Going Green EcoDesign 2001, 2nd International Symposium on

Transcription

Going Green EcoDesign 2001, 2nd International Symposium on
Early Registration Deadline:
November 21, 2001
CONTENTS
Foreword
2
Scope and Format
3
International Symposium on Electronics and the Environment
6
Care Electronics within Eureka
7
Plenary speakers
8
Program Overview
12 December
9
13 December
10
14 December
11
15 December
12
Room Information
13
Tutorials
14
Program
12 December
17
13 December
25
14 December
33
15 December
49
Poster Session
61
General Information
63
Conference Committees
71
Conference Organization
77
Acknowledgments
80
Registration Form
81
Hotel Reservation Form
85
Access Map to the Intercommunion Session (NMESI, the Nippon Miraikan) 87
1
FOREWORD
Sustainable Development is the most significant concept that all kinds of people
must deeply consider its implication in modern society. The concept was originated
by Mrs. Brundtland who chained the World Commission for Environment and Development in 1987. The concept has become subject of discussion very often and in
various occasions since then, but without concluding any practical policy or activity to
satisfy the concept. As a result, some people starts insisting that the concept is just
an illusion which can not be realized and sometimes deceive the masses.
This insistence is absolutely wrong. The concept, Sustainable Development, is not
mentioning the ways along which people can actually achieve the goal. On the contrary, it is proposing an equation that must be solved urgently in order to avoid the
concurrent global disasters of natural environment and human society. The definition
of the concept is clear but solution of the equation proposed within the concept is difficult to solve.
More definitely, it should be said that Mrs. Brundtland told us that there is no solution
in our society if we proceed on the same way that we did in the past. Some fundamental changes are requested. They are international relations, industrial policies,
competition in the market, policies for material and energy resources, official aids for
developing countries, and rather strange to say, life styles of people. How can we
moderate them in a harmonic way? We do not have any feasible way to cope with
them concurrently.
Some comprehensive proposals to solve the equation of Sustainable Development
are highly requested. They seem to be integrated ones that involve national science,
engineering, social science, medical science and humanities. It is desirable that
those separated researchers in different academic domains would come together to
communicate each other and to construct a unique proposal to be opened to the
general society. It should be pointed out here,that for the integration of different academic domains, the domain-specific academic conclusions must be followed up by
practical actions.
For such follow-up, we may need new engineering, such as social engineering and
humanity engineering, both of them will be doubtlessly based on social science and
humanities, being similarly composed the relationship between natural science and
engineering.
EcoDesign 2001 will show a sound step to solve the different equation of Sustainable Development from various aspects of disciplinary and interdisciplinary
researches. We heartily hope that you will get unbounded information about Sustainable Development from the Conference, and possibly contribute it for further step of
progress by your thoughts in the particular scientific domains.
Hiroyuki Yoshikawa, Symposium Chair
Chairman, The Science Council of Japan
2
SCOPE AND FORMAT
The EcoDesign 2001 organizing committee is pleased to announce EcoDesign
2001, the Second International Symposium on Environmentally Conscious Design
and Inverse Manufacturing, to be held on December 11-15, 2001 at Tokyo Big Sight,
Tokyo, Japan.
This symposium is organized by Union of EcoDesigners (Association of EcoDesign
Societies, Japan), follow up on the first, successful “EcoDesign ’99” (Tokyo, February
1999). The Union comprises of 50 scientific societies, foundations and associations
in Japan. The symposium is held in “Going Green” : Global collaboration with IEEE
Technical Committee on the Electronics and the Environment, USA, and CARE Electronics, Europe.
The technical program of EcoDesign 2001 comprises three plenary speeches,
10 keynotes addresses, and 10 invited speeches along with approximately 236 contributed papers (including 16 posters) from 23 countries around the world, which are
based upon six pillars of categories and nine special themes as follows.
We want to discuss how information and communication technology can contribute
to a sustainable developmet. Which products and technologies are needed?
You can expect to learn state-of-the-art of these domains by attending the sessions.
Category A: Environmentally Conscious Product Design
Topics:
EcoDesign Case Studies, Modular Design, Industrial Design, Life Cycle
Design, EcoDesign Processes, EcoDesign Methods, Design for X,
Integration of EcoDesign and CAD, Information Sharing for EcoDesign,
Tools for X, LCA Case Studies, Design for Disassembly
Sessions: 19
Oral presentations: 75 (included one keynote speech made by Prof. E. Manzini, Italy)
Category B: Process Technologies and Elemental Technologies
Topics:
Eco-Materials, Long Fatigue Life (Giga-cycle) of Materials, Maintenance,
Cleaner Processes and Energy-Saving Processes
Sessions: 6
Oral presentations: 23 (included one keynote speech made by Dr. C. Bathias,
France)
Category C: Inverse Process Technologies
Topics:
Reuse and Recycling (Strategies and Technologies), Inverse Process
System Design
Sessions: 7
Oral presentations: 24 (included one Invited speech)
3
Category D: Business Strategies
Topics:
Environmental Conscious Market and Corporate Strategies, Servicification for Dematerialization
Sessions: 2
Oral presentations: 9 (included one keynote speech made by Prof. H. Brezet, The
Netherlands)
Category E: Sustainable Social Systems
Topics:
Environmental Education, Environmental Accounting, Social System
Design, Labelling and Logistics
Sessions: 5
Oral presentations: 19 (included one keynote speech made by Prof. M. Charter, UK)
Category F: Environmentally Conscious Management
Topics: Supply Chain Management, Management System, LCA
Sessions: 4
Oral presentation: 22
Following specific sessions created by leading experts from around the globe.
Special Theme 1: Factor 10 (Resources Productivity)
Oral presentations: 7
Special Theme 2: Promotion of DFE (Design for Environment)
Sessions: 2
Oral presentations: 6 (included one keynote speech made by Prof. P. Eagan, USA)
Special Theme 4: Industrial Ecology (Invited Session)
Sessions: 4
Oral presentations: 10 (including 9 invited lectures)
Special Theme 5: Recycling of Individual Products (Current and Future)
Oral presentations: 5
Special Theme 6: Research Trends in Lead-free Soldering
Oral Presentations: 6 (including two keynote speeches made by Prof. K. Nimmo, Italy
and Dr. C. Handwerker, USA)
Special Theme 8: EcoDesign and Chemical Engineering
Organized by The Society of Chemical Engineers, Japan
Sessions: 3
Oral presentations: 13 (including two keynote speeches made by Mr. Y. Yasui, Japan
and Prof. J. Petrie, Australia)
4
Special Theme 9: Advanced Technology for Electronic Packaging
– JIEP Session
Organized by Japan Institute of Electronics Packaging
Sessions: 2
Oral presentations: 9 (including one keynote speech made by Mr. H. Hayashi, Japan)
Special Theme 10: Low-temperature Lead-free Solder
This session reports the current status of the low-temperature lead-free soldering
project organized by Japan Institute of Electronic Packaging
Oral presentations: 6
Special Theme 11: IMS Project on Lead-free Soldering EFSOT
Organized by IMS (Intelligent Manufacturing System) Project on Next Generation
Environment-Friendly Soldering Technology (EFSOT)
Sessions: 2
Oral presentations: 6
As another important feature, three tutorials are scheduled on the first day of the
symposium, December 12 morning, inviting international lectures to provide participants with their enlightening ideas. Additional interesting events are exhibition held
by a variety of 350 companies displaying their unique products and latest environmentally conscious technologies from around the globe, and, specially arranged for
overseas participants, technical tours (December 11) which introduce them to the
recycling facilities of two Japanese firms and two interesting architectures.
Abundant in topics and nationalities of the speakers, EcoDesign 2001 will produce
a stimulating and productive moment for all participants. We welcome you to the
symposium and hope you find this opportunity useful.
Tadatomo Suga, Technical Committee Chair
Prof. Dr., The Univ. of Tokyo
RCAST (Research Center for Advanced Science & Technology)
5
International Symposium on Electronics and
the Environment
The ISEE will continue established traditions as the world’s leading forum on electronics and the environment. More broadly, the ISEE has grown into a premier meeting of professionals in design for environment, polllution prevention and
environmental policy fields. “Life-Cycle Environmental Stewardship for Electronic
Products” will reaffirm the electronics industry’s leadership in environmental design
and management, including life-cycle management, disassembly, recycling, takeback, energy use minimization, supply chain management and other activities.
The symposium will also look forward to new domains such as electronic commerce, new materials and components, advances in manufacturing, and environmentally preferable purchasing.
The ISEE is organized by IEEE CS TCEE (The Institute of Electrical and Electronics Engineers, Inc. (IEEE), Computer Society, Technical Committee on Electronics
and the Environment), USA.
The next ISEE will be held May 6-8, 2002 in San Francisco, California, USA.
It will be held in conjunction with the IAER’S (International Association of Electronics
Recyclers) third annual Electronics Recycling Summit.
6
Care Electronics within Eureka
On the threshould of a new millennium the impact of electronics on the quality of life
of mankind has never been greater. Advances in electronics have revolutionized the
way in which we live and do business.
However, every technological advance brings with it new demands on the Earth’s
resources and subsequent changes to the global environment. Manufacturers of
electronic equipment are increasingly being made aware of their environmental
impacts by legislation, customers and competitors. Recognizing their responsibility
to the Environment, electronics companies world-wide have been working to minimize their impact, develop new ‘clean’ technologies and to integrate environmental
considerations into new designs to cope with end-of-life issues.
CARE electronics within the EUREKA umbrella is the largest environmental
research platform of the European electronics industry.
CARE Electronics means Comprehensive Approach for the Recycling and Ecoefficiency of Electronics.
CARE Electronics is a strategic initiative to understand the international & national
implications of sustainability for the electr(on)ics industry in the future. CARE Electronics is an independent, industrial R&D network with members from large as well
as small companies & research organisations.
CARE Electronics
• forecasts products, technologies, services & societal expectations,
• identifies & researches strategic issues,
• provides a platform for dialogue with government, business, academia & society
and
• initiates and supports a series of projects which deliver sustainable solutions.
CARE Innovation is the periodic international meeting of CARE Electronics.
7
PLENARY SPEAKERS
Opening Address (Dec.12, 13:30-13:45)
Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan/ National
Inst.of Advanced Industrial Science and Technology, Japan
Plenary I (Dec.12, 13:45-14:25)
The Development and Promotion of the Ecological Rucksacks and MIPS
Concept
F. Schmidt-Bleek, Factor 10 Inst., France
Plenary II (Dec.12, 14:25-15:05)
Overview of Activities of the EC in the Field of Products and
the Environment
Marco Onida, DG Environment, European Commission
Plenary III (Dec.15, 15:40-16:30)
Design ‘Sustainable’ Products/Service Systems
John Ehrenfeld, Masachusetts Inst.of Technology, USA
Closing Lecture (Dec.15, 16:45-17:15)
Comprehensive Product Modelling for Designing Life Cycle Scenarios
Fumihiko Kimura, Org. Com. Co-Chair/The Univ. of Tokyo, Japan
Closing Words (Dec.15, 17:15-17:30)
Diana Bendz, Org. Com. Co-Chair/IEEE CS TCEE/IBM, USA
The above speeches are all held at the International Conference Room on the 7th
floor.
8
9
18:30-20:30
18:00-18:20
17:40-18:00
17:20-17:40
C1-2
Reuse and Recycling
(Strategies and Technologies)
(2)
C1-1
Reuse and Recycling
(Strategies and Technologies)
(1)
F1
Supply Chain
Management
Welcome Reception (at Room 102, 1F, Tokyo Big Sight, Tower Building)
Break
B1-2
Eco-Materials
(2)
A1-3
EcoDesign
Case Studies
(2)
16:40-17:00
B1-1
Eco-Materials
(1)
17:00-17:20
16:20-16:40
16:00-16:20
15:40-16:00
A1-2
EcoDesign
Case Studies
(1)
ST4-1-2(Invited Lectures)
Industrial Ecology
and EcoDesign (2)
Break
ST4-1-1(Invited Lectures)
Industrial Ecology
and EcoDesign
(1)
Break
A1-1
EcoDesign
Strategies
Plenary II: Overview of Activities of the EC in the Field of Products and the Environment (Marco Onida, European Commission)
14:25-15:05
15:05-15:20
15:20-15:40
Opening Address (Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan)
Room 6
Plenary I: The Development and Promotion of the Ecological Rucksacks and MIPS Concept (F. Schmidt-Bleek, Facto 10 Inst, France)
Room 5
13:45-14:25
Lunch/Sing-up & Registration
(B. Bras)
Room 4
13:30-13:45
12:00-13:30
9:00-12:00
Tutorial 3
Tutorial 2
H. Griese
O. Deubzer
J. Müler
L. Stobbe
Room 3
Tutorial 1
Room 2
(A. Stevels)
Room 1
Wednesday, 12 December 2001
PROGRAM OVERVIEW
17:50
Poster
10
Break
C2-2
Inverse Process
System Design
(2)
C2-1
Inverse Process
System Design
(1)
Room 3
Lunch
F2
Management
System
Room 4
ST1-2
Factor 10
Room 5
Room 6
ST4-2-2(Invited Lectures)
Industrial Ecology
and EcoDesign
(4)
Break
ST4-2-1(Invited Lectures)
Industrial Ecology
and EcoDesign
(3)
Break
14:00-14:45
14:45-15:00
15:00-17:00
The Application of Eco-Design —Ten Years of Dynamic Development / A.L.N. Stevels (Delft Univ. Technology)
13:20-14:00
Coordinator:
Panellists:
Hisatake Kato (Tottori Univ. of Env. Studies)
Yotaro Kobayasi (Fuji Xerox)
Kisho Kurokawa (Architect)
Noriko Kimoto (under negotiation)
Panel Discussions
Environmental Efficiency as a Keyword / Ryoichi Yamamoto (The Univ. of Tokyo)
Environmental Technology Applicable to Reforming Economy —My Proposal / Hisatake Kato (Tottori Univ. of Env. Studies)
13:05-13:20
13:00-13:05
12:00-13:00
11:40-12:00
11:20-11:40
A2-4
EcoDesign
Case Studies
(4)
A2-3
EcoDesign
Case Studies
(3)
Room 2
EcoProducts 2001 Exhibition Symposium: For Reforming Japanese Economy on the Basis of Environmental Aspects
—Vision to an Affluent Eco-Society — (organized by EcoProducts Exhibition)
Welcome / Hiroshi Sakisaka (Japan Environmental Management Association for Industry)
A2-2
Industrial
Design
11:00-11:20
Break
10:20-10:40
A2-1
Modular
Design
Room 1
10:40-11:00
10:00-10:20
9:40-10:00
9:20-9:40
Thursday, 13 December 2001
PROGRAM OVERVIEW
Poster
Preparation
Poster
11
A3-4
Design for X
(1)
16:00-16:20
18:00-20:00
17:00-17:20
16:40-17:00
16:20-16:40
Break
15:40-16:00
15:20-15:40
15:00-15:20
14:40-15:00
14:20-14:40
14:00-14:20
13:40-14:00
13:20-13:40
13:00-13:20
12:40-13:00
12:20-12:40
12:00-12:20
11:40-12:00
11:20-11:40
A3-3
EcoDesign
Methods
A3-2
EcoDesign
Processes
11:00-11:20
Break
10:40-11:00
A3-1
Life Cycle
Design
Room 1
10:20-10:40
10:00-10:20
9:40-10:00
9:20-9:40
E3-1
Environmental
Education
Break
C3-3
Reuse and Recycling
(Strategies and Tech.)
(5)
C3-2
Reuse and Recycling
(Strategies and Tech.)
