Going Green EcoDesign 2001, 2nd International Symposium on
Transcription
Going Green EcoDesign 2001, 2nd International Symposium on
Early Registration Deadline: November 21, 2001 CONTENTS Foreword 2 Scope and Format 3 International Symposium on Electronics and the Environment 6 Care Electronics within Eureka 7 Plenary speakers 8 Program Overview 12 December 9 13 December 10 14 December 11 15 December 12 Room Information 13 Tutorials 14 Program 12 December 17 13 December 25 14 December 33 15 December 49 Poster Session 61 General Information 63 Conference Committees 71 Conference Organization 77 Acknowledgments 80 Registration Form 81 Hotel Reservation Form 85 Access Map to the Intercommunion Session (NMESI, the Nippon Miraikan) 87 1 FOREWORD Sustainable Development is the most significant concept that all kinds of people must deeply consider its implication in modern society. The concept was originated by Mrs. Brundtland who chained the World Commission for Environment and Development in 1987. The concept has become subject of discussion very often and in various occasions since then, but without concluding any practical policy or activity to satisfy the concept. As a result, some people starts insisting that the concept is just an illusion which can not be realized and sometimes deceive the masses. This insistence is absolutely wrong. The concept, Sustainable Development, is not mentioning the ways along which people can actually achieve the goal. On the contrary, it is proposing an equation that must be solved urgently in order to avoid the concurrent global disasters of natural environment and human society. The definition of the concept is clear but solution of the equation proposed within the concept is difficult to solve. More definitely, it should be said that Mrs. Brundtland told us that there is no solution in our society if we proceed on the same way that we did in the past. Some fundamental changes are requested. They are international relations, industrial policies, competition in the market, policies for material and energy resources, official aids for developing countries, and rather strange to say, life styles of people. How can we moderate them in a harmonic way? We do not have any feasible way to cope with them concurrently. Some comprehensive proposals to solve the equation of Sustainable Development are highly requested. They seem to be integrated ones that involve national science, engineering, social science, medical science and humanities. It is desirable that those separated researchers in different academic domains would come together to communicate each other and to construct a unique proposal to be opened to the general society. It should be pointed out here,that for the integration of different academic domains, the domain-specific academic conclusions must be followed up by practical actions. For such follow-up, we may need new engineering, such as social engineering and humanity engineering, both of them will be doubtlessly based on social science and humanities, being similarly composed the relationship between natural science and engineering. EcoDesign 2001 will show a sound step to solve the different equation of Sustainable Development from various aspects of disciplinary and interdisciplinary researches. We heartily hope that you will get unbounded information about Sustainable Development from the Conference, and possibly contribute it for further step of progress by your thoughts in the particular scientific domains. Hiroyuki Yoshikawa, Symposium Chair Chairman, The Science Council of Japan 2 SCOPE AND FORMAT The EcoDesign 2001 organizing committee is pleased to announce EcoDesign 2001, the Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, to be held on December 11-15, 2001 at Tokyo Big Sight, Tokyo, Japan. This symposium is organized by Union of EcoDesigners (Association of EcoDesign Societies, Japan), follow up on the first, successful “EcoDesign ’99” (Tokyo, February 1999). The Union comprises of 50 scientific societies, foundations and associations in Japan. The symposium is held in “Going Green” : Global collaboration with IEEE Technical Committee on the Electronics and the Environment, USA, and CARE Electronics, Europe. The technical program of EcoDesign 2001 comprises three plenary speeches, 10 keynotes addresses, and 10 invited speeches along with approximately 236 contributed papers (including 16 posters) from 23 countries around the world, which are based upon six pillars of categories and nine special themes as follows. We want to discuss how information and communication technology can contribute to a sustainable developmet. Which products and technologies are needed? You can expect to learn state-of-the-art of these domains by attending the sessions. Category A: Environmentally Conscious Product Design Topics: EcoDesign Case Studies, Modular Design, Industrial Design, Life Cycle Design, EcoDesign Processes, EcoDesign Methods, Design for X, Integration of EcoDesign and CAD, Information Sharing for EcoDesign, Tools for X, LCA Case Studies, Design for Disassembly Sessions: 19 Oral presentations: 75 (included one keynote speech made by Prof. E. Manzini, Italy) Category B: Process Technologies and Elemental Technologies Topics: Eco-Materials, Long Fatigue Life (Giga-cycle) of Materials, Maintenance, Cleaner Processes and Energy-Saving Processes Sessions: 6 Oral presentations: 23 (included one keynote speech made by Dr. C. Bathias, France) Category C: Inverse Process Technologies Topics: Reuse and Recycling (Strategies and Technologies), Inverse Process System Design Sessions: 7 Oral presentations: 24 (included one Invited speech) 3 Category D: Business Strategies Topics: Environmental Conscious Market and Corporate Strategies, Servicification for Dematerialization Sessions: 2 Oral presentations: 9 (included one keynote speech made by Prof. H. Brezet, The Netherlands) Category E: Sustainable Social Systems Topics: Environmental Education, Environmental Accounting, Social System Design, Labelling and Logistics Sessions: 5 Oral presentations: 19 (included one keynote speech made by Prof. M. Charter, UK) Category F: Environmentally Conscious Management Topics: Supply Chain Management, Management System, LCA Sessions: 4 Oral presentation: 22 Following specific sessions created by leading experts from around the globe. Special Theme 1: Factor 10 (Resources Productivity) Oral presentations: 7 Special Theme 2: Promotion of DFE (Design for Environment) Sessions: 2 Oral presentations: 6 (included one keynote speech made by Prof. P. Eagan, USA) Special Theme 4: Industrial Ecology (Invited Session) Sessions: 4 Oral presentations: 10 (including 9 invited lectures) Special Theme 5: Recycling of Individual Products (Current and Future) Oral presentations: 5 Special Theme 6: Research Trends in Lead-free Soldering Oral Presentations: 6 (including two keynote speeches made by Prof. K. Nimmo, Italy and Dr. C. Handwerker, USA) Special Theme 8: EcoDesign and Chemical Engineering Organized by The Society of Chemical Engineers, Japan Sessions: 3 Oral presentations: 13 (including two keynote speeches made by Mr. Y. Yasui, Japan and Prof. J. Petrie, Australia) 4 Special Theme 9: Advanced Technology for Electronic Packaging – JIEP Session Organized by Japan Institute of Electronics Packaging Sessions: 2 Oral presentations: 9 (including one keynote speech made by Mr. H. Hayashi, Japan) Special Theme 10: Low-temperature Lead-free Solder This session reports the current status of the low-temperature lead-free soldering project organized by Japan Institute of Electronic Packaging Oral presentations: 6 Special Theme 11: IMS Project on Lead-free Soldering EFSOT Organized by IMS (Intelligent Manufacturing System) Project on Next Generation Environment-Friendly Soldering Technology (EFSOT) Sessions: 2 Oral presentations: 6 As another important feature, three tutorials are scheduled on the first day of the symposium, December 12 morning, inviting international lectures to provide participants with their enlightening ideas. Additional interesting events are exhibition held by a variety of 350 companies displaying their unique products and latest environmentally conscious technologies from around the globe, and, specially arranged for overseas participants, technical tours (December 11) which introduce them to the recycling facilities of two Japanese firms and two interesting architectures. Abundant in topics and nationalities of the speakers, EcoDesign 2001 will produce a stimulating and productive moment for all participants. We welcome you to the symposium and hope you find this opportunity useful. Tadatomo Suga, Technical Committee Chair Prof. Dr., The Univ. of Tokyo RCAST (Research Center for Advanced Science & Technology) 5 International Symposium on Electronics and the Environment The ISEE will continue established traditions as the world’s leading forum on electronics and the environment. More broadly, the ISEE has grown into a premier meeting of professionals in design for environment, polllution prevention and environmental policy fields. “Life-Cycle Environmental Stewardship for Electronic Products” will reaffirm the electronics industry’s leadership in environmental design and management, including life-cycle management, disassembly, recycling, takeback, energy use minimization, supply chain management and other activities. The symposium will also look forward to new domains such as electronic commerce, new materials and components, advances in manufacturing, and environmentally preferable purchasing. The ISEE is organized by IEEE CS TCEE (The Institute of Electrical and Electronics Engineers, Inc. (IEEE), Computer Society, Technical Committee on Electronics and the Environment), USA. The next ISEE will be held May 6-8, 2002 in San Francisco, California, USA. It will be held in conjunction with the IAER’S (International Association of Electronics Recyclers) third annual Electronics Recycling Summit. 6 Care Electronics within Eureka On the threshould of a new millennium the impact of electronics on the quality of life of mankind has never been greater. Advances in electronics have revolutionized the way in which we live and do business. However, every technological advance brings with it new demands on the Earth’s resources and subsequent changes to the global environment. Manufacturers of electronic equipment are increasingly being made aware of their environmental impacts by legislation, customers and competitors. Recognizing their responsibility to the Environment, electronics companies world-wide have been working to minimize their impact, develop new ‘clean’ technologies and to integrate environmental considerations into new designs to cope with end-of-life issues. CARE electronics within the EUREKA umbrella is the largest environmental research platform of the European electronics industry. CARE Electronics means Comprehensive Approach for the Recycling and Ecoefficiency of Electronics. CARE Electronics is a strategic initiative to understand the international & national implications of sustainability for the electr(on)ics industry in the future. CARE Electronics is an independent, industrial R&D network with members from large as well as small companies & research organisations. CARE Electronics • forecasts products, technologies, services & societal expectations, • identifies & researches strategic issues, • provides a platform for dialogue with government, business, academia & society and • initiates and supports a series of projects which deliver sustainable solutions. CARE Innovation is the periodic international meeting of CARE Electronics. 7 PLENARY SPEAKERS Opening Address (Dec.12, 13:30-13:45) Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan/ National Inst.of Advanced Industrial Science and Technology, Japan Plenary I (Dec.12, 13:45-14:25) The Development and Promotion of the Ecological Rucksacks and MIPS Concept F. Schmidt-Bleek, Factor 10 Inst., France Plenary II (Dec.12, 14:25-15:05) Overview of Activities of the EC in the Field of Products and the Environment Marco Onida, DG Environment, European Commission Plenary III (Dec.15, 15:40-16:30) Design ‘Sustainable’ Products/Service Systems John Ehrenfeld, Masachusetts Inst.of Technology, USA Closing Lecture (Dec.15, 16:45-17:15) Comprehensive Product Modelling for Designing Life Cycle Scenarios Fumihiko Kimura, Org. Com. Co-Chair/The Univ. of Tokyo, Japan Closing Words (Dec.15, 17:15-17:30) Diana Bendz, Org. Com. Co-Chair/IEEE CS TCEE/IBM, USA The above speeches are all held at the International Conference Room on the 7th floor. 