Global Technical Committee

Transcription

Organizational Chart
● China
● Europe
● Japan
● Korea
● North
America
● Taiwan
Last updated: March 13, 2015
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Global Technical
Committee and TC
Chapters
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CFG
CFG
CFG
Legend:
TCC — the Locale has a TC Chapter of the global technical committee.
CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.
Note 1: An underlined Locale has an RSC and may also be referred as “a Region” (e.g., “Europe Region”).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
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Legend:
Note 1: An underlined Locale has ab RSC and may also be referred as “a Region” (e.g., “Europe Region”).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
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CFG
Legend:
Note 1: An underlined Locale has an RSC and may also be referred as “a Region” (e.g., “Europe Region”).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (red rectangles).
* In NA, Micropatterning is traditionally called Microlithography.
** In Japan, Assembly & Packaging is traditionally called Packaging.
*** In Japan, Automated Test Equipment is traditionally called Test.
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Regional Standards Committee (RSC)
Organizations
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SEMI Europe RSC Organization
Co-chairs: Bert Planting - ASML, Werner Bergholz - Jacobs University of Bremen
Vice-chair: Frank Petzold - Trustsec
Europe Chapter of Automation
Technology Global Technical Committee
C: Christian Hoffman - PEER Group
Europe Chapter of Compound Semiconductor
Materials Global Technical Committee
C: Arnd Weber - SiCrystal
Europe Chapter of Gas Global Technical
Committee
C: Jean-Marie Collard - Solvay Chemicals
C: Gordon Ferrier - Tiger Optics
Europe Chapter of Liquid Chemicals
Europe Chapter of Information & Control
C: Alfred Honold - InReCon
C: Frank Petzold - Trustsec
Europe Chapter of Metrics Global Technical
Committee
C: Lothar Pfitzner - FhG IISB
Europe Chapter of Physical Interfaces &
Carriers Global Technical Committee
Europe Chapter of PV Materials Global
Technical Committee
C: Peter Wagner - Consultant
C: Huber Aulich - Solar Valley
Europe Chapter of Silicon Wafer Global
Technical Committee
C: Werner Bergholz - Jacobs University of Bremen
C: Fritz Passek - Siltronic
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SEMI Japan RSC Organization
Co-Chair: Mitsuhiro Matsuda - Hitachi Kokusai Electric
Co-Chair: Naoyuki Kawai - The University of Tokyo
Vice Chair: Supika Mashiro - TEL
Japan Chapter of Automation
C: Terry Asakawa -TEL
C: Ken Sambu - Mitsubishi Electric
C: Makoto Ishikawa - Nisshinbo Mechatronics
Japan Chapter of Compound Semiconductor
C: Masayoshi Obara - Shin-Etsu Handotai
Japan Chapter of Environmental Health
& Safety Global Technical Committee
C: Supika Mashiro - TEL
C: Hidetoshi Sakura - Intel
C: Moray Crawford - Hatsuta Seisakusho
Japan Chapter of Gases & Facilities
Technical Committee
C: Hiromichi Enami - Hitachi High-Technologies
C: Isao Suzuki - MKS Japan
Japan Chapter of FPD Materials &
Components Global Technical Committee
C: Tadahiro Furukawa - Yamagata University
C: Yoshihiko Shibahara - FUJIFILM
Japan Chapter of FPD Metrology Global
Technical Committee
C: Ryoichi Watanabe - Japan Display
C: Akira Kawaguchi - Otsuka Electronics
Japan Chapter of Information & Control
Japan Chapter of PV Materials
C: Takayuki Nishimura - SCREEN Semiconductor
Solutions
C: Mitsuhiro Matsuda - Hitachi Kokusai Electric
C: Takashi Ishihara - Mitsubishi Electric
C: Kazuhiko Kashima - GlobalWafers Japan
C: Tetsuo Fukuda - AIST
Japan Chapter of Liquid Chemicals
C: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN Semiconductor
Solutions
Japan Chapter of Metrics
C: Toshio Murakami – Murakami
Corporation
