PAC TECH Company Profile

Transcription

Introducing
Pac Tech Packaging Technologies GmbH
Corporate Profile
Technology & Product Overview
Certified ISO 9001 & ISO TS 16949
Confidential
Pac Tech Group - Corporate Profile
1995 Pac Tech GmbH founded in Berlin, Germany as spin-off
from Fraunhofer-IZM
1997 1st Manufacturing facility: Pac Tech Europe
- Germany
2000 2nd Manufacturing facility: NAGASE
- Japan
2001 3rd Manufacturing facility: Pac Tech USA
- USA
2005 Equipment Field Service & Support Center
- Thailand
Pac Tech Europe (HQ)
2006 NAGASE & Co., Ltd. takes 60% shares in Pac Tech
2008 4th Manufacturing facility: Pac Tech Asia
- Malaysia
2009 NAGASE & Co., Ltd. increases shares in Pac Tech to 74%
Pac Tech USA
2011 > 600 Production Machines in the field
Pac Tech Group (Europe, USA, Asia):
Annual sales revenue Pac Tech Group (2011):
230 employees
24 Mio. Euro
Pac Tech Asia
2
Confidential
NAGASE & CO., Ltd. - Profile
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Founded:
Paid-in Capital:
Sales:
Net Income:
Employees:
Stock:
June 18, 1832
100 million US$
7.94 billion US$
154 million US$
4,500 (Consolidated)
Listed TSE-1, OSE-1
• Business Segments:
• Electronics:
Epoxy Encapsulants , Underfill and Resists for
WLP, LCDs etc
• Plastics:
Resins, Plastics, Film or Sheet products etc
• Chemicals:
Petrochemicals, Pigments, Solvents, Additives
25 mfg sites & 13 sales offices in Japan
17 mfg sites & 37 sales offices offshore
3
Confidential
Pac Tech Group - Worldwide Locations
Pac Tech USA Inc
Santa Clara, CA
Boston
Sweden Finland
Denmark
Pac Tech GmbH
France
Nauen, Germany
Italy
Tokyo
Korea
Nagase
Shanghai, Nagase ChemteX
Israel
Himeji, Japan
China
Taiwan
Pac Tech Customer Service Center
Bangkok, Thailand
Philippines
Pac Tech Asia Sdn. Bhd.
Penang, Malaysia
Pac Tech/Nagase facilities
Singapore
Sales Agent/ Distributor
4
Confidential
Selection of Key Customers
5
Confidential
Pac Tech Memberships
6
Confidential
Worldwide Subcontractor Services
Wafer Level Bumping & Packaging
PacTech Asia
PacTech Europe
PacTech USA
•Eless Ni/Au & NiPdAu UBM
•Solder Balling/ Solder Jetting
•Wafer Level Solder Balling
•Wafer Thinning/Grinding
•Wafer Backmetallisation
•Laser Backside Marking
•Wafer Sawing/Dicing
•Tape & Reel
•AOI
•Tape & Reel
•AOI
•Wafer Level RDL
•X-Ray inspection
•FC-Assembly
•CSP BGA Ball Rework
•NiFe Plating for MEMS
•Tape & Reel
•AOI
•Wafer Level RDL
Plan 2012:
•Electrical Test
•Wafer Level RDL
•FC & Capacitor Assembly
Plan 2012:
•Cu Electro Plating
•FC & Capacitor Assembly
7
Confidential
Advanced Packaging Equipment
PacTech Asia
• Sales & Demo Center
PacTech Europe
• Solder Jetting & BGA Rework/Repair:
SB²-M, SB²-SM, SB²-Jet
• Wafer Level Solder Balling:
Ultra-SB² 200/300
• Wafer Level Solder Rework/Repair:
Ultra-SB² 200/300 WLR
• Flip Chip Bonder:
LAPLACE- FC, LAPLACE-Cap/- Can
• Electroless Bumping Line:
PacLine 200/300 A50
• Spin Coating System:
SpinPac ASC 200/300
• Plasma Cleaning/Ashing:
PlasPac 200
• Wafer Backside Marking:
LS² 200/300
• Customized equipment for photovoltaic &
solar industry
• Reflow Oven:
RFM/RFA 200/300
PacTech USA
• Sales & Demo Center
