CHILISIN ELECTRONICS CORP.

CHILISIN ELECTRONICS CORP.
Company Presentation 2013
Outline
 Corporate Overview
 Product Introduction
 Product Roadmap
 Leading Brand in China
2
Company Milestones
Established A Local
Ferrite Producer
Business
Expansion
World-class
Company
Major Domestic
Player
K $USD
Acquired Belkin Int’l
120,000
Formed strategic
alliance with Yageo
Revenue
100,000
Developed HighFrequency Chip
Inductor
Developed SMD
Power Inductor
80,000
Developed Mn-Zn
and Iron Core
40,000
Company
established
1972
1977
1990
1997
1998
1999
Established
Korea office
Expanded China
DongGuan plant
Established China
DongGuan plant
2000
2001
2002
Established
U.S. office
Established China
Henan plant
Established
ChinaSuZhou
office
Developed WireWound and
Multilayer
60,000
Established
second plant
Developed Molding
and Thin-Film
Technology
Public listing
on TWSE
Constructed Hukou
new HQ and plant
2003
2005
2007 2009 2011 2013
Year
3
Chilisin Growth vs. Global Market
($USD ’000)
Global Value
($USD Million)
$3,500
$3,158 $3,000
$2,580 $2,479 $2,500
$2,408 $2,218 $2,216 $2,000
$1,500
$1,000
$500
$0
2008
2009~2012
2009
2010
2011
2012
2013F
Global
Revenue Growth
94.2%
-14.0%
CAGR
24.8%
-4.9%
Source: Paumanok Publications, Inc .
4
Sales Breakdown 2012 – By Region
Sales Breakdown 2012 – By Market Segment
Major Customers
PC / Systems
Telecommunication
Consumer Electronics
OEMs / EMSs
Automotives
*Any trademarks or logos used throughout this presentation are the property of their respective owners,
Chilisin does not claim ownership or distribution rights of the above logos
Global Network & Support
Factory
Factory
Branch Office
Henan, China
Suzhou, China
Aanyang, Korea
Chilisin HQ and
Factory
Hukou, Taiwan
Branch Office
San Jose, USA
Manufacturing sites
with sales offices
Sales offices
Distributors and agents
Factory
Powder Factory
Touliu, Taiwan
Dongguan, China
8
Factory Overview
Headquarter
Hukou, Taiwan
Factory
Dongguan, China
Factory
Henan, China
Factory
Suzhou, China
Est. 1972
Employee: 751
Est. 1997
Employee: 1,199
Est. 2010
Employee: 518
Est. 2001
Employee: 96
-----------------------------------All factories are ISO 9001 and TS 16949 certified ----------------------------------
Wire-Winding
Molding
Multi-layering
Thin-film
Through-hole
Manufacture Site
Finished Products Inventory
9
Diversified Applications
LED
Home Appliances
Server
Computing / Mobile
Display
DSC
Automotive
Mother Board
Game Console
Set Top Box
Alternative Energy
Graphic Card
Outline
 Corporate Overview
 Product Introduction
 Product Roadmap
 Leading Brand in China
 Appendix
11
Product Line and Technology
Wire-winding
Molding
Multi-layering
Thin-film Process
Power Inductor
Power Inductor
Bead Chip Inductor
Chip Inductor
• Wide range
• for power solution
• DIP type
• for motherboard
• High frequency
• Downsize from 0402 to 0201
• for handset
Magnetic-resin
Power Inductor
Power Inductor
New Products
New Products
• SMD type
• for notebook & tablet PC
Power Inductor
Common Mode Choke
Common Mode Choke
• 2016~3030 size
for mobile phone
• 4040~5050 size
for tablet PC
• 6060~8080 size
for TV/audio
Power Inductor
• SMD (miniature) type
• for handset & ultrabook
Chip Inductor
• Ferrite core for power line
• Ceramic core for signal line
& RF matching
Common Mode Choke
• for USB2.0/3.0/HDMI
Core
Formation
In-house
Powder Mixing
Technology
Powder
Formula
12
Comprehensive Product Portfolio
SMD Series
Coil Series
Soft Ferrite
Core Series
Multilayer Power Inductor
Multilayer Chip Inductor
Multilayer Chip Bead
Multilayer 0805 USB2.0 CMM
Thin Film RF Inductor
SMD Power Inductor
0805 USB3.0 CMM
SMD Power Bead
0805 USB2.0 CMM
SMD Molding Choke
0805 HDMI CMM
Chip Wire-wound Inductor
Power Line EMI Filter
Data Line EMI Filter
Toroidal Coil
RF Choke
Ni-Zn Series
EMI Filter
Iron/Ferrite Toroid
Leaded Power Inductor
Leaded Molding Choke
In-house Ferrite Core
Comparable with Murata, TDK, Taiyo Yuden, Sumida, Vishay, Coilcraft, Pulse, Wurth….
