Technology Today

Transcription

Technology Today

Technology
Today
H ighlighting R aytheon ’ s T echnology
2012 ISSUE 1
Raytheon’s Materials Technology
Shaping the future
A Message From
Mark E. Russell
Vice President of Engineering, Technology and Mission Assurance
Materials advances have created new industries and have redefined how we live.
Demand is constant for new materials that deliver greater performance, improved
cost effectiveness, superior reliability and better safety, while having minimal
environmental impact.
Raytheon has a long history of materials discovery and innovation. We recognize
that the proper choices and applications of materials technology are vital to the
quality and performance of our products.
This issue of Technology Today features articles that discuss the engineering of
materials from atomic building blocks, the development of composite structures
that exhibit unique materials properties, the engineering of materials that imitate
characteristics observed in nature and the application of new materials to meet the
demands for higher performance and new capabilities. Articles on materials
restrictions and counterfeit parts underscore the importance of sustainability
and reliability.
In our Leaders Corner, Jim Wade, vice president of Mission Assurance, builds
upon this issue’s theme by focusing on the disciplines that ensure quality,
reliability and dependability in the materials we use and processes we follow in the
production and deployment of our products and systems. In addition, he shares his
Mission Assurance vision and his views on leadership, Raytheon Six Sigma™ and
Mission Assurance competencies and careers.
Materials advances cannot be realized without accompanying innovations in
manufacturing. Among the articles in our Eye on Technology section, we introduce
our Manufacturing Technology Network, a companywide association of experts
enabling the rapid transition of advanced material technologies from the laboratory
into our products.
We complete this issue with a summary of recent events including Raytheon’s prestigious Excellence in Engineering and Technology Awards, a focus on our graduates of the Massachusetts Institute of Technology Leaders for Global Operations
program, and a discussion of PRISM — our enterprise manufacturing process.
On the cover: Metamaterials enable tunable
antenna and radome capabilities. Raytheon
Engineer, Dr.Jacquelyn Vitaz, inspects a
tunable metamaterial sample.
Best regards,
Mark E. Russell
2
2012 ISSUE 1 RAYTHEON TECHNOLOGY TODAY
View Technology Today online at:
www.raytheon.com/technology_today
inside this issue
Feature: Raytheon’s Materials Technology
Overview: Materials Innovations Enable System Performance
Technology Today is published
by the Office of Engineering,
Technology and Mission Assurance.
Vice President
Mark E. Russell
Chief Technology Officer
Bill Kiczuk
Managing Editor
Cliff Drubin
Feature Editor
Randal Tustison
Nanoscale Colloidal Quantum Dots for Imaging System Applications
10
Carbon-Based Nanotechnology
14
Improving Thermal Performance of DoD Systems
18
Raytheon’s Diamond Technology
20
Bio-inspired Shutters and Apertures for Infrared Imaging Applications
22
Realizing the Potential of Metamaterials
24
Detection and Identification of Radiological Sources
28
Advanced Sonar Projector Materials
31
Materials Solutions to Meet the Needs for Large-Scale Energy Storage
34
Zinc-Bromine Flow Battery Technology for Energy Security
Liquid Metal Battery
35
36
Material Restrictions and Reporting
38
Responding to the Counterfeit Threat
41
Raytheon Leaders
Leaders Corner: Q&A With Vice President of Mission Assurance Jim Wade
44
EYE on Technology
Senior Editors
Corey Daniels
Tom Georgon
Eve Hofert
Raytheon Manufacturing Technology Network
Art Director
Debra Graham
Focus Center Research Program and Raytheon
Photography
Fran Brophy
Rob Carlson
Charlie Riniker
4
46
Crew Comm46
48
Events
MathMovesU® Day at the University of Arizona
51
Raytheon Excellence in Engineering and Technology Awards
52
Website Design
Nick Miller
Mechanical, Materials and Structures Technology Network Symposium
54
2011 Raytheon Power and Energy Technology Symposium
54
Publication Distribution
Dolores Priest
2011 Raytheon Energy Summit
55
Contributors
Kate Emerson
Lindley Specht
Frances Vandal
People
Leaders for Global Operations Program
56
Resources
Unleashing the Power of Raytheon Manufacturing Through PRISM
Editor’s note: Correction: Technology Today
2011 Issue 2, page 41. The photo is copyright
AIRBUS S.A.S. 2010, photo by exm Company,
N. Fonade.
58
Patents60
RAYTHEON TECHNOLOGY TODAY 2012 ISSUE 1
3
Feature
Materials Innovations Enable System Performance …
T
he importance of materials in the chronicle of human
materials scientists to develop the Siemens Process, an economical
development cannot be overemphasized. Mankind has been
method of refining metallurgical grade silicon, which enabled the
exploiting materials since prehistoric times. In fact, the three
emergence of the semiconductor industry. Today, silicon integrated
epochs of prehistory, the Stone Age, Bronze Age and Iron Age, are
circuits are ubiquitous, being directly or indirectly involved with
named after the materials and the related tool-making technologies
virtually everything that we touch.
that define them. Perhaps the earliest quantitative study of materials
appeared in Galileo Galilei’s Discourses and Mathematical
Material development and adoption challenges
Demonstrations Relating to Two New Sciences (1638). The two
The demand for stronger, lighter, greener yet less expensive materi-
sciences were the “strength of materials” and the “motion of
als continues to outstrip availability, presenting many challenges
objects” (kinematics). Materials science as a discipline has its roots
as well as opportunities to the materials engineer. Unfortunately,
in the study of metallurgy; only recently has it become the truly
the development of a new material and the related manufactur-
interdisciplinary science that it is today, merging metallurgy,
ing technology can be a lengthy process, taking much longer than
ceramics and polymer science, and including aspects of chemistry
we would like. In Technology Review, Thomas Eagar2 pointed out
and solid state physics.
that it typically takes 20 years from the discovery of a new material
to its commercialization. This proposition is underscored by many
History has shown us that a new material technology can change
the
world.1
As a result, innumerable technological advances owe
examples ranging from the vulcanization of rubber to diamond-like
coatings. The reasons for this lag in materials technology insertion
their success to materials science. To illustrate this point, consider
are many and varied. For example, too frequently product engineers
silicon. Silicon is the second most abundant element in the earth’s
want to use the new material in the same way that they used the
crust, but it rarely occurs in the elemental form. With the inven-
previous material, rarely exploiting all of its favorable properties;
tion of the transistor, the need for high-purity forms of silicon led
hence, the promise of the new material is not immediately realized.
System Challenge:
Third-generation infrared sensing systems based on advanced mercury cadmium telluride (HgCdTe) focal plane arrays (FPAs) require large
area lattice-matched cadmium zinc telluride (CdZnTe) substrates for the epitaxial growth of multilayer HgCdTe devices by molecular beam
epitaxy.Existing second-generation infrared systems utilize HgCdTe
FPAs grown by liquid phase epitaxy (LPE) on CdZnTe substrates that
are cut in the (111) crystal orientation. MBE-grown HgCdTe thirdgeneration FPAs require larger CdZnTe substrates that are cut in a
different crystal orientation (211) with additional
requirements for surface polishing and
preparation.
Materials Innovation:
Raytheon is a leader in the development of
techniques for growing and processing these
crystals for the production of affordable
high-performance third-generation FPAs.
