discotech wafer dicer - Shared Research Facilities

Transcription

STANDARD OPERATING PROCEDURE:
DISCOTECH WAFER DICER
Purpose of this Instrument: This tool is used for dicing of substrates made up materials such as silicon, glass, and
ceramics.
Location: White Hall 414 Cleanroom
Primary Staff Contact: Harley Hart
(412) 443-1514
Office: White Hall 409
[email protected]
Secondary Staff Contact: Dr. Kolin Brown
(304)366-6551
Office: ESB G75D
[email protected]
The Shared Research Facilities are operated for the benefit of all researchers. If you encounter any problems with
this piece of equipment, please contact the staff member listed above immediately. There is never a penalty for
asking questions. If the equipment is not behaving exactly the way it should, contact a staff member.
WARNING: The DISCO Wafer Dicer has rotary sections that operate at high speeds, such as the spindle which can
rotate in excess of 30,000 min-1. As a result due care must be taken and safety protocols must be followed when
operating this tool to prevent severe personal injury to hands.
WARNING: The DISCO Wafer Dicer has high voltage sections where electric shock can occur and drive sections
where user clothing or physical parts can get may become caught causing serious injury.
ATTENTION: Users are required to read the safety manual prior to operating the tool.
ATTENTION: Users are required to wear safety glasses and nitrile gloves at all times while operating the tool.
SUBSTRATE PREP
1. Sign onto the FOM and sign into the logbook.
2. At the substrate prep area in 414 of White Hall, place a cleanroom wipe down on the table.
3. Place the substrate face down in the center of the cleanroom wipe.
NOTE: If the substrate has a flat on one end, orient the substrate so that the flat is in the position shown in
Figure 1. This will assist conducting theta alignment procedures.
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Wafer Flat
Figure 1: Image showing substrate flat
WARNING: If your substrate surface will be damaged by being placed face down on a cleanroom wipe, contact a
Shared Research Facilities staff member for assistance.
4. Place the metal ring on the cleanroom wipe in the orientation shown in Figure 2. The two notches on the
metal ring line up with the wafer dicer ceramic chuck posts.
NOTCH
Figure 2: Metal ring used for attachment of substrates
5. Remove approximately a one-foot section of blue tape from the tape roll. Place this tape with the adhesive
side down over the backside of the substrate to be diced and the metal ring – see Figure 3.
Figure 3: Blue adhesive tape covering the metal ring and substrate
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6. Remove all air pockets between the tape and the metal ring by pressing finger against the tape and wiping
around the metal ring. If there is a crease between the metal ring and the blue tape, gently peel back the
section where a crease in the tape has occurred and reattach the adhesive tape to the metal ring – see Figure
4.
Figure 4: Removing of air pockets between tape and metal ring
7. Using a card, remove all air pockets from between the wafer and the blue tape by sliding the card from the
center of the substrate to the edge of the substrate – see Figure 5.
Figure 5: Removing air pockets from the backside of the wafer
WARNING: Failure to properly secure the substrate can lead to the substrate becoming detached during processing
and become consequently damaged. If the substrate has become detached and cannot be located, contact a
Shared Facilities staff member
8. Using a razor knife, score the tape on the metal ring and then remove any excess blue adhesive tape – see
Figure 6.
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Figure 6: Scoring of tape needed to remove the excess
9. Turn substrate/ring over. The substrate is now ready to be diced – see Figure 7.
Figure 7: Substrate prepared for dicing.
WARNING: If the tape is not properly attached, then proper vacuum will not occur on the backside of the substrate
and tape. If this occurs, repeat Substrate Pep procedures and attach to the chuck. If the vacuum issue persists,
contact a Shared Research Facilities staff member.
TOOL START UP – SYSTEM INITIALIZE
1. At the tool, turn the compressed air valve to the open position by rotating the valve counter-clockwise. The
compressed air valve is located directly behind the tool – see Figure 8.
2. Turn the DI water valve to the open position by rotating the valve counter-clockwise. The DI water valve is
located to the right of the tool – see Figure 8.
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Compressed Air
Valve
Power Key
DI Water Valve
Maintenance
Key
Figure 8: Compressed air and DI water valves in the open position
WARNING: Verify that the MAINTENANCE key is in the COVER INTERLOCK POSITION. This activates the system
interlocks to prevent personal physical injury from occurring by accidentally opening the system splash covers with
the spindle in operation.
3. Turn on the instrument by turning the POWER key clockwise to the START position and holding for 3-5
seconds – see Figure 8. The wafer dicer monitor will turn on and will display ‘PLEASE WAIT…’ as the system
boots up. Once the system boot up is complete the CUT CHART screen will be displayed on the instrument
monitor – see Figure 9. The icon functions are for the CUT CHART are indicated in Chart 1.
NOTE: For Semi-Automatic screenshot of the CUT CHART, see Figure 10 and steps 17-21 of Chart 1 for icon
functions.
Figure 9: CUT CHART Screen for Automatic Processing
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Figure 10: CUT CHART screen for Semi – Automatic processing
Item
#
1
2
3
Parameter
Description
Steps
Status of Steps
System Initialization
Sequential preparation steps for wafer dicing
Show the status of completion of preparation steps.
Executes system initialization.
4
Device Data
Press to enter DEVICE DATA LIST. The recipe is selected and chosen through
this screen.
5
Spindle
Starts or Stops spindle rotation.
6
Cutting Water
Starts or Stops DI water flow for cutting.
7
Setup
Press to enter the Non-Contact Setup screen. This is needed before and
after blade replacement.
8
Blade Replacement
Press to enter the BLADE REPLACEMENT screen. Follow the BLADE
REPLACEMENT procedures.
9
Dress
Press to enter the DRESS DATA LIST. This is required after installing a Hubless style blade.
10
Work Vacuum
11
Auto Alignment
12
Manual Alignment
13
14
15
16
Turns the vacuum on the backside of the substrate through the stage
ON/OFF.
Press to enter the AUTO ALIGNMENT screen and execute AUTO ALIGNMENT.
Press to enter the MANUAL ALIGNMENT screen and execute MANUAL
ALIGNMENT.
Enter a correction value to the amount of material to be left uncut. Press
Height Adjust
the HEIGHT ADJUST icon on the bottom of the screen to execute the change
in parameter.
Enter a correction value to the current cutting recipe. Press the SPEED
Change Speed
CHANGE icon on the bottom of the screen to execute the change in the
parameter.
Device Data Directory
DIRECTORY NAME of the loaded recipe
Device Data number
DEVICE DATA NUMBER of the loaded recipe
The following items are for SEMI-AUTOMATIC processing ONLY – see Figure 10 below
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Cut Lines
Specify the number of cut-lines. When a value greater than zero, the cutting
operation begins from where the street adjustment was made in a singlechannel alignment and then the operation is complete when the specified
number of cuts have completed. If a value of '0' is entered, the number of
cuts will be calculated from the Device settings.
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19
20
21
Single Channel Alignment
Cut Directions
Rear
Front
Press to enter SINGLE CHANNEL ALIGNMENT screen.
Select the cutting direction.
REAR: Tool will cut from the front of the tool to the rear.
FRONT: Tool will cut from the rear of the tool to the front
Chart 1: Description of CUT CHART Screen functions
4. In the CUT CHART screen, press the SYSTEM INITIALIZE icon to initialize all of the instrument motors. Once
this is complete the SYSTEM INITIALIZE STATUS will change from red to green and the status will change
from NOT READY to OK.
SELECT RECIPE – DEVICE DATA
1. In STEP#2 of the CUT CHART, press the DEVICE DATA icon. The Device Data List will be displayed. In the
SRF_USERS folder, select the desired recipe and press the ENTER icon to go to the CUTTING DATA (Simplified)
screen.
NOTE: To create a NEW RECIPE the user must do the following:
 Highlight the ROOT BASIC recipe in the ROOT folder and select the COPY icon on the bottom of the
screen.
 Under the DESTINATION DIRECTORY, highlight the SRF USERS folder and enter the new name in the
DESTINATION DATA section. The naming nomenclature should be as follows:
MATERIAL_USER INTIALS
Then press the ENTER icon to save the name change. Press the EXIT icon to return to the DEVICE
DATA list. The new recipe should be listed.
NOTE: If there are multiple recipes for the same material and user, then enter a number after the USER
INITIALS
2. Enter the process parameters through the basic settings in the CUTTING DATA (SIMPLIFIED) screen or
advanced settings in the CUTTING DATA (ADVANCED) screen. See the requirements for each below:

CUTTING DATA (SIMPLIFIED): This is used for entering parameters for the standard dicing of a
wafer where the end result produces substrates of the same size. The CUTTING DATA (SIMPLIFIED)
screen is shown in Figure 11 and Chart 2 provides a description of the parameters that need to be
entered:
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Figure 11: Basic Settings Screen (CUTTING DATA (SIMPLIFIED))
Item #
Parameter
Description
1
Work Shape
Select ROUND or SQUARE. The substrate will be diced according to shape.
2
Round Substrate Size
Designate the substrate as ROUND and enter the diameter of substrate.
3
Square Substrate Size: CH 1
Designate the substrate as square and enter the width of the substrate of the CH 1
side.
4
Square Substrate Size: CH 2
side.
5
Index Channel 1
This is the distance the stage will move after each cut in the Channel 1 direction.
The distance is measured from the center of the cut lines.
6
Index Channel 2
This is the distance the stage will move after each cut in the Channel 2 direction.
The distance is measured from the center of the cut lines.
7
Feed Speed (mm/s)
This is the speed of the movement of the blade in x-direction. The data range is 0600 mm/s with an input step of 0.001 mm/s. This parameter is blade and material
specific - see DICING BLADE specification sheet.
8
Spindle Revolution
This parameter is the spin speed of the dicing blade. This parameter is blade and
material specific - see the DICING BLADE specification sheet.
9
Work Thickness
Enter the thickness of the substrate.
10
Tape Thickness
Enter the tape thickness. The blue tape is 0.076 mm thick.
11
Blade Height
This is the amount the blade will be above the stage during processing. Typically this
is 0.050mm. This will cut into the tape 0.026mm. If the tape is an issue with your
blade, it is advisable to set the blade height to a minimum 0.076mm.
12
Precut Process Number
Enter the Precut Process number.
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Unit
This will change the display units between mm and in.
Chart 2: Description of parameters (CUTTING DATA (SIMPLIFIED))

