NANIUM, Largest European Pure Play Packaging Foundry

NANIUM, Largest European Pure Play Packaging Foundry

Nanium Overview
NANIUM’s historical background
1996
1999
2006
2010
NANIUM is an independent company in the semiconductor market,
providing contract Assembly and Engineering Services for WLP,
Assembly & Test.
Shareholder Structure
Text
Text
Portuguese
State
41,06%
17,88%
41,06%
Text
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A world-class facility in Europe
● A state-of-the-art facility located in Portugal,
near Porto, with > $1B cumulated investment.
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NANIUM Infrastructure Overview
One-Stop-Service for Customer / Turnkey Solutions
Wafer
Probe
Probe Test
WLP
300mm
Component
Assembly
Lithography
Grinding
Dicing
Sputtering (PVD)
Electro-Plating
Parametric
Wafer Test
Wet Etching
Component
System Test
BurnIn
Test During BI
Wafer Molding
Packing (Trays,
Tape & Reel)
Wire Bonding
Wafer Thinning
Ball Dropping
Electrical
Characterization
Molding
Trim & Form
Ball Dropping
Material Analysis
Final Test
Parametric and
Functional
Preconditioning
Singulation
Pick, Flip & Place
Qualification
Modules Test
Application Test
Reliability
Marking
Laser Fusing
Repair
Labs &
Engineering
Die Attach
Plating
Furnace
Logistic &
Shipping
Inspection
Systems
Drop Shipping
Distribution
Failure Analysis
SMT for Modules
A world-class facility for die / wafer / module level assembly, test & packaging.
Fully certified ISO/TS 16949, ISO 9001, ISO 14001 and OHSAS 18001.
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World Class Wafer Level Equipment
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Wafer Level Packaging (WLP)
Fan-In WLP up to 300 mm
WLCSP
Spheron® Plated Cu Redistribution technology
licensed by Flip Chip International’s (FCI)
APPLICATIONS
WLCSP product’s application includes:
 Mobile and Consumer Products - Handsets
 Wireless Connectivity including Bluetooth, WLAN, FM radio, GPS, A-GPS
 Analog and other ICs like MEMS and Sensors
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More than 300 million units shipped
eWLB
Fan-out technology licensed by Infineon/Intel
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Packaging, Assembly & Test services
Multi Chip Packages (MCP) / Micromodules
● NANIUM also has extensive volume manufacturing experience of multi-chip memory
packages, combining Wafer-level RDL techniques (redistribution) with multiple die stacking
in a package.
● NANIUM’s large technology portfolio combined with its strong engineering know-how and
experience enable new innovative MCP/SiP configurations (stacked, side-by-side, MEMS,
Sensors, cPV, HB-LED Packages)
Complex MCP
Micromodules / Chip on
board COB
MEMS & Sensor packages
SiP / MCM
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WLP – The Top Ten OSAT WLP Assemblers
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
Amkor Technology
FlipChip International
NANIUM
STATS ChipPAC
ASE
Hana Micron
SPIL
Unisem
UTAC
J-Devices
Market Researcher „New Venture
Research“ ranks NANIUM as Nr.3
in the „World Top Ten OSAT
WLP Assemblers“ by
units produced.
Source: „Chip Scale Review“
March-April 2013
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2010 – 2020 FO-WLP Market evolution
FOWLP Revenues
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NANIUM’s differentiated value proposition
Safe and secure environment
IP protection, highest safety standards
High Quality
16 years of experience, qualified at major OEM/ IDM’s
High Volume / Cost effective manufacturing
competitive with Asian OSAT’s
High Flexibility / Complexity / Leadership
experienced in new product development & industrialization
Complete engineering service offer
highly qualified and experienced engineers
World-class facilities & equipment
NANIUM S.A. - 2013 - Confidential
Thank you for
your attention
NANIUM S.A.
Avenida 1 ̊ de Maio 801
4485-629 Vila do Conde
Portugal