INTERFLUX® Electronics

consumables for the electronics assembly industry
Innovation
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product catalogue
INTERFLUX® Electronics
www.interflux.com
about INTERFLUX®
INTERFLUX® Electronics NV, founded in 1985 by Mr. Daniel
Werkhoven in Antwerp, Belgium is specialised in the manufacturing of soldering fluxes, solder wires and solder
pastes for the electronics assembly and the PCB manufacturing industry.
With the development of the No-residue™ soldering flux
IF 2005M, Interflux® Electronics NV became a pioneer in
no-clean soldering. This answer to technical and environmental demands was also the start of its worldwide expansion. The success and international recognition in this highly
competitive market have also been realised thanks to the
intensive field support of a team of soldering experts, sharing its knowledge with its customers.
Today, Interflux® Electronics NV is represented in most industrialised countries all over
the world. Three strategic production facilities have been set up in Belgium (Ghent),
Singapore and China. Other Interflux® Electronics NV support offices are located in
Denmark, Estonia, France, Hungary, Italy, Norway, Poland and Sweden.
In 2008 a new production facility for solder wire, solder paste and bar solder was built next to the production buildings in Ghent, Belgium. All the buildings
of the headquarters in Ghent are connected to an
ecological waste water treatment. A photovoltaic
solar power installation of 314 solar panels with a total
capacity of 72kW is providing ‘green’ power to the offices and production buildings in
Ghent since the start of 2010.
INTERFLUX® Electronics NV
has been ISO 9001 certified
since 1998
products
index
liquid flux
alcohol based flux
3
IF 3006
low VOC flux
4
PacIFic series
VOC free flux
5
solder paste
6
water soluble solder paste
7
activated solder paste
8
SnPb or Pb-free solder wire
9
Pb-free and activated solder wire
10
solder bars, pellets and solder bath treatment
11
bga tacky gel flux for rework
12
repair liquid flux rework
13
cleaning liquids, pre-saturated wipes and Purgel
14
peelable solder mask
15
Lectro Lotion, glass plate, titration kit, density meter
16
ICSF spray fluxer systems
17
No-residueTM
No-residueTM technology
18
halogen-free
halogen-free
19
product overview
20
packaging
21
solder paste
IF 2005 series
page
Delphine series
WSP 2006
IF 9009LT
solder wire
IF 14
Flexsol, IF R88
solder
SnPb and Pb-free
gel flux
IF 8300 series
flux
IF 8001, IF 6000
cleaning
peelable mask
auxiliaries
spray fluxer
product overview
packaging
IF 710
alcohol based flux
alcohol based fluxes
The Interflux® IF 2005 series, no-clean fluxes are alcohol based and absolutely halide free.
IF 2005M is the basis of the No-residueTM technology.
√
alcohol based
√
MIL-F-14256F approved
√
√
√
√
absolutely halide free
high ICT first pass yield, no rosin or flux bodies present
for SnPb and Pb-free alloys
high compatibility with conformal coating without cleaning
Alcohol based fluxes
IF 2005M
IF 2005K
IF 2005C
->
1,8%
2,5%
3,4%
wave soldering
SnPb
250°C (482°F)
->
No-residueTM technology
wave soldering SnPb
low residue
wave soldering Pb-free
prolonged activity
IF 2005M
wave soldering
Pb-free
270°C (518°F)
selective soldering Pb-free
->
selective soldering
SnPb
280°C (536°F)
IF 2005K
* light area is the proposed area of use for the flux type
test results
flux designator
copper mirror test
silver chromate (Cl,Br)
spot test (F)
OR L0
pass
pass
pass
J-STD-004A
IPC-TM-650 2.3.32
IPC-TM-650 2.3.33
IPC-TM-650 2.3.35.1
quantitative halide
0,00%
IPC-TM-650 2.3.35
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
->
IF 2005C
selective soldering
Pb-free
300°C (572°F)
->
low VOC flux
IF 3006 is a no-clean, absolutely halide free soldering flux with a low VOC content.
