semiconductor manufacturing equipment
Transcription
semiconductor manufacturing equipment
GoIndustry Group STATE-OF-THE-ART SEMICONDUCTOR MANUFACTURING EQUIPMENT > KARL SUSS MA6 MASK ALIGNER > GASONICS L3510 DOWNSTREAM PHOTORESIST STRIPPER KARL SUSS MA150 MASK ALIGNER BY ORDER OF AMERICAN ELECTRONIC COMPONENTS, INC. (AECI) REPRESENTING Formerly Lucent Technologies Microelectronics Group 2525 North 12th Street, Reading, Pennsylvania (Approximately 60 Miles Northwest of Philadelphia) • WAFER FABRICATION PHOTOLITHOGRAPHY PLASMA PROCESSING WET PROCESSING DEPOSITION THERMAL PROCESSING • METROLOGY/INSPECTION • LASERS • ASSEMBLY • AUTOMATIC TEST EQUIPMENT • ENVIRONMENTAL • TEST INSTRUMENTATION • POLISHING WEDNESDAY & THURSDAY NOVEMBER 13 & 14 AT 9:00 A.M. http://www.michaelfox.com e-mail: [email protected] DAVID S. FOX, PA. LIC. NO. AU-002273L, ROBERT D. SHERMAN, PA. LIC. NO. AU-002566L, GILBERT SCHWARTZMAN, PA. LIC. NO. AU-002428-L WAFER FABRICATION PHOTOLITHOGRAPHY KARL SUSS MA150 Mask Aligner. KARL SUSS MA6 Mask Aligner. KARL SUSS RC8 Photoresist Coat/Bake Tool. C&D SEMICONDUCTOR 8832CTD/8836HPO 2-Track Photoresist Developer. C&D SEMICONDUCTOR 8826PC/8836HPO 3-Track Photoresist Coater. C&D SEMICONDUCTOR 8838VP Vapor Prime Tool. PERKIN-ELMER Micralign 552HTR Projection Mask Aligner. PERKIN-ELMER Micralign 552 Projection Mask Aligner. C&D SEMICONDUCTOR 8826 3-TRACK PHOTORESIST COATER PLASMA PROCESSING LAM RESEARCH RAINBOW 4420B PLASMA ETCHER LAM 4420B Poly/Nitride Plasma Etcher. GASONICS L3510 Downstream Photoresist Stripper. GASONICS Aura 1000 Downstream Photoresist Stripper. MARCH AP 1000 Plasma Cleaning System, NEW. APPLIED MATERIALS P-5000 Plasma Etchers. (4) APPLIED MATERIALS 8330 and 8110 Plasma Etchers. METROLINE/IPC 9204 Plasma Barrel Stripper, NEW. (2) BRANSON/IPC 9104 Plasma Barrel Strippers. (3) BRANSON/IPC P-2100 Plasma Barrel Strippers. C&D SEMICONDUCTOR 8832 2-TRACK PHOTORESIST DEVELOPER C&D SEMICONDUCTOR 8838 2-HEAD VAPOR PRIME TOOL MARCH AP-1000 PLASMA CLEANER KARL SUSS MA150 MASK ALIGNER KARL SUSS RC8 PHOTORESIST COATER FUSION M-150PC PHOTORESIST STABILIZER SEMITOOL EQUINOX 4-HEAD PLATER A 10% BUYER’S PREMIUM APPLIES TO ALL ON-SITE PURCHASES 2 STS MULTIPLEX CVD EDDY E-BEAM EVAPORATOR VEECO-ION TECH SPECTOR ION BEAM DEPOSITION TOOL VEECO MS50 LEAK DETECTOR VEECO-ION TECH SPECTOR CONTROLLER WAFER FABRICATION, cont. WET PROCESSING DEPOSITION THERMAL PROCESSING SEMITOOL Equinox 4-Head Wafer Plater. (2) STS Multiplex CVD PECVD Tools, NEW. (4) MRL Coyote 430, 8", 4-tube, (3) LPCVD, (1) Oxidation. VEECO/ION TECH Spector 3-Target Ion-Assisted PVD Tool. TEMPRESS 81103, 8", 3-tube, LPCVD Furnace. EDDY C36A E-Beam Evaporator. AG ASSOCIATES 4108 Rapid Thermal