CUTTING DATA (ADVANCED): This can be accessed by pressing the Advanced Settings Icon on the
bottom right-had side of the CUTTING DATE (SIMPLIFIED) screen. Here the user is able to enter
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more advanced recipe parameters which allows for multiple substrate sizes and shapes, as well as,
different cutting techniques – see Figure 12 and Chart 3 below.
Figure 12: Advanced Settings Screen (CUTTING DATA (ADVANED))
Item #
1
Parameter
ID
Description
ID name of the recipe parameters
Work Shape
Select ROUND or SQUARE. The substrate will be diced according to shape.
2
3
4
Round Substrate
Substrate Size (diameter)
Square Substrate
5
Square Channel 1
Designate the substrate as ROUND.
Enter the diameter of the substrate if the substrate is round.
Designate the substrate as SQUARE.
side.
6
Square Channel 2
side.
7
Work Thickness
The thickness of the substrate.
8
Tape Thickness
The tape thickness. The blue tape is 0.076 mm thick.
9
Spindle Revolution
The parameter is spin speed of the dicing blade. This is blade and material specific see DICING BLADE specification sheet.
10
Precut Process Number
Enter the Precut Process number.
11
Cutting Channel Sequence
This is order is which the channel will be cut. For example, '4231' will perform the
operation in the following order; CH4→CH2→CH3→CH1.
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13
Unit
Rotation Angle
This will change the display units between mm and in.
Enter the rotation angle from the theta-axis origin to each channel.
14
Cut Mode
Select FRONT/REAR
15
Cutting Method
FRONT: The tool will cut from the rear of the tool to the front of the tool. REAR: The
tool cuts from the front of the tool to the back of the tool.
16
Cut Lines
Specify the number of cut lines for each channel unto 99999 lines. NOTE: Enter '0' to
have the number of cut lines calculated according the substrate size.
9
17
Align (mm)
Cutting is performed at the position shifted by the entered amount from the street
adjusted position.
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19
Non-Cut Front
Non-Cut Rear
Specify the area to be left uncut on the substrate.
20
Offset - X
Specify the x-direction deviation between the center of the substrate and the chuck
table. See Shared Research Facilities staff member to enable function.
21
Offset - Theta
Specify a value to shift the cut start position by the cut line. . See Shared Research
Facilities staff member to enable function.
22
Sequence
Specify cutting condition for each sequence channel.
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Blade Height
This is the amount the blade will be above the stage during processing. Typically this
is 0.050mm. This will cut into the tape 0.026mm. If the tape is an issue with your
blade, it is advisable to set the blade height to a minimum 0.076mm.
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Feed Speed (mm/s)
This is the speed of the movement of the blade in x-direction. The data range is 0600 mm/s with an input step of 0.001 mm/s. This parameter is blade and material
specific - see DICING BLADE specification sheet.
25
Index
Enter the amount to move the stage in the Y-axis between cuts
26
Repeat
Enter the number of times to repeat the cutting in each sequence before moving on
to the parameters in the next sequence. NOTE: The tool recognizes the value of zero
as '1.'
27
Depth Steps
Multi - Level cutting: The tool will cut the same line repeatedly by the designated cut
depth until the preselected blade height is reached. See a Shared Research Facilities
staff member to activate this function.
28
Loop
Use this function to repeat a combination of two or more sequences. Enter 'S' in the
first column of the LOOP and then enter the number of repetitions in the last column
of the loop.
The following parameters are for the CHOP function ONLY
Enter the descending speed of the z-axis when using the CHOPPER function. See a
Shared Research Facilities staff member to activate this function.
29
Z-Down Speed
30
X-Offset (mm)
31
X-Length (mm)
32
Pitch (mm)
Enter the distance that tool will not cut lines. This function only works with CHOP
modes. See a Shared Research Facilities staff member to activate this function
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Chopper Count
Enter the number of times to perform the CHOPPER travers cut or chopA1:C36per cut
within the substrate size. See a Shared Research Facilities staff member to activate
this function
Enter the travel distance of the x-axis from the alignment position. This function only
works with CHOP modes. See a Shared Research Facilities staff member to activate
this function
Enter the distance of the tool cut lines from the X-OFFSET position. This function only
works with CHOP modes. See a Shared Research Facilities staff member to activate
this function
Chart 3: Description of parameters (CUTTING DATA (Advanced))
3. Parameter changes will be highlighted in yellow. To save the parameter changes press the ENTER icon. Then
