Pac Tech USA - German Pavilion
Transcription
Pac Tech USA - German Pavilion
Introducing Pac Tech Packaging Technologies GmbH Corporate Profile Technology & Product Overview Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Group - Corporate Profile 1995 Pac Tech GmbH founded in Berlin, Germany as spin-off from Fraunhofer-IZM 1997 1st Manufacturing facility: Pac Tech GmbH, Nauen, Germany 2000 2nd Manufacturing facility: NAGASE & Co., Ltd., Japan 2001 3rd Manufacturing facility: Pac Tech USA Inc., CA, USA 2005 Equipment Field Service & Support Center, Thailand Pac Tech Europe (HQ) 2006 NAGASE & Co., Ltd. takes 60% shares in Pac Tech 2008 4th Manufacturing facility: Pac Tech Asia Sdn. Bhd., Malaysia 2009 NAGASE & Co., Ltd. increases shares in Pac Tech to 74% Pac Tech USA 2011 > 600 Production Machines in the field Pac Tech Group (Europe, USA, Asia): ~ 230 employees Annual sales revenue Pac Tech Group (2010) ~ 23 Mio Euro Pac Tech Asia 2 Certified ISO 9001 & ISO TS 16949 Confidential NAGASE & CO., Ltd. - Profile • • • • • • Founded: Paid-in Capital: Sales: Net Income: Employees: Stock: • Business Segments: • Chemicals: • Plastics: • Electronics: • Life Science: June 18, 1832 JP¥ 9,699 million (~100 million US$) JP¥ 715 billion (~7.5 billion US$) JP¥ 13 billion (~138 million US$) 4,506 (Consolidated) Listed TSE-1, OSE-1 Petrochemicals, pigments, solvents, additives Resins, Plastics, Film or sheet products etc LCDs, Photoresist, Semiconductor etc Pharmaceuticals, food materials, Cosmetics etc 25 mfg sites & 13 sales offices in Japan 17 mfg sites & 37 sales offices offshore 3 Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Group - Worldwide Locations Pac Tech USA Inc Santa Clara, CA Boston Sweden Finland Denmark Pac Tech GmbH France Nauen, Germany Italy Tokyo Korea Nagase Shanghai, Nagase ChemteX Israel Himeji, Japan China Taiwan Pac Tech Customer Service Center Bangkok, Thailand Philippines Pac Tech Asia Sdn. Bhd. Penang, Malaysia Pac Tech/Nagase facilities Singapore Sales Agent/ Distributor 4 Certified ISO 9001 & ISO TS 16949 Confidential Selection of Key Customers 5 Certified ISO 9001 & ISO TS 16949 Confidential Worldwide Subcontractor Services Wafer Level Bumping & Packaging PacTech Asia PacTech Europe •Eless Ni/Au & NiPdAu UBM •Solder Balling/ Solder Jetting •Wafer Level Solder Balling •Wafer Thinning/Grinding •Wafer Backmetallisation •Laser Backside Marking •Wafer Sawing/Dicing •Tape & Reel •AOI •Eless Ni/Au & NiPdAu UBM •Solder Balling/ Solder Jetting •Wafer Level Solder Balling •Wafer Thinning/Grinding •Eless Ni/Au & NiPdAu UBM •Solder Balling/ Solder Jetting •Wafer Level Solder Balling •Wafer Thinning/Grinding •Laser Backside Marking •Wafer Sawing/Dicing •Tape & Reel •AOI •Wafer Level RDL •X-Ray inspection •FC-Assembly •CSP BGA Ball Rework •NiFe Plating for MEMS •Laser Backside Marking •Wafer Sawing/Dicing •Tape & Reel •AOI •Wafer Level RDL Plan 2012: •Electrical Test •Wafer Level RDL •FC & Capacitor Assembly PacTech USA Plan 2012: •Cu Electro Plating •FC & Capacitor Assembly 6 Certified ISO 9001 & ISO TS 16949 Confidential Advanced Packaging Equipment PacTech Asia •Sales & Demo Center PacTech Europe • Solder Jetting & BGA Rework/Repair: SB²-M, SB²-SM, SB²-Jet • Wafer Level Solder Balling: Ultra-SB² 200/300 • Wafer Level Solder Rework/Repair: Ultra-SB² 200/300 WLR • Flip Chip Bonder: LAPLACE- FC, LAPLACE-Cap/- Can • Electroless Bumping Line: PacLine 200/300 A50 • Spin Coating System: SpinPac ASC 200/300 • Plasma Cleaning/Ashing: PlasPac 200 • Wafer Backside Marking: LS² 200/300 • Customized equipment for photovoltaic & solar industry • Reflow Oven: RFM/RFA 200/300 PacTech USA •Sales & Demo Center 7 Certified ISO 9001 & ISO TS 16949 Confidential Business Unit A Wafer Level Bumping & Packaging - Subcontractor Service - 8 Certified ISO 9001 & ISO TS 16949 Confidential Worldwide Use of Pac Tech’s WLP Services 9 Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Quality System Overview and Roadmap Pac Tech GmbH established with more than 15 years of quality manufacturing experience in semiconductor industry All Pac Tech sites are certified to ISO quality system standards Pac Tech Germany – ISO9001 / TS16949 Pac Tech USA – IS09001 Pac Tech Asia – ISO9001 / ISO 14001 Pac Tech Asia planned certifications for ISO/TS16949 certification by Q1 2012 Pac Tech Asia has been engaged in ENIG process volume production since 2008 with high yield and quality 10 Certified ISO 9001 & ISO TS 16949 Confidential AI - Wafer Level UBM - 11 Certified ISO 9001 & ISO TS 16949 Confidential Electroless NiAu/NiPdAu Plating & Bumping Services 1. E-less Bump - RFID adhesive attach on antenna - LCD driver 2. E-less UBM for solder ball attach - Wafer Level CSP - Flip chip 3. E-less OPM for fine pitch wire bonding - Automotive high rel./ high temp. wire bonding - Copper wire bonding - Wire bonding on active pad Aluminum or Copper 4. E-less Metallization for PowerMOSFET application - Clip attached - Wire bonding and soldering 12 Certified ISO 9001 & ISO TS 16949 Confidential Comparison of Solder Bumping Technologies Evaporated Solder Bump C4 Solder Sputtered UBM + Plating Sputtered UBM + Print (FCI) Electroless UBM (+) Solder Ball Attach Solder Solder Solder Ni/Au Au 13 Certified ISO 9001 & ISO TS 16949 Confidential Process Flow - Ni/Au & Ni/Pd/Au Bumping Al Pad Cu Pad Zinkating Pd Seed Ni Plating Flash Au FC & WLCSP Pd Barrier Flash Au Flash Au Thick Au Wire Bonding, FC & WLCSP Wire Bonding 14 Certified ISO 9001 & ISO TS 16949 Confidential Electroless Ni/Pd/Au Bumping on Al or Cu Backside Coating Aluminum Cleaning / Cu Cleaning Zincate / Palladium Pretreatment Electroless Nickel Electroless Palladium Immersion Gold Coating Removal 15 Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Design Rules* For Ni/Au - Bumping Criteria Specification Substrate Material Si, SiGe, InP, GaAs, LiTa, Ceramic, Organic, Glass, Quartz Passivation Defect free without any residues on the bond pads Passivation Material Minimum Aluminum Thickness (Flip-Chip) Minimum Aluminum Thickness (WL-CSP) Pad Metallisation Minimum Copper Thickness (optional) Scribe Line Si-Nitride, Si-Oxide, PSG, Polyimide, BCB 0.8 (0.5) µm 2.0 (1.5) µm Al, AlSi, AlCu, AlSiCu, Cu 0.3 µm Must be isolated (by thermal oxide), test pads and structures are acceptable Minimum Pad to Pad Distance Minimum Pad Size (standard process) Minimum Pad Size (optional: fine pitch process) Pad Geometries Minimum Wafer / Substrate Thickness Wafer Backside 2 x hUBM + 10µm 40µm x 40µm 10µm x 10µm any 175 µm (8’’), 100 µm (4‘’) Standard: Thermal Oxide, Back lapped: Silicon On Request: Metal: Ag, Au, Cu, etc., Ceramic Probe Marks Ink Dots Laser Fuses Al fuses poly Si fuses Acceptable (if < ¼ of pad size) Acceptable, stability of ink has to be checked Not acceptable acceptable (with limitations) * Detailed package of design rules available on request Certified ISO 9001 & ISO TS 16949 16 Confidential Advantages of ENIG UBM • Low Capital Investment Cost (by in-house installation) ElectroPlating: 10-20 Mio. US$ Electroless UBM + Solder Print/Ball: 