Processor. SEMITOOL Equinox Single-Head Wafer Plater. FSI Mercury Spray Acid Tool. UNIVERSAL PLASTICS/AKRION UP-V2 Solvent and Acid Wet Stations, w/robotics, NEW. REYNOLDS TECH LCD-25-PVDF Auto Gold Etch Tool. REYNOLDS TECH LCD-25-PVDF Auto Chrome Etch Tool. (37) SEMITOOL Mdls. 8300, 870S, 860F, 860S, 870D, 260S Spin Rinser Dryers. SEMITOOL SSTF2211270F SPRAY SOLVENT TOOL VERTEQ 1600-55 Spin Rinser Dryers, numerous. SPUTTERED FILMS 18" PVD Tool. VARIAN 3190 and 3180 PVD Tools. VARIAN 160-10 Ion Implanter. AG ASSOCIATES 4100 Rapid Thermal Processor. AG ASSOCIATED 610 Rapid Thermal Processor. (3) BRUCE BDF-41 Diffusion Furnaces. (2) ALCATEL ASM180T Leak Detectors. (2) BRUCE BDF-4 Diffusion Furnaces. VEECO MS50 Leak Detector. (3) BRUCE BDF-8 Diffusion Furnaces. SOME ITEMS SUBJECT TO PRIOR SALE 3 METROLOGY/INSPECTION KLA/TENCOR 5200 Overlay Registration Tool. KLA/TENCOR Surfscan 6220 Wafer Surface Inspection Tool. KLA/TENCOR Surfscan 7700 Wafer Surface Inspection Tool. KLA/TENCOR P-10 Profilometer. KLA/TENCOR Omnimap NC110. NANOMETRICS Nanospec/AFT 9100 Film Thickness Measurement Tool. (2) NANOMETRICS Nanospec/AFT 4000 Film Thickness Measurement Tools. (2) NANOMETRICS Nanospec/AFT 210UV Film Thickness Measurement Tools. SCI Film Tek 4000-A Reflectometer, NEW. FLEXUS 2320I Film Stress Tester. TENCOR P-10 PROFILOMETER FSM Film Stress Tester. (4) ZEISS Axiotron Microscopes. (2) ZEISS Universal Microscopes. NIKON Optiphot 66 Nomarski Microscope. (20) NIKON Optiphot 66 Microscopes. NIKON Metaphot Microscope. KLA/TENCOR SURFSCAN 6220 WILD M8, M420 Stereo Microscopes. LEITZ Miniload 2 Microhardness Tester. LASERS EO TECHNICS CSM2000 Laser Wafer Marker. WILD STEREO MICROSCOPES LUMONICS Lightwriter WAMS-50 Laser Marking Tool. (6) ESI 80 Laser Memory Repair Tools. AOI FX 5050 Fiber Optics Laser Welder, w/NEC FX-1801 Laser. NANOMETRICS NANOSPEC/AFT 9100 FILM THICKNESS MEASUREMENT TOOL ZEISS UNIVERSAL MICROSCOPES NIKON MEASURING MICROSCOPE SCI FILM TEK 4000-A 4 SOME ITEMS SUBJECT TO PRIOR SALE LEITZ MINILOAD 2 MICROHARDNESS TESTER ASSEMBLY (41) K&S 1488L Turbo Plus Ball Bonders. (3) K&S 1419-3 Ball Bonders. (22) KAIJO FB-118A Ball Bonders. (4) ESEC 3018 Ball Bonders. (2) ASYMTEK Millennium Glue Dispensers. WEST-BOND 7476-E79 Manual Wedge Bonder. (2) LAURIER DS-4000 Speed Star Pick and Place Tools. (4) LAURIER DS-3000 Pick-and-Place Tools. SEMICONDUCTOR EQUIPMENT CORP. 860 Eutectic Die Bonder. DISCO DAD-321 Dicing Saw. DISCO DFD S/8 Dual-Spindle Dicing Saw. ASSEMBLY TECHNOLOGIES 1100 Dicing Saw. LAURIER DS-4000 SPEED STAR PICK & PLACE TOOL DYNATEX DX-3 WAFER SCRIBER/BREAKER TECA-PRINT ICS2300 Auto Pad Printer. TECA-PRINT ICS2200 Auto Pad Printer. (2) FICO TFM2A Auto Trim and Form