chilisin electronics corp.

CHILISIN ELECTRONICS CORP.
Company Presentation 2014
Outline
Corporate Overview
Product Introduction
Product Roadmap
Leading Brand in China
2
Company Milestones
Established A Local
Ferrite Producer
Business
Expansion
World-class
Company
Major Domestic
Player
K $USD
Acquired Belkin Int’l
120,000
Formed strategic
alliance with Yageo
Revenue
100,000
Developed HighFrequency Chip
Inductor
Developed SMD
Power Inductor
80,000
Developed Mn-Zn
and Iron Core
40,000
Company
established
1972
1977
1997
1998
1999
Established China
Henan plant
Established
Korea office
Expanded China
DongGuan plant
Established China
DongGuan plant
1990
Established
U.S. office
Established
ChinaSuZhou
office
Developed WireWound and
Multilayer
60,000
Established
second plant
Developed Molding
and Thin-Film
Technology
Public listing
on TWSE
Constructed Hukou
new HQ and plant
2000
2001
2002
2003
2005
2007 2009 2011 2014
Year
3
Sales Revenue
(KUSD )
$160,000
$141,000
$140,000
$115,000
$120,000
$120,330
$124,556
$99,433
$100,000
$80,000
$64,375
$60,000
$40,000
$20,000
$0
2009
2010
2009~2013
2011
2012
2013
Revenue Growth
CAGR
93.49%
17.94%
2014F
4
Sales Breakdown 2013 – By Region
Asia
6%
America
4%
Europe &
Others
4%
Greater China
86%
Sales Breakdown 2013 – By Market Segment
NB
Industrial 3%
3%
Consumer
13%
Automotive
2%
Communication
41%
Mobile
16%
PC
22%
6
Major Customers
PC
PC // Systems
Systems
Telecommunication
Telecommunication
Consumer
Consumer Electronics
Electronics
OEMs
OEMs // EMSs
EMSs
Automotives
Automotives
*Any trademarks or logos used throughout this presentation are the property of their respective owners,
Chilisin does not claim ownership or distribution rights of the above logos
Factory Overview
Headquarter
Hsinchu, Taiwan
Factory
Dongguan, China
Factory
Henan, China
Factory
Suzhou, China
Est. 1972
Employee: 751
Est. 1997
Employee: 1,199
Est. 2010
Employee: 518
Est. 2001
Employee: 96
-----------------------------------All factories are ISO 9001 and TS 16949 certified ----------------------------------
Wire-Winding
Molding
Multi-layering
Thin-film
Through-hole
Manufacture Site
Finished Products Inventory
8
Global Network & Support
Factory
Factory
Branch Office
Henan, China
Suzhou, China
Gwangmyeong, Korea
Chilisin HQ and
Factory
Hsinchu, Taiwan
Branch Office
San Jose, USA
Manufacturing sites
with sales offices
Sales offices
Distributors and agents
Factory
Powder Factory
Touliu, Taiwan
Dongguan, China
9
Outline
Corporate Overview
Product Introduction
Product Roadmap
Leading Brand in China
Appendix
10
Product Line and Technology
Wire-winding
Molding
Multi-layering
Thin-film Process
Power Inductor
Power Inductor
Ferrite Bead
Chip Inductor
• Wide range
• for power solution
• DIP type
• for motherboard
• Up to GHZ band
• Downsize from 0402 to
0201
• For RF application
