D3.2 Smart wireless sensor network platform

Transcription

Smart Monitoring of
Historic Structures
D3.2 Smart wireless sensor network platform Grant Agreement number:
212939
Project acronym:
SMooHS
Project Title:
Smart Monitoring of Historic Structures
Funding Scheme:
Collaborative Project
Date of latest version of Annex I against
which the assessment will be made:
2010-02-20
Report:
Period covered by this report:
From 2009-11-01 to 2011-11-31
Dissemination level:
PU (public)
Authors
Krüger (TTI), Bahr (TTI), Bachmaier (IWB), Lehmann (MPA), Willeke
(TTI), Ernst (MPA)
Project coordinator:
Dr. Markus Krüger
Project coordinator organisation:
MPA Universität Stuttgart, Germany
Tel:
+49 711 6856 6789
Fax:
+49 711 6856 6797
Email:
[email protected]
Project web site address:
http://www.smoohs.eu
Doc. Name:
2011-11-25 WP3-P09-D3.2 Smart wireless sensor network platform.doc
SMooHS
Table of Contents
1 Summary .......................................................................................................................................6 2 Introduction....................................................................................................................................7 3 Related work .................................................................................................................................8 4 Structural health monitoring system ..............................................................................................9 4.1 Environmental Influences and Damage Processes .............................................................9 4.2 Benefits of SHM on Historic Structures ................................................................................9 4.3 Principle system layout ........................................................................................................9 5 Aspects of flexible and reliable sensor node hardware ...............................................................11 6 Realization of a robust sensor node hardware ............................................................................12 6.1 Processor board with wireless communication, SmartMCU1 Rev. 2.2 ..................................13 6.1.1 General description ................................................................................................13 6.2 Processor board with wireless communication, integrated sensors and sensor interface,
SmartWS Rev. 3.1 .........................................................................................................................15 6.2.1 General description ................................................................................................15 6.2.2 Features .................................................................................................................17 6.2.3 Peripherals .............................................................................................................18 6.2.4 Sensor port restrictions ..........................................................................................18 6.3 Programmer board, SmartPRG1 Rev. 2.2 .............................................................................20 6.3.1 General description ................................................................................................20 6.4 Radio transceiver board for 2.4GHz ISM band, SmartRF1 Rev. 2.3 ....................................20 6.4.1 General description ................................................................................................20 6.5 Radio transceiver board with front end for 2.4GHz ISM band, SmartRFP1 Rev. 1.0 ............21 6.5.1 General description ................................................................................................21 6.6 Power supply, SmartDPS1 Rev. 2.3......................................................................................21 6.6.1 General description ................................................................................................21 6.7 Gateway Interface, SmartGIF Rev. 3.3 ................................................................................22 6.7.1 General description ................................................................................................22 6.7.2 Features .................................................................................................................23 6.8 Multi-sensor board for strain gauges, vibration, temperature and humidity, SmartSG Rev.
2.2 24 6.8.1 General description ................................................................................................24 6.8.2 Features .................................................................................................................25 6.9 Sensor signal board with integrated multiplexer, SmartSSG Rev. 2.0..................................26 6.9.1 General description ................................................................................................26 6.10 Acceleration sensor board for piezo- and PVDF-sensors, Rev. 1.0...................................27 6.10.1 General description ................................................................................................27 6.11 Inclination and tilt sensor board, SmartInclino Rev. 2.0 .........................................................28 Rev. 2012-01-20
2/92
SMooHS
6.11.1 General description ................................................................................................28 6.11.2 Features .................................................................................................................28 6.12 Air velocity sensor board, SmartVAir Rev. 2.0 .....................................................................29 6.12.1 General description ................................................................................................29 6.12.2 Features .................................................................................................................29 6.13 Impedance converter board system for electrochemical analysis and impedance
spectroscopy, SmartIMP Rev. 2.0 .................................................................................................30 6.13.1 General description ................................................................................................30 6.13.2 Features .................................................................................................................30 6.14 Impedance converter board with 6-channel multiplexer for electrochemical analysis and
impedance spectroscopy, SmartIMP Rev. 2.4...............................................................................31 6.14.1 General description ................................................................................................31 6.14.2 Features .................................................................................................................32 6.14.3 Versions .................................................................................................................32 6.15 Electrometer with external multiplexer, SmartE-Meter Rev. 2.0 .............................................34 6.15.1 General description ................................................................................................34 6.15.2 Features .................................................................................................................34 6.16 Electrometer with integrated multiplexer, SmartEMT Rev. 2.4 .............................................35 6.16.1 General description ................................................................................................35 6.16.2 Features .................................................................................................................36 6.16.3 Remark to Shielding ...............................................................................................36 6.16.4 Versions .................................................................................................................36 6.17 Integrated sensors .............................................................................................................38 6.17.1 Internal humidity and temperature sensor board, SmartTemp1, Rev. 2.2 .................38 6.17.2 Internal humidity and temperature sensor board with dual LED, SmartHT1, Rev. 3.038 6.17.3 Internal humidity and temperature sensor board with dual LED, SmartHT2, Rev. 3.039 6.17.4 External humidity and temperature sensor board, SmartHT3, Rev. 2.0 ...................39 6.17.5 External ambient light photo sensor board, SmartLGT3, Rev. 1.0 ............................40 6.17.6 External magnetic field sensor board, SmartMF1, Rev. 1.0 .....................................40 6.17.7 External passive infrared sensor board, SmartPIR1, Rev. 1.0 .................................40 6.17.8 External temperature sensor board, SmartTMP1, Rev. 1.0 ......................................41 6.17.9 External flexible sensor board for impedance measuring, Rev. 2.4 .......................41 6.17.1 External sensor board for surface impedance measuring......................................42 6.17.2 External potential sensors ......................................................................................43 6.17.3 Test board for UV radiation and light .....................................................................43 7 Wireless Gateway SmartGateWS Rev. 3.3 ...................................................................................44 7.1 Product Description ............................................................................................................44 7.2 Main Specifications/Features .............................................................................................44 Rev. 2012-01-20
3/92
SMooHS
7.3 Peripherals .........................................................................................................................45 8 Structural health monitoring software ..........................................................................................46 8.1 Principal structure of the SHM system software ................................................................46 8.2 Sensor network and data transfer software .......................................................................47 8.2.1 Sensor network protocol ........................................................................................47 8.2.2 Wboot – Sensor node boot loader .........................................................................47 8.2.3 Miranda – sensor node application software..........................................................47 8.2.4 Starcatcher – radio to serial forwarder ...................................................................48 8.2.5 Uranus – forwarder ................................................................................................48 8.2.6 Jupiter – base station and forwarder ......................................................................48 8.2.7 Callisto – on-site control .........................................................................................48 8.3 Data storage ......................................................................................................................48 8.3.1 Galaxy – SQL data base ........................................................................................48 8.3.2 Data Base Overview ..............................................................................................48 8.3.3 Mars – SQL interpreter ..........................................................................................49 8.4 Data analysis .....................................................................................................................49 8.4.1 In-mote data analysis .............................................................................................49 8.4.2 Database analysis ..................................................................................................50 8.5 User interfaces ...................................................................................................................51 8.5.1 Administration software tools .................................................................................51 8.5.2 Data readout software tools ...................................................................................52 8.5.3 Data export software tools .....................................................................................53 8.6 Planemos – Application builder ..........................................................................................53 9 Overview Status of work..............................................................................................................54 10 Conclusions and outlook .............................................................................................................56 11 References ..................................................................................................................................57 12 Appendix .....................................................................................................................................59 12.1 Technical data of different components .............................................................................59 12.1.1 Processor board, Rev. 3.1 .....................................................................................59 12.1.2 Multi-sensor board, Rev. 2.2 ..................................................................................63 12.1.3 Tilt and inclination sensor board, Rev. 2.0 .............................................................63 12.1.4 Air velocity sensor board, Rev. 2.0 ........................................................................64 12.1.5 Impedance sensor board, Rev. 2.0 ........................................................................64 12.1.6 Impedance sensor board, Rev. 2.4 ........................................................................65 12.1.7 Electrometer board, Rev. 2.0 .................................................................................66 12.1.8 Electrometer board, Rev. 2.4 .................................................................................67 12.1.9 SmartGate Rev. 3.3 ...............................................................................................69 Rev. 2012-01-20
4/92
SMooHS
12.2 Terminals and drawings of different components ..............................................................70 12.2.1 Processor board, Rev. 2.2 .....................................................................................70 12.2.2 Processor board, Rev. 3.1 .....................................................................................73 12.2.3 Power module, Rev. 2.3 .........................................................................................78 12.2.4 Multi-sensor board, Rev. 2.2 ..................................................................................80 12.2.5 Tilt and inclination sensor board, Rev. 2.0 .............................................................82 12.2.6 Air velocity sensor board, Rev. 2.0 ........................................................................83 12.2.7 Impedance sensor board, Rev. 2.0 ........................................................................86 12.2.8 Electrometer board, Rev. 2.0 .................................................................................87 12.2.9 Electrometer board, Rev. 2.4 .................................................................................89 12.3 Database Description .........................................................................................................90 Rev. 2012-01-20
5/92
SMooHS
1 Summary
Historic structures are often characterized by their extraordinary architecture, design or material.
The conservation of such structures for future generations of the European population is one of the
main tasks of monument conservators. To conserve historic structures it is increasingly important
to understand the deterioration processes that affect them. Mostly these are caused by the
environment. To obtain more detailed information about the deterioration processes continuous
monitoring systems have been installed in selected cases. However, most of these monitoring
systems are only capable of weather or air pollution data acquisition and basic models for data
analysis are used. The actual influence of these environmental effects on the structure or the
structural material is often neglected. That means that the structural resistance is calculated from
the measurements and not determined by sufficient sensors. Another facet is that most monitoring
systems require cabling, which is neither aesthetically appealing nor applicable in all cases due to
the needed fastening techniques. This is particularly significant to historical monuments and other
cultural heritage.
This report shows the cutting edge of competitive and smart wireless sensor network hardware and
software for monitoring historic structures. A special focus is on the hardware, including
appropriate low power signal conditioning with respect to reliable and event-based data acquisition.
The report is introduced by a chapter of the general setup of the WSN architecture.
In detail, the following system components are included: A main board, similar to the main board in
a personal computer, as a central component. It offers processing capabilities and optional storage
capacity. It also offers connectors where one or two signal conditioning boards can be attached to
and it carries a radio frequency module for the wireless transmission of data. The main board is
powered by a power supply circuit that in turn is powered by either batteries or a solar power
module. For details on the solar power modules tested on the platform, refer to D3.4 "Power supply
technologies".
When it comes to the supported sensor types, the system already supports sensor boards for six
sensors and further adaptation boards are under development. One of the central sensor boards
developed to date is the multi-sensor board, capable of measuring air temperature and air
humidity, three-dimensional vibrations and up to two channels of external resistive sensors, as for
an example temperature sensor, strain sensors or a displacement transducer.
The electrometer sensor board allows the detection of moisture and salt induced electrical potential
in walls. Together with a third type of sensor board which allows complex impedance
measurements, this covers the application area of damp walls and salinization effects which is
important for many historical buildings.
Moving walls is an issue in larger structures, which will be measurable by our inclination sensor
adaptation board with high accuracy. Recording of airflow is supported with a hot-wire anemometer
sensor. Event-triggered evaluation of acoustic emission is going to be a main focus.
The software system that operates the wireless sensors is proprietary and adapted especially for
long-term, low-power operation. It consists of a bootloader function which is responsible for radio
transmission and for over-the-air software updates. On top of this bootloader resides the sensor
board specific application. It is responsible for the acquisition of raw data and for the proper
conversion and preprocessing of raw data before transmission.
The base station runs a Linux operating system and an application that handles the forwarding of
data via a secure virtual connection using a built-in mobile connection modem.
A database system is the final destination of acquired data, where it can be read-out directly from
the database by using secured access accounts. This data is also retrievable online in various
formats via a web interface. It can also be downloaded in common spreadsheet software formats.
Rev. 2012-01-20
6/92
SMooHS
2 Introduction
The use of wireless monitoring systems are usually supposed to have several advantages
compared to wired monitoring systems, which are for example easy installation, cost-effectiveness
and autonomous operation over longer periods providing remote control and analysis features.
Therefore, a lot of research and development activities are ongoing in regard to wireless
monitoring systems to be applied on civil engineering structures like bridges [1], [2] as well as on
historic structures [3]. At first glance, continuous monitoring with wireless sensor networks seems
to be a perfect solution to get more detailed information about structures than from visual
inspection only. However, wireless monitoring is often not that simple if the monitoring task is more
complex than simply acquiring and transferring relatively basic data, such as hourly temperature or
humidity measurements. For such simple tasks, many competitive solutions with adequate
reliability already exist in the form of data loggers, partly also equipped with wireless
communication.
The situation becomes challenging if the desired monitoring is focused on acquiring and analyzing
data like stress, strain, inclination, salt and moisture content inside materials, or even vibration or
acoustic emissions caused by fracture processes which require higher sampling rates. The main
problem in this context is the power supply (primary batteries are most common) so that the
wireless monitoring hard- and software is subject to several restrictions. To remain cost-effective
and practicable, a balance must be found between the data provided by the monitoring task and
the time and effort to perform this continuous monitoring. This is why wireless monitoring systems
frequently have to be customized for the desired monitoring objective. Thus, structural health
monitoring is also to be seen as an interdisciplinary engineering task.
The wireless sensor network system described within this report show the progress of soft- and
hardware development with respect to monitor historic buildings and object. It is a very technical
report showing details of the system components, specifications and basic operation principles.
Therefore, the report is addressed to soft- and hardware developer working in the field of wireless
sensor networks.
Rev. 2012-01-20
7/92
SMooHS
3 Related work
Most of the wireless sensor networks under development consist of several multi-sensor nodes,
called motes, and at least one base station, which also could have an integrated modem
(GPRS/UMTS etc.) for internet connection and remote control. With respect to power consumption,
network robustness, and the possibility to build up big meshes multihop-networks are often the
best solution for monitoring large structures.
The motes are the main components of a wireless monitoring system. There are different tasks a
sensor mote has to perform, which are to collect and digitize data from different sensors, to store
sensor data, to analyze data with simple algorithms, to send and receive selective and relevant
data to and from other nodes as well as the central unit and to work for an adequate time period
without a wired power supply. There are many different wireless sensors that have been developed
by researchers all over the world to be used for structural health monitoring (SHM). A
comprehensive review of available wireless sensing units is given by Lynch and Loh [4] who show
the state of the art at that time. However, a lot of shortcomings especially with respect to reliability
are obvious. The biggest problem is still the conflict between power consumption, storage capacity
and system bandwidth. The system bandwidth is mainly restricted by the limited wireless
communication throughput. That is why multihop network algorithms, mote clustering and in-mote
data processing and reduction are considered in the recent research [4], [5], [6], [7]. Another
drawback is the lack of adequate sensors especially with respect to sensitivity, reliability and
robustness as well as their integration into a mote [8].
Although numerous commercialized smart sensors are also available together with some
application software from different companies (Dust Networks, Microstrain, Millenial Net,
Sensametrics, Sensicast, Testo etc.), most of these sensor networks are in a basic configuration
just wireless data acquisition systems for evaluation purposes that only transmit measured raw
data to a central base station for further processing. Moreover, most of the systems do not fulfill the
requirements with respect to robustness, long-term stability, long-term battery operation or sensor
reliability.
Rev. 2012-01-20
8/92
SMooHS
4 Structural health monitoring system
4.1 Environmental Influences and Damage Processes
Historic materials and historical structures have been under environmental influence for centuries
or even millenniums. These influences induce damage processes in the building materials that
lead to a degraded state of the structures eventually. The degradation effects can add up and
destroy the valuable object the monument authorities try to preserve for future generations.
Environmental influences are manifold and have their origin in physical and chemical effects. This
comprises decomposition by light, rain, salts, gases and others. To prevent the degradation or the
destruction of historic objects, restorers and conservators try to chemically and physically conserve
and protect the object and in some cases have to reconstruct parts. For the restorers and
conservators, it is of great importance to know and understand the main factors responsible for the
damage.
4.2 Benefits of SHM on Historic Structures
By knowing the main causes for damaging effects, best countermeasures for preservation and
conservation can be taken and the remedies are adapted to the specific structure. To this end,
understanding environmental effects is necessary. To this effect, all relevant environmental
quantities have to be recorded and analyzed by relating the resulting effects to the physical and
chemical values. Damage processes are usually slow and medium to long-term measurements are
necessary.
The knowledge resulting from the SHM measurements can be used for the discovery and