(4)
D3-2
Servicification for
Dematerialization
D3-1
Environmental
Conscious
Market
and
Corporate
Strategies
B3-2
Long Fatigue Life
(Giga-cycle) of
Materials
(2)
Break
F3-2
LCA
(2)
F3-1
LCA
(1)
Break
ST10-3
Low-temperature
Lead-free Solder
Break
ST11-3
IMS Project on Lead-free
Soldering EFSOT
ST6-3
Research Trends
in Lead-free
Soldering
E3-2
Environmental
Accounting
B3-1
Long Fatigue Life
(Giga-cycle) of
Materials
(1)
C3-1
Reuse and Recycling
(Strategies and Tech.)
(3)
Break
Room 6
Room 5
Room 4
Room 3
Intercommunion Session (at Restaurant 5K PLANETS, 7F, NMESI <The Nippon Kagaku Miraikan>)
A3-8
Information
Sharing
for EcoDesign (2)
A3-7
Information Sharing
for EcoDesign
(1)
Lunch &
Poster Session
A3-6
Integration of
EcoDesign and CAD
Break
A3-5
EcoDesign
Case Studies
(5)
Room 2
Friday, 14 December 2001
PROGRAM OVERVIEW
Poster
Exhibition
Poster
Session
Poster
Exhibition
Poster
12
Break
B4-2
Cleaner Processes and
Energy-Saving Processes
Lunch
E4-2
Social System Design
(2)
Break
E4-1
Social System Design
(1)
Room 3
ST9-4-2
Advanced
Technology for
Electronic
Packaging
– JIEP Session (2)
ST9-4-1
Advanced
Technology for
Electronic
Packaging
– JIEP Session (1)
E4-3
Labelling and
Logistics
Room 4
Room 5
ST8-4-3
EcoDesign and
Chemical
Engineering
(3)
ST8-4-2
EcoDesign and
Chemical
Engineering
(2)
Break
ST8-4-1
EcoDesign and
Chemical
Engineering
(1)
ST2-4-2
Promotion of
DFE
(2)
Break
ST2-4-1
Promotion of
DFE
(1)
Room 6
ST5-4
Recycling of
Individual
Products
(Current and Future)
Best Paper & Best Poster Awards
Closing Words (Diana Bendz, Org. Com. Co-Chair/IEEE CS TCEE/IBM, USA)
16:45-17:15
17:15-17:30
Plenary III: Designing ‘Sustainable’ Product/Service Systems (John Ehrenfeld, MIT, USA)
A4-4
Design for
Disassembly
A4-3
LCA
Case Studies
Break
B4-1
Maintenance
Room 2
Closing Lecture: Comprehensive Product Modelling for Designing Life Cycle Scenarios
(Fumihiko Kimura, Org. Com. Co-Chair/The Univ. of Tokyo, Japan)
A4-2
Tools for DfX
A4-1
Design for X
(2)
Room 1
16:30-16:45
15:40-16:30
15:20-15:40
15:00-15:20
14:40-15:00
14:20-14:40
14:00-14:20
13:40-14:00
13:20-13:40
13:00-13:20
12:40-13:00
12:20-12:40
12:00-12:20
11:40-12:00
11:20-11:40
11:00-11:20
10:40-11:00
10:20-10:40
10:00-10:20
9:40-10:00
9:20-9:40
Saturday, 15 December 2001
PROGRAM OVERVIEW
Poster
Poster
Exhibition
ROOM INFORMATION
Tokyo Big Sight, Tower Building (Kaigi-to)
6th Fl.
605, 609, 610:Tutorials
605 ~ 610:Conf. Rm
604: Poster
603: Check Rm for Technical
Equipment
Lobby
:Registration Desk
601: Secretariat
602: Committee/Recess Rm
for Invited
7th Fl.
Int. Conf. Rm.
Opening,
Plenaly I ~ III
Best Paper &
Best Poster Awards
Closing
13
TUTORIALS
Wednesday, 12 December 2001, 9:00-12:00
Tutorial 1
Ecodesign Business and Green Marketing
1) Integration of EcoDesign into the Business
2) Green Marketing and Sales
Prof. Dr. Ir. A. L. N. A. Stevels
Philips Consumer Electronics/Delft Univ. of Technology, The Netherlands
Three main drivers to do it (customers, legislation and competetive advantage).
Several types of “green” to be considered (scientific green, government green, customer green). The Ecodesign matrix. Three types of environmental activities (defensive, cost oriented, proactive). Four levels of EcoDesign Vision, strategy policy,
roadmap. How to organize. How to develop green options and how to do business
evaluation of them. Integration of green into product creation. Example of green programmes and of green product realizations. Lessons learned from ten years working
implementation of Ecodesign. Five ways of making money while being “green”.
Seven archetypes of green consumer behaviour:
– Characteristics of archetypes
– How to circumvent the “green does not sell” trap
– Environmental communication
– Green image and its importance
– How to put more green into your brand
– Position of ecolabels
– Integration of green idea generation, product development and marketing
14
Tutorial 2
Applied EcoDesign — Product Characterization
by Sustainability Indices
Dr. H. Griese, O. Deubzer, J. Müller, L. Stobbe
Fraunhofer Inst. for Reliability and Microintegration (IZM), Berlin, Germany
Presentation methods and practical applications of product characterization with
ecological special sustainability indices. Key points are resource consumption, material content, hazardous materials and risk assessment, recycle/reuseability, and
aspects of sustainability in the IT sector. The focus lies on the reduction of energy
consumption and hazardous substances.
The tutorial includes the following topics:
1) Sustainability Roadmap and EcoDesign in the field of ICT
– Status quo and trend analysis
– Field of activity
– Best practice examples environmental report (Sony; Philips; Flextronics)
2) EE Toolbox methodology for environmentally conscious design
– Tool TPI
– Tool ERM
– Tool IPI
– Tool ProTox
– Tool RPI
3) Application examples of the EE-Toolbox
– Example Switched power supply
– Example PWB telephone
– Example mobile phones
– Example Semiconductor Fab
The tutorial will be held by specialists of the Fraunhofer IZM, Dept. of
Environmental Engineering (organizer of “Electronics Goes Green 2000+”).
15
Tutorial 3
Identifying Economic and Environmental Win-Win
Situations in EcoDesign
Prof. Bert Bras
Georgia Institute of Technology, USA
In this tutorial, the focus is on how to identify technical, economical, and environmental win-win situations. A key focus area will be on how to integrate economic and
environmental assessments in order to easily identify opportunities for economic and
reducing environmental improvements.
In the tutorial, attendees will learn about:
– EcoDesign guidelines and strategies and how they affect other design and
business requirements
– Assessment tools like Life-Cycle Analysis, Life-Cycle Costing, Full Cost Accounting, etc. and how they can (or cannot) be used to identify win-win situations in
both product and process design
– How to integrate financial and environmental assessments in a single framework
using Activity-Based Cost and Environmental Management
– Technologies and tools that support integrated performance assessments and
monitoring
– Industrial case studies and examples from Europe, Japan and the United States
The tutorial will be given by Dr. Bert Bras who is a faculty member in Mechanical
Engineering and Director of Georgia Tech’s Institute for Sustainable Technology and
Development. He has taught and published (including one book) extensively in the
area of Environmentally Conscious Design and Manufacturing. He recently served
on a panel of experts benchmarking the global state of Environmentally Benign Manufacturing for the US National Science Foundation and Department of Energy.
16
Room 1
9:00-12:00 Tutorial 1
Ecodesign Business and Green Marketing
1) Integration of EcoDesign into the Business
2) Green Marketing and Sales
Ab Stevels, Philips/Delft Univ. of Technology, The Netherlands
Room 2
9:00-12:00 Tutorial 2
Applied EcoDesign-Product Characterization by Sustainability Indices
Hansjörg Griese, Otmar Deubzer, Jutta Müller, Lutz Stobbe, Fraunhofer IZM, Belin,
Germany
Room 3
9:00-12:00 Tutorial 3
Identifying Economic and Environmental Win-Win Situations in EcoDesign
Bert Bras, Georgia Inst. of Technology, USA
International Conference Room, 7F
13:30-13:45 Opening Address
Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan, Japan
13:45-14:25 Plenary I
The Development and Promotion of the Ecological Rucksacks and
MIPS Concept
F. Schmidt-Bleek, Factor 10 Inst., France
14:25-15:05 Plenary II
Overview of Activities of the EC in the Field of Products and the Environment
Marco Onida, DG Environment, European Commission
17
Dec 12
WEDNESDAY, 12 DECEMBER 2001
Tutorial/Opening/Plenary I, II
PROGRAM
Room 1
A1-1
Dec 12
15:20-17:20
A1-1: EcoDesign Strategies
1. System Boundaries and Functional Priorities in Different Life Phases in the
Context of Eco-Design
Ulrika Forsberg, Jessica Lagerstedt, Royal Inst. of Technology, Sweden
2. Combined Strategies for Recycling — Product and Process
Oriented Benchmarking
Juergen Hesselbach, Christoph Herrmann, Technical Univ. Braunschweig,
Germany
3. Planning Product Take Back Period and Component Life under Uncertainty
in Technological Evolution
Hideo Fujimoto, Alauddin Ahmed, Nagoya Inst. of Technology, Japan
4. The Conflict of Contradictory Environmental Targets
Conrad Luttropp, Reine Karlsson, KTH, Sweden
5. Environmentally Compatible Product Design: The Business Strategy
of Siemens
Ferdinand Quella, Siemens, Germany
6. Subjects in and Approaches for Life Cycle Design
Toshijiro Ohashi1, Yoshio Matsumoto2, 1Hitachi, 2Tokai Univ., Japan
18
1. Confronting Product Life Thinking with Product Life Cycle Analysis
Tim C. McAloone, Technical Univ. of Denmark, Denmark
2. About the Environmental Load Relevant to Water, and Its Reduction
Daisuke Yamanouchi, TOTO, Japan
3. Ecological Design for the Usage Phase: An Interdisciplinary Approach
to DfE
Christof Oberender, Olaf Weger, Juergen Sauer, Herbert Birkhofer, Darmstadt
Univ. of Technology, Germany
4. On the Way to Green Mobile Products
Jutta Mueller1, Hansjoerg Griese1, Herbert Reichl1, 2, 1Fraunhofer Inst. for Reliability and Microintegration, 2Technical Univ. of Berlin, Germany
17:00-18:00
A1-3: EcoDesign Case Studies (2)
1. The Aptitudes of the Ecodesign Competitions Held During 1987 to 1997
in Japan
Edilson Ueda, Tadao Shimizu, Chiba Univ., Japan
2. Ecodesign Demonstration Project (LIFE) — Examples of Ecodesign in
Belgian Industry
An Vercalsteren, Bart Jansen, Vito (Flemish Inst. for Technological Res.),
Belgium
3. Regarding the Actual Condition of Industrial Waste, and Possibility
That Utilizes it Effectively as Materials for Other Industries
Yoshiaki Kamo, Japan Inst. of Plant Maintenance, Japan
19
Dec 12
15:20-16:40
A1-2: EcoDesign Case Studies (1)
A1-2/A1-3
Room 2
Dec 12
B1-1/B1-2
Room 3
15:20-16:40
B1-1: Eco-Materials (1)
1. Properties of a Novel Polyarylate
Yoshinao Ishigure1, Kousuke Yamauchi2, Masashi Niikawa3, Yoshihiro Kubota4,
Yoshihiro Sugi4, Minoru Miwa4, 1Research Inst. of Industrial Products, Gifu Prefectural Government, 2Nissei Kagaku Kogyosho, 3Tenryu Kogyo, 4Gifu Univ.,
Japan
2. Environmental Benchmark Analysis of Electr(on)ic Products with
Components Consisting of Renewable Raw Materials
Heiko Maas1, Michael Flake2, 1Technical Univ. of Braunschweig, 2LCE Consulting, Germany
3. Method for Interconnected Development and Selection of Basic Material,
Exemplified on the Basis of Biodegradable Synthetic Materials Made-up of
Renewable Primary Product
Hermann Kuehnle, Otto-von-Guericke-Univ. Magdeburg, Germany
4. Newly Developed Chromium-free Organic-inorganic Composite Coated
Steel Sheet with Excellent Corrosion Resistance
Takahiro Kubota, Naoto Yoshimi, Akira Matsuzaki, Satoru Ando, Masaaki
Yamashita, NKK, Japan
17:00-18:20
B1-2: Eco-Materials (2)
1. A High Reliability Halogen-free Flame-retardant Dielectric for
Build-up PWBs
Yasunori Yoneda, D. Mizutani, N. F. Cooray, K. Motoyoshi, Fujitsui Labs., Japan
2. Feasibility Study for Recycling of JVC Compact Disks for Use in
the Manufacturing of Motorola Plastic Housings
Markus Stutz1, Doreen Schnecke1, Teruo Takahashi2, Noboru Kawai2, Koji
Tsujita2, 1Motorola, Germany, 2Victor Co. of Japan, Japan
3. Hydrothermal Solidification of Inorganic Waste Materials
Mikihiro Oida1, Hideki Ishida2, Hiroki Maenami2, Hiroto Shin2, Hiroaki Kuno2,
1Aichi Science and Technology Foundation, 2INAX, Japan
20
Room 3
B1-2
21
Dec 12
4. R&D of Environmentally Friendly Plate Material NPPS with Burrs for
Electric Vehicle Storage Battery Use
Kaihua Xu1, Min Wang1, Xueyi Guo2, Ryoichi Yamamoto2, 1Shenzhen Zhongjin
Hi-Energy Battery Material Co., China, 2The Univ. of Tokyo, Japan
Dec 12
C1-1/C1-2
Room 4
15:20-16:40
C1-1: Reuse and Recycling (Strategies and Technologies) (1)