• 0201 size +/-0.1nH
Magnetic-resin
Power Inductor
Power Inductor
Chip Inductor
• SMD type
• for notebook & tablet PC
• Baseband &RF application
• Downsize from 0402 to
0201
• 2016~3030 size
for mobile phone
• 4040~5050 size
for tablet PC
• 6060~8080 size
for TV/audio
Chip Inductor
• Ferrite core for baseband
application
• Ceramic core for RF
application
New - Power Inductor
• SMD Miniature type:
3225~2012 size, t: 0.8mm
• for handset & ultrabook
Power Inductor
• 2520~1608 size, t: 0.55mm
• for handset & ultrabook
Common-mode Choke
• 0805 package
• for USB2.0
Common Mode Choke
• for USB2.0/3.0/HDMI
11
(Million Pcs/month)
Production Capacity
Multi-layering
Molding
Total: 2,600
Total: 130
Thin-film
Through-hole
Total: 40
Total: 100
Wire-winding
Chip Inductor
Total: 140
Common Mode
Total: 30
Power Inductor
Total: 110
12
Diversified Applications
LED
Home Appliances
Server
Computing / Mobile
Display
DSC
Automotive
Mother Board
Game Console
Set Top Box
Alternative Energy
Graphic Card
Product Development Trend
High Current
60A
40A
Green Compliance
Miniaturization
20A
REACH
01005
RoHs
0201
HF
0402
<10mΩ
Ω
1.5mm
<5mΩ
Ω
1.0mm
< 1mΩ
Ω
Low Rdc
0.5mm
Low Profile
14
14
Outline
Corporate Overview
Product Introduction
Product Roadmap
Leading Brand in China
Appendix
15
Power Inductor Product Roadmap(I)
4.0*4.0*1.2
0.24~22uH
3.2*2.5*1.2
0.24~22uH
3.2*1.6*1.0
(Array 4 in 1)
2.5*2.0*1.2
0.24~22uH
2.5*2.0*1.0
2.5*2.0*1.0
L shape Termination
(Array 2 in 1)
RDC down 15%
2.5*2.0*1.0
2.5*2.0*1.0
2.5*2.0*0.6
0.47~1.0uH
2.2uH
2.1~2A
50-63mΩ
Ω 1A
138mΩ
Ω
0.47~2.2uH
2.0*1.6*1.0
2.0*1.6*1.0
6-3.2A
110-30mΩ
Ω
0.24-2.2uH
L shape Termination
9-3.2A
13-18mΩ
Ω
RDC down 15%
2.0*1.6*1.2
0.24~10uH
2014 2H
2.0*1.6*1.0
L+C Module
Metal-Molding
2.0*1.6*1.0
2.0*1.6*1.0
0.24~1.0uH
2.2uH
4.800~1.6A 25~80mΩ
Ω 1A
2014 1H
2.5*2.0*1.0
Array Type
Metal Magnetic-Wire Wound
Ferrite-Multilayer
260mΩ
Ω
2015 1H
2015 2H
2016
16
Power Inductor Product Roadmap(II)
Metal-Molding
Ferrite-Multilayer
2.0*1.6*0.8
0.24~2.2uH
2~0.4A
36~110mΩ
Ω
2.0*1.6*0.6
0.47~2.2uH
4-2.2A
45-170mΩ
Ω
2.0*1.2*1.0
2.0*1.2*1.0
0.33~1uH
L shape Termination
4.2-2.3A 58-100mΩ
Ω RDC down 15%
1.6*0.8*0.8
2.2uH
0.4A
2.0*1.2*1.0
2.0*1.2*1.0
0.16~2.2uH
2~0.7A
38~165mΩ
Ω Array 2 in 1
1.6*0.8*0.8
0.1-1.0uH
3.2-1.5A 20-150mΩ
Ω
390mΩ
Ω
1.6*0.8*0.5
0.47~2.2uH
0.4~0.2A 150~300mΩ
Ω
2014 1H
2014 2H
2015 1H
2015 2H
2016
17
Chip Inductor Product Roadmap
2.92*2.79*1.9(1008)
0.9-10nH
1300-0.55mA
0.1-0.48 Ω
1.8*1.15*0.61(0603)
1-56nH
160-420mA
45-700 Ω
Wire Wound
Thin Film
Multilayer
0.58*0.46*0.45(0201)
0.5-14nH
1250-270mA
0.2-0.44Ω
Ω
0.6*0.3*0.3(0201)
L:27~82nH
Q:10~6
IDC:120~50mA
0.6*0.3*0.3(0201)
L:100nH
Q:6
IDC:40mA
0.4*0.2*0.2(01005)
L:0.6~10nH
Q:8
IDC:200~100mA
2014 1H
2014 2H
2015 1H
2015 2H
2016
18
Chip Bead Product Roadmap
1.6*0.8*0.5
Z:26~330Ω
Ω
RDC:0.007~0.07Ω
Ω
IDC:6000~1500mA
