Microfluidics meets MEMS - Proceedings of the IEEE
Transcription
Microfluidics meets MEMS - Proceedings of the IEEE
Microfluidics Meets MEMS ELISABETH VERPOORTE AND NICO F. DE ROOIJ, FELLOW, IEEE Invited Paper The use of planar fluidic devices for performing small-volume chemistry was first proposed by analytical chemists, who coined the term “miniaturized total chemical analysis systems” (TAS) for this concept. More recently, the TAS field has begun to encompass other areas of chemistry and biology. To reflect this expanded scope, the broader terms “microfluidics” and “lab-on-a-chip” are now often used in addition to TAS. Most microfluidics researchers rely on micromachining technologies at least to some extent to produce microflow systems based on interconnected micrometer-dimensioned channels. As members of the microelectromechanical systems (MEMS) community know, however, one can do more with these techniques. It is possible to impart higher levels of functionality by making features in different materials and at different levels within a microfluidic device. Increasingly, researchers have considered how to integrate electrical or electrochemical function into chips for purposes as diverse as heating, temperature sensing, electrochemical detection, and pumping. MEMS processes applied to new materials have also resulted in new approaches for fabrication of microchannels. This review paper explores these and other developments that have emerged from the increasing interaction between the MEMS and microfluidics worlds. Keywords—Lab-on-a-chip, microfluidics, microfabrication, micromachining, miniaturized total chemical analysis systems (TAS), review . I. INTRODUCTION Though there exist early, pre-1990 examples of microelectromechanical systems (MEMS)-type microfluidic devices for chemical applications, it was the groundbreaking paper of Manz et al. [1] in 1990 that established the field of miniaturized total chemical analysis systems ( TAS). The TAS concept is an extension of the total chemical analysis system concept (TAS), which was put forth in the early 1980s to address the issue of automation in analytical chemistry [2]. Manuscript received February 26, 2003; revised April 4, 2003. E. Verpoorte was with the Institute of Microtechnology, University of Neuchâtel, CH-2007 Neuchâtel, Switzerland. She is now at the Groningen Research Institute of Pharmacy, University of Groningen, 9713 AV Groningen, The Netherlands (e-mail: [email protected]). N. F. de Rooij is with the Institute of Microtechnology, University of Neuchâtel, CH-2007 Neuchâtel, Switzerland (e-mail: [email protected]). Digital Object Identifier 10.1109/JPROC.2003.813570 To simplify the job of the analytical chemist, the TAS concept proposed the full incorporation of analytical procedures into flowing systems. Carrier streams of fluids, rather than human hands, take over the role of sample transport between different sample manipulation steps. Flow paths are defined by interconnected pieces of tubing, arranged in such a way that the desired analysis can be performed. The TAS is a smaller, faster version of this, with analyses taking place in flow systems having L and even sub- L volumes, to achieve times on the order of seconds rather than many minutes. The devices used are small and monolithic in nature. Three-dimensional (3-D) tubing-based systems are replaced by networks of microchannels integrated into planar substrate surfaces, with cross-sectional dimensions generally on the order of micrometers. Though still in its infancy, the interest in this technology has grown explosively over the last decade, with an increasing number of special symposia and conferences dedicated to the subject. Researchers from many disciplines other than analytical chemistry have also wholeheartedly embraced the fundamental fluidic principle of TAS as a way of developing new research tools for chemical and biological applications. This has led, among other things, to the emergence of TAS-like fluidic structures in microreactor technology. It has also resulted in the introduction of new terminologies and concepts. “Microfluidics,” or alternatively, “lab-on-a-chip” (LOC), are recent monikers that have entered the TAS jargon, and are increasingly used in place of TAS as general terms for the field. This development is in fact a tacit acknowledgment, perhaps, that the use of microflow systems has long since ceased to be the domain of the analytical chemist alone. The ability to make networks of interconnecting channels is what lies at the heart of microfluidics, and makes it so powerful. The crucial enabling technologies came first from the world of MEMS, where the use of photolithographic processes to obtain micrometer features in silicon and other substrates was well established. The first successful demonstration of chip-based analysis in the early nineties involved the fast separation of fluorescent dyes [3], [4] and fluorescently labeled amino acids [5] by capillary electrophoresis (CE). This technique, based on the separation of charged 0018-9219/03$17.00 © 2003 IEEE 930 PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 1. Video imaging of sample loading, injection, and separation by micellar electrokinetic capillary chromatography (MECC) in a simple cross injector geometry. Separation is effected by interaction of the analyte with micelles composed of the surfactant, sodium dodecyl sulfate (SDS), which was added to the run buffer. With their hydrophobic interiors and charged surfaces, the micelles are aggregates which act as a pseudostationary phase transported electrokinetically in the electric field. Channels are 40 m wide and 10 m deep, so that the injected plug volume is 20 pL. The vertical channel is filled with sample containing 2 mM each of glycine (Gly) and arginine (Arg), both fluorescently labeled with fluorescein isothiocyanate (FITC). The horizontal channel contains MECC buffer [75-mM SDS, 10-mM Na HPO , and 6-mM Na B O (pH 9.2)]. Arrows indicate direction and relative magnitudes of the flows induced by application of voltages at the ends of these channels. The spot visible in the intersection in images C and D is due to reflection of laser light from an imperfection in the microchannel surface. (Reprinted with permission from [7]. Copyright 1996 American Chemical Society.) species according to their different mobilities in an applied electric field, is performed in liquid-filled capillaries. CE is particularly well suited to the chip format for a number of reasons. For one thing, the electric fields used to separate species electrophoretically also generate a bulk flow of liquid, known as electroosmosis [6]. Electroosmotic flow (EOF) is thus the mechanism by which liquids are moved from one end of the separation capillary to the other, obviating the need for mechanical pumps and valves. This makes this technique very amenable to miniaturization, as it is far simpler to make an electrical contact to a chip via a wire immersed in a reservoir than it is to make a robust connection to a pump. More important, however, is that all the basic fluidic manipulations that a chemist requires for microchip electrophoresis, or any other liquid handling for that matter, have been adapted to electrokinetic microfluidic chips. This is illustrated in Fig. 1, which shows the formation of a 20–pL injection plug containing two fluorescent species and the subsequent separation of the two analytes in just 160 ms [7]. Precise liquid pumping and handling may also be accomplished using applied pressure or centrifugal force. As an illustration, Fig. 2 shows the squeezing or “hydrodynamic focusing” of a fluorescent sample stream at a channel intersection using two buffer flows from side channels [8]. Pressures were applied at the ends of the inlet and side channels to generate liquid flows. The width of the resulting focused sample stream is determined by the ratio of pressures applied to the side channel and to the inlet. Widths as small as 50 nm were observed, ensuring fast diffusion of molecules in the side streams across the sample stream to achieve ultrafast s mixing. It is also clear that controlled s dilution may VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS Fig. 2. (a) Fluorescence microscope image of hydrodynamic focusing in an intersection of microchannels made in silicon (the channels are outlined with a dashed line). The side and outlet channels are 10 m wide, while the inlet channel terminates in a 2-m nozzle. All channels are 10 m deep. The sample contained 5-carboxyfluorescein, a fluorescent dye. w is the width of the channel; w is the width of the focused inlet stream. Inlet pressure is 5 psi; side pressure is 5.5 psi. (b) Images of the 3-D structure of the focused sample stream as a function of side pressure, obtained by confocal scanning microscopy. Inlet pressure is 5 psi. Side pressure of (a) is 2.5 psi; (b), 5.0 psi; (c), 5.5 psi; and (d), 6.0 psi. (Reprinted with permission from [8]. Copyright 1998 American Physical Society.) be carried out in this fashion. As this example proves, pressure-driven flow may also be effectively used to carry out the necessary liquid handling required for chemical applications, though it is somewhat more difficult to implement in conjunction with microfluidic devices. The use of capillary forces or well-defined surface tension gradients is also attracting more attention, as this is a passive means of moving liquids in small channels. One of the most evident trends in the microfluidics world is that of increasing complexity in the microchannel architectures being used. Since the majority of devices do not feature on-board valves, this requires very precise control in all branches of the networks, a very challenging aspect of this technology. Some novel valving approaches have been proposed, which may facilitate development of these systems. The true TAS or LOC, however, is still a long way off, for a number of reasons. First of all, the ability to work with real samples from start to finish in a microfluidic device, in a hands-off sort of way, is usually very difficult. This is because many “real” samples are inherently incompatible with small channels, due to the presence of large particles or wall-adsorbing molecular species that could lead to clogging. The other issue holding back the development of sample pre931 treatment on chips is the sheer variety of samples with which the chemist or biologist is confronted. There will be no one universal approach to solving this problem on microfluidic devices, just as there has been no universal solution in the conventional chemistry laboratory. Second, if one defines the LOC to be an entity that should be able to perform all chemical functions and detection in a monolithic device that fits in the palm of your hand (or smaller), then existing devices are generally still quite underdeveloped. This