Presses. SEMICONDUCTOR TECHNOLOGIES 4070 Lead Inspection Tool. VIKING 1042 Pick and Place Tool. DYNATEX GST-150 Wafer Scriber/Breaker. (3) DYNATEX DX-III Wafer Scriber/Breakers. LOOMIS 38LD Wafer Scriber. SEC 860 EUTECTIC DIE BONDER LAURIER DS-3000 PICK & PLACE TOOL DYNATEX GST-150 WAFER SCRIBER/BREAKER K&S 8028 AUTO WIRE BONDER K&S 982-2 DICING SAW 5 AUTOMATIC TEST EQUIPMENT < LTX FUSION SOC TESTERS (2) LTX Fusion System on Chip Testers. (2) TERADYNE A580 Analog Testers. (2) LTX Synchromaster HT Testers. (33) PWS P5 Probers. (2) AETRIUM 5050 IC Handlers. (2) ASECO S-170-D IC Handlers. (2) ASECO S-150 IC Handlers. (5) ADVANTEST T3340 Memory Testers. DELTA DESIGN Turbo Flex IC Handler. ELECTROGLAS 4090u Prober. SCHLUMBERGER 1DS5000 HX E-Beam Prober. (2) ELECTROGLAS 2001CXE Probers. SCHLUMBERGER IDSP2X Focused Ion Beam Milling/Deposition System. ELECTROGLAS 2001X Prober. ENVIRONMENTAL ELECTROGLAS 4090u WAFER PROBERS (2) THERMOTRON SE-600-3-3 Temperature Chambers, NEW. (2) THERMOTRON SE-600-5-5 Temperature Chambers, NEW. THERMOTRON F-32-CHV-15-15 Temperature Chamber. TENNEY JR. TEMP. CHAMBERS (3) AEHR TEST Max 2 Burn-In Ovens. (2) AEHR TEST ATS12100 Burn -In Ovens. TABAI ESPEC ECT2 Temperature Chamber. (8) TENNEY Jr. Temperature Chambers. BLUE-M, several various models. INSTRUMENTATION HEWLETTPACKARD and TEKTRONIX Oscilloscopes, Power Supplies and Analyzers. (2) AGILENT 86142B Optical Spectrum Analyzers, NEW. (8) AGILENT 86141B Optical Spectrum Analyzers, NEW. BUEHLER FIBRPOL POLISHERS (5) AGILENT 86140B Optical Spectrum Analyzers, NEW. (2) HEWLETTPACKARD 70951B Optical Spectrum Analyzers. (5) HEWLETTPACKARD 8153A Lightwave Multimeters. (8) HEWLETTPACKARD 8156A Optical Attenuators. (20) KEITHLEY 2510 Source Meters, NEW. (20) KEITHLEY 2000 Multimeters, NEW. (10) ILX Lightwave LDT-5910B Temperature Controllers, NEW. (2) TEKTRONIX 576 Curve Tracers. (20) IOTECH Extender 488 Interface Busses. POLISHING LOGITECH IWBT2 WAFER BONDER (2) AEHR TEST 12100 BURN-IN OVENS (4) LOGITECH PM528 Wafer Polishers. (3) BUEHLER Fibrpol Polishing Machines. LOGITECH PM4 Wafer Polisher. LOGITECH and CRANE Conditioning Rings. LOGITECH IWBT2 Wafer Substrate Bonder. CRANE Lapmaster 12 Polishing Machine. LOGITECH and CRANE Wafer Fixtures. FACILITIES KINETIC SYSTEMS Vibraplane Isolation Tables, numerous. TENNEY & BLUE M ENVIRONMENTAL CHAMBERS NESLAB HX-75 CHILLERS 6 TERRA UNIVERSAL Dessicator Boxes, numerous. NEWPORT RESEARCH Optical Benches and Isolation Tables, numerous. BOEKEL Dessicator Boxes, numerous. (17) NESLAB HX-75 Recirculating Chillers. METRO Racks, numerous. INTERNATIONAL LOCATIONS TO BE SOLD BY VIDEO FROM READING, PA SITE • SINGAPORE • (14) K&S 1488L Turbo Plus Wire Bonders, w/K&S 2929 MHS, 870 PRS REV.1. 