ FDTD Methods and Model Order Reduction,
Michal Mrozowski, Technical University of Gdan´sk
✗ Mode-matching and Network Methods in Electromagnetic
Simulation, Mauro Mongiardo, Università di Perugia
Organizers:
Andreas Cangellaris, University of Illinois
at Urbana-Champaign
Peter Russer, Munich University of
Technology
Sponsors:
MTT-15 Microwave Field Theory
Efficient modeling of the complex electromagnetic environment encountered in the state-of-the-art high-speed/highfrequency electronic systems requires advanced computational
methods and powerful CAD tools. Rigorous, full-wave analysis of
the electromagnetic attributes of such systems, capable of resolving with sufficient accuracy their spatial and temporal multiscale attributes, is essential for their design and prototyping.
However, for such analysis to be effective at the design stage it
must be computationally efficient, with turn-around times in the
order of minutes or a few hours. Hence the need for advanced
numerical methodologies, which combine model hybridization,
fast matrix solvers, model order reduction, and the emergence
of parallel and distributed computing, to deliver the needed
computational efficiency in support of effective and expedient
design iteration.
It is the objective of this workshop to present some of the
most exciting recent advances toward the development of such
a comprehensive, versatile, electromagnetic modeling and simulation capability. The presentations include advances in finite element- and finite difference-based methods, integral equationbased methods, model order reduction techniques, state-space
and network methods for electromagnetic modeling, hybrid
methodologies, and Grid-enabled, large-scale electromagnetic
computation.
60
F
R
ARFTG 67th MICROWAVE MEASUREMENT CONFERENCE
T
A
G
Design and Measurements of High Power Devices and Systems
AUTOMATIC RF TECHNIQUES GROUP
CONFERENCE ORGANIZATION
Conference Chair
Ken Wong
Agilent Technologies Inc.
T (707) 577-2616
[email protected]
Technical Program Chair
Mohamed Sayed
MMS
T (707) 578-1092
[email protected]
In conjunction with the IEEE MTT-S International Microwave Symposium 2006
(IMS2006), the Automatic RF Techniques Group will hold its 67th Microwave Measurement Conference in the Renaissance Parc 55 Hotel, San Francisco, California, Friday,
June 16, 2006, as the anchor of Microwave Week 2006. Technical papers describing
original work in the design and measurements of high power devices and systems will
be presented.
EXAMPLES OF SPEAKERS AND PAPERS
Doug Rytting: “Network Analyzers – From Small Signal to Large Signal Measurements”
Franco Sechi: “Broadband High Power Amplifiers for Instrumentation”
Exhibits Chair
Prof. Joe Tauritz
Universiteit Twente
T +31-53-489-4330 F +31-53-4895640
[email protected]
EXECUTIVE COMMITTEE
J. Gregory Burns, President
Northrop Grumman
Leonard Hayden, Vice President, Publicity
Cascade Microtech
Nick Ridler, Secretary
National Physical Lab
Ken Wong, Treasurer
Agilent Technologies Inc.
Brian Pugh, Publications
Quorum Systems Inc.
David Walker, Education
NIST
Joseph Tauritz, Exhibits
Universiteit Twente
William Eisenstadt, Standards
Univerity of Florida
Ronald Ginley, Electronic Communication
NIST
SCHEDULE
Friday, June 16
Activity
Renaissance Parc 55 Hotel
7:00 AM – 4:00 PM
7:00 AM – 8:00 AM
7:00 AM – 8:00 AM
8:00 AM – 9:45 AM
9:45 AM – 10:30 AM
10:30 AM – 12:00 NOON
12:00 NOON – 1:15 PM
1:15 PM – 3:00 PM
3:00 PM – 3:45 PM
3:45 PM – 5:00 PM
Exhibition and Interactive Forum
Continental Breakfast
Technical Session 1
Exhibition/Poster Session
Technical Session 2
Luncheon
Technical Session 3
Exhibition/Poster Session
Technical Session 4
Ballroom III
Ballroom III
Ballroom TBD
Ballroom I & II
Ballroom III
Ballroom I & II
Foyer
Ballroom I & II
Ballroom III
Ballroom I & II
EXHIBITS
The 67th ARFTG Conference also offers an outstanding exhibition opportunity. Please contact our Exhibits Chair directly for further information ([email protected]).
Raymond W. Tucker, Membership
Air Force Research Lab
Mohamed Sayed, Nominations
MMS
Thomas G. Ruttan, Technical Coordinator
Intel Corp.
Dominique Schreurs, Workshops
Ku Leuven East Telemic
Uwe Arz, Awards
PTB
Charles Wilker, MTT-S Liaison
DuPont Superconductivity
EX-OFFICIO MEMBERS
Chris Potter, ARMMS Liaison
P&H Technology Consultants
Jim L. Taylor, Executive Secretary
www.arftg.org
61
NOTES
62
NOTES
63
EXHIBITORS
and devices. The 2006 Exhibition will be held in the Moscone Convention Center.
Exhibition hours are Tuesday, June 13 and Wednesday, June 14 from 9:00 AM to 5:00
PM, and Thursday, June 15 from 9:00 AM to 3:00 PM. Following is a list of exhibiting
companies. The list is complete as of press time, but may not include all companies.
The MTT-S Exhibition is an annual event that has taken place since 1970. It
comprises more than 450 microwave, subassembly, component, device, material, instrument and design software suppliers and each year draws approximately 10,000
microwave engineers involved in the design of systems, subsystems, components
3G Metalworx Inc.
A-Alpha Waveguide Co.
A.R.A.
ABF Elettronica S.R.L.
Actipass Co. Ltd.
ADC Tech International Ltd.
Advance Reproductions Corp.
Advanced Control Components Inc.
Advanced Microwave Inc.
Advanced Switch Technology
Advanced Technical Ceramics Co.
Advanced Test Equipment
Aeroflex Inc.
Aerowave Inc.
Aethercomm Inc.
Agilent Technologies
Akon Inc.
Allied Telecom Components Shanghai
Allrizon-TongGuang Communications
Altair Technologies Inc.
American Microwave Corporation
American Standard Circuits Inc.
American Technical Ceramics
Ametek HCC Industries
Ametek Specialty Metal Products
AML Communications Inc.
Amphenol Connex
AmpliTech Inc. – Gold Sponsor
Analog Devices Inc.
Anaren
Anritsu Co.
Ansoft Corp. – Gold Sponsor
Antelope Valley Microwave
Antenna Systems & Technology Mag.
Apollo Microwaves Ltd.
Applied Engineering Products
Applied Radar Inc.
Applied Thin-Film Products
Applied Wave Research Inc.
AR Worldwide
ARC Technologies Inc.
Arlon
Artech House Publishers
ASB Inc.
Ascor Inc.
Assemblies Inc.
Astra Microwave Products Ltd.
Astrolab Inc.
Atmel Corp.
Auriga Measurement Systems LLC
Avnet Electronics Marketing
Bandwidth Semiconductor LLC
Barry Industries Inc.
Beckelec Inc.
Besser Associates Inc.
Boonton (a Wireless Telecom Co.)
Bowei Integrated Circuits Co.
Broadern Inc.
BroadWave Technologies Inc.
Brush Ceramic Products
C-MAC MicroTechnology
CAD Design Software
Cadence Design Systems
California Eastern Labs
Cambridge University Press
CAP Wireless Inc.
Carleton University
Cascade Microtech
Centellax Inc.
Cernex Inc.
Channel Microwave Corp.
Charter Engineering Inc.
Chengdu Seekon Microwave Comm. Co.
Changdu Yanguang Electronics Co. Ltd.
Chin Nan Precision Electronics Co.
Ciao Wireless Inc.
Circuits Processing Technology
Cobham Defense Electronic Systems
Coilcraft Inc.
Coleman Microwave Co.
Com Dev/Code One
Commercial Microwave Technology
Communications & Power – Canada
Compex Corp.
Component Distributors Inc.
Connectronics Inc.
CoorsTek
Corning Gilbert Inc.
Corry Micronics
Cree Inc.
CST of America Inc. – Gold Sponsor
CTT Inc.
Custom Cable Assemblies Inc.
Custom Interconnects
Daa Sheen Technology Co. Ltd.
dBm
Delta Electronics Mfg. Corp.
Delta Microwave
DeWeyl Tool Company
Dexter Magnetic Technologies Inc.
Diablo Industries Inc.
Diamond Antenna
Dieletric Laboratories Inc.
DiTom Microwave Inc.
Dorado Instrumentation
Dow Key Microwave
DuPont Microcircuit Materials
Dynawave Inc.
e2v Technologies
EADS North America Defense
EE-Evaluation Engineering
Elcom Technologies Inc.
Electro Rent Corp.
Elektrobit Inc.
Elisra Electronic Systems Ltd.
Elva-1 Ltd.
EM Photonics
EM Research Inc.
EM Software & Systems
EMAG Technologies Inc.
EMC Technology Inc.
Emerson & Cuming
Emerson & Cuming Microwave Products
Emerson Network Power Connectivity
EMF Systems
Emhiser Micro-Tech
Empower RF Systems
EMS Technologies Inc.
Endwave Defense Systems
ESPEC Corp.
ETS – Lindgren
Eudyna Devices USA Inc.
European Microwave Week
Excelics Semiconductor Inc.
EZ Form Cable Corp.
F&K Delvotec Inc.
Fairchild Semiconductor
Farran Technology Ltd.
Fastech Synergy Ltd
Fastron Electronics Inc.
FCT Electronics LP
Ferdinand Braun Institut (FBH)
The Ferrite Company Inc.
Filtel Microwave Inc.
Filtran Microcircuits Inc.
Filtronic Compound Semiconductors
Filtronic Sage Laboratories Inc.
Flann Microwave Ltd.
Flexco Microwave Inc.