confirmation of general correlations but it can also be used to erect an object specific treatment
plan, if correlations are already known but influencing factor for the specific object are unknown.
4.3 Principle system layout
Wire-based measurement systems for SHM consist of several sensors applied to the structure at
relevant locations. Sensors are available for a plethora of physical quantities, and have to be
chosen according to the application demands. The sensor readings are analog-digital converted in
a central unit, where the digital data is also stored. Many systems allow online-retrieval of recorded
data (compare Figure 1, left side).
In contrast to these aforementioned systems, wireless systems have no central data acquisition
unit but one or several sensors are connected to a (usually) small data acquisition unit, which is
called a measurement node. The complete measurement system consists of several independent
nodes, linked to each other by a radio communication link, hence building a wireless sensor
network. Additional elements of the system are the gateway, which relays the measurement data
to a long-distance network for remote access, and a database to save data storage for later
retrieval and optional post-processing. The WSN is operated remotely from an operation and
maintenance terminal (O&M). See Figure 1, right side, for a general layout of a WSN.
Figure 2 gives a more detailed view on the general system layout. The autonomous wireless
sensor nodes are depicted deployed on a building, sending their information via Smartswitches if
necessary, to a mandatory base station, called Smartgate. The Smartgate includes a wide area
mobile connection, used for controlling the system and for sending data to the central database
and web server (Smartserver) within the operator's premises. The customer can then access the
information via a web access (refer to chapter 8 for details).
Please read on in chapter 6 for the technical realization of the system.
Rev. 2012-01-20
9/92
SMooHS
Figure 1: Wired SHM schematic with central measurement unit where individual sensors are
connected to, versus the proposed wireless SHM with autonomous sensor nodes relaying
measured data via a short-range transmission and (optionally) long-range mobile networks
SmartmoteWS
SmartswitchWS
&
Data transfer
LAN/WLAN
enance
remote maint
LAN/WLAN
Alarm
WWW
WS
Smartgate
S
-SM
Mobile phone
(PDA)
Client
Smartserver
WS
Client Mobile
Figure 2: General system layout
Rev. 2012-01-20
10/92
SMooHS
5 Aspects of flexible and reliable sensor node hardware
System and data reliability with respect to the desired operation period and desired accuracy are of
utter importance in terms of structural health monitoring under harsh environments. In addition to
these fundamental aspects, wireless monitoring should be more than just acquiring diverse
measurands at different locations of a structure and then storing it in a database. If the monitoring
task and the expected result are well-considered, immediate data processing of the data is
recommended to avoid collecting large amounts of senseless data no one will look at afterwards. If
such immediate data processing is considered, wireless monitoring becomes intelligent and of
direct practical use. Therefore, distributed computing strategies, which include data acquisition,
data analysis and data reduction are of utter importance.
With respect to the restrictions of a sensor node, event based data acquisition may become of
interest or even an obligatory task, if a critical short event occurs during the time the monitoring
system is in sleep mode and as such not capable to recognize this event. Event based monitoring
is useful if temporary loads or other influences stress the structure, e.g. trains, trucks, wind, snow
or rain, earthquakes or structural failure itself. That means, an object specific event itself triggers
the measurement progress.
Some examples of event based monitoring concepts supported by sufficient hardware are reported
by several researchers. A case study on which event based monitoring was successfully tested
was the detection of a train crossing the bridge [9]. The task was to measure dynamic strain of
steel girders during a train crossing a bridge. The train detection was conducted by using a MEMS
vibration sensor on each mote that could be configured by software to trigger the system. The
MEMS sensor provides a vibration detection mode while using only little power. If a train crosses
the bridge the vibration is recognized by the MEMS sensor that then wakes up the microcontroller
from sleep mode by interrupt. After that, the measurement procedure starts within a few
milliseconds. The procedure was acquiring data from dynamic strain during train crossing, with a
sampling rate of 100 samples/s using resistive strain gauges. The collected data was first stored
temporarily inside the mote and then transmitted to the base station consecutively after the train
had passed. This procedure was necessary to reduce data loss rate.
One of the most challenging examples of event based monitoring is acoustic emission analysis,
which is useful to detect and also to characterize or localize fracture processes. Qualitative
acoustic emission analysis techniques often require very sensitive sensors and high-speed data
acquisition systems, because the full waveforms are analyzed. Due to the hard- and software
restrictions it is obvious that only certain quantitative acoustic emission analysis techniques could
be implemented into a wireless sensor network. In terms of acoustic emission analysis hit rate
(relevant acoustic events per second) determination, beam forming techniques for localizing
acoustic events as well as signal characterization and classification techniques have been
investigated and possible solutions for both hard- and software have been discussed [9], [10], [11],
[12], [13], [14]. Although not all mentioned concepts have fully been implemented into a mote and
further investigations are necessary, the concepts of acoustic emission data analysis in wireless
sensor networks are promising.
Rev. 2012-01-20
11/92
SMooHS
6 Realization of a robust sensor node hardware
Figure 3 and Figure 5 show an example of an actual development. It shows a wireless sensor mote
equipped with low-power microcontroller, wireless transceiver, primary batteries and several
sensor boards for multiple sensing. The hardware is optimized to work under harsh environmental
conditions as they occur in case of structural health monitoring and supports several ultra-low
power modes. Therefore, the sensor node is water and dust protected (IP65) and could work in a
temperature range of -25°C to 85°C. Different kinds of sensors could be attached to the wireless
mote simultaneously such as various MEMS (Microelectromechanical systems) sensors with digital
output, e.g. for the acquisition of acceleration, temperature, humidity, inclination, solar radiation
etc. Additionally analog sensors like resistive strain gauges or piezo-based vibration sensors are
connectable by using especially developed electric circuits for the signal conditioning. This modular
concept allows for customization and optimization for specific monitoring objectives.
Wireless Sensor
Multi-Sensor Board
Multi-Sensor Board
Wireless
Communication
Module
(Backside of
Processor Board)
Power
Supply
Acceleration Sensor Board
Processor
Board
Programming
Adapter
(USB/JTAG)
Figure 3. Robust wireless sensor node (mote) for multiple sensing and modular node components
(© www.smartmote.de).
The basic functionality common to all sensor nodes, e.g. communication, data processing etc., is
integrated into the so-called processor board. This processor board also allows the interfacing of
different sensors not requiring specific signal conditioning. Additionally analog sensors like resistive
strain gauges or piezo-based vibration sensors are connectable by using especially developed
electric circuits for the signal conditioning. This modular concept allows for customization and
optimization for specific monitoring objectives. Currently, several additional sensor boards are
available: a signal conditioning board for interfacing piezo- and PVDF- sensors for acoustic
emission and dynamic analysis, a multi-sensor signal conditioning board for strain gauges,
displacement transducers and pressure cells in combination with temperature/humidity and
vibration measurements, sensor boards for high precision inclination measurements, for high-
Rev. 2012-01-20
12/92
SMooHS
impedance potential measurements as well as for high-impedance resistivity measurements in the
field of electrochemical analysis.
Two different processor boards were developed, one without integrated analog signal conditioning
circuits (Rev. 2.2) and another one with integrated signal conditioning circuits and digital sensors.
The latest development version of the processor board is the SmartWS mainboard Rev. 3.1 with the
microcontroller MSP430F5437. This processor has more analog and digital ports and a real time
clock. A sensor interface (analog and digital), battery holders, sensors and the radio transceiver
with higher output power now integrated. It is a complete and more compact node then the old one
with separate boards.
Figure 4. 1st version of a node (Rev. 2.2 left) and the latest version with integrated sensors (Rev.
3.1 right)
Figure 5. Examples of the latest hardware developments.
6.1 Processor board with wireless communication, SmartMCU1 Rev. 2.2
6.1.1 General description
The main components of the processor board presented here are a microcontroller equipped with
FRAM for data storage and a low power radio chip for the wireless communication (see Figure 6).
Rev. 2012-01-20
13/92
SMooHS
The low power operation of the processor board is due to the ultra-low power microcontroller
MSP430 F1611 featuring 10kB of RAM and 48kB of program memory (flash). This 16-bit RISC
processor features several power-down modes with extremely low sleep-current consumption that
permits the sensor node to run for a long time period. The MSP430 has an internal digitally
controlled oscillator (DCO) that may operate up to 8MHz. However, the jitter and accuracy of the
internal DCO shows a strong variation with respect to temperature and supply voltage. This aspect
is supposed to be problematic especially with respect to the usage of the internal A/D-conversion
at higher sampling rates as well as time synchronization accuracy. Therefore, the MSP430
operates either with an external ceramic oscillator at 6 MHz or with an external 32’768 Hz crystal
watch on our processor board.
Programming Board
USB-Connector
Power Supply
Battery
JTAG-Connector
Ext. Solarpanel
Solar
Modul
Supercap
Ext. Keyboard
USB to UART
FT232R
3.3V
Reg.
Power
Management
Misc.
Keyboard
Connector
USB
Keyboard
Adaptation
UART
UART
Power
Supply Connector
JTAG
GIO
Power
ADC
Supply Connector
GIO
MCU Board
JTAG
UART
UART
Supply Connector
GIO
ADC
GIO
JTAG
Power
2.4 GHz ISM
ADC
XIN
Power
Power
32 kHz
XOUT
XT2IN
SPI 1
IO
MCU
Radio Transceiver
SPI
CC2420
IO
MSP430F1611
6 MHz
Power
XT2OUT
F-RAM Memory
8Mbit
Mem Ctrl 4 x FM25H20
Mem Ctrl
VREF
Ext.
VREF
optional
VREF
SPI
2
I C/SPI 0
GIO
ADC
GIO
ADC I2C/SPI 0
Sensor-Board Connector 1
Sensor-Board Connector 2
Power
I2C
Serial ID
DS28CM00
Figure 6. Principle sketch of the processor board, power supply and programming board, Rev. 2.2.
Six of the eight external ADC ports of the MSP430 were split up to two separate connectors with
three ADC ports each to which different sensors or sensor boards could be attached. The
maximum reliable total sampling rate for all ports was tested to be approximately 100 kHz at 12 bit
resolution. The two remaining ADC ports are used to monitor the actual power supply voltage as
well as actual current consumption of the sensor node. The I2C and SPI ports which are also
integrated into the microcontroller are mainly used to control additional sensors and signal
conditioning boards. The MSP430 also includes a 3-port DMA controller. For data storage FRAM
(Ferroelectric random access memory) was supposed to be the best choice, because of its high
addressing speed, low power operation and non-volatile storage capability. Up to four FRAM
Rev. 2012-01-20
14/92
SMooHS
modules with 256 kB each can be attached to the processor board providing a maximum of 1MB
storage capacity.
The processor board is equipped with a Chipcon IC (CC2420) soldered separately on an
interchangeable module for the wireless communication. It permits power management to ensure
low power consumption. The CC2420 is controlled by the TI MSP430 microcontroller through a
separate SPI port and a series of digital I/O to avoid data collisions with the digital sensors. The
radio may be shut off by the microcontroller for reducing the power consumption. The theoretically
achievable maximum data throughput rate of the system is 250 kbps.
The dimensions of the SmartMCU1 incl. radio board is 77.5 x 42 x 9 mm³ (board without supply
connector) and 77.5 x 48 x 9 mm³ (board with supply connector), the weight is about 21 g.
The processor board is mounted headfirst, opposite to the other modules, so that the radio board is
on top.
The terminal pin assignment can be found in appendix 12.2.1
Figure 7. Processor board front and back with mounted radio board, Rev. 2.2.
6.2 Processor board with wireless communication, integrated sensors
and sensor interface, SmartWS Rev. 3.1
The SmartWS mainboard (see Figure 8) is the kernel of a wireless sensor node with integrated
mostly used functions (see Figure 9). It is based on the TI’s Microcontroller MSP430F5437 and is
programmable through a programming connector via JTAG, SPI by Wire and the Bootstrap
Loader. A jumper must be set to position OFF/JTAG for programming. In this position the battery
supply is disconnected and the board is powered by the programming adapter for optimal logic
levels.
Two battery holders are integrated at the bottom side of the board for using up to two LithiumBatteries 3.6V, same type and same capacity only (e.g. Saft LS26500, cell size C). One or both
battery holder parts can be separated from the microcontroller part (sawing with metal saw). The
microcontroller part has two solder connectors on the bottom side for an external power supply
with 3.0V to 3.6V free of ripple.
As for Rev. 2.2 it is possible to connect two sensor modules at the bottom side to the sensor
module connectors (e.g. impedance board, electrometer board, ultrasonic board, digital board…).
In this configuration, the integrated sensors and sensor interfaces are not supported, because the
IO ports of the microcontroller now feature the attached sensor boards. It is possible to use the
microcontroller’s internal reference voltage or an external reference voltage. At the sensor module
connectors there are two terminals for negative and positive reference voltage. These ports of the
microcontroller are programmable as input or output or 12 Bit ADC input. Each sensor module
connector has three 12 Bit ADC ports, six digital ports, one common I2C or SPI port, terminals for
ground (GND), analog ground (AGND), supply voltage output (VCC) and system reset (#RESET).
Rev. 2012-01-20
15/92
SMooHS
The peripheral can use this reset as power up reset, generated by the microcontroller board, or to
reset the microcontroller via open collector. All ports are programmable as GPIO.
For the wireless communication over the 2.4GHz ISM band there is an integrated radio transceiver
(CC2520 from TI) and an output amplifier (CC2090 from TI).
To expand the memory it is possible to place an optional extended memory (Flash memory or FRam or a card holder for micro SD-Card). The extended memory can be set to sleep mode.
An optional acceleration sensor (BMA180 from Bosch) can be placed to detect accelerations in 3axes. The BMA180 supports sleep mode and has an interrupt output to wake up the system from
sleep if a certain vibration level was detected.
A small sensor-/signal module (two versions available) for humidity / temperature measurement
and a signal dual LED (red hardware selectable, green port driven) can be placed at the front side.
There is integrated a 32’768 Hz crystal watch for the real time clock and the system frequency.
Additionally a high frequency crystal (up to 16MHz) can be used.
Figure 8. Processor main board front and back with mounted sensor connectors, Rev. 3.1.
Also integrated are a digital part with 2x2 bidirectional ports and output driver for the most used
applications with its inputs programmable as 12 bit analog input, and an analog part (16 Bit
zooming ADC SX8724 from Semtech) with 2x1 differential inputs or up to 2x3 single-ended inputs
and optional high accuracy reference voltage. These two parts, inclusive sensor connectors at the
Rev. 2012-01-20
16/92
SMooHS
bottom side, can be set to sleep mode separately. The output current at the sensor connectors of
each part is short protected and limited to about 100mA. One port of the microcontroller is used for
overload detection. Additionally the analog part can be upgraded with a digital part.
The dimensions of the board are optimized for using it with the Bopla standard housing Alustyle
1030 (Profile ASP130 100mm, 2 x Cover ASD1030).
The functional areas, terminal pin assignment and connectors are shown in chapter 12.2.2 Figure
52 and Figure 53. Technical data can be found in appendix 12.1.1.
6.2.2 Features
 2.4 GHz transceiver for wireless sensor network data transmission
• Up to 10dBm Output Power
 Mixed Signal Microcontroller MSP430F5437(A)
• 16-Bit Risc Architecture
• 256KB Flash Memory
• 16KB RAM
• Real Time Clock
• Watchdog
• GPIO
• 12Bit ADC
• 16Bit Timer
• DMA
• Interrupt
• Hardware Multiplier
• Universal Serial Communication System
• Unified Clock System
• Flexible Power Management System
• Internal / External Reference Voltage
 Optional Extended Memory for SPI-Bus (Flash Memory or F-RAM or Micro SD-Card)
• With Power Down Switch
 32.768kHz Low-Frequency Crystal
 Optional 16MHz High-Frequency Crystal
 2 Sensor Module Connectors for additional Sensor Modules
 Humidity-, Temperature-, LED- module at front side
 Digital Application with 2x2 bidirectional ports with Output Driver and Power Down, 2x2
Channels, Hardware Configurable
• GPIO with Push Pull Output, Open Drain (Source and Sink), Pull Up and Down
Resistors (e.g. 2-Wire Serial Sensors)
• 12Bit Analog Input without Signal Processing but no special analog layer.
 16Bit Analog Application with Zooming ADC SX8724, Programmable Gain, Power Down,
Internal / External Reference Voltage, Hardware Configurable
• 2x1 Differential Signal Input, (e.g. Wheatstone Bridge)
• 2x3 Single-Ended Signal Input
• Optional High Accuracy Reference Voltage
• Optional Digital Application or Cable Breakage Detection
 Optional Acceleration Sensor BMA180
Rev. 2012-01-20
17/92
SMooHS
 Battery Holder for two Batteries Cell Size C (Baby)
 Operating Voltage 3.0V to 3.6V
 Dimensions 120 x 77 x 15 mm³ (board without front connectors), 132 x 77 x 19 mm³ (board
with front connectors)
 Weight 32 g to 55 g (depending on hardware configuration)
 Typical Weight of one Battery 48 g (Saft LS26500)
6.2.3 Peripherals
 Temperature and Humidity Sensor with Filter Cap at Front Side
 Dual-LED red and green at Front Side, green LED is switchable, red is hardware selectable
 Two Sensor Module Connectors X1, X2 for two half Sensor Modules or one full Sensor
Module, supports GPIO, Interrupt, 12Bit Analog Input, Reference Voltage In/Out, Timers, SPI
and I2C (shared with X1, X2), Reset, Battery Power, Analog Ground (AGND) and Ground
(GND)
 Two Bracket Module Connectors with additional Ground (GND)
 Programming Connector for JTAG, SPI By Wire, Bootstrap Loader, 2-Wire UART, some
Ports are usable as GPIO
 Jumper for Power ON/OFF(JTAG), in OFF Position the device is powered via programming
connector from the programming device for optimal logic levels
 Two 4-way Sensor Connectors X7, X8 for meanly 16Bit analog application, function is
hardware configurable only
 Two 4-way Sensor Connectors X5, X6 for meanly digital application, function is hardware
configurable only
 SMA Reverse Antenna Connector for Wireless Sensor-Net Communication at 2.4GHz, or
Optional U.FL Connector
 Extended Memory with SPI Bus (Micro SD-Card with Card Holder or F-RAM / Flash
Memory), Power Down Switch
 Acceleration Sensor with programmable Trigger for Interrupt
 Two Power Switch with Current Limiter for analog / digital application and Sensor Connectors
 High Frequency Crystal
6.2.4 Sensor port restrictions
Some Ports of the optional digital application at the 16Bit analog part are shared with the Module
Connector X2 and the optional high frequency crystal. If the optional digital application is installed,
these ports cannot be used at the connector X2 and the high frequency crystal.
Rev. 2012-01-20
18/92
SMooHS
Figure 9. Principle sketch of the processor main board Rev. 3.1.
Rev. 2012-01-20
19/92
SMooHS
6.3 Programmer board, SmartPRG1 Rev. 2.2
The programmer board is made for programming and for downloading software to the processor
board SmartMCU1. It has a JTAG connector for a JTAG-Programmer and an USB connector for
downloading software via bootstrap loader. The USB connector can also be used for transmitting
data and commands with a PC. There are some signaling LED’s, a reset button, and two user
programmable buttons integrated.
With some modifications and an adapter this board is usable for the new processor board SmartWS,
but for JTAG only. A new version with more functionality for the new processor board SmartWS is
not developed.
Figure 10. Programmer board, Rev. 2.2
Figure 11. Adapter board and connection cable for the SmartWS board
6.4 Radio transceiver board for 2.4GHz ISM band, SmartRF1 Rev. 2.3
The radio transceiver board is made for the wireless communication at the 2.4GHz ISM band using
the Chipcon transceiver CC2420. The output power is about 0dBm and the receive sensitivity is
about -90dBm. It must be soldered directly to the processor board SmartMCU1 or the gateway
interface SmartGIF. The latest development version of the radio transceiver board is the SmartRFP1
Rev. 1.1 with a higher output power and a higher sensitivity. This version is also integrated in the
processor mainboard Rev 3.1
Rev. 2012-01-20
20/92
SMooHS
Figure 12. Radio transceiver board, Rev. 2.3
6.5 Radio transceiver board with front end for 2.4GHz ISM band,
SmartRFP1 Rev. 1.0
This radio transceiver board with amplifier is made for a higher output power for the wireless
communication at the 2.4GHz ISM band. It is using the Chipcon transceiver CC2520 and the front
end CC2590. The output power is max. 10dBm and the receive sensitivity is about -94dBm. It must
be soldered directly to the processor board SmartMCU1 or the gateway interface SmartGIF.
This board was developed for evaluation only. The finally version is the revision 1.1, but it was not
produced as single board. Moreover this version was integrated in the processor mainboard
SmartWS Rev. 3.1.
The Dimensions are 39 x 26.5 x 3 mm³, the weight is 4 g.
Figure 13. Radio transceiver board with front end, Rev. 1.0
6.6 Power supply, SmartDPS1 Rev. 2.3
The sensor node is primary powered by one or two Li-SOCl2 batteries with each 7.3 Ah @ 3.6 V.
This type of battery has a very long lifetime with only a small drop of voltage and capacity due to
ageing or temperature changes. The battery operates in the temperature range from -55°C to
+85°C; however the operation at temperatures different from ambient may lead to some capacity
reduction. The actual voltage of the battery and the current consumption can be monitored for
estimating the remaining lifetime of the sensor node. As secondary power supply one or two solar
cells (optimal voltage at MPP 5.2V to 6V) can be attached to the sensor node. The power provided
by the solar cell is regulated and stabilized by an electronic circuit to avoid power fluctuation that
could lead to miscellaneous behavior in terms of reliable data acquisition and analysis. The usage
of additional supercaps (high energy density capacitors 1.5F, 5V) allows for temporary powering
the sensor node only with the solar cell during daylight condition even if relatively high current is
Rev. 2012-01-20
21/92
SMooHS
needed, which might be the case during full operation of all node components. The power
regulation circuit provides a maximum power output of 150 mA at 3.3 V. As long as the capacitors
and the solar power module provide sufficient energy, the sensor node uses solar power. If the
voltage level falls below 3.4V, power supply is automatically switched to battery operation until the
solar cell has charged the supercaps to approximately 4.4V again.
With the batteries mentioned, the lifetime of a sensor node is estimated to be at least several
months or years. Note that the lifetime strongly depends on the type of embedded sensors, the
data acquisition and measurement rate, the processing effort and data transmission rate. For
achieving a long lifetime for the system, it is essential to run the sensor nodes in power down mode
most of the time.
It is possible to connect a plastic foil keyboard with low current LED’s to this board. All components
which are necessary to operate a keyboard (3 LED’s, RESET button and 2 function buttons) are
mounted on the board.
To reduce production costs the battery holders are now integrated into the processor mainboard
SmartWS Rev. 3.1.
The terminal pin assignment can be found in appendix 12.2.3.
Figure 14. Power supply board for battery power and solar power, Rev. 2.3.
6.7 Gateway Interface, SmartGIF Rev. 3.3
The SmartGIF (see Figure 15) is made for a wireless gateway for long-range wireless data transfer.
It is an interface adapter for the AarLogic Module C10/3 (Rev. 5) and the processor board
SmartMCU1. In a later software version the SmartMCU1 is not needed anymore and the radio
transceiver board SmartRF1 or SmartRFP1 is placed directly on board. The SmartGIF supports USB,
Ethernet, RS232 and JTAG. An optional interface board can be used for SPI, I2C, UART and RS
485. The USB host connectors are for low power devices only, the total current for both USB ports
is max. 200mA.
Rev. 2012-01-20
22/92
SMooHS
Figure 15. Gateway interface, Rev. 3.3
6.7.2