1. Recent Trends and Benefits of Remanufacturing: From Closed Loop
Businesses to Synergetic Networks
Rolf R. Steinhilper, Univ. of Bayreuth, Germany
2. An Analytic Approach for Designing Reverse Production System
Infrastructure When Facing Uncertainty
Jane C. Ammons, Tiravat Assavapokee, David Newton, Matthew J. Realff,
Georgia Inst. of Technology, USA
3. Experiences with Take-back of White and Brown Goods in The Netherlands
Ab Stevels, Delft Univ. of Technology, The Netherlands
4. Feasibility Study of the Recycling Options in Malaysia — The Kota Kinabalu
Case Study
Lee Chong Theng, Mohd Nasir Hassan, Md Mizanur Rahman, Muhamad Awang,
Univ. Putra Malaysia, Malaysia
17:00-18:00
C1-2: Reuse and Recycling (Strategies and Technologies) (2)
1. Ricoh’s Global Deployment of Recycling
Masakatsu Nakagawa, Ricoh, Japan
2. FXOS Recycled Pulp Promotion Program
Hiromi Ishida, Katsumi Harada, Hiroshi Tokita, Kazuhide Suzuki, Masayuki
Tsuchiya, Kazuya Suda, Mitsuo Ishida, Taiji Ohashi, Fuji Xerox Office Supply,
Japan
3. Recycling-oriented Production and Assessment of FujiFilm One Time Use
Camera “Quick Snap”
Shu-ichi Ichino, Fuji Photo Film, Japan
22
Room 5
F1
1. Environmental-Economic Supply Chain Management of Suppliers, Contract
Manufacturers and Recyclers: More than Requirements for Environmentally
Hazardous Substances and Environmental Management Systems
Menno H. Nagel, Delft Univ. of Technology, The Netherlands
2. Production Planning in Remanufacturing/Manufacturing
Production System
Andre Kasmara1, Masaaki Muraki2, Shinobu Matsuoka2, Sukoyo2, Kadarsah
Suryadi1, 1Bandung Inst. of Technology, Indonesia, 2Tokyo Inst. of Technology,
Japan
3. Environmental Supply Chain Management in the Electronics Industry
Dana Hollien1, Graham L. Adams2, Michael Loch1, Steven M. Scheifers1, Markus
Stutz3, 1Motorola, USA, 2Motorola, UK, 3Motorola, Germany
4. Consumer Incentive toward the Construction of Supply Chain for
Inverse Manufacturing
Keijiro Masui1, Jun Fujimoto2, Toshihiko Ito3, Eiji Sato4, Yuichi Hayakawa5,
Masato Matsunaga6, Mutsumi Mikoda7, Takeshi Yuda8, 1National Inst. of
Advanced Industrial Science and Technology, 2NEC, 3Nissan Motor, 4Hitachi,
5Meidensha, 6ECO KEIKAKU, 7Japanese Material Handling Society, 8Sony,
Japan
5. Material-flow based Supply Chain Management in the Electronic Industry
Juergen Hesselbach, Rene Graf, Martin Ohlendorf, Christoph Herrmann, Technical Univ. Braunschweig, Germany
6. Design and Integration of “Intelligent Agents” to Implement Conscious and
Sustainable Future Production Systems
Pierre Massotte, Jihad Reaidy, Yuinggiu Liu, Daniel Diep, Ecole des mines d’ales,
France
23
Dec 12
15:20-17:20
F1: Supply Chain Management
Dec 12
ST4-1-1/ST4-1-2
Room 6
15:20-16:40
Special Theme 4-1-1 (Invited Lectures):
Industrial Ecology and EcoDesign (1)
1. Designing Sustainable Product/Service Systems
John Ehrenfeld, Massachusetts Inst. of Technology, USA
2. Environmentally-Benign Manufacturing as a System Science
Thomas Graedel, Yale Univ., USA
3. Material Flow Accounting as a Tool for Industrial Ecology
Yuichi Moriguchi, National Inst. for Environmental Studies, Japan
17:00-17:50
Special Theme 4-1-2 (Invited Lectures):
Industrial Ecology and EcoDesign (2)
1. Industrial Ecology in Off-site Building Component Industry: Case Study on
Bathroom Units Sectors
Shih-Hung Yang, Tomonari Yashiro, Kenji Nishimoto, The Univ. of Tokyo, Japan
2. Implementation of “Life Cycle Value Index” in Assembly Houses
Tomomi Murata1, Tomonari Yashiro2, 1The Univ. of Kitakyushu, 2The Univ. of
Tokyo, Japan
24
Thursday, 13 December 2001
Room 1
9:20-10:20
A2-1: Modular Design
3. Design of Product Modularity for Life Cycle Management
Tomoyuki Hata, Satoru Kato, Fumihiko Kimura, The Univ. of Tokyo, Japan
10:40-12:00
A2-2:Industrial Design
1. Sustainability and Scenario Building: Scenarios of Sustainable Well-being
and Sustainable Solutions Development (Keynote)
Ezio Manzini, Politecnico di Milano, Italy
2. Ecodesign Integration in Concept Development
Tracy A. Bhamra, Chris Sherwin, Vicky A. Lofthouse, Stephen Evans, Cranfield
Univ., UK
3. Producing Eco-value for a Recycling-based Society by Industrial Design
Fumikazu Masuda, Tokyo Zokei Univ., Japan
25
Dec 13
2. Management of Joint Information to Support Design Module
Kazuhiro Aoyama1, Shyoji Takechi1, Mitsuhiro Iwamura2, 1The Univ. of Tokyo,
2NTT Data, Japan
A2-1/A2-2
1. A Study on Design for Upgradable Products Considering
Future Uncertainty
Yoshimasa Umemori1, Shinsuke Kondoh1, Yasushi Umeda1, Yoshiki
Shimomura2, Masaharu Yoshioka3, 1Tokyo Metolopolitan Univ., 2The Univ. of
Tokyo, 3National Inst. of Informatics, Japan
Room 2
9:20-10:40
A2-3: EcoDesign Case Studies (3)
1. Recyclability of Flame Retardant Plastics
Raymond B. Dawson, Susan D. Landry, Marcia L. Hardy, Hiroaki Yamada,
Albemarle, USA
Dec 13
A2-3/A2-4
2. A Study on Marketability of Environmentally Conscious Products Made of
Long Life Material
Pi-Ju Tsai, Shin’ya Nagasawa, Ritsumeikan Univ., Japan
3. Vehicle Recycling from a Designers Perspective
Anne-Mrie E. Akermark, Royal Inst. of Technology, KTH, Sweden
4. A Study on Marketability of the Next Generation Community Vehicle
(NCV21)
Pi-Ju Tsai, Satoshi Kawae, Shin’ya Nagasawa, Ritsumeikan Univ., Japan
11:00-12:00
A2-4: EcoDesign Case Studies (4)
1. The Influence of Copper Smelters Requirements on Design Rules
for Electronics
Goran Malhammar, Christina Berglund, Ericsson Radio Systems, Sweden
2. Construction of Two 25M Tall Vertical Arrays with 2nd Generation
Amorphous Silicon Photovoltaic Technologies
King Hang Lam1, Edward Lo2, Josie Close1, 1The Univ. of Hong Kong, 2The
Hong Kong Polytechnic Univ., China
3. Application of Ecodesign in Nonferrous Metal Industry in China
Xueyi Guo1, Chuanfu Zhang2, Ryoichi Yamamoto1, 1The Univ. of Tokyo, Japan,
2Central South Univ., China
26
Room 3
9:40-10:40
C2-1: Inverse Process System Design (1)
1. Car Recycling and Producer Responsibility in Sweden (Invited)
Nils Hernborg, The Association of Swedish Automobile Manufacturers and
Wholesalers, Sweden
11:00-12:00
C2-2: Inverse Process System Design (2)
1. Study of Inverse Supply Chain (1) — Survey of Actual Inverse Supply Chain
in Japan
Susumu Shibata1, Hiroshi Uesugi2, Yasushi Wada3, Hiroya Terui4, Genichi
Mitsuishi4, Makuni Inoko5, Hitoshi Fujiwara6, Shigehisa Endoh7, Kazuhito
Haruki8, Shuuji Hoshino9, Yoshio Itoi10, Toshiyoshi Okazaki11, 1Toyo Engineering, 2Kawasaki Steel, 3Yokogawa Electric, 4Komastu, 5NKK, 6Juki, 7National Inst.
of Advanced Industrial Science and Technology, 8Toshiba, 9Ishikawajima-Harima
Heavy Industries, 10Ricoh, 11FANUC, Japan
2. Study of Inverse Supply Chain (2) — Classification of Inverse Supply Chain
and Characterization of Products
Susumu Shibata1, Hiroshi Uesugi2, Hiroya Wada3, Hiroya Terui4, Genichi
Mitsuishi5, Makuni Inoko6, Hitoshi Fujiwara7, Shigehisa Endoh8, Kazuhito
Haruki9, Shuuji Hoshino10, Yoshio Itoi11, Toshiyoshi Okazaki12, Katsushige
Matsunuma13, 1Toyo Engineering, 2Kawasaki Steel, 3Yokogawa Electric,
4Komastu, 5Japanese Material Handling Society, 6NKK, 7Juki, 8National Inst. of
Advanced Industrial Science and Technology, 9Toshiba, 10Ishikawajima-Harima
Heavy Industries, 11Ricoh, 12FUNUC, 13Sharp, Japan
27
Dec 13
3. Maturing Markets for Recycled Plastics from WEEE: An Elaboration on the
Consequences for the Evaluation of Future End-of-Life Scenarios
Casper Boks, Ab Stevels, Delft Univ. of Technology, The Netherlands
C2-1/C2-2
2. Configuration of Recycling Networks for Enhanced WEEE Recycling
Juergen Hesselbach, Martin Ohlendorf, Christoph Herrmann, Technical Univ. of
Braunschweig, Germany
Room 3
C2-2
Dec 13
3. Study of Inverse Supply Chain (3) — Study of Promotion Issues on Inverse
Supply Chain
Yoshio Itoi1, Susumu Shibata2, Hiroshi Uesugi3, Yasushi Wada4, Hiroya Terui5,
Genichi Mitsuishi6, Hitoshi Fujiwara7, Shigehisa Endoh8, Kazuhito Haruki9,
Shuuji Hoshino10, Toshiyoshi Okazaki11, Katsushige Maysunuma12, 1Ricoh,
2Toyo Engineering, 3Kawasaki Steel, 4Yokogawa Electric, 5Komatsu, 6Japanese
Material Handling Society, 7Juki, 8National Inst. of Advanced Industrial Science
and Technology, 9Toshiba, 10Ishikawajima-Harima Heavy Industries, 11FANUC,
12Sharp, Japan
28
Room 4
10:00-12:00
F2: Management System
1. “Environmental Impact Information System” That Reflects the Eco-Balance
at Ricoh
Kyoko Ohno, Yuji Noritake, Ricoh, Japan
4. Becoming A Zero Waste to Landfill Facility in The USA
Frantz J. Pierre, Jeff Agur, Bobbi Shingleton, Leon W. Fife, Carl Hall, Ricoh
Electronics, USA
5. Cost Benefit Analysis for Implementation of Environmental Management
System for Semiconductor Company
Gunalan Paramasevam1, Mohd Nasir Hassan2, Noor Mohamed2, 1Infineon
Technologies (M) Sdn Bhd, Malaysia, 2Univ. Putra Malaysia, Malaysia
6. Eco-management in Singapore — From Pollution Control to
Resource Management
Wah Sing Loh1, Seng Eng Ong2, Walter Yam3, 1PSB,
2Ministry of the Environment, 3Philips Electronics Singapore, Singapore
29
F2
3. Eco-efficiency and Eco-Target Costing in the Phase of
Developing New Products
Hiroshi Okano1, Karl-Heinz Feuerherd2, Michiyasu Nakajima3, 1Osaka City Univ.,
2Kobe Yamate Univ., 3Kansai Univ., Japan
Dec 13
2. Eco Product Lifecycle Management
Andreas Moeller, Arno Rolf, Univ. of Hamburg, Germany
Room 5
9:40-12:00
Special Theme 1-2: Factor 10
1. A theoretical Estimation of Dematerialization Factor for Sustainable Society
Ryoichi Yamamoto, The Univ. of Tokyo, Japan
2. Zero Energy Home
Hirofumi Ida, Isamu Ohta, Misawa Homes Inst. of R&D, Japan
ST1-2
Dec 13
3. Eco-efficiency of Sanitary Ware and Tiles
Akashi Funamoto, TOTO, Japan
4. Classigication of Eco-effidcient Services in Japan
Kouji Tagusari, Tomonori Honda, Ryoichi Yamamoto, The Univ. of Tokyo, Japan
5. Recycled Organic Material “M-Wood 2”
Masayuki Kamite, Masayuki Kato, Misawa Home Inst. of R&D, Japan
6. Reducion and Elimination of Using Batteries for Watchies
Yasuhito Hirashima, SEIKO EPSON, Japan
7. Efforts to Improve the Eco-efficiency for Products of
Mitsubishi Electric Corporation-Factor X by Using MET Indicators
Etsuko Hirose, Tetsuya Takahashi, Kiyoshi Ueno, Mitsubishi Electric, Japan
30
Room 6
9:20-10:40
Special Theme 4-2-1 (Invited Lectures):
Industrial Ecology and EcoDesign (3)
1. Journey to a Sustainable World
Bob Pfahl, Motorola, USA
11:00-12:00
Special Theme 4-2-2 (Invited Lectures):
Industrial Ecology and EcoDesign (4)
1. The Greening of Industry — A Term from the Past or for the Future
Jurgen Ertel, Brandenburg Technical Univ., Germany
2. The Benefits of Ecodesign and the Risk of Rebound Effects
Thomas Schauer, FAW, Germany
31
Dec 13
3. Ecodesign for Competetive Advantage, How to Make It Happen
Ab Stevels, Philips Consumer Electronics, The Netherlands
ST4-2-1/ST4-2-2
2. Global Responsibility of Electronics — Products and Sustainability
Hansjoerg Griese, Jutta Mueller, Herbert Reichl, Fraunhofer IZM, Germany
International Conference Room, 7F
13:00-17:00
EcoProducts 2001 Exhibition Symposium
For Reforming Japanese Economy on the Basis of Environmental Aspects
— Vision to an Affluent Eco-Society
Hiroshi Sakisaka, Japan Environmental Management Association for Industry, Japan
Dec 13
EcoProduct Symposium
13:00-13:05 Welcome
13:05-13:20 Environmental Efficiency as a Keyword
Ryoichi Yamamoto, The Univ. of Tokyo, Japan
13:20-14:00 Environmental Technology
Economy — My Proposal
Applicable
to
Reforming
Hisatake Kato, Tottori Univ. of Environmental Studies, Japan
14:00-14:45 The Application of Eco-Design
— Ten Years of Dynamic Development
A.L.N. Stevels, Delft Univ. of Technology, The Netherlands
15:00-17:00 Panel Discussions
Coordinator: Hisatake Kato, Tottori Univ. of Environmental Studies, Japan
Panellists:
Yotaro Kobayashi, Fuji Xerox, Japan
Kisho Kurokawa, Architect, Japan
Noriko Kimoto (under negotiation)
* This session is complimentary to all applicants for EcoProducts 2001.