< Large-diameter CdZnTe boule used as the
starting substrate material for the production of
advanced HgCdTe focal plane arrays.
4
Feature
Shaping the Future of Materials Technology
Structure
luctant to specify a new material that might not be available in the
For aerospace applications, qualification of a new material can be
a very costly and time-consuming endeavor, which can also be a
significant barrier to adoption. For these reasons, a new material
with superior performance, even at a lower cost, is frequently slow
to be accepted. Nevertheless, as Eagar points out, industries like the
Processing
Process
fraction/density
required quantities or may only be available from a single source.
Defect Distributions
Properties
Statistical variations
in property values
Performance
Life Predictions
percent failed
Control of Statistical Properties
the demand develops. An unfortunate result is that designers are re-
cycles/time to failure
Initially, new materials are produced in small quantities, at least until
load/time
stress
size
Figure 1. The Accelerated Insertion of Materials program materials
development methodology (source: QuesTek Innovation LLC).
aerospace industry are most likely to lead in the introduction of new
material technologies. Here the value associated with a high level of
performance (for example in advanced composites, the cost savings
associated with a pound of saved weight) can be significantly larger
than for many commercial, less demanding applications.
Cycle time acceleration initiatives
kit for use by designers. The purpose of the tool kit was to predict
and control the statistical material properties through microstructure
control (structure-property relations), thereby reducing insertion risk
(Figure 1).
Several concerted efforts have been made to reduce this 20-year
continued on page 6
cycle time. For example, the Defense Advanced Research Projects
Agency’s (DARPA) Accelerated Insertion of Materials program
attempted to do this by creating a more rigorous materials development and qualification methodology, including a computational tool
System Challenge:
Domes and infrared windows with increased transmission and greater durability are
needed to extend the performance envelope of DoD weapons and sensors.
Raytheon Materials Innovation:
Raytheon’s NanoComposite Optical Ceramic (NCOC) material, developed under a four-year
DARPA (Defense Advanced Research Projects Agency) project, provides a revolutionary
improvement in infrared missile seeker performance. NCOC domes enhance the lethality of
air-to-air missiles, increasing the
seeker’s signal-to-noise ratio
(sensitivity). NCOC also extends
the transmission bandpass beyond
the mid-wave infrared (MWIR)
spectrum and provides durability
improvements.
Raytheon’s new NCOC infrared
>
transparent dome (left) and as
viewed through an infrared camera.
5
Feature
continued from page 5
Discovery
Development
Optimization
System Design
& Integration
Certification
Manufacturing
Deployment/
Sustainment
Figure 2. Materials Development Continuum
Since then, computational materials engineering (CME) has
emerged as a powerful tool in contemporary materials science, and
as the central theme in efforts to accelerate materials discovery and
insertion of new materials technologies.
Still, the lag between new material discovery and insertion continues to be a challenge. Figure 2 illustrates the traditional materials
development continuum. In June 2011, President Obama announced the launching of the Materials Genome Initiative, with the
objective “to help business develop, discover and deploy new
materials twice as fast.”3
In the words of John Holdren,4 Assistant to the President for Science
and Technology and Director of the White House Office of Science
and Technology Policy, “In much the same way that silicon in the
1970s led to the modern information technology industry, the development of advanced materials will fuel many of the emerging
industries that will address challenges in energy, national security,
healthcare and other areas. Yet the time it takes to move a newly
discovered advanced material from the laboratory to the commercial market place remains far too long. Accelerating this process
could significantly improve U.S. global competitiveness and ensure
that the nation remains at the forefront of the advanced materials marketplace. This Materials Genome Initiative for Global
Competitiveness aims to reduce development time by providing
the infrastructure and training that American innovators need to
discover, develop, manufacture and deploy advanced materials in
a more expeditious and economical way.”
System Challenge:
Evolving threats and mission requirements dictate a need for higher performance radio frequency (RF) sensors and
electronic warfare (EW) systems.
The evolution of existing RF device technology was not meeting new system cost, size, weight and performance goals. Therefore, in the
late 1990s Raytheon identified wide bandgap gallium nitride (GaN) as an enabling technology with the potential to meet evolving performance goals. Over the last 10 years we have developed and proven a GaN technology baseline, which is now released to production.
Raytheon’s GaN technology is the cornerstone of multiple system pursuits. This decade-long development, a partnership among material
technologists, device physicists, process engineers, component engineers and
system engineers, serves as a model for developing other enabling technologies.
< A four-inch gallium
nitride wafer being
processed into
individual RF
components.
6
Feature
The Materials Genome Initiative will rely on CME advancements in
conjunction with new experimental tools, and in particular, with
coordinated and open data management systems that allow researchers to access and compare data; thereby facilitating far more
collaboration than is currently available. The Initiative also considers
the whole lifecycle of the material, including issues of recyclability
and sustainability, which we will touch upon in this issue.
Raytheon’s past material innovations
transmit/receive modules and panel arrays; each of which includes a
multitude of underlying and critical supporting materials technologies. Chemically vapor deposited (CVD) zinc sulfide has become the
standard long-wavelength transparent electro-optical material for
passive imaging at 8–12 micrometers wavelength in the infrared.
Raytheon’s materials process innovation supplanted the competing
hot-pressed material, Irtran-2. Raytheon produced thousands of
electro-optic windows and domes, beginning in 1972 with the first
CVD dome ever made.
Raytheon has a long and successful history of materials discovery
and innovation going back to the earliest days of the company.
The Klixon Disk, a simple bi-metallic device invented by Al Spencer,
launched the Spencer Thermostat Company and established the
company’s founding fathers as successful entrepreneurs.5 Numerous
successes followed, including the development of gallium arsenidebased microwave integrated circuits, then gallium nitride-based
continued on page 8
System Challenge:
Windows and domes on infrared imaging systems that operate in the long
wavelength infrared (LWIR) portion of the spectrum are subject to environmental degradation when exposed to high-velocity raindrop and sand
particle impact during mission execution. Unfortunately, materials that are
transparent at these wavelengths are generally soft and weak, or in the
worst case, water soluble. What is needed is a truly durable, multispectral
window/dome material.
Raytheon invented a rain erosion protective and durable
antireflective coating for LWIR transparent materials like
zinc sulfide. This coating increases the abrasion resistance
of this benchmark material while also improving its resistance
to high-velocity raindrop impact damage by more than a
factor of two.
Zinc sulfide radomes treated with Raytheon’s
abrasion-resistant optical coating. >
7
Feature
Raytheon’s materials innovations today
Today, Raytheon continues to be actively involved in materials
discovery, innovation and insertion at all points along the materials
development continuum. With the advent of CME, in tandem with
the ability to manipulate materials at the atomic level, Raytheon
engineers are creating materials with properties that were simply
not attainable before. In this edition of Technology Today, our first
three articles discuss engineering of materials from the ground
(nanoscale) up, one of which includes leveraging the remarkable
properties of the carbon nanotube (CNT). Parenthetically, it has
been 20 years since CNTs were first observed. One could conclude,
based on Eagar’s thesis that wide-scale acceptance of CNTs is just
around the corner.