It can be used in Pb-free and SnPb applications.
√
azeotropic solvent mix (±25% water)
√
up to 60% reduction of VOC emissions possible compared to alcohol based flux
√
√
absolutely halide free
high ICT first pass yield, no rosin or flux bodies present
for foam and spray applications
Low VOC flux
IF 3006
wave soldering
SnPb
3,2% azeotropic flux
wave soldering
Pb-free
wave and selective soldering
selective soldering
SnPb
IF 3006
proposed area of use of the IF 3006 flux in white
test results
flux designator
copper mirror
silver chromate (Cl,Br)
spot test (F)
OR L0
J-STD-004A
pass
IPC-TM-650 2.3.32
pass
IPC-TM-650 2.3.35.1
pass
IPC-TM-650 2.3.33
quantitative halide
0,00%
IPC-TM-650 2.3.35
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
selective soldering
Pb-free
low VOC flux
√
VOC-free flux
VOC-free flux
All fluxes in the PacIFic series are no-clean, completely water based and absolutely halide
free.
√
100% water based, no VOC emissions
√
wave and selective soldering
√
√
√
absolutely halide free
high ICT first pass yield, no rosin or flux bodies present
for spray and foam applications
PacIFic series VOC-free fluxes
spray fluxing
PacIFic 2009M
PacIFic 2009MLF-E
3,7% low residue
3,7% reduced solder balling
wave soldering
wave and selective soldering
PacIFic 2009MLF
3,7% ultra low solder balling
wave and selective soldering
PacIFic 2010F
2,5% low residue
wave soldering, foam fluxer
foam, spray fluxing
PacIFic 2011F
3,7% increased activity
test results
flux designator
copper mirror
silver chromate (Cl,Br)
spot test (F)
OR L0
J-STD-004A
pass
IPC-TM-650 2.3.32
pass
IPC-TM-650 2.3.35.1
pass
IPC-TM-650 2.3.33
quantitative halide
0,00%
IPC-TM-650 2.3.35
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
wave soldering, foam fluxer
solder paste
The Interflux® Delphine no-clean, absolutely halide free solder paste series.
√
absolutely halide free
√
ICT testable
√
no-clean, easy cleanable
√
low voiding
air, N2 or vapour phase soldering
squeegee drop off
residue tackiness
residue spread
paste rolling
print definition
hidden pillow
solder paste
√
abandon 2hours
void level
tack
spreading OSP
slump cold
slump hot
wetting OSP
humidity resistance
properties radar graph
solder paste
_ Delphine 5504
_ DP 5505
Delphine 5504
RE L0
high Pb/ high temp, no-clean
printing and dispensing
DP 5505
RO L0
no-clean, anti hidden pillow,
low voiding
printing and dispensing
test results
availability
copper mirror test
pass
IPC-TM-650 2.3.32
spot test (F)
pass
IPC-TM-650 2.3.35.1
silver chromate (Cl,Br)
quantitative halide
surface insulation
flux corrosion
pass
0,00%
IPC-TM-650 2.3.33
alloys
Pb-free
IPC-TM-650 2.3.35
pass
IPC-TM-650 2.6.3.3
pass
IPC-TM-650 2.6.15
melting range
name
217-219°C SAC 305
217-219°C SAC 387
217-219°C SAC 405
219-227°C Low SAC
221°C
SnPb
PbSn
227°C
179°C
183°C
SnAg
SnCu
Sn62
Sn63
287-294°C PbSnAg
composition
Sn96,5Ag3,0Cu0,5
Sn95,5Ag3,8Cu0,7
Sn95,5Ag4,0Cu0,5
SnAgCuX
SnAg
Sn99,3Cu0,7
Sn62Pb36Ag2
Sn63Pb37
Pb92,5Sn5,0Ag2,5
water soluble solder paste
water soluble solder paste
The Interflux® WSP 2006 is an absolutely halide free, water soluble solder paste.