Florida RF Labs Inc.
Focus Microwaves Inc.
Freescale Semiconductor
G.T. Microwave Inc.
Gaiser Tool Co.
General Dynamics C4, VertexRSI
GGB Industries Inc.
Giga-tronics
GigaLane Co. Ltd.
Global Communication Semiconductors
W.L. Gore & Associates Inc.
Gowanda Electronics
Hantechnic Inc.
Harbour Industries
Haverhill Cable & Mfg. Corp.
Herley Industries Inc.
Herotek Inc.
High Frequency Electronics
Hittite Microwave Corp.
Holland Electronics LLC
HTmicrowave Co. Ltd.
Huber + Suhner Inc.
Hunter Technology
IEEE Communications Magazine
IEEE Microwave Magazine
IHP GmbH-Innovations High Performan
IMS Connector Systems
IMST GmbH
In-Phase Technologies Inc.
Infineon Technologies
Instruments for Industry (IFI)
Inta Technologies
Integra Technologies Inc.
Integrated Engineering Software
International Manufacturing Svcs.
Ion Beam Milling Inc.
Isotec Corp.
iTerra Communications
ITF Co. Ltd.
ITT Industries–Microwave Systems
IW Inc.
J MicroTechnology Inc.
Jacket Micro Devices Inc. (JMD)
Jersey Microwave
JFW Industries Inc.
Johanson Manufacturing Corp.
Johanson Technology Inc.
Johnstech International Corp.
JQL Electronics Inc.
Junper Interconnection Co. Ltd.
JyeBao Co. Ltd.
K&L Microwave Inc.
Keithley Instruments Inc.
Kemac Technology Inc.
Keragis Corp.
KMIC Technology Inc.
KP Microwave Components Inc.
Krytar Inc.
KW Microwave Corp.
Kyocera America Inc.
L-3 Communications
L-3 Electron Devices
Labtech Ltd.
Lansdale Semiconductor Inc.
Lark Engineering Co.
Laser Process Mfg. Inc.
Leader Tech Inc.
Life Line Packaging Inc.
Litron Inc.
Locus Microwave
Logus Microwave Corp.
Lorch Microwave
Lorentz Solution
LPKF Laser & Electronics
M.T. srl
M/A-COM Inc.
M2 Global Technology Ltd.
Maury Microwave Corp.
Maxtek Components Corp.
S.G. McGeary Co.
MCV Technologies Inc.
MECA Electronics Inc.
Mega Circuit Inc.
MegaPhase
Meggitt Safety Systems Inc.
Merix Corp.
Merrimac Industries Inc.
Metallix Inc.
MetricTest
Meusonic
MICA Microwave
Mician GmbH
Micron Precise Corp.
Micro Lambda Wireless Inc.
Micro Networks
Micro-Chem Inc.
Micro-Coax Inc.
Micro-Mode Products Inc.
MicroAssembly Technologies Inc.
Microlab/FXR a Wireless Telecom Co.
Micrometrics Inc.
Micronetics Inc.
Microphase Corp.
Microsemi Corp.
MicroSource Inc.
Microtech Inc.
Microwave Applications Group
Microwave Circuits Inc.
Microwave Communications Labs Inc.
Microwave Development Labs Inc.
Microwave Device Technology Corp.
Microwave Dynamics
Microwave Engineering Europe
Microwave Filter Co. Inc.
Microwave Innovation Group (MIG)
Microwave Journal
Microwave Product Digest
Microwave Technology, an IXYS Co.
Microwaves & RF
Military & Aerospace Electronics
Millitech Inc.
Mimix Broadband Inc. – Silver Sponsor
Mini-Circuits
Mini-Systems Inc.
Mission Telecom Co. (KWLI)
Mitel - Millitech
MITEQ Inc.
Mitsubishi Electric & Electronics
Modelithics Inc.
Modular Components National Inc.
Molex-RF/Microwave Connector Div.
Morecom International
Morgan Advanced Ceramics, GBC
64
Morgan Electro Ceramics
MPDevices Co. Ltd.
MtronPTI
Murata Electronics – Silver Sponsor
Nanowave Technologies Inc.
Narda an L-3 Communications Co.
National Instruments
NDK America Inc.
NEC Microwave Tube Ltd.
Neltec
Netcom Inc.
Network Sciences
Networks International Corp. (NIC)
Noise Com (a Wireless Telecom Co.)
Northeast Electronics Corp.
Northrop Grumman
Novacap
NTK Technologies Inc.
Octagon Communications
OPHIR RF Inc.
Ortel, a division of Emcore
P/M Industries Inc.
Palomar Technologies
Partron Co. Ltd.
Pascall Electronics Ltd.
Passive Microwave Technology
Penn Engineering Components
Penton Media Inc.
Peregrine Semiconductor Corp.
Phase Matrix Inc.
Piconics Inc.
Picosecond Pulse Labs
Planar Electronics Technology
Planar Filter Company
Planar Monolithics Industries Inc.
Plextek Ltd.
Pole/Zero Corp.
Polyfet RF Devices
Polyflon (a Crane Co. company)
Portable Design Magazine
Poseidon Scientific Instruments
Precision Devices Inc.
Precision Photo-Fab Inc.
Presidio Components Inc.
Pulsar Microwave Corp.
Q Microwave Inc.
Q-Tech Corp.
Quantum Leap Packaging Inc.
QUEST Microwave Inc.
QuinStar Technology Inc.
QWED
R&F Products, Laird Technologies
R&K Company Ltd.
R-Theta Thermal Solutions Inc.
Radant MEMS Inc.
Radiall
Reactel Inc.
Redwood Space Controls Inc.
Reed Business Information
Reinhardt Microtech AG
RelComm Technologies Inc.
Remcom Inc.
Remtec Inc.
Renaissance Electronics Corp.
Resin Systems Corp.
Response Microwave Inc.
RF Depot.com Inc.
RF Design Magazine
RF Globalnet
RF Industries
RF Micro Devices – Gold Sponsor
RFHIC
RFMW Inc.
Richardson Electronics
RLC Electronics Inc.
Rockwell Scientific
Rogers Corp.
Rohde & Schwarz Inc.
Roos Instruments Inc.
Rosenberger North America
Roswin Inc.
RTx Technology Co. Ltd.
San-tron Inc.
Sandvik Osprey Ltd.
Sangshin Elecom Co. Ltd.
Sawcom Tech Inc.
Schleifring und Apparatebau GmbH
Scientific Microwave Corp.
Semflex Inc.
Semi Dice Inc.
Servometer/PMG LLC
Shenzhen Kingsignal Cable Tech Co.
Sigma Systems Corp.
Signatone (Lucas/Signatone)
Simulation Technology & Applied Res
Sinclair Manufacturing Company
Sirenza Microdevices Inc.
Skyworks Solutions Inc.
Sonnet Software Inc.
Sonoma Scientific Inc.
Soshin Electronics of America Inc.
Sources East Inc.
Southwest Microwave Inc.
Spectra-Mat Inc.
Spectrum Elektrotechnik GmbH
Spectrum Microwave Inc.
Sprague-Goodman Electronics Inc.
Springer
SSI Cable Corp.
State of the Art Inc.
Statek Corp.
STC Microwave Systems Inc.
Stellar Industries Corp.
STMicroelectronics Inc.
Storm Products Co.
StratEdge Corp.
Summitek Instruments, Inc.
SUSS MicroTec Inc.
SV Microwave Inc.
C.W. Swift & Associates Inc.
Synergy Microwave – Silver Sponsor
Taconic
Talley Communications Corp.
Tecdia Inc.
Technical Research & Manufacturing
Tektronix Inc. – Gold Sponsor
Teledyne
Telegartner Inc.
Telephus Inc.
Temp-Flex Cable Inc.
Temptronic Corp.
Temwell Corp.
Tensolite – Silver Sponsor
Tensolite – Harness & Assemblies
Tensolite High Performance Cable
Tensolite RF/Microwave
Terabeam/HXI
Thales Components Corp.
Thin Film Technology
Times Microwave Systems
TLC Precision Wafer Technology
Toshiba America Electronic Comp.
TRAK Microwave
Trans-Tech Inc.
Transcom Inc.
Trilithic Inc.
TriQuint Semiconductor
Tronser Inc.
TRS-RenTelco
TRU Corp.
TT Electronics
TTE Inc.
A.J. Tuck Co.
UltraSource Inc.
United Monolithic Semiconductors
Universal Microwave Corp.
UTE Microwave Inc.
Vacco Industries
Valpey Fisher Corp.
Vector Fields Inc.
Vectron International
VIDA Products Inc.
Virginia Diodes Inc.
Vishay Intertechnology Inc.
Voltronics Corp.
Weinschel Associates
Wenzel Associates Inc.
Werlatone Inc.
West Bond Inc.
Wiley
Williams Advanced Materials
WIN Semiconductors Corp.
Winchester Electronics
Wireless Design & Development
WiseWave Technologies Inc.
WJ Communications Inc.
Work Microwave
Xpedion Design Systems Inc.
Yantat Group
Ye Eun Tech
Zeland Software Inc. – Silver Sponsor
Zentrix
Zhejiang Zhengyuan Electric Co. Ltd
Zifor Enterprise Co. Ltd.