Japan Chapter of Micropatterning
C: Morihisa Hoga - Dainippon Printing
Japan Chapter of Packaging
C: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
C: Yutaka Koma - Koma Consulting
Japan Chapter of Physical Interfaces &
C: Tsuyoshi Nagashima - Miraial
C: Tsutomu Okabe - TDK
C: Kenji Yamagata - DAIFUKU
Japan Chapter of Silicon Wafer
C: Naoyuki Kawai - The University of Tokyo
C: Tetsuya Nakai - SUMCO
Special Groups
Reporting to the JRSC
Standardization Process
Improvement (SPI)
L: Supika Mahiro -TEL
FPD Coordination Group
L: Yoshitada Nogami - SK
Electronics
L: Makoto Yamamoto - Muratec
Japan Chapter of Traceability
C: Yoichi Iga - Freelance
C: Hirokazu Tsunobuchi - Keyence
Japan Chapter of Test
C: Hirofumi Kaga - Renesas Electronics
C: Takashi Umenaga -Teradyne
Japan Chapter of PV Global
Technical Committee
C: Hiromu Takatsuka - PVTEC
C: Kazuhiko Kashima - GlobalWafers
Japan
C: Masaaki Yamamichi - AIST
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SEMI North America (NA) RSC Organization - NA Locale
Co-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant
NA Chapter of 3DS-IC Global
Technical Committee
C: Richard Allen - NIST
C: Sesh Ramaswami - Applied Materials
C: Chris Moore - BayTech-Resor
NA Chapter of Automated Test
Equipment Global Technical Committee
C: Ajay Khoche - Khoche Consulting
NA Chapter of Compound Semiconductor
C: Russ Kremer - Freiberger Compound Materials
C: James Oliver - Northrop Grumman
NA Chapter of Environmental Health &
Safety Global Technical Committee
C: Chris Evanston - Salus Engineering
C: Sean Larsen - Lam Research
C: Bert Planting - ASML
NA Chapter of Facilities Global
Technical Committee
C: Steve Lewis - DPS Engineering
NA Chapter of Flat Panel Display
C: Bill Colbran - Engenuity Systems
NA Chapter of Gases
C: Tim Volin - Parker Hannifin
C: Mohamed Saleem - Fujikin
NA Chapter of HB-LED Global
Technical Committee
C: Iain Black - Philips
C: Mike Feng - Silian
NA Chapter of Information & Control
C: Jack Ghiselli - Ghiselli Consulting
C: Brian Rubow - Cimetrix
C: Lance Rist - Industry Consultant
NA Chapter of Liquid Chemicals
C: Frank Flowers - PeroxyChem
C: Frank Parker - ICL
NA Chapter of MEMS/NEMS
C: Win Baylies - BayTech-Resor
C: Steve Martell - Sonoscan
NA Chapter of Metrics Global
Technical Committee
C: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
NA Chapter of Microlithography
C: Wes Erck - Wes Erck & Associates
C: Rick Silver - NIST
NA Chapter of Photovoltaic
C: James Moyne - University of
Michigan
NA Chapter of Physical Interfaces &
C: Matt Fuller - Entegris
C: Stefan Radloff - Intel
NA Chapter of Silicon Wafer
C: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein - Intel
NA Chapter of Traceability
C: Yaw Obeng - NIST
NA RSC Technical Architect
Board
Michigan
C: Yaw Obeng - NIST
NA Chapter of PV Materials
C: Lori Nye - Brewer Science
C: John Valley - Sun Edison
C: Hugh Gotts - Air Liquide
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SEMI North America RSC Organization – China Locale
China Chapter of PV Global
Technical Committee
C: Guangchun Zhang CanadianSolar
C: Jun Liu - China Electronics
Standardization Institute
China Chapter of HB-LED
C: Yong Ji - Guizhou Haotian
Optoelectronics Technology
C: Weizhi Cai - San’an
Optoelectronic
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SEMI North America RSC Organization – Korea Locale
Korea EHS CFG
L: Seung Jong Ko - SK hynix
L: Hyunsuk Kim - Samsung
Electronics
Korea Gas & Chemicals CFG
L: TBD
Korea Chapter of FPD Global
Technical Committee
C: JongSeo Lee - Samsung Display
C: II-Ho (William) Kim - Light
Measurement Solution
Korea Chapter of FPD Metrology
C: JongSeo Lee - Samsung Display
Korea Chapter of Global Facilities
Technical Committee
C: Kwang Sun Kim - KUT
Korea Chapter of Information &
Control Global Technical Committee
C: Hyungsu Kim - Doople
C: Chul Hong Ahn - SK hynix
C: Gun Woo Lee - Miracom Inc.