32
Friday, 14 December 2001
Room 1
9:20-10:20
A3-1: Life Cycle Design
1. Proposal for Spiral Design Approach
Kazuhiko Yamazaki, IBM Japan, Japan
2. Decision Factors of Product LifeCycle Strategies
Satoru Kato, Tomoyuki Hata, Fumihiko Kimura, The Univ. of Tokyo, Japan
3. Toward Life Cycle Design Guideline for Inverse Manufacturing
Yasushi Umeda, Tokyo Metropolitan Univ., Japan
10:40-12:00
A3-2: EcoDesign Processes
3. Generalized Eco-Design Process and Guidelines for
Designers/Design Teams
Parag A. Meshram, Vineet Thuvara, Fifth Quadrant Design, India
4. System-based Product Design and System Structure Changeover under
Integrated Optimality: A Case Study on Leading Design of Vehicles
Kikuo Fujita, Shinji Shiba, Osaka Univ., Japan
33
Dec 14
2. Life Cycle Process Knowledge — Application during Product Design
Ola Bernard Faneye, Anderl Reiner, Technical Univ. of Darmstadt, Germany
A3-1/A3-2
1. Pros and Cons of Adjusting and Extending Functionality of
First Generation End-of-Life Evaluation Tools in Relation to
User Requirements
Mirjam Korse-Noordhoek1, Sytze Kalisvaart1, Casper Boks2, Ab Stevels2, 1TNO
Industrial Technology, 2Delft Univ. of Technology, The Netherlands
Room 1
14:00-15:40
A3-3: EcoDesign Methods
1. Development of Product Green Innovation Design Method
Chih-Chen Liu, Jahau L. Chen, National Cheng Kung Univ., Taiwan
2. Selection and Implementation — Key Activities to Successful Use of
EcoDesign Methods
Sofia Ritzén1, Mattias Lindahl2, 1Royal Inst. of Technology, 2Univ. of Kalmar,
Sweden
3. Applicable Methods for Sustainable Development for Small and
Middle-size Companies
Udo Lindemann, Philipp C. Hutterer, Thomas Hessling, Markus Moertl, TUM,
Lehrstuhl fuer Produktentwicklung, Germany
Dec 14
A3-3/A3-4
4. Development of Ecodesign Methodology within Indian European
Ecodesign Program
Ana Mestre1, G. V. Soumitri2, Johan Carel Diehl2, 1INTI, CINDES, Portugal,
2Indian Inst. of Technol. Delhi, India, 2Delft Univ. of Technol., The Netherlands
5. Method for Developing Sustainable Product Service Innovations
Helma Luiten1, Sacha Sivester2, Marjolijn Knot2, 1TNO Industrial Technology,
2Delft Univ. of Technology, The Netherlands
16:00-17:20
A3-4: Design for X (1)
1. Design Idea of Wind Power Generator by Product Dissection
Haruo Sakamoto1, Junichi Matsuoka1, Takashi Uchino1, Sachiko Migiwa1,
Toshifumi Asai2, 1Kochi Univ. of Technology, 2ELF.Co, Japan
2. EcoDesign of Packaging for Cold Rolled Sheet — An Innovative Approach
Vineet Thuvara, Parag M. Anand, V. Vinodhan, Fifth Quadrant, India
3. Development of an Environment-Friendly, Energy-Efficient Copier
Kazunori Karasawa, Hisao Murayama, Yasuhisa Katoh, Masayuki Ohtani, Koichi
Kanaya, Takako Satoh, Ricoh, Japan
34
Room 1
4. Study of the Degrees of Freedom Equations in
the Compliant Mechanism Design
Bartolo R. Rodriguez, Center of Pharmaceutical Chemistry, Cuba
A3-4
Dec 14
35
Room 2
9:20-10:40
A3-5: EcoDesign Case Studies (5)
1. Design of Air Power Meter
Maolin Cai, Toshiharu Kagawa, Tokyo Inst. of Technology, Japan
2. Valuation for Two Experimental Studies of the “Perfect Recycle House”
Yuki Kanemori, Hiroto Takaguchi, Yusuke Nakajima, Waseda Univ., Japan
3. Pb-free Plating for Peripheral/Leadframe Packages
Nhat D. Vo1, Jason M. Conrad1, Ryan R. Kangas1, Balachandar Sundram2, KeeHuat Lee2, Selvakumar M. Arunasalam2, Tatsuo Matsuura3, Masahiro Tsuriya3,
Yoshikuni Nakadaira3, 1Motorola, USA, 2Motorola Malaysia, Malaysia, 3Motorola
Japan, Japan
Dec 14
A3-5/A3-6
4. Solar Powered Telecommunication
Erik C. Palm1, Flemming Hed1, Yumiko Yasuda2, 1Ericsson Radio Systems,
Sweden, 2Nippon Ericsson, Japan
11:00-12:00
A3-6: Integration of EcoDesign and CAD
1. The Development of a CAD Integrated DFE Workbench Software Tool
Thomas Roche1, Elena Man2, Jimmie Browne2, 1GMIT, 2NUIG, Ireland
2. CAD Integrated DFE Workbench, A Case Study
Thomas Roche1, Camelia Chira1, Elena Man2, Jimmie Browne2, 1GMIT, 2NUIG,
Ireland
3. 3D Environmental Conscious Design System
Yuichi Arita, Kazuyuki Ujiie, Akira Sakai, Tadanobu Matsumura, Haruhiko
Yamamoto, Fujitsu, Japan
36
Room 2
14:00-15:20
A3-7: Information Sharing for EcoDesign (1)
1. Eco-KIT: Webbased Ecodesign-Innovation Tool for SMEs
Bart Jansen, An Vercalsteren, Vito, Belgium
2. ECODESIGN Online: The New Internet Tool for Environmentally Conscious
Product Design
Wolfgang Wimmer, Vienna Univ. of Technology, Austria
3. Efficient LCI Data Exchange for Approximate LCA in Industry
Karl G. Mueller, Fumihiko Kimura, The Univ. of Tokyo, Japan
4. A Framework for Structured Data Retrieval in LCA
Using Feature Technology
Harald E. Otto, Karl G. Mueller, Fumihiko Kimura, The Univ. of Tokyo, Japan
2. Integration of Waste-Specific Expert-Knowledge in a Design Environment
for Sustainable Products
Maike Hora, Burkhard Wolf, Johannes Jager, Darmstadt Univ. of Technology,
Germany
3. Developing Java-Based Web Apprication to Support Effective Recycling
and Material Circulation
Sang-Jae Song, Hiroshima Inst. of Technology, Japan
37
Dec 14
1. The Information System: An Advisory Tool or How to Select the Right
Support for DFE
Marc Ernzer, Olaf Weger, Herbert Birkhofer, Darmstadt Univ. of Technology,
Germany
A3-7/A3-8
15:40-16:40
A3-8: Information Sharing for EcoDesign (2)
Room 3
9:20-10:20
C3-1: Reuse and Recycling (Strategies and Technologies) (3)
1. An Economical and Technical Analysis of a Household Appliance
Remanufacturing Process
Erik Sundin, Linkoping Univ., Sweden
2. LCI Analysis for Treatment Processes of Disposed Office Appliances
Misao Murakami1, Masao Yukumoto1, Yasushi Umeda2, 1Kawasaki Steel, 2Tokyo
Metropolitan Univ., Japan
3. Development of Recyclable Eco-Packages
Tomoaki Arai, Ricoh, Japan
10:40-12:00
C3-2: Reuse and Recycling (Strategies and Technologies) (4)
Dec 14
C3-1/C3-2
1. Recycle of Cut Waste of Glass Fabric Coated by Polyvinyl Chloride
Tetsuya Takahashi1, Teruo Kimura2, 1Shimane Univ., 2Kyoto Inst. of Technology,
Japan
2. Compression Molding of Biodegradable Board Using Waste of
Bedding Cotton
Teruo Kimura1, Yasushi Naito1, Seiji Hatta2, 1Kyoto Inst. of Technology, 2Kyoto
Municipal Textile Research Inst., Japan
3. Intelligent Disassembly of Electr(on)ic Equipment
Reinhard Knoth, Martina Hoffmann, Bernd Kopacek, Peter Kopacek, Austrian
Society for Systems Engineering and Automation, Austria
4. Separation of A Joint Using Hydrogen
Naoe Hosoda, Tadatomo Suga, The Univ. of Tokyo, Japan
38
Room 3
14:00-15:20
C3-3: Reuse and Recycling (Strategies and Technologies) (5)
1. Electrostatic Separation Technology for Waste Plastics — Development of
the High Purity Separator in Plastics by Type
Hiroyuki Daiku, Tetsuya Inoue, Masanori Tsukahara, Hidehiko Maehara, Kenji
Kakeda, Hitachi Zosen, Japan
2. Challenges to Sustainable Aqueous Systems: A Case Study in
Metalworking Fluids
Steven J. Skerlos, Peter Adriaens, Katsuo Kurabayashi, Shuichi Takayama, Kim
Hayes, Alexa Rihana, Fu Zhao, The Univ. of Michigan at Ann Arbor, USA
3. Environmentally-friendly Treatment and Recycling of Industrial Wastes in
the Nippon Mining & Metals Group
Yasuhito Kawasaki1, Takahiko Okura2, 1Nippon Mining & Metals, 2Nikko Techno
Service, Japan
1. The Instructional Models and Guidelines for Developing A Curriculum in
Product Eco-design
Chen-fu Chen, Ming Chuan Univ., Taiwan
2. Ricoh Programs for Contributing to Betterment of the Environment
and Society
Megumi Kawahara, Ricoh, Japan
3. Integrating Environmental Science into Modern Engineering Education
Gunther Seliger, Matthias P. Meyer, Technical Univ. Berlin, Germany
4. Internet Based Ecodesign Education
Johan Carel Diehl, Delft Univ. of Technology, The Netherlands
39
Dec 14
15:40-17:20
E3-1: Environmental Education
C3-3/E3-1
4. Chemical Wastewater Recycling System in Semiconductor
Manufacturing Factory
Masashi Nishimura, Kohichi Sugiyama, Ricoh, Japan
Room 3
5. The Development of Ecodesign Courses for Industrial Design Students and
Professionals in India
G.V. Soumitri1, Jan Carel Diehl2, Ana Mestre3, 1Indian Inst. of Technology Delhi,
India, 2Delft Univ. of Technology, The Netherlands, 3INETI, CINDES, Portugal
E3-1
Dec 14
40
Room 4
9:20-11:00
B3-1: Long Fatigue Life (Giga-cycle) of Materials (1)
1. Optimaization of Marerial Selection and Design for Car Industry in order to
Increase Durability (Keynote)
Clause Bathias, CNAM, France
2. Cyclic Damage of Some High Strength Alloys Showing Subsurface Crack
Generation in High-cycle Fatigue
Osamu Umezawa, National Inst. for Materials Science, Japan
3. Characteristic S-N Property of High Strength Steels in Ultra-Wide Life
Regime under Rotating Bending
Tatsuo Sakai1, Nobuaki Tanaka1, Mitsuhiro Takeda2, Manabu Kanemitsu3,
Noriyasu Oguma4, 1Ritsumeikan Univ., 2Toray Industries, 3Kanazawa Technol.
Coll., 4Koyo Seiko, Japan
1. Fracture Surface Analysis of Bearing Steels with Long Fatigue Life
Naotake Ohtsuka1, Yasunori Shindo1, Wataru Kimura2, 1Ryukoku Univ.,
2Takasono Industries, Japan
2. Giga-cycle Fatigue Properties of a High Strength Steel SNCM 439
Yuji Nakasone, Katsuhisa Ogawa, Jun’ichi Katoh, The Science Univ. of Tokyo,
Japan
3. Effects of Shotpeening Treatment on Very Long Life Fatigue Property in
Ductile Cast Irons
Yasuo Ochi1, Takusaburo Hosoya1, Kiyotaka Masaki1, Takashi Matsumura1,
Takeshi Sekino2, 1Univ. of Electro-Communications, 2Cannon, Japan
41
Dec 14
11:20-12:40
B3-2: Long Fatigue Life (Giga-cycle) of Materials (2)
B3-1/B3-2
4. Expansion of the Database MSDRD and Analyses of S-N Fatigue Test Data
in Ultra-Long Life Regime
Tatsuo Sakai1, Tomofumi Shintani1, Kenji Okada2, Satoshi Fukui2, Takafumi
Sogawa2, Noriyasu Oguma3, 1Ritsumeikan Univ., 2Takamatsu National Coll. of
Technology, 3Koyo Seiko, Japan
Room 4
4. On Evaluation Method of the Data for Long Life Fatigue Property
Satoshi Hanaki1, Masaru Zako2, Tesei Kurasiki2, Hitoshi Uchida1, 1Himeji Inst. of
Technology, 2Osaka Univ., Japan
13:40-15:20
D3-1: Environmental Conscious Market and Corporate Strategies
1. Sufficiency Strategies for A Sustainable and Competitive Economy:
Reversed and Inversed Incentives
Warter R. Stahel, Product-Life Inst., Switzerland
2. Green Marketing of Consumer Electronics II
Ab Stevels, Richard Agena, Eelco Hoedemaker, Delft Univ. of Technology, The
Netherlands
Dec 14
D3-1/D3-2
3. An Application of the Market Microstructure Theory to Markets for
Recyclable Products
Kouhei Iyori1, Itsuo Hatono1, Sobei Oda2, Kanji Ueda1, 1Kobe Univ., 2Kyoto
Sangyo Univ., Japan
4. Consideration of the Definition of Zero State on a Scale of Positive and
Negative Evaluation
Koji Masuda, Fuji Xerox, Japan
5. Corporate Environmental Strategies in Poland
Michal Szymanski1, Saburo Ikeda2, 1The Univ. of Tsukuba, 2Inst. of Policy and
Planning Sciences, Japan
15:40-17:20
D3-2: Servicification for Dematerialization
1. Dematerialization through Service and Business Innovation: Lessons from
the Kathalys/DES Experiments (Keynote)
Han Brezet, Sacha Silvester, Tom van der Horst, Delft Univ. of Technology, The
Netherlands
2. Service Engineering to Intensify Serivice Contents in Product Life Cycles
Tetsuo Tomiyama, The Univ. of Tokyo, Japan
3. Eco-efficient Services as a Business Strategy for Dematerialization
Thierry Kazazian, Julia Haake, 02 France, France
42
Room 4
4. Functional Sales as a Further Approach to Environmental Product
Development — Case Studies
Gunilla Olundh, Sofia Ritzèn, Royal Inst. of Technology(Stockholm), Sweden
D3-2
Dec 14
43
Room 5
9:20-10:40
E3-2: Environmental Accounting
1. Eco-Efficiency Accounting of Telecom Product Life Cycle
Pontus Cerin1, Goan Muhammar2, 1Royal Inst. of Technology, 2Ericsson Radio
Systems, Sweden
2. A Pilot Project of Flow Cost Accounting in Japan
Yoshikuni Furukawa, Nitto Denko, Japan
3. Environmental Accounting at Ricoh
Hiroshi Uramoto, Hiromitsu Hatano, Ricoh, Japan
4. Environmental Accounting of Product Design
Hidemi Tomita, Sony, Japan
11:00-12:20
F3-1: LCA (1)
Dec 14
E3-2/F3-1
1. A Simple Life Cycle Assessment Method for Green Product
Conceptual Design
Jahau L. Chen, Chih-Wei Liau, National Cheng kung Univ., Taiwan
2. Life Cycle Assessment of Business
Hiroyuki Abe, Ricoh, Japan
3. Environmental Impact Assessment for Various Information Technology
Systems and Classification by Their Environmental Aspects
Shigeyuki Miyamoto, Hiroo Harada, Jun Fujimoto, NEC, Japan
4. A Study on Comparison of Life Cycle Energy Consumption and
CO2 Emission in Grains Production; Transportation in Japan and
Heilongjiang Province of China
Jie Chen1, Hisashi Kobayashi2, 1Tokyo Univ. of Agriculture and Technology,
2Ibaraki Univ., Japan
44
Room 5
14:00-16:00
F3-2: LCA (2)
1. Development of Hybrid Micro Machine Tool
Tsuneo Kurita1, Shinya Watanabe2, Mitsuro Hattori3, 1Japan Science and Technology, 2Disco, 3National Inst. of Advanced Industrial Science and Technology,
Japan
2. Industrial Ecology: Theory and Environmental Strategy in Viet Nam
Le H. Ba1, Duong V. Viet2, Tran T. Hong, Loan3, Thai V. Nam4, 1National Univ.,
2Univ. of Technology, 3Univ. of National Sciences, 4Ansted Univ., Viet Nam
3. Development of a Risk Assessment Method for Product Disposal
in Landfills
Eiji Hirao, Shigeyuki Miyamoto, NEC, Japan
6. Development of Endpoint-Type Methodology of LCIA in Japan
Norihiro Itsubo, Atsushi Inaba, National Inst. of Advanced Industrial Science and
Technology, Japan
45
F3-2
5. The Development of the Environmental Efficiency Potential Assessment
Katsuya Nagata1, Masahito Aizawa2, Ken Asaoka2, Chikako Usami2, 1Waseda
Univ., 2Mikuniya Environmental Management Systems Inst. Inc., Japan
Dec 14
4. Waste Input-Output Analysis of Disposal, Recycling, and Reuse of
Electric Home Appliances
Shinichiro Nakamura1, Yasushi Kondo2, 1Waseda Univ., 2Toyama Univ, Japan
Room 6
9:20-12:00
Special Theme 6-3: Research Trends in Lead-free Soldering
1. Lead-free Industry Trends in the European Market and the Need for
Global Co-operation (Keynote)
Kay Nimmo, ITRI, UK
2. EUREKA Project LEADFREE
Guenter F. Grossmann, Swiss Federal Inst. for Materials Testing and Research,
Switzerland
3. Development of Environmentally Preferred Plastic Ball Grid Array,
PBGA, Components
Yushi Matsuda1, Alan Woosley2, Thomas Koschmieder2, G.K. Teh3, Ruzaini
Ibrahim3, 1Motorola Japan, Japan, 2Motorola, USA, 3Motorola Malaysia,
Malaysia
ST6-3
Dec 14
4. Estimation of CO2 Emission for Lead-free Soldering by
Life Cycle Inventory Analysis
Hiroshi Yamaguchi1, Atsushi Inaba2, 1Hitachi, 2National Inst. of Advanced Industrial Science and Technology, Japan
5. Lead-free Soldering — Future Aspects of Toxicity, Energy and
Resource Consumption
Otmar K. Deubzer1, Hansjoerg Griese1, Herbert Reichl1, 2, Tadatomo Suga3,
Hideyuki Hamano3,1Fraunhofer IZM Berlin, 2Technical Univ. Berlin, Germany,
3The Univ. of Tokyo, Japan
6. Lead-free Soldering Trends in USA (Keynote)
Carol Handwerker, NIST, USA
46
Room 6
13:00-15:00
Special Theme 11-3: IMS Project on Lead-free Soldering EFSOT
1. Outline of IMS Project “Next Generation Environmental Friendly
Soldering Technology”
Kouji Serizawa, Hitachi, Japan
2. Upgrading Pb-free Soldering Technology (1) — Reflow Soldering
Koji Matsubara1, Katsuaki Suganuma2, Tomoya Kiga3, 1Sharp, 2Osaka Univ.,
3Sony, Japan
3. Upgrading Pb-free Soldering Technology (2) — Flow Soldering
Makoto Miyazaki1, Shigeo Nomura1, Toshiyasu Takei1, Naoaki Katsuyama2,
Hiroyuki Tanaka2, Masanobu Akanuma2, 1Oki Electric, 2Hokkaido Industrial
Research Inst., Japan
6. Environmental Impact Evaluation for the Full Life Cycle of Products