8 9 18:30-20:30 18:00-18:20 17:40-18:00 17:20-17:40 C1-2 Reuse and Recycling (Strategies and Technologies) (2) C1-1 Reuse and Recycling (Strategies and Technologies) (1) F1 Supply Chain Management Welcome Reception (at Room 102, 1F, Tokyo Big Sight, Tower Building) Break B1-2 Eco-Materials (2) A1-3 EcoDesign Case Studies (2) 16:40-17:00 B1-1 Eco-Materials (1) 17:00-17:20 16:20-16:40 16:00-16:20 15:40-16:00 A1-2 EcoDesign Case Studies (1) ST4-1-2(Invited Lectures) Industrial Ecology and EcoDesign (2) Break ST4-1-1(Invited Lectures) Industrial Ecology and EcoDesign (1) Break A1-1 EcoDesign Strategies Plenary II: Overview of Activities of the EC in the Field of Products and the Environment (Marco Onida, European Commission) 14:25-15:05 15:05-15:20 15:20-15:40 Opening Address (Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan) Room 6 Plenary I: The Development and Promotion of the Ecological Rucksacks and MIPS Concept (F. Schmidt-Bleek, Facto 10 Inst, France) Room 5 13:45-14:25 Lunch/Sing-up & Registration (B. Bras) Room 4 13:30-13:45 12:00-13:30 9:00-12:00 Tutorial 3 Tutorial 2 H. Griese O. Deubzer J. Müler L. Stobbe Room 3 Tutorial 1 Room 2 (A. Stevels) Room 1 Wednesday, 12 December 2001 PROGRAM OVERVIEW 17:50 Poster 10 Break C2-2 Inverse Process System Design (2) C2-1 Inverse Process System Design (1) Room 3 Lunch F2 Management System Room 4 ST1-2 Factor 10 Room 5 Room 6 ST4-2-2(Invited Lectures) Industrial Ecology and EcoDesign (4) Break ST4-2-1(Invited Lectures) Industrial Ecology and EcoDesign (3) Break 14:00-14:45 14:45-15:00 15:00-17:00 The Application of Eco-Design —Ten Years of Dynamic Development / A.L.N. Stevels (Delft Univ. Technology) 13:20-14:00 Coordinator: Panellists: Hisatake Kato (Tottori Univ. of Env. Studies) Yotaro Kobayasi (Fuji Xerox) Kisho Kurokawa (Architect) Noriko Kimoto (under negotiation) Panel Discussions Environmental Efficiency as a Keyword / Ryoichi Yamamoto (The Univ. of Tokyo) Environmental Technology Applicable to Reforming Economy —My Proposal / Hisatake Kato (Tottori Univ. of Env. Studies) 13:05-13:20 13:00-13:05 12:00-13:00 11:40-12:00 11:20-11:40 A2-4 EcoDesign Case Studies (4) A2-3 EcoDesign Case Studies (3) Room 2 EcoProducts 2001 Exhibition Symposium: For Reforming Japanese Economy on the Basis of Environmental Aspects —Vision to an Affluent Eco-Society — (organized by EcoProducts Exhibition) Welcome / Hiroshi Sakisaka (Japan Environmental Management Association for Industry) A2-2 Industrial Design 11:00-11:20 Break 10:20-10:40 A2-1 Modular Design Room 1 10:40-11:00 10:00-10:20 9:40-10:00 9:20-9:40 Thursday, 13 December 2001 PROGRAM OVERVIEW Poster Preparation Poster 11 A3-4 Design for X (1) 16:00-16:20 18:00-20:00 17:00-17:20 16:40-17:00 16:20-16:40 Break 15:40-16:00 15:20-15:40 15:00-15:20 14:40-15:00 14:20-14:40 14:00-14:20 13:40-14:00 13:20-13:40 13:00-13:20 12:40-13:00 12:20-12:40 12:00-12:20 11:40-12:00 11:20-11:40 A3-3 EcoDesign Methods A3-2 EcoDesign Processes 11:00-11:20 Break 10:40-11:00 A3-1 Life Cycle Design Room 1 10:20-10:40 10:00-10:20 9:40-10:00 9:20-9:40 E3-1 Environmental Education Break C3-3 Reuse and Recycling (Strategies and Tech.) (5) C3-2 Reuse and Recycling (Strategies and Tech.) (4) D3-2 Servicification for Dematerialization D3-1 Environmental Conscious Market and Corporate Strategies B3-2 Long Fatigue Life (Giga-cycle) of Materials (2) Break F3-2 LCA (2) F3-1 LCA (1) Break ST10-3 Low-temperature Lead-free Solder Break ST11-3 IMS Project on Lead-free Soldering EFSOT ST6-3 Research Trends in Lead-free Soldering E3-2 Environmental Accounting B3-1 Long Fatigue Life (Giga-cycle) of Materials (1) C3-1 Reuse and Recycling (Strategies and Tech.) (3) Break Room 6 Room 5 Room 4 Room 3 Intercommunion Session (at Restaurant 5K PLANETS, 7F, NMESI <The Nippon Kagaku Miraikan>) A3-8 Information Sharing for EcoDesign (2) A3-7 Information Sharing for EcoDesign (1) Lunch & Poster Session A3-6 Integration of EcoDesign and CAD Break A3-5 EcoDesign Case Studies (5) Room 2 Friday, 14 December 2001 PROGRAM OVERVIEW Poster Exhibition Poster Session Poster Exhibition Poster 12 Break B4-2 Cleaner Processes and Energy-Saving Processes Lunch E4-2 Social System Design (2) Break E4-1 Social System Design (1) Room 3 ST9-4-2 Advanced Technology for Electronic Packaging – JIEP Session (2) ST9-4-1 Advanced Technology for Electronic Packaging – JIEP Session (1) E4-3 Labelling and Logistics Room 4 Room 5 ST8-4-3 EcoDesign and Chemical Engineering (3) ST8-4-2 EcoDesign and Chemical Engineering (2) Break ST8-4-1 EcoDesign and Chemical Engineering (1) ST2-4-2 Promotion of DFE (2) Break ST2-4-1 Promotion of DFE (1) Room 6 ST5-4 Recycling of Individual Products (Current and Future) Best Paper & Best Poster Awards Closing Words (Diana Bendz, Org. Com. Co-Chair/IEEE CS TCEE/IBM, USA) 16:45-17:15 17:15-17:30 Plenary III: Designing ‘Sustainable’ Product/Service Systems (John Ehrenfeld, MIT, USA) A4-4 Design for Disassembly A4-3 LCA Case Studies Break B4-1 Maintenance Room 2 Closing Lecture: Comprehensive Product Modelling for Designing Life Cycle Scenarios (Fumihiko Kimura, Org. Com. Co-Chair/The Univ. of Tokyo, Japan) A4-2 Tools for DfX A4-1 Design for X (2) Room 1 16:30-16:45 15:40-16:30 15:20-15:40 15:00-15:20 14:40-15:00 14:20-14:40 14:00-14:20 13:40-14:00 13:20-13:40 13:00-13:20 12:40-13:00 12:20-12:40 12:00-12:20 11:40-12:00 11:20-11:40 11:00-11:20 10:40-11:00 10:20-10:40 10:00-10:20 9:40-10:00 9:20-9:40 Saturday, 15 December 2001 PROGRAM OVERVIEW Poster Poster Exhibition ROOM INFORMATION Tokyo Big Sight, Tower Building (Kaigi-to) 6th Fl. 605, 609, 610:Tutorials 605 ~ 610:Conf. Rm 604: Poster 603: Check Rm for Technical Equipment Lobby :Registration Desk 601: Secretariat 602: Committee/Recess Rm for Invited 7th Fl. Int. Conf. Rm. Opening, Plenaly I ~ III Best Paper & Best Poster Awards Closing 13 TUTORIALS Wednesday, 12 December 2001, 9:00-12:00 Tutorial 1 Ecodesign Business and Green Marketing 1) Integration of EcoDesign into the Business 2) Green Marketing and Sales Prof. Dr. Ir. A. L. N. A. Stevels Philips Consumer Electronics/Delft Univ. of Technology, The Netherlands Three main drivers to do it (customers, legislation and competetive advantage). Several types of “green” to be considered (scientific green, government green, customer green). The Ecodesign matrix. Three types of environmental activities (defensive, cost oriented, proactive). Four levels of EcoDesign Vision, strategy policy, roadmap. How to organize. How to develop green options and how to do business evaluation of them. Integration of green into product creation. Example of green programmes and of green product realizations. Lessons learned from ten years working implementation of Ecodesign. Five ways of making money while being “green”. Seven archetypes of green consumer behaviour: – Characteristics of archetypes – How to circumvent the “green does not sell” trap – Environmental communication – Green image and its importance – How to put more green into your brand – Position of ecolabels – Integration of green idea generation, product development and marketing 14 Tutorial 2 Applied EcoDesign — Product Characterization by Sustainability Indices Dr. H. Griese, O. Deubzer, J. Müller, L. Stobbe Fraunhofer Inst. for Reliability and Microintegration (IZM), Berlin, Germany Presentation methods and practical applications of product characterization with ecological special sustainability indices. Key points are resource consumption, material content, hazardous materials and risk assessment, recycle/reuseability, and aspects of sustainability in the IT sector. The focus lies on the reduction of energy consumption and hazardous substances. The tutorial includes the following topics: 1) Sustainability Roadmap and EcoDesign in the field of ICT – Status quo and trend analysis – Field of activity – Best practice examples environmental report (Sony; Philips; Flextronics) 2) EE Toolbox methodology for environmentally conscious design – Tool TPI – Tool ERM – Tool IPI – Tool ProTox – Tool RPI 3) Application examples of the EE-Toolbox – Example Switched power supply – Example PWB telephone – Example mobile phones – Example Semiconductor Fab The tutorial will be held by specialists of the Fraunhofer IZM, Dept. of Environmental Engineering (organizer of “Electronics Goes Green 2000+”). 15 Tutorial 3 Identifying Economic and Environmental Win-Win Situations in EcoDesign Prof. Bert Bras Georgia Institute of Technology, USA In this tutorial, the focus is on how to identify technical, economical, and environmental win-win situations. A key focus area will be on how to integrate economic and environmental assessments in order to easily identify opportunities for economic and reducing environmental improvements. In the tutorial, attendees will learn about: – EcoDesign guidelines and strategies and how they affect other design and business requirements – Assessment tools like Life-Cycle Analysis, Life-Cycle Costing, Full Cost Accounting, etc. and how they can (or cannot) be used to identify win-win situations in both product and process design – How to integrate financial and environmental assessments in a single framework using Activity-Based Cost and Environmental Management – Technologies and tools that support integrated performance assessments and monitoring – Industrial case studies and examples from Europe, Japan and the United States The tutorial will be given by Dr. Bert Bras who is a faculty member in Mechanical Engineering and Director of Georgia Tech’s Institute for Sustainable Technology and Development. He has taught and published (including one book) extensively in the area of Environmentally Conscious Design and Manufacturing. He recently served on a panel of experts benchmarking the global state of Environmentally Benign Manufacturing for the US National Science Foundation and Department of Energy. 16 Room 1 9:00-12:00 Tutorial 1 Ecodesign Business and Green Marketing 1) Integration of EcoDesign into the Business 2) Green Marketing and Sales Ab Stevels, Philips/Delft Univ. of Technology, The Netherlands Room 2 9:00-12:00 Tutorial 2 Applied EcoDesign-Product Characterization by Sustainability Indices Hansjörg Griese, Otmar Deubzer, Jutta Müller, Lutz Stobbe, Fraunhofer IZM, Belin, Germany Room 3 9:00-12:00 Tutorial 3 Identifying Economic and Environmental Win-Win Situations in EcoDesign Bert Bras, Georgia Inst. of Technology, USA International Conference Room, 7F 13:30-13:45 Opening Address Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan, Japan 13:45-14:25 Plenary I The Development and Promotion of the Ecological Rucksacks and MIPS Concept F. Schmidt-Bleek, Factor 10 Inst., France 14:25-15:05 Plenary II Overview of Activities of the EC in the Field of Products and the Environment Marco Onida, DG Environment, European Commission 17 Dec 12 WEDNESDAY, 12 DECEMBER 2001 Tutorial/Opening/Plenary I, II PROGRAM Room 1 A1-1 Dec 12 15:20-17:20 A1-1: EcoDesign Strategies 1. System Boundaries and Functional Priorities in Different Life Phases in the Context of Eco-Design Ulrika Forsberg, Jessica Lagerstedt, Royal Inst. of Technology, Sweden 2. Combined Strategies for Recycling — Product and Process Oriented Benchmarking Juergen Hesselbach, Christoph Herrmann, Technical Univ. Braunschweig, Germany 3. Planning Product Take Back Period and Component Life under Uncertainty in Technological Evolution Hideo Fujimoto, Alauddin Ahmed, Nagoya Inst. of Technology, Japan 4. The Conflict of Contradictory Environmental Targets Conrad Luttropp, Reine Karlsson, KTH, Sweden 5. Environmentally Compatible Product Design: The Business Strategy of Siemens Ferdinand Quella, Siemens, Germany 6. Subjects in and Approaches for Life Cycle Design Toshijiro Ohashi1, Yoshio Matsumoto2, 1Hitachi, 2Tokai Univ., Japan 18 1. Confronting Product Life Thinking with Product Life Cycle Analysis Tim C. McAloone, Technical Univ. of Denmark, Denmark 2. About the Environmental Load Relevant to Water, and Its Reduction Daisuke Yamanouchi, TOTO, Japan 3. Ecological Design for the Usage Phase: An Interdisciplinary Approach to DfE Christof Oberender, Olaf Weger, Juergen Sauer, Herbert Birkhofer, Darmstadt Univ. of Technology, Germany 4. On the Way to Green Mobile Products Jutta Mueller1, Hansjoerg Griese1, Herbert Reichl1, 2, 1Fraunhofer Inst. for Reliability and Microintegration, 2Technical Univ. of Berlin, Germany 17:00-18:00 A1-3: EcoDesign Case Studies (2) 1. The Aptitudes of the Ecodesign Competitions Held During 1987 to 1997 in Japan Edilson Ueda, Tadao Shimizu, Chiba Univ., Japan 2. Ecodesign Demonstration Project (LIFE) — Examples of Ecodesign in Belgian Industry An Vercalsteren, Bart Jansen, Vito (Flemish Inst. for Technological Res.), Belgium 3. Regarding the Actual Condition of Industrial Waste, and Possibility That Utilizes it Effectively as Materials for Other Industries Yoshiaki Kamo, Japan Inst. of Plant Maintenance, Japan 19 Dec 12 15:20-16:40 A1-2: EcoDesign Case Studies (1) A1-2/A1-3 Room 2 Dec 12 B1-1/B1-2 Room 3 15:20-16:40 B1-1: Eco-Materials (1) 1. Properties of a Novel Polyarylate Yoshinao Ishigure1, Kousuke Yamauchi2, Masashi Niikawa3, Yoshihiro Kubota4, Yoshihiro Sugi4, Minoru Miwa4, 1Research Inst. of Industrial Products, Gifu Prefectural Government, 2Nissei Kagaku Kogyosho, 3Tenryu Kogyo, 4Gifu Univ., Japan 2. Environmental Benchmark Analysis of Electr(on)ic Products with Components Consisting of Renewable Raw Materials Heiko Maas1, Michael Flake2, 1Technical Univ. of Braunschweig, 2LCE Consulting, Germany 3. Method for Interconnected Development and Selection of Basic Material, Exemplified on the Basis of Biodegradable Synthetic Materials Made-up of Renewable Primary Product Hermann Kuehnle, Otto-von-Guericke-Univ. Magdeburg, Germany 4. Newly Developed Chromium-free Organic-inorganic Composite Coated Steel Sheet with Excellent Corrosion Resistance Takahiro Kubota, Naoto Yoshimi, Akira Matsuzaki, Satoru Ando, Masaaki Yamashita, NKK, Japan 17:00-18:20 B1-2: Eco-Materials (2) 1. A High Reliability Halogen-free Flame-retardant Dielectric for Build-up PWBs Yasunori