Korea HB-LED CFG
L: HyeongSoo Park - SEMES
L: Jong Hyeob Baek - KOPTI
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Taiwan
TC Chapters
SEMI
North
America RSC Organization – Taiwan Locale
Taiwan Chapter of 3DS-IC
C: Tzu-Kun Ku - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Roger Hwang ASE
Taiwan Chapter of EHS Global
Technical Committee
C:Shuh-Woei Yu - SAHTECH
C: Fang-Ming Hsu - TSMC
Taiwan Chapter of Flat Panel Display
C: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu - TDMDA
Taiwan Chapter of Information and
C:Robert Chien - TSMC
Taiwan Chapter of Photovoltaic
C : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolar
C : Ray Sung - UL Taiwan
ISC Taiwan Advisor
Tzeng-Yow Lin - CMS/ITRI
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Organization of Each TC
Chapter
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3DS-IC Global Technical Committee
NA TC Chapter of 3DS-IC
C: Richard Allen - NIST
C: Sesh Ramaswami - Applied
Materials
3DS-IC Bonded Wafer
Stack TF
L: Richard Allen - NIST
Taiwan TC Chapter of 3DS-IC
C: Tzu-Kun Ku - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Roger Hwang - ASE
Test TF
L: Tzong-Tsong Miau - ITRI
L: Roger Hwang - ASE
L: Ming-Chin Tsai - KYEC
3DS-IC Inspection and
Metrology TF
L: Victor Vartanian SEMATECH
L: David Read - NIST
Middle End Process TF
L: Arthur Chen - NTUST
L: Erh Hao Chen - ITRI
L: Jerry Yang - SEMATECH
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Assembly & Packaging Global Technical Committee
Japan TC Chapter of Packaging
Technical Committee
C: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
C: Yutaka Koma - Koma Consulting
3D-IC SG
L: Masahiro Tsuriya - iNEMI
L: Haruo Shimamoto - AIST
Fiducial Mark
Interoperability TF
L: Sumio Masuchi - Disco
450 mm ATDP TF
L: Akihito Kawai - Disco
L: Sumio Masuchi - Disco
L: Kiyofumi Tanaka – Shin-Etsu
Polymer
L: Kenichi Watanabe - Lintec
Electromagnetic
Characterization SG
L: Mikio Kiyono - AET
Thin Chip Handling TF
L: Hideki Suzuki - Shin-Etsu
Polymer
L: Kazuhiko Nakamura Consultant
L: Haruo Shimamoto - AIST
Packaging 5 Year Review
TF
L: Masahiro Tsuriya - iNEMI
L: Kazunori Kato - AiT
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Automation Technology Global Technical Committee
Europe TC Chapter of Automation
C: Christian Hoffman - PEER Group
Japan TC Chapter of Automation
C: Makoto Ishikawa - Nisshinbo Mechatronics
C: Ken Sambu - Mitsubishi Electric
C: Terry Asakawa - TEL
Global PV Equipment Interface
Specification (EIS) TF
Global PV Equipment Interface
Specification (PV-EIS) TF
L: Carsten Born - VITRONIC GmbH
L: Makoto Ishikawa - Nisshinbo
Mechatronics
PV Wafer Traceability TF
L: TBD
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Automated Test Equipment Global Technical
Committee
Japan TC Chapter of Test
Technical Committee
C: Hirofumi Kaga - Renesas
Electronics
C: Takashi Umenaga -Teradyne
NA TC Chapter of Automated Test
Equipment Technical Committee
C: Ajay Khoche - Khoche Consulting
Standard Test Data
Format (STDF) TF
L: Ajay Khoche - Khoche
Consulting
Test Cell Communcations
TF
L: Len Van Eck - LTXCredence
L: Mark Roos - Roos
Instruments
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Compound Semiconductor Materials
(CSM) Global Technical Committee
Europe TC Chapter of CSM
C: Arnd Weber - SiCrystal
Contactless Resistivity
and Mobility Mapping TF
L: Wolfgang Jantz - Semimap
Japan TC Chapter of CSM
C: Masayoshi Obara - Shin-Etsu
Handotai
C: open
NA TC Chapter of CSM Global
Technical Committee
C: Russ Kremer - Freiberger
Compound Materials
C: James Oliver - Northrop
Grumman
GaN TF
International SiC TF
L: Taizo Hoshino - Nippon Steel
& Sumikin Materials
L: Judy Kronwasser - NOVASiC
Electrical Properties TF
Sapphire Substrate TF
L: Austin Blew - LEI
SiC TF
L: Arnd Weber - SiCrystal
L: Toshiro Kotaki - Namiki
Precision Jewel
5 Year Review TF
L: TBD
Global 200 mm GaAs
Wafer Specification TF
SEMI M55 5-Yr Review TF
L: Judy Kronwasser - NOVASiC
Silicon Carbide TF
L: TBD
L: Open
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Environmental,
Health & Safety (EHS) Global Technical Committee
Japan TC Chapter of EHS
C: Supika Mashiro - TEL
C: Hidetoshi Sakura - Intel
C: Moray Crawford - Hatsuta
Seisakusho
Taiwan TC Chapter of EHS
C: S. W. Yu - SAHTECH
C: F. M. Hsu - TSMC
IC Equipment Safety TF
FPD System Safety TF
L: Naokatsu Nishiguchi
- Dainippon Screen
Manufacturing
GHG Emission
Characterization TF
L: George Hoshi - TEL
L: Tetsuya Kitagawa - Sony
L: Colin Shen - MXIC
L: C. C. Huang - SAHTECH
EHS TC Chapter
Advisor
Roger Wu - UMC
FPD Safety Subcommittee