√
halide free
√
SnPb and Pb-free alloys
√
√
easy water washable
ICT testable
WSP 2006 must be cleaned.
to clean WSP 2006, water of
30°C (86°F) without saponifier or detergent is advised.
Followed by a final D.I.
rinse.
solder paste
WSP 2006
OR M0
SnPb and Pb-free alloys
test results
availability
copper mirror test
pass
IPC-TM-650 2.3.32
spot test (F)
pass
IPC-TM-650 2.3.35.1
silver chromate (Cl,Br)
printing and dispensing
pass
IPC-TM-650 2.3.33
quantitative halide
0,00%
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
alloys
Pb-free
IPC-TM-650 2.3.35
melting range
name
217-219°C SAC 305
217-219°C SAC 387
217-229°C SAC 405
219-227°C Low SAC
221°C
227°C
SnPb
179°C
183°C
SnAg
SnCu
SnPbAg
SnPb
composition
Sn96,5Ag3,0Cu0,5
Sn95,5Ag3,8Cu0,7
Sn95,5Ag4,0Cu0,5
SnAgCuX
SnAg
Sn99,3Cu0,7
Sn62Pb36Ag2
Sn63Pb37
activated solder paste
The Interflux® IF 9009LT is a no-clean solder paste with extra activation for difficult to solder surfaces.
√
increased activity
√
SnPb, SnBi and Pb-free alloys
√
easy cleanable, cleaning before wire bonding
ICT testable
activated solder paste
√
solder paste
IF 9009
LT
RE L1 SnPb, SnBi and Pb-free alloys printing and dispensing
test results
availability
copper mirror test
pass
IPC-TM-650 2.3.32
spot test (F)
pass
IPC-TM-650 2.3.35.1
silver chromate (Cl,Br)
pass
IPC-TM-650 2.3.33
spread test (mm²)
137,89
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
alloys
Pb-free
melting range
217-219°C
217-219°C
IPC-TM-650 2.4.46
217-219°C
219-227°C
221°C
227°C
SnPb
179°C
183°C
name
SAC 305
SAC 387
SAC 405
Low SAC
SnAg
SnCu
SnPbAg
SnPb
composition
Sn96,5Ag3,0Cu0,5
Sn95,5Ag3,8Cu0,7
Sn95,5Ag4,0Cu0,5
SnAgCuX
SnAg
Sn99,3Cu0,7
Sn62Pb36Ag2
Sn63Pb37
IF 14 solder wire
IF 14 solder wire
The Interflux® IF 14 series solder wires for Pb-free and SnPb alloys.
√
colophony free
√
low residue
√
√
absolutely halide-free
easy brushable residue
solder wire fluxes
IF 14
RE L0
No-residueTM - low residue
Pb-free and SnPb alloys
IF 14 series for manual soldering, repair and
touch up on class 1,2 and 3 type products.
IF 14-22 is ideal for high thermal mass through
hole soldering.
IF 14-06, IF 14-09, IF 14-10 and IF 14-14 for
SnPb alloys
IF 14-16 and IF 14-22 for Pb-free alloys
availability
wire name
IF
IF
IF
IF
IF
IF
14-06
14-09
14-10
14-14
14-16
14-22
availability
flux cont.
0,6
0,9
1,0
1,4
1,6
2,2
%
%
%
%
%
%
diameters mm
(inch)
alloys
Pb-free
0,35-0,5-0,7-1-1,5-2
500g spools for diameters 0,5 to 1,5mm
name
221°C
SnAg3,5
217-219°C SAC 305
217-227°C low SAC
(.014-.020-.027-.040-.060-.078)
100g spools for diameters 0,35mm or smaller
melting
range
227°C
SnPb
179°C
183°C
SnCu
SnPbAg
SnPb
composition
Sn96,5Ag3,0Cu0,5
Sn96,5Ag3,5
Sn99Ag0,3Cu0,7
Sn99,3Cu0,7
Sn62Pb36Ag2
Sn63Pb37
solder wire
Interflux® Flexsol 903 and IF R88 solder wires for Pb-free and SnPb alloys.
