S3X58-M500C-5

Transcription

S3X58-M500C-5

www.ko-ki.co.jp
#50024E-0
Revised on Mar. 06, 2013
Koki no-clean LEAD FREE solder paste
Contents
Features
Powerful Wetting Lead Free Solder Paste
Specifications
Continual printing
Viscosity variation
S3X58-M500C-5
Product information
Intermittent printability
Wetting test
Anti-pillow
Voiding
Other properties
Handling guide
This Product Information contains product performance assessed strictly according to our own test procedures
and may not be compatible with results at end-users.
CHALLENGING NEW TECHNOLOGIES
S3X58-M500C-5
2
Product features
Contents
Features
Specifications
Continual printing

Solder alloy composition is Sn 3.0Ag 0.5Cu (SAC305)

EXCELLENT WETTING to severely oxidized patterns or components,
such as oxidized Cu substrate, oxidized Sn and NiPd plating.

PERFECT MELTING and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.25mm dia CSP, 0603 chip).

Specially formulated flux chemistry ensures EXTREMELY LOW VOIDING with
Viscosity variation
Wetting test
Anti-pillow
CSPs and broad contact area components, e.g. QFN.
Voiding

Designed to prevent occurrence of HIDDEN PILLOW DEFECTS.

Enables REUSE of leftover from previous day. Economical.
Other properties
Handling guide
S3X58-M500C-5
3
Specifications
Contents
Features
Specifications
Continual printing
Application
Printing - Stencil
Product
S3X58-M500C-5
Alloy Composition (%)
Sn 3.0Ag 0.5Cu
Melting Point (ºC)
217 - 219
Shape
Spherical
Particle size (µm)
20 - 38
Halide Content (%)
0
Flux Type
ROL0*3
Flux Content (%)
11.5±1.0
Viscosity*1 (Pa.s)
220±30
Cupper plate corrosion*2
Passed
Tack Time
> 48 hours
Shelf Life (below 10ºC)
6 months
Optional powder (µm)
20 – 45; Product code S3X48-M500C-5
Alloy
Viscosity variation
Flux
Wetting test
Anti-pillow
Voiding
Other properties
Product
Handling guide
*1. Viscosity :
*2. Copper plate corrosion :
*3. Flux type :
Malcom spiral type viscometer,PCU-205 at 25ºC 10rpm
In accordance with IPC J-STD-004
According to IPC J-STD-004
S3X58-M500C-5
4
Continual printing
Contents
Features
Specifications
Continual printing
Test condition;
•
•
•
•
•
•
Stencil :
Printer :
Squeegee :
Print speed :
Atmosphere :
Test pattern :
0.12mm thickness, laser cut stencilｌ
Model YVP-Xg YAMAHA Motor
Metal blade, Angle - 60°
40 mm/sec
24~26 ºC (50~60%RH)
0.4mmp QFP pad pattern - Width 0.20 mm Length 1.5 mm Distance 0.2 mm
BGA pad pattern - Diameter 0.25mm
Viscosity variation
1st print
10th print
After 200strokes
10th print
Wetting test
MBGA
(0.25mm dia.)
Anti-pillow
Voiding
Other properties
0.4mmP QFP
Handling guide
Newly developed additives provide a lubricating effect that greatly improves the paste release properties and
assures excellent print quality with micro-BGA, even at high printing speeds.
S3X58-M500C-5
4
5
Continual printing (SPI DATA)
Contents
• SPI:
MAX
KOHYOUNG aSPIre
Quartile
Features
MIN
MBGA 0.25mmdia.
Specifications
0.4mmP QFP
160
160
140
140
120
120
100
100
Wetting test
Volume(%)
Viscosity variation
Volume(%)
Continual printing
80
60
80
60
Anti-pillow
40
40
Voiding
20
20
0
Other properties
0
Initial
After 200 strokes
Initial
After 200 strokes
Handling guide
Newly developed additives provide a lubricating effect that greatly improves the paste release properties and
assures excellent print quality with micro-BGA, even at high printing speeds.
S3X58-M500C-5
6
Viscosity variation
Contents
Features
Specifications
Test condition
•
•
•
•
•
•
Print (knead) solder paste on the sealed-up stencil continually up for 24 hours to observe viscosity variation.
Squeegee :
Metal blades
Squeegee angle :
60°
Squeegee speed :
30mm/sec.
Print stroke :
300mm
Printing environment :
24~26ºC, 40~60%RH
Continual printing
300
Viscosity variation
250
Wetting test
Anti-pillow
Voiding
Viscosity (Pa.s)
200
150
100
S3X58-M500C-5
50
*120 strokes/hour
0
Other properties
Handling guide
0
500
1000
1500
2000
2500
3000
No. of print strokes (times)
A newly developed flux formula has succeeded in delivering consistent long term printability by preventing
