Heat Sink Design for Thermal Management of Electronics

Transcription

Heat Sink Design for Thermal Management of Electronics
Middle East Technical University
Department of
Metallurgical & Materials Engineering
Heat Sink Design for Thermal Management of Electronics
Uğur ALAKOÇ
Lead Design Engineer
Radar and Electronic Warfare Systems Sector
EW Receiver/Transmitter Technologies Department
Heat sinks are mechanical structures used to transfer heat efficiently. They are the
main heat removal mechanisms for thermal management of electronics. As
technology advances heat fluxes in integrated circuits are getting higher and the
demand for advanced thermal control techniques are increasing. In order to
decrease size, weight and power requirements of military systems and to cope with
increasing hot spots, state of the art heat sinks and cooling methods need to be
developed. In this presentation, heat sink design process from conceptual design to
production will be discussed in detail. First of all, overview of heat sinks and thermal
management methods will be presented. Then, design process of heat sinks will be
given in preliminary design and detailed design phases. The detailed design phase
will be focused on thermo-mechanical design, electronics cooling applications and
how to do thermal simulations. Finally, the talk will conclude with a briefing of
production and verification methods.
Biography
Uğur Alakoç received his B.S. degree from mechanical engineering department of
Middle East Technical University at Ankara in 2001 and received his M.S. degree from
mechanical engineering department of University of Illinois at Chicago in 2003. He is
working as a Lead Thermal Design Engineer at Aselsan Inc. which is the leading
military electronics company of Turkey since 2006. His research interests are
electronics cooling, computational heat transfer, advanced thermal materials,
microchannel and spray liquid cooling technologies.
April 29th 2015 (Wednesday)
12:40 @ Met.E. C-Aud.