miniaturization will require increased integration of not only fluidic elements, but also electrical, optical, or other types of elements into microfluidic devices. The MEMS world has amply demonstrated the integration of mechanical and electrical functionality into small structures for diverse applications. The aim of this review is to examine more closely the role that MEMS technologies have played to date not only in the fabrication of microchannels in different substrate materials, but also in the integration of electrical function into microfluidic devices. II. PASSIVE MICROFLUIDIC ELEMENTS The most basic elements of a microfluidic device are the microchannels and microchambers themselves. These are passive fluidic elements, formed in the planar surface of the chip substrate, which serve only to physically confine liquids to nL- or pL-volume cavities. Interconnection of channels allows the realization of networks along which liquids can be transported from one location to another on a device surface. In this way, small volumes of solution may be introduced from one channel into another, and controlled interaction of reactants is made possible. Analytical chemists turned to microfabrication techniques to be able to design and construct the microchannel manifolds required to satisfy the very stringent volume demands of TAS. This technology, the foundation on which the MEMS field has been built, includes basic IC techniques, namely, film formation, doping, lithography, and etching, developed four decades ago for the microelectronics industry. In addition, special etching and bonding processes that permit the sculpting of 3-D microstructures with micrometer resolution have been and continue to be developed [9]–[12]. Micromachining technologies are primarily silicon-based, due both to the traditional role of this semiconductor in IC technology and its excellent mechanical properties [13]. Silicon is thus unique, as it makes the combination of mechanical and electrical function in single devices possible, providing the impetus for the enormous activity over the past almost three decades in the area of MEMS. In a parallel development, the high precision obtainable with micromachining processes has led to their application in the patterning of materials other than silicon. Thus, ceramics, plastics, quartz, and glass are gradually becoming accepted complementary materials to silicon, widening the potential range of applications of microfabricated components and systems. This section considers some examples of micromachining methods that have been used for the formation of micrometer-dimensioned fluidic channels in various substrate materials. 932 A. Microchannels in Silicon Silicon micromachining can be divided into two categories, depending on what region of the wafer is being worked. Bulk micromachining refers to those processes which lead to structures in the single-crystal wafer, whereas surface micromachining results in structures located on the wafer surface. Bulk micromachining methods fall into four categories, namely wet isotropic, wet anisotropic, dry isotropic, and dry anisotropic [11], [12]. Isotropic methods are those characterized by etch rates which are more or less equal in all directions. Anisotropic methods, on the other hand, have etch rates which are significantly faster in a particular direction or directions. Wet etching involves dipping the silicon wafer into a solution containing the etchant. The etchant may etch certain crystal planes faster than others (e.g., KOH, tetramethylammonium hydroxide). In this case, the side walls of the resulting structure are defined by the slowest etching crystal planes. For wafers of 100 orientation, for example, channel geometries are trapezoidal, with side walls corresponding to the 111 planes. For 110 wafers, the different orientation of the 111 planes makes deep, rectangular channels possible. The isotropic wet etching solution most commonly used is known as HNA, and contains hydrofluoric acid (HF), HNO , and acetic acid. The resulting channels have rounded side walls, and are wider than they are deep, since etch rates are equal for all crystal planes. A discussion of the further intricacies of silicon micromachining using wet etching techniques is beyond the scope of this review. Ample detailed examples are given in [9]–[12]. Reactive-ion etching (RIE) processes are dry, relying on external RF power applied to a pair of plates to accelerate stray electrons in the gas between them. The kinetic energy of the electrons is augmented in this way to levels that allow chemical bonds in the reactant gases to be broken, leading to the formation of reactive ions and radicals. The wafer to be etched is placed between the plates to be exposed to this reactive plasma. Depending on the conditions, etching can be achieved chemically, by reaction of fluorine free radicals with the surface, for example, or physically, through bombardment of the surface with high-energy ions [11], [12]. These processes can be fully or partially isotropic or anisotropic. One type of RIE, termed deep reactive-ion etching (DRIE), has gained in popularity in recent years. DRIE is a very high-aspect-ratio etching method for silicon, with aspect ratios of up to 30:1 (height:width) possible. This is because the plasma is highly dense. In addition, the reactive ions are accelerated by applying a bias voltage to the wafer, so that they bombard the wafer surface vertically. As a result, very thin, tall structures and trenches can be formed with this technique, at typical etch rates of 2–3 m/min [14]–[16]. Microfluidic channels in silicon made by wet or dry etching processes are generally sealed using a glass cover chip, since this facilitates visual interrogation of fluids within the device. Bonding in this case is accomplished by field-assisted or anodic bonding [11], [12]. This involves PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 applying a voltage of between 200 and 1000 V over the silicon/glass assembly, with the cathode (negative electrode) on the glass side. The components to be bonded are heated at the same time to a temperature between 180 C and 500 C. Under these conditions, the glass becomes more conductive, and Na ions in the glass migrate more rapidly toward the cathode (that is, away from the glass–silicon interface). This results in a large electric field at this interface, which pulls the two surfaces together. Covalent bonds between the silicon and glass are formed due to the elevated temperature and applied electric field, although the mechanism is still not so clearly understood. Pyrex 7740, a borosilicate glass, has been the material of choice for anodic bonding. This is because its thermal expansion coefficient nearly equals that of silicon. The use of glues or other adhesive layers to seal devices is not so common, as these approaches are generally not so clean and can result in contamination or even clogging of channels. It is not surprising that some of the first microfluidic channels were made in silicon [17]–[19], given the role that silicon plays in MEMS. (In fact, the 2-in silicon gas chromatograph developed by Terry et al. [17] predated the introduction of the TAS concept by 11 years.) In [18], standard etch techniques were used to form channels in 100 -oriented monocrystalline silicon, involving anisotropic etching using either KOH or ethylenediamine/pyrocatechol. However, the use of silicon is generally incompatible with electroosmotic pumping (EOP), which quickly became the method of choice for liquid transport in microfluidic devices in the 1990s (see preceding text). Typical linear flowrates fall in the range of micrometers per second to several millimeters per second, with the required electric fields usually quite high, corresponding to hundreds of volts per cm. Channel lengths on the order of mm to cm thus necessitate applied voltages which often exceed 1000 V. The substrate used must therefore have excellent electrical insulating qualities. Since silicon itself is a semiconductor, its usage is limited by the quality of the insulating layers of silicon oxide and/or nitride that can be deposited on the surface. Generally speaking, even good quality, pinhole-free insulating layers with thicknesses up to 1 m suffer dielectric breakdown at applied voltages of 720 V or less [18]. Silicon has thus generally not been applied for electroosmotically controlled microflow manifolds. There are a few notable exceptions in the literature, however, where silicon-based devices were used successfully in conjunction with low field strengths ( 100 V/cm) for electrokinetic separations. These include demonstrations of free-flow electrophoresis of amino acids [20] and proteins [21] [see Fig. 3(a) and 3(b)], and DNA analysis by synchronized cyclic capillary electrophoresis [22] and gel electrophoresis [23], [24]. Recently, Petersen et al. reported microchip electrophoretic separation of caffeine, paracetamol, ketoprofen, and ascorbic acid in a silicon channel sealed with glass, using an electric field strength of 550 V/cm over a channel 3.5 cm long [25]. In this case, the silicon was coated with a waveguiding layer consisting of 15 m of thermal oxide, followed by 6 m of silicon VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS oxynitride, and finally 4 m of undoped silica. Channels (12 m deep) were etched into this layer by RIE, leaving a 13- m-thick thermal oxide layer between the channel and the silicon substrate. Pressure-driven flow applications have also been implemented in silicon chips, notably liquid chromatography (LC) [see Fig. 3(c)–3(e)], [26]–[31], optical detection cells [32], [33], microreactors [34]–[37], and miniaturized flow injection analysis ( FIA) [38], [39] (see also Section III-B3). Examples of gas chromatography (GC) chips may also be found in the literature [17], [40]–[43]. When high-aspect 1 channels in silicon are desired, ratio depth:width DRIE is the method of choice. Daridon et al. used DRIE to fabricate a microflow system for ammonia analysis in glass/silicon/glass devices [44]. Deep, narrow channels 30 m wide and 220 m deep made up the first part of the silicon-based network, in which reagents were added to the sample zone. This was done in a side-on fashion, yielding two 15- m-wide curtains of solution running side-by-side down the channel. Diffusion distances of sample and reagent molecules were reduced in this way, allowing complete mixing of solutions in less than 1 s by diffusion alone. To be able to perform absorbance detection of the chemically converted ammonia compound, a small-volume, long-pathlength optical cuvette was required. A small-diameter hole was etched by DRIE through the silicon wafer to form this element, which as a result had an optical pathlength equivalent to the wafer thickness. A recent publication by Juncker et al. describes a microfluidic