Features
Internal Serial CMOS COM/DEBUG Connector for Programming
Module Connectors
RS232 Connector with +/- 5V Driver
Optional internal Pin Connector for JTAG
Optional internal Pin-Connectors for small optional IO-Interface Board (GPIO, SPI, I2C,
UART, RS 485 ext. DC-Power)
Ethernet (10 Base-T connector with PoE, PoE is not isolated)
USB Host Connector for low Power Devices (max. 200mA)
Internal Pin Connector for second USB Host (max. 200mA)
USB Device Connector (no supply via USB)
Internal Pin-Connectors for 2 LED or 2 Ports
Multiple power supply options
• Internal Mains Voltage Converter 110V to 230V
• Optional: 12V to 24V application with Relay Driver 200mA active-low
• Optional: Internal Pin-Connector for external DC-Supply 12V to 48V
• Power over Ethernet (not isolated)
 Dimensions 160 x 100 x 20 mm³ (board without front connectors), 166 x 100 x 20 mm³
(board with front connectors)
 Weight 140 g to 160 g (depending on hardware configuration)
Rev. 2012-01-20
23/92
SMooHS
6.8 Multi-sensor board for strain gauges, vibration, temperature and
humidity, SmartSG Rev. 2.2
The multi-sensor board (see Figure 16) is primarily developed to support any type of sensors
requiring a Wheatstone bridge-type signal conditioning for an accurate measurement of changes of
electric resistance (e.g. piezo-resistive, ceramic-thick film or steel membrane based). Many
different sensors for the measurement of strain, stress, load, displacement, inclination, soil
pressure etc. can be attached to this signal conditioning board. With small changes in the
hardware setup also PT100 elements for temperature measurements could be used. The board
performs the digitalization of the sensor signals. It communicates with the processor board using
the I2C bus. The board is equipped with two ZMD31050 differential sensor signal conditioner
devices for operating two independent sensors simultaneously. The ZMD31050 is a CMOS
integrated circuit for highly accurate amplification and sensor-specific correction of bridge sensor
signals. The IC provides digital compensation of sensor offset, sensitivity, temperature drift and
non-linearity of an integrated 16-bit RISC micro controller running a correction algorithm with
coefficients stored in a non-volatile EEPROM (Electrically Erasable Programmable Read-Only
Memory). These coefficients can be programmed from the processor board, for example during a
calibration process. In addition, the IC can interface a separate temperature sensor.
Multi-Sensor Board
Sensor-Board Connector
Power
Power
Switch
PW INT I2C
Accelero
meter
GIO
I2C/SPI 0
PW
IO
EN
PW
I2C
HUM.
TEMP.
optional
I2C
ZMD 31050
ZMD 31050
Sensor-Connector 1
Sensor-Connector 2
Figure 16. Principle sketch of multi-sensor board, Rev. 2.2.
Because measuring with a Wheatstone-bridge circuit needs considerable power (power mainly
depends on the impedance of the used strain gauge), the signal conditioning board can be
switched off and on by an electronic switch that is controlled by the processor board via the GIO
interface. The bi-directional digital interface (I2C) is also used for simple software controlled oneshot calibration procedure, in order to program a set of calibration coefficients into the on-chip
EEPROM. Thus a specific sensor and the ZMD31050 are digitally connected.
For measuring air temperature and humidity, a MEMS sensor (SHT15 from Sensirion) that is
equipped with a digital interface could be connected to the multi-sensor board. The SHT15 digital
humidity and temperature sensor is a fully calibrated MEMS sensor that offers high precision and
excellent long-term stability. The digital technology integrates two sensors and readout circuitry on
one single chip.
Measuring time series with high sampling rates is energy consuming and also limited by the
system bandwidth and the storage capability. It is therefore advisable to sample a measurand only
Rev. 2012-01-20
24/92
SMooHS
when signals of interest are expected. This often means to sample signals only if a certain
amplitude threshold is exceeded. Especially in case of dynamic strain measurements, such an
event driven data acquisition is indispensible. Hence, a vibration detection mechanism/device was
developed, which enables power-consuming measurements only in case of vibration exceed
certain level.
The chosen solution is an acceleration sensor, SMB380 from Bosch Sensortec GmbH, Germany,
which features energy saving modes. The functional principle of the chosen vibration detection
solution is briefly described: The on-chip routines measure periodically the acceleration and detect
if a given threshold is exceeded. Then the SMB380 generates an interrupt to wake up the MSP430
µC and the ZMD chips and to start with predefined measurement routine.
For the setting of the SMB380's parameters, a software tools is available. Once an optimal setting
is found, it can be stored to the SMB380's EEPROM and is then fixed even without power. In the
“any motion” detection mode, which was tested and found to be suitable e.g. to detect trains
crossing a bridge, the sensor consumes just about 200µA, which guarantees long battery
operation.
Technical data can be found in appendix 12.1.2. The terminal pin assignment can be found in
appendix 12.2.4
Figure 17. Multi-sensor sensor board and temperature/humidity add-on sensor, Rev. 2.2.
6.8.2 Features
 Wheatstone bridge measurements (Pt-elements, strain gauges etc. using ¼-, ½- or fullWheatstone bridge)
 Software programmable (offset, gain etc.)
 Event detection using optional MEMS acceleration sensor
 Optional Temperature/Humidity Measurements
Rev. 2012-01-20
25/92
SMooHS
6.9 Sensor signal board with integrated multiplexer, SmartSSG Rev. 2.0
The sensor signal board, is made with the 16-bit zooming ADC SX8724 with integrated multiplexer.
The Inputs can be configured by hardware and software as two channel 16-bit differential analog
inputs or up to four channel single-ended analog inputs. It has a 2-wire serial interface. The
functionality is about the same then the multi-sensor board described in chapter 6.8. This board is
developed for test only and is, with some modifications, now integrated in the processor mainboard
SmartWS Rev. 3.1.
Figure 18. Sensor signal board, Rev. 2.0
Rev. 2012-01-20
26/92
SMooHS
6.10 Acceleration sensor board for piezo- and PVDF-sensors, Rev. 1.0
During a former research project (www.sustainablebridges.net), different kinds of acceleration
sensors were tested for evaluating their fitness for acoustic emission analysis. However, no
commercially available MEMS sensors fulfilled the requirement of acoustic emission analysis.
Especially their performance with respect to bandwidth, sensitivity, signal to noise ratio and/or
power consumption did not meet the requirements. Therefore, other sensors (piezo and PVDF) are
used for acoustic emission analysis or other higher frequency vibration analysis. For those
sensors, a signal conditioning board (acceleration sensor board) was designed and manufactured
that allows for an event-based data acquisition (see Figure 19).
The signal conditioning board for piezo- and PVDF-sensors is equipped with two amplifiers that
have a programmable gain (gain factor: 100, 1000), low pass filters and an analog trigger
(threshold) that is adjustable in 256 steps by the software running on the processor board. Each
acceleration sensor board has two independent analog channels for performing the signal
conditioning of the two sensors simultaneously. The analog trigger option, which could be used
before or after the analog filtering, allows for running the processor board in power down mode
most of the time. Only if relevant events occur and a certain threshold is exceeded, an interrupt is
initiated that could switch the processor board into working mode for a predefined time that can be
controlled by the microcontroller. The acceleration board itself needs about 800 µW in working
mode so a lifetime of several months up to years could be reached just working with a battery. A
low pass anti-aliasing filter is also implemented to meet the requirements of the analog to digital
conversion. The cut off frequency of the low pass filter can be adjusted to fit the selected sampling
rate.
The acceleration sensor board is not designed only for acoustic emission analysis usage. It can be
used as a signal conditioning board for vibration analysis, too. This can be achieved by just a few
changes in the low pass filtering module.
Figure 19. Principle sketch and picture of acceleration sensor board, Rev. 1.0.
Rev. 2012-01-20
27/92
SMooHS
6.11 Inclination and tilt sensor board, SmartInclino Rev. 2.0
The inclination and tilt sensor board (see Figure 20) is primarily developed to support an additional
external inclination sensor module, which is equipped with up to two VTI SCA830-D07 or similar
sensors for 1- or 2-axis inclination measurements. The inclination module, which is mounted on the
monitored surface of the structure, is connected to the sensor board via two cables, supplying the
module with electrical power and with a digital SPI interface for communication with the processor
board. The SCA830-D07 is a MEMS sensor that primarily contains the sensing element, a 16-bit
analog to digital converter, a temperature sensor for temperature compensation purposes, a nonvolatile memory, a SPI interface and some self-diagnostic features. The sensor module is
equipped with up to two SCA830-D07 sensors that are mounted orthogonally in the module to
ensure 2-axis measurements. Because the MEMS sensors need considerable power, the
inclination and tilt sensor board can be switched off and on by an electronic switch that is
controlled by the processor board via the GIO interface.
Additionally the sensor board is equipped with a Bosch SMB380 acceleration sensor for
acceleration measurements or motion detection. Furthermore for air temperature and humidity
measurements a Sensirion SHT15 sensor can be connected. The SMB380 and the SHT15
sensors are already explained in chapter 6.3.1.
appendix 12.2.5
6.11.2 Features




2-axis inclination measurements with high resolution
Software programmable
Event detection using optional MEMS acceleration sensor
Optional Temperature /Humidity Measurements
Figure 20. Principle sketch and picture of inclination and tilt-sensor board, Rev. 2.0.
Rev. 2012-01-20
28/92
SMooHS
6.12 Air velocity sensor board, SmartVAir Rev. 2.0
The air velocity sensor board (see Figure 21 and Figure 22) is primarily developed to support the
Omrom D6F-V03A1 MEMS flow sensor but actually any sensor equipped with a DC output in the
range of 0 to 3.6 V, a supply voltage of about 2.7 to 3.6 V and a supply current of less than 150 mA
may be connected. The D6F-V03A1 is able to measure air flow in the range of 0 to 3 m/s with an
accuracy of +/-10%. The analog to digital conversion is done by the internal A/D-converter of the
microprocessor with a resolution of 12 bit.
The second channel of the board is used for external temperature measurement with a PT100 or
other RTD sensor. It is equipped with the ZMD31050 differential sensor signal conditioner device,
which is already explained in chapter 6.3.1. With small changes in the hardware it is also possible
to connect any sensor based on a Wheatstone-bridge.
Because the two channels need considerable power, the air velocity sensor board can be switched
off and on by an electronic switch that is controlled by the processor board via the GIO interface.
Additionally, the sensor board is equipped with a Bosch SMB380 acceleration sensor for
acceleration measurements or motion detection. For air temperature and humidity measurements,
a Sensirion SHT15 sensor can be connected. The SMB380 and the SHT15 sensors are already
explained in chapter 6.8.1.
appendix 12.2.6.
Figure 21. Principle sketch of the air velocity sensor adaptation board, Rev. 2.0
6.12.2 Features
 Measurement of the air velocity on channel 1 (or other sensors with DC output)
 Wheatstone bridge measurements on channel 2 (Pt-elements, strain gauges etc. using ¼-,
½- or full- Wheatstone bridge)
 Channel 2 software programmable (offset, gain etc.)
 Event detection using optional MEMS acceleration sensor
 Optional Temperature /Humidity Measurements
Rev. 2012-01-20
29/92
SMooHS
Figure 22. Air velocity sensor board with flow sensor, Rev. 2.0
6.13 Impedance converter board system for electrochemical analysis
and impedance spectroscopy, SmartIMP Rev. 2.0
The impedance converter board (see Figure 23 and Figure 24) is primarily developed for
electrochemical analysis and impedance spectroscopy at historical or modern structures. The
board performs the excitation, measurement and digitalization of external impedance connected to
the board via two electrodes. It communicates with the processor board using the I2C bus. The
main item on the board is the Analog Devices AD5933 integrated circuit. The AD5933 is a high
precision impedance converter system, which combines a programmable frequency generator with
a 12 bit 1 MSPS analog-to-digital converter and a DSP engine. For each output frequency, a real
and an imaginary data word is calculated. Furthermore a temperature sensor for temperature
compensation purposes and an I2C interface are integrated on the chip.
To measure impedance below 1 kOhm an external buffer is required and for output frequencies
below 1 kHz an external programmable clock generator can be used, both are already
implemented on the board.
Because the integrated circuits need considerable power, the impedance converter board can be
switched off and on by an electronic switch that is controlled by the processor board via the GIO
interface.
equipped with a digital interface can be connected to the multi-sensor board. The SHT15 sensor is
already explained in chapter 6.8.1.
appendix 12.2.7
The further development version of the impedance converter board is the Rev. 2.4 with integrated
multiplexer.
6.13.2 Features
 1 MSPS 12 bit impedance converter system
 Software programmable (frequency sweep, excitation, gain etc.)
 Optional Temperature /Humidity Measurements
Rev. 2012-01-20
30/92
SMooHS
Impedance Converter Board
Sensor-Board Connector
Power
2
GIO I C/SPI 0
Power
Switch
PW
I2 C
PW
HUM.
TEMP.
ADC
EN
IO
PW
Freq.
Divider
IO
I2C
AD 5933
Buffer
optional
Sensor-Connector 2
Sensor-Connector 1
Figure 23. Principle sketch of the impedance converter board, Rev. 2.0
Figure 24. Impedance converter board, Rev 2.0
6.14 Impedance converter board with 6-channel multiplexer for
electrochemical analysis and impedance spectroscopy, SmartIMP
Rev. 2.4
The SmartMP board (see Figure 26 and Figure 25) is a measurement system for 2-wire impedance
measurements. The main application is the electrochemical impedance analysis especially to
determine the solution resistance of materials with electrolytic behavior like moist and/or chloride
contaminated sandstones. As the temperature of the specimen has a major influence on the
measuring results there are six channels added for external temperature and/or humidity
measurements with I2C sensors directly at the measuring point. The board is designed for wireless
applications and has been adapted to the SmartMCU1 board or the SmartWS board. Additionally to
the six external impedance channels there are two internal impedance channels connected to two
onboard reference resistors for self check, on board calibration and temperature compensation.
There is also one additionally internal temperature channel connected to an onboard temperature
sensor. It is possible to use this board in a temperature range of -25°C to 85°C. The inputs are six
10-pole ZIF sockets that fit to the external flexible sensor board for impedance measuring. For
different cabling e.g. coaxial cables there are alternatively solder connectors for the impedance
Rev. 2012-01-20
31/92
SMooHS
channels. Two power switches are used to switch the impedance part, the temperature part or the
whole board independently on or off. Thereby power consumption and interferences can be
minimized, because the temperature part can be switched off during an impedance measurement.
Technical data can be found in appendix 12.1.6.
Figure 25. Impedance converter board front and back, Rev. 2.4.
6.14.2 Features
 8-Channel impedance multiplexer with 6 external channels and 2 internal channels
 8-Channel I2C multiplexer for 6 external temperature/humidity I2C sensors and 1 internal
channel
 Frequency range 10 Hz … 100 kHz
 Impedance range 0 … > 10 MOhm
 2 gain resistors (1kOhm, 100 kOhm)
 2 internal reference resistors (1kOhm, 100 kOhm) corresponding to the gain resistors
 1 internal temperature sensor
 2 power down modes
 Operating voltage 3.0 to 3.6V
 Dimensions 53.2 x 77 x 11 14 mm3
 Weight 25 g
6.14.3 Versions
Rev. 2.0: First version, binary clock divider for main clock generation, 1 impedance channel, 1 gain
resistor, internal temperature and humidity sensor as an option, buffer, 1 power switch, 2 Binder
connectors, dimension 38 x 53.5 mm.
Rev. 2.1: Multiplexer for 6 external impedance channels and 2 internal channels, 2 onboard
reference resistors, 2 range resistors, internal temperature sensor STDS75 on board, I2C interface
for external temperature or other I2C sensors, dimensions 77 x 53 mm, 3 Binder connector for
impedance, 1 Binder connector for external I2C sensors.
Rev. 2.2: Not released.
Rev. 2.3: Binary clock divider replaced by DDS (direct digital synthesizer) with XTAL oscillator and
Schmitt trigger, additional I2C multiplexer for external temperature and humidity sensors, Binder
connectors replaced by ZIF connectors and solder connectors, two power switches, internal I2C
interface modified, socket for internal temperature/humidity sensor board removed, internal
temperature sensor changed to TMP102.
Rev. 2.4: Internal 1 kOhm resistor added to extend measurement range down to 0 Ohms, some
minor changes in hardware and layout.
Rev. 2012-01-20
32/92
SMooHS
6-Channel Impedance Analyzer Rev. 2.4
Sensor Module Connector 2
GIO/ADC
Power
GIO
GIO
GIO/ADC
Power
Power On/Off
On/Off Power
Power Switch
Power Switch
100mA limited
TPS22942
Power out
100mA limited
TPS22942
Power out
PWR
Out
Schmitt
Trigger
PWR
In
Out
Ser.
DDS
AD9834
CS
PWR
In
Oscillator
50MHz
Frequency generation by
Direct Digital Synthesis
2
PWR I C
Range
Clock
Impedance Analyzer
AD5933
- Output Driver
- Range Select
PWR
EN
Addr.
Vout
Vin
In
Out
2x8-Channel Analog Multiplexer
6xOut
2xOut
2xIn
6xIn
Ser./I2C
PWR
8-Channel I2C-Multiplexer
6xSer./I2C
Reference
Resistors
1xSer.
Ser. PWR
Temp.
TMP102
6 x Solder Connector
6 x ZIF - Connector
Glossary
(Bold)
More then one Line
Main Power, unregulated
Digital Signal
Analog Signal
Other Ports / Functions
Figure 26. Principle sketch of the impedance converter board, Rev. 2.4
Rev. 2012-01-20
33/92
SMooHS
6.15 Electrometer with external multiplexer, SmartE-Meter Rev. 2.0
The electrometer board (see Figure 28 and Figure 27) is primarily developed to measure potential
differences caused by electrochemical cells with very high internal resistance. Therefore the
electrometer board must have an extremely high input resistance. This is ensured by using at the
input circuit of the board an operational amplifier with a very low bias current. The LMP7721 made
by National Semiconductor that is used here has a typical bias current of only 3 fA at ambient
temperature.
The board acts as an impedance converter and level shifter with extremely high input impedance
and low output impedance. The signal at the output of the board is digitized by the 12 bit analog-todigital converter of the microprocessor. There are three charge pumps on the board to supply the
operational amplifiers and the multiplexer with the required supply voltages.
An additional relay multiplexer extends the numbers of input channel from one to eight. The eight
inputs of the multiplexer can be switched via the I2C bus sequentially to the input of the
electrometer board.
equipped with a digital interface can be connected to the multi-sensor board. The SHT15 sensor is
already explained in chapter 6.8.1.
The further development version of the electrometer board is the SmartEMT Rev. 2.4 with integrated
multiplexer and a lower operating current. The board is smaller, the gain is selectable (x1, x10), the
bias input current is adjustable, and the offset voltage is measurable for offsetting the
measurement. It has a lower output noise and the response time is faster.
appendix 12.2.8.
Figure 27. Electrometer board and multiplexer, Rev. 2.0
6.15.2 Features
 Extremely high input resistance of 100 GOhm
 Eight software selectable input channels with additional multiplexer
 Optional Temperature/Humidity measurements
Rev. 2012-01-20
34/92
SMooHS
Figure 28. Principle sketch of the electrometer board and multiplexer, Rev. 2.0
6.16 Electrometer with integrated multiplexer, SmartEMT Rev. 2.4
The SmartEMT board (see Figure 30 and Figure 29) is an 8-channel analog electrometer for
measuring potentials with high impedances. It is designed for wireless applications and has been
adapted to the SmartMCU1 board (prepare the hardware for VRef-input) or the SmartWS board. The
measurement output VOut and the reference voltage output VRef are prepared for the MSP430 12-bit
DAC input and the VRef input. The VOut is shifted to 1.25V = VRef / 2 (this equates 0V at the input VIn)
and all values are divided by 2. It is possible to measure the own offset voltage for offsetting the
measurement. The bias voltage, resulting of the leakage current at the input of the input-amplifier,
can be measured and adjusted at the input resistor. Therefor it is possible to use this board in a
temperature range of -25°C to 85°C. The inputs are solder contacts for PTFE coaxial cable
RG316/U. The input area is guarded as far as possible to neutralize the isolating resistances of the
board and the relays,. A simple low pass filter against high frequency noise is built-in.
Technical data can be found in appendix 12.1.8. A drawing with functional areas and connectors
can be found in appendix 12.2.9
Rev. 2012-01-20
35/92
SMooHS
Figure 29. Electrometer board, Rev. 2.4
6.16.2 Features