Sometimes, materials discovery can be as straightforward as observing the world around us, as is the case with the bio-inspired optical
shutters being developed at Raytheon for infrared imaging. Nature’s
perfect material, diamond, is formed over millions of years within
the earth’s crust at high temperatures and pressures. Since the
1960s, low-temperature processes have been developed to produce
diamond in the laboratory environment. We will discuss Raytheon’s
pioneering efforts in the chemical vapor deposition of diamond and
its use as a superior conductor of heat, a critical characteristic for
thermal management in high-power device applications. Finally, we
will review progress in developing an exciting new form of “material” referred to as metamaterial. Metamaterials are engineered
materials in the truest sense of the term, deriving their properties
not from their constituent materials but from the periodic arrangement of these materials.
As we have seen, the processes of designing, optimizing and integrating materials into a product, component or subsystem occupy
the center of the materials development continuum. Several articles
on materials optimization and integration are included. New sensors
that derive their unique capabilities from materials engineering are
becoming important elements for ensuring our national defense
System Challenge:
Provide an air-supported radome to protect the world’s largest X-Band
radar system with a probability of survival of 99.9 percent over the course
of 20 years.
The requirement for high reliability and long-term survivability under extreme
environmental conditions, while having minimal impact on radar performance,
drove development of a novel composite radome material and structure to
protect the 10-story X-Band Radar (XBR). Built around a urethane-coated
Vectran® fabric with bias ply laminate construction, the resulting spheroid
shaped radome was constructed by joining 81 sections (gores) together and
clamping them at the bottom. The result was a first-of-its-kind radome that
can withstand 150 mile per hour winds with less than 2 feet deflection.
< The XBR radome measures 120 feet at
the equator, is 103 feet tall and weighs
approximately 18,000 pounds. Inset is a
view from the inside showing the antenna
array face underneath the radome’s
protective shell.
8
Feature
and homeland security in the face of evolving threats. Examples include novel sonar transducer materials and a class of materials that
give off light in the presence of nuclear radiation. Solutions to address energy security are discussed in a series of articles on materials
technologies for large-scale energy storage.
Technology section, we introduce our latest technology network
— the Manufacturing Technology Network, a companywide association of experts established to better integrate manufacturing
technologies and strategies with new materials development in
order to accelerate deployment. •
Randal Tustison
Beyond development
Once a new material technology is integrated and deployed in a
new system, the focus turns to sustainment. This is particularly true
in aerospace and defense systems where very high importance is
placed on reliability. Our remaining feature articles address the
sustainment phase. This includes a discussion of regulations that
control a material’s impact on the environment and Raytheon’s responsiveness to those regulations, as well as Raytheon’s response to
the growing industry threat from counterfeit parts.
Our discussion of materials technology at Raytheon would not
be complete without mentioning the role that manufacturing
plays in the materials development continuum. In our Eye on
References
1.Robert Friedel, Materials That Changed History, Nova (2010). http://www.
pbs.org/wgbh/nova/tech/materials-changed-history.html
2.Thomas W. Eagar, Bringing New Materials to Market, Technology Review,
February/March (1995). Pg. 43.
3.Ceramic Tech Today, ACerS Ceramic Materials, Applications & Business
Blog, Eileen De Guire, editor, June 30, 2011. http://ceramics.org/
ceramictechtoday/2011/06/30/materials-genome-initiative/.
4.Materials Genome Initiative for Global Competitiveness, National Science
and Technology Council, June 24, 2011. http://www.whitehouse.gov/
sites/default/files/microsites/ostp/materials_genome_initiative-final.pdf
5.Alan R. Earls and Robert E. Edwards, Raytheon Company, The First Sixty
Years, Arcadia Publishing (2005).
ENGINEERING PROFILE
involved in all aspects of materials and
mechanical engineering science.
Principal Engineering Fellow, IDS
A former research associate with MIT, Tustison
began his Raytheon career 32 years ago. He
became materials engineering manager and
ultimately managed the research facility until
2002. He has been engaged in both independent research and development and contract
research and development (CRAD) throughout
his career. He acknowledges the importance
of being able to provide the best solutions at
the lowest cost, particularly in our dynamic
environment. “We must constantly innovate.
Through CRAD projects we have the opportunity to shape solutions to difficult problems
while working directly with the customer.”
Dr. Randy Tustison is a principal engineering
fellow on staff in Integrated Defense Systems’
Mechanical Engineering Directorate where he
is capture manager for Advanced Technology.
He is also Mechanical, Materials and Structures
Technology Area Champion for Raytheon,
Since joining Raytheon, Tustison has been
active in the area of optical materials and coatings development. He was a member of DoD
Militarily Critical Technology Working Group
− Optical Materials and a member of the U.S.
delegation to the 4th NATO Conference on
Randal Tustison
Infrared Materials. He is a member of the
American Vacuum Society and past chair of the
Vacuum Technology Division. He was chair
of SPIE’s Windows and Dome Technologies
and Materials Conference 2011. Tustison also
serves on the industrial advisory board of the
National Science Foundation’s Center for
High-Rate Nanomanufacturing.
Tustison notes that the thing that excites him
most about his work is being able to contribute to the creation of something that hasn’t
existed or been done before. “The creative
part of research and development can be very
rewarding.”
He holds a bachelor’s degree in physics from
Purdue University and master’s and doctoral
degrees in materials science and metallurgical
engineering from the University of Illinois at
Urbana-Champaign. He is a member of Sigma
Pi Sigma and a qualified Raytheon Six SigmaTM
Specialist.
9
Feature
Nanoscale Colloidal
Quantum Dots
Providing Innovative Solutions for Evolving Imaging System Applications
Imaging systems for defense and homeland security are evolving from expensive, single-color,
planar components into cost-effective, multi-color, conformal configurations.
Nanotechnology is enabling these changes.
A
focal plane array (FPA) is the
modern day “film” of an imaging system. Photons emitted or
reflected by a scene are collected by the
camera optics and imaged onto the FPA.
The FPA is composed of two components:
the detector array and the readout integrated circuit (ROIC). The detector array
contains thousands to millions of detector
elements. Through a hybrid circuit manufacturing process, each of the detector
elements in the detector array is connected electrically and mechanically to a
companion unit cell circuit on the ROIC
by an indium bump interconnection. The
detector elements produce photocurrents
that travel through the indium interconnects into ROIC unit cell circuitry, where
the photocurrent is integrated and stored
for subsequent readout via a multiplexer.
Detector characteristics usually limit
operation to a certain band of photon
wavelengths or spectral region. For example, to detect two widely separated
bands (such as infrared [IR] and ultraviolet
[UV]) two sets of FPAs are typically required,
more than doubling the cost to the enduser. The FPA manufacturing process is
also expensive, requiring extensive capital
equipment not only to fabricate the small
indium interconnects on each array, but also
to carefully align and press the hybrid circuit
layers together. Quantum dots offer a potential technology solution to mitigate both
of these cost drivers.
Quantum Dots
Quantum dots are minute semiconductor
crystals, typically a few nanometers (nm) in
size. At these small dimensions, the physical
extent of the quantum dot becomes smaller
than the natural size of an electron-hole
pair, and an effect called quantum confinement occurs. This can favorably change the
optical properties that are governed by the
size of the quantum dot. For example, by
adjusting only the size of the quantum dot
one can fine tune the photon absorption or
emission spectra without requiring a complicated change of semiconducting material
composition or stoichiometry. In addition,
the photon absorption can be greater in
quantum-confined nanocrystals, thus making for a more efficient detector.