capillary system formed by DRIE, designed to autonomously transport liquids from one end to the other by capillary forces [45]. The principle was demonstrated using a heterogeneous immunoassay for a cardiac marker, which could be performed within 25 min. DRIE has also been used to fabricate surface-area enhancing structures in silicon microchannels for extraction and catalyzed reactions, in the form of arrays of staggered, narrow silicon columns (see also Section III-B2). These replace packed-bed designs, in which a channel is packed with particulate material. In one example, the columns were used to extract DNA from solution in a sample pretreatment step [46]. Multiphase microreactor devices have also been based on this principle [34]. Of course, arrays of small holes through a wafer are also possible, as Thiébaud et al. demonstrated in a device made for electrophysiological measurements of slices of rat brain [47]. Diffusion of nutrient medium from a reservoir under the chip to the cells on top of the chip was assured in this way. B. Microchannels in Glass and Quartz Glass is a much better material, electrically speaking, for microfluidic devices utilizing electrokinetic sample transport. This, combined with the fact that it is optically transparent, has made it one of the main materials used in microfluidics today. Pyrex 7740, a borosilicate glass found in many cleanrooms, has been popular for glass microfluidic devices. From a fabrication point of view, however, there has been no limitation noted so far as to the type of glass 933 Fig. 3. (a) Free-flow electrophoresis device made in silicon and sealed anodically with glass. The photograph was taken through the glass cover. 1 marks the separation bed (50 mm long, 10 mm wide, 50 m deep); 2, the array of 125 inlet channels; 3, the electrode chambers (50 mm long, 2 mm wide, 50 m deep); 4, the arrays of 2500 channels separating electrode chambers from separation bed; 5, the array of 125 outlet channels; 6, the sample inlet; 7, the buffer inlets; 8, the buffer outlet; 9, common waste. (b) Scanning electron micrograph (SEM) of a corner of the separation bed where both inlet channels (left) and 2500-channel array (right) enter it. The inlet channels are 70 m wide (across the top) and 50 m deep; the channels to the electrode chamber are 12 m wide (across the top), 10 m deep, and 1 mm long. (c) Assembled silicon/glass chip for small-volume liquid chromatography. The separation channel (long horizontal channel) is 20 mm long, 300 m wide, and 100 m deep (490 nL); the injector is the channel element on the right; the detector cell (2.3 nL, 1 mm long, designed for absorbance detection) is at the end of the separation channel on the left. (d) SEM showing the end of the separation column and entry into the detector cell. Two arrays of 58 fine channels serve as a frit to retain particles in the separation channel. Note that the dead volume between the end of the column and the cell is about 140 pL, so that this dead volume is minimized. (e) SEM of a detail of the frit. These channels were 3.2 m wide, 1.4 m deep, 1.6 m apart, and 19 m long (volume of each channel: 59 fL). It was possible to retain particles larger than 3 m in the column with this barrier. 934 PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 4. (a) Schematic diagram of the process flow used for glass micromachining in the authors’ laboratory. This process differs from others in that a polysilicon etch mask is used, rather than a metal mask. (b) SEM of a double-T intersection etched in glass, used to perform volume-defined injection in microchip electrophoresis (see Fig. 1). Channels are about 50 m wide across the top and 20 m deep. The intersection is 200 m long, allowing the definition and injection of 165-pL sample plugs. (c) SEM showing a channel cross section, again about 20 m deep and 50 m wide at its widest point. The channel was thermally sealed with a second glass wafer. Note that there is no visible bonding interface, indicating that the wafers have been hermetically sealed. (d) View of one full FIA structure and partial views of two others. These devices consisted of three layers of glass, with interconnecting vias and holes made by spark-assisted etching. Channels were 200 m wide and 30 m deep. The networks are relatively complex, allowing reagents to be added to a sample stream, and sufficient time for reaction before passage through an integrated optical cuvette. (Photo: A. Daridon, IMT, University of Neuchâtel, Neuchâtel, Switzerland). that can be used, as long as it is available in the form of smooth, planar substrates. Microfluidic devices made in fused silica (quartz) have also been reported. This material is attractive because it is UV-transparent, a characteristic which makes it superior to glass. Photolithographic processes similar to those used for silicon can be employed for the patterning and subsequent transfer of channels into planar glass and quartz wafer surfaces. The glass micromachining method established in our laboratory is shown in Fig. 4(a). This is based on a process first VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS developed by Grétillat et al. [48] and has become standard in our work [49]–[51]. Channels are etched into a 10-cm Pyrex 7740 wafer using HF, using a 200- or 400-nm-thick layer of polysilicon as a masking layer over areas where etching is not desired. A typical process flow would proceed as follows. After deposition of the polysilicon by low-pressure chemical vapor deposition (LPCVD), wafers are dehydrated at 200 C for 30 min and exposed to hexamethyldisilazane (HMDS) vapor for 15 min to improve photoresist adhesion. A 1.8- m-thin layer of AZ1518 (Clariant, Muttenz, 935 Switzerland) positive photoresist is then spin-coated onto the wafer at 4000 r/min for 40 s and prebaked on a hotplate for 1 min at 100 C. The resist layer is then patterned photolithographically by illumination through an optical mask. Laser-plotted transparency films with a dot size of 7 m (DIP SA Repro, Lausanne, Switzerland), mounted on blank 5-in glass plates, serve as photolithography masks for rapid prototyping applications. When higher resolution or fine structuring are required, Cr masks with 1- to 2- m resolution are used. In the case of transparency films, the exposure dose is increased to 60 mJ/cm , a value which is 10% above the recommended value for the resist, to compensate for the reduced transparency of the laser-plotted films. Wafers are then developed for 1 min in AZ351 developer (Clariant), which has been diluted 1:4 with deionized, 18-M (DI-18M) water. This is followed by a rinse in DI water and postbake at 125 C for 30 min. RIE is used to transfer the pattern into the polysilicon layer. After photoresist removal with acetone, the channel structures are etched into the glass using 49% HF. Finally, the polysilicon layer is removed by dipping the wafer for 5 min in 40% KOH solution at 60 C. The channels are then thermally sealed with glass cover-plates containing holes to access the microfluidic network. Once these holes have been aligned with the ends of the corresponding channels in the lower wafer, the two-wafer assembly is placed in an oven for thermal bonding at 650 C. After an initial temperature ramp, the wafers are held at 650 C for a couple of hours. During this time, the wafers are fused together. A slow cooling process is then initiated to prevent thermal stress and the resulting cracking or breaking of wafers. A thorough cleaning procedure to remove both organic and inorganic residues (e.g., micrometer-sized particles from the hole-drilling process) from the wafers is critical for achieving good, void-free bonding. Fig. 4(b) shows a SEM of a 200- m-long double-T junction made in glass, so called because each of the side channels forms a T-shaped intersection with the horizontal channel. An example of the hermetic seal between two wafers that is typically achieved with thermal bonding is given in Fig. 4(c). Note that there is no visible interface between the wafer surfaces. Glass etching with HF is isotropic in nature. The resulting channels have rounded side walls, and widths which are twice the channel depth plus the width of the initial line on the etch mask [see Fig. 4(b) and 4(c)]. Channel depths are determined by etch times. Typical dimensions are widths and depths of tens of m, with channel lengths on the order of a few cm. The etchants used in glass microfabrication may vary in composition [52], [53], with mixtures of HF and HNO [54], NH F-buffered HF [55], or concentrated [56] or dilute HF baths being used. Metal etch masks composed of a thin layer of Cr covered by Au are most common [54], [56]. The Cr layer acts as an adhesion layer to better coat the Au onto the glass surface. Polysilicon [48] and amorphous silicon [56] may also be used as etch mask layers, as described previously. For very shallow structures, photoresist alone may be adequate to protect the glass surface, although it quickly deteriorates in the more aggressive etch solutions 936 [55], [56]. Quartz devices have been fabricated using similar techniques as those described previously, though the thermal bonding must be carried out at higher temperatures, around 1000 C or so [57]–[59]. Alternative glass-to-glass bonding methods are available. For instance, anodic bonding of glass to glass via an intermediate, 160-nm layer of silicon nitride at a temperature of 400 C and a voltage of 100 V has been reported [60]. Low-temperature glass-to-glass bonding is possible, using a 1% HF solution, wicked in between the wafers, and pressure (1 MPa) at room temperature [61]. Another low-temperature approach involves a spin-on layer of sodium silicate solution as adhesive layer [62], [63]. Spontaneous bonding of thoroughly cleaned and hydroxylated wafers at room temperature has also been described for both quartz and glass [64]. Generally speaking, channels are formed in one layer and sealed by a second. It is also possible to achieve symmetrical channel cross sections by mating two surfaces containing channels [51], [65]. The inclusion of special alignment marks on the wafers to be bonded can yield an alignment precision of 5 m, dictated only by the optical resolution of the mask aligner used [65]. Three-layer glass devices for FIA, incorporating through-holes from one layer to the next, and a 200- m-diameter optical cuvette formed through the middle wafer, have also been reported [51]. These were made and bonded in the same way as shown in Fig. 4(a). The challenge in this case was the formation of holes small enough not to cause dispersion of the sample zone as it passed from one level to the next. Particularly critical in this regard was the fabrication of the optical cuvette. Spark-assisted etching, also known as electrical discharge machining, proved to be a valuable tool for making holes as small as 200 m in