IEEE MTT-S ADMINISTRATIVE COMMITTEE
2006 OFFICERS
President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Karl Varian
Vice President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J. Steve Kenney
Treasurer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Nick Kolias
Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .William H. Cantrell
ELECTED ADCOM MEMBERS
2006
2007
2008
S.M. El-Ghazaly
J. Hausner
K. Itoh
H.M. Harris
T. Lee
L. Katehi
D. Harvey
J. Modelski
J. Lin
J.S. Kenney
V.K. Nair
A. Mortazawi
N. Kolias
B.S. Perlman
K.R. Varian
D. Rutledge
W.A. Shiroma
K. Wu
R. Weigel
R. Snyder
R. York
IMMEDIATE PAST PRESIDENTS
2005 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .K.C. Gupta
2004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.J. Trew
2003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .M.J. Schindler
HONORARY LIFE MEMBERS
S.B. Cohn
T. Itoh
A.A. Oliner
K. Tomiyasu
T.S. Saad
L. Young
P.W. Staecker
FUTURE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIA
2007 — HONOLULU, HI — JUNE 3–8, 2007
General Co-Chairman
Wayne Shiroma
University of Hawaii
Tel (808) 956-7218
[email protected]
Local Arrangements
Co-Chairman
Dana Matsunaga
Spirent Communications
Tel (808) 440-3376
[email protected]
General Co-Chairman
TPC Chairman
Michael DeLisio
Wavestream corp.
Tel (909) 599-9080
[email protected]
Tatsuo Itoh
UCLA
Tel (310) 206-4820
[email protected]
Local Arrangements
Co-Chairman
Operations
Chairman
Pacific Rim
Coordinator
Kevin Miyashiro
Trex Enterprises
Tel (808) 442-7042
[email protected]
Reynold Kagiwada
Northrop Grumman
Tel (310) 814-1970
[email protected]
Victor Lubecke
University of Hawaii
Tel (808) 956-4942
[email protected]
2008—ATLANTA, GA
2010—ANAHEIM, CA
2012—MONTREAL, CAN
June, 2008
Chairman
June 2010
Chairman
June 2012
Chairman
Joy Laskar
Georgia Tech
Tel (404) 894-5268
[email protected]
J.K. McKinney
Dura Sales of Southern California Inc.
Tel (909) 612-1044
[email protected]
Ke Wu
Ecole Polytechnique
Tel (514) 340-4711 x5991
[email protected]
2009—BOSTON, MA
2011—BALTIMORE, MD
2013—SEATTLE, WA
June 2009
Chairman
June 2011
Chairman
June 2013
Chairman
Fred Schindler
RF Micro Devices
Tel (978) 670-2230
[email protected]
Jeffrey Pond
Naval Research Laboratory
Tel (202) 767-2862
[email protected]
65
Tom Raschko
Sea-Port Technical Sales
Tel (425) 702-8300
[email protected]
2006 IEEE MTT-S AWARDS
HONORARY LIFE MEMBER RECOGNITION
The position of Honorary Life Member is the highest honor that the
Society can bestow upon a member and is filled with extraordinary individuals who have provided sustained leadership in Society affairs. This
recognition is not made yearly and the Society By Laws allow a maximum
of eight Honorary Life Members.
In 2006 the Society is pleased to recognize Peter W. Staecker with the
position of Honorary Life Member
Citation
2006 MICROWAVE APPLICATION AWARD
The Microwave Application Award recognizes an individual or team
for outstanding application of microwave theory and techniques.
This year’s recipient is Marian W. Pospieszalski.
Citation
“THE MICROWAVE THEORY AND TECHNIQUES SOCIETY HEREBY
ACKNOWLEDGES THE CONTINUED OUTSTANDING
CONTRIBUTIONS AND SERVICES OF PETER W. STAECKER WITH
THE POSITION OF HONORARY LIFE MEMBER.”
2006 OUTSTANDING YOUNG ENGINEER AWARD
The Outstanding Young Engineer Award was established to recognize
an outstanding young MTT-S Member(s), who has distinguished
him/herself through achievement(s), which may be technical (within
the MTT-S Field of Interest), may be exemplary service to the MTT-S, or
may be a combination of both. Nominee must be no more than 38 years
of age (i.e., must not have reached their 39th birthday) and must be an
MTT member at time of nomination.
This year’s recipients are Ian Gresham and Emmanouil Tentzeris.
Citation for Ian Gresham:
“FOR THE DEVELOPMENT OF A NOVEL MESFET/HEMT LOW
NOISE MODEL AND ITS USE IN THE DESIGN OF ADVANCED
CRYOGENICS LOW NOISE AMPLIFIERS.”
2006 MICROWAVE CAREER AWARD
This award recognizes an individual for a career of meritorious
achievement and outstanding technical contribution in the field of microwave theory and techniques.
This year’s recipient is Eikichi Yamashita
Citation
“FOR THE DEVELOPMENT OF MM-WAVE SI AND GAAS-BASED
CIRCUITS AND SYSTEMS-ON-CHIP FOR COMMERCIAL AND
DEFENSE APPLICATIONS.”
“FOR A CAREER OF LEADERSHIP, MERITORIOUS ACHIEVEMENT,
CREATIVITY, AND OUTSTANDING CONTRIBUTIONS IN THE
FIELDS OF MICROWAVE THEORY AND TECHNIQUES.”
Citation for Emmanouil Tentzeris:
2006 DISTINGUISHED SERVICE AWARD
This award is given in recognition of significant contributions and outstanding service to the Microwave Theory and Techniques Society and
the microwave profession over a sustained period of time.
This year’s recipient is Roger D. Pollard.
Citation
“FOR THE DEVELOPMENT OF ADAPTIVE NUMERICAL TOOLS FOR
THE FULL-WAVE MODELING AND DESIGN OF RF COMPONENTS
AND 3-DIMENSIONAL MODULES.”
2006 N. WALTER COX AWARD
The N. Walter Cox Award was established in recognition of the qualities of N. Walter Cox and his service to the MTT Society prior to his untimely death in 1988. It is given to a Society volunteer whose efforts on
behalf of MTT-S best exemplify Walter’s spirit and dedication.
This year’s recipient is Timothy T. Lee.
Citation
“FOR HIS OUTSTANDING AND DEDICATED SERVICE TO THE
SOCIETY.”
2006 DISTINGUISHED EDUCATOR AWARD
This award was inspired by the untimely death of Prof. F.J. Rosenbaum (1937–1992), an outstanding teacher of microwave science and a
dedicated Administrative Committee Member and contributor. The
award recognizes a distinguished educator in the field of microwave engineering and science who best exemplifies the special human qualities
of Fred Rosenbaum who considered teaching a high calling and demonstrated his dedication to the Society through tireless service.
This year the Society is pleased to recognize two recipients of this
Award
Wolfgang Hoefer and Peter Russer
Citation
“FOR EXEMPLARY SERVICE, GIVEN IN A SPIRIT OF SELFLESS
DEDICATION AND COOPERATION.”
2006 MICROWAVE PRIZE
The Microwave Prize recognizes, on an annual basis, the most significant contribution by a published paper to the field of interest of the Microwave Theory and Techniques Society. Papers under consideration are
those published during the period January 1 to December 31 of the year
preceding the Fall Meeting of the Administrative Committee at which
the award is considered.
This year’s recipients are Joseph A. Hagerty, Florian Helmbrecht,
William McCalpin, Regan A. Zane, and Zoya Popovic
Each Citation reads:
“FOR OUTSTANDING ACHIEVEMENTS AS AN EDUCATOR,
MENTOR AND ROLE MODEL OF MICROWAVE ENGINEERS AND
ENGINEERING STUDENTS.”
“FOR THEIR PAPER, ‘RECYCLING AMBIENT MICROWAVE
ENERGY WITH BROAD-BAND RECTENNA ARRAYS,’ IEEE
TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES,
MTT-52, PP. 1014–1024 (2004).”
2006 MICROWAVE PIONEER AWARD
The Microwave Pioneer award recognizes an individual or a team not
exceeding three persons having made outstanding pioneering technical
contributions that advance microwave theory and techniques and described in an archival paper published at least 20 years prior to the year
of the award.
This year’s recipient is Peter R. Herczfeld.
Citation
“FOR PIONEERING WORK IN MICROWAVE PHOTONICS.”
66
IEEE FELLOWS: CLASS OF 2006
The Member Grade of Fellow is conferred in recognition of unusual
and outstanding professional distinction. It is awarded at the initiative of
the IEEE Board of Directors following a rigorous nomination and evaluation process. Individuals receiving this distinction have demonstrated extraordinary contributions to one or more fields of electrical engineering,
electronics, computer engineering and related sciences. This Grade is
not conferred automatically on nomination; only a fraction of those nominated are elected. Eleven MTT-S Members who were evaluated by our
Society were elected to the Grade of Fellow, effective 1 January 2006:
Frederick Raab
For contributions to modeling and design of highefficiency power amplifiers and radio
transmitters.
Richard Ranson
For contributions to advanced microwave systems.
Tsuneo Tokumitsu
For contributions to uniplanar and 3-dimensional
monolithic microwave integrated circuits
(MMICs).
Huei Wang
For contributions to broadband and millimeterwave monolithic millimeter-wave integrated
circuits (MMICs) and radio frequency integrated
circuits (RFICs).
NAME
CITATION
Christos Christopoulos
For contributions to electromagnetic modeling
and simulation of high-frequency electronic
systems.
Andreas Weisshaar
For contributions to radio frequency (RF) and
microwave micro electromechanical systems
(MEMS) devices and applications.
For contributions to modeling of on-chip
interconnects and integrated passive microwave
components.
Jan Zehentner
For the discovery of new leaky modes in open
planar transmission lines for microwave
integrated circuits.
Qi-jun Zhang
For contributions to linear and nonlinear
microwave modeling and circuit optimization.
Madhavan Swaminathan (CPMT)
For contributions in design tools, design
methodologies and electromagnetic interference
(EMI) control for power delivery in digital and
mixed signal systems.
Charles Turner (EDUCATION)
For contributions to engineering education.
Todd Hubing (EMC)
For contributions to numerical electromagnetic
modeling of complex printed circuit boards as
applied to electromagnetic compatibility (EMC).
Heyno Garbe (EMC)
For contributions to electro magnetic
compatibility (EMC) measurement techniques.