press the EXIT icon to return to the DEVICE DATA LIST. Press the EXIT icon again to return to the CUT CHART
screen.
WARNING: Failure to press the ENTER icon to save changes will result in undesired cuts and results as the system
will process the previously saved parameters.
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4. Verify that STEP#2 DEVICE DATA status is green and displays OK. Also, verify that the recipe has been
properly loaded. This is done by checking the information displayed in the Device Data section of the CUT
CHART screen.
WARNING: If the STATUS displays CAUTION or ERROR, select the DEVICE DATA icon again and check the recipe
parameters. If this does not solve the problem, then contact a Shared Research Facilities staff member.
NOTE: For assistance with using the MEASURE feature for measuring distances to determine channel indices and
the KERF CHECK feature for measuring chipping, see a Shared Research Facilities staff member.
BLADE REPLACEMENT AND BLADE SET-UP
NOTE: Users are required to supply and install dicing blades that are specific to the material being diced. Reference
information for the dicing blades supplied by DISCOTECH online at www.discousa.com or this information can be
located in the handbook next to the tool.
1. In STEP#3, press the SETUP icon. The NON-CONTACT SETUP screen will be displayed.
WARNING: All setup procedures should be run in NON-CONTACT SETUP mode to prevent damage to dicing blades.
If CONTACT SETUP needs to be conducted, contact a Shared Research Facilities staff member.
2. Press the START icon. The spindle will turn on and the dicing blade assembly will move to the sensor at the
rear of the tool and the dicing blade wear will be measured at the NCS sensor. The dicing blade consumption
amount will be displayed on the tool bar at the top of screen.
NOTE: If the system alarms for a BLADE WEAR, the blade information may have been entered incorrectly or a
new blade needs to be installed. Contact a Shared Facilities staff member for assistance.
3. Press the BLADE REPLACEMENT icon on the bottom of the screen. The spindle will turn off and the dicing
blade assembly will move to forward towards to splash door.
4. Select the SAVE DATA icon on the bottom of the BLADE REPLACEMENT screen. Enter the ID for the blade that
is to be removed to save the current wear information for the dicing blade installed on the system. Input the
SRF Blade ID: ZH05_SD2000_SRF. Then press the ENTER icon to save the dicing blade information.
5. The user will then be taken to the USED BLADE LIST. If a user has a USED BLADE to install on the system, then
highlight the used blade ID and press the SELECT OK icon on the bottom of the screen. Then press the ENTER
icon in the BLADE REPLACEMENT screen. This will delete the previously saved blade data that was stored on
the system prevent multiple dicing blade usage entries for the same blade.
If this is a NEW BLADE, then enter the following information in the BLADE REPLACEMENT SCREEN see Figure
14 below and Chart 4 details:
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Figure 13: BLADE REPLACEMENT screen
Item
#
1
Parameter
Description
2
Lot ID
Specification
New/Used
Enter Blade Type_Grit_User Initials
Blade type - see blade storage container
Enter NEW or USED
3
Blade OD
Enter the outer diameter of the dicing blade to be use - see blade
storage container
4
5
6
7
8
Blade Thickness
Exposure
Flange OD
Flange: Select this for the installation of the Hub-less style blade
HUB BLADE ONLY: Specify the tip protrusion of the Hub style blade
HUB-LESS BLADE ONLY: Flange outer diameter is 49.44
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10
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Replacement reason
Blade Life: Lines
Blade Life: Cumulative Length
Select the Reason for replacement NEW/USED
Specify the maximum number of cut lines for the dicing blade
Specify the cumulative length of the blade
Enter the thickness of the blade - see blade storage container
Hub Blade: Select this for the installation of the Hub style blade
Blade Type
Chart 4: BLADE REPLACEMENT screen functions
6. Press the ENTER icon to save the entered information.
7. Deactivate the touch panel by pressing the DISCO icon in the upper left hand corner of the screen.
WARNING: Failure to deactivate the touch panel can lead to severe personal injury as the safety interlock for the
dicing will not be engaged
8. Open the splash cover door to the left to access the dicing blade.
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WARNING: Do not open the splash cover door until the blade has stopped rotating or severe personal injury can
occur.
9. The SRF ZH05_SD2000_SRF is a Hub style dicing blade. If the user would like to install a Hub-less style dicing
blade then the hub mount will need to be changed. Please follow the instructions for the style of blade being
installed on the wafer dicer:
HUB STYLE BLADE REMOVAL/INSTALLATION