diameter through the 525- m glass wafers. Fig. 4(d) shows several bonded devices still in wafer format, before dicing (cutting) of the individual chips. Multilayer glass devices with 3-D microchannel networks for chemical synthesis applications have also been reported by Kikutani et al. [66], [67]. The “pile-up” glass microreactor described in [67] contained ten layers of microchannel circuits, which were thermally bonded all at once in much the same way as described previously. RIE of quartz has been employed to produce a liquid chromatographic chip with an array of 10- m-high, 5- m 5- m rectangular columns to act as support for the stationary phase in the 4.5-cm-long, 150- m-wide separation channel [68]–[70]. Fig. 5 is a SEM of this type of device, taken at the entrance to the separation column. It clearly shows how the inlet channel is bifurcated several times to ensure even solution distribution over the array of diamond-shaped pillars at the top of the photo. Chromatographic performance was good [68], and peptides stemming from the tryptic digest of ovalbumin could be separated [70]. DRIE of Pyrex has recently been well characterized, with a 20- m-thick nickel mask being used to achieve good verticality and aspect ratios greater than 10 [71]. Ceriotti et al. also used a nickel mask to fabricate 50- m-deep rectangular channels in quartz by inductively coupled plasma (ICP)-RIE, using the process flow shown PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 5. SEM of structure designed for microchip chromatography, showing channel layout at the beginning of the column. All features have been etched by RIE to a depth of 10 m. (Reprinted in part with permission from [68]. Copyright 1998 American Chemical Society). in Fig. 6(a) [72]. Detection of fluorescently labeled amino acids separated electrophoretically in a DRIE quartz channel much like that in Fig. 6(b), sealed with an elastomer chip, was demonstrated [73]. Photostructurable glasses such as FOTURAN (Schott) are also interesting materials for TAS, as they allow for microstructures having aspect ratios of 20:1, and the possibility of transformation to a glass ceramic upon heating [74]. These materials are inherently photosensitive, and hence do not require a photoresist layer for patterning. Exposure to UV results in the formation of microcrystallites, which can subsequently be removed by etching in HF. Tips for atomic force microscopy have been fabricated in this material [75]. Channels having a minimum depth of 25 m are also possible [74]. Recently, Becker et al. reported the fabrication of a microchip electrophoresis device in a new type of photostructurable glass [76]. A separation of fluorescently labeled amino acids was demonstrated in channels which were 500 m deep and 200 m wide. C. Miniaturized Transparent Insulating Channels ( TICs) There are a number of alternative approaches for the fabrication of insulated microchannels which still use silicon. One of these involves the formation of channels with extremely thin walls ( 1 m) in silicon nitride or oxide, using a thick ground plate to support these structures [77]–[80]. The process used to produce the channels is shown in Fig. 7(a). To start, channels are patterned and etched in silicon, using either wet or dry, anisotropic or isotropic methods. The structure on the right in Fig. 7(a) has a geometry which is characteristic for an isotropic process. The middle and left channels, on the other hand, were formed with anistropic processes. (Note that the combination of all these channel geometries in one Si wafer is unrealistic. The geometries are given to indicate that there is some flexibility in the choice of profile geometry available when using silicon. This is in contrast to glass, for which anisotropic processes are not yet well established.) VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS Fig. 6. (a) Process flow for ICP-RIE of 50-m-deep rectangular channels in quartz. (b) SEM showing the cross-sectional profile of a dry-etched channel in quartz. Width across the top: 50 m. Depth: about 50 m. Conditions for etching had not been optimized in this case. It was possible in later experiments to achieve good wall verticality and smooth walls [72]. Once formed, the masking material used to form the channels is removed from the silicon surface, and the channels are coated with an insulating layer. The silicon wafer is then anodically bonded via the insulating layer to a Pyrex wafer. After bonding, the silicon is etched away from the 937 backside using an isotropic etchant, leaving the freestanding, thin-walled microchannels. An early publication described the deposition first of a 50-nm-thick layer of silicon nitride, followed by an oxide layer of up to 600 nm [78], to facilitate bonding to the Pyrex. Later work used only silicon nitride layers of 360 nm [79] or 390 nm [80] to form the channels. In any case, these channels are electrically insulating, optically transparent, and demonstrate very efficient heat dissipation, making them ideal candidates for electrokinetically driven microfluidic applications. Fig. 7(b) and (c) shows SEMs of TICs molded in an isotropically etched Si channel, and a DRIE channel, respectively. As is evident in Fig. 7(c), TICs do have the disadvantage that they are fragile. This may be overcome by covering the channels with a glue or other polymer layer [77]–[79]. This type of structure has been used for microchip electrophoresis of small cations in conjunction with conductivity detection [79], and for the demonstration of field-effect flow control in microfabricated structures [80]. D. Microchannels by Replication in Poly(Dimethylsiloxane) (PDMS) Poly(dimethylsiloxane) (PDMS) is a polymer which is becoming increasingly popular for microfluidic applications, because structures made in this material are inexpensive, easy to handle, and rapidly fabricated by replica molding under noncleanroom conditions. The special properties of this elastomer, and its use in soft lithography (replication) and micro contact printing (surface patterning by deposition of molecules using stamping techniques) to obtain micrometer-sized structures, are described in several reviews [81]–[83]. The use of microfluidic devices replicated in silicone rubber was reported as early as 1989 by Masuda et al. for a biological application involving cell fusion [84]. Fig. 8(a) is a schematic diagram of a typical casting procedure for replication of microchannels in PDMS. Fabrication of microchannels involves casting a solution of the PDMS prepolymer onto a master whose surface has been structured to yield a topography or surface relief of some kind. When cured, PDMS faithfully replicates, with nm resolution, the surfaces with which it has been in contact. Microchannels are thus easily formed in PDMS if the corresponding master has a raised network of ridges to serve as microfluidic network mold. PDMS has a number of intrinsic properties which make it interesting for microfluidic applications. It is, for example, optically transparent in the UV and visible, from 230 to 700 nm [72], [85]. The gas permeability of PDMS means that bubbles created inside channels by electrolysis of water or from other sources may be dissipated through the material [86]. Gases can of course also penetrate the PDMS to enter microchannel structures, making it a suitable material for applications using live cells [83], [85]. Structures with flat surfaces made in this material seal reversibly with glass, silicon, and PDMS. Alternatively, irreversible bonding can be accomplished by treatment of the surfaces to be bonded with an oxygen plasma [87], [88]. A variety of masters have been used for replication of microchannels in PDMS. Anisotropic wet etching of 100 938 Fig. 7. (a) Basic process used for the fabrication of TICs. Cross-sectional views of TICs made using (b) an isotropically wet-etched silicon mold and (c) a DRIE silicon mold. [(b) Reprinted in part with permission from [78]. Copyright 1998 Elsevier Science Ltd.; (c) Reprinted in part with permission from [79]. Copyright 2001 Wiley-VCH Verlag GmbH]. silicon has been used to produce masters for plastic channel replication [89]–[91], but the resulting channels had trapePROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 8. (a) Schematic diagram of the steps involved in replication of microchannels in PDMS. (b) A three-layer PDMS device for passive mixing by lamination of solution streams. (Reprinted with permission from [85]. Copyright 2000 IEEE) (c) A 3-D PDMS network for a cell culture application. (Reprinted with permission from [100]. Copyright 2002 IEEE.) zoidal cross sections with aspect ratios 1. There is little freedom in channel network design, since possible layout geometries are dictated by crystalline orientation. To retain VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS the freedom of channel layout afforded by isotropic etching of glass, a nickel master can be prepared directly from a structured glass wafer by growing a relatively thick (3-mm) 939 nickel layer onto it [92], [93]. Alternatively, resist reliefs on silicon wafers made using the negative photoresist, EPON SU-8, can be used as masters. This approach is an attractive choice in terms of fabrication time and layout flexibility [85], [87], [94], [95]. Moreover, features 5 to 1200 m high are possible with aspect (height-to-width) ratios approaching 20 [96]–[98]. To date, 1 : 1 aspect-ratio structures [negative channel structures (i.e., ridges) with equal height and width] were used for PDMS molding, and they can be used indefinitely [83]. Masters realized by DRIE have the same advantage as those made in photoresist, namely, freedom to choose channel layout [88], [99]. Curved relief patterns with vertical walls and high aspect ratios are thus possible. 