Using Pb-free Solders
Tadatomo Suga1, Hideyuki Hamano1, Masahide Okamoto2, 1The Univ. of Tokyo,
2Hitachi, Japan
15:20-17:20
Special Theme 10-3: Low-temperature Lead-free Solder
1. Lead Free Activities of JEITA
Katsumi Yamamoto, Sony, Japan
2. JIEP Project fow Low-temperature Lead-free Solder and Its Report on
Questionaire Survey
Tadatomo Suga, The Univ. of Tokyo, Japan
47
Dec 14
5. Evaluation of Biological Effects of Metals in Pb-free Solders
Hiroshi Satoh1, Kazuyuki Omae2, Momoko Chiba3, Masahide Okamoto4,
1Tohoku Univ., 2Keio Univ. 3Juntendo Univ., 4Hitachi, Japan
ST11-3/ST10-3
4. Upgrading Pb-free Soldering Technology (3) — Reliability Evaluation
Masahide Okamoto1, Hanae Shimokawa1, Koji Serizawa1, Toshio Narita2,
1Hitachi, 2Hokkaido Univ., Japan
Room 6
3. Sn-Zn Eutectic Alloy Soldering in a Low Oxygen Atmosphere
Masahiro Tadauchi, Izuru Komatsu, Hiroshi Tateishi, Kouichi Teshima, Toshiba,
Japan
4. CSP Mounting Reliability with Sn-Zn-Bi in JIEP Project
Makoto Takeuchi, Victor Co. of Japan, Japan
5. Newly Developed Real Time Monitoring System for lonic Migration of
Lead Free Solder by Means of Crystal Microbalance
Sachio Yoshihara, Utsunomiya Univ., Japan
6. Applications of Sn-Zn Lead-free Solder in Reflow Soldering Process
Eiichi Kouno, NEC, Japan
ST10-3
Dec 14
48
Saturday, 15 December 2001
Room 1
11:00-12:20
A4-1: Design for X (2)
1. Life Design for Remanufacturing Durable Products
Susumu Okumura1, Toshimitsu Morikuni2, Norio Okino1, 1Univ. of Shiga
Prefecture, Japan, 2NEC Machinery, Japan
2. On the Benefits of Use of Recently Developed Recovery Indicators during
the Design Process of Electr(on)ic Products
Fabrice Mathieux1, Daniel Froelich1, Pierre Moszkowicz2, 1ENSAM Chambery,
France, 2INSA Lyon, France
3. Treatment of Reliability for Reuse and Remanufacture
Takeshi Murayama1, Lily H. Shu2, 1Hiroshima Univ., Japan, 2Univ. of Toronto,
Canada
4. EcoDesign for Product Variety: A Multi-Objective Optimization Framework
Suiran Yu, Satoru Kato, Fumihiko Kimura, The Univ. of Tokyo, Japan
13:20-15:20
A4-2: Tools for DfX
1. Development of Life Cycle Design System for Machine Tools
Tojiro Aoyama, Shoji Nawata, Keio Univ., Japan
4. Design for Environment and the Recyclability Evaluation Method (REM)
Yuzo Hiroshige, Takayuki Nishi, Toshijiro Ohashi, Hitachi, Japan
49
Dec 15
3. Recycling Oriented Design — A Case Study for Household Appliances
Using the Software ATROiD
Hong-Yoon Kang1, Christoph Herrmann2, Jang-Woo Jung1, 1LG Production
Engineering Research Center, Korea, 2LCE Consulting, Germany
A4-1/A4-2
2. Development of Recyclability Evaluation Tool
Naohiko Oyasato, Hideki Kobayashi, Kazuhito Haruki, Toshiba, Japan
Room 1
5. Approximate Life Cycle Assessment for Classified Products Using Artificial
Neural Network and Statistical Analysis in Conceptual Product Design
Ji-Hyung Park1, Kwang-Kyu Seo1, David R. Wallace2, 1Korea Inst. of Science
and Technology, Korea, 2MIT, USA
6. DfE Tools — A Way for Application of LCA in Product Design
Michael Betz, Hartmut Schoech, Harald Florin, PE Product Engineering,
Germany
A4-2
Dec 15
50
Room 2
10:00-11:00
B4-1: Maintenance
1. A System Framework for Next-Generation E-Maintenance System
Muammer Koc, Jay Lee, Univ. of Wisconsin-Milwaukee, USA
2. Life Cycle Management of Inductrial Robots Based on
Deterioration Evaluation
Atsushi Yamada, Shozo Takata, Waseda Univ., Japan
3. Decision-making Method of Optimum Inspection Interval for
Plant Maintenance by Genetic Algorithms
Masanori Yamamoto1, Peng Chen1, Toshio Toyota2, 1Kyusyu Inst. of Technology,
2Japan Condition Diagnosis Technology Lab., Japan
11:20-12:40
A4-3: LCA Case Studies
1. LCA of Third Generation (3G) Wireless Telecom Systems at Ericsson
Jens Malmodin, Pernilla Bergmark, Royal Inst. of Technology, Sweden
2. Generic LCA Based DfE — A Case Study of Different PWB Systems
Constantin Herrmann1, Michael Betz2, Niels Warburg1, 1Univ. of Stuttgart,
2PE Product Engineering, Germany
51
Dec 15
4. LCA of Machine Tools with Regard to Their Secondary Effects on Quality of
Machined Parts
Javad Akbari, Keigo Oyamada, Yoshio Saito, Tokyo Inst. of Technology, Japan
B4-1/A4-3
3. Ecological Improvement of the Vending Machine Using LCA Method
Yukio Kimura1, Seizo Kato2, Naoki Maruyama2, Yucho Sadamichi2, 1Fuji Electric,
2Mie Univ., Japan
Room 2
13:40-15:20
A4-4: Design for Disassembly
1. Product’s Disassemblability Evaluation Using Information Entropy
Hideo Fujimoto, Alauddin Ahmed, Kazuaki Sugi, Nagoya Inst. of Technology,
Japan
2. Design of Heat-activated Reversible Integral Attachments for
Product-embedded Disassembly
Ying Li, Kazuhiro Saitou, Noboru Kikuchi, Steven J. Skerlos,
Panos Y. Papalambros, The Univ. of Michigan, USA
3. A Design for Recycling Technique for Optimizing Resource Circulation
Characteristics of Products
Yasuo Kondo, Ko-suke Hirai, Fumio Obata, Tottori Univ., Japan
4. Development of Disassembly Support System for Mechanical Parts and
Its Application to Design Considering Reuse/Recycle
Hidefumi Wakamatsu, Akira Tsumaya, Keiichi Shirase, Eiji Arai, Osaka Univ.,
Japan
5. Design for Reuse and Disassembly
Martina Hoffmann, Reinhard Knoth, Bernd Kopacek, Peter Kopacek, Austrian
Society for Systems Engineering and Automation, Austria
A4-4
Dec 15
52
Room 3
9:40-10:40
E4-1: Social System Design (1)
1. Analyzing Sustainability of Circulatory System by Using
the Rewriting System
Kotaro Kakimoto, Takayuki Shiose, Toshiharu Taura, Kobe Univ., Japan
2. Indirect Control Methods for Navigating the Agent-based Recycle Society
Takayuki Shiose, Kouji Yokoyama, Toshiharu Taura, Kobe Univ., Japan
3. From a Factory to a Person: One Approach for Sustainable and
Service-oriented Manufacturing Scheme
Masahiko Onosato1, Nydia Suppen1, Koji Teramoto1, Kazuaki Iwata2, 1Osaka
Univ., 2International Inst. of Advanced Studies, Japan
11:00-12:40
E4-2: Social System Design (2)
1. Integrated Product Policy (IPP), Eco-Design and Supply Chains (Keynote)
Martin Charter, The Centre for Sustainable Design, UK
2. Design and Evaluation of the Recycle of Home Appliances: An Application
of Market Microstructure Theory
Kanji Ueda1, Nariaki Nishino1, Atsushi Iwasaki1, Sobei H. Oda2, Itsuo Hatono1,
1Kobe Univ., 2Kyoto Sangyo Univ., Japan
53
Dec 15
4. Greener Mobil Telecommunication Networks: The 3G Greenbook Initiative
Klause Rick, T-Mobil Deutsche Telekom, Germany
E4-1/E4-2
3. Demonstration of a Nature Symbiotic Office Designed for 100Years Use
Masanobu Nagano, Soai Co., Japan
Room 3
14:00-15:20
B4-2: Cleaner Processes and Energy-Saving Proccesses
1. Development of Drying Technology Utilizing Solar Energy to
Dry Agricultural and Marine Products
Hedetoshi Aoki, Hachinohe Inst. of Technology, Japan
2. On Process Planning with Multiple Agents: Environmentally Conscious
Decisions among Feasible Process Plans
Beth E. Allen, Univ. of Minnesota, USA
3. 100% Ozone-treatment System for Bath and Swimming Pool Water
Reiji Terao1, Kazunori Mori1, Masaki Matsui2, 1TERAO, 2Gifu Univ., Japan
4. Energy Saving Cleaner Technology for Conversion of Waste Pickle Liquor
and Millscale
Parthasarathy M. Natteri1, Sudharsan M. Natteri2, 1SALN Coll. of Engineering &
Management, 2ETK International Ferrites, India
B4-2
Dec 15
54
Room 4
9:40-10:40
E4-3: Labelling and Logistics
1. Trial of Product Environmental Information System — Canon Case (Type III
Eco-Label, JEMAI Program Ver.2)
Kiyofumi Matsumoto, Norihiro Mochizuki, Keizo Naganuma, Masaaki Oono,
Canon, Japan
2. Re-Use of End-of-Life Electronic Equipment and Components
— Logistic Aspects
Reinhard Knoth, Martina Hoffmann, Bernd Kopacek, Peter Kopacek, Austrian
Society for Systems Engineering and Automation, Austria
3. Formation of a Reverse Logistic System for a Circulated Type Construction
Production System
Hiroyuki Nakamura1, Jun Shiino2, Makoto Taneda3, 1Shimizu, 2Waseda Univ.,
3Toda, Japan
11:00-12:40
Special Theme 9-4-1: Advanced Technology for Electronic Packaging
— JIEP Session (1)
1. JIEP-EcoDesign for Tomorrow (Keynote)
Hidetaka Hayashi, Fujikura, Japan
4. Trend of Halogen Free Printed Wiring Board Materials
Tetsuaki Suzuki, Toshiba Chemical, Japan
55
Dec 15
3. Development of Environmentally Friendly Epoxy Resin Compounds without
Toxic Flame Retardants and Their Application to Electronic Parts
Yukihiro Kiuchi, Masatoshi Iji, NEC, Japan
E4-3/ST9-4-1
2. Conductive Adhesive for Plated Sn Electrode
Michinori Komagata, Namics, Japan
Room 4
13:40-15:20
Special Theme 9-4-2:Advanced Technology for Electronic Packaging
— JIEP Session (2)
1. Development of Formaldehyde Free Electroless Copper Plating Technology
Takeyuki Itabashi1, Hiroshi Kanemoto1, Haruo Akahoshi1, Tadashi Iida2, Eiji
Takai1, Naoki Nishimura1, Jyunichi Kawasaki1, 1Hitachi, 2Hitachi Printed Wiring
Board Solutions Co., Japan
2. Low Distortion Cold Rolled Clad Sheets for Mounting Material
Shinji Ozawa, Kazuo Yosida, Hiroaki Okamoto, Kinji Saijo, Toyo Kohan, Japan
3. High Sensitive Dry Film Photoresist for Laser Direct Imaging System
Teruhiro Uematsu, Tokyo Ohka Kogyo, Japan
4. Halogen-free High Elastic Moduls Build-up Material
Nobuyuki Ogawa, Hitachi Chemical, Japan
5. Ball Semiconductor Process and Material
Masataka Yoshida, Masataka Yoshida Ball Semiconductor, Japan
ST9-4-2
Dec 15
56
Room 5
9:20-11:00
Special Theme 8-4-1: EcoDesign and Chemical Engineering (1)
1. Eco-Design of Water Purification Equipment for Domestic Use
Kensaku Mizoguchi1, Hideya Kamikawa2, 1Shizuoka Univ., 2Yamaha Motor,
Japan
2. Filtration Behaviors in Microfiltration with Periodic Backwashing of
Secondary Municipal Wastewater
Than Ohn1, M. S. Jami2, Y. Mukai2, E. Iritani2, 1Aichi Science and Technology
Foundation, 2Nagoya Univ., Japan
3. Life Cycle Inventory Analysis of Waste Oil
Chie Nakaniwa1, Yoshie Yagita2, Atsushi Inaba3, 1Yale Univ., USA, 2Ochanomizu
Univ., 3National Inst. of Advanced Industrial Science and Technology, Japan
4. Development of a Life Cycle Inventory Database for Chemical Products
Kiyotaka Tahara, Atsushi Inaba, National Inst. of Advanced Industrial Science
and Technology, Japan
5. A Method to Evaluate Regional Material Flow for
Designing Recycling Society
Naohiro Goto1, Koichi Fujie1, Tomotaka Usui2, 1Toyohashi Univ. of Technology,
2Aichi Science and Technology Foundation, Japan
2. Plastic Recycling with Supercritical Fluids
Izumi Okajima, Takeshi Sako, Shizuoka Univ., Japan
3. For Building a Recycling-oriented Economic Society Originating in Chubu
(Central Japan) (Keynote)
Yoshihiro Yasui, Environmental Partnership Organizing Club, Japan
57
Dec 15
1. Decomposition Mechanism of Epoxy Resin in Nitric Acid for Recycling
Weirong Dang, Kosuke Yamaki, Hideki Sembokuya, Masatoshi Kubouchi, Ken
Tsuda, Tokyo Inst. of Technology, Japan
ST8-4-1/ST8-4-2
11:20-12:40
Special Theme 8-4-2: EcoDesign and Chemical Engineering (2)
Room 5
13:20-15:20
Special Theme 8-4-3: EcoDesign and Chemical Engineering (3)
1. A New Program for Integrated Recycle System of Chemical Products
Kensaku Mizoguchi1, Youji Akiya2, Toshiaki Ito3, Junjiro Kawasaki4, Minoru
Nomura5, Yoshiyuki Hashiguchi6, Yasushi Hirata7, Kiyomi Imou6, Akira Kanai5,
Masahito Sato2, Shigeru Matsumoto8, Ken Kataoka9, 1Shizuoka Univ., 2AIST,
3Mitsubishi Heavy Ind., 4Tokyo Inst. of Technology, 5JCII, 6KANEKA,
7Bridgestone, 8Tohoku Univ., 9Daceil Chem. Ind., Japan
2. Information Infrastractue for Supporting Recycling Systems Design
and Operation
Yuji Naka1, Atsushi Aoyama1, Katsuyoshi Kameda2, Takashi Kagiyama2, Kazuhisa Hamda2, 1Tokyo Inst. of Technology, 2Japan Chemical Innovation Inst.,
Japan
3. Gasification of Organic Waste Materials (OWM) for Power Generation
Using Fuel Cell
Michihiko Hamai1, Motohiro Kondo1, Masataka Yamaguchi1, Shigekatsu Mori2,
Yoshinori Itaya2, Guilin Piao3, 1Toyota Motor, 2Nagoya Univ., 3Aichi Science &
Technology Foundation, Japan
4. Double-coated Tape for Recycle Application
Koichi Ikeda, Kazuhiko Shibata, Nitto Denko, Japan
ST8-4-3
Dec 15
5. Considerations of Process Flexibility in Design and Optimisation of
Chemical Processes for Simultaneous Satisfaction of Economic and
Environmental Objectives (Keynote)
Jim Petrie, Univ. of Sydney, Australia
58
Room 6
10:00-11:20
Special Theme 2-4-1: Promotion of DFE (1)
1. Clarifying the Environmental Voice of the Customer
Using the Kano Technique (Keynote)
Patrick Eagan, Mark Finster, Dennis Hussey, Univ. of Wisconsin-Madison, USA
2. An Outline of Activities by the Committee of Desgin for Environment (DfE),
Japan, 1994-2001
Shinzo Omi1, Mamoru Morimoto2, Shigeru Suda2, 1Tokyo Univ. of Agriculture
and Technology, 2Japan Environmental Management Association for Industry,
Japan
3. Quality Function Deployment for Environment: QFDE (1st Report)
— A Methodology in Early Stage of DfE
Keijiro Masui1, Tomohiko Sakao2, Atsushi Inaba1, 1National Inst. of Advanced
Industrial Science and Technology, 2Mitsubishi Research Inst., Japan
11:40-12:40
Special Theme 2-4-2: Promotion of DFE (2)
3. Developments in Product Oriented Environmental Management Systems
(POEMS) and ISO 14062
Cristina Rocha1, Parag Anand2, Sacha Silvester3, 1INETI, CINDES, Portugal,
2Fifth Quadrant, India, 3Delft Univ. of Technology, The Netherlands
59
Dec 15
2. Environmental Effect Analysis — How Does the Method Stand in Relation to
Lessons Learned from the Use of Other Design for Environment Methods
Mattias Lindahl, Univ. of Kalmar, Sweden
ST2-4-1/ST2-4-2
1. Quality Function Deployment for Environment: QFDE (2nd Report)
— Verifying the Applicability by Two Case Studies
Tomohiko Sakao1, Keijiro Masui2, Mitsuru Kobayashi3, Seiichi Aizawa4, Atsushi
Inaba2, 1Mitsubishi Research Inst., 2National Inst. of Advanced Industrial
Science and Technology, 3Shinko Electric, 4Iiyama, Japan
Room 6
13:40-15:20
Special Theme 5-4: Recycling of Individual Products
(Current and Future)
1. Towards Inverse Production Life Cycle: A Simulation Tool Linking Mass
Products to Environmental Legislation and Market
Fabio Salsa1, Lorenzo Castelli2, Roberto Bosani1, Francesco Jovane1, 1National
Research Council, 2Univ. of Trieste, Italy
2. The QWERTY Concept, a Powerful Method for Evaluating
the Environmental Consequences of End-of-Life Processing of Consumer
Electronic Products
Jaco Huisman, Ab Stevels, Delft Univ. of Technology, The Netherlands
3. Some Obervations on Recycling of Electrical Home Appliances Activities
in Taiwan
Jahau L. Chen, National Cheng Kung Univ., Taiwan
4. The Regulation Plan of Disposal Goods and Articles in South Korea
Kentoku Funaki, Funaki Enviromental Economics & Policy Research Inst., Japan
5. Waste Utilization by Melting and Crystallization Technology
Takumi Kaneko, Tsukishima Kikai, Japan
Dec 15
ST5-4/Plenary III/Closing
International Conference Room, 7F
15:40-16:30 Plenary III
Designing ‘Sustainable’ Product/Service Systems
John Ehrenfeld, Massachusetts Inst. of Technology, USA
16:30-16:45 Best Paper & Best Poster Awards
16:45-17:15 Closing Lecture
Comprehensive Product Modeling for Designing Life Cycle Scenario
Fumihiko Kimura, Organizing Committee Co-Chair/The Univ. of Tokyo, Japan
17:15-17:30 Closing Words
Diana Bendz, Organizing Committee Co-Chair/IEEE CS TCEE/IBM, USA
60
Poster Session
Display:
9:20-17:00, 14 December 2001
9:20-13:20, 15 December 2001
Discussion: 12:00-14:00, 14 December 2001
Green Marketing of Automobile Engine Air-Filter Element Using LCA
Study
Myung-Hwi Kang1, Han-Kyoung Lee1, Nam-Woong Lee2, 1Eco-Frontier,
2KOAIR, South Korea
P2.