3-5 Mio. US$ • High Throughput 600.000 wafer per year (8“); 450.000 wafer per year (12“) Lowest Process Cost • Maskless Process No tooling required • Compatible for wafer from 4“ to 12“ no additional invest for different wafer sizes • Proven Reliability and Production History Performance • NiAu and NiPdAu for Optimized IMC Growth and Reliability • Compatibility with all FC and WLCSP-Assembly processes Soldering ACF NCP Applications • Suitable for Al and Cu pad metallization • Compatibility with Au and Cu Wire Bonding 17 Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Group Worldwide Wafer Bumping Capacity - ENIG 4”-8” Wafer/Year 12” Wafer/Year Pac Tech Europe 600k 450k Pac Tech USA 600k 450k Nagase Japan 600k 450k Pac Tech Asia 600k 450k 18 Certified ISO 9001 & ISO TS 16949 Confidential A II - Wafer Level Solder Bumping - 19 Certified ISO 9001 & ISO TS 16949 Confidential Solder Bumping and Other Applications 1. Solder Ball Attach - Wafer Level CSP 2. Solder Ball Attach - Flip chip bumps 3. Fluxless and Speciality Laser assisted Solder Attach - 3D HDD Modules - 3D Camera Modules - High rel. Aerospace Solder bumping - Rework and Repair 4. Speciality Solder Printing and Components Attached on Wafer - Special capacitor resistor and component attach on wafer level 20 Certified ISO 9001 & ISO TS 16949 Confidential Sphere Transfer Vacuum Laser Jet Reflow Laser Capillary Pick up Spheres Drop Balls & Reflow Align to Wafer Lower Spheres Raise Head Reflow 21 Certified ISO 9001 & ISO TS 16949 Confidential Wafer Level Solder Sphere Transfer 1/3 Vacuum picking of solder spheres from reservoir to stencil Removal of excess balls by US & optical inspection of balls in stencil Vacuum Bond Tool Solder Ball Mask Vibration Floating Solder Balls by US Jumping Solder Balls by Air knife Air knife Certified ISO 9001 & ISO TS 16949 22 Confidential Wafer Level Solder Sphere Transfer 2/3 Placement of solder spheres Per robot back to cassette & optical inspection of balls on wafer Solder Ball Next step: Reflow Bond Tool Mask Flux Wafer UBM 23 Certified ISO 9001 & ISO TS 16949 Confidential Wafer Level Solder Sphere Transfer 3/3 Ultra-SB² 200/300 200/300mm wafer chuck Dual endeffector & Prealigner Stencil mounted on vacuum transfer head 24 Certified ISO 9001 & ISO TS 16949 Confidential Solder Sphere Jetting (SB²) Schematic diagram of Solder Ball Bumping (SB²) process: Optical sensor Ball Reservoir Laser Singulation Disk Optical sensors Pressure sensor N2 N2 gas Capillary Reflowed solder balls Search level Bond level Semiconductor wafer Bond pad 25 Certified ISO 9001 & ISO TS 16949 Confidential Business Unit B Advanced Packaging Equipment - Manufacturing & Sales - 26 Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Equipment SB²-M SB²-SM SB²-Jet BGA, CSP Solder Rework Solder Jetting Solder Jetting Ultra-SB2 300 Ultra-SB2 300 WLR PacLine 300 A50 WL Solder Balling WL Solder Ball Rework Electroless Plating Line 27 Certified ISO 9001 & ISO TS 16949 Confidential Pac Tech Equipment MegaPac 200/300 Wafer Level Flux Cleaning HS3 2D Ball Inspection PlasPac 200/300 Plasma Cleaning SpinPac ASC 200/300 Laser Marker LAPLACE Spin Coater Wafer Backside Marking Flip Chip Bonding 28 Certified ISO 9001 & ISO TS 16949 Confidential BI Equipment for Electroless Ni/Au UBM Turnkey Solution: - Equipment - Process Transfer - Chemistry 29 Certified ISO 9001 & ISO TS 16949 Confidential Turnkey Bumping Solutions Equipment Process Chemistry One Source! Volume Wafer Bumping matched to Customer’s Supply Chain Requirements 4 Locations Worldwide: 2nd Sourcing! Development Support in Customer’s R&D Center Time Zone Turnkey Process Transfer to Customer possible at Any Time Worldwide Support and Highest Quality through Turnkey Process Ownership! 