General-Signal
Low DCR-Power
1.0*1.5*0.5
Z:33~220Ω
Ω
RDC:0.022~0.1Ω
Ω
IDC:3000~1400mA
1.0*0.5*0.5
Z:330~600Ω
Ω
RDC:0.15~0.23Ω
Ω
IDC:1200~900mA
0.6*0.3*0.3
Z:22~33Ω
Ω
RDC:0.04~0.055Ω
Ω
IDC:1800~1500mA
0.6*0.3*0.3
Z:80Ω
Ω/600Ω
Ω
RDC:0.1Ω
Ω/0.85Ω
Ω
IDC:1000mA/250mA
0.6*0.3*0.3
Z:1000Ω
Ω
RDC:2.5Ω
Ω
IDC:100mA
0.6*0.3*0.3
GHz Band
Z:600~1800Ω
Ω
RDC:1.5~3.8Ω
Ω
IDC:160~90mA
0.4*0.2*0.2
Z:10~120Ω
Ω
RDC:0.1~0.53Ω
Ω
IDC:540~240mA
0.4*0.2*0.2
Z:10~120Ω
Ω
RDC:0.07~0.5Ω
Ω
IDC:750~250mA
2014 1H
2014 2H
2015 1H
2015 2H
2016
19
Common Mode Choke Product Roadmap
Thin Film
Multilayer
1.0*1.0*0.5
Z: 40~120Ω
Ω
IDC:100mA
with ESD
1.2*1.0*0.55
Z: 40~120Ω
Ω
IDC:100mA
0.8*0.6*0.4
Z:12~90Ω
Ω
IDC:100mA
with ESD
0.6*0.5*0.3
Z:12~36Ω
Ω
IDC:50mA
2014 1H
2014 2H
2015 1H
2015 2H
2016
20
Outline
Corporate Overview
Product Introduction
Product Roadmap
Leading Brand in China
Appendix
21
Certificates and Awards
Best Supplier Award from New Kinpo (2010)(2013)
Best “Cooperate To Win” Award from Lenovo (2011)
Outstanding Supplier Award from SerNet (2011)
Best Supplier Award from Asus (2005)(2007)
Best Supplier Award from Solectron (2007)
Best Supplier Award from Zyxel (2006)(2007)
TS16949 Certification (Since 2005)
Samsung Eco-Partner Certificate (Since 2005)
ISO 14001 Certification (Since 2004)
Sony Green Partner Certificate (Since 2003)
22
Value-added Service
RFQ
Response
24hrs
Capacity
Fully
Support
100%
Customer
Satisfaction
Technical
Service
Delivery
Response
48hrs
Logistic
VMI
23
Technical Service
Work Frame for Engineering Support
Customer
Design-in
Technical
Seminar
Teams:
EE & Material
R/L/C Know-how
Product
Development
Circuit
Simulation
Material
Research &
Developmet
24
Trustworthy Supplier
Competitive Products
Full Range of Magnetics Series
Sufficient Capacity Support
Vertical integration from powder mixing to inductor manufacturing
World-class Quality
Cost Competitiveness
Quick Delivery & Flexible Logistic Support
Value-added Service
Total Solution Provider for EMI, power and RF
Design-in Capability
Professional Engineering Support
Material Research & Development
Concurrent Product Innovation
25
Appendix
26
Product Selection Guide - SMD Type
Chip
Beads
Beads
General (Signal)
SB 0201~1812
5~2700Ω / ~0.6A
GB 0603~1812
7~2000Ω / ~1A
Large Current (Power)
PB 0201~1812
7~1500Ω / ~6A
xPB 0603~1812
10~600Ω / ~9A
High Speed(Power/Signal)
NB 0402~1206
5~2700Ω / ~3A
High Freq. (Power/Signal)
HF 0402~0603
120~1800Ω /~1.5A
SBH 0402~0603
20~44Ω / ~0.4A
Inductors
Inductors
High Freq. (Signal)
CHQ 0201
0.6~22nH /
~0.9A
High Freq. (Signal)
CLH 0201~0805
0.2~390nH /
~0.6A
General (Signal)
CL 0402~1206
0.01~33uH/
~0.3A
General Power)
MP 0603~1008
0.47~4.7uH/
~1.8A
Thin
Thin Film
Film
Wire-wound
Wire-wound
Multilayer
Multilayer
Commo
Commo
nn Mode
Mode
Chokes
Chokes
USB2.0
CMF21
0805
67~120Ω
Inductors
Inductors
High Freq.