Quantum dots are typically produced using
one of two processes. They are either
grown with molecular beam epitaxy onto
a crystal substrate, or they are synthesized
with solution-based chemistry, producing a
nanocrystal colloidal suspension. The synthesis and application of colloidal quantum
dots (CQDs) are discussed in the remainder
of this article.
Figure1 shows the structure of a CQD;
however, they need not be only spherical. Disks, rods and other structures have
been produced by means of colloidal
quantum dot processing. This example uses
lead sulfide (PbS) CQDs that are made by
injecting lead and sulfur organo-metallic
precursors into a flask held within an inert
atmosphere. Precise temperature and solvent combinations control the size of the
CQDs. The CQDs are often encased in a
semiconducting shell to protect and passivate the surface. Surface groups, such as
ligands*, are attached to the shell and allow
the CQDs to be suspended in solution. This
solution-suspended state permits convenient deposition onto a variety of surfaces.
Deposition techniques include drop casting, jet printing, stamping and spin casting
to produce novel devices on a variety of
substrates.
As shown in Figure 2, varying the CQD size
modifies its physical properties, such as
the bandgap, while using the same CQD
Core:
Active material
1−20 nm size
spheres, rods,
disks, etc.
Shells:
Protective or
complementary
layers
X
Functional
Groups:
Chemically,
electrically,
or optically
active groups
Surface Groups:
Passivating, protective and
chemically active layer
Figure 1. Colloidal quantum dot composition. (Courtesy of the Bawendi Group, MIT.)
* Ligands – Ions or molecule that bind to transition metal ions to form complex ions.
10 2012 ISSUE 1 RAYTHEON TECHNOLOGY TODAY
Feature
Quantum Dot Applications
Raytheon is developing quantum dot
applications in collaboration with
Prof. Moungi Bawendi’s Group at the
Massachusetts Institute of Technology (MIT).
The Institute of Soldier Nanotechnology
(ISN), an Army University Affiliated Research
Center (UARC), provides funding for this
joint activity.1,2 These applications include
not only short wavelength infrared (SWIR,
nominally defined as the 1–2 micron spectral range) sensitive surfaces for use in FPAs,
but also emitting surfaces for use in microdisplays, communications and dual-band
detection devices.
Since CQDs can downshift the frequency
of photons from the UV (nominally
200–400 nm) to the visible or SWIR region,
a layer of CQDs on the detector transforms
a SWIR FPA into a combination UV/SWIR
FPA. So in addition to the usual SWIR imaging, the camera now has the ability to
image in the UV for applications in UV
optical communications (line-of-sight and
CdSe
2 nm
8 nm
Conduction
Band
(arb. unit
)
Energy
Gap
Valence
Band
ty
PL Intensi
material. In contrast, significantly changing
the bandgap of a bulk semiconducting material typically requires a different chemical
composition or stoichiometry. The left side
of the figure shows that as the CQDs get
smaller, the energy gap becomes larger,
with discrete conduction and valence band
levels. This means that photon absorption versus photon energy is no longer
continuous, as in the bulk semiconductor
case. Instead, the spectra are divided into
a discrete set of levels that have enhanced
absorption at each resonance. Similarly,
photon emission depends on CQD size,
which is demonstrated by using ultraviolet
light to excite different size CQDs contained
in a set of vials (right side of figure). The
CQDs fluoresce with different colors and
the smaller the CQD, the more blue-shifted
is the emission. Figure 2 demonstrates this
effect for CdSe dots ranging in size from
2 to 8 nm in diameter.
Bulk
semiconductor:
Energy bands
are continuous
Nanosemiconductor:
Energy bands
are discrete
8 nm
Diameter
500
600
700
Wavelength (nm)
800
2 nm
Photoluminescence (PL) Spectra of CdSe and CdTe
Quantum Dots
Figure 2. Quantum confinement effects in quantum dots modify the semiconductor
energy level structure.
non-line-of sight), in detection of covertly
placed UV tags, in UV biometrics and in UV
muzzle flash detection. In this way the technology increases the spectral range for
broadband imaging applications.
Quantum Dot Imaging Technology
CQD enhanced imagers can take advantage of both direct detection photocurrent
generation and the frequency downshifting
properties of CQDs.
Figure 3 illustrates how Raytheon employs
the photocurrent properties of CQDs. The
upper illustration depicts conventional technology that uses a hybridization technique.
The lower illustration (cross section and top
views) shows the CQDs deposited on the
top over-glass layer of a CMOS (complementary metal oxide semiconductor) ROIC
that has been post-processed with a gold
grid structure. The CQDs are photo-active in
the annular sections of the grid and are surrounded by the gold electrodes. The CQDs
absorb photons and produce photocurrents,
Conventional Technology
Detector Substrate
Detector Array Pixels
Readout Integrated Circuit
(Indium bumps between detector
and ROIC substrates)
Colloidal Quantum Dot Technology
QCDs detecting film − no substrate
(QCDs lay in between metallic grid
deposited on top surface)
Figure 3. Comparison of colloidal quantum
dot technology with conventional hybrid
technology for an imager employing the photocurrent properties of CQDs. Due to their
inherent simplicity, CQD imagers promise
lower fabrication costs and higher reliability.
which are injected via the gold electrodes
into the underlying CMOS circuitry for
further processing.
continued on page 12
RAYTHEON TECHNOLOGY TODAY 2012 ISSUE 1 11
ENGINEERING PROFILE
Lauren Crews
Manager, IRAD
IDS
Dr. Lauren Crews
manages Integrated
Defense Systems’
portfolio of independent research
and development
(IRAD) projects.
She is also chair
of Raytheon’s
Mechanical,
Materials and
Structures technology network,
a companywide community of more than
1,000 engineers and technologists.
“Much of our new technology that advances
the state of the art and creates solutions to customers’ unmet needs is developed through our
IRAD program,” says Crews. As IRAD manager, she ensures that all projects are clearly
defined, well planned, aligned with customer
needs and achieve their intended results.
Prior to her current roles, Crews served as the
Mechanical, Materials and Structures
Technology Area director for Raytheon
Corporate Research and Technology. Before
this, she was a section manager within IDS’
Mechanical Engineering Directorate. She was
also the mechanical engineering lead for the
Advanced Spectroscopic Portal program and
the deputy lead of the Ship Integrated Product
team for the Cobra Judy Replacement program.
Crews started her career with Raytheon as a
mechanical design engineer and thermal analyst for ship- and ground-based radar systems.
Crews is a certified Raytheon Six Sigma™
Expert and a graduate of the IDS Program
Management College, the Raytheon Leadership
Excellence Program and the IDS Strategic
Development Program. She received a
bachelor’s degree in aerospace engineering
from the University of Maryland, and she has
both a master’s and Ph.D. in aeronautics and
astronautics from MIT.
Crews speaks to her experience with new technology and IRAD innovations: “It’s exciting to
watch technologies mature and see first-of-akind demonstrations, knowing that the success
of these projects will enable great things for
our customers and support the future success
of our business.”
Feature
Quantum Dots
The CQD detecting film is applied by spin
coating onto a packaged ROIC. The ROIC
itself forms the detector substrate, so no
hybridization is required. The conventional
hybrid technology shown above requires
several layers of processing with many
more interfaces and interconnections,
which increase the fabrication cost.