8
Confidential
Business Unit A
Wafer Level Bumping & Packaging
- Subcontractor Service -
9
Confidential
Worldwide Use of Pac Tech’s WLP Services
Power Devices &
Automotive
40%
RFID
30%
Telecom
5%
Medical
5%
Aerospace & Defense
10%
Computer &
Consumer Electronics
10%
10
Confidential
Pac Tech Quality System Overview and Roadmap

Pac Tech GmbH established with more than 15 years of
quality manufacturing experience in semiconductor industry

All Pac Tech sites are certified to ISO quality system standards
 Pac Tech Germany – ISO 9001 & TS16949
 Pac Tech USA – IS0 9001
 Pac Tech Asia – ISO 9001 & ISO 14001

Pac Tech Asia planned certifications for ISO/TS16949 certification
by Q3 2012
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Confidential
AI
- Wafer Level UBM -
12
Confidential
Electroless NiAu/NiPdAu Plating & Bumping Services
1. E-less Bump
- RFID adhesive attach
on antenna
- LCD driver
2. E-less UBM
for solder ball
attach
- Wafer Level CSP
- Flip chip
3. E-less OPM
for fine pitch wire
bonding
- Automotive high rel./
high temp. wire bonding
- Copper wire bonding
- Wire bonding on active
pad Aluminum or Copper
4. E-less Metallization
for PowerMOSFET
application
- Clip attached
- Wire bonding and
soldering
13
Confidential
Comparison of Solder Bumping Technologies
Evaporated Solder
Bump
C4 Solder
Sputtered UBM +
Plating
Sputtered UBM +
Print (FCI)
Electroless UBM (+)
Solder Ball Attach
Solder
Solder
Solder
Ni/Au
Au
14
Confidential
Process Flow - Ni/Au & Ni/Pd/Au Bumping
Al Pad
Cu Pad
Zinkating
Pd Seed
Ni Plating
Flash Au
FC & WLCSP
Pd Barrier
Flash Au
Flash Au
Thick Au
Wire Bonding,
FC & WLCSP
Wire Bonding
15
Confidential
Electroless Ni/Pd/Au Bumping on Al or Cu
Backside Coating
Aluminum Cleaning /
Cu Cleaning
Zincate / Palladium
Pretreatment
Electroless Nickel
Electroless Palladium
Immersion Gold
Coating Removal
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Confidential
Pac Tech Design Rules* For Ni/Au - Bumping
Criteria
Specification
Substrate Material
Si, SiGe, InP, GaAs, LiTa, Ceramic, Organic, Glass,
Quartz
Passivation
Defect free without any residues on
the bond pads
Passivation Material
Minimum Aluminum Thickness (Flip-Chip)
Minimum Aluminum Thickness (WL-CSP)
Pad Metallisation
Minimum Copper Thickness (optional)
Scribe Line
Si-Nitride, Si-Oxide, PSG, Polyimide, BCB
0.8 (0.5) µm
2.0 (1.5) µm
Al, AlSi, AlCu, AlSiCu, Cu
0.3 µm
Must be isolated (by thermal oxide), test pads and
structures are acceptable
Minimum Pad to Pad Distance
Minimum Pad Size (standard process)
Minimum Pad Size (optional: fine pitch process)
Pad Geometries
Minimum Wafer / Substrate Thickness
Wafer Backside
2 x hUBM + 10µm
40µm x 40µm
10µm x 10µm
any
175 µm (8’’), 100 µm (4‘’)
Standard: Thermal Oxide, Back lapped: Silicon
On Request: Metal: Ag, Au, Cu, etc., Ceramic
Probe Marks
Ink Dots
Laser Fuses
Al fuses
poly Si fuses
Acceptable (if < ¼ of pad size)
Acceptable, stability of ink has to be checked
Not acceptable
acceptable (with limitations)
* Detailed package of design rules available on request
17
Confidential
Advantages of ENIG UBM
• Low Capital Investment Cost (by in-house installation)