L: C. C. Huang - SAHTECH
Global S23 Revision TF
L: George Hoshi - TEL
Gas and Chemical Safety
TF
L: Benny Chen - AUO
L: Heng-Li Sue - SAHTECH
L: Moony Lee - UMC
Seismic Protection
TF
L: Eiji Nakatani - SCREEN
Semiconductor Solutions
Equipment Safety TF
L: Benny Chen - AUO
L: Juo Cho - AUO
L: Alice Lin - CMO
Environmental
Sustainability TF
L: Tony C. H. Lu - ITRI
L: C Y Huang - TSMC
STEP Planning WG
L: Kenji Sugihara - Panasonic
PV Safety
TF
L: Eddie Wu - Nexpower
Seismic TF
L: K. C. Tsai - NCREE
L: J. S. Hwang - NCREE
L: D. W. Sun - TSMC
LED Safety
TF
L: Eric Lin - Epistar
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Environmental,
Health & Safety Global Technical Committee
NA TC Chapter of EHS Global
Technical Committee
Korea TC Chapter of EHS CFG
C: Chris Evanston - Salus Engineering
C: Sean Larsen - Lam Research
C: Bert Planting - ASML
L: Seung Jong Ko - SK hynix
L: Hyunsuk Kim - Samsung
Electronics
S2 Sub-WG
S6 Revision TF
S1 Revision TF
L: Deok Seop Shim - TUV
Rheinland
S23 Sub-WG
L: Sangyun Jung - Samsung
Electronics
L: John Visty - Salus
Engineering
L: Glenn Holbrook - TUV SUD
L: Lauren Crane - KLA-Tencor
L: Edward Karl - Applied
Materials
Manufacturing Equipment Safety
Subcommittee
C: Cliff Greenberg - Nikon Precision
C: Andrew Giles - ESTEC
C: Lauren Crane - KLA-Tencor
S10 Revision TF
L: Bert Planting - ASML
L: Tom Pilz - Pilz GmbH
Ergonomics TF
L: Ron Macklin - Macklin &
Associates
L: Paul Schwab - Texas
Instruments
Seismic Liaison TF
Hazardous Energy Control
Isolation Devices TF
L: Chris Evanston - Salus
Engineering
L: Sean Larsen - Lam Research
L: Andrew Giles - ESTEC
AG L: Mark Fessler - Tokyo
Electron
Lifting Equipment TF
S2 Interlock Reliability TF
S2 Chemical Exposure TF
L: Bert Planting - ASML
L: Tom Pilz - Pilz GmbH
Engineering
Associates
Fire Protection TF
S7 Revision TF
S2 Ladders & Steps TF
S22 Revision TF
L: Eric Sklar - Safety Guru
L: Matt Wyman - Koetter Fire
Associates
L: Carl Wong - AKT
L: Lindy Austin - Salus
Engineering
S2 Non-Ionizing Radiation
TF
Engineering
L: Chris Evanston - Salus
Engineering
Global S23 TF
Energetic Materials EHS
TF
L: Steve Trammell SEMATECH
L: Andy McIntyre - EORM
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Facilities Global Technical Committee
Japan TC Chapter of Facilities
Korea TC Chapter of Facilities
C: Hiromichi Enami - Hitachi High
Technologies
C: Kwang Sun Kim - KUT
NA TC Chapter of Facilities
C: Steve Lewis - DPS Engineering
F51 Revision TF
L: Dalia Vernikovsky - Applied
Seals North America
5-year Review TF
L: Yoshifumi Machii - Fujikin
Equipment Cleanness TF
L: Insoo Cho - Shinsung ENG
F1 Revision TF
Building Information Modeling (BIM) for
Semiconductor Capital Equipment TF
L: Ben Bruce - Applied Materials
L: Shuji Moriya - Tokyo Electron
Yamanashi
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FPD Metrology Global Technical Committee
Japan TC Chapter of FPD Metrology
C: Ryoichi Watanabe - Japan Display
C: Akira Kawaguchi - Otsuka Electronics
Korea TC Chapter of FPD Metrology
C: JongSeo Lee - Samsung
Display
Taiwan TC Chapter of FPD Metrology
C: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu - TDMDA
Liaison TF
D31 Revision TF
L: Kose Tanahashi - Samsung
Electronics
L: Masao Kochi - Highland
L: Keizo Ochi - Konica Minolta
Perceptual Viewing Angle
TF
L: Myongyoung Lee - LG
Electronics
LCD Subcommittee
L: YP Lan - ITRI
L:DA Chang - Kingbird
L:RJ Chuang - TDMDA
L:Tony Chiu - CIPO
L: Kerson Wang - AUO
Flexible Display TF
Perceptual Image Quality
TF
L: Jongho Chong - Samsung
Display
L: WangWen - Tung - ITRI
Touch Screen Panel TF
Transparent Display TF
L: Yen-Wen Fang - AUO
L: S.Y. Chou - CMS/ITRI
L:JongSeo Lee - Samsung
Display
E-Paper Display TF
L: Fang Hui - Mei
L: Bor-Jiunn Wen - CMS/ITRI
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FPD Materials & Components
Japan TC Chapter of FPD Materials &
Components Global Technical Committee
C: Tadahiro Furukawa - Yamagata University
C: Yoshihiko Shibahara - Fujifilm
Flexible Display TF
L: Haruhiko Itoh - Teijin
L: Tadahiro Furukawa Yamagata University
FPD Mask TF
L: Kaname Nitobe - HOYA
L: Kazuya Shiojiri - SK
Electronics
FPD Color Filter TF
L: Tadahiro Furukawa Yamagata University
Polarizing Film TF
L: Toshihito Otsuka - Sanritz
L: Yoshihiko Shibahara Fujifilm
L: Shigeo Kobayashi - Nitto
Denko
Korea TC Chapter of FPD
Technical Committee
C: JongSeo Lee - Samsung
Display
NA TC Chapter of FPD
Technical Committee
C:Bill Colbran - Engenuity Systems
LCD Subcommittee
L: JongSeo Lee - Samsung
Display
PDP Subcommittee
L: SeKwang Park - Kyungpook
Univ.