√
extensive range
√
suited for automated, robotic soldering
√
Flexsol 903: absolutely halide free
Pb-free and SnPb alloys
solder wire fluxes
Flexsol 903
IF R88
RO L0
RO L1
halide free - low spatter
RMA - increased activity
Flexsol 903
IF R88
Pb-free and SnPb alloys
availability
availability
wire name
Pb-free and SnPb alloys
solder wire
√
flux cont.
2,2 %
3,5 %
0,9 %
2,2 %
3,5 %
diameters mm
(inch)
0,35-0,5-0,7-1-1,5-2
alloys
Pb-free
(.014-.020-.027-.040-.060-.078)
0,35-0,5-0,7-1-1,5-2
(.014-.020-.027-.040-.060-.078)
100g spools for diameters 0,35mm or smaller
500g spools for diameters 0,5 to 1,5mm
melting
range
name
221°C
SnAg3,5
217-219°C SAC 305
217-227°C low SAC
SnPb
227°C
179°C
183°C
SnCu
SnPbAg
SnPb
composition
Sn96,5Ag3,0Cu0,5
Sn96,5Ag3,5
Sn99Ag0,3Cu0,7
Sn99,3Cu0,7
Sn62Pb36Ag2
Sn63Pb37
solder
The Interflux® solder for Pb-free and SnPb alloys.
√
extensive range
√
SnPb and Pb-free alloys
√
√
bars, pellets and solid wires
high purity, low oxidation levels
solder
solid wire on spools
for autofeeding selective
soldering machines
anti-oxidant pellets
for leaded and lead free
solder
solder bars
de-oxidation oil
alloy
description
melting point
(approx.)
composition
SAC305
Lead-free, Tin-Silver-Copper alloy with 3% silver (Ag) content
Lead-free, Tin-Silver-Copper alloy with 3,8% silver (Ag) content
217-219°C
Sn95,5 Ag3,8 Cu0,7
SAC0307
Lead-free, Tin-Silver-Copper alloy with 0,3% silver (Ag) content
217-227°C
Sn99 Ag0,3 Cu0,7
SA30
Lead-free, Tin-Silver alloy with 3,0% Ag to correct high Cu levels in a SAC bath
221°C
Sn97 Ag3
SnCu
Lead-free, Tin-Copper alloy with 0,7% copper
227°C
Sn99,3 Cu0,7
Sn62
Tin-Lead alloy with 36% lead (Pb) and 2% silver (Ag)
179°C
Sn62 Pb36 Ag2
SAC387
SAC0807
Sn100
Sn63
Lead-free, Tin-Silver-Copper alloy with 0,8% silver (Ag) content
Pure Tin (Sn 100%)
Tin-Lead alloy with 37% lead (Pb)
217-219°C
217-227°C
232°C
Sn96,5 Ag3 Cu0,5
Sn98,5 Ag0,8 Cu0,7
Sn100
183°C
Sn63 Pb37
232°C
Sn100
solder bath treatment
A-O Sn
Anti-oxidant pellets for Pb-free alloys (green label)
IF 910
De-oxidation oil to separate oxides from solder on a solder bath
A-O PbSn
Anti-oxidant pellets for SnPb alloys (blue label)
183°C
Sn63 Pb37
gel flux
The Interflux® IF 8300 series, no-clean, absolutely halide free tacky gel fluxes. For local application, rework and repair of bga and other components.
√
100% halide free
√
high tack for component fixation
√
no-clean
√
for SnPb and Pb-free alloys
√
low residue
long profile resistance
gel flux
√
viscosity
<-
210 kcps
more solid
IF 8300
<-
70 kcps
<->
IF 8300-4
->
25 kcps
more liquid
IF 8300-6
tacky gel flux
IF 8300
RE L0
210 kcps
IF 8300-6
RE L0
25 kcps
IF 8300-4
RE L0
70 kcps
test results
copper mirror test
silver chromate (Cl,Br)
spot test (F)
pass
IPC-TM-650 2.3.32
pass
IPC-TM-650 2.3.35.1
pass
IPC-TM-650 2.3.33
quantitative halide
0,00%
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
IPC-TM-650 2.3.35
jar, syringe
jar with brush
jar with brush
->
liquid rework flux
liquid rework flux
The Interflux® IF 8001 is a no-clean, absolutely halide free liquid rework flux. Typically applied by means of a soft brush pen.
