presentation - Home | SEMICON Russia

Advanced Technologies and
Equipment for 3D-Packaging
Thomas Oppert
Semicon Russia
15th May 2014
Outline
 Short Company Introduction
 Electroless Plating on Wafer Level
 Ultra-SB2 - Wafer Level Solder Balling
 SB2 - Solder Jetting & Laser Reflow for 3D Devices
Process
Applications
 LAPLACE – Laser Placement of Flip Chips and others
 Summary
PacTech Group - Corporate Profile
1995 PacTech GmbH founded in Berlin, Germany as spin-off
from Fraunhofer-IZM
1997 1st Manufacturing facility: PacTech GmbH, Nauen, Germany
2001 2nd Manufacturing facility: PacTech USA Inc., CA, USA
2005 Equipment Field Service & Support Center, Thailand
PacTech Europe (HQ)
2006 NAGASE & Co., Ltd. takes 60% shares in PacTech
2008 3rd Manufacturing facility: PacTech Asia Sdn. Bhd., Malaysia
2009 NAGASE & Co., Ltd. increases shares in PacTech to 74%
2012 > 800 Production Machines in the field
2013 > 115 patents granted
PacTech USA
2013 NAGASE & Co., Ltd. increases shares in PacTech to 97,2%
PacTech Group (Europe, USA, Asia): 280 employees
PacTech Asia
3
Eletroless Plating of
NiAu, NiPd, NiPdAu
Electroless NiAu / NiPdAu Plating & Bumping Services
5
1. E-less Bumping
 RFID attach by adhesive on
antenna
 LCD driver
2. E-less UBM
for solder ball
attach
 Wafer Level CSP
 Flip chip
3. E-less OPM
for fine pitch wire
bonding
 Automotive high rel./ high
temp. wire bonding
 Copper wire bonding
 Wire bonding on active pad
Aluminum or Copper
4. E-less Metallization
for Power MOSFET
application
 Clip attached
 Wire bonding and soldering
Process Flow – Ni/Au & Ni/Pd/Au Bumping
Al Pad
Cu Pad
Zinkating
Pd Seed
Ni Plating
Flash Au
Pd Barrier
Flash Au
UBM for FC & WLCSP
6
OPM for Wire Bonding
Turnkey Bumping Solutions
Worldwide Support and Highest Quality
through Turnkey Process Ownership!
One Source!
Volume Wafer Bumping
matched to Customer’s
Supply Chain
Requirements.
Development Support
in customer’s R&D
Center Time Zone
7
3 location worldwide:
2nd sourcing!
Turnkey Process
Transfer to customer
possible at Any Time
PacLine 300 A50
ENEPIG Plating Systems in the Field @ major OEM’s
300 mm
8
Ultra-SB2 – Wafer Level Solder Balling
Wafer Level Solder Sphere Transfer 1/2
Vacuum picking of
solder spheres from
reservoir to stencil
Removal of excess
balls by Ultra Sonic
&
optical inspection of
balls in stencil
Vacuum
Bond Tool
Solder Ball
Mask
Vibration
Floating Solder
Balls by Ultra Sonic
Jumping Solder Balls
Air knife
10
Wafer Level Solder Sphere Transfer 2/2
Placement of solder
spheres
Per robot back to
cassette
&
optical inspection of
balls on wafer
Solder Ball
Next step: Reflow
Bond Tool
Mask
Flux
Wafer
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UBM
Automatic Wafer Level Solder Ball Transfer with
Ultra-SB2 300
 Cassette to Cassette robot handling for wafer up to 12"
 UPH 8"
>40 wafer/hour *
 UPH 12" >25 wafer/hour *
 ball sizes: 60µm - 500µm
 2x optical inspection (optional)
 Integrating fluxing (optional)
 Integrated reflow oven (optional)
 Integrated rework capability for yield Improvement
(optional)
* depending on ball size and on I/O count
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SB2 – Solder Jetting & Laser Reflow
Advantages of SB2 Solder Jetting

Solder ball diameter capability:
 40µm - 760µm (qualified for volume production)
 30µm (in qualification)
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
Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi

No tooling

No flux

No mechanical stress/contact

No thermal stress

No additional reflow

No cleaning of flux residues

Fine pitch applications (< 80µm)
Solder Sphere Jetting (SB²) 1/2
Schematic diagram of Solder Ball Bumping (SB²) process:
Optical sensor
Ball Reservoir
Laser
Singulation Disk
Optical
sensors
N2
Reflowed
solder balls
N2 gas
Capillary
Search level
Bond level
Semiconductor wafer
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Pressure sensor
Bond pad
Solder Sphere Jetting (SB²) 2/2
Process video for solder jetting and solder stacking
16
SB2 - Jet Applications
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
BGA / cLCC Balling