OLED Subcommittee
L: Choonghoon Yi MODISTECH
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Gases Global Technical
Committee
Europe TC Chapter of Gas
C: Jean-Marie Collard - Solvay
Chemicals
Japan TC Chapter of Gases
C: Hiromichi Enami - Hitachi High
Technologies
C: Tim Volin - Parker Hannifin
C: Mohamed Saleem - Fujikin
L: TBD
Gas Specifications TF
Gas Panel Test Method TF
NA TC Chapter of Gases
Korea Gas & Liquid Chemicals
CFG
L: Mark Ripkowski - CONSCI
Filters & Purifiers TF
L: Mohamed Saleem - Fujikin
Yamanashi
Heater Jacket TF
Standardization of live Gas
Flow Rate Study Group
L: David Colquhoun - BriskHeat
Materials of Construction
Gas Delivery Systems TF
L: Tim Volin - Parker
Hannifin
L: Bill Kiikvee - AP TECH
Pressure Measurement TF
L: Joyce Chen - UCT
L: Jeff Christian - WIKA
Yamanashi
Mass Flow TF
L: Mohamed Saleem - Fujikin
Surface Mount Sandwich
Component Dimensions TF
L: Matt Milburn - UCT
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HB-LED Global Technical Committee
China TC Chapter of HB-LED
C: Yong Ji - Guizhou Haotian
C: Weizhi Cai - San’an
Optoelectronic
Korea HB-LED CFG
NA TC Chapter of HB-LED
L: HyeongSoo Park - SEMES
L: Jong Hyeob Baek - KOPTI
C: Iain Black - Philips
C: Mike Feng - Silian
Single Crystal Sapphire TF
L: Yong Ji - Guizhou Haotian
L: Xinhong Yang - AURORA
Sapphire Single Crystal Ingot
TF
L: Hongo Zuo - AURORA
Patterned Sapphire
Substrate (PSS) TF
HB-LED Wafer TF
L: Win Bayles - BayTech-Resor
HB-LED Equipment
Communication Interfaces TF
L: Brian Rubow - Cimetrix
GaN based LED Epitaxial Wafer
TF
L: Donghai Wu - THTF
L: Xinhong Yang - AURORA
HB-LED Impurities and Defects
in Sapphire Wafers TF
L: Luke Glinski - GT Advanced
Technologies
HB-LED Tablet WG
L: Chris Moore - BayTechResor
HB-LED Assembly TF
L: Paul Reid - Kulicke & Soffa
HB-LED Equipment
Automation Interfaces TF
L: Daniel Babbs - Brooks
Automation
L: Jeff Felipe - Entegris
Test Methods TF
L: Peter Wagner - Self
25 / 37
Information & Control Global Technical Committee
Europe TC Chapter of Information &
Korea TC Chapter of Information &
Japan TC Chapter of Information &
C: Takayuki Nishimura - SCREEN
Semiconductor Solutions
C: Mitsuhiro Matsuda - Hitachi Kokusai
Electric
Adviser: Mitch Sakamoto - Freelance
TA
Hiroshi Kondo - Murata
Machinery
Tadashi Mochizuki - TEL
Process Control Systems
TF
L: Martin Schellenberger - FhG
IISB
Equipment Information
System Security TF
Japan I&CC Maintenance
TF
L: Mitch Sakamoto - Freelance
L: Hideaki Ogihara - Reno SubSystems
L: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
C: Hyungsu Kim - Doople
C: Chul Hong Ahn - SK hynix
C: Gun Woo Lee - Miracom Inc.