3-D PDMS structures have been reported by several groups. In one case, many thin ( 100 m thick) patterned PDMS layers were stacked to form 3-D channel paths [85]. Each layer contained channels and openings, molded against an SU-8 master using a sandwich-type molding configuration. Fig. 8(b) shows a photograph of an assembled 3-D passive micromixer made in this way. Anderson et al. used a similar approach yielding thin layers with through-holes and microstructuring on both sides, which were sealed with thicker PDMS slabs [95]. A microfluidic device for the creation of a sheath flow of buffer to hydrodynamically confine a sample stream close to a sensor surface was realized in PDMS by Hofmann et al. [99]. This approach required the ability to introduce a buffer flow onto the sample stream from above to compress it, a criterion which this 3-D device fulfilled well. Fig. 8(c) shows a close-up SEM image of a 3-D microchannel network formed in PDMS for culturing of human cancerous liver cells [100]. The 3-D approach taken here could prove useful for more sophisticated tissue engineering applications. E. Microchannels by Replication in Other Polymers Masters made in silicon can be used to imprint or hotemboss channels in hard plastic materials like poly(methyl methacrylate) (PMMA) at temperatures close to the softening point of the plastic or, alternatively, at elevated pressures [101], [102]. Martynova et al. used the former approach to make plastic microchannels [103], whereas Xu et al. were able to do much the same but at room temperature and high applied pressures [104]. McCormick et al. used a micromachined silicon wafer to fabricate a metal stamp by electroplating Ni onto the silicon, and using this electroform to create a second electroform [105]. The second form is thus a replica of the original silicon master. These researchers used forms made using this two-step electroplating process to both imprint and injection-mold channels into plastic. Other reports of injection molding for microfluidic chips may be found in [106] and [107]. Excellent discussions generally about the fabrication of polymer microfluidic devices are given by Becker and Gärtner in [101], and again by Becker and Locascio in [102]. A more recent report describes the 3-D replication of structures in UV-curable acrylates using a finely patterned silicon master, produced by a series of dry etching processes [108]. 940 Though this technique has not been applied to microfluidic devices yet, it offers a route to nanostructuring, and hence could be an attractive tool for the microfluidics community. F. Other Techniques for Fabrication of Polymer Microfluidic Devices Laser ablation was first introduced by Roberts et al. for the fabrication of polymer microchannels [109]. This technique involves directing laser pulses at the plastic surface in defined regions, which causes degradation of the plastic at those spots as a consequence of a combination of photochemical and photothermal degradation processes. A UV excimer laser was used to produce channels in a variety of substrates, which were then subsequently sealed using a low-cost plastic lamination technique. EOF in these channels was characterized, and shown to be a function of ablation conditions [109]. Henry et al. studied this aspect of laser-ablated channels in more depth, using channels made in poly(ethylene terephthalate glycol) [110]. Johnson et al. used laser ablation techniques to modify the surfaces of channels already hot-embossed into various polymer substrates [111], [112]. In one case, the surface structures were designed to reduce broadening of sample plugs as they passed around corners [111], whereas in the other, the purpose of the modification was to create a rapid mixer [112]. CO -laser machining has also been used to rapidly write structures in PMMA [113], and has proven to be an effective tool for rapid protoyping of devices for diagnostic applications [114]. A simple method based on plasma etching was recently presented for producing both channels and electrodes in polymer, starting with three-layer foil composed of 50 m of polyimide sandwiched between two 5- m layers of copper [115]. Photoresist is used to pattern the copper layers, after which the exposed copper is etched away chemically using an aqueous solution of CuCl –H O . The foil is then placed in a reactive plasma chamber to transfer the desired pattern into the polyimide. After the plasma etch, the copper is either removed or further patterned to produce conductive pads, which can be coated with Au by electroplating. The process is shown in Fig. 9(a), along with some photos of the finished devices in Fig. 9(b). Implementation of such devices for microchemical analysis was demonstrated with voltammetric detection in a 60-nL microchannel. III. INTEGRATION OF ELECTRICAL AND ELECTROCHEMICAL FUNCTION INTO MICROFLUIDIC DEVICES One of the unique possibilities offered by MEMS technology is the direct integration into microfluidic devices of elements not having a fluidic function per se. The fact that these technologies were developed for the microelectronics industry in the first place makes their use for fabrication of features with electrical function rather obvious. The ability to deposit and structure thin metal or other conductive films on wafer or channel surfaces is thus being exploited in microfluidics for integrating electrochemical detection (ECD), resistive heating, and pumping elements into devices. This PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 9. (a) Process flow for plasma etching microchannels in polyimide foil. A) Channels are formed first, followed by a second patterning/etching step to form access holes. It is during this step that channels may be etched down to contact the underlying Cu layer. B) This copper layer may be further structured to yield electrodes and electrical contact pads. (b) Photographs of a four-electrode device made in polyimide foil. (Reprinted with permission from [115]. Copyright 2002 Royal Society of Chemistry.) section will consider examples which have an electrical element somewhere on or in the chip for performing one or more of these functions. A. Electrochemical Detection in Microfluidic Chips ECD, which includes amperometric, potentiometric, and conductometric detection, is the subject of an increasing number of research papers looking at its integration into microfluidic chips [116], [117]. This is because it scales better upon miniaturization than absorbance or fluorescence detection, since output signal is dependent on electrode surface area rather than on available detection volume [118]. As a result, limits of detection (in concentration terms) do not degrade as rapidly for electrochemical detection as VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS they would for optical techniques [119]. Electrochemical techniques are generally attractive for this reason, though they will never compete with fluorescence in terms of sensitivity. The use of micromachining technologies to integrate electrochemical sensing elements into microfluidic devices brings some unique advantages not possible in conventional systems. For instance, fabrication of electrodes directly in microfluidic channels means that these are aligned a priori, eliminating the need for often-difficult alignment procedures. Moreover, devices incorporating detection electrodes do not require a large amount of peripheral equipment for acquisition of detector signal. This makes the development of portable instrumentation based on microfluidic devices with ECD a realistic possibility. There have been a number of approaches reported in the literature for integration of electrodes into chips. In the simplest case, grooves or channels whose purpose it is to simply hold metal or carbon electrodes in place are formed in one of the surfaces of the device, and sealed with the second layer. Electrodes are inserted into these channels before assembly of the devices. This approach has been reported for chips replicated in PDMS and utilizing 30- m carbon fiber electrodes [120]–[122]. Pt wires 127 m in diameter were inserted in 130- m guide channels for contact conductivity detection in chips which had been hot-embossed in PMMA [123], [124]. In [125], the end of an electrophoresis separation channel in glass was widened by etching in HF, to facilitate insertion of Pt, Au, or Cu wires for amperometric detection. Alternatively, electrode channels were formed in PDMS and filled with carbon paste [126], or laser-ablated in polyethylene terephthalate (PET) and filled with carbon ink [127]–[130]. More sophisticated means of integrating electrodes for ECD involve deposition and patterning of metal layers according to established micromachining techniques. The technique used will depend on the type of metal chosen. In the simplest case, glass devices for microchip electrophoresis were modified by cutting off the end of the chip perpendicularly through the separation channel to sever the waste reservoir from the chip. In this way, the outlet of the separation channel was directly at the flat end of the chip, rather than in a solution reservoir. Gold electrodes were then formed around this channel outlet [131], [132]. In one case, a thin gold film was sputtered around the outlet to a thickness of 200 nm. Electrical contact was made using a lead glued with silver epoxy to the gold layer. The gold electrode plus lead was then coated with an electrically insulating ink, leaving a gold disk-shaped area of 78 mm exposed for use in amperometric detection [131]. In the other example, electroless deposition of gold was carried out on the end of the chip, using formaldehyde as a chemical reducing agent to plate gold from solution onto the glass surface [132]. Again, the actual active electrode surface was defined when the wire contact and gold surface were covered with an insulating layer to leave only a small region bare. In the previous examples, patterning using a photolithographic process was not possible, since the electrodes were located on the edge of the devices, rather than on a planar 941 surface. More precise structuring of electrodes results when photolithographic patterning is used. The simplest procedure involves deposition of a uniform metal layer onto a planar surface, followed by standard photolithography and transfer of the electrode geometry in the metal layer. Generally, a thin layer of one metal is first deposited to enhance the adhesion of a second, thicker metal layer to be used as electrode. Typical adhesion layers for different metals include: 1) Cr (for Au); 2) Ta or Ti (for Pt); and 3) Ti (for Cu). This was the approach followed by Martin et al. [133], who coated soda-lime glass squares sequentially with chromium (5 nm) and gold ( 200 nm) using an evaporation technique. Chromium was used as an adhesion layer for the gold. The Cr–Au layer was then patterned using a positive photoresist, and the underlying Cr–Au layers removed in appropriate etchant solutions in areas where the resist had been stripped during development. The result was an array of four parallel electrodes, 40 m wide and with a pitch of 80 m. Because these electrodes protrude slightly from the surface, the wafer surface is no longer completely flat. Hence, hermetically sealing this surface by thermal or anodic bonding to a second chip containing channels would not be possible if the second substrate were glass or silicon. Martin et al. used a PDMS substrate instead, since this material conforms well to a surface bearing a topography [133]. The PDMS and glass chips were aligned in such a way that the electrodes were positioned perpendicularly to the separation channel, just beyond the end of this channel. A similar procedure was used by Liu et al. to produce a single-gold-electrode PDMS/glass device [134]. In a microreactor application, interdigitated arrays of carbon microelectrodes were integrated into a silicon-based device containing two flow chambers. The upstream chamber was packed with enzyme-modified porous glass beads for glucose oxidation. The second chamber contained the electrode arrays for electrochemiluminescence (ECL) detection of the hydrogen peroxide produced, each consisting of 125 pairs of 1-mm-long, 3.2- m-wide electrodes, with an electrode spacing of 0.8 m. To obtain these detectors, the electrodes were defined on a sputtered thin film of carbon with a standard photolithographic procedure, followed by structuring of the carbon layer using an O plasma [135], [136]. The flow chambers were defined after electrode fabrication by photolithography in a thick layer (300 m) of Epon-SU 8 [135]. Woolley et al. presented a glass CE device with integrated Pt electrodes for indirect ECD of DNA [137]. As the SEM image of this device in Fig. 10 shows, photolithography makes possible the positioning of the 10- m-wide, dual-lead, platinum working electrode just 30 m beyond the end of the separation channel in the large reservoir. This is important, as this detection electrode finds itself just outside the high electric field used for separation, and is effectively decoupled from this field as a result. In this case, 20 nm of Ti (adhesion layer) and 260 nm of Pt were sequentially sputtered onto the substrate. Thick photoresist (ca. 10 m) was then coated onto the wafer and patterned, and the exposed Pt removed in hot aqua regia (personal communication with R. A. Mathies, University of California, Berkeley). 