General
CS / LCN
Low Profile
CT
High Q
HQ
Large Current HC
HighQ&Current HP/PM/HPH
0402~1206
1~15000nH / ~2.4A
General Signal/Decoupling
NL/Lx 0805~1210
0.005~680uH /
~2A
SQV 1210~1812
0.1~2200uH /
~0.7A
SQC 0805~2220
0.15~10000uH /
~6A
Common
Common
Mode
Mode
Chokes
Chokes
USB2.0
IEEE1394
CMM11
0504
60~160Ω/~0.3A
CMM21/31
0805~1206
30~2200Ω/~3.7A
CMDH21
0805
67~120Ω
~0.4A
USB3.0
HDMI
CMMI21
0805
50~130Ω/~0.5A
CMMI11
0504
50~130Ω/~0.5A
Inductors
Inductors
High Freq.
TFL 0201
0.6~22nH
~0.45A
27
Product Selection Guide - SMD Type (Con.)
Power Inductors
Molded
Molded
Wire-wound
Wire-wound
Un-shielded
Un-shielded
SCD 3.5*3.0~13.0*13.0mm
H: 1.1~7.0mm
0.82~8200uH / ~9.5A
~0.2mΩ
SSL/SSL-HC
6.5*5.6~16.26*22.35mm
H: 1.0~8.0mm
1.0~1000uH / ~20A
~0.009mΩ
Shielded
Shielded
SCDS 3.2*3.2~12.5*12.5mm
H: 1.0~8.0mm
0.8 ~1000uH/~9.8A
SLPS 4.0*4.0~5.0*5.0mm
H: 1.8~2.5mm
1.0 ~47uH/~3.9A
SDS 6.6*4.45~18.54*15.24mm
H: 2.92~7.62mm
1.0~10000uH/~5.0A
SLF 6.0*6.0~12.5*12.5mm
H: 2.8~7.5mm
1.2uH ~1500uH/~13A
Magnetic
Magnetic (Metal)-resin
(Metal)-resin
Shielded
Shielded
Shielded
Shielded
Ultra
Ultra Large
Large Current
Current
LVx 2016 H: 1.0mm
MRSC 2520 H: 1.0~1.2mm
3030 H: 1.0~1.5mm
4040 H: 1.0~2.6mm
5050 H: 2.0~4.0mm
6060 H: 2.0~4.5mm
8080 H: 4.0mm
0.47~1000uH /
~13.8A
~0.01mΩ
MHCx 040 H: 1.2~2.0mm
050 H: 1.2~3.0mm
060 H: 1.2~3.0mm
100 H: 3.0~4.0mm
125 H: 3.5~4.0mm
0.1~22uH / ~46A
~0.6mΩ
Ultra Large Current
CPUN 8.8*8.4~12.3*11.7mm
H: 7.0~10.0mm
0.22~6.8uH/~37A
SFx 7.7*6.9~14.7*6.7mm
H: 5.0~7.3mm
0.1~0.51uH/~87A
MHSC 040 H: 1.5~3.0mm
060 H: 3.0mm
080 H: 6.0mm
0.22~10uH / ~40A
~1.6mΩ
MHCD 2.0*1.2~3.2*2.5mm
HEI
H:0.8~1.2mm
0.24~2.2uH / ~9.5A
~27mΩ
28
Product Selection Guide - DIP(PTH)
Coils & Power Chokes
Molded
Molded
Wire-wound
Wire-wound
Un-shielded
Un-shielded
Customized spec
BC
MB
Common Mode Chokes
BCx
Shielded
Shielded
Ultra
Ultra Large
Large Current
Current
CPU 0806~1210
H: 7.0~10.0mm
0.22~120uH / ~40A
~0.78mΩ
Shielded
Shielded
Ultra
Large
Ultra Large Current
Current
DMI 0807~1210
H: 7.5~12.0mm
0.22~4.7uH / ~45A
~0.7mΩ
Customized spec
TDH
TD/SL
TC
Customized spec
RxH
Customized spec
EMI Filter (Power/Data Line)
29
Product Selection Guide - Soft Ferrite Cores
Cores
EMI Filter
Ni-Zi Series
Iron/Ferrite power Toroid
Ferrite Series
30
Product Application – Graphic Card
Vcore
(CPU)
(SFx)