8-Channel Multiplexer integrated
Input Range max. -2.5V to 1.7V
Selectable Gain (x1, x10)
Input resistance 100GΩ
Input bias current adjustable
Measurable offset voltage for offsetting the measurement
Power Down Mode
Low Pass Filter against high frequency noise
Operating Voltage 3.0 to 3.6V
Dimensions 85.3 x 77 x 11 to 14 mm3 (height depending on module connector type)
Weight 40 g
6.16.3 Remark to Shielding
It is necessary to use this module in a shielded case. In combination with the microcontroller board
SmartMCU1 and the supply board SmartDPS1 the ground connection to the case is done at the
SmartDPS1 module. There are two 0Ω-bridges soldered at the fixing holes to GND. Leave the
ground selector areas at the SmartEMT module open. If this module is used with the SmartWS
mainboard, it is recommended to solder one or two 0Ω-bridges at the ground selector area to
contact the fixing holes. In this case you can select between ground (GND) and analog ground
(see Figure 59 at chapter 12.2.9). Normally GND is used.
6.16.4 Versions
Rev. 2.0: First version, Electrometer and Scanner are separate. Both boards are modified.
Rev. 2.1: Not made.
Rev. 2.2: New Scanner with Guard Relays implemented into Electrometer board. Modifications
implemented.
Rev. 2.3: Some hardware errors solved. Some devices changed for lower power consumption. I2C
coded relay driver changed to 3 bit binary code relay driver.
Rev. 2012-01-20
36/92
SMooHS
Rev. 2.4: Mechanical problems solved. Guard Relays removed. Design changed for lower power
consumption, higher isolating resistance between strip lines. Reference Voltage used from DAC for
higher accuracy. smaller board dimensions.
8-Channel Electrometer Rev. 2.4
GIO
Power
On/Off
VREF in/out
GIO/ADC
GIO
Power
Power Switch
Power out
Power
Voltage Regulators
Inverter
+2.8V
+2.7V
-2.7V
+PWR
-PWR
Gain
High Imp. Amp.
LMP7721
- Gain Select x1/x10+LPF
- Guard Driver
Guard
+PWR -PWR
In
Out
Out
Level Shifter
Low-Pass Filter
VREF In
In
-PWR
+PWR Level
PWR
Driver
EN
Shifter
Voltage Divider
GND Relay
Bias Adj.
(Offset detect)
In
VREF In
100GΩ
+PWR
Out
VREF Out
16 bit DAC
PWR
EN
DAC8560
Decoder
CS
Ser In.
3 to 8 Line
Address
Out
Out
In
Driver
PWR
Sel.
8 – Channel Relay Multiplexer
8xIn
8 x Solder Connector for Coaxial Cable
Glossary
(Bold)
More then one Line
Main Power, unregulated
Reference Voltage
Positive Powersupply, regulated
Negative Powersupply, regulated
Digital Signal
Analog Signal
Other Ports / Functions
Figure 30. Principle sketch of the electrometer board, Rev. 2.4
Rev. 2012-01-20
37/92
SMooHS
6.17 Integrated sensors
This chapter gives an overview of realized sensor boards. An overview of sensors with short data
is given in the Report: D3.3 Sensors and Sensor adaption
6.17.1 Internal humidity and temperature sensor board, SmartTemp1, Rev. 2.2
This board is made for sensor boards with an internal extension connector. It could be connected
at the front of the sensor board in a right angle. In this way it is possible to measure humidity and
temperature at the front side of the housing. The Filter Cap (SF1 from Sensirion) protects the
sensor against dust, water immersion and consequent condensation, as well as against
contamination by particles. The sensor is the SHT15 from Sensirion with a two-wire serial
interface. It has low power consumption and supports sleep mode. The dimensions are 17.6 x 11.5
x 9.5 mm without filter cap.
Figure 31. Internal humidity and temperature sensor board,SmartTemp1 Rev. 2.2
6.17.2 Internal humidity and temperature sensor board with dual LED, SmartHT1, Rev.
3.0
This board is made for the processor mainboard SmartWS and could be soldered at the front side of
the processor board. The board is the same as the SmartTemp1 explained in chapter 6.17.1, but it
has additional a dual signal LED (red, green). The dimensions are 17 x 12.2 x 4 mm3 without filter
cap.
Figure 32. Internal humidity and temperature sensor board with dual LED, SmartHT1 Rev. 3.0
Rev. 2012-01-20
38/92
SMooHS
6.17.3 Internal humidity and temperature sensor board with dual LED, SmartHT2, Rev.
3.0
This board is the same as the SmartHT1 explained in chapter 6.17.2, but the sensors are the SHT21
or SHT25 with I2C interface from Sensirion. The SHT21 is cheaper than the SHT15 but has a lower
accuracy. The SHT25 is more expensive than the SHT15 but has a higher accuracy. The
dimensions are 17 x 12.2 x 3.5 mm3 without filter cap.
Figure 33. Internal humidity and temperature sensor board with dual LED, SmartHT2 Rev. 3.0
6.17.4 External humidity and temperature sensor board, SmartHT3, Rev. 2.0
This board is made for external applications. On the back side there are solder connectors for
cable. On the top side are two solder pads for additional pull up resistors. It is the same as the
SmartHT2 without LED explained in chapter 6.17.3. The sensor board fits into the filter cap 12 mm x
23 mm with an inner diameter of 9 mm from Hygrosens. It is also possible to use the filter cap SF2
from Sensirion. The cap has to be fixed with gum. The dimensions are 13 x 8 x 2.8 mm without
filter cap.
Figure 34. External humidity and temperature sensor board, SmartHT3 Rev. 2.0 and filter cap from
Hygrosens and Sensirion.
Rev. 2012-01-20
39/92
SMooHS
6.17.5 External ambient light photo sensor board, SmartLGT3, Rev. 1.0
This sensor board has a digital light photo sensor APDS-9301 from Avago Technologies
integrated. The photo sensor has an I2C interface and three addresses. On the top side are two
solder pads for additional pull up resistors. At the back side are the solder connectors for cable and
two solder pads for selecting one of the three slave addresses. The dimensions are 13 x 8 x 2.8
mm3.
Figure 35. External ambient light photo sensor board, SmartLGT3 Rev. 1.0 and address list
6.17.6 External magnetic field sensor board, SmartMF1, Rev. 1.0
This sensor board is made to detect if there is a window or a door open in rooms with special
climatic. The sensor is an ultrasensitive, pole independent Hall-effect switch (A3212 from Allegro).
At the back side are the solder connectors for cable. The sensor has an open collector output,
therefore it is necessary to use a pull up resistor. In this picture the resistor is placed on board. The
dimensions are 13 x 8 x 2.8 mm.
Figure 36. External magnetic field sensor board, SmartMF1 Rev. 1.0
6.17.7 External passive infrared sensor board, SmartPIR1, Rev. 1.0
This sensor board is made for the Panasonic digital sensor series AMNxxxxx. These sensors
detect changes in the thermal radiation, e.g. moving objects or people. The complete signal
processing is in the sensor integrated. The output signal is a digital trigger signal. The sensor has
an open source output; therefore it is necessary to use a pull down resistor. The solder pad for this
resistor is on the top side. At the back side are the solder connectors for cable. The dimensions are
20.7 x 11.2 x 16.1 to 20.2 mm (depending on sensor type).
Figure 37. External passive infrared sensor board, SmartPIR1 Rev. 1.0
Rev. 2012-01-20
40/92
SMooHS
6.17.8 External temperature sensor board, SmartTMP1, Rev. 1.0
This sensor board is made for temperature measuring inside of objects. The sensor is the TMP102
from Texas Instruments with a two-wire serial interface and four addresses. The solder pads for
the address selection are at the top side. The board has on both side solder connectors for cable.
The dimensions are 43 x 8 x 2 mm.
Figure 38. External temperature sensor board, Smart TMP1 Rev. 1.0 and address overview
6.17.9 External flexible sensor board for impedance measuring, Rev. 2.4
This sensor board has two connectors for probes (e.g. conductive rubber) to measure impedances
in stone. A sensor SHT21 from Sensirion is placed to get the actual humidity and temperature. The
sensor board is made slight and flexible, because it will be placed in drilled holes of stone. To get
measurement values in different deepness some boards will be stacked together with a little
displacement. The flex board could be connected into the ZIF sockets of the impedance converter
board SmartIMP Rev. 2.4 (see the principle in Figure 40). The dimensions are 77 x 53,3 x 0.1 mm3
without sensor and 1.4 mm with sensor.
Figure 39. External flexible sensor board for impedance measuring, Rev. 2.4
Rev. 2012-01-20
41/92
SMooHS
Figure 40. Principle of measuring impedances in stone
6.17.1 External sensor board for surface impedance measuring
This sensor boards are made for the impedance measuring on the surface of stone. There can be
placed probes (e.g. spring contact or conductive rubber) in different displacement. The sensor
board could be connected via cable or coaxial cable to the impedance converter board SmartIMP.
Figure 41. External sensor boards without and with conductive rubber
Rev. 2012-01-20
42/92
SMooHS
6.17.2 External potential sensors
These sensors are made for measuring potentials in stone. The electrodes are consisting of
AgAgCl. The sensors could be connected to the electrometer board SmartEMT. The sensors and a
test assembly are shown in Figure 42.
Figure 42. Potential sensors and test assembly
6.17.3 Test board for UV radiation and light
This board is made for testing some light and UV radiation sensors. A separate UV radiation
sensor board is not made.
Figure 43. Test board for UV radiation and light
Rev. 2012-01-20
43/92
SMooHS
7 Wireless Gateway SmartGateWS Rev. 3.3
7.1 Product Description
The SmartGateWS is a stand-alone gateway that provides long-distance data-transfer per
GSM/GPRS-Modem from the monitoring site to the end-user. The gateway is designed to
withstand harsh environments and multiple power supply options guarantee its worldwide
application. To allow for fully autonomous operation in applications where no electric power is
available, the SmartGateWS could be equipped with solar cells and secondary batteries. The
SmartGateWS supports USB, Ethernet, RS232 and optionally SPI, I2C, UART, RS 485 (additional
interface board). The integrated IEEE 802.15.4-compliant radio bridges the wireless sensor
network to local wire line infrastructure or even wireless to the internet.
Technical data can be found in appendix 12.1.9
Figure 44. SmartGateWS, Rev. 3.3 and connector side
7.2 Main Specifications/Features













GSM/GPRS Module GE863-PRO³, QUAD-BAND
GPS Module 3M (SiRF 3/LP)
CPU ARM 9 integrated (200 MIPS) (Core AT91SAM9260)
64 MB RAM for applications
Nonvolatile data flash 4 MB (up to 128MB onboard)
Data flash extension SD card or MMC card
2.4 GHz transceiver for wireless sensor network data transmission
Interfaces Serial CMOS and +/- 5V driver, JTAG, Ethernet (10 Base-T connector with PoE)
USB, I2C, SPI, GPIO
SIM Holder onboard
Multiple power supply options
• Internal Mains Voltage Converter 110V to 230V
• Optional: 12V to 24V application with Relay Driver 200mA active-low
• Optional: Internal Pin-Connector for external DC-Supply 12V to 48V
• Power over Ethernet (not isolated)
Embedded Linux onboard (as default, Kernel 2.6.x)
Dimensions 250 x 154 x 38 mm³ (in case)
Weight 1.2 kg (in IP 65 case)
Rev. 2012-01-20
44/92
SMooHS
7.3 Peripherals