942 An alternative way of structuring electrodes in microfluidic devices uses a microfabrication procedure known as liftoff. This approach is more involved than that described previously, requiring several steps. However, it remains popular, particularly when making electrodes in platinum, a metal which does not etch easily (see the previous text). The liftoff process is described in more detail in Hierlemann et al. (in this issue). Liftoff processes have been used to form microelectrode arrays in microfluidic devices in gold for generation of ECL [138], [139], and platinum, for amperometric [135], [138] and conductivity [140] detection. Three images of a microdevice incorporating two arrays of Pt microelectrodes for glucose detection are shown in Fig. 11 [138]. A microchip electrophoresis device in glass incorporating a single platinum electrode for wireless ECL detection has also been reported [141]. As mentioned previously, electrodes formed on top of planar surfaces make good sealing with other planar substrates in hard materials difficult. A number of researchers have developed a variation of liftoff processing which circumvents this problem. The procedure starts much the same, with a layer of photoresist being spin-coated onto a wafer surface and electrode geometries defined. However, at this point, shallow cavities ( 500 nm) are formed first in the regions where electrodes are to be deposited. Only then are the metal layers deposited onto the wafer, with thicknesses that just fill the cavities in the substrate. The resist is then removed as before by dissolution in an organic solvent, with liftoff of the metal occurring at the same time. In this way, the chip surface containing the electrodes retains its planarity, and may be bonded to another silicon or glass substrate. This approach was taken to form 160-nm-thick Pt electrodes in a silicon chip for use in coulometric nanotitration in stopped-flow [142] and continuous-flow systems [143]. Pt electrodes were made similarly in 200-nm recesses in glass for conductivity detection [79], and 300-nm recesses in glass for amperometric detection in conjunction with microchip electrophoresis [144]. The device in Fig. 12 was somewhat different, in that 170-nm-thick Pt–Ta electrodes were formed in 12- m-deep cavities [145]. The application in this case was contactless conductivity detection for microchip CE. Good capacitive coupling into the detection volume over a thin glass wall was thus required, while at the same time ensuring complete isolation of the electrodes from the solution in the analysis channel. Fig. 12 shows a photograph of the finished device, focusing on the detector region. B. Integrated Temperature Control There are a number of ways to generate heat in MEMS devices, which have been developed for a variety of applications (see, e.g., Kovacs [11]). In microfluidics, the most commonly implemented approach involves integration of a simple resistor somewhere on the device. Passage of current through a resistive element results in the generation of Joule , where is electrical resisheat, , according to tance and is current. Microfluidic devices are attractive for PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 10. Microchip electrophoresis device with integrated Pt counter and working electrodes for amperometric detection. (A) Overall layout of the device. (B) Detailed schematic diagram of the arrangement of electrodes at the end of the separation channel. A small Ag/AgCl reference electrode was immersed in the detection reservoir to complete the three-electrode setup. (C) Close-up SEM image of the photolithographically patterned Pt working electrode positioned just after the end of the separation channel. (Reprinted with permission from [137]. Copyright 1998 American Chemical Society.) performing chemical reactions or processes requiring temperature control, since the high heat transfer rates in these systems lead to easier implementation of uniform temperature conditions [146]. This section will examine microfluidic devices incorporating resistive heating in one form or another for both chemical and biochemical applications. 1) Biochemical Applications: There have been many publications describing the application of MEMS technologies to the development of devices for DNA analysis. A significant number have focused on the integration of the polymerase chain reaction (PCR), used to increase the amount of DNA from a sample for analysis, into micromachined chambers. Microchip PCR provides an attractive alternative because the low thermal mass of these devices allows the reduction of cycle times from several minutes to 30 s or less. Another DNA-related topic that has received a lot of attention in recent years is the use of microchip gel electrophoresis for DNA analysis (see, e.g., [147]–[149]). VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS Several of these use integrated heaters to achieve denaturation of double-stranded DNA [150], [151]. An in-depth review of the general topic of nucleic acid analysis with micromachined devices is presented by Mastrangelo (in this issue). Yamamoto et al. contacted a PDMS chip containing a microreactor array with a glass temperature control chip for cell-free protein synthesis [152]. The glass chip had heaters and sensors structured in a 500-nm-thick layer of indium tin oxide (ITO) by etching in a 1:1 HNO :HCl solution at 50 C for about 20 min using a patterned resist layer as etch mask. Contact electrodes were then formed by liftoff, and the entire surface passivated by a 500-nm layer of SiO . Because the ITO layer is optically transparent, optical detection was possible through both chip surfaces. Thermal time constants for heating and cooling were 170 ms and 3 s, respectively, and uniform temperature gradients could be achieved across each reactor. The cell-free synthesis of green and blue fluo943 Fig. 11. Three images of a microfluidic device designed to function as an enzymatic microreactor. The devices incorporate two arrays of Pt microelectrodes formed by liftoff. (a) Optical image of empty devices before wafer dicing. The microreactor geometry was defined in a 300-m-thick layer of EPON SU-8, and contains two chambers separated by 11 posts. The chamber with the zigzag shape was packed with glass beads that had glucose oxidase immobilized on them. These were retained in this chamber behind the posts. The H O produced when a glucose-containing sample was reacted with the beads could pass the posts, to be detected amperometrically at the electrode arrays, visible as light-reflecting squares in this image. (b) SEM of a single microreactor after dicing. The two electrodes arrays are more visible in this image (upper left). (c) Close-up view of the posts and an electrode array, obtained by scanning electron microscopy. The Pt electrodes are 3.2 m wide, 0.8 m apart, and about 1 mm long. [Fig. 11(a) and (b) reprinted with permission from [138]. Copyright 2000 Kluwer Academic Publishers; photographs courtesy of G.-C. Fiaccabrino, IMT.] rescent proteins from their DNA templates was successfully demonstrated. Controlled protein crystal growth was the objective of studies carried out by Sanjoh et al. with the help of microfluidic silicon devices [153], [154]. The microfluidic 944 devices typically contained a crystal growth cell, reservoir cell, and, for certain studies, heaters. The lower surface of the growth cell was patterned with fine features in either nor p-type silicon layers, which serve as spatially selective nucleation sites by electrostatically attracting dissolved protein molecules. The integrated heaters were used to control the degree of supersaturation of protein in solution. Lysozyme crystals grown on n-type Si features are shown in Fig. 13. In Fig. 13(a), the features are narrow ridges, as shown in the inset, whereas in Fig. 13(b), they are trenches. Crystallization is well-defined and clearly selective for the n-type Si. 2) Microreactors for Chemical Engineering: Miniaturization, and hence MEMS technology, is attractive to the chemical engineering community for the realization of microfluidic platforms for chemical process optimization. Of particular interest is the capability MEMS offers to integrate control, sensing, and reactor functions into the same device. It has also been proposed that reactions, once optimized, could be scaled out in arrays of microreactors rather than scaled up to larger volumes in a single reactor. This would certainly reduce the risks associated with handling particularly explosive or exothermic reactions, making chemical production safer. It also becomes conceivable to think of on-site generation of hazardous chemicals, thereby forgoing the need for special storage and transport conditions [146], [155]. Improved temperature control is ultimately one of the main advantages to be gained from downscaling. Microfabricated microreactors for chemical engineering purposes thus have often included elements for heating and temperature sensing. A very simple example by McCreedy et al. saw the insertion of a Ni–Cr wire, twisted into a serpentine shape, into a PDMS solution before it was cured, to serve as a heater in the resulting polymer chip [156]. This chip was sealed to a glass base-plate that contained the microreactor channels. Sulfated zirconia was used as catalyst, and was immobilized in the inner surface of