Yoneda, D. Mizutani, N. F. Cooray, K. Motoyoshi, Fujitsui Labs., Japan 2. Feasibility Study for Recycling of JVC Compact Disks for Use in the Manufacturing of Motorola Plastic Housings Markus Stutz1, Doreen Schnecke1, Teruo Takahashi2, Noboru Kawai2, Koji Tsujita2, 1Motorola, Germany, 2Victor Co. of Japan, Japan 3. Hydrothermal Solidification of Inorganic Waste Materials Mikihiro Oida1, Hideki Ishida2, Hiroki Maenami2, Hiroto Shin2, Hiroaki Kuno2, 1Aichi Science and Technology Foundation, 2INAX, Japan 20 Room 3 B1-2 21 Dec 12 4. R&D of Environmentally Friendly Plate Material NPPS with Burrs for Electric Vehicle Storage Battery Use Kaihua Xu1, Min Wang1, Xueyi Guo2, Ryoichi Yamamoto2, 1Shenzhen Zhongjin Hi-Energy Battery Material Co., China, 2The Univ. of Tokyo, Japan Dec 12 C1-1/C1-2 Room 4 15:20-16:40 C1-1: Reuse and Recycling (Strategies and Technologies) (1) 1. Recent Trends and Benefits of Remanufacturing: From Closed Loop Businesses to Synergetic Networks Rolf R. Steinhilper, Univ. of Bayreuth, Germany 2. An Analytic Approach for Designing Reverse Production System Infrastructure When Facing Uncertainty Jane C. Ammons, Tiravat Assavapokee, David Newton, Matthew J. Realff, Georgia Inst. of Technology, USA 3. Experiences with Take-back of White and Brown Goods in The Netherlands Ab Stevels, Delft Univ. of Technology, The Netherlands 4. Feasibility Study of the Recycling Options in Malaysia — The Kota Kinabalu Case Study Lee Chong Theng, Mohd Nasir Hassan, Md Mizanur Rahman, Muhamad Awang, Univ. Putra Malaysia, Malaysia 17:00-18:00 C1-2: Reuse and Recycling (Strategies and Technologies) (2) 1. Ricoh’s Global Deployment of Recycling Masakatsu Nakagawa, Ricoh, Japan 2. FXOS Recycled Pulp Promotion Program Hiromi Ishida, Katsumi Harada, Hiroshi Tokita, Kazuhide Suzuki, Masayuki Tsuchiya, Kazuya Suda, Mitsuo Ishida, Taiji Ohashi, Fuji Xerox Office Supply, Japan 3. Recycling-oriented Production and Assessment of FujiFilm One Time Use Camera “Quick Snap” Shu-ichi Ichino, Fuji Photo Film, Japan 22 Room 5 F1 1. Environmental-Economic Supply Chain Management of Suppliers, Contract Manufacturers and Recyclers: More than Requirements for Environmentally Hazardous Substances and Environmental Management Systems Menno H. Nagel, Delft Univ. of Technology, The Netherlands 2. Production Planning in Remanufacturing/Manufacturing Production System Andre Kasmara1, Masaaki Muraki2, Shinobu Matsuoka2, Sukoyo2, Kadarsah Suryadi1, 1Bandung Inst. of Technology, Indonesia, 2Tokyo Inst. of Technology, Japan 3. Environmental Supply Chain Management in the Electronics Industry Dana Hollien1, Graham L. Adams2, Michael Loch1, Steven M. Scheifers1, Markus Stutz3, 1Motorola, USA, 2Motorola, UK, 3Motorola, Germany 4. Consumer Incentive toward the Construction of Supply Chain for Inverse Manufacturing Keijiro Masui1, Jun Fujimoto2, Toshihiko Ito3, Eiji Sato4, Yuichi Hayakawa5, Masato Matsunaga6, Mutsumi Mikoda7, Takeshi Yuda8, 1National Inst. of Advanced Industrial Science and Technology, 2NEC, 3Nissan Motor, 4Hitachi, 5Meidensha, 6ECO KEIKAKU, 7Japanese Material Handling Society, 8Sony, Japan 5. Material-flow based Supply Chain Management in the Electronic Industry Juergen Hesselbach, Rene Graf, Martin Ohlendorf, Christoph Herrmann, Technical Univ. Braunschweig, Germany 6. Design and Integration of “Intelligent Agents” to Implement Conscious and Sustainable Future Production Systems Pierre Massotte, Jihad Reaidy, Yuinggiu Liu, Daniel Diep, Ecole des mines d’ales, France 23 Dec 12 15:20-17:20 F1: Supply Chain Management Dec 12 ST4-1-1/ST4-1-2 Room 6 15:20-16:40 Special Theme 4-1-1 (Invited Lectures): Industrial Ecology and EcoDesign (1) 1. Designing Sustainable Product/Service Systems John Ehrenfeld, Massachusetts Inst. of Technology, USA 2. Environmentally-Benign Manufacturing as a System Science Thomas Graedel, Yale Univ., USA 3. Material Flow Accounting as a Tool for Industrial Ecology Yuichi Moriguchi, National Inst. for Environmental Studies, Japan 17:00-17:50 Special Theme 4-1-2 (Invited Lectures): Industrial Ecology and EcoDesign (2) 1. Industrial Ecology in Off-site Building Component Industry: Case Study on Bathroom Units Sectors Shih-Hung Yang, Tomonari Yashiro, Kenji Nishimoto, The Univ. of Tokyo, Japan 2. Implementation of “Life Cycle Value Index” in Assembly Houses Tomomi Murata1, Tomonari Yashiro2, 1The Univ. of Kitakyushu, 2The Univ. of Tokyo, Japan 24 Thursday, 13 December 2001 Room 1 9:20-10:20 A2-1: Modular Design 3. Design of Product Modularity for Life Cycle Management Tomoyuki Hata, Satoru Kato, Fumihiko Kimura, The Univ. of Tokyo, Japan 10:40-12:00 A2-2:Industrial Design 1. Sustainability and Scenario Building: Scenarios of Sustainable Well-being and Sustainable Solutions Development (Keynote) Ezio Manzini, Politecnico di Milano, Italy 2. Ecodesign Integration in Concept Development Tracy A. Bhamra, Chris Sherwin, Vicky A. Lofthouse, Stephen Evans, Cranfield Univ., UK 3. Producing Eco-value for a Recycling-based Society by Industrial Design Fumikazu Masuda, Tokyo Zokei Univ., Japan 25 Dec 13 2. Management of Joint Information to Support Design Module Kazuhiro Aoyama1, Shyoji Takechi1, Mitsuhiro Iwamura2, 1The Univ. of Tokyo, 2NTT Data, Japan A2-1/A2-2 1. A Study on Design for Upgradable Products Considering Future Uncertainty Yoshimasa Umemori1, Shinsuke Kondoh1, Yasushi Umeda1, Yoshiki Shimomura2, Masaharu Yoshioka3, 1Tokyo Metolopolitan Univ., 2The Univ. of Tokyo, 3National Inst. of Informatics, Japan Room 2 9:20-10:40 A2-3: EcoDesign Case Studies (3) 1. Recyclability of Flame Retardant Plastics Raymond B. Dawson, Susan D. Landry, Marcia L. Hardy, Hiroaki Yamada, Albemarle, USA Dec 13 A2-3/A2-4 2. A Study on Marketability of Environmentally Conscious Products Made of Long Life Material Pi-Ju Tsai, Shin’ya Nagasawa, Ritsumeikan Univ., Japan 3. Vehicle Recycling from a Designers Perspective Anne-Mrie E. Akermark, Royal Inst. of Technology, KTH, Sweden 4. A Study on Marketability of the Next Generation Community Vehicle (NCV21) Pi-Ju Tsai, Satoshi Kawae, Shin’ya Nagasawa, Ritsumeikan Univ., Japan 11:00-12:00 A2-4: EcoDesign Case Studies (4) 1. The Influence of Copper Smelters Requirements on Design Rules for Electronics Goran Malhammar, Christina Berglund, Ericsson Radio Systems, Sweden 2. Construction of Two 25M Tall Vertical Arrays with 2nd Generation Amorphous Silicon Photovoltaic Technologies King Hang Lam1, Edward Lo2, Josie Close1, 1The Univ. of Hong Kong, 2The Hong Kong Polytechnic Univ., China 3. Application of Ecodesign in Nonferrous Metal Industry in China Xueyi Guo1, Chuanfu Zhang2, Ryoichi Yamamoto1, 1The Univ. of Tokyo, Japan, 2Central South Univ., China 26 Room 3 9:40-10:40 C2-1: Inverse Process System Design (1) 1. Car Recycling and Producer Responsibility in Sweden (Invited) Nils Hernborg, The Association of Swedish Automobile Manufacturers and Wholesalers, Sweden 11:00-12:00 C2-2: Inverse Process System Design (2) 1. Study of Inverse Supply Chain (1) — Survey of Actual Inverse Supply Chain in Japan Susumu Shibata1, Hiroshi Uesugi2, Yasushi Wada3, Hiroya Terui4, Genichi Mitsuishi4, Makuni Inoko5, Hitoshi Fujiwara6, Shigehisa Endoh7, Kazuhito Haruki8, Shuuji Hoshino9, Yoshio Itoi10, Toshiyoshi Okazaki11, 1Toyo Engineering, 2Kawasaki Steel, 3Yokogawa Electric, 4Komastu, 5NKK, 6Juki, 7National Inst. of Advanced Industrial Science and Technology, 8Toshiba, 9Ishikawajima-Harima Heavy Industries, 10Ricoh, 11FANUC, Japan 2. Study of Inverse Supply Chain (2) — Classification of Inverse Supply Chain and Characterization of Products Susumu Shibata1, Hiroshi Uesugi2, Hiroya Wada3, Hiroya Terui4, Genichi Mitsuishi5, Makuni Inoko6, Hitoshi Fujiwara7, Shigehisa Endoh8, Kazuhito Haruki9, Shuuji Hoshino10, Yoshio Itoi11, Toshiyoshi Okazaki12, Katsushige Matsunuma13, 1Toyo Engineering, 2Kawasaki Steel, 3Yokogawa Electric, 4Komastu, 5Japanese Material Handling Society, 6NKK, 7Juki, 8National Inst. of Advanced Industrial Science and Technology, 9Toshiba, 10Ishikawajima-Harima Heavy Industries, 11Ricoh, 12FUNUC, 13Sharp, Japan 27 Dec 13 3. Maturing Markets for Recycled Plastics from WEEE: An Elaboration on the Consequences for the Evaluation of Future End-of-Life Scenarios Casper Boks, Ab Stevels, Delft Univ. of Technology, The Netherlands C2-1/C2-2 2. Configuration of Recycling Networks for Enhanced WEEE Recycling Juergen Hesselbach, Martin Ohlendorf, Christoph Herrmann, Technical Univ. of Braunschweig, Germany Room 3 C2-2 Dec 13 3. Study of Inverse Supply Chain (3) — Study of Promotion Issues on Inverse Supply Chain Yoshio Itoi1, Susumu Shibata2, Hiroshi Uesugi3, Yasushi Wada4, Hiroya Terui5, Genichi Mitsuishi6, Hitoshi Fujiwara7, Shigehisa Endoh8, Kazuhito Haruki9, Shuuji Hoshino10, Toshiyoshi Okazaki11, Katsushige Maysunuma12, 1Ricoh, 2Toyo Engineering, 3Kawasaki Steel, 4Yokogawa Electric, 5Komatsu, 6Japanese Material Handling Society, 7Juki, 8National Inst. of Advanced Industrial Science and Technology, 9Toshiba, 10Ishikawajima-Harima Heavy Industries, 11FANUC, 12Sharp, Japan 28 Room 4 10:00-12:00 F2: Management System 1. “Environmental Impact Information System” That Reflects the Eco-Balance at Ricoh Kyoko Ohno, Yuji Noritake, Ricoh, Japan 4. Becoming A Zero Waste to Landfill Facility in The USA Frantz J. Pierre, Jeff Agur, Bobbi Shingleton, Leon W. Fife, Carl Hall, Ricoh Electronics, USA 5. Cost Benefit Analysis for Implementation of Environmental Management System for Semiconductor Company Gunalan Paramasevam1, Mohd Nasir Hassan2, Noor Mohamed2, 1Infineon Technologies (M) Sdn Bhd, Malaysia, 2Univ. Putra Malaysia, Malaysia 6. Eco-management in Singapore — From Pollution Control to Resource Management Wah Sing Loh1, Seng Eng Ong2, Walter Yam3, 1PSB, 2Ministry of the Environment, 3Philips Electronics Singapore, Singapore 29 F2 3. Eco-efficiency and Eco-Target Costing in the Phase of Developing New Products Hiroshi Okano1, Karl-Heinz Feuerherd2, Michiyasu Nakajima3, 1Osaka City Univ., 2Kobe Yamate Univ., 3Kansai Univ., Japan Dec 13 2. Eco Product Lifecycle Management Andreas Moeller, Arno Rolf, Univ. of Hamburg, Germany Room 5 9:40-12:00 Special Theme 1-2: Factor 10 1. A theoretical Estimation of Dematerialization Factor for Sustainable Society Ryoichi Yamamoto, The Univ. of Tokyo, Japan 2. Zero Energy Home Hirofumi Ida, Isamu Ohta, Misawa Homes Inst. of R&D, Japan ST1-2 Dec 13 3. Eco-efficiency of Sanitary Ware and Tiles Akashi Funamoto, TOTO, Japan 4. Classigication of Eco-effidcient Services in Japan Kouji Tagusari, Tomonori Honda, Ryoichi Yamamoto, The Univ. of Tokyo, Japan 5. Recycled Organic Material “M-Wood 2” Masayuki Kamite, Masayuki Kato, Misawa Home Inst. of R&D, Japan 6. Reducion and Elimination of Using Batteries for Watchies Yasuhito Hirashima, SEIKO EPSON, Japan 7. Efforts to Improve the Eco-efficiency for Products of Mitsubishi Electric Corporation-Factor X by Using MET Indicators Etsuko Hirose, Tetsuya Takahashi, Kiyoshi Ueno, Mitsubishi Electric, Japan 30 Room 6 9:20-10:40 Special Theme 4-2-1 (Invited Lectures): Industrial Ecology and EcoDesign (3) 1. Journey to a Sustainable World Bob Pfahl, Motorola, USA 11:00-12:00 Special Theme 4-2-2 (Invited Lectures): Industrial Ecology and EcoDesign (4) 1. The Greening of Industry — A Term from the Past or for the Future Jurgen Ertel, Brandenburg Technical Univ., Germany 2. The Benefits of Ecodesign and the Risk of Rebound Effects Thomas Schauer, FAW, Germany 31 Dec 13 3. Ecodesign for Competetive Advantage, How to Make It Happen Ab Stevels, Philips Consumer Electronics, The Netherlands ST4-2-1/ST4-2-2 2. Global Responsibility of Electronics — Products and Sustainability Hansjoerg Griese, Jutta Mueller, Herbert Reichl, Fraunhofer IZM, Germany International Conference Room, 7F 13:00-17:00 EcoProducts 2001 Exhibition Symposium For Reforming Japanese Economy on the Basis of Environmental Aspects — Vision to an Affluent Eco-Society Hiroshi Sakisaka, Japan Environmental Management Association for Industry, Japan Dec 13 EcoProduct Symposium 13:00-13:05 Welcome 13:05-13:20 Environmental Efficiency as a Keyword Ryoichi Yamamoto, The Univ. of Tokyo, Japan 13:20-14:00 Environmental Technology Economy — My Proposal Applicable to Reforming Hisatake Kato, Tottori Univ. of Environmental Studies, Japan 14:00-14:45 The Application of Eco-Design — Ten Years of Dynamic Development A.L.N. Stevels, Delft Univ. of Technology, The Netherlands 15:00-17:00 Panel Discussions Coordinator: Hisatake Kato, Tottori Univ. of Environmental Studies, Japan Panellists: Yotaro Kobayashi, Fuji Xerox, Japan Kisho Kurokawa, Architect, Japan Noriko Kimoto (under negotiation) * This session is complimentary to all applicants for EcoProducts 2001. 