DC-DC Converter
(SCD)
(LVS/LVF)
(DMI)
(MHCx)
(SSL)
(CPUN)
EMI Filter for Power
(GBK)
(SBK)
(SBY)
(PBY)
(NBQ)
(MB)
(DMI)
EMI Filter for Signal
(CL)
(CS)
USB2.0/USB3.0/HDM
I
(CMM)
31
Product Application - Motherboard
Vcore (CPU)
(CPU)
(SFx)
DC-DC Converter
(PBY)
(LVS/LVF)
(DMI)
(MHCx)
(DMI)
(MHCx)
(CPUN)
(CPU)
(SFx)
HDMI/DVI/Analog RGB
(CMM)
USB/IEEE1394/
LAN Interface
(PBY)
(CMM)
(SCD/SCDS)
South Bridge
(CP, PBY)
Video Chip
(CLH)
(PBU)
AC Adapter
(RH)
(TFU)
(DMI)
(MHCx)
(ET/UT)
(CPU)
32
Product Application – Tablet PC
WiFi / Bluetooth
(CLH)
(NBQ,SBJ,HFJ)
Camera Unit
(SBY,CL,MPB)
3G
(CS)
(CLH)
DC-DC Converter
(PBY)
(CMM)
(LVS)
(MHCC)
(LVF)
Back Lighting
(LVS)
(LVF)
(MPB)
33
Product Application - Server
Baseband Processing
Control & Clock
Remote Radio
(Bead-NBI)
(CS)
(LVS/LVF)
(CMM)
(Bead-NBI)
(LVS/LVF)
(CLH)
(CS)
(LVS/LVF)
Filter Switch
Power Management
(Bead-PBY)
(SQV)
(LVS/LVF)
(SCD/SCDS)
(MHCC)
(DMI/CPU)
(SF)
(CLH)
(CS)
(LVS/LVF)
AC Adapter
(SCD)
(RH)
34
Product Application - Smart Phone
RF Circuit
(CLH)
(NBQ,SBJ,HFJ, CHQ)
(TFL)
Analog TV Circuit
(CLH)
(CS)
(LD)
(CMM11)
Camera Unit
(SBY,CL,MPB)
(CM)
DC-DC Converter
(LVS)
(MPB)
(LVF)
35
Product Application – Digital Camera
Analog Front End
(NBI, PBY)
Speaker
/Microphone
(BA)
Lens Motor
(NBI)
USB/HDMI
(PBY)
(BA)
(CMM)
Image
Processing IC
(NBI)
Power Supply Unit
(CL)
(LVS)
(LVF)
(BA)
(SCDS)
LCD Panel
(LVS)
(LVF)
AC Adapter
(RH)
(TFU)
(ET/UT)
Strobe Light
(NBI)
36
Product Application - Game Console
CPU
(PBY)
Controller I/F
(NBI)
USB/1394/LAN/HDD Interface
(PBY)
(CMM)
Wireless LAN
(NBQ)
(CLH)
(CL)
(CS,LCN)
(BPF)
(Balun)
Controller
(NBI)
(CMM)
(SLF)
(SCDS)
(LVS)
(RH)
(LVF)
AC Adapter
(RH)
(TFU)
(ET/UT)
Graphic
Processing
(MHCC)
(NBI,NBQ)
DC-DC Converter
(PBY)
Blu-ray Disc/DVD
(BA)
(CMM)
( NBI)
(SCDS)
(SQV)
37
Product Application - LCD TV
DSP
Tuner
(NBI, CL)
(SQV)
(CLH)
(CS, LCN)
(NBI,CL)
(SQV)
(BA)
(LVS)
(LVF)
AC Adapter
(RH)
USB/1394/HDMI Interface
(PBY)
(CMM)
Clock
(NBI)
(TFU)
(ET/UT)
LCD Back Lighting
(LVF)
(LVS)
(SCDS)
WiFi
(MPB)
Memory Card Interface
(NBI)
(CMM)
DC-DC Converter
(PBY)
(CMM)
(SCDS)
Audio
(LVS)
(LVF)
(SCDS)
38
Product Application – Set Top Box
Power Management
DC-DC Converter
(Bead-PBY)
(CMM)
(LVS/LVF)
(LVC/LVT)
(SCDS104R)
(MHCC)
RF Modulator
(Bead)
(CL/CLH)
(CS)
Video/Audio Interface
USB/IEEE1394/HDMI/DVI