The Impact of Literature References in the Field of Applied Ecodesign
Casper Boks, Ab Stevels, Jurgen Koster, Delft Univ. of Technology, The
Netherlands
P3.
Research Regarding the Environment-friendly Slope Protection Frame
That Utilized the Felled Tree
Kenji Nakamura, Shimizu, Japan
P4.
Current Status of Phosphoric Acid Fuel Cell Power Plant
Toshiyuki Ito, Tokyo Gas, Japan
P5.
Incorporating Environmentally Conscious Materials Selection in CAD
System
Narito Shibaike, Matsushita Electric, Japan
P6.
Design Process to Achieve Easy Assembly and Disassembly
Yasuyuki Yamagiwa1, Shuichi Iwata2, Jun Numata3, Yuko Namiki3, 1Sony, 2The
Univ. of Tokyo, 3Musashi Inst. of Technology, Japan
P7.
Eco-Value as an Indicator for Sustainable Design
Fumikazu Masuda, Satsuki Kashima, Naoki Iijima, Kengo Kato, Rei Sekine,
Kenji Yamato, Satoko Watanabe, Risa Usami, Katsura Emukai, Tomohisa Kato,
Tsuneya Kocho, Tomoya Sasaki, Takuya Sato, Mie Suzuki, Masashi Seo,Tokyo
Zokei Univ., Japan
P8.
Charcoal Board Adhered with Superfine Natural Fibers
Kazunori Shibano1, Shuji Yoshizawa2, Yuu Ogawa1, 1Tokyu Construction,
2Meisei Univ., Japan
61
Poster Session
P1.
P9.
Thermal Recycling of Used Vegetable Oil in an University Campus
HaruHisa Uchida1, Tokiko Morikawa1, Hiroaki Iwasaki2, Shigeru Ohga2, 1Tokai
Univ., 2Yamaichi New Technology, Japan
P10. Solubility of Glass-Epoxy laminate of Various Sizes in Solution
Takeshi Horiuchi, Katsuji Shibata, Hiroshi Shimizu, Hitachi Chemical, Japan
P11. The Research into the Method of Developing Efficient Universal Design in
Traffic Environment through the Application of Contingent Valuation
Method
Toshiki Nishiyama, Ken’ichi Gomyo, Makoto Arisawa, Keio Univ., Japan
P12. Environmental Impact of Energy Distribution Using Hydrogen
HaruHisa Uchida, Shinya Kato, Asami Komatsu, Mikio Suga, Tokai Univ.,
Japan
P13. Frist Contract under Green Power Certifrication System
Takeshi Shouda, Yamanaka Yasushi, Daisuke Makino, Junji Omura, Japan Natural Energy, Japan
P14. Suppression of Dross Formation in Lead-free Wave Soldering
Tadashi Takemoto1, Yeon Jun Joo1, Shohei Mawatari2, Rikiya Kato2, 1Osaka
Univ., 2Senju Metal Industry, Japan
P15. Microscopic Observation of Pb-free Solder Joint Interface
Yasushi Kadota1, Sunao Miyatake1, Tsutomu Sakatsu1, Hideo Watanabe1,
Masaru Yamashita2, Ryuji Kanehara2, 1Ricoh, 2ITES, Japan
P16. Future Outlook of Eco-Design in China
Tadatomo Suga, Toshihiko Itou, Naoe Hosoda, Zhaohui Qiang, The Univ. of
Tokyo, Japan
Poster Session
62
GENERAL INFORMATION
Registration
Early Registration is recommended (Deadline: 21 November 2001).
Please choose and fill in the attached Registration Form Type A (For All Sessions) or
Type B (For All Technical Sessions), and mail or fax to the EcoDesign 2001 Secretariat with the payment.
After the payment is confirmed, the registrant will receive a payment receipt and a
ticket for conference kit by mail, which will be exchanged for a conference kit on site.
Payment
Please choose one from the following methods. Unfortunately, no personal check is
acceptable. Do not remit the fee before sending the registration form.
• Bank Check Payable to the EcoDesign 2001 in Japanese Yen
• Bank Transfer to: Bank Name: Daiichi Kangyo Bank, Hongo Branch, Tokyo
Account No.: 2396620
Account No.: ECODESIGN 2001
* Please attach a copy of the bank transfer receipt with the registration form.
• Credit Cards: American Express, VISA, Master, or Diners
* Master card issued in Japan is limited to UC only.
Registration Fees
Registration Fee: For All Sessions (Type A)
Early Registration
(before 21 Nov. 2001)
Late and On site
(after 21 Nov. 2001)
¥53,000
¥58,000
Conference
Member*
* Co-Sponsors, IEEE, and CARE Electronics members
Non-member
Student
¥58,000
¥63,000
¥5,000
¥10,000
¥8,000
¥10,000
¥10,000
¥10,000
(Intercommunion
Session excluded)
Intercommunion Session
(For student or an accompany)
Tutorial
Technical Tour
¥6,000
Conference registration fees include conference attendance, a copy of Proceedings, Intercommunion Session, and Welcome Reception. Tutorial fee is optional.
63
Registration Fee: For All Technical Sessions (Type B)
Early Registration
(before 21 Nov. 2001)
Late and On site
(after 21 Nov. 2001)
¥45,000
¥50,000
Conference
Member*
* Co-Sponsors, IEEE, and CARE Electronics members
Non-member
¥50,000
Student
¥55,000
¥ 5,000
¥10,000
Intercommunion Session
¥ 8,000
¥10,000
Tutorial
¥10,000
¥10,000
Technical Tour
¥ 6,000
Conference registration fees include conference attendance, a copy of Proceedings, Welcome Reception. Intercommunion Session fee and Tutorial fee are
optional.
Cancellation of Registration and Refund
Cancellation with refund will be accepted before 30 November 2001.
However, written notification is required and there will be a cancellation fee: ¥5,000.
No refund for cancellation received after 30 November 2001 or no notice given.
Refund will be made after deducting the cancellation fee and bank or credit card service charges.
If the payment is made by credit card, refund will be made through the credit card
company. If bank transfer, please inform your bank account to the Secretariat.
Registration Desk during the Conference
Upon arrival at the conference site, Tokyo Big Sight, please sign-up with a conference kit ticket at the Advanced Registration Desk to receive a conference kit and
other necessary items. Onsite registration is also welcome.
Registration Desk is open at the 6th floor of The Tower Building (Kaigito) of Tokyo Big
Sight as follows,
Tuesday
Dec.11: 17:00-19:00
Wednesday Dec.12: 8:30-17:00
Thursday
Dec.13: 8:30-17:00
Friday
Dec.14: 8:30-17:00
Saturday
Dec.15: 8:30-15:00
64
Social Events
Welcome Reception
All participants are invited to the Welcome Reception on 12 December 2001 held at
The Tower Building (Kaigito), Tokyo Big Sight (1F Room 102 from 18:30-20:30).
The reception desk will be open at 18:00.
Intercommunion Session
Participants who registered for all sessions (by using Form Type A) or applied the
intercommunion session (by using Type B) are invited to participate in the Intercommunion Session.
On 14 December, it will be held at Restaurant 5K PLANETS in National Museum
of Emerging Science and Innovation (7F, 18:00-20:00). The reception desk will be
open at 17:30.
Overview of National Museum of Emerging Science and Innovation (the Nippon
Kagaku Miraikan)
In July 2001, the Nippon Kagaku Miraikan opened in the Tokyo Metropolitan Waterfront Subcenter (Aomi, Koto-ku).
The museum is a facility for sharing the most up-to-date information about science
and technology, and an all-round facility for human interaction.
At the museum, visitors come in direct contact with, and experience, the latest developments in science and technology by hands-on exhibits, participating in various
events, and meeting scientists and technicians.
The objective of the museum is not limited to the acquisition of new knowledge. Its
goals are to be the primary entity for the discovery of science, to consider the role of
science and technology in contemporary society, and to be a dynamic entity that continues to create.
Technical Tours
As a special event for overseas participants, Technical Tours are planned on 11
December (Tue) 2001 as follows,
Destinations 1) To see the advance technology for recycling
Eg. Kawasaki Steel Plant and so on
Destinations 2) To see the advance technology for zero-emission
Eg. Zero-Energy Home by Misawa Homes
A Tour fee is ¥6,000 including lunch and bus charge. For application, please check
the box of “Technical tour” in the attached registration form and send it to EcoDesign
2001 Secretariat by 21 November, 2001. Domestic registrants are also welcomed to
apply.
(Minimum operating numbers of participants: 30 persons)
65
EcoProducts 2001 Exhibition
Since 1999, the “Eco-Products Japan” exhibition has been held to provide a forum
for exchanging and spreading ideas, information and opinions about eco-products
among manufacturers and suppliers, governments and autonomous bodies, and
consumers, citizen groups and NGOs. It features exhibitions of some 350 companies’ environmentally conscious products in a wide range of fields, from “home use”
products such as furniture, stationery, clothing, and home appliances to “information/
service” products such as software, and products in the finance, logistics, lease/
rental, and consulting fields. In 2001, it will be the largest scale international exhibition in the field of eco-design and eco-products.
All participants of EcoDesign 2001 are invited to attend the “ECO-PRODUCTS
2001” exhibition, 13-15 December 2001, at Tokyo Big Sight, East Exhibition Hall. For
more information, please address e-mail inquiries to NIKKEI at
[email protected].
Language
The official language of all presentation is English. Except for tutorials those have
simultaneous interpretation from English to Japanese.
Proceedings
The proceedings of EcoDesign 2001 is published in English by IEEE CS Press and
distributed at the conference site. Extra copies of the proceedings can be purchased
at ¥8,000 per a copy at site.
Technical Equipment
For oral presentation, an overhead projector is available.
If a 35 mm slide projector, a video beamer or further equipment is needed, please
contact with the EcoDesign 2001 Secretariat until 14 November. Upon receiving
request, the Secretariat will inform the confirmation after the deadline.
At conference site, please check and confirm the operation of tools such as ‘Power
Point’ with speaker’s PC 30-60 min. before speaker’s session starts at the check
room (Rm 603, 6F) to avoid trouble in the session.
In any case, please ensure to bring a set of OHP sheets for all presentation.
66
Conference Venue
Tokyo Big Sight, The Tower Building (Kaigito)
Address: Ariake 3-21-1, Koto-ku, Tokyo, Zip-code 135-0063
Tel: +81-3-5530-1111, Internet: http://www.bigsight.or.jp/
Direct Telephone and Fax number of EcoDesign 2001 Secretariat at site will be
announced in the Final Program.
Travel to Hotels and the Conference Venue
Three routes can be offered upon arrival at Narita Airport to come to the conference
venue,
1) Narita Airport→(JR Narita Express train)→Tokyo Station→(JR line bound for Shinagawa) →Shinbashi Sta.→(YURIKAMOME) →Kokusai Tenjijo Seimon
Fee: ¥3,280 in total to go, Time: approximately 100 min., Frequency: once or
twice an hour
2) Narita Airport→(KEISEI Skyliner)→Nippori Station→(JR line bound for Shinagawa)→Shinbashi Sta.→(YURIKAMOME) →Kokusai Tenjijo Seimon
Fee: ¥2,080 in total to go, Time: approximately 100 min., Frequency: once or
twice an hour
3) Narita Airport→(a limousine bus bound for Ariake & Odaiba area in Tokyo)
→Kokusai-Tenjijo Seimon or the Entrance of Tokyo Big Sight.