Figure 4 shows how CQD technology can
significantly reduce complexity, cycle time,
size, weight, power and cost by employing its downshifting properties. CQDs are
deposited onto the detector surface of a
conventional hybrid focal plane array. The
CQDs once again absorb photons; but
instead of producing a photocurrent, they
emit longer-wavelength (red-shifted) photons that are subsequently detected by the
FPA. This extends the detection band of
the imager without the need for a second
FPA. The middle section of Figure 4 shows
the conventional technology, and the lower
section depicts the reduction in complexity
through the use of CQDs.
Experimental Results
Figure 5 illustrates an imaging setup for
evaluating the performance of directly deposited CQDs onto ROICs. Separate quad
structures with circular depositions of CQDs
on three of the four quadrants of the ROIC
allow testing of different CQD materials.
Also shown is the image formed by an
infrared light beam focused by the camera
onto the CQD focal plane.
The image shown in Figure 5 demonstrates
that an IR focal plane can be produced by
simply drop casting CQD material onto
an appropriately modified silicon ROIC.
Visible focal planes can be made in a
similar fashion. It is also possible to extend
the spectral response of the resultant FPA
device beyond the visible range into the
SWIR spectral band consistent with the
spectral characteristics of the CQDs. While
this nascent CQD FPA technology does not
CQD Downshifting Property
Detector Array
Dual Band CQD Focal Plane Array (FPA)
Conventional Technology
Two Optics
Band 1 Band 1
FPA
Image
Band 1
Band 2
Scene
Band 2 Band 2
FPA
Image
Combined
Image
CQD
Enhancement
Colloidal Quantum Dot Technology
Band 1
Band 2
Scene
One Optic
Single FPA
CQD converts
Band 1 to Band 2
Combined
Image
Figure 4. The downshifting property of CQDs
can considerably simplify the design of a
multi-band focal plane array.
currently match the performance of stateof-the-art SWIR FPAs, it does significantly
reduce complexity and, therefore, cost.
This has the potential to address more costsensitive applications in which the higher
level of performance is not required. For
example, one application may be the formation of non-planar conformal focal plane
arrays as opposed to the current rigid,
rectangular structures. Another example
is to replace a few expensive systems that
monitor a field of regard, with numerous,
less expensive networked systems that can
monitor and expand the field of regard
with system redundancy.
We have also demonstrated the downshifting capability by depositing CQDs on
a quartz plate that is displaced off-focal
plane. The CQDs absorb in the UV and
Feature
ENGINEERING PROFILE
Christopher
Solecki
Technology Area
Director,
SAS
Infrared Camera
CQD
Film
Blow up section of CQD Film
with Gold Grid on Top Surface
4.0 µm
Gold Pad
Image of a SWIR light beam
on the CQD film
Gold Ground Plane
8.3 µm
CQD Annular Region
Figure 5. CQDs are deposited on a readout integrated circuit and mounted in a test assembly.
An image is formed by the readout integrated circuit upon application of a bias voltage and
exposure of the CQDs to infrared radiation.
visible bands and emit at ~1,300 nm in the
SWIR region. Using a re-imaging technique
that focuses the CQD emissions from the
downshifting plate onto an InGaAs (indium
gallium arsenide) FPA, it was possible to
extend the spectral response of this FPA
into the UV region.
Raytheon is working with the MIT Bawendi
Group on several CQD applications,
including biomedical imaging research. By
functionalizing** the CQD surface groups,
they can be designed to stick to stem cells,
tumors and other biological structures.3
This allows for direct imaging and monitoring of medical and biological processes
using Raytheon SWIR cameras set to detect
certain tissue transparency bands. Recently
this was demonstrated at MIT by imaging a
mouse liver. The liver collects the functionalized CQDs that were injected into the
blood stream. These CQDs were irradiated,
and the SWIR downshifted emissions were
imaged with a SWIR camera using one
of the SWIR transparency bands of the
epidermal tissue.
CQDs can be used to modify the capabilities of conventional FPA imaging devices.
As the technology matures, CQDs will not
only enable more cost-effective defense
products, but they will also help drive new
products and innovations in both adjacent
sciences and commercial marketplaces. •
Frank Jaworski
1Geyer,
Scott, Ph.D. Dissertation: Science and Applications of
Infrared Semiconductor Nanocrystals, MIT Chemistry DeptBawendi Group, 2010.
2Efficient Luminescent Down-shifting Detectors Based on Colloidal
Quantum Dots for Dual-Band Detection Applications, May 2011,
ACS Nano (American Chemical Society).
3W. Liu, et al. Compact Biocompatible Quantum Dots
Functionalized for Cellular Imaging, JACS, Jan. 5, 2008.
Christopher Solecki
is the Mechanical,
Materials and
Structures
Technology
Area director for
Raytheon Corporate
Research and
Technology. In this
role, he is responsible for coordinating this
technology development across the company.
He has a total of 17 years of unique engineering
experience — designing, testing, manufacturing
and implementing materials and design solutions for challenging applications.
As technology area director, Solecki interfaces
with Raytheon’s customers on strategies for
applying our technologies to address their mission requirements. Internally, he works closely
with engineers, technologists and engineering
leadership in developing technology plans and
road maps to align with our customers’ needs.
Solecki has always had a keen interest in
composites and structures, radomes, and
high-temperature materials. He is a subject
matter expert in these areas and, as a result,
has held lead radome development roles on
numerous programs, including Future Naval
Components – Phase 3, Volume Search Radar
(VSR) DDG 1000, Advanced Medium Range
Air-to-Air Missile (AMRAAM), proprietary radome programs and the Hypersonic
Wideband Radome (HWR).
Before joining Raytheon in 2004, Solecki
worked at Lockheed Astronautics, Ball
Aerospace, Cytec Engineered Materials and
Spectrum Astro.
“From early in my career, I have always looked
to do more; make an impact and make a difference,” Solecki states. “Being the technology
area director for Mechanical, Materials and
Structures affords me this opportunity.”
** Functionalizing – Adding new features by altering the surface chemistry.
Feature
Carbon-Based Nanotechnology
Realizing the Promise and Overcoming the Challenges
A
s early as 1970, there was speculation that carbon fullerenes* existed
in addition to the well known allotropes** of carbon found in the forms of
coal, soot, diamond and graphite.1,2 The
existence of C60 fullerenes, or “buckyballs,”
was first demonstrated by Kroto, Curl and
Smalley of Rice University in 1985. For their
work, they were awarded the 1996 Nobel
Prize in Chemistry. With the discovery of this
new class of carbon allotropes, research interest in this family of materials exploded. In
addition to buckyballs, fullerene structures
include other spherical, ellipsoidal and tubular shapes, all of which display a hollow,
cage-like structure formed by each carbon
atom being covalently bonded to three others. The first carbon nanotubes (CNTs) were
synthesized in 1991, and they have attracted
increased attention since then as a result of
their unique and tailorable properties.3
The structure of a CNT is shown in Figure 1.
The figure depicts a single-wall carbon nanotube (SWNT). Note that CNTs are composed
entirely of sp2 bonds, which are stronger
than the sp3 bonds found in the diamond
form of carbon.4 Multiwalled nanotubes
Figure 1. The structure of a carbon nanotube.
Image generated by Ninithi Software for
Nanotechnology.