USB Host Connector (max. 200mA)
Internal second USB Host Pin-Connector (max. 200mA)
USB Device Connector (no supply via USB)
Sub-D 9pin Connector RS232 (DCE), 2 and 4 Wire Communication, configurable for
programming / debugging
Internal Pin-Connector for programming / debugging (C-MOS 3.1V)
Internal Pin-Connectors for 2 LED or 2 Ports
Optional: Internal Pin-Connector for JTAG
Optional: Internal Pin-Connectors for small optional IO-Interface Board (GPIO, SPI, I2C,
UART, RS 485 ext. DC-Power)
SMA Reverse Antenna Connector for Wireless Sensor-Net Communication at 2.4GHz
SMA Antenna Connector for GSM: GSM-850 / 900 Class 4, DCS–1800 / PCS–1900 Class 1
U.FL Connector for GPS (internal)
Real Time Clock
Rev. 2012-01-20
45/92
SMooHS
8 Structural health monitoring software
8.1 Principal structure of the SHM system software
To operate the WSN, a complex but flexible architecture of software components has been coded,
which interact to form the WSN. To each of the hardware components, as described in chapter 6,
belongs a software component that operates this component. A block diagram of the software
system is shown in Figure 45. The measurement nodes (Smartmotes) are the core of the system.
The Smartmotes run two components: the sensor node boot loader (Wboot) and the sensor node
application software, called Miranda. For details on this software, refer to chapters 8.2.2 and 8.2.3.
The Smartswitch is an optional system unit, which is not necessary for small-scaled deployments.
The software component Uranus, running on the Smartswitch, is therefore postponed.
The Smartgate is the central node in the WSN and offers base station functionality. It is composed
of the Starcatcher application, which receives the radio messages from all the Smartmotes and
forwards them to the Jupiter application. Starcatcher can be seen as the radio interface component
of the Jupiter application. Jupiter is a component that manages the WSN. Command messages
can be injected into the network and also data can be displayed. The Callisto application is optional
and is used for on-site-interaction with the object.
„wboot“
Bootloader
2.4GHz
„miranda“
Application (Data
Acquisition, Data
analysis)
SmartswitchWS
SmartgateWS
„starcatcher“
Serial forwarder
„callisto“
On-Site control
„uranus“
Forwarder
2.4GHz
SmartmoteWS
SmartswitchWS
LAN/WLAN
SmartserverWS
„mars“
SQL interpreter
(PHP-Skript)
GPRS/UMTS
LAN/WLAN
„jupiter“
Forwarder
„starcatcher“
Serial forwarder
„galaxy“
MySQL Data Base
VI-Server (Labview-Vis)
SmartmoteWS
SQL interpreter
Data analysis
toolbox
SmartgateWS
„planemos“
Application builder
miranda:
mir_shtup, mir_DMS
SmartserverWS
Figure 45: Principle sketch of the SHM system software components including name conventions.
The Smartserver is a hardware unit which is detached from the rest of the WSN. For details refer to
the system description in chapter 4. A software component called Mars receives the data from the
WSN and inserts the data into a database (Galaxy). The VI-Server, running National Instruments
Rev. 2012-01-20
46/92
SMooHS
LabVIEW, handles the requests for online visualization of the data. The requests to these
visualization tools originate from a web server, which is not shown in this sketch. The application
builder software (Planemos) handles the update process of the sensor nodes with Miranda
applications.
8.2 Sensor network and data transfer software
8.2.1 Sensor network protocol
The individual nodes erect a wireless sensor network by exchanging radio messages with their
neighbors or with the base station. The protocol that regulates the interchange of messages is a
customized protocol, implemented by TTI. To simplify matters and moreover to make the protocol
as power-saving as possible, a routing-free direct-path transmission, request-based protocol was
devised which establishes a star topology. The routing-free direct-path transmission can be
substituted by a multi-hop subsystem for large-scale deployments, where the forwarding of data
from several star networks by Smartswitches would be uneconomic and a tree topology is
desirable.
The protocol realizes a low payload overhead for common tasks (~ 50 % less than ZigBee) which
results to minimum power consumption (again ~ 50 % less than ZigBee). This is realized by 1) an
early split between Wboot and Miranda data on a very low level, and 2) an acknowledge-requestbased-only transmission. This means that requests for sending a command can be sent to the
network nodes only with the acknowledgement of another message that has been sent before.
8.2.2 Wboot – Sensor node boot loader
The sensor boot loader can be seen as the operating system of the sensor nodes. It provides a
common interface for basic radio transmission routines to the application software (refer to chapter
8.2.3). Furthermore, it provides support functions like a sleep timer, enabling the application to
power down to a low-power mode during inactive periods, and read/write accesses routines for the
microcontroller flash memory.
The operation of the boot loader (and of the application software) is supervised by a watchdog.
The watchdog resets the software to an initial state, if it is not responding any more. This is a
fallback safety feature, avoiding the "loss", i.e. the non-responsiveness, of a sensor node. The
watchdog is automatically configured and cleared periodically by the boot loader.
The boot loader is also capable of loading software updates into the node. In this mode, the
software update is transmitted wirelessly to the node and flashed into the internal memory. A CRC
check is provided to guarantee the error-free transmission of the software package. It is even
possible to auto-start the application when the CRC check is valid. This update feature is usually
used to load newer version of the Miranda software, however, it is even possible to install a new
boot loader over the air.
8.2.3 Miranda – sensor node application software
The Miranda packages represent the application software, which is specific to the signal adaptation
board (refer to chapter 6), which is build into a specific node. In general, this software component
handles the data acquisition, data format conversion and data analysis. It can also store data to
additional flash memory, if the node is equipped like that.
Data acquisition is done by either using the microcontroller's internal analog-to-digital converter or
specialized measurement hardware on the signal conditioning board. The software accomplishing
this task is therefore as diverse as the underlying hardware. The general program flow, however, is
common to all Miranda applications. Firstly, the data is acquired from the hardware, then data is
converted to a common format, post-processed (optional) and then sent to the SmartgateWS base
Rev. 2012-01-20
47/92
SMooHS
station, using the Wboot radio driver. Afterwards, the sensor node is set to a sleep mode, to save
energy. After the measurement interval has expired, the whole measurement cycle starts over.
Be referred to Table 3 in chapter 9 for details on the status of availability of the Miranda application
software packages.
8.2.4 Starcatcher – radio to serial forwarder
The Starcatcher software is software running on a SmartmoteWS that is directly connected to USBPort of a SmartswitchWS or a SmartgateWS. It is designed to provide a reliable connection between
the SmartmotesWS and the SmartswitchWS or SmartgateWS units. This application can be seen as
the radio interface of the Jupiter application. Its coupling with the Jupiter package is therefore tight.
Its task is to forward data from the nodes to the Uranus or Jupiter application, and to forward
command is opposite direction from Uranus or Jupiter to the network. Additionally, the sending of
software update to the nodes is done by this component.
8.2.5 Uranus – forwarder
The Uranus software is a stripped-down version of the Jupiter software. It is designed for use in
multi-star networks in large deployments. It communicates with the mars component to put data
into the Galaxy data base.
The Uranus component is running on a Linux system or an embedded Linux system.
8.2.6
Jupiter – base station and forwarder
The Jupiter software is basically similar to the Uranus software but has some advanced features. It
supports UMTS/GPRS modem support for wide area mobile network connections and provides a
data interface for the Callisto software.
The Uranus component is running on a Linux system or an embedded Linux system.
8.2.7
Callisto – on-site control
Callisto is the software package that provides direct on-site control. This can be used for
immediate interaction with the object under observation. For example in a church where the air
humidity is monitored, the on-site control component could provide an interface to a acclimatization
appliance, or even only a window-opening control system, to reduce the humidity by ventilation or
heating under certain conditions. This software is still under evaluation and not finished yet.
8.3 Data storage
8.3.1 Galaxy – SQL data base
Galaxy is the link between the nodes and the user interface. Nodes and user interface never talk to
each other directly; moreover, they always use the Galaxy as a link. That guaranties a common
interface and the possibility to use more than one user interface. It also cares for all the
synchronization and data storage.
8.3.2 Data Base Overview
The database layout is designed to allow both a quick insertion of new data items into the structure
and a quick retrieval of information items for further processing, analysis and visualization. Galaxy
is a relational database with tables as shown in Figure 46.
For more details on the database layout, refer to chapter 12.3.
Rev. 2012-01-20
48/92
SMooHS
Figure 46: Data base structure: each square stands for one table
8.3.3 Mars – SQL interpreter
The Mars software is written in PHP. On the one hand, it is used to load data into the galaxy data
base. For security reasons direct SQL access is not permitted. On the other hand, simple PHP
scripts readout the database and print it in simple HTML sites for client access. The scripts are
simple and for debugging only.
8.4 Data analysis
After raw data is gathered with the above described system, the data has to be analyzed regarding
the sought-after information and to reduce the amount of data. These goals are achieved by a twostep analysis procedure. First, some basic data filtering and reduction is done within the motes
themselves, e.g. by using hardware filter components to disregard noise or by averaging of data.
Then, in a second step after the transmission and storage, the data can be post-processed and
analyzed in depth.
8.4.1 In-mote data analysis
In wireless sensor networks, low power consumption is of utmost importance. Of the factors that
account for the most power consumption in wireless sensor nodes, radio transmission is on the
first ranks. Current drain is linear with the time a sensor needs to transmit data. This is also true for
mote processing power; however, data processing of one byte is less costly – in the sense of
power consumption – than the radio transmission of one byte. It is hence in our interest to reduce
transmission times as much as possible. Preprocessing of data – so called in-mote data analysis –
can be used to reduce the acquired data to useable information. The principles used for this,
comprise standard approaches from information theory, like compression by differencing
(transmission of deltas only) but include also more complex analysis that are application specific.
An example for such an analysis is the analysis of vibration time series to retrieve the natural
frequencies.
At present, no reduction routines are implemented in-mote. Transmission of deltas-only is a first
step, which will be implemented during the next timeframe.
Rev. 2012-01-20
49/92
SMooHS
8.4.2 Database analysis
The database analysis is controlled by the individual user, who requests a data analysis via a web
server user interface (cf. Figure 47). The web server does not handle the request on its own, but
forwards it to the analysis server running National Instruments LabVIEW. This server retrieves the
data to analyze from the database server (which coincides with the web server in this architecture).
The data is then accordingly analyzed and the analysis results are returned as Portable Network
Graphics (png) via the web server to the client web browser.
1. Request analysis
via web interface
5. Send html
and graphics
Customers
Web server
(public access)
Database server
(local access only)
2. Request analysis
3. Retrieve data
4. Return analysis results
LabVIEW analysis server
(local access only)
Figure 47. Database analysis architecture
The modular database analysis architecture was chosen to guarantee a stability of the entire
system while maintaining a high flexibility and to ensure maximum data integrity on the database
server by limiting the required access from the analysis and web servers to read-only. The use of a
LabVIEW analysis server allows the easy implementation of a considerably large ready-to-use data
analysis toolbox.
Figure 48. LabVIEW analysis server code
Rev. 2012-01-20
50/92
SMooHS
In a first step, the interfaces between the four members of the analysis server architecture, as well
as the graphical display of the raw data were implemented. On this basis, the architecture was
then successively extended. The LabVIEW analysis server main code is shown in Figure 48. Two
different general analysis functions are supported by the code that return different outputs to the
user:
 <<diagram>> shows discrete data points from one or more sensors and up to two sensor
types over a selected period of time. This is for example used to display a graph of the
temperature and humidity development over time.
 <<current data>> returns a time-specific measurement series of one or more sensors. A
typical task would be to display a transient vibration signal or a graph of the electrical
impedance vs. the measurement frequencies. If no specific time is specified, the latest
recorded measurement value is returned.
Further analysis can easily be implemented in the code that can be accessed by adding another
option in the html request. The graphical overview of the measurement data collected at
Johanniskirche in Schwäbisch Gmünd (Figure 51) is an example for such an extension. Here,
additional to the fundamental database readout, a dew point calculation is carried out with the
available data, giving advice to the owner whether to open or to close the windows and doors to
avoid condensation on the building envelope.
8.5 User interfaces
8.5.1 Administration software tools
For operation and maintenance (O&M) of the wireless sensor network, technical tools have been
developed that allow a technically adept administrator to configure the network in respect to
measurement tasks, networking parameters and general system settings.
S: 30 SM_TEMP id: 76 temp: 26.70
S: 30 SM_TEMP id: 77 temp: 26.70
S: 2c SHT15 5: 24.48 36.79
S: 30 SHT15
22.33 26.28
S: 2c SM_AIRFLOW id:
6:
0.00 m/s
0
S: 31 SHT15 5: 22.36 24.35
sn 98
L: Set Cmd Node: 98
S: 98 SM_VOLTAGE id: 34 Voltage: 1511.6 mV
S: 98 SM_VOLTAGE id:
0 Voltage: 1512.8 mV
load emeterapp.bin
.. ..loading .. ..
Figure 49: Example trace of administration tool
The administration is considered to be done via a web interface. Having in mind the complexity of
the administration and allowing for the current development phase where progress is fast and
software still changes rapidly, the O&M is done with specialized tools.
Rev. 2012-01-20
51/92
SMooHS
8.5.2 Data readout software tools
Apart from the administrative tools that have been implemented to operate and maintain the
wireless sensor network, the data readout software tools are designed to bring the customer an
easy-to-use and easy-to-understand graphical user interface for data readout and visualization.
The data visualization and data retrieval have been decided to be implemented as a set of onlinetools.
For each project, the customer gets a web page as a starting point. See Figure 50 for an example.
Here, the user rights management is handled and links to the individual retrieval, visualization and
analysis tools are offered.
Figure 51 depicts exemplarily a data visualization tools for temperature and humidity values on a
medieval church in southwest Germany. Temperature and humidity are shown at the exact places
where the sensors are installed in the church. By using this tool, a quick impression of the
measurement values can be obtained.
Figure 50: Web-interface start page, with the offered retrieval and visualization tools circled in red
Rev. 2012-01-20
52/92
SMooHS
Figure 51: Data visualization of temperature and humidity data of a church in Germany
8.5.3 Data export software tools
