Soldering - ASM Assembly Systems

Kurtz- Ersa Soldering Systems
ASM Meeting Timisoara 14-10-2014
Production needs us
Kurtz- Ersa Soldering Systems
ASM Meeting Timisoara 14-10-2014
Innovations in Selective Soldering
• Highest Flexibility
• Throughput Solutions
Production needs us
Business Segments
Electronics Production Equipment
- Soldering systems
- Soldering tools
Metal Components
- Castings
- Sheet metal
- Machining
Moulding Machines
- Particle foam machines
- Foundry machines
Who is Ersa?
• One of the biggest producers of
soldering equipment in the world
• Privately owned by
the Kurtz Family
• Total production in Wertheim (D)
• + 300 Employees
• Turnover 2013 = 71 Million
• 219 Selectives sold in 2013
• 200 Selectives sold in 2014 (and counting)
Ersa – History
Ersa was created 1921 on the Vision of our founder, ERnst SAchs
Ersa Technology Leadership reacting to Market needs
1921
1960
The industrial
Revolution
begins for
Electronics.
1921:
Ernst Sachs invents the
first electric soldering
iron ERSA H1*.
*patented
Ersa Technology Leadership reacting to Market needs
1960
Wave soldering
finds its place in
the “modern“
production line.
1980
1968:
Ersa brings
Wave soldering
to Germany
Ersa Wave soldering machine
with Fluxer and Drying unit.
*
*patented
Production Equipment
Stencil Printer
Reflow Soldering Systems
Hand Solder Tools
Selective Soldering Systems
Repair Equipment
Wave Soldering Systems
Inspection Equipment
Kurtz- Ersa Soldering Systems
ASM Meeting Timisoara 14-10-2014
Innovations in Selective Soldering
• Highest Flexibility
• Throughput Solutions
Production needs us
Product Range - Selective Soldering Systems
Versaflow
Ecoselect 2
Multiwave
Ecocell
Ecoselect 1
Selective Soldering Technologies
Advantages single-wave
• Highest flexibility through programmable x,y,z
movement of the wave
• Individual parameters for every solder joint
• No prefered direction of soldering
• No costs for tooling
• No lead times
Advantages multi-wave
• Shorter cycle times because of simultaneous soldering
• Process time is independent from the number of solder
joints
Technology
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Fluxing
Preheat
Flexible Soldering
Multiwave Soldering
Technical Support
Technology
Fluxing Technology
Multidrop-Precision Spray Fluxer
play video
click button
- Precise and exactly defined flux
deposition
- Minimization of the amount of flux
deposited (Diameter of area covered
with flux is down to 3 mm)
- Minimization of ionic contamination
(No Clean Process)
- Flux deposition either as single point
or as track
- Amount of flux deposited for each
joint is programmable
- Standard Flux Head is 130 µ
Options = 180 µ and 270 µ
Multidrop-Precision Spray Fluxer
- Provision of an alternative flux type to reduce change-over time
- Continuous flux level monitoring
- Optimized accessibility through simple removal of the flux tanks
Multiple Spray Heads
- Controls up to 4 spray heads
- Increasing rate of throughput by processing multiple-up assemblies
- Precise coating of larger areas without time-consuming stopping of the axes
Standard Monitoring Function
Programable spray stream monitoring to check if there is
flux and if the fluxer sprays vertically
Fluxer Monitoring
 Measuring of fluxer amount
 Droplet counter
Technology
Preheat Technology
The task of the preheating is to
 Vaporize the fluxes carrier medium
 Pre-activate the flux / depending on the type
 Reduce the thermal shock for the components
 Ensure the reproducibility of the temperature profile
 Only preheat as much as required, keeping in mind the
amount of energy required by the particular assembly
Temperature profile for selective soldering
Solder time
Gradient
The gradient has to be observed if ceramic
components ore in the immediate vicinity of the solder
joint to be made (Temp. shock of ceramic capacitors)
e.g. 2 – 3 K/s
Shock
The sharp increase in temperature from the
preheat level to soldering temperature
depends in large parts on the specification
of the components. The permissible values
are to be taken from the data sheets of the
components. In addition, the effect of the
temperature on already soldered SMD’s
close by to the selective soldering joint
needs also be observed.
The saddle
of the profile is determined by the heat required
by the assembly.
Bottom Preheater
- High performance density for
effective preheating of the board
- Inertia-less Control
- Four time windows to control the
temperature profiles
- Adaptation of the heated length to
the format of the assembly
- Chronological control depending on
the time required for soldering
- Max. 3 modules prior to solder
module 1
- Post heating cycles after process
disruptions
- Pyrometer Control as option
Preheating Multilayer Boards – Telecommunication (24 Layers)
T--∆T

T +++
If, for multi-layer assemblies, thermal energy is supplied only from one side (lower side), then
the heat has to travel, layer by layer, from the bottom up through the board.
Since each layer absorbs energy, a temperature gradient exists from bottom to top of the
board. Therefore, to achieve a uniform and homogeneous heating of the board, a
correspondingly long time has to be accepted.