13
(Million Pcs/month)
Production Capacity
Multi-layering
Molding
Total: 2,600
Total: 85
Thin-film
Through-hole
Total: 40
Total: 100
Wire-winding
Chip Inductor
Total: 120
Common Mode
Total: 30
Power Inductor
Total: 160
14
Product Development Trend
High Current
60A
40A
Green Compliance
Miniaturization
20A
REACH
RoHs
0201
HF
01005
0402
<10m
1.5mm
<5m
1.0mm
< 2m
Low Rdc
0.5mm
Low Profile
15
Outline
 Corporate Overview
 Product Introduction
 Product Roadmap
 Leading Brand in China
 Appendix
16
Product Roadmap
Photo
Tech
CMM
CMF1210+ESD (CMM0504+ESD)
CMF1210 90Ω/120Ω
(CMM0504)
90Ω/120Ω
1.0uH/150mΩ
1.4A/1.6A
Traditional
Power
Inductor
MPx201610
(MPx201610)
MPx252010 1.0uH/48mΩ
2.5A/2.9A
(LQM2HPN_G)
HFJ0603 (BLM03HD) 600Ω/1000Ω
Photo
Tech
HFY0603 (BLM03HG) 600Ω/1000Ω
Traditional
Chip bead
UPB160805 26~120Ω UPB160805 120~330Ω
(BLM18SG_TN)
(BLM18SG_TN)
UPB1005 33~80Ω UPB1005 180~220Ω UPB1005
(BLM15PX)
(BLM15PX)
(BLM15PX)
UPB0603
UPB0603
~22Ω
(BLM03PX)
(BLM03PX)
PBY1005
~1000Ω
(BLM15AX)
SBJ0603
~600Ω
(BLM03BD)
2013 Q1
2013 Q2
2013 Q3
PBY0603 (BLM03AX) 600Ω/1000Ω
~600Ω
80Ω
UPB0603
(BLM03PX)
120Ω
Multilayer Type
2013 Q4
2014 Q1
17
Product Roadmap
AME252010
(DFE252010)
4.7uH 250mΩ 1.6A/1.2A
AME201612
(DFE201612)
4.7uH 200mΩ 1.9A/1/5A
AME201610
(DFE201610)
1.0uH 80mΩ 2.7A/2.3A
AME201610
(DFE201610)
AME252012
(DFE252012)
2.2uH 170mΩ 1.9A/1.4A
10uH 400mΩ
1.3A/1.0A
MHCD2016
MHCD2520
2.2~4.7uH
MHCD2520
≦1.5uH
Molding Type
MHCC – Amorphous powder for core material
to enhance electrical characteristics
2013 Q1
2013 Q2
2013 Q3
2013 Q4
2014 Q1
18
Product Roadmap
MDSC/MRSC25201x
2.5x2.0x1.0/1.2
Shielded, Metal
LVF121010
1.2x1.0x1.0
Shielded
LVF161010
1.6x1.0x1.0
Shielded
SCID3010
3.0x3.0x1.0
Shielded, Coupled Inductor
SCID3015
3.0x3.0x1.5
Shielded, Coupled Inductor
HP0603 1.8x1.15x1.0
High Irms
PM0603
High Irms
PM0402
High Irms
1.8x1.15x1.0
1.1x0.5x0.45
CM0302 0.9x0.5x0.45
CS0201
2013 Q1
2013 Q2
0.6x0.5x0.45
2013 Q3
Wire-wound
Type
2013 Q4
2014 Q1
19
Product Roadmap
Thin-film + Molding
Power Inductor
TFP201210
(TFM201210)
1.0uH
140mΩ
2.2A/1.3A
TFP201610
1.0uH
(TFM201610) 60mΩ
2.9A/2.2A
Commonmode choke
Thin-film
CMF0806
(CMM0302)
Thin-film
Inductor
TFL0603
(TFL0201)
2013 Q1
90Ω
~22nH
Thin-film Type
2013 Q2
2013 Q3
2013 Q4
2014 Q1
20
Outline
 Corporate Overview
 Product Introduction
 Product Roadmap
 Leading Brand in China
 Appendix
21
Certificates and Awards
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Best Partner Award from Coolpad (2012)
Best “Cooperate To Win” Award from Lenovo (2011)
Outstanding Supplier Award from SerNet (2011)
Best Supplier Award from New Kinpo (2010)
Best Supplier Award from Asus (2005)(2007)
Best Supplier Award from Solectron (2007)
Best Supplier Award from Zyxel (2006)(2007)
TS16949 Certification (Since 2005)
Samsung Eco-Partner Certificate (Since 2005)
ISO 14001 Certification (Since 2004)
Sony Green Partner Certificate (Since 2003)
22
Value-added Service
Work Frame for Engineering Support
Customer
Design-in
Technical
Seminar
Teams:
EE & Material
R/L/C Know-how
Product
Development
Circuit
Simulation
Material
Research &
Developmet
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Trustworthy Supplier
Competitive Products
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Full Range of Magnetics Series
Sufficient Capacity Support
World-class Quality
Cost Competitiveness
Quick Delivery
Flexible Logistic Support
Value-added Service
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Professional Engineering Support
Concurrent Product Innovation
Design-in Capability
Total Solution Provider
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