Reza Zoughi (IM)
For contributions to microwave and millimeter
wave nondestructive testing and evaluation.
Yves Rolain (IM)
For contributions to measurement and modeling
of nonlinear microwave devices.
Richard Spencer (SSC)
For contributions to integrated circuits for digital
communication, and magnetic recording.
Hector De Los Santos
Youji Kotsuka
For contributions to ferrite application to
RF/microwave devices.
Amir Mortazawi
For contributions to quasi-optical and circuit
based power generation techniques.
In addition thirteen other MTT-S Members were elected to the Grade
of Fellow in 2006 after their qualifications were evaluated by other IEEE
Societies:
NAME
CITATION
Steven Best (AP)
For contributions to the theory, design, and
understanding of electrically small antennas.
Nikolaos Uzunoglu (AP)
For contributions to electromagnetic theory with
applications to scattering and guided wave
propagation.
John Sahalos (AP)
For contributions to antenna analysis and design.
Carey Rappaport (AP)
For contributions to modeling electromagnetic
wave propagation in complex media.
George Eleftheriades (AP)
For contributions to conception, analysis and
fabrication of electromagnetic materials and their
applications.
Ramesh Harjani (CAS)
For contributions to the design and computer
aided design (CAD) of analog and radio frequency
circuits.
GENERAL INFORMATION
Information Booth: Pamphlets and information on the San Francisco area will be available at a booth centrally located in the registration area of the convention center. The
hospitality suite is located in the Marriott Hotel. Sign in and guest badges will be required to insure exclusive guest use.
IEEE/MTT-S Memberships: Those who apply for IEEE membership before registering
for the Symposium will be eligible for IEEE member discounted registration fees. Membership applications and payments will be accepted at the IEEE Booth in the registration area. IEEE members (or on site applicants) who register for the full Symposium
and have not been MTT-S members in the past year will be offered a free basic MTT-S
membership, good until the end of the year.
Children: Children under the age of 14 will not be admitted to the exhibition hall at any
time.
Drinks and Refreshments: Free coffee and soft drinks will be available during midmorning and midafternoon breaks in the refreshment areas in the exhibition hall.
Smoking: Smoking is not permitted in the MCC. All restaurants and bars in San Francisco are 100% smoke-free, but if there is outdoor seating, smoking is allowed outdoors.
Most hotel rooms are also designated as smoke free. If you are a smoker, it is suggested
that you register for your hotel early to ensure a smoking room is available. Stiff penalties are applied for smoking in non-smoking rooms.
Recruiting: Businesses do not send their personnel to the IMS to be recruited by the other businesses. To ensure that good attendance to these meetings continues in the future, IEEE policy insists that recruiting does not occur at the Symposium.
Recording of Technical Presentations: The recording of technical presentations by
video or audio recorders or cameras is not allowed without the permission of the speaker and notification of the session organizer.
Citizens of certain countries, traveling for visitor visa purposes for 90 days or
less, and who meet all the requirements, can travel to the United States for tourism
or business under the Visa Waiver Currently, the 27 countries, shown below, participate in the Visa Waiver Program. (Certain citizens of Canada and Bermuda do
not need a visa to visit the US).
Andorra, Australia, Austria, Belgium, Brunei, Denmark, Finland, France, Germany, Iceland, Ireland, Italy, Japan, Liechtenstein, Luxembourg, Monaco, the
Netherlands, New Zealand, Norway, Portugal, San Marino, Singapore, Slovenia,
Spain, Sweden, Switzerland and United Kingdom.
Since October 2004, visa waiver travelers from ALL VWP countries must present a machine-readable passport at the US port of entry. Machine-readable passports issued since October 2005 require a digital photograph printed on the data
page or integrated chip with information from the data page. A passport with a validity date at least six months beyond the applicant’s intended period of stay in the
United States is required. If more than one person is included in the passport, each
person desiring a visa must make a separate application;
To avoid frustrations and disappointments
• Advance planning by travelers is essential. Review your visa status and find out
if you need a US visa or a visa renewal.
• Plan to submit your visa application well in advance of your departure date.
Contact your nearest US embassy or consulate for a current time estimate and recommendations.
• Visit the embassy or consular section website where you will apply for your visa
to find out how to schedule an interview appointment, pay fees and any other instructions. An interview is required as a standard part of visa processing for
VISA INFORMATION: TEMPORARY VISITORS TO THE US
prior to the visa interview.
The US has updated its visa policies to increase security. It will likely take you
longer to get a visa than it used to, and you will find that a few new security measures have been put into place. For details that may apply specifically to your country, see information posted by your nearest US Consulate or Embassy.
Please note that this information is given in good faith, but that the regulations
may change and the only authoritative sources of information are the US Government websites at http://www.unitedstatesvisas.gov/ and http://travel.state.gov/
visa/visa_1750.html.
most visa applicants.
• Applicants must now also have two index finger-scans collected as part of the
visa application process. These finger-scans are normally collected by the consular
officer at the visa interview window, but in some countries they are collected
67
2006 IEEE MTT-S TECHNICAL PROGRAM COMMITTEE
Peter Aaen
Mohamed Abouzahra
John (Douglas) Adam
Peter Asbeck
John Atherton
Inder Bahl
John Bandler
Rajeev Bansal
Zaher Bardai
Scott Barker
H. Clark Bell
Tibor Berceli
Adalbert Beyer
Sarjit Bharj
Pierre Blondy
Vicente Boria
Olga Boric-Lubecke
Jens Bornemann
Hermann Boss
Thomas Brazil
Gailon Brehm
Klaus Breuer
Steve Brozovich
Eric Bryerton
Chuck Buntschuh
Nicholas Buris
Edmar Camargo
Andreas Cangellaris
Robert Caverly
Malgorzata Celuch
Zoltan Cendes
Kai Chang
Richard Chen
Young-Kai Chen
Zhizhang (David) Chen
J.C. Chiao
Debabani Choudhury
Terry Cisco
Eliot Cohen
James Crescenzi
Steve Cripps
John Cunningham
Lionel Davis
Har Dayal
Leo de Vreede
Guglielmo D’Inzeo
Paul Draxler
Rhonda Franklin Drayton
John Ebel
Danny Elad
George Eleftherides
Samir El-Ghazaly
Atef Elsherbeni
Rudy Emrick
Andrea Ferrero
Victor Fouad Hanna
Bernard Geller
Stephen Maas
Mohammad Madihian
Asher Madjar
Raghu Mallavarpu
Raafat Mansour
Steve Marsh
Jon Martens
Babak Matinpour
JK McKinney
Robert McMillan
Mohamed Megahed
David Meharry
Francisco Mesa
Robert Minasian
Ryan Miyamoto
Jozef Modelski
Mauro Mongiardo
Amir Mortazawi
Koichi Murata
Vijay Nair
Michel Nakhla
Jean-Christophe Nallatamby
Julio Navarro
Brad Nelson
Edouard Ngoya
Cam Nguyen
Edward Niehenke
Martin Nisenoff
Toshio Nishikawa
Dalma Novak
Takashi Ohira
Abbas Omar
John Owens
John Papapolymerou
Jose Pedro
Luca Perregrini
Anh-Vu Pham
Aryeh Platzker
Roger D. Pollard
George Ponchak
Zoya Popovic
Marian Pospieszalski
Reinhold Pregla
Joseph Pribetich
Frederick Raab
Richard Ranson
James Rautio
Jose E. Rayas-Sanchez
Gabriel Rebeiz
Kate Remley
Edward Rezek
Alfred Riddle
Vittorio Rizzoli
David Root
Luca Roselli
Arye Rosen
Clemens Ruppel
Spartak Gevorgian
Fadel Ghannouchi
Chuck Goldsmith
Mike Golio
Stephen Goodnick
Anand Gopinath
Mark Gouker
Kavita Goverdhanam
Ian Gresham
Drew Guckenberger
Ramesh Gupta
Wojciech Gwarek
Mike Harris
Leonard Hayden
John Heaton
Patric Heide
Wolfgang Heinrich
George Heiter
Bert Henderson
Rashaunda Henderson
Peter Herczfeld
Wolfgang J. R. Hoefer
Glenn Hopkins
Derry Hornbuckle
John Horton
Ho Huang
H. Alfred Hung
Ian Hunter
Kiki Ikossi
Kenji Itoh
Tatsuo Itoh
David Jackson
Robert Jackson
Dieter Jaeger
Michael Janezic
Sridhar Kanamaluru
Linda Katehi
Allen Katz
Roger Kaul
Wayne Kennan
Amarpal (Paul) Khanna
Reinhard Knoechel
James (Jim) Komiak
Agnieszka Konczykowska
Hiroshi Kondoh
Bruce Kopp
Youji Kotsuka
Vikram Krishnamurthy
Sushil Kumar
H. John Kuno
Youngwoo Kwon
Paolo Lampariello
Joy Laskar
Timothy Lee
Ralph Levy
Johann Luy
Gregory Lyons
68
Peter Russer
Dave Rutledge
Tom Ruttan
Magdalena Salazar-Palma
Tapan Sarkar
James Schellenberg
Dominique Schreurs
John Sevic
Arvind Sharma
Wayne Shiroma
Phillip Smith
Chris Snowden
Richard Snyder
Roberto Sorrentino
Richard Sparks
Peter Staecker
Michael Steer
Eric Strid
Wayne Struble
Almudena Suarez
Roger Sudbury
Daniel Swanson
Bela Szendrenyi
Yusuke Tajima
Jesse Taub
Manos Tentzeris
Mohammad-Reza Tofighi
Tsuneo Tokumitsu
Kiyo Tomiyasu
Robert Trew
Ruediger Vahldieck
Andre Vander Vorst
John Walker
Chi Wang
Keh-Chung Wang
Paul Watson
Robert Weigel
Claude Weil
Andreas Weisshaar
Charles Weitzel
Tom Weller
Cheng (CP) Wen
Scott Wetenkamp
James Whelehan
James Wiltse
Ingo Wolff
Dwight Woolard
Ke Wu
H.Y. David Yang
Huiwen Yao
Robert York
Ming Yu
Kawthar Zaki
Jan Zehentner
Q.J. Zhang
2006 IEEE MTT-S IMS STEERING COMMITTEE
POSITION
NAME
POSITION
NAME
General Chair.............................................................................John Barr
Panel Sessions ......................................................................Suresh Ojha
Finance Chair .................................................................Steven Rosenau
TPC Co-Chair ........................................................................Paul Khanna
Photography.....................................................................Milica Markovic
TPC Co-Chair ......................................................................Roger Pollard
Secretary ................................................................................Simon Wood
Protocol/VIP......................................................................Charlie Jackson
Publications Chair .................................................................Jim Sowers
ARFTG Liaison ...............................................................Bela Szendrenyi
Publications Vice Chair ...........................................Michael Thornburn
Awards Banquet .....................................................................Debbie Kim
Conference Services ...........................................................Larry Whicker
Publicity Chair..........................................................................Ken Wong
Electronic Paper Management..............................................Jon Hacker
Electronic Paper Management .................................................Jeff Pond