32 Friday, 14 December 2001 Room 1 9:20-10:20 A3-1: Life Cycle Design 1. Proposal for Spiral Design Approach Kazuhiko Yamazaki, IBM Japan, Japan 2. Decision Factors of Product LifeCycle Strategies Satoru Kato, Tomoyuki Hata, Fumihiko Kimura, The Univ. of Tokyo, Japan 3. Toward Life Cycle Design Guideline for Inverse Manufacturing Yasushi Umeda, Tokyo Metropolitan Univ., Japan 10:40-12:00 A3-2: EcoDesign Processes 3. Generalized Eco-Design Process and Guidelines for Designers/Design Teams Parag A. Meshram, Vineet Thuvara, Fifth Quadrant Design, India 4. System-based Product Design and System Structure Changeover under Integrated Optimality: A Case Study on Leading Design of Vehicles Kikuo Fujita, Shinji Shiba, Osaka Univ., Japan 33 Dec 14 2. Life Cycle Process Knowledge — Application during Product Design Ola Bernard Faneye, Anderl Reiner, Technical Univ. of Darmstadt, Germany A3-1/A3-2 1. Pros and Cons of Adjusting and Extending Functionality of First Generation End-of-Life Evaluation Tools in Relation to User Requirements Mirjam Korse-Noordhoek1, Sytze Kalisvaart1, Casper Boks2, Ab Stevels2, 1TNO Industrial Technology, 2Delft Univ. of Technology, The Netherlands Room 1 14:00-15:40 A3-3: EcoDesign Methods 1. Development of Product Green Innovation Design Method Chih-Chen Liu, Jahau L. Chen, National Cheng Kung Univ., Taiwan 2. Selection and Implementation — Key Activities to Successful Use of EcoDesign Methods Sofia Ritzén1, Mattias Lindahl2, 1Royal Inst. of Technology, 2Univ. of Kalmar, Sweden 3. Applicable Methods for Sustainable Development for Small and Middle-size Companies Udo Lindemann, Philipp C. Hutterer, Thomas Hessling, Markus Moertl, TUM, Lehrstuhl fuer Produktentwicklung, Germany Dec 14 A3-3/A3-4 4. Development of Ecodesign Methodology within Indian European Ecodesign Program Ana Mestre1, G. V. Soumitri2, Johan Carel Diehl2, 1INTI, CINDES, Portugal, 2Indian Inst. of Technol. Delhi, India, 2Delft Univ. of Technol., The Netherlands 5. Method for Developing Sustainable Product Service Innovations Helma Luiten1, Sacha Sivester2, Marjolijn Knot2, 1TNO Industrial Technology, 2Delft Univ. of Technology, The Netherlands 16:00-17:20 A3-4: Design for X (1) 1. Design Idea of Wind Power Generator by Product Dissection Haruo Sakamoto1, Junichi Matsuoka1, Takashi Uchino1, Sachiko Migiwa1, Toshifumi Asai2, 1Kochi Univ. of Technology, 2ELF.Co, Japan 2. EcoDesign of Packaging for Cold Rolled Sheet — An Innovative Approach Vineet Thuvara, Parag M. Anand, V. Vinodhan, Fifth Quadrant, India 3. Development of an Environment-Friendly, Energy-Efficient Copier Kazunori Karasawa, Hisao Murayama, Yasuhisa Katoh, Masayuki Ohtani, Koichi Kanaya, Takako Satoh, Ricoh, Japan 34 Room 1 4. Study of the Degrees of Freedom Equations in the Compliant Mechanism Design Bartolo R. Rodriguez, Center of Pharmaceutical Chemistry, Cuba A3-4 Dec 14 35 Room 2 9:20-10:40 A3-5: EcoDesign Case Studies (5) 1. Design of Air Power Meter Maolin Cai, Toshiharu Kagawa, Tokyo Inst. of Technology, Japan 2. Valuation for Two Experimental Studies of the “Perfect Recycle House” Yuki Kanemori, Hiroto Takaguchi, Yusuke Nakajima, Waseda Univ., Japan 3. Pb-free Plating for Peripheral/Leadframe Packages Nhat D. Vo1, Jason M. Conrad1, Ryan R. Kangas1, Balachandar Sundram2, KeeHuat Lee2, Selvakumar M. Arunasalam2, Tatsuo Matsuura3, Masahiro Tsuriya3, Yoshikuni Nakadaira3, 1Motorola, USA, 2Motorola Malaysia, Malaysia, 3Motorola Japan, Japan Dec 14 A3-5/A3-6 4. Solar Powered Telecommunication Erik C. Palm1, Flemming Hed1, Yumiko Yasuda2, 1Ericsson Radio Systems, Sweden, 2Nippon Ericsson, Japan 11:00-12:00 A3-6: Integration of EcoDesign and CAD 1. The Development of a CAD Integrated DFE Workbench Software Tool Thomas Roche1, Elena Man2, Jimmie Browne2, 1GMIT, 2NUIG, Ireland 2. CAD Integrated DFE Workbench, A Case Study Thomas Roche1, Camelia Chira1, Elena Man2, Jimmie Browne2, 1GMIT, 2NUIG, Ireland 3. 3D Environmental Conscious Design System Yuichi Arita, Kazuyuki Ujiie, Akira Sakai, Tadanobu Matsumura, Haruhiko Yamamoto, Fujitsu, Japan 36 Room 2 14:00-15:20 A3-7: Information Sharing for EcoDesign (1) 1. Eco-KIT: Webbased Ecodesign-Innovation Tool for SMEs Bart Jansen, An Vercalsteren, Vito, Belgium 2. ECODESIGN Online: The New Internet Tool for Environmentally Conscious Product Design Wolfgang Wimmer, Vienna Univ. of Technology, Austria 3. Efficient LCI Data Exchange for Approximate LCA in Industry Karl G. Mueller, Fumihiko Kimura, The Univ. of Tokyo, Japan 4. A Framework for Structured Data Retrieval in LCA Using Feature Technology Harald E. Otto, Karl G. Mueller, Fumihiko Kimura, The Univ. of Tokyo, Japan 2. Integration of Waste-Specific Expert-Knowledge in a Design Environment for Sustainable Products Maike Hora, Burkhard Wolf, Johannes Jager, Darmstadt Univ. of Technology, Germany 3. Developing Java-Based Web Apprication to Support Effective Recycling and Material Circulation Sang-Jae Song, Hiroshima Inst. of Technology, Japan 37 Dec 14 1. The Information System: An Advisory Tool or How to Select the Right Support for DFE Marc Ernzer, Olaf Weger, Herbert Birkhofer, Darmstadt Univ. of Technology, Germany A3-7/A3-8 15:40-16:40 A3-8: Information Sharing for EcoDesign (2) Room 3 9:20-10:20 C3-1: Reuse and Recycling (Strategies and Technologies) (3) 1. An Economical and Technical Analysis of a Household Appliance Remanufacturing Process Erik Sundin, Linkoping Univ., Sweden 2. LCI Analysis for Treatment Processes of Disposed Office Appliances Misao Murakami1, Masao Yukumoto1, Yasushi Umeda2, 1Kawasaki Steel, 2Tokyo Metropolitan Univ., Japan 3. Development of Recyclable Eco-Packages Tomoaki Arai, Ricoh, Japan 10:40-12:00 C3-2: Reuse and Recycling (Strategies and Technologies) (4) Dec 14 C3-1/C3-2 1. Recycle of Cut Waste of Glass Fabric Coated by Polyvinyl Chloride Tetsuya Takahashi1, Teruo Kimura2, 1Shimane Univ., 2Kyoto Inst. of Technology, Japan 2. Compression Molding of Biodegradable Board Using Waste of Bedding Cotton Teruo Kimura1, Yasushi Naito1, Seiji Hatta2, 1Kyoto Inst. of Technology, 2Kyoto Municipal Textile Research Inst., Japan 3. Intelligent Disassembly of Electr(on)ic Equipment Reinhard Knoth, Martina Hoffmann, Bernd Kopacek, Peter Kopacek, Austrian Society for Systems Engineering and Automation, Austria 4. Separation of A Joint Using Hydrogen Naoe Hosoda, Tadatomo Suga, The Univ. of Tokyo, Japan 38 Room 3 14:00-15:20 C3-3: Reuse and Recycling (Strategies and Technologies) (5) 1. Electrostatic Separation Technology for Waste Plastics — Development of the High Purity Separator in Plastics by Type Hiroyuki Daiku, Tetsuya Inoue, Masanori Tsukahara, Hidehiko Maehara, Kenji Kakeda, Hitachi Zosen, Japan 2. Challenges to Sustainable Aqueous Systems: A Case Study in Metalworking Fluids Steven J. Skerlos, Peter Adriaens, Katsuo Kurabayashi, Shuichi Takayama, Kim Hayes, Alexa Rihana, Fu Zhao, The Univ. of Michigan at Ann Arbor, USA 3. Environmentally-friendly Treatment and Recycling of Industrial Wastes in the Nippon Mining & Metals Group Yasuhito Kawasaki1, Takahiko Okura2, 1Nippon Mining & Metals, 2Nikko Techno Service, Japan 1. The Instructional Models and Guidelines for Developing A Curriculum in Product Eco-design Chen-fu Chen, Ming Chuan Univ., Taiwan 2. Ricoh Programs for Contributing to Betterment of the Environment and Society Megumi Kawahara, Ricoh, Japan 3. Integrating Environmental Science into Modern Engineering Education Gunther Seliger, Matthias P. Meyer, Technical Univ. Berlin, Germany 4. Internet Based Ecodesign Education Johan Carel Diehl, Delft Univ. of Technology, The Netherlands 39 Dec 14 15:40-17:20 E3-1: Environmental Education C3-3/E3-1 4. Chemical Wastewater Recycling System in Semiconductor Manufacturing Factory Masashi Nishimura, Kohichi Sugiyama, Ricoh, Japan Room 3 5. The Development of Ecodesign Courses for Industrial Design Students and Professionals in India G.V. Soumitri1, Jan Carel Diehl2, Ana Mestre3, 1Indian Inst. of Technology Delhi, India, 2Delft Univ. of Technology, The Netherlands, 3INETI, CINDES, Portugal E3-1 Dec 14 40 Room 4 9:20-11:00 B3-1: Long Fatigue Life (Giga-cycle) of Materials (1) 1. Optimaization of Marerial Selection and Design for Car Industry in order to Increase Durability (Keynote) Clause Bathias, CNAM, France 2. Cyclic Damage of Some High Strength Alloys Showing Subsurface Crack Generation in High-cycle Fatigue Osamu Umezawa, National Inst. for Materials Science, Japan 3. Characteristic S-N Property of High Strength Steels in Ultra-Wide Life Regime under Rotating Bending Tatsuo Sakai1, Nobuaki Tanaka1, Mitsuhiro Takeda2, Manabu Kanemitsu3, Noriyasu Oguma4, 1Ritsumeikan Univ., 2Toray Industries, 3Kanazawa Technol. Coll., 4Koyo Seiko, Japan 1. Fracture Surface Analysis of Bearing Steels with Long Fatigue Life Naotake Ohtsuka1, Yasunori Shindo1, Wataru Kimura2, 1Ryukoku Univ., 2Takasono Industries, Japan 2. Giga-cycle Fatigue Properties of a High Strength Steel SNCM 439 Yuji Nakasone, Katsuhisa Ogawa, Jun’ichi Katoh, The Science Univ. of Tokyo, Japan 3. Effects of Shotpeening Treatment on Very Long Life Fatigue Property in Ductile Cast Irons Yasuo Ochi1, Takusaburo Hosoya1, Kiyotaka Masaki1, Takashi Matsumura1, Takeshi Sekino2, 1Univ. of Electro-Communications, 2Cannon, Japan 41 Dec 14 11:20-12:40 B3-2: Long Fatigue Life (Giga-cycle) of Materials (2) B3-1/B3-2 4. Expansion of the Database MSDRD and Analyses of S-N Fatigue Test Data in Ultra-Long Life Regime Tatsuo Sakai1, Tomofumi Shintani1, Kenji Okada2, Satoshi Fukui2, Takafumi Sogawa2, Noriyasu Oguma3, 1Ritsumeikan Univ., 2Takamatsu National Coll. of Technology, 3Koyo Seiko, Japan Room 4 4. On Evaluation Method of the Data for Long Life Fatigue Property Satoshi Hanaki1, Masaru Zako2, Tesei Kurasiki2, Hitoshi Uchida1, 1Himeji Inst. of Technology, 2Osaka Univ., Japan 13:40-15:20 D3-1: Environmental Conscious Market and Corporate Strategies 1. Sufficiency Strategies for A Sustainable and Competitive Economy: Reversed and Inversed Incentives Warter R. Stahel, Product-Life Inst., Switzerland 2. Green Marketing of Consumer Electronics II Ab Stevels, Richard Agena, Eelco Hoedemaker, Delft Univ. of Technology, The Netherlands Dec 14 D3-1/D3-2 3. An Application of the Market Microstructure Theory to Markets for Recyclable Products Kouhei Iyori1, Itsuo Hatono1, Sobei Oda2, Kanji Ueda1, 1Kobe Univ., 2Kyoto Sangyo Univ., Japan 4. Consideration of the Definition of Zero State on a Scale of Positive and Negative Evaluation Koji Masuda, Fuji Xerox, Japan 5. Corporate Environmental Strategies in Poland Michal Szymanski1, Saburo Ikeda2, 1The Univ. of Tsukuba, 2Inst. of Policy and Planning Sciences, Japan 15:40-17:20 D3-2: Servicification for Dematerialization 1. Dematerialization through Service and Business Innovation: Lessons from the Kathalys/DES Experiments (Keynote) Han Brezet, Sacha Silvester, Tom van der Horst, Delft Univ. of Technology, The Netherlands 2. Service Engineering to Intensify Serivice Contents in Product Life Cycles Tetsuo Tomiyama, The Univ. of Tokyo, Japan 3. Eco-efficient Services as a Business Strategy for Dematerialization Thierry Kazazian, Julia Haake, 02 France, France 42 Room 4 4. Functional Sales as a Further Approach to Environmental Product Development — Case Studies Gunilla Olundh, Sofia Ritzèn, Royal Inst. of Technology(Stockholm), Sweden D3-2 Dec 14 43 Room 5 9:20-10:40 E3-2: Environmental Accounting 1. Eco-Efficiency Accounting of Telecom Product Life Cycle Pontus Cerin1, Goan Muhammar2, 1Royal Inst. of Technology, 2Ericsson Radio Systems, Sweden 2. A Pilot Project of Flow Cost Accounting in Japan Yoshikuni Furukawa, Nitto Denko, Japan 3. Environmental Accounting at Ricoh Hiroshi Uramoto, Hiromitsu Hatano, Ricoh, Japan 4. Environmental Accounting of Product Design Hidemi Tomita, Sony, Japan 11:00-12:20 F3-1: LCA (1) Dec 14 E3-2/F3-1 1. A Simple Life Cycle Assessment Method for Green Product Conceptual Design Jahau L. Chen, Chih-Wei Liau, National Cheng kung Univ., Taiwan 2. Life Cycle Assessment of Business Hiroyuki Abe, Ricoh, Japan 3. Environmental Impact Assessment for Various Information Technology Systems and Classification by Their Environmental Aspects Shigeyuki Miyamoto, Hiroo Harada, Jun Fujimoto, NEC, Japan 4. A Study on Comparison of Life Cycle Energy Consumption and CO2 Emission in Grains Production; Transportation in Japan and Heilongjiang Province of China Jie Chen1, Hisashi Kobayashi2, 1Tokyo Univ. of Agriculture and Technology, 2Ibaraki Univ., Japan 44 Room 5 14:00-16:00 F3-2: LCA (2) 1. Development of Hybrid Micro Machine Tool Tsuneo Kurita1, Shinya Watanabe2, Mitsuro Hattori3, 1Japan Science and Technology, 2Disco, 3National Inst. of Advanced Industrial Science and Technology, Japan 2. Industrial Ecology: Theory and Environmental Strategy in Viet Nam Le H. Ba1, Duong V. Viet2, Tran T. Hong, Loan3, Thai V. Nam4, 1National Univ., 2Univ. of Technology, 3Univ. of National Sciences, 4Ansted Univ., Viet Nam 3. Development of a Risk Assessment Method for Product Disposal in Landfills Eiji Hirao, Shigeyuki Miyamoto, NEC, Japan 6. Development of Endpoint-Type Methodology of LCIA in Japan Norihiro Itsubo, Atsushi Inaba, National Inst. of Advanced Industrial Science and Technology, Japan 45 F3-2 5. The Development of the Environmental Efficiency Potential Assessment Katsuya Nagata1, Masahito Aizawa2, Ken Asaoka2, Chikako Usami2, 1Waseda Univ., 2Mikuniya Environmental Management Systems Inst. Inc., Japan Dec 14 4. Waste Input-Output Analysis of Disposal, Recycling, and Reuse of Electric Home Appliances Shinichiro Nakamura1, Yasushi Kondo2, 1Waseda Univ., 2Toyama Univ, Japan Room 6 9:20-12:00 Special Theme 6-3: Research Trends in Lead-free Soldering 1. Lead-free Industry Trends in the European Market and the Need for Global Co-operation (Keynote) Kay Nimmo, ITRI, UK 2. EUREKA Project LEADFREE Guenter F. Grossmann, Swiss Federal Inst. for Materials Testing and Research, Switzerland 3. Development of Environmentally Preferred Plastic Ball Grid Array, PBGA, Components Yushi Matsuda1, Alan Woosley2, Thomas Koschmieder2, G.K. Teh3, Ruzaini Ibrahim3, 1Motorola Japan, Japan, 