As mentioned in chapter 8.5.2, data retrieval can be triggered by another online tool. This tool
offers the download of information stored in the data base. Parameters include the start and end
time, the desired sensors and measurement type.
Data can be obtained in Excel file format, Open Document file format or as comma separated
values.
It is also possible to access the database online via a query language. This way of extracting data
for post processing is favored, over file export, as data is more up-to-date then.
8.6 Planemos – Application builder
Planemos is the connection between the Galaxy SQL data base and the binary files of the Miranda
application software. After the compiler builds the Miranda software, Planemos loads it into the
database. From there it can be uploaded to the motes. Planemos also writes into the database
where configuration values are stored. This is needed to tell the user interface what possible
configurations are implemented in this Miranda application.
Rev. 2012-01-20
53/92
SMooHS
9 Overview Status of work
Table 1: Basic sensor node components
Progress
Processor board
Available
Wireless transceiver unit
Available
Power supply
 Dual power regulation
 Battery operation
 Solar cell operation
Available
Available
Available (prototype)
Housing (casing)
Available
Programming adapter (USB/JTAG)
Available
Table 2: Sensor and signal conditioning
Progress
Air temperature & relative humidity
Available
Material temperature
Available
Local strain and deformation
Available
Large distance and deformation
Available (only wire transducer)
Acceleration sensors:
 Event detection
 Modal analysis
 Acoustic emission analysis
Available
Inclination
Available
Barometric pressure
(on request)
Air velocity
Available
Material moisture:
 potential mapping sensors
 impedance measurement
Available
Available
Solar irradiance
Available
UV light
Available
Ozone
(on request)
Rev. 2012-01-20
54/92
SMooHS
Table 3: Wireless Sensor Node Operating System and Application Software
Progress
Bootloader (Wboot)
Available
Application Software Packages (Mirandas)
 Environmental temperature and humidity
 Body temperature (Pt100)
 Electrometer (potential measurements)
 Air flow sensing
 Strain measurements
 Impedance measurements
 Inclination
 Light (incl. UV)
 Acoustic emission analysis
Available
Available
Available
Available
Available
Available
Available
Available
Under development
Web-Interface
Online-Analysis (basic tools)
Available (exemplary prototype)
Analysis packages
 Time Series
 Dew point analysis
 further analysis
Available
Available
(on request)
Forwarder (Uranus)
(on request)
Base Station Software (Jupiter)
Available
Radio to serial forwarder (Starcatcher)
Available
On-site control (Callisto)
(on request)
Database system (Galaxy)
Available
Application builder (Planemos)
Under development
Rev. 2012-01-20
55/92
SMooHS
10 Conclusions and outlook
Wireless sensor networks using intelligent data acquisition and processing could enormously
reduce the costs for structural health monitoring to a small percentage of a conventional wired
monitoring system. This will increase its application and thus more detailed information could be
obtained from the structural behavior as well as the actual condition of the building structure. This
will enable engineers to do structural analysis and repairs based on more precise information, and
conduct more accurate lifetime predictions. For that reason, diverse wireless monitoring systems
and promising distributed computing strategies were developed or are under investigation.
Reliability, especially in respect to long-term monitoring, is still challenging and the high complexity
in customizing and assembling monitoring systems conflicts with easy handling and usability.
Therefore still more practicable modular concepts must be developed the way it is described
shortly in this report for the sensor node hardware. The detection of abnormal or critical events is
one aspect in which hardware could play a decisive role. Solutions for that must be further
investigated and developed. In combination with intelligent distributed computing strategies,
structural health monitoring will then be intrinsically efficient and will help reduce maintenance
costs while at the same time increase the lifetime of structures. Ultimately it will help to achieve a
safer and healthier work and living environment for EU citizens, and by saving monuments and
historic structures, help preserve European history and culture as a whole.
Rev. 2012-01-20
56/92
SMooHS
11 References
[1] Meyer, J., R. Bischoff, G. Feltrin, M. Krüger, O. Saukh, S. Bachmaier. 2007. “Sustainable
Bridges 5.7 - Prototype Implementation of a Wireless Sensor Network”, Report of ´Sustainable
Bridges´ project, http://www.sustainablebridges.net/main.php/SB5.7.pdf?fileitem=11681876.
[2] Kim, S., S. Pakzad, D. Culler, J. Demmel G. Fenves, S. Glaser, M. Turon. 2007. “Health
Monitoring of Civil Infrastructures Using Wireless Sensor Networks”, in Proc. of the 6th
International Conf. on Information Processing in Sensor Networks. ACM Press. 254-263.
[3] Grosse, C.U., G. Pascale, S. Simon, M. Krüger, A. Troi, C. Colla, V. Rajcic, M. Lukomski.
2008. “Recent Advances in Smart Monitoring of Historic Structures”, Proc. 8th European
Conference on Research for Protection, Conservation and Enhancement of Cultural Heritage
(CHRESP), Ljubljana, Slovenia, November 2008.
[4] Lynch, J.P., K. Loh. 2006. “A summary review of wireless sensors and sensor networks for
structural health monitoring”, in Shock and Vibration Digest, 38:2, 91-128.
[5] Gao, Y., B. Spencer. 2008. “Structural Health Monitoring Strategies for Smart Sensor
Networks”, Newmark Structural Laboratory Report Series (NSEL Report Series ISSN 19409826) Newmark Structural Engineering Laboratory, University of Illinois at Urbana-Champaign,
2008-05.
[6] Ruiz-Sandoval, M. 2004. “Smart sensors for civil infrastructure systems”, Ph.D. Dissertation,
University of Notre Dame, Indiana.
[7] Wang, Y. 2007. “Wireless sensing and decentralized control for civil structures: theory and
Implementation”, Ph.D. Thesis, Department of Civil and Environmental Engineering, Stanford
University, Stanford, CA.
[8] Nagayama, T., B. Spencer. 2007. “Structural Health Monitoring Using Smart Sensors”,
Newmark Structural Laboratory Report Series (NSEL Report Series ISSN 1940-9826)
Newmark Structural Engineering Laboratory, University of Illinois at Urbana-Champaign, 200701.
[9] Meyer, J., R. Bischoff, G. Feltrin, M. Krüger, P. Chatzichrisafis, C. Grosse. 2007. “Sustainable
Bridges 5.8 - Data analysis and reduction methodologies for wireless sensor networks”, Report
of
´Sustainable
Bridges´
project,
http://www.sustainablebridges.net/main.php/SB5.8.pdf?fileitem=11681877.
[10] Grosse, C.U., M. Krüger, P. Chatzichrisafis. 2007. “Acoustic emission techniques using
wireless sensor networks”, in International Conference ´Sustainable Bridges – Assessment for
Future Traffic Demands and Longer Lives´, Wrocław, Poland, October 10-11, 2007, pp. 191200.
[11] Grosse, C.U., M. Krüger, S.D. Glaser, G.C. McLaskey. 2008. “Bridge monitoring using
wireless sensors and acoustic emission techniques”, in Proc. EM08, Inaugural International
Conference of the Engineering Mechanics Institute, Department of Civil Engineering,
University of Minnesota, USA. (Eds. R. Ballarini, B. Guzina, and S. Wojtkiewicz), paper
m2303, Minneapolis 2008, on CD, 7 p.
[12] Grosse, C.U., M. Krüger, S. Bachmaier. 2008. “Wireless monitoring of structures including
acoustic emission techniques”, in Proc. Int. Conf. on Conc. Repair, Rehabilitation and
Retrofitting (ICCRRR), Cape Town, South Africa, Nov. 2008, Balkema Publ. Rotterdam (eds.
M. Alexander et a.).
Rev. 2012-01-20
57/92
SMooHS
[13] Krüger, M., C.U. Grosse, J. Kurz. 2006. “Acoustic emission analysis techniques for wireless
sensor networks used for structural health monitoring”, in IABMAS'06 - Third International
Conference on Bridge Maintenance, Safety and Management, Porto.
[14] Krüger, M., C.U. Grosse, J. Kurz. 2007. “Sustainable Bridges 5.5 - Technical Report on
Wireless Sensor Networks Using MEMS for Acoustic Emission Analysis Including Other
Monitoring
Tasks”,
Report
of
´Sustainable
Bridges´
project,
http://www.sustainablebridges.net/main.php/SB5.5.pdf?fileitem=11681873.
Rev. 2012-01-20
58/92
SMooHS
12 Appendix
12.1 Technical data of different components
12.1.1 Processor board, Rev. 3.1
Table 4: SmartWS main board specifications, Rev. 3.1
Parameter
Test Conditions(1)
Value
Min.
Typ.
Max.
Unit
Maximum Ratings
Operating Voltage
Range (VCC)
Total Current Load
Itot @VCC
On Switching
Capacitive Load
@VCC (without
Puls current
limiting)
-25°C to 85°C
3.6
V
-25°C to 85°C
250
mA
-25°C to 85°C
Power Switch with RDS(ON)=0.1Ω
10
µF
+85
°C
90
%RH
7
mA
Operating Temperature Range
Operating Relative Humdity
-25
Non-Condensing
Microcontroller Part and Terminals at the Sensor Module Connectors
Microcontroller
-25°C to 85°C
Operating
Current(2)
Low Frequency
-25°C to 85°C
Crystal
High Frequency
Crystal
Flash Memory
RAM
Flash Memory
Program/Erase
Endurance
Baud Rate
UART Mode
Clock SPI Mode
2
Clock I C Mode
Clock Output @
GPIO with Clock
Output
Clock Input
@Timers
GPIO
Positive-going
Input Threshold
Voltage
GPIO
Negative-going
Input Threshold
Voltage
GPIO
Input Voltage
Rev. 2012-01-20
3.0
-25°C to 85°C
-25°C to 85°C
0.1
0.5(3)
32.768
4
104
kHz
16
MHz
256
16
KB
KB
105
Cycles
-25°C to 85°C
1
MBaud
-25°C to 85°C
-25°C to 85°C
10
400
MHz
kHz
-25°C to 85°C
16
MHz
-25°C to 85°C
16
MHz
-25°C to 85°C, VCC=3V
1.5
2.1
V
-25°C to 85°C, VCC=3V
0.75
1.65
V
-25°C to 85°C, VCC=3V
0.4
1.0
V
59/92
SMooHS
Parameter
Hysteresis
GPIO/ADC Input
Leakage Current
Rpull Disabled
GPIO
Pullup/Pulldown
Resistor Rpull
GPIO with INT
Interrupt Pulse
length
GPIO High-Level
Output Voltage(4)(8)
GPIO Low-Level
(4)(8)
Output Voltage
ADC Input Voltage
Range
ADC Conversion
Rate
ADC Resolution
Positive External Reference Voltage
Input
Negative External
Reference Voltage
Input
Differential
External Reference Voltage Input
Static Input
Current @
Reference Voltage
Input
Internal Reference
Voltage
Load Current
@VREF Output
Reset Pulse length
(Low Active)
Load @Reset
Terminal (Pullup
Resistor)
Capacitive Load
@Reset Terminal
Radio Transceiver
Power Down
Current
Test Conditions(1)
Value
Unit
-25°C to 85°C, VCC=3V
-25°C to 85°C
20
-25°C to 85°C, VCC=3V
20
-25°C to 85°C, VCC=3V, Imax = 15mA
Full Drive Strength
-25°C to 85°C, VCC=3V, Imax = -6mA
Reduced Drive Strength
-25°C to 85°C, VCC=3V, Imax =
15mA
Full Drive Strength
-25°C to 85°C, VCC=3V, Imax = 6mA
Reduced Drive Strength
35
±50
nA
50
kΩ
ns
VCC0.6
VCC
V
VCC0.6
VCC
V
GND
GND+
0.6
V
GND
GND+
0.6
V
GND
VCC
V
-25°C to 85°C
200
ksps
-25°C to 85°C
12
Bits
-25°C to 85°C
-25°C to 85°C
1.4
VCC
V
-25°C to 85°C
GND
1.2
V
-25°C to 85°C
1.4
VCC
V
±1
µA
2.53 /
1.53
V
-25°C to 85°C, VCC=3V
-25°C to 85°C, VCC=3V
2.35 /
1.41
2.45 /
1.47
-25°C to 85°C
-25°C to 85°C
-1
2
mA
µS
-25°C to 85°C
47
kΩ
-25°C to 85°C
2.2
nF
-25°C to 85°C
5
Transmit Current(5)
-25°C to 85°C, 12dBm
60.5
Receive Current(5)
-25°C to 85°C
30.3
Transmit(5)
Output Power
-25°C to 85°C
10
µA
mA
Rev. 2012-01-20
dBm
60/92
SMooHS
Test Conditions(1)
Parameter
Receive Input(5)
Sensitivity
Digital Application Part
-25°C to 85°C
-94
Power Down
Current
-25°C to 85°C
2
Operating Current
Power On
Setup Time(6)
Current Limiter
Output Supply
Voltage @Sensor
Connector(7)(8)
Output Driver
Low Level(7)(8)
Output Driver
High Level(7)(8)
Digital Input Level
Analog Input
Range
16Bit Analog Application Part
Power Down
Current
Operating
Current(5)
Sleep Current
Power On
Setup Time(6)
Current Limiter
Output Supply
Voltage @Sensor
Connector(7)(8)
Input Voltage
Range(5)
Input Differential
(5)
Voltage Range
Input Common
Mode Voltage
Range
Input Impedance
SX8724(5)
Conversion Rate
Resolution
Internal Reference
Voltage
Reference Voltage
Input
High accuracy
Reference Voltage
REF5025ID
Operating Current
REF5025ID
Extended Memory
Power Down
Current
Rev. 2012-01-20
Value
Unit
-25°C to 85°C, no Load
50
-25°C to 85°C
100
-25°C to 85°C
100
150
µA
100
ms
200
mA
-25°C to 85°C, Imax = 100mA
VCC0.1
VCC
V
-25°C to 85°C, Imax = 100mA
GND
GND+
0.15
V
-25°C to 85°C
VCCVCC
0.15
Same as GPIO
-25°C to 85°C
Same as ADC Input
-25°C to 85°C
2
-25°C to 85°C
950
-25°C to 85°C
101
-25°C to 85°C, Imax = 100mA
V
µA
-25°C to 85°C
-25°C to 85°C
100
100
150
ms
200
mA
V
-25°C to 85°C, Imax = 100mA,
Configured for Power Out
VCC0.1
VCC
-25°C to 85°C
GND
2.42
-25°C to 85°C
±2.42
-25°C to 85°C
GND
VCC
-25°C to 85°C
150
1500
-25°C to 85°C
-25°C to 85°C
-25°C to 85°C
1
16
1.19
1.22
V
kΩ
ksps
Bits
1.25
V
-25°C to 85°C
-25°C to 85°C
VCC
-0.05%
2.5
-25°C to 85°C
@85°C
0
3
+0.05%
V
1.2
mA
2
20
µA
61/92
SMooHS
Parameter
Test Conditions(1)
Value
Depending
of
Operating Current
Type
Module for Humidity/Temperature Sensor (SHT15 or SHT21, SHT25) and Dual-LED
Operating Current
0,55
SHT-Sensor(9)
Sleep Current
0,3
SHT-Sensor(9)
-25°C to 85°C, 12 Bit
Resolution
Temperature(9)
-25°C to 85°C, 14 Bit
Accuracy
-25°C to 85°C
±0,3
Temperature(9)
25°C, 8 Bit
Resolution
Humidity(9)
25°C, 12 Bit
Accuracy
±2
(9)
Humidity
Operating Current
LED red
-25°C to 85°C
(selectable
via bridge)
Operating Current
LED green
-25°C to 85°C
(controlled by port,
High Active)
Acceleration Sensor BMA180
Operating Current
-25°C to 85°C
650
Low Power Mode
Operating Current
-25°C to 85°C
975
Low Noise Mode
Sleep Current
0.5
Start-Up Time from
-25°C to 85°C
2
Sleep Mode
ADC Resolution
-25°C to 85°C
12
Selectable
Acceleration
-25°C to 85°C
1 to 16
Ranges
ADC Resolution
0,25
In 2g Mode
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
Unit
Memory
1
mA
1,5
µA
0,04
0,01
°C
±1,8
0,7
0,05
%RH
±5
5
mA
5
µA
ms
14
Bit
g
mg
Typical Specifications @25°C, VCC = 3.0V to 3.6V (unless otherwise noted), sensor connectors open, no
load. These values are average values. For more significant and detailed specifications refer to the
datasheets of the hardware and test it. The Values have been calculated from the original Datasheets
and not measured.
Depending on System Frequency, Power Modes and Activities
Typical Current @Clock 32.768 kHz and using Ports as GPIO
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed±100 mA to
hold the maximum voltage drop specified.
Depending on Operating Modes
Depending on Load
The maximum total current of all partial currents at this part should not exceed ±100mA
The maximum total current of all partial currents should not exceed the total current Itot @VCC
Depending on Sensor Type
Rev. 2012-01-20
62/92
SMooHS
12.1.2 Multi-sensor board, Rev. 2.2
Table 5: Multi-sensor board specifications, Rev. 2.2 (Wheatstone bridge)
Item / Parameter
Supply voltage
Supply current
 Sleep mode
 Operation mode (without sensor)
Response time
 From sleep mode
 From operation mode
No. of input channels
Input range
Resolution
Max. sampling rate
Ambient Temperature
Ambient Humidity
Add-ons (optional)
 Bosch SMB380 (Event detection)
 Sensirion SHT15
Symbol
Value
3V to 3.6V
ASM
AOM
12µA
6mA (typ.)
25ms
5ms
Ch1, Ch2
2
2mV/V to 280mV/V
≤15 bit
≤3.9 kHz
-40 to +85°C
90% RH Non Condensing
Vibration detection
Temp. /Hum. measurement
12.1.3 Tilt and inclination sensor board, Rev. 2.0
Table 6: Inclination and tilt sensor board specification, Rev. 2.0
Item / Parameter
Supply voltage
Supply current
 Sleep mode
 Operation mode (with 2 SCA830-D07)
Response time
 From sleep mode
No. of channels
Input range
Resolution
Max. sampling rate
Amplitude response
Ambient Temperature
Ambient Humidity
Add-ons (optional)
 Sensirion SHT15
Rev. 2012-01-20
Symbol
Value
3 V to 3.6 V
ASM
AOM
12 µA
10 mA (typ.)
Ch1, Ch2
95ms
2 one axis inclinometers
orthogonally installed
-90° to +90°
0.00179° (range +/-3°)
125 Hz
6.25 Hz
-40 to +85°C
Vibration detection
63/92
SMooHS
12.1.4 Air velocity sensor board, Rev. 2.0
Table 7: Air velocity sensor board specifications, Rev. 2.0
Item / Parameter
Supply voltage
Supply current
 Sleep mode
 Operation mode (with sensors)
Response time
 From sleep mode
No. of channels
Symbol
Value
3.15 to 3.6 V
ASM
AOM
12µA
about 20 mA
Ch1
Ch2
Air velocity sensor
RTD Temperature Sensor
0 to 3 m/s
+/-10 %
-10 to +60°C
Max. 85% RH
2mV/V to 280mV/V
≤15 bit
≤3.9 kHz
-40 to +85°C
Input range channel 1
Accuracy channel 1
Ambient Temperature channel 1
Ambient Humidity channel 1
Input range channel 2
Resolution channel 2
Max. sampling rate channel 2
Ambient Temperature channel 2
12.1.5 Impedance sensor board, Rev. 2.0
Table 8: Impedance converter system board specifications, Rev. 2.0
Item / Parameter
Supply voltage
Supply current
 Sleep mode
 Operation mode
No. of channels
Input range
Resolution
Max. sampling rate
Max. frequency
Ambient Temperature
Ambient Humidity
Add-ons (optional)
 Sensirion SHT15
Impedance converter Add-ons (optional)
 Sensirion SHT15
Rev. 2012-01-20
Symbol
Value
3 to 3.6 V
ASM
AOM
12 µA
18 mA