Registration Chair..........................................................Bert Henderson
RFIC General Chair ...........................................................Stefan Heinen
Exhibition Manager ............................................................Harlan Howe
RFIC TPC Chair ...........................................................Luciano Boglione
RFIC TPC Co-Chair ...............................................................Jenshan Lin
Plenary Session ............................................................Bobby Matinpour
Publicity..........................................................................Tom Brinkoetter
Exhibition Manager......................................................Howard Ellowitz
General Chair Emeritus....................................................Jim Crescenzi
Gifts..........................................................................................Myra Verret
Speakers Prep Room........................................................Shahram Farazi
Special & Focussed Sessions Chair....................................Jay Banwait
Special Events Chair ...........................................................Darin Phelps
Golfing Chairman..................................................................Mike Bailey
Grants Administration .................................................Milica Markovic
Student Activities ...............................................................Anh-Vu Pham
Student Paper Contest.........................................................Rick Branner
Historical Exhibit Chair....................................................Vernon Dunn
Hospitality ......................................................................Marcia Camargo
IEEE Conference Management .........................................Elsie Cabrera
Interactive Forum Chair....................................................Sushil Kumar
Student Paper Contest ...........................................................Bob Owens
TPC Membership Logistics....................................................John Wood
Visa letters/International Liaison.....................................Zaher Bardai
Web Master.......................................................................Dan McCormick
Interactive Forum ...........................................................Balvinder Bisla
Wireless Network Support...............................................Chad Deckman
Women in Engineering........................................................Linda Katehi
Workshops & Tutorials Chair ......................................Edmar Camargo
IP PDA Environment ...................................................................Tim Lee
Local Arrangements Chair ...........................................Steve Brozovich
Local Arrangements Vice Chair .........................................Richard Lira
Local Arrangements Audio Visual ..............................Michael Forman
Local Arrangements Food/Banquets...............................Vincent Verret
Local Arrangements Guest Program .................................Richard Lira
Workshops .......................................................................Amolak Badesha
Workshops...............................................................................Nima Shams
Workshops & Tutorials (Friday)...................................Toshi Moriuchi
Workshops & Tutorials (Monday) .................................Wayne Kennan
Local Arrangements Room Plan ..................................Dustin Hoekstra
Local Arrangements Signs ...............................................Jon Shumaker
Local Arrangements Transportation......................................Les Levitt
Panel Sessions Chair .............................................................Alfie Riddle
Workshops & Tutorials (Sunday) ......................................Brad Nelson
Workshop Editor ......................................................................Jeff Keyzer
Workshops & Tutorials Publications................................Ravinder Gill
69
HISTORICAL EXHIBIT
HISTORICAL ELECTRONICS MUSEUM
The Historical Electronics Museum is the permanent home of
the MTT-S Historical Collection between Symposia. The Museum holds many microwave-related items besides the MTT-S
Collection, including parts of
the SCR-270 (Pearl Harbor)
radar and a complete SCR-584
radar, which was used with the
proximity fuze in World War II.
It also contains an impressive
library of over 10,000 books and 11,000 journals. The Museum is
located near Baltimore-Washington International Airport, and is
approximately 20 minutes from downtown Baltimore. Additional
information on the Museum can be found on its Web site at
http://www.hem-usa.org/, or call (410) 765-2345.
The Microwave Theory and Techniques Society Historical Exhibit will be located in the Exhibit Hall of the Moscone
Center. Symposium attendees are encouraged to visit the Historical Exhibit during
the regular exhibition hours, Tuesday
through Thursday. The Historical Exhibit
includes the MTT-S library collection of
books and documents with descriptions of
early theoretical and experimental achievements in microwaves. A collection of historical artifacts will be on display chronicling
the history of modern MMIC chips and
Vernon Dunn microwave modules from their inception.
Exhibits willl illustrate the rich history of microwave developments in the San Francisco Bay area.
SAN FRANCISCO INFORMATION
views take your breath away, but also the magnitude of the entire city will truly leave you in awe. Alcatraz, on the other hand,
is more historic than anything else. Though during the summer
it is difficult to catch a ferry without a previous reservation, the
island is a beauty to marvel from near or far.
Perhaps one of the more calming and cultural sights located in
the heart of San Francisco is its Golden Gate Park. Although at
one time it was a wasteland of sand dunes, now it is the largest
man-made city park in the world. Dotted with lakes and gardens,
the park also boasts athletic fields of all sorts, fun-filled playgrounds for children, trails covered with unusual plants and
flowers, as well as picnic areas. On Sundays, the park is shut
down from all transportation and cars are not allowed to enter.
People get a perfect opportunity to rollerblade, rent bikes, or
simply take a stroll in the streets-without having to worry about
vehicles. Within the park, the Japanese Tea Gardens are a perfect place to absorb Japanese culture. The multi-level garden
with many twisting paths and photographic landscape is the
ideal rest stop while touring the Golden Gate Park. Not far from
the gardens is the De Young Museum and Exploratorium-both
excellent places to be visiting on a rainy day (yes, it rains often
in San Francisco).
Yet another famous landmark to discover the city’s ethnic diversity is the legendary Chinatown. It is an electrifying place
with copious numbers of interesting sights, smells and sounds.
You can’t possibly leave without trying one of the great restaurants Chinatown has to offer.
Perhaps the best place to visit if breathtaking views are your
preference is Coit Memorial Tower. The tall, cylindrical tube of a
building makes it recognizable from afar. Built with funds left to
the city by philanthropist Lillie Hitchcock Coit for the beautification of San Francisco, many believe the tower was designed in
the shape of a fire hose nozzle in order to commemorate Coit’s
admiration for firefighters. Take the elevator up to the top and
discover the city from above.
Lombard Street. Need we say more? One of the most famousand curviest-street in the world, Lombard twists down Russian
Hill in nine hairpin turns, furnished with colorful flowers along
the way. The ideal sight to drive or even walk down. And once
you are finished, hop on one of San Francisco’s famous trolleys
which will take you downtown. If you are coming with young
children, this is one thing you cannot leave out. Once in downtown, you will be in the center of style, the latest fashion, and
high-end clothing. If you are looking for a quick lunch, just stop
by Macy’s and take the escalators to the lowest level. There you
will find quality food for low prices. Or, you can try some of the
upscale restaurants found on almost every corner of downtown.
Last but not least is the famous Fisherman’s Wharf, where
both children and adults will surely enjoy themselves. Bustling
Hello and welcome to San Francisco’s IMS 2006! Not only do
we hope you enjoy your stay for the Microwave Week while you
are here, but we also hope you are able to sightsee and indulge
yourself in the beauties San Francisco encompasses. One of the
oldest cities in the Bay area, San Francisco has grown since its
founding year in 1835 to a grand city of about one million inhabitants, occupying a mere 48 hilly square miles at the tip of a slender peninsula, almost perfectly centered along the California
coast. Though extremely small and compact, the city is more
than an approachable place, with an enlivened downtown, clam
piers, stunning views, and unforgettable landmarks.
San Francisco’s long history began about 15,000 years ago
when the original inhabitants of this area, the Ohlone Indians,
settled and lived as a hunter-gatherer society for thousands of
years. That is, until they were all wiped out within a few years of
the establishment in 1776 of the Mission Dolores, the sixth in the
chain of Spanish Catholic missions that ran the length of California. Though California was slow to be inhabited, two years after
the Americans replaced the Mexicans in 1846, the discovery of
gold in the Sierra foothills triggered the impetuous Gold Rush.
Within a year, about fifty thousand pioneers had traveled out
west, or east from China as a matter of fact-all seeking a better
life. It turned San Francisco from a muddy village and wasteland
of sand dunes into a thriving supply center and transit town. By
the time the transcontinental railroad was completed in 1869,
San Francisco was a lawless, rowdy boomtown of bordellos and
drinking dens, something the moneyed elite worked hard to
mend, constructing wide boulevards, parks, a cable car system
and elaborate Victorian redwood mansions.
In the midst of the city’s golden age, the notorious 1906 earthquake burned San Francisco to the ground. After rebuilding the
town, it only became more magnificent than before, developing a
unique charm it still possesses today. Though by World War II
San Francisco had been eclipsed by Los Angeles as the main
West Coast city, it had also achieved a new cultural eminence
with the emergence of the Beats in the Fifties and the hippies in
the Sixties-when the fusion of music, protest, and rebellion characterized 1967’s “Summer of Love.”
