MIE - Processes for the Multilayer

MIE - Processes for the Multilayer-Production
MIE - Verfahrenstechnologien für die Multilayer - Fertigung
Process steps
Recommended MIE - Systems / Equipment
Necessary Equipment
Empfohlene MIE - Systeme / Geräte
Verfahrensschritt
Notwendiges Equipment
Manuell Machines
Automatic Machines
Manuelle Geräte
Automatische Geräte
Paneling / Zuschnitt
Cleaning
Horizontal lines
Ishii-Hyoki-equipment
Desoxidieren/Bürsten
Durchlaufanlagen
Ishii-Hyoki-Anlagen
Resist - coating
Resist - Beschichten
Dry film laminator
Trockenfilm - Laminator
DuPont HRL-24
Sentek DFL 2000
Spareparts / Ersatzteile
DuPont - Spareparts
DuPont - Spareparts
Photoresist
Dry film / Trockenfilm
Dry film / Trockenfilm
Dip Coater SZC-720
Semi Auto Dip Coater SD6200
Sazma Dip coating
Sazma Tauchanlagen
Innerlayer - Exposing
Artwork punch
MT - MAP, MT - SAP,
Innenlagen - Belichten
Filmstanze
MT - AAP
Exposure
Belichter
MIE ExpoUnit K 5, K 8
MIE ExpoUnit C 5, C 8
MIE(JSE Expomatic M1
UV-Bulbs/lamps
UV-Brenner
UV - lamps for most of
common exposure units
UV - lamps for most of
common exposure units
MIE - Multiframe (PinRegistration)
MIE - Multiframe MVA (CCDCameras)
Exposure frame
Belichtungsrahmen
Artwork generation
Filmerstellung
MIE - ML -Technologies and Processes
Cleaning equipment
Reinigungsequipment
SDI - Cleaning pads
SDI Microcleaner
Filmplotter
FEIE RP 24, 204, 304
FEIE RP 200 - 500
Filmdeveloper / -entwickler
MultiLine Pro Serie
MultiLine Pro Serie
Films
PCB Silverfilms
PCB Silverfilms
Page 1 of 6
03.05.2005
MIE - Processes for the Multilayer-Production
MIE - Verfahrenstechnologien für die Multilayer - Fertigung
Process steps
Recommended MIE - Systems / Equipment
Necessary Equipment
Empfohlene MIE - Systeme / Geräte
Verfahrensschritt
Notwendiges Equipment
Manuell Machines
Automatic Machines
Manuelle Geräte
Automatische Geräte
Mylar remover
Folienabziehen
Mylar-Remover
MIE-FLG TP 01 / TP 02
DES
Horizontal lines
Ishii-Hyoki-equipment
Entwickeln/Ätzen/Strippen
Durchlaufanlagen
Ishii-Hyoki-Anlagen
Post-etch-punch systems
PE punches
MT - OPE 1000, 3000
MT - OPE 5000
Nachätzstanzen
PE-Stanze
MT - ATP 1000, 3000
MT - ATP 5000
MT - Stacker/Interleaver
MT - Stacker/Interleaver
SDI - Cleaning pads
SDI Microcleaner
Optical Inspection (AOI)
Cleaning equipment
Optische Kontrolle (AOI)
Reinigungsequipment
Inspection
Kontrolle
Front-to-back registration
Kontrolle des Vorder-Rückseitenversatzes
Measurement and
verification
of punching and drilling
accuracy
Messung und Kontrolle der
MT - Multiview
MT - Verifier
Stanz- und Bohrgenauigkeit
Black-Oxid / Schwarzoxid
Lay-up Station
Paketieren
MT - Bonding-Machine
Lay-up
MT - Multilayer Lay-up
station
MT - Plate Handler
MT-lamination plates
Werkzeugplatten
MT - separator plates
Trennbleche
MT - Prepreg-Punch
Automated Build-up and layup system
MBS 2000
Brushing machine
Bürstmaschine
Ishii-Hyoki-equipment
Ishii-Hyoki-Anlagen
Cleaning equipment
Reinigungsequipment
MIE - ML -Technologies and Processes