2Motorola, USA, 3Motorola Malaysia, Malaysia ST6-3 Dec 14 4. Estimation of CO2 Emission for Lead-free Soldering by Life Cycle Inventory Analysis Hiroshi Yamaguchi1, Atsushi Inaba2, 1Hitachi, 2National Inst. of Advanced Industrial Science and Technology, Japan 5. Lead-free Soldering — Future Aspects of Toxicity, Energy and Resource Consumption Otmar K. Deubzer1, Hansjoerg Griese1, Herbert Reichl1, 2, Tadatomo Suga3, Hideyuki Hamano3,1Fraunhofer IZM Berlin, 2Technical Univ. Berlin, Germany, 3The Univ. of Tokyo, Japan 6. Lead-free Soldering Trends in USA (Keynote) Carol Handwerker, NIST, USA 46 Room 6 13:00-15:00 Special Theme 11-3: IMS Project on Lead-free Soldering EFSOT 1. Outline of IMS Project “Next Generation Environmental Friendly Soldering Technology” Kouji Serizawa, Hitachi, Japan 2. Upgrading Pb-free Soldering Technology (1) — Reflow Soldering Koji Matsubara1, Katsuaki Suganuma2, Tomoya Kiga3, 1Sharp, 2Osaka Univ., 3Sony, Japan 3. Upgrading Pb-free Soldering Technology (2) — Flow Soldering Makoto Miyazaki1, Shigeo Nomura1, Toshiyasu Takei1, Naoaki Katsuyama2, Hiroyuki Tanaka2, Masanobu Akanuma2, 1Oki Electric, 2Hokkaido Industrial Research Inst., Japan 6. Environmental Impact Evaluation for the Full Life Cycle of Products Using Pb-free Solders Tadatomo Suga1, Hideyuki Hamano1, Masahide Okamoto2, 1The Univ. of Tokyo, 2Hitachi, Japan 15:20-17:20 Special Theme 10-3: Low-temperature Lead-free Solder 1. Lead Free Activities of JEITA Katsumi Yamamoto, Sony, Japan 2. JIEP Project fow Low-temperature Lead-free Solder and Its Report on Questionaire Survey Tadatomo Suga, The Univ. of Tokyo, Japan 47 Dec 14 5. Evaluation of Biological Effects of Metals in Pb-free Solders Hiroshi Satoh1, Kazuyuki Omae2, Momoko Chiba3, Masahide Okamoto4, 1Tohoku Univ., 2Keio Univ. 3Juntendo Univ., 4Hitachi, Japan ST11-3/ST10-3 4. Upgrading Pb-free Soldering Technology (3) — Reliability Evaluation Masahide Okamoto1, Hanae Shimokawa1, Koji Serizawa1, Toshio Narita2, 1Hitachi, 2Hokkaido Univ., Japan Room 6 3. Sn-Zn Eutectic Alloy Soldering in a Low Oxygen Atmosphere Masahiro Tadauchi, Izuru Komatsu, Hiroshi Tateishi, Kouichi Teshima, Toshiba, Japan 4. CSP Mounting Reliability with Sn-Zn-Bi in JIEP Project Makoto Takeuchi, Victor Co. of Japan, Japan 5. Newly Developed Real Time Monitoring System for lonic Migration of Lead Free Solder by Means of Crystal Microbalance Sachio Yoshihara, Utsunomiya Univ., Japan 6. Applications of Sn-Zn Lead-free Solder in Reflow Soldering Process Eiichi Kouno, NEC, Japan ST10-3 Dec 14 48 Saturday, 15 December 2001 Room 1 11:00-12:20 A4-1: Design for X (2) 1. Life Design for Remanufacturing Durable Products Susumu Okumura1, Toshimitsu Morikuni2, Norio Okino1, 1Univ. of Shiga Prefecture, Japan, 2NEC Machinery, Japan 2. On the Benefits of Use of Recently Developed Recovery Indicators during the Design Process of Electr(on)ic Products Fabrice Mathieux1, Daniel Froelich1, Pierre Moszkowicz2, 1ENSAM Chambery, France, 2INSA Lyon, France 3. Treatment of Reliability for Reuse and Remanufacture Takeshi Murayama1, Lily H. Shu2, 1Hiroshima Univ., Japan, 2Univ. of Toronto, Canada 4. EcoDesign for Product Variety: A Multi-Objective Optimization Framework Suiran Yu, Satoru Kato, Fumihiko Kimura, The Univ. of Tokyo, Japan 13:20-15:20 A4-2: Tools for DfX 1. Development of Life Cycle Design System for Machine Tools Tojiro Aoyama, Shoji Nawata, Keio Univ., Japan 4. Design for Environment and the Recyclability Evaluation Method (REM) Yuzo Hiroshige, Takayuki Nishi, Toshijiro Ohashi, Hitachi, Japan 49 Dec 15 3. Recycling Oriented Design — A Case Study for Household Appliances Using the Software ATROiD Hong-Yoon Kang1, Christoph Herrmann2, Jang-Woo Jung1, 1LG Production Engineering Research Center, Korea, 2LCE Consulting, Germany A4-1/A4-2 2. Development of Recyclability Evaluation Tool Naohiko Oyasato, Hideki Kobayashi, Kazuhito Haruki, Toshiba, Japan Room 1 5. Approximate Life Cycle Assessment for Classified Products Using Artificial Neural Network and Statistical Analysis in Conceptual Product Design Ji-Hyung Park1, Kwang-Kyu Seo1, David R. Wallace2, 1Korea Inst. of Science and Technology, Korea, 2MIT, USA 6. DfE Tools — A Way for Application of LCA in Product Design Michael Betz, Hartmut Schoech, Harald Florin, PE Product Engineering, Germany A4-2 Dec 15 50 Room 2 10:00-11:00 B4-1: Maintenance 1. A System Framework for Next-Generation E-Maintenance System Muammer Koc, Jay Lee, Univ. of Wisconsin-Milwaukee, USA 2. Life Cycle Management of Inductrial Robots Based on Deterioration Evaluation Atsushi Yamada, Shozo Takata, Waseda Univ., Japan 3. Decision-making Method of Optimum Inspection Interval for Plant Maintenance by Genetic Algorithms Masanori Yamamoto1, Peng Chen1, Toshio Toyota2, 1Kyusyu Inst. of Technology, 2Japan Condition Diagnosis Technology Lab., Japan 11:20-12:40 A4-3: LCA Case Studies 1. LCA of Third Generation (3G) Wireless Telecom Systems at Ericsson Jens Malmodin, Pernilla Bergmark, Royal Inst. of Technology, Sweden 2. Generic LCA Based DfE — A Case Study of Different PWB Systems Constantin Herrmann1, Michael Betz2, Niels Warburg1, 1Univ. of Stuttgart, 2PE Product Engineering, Germany 51 Dec 15 4. LCA of Machine Tools with Regard to Their Secondary Effects on Quality of Machined Parts Javad Akbari, Keigo Oyamada, Yoshio Saito, Tokyo Inst. of Technology, Japan B4-1/A4-3 3. Ecological Improvement of the Vending Machine Using LCA Method Yukio Kimura1, Seizo Kato2, Naoki Maruyama2, Yucho Sadamichi2, 1Fuji Electric, 2Mie Univ., Japan Room 2 13:40-15:20 A4-4: Design for Disassembly 1. Product’s Disassemblability Evaluation Using Information Entropy Hideo Fujimoto, Alauddin Ahmed, Kazuaki Sugi, Nagoya Inst. of Technology, Japan 2. Design of Heat-activated Reversible Integral Attachments for Product-embedded Disassembly Ying Li, Kazuhiro Saitou, Noboru Kikuchi, Steven J. Skerlos, Panos Y. Papalambros, The Univ. of Michigan, USA 3. A Design for Recycling Technique for Optimizing Resource Circulation Characteristics of Products Yasuo Kondo, Ko-suke Hirai, Fumio Obata, Tottori Univ., Japan 4. Development of Disassembly Support System for Mechanical Parts and Its Application to Design Considering Reuse/Recycle Hidefumi Wakamatsu, Akira Tsumaya, Keiichi Shirase, Eiji Arai, Osaka Univ., Japan 5. Design for Reuse and Disassembly Martina Hoffmann, Reinhard Knoth, Bernd Kopacek, Peter Kopacek, Austrian Society for Systems Engineering and Automation, Austria A4-4 Dec 15 52 Room 3 9:40-10:40 E4-1: Social System Design (1) 1. Analyzing Sustainability of Circulatory System by Using the Rewriting System Kotaro Kakimoto, Takayuki Shiose, Toshiharu Taura, Kobe Univ., Japan 2. Indirect Control Methods for Navigating the Agent-based Recycle Society Takayuki Shiose, Kouji Yokoyama, Toshiharu Taura, Kobe Univ., Japan 3. From a Factory to a Person: One Approach for Sustainable and Service-oriented Manufacturing Scheme Masahiko Onosato1, Nydia Suppen1, Koji Teramoto1, Kazuaki Iwata2, 1Osaka Univ., 2International Inst. of Advanced Studies, Japan 11:00-12:40 E4-2: Social System Design (2) 1. Integrated Product Policy (IPP), Eco-Design and Supply Chains (Keynote) Martin Charter, The Centre for Sustainable Design, UK 2. Design and Evaluation of the Recycle of Home Appliances: An Application of Market Microstructure Theory Kanji Ueda1, Nariaki Nishino1, Atsushi Iwasaki1, Sobei H. Oda2, Itsuo Hatono1, 1Kobe Univ., 2Kyoto Sangyo Univ., Japan 53 Dec 15 4. Greener Mobil Telecommunication Networks: The 3G Greenbook Initiative Klause Rick, T-Mobil Deutsche Telekom, Germany E4-1/E4-2 3. Demonstration of a Nature Symbiotic Office Designed for 100Years Use Masanobu Nagano, Soai Co., Japan Room 3 14:00-15:20 B4-2: Cleaner Processes and Energy-Saving Proccesses 1. Development of Drying Technology Utilizing Solar Energy to Dry Agricultural and Marine Products Hedetoshi Aoki, Hachinohe Inst. of Technology, Japan 2. On Process Planning with Multiple Agents: Environmentally Conscious Decisions among Feasible Process Plans Beth E. Allen, Univ. of Minnesota, USA 3. 100% Ozone-treatment System for Bath and Swimming Pool Water Reiji Terao1, Kazunori Mori1, Masaki Matsui2, 1TERAO, 2Gifu Univ., Japan 4. Energy Saving Cleaner Technology for Conversion of Waste Pickle Liquor and Millscale Parthasarathy M. Natteri1, Sudharsan M. Natteri2, 1SALN Coll. of Engineering & Management, 2ETK International Ferrites, India B4-2 Dec 15 54 Room 4 9:40-10:40 E4-3: Labelling and Logistics 1. Trial of Product Environmental Information System — Canon Case (Type III Eco-Label, JEMAI Program Ver.2) Kiyofumi Matsumoto, Norihiro Mochizuki, Keizo Naganuma, Masaaki Oono, Canon, Japan 2. Re-Use of End-of-Life Electronic Equipment and Components — Logistic Aspects Reinhard Knoth, Martina Hoffmann, Bernd Kopacek, Peter Kopacek, Austrian Society for Systems Engineering and Automation, Austria 3. Formation of a Reverse Logistic System for a Circulated Type Construction Production System Hiroyuki Nakamura1, Jun Shiino2, Makoto Taneda3, 1Shimizu, 2Waseda Univ., 3Toda, Japan 11:00-12:40 Special Theme 9-4-1: Advanced Technology for Electronic Packaging — JIEP Session (1) 1. JIEP-EcoDesign for Tomorrow (Keynote) Hidetaka Hayashi, Fujikura, Japan 4. Trend of Halogen Free Printed Wiring Board Materials Tetsuaki Suzuki, Toshiba Chemical, Japan 55 Dec 15 3. Development of Environmentally Friendly Epoxy Resin Compounds without Toxic Flame Retardants and Their Application to Electronic Parts Yukihiro Kiuchi, Masatoshi Iji, NEC, Japan E4-3/ST9-4-1 2. Conductive Adhesive for Plated Sn Electrode Michinori Komagata, Namics, Japan Room 4 13:40-15:20 Special Theme 9-4-2:Advanced Technology for Electronic Packaging — JIEP Session (2) 1. Development of Formaldehyde Free Electroless Copper Plating Technology Takeyuki Itabashi1, Hiroshi Kanemoto1, Haruo Akahoshi1, Tadashi Iida2, Eiji Takai1, Naoki Nishimura1, Jyunichi Kawasaki1, 1Hitachi, 2Hitachi Printed Wiring Board Solutions Co., Japan 2. Low Distortion Cold Rolled Clad Sheets for Mounting Material Shinji Ozawa, Kazuo Yosida, Hiroaki Okamoto, Kinji Saijo, Toyo Kohan, Japan 3. High Sensitive Dry Film Photoresist for Laser Direct Imaging System Teruhiro Uematsu, Tokyo Ohka Kogyo, Japan 4. Halogen-free High Elastic Moduls Build-up Material Nobuyuki Ogawa, Hitachi Chemical, Japan 5. Ball Semiconductor Process and Material Masataka Yoshida, Masataka Yoshida Ball Semiconductor, Japan ST9-4-2 Dec 15 56 Room 5 9:20-11:00 Special Theme 8-4-1: EcoDesign and Chemical Engineering (1) 1. Eco-Design of Water Purification Equipment for Domestic Use Kensaku Mizoguchi1, Hideya Kamikawa2, 1Shizuoka Univ., 2Yamaha Motor, Japan 2. Filtration Behaviors in Microfiltration with Periodic Backwashing of Secondary Municipal Wastewater Than Ohn1, M. S. Jami2, Y. Mukai2, E. Iritani2, 1Aichi Science and Technology Foundation, 2Nagoya Univ., Japan 3. Life Cycle Inventory Analysis of Waste Oil Chie Nakaniwa1, Yoshie Yagita2, Atsushi Inaba3, 1Yale Univ., USA, 2Ochanomizu Univ., 3National Inst. of Advanced Industrial Science and Technology, Japan 4. Development of a Life Cycle Inventory Database for Chemical Products Kiyotaka Tahara, Atsushi Inaba, National Inst. of Advanced Industrial Science and Technology, Japan 5. A Method to Evaluate Regional Material Flow for Designing Recycling Society Naohiro Goto1, Koichi Fujie1, Tomotaka Usui2, 1Toyohashi Univ. of Technology, 2Aichi Science and Technology Foundation, Japan 2. Plastic Recycling with Supercritical Fluids Izumi Okajima, Takeshi Sako, Shizuoka Univ., Japan 3. For Building a Recycling-oriented Economic Society Originating in Chubu (Central Japan) (Keynote) Yoshihiro Yasui, Environmental Partnership Organizing Club, Japan 57 Dec 15 1. Decomposition Mechanism of Epoxy Resin in Nitric Acid for Recycling Weirong Dang, Kosuke Yamaki, Hideki Sembokuya, Masatoshi Kubouchi, Ken Tsuda, Tokyo Inst. of Technology, Japan ST8-4-1/ST8-4-2 11:20-12:40 Special Theme 8-4-2: EcoDesign and Chemical Engineering (2) Room 5 13:20-15:20 Special Theme 8-4-3: EcoDesign and Chemical Engineering (3) 1. A New Program for Integrated Recycle System of Chemical Products Kensaku Mizoguchi1, Youji Akiya2, Toshiaki Ito3, Junjiro Kawasaki4, Minoru Nomura5, Yoshiyuki Hashiguchi6, Yasushi Hirata7, Kiyomi Imou6, Akira Kanai5, Masahito Sato2, Shigeru Matsumoto8, Ken Kataoka9, 1Shizuoka Univ., 2AIST, 3Mitsubishi Heavy Ind., 4Tokyo Inst. of Technology, 5JCII, 6KANEKA, 7Bridgestone, 8Tohoku Univ., 9Daceil Chem. Ind., Japan 2. Information Infrastractue for Supporting Recycling Systems Design and Operation Yuji Naka1, Atsushi Aoyama1, Katsuyoshi Kameda2, Takashi Kagiyama2, Kazuhisa Hamda2, 1Tokyo Inst. of Technology, 2Japan Chemical Innovation Inst., Japan 3. Gasification of Organic Waste Materials (OWM) for Power Generation Using Fuel Cell Michihiko Hamai1, Motohiro Kondo1, Masataka Yamaguchi1, Shigekatsu Mori2, Yoshinori Itaya2, Guilin Piao3, 1Toyota Motor, 2Nagoya Univ., 3Aichi Science & Technology Foundation, Japan 4. Double-coated Tape for Recycle Application Koichi Ikeda, Kazuhiko Shibata, Nitto Denko, Japan ST8-4-3 Dec 15 5. Considerations of Process Flexibility in Design and Optimisation of Chemical Processes for Simultaneous Satisfaction of Economic and Environmental Objectives (Keynote) Jim Petrie, Univ. of Sydney, Australia 58 Room 6 10:00-11:20 Special Theme 2-4-1: Promotion of DFE (1) 1. Clarifying the