Much has been said and written about San Francisco, but no
single line rings more genuine than that of the author Gene
Fowler’s: “Every man should be allowed to love two cities-his
own and San Francisco.” So, while you are here in San Francisco, pay a visit to the countless sights to see. Two of the “mustsees” are quite obviously the Golden Gate Bridge and Alcatraz.
Golden Gate, essentially the very symbol and essence of San
Francisco, is a perfect landmark to visit, especially in the summer. The constant cool breeze makes strolling back and forth
across the bridge a worthwhile experience. If you are lucky and
catch a day with perfect weather, not only will the astounding
70
SAN FRANCISCO INFORMATION (CONT)
BART according to this link: http://www.bart.gov/guide/
airport/oak.asp .
with excitement, tour each pier with care and find out what it
would be like to live the life of a fisherman. Don’t forget to visit
the seals-they are simply too adorable to miss.
But remember not to be fooled by San Francisco’s climate. It is
not the California of monotonous blue skies and slothful warmth.
Rather, the temperatures rarely exceed the seventies (or the low
twenties in Celsius), and even during summer it can drop much
lower. So bring layered clothing-and possibly even an umbrella.
Most importantly, however, San Francisco is a city of multiple
ambiances and lots to do. After all, it is called “The City of Cities”
for a reason. We look forward to seeing you here in San Francisco in June 2006!
Please, look around on the Official Visitor Site for San Francisco at http://www.welcometosf.com to learn more about this
wonderful city and the gamut of additional small programs to do
while here. Also, our IMS 2006 website www.ims2006.org provides further useful links to various tourist sites, such as wine
tours in Napa Valley or Lawrence Hall of Science just to name a
few, which may become of interest to you.
Anna Szendreni
Bela Szendreni
Norman Y. Mineta San Jose International Airport (airport code
SJC): The Moscone Center and conference hotels are located 44
miles by ground transportation from the San Jose Airport.
Caltrain is a convenient method to get to San Francisco from
SJC. Travelers may use VTA Bus 10 (Airport Flyer) to get to the
Cal Train Santa Clara Station. See these two links for information
on SJC to Caltrain. http://www.sjc.org/travelers/maps.html and
http://www.sjc.org/travelers/public.html. Travelers will need to
take either a MUNI Bus, the Muni N Streetcar, or a taxi to their
hotel from the San Francisco Caltrain terminal at 4th and
Townsend (4th and King for the Muni N Streetcar). See San
Francisco City Wide map at http://onlysf.sfvisitor.org/maps/ and
MUNI map at http://www.sfmuni.com/cms/mms/home/
home50.htm.
There is no general attendee bussing between hotels and convention center. But, those with special needs should contact
[email protected]
TRANSPORTATION
SOCIAL EVENTS
The City of San Francisco is located on the northern tip of the
peninsula created by the Pacific Ocean to the west and the San
Francisco Bay to the east. This geography determines the locations of the major roads and transit systems. San Francisco is
connected to San Jose by US Highway 101 which runs south
along the west side of the bay and also by Interstate 280 which
runs south along the spine of the peninsula hills. San Francisco is
connected to Oakland by Interstate 80 over the Bay Bridge and
by Interstate 880 which runs along the east side of the bay. San
Francisco is served by the Muni Transit System in San Francisco,
BART Transit System to San Francisco Airport and Oakland Airport, and CALTRAIN to San Jose. Downtown San Francisco is
easy to get around via the Muni transit system, taxi, or walking.
The convenience of having a car in the City of San Francisco may
be reduced by the limited availability of parking and its expense.
There are three nearby airports hosting all major domestic and
international air carriers in the Bay Area. San Francisco International Airport is the most conveniently located and offers a
greater variety of flights. However, it may have higher airfares
and may be subject to flight delays during periods of low clouds.
Oakland International Airport and Norman Y. Mineta San Jose International Airport may have lower airfares and may be less subject to delays.
San Francisco International Airport (airport code SFO): The
Moscone Center and conference hotels are located just 13 miles
by ground transportation from the San Francisco Airport. The
BART link http://www.bart.gov/guide/airport/sfo.asp compares
available ground transportation and their estimated costs:
RFIC SYMPOSIUM RECEPTION: Sunday evening, June 11, is a highlight of
RFIC technical activity and social events. The evening begins with the
official opening of the technical program at the RFIC Plenary session
at 5:30 PM in the SFCC Esplanade Ballroom. All attendees are invited
to the plenary. Following the plenary, the RFIC Steering committee is
hosting a reception.
MICROWAVE JOURNAL/MTT-S RECEPTION: All Microwave week attendees
and exhibitors are invited to attend a reception hosted by Microwave
Journal and MTT-S on Monday, June 12 from 6:00 to 8:00 PM at the
Yerba Buena Gardens, just across the street from the Convention Center and the Marriott.
IEEE MTT WOMEN IN ENGINEERING RECEPTION: The IEEE MTT WIE
committee will host a meeting and reception on Tuesday, June 13,
8:00–10:00 PM, at the Marriott Hotel.
HAM RADIO SOCIAL: All radio amateurs who are attending IMS 2006 are
invited to a social gathering on Tuesday, June 13, 8:30–10:00 PM, at the
Marriott Hotel.
STUDENT RECEPTION: A reception for all students will be held at the
Marriott Hotel on Tuesday, June 13, 6:30–9:00 PM. All students are invited to attend.
MAXWELL RUMP SESSION RECEPTION: A reception will be held for all attendees of the Maxwell rump session prior to the presentation at the
Marriott Hotel.
INDUSTRY HOSTED COCKTAIL RECEPTION: Symposium exhibitors will host
a cocktail reception on Wednesday, June 14, from 5:45 PM to 7:15 PM at
the Marriott. Complimentary beverage tickets will be included in the
registration packages.
IEEE MTT-S AWARDS BANQUET: The annual Awards Banquet will be
held on Wednesday, June 14, from 7:30 PM to 10:00 PM at the Marriott
Hotel. The evening will include a fine dinner, awards presentation and
entertainment. Major society awards will be presented at this event.
The banquet is free of charge for the awardees.
IEEE MTT-S STUDENT AWARDS LUNCHEON: Student Paper Awards, MTT
graduate Fellowships and MTT undergraduate scholarships will be
presented at the Student awards luncheon at noon on Thursday, June
15 at the Marriott Hotel. The Luncheon is free for all student paper finalists and their advisors.
TECHNICAL ATTENDEES BREAKFAST: Monday–Thursday at the convention center lobby from 7:00 AM to 9:00 AM. This breakfast is for all persons registered as technical participants in the IMS, RFIC or ARFTG.
Badge required for admission.
Destination
Downtown SF
Taxi: $25–$37
Shuttle Van: $12–$17
Daily Car Rental: $39–80
BART: $4.95
The BART station nearest to the Moscone Center is either BART
Montgomery St. Station or BART Powell St. Station. A map of
the area may be found at http://onlysf.sfvisitor.org/maps/.
Oakland International Airport (airport code OAK): The
Moscone Center and conference hotels are located 20 miles by
ground transportation from the Oakland Airport. BART is a convenient method to get to San Francisco from Oakland Airport.
Travelers may use the AirBART Bus (Shuttle) from OAK to
71
IMS2006 GUEST PROGRAM
All tours have a 30 guest minimum with the exception of
Muir Woods. If the tour minimum is not met 14 business
days prior to the scheduled tour date, the tour will be subject
to cancellation. All tour fees will be completely refunded to
the IEEE attendee in the event of a tour cancellation. All
tours depart from The San Francisco Marriott’s Mission
Street exit. Look for a uniformed tour guide wearing black
with a sign listing your tour. The guide will be stationed in
the Marriott lobby. A Signature Hospitality Group representative will be available daily in the Hospitality Suite.
Hours: 10:00 AM–2:00 PM
Sunday, June 11, 2006
Hours: 12:00 PM–4:00 PM
Includes:
From the towering pillars of the Golden Gate Bridge to the
quiet parks of Russian Hill, San Francisco is a city of contrasts.
The steep rollercoaster hills seem oddly misplaced against the
deliberate lines and angles of the city’s high-rise horizon. This is
a tour to several of San Francisco’s most beautiful and popular
attractions with free time for lunch. You’ll be transported via motorized cable car through the city’s greatest sights, including a
stop across the Golden Gate Bridge for a photo opportunity.
Roundtrip motorized cable car transportation
Tour of San Francisco highlights
Photo stops at several San Francisco attractions
Free time for lunch
Professional Tour Guide on cable car throughout the tour
All applicable taxes, fees and gratuities
Cost of Tour: $60.25 pp (casual attire)
Muir Woods, Sausalito
& Golden Gate Bridge
The Marin Headlands, perched above the spires of the Golden
Gate Bridge, is a geographically unique vantage point where,
high above the city, guests will enjoy one of the area’s best and
most beloved city and ocean vistas. Continuing north, guests will
stop in Muir Woods, a spot described by conservationist John
Muir as “the best tree-lovers monument that could possibly be
found in all the forests of the world.” The redwood, old-growth
forest was once typical of the Northern California coast. The
tour closes with a stop for shopping and sightseeing in the former fishing village of Sausalito. Guests invariably adore Sausalito
for all its quaint, eclectic charm — not to mention the city’s wonderful architecture, shopping and natural beauty.
Hours: 10:00 AM–2:00 PM
Roundtrip mini coach transportation
Photo stop at the Golden Gate Bridge
Guided tour in Muir Woods
Free time for shopping & lunch in Sausalito
Professional tour guide throughout the tour
Includes:
Detailed walking tour of Cinatown by a Neighborhood Native Tour Guide
Free time for shopping & lunch
Visit to temples, markets and a Fortune Cookie factory
Hours: 10:00 AM–6:00 PM
IMS 06 Golf Outing
Monterey, Carmel & Pebble Beach
This spectacular tour will take you south of San Francisco
through the Silicon Valley and the Santa Cruz Mountains to the
beautiful coastal cities of Monterey, Carmel and Pebble Beach.