Ch1
100 Ω to 10 MΩ
12 bit
1 MHz
100 kHz
-40 to +85°C
Vibration detection
64/92
SMooHS
Table 9: Impedance converter system board specifications, Rev. 2.4
Test Conditions(1)
Parameter
Power Supply
Operating Voltage
-25°C to 85°C
Range (VCC)
Power Down
Leakage Current
Operating Current
Without external I2C sensors
Power On Setup
Time
Temperature range
Operating
Temperature Range
Operating
Relative
Non-Condensing
Humidity
Impedance Part (incl. 8-Channel Impedance Multiplexer)
No.
of
external
channels
No.
of
internal
channels
Internal
resistors
40
Output
frequency
resolution
Range 1 (range resistor 1 kOhm)
Range 2 (range resistor 100 kOhm)
2 Vpp output excitation voltage @30 kHz, impedance
range 100 kOhm, 200 kOhm connected at the output
Output frequency 10 Hz … 10 kHz
Output frequency >10 kHz … 100 kHz
DC
impedance
excitation
2
µA
45
mA
+85
°C
90
%RH
6
2
kOhm
>0
<100k
>100k
>10M
10
100k
0
0
output
Ohm
Hz
0.5
%
0.2
0.1
Hz
30
ppm/°C
1.98
0.97
0.383
0.198
Vpp
1.005
kOhm
12
16
Resolution
Rev. 2012-01-20
V
ms
-25
Range 1 @VCC = 3.3 V
Analog to digital converter
Real and imaginary registers
Temperature Part (incl. 8-Channel I2C Multiplexer)
No.
of
external
channels
No.
of
internal
channels
Onboard temperature Sensor TMP102
Accuracy
-25 … 85°C
Resolution
Logic Input, Power Switches
Power On (VInL)
@VCC = 3.3 V, -25°C to 85°C
Power Off (VInH)
@VCC = 3.3 V, -25°C to 85°C
Power On (IInL)
-25°C to 85°C
Unit
3.6
100
Oscillator
temperature
coefficient
Output
voltage
Max.
1
100
frequency
System accuracy
Typ.
3.0
reference
Impedance range
Output
range
Value
Min.
bit
6
1
0.5
0.0625
0
1.4
°C
°C
0.8
VCC
1
V
V
µA
65/92
SMooHS
Parameter
Test Conditions(1)
Logic Input, Impedance chip AD5933
VInL
25°C
VInH
25°C
IIn
25°C
Logic Input, DDS chip AD9834
VInL
25°C
VInH
25°C
IIn
25°C
Logic Input, Impedance Multiplexer ADG707
VInL
-25°C to 85°C
VInH
-25°C to 85°C
IIn
-25°C to 85°C
Logic Input, Range switch ADG620
VInL
-25°C to 85°C
VInH
-25°C to 85°C
IIn
-25°C to 85°C
Logic Input, I2C Multiplexer
VInL
-25°C to 85°C
VInH
-25°C to 85°C
IIn
-25°C to 85°C
Value
Unit
0.7xVCC
0.3xVCC
VCC
1
V
V
µA
2.0
0.7
VCC
10
V
V
µA
2.4
0.005
0.8
VCC
1
V
V
µA
0.005
0.8
VCC
0.1
V
V
µA
0.3xVCC
VCC
1
V
V
µA
2.4
0.7xVCC
-1
12.1.7 Electrometer board, Rev. 2.0
Table 10: Specifications of the electrometer board with external multiplexer, Rev. 2.0
Item / Parameter
Supply voltage
Supply current
 Sleep mode
 Operation mode (without sensor)
 Operating mode (with sensor)
Response time
 From sleep mode
No. of channels
 Single use
 In combination with Multiplexer
Input range
Resolution
Input resistance
Ambient Temperature
Ambient Humidity
Add-ons (optional)
 Sensirion SHT15
Rev. 2012-01-20
Symbol
Value
3V to 3.6V
ISM
IOM
IM
12µA
~13mA
~63mA
~100ms
Not specified
Ch1
Ch1 - CH8
1
8
-2V to +1.7V
12 bit
~100 GΩ
-25 to +85°C
66/92
SMooHS
Table 11: Specifications of the electrometer board with external multiplexer, Rev. 2.4
Parameter
Test Conditions(1)
Value
Min.
Typ.
Max.
Unit
Power Supply
Operating Voltage
Range (VCC)
Power Down
Leakage Current
-25°C to 85°C
3.0
@85°C
all Relays switched off
Operating Current
one Relay switched on
Power On
Setup Time
all Relays switched off, -25°C to 85°C
Analog Part (incl. 8-Channel Multiplexer)
@Gain =1, -25°C to 85°C
Input Voltage
Range (VIn)
@Gain =10, -25°C to 85°C
Output Voltage
-25°C to 85°C
@(VIn) = 0V
@Gain =1, -25°C to 85°C, VIn = -2.5V to 1.7V
Output Voltage
@Gain
=10, -25°C to 85°C, VIn = -0.25V to
Range (VOut)
0.25V
@Gain =1, -25°C to 85°C
Accuracy (VOut)
@Gain =10, -25°C to 85°C
Output Resistance
-25°C to 85°C
Setup Time for
Measurement
-25°C to 85°C
Value after
1 Channel
switched on
Relay Switching
-25°C to 85°C
Time
Required Delay
-25°C to 85°C
Time between
toggling Relays
Offset Voltage(2)
@(VOut)
Bias Voltage
@(VOut)
Range of Bias
Voltage Adjust(3)
@Resistor (RIn)
Setup Time Bias
Voltage Adjust(4)
Bandwidth -3dB
Noise @(VOut)
Input Resistance
Rev. 2012-01-20
@Gain =1, -25°C to 85°C
@Gain =10, -25°C to 85°C
@Gain =1, -25°C to 85°C
@Gain =10, -25°C to 85°C
-25°C to 85°C
@Gain =1
@Gain =10
@Gain =10, in shielded case
36
@85°C
3.6
0
1
3
10
10.4
11.2
@85°C
48,6
55
@25°C
100
V
µA
mA
ms
-2.5
-0.25
1.7
0.25
(VRef)/2
V
0
2.1
0
2.5
98
±0.2
±0.4
102
100
V
330
V
%
Ω
ms
1
ms
1
ms
±0.3
@25°C
±0.4
@25°C
±1
@25°C
±10
@25°C
±1.1
mV
±4.5
±50
mV
±500
±247.7
(16bit)
mV
12
s
33
16
Hz
100
2
±5%
mVrms
GΩ
67/92
SMooHS
Parameter
(RIn)
Temperature Drift
(RIn)
Reference Voltage
Output Voltage
(VRef)
Output Voltage
Temperature Drift
Output Resistance
Logic Input, Power Switch
Power On (VInL)
Power On (IInL)
Power Off (VInH)
Logic Input, other Peripherals
VInL
IInL
VInH
IInH
Clock Frequency
Operating
Temperature
Range
Operating Relative Humidity
(1)
Test Conditions(1)
Value
Unit
ppm/
°C
500
2.4995
2.5
2.5005
2
5
47
48
ppm/
°C
Ω
0.6
-3.6
V
µA
VCC0.1
VCC
V
2.95
0.6
-5
3.6
14
400
V
µA
V
µA
kHz
-25
+85
°C
90
%RH
-25°C to 85°C
46
-25°C to 85°C
-25°C to 85°C
0
-25°C to 85°C
-25°C to 85°C
-25°C to 85°C
-25°C to 85°C
-25°C to 85°C
-25°C to 85°C
Non-Condensing
V
Typical Specifications @25°C, VCC = 3.0V to 3.6V (unless otherwise noted).
(2)
The offset voltage can be measured by switching on the GND-Relay. It is not adjustable,
subtract it from the measurement.
(3)
The adjustment of the bias voltage is done at the low end of the input resistor (RIn), because the
bias voltage is a result of the bias current flowing into the input resistor. The bias current is a
leakage current at the input of the input amplifier. The bias voltage can be measured by switching
off all relays.
(4)
A simple principle of Bias voltage adjusting with relative good results:
Read out first the offset voltage and multiply by two (setup time after switching on the GND-Relay
= 300ms).Read out the bias voltage and multiply by two (setup time after switching off the GNDRelay = 7sec.).Subtract the result of the offset voltage from the result of the bias voltage. Negate
this result and shift the low end of the input resistor (RIn) with this value. The setup time to the
output (VOut) takes about 12 sec. Now the bias current at the input is compensated and the input is
nearly free of voltage, the output takes only the offset voltage (see point (2)).
Rev. 2012-01-20
68/92
SMooHS
12.1.9 SmartGate Rev. 3.3
Table 12: Specifications of the Smart Gateway, Rev. 3.3
Value
Min.
Test Conditions1
Parameter
DC Low Voltage Connector
Connector X16
DC Supply Voltage
Connector X12
Power on current (Inrush Current) @12V
Idle (GSM standby, WSN standby) @12V
Peak
Current
during
GSM
Startup
DC Supply Current
(GSM active, WSN active) @12V
RMS Current (GSM active, WSN active) @12V
Peak Current (GSM active, WSN active) @12V
DC High Voltage Connector
Mains AC Supply
Voltage
Mains DC Supply
Voltage
Typ.
10
10
12
12
130
140
150
170
250
420
110
370
V
230VAC
110VAC
Power over Ethernet (PoE)
DC Supply Voltage
(PoE)
20
10
Inrush
Peak
Current
during
GSM
(GSM active, WSN active) @48V
mA
V
110
DC Supply Current
(PoE)
V
V
240
110VAC
RMS Current (GSM active, WSN active) @48V
Unit
100
70
Mains
Current
48
24
(10.000)
150
800
230VAC
Mains AC Supply
Current
Max.
mA
A
12
48
54
42
47
69
Startup
220
Peak Current (GSM active, WSN active) @48V
Power on current (Inrush Current) @12V
V
mA
120
(30.000)
Peripherals / Others
Relay
Current
Driver
DC Supply Voltage Range of Connector X12 (active low, not
short-circuit proof)
Current on USB
Maximum value for both USB connectors @5V
Host
Operating
Temperature
Range
Operating Relative
Non-Condensing
Humdity
1
Typical Specifications @25°C
200
300
mA
200
300
mA
-25
+70
°C
10
90
%RH
SmartGateWS Components
 AarLogic Module C10/3 (Rev. 5) with SD-Memory Card and GSM Card
 SmartGIF gateway interface board (Rev. 3.3)
 SmartMCU1 WSN processing module (Rev. 2.2)
 SmartRF1 radio module (Rev. 2.3)
Rev. 2012-01-20
69/92
SMooHS
12.2 Terminals and drawings of different components
Pin definitions
Table 13: MCU Sensor board connector X1 and X2
Item / Parameter
General-purpose digital I/O pin/slave in/master out of
USART0/SPI mode, I2C data − USART0/I2C mode
General-purpose digital I/O pin/slave out/master in of
USART0/SPI mode
General-purpose digital I/O pin/external clock input −
USART0/UART or SPI mode, clock output – USART0/SPI
mode, I2C clock − USART0/I2C mode
General-purpose digital I/O pin/slave transmit enable –
USART0/SPI mode
General-purpose digital I/O pin/Timer_A, clock signal at
INCLK
General-purpose digital I/O pin/Timer_A, compare: Out1
output/Comparator_A input
General-purpose digital I/O pin/ACLK output
General-purpose digital I/O pin/conversion clock – 12-bit
ADC/DMA channel 0 external trigger
output
General-purpose digital I/O pin/transmit data out –
USART0/UART mode
output
General-purpose digital I/O pin/receive data in –
USART0/UART mode
output
General-purpose digital I/O pin/main system clock MCLK
output
Digital supply voltage, positive terminal. Supplies all digital
parts.
Reset input, nonmaskable interrupt input port, or bootstrap
loader start (in Flash devices). Connected via 1nF to GND
and pull up resistor 47k to DVCC
Digital supply voltage, negative terminal. Supplies all digital
parts.
General-purpose digital I/O pin/analog input a7 – 12-bit
ADC/DAC12.1 output/SVS input
General-purpose digital I/O pin/analog input a2 – 12-bit ADC
General-purpose digital I/O pin/analog input a6 – 12-bit
ADC/DAC12.0 output
Output of positive terminal of the reference voltage in the
ADC12 / or external reference voltage via Ref-IC and solder
bridge
Rev. 2012-01-20
Pin
MCU-X1
MCU-X2
P1
I2C_SDA_SI
I2C_SDA_SI
P2
SO
SO
P3
I2C_SCL_SCLK
I2C_SCL_SCLK
P4
GIO10
GIO10
P5
GIO4
P5
P6
GIO5
GIO3
P6
P7
GIO8
GIO2
P7
P8
GIO11
GIO1
P8
P9
GIO12
GIO0
P9
GIO13
P10
DVCC
DVCC
P11
\RESET
\RESET
P12
GND
GND
P13
ADC7
P13
P14
ADC2
ADC6
P14
P15
ADC3
ADC1
ADC0
P16
VREF+OUT
VREF+OUT
70/92
SMooHS
Item / Parameter
Negative terminal for the reference voltage for both sources,
the internal reference voltage, or an external applied
reference voltage
Analog supply voltage, negative terminal. Supplies only the
analog portion of ADC12 and DAC12.
Pin
MCU-X1
MCU-X2
P17
VEREF-_IN
VEREF-_IN
P18
AGND
AGND
Table 14: MCU Sensor board connector X4 and X5
Item / Parameter
Pin
Digital supply voltage, negative terminal. Supplies all
P1
digital parts.
Digital supply voltage, negative terminal. Supplies all
P2
digital parts.
Rev. 2012-01-20
MCU-X4
MCU-X5
GND
GND
GND
GND
71/92
SMooHS
Table 15: MCU supply board connector X3
Item / Parameter
Main supply voltage input, positive terminal. (+3.6V max)
Main supply voltage input, negative terminal. This is the main ground.
Main supply voltage input, negative terminal. This is the main ground.
General-purpose digital I/O pin/input for external resistor defining the
DCO nominal frequency
Analog ground. Supplies all analog parts. Can be connected via resistor
0R0 to GND
General-purpose digital I/O pin/Timer_A, capture: CCI1A input,
compare: Out1 output
General-purpose digital I/O pin/Timer_A, compare: Out0 output
General-purpose
digital
I/O
pin/Timer_A,
compare:
Out2
output/Comparator_A input
General-purpose digital I/O pin/switch all PWM digital output ports to
high impedance − Timer_B TB0 to TB6/SVS comparator output
General-purpose digital I/O pin/auxiliary clock ACLK output
General-purpose digital I/O pin/submain system clock SMCLK output
Test clock. TCK is the clock input port for device programming test and
bootstrap loader start
Test mode select. TMS is used as an input port for device programming
and test.
Test data input or test clock input. The device protection fuse is
connected to TDI/TCLK.
Test data output port. TDO/TDI data output or programming data input
terminal
Reset input, nonmaskable interrupt input port, or bootstrap loader start
(in Flash devices). Connected via 1nF to GND and pull up resistor 47k to
DVCC
General-purpose digital I/O pin/receive data in – USART1/UART mode
General-purpose digital I/O pin/transmit data out – USART1/UART mode
Pin
P1
P2
P3
P4
MCU-X3
VCC
GND
GND
GIO7
P5
AGND
P6
P_DVCC
P7
P8
GIO9
GIO6
P9
GIO16
P10
P11
P12
P13
P14
GIO15
GIO14
ADC4
ADC5
TCK
P15
TMS
P16
TDI
P17
TDO
P18
\RESET
P19
P20
UART1RX
UART1TX
I2C addressing serial number chip
The address of the silicon serial number chip DS28CM00 (IC8) is fixed at 0x50.
Rev. 2012-01-20
72/92
SMooHS
Pin definitions and usage of ports
Table 16: SmartWS, Rev. 3.1
Smart_WS_Rev3.1
Connectors
X1 X2 X3
Signal Name
Internal Use
X4
X5 X6 X7 X8
(1)
(1)
(1)
(1)
X27
Main Function
ResetN MCU
11 11
AGND
Analog
supply
ground
18 18
DVCC
Digital
supply
power
GND
Digital
supply
ground
P1.0/TA0_
CLK/ACLK
GPIO,
Clock
output, 5
TA0 Clock input
P1.1/BSL_TXD
P1.2/BSL_RXD
11
(4)
(4)
3
3
12 12 1,2 1,2 1
1
10 10
3
(4)
1
Bootstrap
Loader
transmit output
Bootstrap
Loader
receive input
3
4)
1
2
(5)
9
X22,
(X24
LED
red)
x
x
x
x
x
X20
x
x
x
x
x
Radio ResetN
x
Radio GPIO0
x
P1.5/RF_GPIO1
Radio GPIO1
x
P1.6/RF_GPIO2
Radio GPIO2
x
P1.7/RF_VREG_
EN
Radio
Enable
x
P2.0/INT/PWR_X1
Power ON/OFF,
6
GPIO, INT
P2.1/INT
GPIO, INT
P2.3/INT/X7-4_IN
P2.4/#CS_
ACCLR
P2.5/LED_G_
ANODE
P2.6/#
OVERLOAD
Rev. 2012-01-20
(4)
(4)
15
P1.4/RF_GPIO0
P2.2/INT/PWR_
X2/X7-4_OUT
(4)
17
P1.3/#RF_RESET
Vreg
At conn. X7:
Output,
else
Power ON/OFF,
GPIO, INT
At conn. X7:
Input,
(GPIO
INT),
else
GPIO, INT
Chip
selectN
internal
acceleration
sensor
Output,
DualLED
green
anode
OverloadN
detect.
at
external
connectors
(with pull up
100k)
High
Freq.
Crys
(3)
tal
Solder
Connection = x
Pad
Pin No.
#RESET
Hum./
Me
Analog Digit. Accele
Temp. Ra
mory + dig. App. ration
Dual- dio (2)
(2)
(2)
(2)
App.
(2)
LED
7
6
4
x
7
4
x
x
X25
x
x
73/92
SMooHS
Smart_WS_Rev3.1
Connectors
X1 X2 X3
Signal Name
Internal Use
X4
X5 X6 X7 X8
(1)
(1)
(1)
Main Function
(1)
Hum./
Me
Temp. Ra
X27
Dual- dio (2)
(2)
(2)
(2)
App.
(2)
LED
Solder
Connection = x
Pad
Pin No.
P2.7/INT_ACCLR
P3.0/#RF_CS
P3.1/RF_MOSI
INT of internal
acceleration
sensor
Radio
chip
selectN
x
x
Radio SPI MOSI
x
P3.2/RF_MISO
Radio SPI MISO
x
P3.3/RF_SCLK
Radio SPI SCLK
x
P3.4/UCA0_TXD
Transmit output,
GPIO
18
P3.5/UCA0_RXD
Receiv
GPIO
16
P3.6/UCA1_SPI_
CLK
SPI SCLK, (I2C
SCK)
internal memory
and acceleration
(with pull up 10k)
P3.7/UCB1_SPI_
SIMO/UCB1_I2C_
SDA
SPI SIMO, I2C
1
SDA,
GPIO
P4.0/TB0.0/X7-2_
IN
P4.1/TB0.1/X7-2_
OUT
P4.2/SCLK_HT
P4.3/SDATA_HT
input,
At conn. X7:
Input,
Timer
B0.0
input,
(GPIO),
else
GPIO,
Timer B0.0 input
At conn. X7:
Output,
else
GPIO,
Timer B0.1 input
SCLK
internal humidity
+
temperature
sensor
(with pull up 10k)
SDATA
internal humidity
+
temperature
sensor
(with pull up 10k)
x
x
1
9
2
x
8
2
x
X23
X21
P4.4/SCLK_
ANA-APP
SCLK
internal analog
application
(with pull up 10k)
x
P4.5/SDATA_
ANA-APP
SDATA
internal analog
application
(with pull up 10k)
x
P4.6/#PWR_
ANA-APP
Power ON/OFF
(L=ON) internal
analog,
application
x
Rev. 2012-01-20
High
Freq.
Crys
(3)
tal
74/92
SMooHS
Smart_WS_Rev3.1
Connectors
X1 X2 X3
Signal Name
Internal Use
X4
X5 X6 X7 X8
(1)
(1)
(1)
(1)
Main Function
Hum./
Me
Temp. Ra
X27
Dual- dio (2)
(2)
(2)
(2)
App.
(2)
LED
High
Freq.
Crys
(3)
tal
Solder
Connection = x
Pad
Pin No.
P4.7/TB0_CLK/
SMCLK/X8-2_IN
At conn. X8:
Input,
TB0 Clock input,
(GPIO),
Clock
output,
else
GPIO,Clock
output,
TB0 Clock input
P5.0/A8/VREF+/
VEREF+
VREF+
out,
16 16
extern VREF+ in
P5.1/A9/VREF-/
VEREF-
VREFout,
17 17
extern VREF- in
P5.2/XT2IN/X84_OUT
At conn. X8:
Output,elsehigh
frequencycrystal
4
x
P5.3/XT2OUT/
X8-4_IN
At conn. X8:
Input,
(GPIO),
else
high frequency
crystal
4
x
P5.4/UCB1_SPI_
SOMI/UCB1_
I2C_SCL
SPI
I2C
GPIO
P5.5/UCB1_SPI_
CLK
SPI
GPIO
P5.6/UCA1_SPI_
SIMO
SPI SIMO, (I2C
SDA)
internal memory
and acceleration
(with pull up 10k)
x
x
P5.7/UCA1_SPI_
SOMI
SPI
SOMI,
internal memory
and acceleration
x
x
SOMI,
SCL, 3
CLK,
Analog
(GPIO)
Analog
(GPIO)
Analog
(GPIO)
Analog
(GPIO)
input,
P6.4/A4
Analog
(GPIO)
input,
P6.5/A5
Analog
(GPIO)
input,
Input,
input,
(GPIO)
Input,
input,
(GPIO)
Analog
P6.0/A0
P6.1/A1
P6.2/A2
P6.3/A3
P6.6/A6/X6-2_IN
P6.7/A7/X6-4_IN
2
x
3
2
14
input,
input,
2
15
input,
13
15
14
13
2
x
4
x
Analog
P7.0/XIN
Clock Crystal
P7.1/XOUT
Clock Crystal
Rev. 2012-01-20
5
75/92
SMooHS
Smart_WS_Rev3.1
Connectors
X1 X2 X3
Signal Name
Internal Use
X4
X5 X6 X7 X8
(1)
(1)
(1)
(1)
Main Function
Hum./
Me
Temp. Ra
X27
Dual- dio (2)
(2)
(2)
(2)
App.
(2)
LED
Solder
Connection = x
Pad
Pin No.
P7.2/CS_SPI_X2/
X8-2_OUT
P7.3/CS_SPI_X1
At conn.
Output,
else
chip selct
select I2C
GPIO
Chip select
select I2C
GPIO
P7.4/X5-4_OUT
Output
P7.5/A13/X5-4_IN
Input,
input,
(GPIO)
X8:
4
SPI,
bus,
2
x
SPI,
bus, 4
4
x
4
x
2
x
2
x
Analog
P7.6/X5-2_OUT
Output
P7.7/A15/X5-2_IN
Input,
input,
(GPIO)
P8.0/TA0.0
GPIO,
Timer A0.0 input
9
P8.1/TA0.1
GPIO,
Timer A0.1 input
8
P8.2/#CS_MEM
Chip
selectN
memory
x
P8.3/#PWR_MEM
Power ON/OFF
memory (L=ON)
x
P8.4/X6-2_OUT
Output
2
x
P8.5/X6-4_OUT
Output
4
x
P8.6/#PWR_
DIG-APP
PJ.0/TDO
PJ.1/TDI
PJ.2/TMS
PJ.3/TCK
TEST
High
Freq.
Crys
(3)
tal
Analog
Power ON/OFF
(L=ON) internal
digital
application
Programming
port,
GPIO
Programming
port,
GPIO
Programming
port,