Remove the dicing blade water nozzle by loosening the attachment screw– see Figure 14.
Attachment
Screw
Figure 14: Dicing blade water nozzle

Attach the nut demounting jig, and then insert the torque driver into the nut demounting jig –see
Figure 15. Turn the torque driver counterclockwise until the jig is loose. Then remove the torque
driver and turn the nut demounting jig counter-clockwise to remove the flange locking nut by hand.
Nut Demounting Jig
Torque Driver
Figure 15: Nut demounting jig and torque driver attached to the Hub style locking nut
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
Using the large 3-prong clamp, remove the dicing blade and place in storage container for the
specified dicing blade– see Figure 16. Be careful to not break the blade the by making contact with
any part of the blade assembly.
Large 3-Prong
Clamp
Figure 16: Large 3-prong clamp attached to the Hub style dicing blade for removal
WARNING: Use the 3-prong clamps at all times when installing and removing blades to prevent damage to the
blades a minimize potential for physical injury.

Using the large 3-prong clamp, remove the desired dicing blade from the storage container and
install on the dicing blade assembly in the opposite fashion that the previous dicing blade was
removed – see Figure 17.
Figure 17: Removing the Hub style dicing blade from the storage container

Using nut demounting jig, gently start to screw on the locking nut. Then attach the torque driver
and turn it clockwise until a click is heard.
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
Attach the dicing blade water nozzle

Close the splash cover by sliding it to the right
HUB-LESS STYLE BLADE REMOVAL/INSTALLATION

Remove the dicing blade water nozzle by loosening the attachment screw– see Figure 18.
Attachment
Screw
Figure 18: Dicing blade water nozzle

Nut Demounting Jig
Torque Driver
Figure 19: Nut demounting jig and torque driver attached to the Hub style locking nut
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
specified dicing blade– see Figure 120Be careful to not break the blade the by making contact with
Large 3-Prong
Clamp
Figure 20: Large 3-prong clamp attached to the Hub style dicing blade for removal

Place the torque driver in the lock bolt. Turn the torque driver counter-clockwise to remove the
lock bolt – see Figure 21.
Locking Bolt
Figure 21: Torque driver inserted into the lock bolt for removal
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
Attach the Hub style removing jig in Figure 22 to the rear flange. Turn the front portion of the jig
clockwise a few turns to attach the dicing blade flange. Do not over tighten. Then turn the rear
portion of the jig until the flange is removed. Place these items in the proper hub flange storage
container.
Front Portion of
Jig
Rear Portion of
Jig
Rear Flange
Figure 22: Hub style removing jig
WARNING: Do not over tighten the removing jig or it will be difficult to remove the flange from the jig.

Remove the Hub-less style flange from the storage container and place the back part of the flange
on the wafer dicer assembly – see Figure 23.
Hub-less Style
Flange
Figure 23: Hub-less style flange inserted on the wafer dicer assembly

Place the washer over the lock bolt. Then place the torque driver in the lock bolt and turn
clockwise until a click is heard – see Figure 24.
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Washer and Lock
Bolt
Figure 24: Washer for Hub-less flange and lock bolt.

Remove the Hub-less blade from the storage container and carefully install the dicing blade over
the lip of the flange so that it rests in a centered on the flange – see Figure 25.
Figure 25: Hub-less blade centered on the flange

Using the small three prong, install the front flange. Verify that flange seated flush against the
blade.
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Figure 26: Small 3-prong clamp with front flange

Using nut demounting jig, gently start to screw on the Hub-less style locking nut locking nut. Then
attach the torque driver and turn it clockwise until a click is heard.
Figure 27: Hub-less style locking nut
WARNING: The locking nuts for the Hub style and Hub-less styles blades are not interchangeable. Using the wrong
locking nut can cause severe damage to the tool.


Close the splash cover by sliding it to the right.
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10. Activate the touch panel by pressing the DISCO icon in the upper left hand corner of the screen.
11. Press the NEXT icon. The press the START icon to conduct blade set-up procedures on the newly installed
dicing blade. The consumption of the blade should be 0.000mm.
NOTE: Verify the dicing blade information in the NON CONTACT SETUP screen to ensure the proper dicing
blade has been loaded.
12. Press the EXIT icon to return to the CUT CHART screen. Verify that the set-up status has changed to green
and displays OK.
If a Hub-less blade is to be used, then the blade needs to be dressed prior to being used to dice a substrate.
Follow steps 13-29 for the dressing of the blade. This step is necessary to true the circumference of the dicing
blade and remove metal from the blade to expose diamond abrasive grains.
13. Place the dressing board properly secured to the metal ring using tape onto the ceramic chuck – see Figure
28.
Figure 28: Dressing board prepared for dress cutting.
14. Press the DRESS icon in the CUT CHART screen
15. Highlight the desired DRESS DATA recipe and press ENTER to go to the DRESS DATA setting screen – see
Figure 29 and Chart 5 for details.
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Figure 29: DRESS DATA screen
Item #
Parameter
Description
1
Spindle Revolution
Enter the spindle revolution for dressing. See dicing blade specification sheet as this
is blade specific
2
Cut Mode
Select the cut mode. Typically this is 'A'
3
Work Thickness
Specify the dresser board thickness. The SRF dresser boards are 1 mm thick.
4
Tape Thickness
Specify the tape thickness. The thickness of the blue tape is 0.076mm.
5
Blade Height
Specify the amount to be left un-cut on the dresser board. The value should be
greater than the tape thickness. Typical value is 0.1mm
6
Set-up After Dress
Enter whether or not non-contact setup is to be conducted after dressing.
7
Cut Line
Specify the total number of cut lines
8
X-Stroke
Enter the dresser board X-direction stroke. This vale is 100mm for SRF dresser board.
9
Y-Stroke
Enter the dresser board Y-direction stroke. This vale is 100mm for SRF dresser board.
10
Index
Enter the Y-direction indexing amount.
11
Feed Speed
Enter the sequential feed speed to dress the blade. The initial speed should be lower
than the final feed speed to be used during processing and should incrementally
increase to the final feed speed which is to be used during processing.
12
Lines
Enter the number of lines to be cut for each Feed Speed.
13
Mode
Indicates the cutting direction: REAR/FRONT.
Chart 5: DRESS DATA icon details
16. Press the MANUAL ALIGNMENT button on the bottom of the DRESS DATA screen to enter the MANUAL
ALIGNMENT screen. The dresser board will move under the microscope and the MANUAL ALIGNMENT
screen will be displayed.
17. Press the CHANGE MAGNIFICATION icon to go into LOW mag.
18. Press the FOCUS icon on the bottom of the screen. The focus options will be displayed. Press the AUTO
FOCUS icon to focus the substrate. Once AUTO FOCUS is complete, press the EXIT icon to return to the
MANUAL ALIGNMENT screen.
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19. Press the LIGHT LEVEL icon on the bottom of the screen. The light level option will be displayed. Press the
AUTO LIGHT icon to have the system adjust the light. Once the LIGHT LEVEL adjustment is complete, press
the EXIT icon to return to the MANUAL ALIGNMENT screen.
20. Using the AXIS OPERATION arrows, find the dresser board. To change to stage speed to HI SPEED press the
HI-SPEED icon – it will turn yellow.
21. Perform theta adjustment procedures by doing the following:

Move the stage to the bottom of the dresser board and place the center crosshairs on the edge of
the dressing board.

Press the ALIGN THETA icon on the bottom of the screen to select the first point.

Move the stage back to the dresser board.

Place the center crosshairs on a second point on the edge of the dresser board.

Press the ALIGN THETA icon on the bottom of screen to select the second point for adjustment.

The stage will adjust the theta position so that edge of the dresser board is parallel to the hairline
crosshairs. Repeat if necessary.
22. Press the CHANGE MAGNIFICATION icon on the bottom of the screen to go to HI MAG to perform theta
adjustment procedures.
25. Perform theta adjustment procedures by doing the following:

the dressing board.





26. Verify that the toolbar reads THETA ADJUSTMENT IS COMPLETED and then press the ENTER icon on the right
hand side of the screen. Then press the up direction Y-Axis button to set the position of the first cut in the
Channel 1 direction.
27. Press the ENTER icon to return to the DEVICE DATA screen.
28. Press the START icon to commence DRESS cutting. In the DRESS STATUS screen monitor the process.
29. Once the process is complete, the tool will return to the CUT CHART screen. Press the WORK VACUUM icon
to return the substrate stage to the unload position. Then slide the door to the left and using the compressed
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air gun, remove any excess DI water and then remove the metal ring w/dresser board. Place this back in the
bin on the substrate prep table.
SUBSTRATE LOADING
1. Slide the substrate stage door to the left and place the substrate onto the ceramic chuck. This is done by the
aligning the notched ends of the metal ring with the posts on the ceramic chuck – see Figure 30.
Figure 30: Substrate loaded onto the ceramic chuck
2. Slide the substrate door back to the right.
WARNING: Failure to close the door completely will cause the system to alarm for DOOR NOT CLOSED. If this
occurs, press the ALARM CLEAR icon in the right-hand corner of the screen and close the substrate door properly.
3. Press the WORK VACUUM icon at Step #4 of the CUT CHART screen. The STATUS should turn from red green
and the display should change from NOT READY to OK.
4. Verify the C/T Work vacuum on the right –hand side of the screen is greater than -70 kPa and is green.
5. Verify that the Main Air display on the right-hand side of the screen is greater than 40 MPa and is green.
SUBSTRATE ALIGNMENT
1. The MANUAL ALIGNMENT screen shown in Figure 31 and a descriptions of the functions on this screen are
displayed in Chart 6.
23
Figure 31: MANUAL ALIGNMENT screen
Item #
1
2
3
4
5
Parameter
Magnification
Channel
Hairline Width
Direct Light Level
Direct Light Level
Description
Indicates the current magnification of the macro microscope - HI or LOW.
Indicates the channel which is currently being aligned
Indicates the current Hairline Width
Indicates the light intensity of direct light.
Icons to adjust the intensity of direct light
6
7
8
F1
F4
Oblique Light Level
Oblique Light Level
Axis Operation
Auto Alignment
Narrow Hairline
Indicates the light intensity of oblique light
Icons to adjust the intensity of oblique light
Arrows for directional control of the substrate as well as speed control functions
Call-Up the Auto Alignment screen
Narrow the hairline width
F5
Align Theta
F8
F9
F10
F11
Execute theta alignment procedures. Follow the toolbar instructions
after selecting.
Light Level
Opens the Light Level control screen. Select AUTO LIGHT.
Focus
Opens the Focus control screen. Select AUTO FOCUS.
Widen Hairline
Widen the hairline width
Change Magnification
Change the magnification levels of the microscope.
Chart 6: MANUAL ALIGNMENT screen functions
2. Press the Manual Alignment icon on the bottom of the screen. The substrate will move under the microscope
and the MANUAL ALIGNMENT screen will be displayed.
3. Press the CHANGE MAGNIFICATION icon to go into LOW mag.
24
6. Using the AXIS OPERATION arrows, find the substrate. To change to stage speed to HI SPEED press the HISPEED icon – it will turn yellow.
7. Perform Theta adjustment procedures by doing the following:

the dressing board.





