Registration Form
Transcription
Registration Form
Registration Form SEMI SEA - Fundamentals of IC Packaging Seminar 2014 SEMI SEA – Fundamentals of IC Packaging Seminar 30-31 October 2014, MIDA HQ Building, Kuala Lumpur, Malaysia Upon completion, please email or fax to :SEMI Southeast Asia Email: [email protected] Fax No.: +65 6339.6637 Tel: +65 6339.6361 Attention : Ms Linda Tan Registration Profile (You must complete this section to receive an admission badge) Delegate Information 1. Please indicate your level of management or supervisory responsibilities. (Select one) *Salutation □ 01 Executive Management (Chairman, □ 02 Senior Management President, Chief, Managing Director, etc.) (Vice President / Director) □ 03 Other □ 04 Non-management Management □ 05 Other: (Staff / Professional) (Includes Trainee) 2. Please indicate your primary job function. (Select one) *First (Given) Name *Last (Family) Name □ 10 Executive Management / Board Member □ 32 Fabrication and Process Engineering □ 11 Facilities Engineering / Engineering Support □ 29 Human Resources Mgmt □ 16 Mfg. Engineering / Operations Mgmt. □ 34 Assembly / Packaging Engineering □ 17 Marketing, Sales, Business Developmt □ 12 Financial / Industrial Analyst □ 44 Product Management / Engineering □ 23 Quality Assurance & Test Engineering □ 28 Manufacturing and Production □ 27 Training □ 63 Design Engineering (incl. Software, □ 24 Research & Developmt Engineering □ 09 Environment, Health & Safety □ 99 Other: (Please describe) □ 22 Purchasing / Procurement □ 13 Government / Public Policy Systems, Test, Hardware) *Job Title 3. Which of the following best describes your company? (Select one) □ 210 PC / Consumer / Commercial *Company Name Electronics Manufacturer *Company Address *City State *Postal Code / Zip □ 220 Electronic Manufacturing Services (EMS) Provider □ 018 Photovoltaic / PV Cells and Modules Manufacturer □ 230 Electronics Distributor / Reseller □ 010 Semiconductor Device Manufacturer (IDM, foundry) □ 014 MEMS / MST / Micromachines Mfr □ 013 Fabless Semiconductor Manufacturer / Design House □ 012 Assembly & Test Services Provider □ 024 Semiconductor Equipmt Mfr □ 015 Flat Panel Display Manufacturer □ 041 Sub-systems / Components / Parts Manufacturer *Country *Tel (Country/Area Code/Number) Fax (Country/Area Code/Number) □ 016 LED / Optoelectronics / Photonics Manufacturer □ 036 Materials Supplier □ 085 R&D / Academic / Professional □ 050 Software – Electronic Design (EDA) / Silicon Intellectual Property (IP) □ 060 Software – Manufacturing/ Factory Automation □ 087 Media / Publication □ 073 Secondary Equipment and Services □ 090 Manufacturing Products / Consumables □ 070 Manufacturing Services and Consulting Organisations and Institutions □ 103 Construction / Construction Services □ 083 Finance / Investmt Pdts / Services □ 999 Other: (Please describe) □ 080 Professional Services and Consulting 4. Please indicate the technology areas or segment in which you are interested. (Select all that apply) □ 610 Semiconductors □ 617 Flexible / Printed Electronics □ 614 MEMS □ 618 Photovoltaic / PV □ 615 Flat Panel Display □ 619 Nano-electronics □ 616 LEDs/ Solid State Lighting □ 699 Other: (Please describe) *Mobile (Country/Area Code/Number) 5. Please select the product/technology categories of interest to you. (Select all that apply) MANUFACTURING EQUIPMENT MATERIALS SOFTWARE, OTHER PRODUCT AND SERVICES *Email (Receive confirmation letter by email) □ 024-00 Wafer Processing/Front-end Manufacturing Equipment Website □ 022-01 Thin Film Mfg Equipment □ 025-00 Test Equipment 30-31 October 2014 (Thurs – Fri) SEMI Member Non-Member □ □ RM1300 per pax RM1500 per pax □ 021-00 Assembly and Packaging Equip. □ 023-00 Inspection & Measurement/Metrology Products □ 026-00 Other