65 -0-08, 7-11-9 -04A OPERATING SYSTEM. (2) SEMITOOL 870S Spin Rinse Dryers. SEMITOOL 8300 Spin Rinsers Dryer. Custom-Made Machined Mold Press Components. (4) ESEC 3018 Wire Bonders. (2) FICO TFM2A Trim and Form Presses. (1 OF 14) K&S 1488L TURBO PLUS WIRE BONDERS BLUE M ELECTRIC DCA-256CY Oven, s/n DC4699. (4) FUJI ELECTRIC FDP -723M RF Preheaters. (2) BLUE M ELECTRIC MP-1406KY Ovens. EVER TECHNOLOGIES FP -330A BQFP Lead Conditioning, s/n ETS -A780. TRIGON Sigma 101NS IC Handler. (2) BLUE M ELECTRIC MP-246 -EY Ovens. TRIGON Sigma 102NS IC Handler. BLUE M ELECTRIC MP-246SRY Ovens. (2) TRIGON Sigma 101 IC Handlers. KELVINATOR UC109-2 Low Temperature Freezer. (4) ADVANTEST T3340 SANYO MDF-435 Memory Testers. Industrial Freezer. (22) KAIJO FB-118A (3) OLYMPUS SZ40 Microscopes. Wire Bonders. (5) DELTA DESIGN 1210 Ovens. BLUE M ELECTRIC MP-256RY-HP Oven, s/n Y10E223515YE. (7) BLUE M ELECTRIC DCA -256RY-MP Ovens. OLYMPUS SZ30 Microscopes. (3) KINERGY Robotic Lead Frame Loaders. (2) RVSI SYSTEMATION ST-50 Tape and Reel Machines, s/n’s 75110, 7590. TECA-PRINT ICS-2200 Pad Printer. (1 OF 2) FICO TFM2A TRIM & FORM PRESSES AESCO S-170-D IC HANDLER • BANGKOK, THAILAND • (2) ASECO S-150 Handlers. TECA-PRINT ICS-2300 Pad Printer. (2) LTX SYNCHOMASTER-HT Testers, w/Sparc Ultra NIC upgrades. (1 OF 2) LTX SYNCHROMASTER HT TESTERS (2) AETRIUM 4098 Handlers. (20) K&S 1488L Turbo Plus Wire Bonders, w/Flex Line III MATERIAL HANDLING SYSTEM. ICE 5T Trim and Form Press. FICO TFM2A TRIM & FORM PRESS (3) AETRIUM 5050 IC Handlers. (2) ASECO S-170-D IC Handlers. EO TECHNICS CSM 2000 Laser Wafer Marker. TECA-PRINT ICS-2300 PAD PRINTER (3) AST 960 Marking Machines. AMERICAN TECH MANUFACTURING AT -1045FP Lead Conditioning Tool. ICE SP -5T Auto Trim and Form Press. (2) DUSAN 5500 Presses. (2) ICE SP -5T Manual Trim and Form Presses. KAI N WAH Hydraulic Press System. SEMITOOL 8300 & 870S SPIN RINSE DRYERS 7 TERMS OF SALE NO WARRANTIES: Every item and lot in the “Auction” is sold: (a) “AS IS, WHERE IS, AND WITHOUT RECOURSE,” and (b) with no warranties, guarantees or representation of any kind or variety, whether expressed, implied or otherwise. MACHINERY: A 10% buyer’s premium applies to the purchase price of all on-site purchases. A 13.5% buyer’s premium applies for all on-line purchases. Cash or certified funds required in full at the time and place of auction. Non-certified checks will NOT be accepted unless accompanied by a valid bank letter of guarantee, which must be in the following format: This bank guarantees payment to Michael Fox International from (name of customer) on account #_________ up to the amount of $______. This letter is valid for purchases at the auction held