GEM300 TF
L: Jong Sub Shim - ASM
L: Chang Yul Cho - SEMES
L: Byoung Min Im - TEL Korea
DDA TF
L: Hyungsu Kim - Doople
Fiducial Mark
Interoperability TF
L: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
GEM300 TF
L: Yoshihisa Takasaki SCREEN Semiconductor
Solutions
L: Yuko Toyoshima - Hitachi
High-Technologies
Sensor Bus TF
L: Hideaki Ogihara - Reno SubSystems
26 / 37
Information & Control Global Technical Committee
NA TC Chapter of Information &
C: Brian Rubow - Cimetrix
C: Jack Ghiselli - Ghiselli Consulting
C: Lance Rist - Industry Consultant
Taiwan TC Chapter of Information &
C: Robert Chien - TSMC
Liaison - TSIA
Celia Shih - TSIA
Factory Integration TF
Diagnostic Data
Acquisition (DDA) TF
L: Gino Crispieri - Consultant
Sensor Bus TF
Michigan
Information & Control TC
Chapter Advisor
L : MT Yeh - PSC
L: Robert Weng - TEL
L: H. S You - Energywell
Thomas W.Y Chen - TSMC
Energy Saving Equipment
Communication TF
L: Mike Czerniak - Edwards
Vacuum
Equipment Engineering
System (EES) TF
Process Control System
Architecture (PCS) TF
L : Ivan Chen - TSMC
L: Jack Huang - MKS
L: James Moyne - University of
Michigan
L: Chris Maloney - Intel
Automated Material
Handling System (AMHS) TF
GEM300 TF
L :William Liu - UMC
L: Hu Szn Fan - UMC
27 / 37
Liquid Chemicals Global Technical Committee
Europe TC Chapter of Liquid Chemicals
Japan TC Chapter of Liquid Chemicals
C: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN Semiconductor
Solutions
Korea Gas & Liquids
Chemicals CFG
L: TBD
NA TC Chapter of Liquid Chemicals
Liquid Filter TF
Permeation Tubes for Trace
Moisture Calibration TF
L: Jean-Marie Collard - Solvay
Chemicals
L: Jim Mc Kinley - KIN-TEK
L: Takuya Nagafuchi - Nihon
Entegris
L: Takehito Mizuno - Nihon Pall
Liquid Chemicals
Subcommittee
Precursor Specifications
TF
L: Paul Williams - SAFC Hitech
C: open
Liquid-Borne Particle
Counter TF
L: Kaoru Kondo - RION
L: Kazutoshi Kato - PMS
Liquid Chemical Distribution
Subcommittee
Analytical Methods TF
L: Frank Flowers - PeroxyChem
SEMI F31, F39 & F41
Rewrite TF
L: David Kandiyeli - Mega Fluid
Systems
L: Koh Murai - Mega Fluid
Systems
Diaphragm Valve TF
Solvents in Advanced
Processes TF
L: TBD
L: Shigeru Ohsugi - CKD
L: Kimihito Sasao - Advance
Electric
Welding Fitting TF
L: Kimihito Sasao - Advance
Electric
L: Takashi Hasegawa - KITZ
SCT
SEMI F40 Rewrite TF
Determining Roughness
of Polymer Surfaces TF
SEMI F57 Rewrite TF
UPW Filter Performance
TF
L: Slava Libman - Air Liquide
Ultrapure Liquid
Evaluation Study Group
L: Kaoru Kondo - Rion
L: Hiroshi Sugawara - Organo
L: Don Hadder Jr. - Intel
L: Gunter Moeller - Arkema
Group
SEMI IX Resin TF
L: James Henry - Arkema
Group
L: Ian Francisco - Lam
Research
SEMI F63 Rewrite TF
28 / 37
MEMS/NEMS Global Technical Committee
NA TC Chapter of MEMS/NEMS
C: Steve Martell - Sonoscan
Packaging TF
L: Steve Martell - Sonoscan
Wafer Bond TF
L: Win Baylies - BayTech-Resor
L: Richard Allen - NIST
International MEMS
Terminology TF
L: Steven Martell - Sonoscan
Material Characterization
TF
L: Kevin Turner - University of
Pennsylvania
Microfluidics TF
L: Mark Tondra - Diagnostic
Biosensors
Reliability TF
L: Open
29 / 37
Metrics Global Technical Committee
Europe TC Chapter of Metrics
C: Lothar Pfitzner - FhG IISB
NA TC Chapter of Metrics
Japan TC Chapter of Metrics
C: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
TE: Carolyn Busing - Self
TE: Chona Shumate - Cymer
TA: Greg Francis - Cymer
C: Toshio Murakami - Murakami
Corporation
Int'l Environmental
Contamination Control TF
L: Mikio Furukawa - Shin-Etsu
Polymer
Cycle Time Metrics TF
L: Kenichiro Mukai - Applied
Materials Japan
L: Supika Mashiro - TEL
ESD/ESC TF
L: Toshio Murakami Murakumi Corporation
EMC Study Group
L: Koji Ochi - Noise Laboratory
Wait Time Waste Metrics
and Methods TF
L: Lance Rist - Industry
Consultant
ESD/ESC TF
L: Arnold Steinman - Electronics
Workshop
L: open
EMC TF
L: Vladimir Kraz - BestESD
Technical Services