8. Press the CHANGE MAGNIFICATION icon on the bottom of the screen to go to HI MAG
11. Perform Theta adjustment procedures by doing the following:

the dressing board.





12. Verify that the toolbar reads THETA ADJUSTMENT IS COMPLETED and then press the ENTER icon on the right
hand side of the screen. Then press the up direction Y-Axis button to set the position of the first cut in the
Channel 1 direction.
13. Press the ENTER icon to return to the CUT CHART screen. Verify that STEP#5 status in the CUT CHART is green
and displays READY.
14. Press the SPINDLE icon to turn the spindle on. The spindle will spin-up to set-point and the door will lock.
25
15. Press the CUTTING WATER icon to turn on the DI WATER for the blade, shower, and spray. Check the flow
rates on the right-hand side of the tool – see Figure 32. The flow rates should be as follows:
a. BLADE: 1.5 L/min
b. SHOWER: 1.0 L/min
c. SPRAY: 1.0 L/min
Figure 32: DI Water flow meters
16. Press the START icon on the top left-hand side of the screen to begin cutting the substrate.
17. After the first cut, the HAIRLINE ADJUSTMENT screen will be displayed. Using the NARROW HAIRLINE &
WIDEN HAIRLINE icon, line up the crosshairs with the edge of the cut. Once complete, press the HAIRLINE
ADJ icon to set these values.
18. Press the START icon to continue the cutting sequence.
Figure 33: CUT STATUS screen
26
Item
#
1
2
3
4
5
6
Parameter
Description
Channel
Indicates the directory name.
Indicates the directory number.
Indicates the device ID
Indicates the current cut line.
Indicates the total number of cuts for the substrate.
Indicates the channel being currently being cut.
7
8
Blade Height
Feed Speed
Indicates the amount being left uncut on the substrate.
Indicates the feed speed for the current cut.
9
Height Adjust
Enter a correction value for the amount being left uncut. To update the correction
value, press the <F8> icon.
10
Change Speed
Enter a correction value for the cutting speed being applied to the current cut. To
update the correction value, press the <F2> icon.
Device Data
Device ID
Cut Line
Chart 7: CUT STATUS screen functions
19. Once the cutting sequence is complete, press the WORK VACUUM icon to remove the substrate. The stage
will move the removal position. Slide the door to the left and blow excess water off the substrate using the
compressed air gun.
WARNING: If at any time, the substrate is not be cut as desired, press the Z-EM (Z-EMERGENCY) icon. This will lift
the dicing blade away from the substrate. The stage will move but the substrate dicing will not take place.
20. If the substrate has alignment marks to align to, then the AUTO ALIGNMENT can be used to align the
substrate, contact a Shared Research Facilities staff member for assistance with this feature.
BLADE REMOVAL / INSTALLATION OF POST PROCESSING
NOTE: Users are required to remove dicing blades at the end of the session and install the SRF dicing blade ZH05SD2000_SRF. The procedures are shown below.
1. In STEP#3, press the SETUP icon. The NON-CONTACT SETUP screen will be displayed.
WARNING: All setup procedures should be run in NON-CONTACT SETUP mode to prevent damage to dicing blades.
If CONTACT SETUP needs to be conducted, contact a Shared Research Facilities staff member.
2. Press the START icon. The spindle will turn on and the dicing blade assembly will move to the sensor at the
rear of the tool and the dicing blade wear will be measured at the NCS sensor. The dicing blade consumption
amount will be displayed on the tool bar at the top of screen.
NOTE: If the system alarms for a BLADE WEAR, the blade information may have been entered incorrectly or a
new blade needs to be installed. Contact a Shared Facilities staff member for assistance.
27
3. Press the BLADE REPLACEMENT icon on the bottom of the screen. The spindle will turn off and the dicing
blade assembly will move to forward towards to splash door.
4. Select the SAVE DATA icon on the bottom of the BLADE REPLACEMENT screen. Enter the ID for the blade that
is to be removed to save the current wear information for the dicing blade installed on the system. Then
press the ENTER icon to save the dicing blade information.
5. The user will then be taken to the USED BLADE LIST. If a user has a USED BLADE to install on the system, then
highlight the SRF Blade ID (ZH05_SD2000_SRF) and press the SELECT OK icon on the bottom of the screen.
Then press the ENTER icon in the BLADE REPLACEMENT screen. This will delete the previously saved blade
data that was stored on the system prevent multiple dicing blade usage entries for the same blade.
6. Deactivate the touch panel by pressing the DISCO icon in the upper left hand corner of the screen.
WARNING: Failure to deactivate the touch panel can lead to severe personal injury as the safety interlock for the
dicing will not be engaged
7. Open the splash cover door to the left to access the dicing blade.
WARNING: Do not open the splash cover door until the blade has stopped rotating or severe personal injury can
occur.
8. Follow the instructions for the style of dicing blade being removed from the wafer dicer:
HUB STYLE BLADE REMOVAL/ INSTALLATION

Remove the dicing blade water nozzle by loosening the attachment screw.