Guests will drive down 17-Mile Drive and enjoy some of the most
spectacular, picturesque coastline in California. Free time will
be given in Monterey and the seaside town of Carmel-by-theSea, home of former Mayor Clint Eastwood, Doris Day and many
other celebrities, for sightseeing and shopping.
Presidio Golf Course, 300 Finley Rd., San Francisco, CA
Play: Staggered Tee times, "Scramble" rules for each Team of 4
Players
Awards for longest drive, nearest to the pin (par 3); best team
score, 2nd and 3rd place team scores.
For more information about Presidio Golf Course, visit their
website at http://www.presidiogolf.com/
Includes:
Golf Carts
Range Balls
Lunch
Rental clubs available
Cost: $85.00 pp for early registration; $95:00 after May 5, 2006
Hours: 10:00 AM–2:00 PM
Walking Tour of Chinatown
Chinatown is one of the city’s most eclectic and fascinating
neighborhoods. The infectious energy of the neighborhood, coupled with the guide’s intimate knowledge, makes this one of the
most popular tours. Take a guided walking tour of unique Grant
Avenue, the home of Chinese markets, restaurants, theaters,
herb shops, temples, a fortune cookie factory and more in one of
the largest Chinese communities outside of Asia.
Includes:
Hours: 8:00 AM (Players must register by 8:00 AM)
San Francisco City Tour
Includes:
Roundtrip motor coach transportation
Entrance to 17-Mile Drive
Free time in Monterey and Carmel for shopping & lunch
Professional tour guide throughout the day
Alcatraz, Fisherman’s Wharf & Pier 39
Wednesday, June 14, 2006
Hours: 10:00 AM–2:00 PM
Fisherman’s Wharf, “San Francisco’s most popular destination” is beloved for the history, culture and scenery, including
the famous sea lions on exhibition at Pier 39. Others simply enjoy the unique restaurants and abundant shopping. We’ll transport you from your hotel to the Wharf, where you’ll board ferries
and sail to the intersection of myth, imagination and history: Alcatraz. Perhaps the most famous prison in the world, Alcatraz
was also the first military outpost on the West Coast, the setting
for a two-year Native American occupation, and the home to a
surprisingly varied ecosystem. You’ll then return to the Wharf
for free time for lunch, sightseeing and shopping.
Golden Gate Park, Japanese Tea
GARDENS & New de Young Museum
This guided tour of Golden Gate Park highlights the legendary
landmarks in San Francisco including the Music Concourse, the
Polo Fields, the “Garden of Shakespeare’s Flowers,” the French
Bowling Lawn, an 87 year-old carousel, the public botanical gardens and, perhaps most famously, the Conservatory of Flowers
and Japanese Tea Gardens. You will then visit the newly remodeled and world-renowned M.H. de Young Museum. This new facility integrates art, architecture and natural landscape in one
multi-faceted destination that will inspire audiences from around
the world.
Includes:
Ferry & admission to Alcatraz
Free time at Fisherman’s Wharf and Pier 39
Includes:
Guided tour of the Golden Gate Park Highlights
Admission for de Young Museum
Admission fees for the Japanese Tea Gardens & Conservatory of Flowers
72
IMS2006 GUEST PROGRAM
Thursday, June 15, 2006
Hours: 10:00 AM–5:00 PM
Wine Country Tour
Friday, June 16, 2006
Hours: 7:00 AM–9:00 PM
Enjoy the beauty, sights and tastes of the wine country. Upon
entering the gateway to the Sonoma and Napa valleys, this tour
will visit wineries that showcase award-winning wine produced
in California. You’ll visit three wineries, where you’ll enjoy tours
and tastings of the best of California wine.
Yosemite National Park
Yosemite National Park embraces a spectacular tract of mountain-and-valley scenery in the Sierra Nevada, which was set
aside as a national park in 1890. The park harbors a grand collection of waterfalls, meadows, and forests that include groves of giant sequoias, the world’s largest living things. There will be
plenty of photo opportunities and time for lunch on your own.
Includes:
Deluxe motor coach transportation
Tour and tasting at three wineries
Free time for lunch & picnicking
Includes:
Roundtrip motor coach transportation to Yosemite National Park
Free time for lunch
Snacks and bottled water
Note: Transportation one-way is approximately four hours. Restroom breaks will be taken
as necessary. Motor coach has one restroom on board.
NOTE: go to www.signaturesf.com/ieee
for the latest program details and pricing
73
Marriott Floor Plan
South Registration
Telephone
North Registration
Salon 6
Salon 10
Salon 5
Salon 11
Salon 4
Salon 12
Salon 3
Salon 13
Salon 2
Salon 14
Salon 1
Salon 7
Salon 8
Bake
Shop
Kitchen
Salon 9
Salon 15
Howard
Street
Loading
Dock
74
Howard Street
Yerba Buena
Grand Assembly
As s em bly
Assembly
N o b H ill D
N o b H ill C
N o b H ill B
N o b H ill A
Yerba Buena Ballroom Level
Moscone Floor Plan
Exhibit Level
Mezzanine Level
Esplanade Level
75
2006 RFIC TECHNICAL PROGRAM — TUESDAY, JUNE 13, 2006
RTU1A Wideband Communication System & ICs – Moscone 302
Chair: R. Gharpurey, UT Austin
Co-chair: M. Reddy, Maxlinear Inc.
8:00 AM: RTU1A-1: Millimeter-Wave Wireless Personal Area Network Systems
H. Ogawa, National Institute of Information and Communications Technology (NICT)
8:20 AM: RTU1A-2: Student Paper: Distributed Amplifiers with Non-Uniform Filtering
Structures
Y. Zhu, H. Wu, Department of Electrical and Computer Engineering, University of Rochester
8:40 AM: RTU1A-3: A Fully Integrated 24 GHz SiGe Receiver Chip in a Low-cost Micro-lead
Plastic Package
I. Gresham, A. Jenkins, N. Kinayman, R. Point, A. Street, Y. Lu, A. Khalil, R. Ito, R. Anderson,
M/A-COM, Lowell, MA
9:00 AM: RTU1A-4: A Fully-Integrated 0.13 μm CMOS Low-IF DBS Satellite Tuner Using a
Ring Oscillator Based Frequency Synthesizer
A. Maxim, R. Poorfard, R. Johnson, P. Crawley, J. Kao, Z. Dong, M. Chennam, T. Nutt,
D. Trager, Silicon Laboratories Inc.
9:20 AM: RTU1A-5: A CMOS Quadrature Down-Conversion Mixer with Analog I/Q Correction
Obtaining 55 dB of Image Rejection for TV on Mobile applications
M. Notten, V. Rambeau, Philips Research Laboratories Eindhoven, The Netherlands;
M. Bernard, J. van Sinderen, Philips Semiconductors Caen, France
RTU1B Advanced ICs for Optical Communications – Moscone 304
Chair: S. Heinen, RWTH Aachen University
Co-chair: J. Lin, University of Florida
8:00 AM: RTU1B-1: A 9.953–12.5 Hz 0.13 μm Standard CMOS Bondwire LC Oscillator Using a
Resistor-Tuned Varactor and a Low-Noise Dual-Regulator
A. Maxim, C. Turinici, Integrated Products, Austin TX
8:20 AM: RTU1B-2: 10 GHz VCO for a 0.13 μm CMOS Sonet CDR
W.S. Titus, J.G. Kenney, Analog Devices
8:40 AM: RTU1B-3: A 40 Gb/s, Digitally Programmable Peaking, Limiting Amplifier with 20
dB Differential Gain in 90 Nm CMOS
J. Weiss, M.L. Schmatz, IBM Zürich Research Laboratory; H. Jäckel, Swiss Federal Institute
of Technology, ETH Zurich
9:00 AM: RTU1B-4: Student Paper: Transmitter and Receiver Circuits for Serial Data
Transmission over Lossy Copper Channels for 10 Gb/s in 0.13 μm CMOS
F. Weiss, D. Kehrer, Infineon AG; A.L. Scholtz, Technical University of Viena
9:20 AM: RTU1B-5: An SOI CMOS, High Gain and Low Noise Transimpedance-Limiting
Amplifier for 10 Gb/s Applications
F. Pera, INSYTE (Innovative System and Technologies Corp.); S.P. Voinigescu, University of
Toronto
RTU1C RFIC Simulation and Layout Optimization – Moscone 305
Chair: K. McCarthy, University College Cork
Co-chair: L. Liu, Northrop Grumman Corp.
8:00 AM: RTU1C-1: Verification of RF Transceivers in SOC: RF, IF, Baseband and Software
K. Muhammad, B. Staszewski, T. Murphy, I. Elahi, Texas Instruments Inc., Dallas, Texas
8:20 AM: RTU1C-2: Next-Generation Silicon Analysis Tools for RF Integrated Circuits
A. Mehrotra, A. Narayan, R. Subramanian, Berkeley Design Automation, Inc.
8:40 AM: RTU1C-3: Student Paper: A Unified Modeling and Design Methodology for RFICs
Using Parameterized Sub-Circuit Cells
D.H. Shin, C.P. Yue, Carnegie Mellon University
9:00 AM: RTU1C-4: Layout Optimization of RF CMOS in the 90 nm Generation
A. Nakamura, T. Oishi, H. Ammo, K. Takeshita, Modeling Development Section, Analog & RF
Device Development Department, Semiconductor Technology Development Group,
Semiconductor Business Unit; N. Yoshikawa, T. Miyazako, System LSI Business Gp
9:20 AM: RTU1C-5: Circuit Model of a SiGe HBT Flip-Chip Mounted onto a Silicon Carrier
M. Norling, S. Gevorgian, Department of Microtechnology and Nanoscience MC2, Chalmers
University of Technology, Gothenburg, Sweden
RTU1D Cellular Bands Power Amplifiers - Moscone 306
Chair: F. Straten, Philips Semiconductors
Co-chair: D. Ngo, RFMD
8:00 AM: RTU1D-1: Average Current Reduction in (W)CDMA Power Amplifiers
D.A. Teeter, E.T. Spears, H.D. Bui, H. Jiang, D. Widay, RF Micro Devices
8:20 AM: RTU1D-2: A 2.4 V Low-Reference-Voltage Operation, InGaP HBT MMIC Power
Amplifier Module for CDMA Applications
T. Moriwaki, K. Yamamoto, S. Suzuki, N. Ogawa, K. Maemura, T. Shimura, Mitsubishi Electric
Corp.; H. Otsuka, Wave Technology Inc.