L: Mark Frankfurth - Cymer
Equipment RAMP Metrics
TF
L: David Busing - Consultant
L: Steven Meyer - Intel
Metrics Education & Adoption
(MEA) Subc (inactive)
C: TBD
Equipment Training &
Documentation TF
L: Mark Cohran - Intel
L: Malthi Venkat - Nikon Precision
Factory Level Productivity
Metrics TF (inactive)
L: Ron Billings - Georgia Tech/
FABQ
L: Jim Irwin - I/C Irwin Consulting
Equipment Cost of
Ownership TF (inactive)
L: Daren Dance - WWK
L: David Bouldin - Fab Consulting
30 / 37
Micropatterning Global Technical Committee
Japan TC Chapter of Micropatterning
C: Morihisa Hoga - Dainippon Printing
C: open
Mask Data Format for
Mask Tools TF
L: Toshio Suzuki - Dainippon
Printing
5 Year Review TF
NA TC Chapter of Microlithography
C: Wes Erck - Wes Erck &
Associates
C: Rick Silver - NIST
Terminology of Metrology
TF
Extreme Ultraviolet (EUV)
Mask TF
L: Jim Potzick - NIST
L: David Chan - SEMATECH
L: Morihisa Hoga - Dainippon
Printing
Standards for
Scatterometry TF
L: Thomas Germer - NIST
Data Path TF
L: Thomas Grebinski - OASIS
Tooling
L: Kurt Wampler - ASML
Mask Orders (P10) TF
L: Wes Erck - Wes Erck &
Associates
Extreme Ultraviolet (EUV)
Fiducial Mark TF
L: Long He - SEMATECH
31 / 37
Photovoltaic Global Technical Committee
China TC Chapter of PV
C: Guangchun Zhang CanadianSolar
C: Jun Liu - China Electronics
Standardization Institute
Crystalline Silicon Solar Cell TF
L: Dengyuan Song - YingLi Energy
L: Ruling Chen - Suntech
L: Xianwu Cai - 48th Institute
PV Diffusion Furnace Test
Methods TF
L: Liangyu Liu - CETC-48th
L: Xianwu Cai - CETC-48th
PV Module TF
Japan TC Chapter of Global PV
Technical Committee
C: Hiromu Takatsuka - PVTEC
C: Kazuhiko Kashima - GlobalWafers
Japan
C: Masaaki Yamamichi - AIST
PV Silicon Raw Materials
TF
L: Xiaoxia Liu - GCL
L: Dongxu Chu - SINOSICO
L: He Li - CPVT
PV Silicon Wafer TF
NA TC Chapter of Global PV
Technical Committee
Michigan
PV Package Performance
TF
L: C.C.Lin - PV Guider
L: Bor -Tsuen Wang - National
Pingtung Unviersity
L: T.C. Wu - CMS/ITRI
L: Ivan Chou - Delsolar
L: K.T.Lee - King Design
C : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolar
C : Ray Sung - UL Taiwan
Building Integrated
Photovoltaic (BIPV) TF
L: C.C.Lin - PV Guider
L: Der-Ray Huang - NDHU
L: Ivan Chou - Delsolar
L: K.T.Lee - King Design
L: K. Han Ke - Gran System
L: Yuepeng Wan - LDK
L: Xiaoyong Wang - JAsolar
L: Jingang Lu - Suntech
PV Thin Film TF
PV Wafer Measurement
Method TF
L : Samunine Chen - Chunson
L: Wei Zhou - Trina Solar
L: Liang Luo - Hunan Red Solar
L: Ton Schless - Sibco
L: Jingbing Zhu - Suntech
Taiwan TC Chapter of PV
L: Yaohua Mai - Baoding
Tianwei Solarfilms
L: Xinwei Niu - Chint Solar
L: Jian Ding - Hanergy
Organic & Dye Sensitized
Solar Cell TF
L : Der-Ray Huang - NDHU
Multi-Wire Saws TF
PV Power Station Equipment
Integrated Performance TF
L: Xiexiang Wu - GD Solar
L: Jie Miao - GD Solar
L: Jingying Jia - National
Engineering Research Center
for Photovoltaic Equipment
L: Xianwu Cai - CETC 48th
Institute
L: Zhixin Li - LCT
32 / 37
PV Materials Global Technical Committee
EU TC Chapter of PV Materials
JA TC Chapter of PV Materials
C: Huber Aulich - Solar Valley
C: Takashi Ishihara - Mitsubishi
Electric
C: Kazuhiko Kashima GlobalWafers Japan
C: Tetsuo Fukuda - AIST
Int’l PV Analytical Test Methods,
Metrology, and Inspection TF
L: Peter Wagner - Consultant
Japan PV Materials TF
L: Tetsuo Fukuda - National
Institute of AIST
L: Takashi Ishihara - Mitsubishi
Electronic
NA TC Chapter of PV Materials
C: Lori Nye - Brewer Science
C: John Valley - Sun Edison
C: Hugh Gotts - Air Liquide
Electronics US
Int’l PV Analytical Test Methods,
Metrology, and Inspection TF
L: Hugh Gotts - Air Liquide Electronics US
L: Ron Sinton - Sinton Instruments
L: Chris Moore - BayTech-Resor
PV Silicon Materials TF
33 / 37
Physical Interfaces & Carriers Global
Technical Committee
Europe TC Chapter of Physical Interfaces &
International Reticle SMIF Pod
& Loadport Interoperability TF