√
100% halide free
√
RE L0
√
√
√
√
for SnPb and Pb-free alloys
available in refillable ESD safe pen or non-refillable pen
no-clean
low residue
The Interflux® IF 6000 is a rosin based, no-clean, absolutely halide free liquid rework flux.
Typically applied by means of a soft brush pen.
√
100% halide free
√
RO L0
√
√
√
√
no-clean, easy cleanable with IPA
available in refillable ESD safe pen or non-refillable pen
for SnPb and Pb-free alloys
suited for BGA repair
liquid rework flux
IF 8001
IF 6000
RE L0
RO L0
59,9 mgKOH/g
67,5 mgKOH/g
test results
copper mirror test
silver chromate (Cl,Br)
spot test (F)
pass
IPC-TM-650 2.3.32
pass
IPC-TM-650 2.3.35.1
pass
IPC-TM-650 2.3.33
quantitative halide
0,00%
surface insulation
pass
IPC-TM-650 2.6.3.3
flux corrosion
pass
IPC-TM-650 2.6.15
IPC-TM-650 2.3.35
pen, bottle
pen, bottle
cleaning
The Interflux® range of cleaning products make use of specially developed solvents for
different cleaning operations like solder paste removal, adhesive removal, etc.
Interflux® pre-saturated cleaning wipes are made of clean room grade, non woven fabric.
√
pre-saturated
√
for manual cleaning
√
√
special solvents
refill bags for flip-top tubs
low odour
cleaning
√
Pre-saturated wipes
Stencil clean
IPA/ DI
Adhesive remover
cleans solder paste from stencils,
tools, misprinted boards, etc.
as final wipe to Stencil clean and
Adhesive remover, general cleaner
cleans smt adhesive from stencils,
tools, misprinted boards, etc.
size 15x21cm
lint-free, non woven
size 15x21cm
lint-free, non woven
size 15x21cm
lint-free, non woven
100 pcs/ roll
100 pcs/ roll
100 pcs/ roll
stencil clean roll
other cleaning products
Stencil clean roll
ISC 8020
Purgel
IF 930
Tip Cleaner
Stencil clean roll for use in stencil printer
under screen cleaning.
liquid cleaner solvent based for use in
stencil printer under screen cleaning
dispense pump cleaner/ conditioner for
Archimedes screw and jetter systems
DupontTM Sontara fabric
compatible with solder
paste
Mydata tested and approved for MY 500
cleans wettable nozzles in selective soldering systems, replaces adipic acid
safe and easy, one-step
cleaning
to clean soldering iron tips
peelable solder mask
peelable solder mask
The Interflux® IF 710 Peelable solder mask for local masking applications.
√
very fast drying
√
easy peelable
√
√
√
natural latex based
for SnPb and Pb-free processes
RoHS compliant
auxiliaries
The Interflux® IF Lectro Lotion hand lotion.
√
ESD safe and protective
√
for handling electronic equipment
contains aloe vera
The Interflux® IF solder wave glass plate.
√
extremely heat resistant
√
grid lines for easy reading
√
210mm x 297mm
The Interflux® IF titration kit.
√
complete kit for flux titration
√
in hard shell case
√
dedicated pipettes
The Interflux® IF density meter.
√
flux density check
√
dedicated range for wave soldering fluxes
√
with temperature compensation
auxiliaries
√
spray fluxers
spray fluxers
Interflux® offers the first modular spray fluxer systems to suit even the most demanding situations.