(MWNT) also exist, and they are essentially
the equivalent of concentric SWNTs.
A number of CNT-based nanomaterials are
under development based on their unique
properties, which make them attractive alternatives to traditional materials. CNTs can
be formed into a thin sheet. “Buckypaper”
is a particular type of CNT sheet. Figure
2 shows a scanning electron microscopy
image of buckypaper on the left, as well
as a large sheet of CNT paper on the right
(produced at Nanocomp Technologies, Inc.).
Due to advances in the manufacturability of
buckypaper, it is becoming increasingly common to find this form of CNTs being used
in structural, electromagnetic interference
(EMI) shielding and thermal applications.
Graphene is another carbon-based nanomaterial that is receiving a lot of attention
since Geim and Novoselov were awarded
the 2010 Nobel Prize in Physics for its discovery. Graphene is a single atomic layer of
carbon, equivalent to a CNT that has been
“unrolled” into a two-dimensional structure
as shown in Figure 3. Graphene is highly
transparent yet conductive, making it an
excellent candidate for photovoltaic applications, liquid crystal displays (LCDs) and
light-emitting diodes (LEDs).5
CNTs can behave as semiconductors or metals, depending on their structure, and they
can support high current densities. The thermal conductivity of CNTs is elevated along
the nanotube axis and is approximately ten
times that of copper. Yet, CNTs are excellent
thermal insulators along their radial axis.
In addition to their electrical and thermal
characteristics, CNTs are promising for structural applications due to their high strength
and stiffness. With diameters on the order
on 1−10 nanometers (nm), and lengths
ranging from the submicron scale to several
millimeters or more, CNTs exhibit tensile
strengths along their axes approximately ten
times that of Kevlar®.
At Raytheon, CNTs are being developed
for use in EMI shielding and high-strength
applications where lightweight materials
are required. They are also being developed
for use as thermally conducting interfaces
in high-power devices. Additional uses for
Figure 2. Scanning electron microscopy image of buckypaper (left); 400 foot roll of CNT (right).
Source: Nanocomp.
* Fullerine – Any of various cage-like, hollow molecules composed of hexagonal and pentagonal groups of carbon atoms (adapted from the American
Heritage Dictionary, 2009).
**Allotrope – Any of two or more physical forms in which an element can exist (adapted from the Collins English Dictionary 2009).
Feature
10
~60
Tensile Strength (GPa)
CNTs
8
Steel
5
CNTs are being investigated through collaborations with university laboratories.
However, challenges still exist in the development of CNT technologies for real-world
applications. The behavior of bulk CNT
materials often falls short for that of a single
nanotube. Novel CNT growth techniques,
as well as CNT alignment and integration
into bulk materials, are ongoing and critical
research areas. In fact, twenty years after
they were first synthesized, the potential for
CNTs is just now being realized.
Properties of Carbon-Based Nanomaterials
In applications where strength or weight is
an issue, CNTs and buckypaper can have a
significant advantage over traditional materials. While individual CNTs have measured
tensile strengths ranging from 10–150
gigapascals (GPa) in laboratory demonstrations, the tensile strength of mass-produced
yarns of CNTs and buckypaper has fallen far
short of those values. State-of-the-art CNT
yarns and sheets have tensile strengths of
1.5–3.0 GPa and 0.4–1.2 GPa, respectively.6
Figure 3. The structure of graphene
(image generated by Ninithi
Software for Nanotechnology).
Copper
Density (g/cm3)
6
4
Kevlar
3
CNT
yarns
2
1
4
Buckypaper
(non-aligned)
Buckypaper
(aligned)
Graphite
Steel
2
Aluminum
Copper
CNT
yarns Buckypaper
Aluminum
Kevlar
0
0
Figure 4. Plots showing the relatively high tensile strength and low density of
carbon-based materials.
While still lagging behind Kevlar (3.7 GPa),
these values meet or exceed those of copper, aluminum and steel. Moreover, when
the density of the materials is considered
(typical densities < 1 g/cm3), the strengthto-weight ratio of CNT-based materials
holds a dramatic advantage over these
other materials, including Kevlar. The tensile strength and density of carbon-based
and other common materials are shown in
Figure 4.6
CNT Fabrication Techniques
Synthesizing CNTs remains a primary challenge because low yields, and often diverse
and unpredictable properties, are obtained7
due to the assortment of material diameters,
lengths and chiralities*** produced; yielding
a mix of semiconducting and metallic material. CNTs can be fabricated using a number
of techniques, including chemical vapor
deposition (CVD), electric arc discharge and
pulsed laser ablation. Each technique has
numerous process variables that affect uniformity, defects and purity, thereby affecting
ultimate quality and utilization.
Because of its potential for large-volume
CNT production, CVD synthesis is the
method most commonly employed in industry. In the CVD process, catalysts such
as cobalt, molybdenum, iron and nickel
are nucleated using thermal or chemical
methods. Gaseous carbon compounds are
introduced at high temperatures, typically
on the order of 700–1,000 degrees Celsius
(lower for plasma-enhanced CVD). Carbon
migrates to the nucleation sites and nanotubes are grown on the catalysts. Electric
arc discharge is probably the most common
synthesis method used in research due to
its relatively low equipment cost. Using this
method, high current discharge between
graphite electrodes generates individual
carbon atoms that migrate to a cathode and
crystallize, forming nanotubes. Laser ablation techniques similarly use high-power
lasers (pulsed or continuous wave) to vaporize graphite, forming nanotubes as the
carbon condenses onto a cool substrate.
Table 1 summarizes some advantages and
disadvantages of these techniques.
While optimal CNT synthesis remains a topic
of much investigation, manufacturing processes for CNTs have matured significantly.
CNTs are produced at many small and
large companies throughout the industry.
Annual global production is projected to
reach ~1,000 tons in the coming years.9
Additionally, improvements in manufacturing
Table 1. Common methods for CNT synthesis.8
Method
Typical Yield
Pros
30−90%
Inexpensive, simple equipment
Short, random-length tubes
Chemical Vapor Deposition ~30%
Long tubes, good purity, scalable
High density of defects
Laser Ablation
High purity, good diameter control Capital equipment cost
Arc Discharge
< ~ 70%
Cons
*** Chirality – The configuration (or handedness) of an asymmetric structure (adapted from
the Collins English Dictionary 2003).
ENGINEERING PROFILE
Feature
Nanotechnology
Mary Herndon
Principal Engineer,
IDS
Since joining the
materials engineering group in
January 2006, Dr.
Mary Herndon has
implemented novel
optical techniques
for characterizing
scatter and absorbance properties in
laser materials. She currently leads nano- and
metamaterials independent research and
development for Raytheon Integrated Defense
Systems and the corporate-level Nano Science
and Engineering Technology Interest Group.
In her position, Herndon has had the opportunity to improve upon existing products as
well as identify new solutions. As a materials
engineer, she gets to look at both incremental,
near-term solutions and potentially disruptive
materials and technologies.
Herndon served as the materials engineering lead for various Zumwalt, Patriot and
Terminal High Altitude Area Defense
(THAAD) efforts. She participated in
Raytheon-sponsored projects involving metamaterials as well as chemical, biological and
explosive (CBE) sensing technologies. Before
joining Raytheon, she spent six years working
at startup companies, where she managed a
wafer fabrication lab and specialized in transitioning engineering processes to volume
manufacturing.