Equipment □ 037-00 □ 036-00 □ 032-00 □ 033-00 Wafers and Substrates Process Materials Chemicals & Solids Gases □ 038-00 Test Materials □ 031-00 Assembly & Packaging Materials □ 039B-00 Other Materials □ 040-00 □ 045-00 □ 050-00 □ 063-00 Sub-Systems Component Parts & Accessories Factory Control Automation Software – Electronic Design/ Silicon Intellectual Property (IP) □ 070-00 Manufacturing Services or Consulting (incl. those service or consulting directly related to manufacturing) MANUFACTURING □ 210-00 Electronic Manufacturing Svcs □ 010-00 Semiconductor Device Mfg. (IDM, Foundries) □ 013-00 Fabless Semiconductor Mfr/ Design Services □ 012-00 Assembly & Test Services Special dietary Request Vegetarian □ 080-00 Business Services or Consulting □ 099-00 Other: (Please describe) □ Programmes and timings are subject to change without prior notice. Applicable to Malaysian companies only Course fee will be debited from Human Resources Development Fund (HRDF) employer’s account. Registered employers will be given 100% financial assistance (subject to terms and conditions). 6. Would you like to receive information on SEMICON Southeast Asia 2015 Penang ? (Select one) □ Yes □ No IMPORTANT: Limited seats are available. Registration based on first-come-first-serve basis. Upon receipt of registration, participant will receive email confirmation within a week. Course fee must be made prior to the event to SEMI Singapore Pte Ltd via bank draft/cheque. No cancellation is allowed once registered. Replacement of participant is permitted with authorisation letter. SEMI SEA - Fundamentals of IC Packaging Seminar 2014 PAYMENT INFORMATION FORM Please m ar k o n e o f t h e 3 p aym en t o p t io n s r ef er en ced b elo w an d co m p let e t h at r elat ed sect io n . Registration from individuals/companies with delinquent balances due SEMI will not be processed. No cancellation is allowed once registered. Replacement of participant is permitted with authorisation letter. 1. PAYMENT BY CHECK or INTERNATIONAL DRAFT (Singapore Dollars) Co m p an y Nam e:_________________________________________________________________ Make ch eck p ayab le t o SEMI Singapore Pte Ltd. (p lease in d icat e “Registration/Invoice No.” o n t h e r ever se sid e o f yo u r ch eck) an d sen d t o : SEMI Sin g ap o r e Pt e Lt d . 161 Laven d er St r eet #04-04 Sin g ap o r e 338750 Ph o n e: + 65.6339.6361 Fax: + 65.6339.6637 2. PAYMENT BY WIRE TRANSFER Wh en p ayin g w it h a w ir e t r an sf er , in st r u ct yo ur b an k t o r ef er en ce yo u r Nam e/ Co m p an y Nam e an d “Fundamentals of IC Packaging Seminar 2014” o n t h e b an k t r an sf er t o en su r e p r o p er cr ed it t o yo u r acco un t . It is t h e cu st o m er ’s r esp o n sib ilit y t o t r ack w ir e t r an sf er s w it h t h eir b an k in t h e even t SEMI d o es n o t r eceive t h e w ir e. Co m p an y Nam e: Or ig in at in g Ban k: Am o u n t o f Tr an sf er : Dat e o f Tr an sf er : Ban k Tr an sf er Rem it t an ce In f o r m at io n : Ben ef iciar y Nam e: Ban k Nam e: Ban k Ad d r ess: Ban k co d e: Br an ch Co d e: SEMI Sin g ap o r e Pt e Lt d St an d ar d Ch ar t er ed Ban k 6 Bat t er y Ro ad #01-00 Sin g ap o r e 049909 7144 001 Singapore SGD $ Acco u n t # 01-005-5128-9 Sw if t Co d e: SCBLSGSG U.S. USD $* Acco u n t # 01-740-2252-2 Sw if t Code: SCBLSGSG *Please use daily bank exchange rate on the date of payment for conversion to US$ 3. PAYMENT BY CREDIT CARD (We accept VISA, Mastercard Only) CC Type: VISA / Mastercard (*delete) CC Holder Name: Expiry Date: CC #: CCV #: Amount: Signature:_____________________________________________ Please return this completed form with your registration form by fax to +65.6339.6637 (SEMI Singapore Office) or email to [email protected]