excessive viscosity drop due to shear thinning. Furthermore excessive increase of viscosity due to the
chemical reaction between solder powder and flux during print rolling, is also eliminated.
S3X58-M500C-5
7
Intermittent printability (Stencil idle time)
Contents
Features
Specifications
Continual printing
Viscosity variation
Print solder paste continuously and stop to idle the paste for 45min. intervals, and resume the printing and observe the
1st print result to verify intermittent printability.
Test condition
• Squeegee :
• Squeegee angle :
• Squeegee speed :
• Print stroke :
• Printing environment :
• Test pattern :
Metal blades
60°
40mm/sec.
300mm
24~26ºC, 40~60%RH
0.4mmP QFP pad pattern - Width 0.20 mm Length 1.5 mm Distance 0.2 mm
MBGA pad pattern - Diameter 0.25mm
Initial
After 45min
Wetting test
MBGA
(0.25mmdia.)
Anti-pillow
Voiding
Other properties
0.4mmP QFP
Handling guide
Unique solvent formulation system assures extremely long stencil idle time, eliminating printing
faults and improving the process window and production yields.
S3X58-M500C-5
8
Wetting test
Contents
Test conditions
Specifications
Material :
Surface treatment :
Stencil thickness :
Pad size :
Component:
Continual printing
Viscosity variation
•
•
•
•
•
Stencil aperture :
Heat source :
Zone structure :
Atmosphere :
Reflow profile :
250
Glass epoxy FR-4
OSP, ImSn (Pre-reflowed x 2 times),Ni/Au
0.12mm (laser cut)
0.25mm diameter
0603R (0201) chip (100%Sn)
0.5mmP QFP(Ni-Pd)
Ni plate
100% aperture opening to pad
Hot air convection
5 pre-heat zones +2 peak zones
Air
See the reflow profile on the right
200
Temp.
Features
•
•
•
•
150
100
50
0
0
50
100
150
200
250
sec
Wetting test
Wetting to Ni plate
Anti-pillow
0.5mmP QFP
Voiding
Other properties
0.25mm dia.
Convection reflow oven
Handling guide
0603R (0201)
S3X58-M500C-5
9
Wetting test
Contents
MBGA
(0.25mmdia.)
Features
0603R (0201)
0.5mmP QFP（NiPd)
Ni plate
Specifications
Continual printing
OSP
Viscosity variation
Wetting test
ImSn
(Pre-reflowed x 2
times)
Anti-pillow
Voiding
Au
Other properties
Handling guide
Generally, S3X58-M500C-5 indicated good coalescence with super fine patterns as well as large pads. It showed good
meniscus/wetting to a Ni plate (simulation test to QFP component) while a competitive product had lesser results.
S3X58-M500C-5
10
Wetting test – Solder dewetting
Contents
Features
Specifications
Test condition
•
•
•
•
Material pieces :
Stencil thickness :
Stencil aperture :
Heat source:
Nickel, Copper, ImSn
0.20mm (laser cut)
6.5mm diameter
Same as “Wetting test”
Preparation (ImSn)
Store inside the oven at 180ºC (10 hrs).
Preparation (Ni)
Preparation (Cu)
Continual printing
The nickel plates must be cleaned with acetone, dry with
a mop, put them in a hydrochloride acid bath (1.75% in
weight) for 2 min, then clean the acid with de-ionized
water and air dry.
The copper plates must be cleaned with acetone, dry with a mop, put
them in a hydrochloride acid bath (1.75% in weight) for 5 min, and then
clean the acid with de-ionized water and air dry.
Viscosity variation
Store inside the oven in boiling de-ionized water for 5
minutes.
Oxidized Ni
Store inside the oven at 70ºC in a pot of de-ionized water (70 %RH for
24 hrs).
Oxidized Cu
Oxidized ImSn
Wetting test
M500C-5
Anti-pillow
Voiding
Other properties
Conventional
Handling guide
S3X58-M500C-5 secures good solder spreading even on the oxidized Ni ,Cu plates and ImSn pｌates.
S3X58-M500C-5
11
Anti-pillow test
Contents
Features
Specifications
Continual printing
Viscosity variation
Test condition
•
•
•
•
•
•
•
•
Good
Material :
Surface treatment :
Stencil thickness :
Pad size :
Component:
Stencil aperture :
Heat source :
mount interval:
Glass epoxy FR-4
OSP
0.12mm (laser cut)
0.8 x 0.8mm diameter
0.76mm ball SAC305
100% aperture opening to pad
Solder pod 275ºC
10sec.
NG
Drop a solder ball every 10 sec. after the solder paste
has melted to see the heat durability of flux.
Pillow defect
30sec
40sec
50sec
Wetting test
M500C-5
Anti-pillow
Voiding
Other properties
Conventional