Herndon has experience in optical characterization techniques, semiconductor processing,
and the transfer of processes from prototype
to production manufacturing. She received her
Ph.D. in applied physics with an emphasis in
materials science from the Colorado School
of Mines, while working within the Center for
Solar and Electronic Materials and collaboratively with partners at the National Renewable
Energy Lab.
“I went into physics because I enjoy handson experiments and figuring out how things
work,” Herndon comments. “I am also somewhat of an obsessive planner and organizer.
My work allows me to be in the lab and enjoy
the creative and applied aspects of research
while also organizing the details and logistics
of project management.”
methods have led to about a 75 percent
drop in the cost of CNTs over the last ten
years.10 Now that reliable sources of CNTs
are available, the largest barrier to commercialization of CNT-based products is the
integration of CNTs into composites and
other material systems. By themselves, CNTs
are typically sold suspended in a solvent;
however, agglomeration often prevents
uniform dispersion and inhibits the potential
benefits of CNT use. In addition, lack of
material standards and metrology capabilities, as well as environmental, health and
safety (EH&S) concerns, have limited the
rate at which CNT technologies have been
accepted and therefore can mature.
Nanocomp Technologies produces CNT
sheets. They use the CVD-based nanotube
growth process combined with a drum uptake to allow batch sheets to be fabricated
in sizes up to 4.5 by 9 feet. These pieces can
then be seamed into indefinitely sized roll
stock (see Figure 2). Nanocomp also produces CNT yarns at a rate of ~15 km/week.
Depending on the processing, buckypaper
can be malleable or brittle. Typical sheets
are on the order of 25 microns thick and
less than 2 grams/ft2.12 Some typical properties of CNT sheets are listed in Table 2.
Table 2. CNT sheet properties compared to copper and aluminum.
Property
CNT Sheet Copper
Aluminum
Thermal Conductivity (W/m-K)
22 random/100 aligned* 395
237
17
23.6
Coefficient of Thermal Expansion 2
DC Resistivity (Ohm-cm)
2 x 10-4
1.56 x 10-6
2.45 x 10-6
Resistivity at 1MHz (Ohm-cm)
1 x 10-5
1.69 x 10-7
2.82 x 10-6
*Individual single-wall carbon nanotubes can exhibit thermal conductivities of up to 3,000 W/m-K.
Sources: Nanocomp Technologies and Solid State Physics, Ashcroft & Mermin, 1976
Buckypaper
Compared to composites loaded with
CNTs, the use of buckypaper circumvents
many of the agglomeration and EH&S issues. CNT sheets or film (buckypaper) was
first produced by Smalley et al in 1998,
when suspensions of functionalized CNTs
were vacuum dried on membranes.11 A
similar technique is being used at the High
Performance Materials Institute (HPMI) at
Florida State University, where sonicated
CNTs are being filtered through membranes
to produce buckypaper in both batch and
continuous processes. Aligned buckypaper
can be fabricated from carbon nanotube
“forests” by essentially flattening the CNTs
in one direction against the substrate. The
strong Van der Waals (intermolecular) forces
between nanotubes create a structure that
is then easily removed from the substrate.
Alignment can also be achieved by postprocessing randomly oriented buckypaper.
CNT sheets and yarns can be used in
cables to replace conventional EMI shielding and conductor materials. Nanocomp
Technologies has demonstrated a weight
reduction of 40–50 percent for coax
cables, and as much as 70 percent for
USB cables. In addition to cable applications, buckypaper is well suited for use as
a pre-impregnated material. Composites
that incorporate CNT sheet can provide
EMI shielding, integrated de-icing heaters
and lightning protection solutions for aircraft. A Nanocomp CNT sheet was recently
deployed on the Materials International
Space Station Experiment-8, and it was
implemented on the Juno mission, launched
in August 2011, to provide electrostatic
discharge protection for the spacecraft.
Completion of stringent qualification criteria for NASA, combined with Nanocomp’s
high-volume capabilities, has proven that
these technologies are poised to realize the
potential of CNTs in real-world applications.
Feature
Graphene
Graphene was recognized for years as a
contaminant, which often formed on the
surface of semiconductors or metals and
interfered with electronic transport experiments.5 Mechanical exfoliation of graphene
was first demonstrated in 2004, promoting
the explosive growth of graphene research.
With intrinsic charge carrier mobilities
higher than any other known material,13
and better thermal conductivity at room
temperature than diamond,14 graphene’s
extraordinary properties are being investigated to provide next-generation solutions
for complementary metal oxide semiconductors (CMOS), among possible applications.
as nickel, copper and platinum has been
demonstrated.16,17,18 Epitaxial growth on
SiC is achieved by heating the substrate
to temperatures of 1,200–1,800 degrees
Celsius, where silicon desorbs and promotes
the formation of graphene through the
rearrangement of the remaining carbon
atoms.19 Compared to exfoliation techniques, similarly high mobilities at room
temperature have been achieved with epitaxial methods.20
While mechanical exfoliation continues to
be the most common method for graphene
synthesis, epitaxial growth is also being
optimized to allow for oriented, large-scale
production. As the name implies, mechanical exfoliation of graphene is achieved by
rubbing graphite on a smooth surface.15
The resulting film has good electrical properties and can reliably be produced at the
millimeter scale.5
Graphene is a remarkable electronic conductor, capable of achieving intrinsic charge
carrier mobilities of 200,000 cm2/Volt-sec at
room temperature and capable of sustaining current densities5 of 5 x 108 A/cm2. Its
thermal conductivity (at room temperature)
is as high as 5,000 watts/meter-Kelvin, more
than double that of high-quality diamond
and more than an order of magnitude
greater than copper. Additionally, graphene
has a high intrinsic strength of 130 GPa, a
Young’s Modulus of 1 terapascal (TPa), and
it can support strains in excess of 20 percent
without breaking.21
Epitaxial growth is currently performed on
silicon carbide (SiC) substrates, but growth
on large-area polycrystalline materials such
Because of its single atomic layer thickness,
the surface area to volume ratio of graphene is very high, making it potentially
interesting for sensor applications and energy storage. Quantum confinement of a
charge in graphene allows bandgap tuning,
yielding essentially unlimited design possibilities for nanoscale transistors.22,23 Graphene
applications for LCDs, organic LEDs and
transparent conducting electrodes for solar
cells are enabled by its unique combination
of electronic and optical properties.
Raytheon continues to explore these promising allotropes of carbon to enable new
functionalities, as well as to improve the
performance and reduce the weight of
our products. The use of CNT-loaded composites has been explored for light-weight
body armor applications. We are currently
partnering with Purdue and Georgia Tech
to develop CNT-based interface materials to
enable efficient thermal contact between
electronic devices and heat spreaders. These
projects and many others are fueling the
evolution and ultimately the realization of
advanced carbon-based materials solutions
for the warfighter. •
Mary K. Herndon, Stephanie Fernandez
The authors would like to thank John Dorr and
David Lashmore of Nanocomp Technologies, Inc., for
contributing data and graphics used in this article.
References:
1. E. Osawa, Kagaku, 25, 854-863 (1970).
2. Henson, R.W., The History of Carbon 60 or Buckminsterfullerene, website revision March 2010, http://www.solina.demon.co.uk/c60.htm.