SDI - Cleaning pads
Page 2 of 6
SDI Microcleaner
03.05.2005
MIE - Processes for the Multilayer-Production
MIE - Verfahrenstechnologien für die Multilayer - Fertigung
Process steps
Recommended MIE - Systems / Equipment
Necessary Equipment
Empfohlene MIE - Systeme / Geräte
Verfahrensschritt
Notwendiges Equipment
Manuell Machines
Automatic Machines
Manuelle Geräte
Automatische Geräte
Presses / Pressen
Multilayer Press
Multilayer Presse
Depinning
Entpacketieren
Depinning equipment
Entpacketiermaschine
MT - Depinner
MT - Break-down station
X-ray drilling machines
Röntgenbohrmaschien
MT-XRT - 1000
MT-XRT 3000 - 5000
CNC - Drilling machines
Excellon Drilling Equipment
Excellon Drilling Equipment
CNC - Bohrmaschinen
Excellon - Bohrmaschinen
Excellon - Bohrmaschinen
UV-CO2-Hybrid Laser Drill
Machine
UV-CO2-Hybrid
Laserbohrmaschine
Excellon LVD COBRA Hybrid
Laser Microvia System
Excellon LVD COBRA Hybrid
Laser Microvia System
ESI 5300 Laser µVia Drill
ESI 5300 Laser µVia Drill
MPS 1100
Trimming /
Kantenbesäumen
Tooling hole drilling
Aufnahmelochbohren
PTH - Drilling / Blind vias
drilling
DK - Bohren /
Sacklochbohren
mechanisch
Blind vias drilling with
Hybrid Laser
Sacklochbohren mittels
Hybridlaser
Blind vias drilling with UV UV:YAG - Laser Drill Machine
Laser
Sacklochbohren mittels UV - UV:YAG Laser
Laserbohrmaschine
Desmearing
Lochwandreinigung
Dry Jet machine
Ishii-Hyoki-equipment
Ishii-Hyoki-Anlagen
Cleaning
Reinigen
Brushing machine
Bürst- / Bimsanlagen
Ishii-Hyoki-equipment
Ishii-Hyoki-Anlagen
Laminieren
Laminieren
Dry film - laminator
Trockenfilm - Laminator
Photoresist
Electroless Cu - Process
DK - Prozess
MIE - ML -Technologies and Processes
DuPont HRL-24
Sentek DFL 2000
Dry film / Trockenfilm
Dry film / Trockenfilm
Page 3 of 6
03.05.2005
MIE - Processes for the Multilayer-Production
MIE - Verfahrenstechnologien für die Multilayer - Fertigung
Process steps
Recommended MIE - Systems / Equipment
Necessary Equipment
Empfohlene MIE - Systeme / Geräte
Verfahrensschritt
Outerlayer Exposing
Aussenlagen - Belichten
Notwendiges Equipment
Automatic Machines
Manuelle Geräte
Automatische Geräte
Artwork punch
Filmstanze
MT - MAP, MT - SAP
MT - AAP
Exposure
Belichter
MIE ExpoUnit K 5, K 8
MIE ExpoUnit C 5, C 8
MIE(JSE Expomatic M2
UV-Bulbs/lamps
UV-Brenner
UV - lamps for most of
common exposure units
UV - lamps for most of
common exposure units
MIE - Multiframe (PinRegistration)
MIE - Multiframe MVA (CCDCameras)
Exposure frame
Belichtungsrahmen
Artwork generation
Filmerstellung
Manuell Machines
Cleaning equipment
Reinigungsequipment
SDI - Cleaning pads
SDI Microcleaner
Filmplotter
FEIE RP 24, 204, 304
FEIE RP 200 - 500
Filmdeveloper / -entwickler
MultiLine Pro Serie
MultiLine Pro Serie
Films
PCB Silver and Diazofilms
PCB Silver and Diazofilms
Mylar Remover
Folienabziehen
Mylar-Remover
MIE-FLG TP 01 / TP 02
Developing
Entwickeln
Horizontal lines
Durchlaufanlagen
Ishii-Hyoki-equipment
Ishii-Hyoki-Anlagen
Electroplating
Bath analyzing equipment
Galvanisieren