the PDMS cover. The PDMS was stable up to 180 C, and it was possible to dehydrate hexanol and ethanol to hexene and ethene, respectively. Srinivasan et al. described a more sophisticated, Si-based microreactor [37]. Pt–Ti heaters and sensors for temperature and flow were formed by liftoff on a 1- m silicon nitride layer deposited on silicon. The T-shaped reactor chamber was then etched from the other side down to the nitride membrane, and a thin Pt catalyst film deposited by shadow-mask evaporation on the inside surface of the membrane. The highly exothermic, Pt-catalyzed partial oxidation of ammonia was considered, and the safe investigation of ignition-extinction behavior demonstrated. Pt–Ti heaters and resistance temperature detectors (RTDs) were incorporated by the same group into a Pd membrane reactor, for purification of hydrogen, or alternatively, for hydrogenation and dehydrogenation reactions [146]. The gas–liquid–solid reaction of cyclohexene with H in the presence of a Pt catalyst was chosen as the model reaction in another set of three-layer microfluidic devices [34]. Two structured layers of silicon were topped off by a glass cover-plate, onto PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 Fig. 12. Layout of a microchip electrophoresis device designed for small-ion analysis using contactless conductivity detection. The inset on the right shows a photograph of the detector region. Electrical connections to the electrodes were made via round contact pads at the end of the metal lines. All metal structures were placed in 12-m-deep recesses to prevent problems during thermal bonding due to uneven surface topography. (Reprinted with permission from [145]. Copyright 2002 Wiley-VCH Verlag GmbH.) which a Pt–Ti thin-film heater and RTD had been made [see Fig. 14(a) and (b)]. These contained either a packed bed of catalytic particles or structured microchannels with staggered arrays of columns, 50 m in diameter, 300 m tall, with nearly 20 000 columns in all, to act as catalyst support [see Fig. 14(c)]. It was pointed out that while the high thermal conductivity of silicon allowed excellent heat dissipation and hence good thermal control by the heaters, large amounts of heat were lost to the environment. In addition, heater performance was very dependent on how the chip was packaged. 3) Other Microchemical Reaction Applications: Classical wet chemical analytical methods are generally based on the chemical conversion of the analyte of interest through derivatization, complexation, or other means to make it more visible to a detector. Many of these methods lend themselves well to automation by flow injection analysis (FIA). In this technique, sample is injected into a flowing carrier stream and subjected to various sample handling steps, such as dilution, reagent addition, mixing, and finally, detection. Reaction times are defined by the residence time of the reacting sample zone in the flow system, and hence can be adjusted to some extent by flow-rate variation. Precise flow control is crucial to obtaining reproducibility in FIA, since measurements are done under nonequilibrium conditions. A number of publications have described the integration of classical wet chemical methods into micromachined fluVERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS idic systems. One early example using a stacked system of silicon chips focused on the analysis of phosphate using the Molybdenum Blue method to form a blue-colored phosphate complex which could easily be detected by absorbance [38], [157]. This example was interesting in that it was the first to use silicon-based micro pumps for controlling liquids within the valveless system. However, a smaller flow system did not mean enhanced reaction, since the kinetics of the reaction used for phosphate analysis are slow and proved to be the limiting factor for analysis. A more recent example of FIA, using much smaller chips, was developed for analysis of ammonia in waste and drinking waters. It used the Berthelot reaction to convert ammonia through reaction with phenol to a blue indophenol dye. Again, the kinetics of this reaction are slow, with maximum absorbance achieved only after 15 minutes or so at 25 C. Since a sensitive measurement was desired in 5 min or less, and because reaction rates increased significantly at 35 C and 45 C, the three-layer microfluidic device used had a 50-nm-thick ITO layer sputtered on one surface for resistive heating [44]. An all-glass version of the three-layer chips for this application, complete with ITO layer, has also been reported [51]. Fast derivatization is especially important when analytes are to be labeled on-line just before or after a separation. Eijkel et al. micromachined a heated chemical reactor for precolumn chemical derivatization of amino acids with the fluorescent agent, 4-fluoro-7-nitrobenzofurazan (NBD-F) before separation in a conventional high-performance 945 Fig. 13. Photographs show lysozyme crystals that have been grown in a growth cell with n-Si features patterned in the bottom. (a) The n-Si nucleation sites take the form of ridges, whereas in (b), they are narrow trenches. In both cases, crystals clearly prefer to form on these sites. Solution pH: 4.7. (Reprinted with permission from [153]. Copyright 1999 Elsevier Science Ltd.) liquid chromatography system (HPLC) [158]. The device contained on-chip Pt–Cr thin-film metal resistors as heaters, which were recessed into the silicon chip by sputtering the metals into a 1.5- m-deep groove. These elements could heat a 50- L volume to a maximum of about 90 C at a rate of 2 C/s, using 2 W of power. In addition, there were two temperature-sensitive resistors on board for temperature measurement. 4) Other Examples Using Integrated Temperature Control: Analysis of gaseous analytes often requires their preconcentration by adsorption onto a solid surface, followed by a thermal desorption step once enough sample has been collected for further detection. Microfluidic devices designed for this purpose and incorporating thin-film resistive heaters have been reported. In one case, airborne benzene, toluene, ethylbenzene, and xylenes were of interest [159]. A Pt heater was formed by sputter deposition and liftoff on the bottom of a Pyrex wafer, which then had a trench machined into it and was sealed by anodic bonding to a second Pyrex wafer. The trench was packed with adsorbent particles, and gaseous samples passed through the packed bed. Gases preconcentrated in this device were desorbed by ramping the temperature at about 2 C/s, and collected in a second micromachined detection cell. A preconcentration factor of 100 could be obtained this way, and parts-per-million (ppm) levels of toluene could be determined. The same researchers (Ueno et al.) later 946 Fig. 14. (a) Schematic overview of a three-layer silicon–glass device for multiphase mixing and reaction. The thin-film metal heater and temperature sensor pattern is superimposed onto the channel layout. (b) Photograph of the device, corresponding to the schematic in (a). (c) SEM of a small portion of the 20 000-column array in the reactor bed, each of which is 300 m high and 50 m in diameter. These structures serve as catalyst supports within the microreactor. (Reprinted with permission from [34]. Copyright 2002 IEEE.) used this device for measurements of mixtures containing benzene, toluene, and o-xylene at the 10-ppm level [160]. Manginell et al. reported a microfabricated planar preconcentrator for integration with a silicon-based gas chromatographic column [161]. This silicon-based device consisted of a flow-through chamber formed by through-wafer etching down to a silicon nitride membrane, onto which a thin-film Pt heater had been previously patterned. The heater served as the hotplate, and was covered by a porous sol-gel adsorbent layer. Preconcentration factors of between 100 and 500 were achieved for the analyte of interest, dimethyl methyl phosphonate (DMMP), a nerve gas simulant. Heating rates PROCEEDINGS OF THE IEEE, VOL. 91, NO. 6, JUNE 2003 of 10 C/s were possible, which represented a thousandfold improvement over conventional systems. At the same time, power consumption, which was 100 mW for a typical desorption temperature of 200 C, was a thousandfold lower. Increased temperatures are also beneficial in GC for separating less volatile compounds (i.e., compounds that are strongly retained on the stationary phase). Noh et al. recently presented a gas chromatographic column micromachined in parylene, a polymer exhibiting a low heat capacity and good chemical inertness [162]. Parylene was deposited from the gas phase onto a DRIE mold, followed by an intermediate layer of Pt, and finally a second layer of parylene. A Pyrex wafer was then coated with parylene, and bonded to the coated Si wafer under high pressure and temperature. The Si was then etched away, leaving a freestanding parylene column attached to the Pyrex wafer. Gold was evaporated onto the tops of the column to serve as a heater. The purpose of the intermediate layer of Pt in the parylene walls was twofold: namely, it reduced gas permeation through the walls of the column, in addition to diffusing the heat uniformly throughout the column. Simulation and experiment showed that this polymer material showed much faster heating and cooling than chip-based silicon-glass columns. A unique micro liquid handling method was reported by Handique et al., who used an integrated heater and RTD to thermally generate air pressure inside a microfluidic channel for pumping discrete droplets [163]. The hybrid device contained a lower Si chip with Pt electrodes formed by liftoff and coated by oxide, and an upper glass chip with the microfluidic channels and air trapping chambers (see Fig. 15). The chamber containing the heater and trapped air is connected to the microfluidic channel via a small channel. It is through this channel that heated, expanding air pushes its way from the chamber into the liquid-containing channel, displacing a plug of liquid before it. Droplets of nL volume could be precisely defined using this system at flow rates of 20 nL/s using air heating rates of 6 C/s. C. Pumping As mentioned previously, EOF has been a popular means of pumping liquids in microfluidic devices. In most cases, this is still achieved by immersing wire electrodes into open reservoirs at the ends of the channels. The resulting electrolytically generated gas bubbles are easily removed, as they simply drift to the surface of the liquids in the reservoir and vanish into the air. Smaller, more compact devices could be realized by integration of the pumping electrodes into the microchannels themselves. However, this would result in the formation and trapping of gas bubbles in the channels, which would interrupt the applied electric field and halt the EOF unless gas dissipation was facilitated in some