Attach the nut demounting jig, and then insert the torque driver into the nut demounting jig. Turn
the torque driver counterclockwise until the jig is loose. Then remove the torque driver and turn
the nut demounting jig counter-clockwise to remove the flange locking nut by hand.

specified dicing blade. Be careful to not break the blade the by making contact with any part of the
blade assembly.
WARNING: Use the 3-prong clamps at all times when installing and removing blades to prevent damage to the
blades a minimize potential for physical injury.

Using the large 3-prong clamp, remove the desired dicing blade from the storage container and
install on the dicing blade assembly in the opposite fashion that the previous dicing blade was
removed.

Using nut demounting jig, gently start to screw on the locking nut. Then attach the torque driver
and turn it clockwise until a click is heard.


Close the splash cover by sliding it to the right
28
HUB-LESS STYLE BLADE REMOVAL/INSTALLATION

Remove the dicing blade water nozzle by loosening the attachment screw.


specified dicing blade– see Figure 120Be careful to not break the blade the by making contact with

Place the torque driver in the lock bolt. Turn the torque driver counter-clockwise to remove the
lock bolt.

Attach the Hub style removing jig to the rear flange. Turn the front portion of the jig clockwise a
few turns to attach the dicing blade flange. Do not over tighten. Then turn the rear portion of the
jig until the flange is removed. Place these items in the proper Hub flange storage container.
WARNING: Do not over tighten the removing jig or it will be difficult to remove the flange from the jig.

Place the washer over the lock bolt. Then place the torque driver in the lock bolt and turn
clockwise until a click is heard.

Remove the Hub-less blade from the storage container and carefully install the dicing blade over
the lip of the flange so that it rests in a centered on the flange.

Using the small three prong, install the front flange. Verify that flange seated flush against the
blade.

Using nut demounting jig, gently start to screw on the Hub-less style locking nut locking nut. Then
attach the torque driver and turn it clockwise until a click is heard.
WARNING: The locking nuts for the Hub style and Hub-less styles blades are not interchangeable. Using the wrong
locking nut can cause severe damage to the tool.


Close the splash cover by sliding it to the right.
9. Activate the touch panel by pressing the DISCO icon in the upper left hand corner of the screen.
10. Press the NEXT icon. Then press the START icon to conduct blade set-up procedures on SRF dicing blade. The
consumption of the blade should be 0.000mm.
NOTE: Verify the dicing blade information in the NON CONTACT SETUP screen to ensure the proper dicing
blade has been loaded.
29
11. Press the EXIT icon to return to the CUT CHART screen. Verify that the set-up status has changed to green
and displays OK.
TURNING OFF THE SYSTEM
1. Press the SYSTEM INITIALIZE icon to initialize all of the instrument motors. Once this is complete the SYSTEM
INITIALIZE STATUS will be green and display OK.
2. Turn off the instrument by turning the POWER key counter-clockwise to the OFF position. The audible system
alarm will be heard for five seconds while the wafer dicer boots down.
3. Turn the DI water valve to the closed position by rotating the valve clockwise. The DI water valve is located to
the right of the tool.
4. Turn the compressed air valve to the closed position by rotating the valve clockwise. The compressed air
valve is located directly behind the tool.
5. Sign out of the FOM and verify that all required information has been properly entered into the log book.
EMERGENCY SHUT-DOWN PROCEDURES
If, at any time, the user needs to contact someone for help, call or locate the following staff of the Shared Research
Facility (SRF):
Primary Staff Contact: Harley Hart
(412) 443-1514
Office: White Hall 409
[email protected]
Secondary Staff Contact: Dr. Kolin Brown
(304)366-6551
Office: ESB G75D
[email protected]
If no one is available and the WAFER DICER is not acting as expected, the user should do the following:



Turn OFF the system power by turning the key to the OFF position
CLOSE the DI water valve
CLOSE the compressed air valve
Then, if possible, the user should stay by the tool while trying to contact a Shared Facilities staff member. If it
becomes necessary to leave the instrument then the user should leave a large, legible note on the WAFER DICER
stating:



The problem (describe what happened and steps taken)
When it occurred (date and time)
User name and phone number
If it becomes necessary to leave the tool then the user should leave a large, legible note at the WAFER DICER stating
the tool is DOWN.
30
If a dangerous situation is evident (smoke, fire, sparks, etc.), then, ONLY if it is safe to do so, the user should
press the EMO button located on the front of the tool. The user should notify all other cleanroom persons within
the cleanroom to evacuate. The user should then contact proper emergency personnel. The contact numbers
can be found posted outside of the cleanroom or on the cover of the tool log book.
31

discotech wafer dicer - Shared Research Facilities

Transcription

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