L: Jan Rothe - GLOBALFOUNDRIES
C: Tsuyoshi Nagashima - Miraial
C: Tsutomu Okabe - TDK
C: Kenji Yamagata - DAIFUKU
TA: Shoji Komatsu - Acteon
International 450 mm PIC
TF
L: Shoji Komatsu - Acteon
E84 Revision
TF
L: Alfred Honold - InReCon
Japan TC Chapter of Physical Interfaces &
Global PIC Maintenance
TF
450 mm AMHS
TF
L: Yoichi Motoori - Muratec
L: Kenji Yamagata - DAIFUKU
Japan Shipping Box TF
L: Shoji Komatsu – Acteon
L: Tsuyoshi Nagashima Miraial
(PIC-Si) Int’l 450 mm Shipping
Box TF
NA TC Chapter of Physical Interfaces & Carriers
C: Matt Fuller - Entegris
C: Stefan Radloff - Intel
International Process Module
Physical Interface (IPPI) TF
L: Richard Oechsner - Fraunhofer
L: Koji Oyama - Freelance
International Process Module
Physical Interface (IPPI) TF
Fiducial Mark Interoperability
TF
L: Jan Rothe - GLOBALFOUNDRIES
Glboal PIC Maintenance
TF
L: Larry Hartsough - UA
Associates
International 450 mm PIC
TF
L: Melvin Jung - Intel
International 450 mm
Shipping Box TF
L: Tom Quinn - Intel
NA 450mm Shipping Box
TF
L: Tom Quinn - Intel
EUV Reticle Handling TF
450mm ATDP TF
L: Stefan Radloff - Intel
L: Long He - SEMATECH
L: David Chan - SEMATECH
L: John Zimmerman - ASML
L: Kazuya Ota - Nikon
34 / 37
Silicon Wafer Global Technical Committee
NA TC Chapter of Si Wafer
Europe TC Chapter of Si Wafer
C: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein - Intel
TE: Murray Bullis - Materials &
Metrology
C: Werner Bergholz - Jacobs
University of Bremen
C: Fritz Passek - Siltronic
International Advanced
Surface Inspection TF
L: Frank Riedel - Siltronic
Wafer Geometry TF
L: Fritz Passek - Siltronic
International Terminology
TF
International Test
Methods TF
International Polished
Wafers TF
International Annealed
Wafers TF
L: Dinesh Gupta - STA
International Epitaxial
Wafers TF
Wafers (Substrate) TF
L: TBD
International SOI Wafers
TF
L: Bich-Yen Nguyen - SOITEC
TF
L: TBD
International Test
Methods TF
Wafer Geometry TF
L: Noel Poduje - SMS
L: Jaydeep Sinha - KLA-Tencor
International Automated
Advance Surface Inspection TF
L: Kurt Haller - KLA Tencor
Wafer TF
L: Mike Goldstein - Intel
35 / 37
Silicon Wafer Global Technical Committee
Japan TC Chapter of Si Wafer
C: Naoyuki Kawai - The University of
Tokyo
C: Tetsuya Nakai - SUMCO
TF
L: Tetsuya Nakai - SUMCO
International Annealed
Wafers TF
L: Koji Araki - GlobalWafers
Japan
International Test Method
TF
JA Shipping Box TF
L: Ryuji Takeda GlobalWafers Japan
Japan Test Method TF
International SOI Wafers
TF
L: Atsushi Ogura - Meiji
University
International Epitaxial
Wafers TF
L: Naohisa Toda - Shin-Etsu
Handotai
L: Ryuji Takeda - GlobalWafers
Japan
L: Tsuyoshi Otsuki Shin-Etsu
Handotai
L: Mikako Omata - SCAS
Shipping Box TF
GOI WG
L: Tsuyoshi Otsuki - Shin-Etsu
Handotai
Wafers TF
L: Koji Izunome - GlobalWafers
Japan
Fiducial Mark
Interoperability TF
Surface Organic
Contaminant Analysis WG
L: Mikako Omata - Sumika
Chemical Analysis Service
Surface Metal Chemical
Analysis WG
L: Ryuji Takeda - GlobalWafers
Japan
L: Ryo Machida - Sumika
Chemical Analysis Service
BMD DZ WG
L: Satoshi Akiyama - Raytex
L: Kazuo Moriya - Raytex
Bulk Heavy Metal Analysis by
Electrical Measurement WG
L: Shingo Sumie - KOBELCO
L: Masaru Akamatsu - KOBELCO
Wafer TF
L: Masaharu Watanabe Semilab
L: Naoyuki Kawai - The
University of Tokyo
Wafer Geometry TF
Japan JWG TF
L: Masanori Yoshise Freelance
Surface Inspection TF
L: Yusuke Tamaki - ATMI
Japan
L: Masami Ikota - Hitachi High
Technologies
36 / 37
Traceability Global Technical Committee
Japan TC Chapter of Traceability
C: Yoichi Iga - Freelance
C: Hirokazu Tsunobuchi - Keyence
5 Year Review
TF
L: Hirokazu Tsunobuchi Keyence
NA TC Chapter of Traceability
C: Yaw Obeng - NIST
5 Year Review TF
L: Win Baylies - BayTech-Resor
Fiducial Mark
Interoperability TF
Japan PV Traceability TF
L: Yoichi Iga - Freelance
37 / 37

Global Technical Committee

Transcription

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