(PBY)
(CMM)
AV Decorder
(Bead Array-BA)
(Bead-NBI/PBY)
(SQV)
Digital Signal Processing
(Bead-NBI)
(CL)
(LVS/LVF)
(LVC/LVT)
(SQV)
(SCDS10xR)
39
Product Application – Femtocell Base Station
Antenna
WiFi Cellular
(CLH)
(CS)
(LVS/LVF)
Baseband Processing
(Bead-NBI)
(CS)
(LVS/LVF)
(CMM)
Network Interface
USB
(CMM)
RF Modulator
(Bead)
(CL/CLH)
(CS)
Power Management System
DC-DC Converter
(Bead-PB)
(SQV)
(LVS/LVF)
(SCD/SCDS)
(MHCC)
(DMI/CPU)
Product Application - Solar Inverter
DC-DC Converter
DC-AC Converter
(BC)
41
Product Application - Automotive
Electronic Control Units
(ECU for climate control, lighting, communication…)
Controller ASICS-Filtering
Power Supply-SMPS Buck
-EMI Filtering
-Switching Mode Power
-Air Flow Control
(Bead)
(MHCC)
(SCDS5D2x)
AEC Q200
AEC Q200
AEC Q200
AEC Q200
AEC Q200
DC-DC Converter
(MHCC)
(LVS/LVF)
(SCDS5D2x)
Standard: AEC-Q200
Soldering Temp.: JEDEC-202-C
42
Product Application - Automotive
Safety & Amenity
HID Head-lighting
Ballast-EMI Filtering
LED Daylighting-Power Switch
-SMPS Buck/Boost
-Current Regulated
(Bead)
(MHCC)
(SL)
(LVS/LVF)
(MP)
(SLF06xx/07xx/10xx/12xx)
(CLH)
(CS/HQ)
Power Seat/Window
(Bead)
(CLH)
(CS/HQ)
(CL)
Power Antenna
(Bead)
(CLH)
(CL)
(CS/HQ)
ETC System
(Bead)
(CLH)
(CS/HQ)
(MP)
(SLF)
(SCDS)
Air Conditioner
(Bead)
Keyless Entry
(Bead)
(CS/HQ)
(CL)
(NL)
(CL)
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Application - Automotive
Car Entertainment Device
Audio/Stereo System
EMI Filtering
(Bead)
USB
(CMM)
Signal
(CS/CT/HQ/HC)
DC-DC Converter
(CLH)
(SCDS5D2x)
(SCDS6D2X)
(LVS/LVF)
(MHCC)
(TC)
(BC)
(BCB)
Navigation System
LCD Display/Power Supply Line
(Bead)
(CL)
DC-DC Converter/Power Supply Unit
(Bead)
(MP)
(SLF)
(SCDS6x)
(SCDS10x)
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Product Application – Home Appliances
AC Adapter
(RH)
(ET/UT)
(TFU)
Power Management
(SQV/SQC)
(LVS/LVF)
(SCD/SCDS)
(MHCC)
(DMI/CPU)
(SF)
DC-DC Converter
AC-DC Converter
(BC)
(BCB)
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Product Application – LED Lighting
EMI Solution (Bead)
for Power
(SBK)
(PBY)
(UPB)
Power Management
(SQV/SQC)
(LVS/LVF)
(SCDS)
(MHCC)
(SL/PDR)
DC-DC Converter
AC-DC Converter
(BC)
(BCB/SBCB)
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Thank you!
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