Fee: ¥2,700 in total to go, Time: approximately 80 min., Frequency: three times a
day
Access to the Intercommunion Session at National Museum of Emerging Science and Innovation (the Nippon Kagaku Miraikan)
It takes about 15 min. on YURIKAMOME and foot from the conference venue (Tokyo
Big Sight) to National Museum of Emerging Science and Innovation.
From hotels near Shinbashi station, take YURIKAMOME line to the site.
Taxi is usually available to the venue and National Museum of Emerging Science and
Innovation. In Tokyo, however, traffic jams is going to be happened. So, public transportation is more reasonable and recommendatory than taxi in terms of the time and
fee to go. Please refer Access Map on page 87.
A Climate in December of Tokyo
In December, winter season starts in Japan. The weather in Tokyo is usually cold
with the average temperature during the day ranging from 18 to 9°C.
Visa to Entry into Japan
Those from countries requiring visas should apply to the nearest Japanese consulate or Embassy. The EcoDesign 2001 Secretariat can also help you with Visa
arrangement. For further information, please contact the EcoDesign 2001 Secretariat as early as possible.
67
Travel Arrangements
Travel Agency
Kinki Nippon Tourist Co., Ltd. (KNT), the official travel agency for the symposium will
handle travel arrangements such as hotel accommodation and sightseeing tour.
Inquiries and applications in this regard should be addressed to:
EcoDesign 2001 DESK
Events and Conventions, Tokyo
Kinki Nippon Tourist Co., Ltd.
Kyodo Bldg. 6F 2-2 Kanda-jimbocho, Chiyoda-ku,
Tokyo 101-0051 JAPAN
Tel: +81-3-3263-5581 Fax: +81-3-3263-5961
E-mail:[email protected]
A) Hotel Accommodation
KNT has reserved rooms at hotels around Tokyo Big Sight. Hotel reservations are
processed on a first-come-first-served basis. If your selected hotel is fully booked,
you will be assigned to a hotel as close as possible to your choice. The name of your
confirmed hotel, its exact room charge will be informed in a confirmation slip sent to
you after the deadline of application.
Rank
Name of Hotel
Room
Type
Size
(m3)
Room
Charge
Deposit
Access to Tokyo Big Sight
Access to Hotel
A
Hotel Nikko Tokyo
*No Breakfast
Single
Twin
33~
33~
¥21,945
¥27,720
¥30,000
7min. by Yurikamome Monorail Line
♦Hotel : Connected to Daiba Station
B
Tokyo Bay Ariake
Washington Hotel
*Breakfast
included
Single
Twin
15~
22~
¥11,300
¥18,600
¥20,000
3min. walk from Hotel
♦Hotel : 3min. walk from Kokusai Tenjijo Station or Kokusai Tenjijo Seimon
Station
C
Hotel Amista Ohi
*Breakfast
included
Single
Twin
10~
10~
¥ 8,085
¥11,970
¥20,000
35min. by JR Keihin Tohoku Line or
Yurikamome Monorail Line
♦Hotel : 5min. walk from JR Ohi-machi
Station
1) Above rates are per room per night including 10% service charge and 5% consumption tax.
2) Breakfast is NOT included at Hotel Nikko Tokyo.
3) Above rates are valid only during the period of EcoDesign 2001.
4) The deposit will be deducted from your hotel bill. Please settle the balance when
you check out the hotel.
5) Those who are staying for one night only should send one night room charge
instead of deposit.
68
6) The above rates and the information are subject to change without notice.
7) Closest stations to Big Sight:
By Rinkai Fukutochin Line: 5min walk form Kokusai Tenjijo Station
By Yurikamome Monorail Line: in front of Kokusai Tenjijo Seimon Station
B) Sightseeing Tour
Sightseeing tours with English speaking guide are available during your stay in
Japan. For the details, please refer to the web site http://www.knt.co.jp/kokusai/packjht/jhtinde.htm . Those who wish to make a reservation should fill out tour name, date
and the number of participants in the Application Form. Assemble time and place to
join the tour will be informed in the confirmation slip sent to you after the dead line.
Reservation
For reservations, you are kindly requested to forward the Application Form directly to
KNT by 14 November 2001. Reservation should be accompanied by the payment of
room deposit, sightseeing tour and communication fee of ¥1500. No reservation will
be confirmed in the absence of the payment.
Confirmation
Upon receiving your application form and payment, KNT will issue a confirmation slip
and send it to after the deadline of application. Please ensure to bring this slip with
you when you check-in at the hotel or join a sightseeing tour.
Payment
Payment of hotel deposit, sightseeing tour and communication fee (¥1500) should be
made only in Japanese yen by one of the following methods.
1) Credit Card (VISA, Master Card, American Express, Diners Club, or JCB only.)
Please fill out the credit card section in the Application Form with your signature.
2) Bank Transfer to
Bank: Sumitomo Mitsui Banking Corp.
Chuo Branch
Account No: 1855212
Account Name: Kinki Nippon Tourist Co., Ltd
* Please attach a copy of your bank receipt to the application form.
* Please note that the bank charge for remittance must be borne by the participant.
69
Reservation Change or Cancellation
For reservation change or cancellation, a written notification should be sent directly
to KNT to avoid troubles.
Hotel cancellation charges
Up to 14 days prior to check-in date ................ No charge
13-7 days prior to check-in date ....................... 10% of one day room charge
6-3 days prior to check-in date ......................... 40% of one day room charge
Less than 3 days or no notice given................. 100% of one day room charge
Sightseeing tour cancellation charges
7 or more days prior to the commencement of the tour ...... No charge
1-6 days prior to the commencement of the tour ................ 10% of Tour Fare
On or after the Tour Date .................................................... 20% of Tour Fare
Refund
When reservation is cancelled, refunds will be made after deducting the cancellation
charges and bank or credit card service charges. If the payment is made by credit
card, refund will be made through the credit card company. If by bank transfer, please
inform us of your bank account.
70
CONFERENCE COMMITTEES
Symposium Chair
H. Yoshikawa, Chairman, The Science Council of Japan
Organizing Committee
Co-Chairs: R. Yamamoto, The Univ. of Tokyo
F. Kimura, The Univ. of Tokyo
D. Bendz, IEEE CS TCEE, IBM
J. Ehrenfeld, ISIE
International Members
T. Graedel, Yale Univ., USA
H. Griese, Fraunhofer IZM, Germany
C. Handwerker, NIST, USA
W. Harris, Columbia Univ., USA
F.J.A.M. Hermann, Compaq Computer,
Germany
N.P. Hernborg, The Association of
Swedish Automobile Manufacturers
and Wholesalers, Sweden
K. Ishii, Stanford Univ., USA
J. Jeswiet, Queen’s Univ., Canada
F.J.A.M. Jovane, CNR-Milano, Italy
H.J.J. Kals, Univ. of Twente, The Netherlands
T. Kjellberg, Royal Inst. of Technology,
Sweden
W.A. Knight, Rhode Island Univ., USA
B. Kopacek, SAT-Care Electronics,
Austria
F.-L. Krause, Fraunhofer Inst. for Production Systems & Design Technology,
Germany
S.C.-Y. Lu, Univ. of Southerm California,
USA
A.Y.C. Nee, National Univ. of Singapore,
Singapore
K. Nimmo, ITRI, UK
D. Allen, Univ. of Texas, USA
B. Allenby, AT&T, USA
L. Altings, Technical Univ. of Denmark,
Denmark
R. Aschenbrenner, Fraunhofer IZM,
Germany
C. Bathias, CNAM/ITMA, France
S. Bleek, Factor 10 Inst., France
G. Boothroyd, Boothroyd Dewhurst,
USA
W. Both, Berlin Senate, Germany
D. Botkin, Center for the Study of the
Environment, USA
J. Brezet, Delft Univ. of Technology, The
Netherlands
M. Charter, The Centre for Sustainable
Design, UK
P. Dubots, Alcatel CIT, France
P. Eagan, Univ. of Wisconsin-Madison,
USA
J. Ertel, Brandenburg Technical Univ.,
Germany
W. Eversheim, Aachen Univ. of Technology, Germany
K. Feldmann, Univ. of
Erlangen-Nuernberg, Germany
W. Fried, BMW, Germany
71
W. Oppermann, Nokia Mobile Phones,
Germany
J.-G. Persson, The Royal Inst. of Technology – KTH, Sweden
R. Pfahl, Motorola, USA
G. Pitts, Ecolibrium, USA
H. Reichl, Fraunhofer IZM / Technical
Univ. of Berlin, Germany
H.-M. Rho, Korea Inst. of Science &
Technology, Korea
T. Schauer, FAW, Germany
L.-G. Scheidt, Sony International
(Europe), Germany
G. Seliger, Technical Univ. of Belrin,
Germany
G. Sohlenius, The Royal Inst. of Technology, Sweden
W.R. Stahel, Product-Life Inst.,
Switzerland
R. Steinhilper, Fraunhofer IPA, Germany
A. Stevels, Philips Consumer Electronics/Delft Univ. of Technology, The
Netherlands
N.P. Suh, Massachusetts Inst. of Technology, USA
M. Terho, Nokia Res. Center, Finland
H.K. Toenshoff, Univ. Hannover,
Germany
D. Ufford, Raytheon, USA
H. van Brussel, Catholic Univ. of
Louvain, Belgium
F.J.A.M. van Houten, Univ. of Twente,
The Netherlands
E.V. von Weizackerr, Wuppertal Inst.,
Germany
Y. Yasuda, Telefonab LM Ericsson,
Sweden
Domestic Members
A. Ichikawa , Japan Inst. of Plant Maintenance
T. Iida, Osaka Univ.
K. Ikebuchi, Toyota Motor
H. Ikeda, Matsushita Erectric
H. Ishida, INAX
Y. Ishikawa, Japan Techno-Economics
Society
H. Ishitani, The Univ. of Tokyo
A. Izumi, Misawa Homes Inst. of
Research and Development
K. Kageyama, The Univ. of Tokyo
T. Kamimura, National Inst. for Fusion
Science
M. Kamon, Kyoto Univ.
H. Kato, Industrial Environment
Research Center
M. Kato, Akita Prefectural Univ.
H. Katsura, Tokyo Ink Mfg.
T. Kimura, NTT Advanced Technology
T. Kimura, Kyoto Inst. of Technology
G. Kinoshita, Chuo Univ.
T. Arai, The Univ. of Tokyo
Y. Baba, NEC
Y. Emura, Canon
T. Enkawa, Tokyo Inst. of Technology
T. Fukuda, Nagoya Univ.
T. Fukushima, Japan Audit and Certification Organization for Environment and
Quality
Y. Furukawa, Tokyo Metropolitan Univ.
T. Gunjima, Doshisya Univ.
I. Hamano, Mitsubishi Erectric
M. Hanai, Denso
I. Hashimoto, Kyoto Univ.
K. Hashimoto, The Univ. of Tokyo
N. Hashizume, Seiko Epson
H. Hayashi, Manufacturing Science and
Technology Center
Y. Hayashi, ITOKI
K. Higashio, Kubota
H. Hirai, Tokyo Gas
S. Hoshino, Musashi Inst. of Technology
72
M. Sadakata, The Univ. of Tokyo
T. Sakai, Ritsumeikan Univ.
K. Sanada, Yokohama National Univ.
S. Sano, Sony
K. Seika, TOTO
T. Seo, The Yasuda Fire & Marine Insurance
T. Shibasaka, Kobe Univ.
Y. Shimoi, Toshiba
M. Shoji, Kajima
H. Suda, Toppan Printing
S. Suda, The Japan Federation of Engineering Societies
K. Sugimura, Sekisui House
H. Tabata, Metocean Environment Inc.
S. Takata, Waseda Univ.
N. Taketa, Kyoto Univ.
T. Takemoto, Osaka Univ.
K. Takiguchi, Fuji Xerox
N. Tanaka, Hokkaido Univ.
Y. Tanaka, Toyo Univ.
T. Tani, Ricoh
R. Terakado, Nippon Steel
T. Tomiyama, The Univ. of Tokyo
N. Tosaka, Nihon Univ.
H.Tsuchiya, Society of Japanese Value
Engineering
H. Uchida, Tokai Univ.
K. Ueda, Kobe Univ.
K. Ueno, Mitsubishi Erectric
T. Umeda, Chiba Inst. of Technology
T. Watanabe, Ritsumeikan Univ.
K. Yagi, National Inst. for Materials Science
T. Yagi, The Univ. of Tokyo
A. Yamato, Japan Nuclear Cycle Development Inst.
T. Yashiro, The Univ. of Tokyo
I. Yasui, The Univ. of Tokyo
T. Yoshizawa, The Univ. of Tsukuba
(As of 30 September 2001)
T. Kishi, National Inst. of Advanced Interdisciplinary
S. Kishida, NEC
M. Kobayashi, IBM Japan
T. Kobayashi, The Univ. of Tokyo
T. Koga, Fujitsu
T. Koitabashi, Konika
H. Koshibu, Fuji Xerox Office Supply
M. Kouno, The Univ. of Tokyo
N. Kumagaya, Inst. of Nuclear Safety
System
M. Kuriyagawa, National Inst. of
Advanced Industrial Science and
Technology
M. Maeda, The Univ. of Tokyo
T. Matsuo, Toyo Univ.
A. Mitarai, Sharp
K. Miyazaki, Chiba Univ.
K. Mizoguchi, Shizuoka Univ.
S. Mori, Nagoya Univ.
Y. Moriguchi, The National Inst. for Environmental Studies
K. Nagata, Waseda Univ.
Y. Nakagami, The Sanno Inst. of Management
Y. Nakagawa, Hitachi
N. Nakajima, The Univ. of the Air
K. Nakamura, Kirin Brewery
T. Nakamura, Meidensha
T. Nakayama, Japan Environmental
Management Association for Industry
M. Naki, Clean Japan Center
K. Nihei, Waseda Univ.
S. Ohkouchi, Hosei Univ.
R. Okada, Mitsui Engineering and Shipbuilding
T. Okajima, Osaka Gas
T. Okano, Tokyo Women’s Medical Univ.
N. Omi, Tokyo Univ. of Agriculture and
Technology
T. Osako, OMURON
S. Owada, Waseda Univ.
73
Technical Committee
Chair/Tutorial Chair:
Vice-Chair:
Secretariat:
Technical Tour Chair:
Seminar Chair:
International Publicity Chair:
Publicity Chair:
Finance Chair:
Home Page Chair:
T. Suga, The Univ. of Tokyo
J. Fujimoto, NEC
K. Ajiki*, +, Ricoh
K. Ido++, I.D.O. Digital Publishing
H. Hayashi*, +, Fujikura
N. Kimata*, Tottori Univ. of Environmental
Studies
S. Kishida, NEC
M. Kobayashi, IBM Japan
T. Koga, Fujitsu
H. Koshibu+++, Fuji Xerox Office Supply
K. Masui, National Inst. of Advanced Industrial Science and Technology
Special Themes
& Arrangements:
S. Owada*, Waseda Univ.
K. Suganuma, Osaka Univ.
Award Chair:
T. Tomiyama*, The Univ. of Tokyo
Event Chair:
H. H. Uchida, Tokai Univ.
Program Chair:
Y. Umeda, TokyoMetropolitan Univ.
Asian Countries Support Chair: H. Yokoyama*, Hitachi
Members
Y. Adachi, The Univ. of Tokyo
K. Amagai*, Gunma Univ.
K. Aoyama+, The Univ. of Tokyo
S. Doi #, Toshiba
T. Gamo*, Matushita Electric
K. Halada*, National Inst. for Materials
Science
K. Hashimoto*, The Univ. of Tokyo
Y. Hirashima*, Seiko-Epson
S. Honda++, Shoei Lab.
N. Hosoda*, **, The Univ. of Tokyo
H. Igarashi*, The Univ. of Tsukuba
A. Inaba*, **, ##, National Inst. of
Advanced Industrial Science and
Technology
T. Itou*, Toyota Motor
Y. Izumi*, Japan Inst. of Plant Maintenance
K. Kageyama*, The Univ. of Tokyo
S. Kanai*, Hokkaido Univ.
J. Kasai*, Isuzu Motors
S. Kato*, +, The Univ. of Tokyo
M. Katou, ITOKI
H. Katsura*, Toyo Ink Mfg.
C. Kawamoto*, Osaka Industrial Design
Inst.
