ISI Reballing Process - Interconnect Systems, Inc.

ISI BGA Reballing Process
September 2012
www.isipkg.com
ISI Company Overview
• Founded in 1987
• Advanced electronic design and manufacturing
facility in the U.S.
• 200 full-time employees, including 70 with
engineering degrees, and 9 technicians
• 25+ patents
• Broad and diversified manufacturing capabilities
• Thousands of solutions designed
• Millions of products shipped each year
• Subsidiaries: Nallatech and Innovative Integration
Delivering Next Level Integration
Pioneered Next Level Integration by blending high density packaging
with advanced interconnect technologies to quickly deliver
optimized modular solutions
– Multi-discipline approach improves performance, reduces size and cost,
and accelerates time-to-market
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The Need for Reballing Components
• Lead-free is not compatible with a tin-lead assembly
process; likewise tin-lead is not compatible with a
lead-free assembly process
• Industry is predominantly supplying lead-free
packages
• Customers need to reball components to alloy that is
compatible with the rest of its assembly process
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ISI Solution: Reballing
• ISI has an advanced process for removing and reballing solder spheres that
is compatible to the assembly process criteria, whether it requires:
– Tin-lead (Sn63Pb37 eutectic)
– Lead-free
– Or any specialty alloys
• Qualified by leading commercial, military and aerospace companies
• Processes are tailored to each part. Specific control parameters are clearly
defined and indicated for:
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Handling
Production
Controls for temperature
Humidity
ESD protection
Ball size/position tolerance specifications
Automation
Cleanliness
Inspection
Repackaging
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ISI Certification and Statement Of Work
All processes done in
accordance with IPC/JEDEC
J-STD sensitivity levels.
The component
temperature exposure is
minimized during the ball
removal process.
ISI Reball
Certification
All parts are reballed using
a custom temperature
profile in a nitrogen
environment.
Parts are 100% optically
inspected to ensure the
device meets the
specifications for flatness
and co-planarity.
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ISI Certification and Statement Of Work
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Reballing Process Flow
Incoming inspection procedures per Quality Assurance Procedures (QAP)
Moisture Sensitivity Level (MSL) requirements are observed and followed
Deballing process is specified based on the component
Reballing utilizes high accuracy assembly tooling for ball placement
Reflow solder profiles customized for each component
Post ball attach cleaning procedures are monitored and measured using an Ionograph
Part marking available per customer specifications on request
True position, co-planarity and flatness are measured using Nikon Nexis or RVSI model LS6000
Final inspection per QAP
Packaging: either customer supplied, JEDEC trays or tape and reel per EIA-481 with nitrogen purged dry pack
bags
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Reballing – Flux Dispense
Ekra Screen Printer
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Reballing
Ball Placement
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Reflow Ovens – Integrated Electronic Assembly
Heller Reflow Ovens
Sikama Conduction Convection Oven
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Inspection and Test
Nikon Automated Optical Inspection
Ionograph Cleanliness Testing
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Automated Optical Inspection
RVSI 100% Automated Optical Inspection
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Operations and Quality
ISO9001:2008 certified by Perry
Johnson Registrars
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• IPC Class III compliant soldering
• Certified IPC Specialist inspectors
and key operators
• In-house Certified IPC Trainer
ITAR registered
North American
facilities
ISO 9001:2008 certified
ISO certified since July 2000
ITAR Registered
Comprehensive Quality and Process Controls
Material traceability
In-process controls
Automated test, measurement, and inspection systems
All work is performed at the ISI facilities in Camarillo, CA
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The ISI Difference
• ISI’s reballing process has been audited and
approved for production by several Tier 1 defense
suppliers
• ISI process is designed and optimized to minimize
stress on IC
• 100% automated optical assembly of reballed
components
• ISI has reballed over 1,000,000 components
• Any pitch, any package, any quantity
• Fast turn-around conversion of any alloy to any alloy
including Pb-free to Sn/Pb
• Get a reballing quote in less than 24 hours
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Thank you!
For more information, please visit www.isipkg.com
© Copyright 2012 Interconnect Systems, Inc. All rights reserved.