Preheating Multilayer Boards - Telecommunication (24 Layers)
T +++
∆T

T +++
If multi-layer boards are supplied with thermal energy from both sides, the heat penetrates
the board simultaneously from top and from bottom. As a result, the temperature gradient is
very small, and the board warms up uniformly and homogeneously at a much faster rate. At
the same time, the stress experienced by the lower side is reduced, and the danger that the
flux is damaged during the preheat process is minimized.
Top Side Preheater
- Combines IR and convection technology
- Effectively preheats assemblies requiring large amounts of heat
- Suitable for installation in the preheat as well as in the solder module
play video
click button
Technology
Flexible (Point)
Solder Technology
Reflowlöten
Configuration - Single Solder Nozzle
- Wettable Nozzles
- Constant solder flow over the complete nozzle
surface – no preferred direction for solder to drain
- Continuous heat transfer into the solder joint during
the solder process
- No orientation of the component to the solder
nozzle required
- No layout constraints for the orientation of the
components
- Suitable for a wide variety of solder alloys
Design of Electro-Magnetic Solder Pot
Reflowlöten
- Maintenance-free design with
electro-magnetic solder pump
- No mechanical movable part in the
solder bath
- Precise wave height due to
continuous circulation of solder
- Outstanding repeatability of solder
process (no impeller)
- No adjustment after servicing the
solder bath
Reflowlöten
Monitoring - Solder Bath
- Solder wave height is
measured
- Solder level in bath is
monitored / Solder wire
feeder option
- Solder temperature is
exactly controlled
- N2 atmosphere assures
stabile process conditions
Reflowlöten
Solder Snap-Off with Wettable Nozzle Surfaces
F1= Wetting Force
F2= Capillary Force
F3= Gravity
F4= Adhesive Forces
- Solder snap-off, the point in the process when the solder breaks off
from the solder joint, is positively assisted by the adhesive force F4,
which is generated by the wettable surface of the nozzle.
- This adhesive force, in conjunction with gravity F3, enables the solder
to properly drain off from the solder joint after having formed it, and
to eliminate bridging and shorts.
Reflowlöten
Advantages when Soldering with Wettable Nozzles
Substantial saving in time and
reduced thermal stress on the
board material through
perfect process management
- To solder square PGA‘s, it is sufficient to program the
four corner points of the component
- Neither the board assembly nor the nozzle needs to
be repositioned
- The solder nozzle moves without pausing and solders
the component without a run-out zone
Reflowlöten
Solder Snap-Off with Wettable Nozzle Surfaces
Standard Snap-Off
Controlled Snap-Off
- forms convex solder joints
- forms concave solder joints
Reflowlöten
Configuration Solder Module Z - variable
Different nozzle geometries
Variety of Alloys
- Both solder bath can be raised, separately and individually, on the axis up to the required
working height (z- direction)
- First mode of operation with two identical nozzles but different alloys.
- Second mode of operation with two nozzles of different geometries and identical solder.
Technology
Multiwave (DIP)
Solder Technology
Simultaneous Dip Soldering with Multiple Nozzles
• Non wettable surfaces for
improved flow characteristics
• Good stability of the shape of
the joints
• Improved peel off
• Short cycle times
• High throughput
Summary of needs, requirements and possibilities
in order to design a nozzle plate
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PCB Layout recommendations
What do we need from our customers
Design procedure
Standard nozzle design and tools
Results of own research
Applications
Each nozzle plate is designed
individually at Ersa, depending on the
customer needs and specifications!
What do we need from our customers?
 Perfect Solution:
the Real board
 The Better Solution:
3D CAD drawing - .stp file
 A Good Solution:
2D CAD drawing
dxf or GERBER files
Design procedure at Ersa
1. Customer Data are collected by Steffen Schuetz – EPTM
2. Nozzle Dimension Design by Process Technology Team
Design procedure at Ersa
3. EPTM Decision - Standard Nozzles or Specific Nozzle Design
Specific Nozzle Design
„Standard Nozzle Catalog“
Design procedure at Ersa
4. Specific Nozzle Tooling Design in the Design Department
Design procedure at Ersa
5. Bill of Material is sent to Purchasing Department
6. Parts are assembled on Production Floor
Description of Parts
1. Quick connects for
plate removal tool
2. Baffle frame
3. PCB Support pins
4. Solder nozzle
5. Base plate
6. Board stop
7. Coding and center
holes
8. Quick locks
Ersa Standard Solder Nozzle Design
Old Standard
Wettable outer nozzle surface
New Standard
Non wettable outer nozzle surface
Requires continuous maintenance
Requires much less maintenance
Effective Measures against Solder Bridging
The use of wettable Combs and Plates inside the nozzles
• Mainly used with multiple rowed components
• Stops bridging of solder joints
• Better „peel off“ for excessive solder
Improving Process Management
Use of baffle frames for rising the solder level arround the nozzles
• Better heat transfer
• Reduction of dross
• Has to be adapted to the PCB size
Active Process Interlock
“Poka-Yoke Coding”
• Security to build in the right nozzle plate (and hold down system) in the right direction
• Plausibility check if solder nozzle plate matches with active solder program
Center holes
RFID Transponder + Reader
PCB/Component Hold Down System
• The PCB and/or the components can be held down
by the use of a product specific hold down plate.