The spray fluxer systems consist of 3 modules: a spray fluxer module, a control box module and a flux in
feed module, which can be combined to suit a specific situation.
module 1: Spray Fluxer module
Slim Line (SL)
-
auto width sensor
backup width control
rodless cylinder
spray nozzle
air knife
Ultra Slim Line (USL)
- ultra slim design may be
combined with an existing
foam fluxer
- easy access to manual width
control
- rodless cylinder
- spray nozzle
- plug in connections
module 2: Control box module
dc module
- incoming board sensor
- forward/ backward glider
speed control
- manual timing setting
- single/ dual spray selection
- flux spray pressure
module 3: Flux in feed module
gravity tank
-
9 litres flux tank in HDPE
1 litre thinner tank in HDPE
mounting bracket
stainless steel valves
integrated flux flow regulator
sc module
- incoming board sensor
- forward/ backward glider
speed control
- manual timing setting
- encoder mode
- single/ dual spray selection
- flux spray pressure
siphon tube
- flux flow regulator
- stainless steel tube
Compact (CP)
-
economical design
manual width control
rodless cylinder
spray nozzle
plug in connections
No-residueTM technology
No-residueTM technology is putting no-clean soldering flux on a higher level when it comes to
cleanliness, ionic contamination and long term reliability. It involves the possibility to totally eliminate any post soldering residue of the flux.
To get in a No-residueTM situation a few conditions have to be fulfilled. These conditions have to
be met in both the composition of a particular soldering flux and in the soldering process used
for this flux. The principle of a No-residueTM soldering flux is to use only flux ingredients that can
be eliminated, during the soldering process itself by evaporation under normal process conditions.
No-residueTM technology
As a result rosins, resins, waxes and other substances, often used as a flux body or for residue
containment, cannot be present in a No-residueTM soldering flux. These ingredients are used to
form a post soldering layer to cover and shield any unconsumed flux ingredients or reaction
products like halogens or metal salts that have the potential to compromise the reliability and
(ionic) cleanliness of a printed circuit board. Interflux®, as a rule, does not use halogens or
bodies in its fluxes.
No-residueTM fluxes provide the best cleanliness without performing the actual step of cleaning
no-clean flux with residue
No-residueTM flux
In the process of soldering the guidelines and recommendations for preheat temperatures and
solder contact times provide a good starting point to get to a No-residueTM situation. With the
right amount of flux, preheating, solder contact and solder temperature, a No-residueTM situation can be achieved. Areas with flux that are shielded from either solder contact or preheating
automatically will fall under the no-clean classification where residue might be present and visible but is safe to be left uncleaned.
Figurative graph showing the areas of evaporation of
the components in a No-residueTM flux
temperature
in °C
area of evaporation of No-residueTM
flux solids
area where flux solids are in crystalline form
T <160°C
time
(unrelated scale)
No-residueTM and conformal coating/ potting
When using fluxes based on No-residueTM technology
there is already a very high level of compatibility
with the conformal coating.
A conformal coating only works well when the adherence of the coating to the printed circuit board is
guaranteed. Adherence failure of a conformal coating in most cases occurs on those spots on the
boards where a ‘substance’ is found between conformal coating and printed circuit board. These ‘substances’ could be flux residue.
It is clear that No-residueTM fluxes have an advantage over normal no-clean fluxes.
halogen-free
halogen-free
Cl, Br and F are halogens that are traditionally present in soldering materials like solder paste, soldering
fluxes and solder wire, but they are also found in solder masks, printed circuit boards, components, cables, connectors and wires. Halogens have the property of staying active on all temperatures.
The chemical reaction:
Halogens combine with metals. The reaction product is a metal salt that usually stays on the board after
soldering. These metal salts may absorb moisture from the air.