at Agere Systems on Wednesday and Thursday, November 13 and 14. AUCTION SITE INSPECTION Monday and Tuesday, November 11 and 12 from 10:00 A.M. to 4:00 P.M. or by appointment. AIRPORT DIRECTIONS From the Philadelphia International Airport: I-95 South to I-476 North for approximately 15 miles to I-76 West for approximately 4 miles to the Pennsylvania Turnpike. Take the Pennsylvania Turnpike west to I-176 North. Drive approximately 17 miles to Route 422 West. Drive approximately 5 miles to Route 12 East. Drive approximately 2.5 miles to the 11th Street exit. Turn left onto North 11th Street. Turn right onto Agere Way to auction site. AIRPORT & TRANSPORTATION The area is served by the Reading Municipal Airport, approximately 5 miles northwest of the auction site and the Philadelphia International Airport, approximately 60 miles southeast of the auction site. OVERNIGHT ACCOMMODATIONS Hampton Inn..............................................................................(610) 374-8100 Homewood Suites .....................................................................(610) 736-3100 Sheraton.....................................................................................(610) 376-3811 INFORMATION PROVIDED IS BELIEVED TO BE ACCURATE, BUT IS NOT GUARANTEED LEASING INFORMATION PRE-APPROVED LEASE/FINANCE CREDIT LINE AVAILABLE In order to establish a lease/finance credit line for qualified purchasers that can be used for purchases at this or future Michael Fox International auctions, please contact... Horizon-Keystone Leasing Services John Messersmith Phone (800) 514-2323 • Fax (800) 606-0037 The auction bidder must provide Michael Fox International, Inc. with a letter from the lease/finance company in the following format: The lease finance company ________ guarantees payment to Michael Fox International, Inc. on a non-contingent basis for purchases at the auction of Agere Systems on November 13 and 14. STATE-OF-THE-ART SEMICONDUCTOR MANUFACTURING EQUIPMENT FIRST CLASS MAIL POSTMASTER: Dated Material. Please Deliver Promptly. EXECUTIVE OFFICES 11425 CRONHILL DRIVE, OWINGS MILLS, MARYLAND 21117 (410) 654-7500 • (800) 722-3334 • Fax (410) 654-5876 NORTH AMERICAN OFFICES CALIFORNIA, CANADA, FLORIDA, ILLINOIS, MARYLAND, MASSACHUSETTS, MICHIGAN, NEW YORK, PENNSYLVANIA, TEXAS INTERNATIONAL OFFICES INCLUDING UNITED KINGDOM, AUSTRIA, BELGIUM, GERMANY, POLAND, TURKEY, CHINA, INDONESIA, KOREA, PHILIPPINES, SINGAPORE, MALAYSIA, THAILAND www.industrialauctioneers.org http://www.michaelfox.com e-mail: info@ michaelfox.com WEDNESDAY & THURSDAY NOVEMBER 13 & 14 9:00 A.M. EACH DAY READING, PENNSYLVANIA IP-2145131 Presorted First Class Mail U.S. Postage PAID Eugene, Oregon Permit No. 305