Environmental Voice of the Customer Using the Kano Technique (Keynote) Patrick Eagan, Mark Finster, Dennis Hussey, Univ. of Wisconsin-Madison, USA 2. An Outline of Activities by the Committee of Desgin for Environment (DfE), Japan, 1994-2001 Shinzo Omi1, Mamoru Morimoto2, Shigeru Suda2, 1Tokyo Univ. of Agriculture and Technology, 2Japan Environmental Management Association for Industry, Japan 3. Quality Function Deployment for Environment: QFDE (1st Report) — A Methodology in Early Stage of DfE Keijiro Masui1, Tomohiko Sakao2, Atsushi Inaba1, 1National Inst. of Advanced Industrial Science and Technology, 2Mitsubishi Research Inst., Japan 11:40-12:40 Special Theme 2-4-2: Promotion of DFE (2) 3. Developments in Product Oriented Environmental Management Systems (POEMS) and ISO 14062 Cristina Rocha1, Parag Anand2, Sacha Silvester3, 1INETI, CINDES, Portugal, 2Fifth Quadrant, India, 3Delft Univ. of Technology, The Netherlands 59 Dec 15 2. Environmental Effect Analysis — How Does the Method Stand in Relation to Lessons Learned from the Use of Other Design for Environment Methods Mattias Lindahl, Univ. of Kalmar, Sweden ST2-4-1/ST2-4-2 1. Quality Function Deployment for Environment: QFDE (2nd Report) — Verifying the Applicability by Two Case Studies Tomohiko Sakao1, Keijiro Masui2, Mitsuru Kobayashi3, Seiichi Aizawa4, Atsushi Inaba2, 1Mitsubishi Research Inst., 2National Inst. of Advanced Industrial Science and Technology, 3Shinko Electric, 4Iiyama, Japan Room 6 13:40-15:20 Special Theme 5-4: Recycling of Individual Products (Current and Future) 1. Towards Inverse Production Life Cycle: A Simulation Tool Linking Mass Products to Environmental Legislation and Market Fabio Salsa1, Lorenzo Castelli2, Roberto Bosani1, Francesco Jovane1, 1National Research Council, 2Univ. of Trieste, Italy 2. The QWERTY Concept, a Powerful Method for Evaluating the Environmental Consequences of End-of-Life Processing of Consumer Electronic Products Jaco Huisman, Ab Stevels, Delft Univ. of Technology, The Netherlands 3. Some Obervations on Recycling of Electrical Home Appliances Activities in Taiwan Jahau L. Chen, National Cheng Kung Univ., Taiwan 4. The Regulation Plan of Disposal Goods and Articles in South Korea Kentoku Funaki, Funaki Enviromental Economics & Policy Research Inst., Japan 5. Waste Utilization by Melting and Crystallization Technology Takumi Kaneko, Tsukishima Kikai, Japan Dec 15 ST5-4/Plenary III/Closing International Conference Room, 7F 15:40-16:30 Plenary III Designing ‘Sustainable’ Product/Service Systems John Ehrenfeld, Massachusetts Inst. of Technology, USA 16:30-16:45 Best Paper & Best Poster Awards 16:45-17:15 Closing Lecture Comprehensive Product Modeling for Designing Life Cycle Scenario Fumihiko Kimura, Organizing Committee Co-Chair/The Univ. of Tokyo, Japan 17:15-17:30 Closing Words Diana Bendz, Organizing Committee Co-Chair/IEEE CS TCEE/IBM, USA 60 Poster Session Display: 9:20-17:00, 14 December 2001 9:20-13:20, 15 December 2001 Discussion: 12:00-14:00, 14 December 2001 Green Marketing of Automobile Engine Air-Filter Element Using LCA Study Myung-Hwi Kang1, Han-Kyoung Lee1, Nam-Woong Lee2, 1Eco-Frontier, 2KOAIR, South Korea P2. The Impact of Literature References in the Field of Applied Ecodesign Casper Boks, Ab Stevels, Jurgen Koster, Delft Univ. of Technology, The Netherlands P3. Research Regarding the Environment-friendly Slope Protection Frame That Utilized the Felled Tree Kenji Nakamura, Shimizu, Japan P4. Current Status of Phosphoric Acid Fuel Cell Power Plant Toshiyuki Ito, Tokyo Gas, Japan P5. Incorporating Environmentally Conscious Materials Selection in CAD System Narito Shibaike, Matsushita Electric, Japan P6. Design Process to Achieve Easy Assembly and Disassembly Yasuyuki Yamagiwa1, Shuichi Iwata2, Jun Numata3, Yuko Namiki3, 1Sony, 2The Univ. of Tokyo, 3Musashi Inst. of Technology, Japan P7. Eco-Value as an Indicator for Sustainable Design Fumikazu Masuda, Satsuki Kashima, Naoki Iijima, Kengo Kato, Rei Sekine, Kenji Yamato, Satoko Watanabe, Risa Usami, Katsura Emukai, Tomohisa Kato, Tsuneya Kocho, Tomoya Sasaki, Takuya Sato, Mie Suzuki, Masashi Seo,Tokyo Zokei Univ., Japan P8. Charcoal Board Adhered with Superfine Natural Fibers Kazunori Shibano1, Shuji Yoshizawa2, Yuu Ogawa1, 1Tokyu Construction, 2Meisei Univ., Japan 61 Poster Session P1. P9. Thermal Recycling of Used Vegetable Oil in an University Campus HaruHisa Uchida1, Tokiko Morikawa1, Hiroaki Iwasaki2, Shigeru Ohga2, 1Tokai Univ., 2Yamaichi New Technology, Japan P10. Solubility of Glass-Epoxy laminate of Various Sizes in Solution Takeshi Horiuchi, Katsuji Shibata, Hiroshi Shimizu, Hitachi Chemical, Japan P11. The Research into the Method of Developing Efficient Universal Design in Traffic Environment through the Application of Contingent Valuation Method Toshiki Nishiyama, Ken’ichi Gomyo, Makoto Arisawa, Keio Univ., Japan P12. Environmental Impact of Energy Distribution Using Hydrogen HaruHisa Uchida, Shinya Kato, Asami Komatsu, Mikio Suga, Tokai Univ., Japan P13. Frist Contract under Green Power Certifrication System Takeshi Shouda, Yamanaka Yasushi, Daisuke Makino, Junji Omura, Japan Natural Energy, Japan P14. Suppression of Dross Formation in Lead-free Wave Soldering Tadashi Takemoto1, Yeon Jun Joo1, Shohei Mawatari2, Rikiya Kato2, 1Osaka Univ., 2Senju Metal Industry, Japan P15. Microscopic Observation of Pb-free Solder Joint Interface Yasushi Kadota1, Sunao Miyatake1, Tsutomu Sakatsu1, Hideo Watanabe1, Masaru Yamashita2, Ryuji Kanehara2, 1Ricoh, 2ITES, Japan P16. Future Outlook of Eco-Design in China Tadatomo Suga, Toshihiko Itou, Naoe Hosoda, Zhaohui Qiang, The Univ. of Tokyo, Japan Poster Session 62 GENERAL INFORMATION Registration Early Registration is recommended (Deadline: 21 November 2001). Please choose and fill in the attached Registration Form Type A (For All Sessions) or Type B (For All Technical Sessions), and mail or fax to the EcoDesign 2001 Secretariat with the payment. After the payment is confirmed, the registrant will receive a payment receipt and a ticket for conference kit by mail, which will be exchanged for a conference kit on site. Payment Please choose one from the following methods. Unfortunately, no personal check is acceptable. Do not remit the fee before sending the registration form. • Bank Check Payable to the EcoDesign 2001 in Japanese Yen • Bank Transfer to: Bank Name: Daiichi Kangyo Bank, Hongo Branch, Tokyo Account No.: 2396620 Account No.: ECODESIGN 2001 * Please attach a copy of the bank transfer receipt with the registration form. • Credit Cards: American Express, VISA, Master, or Diners * Master card issued in Japan is limited to UC only. Registration Fees Registration Fee: For All Sessions (Type A) Early Registration (before 21 Nov. 2001) Late and On site (after 21 Nov. 2001) ¥53,000 ¥58,000 Conference Member* * Co-Sponsors, IEEE, and CARE Electronics members Non-member Student ¥58,000 ¥63,000 ¥5,000 ¥10,000 ¥8,000 ¥10,000 ¥10,000 ¥10,000 (Intercommunion Session excluded) Intercommunion Session (For student or an accompany) Tutorial Technical Tour ¥6,000 Conference registration fees include conference attendance, a copy of Proceedings, Intercommunion Session, and Welcome Reception. Tutorial fee is optional. 63 Registration Fee: For All Technical Sessions (Type B) Early Registration (before 21 Nov. 2001) Late and On site (after 21 Nov. 2001) ¥45,000 ¥50,000 Conference Member* * Co-Sponsors, IEEE, and CARE Electronics members Non-member ¥50,000 Student ¥55,000 ¥ 5,000 ¥10,000 Intercommunion Session ¥ 8,000 ¥10,000 Tutorial ¥10,000 ¥10,000 Technical Tour ¥ 6,000 Conference registration fees include conference attendance, a copy of Proceedings, Welcome Reception. Intercommunion Session fee and Tutorial fee are optional. Cancellation of Registration and Refund Cancellation with refund will be accepted before 30 November 2001. However, written notification is required and there will be a cancellation fee: ¥5,000. No refund for cancellation received after 30 November 2001 or no notice given. Refund will be made after deducting the cancellation fee and bank or credit card service charges. If the payment is made by credit card, refund will be made through the credit card company. If bank transfer, please inform your bank account to the Secretariat. Registration Desk during the Conference Upon arrival at the conference site, Tokyo Big Sight, please sign-up with a conference kit ticket at the Advanced Registration Desk to receive a conference kit and other necessary items. Onsite registration is also welcome. Registration Desk is open at the 6th floor of The Tower Building (Kaigito) of Tokyo Big Sight as follows, Tuesday Dec.11: 17:00-19:00 Wednesday Dec.12: 8:30-17:00 Thursday Dec.13: 8:30-17:00 Friday Dec.14: 8:30-17:00 Saturday Dec.15: 8:30-15:00 64 Social Events Welcome Reception All participants are invited to the Welcome Reception on 12 December 2001 held at The Tower Building (Kaigito), Tokyo Big Sight (1F Room 102 from 18:30-20:30). The reception desk will be open at 18:00. Intercommunion Session Participants who registered for all sessions (by using Form Type A) or applied the intercommunion session (by using Type B) are invited to participate in the Intercommunion Session. On 14 December, it will be held at Restaurant 5K PLANETS in National Museum of Emerging Science and Innovation (7F, 18:00-20:00). The reception desk will be open at 17:30. Overview of National Museum of Emerging Science and Innovation (the Nippon Kagaku Miraikan) In July 2001, the Nippon Kagaku Miraikan opened in the Tokyo Metropolitan Waterfront Subcenter (Aomi, Koto-ku). The museum is a facility for sharing the most up-to-date information about science and technology, and an all-round facility for human interaction. At the museum, visitors come in direct contact with, and experience, the latest developments in science and technology by hands-on exhibits, participating in various events, and meeting scientists and technicians. The objective of the museum is not limited to the acquisition of new knowledge. Its goals are to be the primary entity for the discovery of science, to consider the role of science and technology in contemporary society, and to be a dynamic entity that continues to create. Technical Tours As a special event for overseas participants, Technical Tours are planned on 11 December (Tue) 2001 as follows, Destinations 1) To see the advance technology for recycling Eg. Kawasaki Steel Plant and so on Destinations 2) To see the advance technology for zero-emission Eg. Zero-Energy Home by Misawa Homes A Tour fee is ¥6,000 including lunch and bus charge. For application, please check the box of “Technical tour” in the attached registration form and send it to EcoDesign 2001 Secretariat by 21 November, 2001. Domestic registrants are also welcomed to apply. (Minimum operating numbers of participants: 30 persons) 65 EcoProducts 2001 Exhibition Since 1999, the “Eco-Products Japan” exhibition has been held to provide a forum for exchanging and spreading ideas, information and opinions about eco-products among manufacturers and suppliers, governments and autonomous bodies, and consumers, citizen groups and NGOs. It features exhibitions of some 350 companies’ environmentally conscious products in a wide range of fields, from “home use” products such as furniture, stationery, clothing, and home appliances to “information/ service” products such as software, and products in the finance, logistics, lease/ rental, and consulting fields. In 2001, it will be the largest scale international exhibition in the field of eco-design and eco-products. All participants of EcoDesign 2001 are invited to attend the “ECO-PRODUCTS 2001” exhibition, 13-15 December 2001, at Tokyo Big Sight, East Exhibition Hall. For more information, please address e-mail inquiries to NIKKEI at [email protected]. Language The official language of all presentation is English. Except for tutorials those have simultaneous interpretation from English to Japanese. Proceedings The proceedings of EcoDesign 2001 is published in English by IEEE CS Press and distributed at the conference site. Extra copies of the proceedings can be purchased at ¥8,000 per a copy at site. Technical Equipment For oral presentation, an overhead projector is available. If a 35 mm slide projector, a video beamer or further equipment is needed, please contact with the EcoDesign 2001 Secretariat until 14 November. Upon receiving request, the Secretariat will inform the confirmation after the deadline. At conference site, please check and confirm the operation of tools such as ‘Power Point’ with speaker’s PC 30-60 min. before speaker’s session starts at the check room (Rm 603, 6F) to avoid trouble in the session. In any case, please ensure to bring a set of OHP sheets for all presentation. 66 Conference Venue Tokyo Big Sight, The Tower Building (Kaigito) Address: Ariake 3-21-1, Koto-ku, Tokyo, Zip-code 135-0063 Tel: +81-3-5530-1111, Internet: http://www.bigsight.or.jp/ Direct Telephone and Fax number of EcoDesign 2001 Secretariat at site will be announced in the Final Program. Travel to Hotels and the Conference Venue Three routes can be offered upon arrival at Narita Airport to come to the conference venue, 1) Narita Airport→(JR Narita Express train)→Tokyo Station→(JR line bound for Shinagawa) →Shinbashi Sta.