8:40 AM: RTU1D-3: Large-Signal Characterization of an 870 MHz Inverse Class-F CrossCoupled Push-Pull PA using Active Mixed-Mode Load-Pull
M.P. van der Heijden, D.M.H. Hartskeerl, I. Volokhine, Philips Research Lab; V. Teppati,
A. Ferrero, Politecnico di Torino
9:00 AM: RTU1D-4: Student Paper: A Fully-Integrated 900 MHz CMOS Power Amplifier for
Mobile RFID Reader Applications
J. Han, Y. Kim, C. Park, D. Lee, S. Hong, Dept. of EE, KAIST, Daejeon, Korea
9:20 AM: RTU1D-5: Student Paper: A CMOS Power Amplifier for Full-Band UWB
Transmitters
C. Lu, A. Pham, University of California at Davis; M. Shaw, Tahoe RF Semiconductor Inc.
76
2006 RFIC TECHNICAL PROGRAM — TUESDAY, JUNE 13, 2006
RTUIFR Interactive Forum – Moscone 103
103/104
Chair: J. Lin, University of Florida
Co-chair: L. Boglione, IECI
1:30 PM
RTUIFR-01: A 2.4 GHz Direct Conversion Transmitter for Wimax Applications
C. Masse, Analog Devices, Inc., Wilmington MA
RTUIFR-02: A 2.4 GHz CMOS RF Front-end for Wireless Sensor Network Applications
M. Annamalai, K.F.Ong, Y.B.Choi, W.G.Yeoh, Institute of Microelectronics, Singapore
RTUIFR-03: Student Paper: 1–11 GHz Ultra-Wideband Resistive Ring Mixer in 0.18 μm
CMOS Technology
T. Chang, J. Lin, University of Florida
RTUIFR-04: Student Paper: Receiver RF Front-End with 5 GHz-Band LC Voltage-Controlled
Oscillator and Subharmonically-Locked Oscillator for 17 GHz Applications
A. Tasic, W.A. Serdijn, J.R. Long, Delft University of Technology, The Netherlands; S.S.Y. Yue,
ATI Technologies, Canada; D.K.L. Ma, Synopsys, Canada; D.L. Harame, IBM Microelectronics,
Burlington, MA
RTUIFR-05: A Transformer-Based Receiver Front-End for 5 GHz WLANs
E. Ragonese, A. Italia, G. Palmisano, Università di Catania, Facoltà di Ingegneria, DIEES,
Italy; M.F. Seminara, STMicroelectronics, Catania, Italy
RTUIFR-06: Student Paper: A Miniature 15-50 GHz Medium Power Amplifier
M.-C. Chuang, P.-S. Wu, M.-F. Lei, H. Wang, Dept. of Electrical Engineering and Graduate
Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, ROC;
Y.-C. Wang, C.S. Wu, WIN Semiconductors Corp.
RTUIFR-07: Student Paper: Linear RF Polar Modulated SiGe Class E and F Power
Amplifiers
J.D. Kitchen, I. Deligoz, S. Kiaei, B. Bakkaloglu, Arizona State University
RTUIFR-08: LDMOST Integrated Doherty Amplifier
I. Blednov, J v d Zanden, Philips Semiconductors, The Netherlands
RTUIFR-09: Student Paper: SiGe Integrated mm-Wave Push-Push VCOs with Reduced
Power Consumption
R. Wanner, G.R. Olbrich, Technische Universität Muenchen, Germany; R. Lachner, Infineon
Technologies, Germany
RTUIFR-10: A Wide Operation Range CMOS Frequency Divider for 60 GHz Dual-Conversion
Receiver
Y.-J.E. Chen, S.-Y. Bai, T.-N. Luo, Graduate Institute of Electronics Engineering, National
Taiwan University, Taipei, Taiwan; D. Heo, School of Electrical Engineering and Computer
Science, Washington State University, Pullman, WA.
RTUIFR-11: A 18 GHz Silicon Bipolar VCO with Transformer-Based Resonator
A. Scuderi, E. Ragonese, G. Palmisano, Università di Catania, Facoltà di Ingegneria, DIEES,
Italy; T. Biondi, STMicroelectronics, Catania, Italy
RTUIFR-12: Student Paper: A Sub-mA FH Frequency Synthesizer Technique
E. Lopelli, A. van Roermund, Eindhoven University of Technology; J. van der Tang, ItoM
RTUIFR-13: 14 mW 5 GHz Frequency Synthesizer With CMOS Logic Divider and Phaseswitching Dual-modulus Prescaler
M. Kim, T.J. Park, Y. Kwon, J.H. Lim, S.G. Park, IC Design Center of Central R&D, Samsung
Electro-Mechanics; S.H. Kim, EMD Lab of Central R&D, Samsung Electro-Mechanics
RTUIFR-14: A 1 GHz Sigma-Delta Noise Shaper for All Digital PLLs with Multiband UMTS
Modulation Capability
T. Mayer, T. Pittorino, A. Springer, Johannes Kepler University Linz; V. Neubauer, L. Maurer,
DICE GmbH & Co KG; U. Vollenbruch, Linz Center of Mechatronics
RTUIFR-15: Tailoring On-Chip Inductors For Low-Noise Ultra-Wide-Band Receiver
Applications
F.K. Chai, I. To, D. Hammock, M. Huang, Microwave & Mixed-Signal Technologies Labs,
RTUIFR-16: High Performance NPN BJTs in Standard CMOS Process for GSM Transceiver
and DVB-H Tuner
J. Kim, H. Oh, C. Chung, J.-H. Jeong, H. Lee, S.-H. Hwang, I.-C. Hwang, Y.-J. Kim, K. Hong,
E. Jung, K.-P. Suh, System LSI Business, Samsung Electronics Co. Ltd.
RTUIFR-17: Why Reciprocal Procedure Works?
T. Jamneala, D.A. Feld, B. Zaini, Avago Technologies Inc.; D. Blackham, K.H. Wong, Agilent
Technologies Inc.
RTUIFR-18: Student Paper: Ultra-Low Power RFIC Design Using Moderately Inverted
MOSFETs: An Analytical/Experimental Study
A. Shameli, P. Heydari, University Of California at Irvine
RTUIFR-19: High Linearity Performance of 0.13 μm CMOS Devices using Field-Plate
Technology
C.-C. Wei, H.-C. Chiu, W.-S. Feng, Department of Electronic Engineering, Chang Gung
University, Taoyuan, Taiwan, R.O.C.
RTUIFR-20: Wideband Lumped Element Model for On-Chip Interconnects on Lossy Silicon
Substrate
S. Sun, R. Kumar, S.C. Rustagi, Institute of Microelectronics; K. Mouthaan, National
University of Singapore; T.K.S. Wong, Nanyang Technological University.
RTUIFR-21: Student Paper: Systematic Design Methodology for On-Chip Transformers
with Patterned Ground Shield
O. El-Gharniti, E. Kerhervé, J. B. Bégueret, IXL Laboratory at Talence, France
RTUIFR-22: A Broadband and Scalable On-chip Inductor Model Appropriate for Operation
Modes of Varying Substrate Resistivities
J.C. Guo, T.Y. Tan, Department of Electronics Engineering, National Chiao Tung University,
Taiwan
RTUIFR-23: Minimization of Via Count in Multiple-Metal Inductors: Performance
Characterization and Physical Modelling
O.H. Murphy, K.G. McCarthy, P.J. Murphy, Department of Electrical and Electronic
Engineering, University College Cork, Cork, Ireland.
RTUIFR-24: Student Paper: A 3 GHz Subthreshold CMOS Low Noise Amplifier
H. Lee, S. Mohammadi, Purdue University
RTUIFR-25: Student Paper: An X-Band SiGe LNA with 1.36 dB Mean Noise Figure for
Monolithic Phased Array Transmit/Receive Radar Modules
W.-M.L. Kuo, J.D. Cressler, Georgia Institute of Technology; Q. Liang, IBM Microelectronics;
M.A. Mitchell, Georgia Tech Research Institute
RTUIFR-26: A +7.9 dBm IIP3 LNA for CDMA2000 in a 90 nm Digital CMOS Process
D.L. Griffith, Texas Instruments Inc.
RTUIFR-27: Student Paper: A 0.18 μm RF CMOS Ultra Wide Band Transmitter Front End
RFIC
J. Zhao, S. Raman, Bradley Dept. of ECE, Virginia Tech, Blacksburg, VA
RTUIFR-28: Low-Power Full-Band UWB Active Pulse Shaping Circuit Using 0.18 μm CMOS
Technology
K.W. Wong, S.R. Karri, Y. Zheng, Institute of Microelectronics, Singapore
RTUIFR-29: Frequency Characterization of a 2.4 GHz CMOS LNA by Thermal Measurements
D. Maleo, J. Allet, E. Aldrele-Vidrio, J.L. Gonzalez, Universitat Politecnica, Barcelona, Spain
2006 IEEE MTT-S
International Microwave Symposium Program Guide
San Francisco, California
Photo Courtesy of the
California Alliance for Jobs
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