Rework/ Repair of BGA-like packages

Hard Disk Drive (HGA, HSA, Hook-Up)

Camera Modules

Wafer Bumping

Wafer Level CSP Bumping

Optoelectronics/ Microoptics

Filter Devices (SAW, BAW)

MEMS & 3D-Packaging
Reworked Package
HGA for HDD (Source: Seagate)
Camera Module
Solder Jetting for Microoptics
Soldering of stacked chips
Laser Beam
Chip 1
Capillary
Fig.1
Solder Ball
Chip 2
Pin to Pin
Fig.2
Pin soldering of two stacked chips
18
PIN-Soldering
Laser Beam
Chip
PIN
Fig.3
Capillary
Solder Ball
FR4 Substrate
Au Pad
Fig.4
Pin soldering onto organic substrate
19
3D HGA Soldering
Soldering Read-Write Head of a Hard Disk Drive (HDD)
Movie starts with mouse click
Hook-Up Soldering for HDD 1/5
Solder Jetting FPC
Solder Jetting FPC
-
-
-
Solder jetting with
2x 760µm
Solder alloy SAC305
-
Solder jetting with
1x 760µm
Solder alloy SAC305
Hook-Up Soldering for HDD 2/5
Solder Jetting FPC
-
Solder jetting with 2x
760µm
Solder alloy SAC305
Hook-Up Soldering for HDD 3/5
Solder Jetting FPC
-
Solder jetting with 1x
760µm
Solder alloy SAC305
Hook-Up Soldering for HDD 4/5
Solder Jetting VCM
-
Middle pad with 3x solder ball stacking, each
760µm
Wire soldering left and right with 1x 760µm
Solder alloy SAC305
Hook-Up Soldering for HDD 5/5
Solder Jetting VCM
-
-
Middle pad with 3x
solder ball stacking,
each 760µm
Wire soldering left and
right with 1x 760µm
Solder alloy SAC305
CMOS Camera Market
Camera Module Terminal Soldering
VCM Terminal Contacts
1. Gap Between FPCB and
Pad
< 200um (for
Solder
VCM
Camera Module Terminal Soldering
better wettability
on VCM and Gold
Pad)
Gold Pad
2. Length of FPCB
> 600UM (for better
solder flow without
housing burning
issues)
3. Width of Pad with angle Tolerance
> 200UM ( for 300 – 450um solder ball)
Figure above shows the best case for Camera Module bonding
Soldering Quality of Terminal Bonding
•
Picture above shows good solder wettability on
Gold Pad and VCM. Solder covered 100% of the
pad and 90% of the pin. 400µm Solder ball size
was used (SAC 305) without flux.
Camera Module Bonding with 600µm solder balls
Reliable wetting on
the pre-soldered
ground pad as well as
on the titanium pin.
No burnings or
discoloration of the
epoxy material around
the solder connection,
pad or pin.
Minimized influence of
alternating quality of
the pre-soldered
ground pad, with
600µm solder
spheres.
Camera Module Bonding with 2x 300µm solder ball
LAPLACE
(LAser PLACEr)
LAPLACE with Reel-To-Reel-System
33
LAPLACE Flip Chip Bonding
Final assembled Flip Chip
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Flip Chip placement and laser reflow
LAPLACE Capacitor Bonding
LAPLACE Capacitor attach on PCB
35
Cantilever Assembly Line for Probe Cards
Cantilever Bonder
SB2-Jet: Solder Jetting
Features
Features
Features
 Input: MEMS substrates
 Cantilever supplied in waffle packs
 Inspection of cantilever
 Cantilever pick & rotation in vertical position
 Solder Jetting on
ceramic substrate
 Laser cutting with the Laser
 Substrate height measurement
 Placement of cantilever in
waffle packs
 Dual camera for x, y alignment of cantilever
to the substrate
Cantilever Sorter
 Probe tip z alignment
 Laser bonding of cantilever
 Post inspection
 Cantilever rework capability
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 Solder Balls sizes:
30 – 760 µm
 Solder alloys capability:
PbSn, SnAgCu or AuSn
Cantilever Bonder Specifications
 Linear axis or gantry system
 Probe card sizes up to 13 inch
 Full process control
 Alignment control by position bonding
 Placement Accuracy: down to +/- 2µm
 High power laser for bond reflow
 Height control: 1µm accuracy
 Cantilever thickness: 20 – 100µm
 Pitch: down to 60µm
 High mechanical stability of probes
 Process suitable for rework and complete card assembly
37
Summary
• Brief Introduction in electroless plating
• Solder Balling Processes
• Wafer Level Ultra-SB2 process
• SB2-process for 3D applications
• Laser Placement and bonding by LAPLACE
THANK YOU