2CuO + 2Cl2 = 2CuCl2 + O2: Cu binds with Cl - metal salt formation
The difference with lead containing alloys:
The water solubility of the metal salts:
Water solubility is an indicator for corrosion sensitivity. Looking at the metal salts
formed with Cl, the most commonly used halogen in soldering materials one sees that the
metal
halide
metal salt solubility in water
(20°C-86°F) g/ 100ml
affinity for humidity
Sn
Cl
SnCl2
83,90
very high
Cu
Cl
CuCl2
70,60
very high
Pb
Ag
Cl
Cl
PbCl2
AgCl
Table 1 : water solubility of the metal salts
0,99
89x10-6
very low
very low
tin chloride and the copper chloride are the most water soluble. When changing over to lead free, the increased tin content will have the biggest influence on the increased water solubility. The metal salts formed
with SnAgCu for example will be about 50% more water soluble than the metal salts formed with SnPb.
Unconsumed soldering chemistry :
A major concern on the market lately is the influence of unused flux chemistry on the electronic circuits.
Soldering processes like selective soldering and selective wave soldering may have fluxed spots that are
not covered by the solder contact area, resulting in unused flux chemistry remaining on the board. The
issue in this, is that standard reliability tests, that are done to check the influence of flux residues, do not
cover these situations. A minor presence of halogens in the flux can already cause major reliability problems in these cases.
Risks:
Electro migration or corrosion is very dependent on the conditions a board is operating in. After some
time, residue can show some fatigue signs like cracks and the metal salts may get in contact with the atmosphere. When operated in an atmosphere with high humidity, electro migration is very likely to happen. A problem is that the standard surface insulation resistance (SIR) tests and electro migration tests
are not always able to reveal this phenomenon. These tests are performed with a certain temperature and
relative humidity but do not take fatigue into account. The safest solution for this moment is to solder without halogens.
Absolutely halogen free:
Most solder pastes, soldering fluxes and solder wires are classified according to IPC-standards. The IPC
Standard, IPC J-STD-004A (2004) allows a halogen content of 0.05% halogens for a 'L0'-classified product. Also European standard EN 61190-1-2 (2002) allows 0.01%halogens for a 'L0'- classified product. The
current test methods to determine the presence of halides are susceptible to manipulation. This means that
in most cases, one will have to rely on the manufacturer.
Conclusion:
If for a certain application, an absoluetly halogen free soldering product is available, it certainly is the
safest choice.
INTERFLUX® products, absolutely halogen-free: the rule, not the exception
notes
2,5
1,0
0,9-2,2-3,5
2,2 - 3,5
2,2
1,6
1,4
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
Pb-free, high Pb
SnPb and Pb-free
SnPb and Pb-free
SnPb, Pb-free
Pb-free
Pb-free
Pb-free
SnPb
SnPb
SnPb
SnPb
OR M0 SnPb and Pb-free
RE L0
RE L1
RO L0
RO L1
RO L0
RE L0
RE L0
RE L0
RE L0
RE L0
RE L0
water based
water based
water based
water based
alcohol based
alcohol based
alcohol based
manual, automated soldering
manual, automated soldering
high thermal mass, through hole soldering, repair
manual, automated soldering, repair
low spattter, manual, automated soldering, repair
easy brushable, manual soldering, repair
water washable
high melt alloys
extra activity
water soluble*, easy post reflow cleaning
Pb-free, component manuf., high melting point alloys
difficult to solder surfaces
printing, dispensing
printing, dispensing
printing, dispensing
printing, dispensing
manual, automated soldering
manual soldering
manual soldering
manual soldering
easy brushable, manual soldering, repair
manual soldering, repair
manual soldering
manual soldering
manual soldering, repair
SMD soldering, repair
brush
brush
repair, BGA soldering
water soluble* repair, BGA soldering
syringe, brush
brush
pen, brush
pen, brush
foam, spray, jet
foam, spray, jet
foam, spray, jet
spray, jet
spray, jet
spray, jet
foam, spray, jet, dip, pen
foam, spray, jet, dip, pen
foam, spray, jet, dip, pen
application
repair, BGA soldering
repair, BGA soldering
BGA repair, manual soldering
low residue manual soldering
wave and selective soldering
wave soldering, foam fluxing, increased activity
wave soldering, foam fluxing
selective and wave soldering, anti solder ball
selective and wave soldering, lowers solder balls
wave soldering
selective soldering
Pb-free wave soldering
no-residueTM - SnPb wave soldering
main process use
anti hidden pillow general first choice paste, air or N2
extra activity
fast wetting
fast wetting
low residue
low residue
very low residue
very low residue
no-residueTM
gel flux
gel flux
gel flux
gel flux
alcohol based
alcohol based
low VOC
Sn Pb and Pb-free water based
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
SnPb and Pb-free
Pb-free and SnPb
SnPb and Pb-free
alloys
OR M0 SnPb and Pb-free
RE L0
RE L0
RE L0
RO L0
RE L0
OR L0
OR L0
OR L0
OR L0
OR L0
OR L0
OR L0
OR L0
OR L0
activity
* water soluble means post reflow residue always has to be cleaned.
