LASER TECHNOLOGY FOR ELECTRONIC MANUFACTURING

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Märkisches Museum
tool: www.izm.fraunhofer.de/lasertechnology
we are investing a great deal of effort into lasers, as they
Contact: Georg Weigelt | Phone: +49 30 46403-279
become increasingly crucial to tomorrow’s state-of-the-art
Fax: -650 | [email protected]
This workshop will present the advantages of laser
PARTICIPATION FEE
new trends in wafer processing, printed
c i r c u i t b o a r d s a n d p h o t o n i c pa c k a g i n g
technology and related processes from three different
495,00 € per person (incl. evening event)
perspectives.
The fees are VAT exempt according to § 4 No. 22 UStG.
We will begin with laser-assisted technologies in wafer level
VENUE
lithography, providing an overview of its advantages, such
Fraunhofer-Forum Berlin im SpreePalais
as those of mask-free wafer processing, but also challenges
Anna-Louisa-Karsch-Str. 2, 10178 Berlin, Germany
such as limited compatible materials and resolution
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technology.
Mohrenstraße
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development of cutting-edge packaging. In particular,
LASER TECHNOLOGY
FOR ELECTRONIC
MANUFACTURING
REGISTRATION
Mohrenstraße
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Please register by June 17th 2014 at the latest by our web
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Fraunhofer IZM is a world-leader in the research and
workshop profilE
issues. A second topic will be the precise shape forming
WHO SHOULD ATTEND?
of interlayer connections and wiring for manufacturing of
The workshop is aimed primarily at developers and electronic
chip-embedded boards.
packaging specialists who are considering the use of laser
technology in microelectronics manufacturing, owning the
Finally, the workshop will focus on highly accurate glass
responsibility for manufacturing and/or are involved in or
processing, including cutting and welding, but also precise
supervise decision-making processes during product develop-
breaking for waveguide interconnection in planar glass for
ment and quality assurance.
photonic components. All of the above techniques will be
discussed as they relate to actual and future applications.
Finally, the workshop has been designed to include plenty
of time for discussion between the participants and our
experts.
AGENDA
8.30
Registration
11.30 From cw to femtoseconds: Current trends in
laser micro machining
9.00
9.10
PHOTONIC PACKAGING
15.00 Laser processing of thin glass for photonic
Welcome
Industrial-proven ultra-short pulsed lasers and systems for high-
packaging
Dr. Stephan Guttowski, Fraunhofer IZM
precision and low-damage micro processing technologies.
Glass as a superior substrate material for integration of optics,
Dr. Roland Mayerhofer, ROFIN-BAASEL Lasertech
manufacturing of electro-optical transceivers and electro-optical
GmbH & Co. KG
circuit boards (EOCB) by different laser technologies.
European competence in electronic packaging
Dr. Lars Brusberg, Fraunhofer IZM
Rolf Aschenbrenner, Fraunhofer IZM
12.00 Lunch
9.30
15.30 Selective processing of glass depending on
Challenges in forward locking packaging
technologies
How Fraunhofer IZM addresses them with laser processing methods
Dr. Rafael Jordan, Fraunhofer IZM
10.00 Coffee break
BOARD TECHNOLOGIES
13.30 Application of laser technologies for board
laser source
Laser technologies for cutting, drilling and marking of glass as
manufacturing
well as selective coating removal will be introduced for industrial
Drilling and structuring of organic substrates, direct imaging of
processing on panel size.
photosensitive materials for circuit patterning
Dr. Christoph Hermanns, MDI Schott Advanced
Lars Böttcher, Fraunhofer IZM
Processing GmbH
WAFER TECHNOLOGIES
10.30 Application of laser technologies for wafer
14.00 Characteristics and potentials of ultrashort pulse
processing
lasers for industrial PCB manufacturing
Thin film polymer processing and temporary wafer bonding
Pico-second lasers replacing conventional manufacturing processes:
Dr. Michael Töpper, Fraunhofer IZM
cutting, drilling or even micro structuring, application development
16.00 Questions, disussion and feedback
Dr. Stephan Guttowski, Fraunhofer IZM
16.30 End of workshop
and economic benefits
11.00 Novel laser patterning technology in the field of
Grant Christiansen, Schmoll Maschinen GmbH
wafer level packaging
Excimer laser ablation technology, recent developments and
14.30 Coffee break
achievements
Ralph Zoberbier, SÜSS MicroTec AG
d o n ' t m i s s o u r e v e n i n g - b e f o r e e v e n t o n J u ly 2 n d w i t h t h e o p p o r t u n i t y t o m e e t o u r e x p e r t s a n d e n j o y t h e i n s p i r i n g c i t y o f b e r l i n !