→(YURIKAMOME) →Kokusai Tenjijo Seimon Fee: ¥3,280 in total to go, Time: approximately 100 min., Frequency: once or twice an hour 2) Narita Airport→(KEISEI Skyliner)→Nippori Station→(JR line bound for Shinagawa)→Shinbashi Sta.→(YURIKAMOME) →Kokusai Tenjijo Seimon Fee: ¥2,080 in total to go, Time: approximately 100 min., Frequency: once or twice an hour 3) Narita Airport→(a limousine bus bound for Ariake & Odaiba area in Tokyo) →Kokusai-Tenjijo Seimon or the Entrance of Tokyo Big Sight. Fee: ¥2,700 in total to go, Time: approximately 80 min., Frequency: three times a day Access to the Intercommunion Session at National Museum of Emerging Science and Innovation (the Nippon Kagaku Miraikan) It takes about 15 min. on YURIKAMOME and foot from the conference venue (Tokyo Big Sight) to National Museum of Emerging Science and Innovation. From hotels near Shinbashi station, take YURIKAMOME line to the site. Taxi is usually available to the venue and National Museum of Emerging Science and Innovation. In Tokyo, however, traffic jams is going to be happened. So, public transportation is more reasonable and recommendatory than taxi in terms of the time and fee to go. Please refer Access Map on page 87. A Climate in December of Tokyo In December, winter season starts in Japan. The weather in Tokyo is usually cold with the average temperature during the day ranging from 18 to 9°C. Visa to Entry into Japan Those from countries requiring visas should apply to the nearest Japanese consulate or Embassy. The EcoDesign 2001 Secretariat can also help you with Visa arrangement. For further information, please contact the EcoDesign 2001 Secretariat as early as possible. 67 Travel Arrangements Travel Agency Kinki Nippon Tourist Co., Ltd. (KNT), the official travel agency for the symposium will handle travel arrangements such as hotel accommodation and sightseeing tour. Inquiries and applications in this regard should be addressed to: EcoDesign 2001 DESK Events and Conventions, Tokyo Kinki Nippon Tourist Co., Ltd. Kyodo Bldg. 6F 2-2 Kanda-jimbocho, Chiyoda-ku, Tokyo 101-0051 JAPAN Tel: +81-3-3263-5581 Fax: +81-3-3263-5961 E-mail:[email protected] A) Hotel Accommodation KNT has reserved rooms at hotels around Tokyo Big Sight. Hotel reservations are processed on a first-come-first-served basis. If your selected hotel is fully booked, you will be assigned to a hotel as close as possible to your choice. The name of your confirmed hotel, its exact room charge will be informed in a confirmation slip sent to you after the deadline of application. Rank Name of Hotel Room Type Size (m3) Room Charge Deposit Access to Tokyo Big Sight Access to Hotel A Hotel Nikko Tokyo *No Breakfast Single Twin 33~ 33~ ¥21,945 ¥27,720 ¥30,000 7min. by Yurikamome Monorail Line ♦Hotel : Connected to Daiba Station B Tokyo Bay Ariake Washington Hotel *Breakfast included Single Twin 15~ 22~ ¥11,300 ¥18,600 ¥20,000 3min. walk from Hotel ♦Hotel : 3min. walk from Kokusai Tenjijo Station or Kokusai Tenjijo Seimon Station C Hotel Amista Ohi *Breakfast included Single Twin 10~ 10~ ¥ 8,085 ¥11,970 ¥20,000 35min. by JR Keihin Tohoku Line or Yurikamome Monorail Line ♦Hotel : 5min. walk from JR Ohi-machi Station 1) Above rates are per room per night including 10% service charge and 5% consumption tax. 2) Breakfast is NOT included at Hotel Nikko Tokyo. 3) Above rates are valid only during the period of EcoDesign 2001. 4) The deposit will be deducted from your hotel bill. Please settle the balance when you check out the hotel. 5) Those who are staying for one night only should send one night room charge instead of deposit. 68 6) The above rates and the information are subject to change without notice. 7) Closest stations to Big Sight: By Rinkai Fukutochin Line: 5min walk form Kokusai Tenjijo Station By Yurikamome Monorail Line: in front of Kokusai Tenjijo Seimon Station B) Sightseeing Tour Sightseeing tours with English speaking guide are available during your stay in Japan. For the details, please refer to the web site http://www.knt.co.jp/kokusai/packjht/jhtinde.htm . Those who wish to make a reservation should fill out tour name, date and the number of participants in the Application Form. Assemble time and place to join the tour will be informed in the confirmation slip sent to you after the dead line. Reservation For reservations, you are kindly requested to forward the Application Form directly to KNT by 14 November 2001. Reservation should be accompanied by the payment of room deposit, sightseeing tour and communication fee of ¥1500. No reservation will be confirmed in the absence of the payment. Confirmation Upon receiving your application form and payment, KNT will issue a confirmation slip and send it to after the deadline of application. Please ensure to bring this slip with you when you check-in at the hotel or join a sightseeing tour. Payment Payment of hotel deposit, sightseeing tour and communication fee (¥1500) should be made only in Japanese yen by one of the following methods. 1) Credit Card (VISA, Master Card, American Express, Diners Club, or JCB only.) Please fill out the credit card section in the Application Form with your signature. 2) Bank Transfer to Bank: Sumitomo Mitsui Banking Corp. Chuo Branch Account No: 1855212 Account Name: Kinki Nippon Tourist Co., Ltd * Please attach a copy of your bank receipt to the application form. * Please note that the bank charge for remittance must be borne by the participant. 69 Reservation Change or Cancellation For reservation change or cancellation, a written notification should be sent directly to KNT to avoid troubles. Hotel cancellation charges Up to 14 days prior to check-in date ................ No charge 13-7 days prior to check-in date ....................... 10% of one day room charge 6-3 days prior to check-in date ......................... 40% of one day room charge Less than 3 days or no notice given................. 100% of one day room charge Sightseeing tour cancellation charges 7 or more days prior to the commencement of the tour ...... No charge 1-6 days prior to the commencement of the tour ................ 10% of Tour Fare On or after the Tour Date .................................................... 20% of Tour Fare Refund When reservation is cancelled, refunds will be made after deducting the cancellation charges and bank or credit card service charges. If the payment is made by credit card, refund will be made through the credit card company. If by bank transfer, please inform us of your bank account. 70 CONFERENCE COMMITTEES Symposium Chair H. Yoshikawa, Chairman, The Science Council of Japan Organizing Committee Co-Chairs: R. Yamamoto, The Univ. of Tokyo F. Kimura, The Univ. of Tokyo D. Bendz, IEEE CS TCEE, IBM J. Ehrenfeld, ISIE International Members T. Graedel, Yale Univ., USA H. Griese, Fraunhofer IZM, Germany C. Handwerker, NIST, USA W. Harris, Columbia Univ., USA F.J.A.M. Hermann, Compaq Computer, Germany N.P. Hernborg, The Association of Swedish Automobile Manufacturers and Wholesalers, Sweden K. Ishii, Stanford Univ., USA J. Jeswiet, Queen’s Univ., Canada F.J.A.M. Jovane, CNR-Milano, Italy H.J.J. Kals, Univ. of Twente, The Netherlands T. Kjellberg, Royal Inst. of Technology, Sweden W.A. Knight, Rhode Island Univ., USA B. Kopacek, SAT-Care Electronics, Austria F.-L. Krause, Fraunhofer Inst. for Production Systems & Design Technology, Germany S.C.-Y. Lu, Univ. of Southerm California, USA A.Y.C. Nee, National Univ. of Singapore, Singapore K. Nimmo, ITRI, UK D. Allen, Univ. of Texas, USA B. Allenby, AT&T, USA L. Altings, Technical Univ. of Denmark, Denmark R. Aschenbrenner, Fraunhofer IZM, Germany C. Bathias, CNAM/ITMA, France S. Bleek, Factor 10 Inst., France G. Boothroyd, Boothroyd Dewhurst, USA W. Both, Berlin Senate, Germany D. Botkin, Center for the Study of the Environment, USA J. Brezet, Delft Univ. of Technology, The Netherlands M. Charter, The Centre for Sustainable Design, UK P. Dubots, Alcatel CIT, France P. Eagan, Univ. of Wisconsin-Madison, USA J. Ertel, Brandenburg Technical Univ., Germany W. Eversheim, Aachen Univ. of Technology, Germany K. Feldmann, Univ. of Erlangen-Nuernberg, Germany W. Fried, BMW, Germany 71 W. Oppermann, Nokia Mobile Phones, Germany J.-G. Persson, The Royal Inst. of Technology – KTH, Sweden R. Pfahl, Motorola, USA G. Pitts, Ecolibrium, USA H. Reichl, Fraunhofer IZM / Technical Univ. of Berlin, Germany H.-M. Rho, Korea Inst. of Science & Technology, Korea T. Schauer, FAW, Germany L.-G. Scheidt, Sony International (Europe), Germany G. Seliger, Technical Univ. of Belrin, Germany G. Sohlenius, The Royal Inst. of Technology, Sweden W.R. Stahel, Product-Life Inst., Switzerland R. Steinhilper, Fraunhofer IPA, Germany A. Stevels, Philips Consumer Electronics/Delft Univ. of Technology, The Netherlands N.P. Suh, Massachusetts Inst. of Technology, USA M. Terho, Nokia Res. Center, Finland H.K. Toenshoff, Univ. Hannover, Germany D. Ufford, Raytheon, USA H. van Brussel, Catholic Univ. of Louvain, Belgium F.J.A.M. van Houten, Univ. of Twente, The Netherlands E.V. von Weizackerr, Wuppertal Inst., Germany Y. Yasuda, Telefonab LM Ericsson, Sweden Domestic Members A. Ichikawa , Japan Inst. of Plant Maintenance T. Iida, Osaka Univ. K. Ikebuchi, Toyota Motor H. Ikeda, Matsushita Erectric H. Ishida, INAX Y. Ishikawa, Japan Techno-Economics Society H. Ishitani, The Univ. of Tokyo A. Izumi, Misawa Homes Inst. of Research and Development K. Kageyama, The Univ. of Tokyo T. Kamimura, National Inst. for Fusion Science M. Kamon, Kyoto Univ. H. Kato, Industrial Environment Research Center M. Kato, Akita Prefectural Univ. H. Katsura, Tokyo Ink Mfg. T. Kimura, NTT Advanced Technology T. Kimura, Kyoto Inst. of Technology G. Kinoshita, Chuo Univ. T. Arai, The Univ. of Tokyo Y. Baba, NEC Y. Emura, Canon T. Enkawa, Tokyo Inst. of Technology T. Fukuda, Nagoya Univ. T. Fukushima, Japan Audit and Certification Organization for Environment and Quality Y. Furukawa, Tokyo Metropolitan Univ. T. Gunjima, Doshisya Univ. I. Hamano, Mitsubishi Erectric M. Hanai, Denso I. Hashimoto, Kyoto Univ. K. Hashimoto, The Univ. of Tokyo N. Hashizume, Seiko Epson H. Hayashi, Manufacturing Science and Technology Center Y. Hayashi, ITOKI K. Higashio, Kubota H. Hirai, Tokyo Gas S. Hoshino, Musashi Inst. of Technology 72 M. Sadakata, The Univ. of Tokyo T. Sakai, Ritsumeikan Univ. K. Sanada, Yokohama National Univ. S. Sano, Sony K. Seika, TOTO T. Seo, The Yasuda Fire & Marine Insurance T. Shibasaka, Kobe Univ. Y. Shimoi, Toshiba M. Shoji, Kajima H. Suda, Toppan Printing S. Suda, The Japan Federation of Engineering Societies K. Sugimura, Sekisui House H. Tabata, Metocean Environment Inc. S. Takata, Waseda Univ. N. Taketa, Kyoto Univ. T. Takemoto, Osaka Univ. K. Takiguchi, Fuji Xerox N. Tanaka, Hokkaido Univ. Y. Tanaka, Toyo Univ. T. Tani, Ricoh R. Terakado, Nippon Steel T. Tomiyama, The Univ. of Tokyo N. Tosaka, Nihon Univ. H.Tsuchiya, Society of Japanese Value Engineering H. Uchida, Tokai Univ. K. Ueda, Kobe Univ. K. Ueno, Mitsubishi Erectric T. Umeda, Chiba Inst. of Technology T. Watanabe, Ritsumeikan Univ. K. Yagi, National Inst. for Materials Science T. Yagi, The Univ. of Tokyo A. Yamato, Japan Nuclear Cycle Development Inst. T. Yashiro, The Univ. of Tokyo I. Yasui, The Univ. of Tokyo T. Yoshizawa, The Univ. of Tsukuba (As of 30 September 2001) T. Kishi, National Inst. of Advanced Interdisciplinary S. Kishida, NEC M. Kobayashi, IBM Japan T. Kobayashi, The Univ. of Tokyo T. Koga, Fujitsu T. Koitabashi, Konika H. Koshibu, Fuji Xerox Office Supply M. Kouno, The Univ. of Tokyo N. Kumagaya, Inst. of Nuclear Safety System M. Kuriyagawa, National Inst. of Advanced Industrial Science and Technology M. Maeda, The Univ. of Tokyo T. Matsuo, Toyo Univ. A. Mitarai, Sharp K. Miyazaki, Chiba Univ. K. Mizoguchi, Shizuoka Univ. S. Mori, Nagoya Univ. Y. Moriguchi, The National Inst. for Environmental Studies K. Nagata, Waseda Univ. Y. Nakagami, The Sanno Inst. of Management Y. Nakagawa, Hitachi N. Nakajima, The Univ. of the Air K. Nakamura, Kirin Brewery T. Nakamura, Meidensha T. Nakayama, Japan Environmental Management Association for Industry M. Naki, Clean Japan Center K. Nihei, Waseda Univ. S. Ohkouchi, Hosei Univ. R. Okada, Mitsui Engineering and Shipbuilding T. Okajima, Osaka Gas T. Okano, Tokyo Women’s Medical Univ. N. Omi, Tokyo Univ. of Agriculture and Technology T. Osako, OMURON S. Owada, Waseda Univ. 73 Technical Committee Chair/Tutorial Chair: Vice-Chair: Secretariat: Technical Tour Chair: Seminar Chair: International Publicity Chair: Publicity Chair: Finance Chair: Home Page Chair: T. Suga, The Univ. of Tokyo J. Fujimoto, NEC K. Ajiki*, +, Ricoh K. Ido++, I.D.O. Digital Publishing H. Hayashi*, +, Fujikura N. Kimata*, Tottori Univ. of Environmental Studies S. Kishida, NEC M. Kobayashi, IBM Japan T. Koga, Fujitsu H. Koshibu+++, Fuji Xerox Office Supply K. Masui, National Inst. of Advanced Industrial Science and Technology Special Themes & Arrangements: S. Owada*, Waseda Univ. K. Suganuma, Osaka Univ. Award Chair: T. Tomiyama*, The Univ. of Tokyo Event Chair: H. H. Uchida, Tokai Univ. Program Chair: Y. Umeda, TokyoMetropolitan Univ. Asian Countries Support Chair: H. Yokoyama*, Hitachi Members Y. Adachi, The Univ. of Tokyo K. Amagai*, Gunma Univ. K. Aoyama+, The Univ. of Tokyo S. Doi #, Toshiba T. Gamo*, Matushita Electric K. Halada*, National Inst. for Materials Science