ElectroPlating:
10-20 Mio. US$
Electroless UBM + Solder Print/Ball:
3-5 Mio. US$
• High Throughput
600.000 wafer per year (8“); 450.000 wafer per year (12“)
Lowest
Process Cost
• Maskless Process
No tooling required
• Compatible for wafer from 4“ to 12“
no additional invest for different wafer sizes
• Proven Reliability and Production History
Performance
• NiAu and NiPdAu for Optimized IMC Growth and Reliability
• Compatibility with all FC and WLCSP-Assembly processes
Soldering
ACF
NCP
Applications
• Suitable for Al and Cu pad metallization
• Compatibility with Au and Cu Wire Bonding
18
Confidential
Pac Tech Group Worldwide
Wafer Bumping Capacity - ENIG
4”-8” Wafer/Year
12” Wafer/Year
Pac Tech Europe
600k
450k
Pac Tech USA
600k
450k
Nagase Japan
600k
450k
Pac Tech Asia
600k
450k
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Confidential
A II
- Wafer Level Solder Bumping -
20
Confidential
Solder Bumping and Other Applications
1. Solder Ball Attach
- Wafer Level CSP
2. Solder Ball Attach
- Flip chip bumps
3. Fluxless and
Speciality Laser
assisted Solder
Attach
- 3D HDD Modules
- 3D Camera Modules
- High rel. Aerospace
Solder bumping
- Rework and Repair
4. Speciality Solder
Printing and
Components
Attached on
Wafer
- Special capacitor
resistor and component
attach on wafer level
21
Confidential
Sphere Transfer
Vacuum
Laser Jet
Reflow
Laser
Capillary
Pick up Spheres
Drop Balls & Reflow
Align to Wafer
Lower Spheres
Raise Head
Reflow
22
Confidential
Wafer Level Solder Sphere Transfer 1/3
Vacuum picking of
solder spheres from
reservoir to stencil
Removal of excess
balls by US
&
optical inspection of
balls in stencil
Vacuum
Bond Tool
Solder Ball
Mask
Vibration
Floating Solder
Balls by US
Jumping Solder
Balls by Air knife
Air knife
23
Confidential
Placement of solder
spheres
Per robot back to
cassette
&
optical inspection of
balls on wafer
Solder Ball
Next step: Reflow
Bond Tool
Mask
Flux
Wafer
UBM
24
Confidential
Ultra-SB² 200/300
200/300mm wafer chuck
Dual endeffector & Prealigner
Stencil mounted on vacuum
transfer head
25
Confidential
Solder Sphere Jetting (SB²)
Schematic diagram of Solder Ball Bumping (SB²) process:
Optical sensor
Ball Reservoir
Laser
Singulation Disk
Optical
sensors
Pressure
sensor
N2
N2 gas
Capillary
Reflowed
solder balls
Search level
Bond level
Semiconductor wafer
Bond pad
26
Confidential
Business Unit B
Advanced Packaging Equipment
- Manufacturing & Sales -
27
Confidential
Pac Tech Equipment
SB²-M
SB²-SM
SB²-Jet
BGA, CSP Solder Rework
Solder Jetting
Solder Jetting
Ultra-SB2 300
Ultra-SB2 300 WLR
PacLine 300 A50
WL Solder Balling
WL Solder Ball Rework
Electroless Plating Line
28
Confidential
Pac Tech Equipment
MegaPac 200/300
Wafer Level Flux Cleaning
SpinPac ASC 200/300
Spin Coater
Reflow Oven RFM 300
Wafer Level Reflow
PlasPac 200/300
LAPLACE-HT
LAPLACE-FC
Plasma Cleaning
High Throughput Laser Bonding
Flip Chip Bonding
29
Confidential
BI
Equipment for Electroless Ni/Au UBM
Turnkey Solution:
- Equipment
- Process Transfer
- Chemistry
30
Confidential
Turnkey Bumping Solutions
Equipment
Process
Chemistry
One Source!