T. Kiriyama*, The Univ. of Tokyo
T. Kishimoto*, NTT
H. Kitahara, Daikin Environmental Lab.
H. Kobayashi*, Toshiba
S. Komatani*, Kirin Brewery
T. Kosuda*, Meidensha
Y. Kurimoto*, Metocean Environment
74
K. Kuriyama*, Waseda Univ.
S. Magaino*, Kanagawa Industrial Technology Reserch Inst.
F. Masuda*, Open House/Tokyo Zokei
Univ.
K. Masuda*, Fuji Xerox
Y. Minagawa, Fuji Photo Film
S. Miyama*, Mertex
T. Miyauchi*, Tokyo Inst. of Technology
S. Miyawaki*, INAX
K. Mizoguchi*, Shizuoka Univ.
K. Monzen*, Japan Mining Association
S. Mori*, Nagoya Univ.
T. Murakami*, The Univ. of Tokyo
K. Muramoto*, Misawa Homes
M. Nakajima*, Sanyo Electric
S. Nakamura*, Waseda Univ.
M. Naki*, Clean Japan Center
Y. Ogawa*, Japan Excel-Management
Consulting
K. Okaniwa*, Konica
N. Omi*, Tokyo Univ. of Agriculture and
Technology
N. Saegusa*, #, Nissan Motor
K. Sakai*, Sony
H. Sakamura*, The Univ. of Tokyo
K. Sanada*, Yokohama National Univ.
T. Sano, National Inst. of Advanced
Industrial Science and Technology
K. Satoh##, Japan Audit and Certification Organization for Environment and
Quality
T. Satoh*, Ricoh
M. Seki*, The Yasuda Fire & Marine
Insulance
H.A. Shapiro, Osaka Univ. of Arts
T. Shibasaka*, Kobe Univ.
*
**
+
++
S. Shimada*, OMRON
M. Shimizu*, Advantest
Y. Shirai, The Japan Research and
Development Center for Metals
S. Suda, Japan Environmental Mamagement Associatiopn for Industry
H. Suzuki*, The Univ. of Tokyo
S. Takada*, Waseda Univ.
T. Takemoto, Osaka Univ.
R. Terao, Kochi EcoDesign Council
O. Teshigawara*, Japan Radio
S. Tounai*, Mori Landscape Architects
M. Tsuchiya*, Matsushita Electric Components
Y. Tsuchiya*, Society of Japanese Value
Engineering
T. Tsukui*, Tokai Univ.
M. Uno+, Hitachi
T. Urayama*, Ritsumeikan Univ.
T. Watanabe, Ritsumeikan Univ.
T. Yabe*, Tokyo Inst. of Technology
K. Yagi, National Inst. for Materials Science
Y. Yamagiwa*, Sony
H. Yamamoto+, Fujitsu
H. Yamamoto*, Canon
T. Yashiro*, #, The Univ. of Tokyo
I. Yasui*, The Univ. of Tokyo
A. Yasumoto*, Japan Techno-Economics
Society
K. Yokoyama*, #, Joho Solution
Y. Yoneda*, Fujitsu Labs.
T. Yoshida*, Mitsubishi Electric
T. Yoshizawa*, The Univ. of Tsukuba
M. Yukimoto#, Kawasaki Steel
(As of 30 September 2001)
Program Committee member
Award Subcommittee member
Event Subcomittee member
Publicity Subcommittee member
75
+++
#
##
International Publicity Subcommittee member
Technical Tour Subcommittee member
Asian Countries Support Subcommittee member
Managing Society
K. Hirata, Japan Inst. of Electronics Pakaging
ECO-PRODUCTS 2001 Secretariat
K. Hasegawa, Nihon Keizai Shimbun, Inc.
A. Morita, Nihon Keizai Shimbun, Inc.
EcoDesign 2001 Secretariat
H. Araki, Business Center for Academic Societies Japan
N. Uehara, Business Center for Academic Societies Japan
76
CONFERENCE ORGANIZATION
Organized by
Union of EcoDesigners;
2001 Managing society: Japan Institute of Electronics Packaging
Secretariat:
Business Center for Academic Societies Japan
In Cooperation with (Going Green: Global Collaboration
with)
IEEE Computer Society Technical Committee on Electronics and the Environment
(IEEE CS TCEE), USA
CARE Electronics, Europe
Co-Sponsors
Union of EcoDesigners:
Japan Vending Machine Manufactures
Association
Japan Welding Society
Japanese Society for the Science of
Design
Kochi EcoDesign Council
Nippon Environment Club
Osaka Industrial Design Inst., Osaka
Prefectural Government
Science Forum on Generation and Formation
Society of Environmental Science Japan
Society of Japanese Value Engineering
The Carbon Society of Japan
The Ceramic Society of Japan
The Electrochemical Society of Japan
The Illuminating Engineering Inst. of
Japan
The Inst. of Electrical Engineers of
Japan
The Inst. of Electrical Installation Engineers of Japan
The Inst. of Electronics, Information and
Communication Engineers
The Iron and Steel Inst. of Japan
Japan Inst. of Electronics Packaging
(2001 Managing Society)
Architectural Inst. of Japan
Center for Environmental Information
Science
Clean Japan Center
Combustion Society of Japan
Design Engineering Special Comm.,
Liaison Comm. for Artifact Design and
Manufacturing, The Science Council
of Japan
Inst. of Systems, Control and Information
Japan Electronics and Information Technology Industries Association
Japan Inst. of Plant Maintenance
Japan Machine Tool Builders’ Association
Japan Society for Design Engineering
Japan Society of Civil Engineers
Japan Society of Color Material
Japan Society of Powder and Powder
Metallurgy
Japan Society on Water Environment
Japan Techno-Economics Society
77
The Japan Electrical Manufactures’
Association
The Japan Federation of Engineering
Society
The Japan Hydraulics & Pneumatics
Society
The Japan Inst. of Energy
The Japan Inst. of Metals
The Japan Research and Development
Center for Metals
The Japan Society for Composite Materials
The Japan Society for Precision Engineering
The Japan Society for Technology of
Plasticity
The Japan Society of Applied Physics
The Japan Society of Hydrology and
Water Resources
The Japan Society of Mechanical Engineers
The Japan Society of Plasma Sci. and
Nuclear Fusion Res.
The Japan Society of Polymer Processing
The Japan of Society for Quality Control
The Mining and Materials Processing
Inst. of Japan
The Society of Chemical Engineers,
Japan
The Society of Inorganic Materials,
Japan
The Society of Powder Technology,
Japan
The United Nations Univ., Inst. of
Advanced Studies
The Visualization Society of Japan
Interrelated to
Japan Society for Natural Disaster Science
Japan Society for Snow Engineering
Japan Society of Engineering Geology
Japan Society of Fluid Mechanics
Japan Society of Refrigerating and Air
Conditioning Engineer
Japan Thermal Spraying Society
Japanese Society for Engineering Education
Japanese Society of Snow and Ice
Manufacturing Science and Technology
Center
Personal Computer Users’ Application
Technology Association
Quality Engineering Society
The Chemical Society of Japan
The Development Engineering Society
of Japan
The Energy Conservation Center, Japan
The Iron and Steel Inst. of Japan
The Japan Institute of Energy
Atomic Energy Society of Japan
Communications Industry Association of
Japan
Cryogenic Association of Japan
Geothermal Research Society of Japan
High Temperature Society of Japan
Inverse Manufacturing Forum, Japan
Japan Association of Industries and
Environment
Japan Automobile Manufacturers Association
Japan Business Machine Maker’s Association
Japan Coating Technology Association
Japan Concrete Inst.
Japan Electric Power Civil Engineering
Association
Japan Fluid Power Association
Japan Foundry Engineering Society
Japan Oil Chemists’ Society
Japan Prestressed Concrete Engineering Association
78
The Resource Processing Society of
Japan
The Robotics Society of Japan
The Society for Bioscience and Bioengineering
The Society of Instrument and Control
Engineers
The Society of Naval Architects of Japan
The Society of Resource Geology
The Society of Rheology, Japan
The Society of Rubber Industry Japan
The Society of Synthetic Organic Chemistry
The Society of Waste Management
Experts
The Spectroscopical Society of Japan
The Surface Finishing Society of Japan
The Surface Science Society of Japan
(As of 1 October 2001)
The Japan Institute of Light Metals
The Japan Machinery Federation
The Japan Society for The Conservation
of Cultural Property
The Japan Society of High Pressure Science and Technology
The Japan Society of Industrial Machinery Manufacturers
The Japanese Geotechnical Society
The Japanese Society for Biomaterial
The Japanese Society for Non-Destructive Inspection
The Japanese Society for Strength and
Fracture of Materials
The Japanese Society of Printing Science and Technology
The Laser Society of Japan
The Marine Engineering Society in
Japan
Supported by
Japan Environment Management Association for Industry
Nihon Keizai Shimbun, Inc.
79
ACKNOWLEDGMENTS
EcoDesign 2001 is financially supported by the following foundations:
Kansai Research Foundation for Technology Promotion
Nippon Sheet Glass Foundation for Materials Science and Engineering
The Commemorative Association for the Japan World Exposition (1970)
The Kajima Foundation
Tokyo Convention and Visitors Bureau
(As of 1 October 2001)
80
For office use:
EcoDesign 2001 REGISTRATION FORM
Reg.#
Type A (For All Sessions)
Early Registration
This form must be sent to:
Deadline: 21 Nov. 2001
EcoDesign 2001 SECRETARIAT
c/o Business Center for Academic Societies Japan
Honkomagome 5-16-9, Bunkyo-ku, Tokyo 113-8622, Japan
Tel: +81 3 5814 1430 Fax: +81 3 5814 5845 E-mail [email protected]/[email protected]
Please print or type:
Title:
Name:
Prof. Dr. Mr. Ms.
(Family)
(First)
(Middle Initial)
Institution:
Department:
cut here
Division:
Address:
Office Home
Zip Code:
Country:
Tel:
Fax:
E-mail:
Registration Fee
Conference
Member
Sponsoring Society members and IEEE members
Non-Members
Student (Intercommunion Session Excluded)
Intercommunion session (For Student, or an accompany)
Tutorial
Technical Tour
Early Registration
(before 21 Nov. 2001)
¥53,000
¥58,000
¥ 5,000
¥ 8,000
¥10,000
¥ 6,000
Total¥
Name of society(ies):
Name of Accompanying Person (if any):
Mr. Ms.
Late Registration
(after 21 Nov. 2001)
¥58,000
¥63,000
¥10,000
¥10,000
¥10,000
Total¥
,
(Family)
(First)
Remittance:
Bank Check enclosed (payable to EcoDesign 2001)
Bank Transfer:I will remit/have remitted the total fee on (date)
to the account of EcoDesign 2001,
through (your bank)
A/C 075-2396620 (Ordinary Account),
Credit Card: Amex Visa Master Diners
Daiichi Kangyo Bank, Hongo Branch, Tokyo
Master card issued in Japan is limited to UC only.
Holder’s Name:
Card Number:
Expiry:
(month)/
(year)
Holder’s Signature:
Date:
Signature:
81
For office use:
EcoDesign 2001 REGISTRATION FORM
Reg.#
Type B (For All Technical Sessions)
Early Registration
This form must be sent to:
Deadline: 21 Nov. 2001
EcoDesign 2001 SECRETARIAT
c/o Business Center for Academic Societies Japan
Honkomagome 5-16-9, Bunkyo-ku, Tokyo 113-8622, Japan
Tel: +81 3 5814 1430 Fax: +81 3 5814 5845 E-mail [email protected]/[email protected]
Please print or type:
Title:
Name:
Prof. Dr. Mr. Ms.
(Family)
(First)
(Middle Initial)
Institution:
Department:
cut here
Division:
Address:
Office Home
Zip Code:
Country:
Tel:
Fax:
E-mail:
Registration Fee
Conference
Member
Sponsoring Society members and IEEE members
Non-Members
Student (Intercommunion Session Excluded)
Intercommunion Session (per a person)
Tutorial
Technical Tour
Early Registration
(before 21 Nov. 2001)
¥45,000
Name of Accompanying Person (if any):
Mr. Ms.
¥50,000
¥ 5,000
¥ 8,000
¥10,000
¥ 6,000
Total¥
Name of society(ies):
Late Registration
(after 21 Nov. 2001)
¥50,000
¥55,000
¥10,000
¥10,000
¥10,000
Total¥
,
(Family)
(First)
Remittance:
Bank Check enclosed (payable to EcoDesign 2001)
Bank Transfer:I will remit/have remitted the total fee on (date)
to the account of EcoDesign 2001,
through (your bank)
A/C 075-2396620 (Ordinary Account),
Credit Card: Amex Visa Master Diners
Daiichi Kangyo Bank, Hongo Branch, Tokyo
Master card issued in Japan is limited to UC only.
Holder’s Name:
Card Number:
Expiry:
(month)/
(year)
Holder’s Signature:
Date:
Signature:
83
December 12-15, 2001 Tokyo Big Sight
A P P L IC A T IO N F O R M
(D e a ld L in e : N o v e m b e r 1 4 )
(official use)
Reg. no.
Date
Please complete this form using a typewriter or block letters and return to:
EcoDesign 2001 Desk
K inki N ippon T ourist, C o., L td., E vents & C onventions, T okyo
Kyodo Bldg. 6F, 2-2, Kandajimbo-cho, Chiyoda-ku
Tokyo, 101-0051, Japan
FAX: +81-3-3263-5961 TEL: +81-3-3263-5581 e-mail: [email protected]
Prof. Dr. Mr. Ms.
Title:
Family Name:
Given Name:
, Middle Name
Institution:
Department:
Division:
Address
Home Office
E-mail:
Country:
TEL:
FAX:
Name of Accompanying Person (if any): Mr. Ms.
Family Name
Given Name
cut here
(A )H O T E L A C C O M M O D A T IO N
Hotel Nikko Tokyo
Check in date:
Room type:
Single
Tokyo Bay Washington Hotel
/ Dec., 2001
Twin
Hotel Amista Ohi
Check out date:
(to share with
/ Dec., 2001
for
Mr./Ms.
nights
)
Hotel deposit: ¥
-(A)
(B )S IG H T S E E IN G T O U R
Tour Name
Date
Fee
Person(s)
Dec.
¥
Dec.
¥
Tour Fee: ¥
G ra n d T o ta l (A ) + (B ) + ¥ 1 ,5 0 0
=
Total
-(B)
¥
* ¥ 1 5 0 0 ;c o m m u n ic a tio n fe e
PAYM ENT
(Payment should be made only in Japanese Yen and personal checks are NOT acceptable.)
BANK TRANSFER
(Any handling charge must be settled by the participant.)
I have remitted the above amount to the following bank on
Name of bank:
Account Number:
Sumitomo Mitsui Banking Corp
1855212
(date) through
Branch Name:
Account Name:
(bank).
Chuo Branch
Kinki Nippon Tourist Co., Ltd.
CREDIT CARD I authorize to charge the above Grand Total to the following credit card.
VISA Master Card American Express Diners JCB
Card Holder’s Name (as appeared on the card):
Good through:
Card Number:
Date:
Signature:
85
(month)/
(year)
National Museum of Emerging Science and Innovation
87