30 Certified ISO 9001 & ISO TS 16949 Confidential Business Development Installed Equipment for ENIG UBM & Technology Transfer/Licenses of Pac Tech Japan Malaysia Germany Growth (Nagase) France USA USA France (PacTech) Philippines Japan Korea (STW) USA Memory (Nagase) 2000 2001 2002 2003 2005 2006 2007 2008 Year 2009 31 Certified ISO 9001 & ISO TS 16949 Confidential PacLine 300 A50 10 ENIG Plating Systems in the Field @ major OEM’s 300 mm 32 Certified ISO 9001 & ISO TS 16949 Confidential PacLine 300 A50 Parallel processing of 3 baskets with each 50 wafer 8“ or 3 baskets with each 13 wafer 12” • • • • • • • • • UPH: max. 150 wafer 8"/hour or max. 39 wafer 12”/hour (5µm Ni/Au UBM) Thick Au ability for wire bonding reliability Ni bath control with ConPac 2.0 (bath conditioner) and ConPac control set Central Computer Control Unit (CCCU) PLC with Profi Bus system Additional security tanks for each module and pump system Design will be adapted to customer’s facility SECS GEM Interfacing The system fulfills the fire safety standard FM 4910 33 Certified ISO 9001 & ISO TS 16949 Confidential B II SB2- Jet Equipment (Laser assisted Solder Jetting) 34 Certified ISO 9001 & ISO TS 16949 Confidential SB² Equipment SB²-Jet ESD SB²-Jet SB²-SM Solder Jetting Solder Jetting Solder Jetting SB2-SM ESD SB2-SM R2R Solder Jetting Solder Jetting SB²-M BGA, CSP Solder Rework 35 Certified ISO 9001 & ISO TS 16949 Confidential SB2 - Jet Advantages • No tooling • Solder ball diameter capability: • • 50µm - 760µm (qualified for volume production) 40µm & 30µm (in qualification) • Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi • No flux • No mechanical stress/contact • No thermal stress • No additional reflow • No cleaning of flux residues • Fine pitch applications (< 80µm) 36 Certified ISO 9001 & ISO TS 16949 Confidential SB2 - Jet Applications • BGA/ cLCC Balling • Rework/ Repair of BGA-like packages • Hard Disk Drive (HGA, HSA) • Camera Modules Head Gimbal Assembly for Hard Disk Drives (Source: Seagate) • Wafer Bumping • Wafer Level CSP Bumping • Optoelectronics/ Microoptics • Filter Devices (SAW, BAW) • MEMS & 3D-Packaging Solder Jetting for Microoptics Reworked Package 37 Certified ISO 9001 & ISO TS 16949 Confidential SB² - Solder Jet Speed & Ball Diameter: Roadmap 30µm 40µm Solder Ball Diameter & Speed 50µm 10 balls/sec 60µm 80µm 7 balls/sec 100µm 120µm 6 balls/sec 200µm 5 balls/sec 3 balls/sec 2000 2004 2008 2010 38 Certified ISO 9001 & ISO TS 16949 Confidential B III Equipment for Wafer Level Solder Ball Transfer 39 Certified ISO 9001 & ISO TS 16949 Confidential Process Flow Ultra-SB2 300 Wafer Loading Spin Coating of Flux Solder Ball Vacuum Pick-up (US agitation) High Speed 2D Wafer Inspection (Stencil) Alignment of Stencil to Wafer (Dual Camera) Solder Ball Transfer to Wafer High Speed 2D Inspection (Wafer) Conduction Reflow (N2) Wafer Unloading Standard Optional Certified ISO 9001 & ISO TS 16949 40 Confidential Automatic Wafer Level Solder Ball Transfer with „Ultra-SB² 300“ • Cassette to Cassette robot handling for wafer up to 12“ • Integrated rework capability for yield Improvement (optional) • 2x optical inspection (optional) • ball sizes: 60µm - 500µm • Integrating fluxing by spincoating (optional) • Integrated reflow oven (optional) • UPH 8“ >40 wafer/hour * • UPH 12“ >25 