Volume Wafer Bumping
matched to Customer’s
Supply Chain Requirements
4 Locations Worldwide:
2nd Sourcing!
Development Support in
Customer’s R&D Center
Time Zone
Turnkey Process Transfer
to Customer possible at
Any Time
Worldwide Support and Highest Quality
through Turnkey Process Ownership!
31
Confidential
Business Development
Installed Equipment for ENIG & ENEPIG UBM/OPM & Technology Transfer/Licenses of Pac Tech
Growth
Japan
China
USA
Japan
Malaysia
Germany
France
USA
USA
USA
Japan
2000
France
Philippines
Korea
2005
2010
Year
2012
32
Confidential
PacLine 300 A50
14 ENIG Plating Systems in the Field @ major OEM’s
300 mm
33
Confidential
PacLine 300 A50
Parallel processing of 3 baskets with each 50 wafer 8“ or 3 baskets with each 20 wafer 12”
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UPH: max. 150 wafer 8"/hour or max. 60 wafer 12”/hour (5µm Ni/Au UBM)
Thick Au ability for wire bonding reliability
Ni bath control with ConPac 2.0 (bath conditioner) and ConPac control set
Central Computer Control Unit (CCCU)
PLC with Profi Bus system
Additional security tanks for each module and pump system
Design will be adapted to customer’s facility
SECS GEM Interfacing
The system fulfills the fire safety standard FM 4910
34
Confidential
B II
SB2- Jet Equipment
(Laser assisted Solder Jetting)
35
Confidential
SB² Equipment
SB²-M
BGA, CSP Solder
Rework/Reballing
SB²-SM
Solder Jetting
SB2-Jet ESD
SB2-SMs
Solder Jetting for
HGA & HSA
Solder Jetting for
Camera Modules
SB²-Jet
Solder Jetting
SB²-SM R2R
Solder Jetting
36
Confidential
SB2 - Jet Advantages
• No tooling
• Solder ball diameter capability:
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50µm - 760µm (qualified for volume production)
40µm & 30µm (in qualification)
• Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
• No flux
• No mechanical stress/contact
• No thermal stress
• No additional reflow
• No cleaning of flux residues
• Fine pitch applications (< 80µm)
37
Confidential
SB2 - Jet Applications
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BGA/ cLCC Balling
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Rework/ Repair of BGA-like packages
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Hard Disk Drive (HGA, HSA)
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Camera Modules
Head Gimbal Assembly for Hard Disk Drives (Source: Seagate)
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Wafer Bumping
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Wafer Level CSP Bumping
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Optoelectronics/ Microoptics
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Filter Devices (SAW, BAW)
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MEMS & 3D-Packaging
Solder Jetting for Microoptics
Reworked Package
38
Confidential
SB² - Solder Jet Speed & Ball Diameter:
Roadmap
30µm
40µm
Solder Ball Diameter
& Speed
50µm
10 balls/sec
60µm
80µm
7 balls/sec
100µm
120µm
6 balls/sec
200µm
5 balls/sec
3 balls/sec
2000
2004
2008
2010
39
Confidential
B III
Equipment for
Wafer Level Solder Ball Transfer
40
Confidential
Process Flow Ultra-SB2 300
Wafer Loading
Fluxing
Solder Ball Vacuum Pick-up (US agitation)
High Speed 2D Wafer Inspection (Stencil)
Alignment of Stencil to Wafer (Dual Camera)
Solder Ball Transfer to Wafer
High Speed 2D Inspection (Wafer)
Conduction Reflow (N2)
Wafer Unloading
Standard
Optional
41
Confidential
Automatic Wafer Level Solder Ball Transfer with
„Ultra-SB² 300“
• Cassette to Cassette robot handling for
wafer up to 12“
• Integrated rework capability for yield