way. To avoid this problem, electrodes integrated into the reservoirs themselves have been described by Figeys et al. [164]. After 30- m-deep channels and reservoirs had been etched into the glass wafer, Au electrodes were vacuum-deposited in the reservoirs. The electrode pads were connected by an 80- m-wide metal line to contact pads, at which the high voltage was applied. Jeong et al. also integrated Au VERPOORTE AND DE ROOIJ: MICROFLUIDICS MEETS MEMS Fig. 15. (a) Schematic of the discrete drop pumping device. (b)–(e) How the pump operates: (b) Liquid is introduced at the inlet, and drawn into the device by capillary forces up to the hydrophobic patch (channel surface is not conducive to capillary flow). Air is trapped in the chamber during this process. (c) The heater is turned on, and the air inside the chamber is heated to the point that it exceeds a threshold pressure and enters the liquid channel to push a well-defined liquid droplet past the hydrophobic patch. (d) Further heating leads to continued expansion of air, and further motion of the liquid droplet as a result. (e) The air pressure is vented as the droplet passes the vent channel. (Reprinted with permission from [163]. Copyright 2001 American Chemical Society.) electrodes into their Si–glass device for synchronized cyclic CE [22]. McKnight et al. photolithographically patterned and etched a Au–Ti layer on glass to form electrodes [86]. A channel in PDMS was positioned perpendicular to these electrodes, which extended across the channel. In this case, gas dissipation through the gas-permeable PDMS layer ensured that the electric field was not interrupted. It was possible to generate EOF in just a short segment of a microchannel in this way, causing solution to be hydraulically displaced on either side of the pair of electrodes. In fact, bubbles generated by electrolysis may be used beneficially in a microfluidic device for pumping purposes. Böhm et al. described a microfluidic device comprising a 947 channel/reservoir structure in silicon, capped by a Pyrex glass cover onto which a set of Pt electrodes had been fabricated [165], [166]. The interdigitated electrodes served a dual purpose, since the bubbles were generated and their volume simultaneously measured by impedance at these electrodes. The bubbles displaced liquid in reservoir channels connected to the gas generation chamber as they grew, which in turn dispensed the liquids into a third channel for further use upstream. Flow rates in the order of nL/s were possible with this system [165], [166]. IV. CONCLUSION Clearly, micromachining technologies have played a crucial role in the development of microfluidics from the very beginning. The realization of sub- L flow systems with features precise enough to achieve the desired performance for most applications is difficult if not impossible without a photolithographic process involved somewhere in device fabrication. Hence, micromachined channel devices have become inherent to the microfluidics field. The association of microfluidics with MEMS has extended beyond the fabrication of simple microchannels, however, as has been discussed. The MEMS field has utilized the ability to work with different materials to construct devices with an increasing number of functions. The microfluidics world is learning to do the same. One area of increasing interest is the integration of optical elements into microfluidic devices, a subject which was not dealt with in this paper. Both early and more recent papers have focused on small-volume, long-pathlength detector cells for application to absorbance detection [27], [32], [33], [44], [51], [167]. Other groups have investigated the direct microfabrication into microfluidic devices of microlenses [168]–[171], integrated waveguides [25], [172], and photodiodes [139], [173]–[176]. A dc microplasma on a chip has also been reported as an optical emission detector for GC [177]–[179]. Besides the possibility of smaller, more portable devices, the integrated approach also has the potential to alleviate problems associated with the alignment of external detection elements with the microfluidic chip. Increased sensitivity may also result if the number of optical interfaces can be minimized through integration. The advantages of microchip electrophoresis especially for nucleic acid analysis have been widely touted. Generally, the increase in speed reported is on the order of tenfold to a hundredfold relative to capillaries and slab-gel formats, respectively (see, e.g., [180], [181]). Resolution of peaks in the electropherogram obtained on the chip, though sometimes lower than that observed in fused-silica capillaries [181], [182], is comparable in all cases to the equivalent experiments done in conventional CE systems. Throughput can be increased even further by resorting to multicapillary arrays in glass, as has been put forth particularly by the Mathies group [149], [183]–[187], but also described by Sassi et al. [188] and Huang et al. [189]. The most recent example from the Mathies group describes a 384-lane capillary array electrophoresis bioanalyzer for ultrahigh-throughput genetic analysis [190]. This device 948 was fabricated on a 20-mm-diameter glass wafer, and had 384 sample reservoirs and 96 common buffer reservoirs. Fabrication of such a system represents a challenge, as all 384 lanes need to be exactly the same. Moreover, getting solutions onto the device requires some form of automated sample addition step. Improving the interface between the microfluidic device and the macroscopic world for this and many other applications is an area in which MEMS technologies could provide some advances in the future. Last but not least, the trend toward the integration of more sample pretreatment onto microfluidic devices is now established, particularly in the area of genetic analysis. A number of researchers have reported the (almost) total integration of nucleic acid analysis, including sample pretreatment, onto polymer-based [191]–[193], glass-based [194], and silicon-based [23], [24] devices. Of these, the devices emerging from the Burns group [23], [24] are the most sophisticated from a MEMS point of view, incorporating micromachined elements for micro liquid handling, thermal reaction, electrophoretic separation, and detection onto a single device. With batch-type processing, it may be possible to scale out these types to large arrays for highly parallel analysis. However, control of liquids in multibranch systems will ultimately require the development of new valving concepts. This is because present valveless concepts based on electroosmotic flow or hydrophobic patches, while appropriate for many simpler applications, are somewhat limited due to their tendency toward leakiness. Microfabricated valves based on pneumatically actuated elastomer membranes have recently been proposed for array applications in biochemistry [195], [196]. Thorsen et al. have extended this concept to realize high-density microfluidic chips with thousands of valves and hundreds of individually addressable microchambers [197]. These truly impressive devices, designed to be analogous to electronic ICs, prove the feasibility of very large-scale valving in complex microfluidic systems. Here too, MEMS technologies will play an important role in the future development of microfluidics. ACKNOWLEDGMENT The authors would like to thank all the members, past and present, of the TAS team in the Sensors, Actuators, and Microsystems Laboratory (SAMLAB), at the Institute of Microtechnology, University of Neuchâtel, Neuchâtel, Switzerland, for their valuable efforts. Their contributions to this paper in the form of photos and figures are of particular note. The authors would also like to thank G. C. Fiaccabrino (SAMLAB), R. Guijt-van Duijn (Technical University of Delft), T. Fujii (University of Tokyo), H. Minhas (RSC Journals), and J. 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Mathies, “Practical valves and pumps for large-scale integration into microfluidic analysis devices,” in Micro Total Analysis Systems 2002: Proceedings of the TAS 2002 Symposium, Y. Baba, S. Shoji, and A. van den Berg, Eds. Dordrecht, The Netherlands: Kluwer, 2002, vol. 1, pp. 136–138. [197] T. Thorsen, S. J. Maerkl, and S. R. Quake, “Microfluidic large-scale integration,” Science, vol. 298, pp. 580–584, 2002. Elisabeth Verpoorte received the Ph.D. in analytical chemistry from the University of Alberta, Edmonton, AB, Canada, in 1990. Her dissertation focused on the use of AC impedance analysis for studying the permeability and behavior of dissociable species in PVC-based ion selective membranes. She was in the Corporate Analytical Research department of Ciba Ltd., Basel, Switzerland, first in a postdoctoral position, and later in a permanent position as Research Scientist. There, she worked on the development of miniaturized total analysis systems (TAS). In July 1996, she assumed a position as Team Leader in the group of Prof. N. F. de Rooij at the Institute of Microtechnology (IMT), University of Neuchâtel, Switzerland, where her research interests concentrated in the area of TAS (Lab-on-a-Chip) for bioanalytical and environmental applications. She led a research team of about eight Ph.D. students and researchers while at IMT. Recently, she accepted a Chair of Pharmaceutical Analysis at the Groningen Research Institute of Pharmacy, University of Groningen, Groningen, The Netherlands. She holds three patents and has published over 40 peer-reviewed papers. Nico F. de Rooij (Fellow, IEEE) received the M.Sc. degree in physical chemistry from the State University of Utrecht, Utrecht, The Netherlands, in 1975, and the Ph.D. degree from Twente University of Technology, Enschede, The Netherlands, in 1978. From 1978 to 1982, he worked at the Research and Development Department of Cordis Europa NV, Roden, The Netherlands. In 1982, he joined the Institute of Microtechnology of the University of Neuchâtel, Neuchâtel, Switzerland (IMT UNI-NE), as Professor and Head of the Sensors, Actuators and Microsystems Laboratory. From 1990 to 1996 and since October 2002, he is Director of the IMT UNI-NE. He has lectured at the Swiss Federal Institute of Technology, Zurich (ETHZ), and since 1989, he has been a part-time professor at the Swiss Federal Institute of Technology, Lausanne (EPFL). He is a Member of the editorial boards for the journals Sensors and Actuators and Sensors and Materials. His research activities include microfabricated sensors, actuators, and microsystems. Dr. de Rooij was a Member of the steering committee of the International Conference on Solid-State Sensors and Actuators and of Eurosensors. He acted as European Program Chairman of Transducers ’87 and General Chairman of Transducers ’89. He is a Member of the editorial board of the IEEE JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 953