K. Hashimoto*, The Univ. of Tokyo Y. Hirashima*, Seiko-Epson S. Honda++, Shoei Lab. N. Hosoda*, **, The Univ. of Tokyo H. Igarashi*, The Univ. of Tsukuba A. Inaba*, **, ##, National Inst. of Advanced Industrial Science and Technology T. Itou*, Toyota Motor Y. Izumi*, Japan Inst. of Plant Maintenance K. Kageyama*, The Univ. of Tokyo S. Kanai*, Hokkaido Univ. J. Kasai*, Isuzu Motors S. Kato*, +, The Univ. of Tokyo M. Katou, ITOKI H. Katsura*, Toyo Ink Mfg. C. Kawamoto*, Osaka Industrial Design Inst. T. Kiriyama*, The Univ. of Tokyo T. Kishimoto*, NTT H. Kitahara, Daikin Environmental Lab. H. Kobayashi*, Toshiba S. Komatani*, Kirin Brewery T. Kosuda*, Meidensha Y. Kurimoto*, Metocean Environment 74 K. Kuriyama*, Waseda Univ. S. Magaino*, Kanagawa Industrial Technology Reserch Inst. F. Masuda*, Open House/Tokyo Zokei Univ. K. Masuda*, Fuji Xerox Y. Minagawa, Fuji Photo Film S. Miyama*, Mertex T. Miyauchi*, Tokyo Inst. of Technology S. Miyawaki*, INAX K. Mizoguchi*, Shizuoka Univ. K. Monzen*, Japan Mining Association S. Mori*, Nagoya Univ. T. Murakami*, The Univ. of Tokyo K. Muramoto*, Misawa Homes M. Nakajima*, Sanyo Electric S. Nakamura*, Waseda Univ. M. Naki*, Clean Japan Center Y. Ogawa*, Japan Excel-Management Consulting K. Okaniwa*, Konica N. Omi*, Tokyo Univ. of Agriculture and Technology N. Saegusa*, #, Nissan Motor K. Sakai*, Sony H. Sakamura*, The Univ. of Tokyo K. Sanada*, Yokohama National Univ. T. Sano, National Inst. of Advanced Industrial Science and Technology K. Satoh##, Japan Audit and Certification Organization for Environment and Quality T. Satoh*, Ricoh M. Seki*, The Yasuda Fire & Marine Insulance H.A. Shapiro, Osaka Univ. of Arts T. Shibasaka*, Kobe Univ. * ** + ++ S. Shimada*, OMRON M. Shimizu*, Advantest Y. Shirai, The Japan Research and Development Center for Metals S. Suda, Japan Environmental Mamagement Associatiopn for Industry H. Suzuki*, The Univ. of Tokyo S. Takada*, Waseda Univ. T. Takemoto, Osaka Univ. R. Terao, Kochi EcoDesign Council O. Teshigawara*, Japan Radio S. Tounai*, Mori Landscape Architects M. Tsuchiya*, Matsushita Electric Components Y. Tsuchiya*, Society of Japanese Value Engineering T. Tsukui*, Tokai Univ. M. Uno+, Hitachi T. Urayama*, Ritsumeikan Univ. T. Watanabe, Ritsumeikan Univ. T. Yabe*, Tokyo Inst. of Technology K. Yagi, National Inst. for Materials Science Y. Yamagiwa*, Sony H. Yamamoto+, Fujitsu H. Yamamoto*, Canon T. Yashiro*, #, The Univ. of Tokyo I. Yasui*, The Univ. of Tokyo A. Yasumoto*, Japan Techno-Economics Society K. Yokoyama*, #, Joho Solution Y. Yoneda*, Fujitsu Labs. T. Yoshida*, Mitsubishi Electric T. Yoshizawa*, The Univ. of Tsukuba M. Yukimoto#, Kawasaki Steel (As of 30 September 2001) Program Committee member Award Subcommittee member Event Subcomittee member Publicity Subcommittee member 75 +++ # ## International Publicity Subcommittee member Technical Tour Subcommittee member Asian Countries Support Subcommittee member Managing Society K. Hirata, Japan Inst. of Electronics Pakaging ECO-PRODUCTS 2001 Secretariat K. Hasegawa, Nihon Keizai Shimbun, Inc. A. Morita, Nihon Keizai Shimbun, Inc. EcoDesign 2001 Secretariat H. Araki, Business Center for Academic Societies Japan N. Uehara, Business Center for Academic Societies Japan 76 CONFERENCE ORGANIZATION Organized by Union of EcoDesigners; 2001 Managing society: Japan Institute of Electronics Packaging Secretariat: Business Center for Academic Societies Japan In Cooperation with (Going Green: Global Collaboration with) IEEE Computer Society Technical Committee on Electronics and the Environment (IEEE CS TCEE), USA CARE Electronics, Europe Co-Sponsors Union of EcoDesigners: Japan Vending Machine Manufactures Association Japan Welding Society Japanese Society for the Science of Design Kochi EcoDesign Council Nippon Environment Club Osaka Industrial Design Inst., Osaka Prefectural Government Science Forum on Generation and Formation Society of Environmental Science Japan Society of Japanese Value Engineering The Carbon Society of Japan The Ceramic Society of Japan The Electrochemical Society of Japan The Illuminating Engineering Inst. of Japan The Inst. of Electrical Engineers of Japan The Inst. of Electrical Installation Engineers of Japan The Inst. of Electronics, Information and Communication Engineers The Iron and Steel Inst. of Japan Japan Inst. of Electronics Packaging (2001 Managing Society) Architectural Inst. of Japan Center for Environmental Information Science Clean Japan Center Combustion Society of Japan Design Engineering Special Comm., Liaison Comm. for Artifact Design and Manufacturing, The Science Council of Japan Inst. of Systems, Control and Information Japan Electronics and Information Technology Industries Association Japan Inst. of Plant Maintenance Japan Machine Tool Builders’ Association Japan Society for Design Engineering Japan Society of Civil Engineers Japan Society of Color Material Japan Society of Powder and Powder Metallurgy Japan Society on Water Environment Japan Techno-Economics Society 77 The Japan Electrical Manufactures’ Association The Japan Federation of Engineering Society The Japan Hydraulics & Pneumatics Society The Japan Inst. of Energy The Japan Inst. of Metals The Japan Research and Development Center for Metals The Japan Society for Composite Materials The Japan Society for Precision Engineering The Japan Society for Technology of Plasticity The Japan Society of Applied Physics The Japan Society of Hydrology and Water Resources The Japan Society of Mechanical Engineers The Japan Society of Plasma Sci. and Nuclear Fusion Res. The Japan Society of Polymer Processing The Japan of Society for Quality Control The Mining and Materials Processing Inst. of Japan The Society of Chemical Engineers, Japan The Society of Inorganic Materials, Japan The Society of Powder Technology, Japan The United Nations Univ., Inst. of Advanced Studies The Visualization Society of Japan Interrelated to Japan Society for Natural Disaster Science Japan Society for Snow Engineering Japan Society of Engineering Geology Japan Society of Fluid Mechanics Japan Society of Refrigerating and Air Conditioning Engineer Japan Thermal Spraying Society Japanese Society for Engineering Education Japanese Society of Snow and Ice Manufacturing Science and Technology Center Personal Computer Users’ Application Technology Association Quality Engineering Society The Chemical Society of Japan The Development Engineering Society of Japan The Energy Conservation Center, Japan The Iron and Steel Inst. of Japan The Japan Institute of Energy Atomic Energy Society of Japan Communications Industry Association of Japan Cryogenic Association of Japan Geothermal Research Society of Japan High Temperature Society of Japan Inverse Manufacturing Forum, Japan Japan Association of Industries and Environment Japan Automobile Manufacturers Association Japan Business Machine Maker’s Association Japan Coating Technology Association Japan Concrete Inst. Japan Electric Power Civil Engineering Association Japan Fluid Power Association Japan Foundry Engineering Society Japan Oil Chemists’ Society Japan Prestressed Concrete Engineering Association 78 The Resource Processing Society of Japan The Robotics Society of Japan The Society for Bioscience and Bioengineering The Society of Instrument and Control Engineers The Society of Naval Architects of Japan The Society of Resource Geology The Society of Rheology, Japan The Society of Rubber Industry Japan The Society of Synthetic Organic Chemistry The Society of Waste Management Experts The Spectroscopical Society of Japan The Surface Finishing Society of Japan The Surface Science Society of Japan (As of 1 October 2001) The Japan Institute of Light Metals The Japan Machinery Federation The Japan Society for The Conservation of Cultural Property The Japan Society of High Pressure Science and Technology The Japan Society of Industrial Machinery Manufacturers The Japanese Geotechnical Society The Japanese Society for Biomaterial The Japanese Society for Non-Destructive Inspection The Japanese Society for Strength and Fracture of Materials The Japanese Society of Printing Science and Technology The Laser Society of Japan The Marine Engineering Society in Japan Supported by Japan Environment Management Association for Industry Nihon Keizai Shimbun, Inc. 79 ACKNOWLEDGMENTS EcoDesign 2001 is financially supported by the following foundations: Kansai Research Foundation for Technology Promotion Nippon Sheet Glass Foundation for Materials Science and Engineering The Commemorative Association for the Japan World Exposition (1970) The Kajima Foundation Tokyo Convention and Visitors Bureau (As of 1 October 2001) 80 For office use: EcoDesign 2001 REGISTRATION FORM Reg.# Type A (For All Sessions) Early Registration This form must be sent to: Deadline: 21 Nov. 2001 EcoDesign 2001 SECRETARIAT c/o Business Center for Academic Societies Japan Honkomagome 5-16-9, Bunkyo-ku, Tokyo 113-8622, Japan Tel: +81 3 5814 1430 Fax: +81 3 5814 5845 E-mail [email protected]/[email protected] Please print or type: Title: Name: Prof. Dr. Mr. Ms. (Family) (First) (Middle Initial) Institution: Department: cut here Division: Address: Office Home Zip Code: Country: Tel: Fax: E-mail: Registration Fee Conference Member Sponsoring Society members and IEEE members Non-Members Student (Intercommunion Session Excluded) Intercommunion session (For Student, or an accompany) Tutorial Technical Tour Early Registration (before 21 Nov. 2001) ¥53,000 ¥58,000 ¥ 5,000 ¥ 8,000 ¥10,000 ¥ 6,000 Total¥ Name of society(ies): Name of Accompanying Person (if any): Mr. Ms. Late Registration (after 21 Nov. 2001) ¥58,000 ¥63,000 ¥10,000 ¥10,000 ¥10,000 Total¥ , (Family) (First) Remittance: Bank Check enclosed (payable to EcoDesign 2001) Bank Transfer:I will remit/have remitted the total fee on (date) to the account of EcoDesign 2001, through (your bank) A/C 075-2396620 (Ordinary Account), Credit Card: Amex Visa Master Diners Daiichi Kangyo Bank, Hongo Branch, Tokyo Master card issued in Japan is limited to UC only. Holder’s Name: Card Number: Expiry: (month)/ (year) Holder’s Signature: Date: Signature: 81 For office use: EcoDesign 2001 REGISTRATION FORM Reg.# Type B (For All Technical Sessions) Early Registration This form must be sent to: Deadline: 21 Nov. 2001 EcoDesign 2001 SECRETARIAT c/o Business Center for Academic Societies Japan Honkomagome 5-16-9, Bunkyo-ku, Tokyo 113-8622, Japan Tel: +81 3 5814 1430 Fax: +81 3 5814 5845 E-mail [email protected]/[email protected] Please print or type: Title: Name: Prof. Dr. Mr. Ms. (Family) (First) (Middle Initial) Institution: Department: cut here Division: Address: Office Home Zip Code: Country: Tel: Fax: E-mail: Registration Fee Conference Member Sponsoring Society members and IEEE members Non-Members Student (Intercommunion Session Excluded) Intercommunion Session (per a person) Tutorial Technical Tour Early Registration (before 21 Nov. 2001) ¥45,000 Name of Accompanying Person (if any): Mr. Ms. ¥50,000 ¥ 5,000 ¥ 8,000 ¥10,000 ¥ 6,000 Total¥ Name of society(ies): Late Registration (after 21 Nov. 2001) ¥50,000 ¥55,000 ¥10,000 ¥10,000 ¥10,000 Total¥ , (Family) (First) Remittance: Bank Check enclosed (payable to EcoDesign 2001) Bank Transfer:I will remit/have remitted the total fee on (date) to the account of EcoDesign 2001, through (your bank) A/C 075-2396620 (Ordinary Account), Credit Card: Amex Visa Master Diners Daiichi Kangyo Bank, Hongo Branch, Tokyo Master card issued in Japan is limited to UC only. Holder’s Name: Card Number: Expiry: (month)/ (year) Holder’s Signature: Date: Signature: 83 December 12-15, 2001 Tokyo Big Sight A P P L IC A T IO N F O R M (D e a ld L in e : N o v e m b e r 1 4 ) (official use) Reg. no. Date Please complete this form using a typewriter or block letters and return to: EcoDesign 2001 Desk K inki N ippon T ourist, C o., L td., E vents & C onventions, T okyo Kyodo Bldg. 6F, 2-2, Kandajimbo-cho, Chiyoda-ku Tokyo, 101-0051, Japan FAX: +81-3-3263-5961 TEL: +81-3-3263-5581 e-mail: [email protected] Prof. Dr. Mr. Ms. Title: Family Name: Given Name: , Middle Name Institution: Department: Division: Address Home Office E-mail: Country: TEL: FAX: Name of Accompanying Person (if any): Mr. Ms. Family Name Given Name cut here (A )H O T E L A C C O M M O D A T IO N Hotel Nikko Tokyo Check in date: Room type: Single Tokyo Bay Washington Hotel / Dec., 2001 Twin Hotel Amista Ohi Check out date: (to share with / Dec., 2001 for Mr./Ms. nights ) Hotel deposit: ¥ -(A) (B )S IG H T S E E IN G T O U R Tour Name Date Fee Person(s) Dec. ¥ Dec. ¥ Tour Fee: ¥ G ra n d T o ta l (A ) + (B ) + ¥ 1 ,5 0 0 = Total -(B) ¥ * ¥ 1 5 0 0 ;c o m m u n ic a tio n fe e PAYM ENT (Payment should be made only in Japanese Yen and personal checks are NOT acceptable.) BANK TRANSFER (Any handling charge must be settled by the participant.) I have remitted the above amount to the following bank on Name of bank: Account Number: Sumitomo Mitsui Banking Corp 1855212 (date) through Branch Name: Account Name: (bank). Chuo Branch Kinki Nippon Tourist Co., Ltd. CREDIT CARD I authorize to charge the above Grand Total to the following credit card. VISA Master Card American Express Diners JCB Card Holder’s Name (as appeared on the card): Good through: Card Number: Date: Signature: 85 (month)/ (year) National Museum of Emerging Science and Innovation 87