This is not a no-clean process
WSP 2006
Delphine 5504
IF 9009Lt
Solder paste . DP 5505
IF R88
Flexsol 903
IF 14-22
IF 14-16
IF 14-14
0,9
IF 14-10
IF 14-09
0,6
flux content
25 kcps
70 kcps
210 kcps
viscosity
7,55
8,55
3,2
3,7
Solder wire . IF 14-06
WSGF 2006
IF 8300-6
IF 8300-4
Gel flux . IF 8300
IF 6000
Repair flux . IF 8001
IF 3006
PacIFic 2011F
3,7
PacIFic 2010F
PacIFic 2009MLF
3,7
PacIFic 2009MLF-E
PacIFic 2009M
3,7
3,4
2,5
IF 2005C
IF 2005K
1,8
solids (%)
Flux . IF 2005M
no-clean.products
product overview
product overview
WSP 2006
Delphine 5504
IF 9009Lt
DP 5505
IF R88
Flexsol 903
IF 14-22
IF 14-16
IF 14-14
IF 14-10
IF 14-09
IF 14-06
WSP 2006
IF 8300-6
IF 8300-4
IF 8300
syringes: 10cc, 30cc
jars: 250g, 500g
cartridges: 6oz (177cc), 12oz (355cc)
ProFlowTM
spools: 100g (Ø 0,35mm)
500g,
1kg, 4kg (Ø 2mm and up)
syringes: 10cc, 30cc (IF 8300 only)
jar with or without brush: 30cc
250ml squeezable bottle
IF 710
IF 6000
HDPE bottles: 100ml, 250ml, 500ml, 1l
HDPE drums: 10l
refillable flux pen, non-refillable flux pen
refillable flux pen, non-refillable flux pen
HDPE drums : 10l, 25l, 200l
standard packaging
IF 8001
IF 3006
PacIFic 2011F
PacIFic 2010F
PacIFic 2009MLF
PacIFic 2009MLF-E
PacIFic 2009M
IF 2005C
IF 2005K
IF 2005M
products
package overview
syringe: 5cc, 10cc
jar: 250g
bag ± 10g wire
syringes: 2cc, 5cc, 310cc
cartridge: 32oz (946cc)
spray bottle
HDPE bottles: 100ml, 250ml, 500ml, 1l
special or sample packaging
package overview
worldwide
INTERFLUX® Electronics
Eddastraat 51
9042 Gent
Belgium
www.interflux.com
N.V.
INTERFLUX®
INTERFLUX®
INTERFLUX®
INTERFLUX®
INTERFLUX®
INTERFLUX®
INTERFLUX®
INTERFLUX®
INTERFLUX®
China
Danmark Aps
Eesti Ltd
France
Hungary Kft
Norge As
Singapore Ltd
Skandinavia AB
Poland
www.interflux.com.cn
www.interflux.dk
www.interflux.ee
www.interfluxfrance.com
www.interflux.com
www.interflux.no
www.interflux.com.sg
www.interflux.se
www.interflux.pl
Represented by:
© INTERFLUX®. The Interflux® IF logo and trade name are registered trade marks of Interflux® Electronics N.V.