MOST PRODUCTIvE PACKAGING SOLUTION

worldwide sales & service contacts
Any Questions? We are here to help
LIECHTENSTEIN
Headquarters
OC Oerlikon Balzers Ltd.
Iramali 18
P.O. Box 1000
9496 Balzers
Liechtenstein
T: +423 388 4770
[email protected]
S: [email protected]
CS: [email protected]
Germany
EMEA Hub
Oerlikon Deutschland
Vertriebs GmbH
Karl-Hammerschmidt-Strasse 34
85609 Aschheim-Dornach
Germany
T: +49 89 75 505 100
S: [email protected]
CS: [email protected]
AMERICAS
Central Hub
Oerlikon USA Inc
10050 16th Street North
St. Petersburg FL 33716
United States
T: +1 727 828 0850
S: [email protected]
CS: [email protected]
Taiwan (ROC)
Central Hub
DKSH Taiwan Ltd.
13F-1, No.100, Sec. 1,
Jiafong 11th Rd.
Jhubei City, Hsinchu County 302
Taiwan (R.O.C.)
T: +886 3 657 8788
S: [email protected]
CS: [email protected]
China
DKSH China Ltd.
1801 Hongmei Road
Innov Tower / Block A Unit 2208
Shanghai
China
T: +86 21 5383 8811
S: [email protected]
Japan
Hakuto Co., Ltd.
1-13. Shinjuku 1-Chome
Shinjuku-ku
Tokyo 160-8910
Japan
S: +81-3-3225-8992
CS: +81-3-3225-8992
S: [email protected]
Malaysia *
ZMC Technologies
(Malaysia) Sdn Bhd
No. 1-3-23 Krystal Point 2
Lebuh Bukit Kecil 6
Penang 11900
Malaysia
T: +60 4 646 4586
S: [email protected]
CS: [email protected]
STL: [email protected]
Singapore *
ZMC Technologies
(Singapore) Pte Ltd
10 Ubi Crescent #05-92/93/94/95
Lobby E, Ubi Techpark
Singapore 408564
Singapore
T: +65 6285 1161
S: [email protected]
CS: [email protected]
STL: [email protected]
South Korea
Woowon Technology Co., Ltd
1903 Parkview Office Tower
6 Jeongja-dong, Bundang-gu
Seongnam-si, Kyeonggi-do
463-863 South Korea
T: +82 31 783 4770
S: [email protected]
CS: [email protected]
KEY: T: Telephone, S: Sales, CS: Customer service, STL: Support, training & logistics. *Including Indonesia / Thailand / Philippines
www.oerlikon.com/systems
HEX/6P/EN/08_2011
Most Productive
Packaging
Solution
Outperforming Technology Requirements
HEXAGON
Advanced Packaging Solution
for High Volume Production
Under Bump & Re-distribution Metallization
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Innovation Has A Name – Cost of Ownership does too
At Oerlikon, we understand the pressure you have to lower your cost per wafer. That’s why our
newest tool for advanced packaging more than doubles wafer throughput, has a 50% smaller
footprint than its competitors, and runs up to 5000 wafers before requiring maintenance.
System integration and packaging are responsible for the functionality, quality and
economy of microelectronic products.
HEXAGON
Technical Information
UBM and RDL films are commonly used in todays advanced packaging industry.
The main requirements include Oxide free IC final metal pads, no damage etch step,
good adhesion to the chip surface and even more importand to the chip passivation,
hermetic seal to the chip passivation, good diffusion barrier between solder bump
metals and IC final metal,sufficient wetability of the UBM and low stress metal stack.
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UBM for Flip Chip, WLP and SIP production solutions eg. Ti-Cu, WTi-Cu etc.
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Oerlikon the market leader in packaging
Throughput
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Productivity
Features
Enhanced Wafer Level Packaging
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Cost per Wafer
Highest Throughput
Smallest Footprint
Lowest Energy Consumption
300mm or 200/300mm Bridge Capability
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Process Capabilities
DC/DCp Sputtering
ICP Etching
Thermal Pre-Treatment
Ultra Low Temperature Cleaning
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Reliability
Proven Process Components
Proven Material Handling Systems
Proven Control Backbone
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The eWLB technology allows the realization of chips with a high
number of interconnects. The package is not realized on a silicon
wafer as for classical Wafer Level Package, but on an artificial wafer.
Therefore a front-end-processed wafer is diced and the singulated
chips are placed on a carrier.
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100 Wafers-per-hour (Wph) Handling Limit
Conventional UBM Processing: 56 Wph
Enhanced UBM Processing: 68 Wph
High Output UBM Processing: 80Wph
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Chucks
Temperature Controlled
Full Face, Clamped, ESC, Floating
RF or DC Biased
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Over 90% typical availability
Over 4000 wafers maintenance intervals
Less than 6 hours Total Equipment Maintenance Time
Breakage rate Less than 1:20k
Mean Time Between Failure over 500 hours
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Chambers
Full Metal Sealed Stainless Steel Process Chambers
Full Process Isolation
UHV Pumping and Vacuum Capacity
3D &Through Silicon Packaging
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12m2 Equipment Mainframe
5m2 Support and Control Systems
17m2 Total Installation Area
Less than half of any other
commercially available System
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Maintainability
Drop-in Shield Kits
Powered Source Handling
Automated Maintenance Services
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Productivity
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Availability
Designed for Organic Passivation Layers
Highest Wafer Count per Maintenance Interval
Temperature Controlled Shields and Targets
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HEXAGON the ideal system to do eWLB production
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Foot Print & Layout
Transfer System
Up to four FOUP Atmospheric Front End
High Throughput Synchronous Motion Indexer
Wafer Position Monitoring
Mechanically Confined Wafer Transfers
Cryogenic Gates and Toroidal Chamber Design for
Open Source Isolation
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Traditional scaling of semiconductor chips also improves signal
propagation speed. 3-D integrated circuits address the scaling challenge
by stacking 2-D dies an connecting them in the 3rd dimension. This
promises to speed up communication between layered chips. 3D
ICs promise many significant benefits including: Footprint, Cost,
Heterogeneous integration, Shorter interconnect, Power, Design, Circuit
security
Another application for the HEXAGON
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Operability
Fully Pre-Integrated Systems for Fast Installation
90% Spare Part Overlap with Previous Generation
90% Process Matching with Previous Generation
100% Control and Operation Compatibility with
Previous Generation
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Thin Wafer & Backside Metallization
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Backside metallization on thin wafers are required to either build a
solder contact for improved heat drain or create an ohmic contact
layer, typically used in power device (IGBT), processors, graphic chips
etc.
Handling reliability is one of the key advantages of the HEXAGON
Above: The revolving carousel on HEXAGON
Below: At just 12m2 the HEXAGON mainframe