GPIO
Programming
port,
GPIO
Programming
port
x
1
3
5
7
8
Notes:
(1) Connected via analog - and/or digital application, some functions are hardware configurable, VCC and GND too,
some pins are connected to more than one port
(2) Some connections depend on hardware function
(3) Optional. If high frequency crystal is used, disconnect application at X8 pin 4 (R110, R111)
(4) Power supply is switchable, L=ON
(5)
This
is
power
supply
input
named
VCC_JTAG.
Jumper
JP1
The power must be supplied by the programmer board or another device, range 3.0V-3.6V
Rev. 2012-01-20
must
be
in
position
1-2.
76/92
SMooHS
Functional areas
Figure 52. Principle sketch of the functional areas at the top side
Connectors
Figure 53. Connectors at the bottom side
Rev. 2012-01-20
77/92
SMooHS
12.2.3 Power module, Rev. 2.3
Pin definitions
Table 17: Power supply board connector X5 connected to MCU-X3
Item / Parameter
Not used, grounded via resistor 47k. Set MCU’s port to input or to output
low if not other ways used
Not used, grounded via resistor 47k. Set MCU’s port to input or to output
low if not other ways used
Resetting the MCU, connected via 10nF to ground and to X6 for reset
button
Open
Open
Open
Open
Measuring the current consumption at the ILIM-pin of IC5. Set MCU’s
port to analog input. The max. value is about 0.5V if VCC is shorted
Measuring the battery voltage or the main supply voltage VCC, this is
selectable via 0R0 resistor. The voltage is divided by 2. Set MCU’s port
to analog input and MCU’s reference to 2.5V for converting
Digital output via resistor 330R to X6, anode LED (green) on external
keyboard. H = LED on
Digital output via resistor 330R to X6, anode LED (yellow) on external
Digital output via resistor 330R to X6, anode LED (red) on external
Connected to X6 via 1µF to GND and pull up resistor 47k to VCC. Used
for function key on external keyboard. Set MCU’s port to input. L =
button pressed
Connected to X6 via 1µF to GND and pull up resistor 47k to VCC. Used
for function key on external keyboard. Set MCU’s port to input. L =
button pressed
Connected via resistor 47k to GND. Set MCU’s port to input. L = no
connection with PC via USB (signal is used on programmer board)
Analog ground. Supplies all analog parts. This line is connected via
resistor 0R0 to GND
Power state signal, connected via pull up resistor 100k to VCC.
Important: Set MCU’s port to input! This signal is internal used for the
power management. H = battery power, L = solar power
Main supply voltage output, negative terminal. This is the main ground.
Main supply voltage output, negative terminal. This is the main ground.
Main supply voltage output, positive terminal. (+3.6V max)
Rev. 2012-01-20
Pin
P1
MCU-X3
UART1TX
P2
UART1RX
P3
\RESET
P4
P5
P6
P7
P8
TDO
TDI
TMS
TCK
ADC5
P9
ADC4
P10
GIO14
P11
GIO15
P12
GIO16
P13
GIO6
P14
GIO9
P15
P_DVCC
P16
AGND
P17
GIO7
P18
P19
P20
GND
GND
VCC
78/92
SMooHS
Table 18: Connector X6 for plastic foil keyboard
Item / Parameter
Output to anode low current LED
Digital ground. Supplies all digital parts.
Function button, switch to GND
Function button, switch to GND
Reset button, switch to GND
Open
Pin
P1
P2
P3
P4
P5
P6
P7
P8
X6
LED_RED
LED_GREEN
LED_YELLOW
GND
USERINT_EXT
LED_on_off
\RESET
VCC_OUT
Table 19: Connector X7 for extern power (for example a small solar module)
Item / Parameter
Supply voltage input, negative terminal. This is the main ground.
Supply voltage input, positive terminal. (optimal +5.2V to +6V)
Pin
P1
P2
X7
GND
V-EXT1
Table 20: Connector X8 for extern power (for example a small solar module)
Item / Parameter
Supply voltage input, negative terminal. This is the main ground.
Supply voltage input, positive terminal. (optimal +5.2V to +6V)
Rev. 2012-01-20
Pin
P1
P2
X8
GND
V-EXT2
79/92
SMooHS
12.2.4 Multi-sensor board, Rev. 2.2
Pin definitions
Table 21: Multi-sensor board connector X1 connected to MCU-X1 or to MCU-X2
Item / Parameter
I2C serial data, SHT15 serial data
Open
I2C serial clock, SHT15 serial clock
Programmable I/O1 of ZMD31050 (IC101),
remove resistor R113 if not used and set MCU’s
port to output low if not other ways used
Power on Ch1 and Ch2 (L = power on, H =
power off)
Event detection (INT, output of SMB380)
Supply voltage. Supplies all digital and analog
parts.
Open
Open, set MCU’s port to output low if not other
ways used
Analog output of ZMD31050 (IC101)
Open
Not used, connected to AGND
Analog ground. Supplies all analog parts
Pin
P1
P2
P3
P4
MCU-X1
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
MCU-X2
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
P5
GIO4
GIO5
P6
P7
GIO3
GIO2
GIO8
GIO11
P8
GIO1
GIO12
P9
GIO0
GIO13
P10
DVCC
DVCC
P11
P12
P13
\RESET
GND
ADC7
\RESET
GND
ADC2
P14
P15
P16
P17
P18
ADC6
ADC3
VREF+OUT
VEREF-_IN
AGND
ADC1
ADC0
VREF+OUT
VEREF-_IN
AGND
Table 22: Multi-sensor board connector X4, connected to MCU-X4 or to MCU-X5
Item / Parameter
Open
Open
Rev. 2012-01-20
Pin
P1
P2
MCU-X4
GND
GND
MCU-X5
GND
GND
80/92
SMooHS
Socket definition
Table 23: Sensor connector BU101 and BU201, female sockets 4-pin
Item / Parameter
Pin
Normally negative supply to the sensor bridge P1
(configurable)
Normally negative
(configurable)
signal
from
sensor
bridge P2
Normally positive
(configurable)
signal
from
sensor
bridge P4
Normally positive supply to the sensor bridge P3
(configurable)
BU101
Measuring
circuit
IC101
Measuring
circuit
IC101
Measuring
circuit
IC101
Measuring
circuit
IC101
BU201
Measuring
circuit IC102
Measuring
circuit IC102
Measuring
circuit IC102
Measuring
circuit IC102
Figure 54. Female socket 4-pin, front side.
I2C addressing
Each ZMD31050 chip has a base address 0x78 that is always valid, but it is possible to program a
second address into the EE-Prom of the ZMD31050.
Table 24: I2C addresses
Item / Parameter
Module connected with MCU’s connector X1
Module connected with MCU’s connector X2
Rev. 2012-01-20
Position
Slot 1
Slot 2
IC101
0x74
0x76
IC201
0x75
0x77
81/92
SMooHS
12.2.5 Tilt and inclination sensor board, Rev. 2.0
Pin definitions
Table 25: Inclination and tilt sensor board connector X1 connected to MCU-X1 or to MCU-X2
Item / Parameter
I2C serial data, SPI serial data (master out,
slave in), SHT15 serial data
SPI serial data (master in, slave out)
I2C serial clock, SPI serial clock, SHT15 serial
clock
Chip select, digital input of SCA830 (IC5), active
low enables serial data communication of IC5.
This line is connected via connector BU101 to
the line CSB2 of the external sensor board. If
the power of the external sensor board is
switched off, hold this line low! A high will
provide a current flow into IC5.
Active low enables the SPI-bus at the connector
BU201 and power on the external sensor board
Chip select, digital input of SCA830 (IC4), active
low enables serial data communication of IC4.
This line is connected via connector BU201 to
the line CSB1 of the external sensor board. If
the power of the external sensor board is
switched off, hold this line low! A high will
provide a current flow into IC4.
ways used
Pin
P1
MCU-X1
I2C_SDA_SI
P2
P3
SO
SO
I2C_SCL_SCLK I2C_SCL_SCLK
P4
GIO10
GIO10
P5
GIO4
GIO5
P6
P7
GIO3
GIO2
GIO8
GIO11
P8
GIO1
GIO12
Open, set MCU’s port to output low if not other P9
ways used
GIO0
GIO13
parts.
Open
ways used
ways used
ways used
Open
P10
DVCC
DVCC
P11
P12
P13
\RESET
GND
ADC7
\RESET
GND
ADC2
P14
ADC6
ADC1
P15
ADC3
ADC0
P16
P17
P18
VREF+OUT
VEREF-_IN
AGND
VREF+OUT
VEREF-_IN
AGND
Rev. 2012-01-20
MCU-X2
I2C_SDA_SI
82/92
SMooHS
Table 26: Inclination and tilt sensor board connector X4, connected to MCU-X4 or to MCU-X5
Item / Parameter
Pin
MCU-X4
MCU-X5
Open
Open
P1
P2
GND
GND
GND
GND
Table 27: Sensor connector BU101, female socket 3-pin
Item / Parameter
Ground, supplies the external sensor board
Chip select, digital input of SCA830 (IC5), active low
enables serial data communication of IC5 on the
external sensor board
Supply voltage, switched. Supplies the external
sensor board
Pin
P1
P3
Extern sensor board
GND
CSB2
P4
VDD
Socket definition
Item / Parameter
Pin
Chip select, digital input of SCA830 (IC4), active low P1
enables serial data communication of IC4 on the
external sensor board
SPI serial data, switched (master out, slave in)
P2
SPI serial data, switched (master in, slave out)
P4
SPI serial clock, switched
P3
Extern sensor board
CSB1
MOSI
MISO
SCK
Figure 55. Female sockets 4-pin and 3-pin, front side.
12.2.6 Air velocity sensor board, Rev. 2.0
Pin definitions
Rev. 2012-01-20
83/92
SMooHS
Table 29: Air velocity sensor board connector X1 connected to MCU-X1 or to MCU-X2
Item / Parameter
I2C serial data, SHT15 serial data
Open
I2C serial clock, SHT15 serial clock
Power on sensor bridge (ZMD31050) and air
velocity sensor (L = power on, H = power off)
ways used
Pin
P1
P2
P3
P4
MCU-X1
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
MCU-X2
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
P5
GIO4
GIO5
P6
P7
GIO3
GIO2
GIO8
GIO11
P8
GIO1
GIO12
Open, set MCU’s port to output low if not other P9
ways used
GIO0
GIO13
parts.
Open
ways used
Analog output of air velocity sensor, set the
internal MCU’s reference to 2.5V for converting
Open
P10
DVCC
DVCC
P11
P12
P13
\RESET
GND
ADC7
\RESET
GND
ADC2
P14
P15
ADC6
ADC3
ADC1
ADC0
P16
P17
P18
VREF+OUT
VEREF-_IN
AGND
VREF+OUT
VEREF-_IN
AGND
Table 30: Air velocity sensor board connector X4, connected to MCU-X4 or to MCU-X5
Item / Parameter
Open
Open
Rev. 2012-01-20
Pin
P1
P2
MCU-X4
GND
GND
MCU-X5
GND
GND
84/92
SMooHS
Socket definition
Item / Parameter
Normally negative supply to the
(configurable)
Normally negative signal from
(configurable)
Normally positive signal from
(configurable)
Normally positive supply to the
(configurable)
Pin
sensor bridge P1
BU101
Measuring circuit IC101
sensor
bridge P2
sensor
bridge P4
sensor bridge P3
Item / Parameter
Ground. Supplies the air velocity sensor
Ground. Supplies the air velocity sensor
Analog output of the air velocity sensor
Supply voltage, switched. Supplies the air velocity
sensor
Pin
P1
P2
P4
P3
Air velocity sensor
GND
GND
Vout
VCC
I2C addressing
Each ZMD31050 chip has a base address 0x78 that is always valid, but it is possible to program a
second address into the EE-Prom of the ZMD31050.
Rev. 2012-01-20
85/92
SMooHS
Pin definitions
Table 33: Impedance converter board connector X1 connected to MCU-X1 or to MCU-X2
Item / Parameter
I2C serial data, SHT15 serial data (selectable)
Open
I2C serial clock, SHT15 serial clock (selectable)
Select measuring frequency, input DIVA (bit0) of
oscillator-IC LTC6930
Power on oscillator and measuring circuits (L =
power on, H = power off)
SHT15 serial data (selectable)
Select measuring frequency, input DIVC (bit2) of
SHT15 serial clock (selectable)
Select measuring frequency, input DIVB (bit1) of
parts.
Open
ways used
ways used
ways used
Open
Pin
P1
P2
P3
P4
MCU-X1
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
MCU-X2
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
P5
GIO4
GIO5
P6
P7
GIO3
GIO2
GIO8
GIO11
P8
P9
GIO1
GIO0
GIO12
GIO13
P10
DVCC
DVCC
P11
P12
P13
\RESET
GND
ADC7
\RESET
GND
ADC2
P14
ADC6
ADC1
P15
ADC3
ADC0
P16
P17
P18
VREF+OUT
VEREF-_IN
AGND
VREF+OUT
VEREF-_IN
AGND
Table 34: Impedance converter board connector X4, connected to MCU-X4 or to MCU-X5
Item / Parameter
Open
Open
Pin
P1
P2
MCU-X4
GND
GND
MCU-X5
GND
GND
Socket definition
Table 35: Connector BU101 to measuring object, female socket 4-pin
Item / Parameter
Analog ground
Measuring frequency output to measuring object
Measuring signal input from measuring object
Analog ground
Rev. 2012-01-20
Pin
P1
P2
P4
P3
BU101
86/92
SMooHS
Table 36: Connector BU201, female socket 4-pin
Item / Parameter
Open
Open
Open
Open
Pin
P1
P2
P4
P3
BU201
I2C addressing
The AD5933 chip has a base address 0x0D.
Pin definitions
Table 37: Electrometer board connector X1 connected to MCU-X1
Item / Parameter
Open
Open
Open
Open, set MCU’s port to output low if not other ways used
Open
Open
Open
Open
Not used, connected to AGND at X2
Open
Rev. 2012-01-20
Pin
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
MCU-X1
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
GIO4
GIO3
GIO2
GIO1
GIO0
DVCC
\RESET
GND
ADC7
ADC6
ADC3
VREF+OUT
VEREF-_IN
AGND
87/92
SMooHS
Table 38: Electrometer board connector X2 connected to MCU-X2
Item / Parameter
I2C serial data, SHT15 serial data (selectable)
Open
I2C serial clock, SHT15 serial clock (selectable)
Power on measuring circuits and enables the SPI-bus at the
connector BU1 (H = power on, L = power off)
SHT15 serial data (selectable)
SHT15 serial clock (selectable)
Supply voltage. Supplies all digital and analog parts.
Open
Analog output of the measuring amplifier, set the internal MCU’s
reference to 2.5V for converting
MCU´s internal reference voltage, used for the measuring amplifier.
Activate this MCU’s output.
Pin
P1
P2
P3
P4
P5
MCU-X2
I2C_SDA_SI
SO
I2C_SCL_SCLK
GIO10
GIO5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
GIO8
GIO11
GIO12
GIO13
DVCC
\RESET
GND
ADC2
ADC1
ADC0
P16
VREF+OUT
P17
P18
VEREF-_IN
AGND
Pin
P1
P2
MCU-X5
GND
GND
Table 39: Electrometer board connector X5, connected to MCU-X5
Item / Parameter
Open
Open
Socket definition
Table 40: Connector BU1 to scanner board, female socket 4-pin
Item / Parameter
Positive supply +5V for the scanner board
I2C serial clock
I2C serial data
GND
Rev. 2012-01-20
Pin
P1
P2
P4
P3
Multiplexer
VCC
SCL
SDA
GND
88/92
SMooHS
Table 41: Connector BU2, female socket 4-pin
Item / Parameter
Open
Open
Open
Open
Pin
P1
P2
P4
P3
BU2
Table 42: Connector BU101of scanner board, female socket 4-pin
Item / Parameter
VCC input, positive supply +5V
SDA, I2C serial data
SCL, I2C serial clock
GND
Pin
P1
P2
P4
P3
BU101
I2C addressing
The multiplexer has an I2C address of 0x20, but it is possible to change the address with hardware.
Functional Areas and Connectors
Rev. 2012-01-20
89/92
SMooHS
Figure 59. Principle sketch of the functional areas and connections at the top side
12.3 Database Description
Table 43: Table structure for table Cluster
Type
Description
Field
clusterid
int
project
int
name
varchar(32)
description
varchar(400)
sensors
varchar(4096) Comma separated list of sensor IDs
Clusters are used to define a group of sensors.
Example
1,2,3
Table 44: Table structure for table Command
Field
cmdid
mote
cmd
timesend
timeanswer
answer
Type
int
int
varchar(40)
timestamp
timestamp
varchar(40)
Description
index
Mote to process command
Cmd text
Example
R 1000 2
CURRENT_TIMESTAMP
Time when answer is incoming
Ok 1234
Command transfer table. The user interface writes commands. The Gates are looking for
commands for their motes.
Rev. 2012-01-20
90/92
SMooHS
Table 45: Table structure for table Gates
Field
gateid
project
name
description
Type
int
int
varchar(32)
varchar(400)
Description
Example
Each gate has its entry
Table 46: Table structure for table Motes
Type
Field
moteid
int
gate
int
description
varchar(400)
x
int
y
int
z
int
Miranda
int
Wboot
int
Each mote has its entry.
Description
X GPS Coordinate
Y GPS Coordinate
Z GPS Coordinate
flashed Miranda ID
flashed Wboot ID
Example
0x27
0
2
1
Table 47: Table structure for table Project
Field
projectid
name
description
date
Type
int
varchar(32)
varchar(400)
timestamp
Description
Example
CURRENT_TIMESTAMP
Table 48: Table structure for table SHT15data
Type
Field
dataid
int(10)
sensor
int(10)
time
timestamp
temp
float
hum
float
Data Table for all SHT15 data.
Rev. 2012-01-20
Description
CURRENT_TIMESTAMP
Example
125445
1
1/12/2009 11:40:34
1.56
40.56
91/92
SMooHS
Table 49: Table structure for table SensorType
Field
typeid
name
description
tablename
Type
int
varchar(32)
varchar(400)
varchar(20)
Description
1
SHT15
temperature and humidity sensor
SHT15data
Example
Table 50: Table structure for table Sensors
Field
sensorid
mote
type
Type
int
int
int
description
varchar(40)
position
varchar(32)
Description
1
0x27
1
Example
With
drypack
sealed
waterproof
Church floor south west
Table 51: Table structure for table Software
Field
softwareid
name
svn
Type
int
varchar(32)
int
Description
1
Wboot
125
description
varchar(400)
Wboot version 125
crc
length
data
int
int
var(32000)
0x1234
0x978
//binary
Example
2
Miranda SHT15app
120
SHT15app
version
Johanniskirche
0x5678
0x1234
//binary
Table 52: Table structure for table Software Parameter
Field
pramid
software
name
description
address
length
type
upperlimit
lowerlimit
Rev. 2012-01-20
Type
int
int
varchar(32)
varchar(400)
int
int
int
int
int
Description
1
2
sleep time
measurement interval
0x1080
2
1
1200
1
Example
92/92

D3.2 Smart wireless sensor network platform

Transcription

Similar documents

Two forces working with the weather…

The idea with modifying stock down pipes is to gut the pre

Wireless Sensor Troubleshooting Guide

Untitled

iSCOUT PRS80

your seventh sense - L

ASSURANCE - Sensaphone

Sponsor: NXP Semiconductor Mentors: Dr. Jacob Murray, Scott Odle

EM01B Websensor

Mid-Semester Presentation 2.27 MB Wednesday, October 24, 2012