Improvement (optional)
• 2x optical inspection (optional)
• ball sizes: 60µm - 500µm
• Integrating fluxing (optional)
• Integrated reflow oven (optional)
• UPH 8“
>40 wafer/hour *
• UPH 12“
>25 wafer/hour *
* depending on ball size and on I/O count
42
Confidential
Application for Micro Ball Placement with
„Ultra-SB² “
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8“ wafer
Pitch 200µm
400,000 I/O‘s
100µm SnAgCu
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12“ wafer
Pitch 225µm
740,000 I/O‘s
100µm SnAgCu
43
Confidential
B IV
Equipment for
Wafer Level Solder Ball Rework before Reflow
44
Confidential
Process Flow Ultra-SB2 300 WLR
Wafer Loading
Wafer Alignment
High Speed 2D Wafer Inspection
Removal of misaligned & excessive balls
Re-fluxing of repair locations (dispense)
Placement of spheres
High Speed 2D Wafer Inspection
Wafer Unloading
Standard
Optional
45
Confidential
Automatic Wafer Level Solder Ball Rework for
Yield Improvement with „Ultra-SB² 300 WLR“
• Cassette to Cassette robot handling for wafer up to 12“
• Integrated 2-D AOI
• missing ball
• double ball
• ball shape etc.
• Integrated rework capability for yield improvement
• single ball placement
• single ball removal
• ball sizes: 60µm - 500µm
• UPH 8“
~25 wafer/hour
• UPH 12“
~25 wafer/hour
46
Confidential
BV
LAPLACE Equipment for
- Flip Chip Bonding
- Capacitor Bonding
- Cantilever Bonding
47
Confidential
LAPLACE with Reel-To-Reel-System
48
Confidential
LAPLACE-Applications
LCD Driver Assembly
Flip chip on antenna for
contactless smart cards
ACF
NCP
coil
reed
SMDs ASIC
4,8
24 mm
49
Confidential
Flip Chip Modules for contactless Smart Cards
Substrate handling: reel to reel
Assembly: Flip Chip using LAPLACE soldering
50
Confidential
Capacitor Bonding
LAPLACE Capacitor Attach on PCB
51
Confidential
Cantilever Assembly Line for Probe Cards
1. Cantilever Sorter
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Input: MEMS substrates
Inspection of cantilever
Laser cutting with the Laser
Placement of cantilever in
waffle packs
2. SB2-Jet: Solder Jetting
• Solder Jetting on
ceramic substrate
• Solder Balls sizes:
30 – 760 µm,
• Solder alloys capability:
PbSn, SnAgCu or AuSn
3. Cantilever Bonder
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Cantilever supplied in waffle packs
Cantilever pick & rotation in vertical position
Substrate height measurement
Dual camera for x,y alignment of cantilever
to the substrate
Probe tip z alignment
Laser bonding of cantilever
Post inspection
Cantilever rework capability
52
Confidential
Cantilever Bonder Specifications
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Linear axis or gantry system
Probe card sizes up to 13 inch
Full process control
Alignment control by position bonding
Placement Accuracy: down to +/- 2µm
High power laser for bond reflow
Height control: 1µm accuracy
Cantilever thickness: 20 – 100µm
Pitch: down to 60µm
High mechanical stability of probes
Process suitable for rework and complete card assembly
53
Confidential
Contacts
PAC TECH EUROPE
Contact
Dr. Elke Zakel
Telephone
+49-3321-4495-100
Fax
+49-3321-4495-124
E-mail
[email protected]
Thomas Oppert
+49-3321-4495-100
+49-3321-4495-610
[email protected]
Ghassem Azdasht
+49-3321-4495-100
+49-3321-4495-124
[email protected]
PAC TECH USA
Contact
Telephone
Dr. Thorsten Teutsch +1-408-588-1925
Fax
+1-408-588-1927
E-mail
[email protected]
PAC TECH ASIA
Contact
Sales team
Telephone
+60 4-6440 986
Fax
+60 4-6449 987
E-mail
[email protected]
54
Confidential

PAC TECH Company Profile

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