Badanalysengeräte
ECI QLC 5000
Galvano Rack
Vibration Galvano Rack for Blind Via Plating
Galvanogestell
Vibrierendes Galvanogestell für die Sacklochgalvanisierung
Stripping / Etching
Strippen / Ätzen
Horizontal lines
Durchlaufanlagen
Optical Inspection (AOI)
Optische Kontrolle (AOI)
Cleaning equipment
Reinigungsequipment
MIE - ML -Technologies and Processes
ECI QL-5, ECI QL-10
Ishii-Hyoki-equipment
Ishii-Hyoki-Anlagen
SDI - Cleaning pads
Page 4 of 6
SDI Microcleaner
03.05.2005
MIE - Processes for the Multilayer-Production
MIE - Verfahrenstechnologien für die Multilayer - Fertigung
Process steps
Recommended MIE - Systems / Equipment
Necessary Equipment
Empfohlene MIE - Systeme / Geräte
Verfahrensschritt
Notwendiges Equipment
Manuell Machines
Automatic Machines
Manuelle Geräte
Automatische Geräte
Soldermask coating / SM - Beschichten
Soldermask exposure
Artwork punch
MT - MAP, MT - SAP,
Lötstopplack - Belichten
Filmstanze
MT - AAP
Exposure
Belichter
MIE ExpoUnit K8
MIE(JSE Expomatic M2
UV-Bulbs/lamps
UV-Brenner
UV - lamps for most of
common exposure units
UV - lamps for most of
common exposure units
Exposure frame
MIE - Multiframe (Pin-Reg)
MIE - Multiframe MVA (CCDCam.)
Belichtungsrahmen
Film- to Panel registration
MT - APR
Film- zu Panelregistrierung
Cleaning equipment
SDI - Cleaning pads
SDI Microcleaner
Filmplotter
FEIE RP 24, 204, 304
FEIE RP 200 - 500
Filmdeveloper / -entwickler
MultiLine Pro Serie
MultiLine Pro Serie
Films
PCB Silver and Diazofilms
PCB Silver and Diazofilms
Reinigungsequipment
Artwork generation
Filmerstellung
Developing/Drying/Entwickeln/Einbrennen
Surface finishing
Oberflächenfinish
Surface analysis
Oberflächenanalyse
Legend printing
Positionsdruck
Ink Jet Printing
Ink Jet Drucker
Ink / Lack
FEIE CP 400 Ink Jet Printer
FEIE CP 400 Ink Jet Printer
UV-curable Ink
UV-curable Ink
Routing
Routing Machines
Excellon Router Equipment
Excellon Router Equipment
Fräsen
Fräsmaschinen
Excellon Fräsmaschinen
Excellon Fräsmaschinen
MIE - ML -Technologies and Processes
ECI - QC-100 Sera
Page 5 of 6
03.05.2005
MIE - Processes for the Multilayer-Production
MIE - Verfahrenstechnologien für die Multilayer - Fertigung
Process steps
Recommended MIE - Systems / Equipment
Necessary Equipment
Empfohlene MIE - Systeme / Geräte
Verfahrensschritt
Notwendiges Equipment
Manuell Machines
Automatic Machines
Manuelle Geräte
Automatische Geräte
Electrical test / Elektrischer Test
Final inspection
Endkontrolle
Surface analysis
Oberflächenanalyse
Quality Management
Thermal Shock Test
Qualitätsmanagement
Thermal Shock Test
ECI - QC-100 Sera
IRTS - HATS - Tester (Highly
Accelerated Thermal Shock
Tester)
IRTS - HATS - Tester (Highly
Accelerated Thermal Shock
Tester)
Shipping / Versand
MIE (Multiline International Europa L.P.)
Industriestrasse 10
61381 Friedrichsdorf - Germany
Telephone: +49-(0)6172-76 07 0
Telefax:
+49-(0)6172-76 07 50
e-mail: [email protected]
web-site: www.mie.de
MIE - ML -Technologies and Processes
Page 6 of 6
03.05.2005