• On this plate there are spring loaded pins, placed at
positions where support is needed.
PCB/Component Hold Down System
How it works
Support Pins
Carrier + PCB
Results of our Ersa research
Designing a nozzle plate is not as easy as it seems. There are a lot of different
parameters that take influence to the solder quality. Therefore permanent (time
consuming) talks between the design and application department is essential.
These parameters are:
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Heat capacity of the component
Adjacent components
Adjacent nozzles
Geometry of the component
Geometry of adjacent components
Geometry of the nozzles
• Parts built in the nozzle
(Combs, plates, platforms)
• Drain holes
• Splashing safety at drillings
• Keep-out zones
• …
Results of our own research
Bachelor Thesis of Ulrich Dosch
• Tests with different positions and diameters of the drains
• Tests with hot water and solder
Goal: Maximize the heat transfer from the solder wave to the PCB
Standard Applications
Special Applications
Electromagnetic Solder Pumps
Mechanical Pump
Multiwave solder module
Max. solder dimension 370 x 480mm
Max. pcb/carrier dimension 380 x 500mm
Solder filling (leadfree) appr. 450kg
Free space top/bottom +100/-40mm
Electromagnetic Pump (+ XL Version)
Muliwave Solder Module
Max. solder dimension 350 x 380mm (360 x 460)
Max. pcb/carrier dimension 350 x 450mm (406 x 500)
Solder filling (leadfree) appr. 230 kg (410 Kg)
Free space top/bottom +80/-25mm
Software
ERSAsoft – System
Visualization
Reflowlöten
Ersa CAD – Assistant 3
Off-line program
software
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Time-saving
Fluxer
Soldering
Auto-Track
Keep – Out Areas
PCB Layout Recommendations for Designers
Schematic diagram of soldering - and restricted areas
Solder joint
Area of soldering
Restricted area for non
selective solder joints
Area of soldering:
Area which is wetted by the solder wave. It is possible that the real solder joint
might be smaller. The position of the solder joint within the area of soldering
could be chosen. If possible a symmetrical/central position should be taken.
Restricted area:
Within this area there should be no adjacent components which are not going
to be selective soldered.
Important:Highest priority is the integrity of the restricted areas. If their size is less than specified,
adjacent SMT components may be spilled away during the selective soldering process.
Layout recommendations for Versaflow Flex - and Multi Wave are available as PDF
Kurtz- Ersa Soldering Systems
ASM Meeting Timisoara 14-10-2014
Innovations in Selective Soldering
• Highest Flexibility
• Throughput Solutions
Production needs us
Flexibility in modules
Basic System with Mini-Wave Soldering Module
Preheating Soldering
Module Module
and additional Mini-Wave
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One Fluxer module can be fitted with up to 4 flux spray heads
Preheater modules can additionally be segmented
Each solder module can be equipped with twin solder baths
With a dual conveyor throughput can be doubled
Basic System with Multi-Wave Module and additional Mini-Wave
Preheat Module
Module
- Fluxer: Precise fluxing of larger areas through application of 4 spray heads
- Preheat modules can additionally be segmented
- Alternatively available also with second multi-wave bath (no loss in productivity because of
product change)
Basic System  and maximum variation
- Highest throughput
- Maximum variation
Segmented Conveyor System (Dual Lane)
Dual Lane
- Doubles the through put
- Synchronous processing of the
board in the respective modules
Conveyor System
Versaflow with Dual Track Conveyor and additional soldering module
VERSAFLOW 3-45 Highspeed Multiwave
VERSAFLOW - Options
Other Selective Machines
Nozzle Solutions
Nozzle Solutions
NEW: Mini Vario Wave
- Selective Soldering machine with a stabile,
reproducible wave soldering process
- Selective- and wave soldering process in
one soldering module possible
- Outstanding wettability (75mm)
- Controlled movement speed and wave
pressure
- Ideal pressure distribution due to VARIOTechnology
- For selected applications and throughput
- Improved solder snap-off through
improved flow characteristics
Additional Options
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VF 3-66 (610 x 610mm) machines
Camera Control of Soldering Process
Automatic Solder Pot Feeders (with colour control)
Fiducial Recognition
Warpage Control Solutions
Automatic Nozzle Activation
Fifo Cooling Tower for Ecocell
Complete (Closed-loop) conveyor solutions
…
Ersa References (extract)
Selective Machine References in Romania
• Flextronics Timisoara (12)
• Zollner Satu Mare (3)
• Continental Timisoara (2)
• Psi-Control Brasov
• AEM Timisoara (4)
• Miele Brasov
• Leoni Arad (2)
• A-E Electronics Bacau
• Plexus Oradea
• Connect Group Oradea (In order)
• Celestica Oradea
• ...
• Robert Bosch Cluj (2)
Thank you
very much
for your attention!
We are highly
interested in your
„Challenges“
Questions ?????
Mixed PCB
Fine-Pitch PCB