wafer/hour * * depending on ball size and on I/O count 41 Certified ISO 9001 & ISO TS 16949 Confidential Application for Micro Ball Placement with „Ultra-SB² “ • • • • 8“ wafer Pitch 200µm 400,000 I/O‘s 100µm SnAgCu • • • • 12“ wafer Pitch 225µm 740,000 I/O‘s 100µm SnAgCu 42 Certified ISO 9001 & ISO TS 16949 Confidential B IV Equipment for Wafer Level Solder Ball Rework before Reflow 43 Certified ISO 9001 & ISO TS 16949 Confidential Process Flow Ultra-SB2 300 WLR Wafer Loading Wafer Alignment High Speed 2D Wafer Inspection Removal of misaligned & excessive balls Re-fluxing of repair locations (dispense) Placement of spheres High Speed 2D Wafer Inspection Wafer Unloading Standard Optional Certified ISO 9001 & ISO TS 16949 44 Confidential Automatic Wafer Level Solder Ball Rework for Yield Improvement with „Ultra-SB² 300 WLR“ • Cassette to Cassette robot handling for wafer up to 12“ • Integrated 2-D AOI • missing ball • double ball • ball shape etc. • Integrated rework capability for yield improvement • single ball placement • single ball removal • ball sizes: 60µm - 500µm • UPH 8“ ~25 wafer/hour • UPH 12“ ~25 wafer/hour 45 Certified ISO 9001 & ISO TS 16949 Confidential BV LAPLACE Equipment for - Flip Chip Bonding - Capacitor Bonding - Cantilever Bonding 46 Certified ISO 9001 & ISO TS 16949 Confidential LAPLACE with Reel-To-Reel-System 47 Certified ISO 9001 & ISO TS 16949 Confidential LAPLACE-Applications LCD Driver Assembly Flip chip on antenna for contactless smart cards ACF NCP coil reed SMDs ASIC 4,8 24 mm 48 Certified ISO 9001 & ISO TS 16949 Confidential Flip Chip Modules for contactless Smart Cards Substrate handling: reel to reel Assembly: Flip Chip using LAPLACE soldering 49 Certified ISO 9001 & ISO TS 16949 Confidential Capacitor Bonding LAPLACE Capacitor Attach on PCB 50 Certified ISO 9001 & ISO TS 16949 Confidential Cantilever Assembly Line for Probe Cards 1. Cantilever Sorter • • • • Input: MEMS substrates Inspection of cantilever Laser cutting with the Laser Placement of cantilever in waffle packs 2. SB2-Jet: Solder Jetting • Solder Jetting on ceramic substrate • Solder Balls sizes: 30 – 760 µm, • Solder alloys capability: PbSn, SnAgCu or AuSn 3. Cantilever Bonder • • • • • • • • Cantilever supplied in waffle packs Cantilever pick & rotation in vertical position Substrate height measurement Dual camera for x,y alignment of cantilever to the substrate Probe tip z alignment Laser bonding of cantilever Post inspection Cantilever rework capability 51 Certified ISO 9001 & ISO TS 16949 Confidential Cantilever Bonder Specifications • • • • • • • • • • • Linear axis or gantry system Probe card sizes up to 13 inch Full process control Alignment control by position bonding Placement Accuracy: down to +/- 2µm High power laser for bond reflow Height control: 1µm accuracy Cantilever thickness: 20 – 100µm Pitch: down to 60µm High mechanical stability of probes Process suitable for rework and complete card assembly 52 Certified ISO 9001 & ISO TS 16949 Confidential Contacts PAC TECH EUROPE Contact Dr. Elke Zakel Telephone +49-3321-4495-100 Fax +49-3321-4495-124 E-mail [email protected] Thomas Oppert +49-3321-4495-100 +49-3321-4495-610 [email protected] Ghassem Azdasht +49-3321-4495-100 +49-3321-4495-124 [email protected] PAC TECH USA Contact Telephone Dr. Thorsten Teutsch +1-408-588-1925 Fax +1-408-588-1927 E-mail [email protected] PAC TECH ASIA Contact Sales team Telephone +60 4-6440 986 Fax +60 4-6449 987 E-mail [email protected] 53 Certified ISO 9001 & ISO TS 16949 Confidential