solder paste
Handling guide
S3X58-M500C-5 indicates much longer heat durability up to 50sec., while the conventional solder paste lost
activation in less than 30 sec. once the solder paste had started to melt. The results demonstrates that S3X58M500C-5 effectively prevents the occurrence of head-in-pillow defects.
S3X58-M500C-5
12
Voiding
Contents
Features
Specifications
Continual printing
Viscosity variation
Test condition
•
•
•
•
Material :
Surface treatment :
Stencil thickness :
Components
• Heat source :
• Atmosphere :
• Reflow profile :
Surface finish
Glass epoxy FR-4
OSP, ImSn, NiAu
0.12mm (laser cut)
PwTr,2012R (0805)100% - Sn plated
BGA ball - SAC305, QFN Sn plated
Hot air convection
Air
Same as “Wetting test”
Pwtr.
QFN
BGA
PwTr
QFN
2012R (0805)
2012R(0805)
BGA
OSP
Wetting test
Anti-pillow
Voiding
ImSn
Other properties
Handling guide
NiAu
S3X58-M500C-5
13
Other properties
Contents
Features
Specifications
Continual printing
Item
Tack time
Result
Method
> 48 hours
JIS Z 3284
Heat slump
0.4mm pass
JIS Z 3284
Solder balling
< Category 3
JIS Z 3284
Viscosity variation
Wetting test
Anti-pillow
Copper mirror corrosion
Type L
IPC-JSTD-004
Copper plate corrosion
Pass
IPC-JSTD-004
JIS Z 3194
> 1E+9
IPC-JSTD-004
JIS Z 3194
Voiding
Other properties
Voltage applied SIR
Handling guide
S3X58-M500C-5
14
Handling guide
Contents
1. Printing
Features
Specifications
Continual printing
Viscosity variation
Wetting test
Anti-pillow
1) Recommended printing parameters
(1) Squeegee
1. Kind
: Flat
2. Material
: Rubber or metal blade
3. Angle
: 60~70º (rubber) or metal blade
4. Pressure
: Lowest
5. Squeegee speed
: 20~80mm/sec.
(2) Stencil
1. Thickness
2. Type :
3. Separation speed
4. Snap-off distance
(3) Ambiance
1. Temperature
2. Humidity
3. Air Flow
Voiding
:
:
:
:
150~100µm for 0.65~0.4mm pitch pattern
Laser or electroform
7.0~10.0mm/sec.
0mm
: 23~27ºC
: 40~60%RH
: Excessive air flow in the printer badly affects stencil life and tack performance
of solder pastes.
2. Shelf life
Other properties
0~10ºC
: 6 months from manufacturing date
* Manufacturing date can be obtained from the lot number
Handling guide
ex.
Lot No. 3 03 06 2
No. of lot :
Date
:
Month
:
Year
:
2nd
6th
March
2013
S3X58-M500C-5
15
Handling guide - Recommended reflow profile
Contents
Features
Specifications
Continual printing
Peak temp.
230~250ºC
(ºC)
250
Viscosity variation
200
Pre-heat temp.
150~200ºC 60~100sec.
Wetting test
Anti-pillow
150
100
Voiding
Other properties
Handling guide
Over 220ºC >30 sec
50
Pre-heat conditions
Upper limit: 180~200ºC 100sec
Lower limit: 150~175ºC 60sec
Ramp-up temp.
1.0~3.0ºC/sec.
0
60
120
(sec.)
180
240
S3X58-M500C-5
16
Handling guide - Recommended reflow profile
Contents
Shorter TAL and lower peak temperature may become
a cause of voiding.
In case relatively larger volume of voiding is observed,
it is recommended either to increase the peak
temperature or extend TAL (for >45sec.).
Features
(ºC)
Specifications
250
Continual printing
Viscosity variation
200
Higher pre-heating temperature may lead to
grainy solder fillet or de-wetting by accelerating
oxidization of the solder alloy and exhaustion of
the flux activation. It is recommended to decrease
pre-heating temperature in case poor solder
wetting is observed.
150
Wetting test
Anti-pillow
100
Voiding
50
Other properties
Handling guide
0
Fast ramp-up speed is prone to cause bridging ,
mid-chip balling or solder beading by promoting
heat slumping. It is recommended to slow down
ramp-up temperature to alleviate the degree of
heat slump of the solder paste.
60
120
(sec.)
Similarly to the pre-heating, slow
temperature elevation between preheating to the peak is prone to cause
grainy solder fillet and/or de-wetting to
the pad due to excessive oxidization of
the solder alloy, pad surface and
exhaustion of the flux activation.
It is recommended to quicken
temperature elevation speed in case
the poor solder wetting is observed.
180
240

S3X58-M500C-5

Transcription

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