3. Iijima, Sumio, Nature, 354, 56–58 (1991).
4. R. Saito, G. Dresselhaus, and M. S. Dresselhaus, Physical Properties of Carbon Nanotubes, World Scientific Publishing Co, 1998.
5. Michael Fuhrer, Chun Ning Lau and Allan H. MacDonald, Graphene: Materially Better Carbon, MRS Bulletin, 35 (4), April 2010, pg 289.
6. Source: Nanocomp Data, April 2011.
7. Alvarenga, J., Carbon Nanotube Fabrication and Characterization, Faculty Presentation, Department of Physics, Rochester Institute of Technology, 84 Lomb Memorial
Drive, Rochester, NY 14623-5603, USA, February 2008.
8. Laura Young, Trevor Seidel, Pradip Rijal, Jason Savatsky, Carbon Nanotubes, Presentation for Texas A&M Dept of Chemical Engineering, March, 2010.
9. Science and Technology Policy Institute, White Papers on Advanced Manufacturing Questions, 2010
10.Jon Evans, Manufacturing the Carbon Nanotube Market, Chemistry World, November 2007, Royal Society of Chemistry.
11.Rinzler, Liu, Dai, Niolaev, Huffman, Rodriguez-Macia, Boul, Lu, Heymann, Colbert, Lee, Fischer, Rao, Eklund and Smalley. Large-Scale Purification of Single-Wall
Carbon Nanotubes: Process, Product, and Characterization, Applied Physics A, 67, 29–37 (1998).
12.Source: High Performance Materials Institute, Florida State University, Tallahassee, Fla.
13.S. V. Morozov, K. S. Novoselov, M. I. Katsnelson, F. Schedin, D. C. Elias, J. A. Jaszczak and A. K. Gein, Phys Rev Letters, Volume 100, 026602 (2008).
14.A. A. Balandin, S. Ghosh, W. Bao, I Calizo, D. Teweldebrhan, F. Miao, C. N. Lau, Nano Letters, 8, 902 (2008).
15.K. S. Novoselov, D. Jiang, F. Schedin, T. J. Booth, V. V. Khotkevich, S. V. Morozov, A. K. Geim, PNAS V.102, 10451 (2005).
16.K. S. Kim, Y. Zhao, H. Jang, S. Y. Lee, J. M. Kim, J. H. Ahn, P. Kim, J. Y. Choi, B. H. Hong, Nature 457, 706 (2009).
17.X. S. Li, W. W. Cai, J. H. An, S. Kim, J. Nah, D. X. Yang, R. Piner, A. Velamakanni, I. Jung, E. Tutuc, S. K. Banerjee, L. Colombo, R. S. Ruoff, Science, 324, 1312
(2009).
18.A. Reina, X. T. Jia, J. Ho, D. Nezich, H. B. Son, V. Bulovic, M. S. Dresselhaus, J. Kong, Nano Letters, 9, 30 (2009).
19.Philip N. First, Walt A. de Heer, Thomas Seyller, Claire Berger, Joseph A. Stroscio, Jeong-Sun Moon, MRS Bulletin, 35, 296 (April 2010).
20.Y. Zhang, Y.-W. Tan, H. L. Stormer, P. Kim, Nature, 438, 201 (2005).
21.C. Lee, X. D. Wei, J. W. Kysar, J. Hone, Science, 321, 385 (2008).
22.K. Nakata, M. Fujita, G. Dresselhaus, M.S. Dresselhaus, Phys. Rev. B, 54, 17954 (1996).
23.Yuanbo Zhang, Tsung-Ta Tang, Caglar Girit, Zhao Hao, Michael C. Martin, Alex Zettl, Michael F. Crommie, Y. Ron Shen, and Feng Wang, Nature, 459, 820–823
(11 June 2009).
Feature
R
aytheon is an industry leader in
high-power radio frequency (RF)
semiconductor device development
and integration. Raytheon’s wide bandgap
gallium nitride (GaN) device technology for
radar, electronic warfare and communications applications offers significant cost,
size, weight and power advantages over
conventional devices employing gallium
arsenide (GaAs) technology. For comparably
sized devices, GaN produces five to 10 times
more RF power than GaAs.
As shown in Figure 1, this significant
increase in output power and die-level dissipation within the same footprint presents
a challenge for controlling device junction
temperatures. The extreme heat fluxes
present in GaN semiconductor devices are
similar to those experienced within a rocket
nozzle, or upon ballistic entry. If thermal
resistance is not effectively addressed, device junction temperatures can easily exceed
levels that affect reliability. To realize GaN’s
full potential, Raytheon is collaborating with
leading researchers from academia and
industry to investigate micro- and nanoscale technology-enabled approaches for
improved thermal management.
These investigations are motivated by the
fundamental and potentially beneficial characteristics unique to engineered micro and
nanomaterials. For example, individual carbon nanotubes (CNTs) have been reported
to exhibit extraordinary on-axis thermal
conductivities of greater than 3,000 watts/
meter Kelvin (W/mK), which is nearly eight
times that of good thermal conducting
metals such as copper. By utilizing micro
and nanomaterials, designers can take
full advantage of physical scaling laws to
increase the effectiveness of thermal management components. This approach has
been studied extensively for cold plates and
heat exchangers, where reducing the size of
channels results in improved heat transfer.
Today, microchannel cold plates are used in
many commercial products and in fielded
military hardware.
Raytheon’s comprehensive technology
development strategy, which addresses
heat transport, heat spreading, thermal
interfaces and chip-scale thermal management, is shown in Figure 2 for a transmit/
receive (T/R) module in an active electronically scanned phased array radar. Advances
are required in all aspects of the thermal
management system to avoid thermal bottlenecks that can limit performance.
Chip-Scale Thermal Management: In collaboration with Group4 Labs, Stanford University
and the Georgia Institute of Technology,
Raytheon is pursuing approaches to integrate synthetic diamond directly into
high-power devices. Integration of polycrystalline diamond, with conductivity greater
than three times that of silicon carbide (SiC),
has the potential to improve device power
handling by a factor of three over the current GaN-on-SiC technology. This enables
more powerful and affordable devices.
Radar Transmit/Receive Module
Chip-Scale Thermal Management
Goal: Reduce intra-device temperature rises
Approach: Highly Integrated Diamond
Heat Flux (W/cm2)
103
102
10
GaN
Ballistic Entry
Rocket Nozzle Throat
Nuclear Blast
GaAs
Si
Re-entry from Earth Orbit
Goal: Reduce interface temperature rise with
improved compliance and reworkability
Approach: Nano Thermal Interface Materials
Heat Spreading
Rocket Motor Case
Goal: Achieve low temperature rise spreading
with minimized thickness
Approach: Thermal Ground Plane
1
10-1
Thermal Interfaces
Solar Heating
Chip/Device
Interface
Chip Carrier
Interface
T/R Module
Package Base
Interface
TRIMM Coldplate
Coldplate
Cooling
Fluid
Interface
1000
2000
3000
Temperature (K)
4000
Figure 1. Next-generation GaN device
technologies present formidable thermal
challenges, driving the development of
advanced thermal management solutions.
(Adapted from Bar-Cohen, ca 1985.)
Heat Transport
Goal: Achieve low-resistance, high-efficiency heat rejection
in limited volume
Approach: Micro Technology Enabled Heat Sinks/Cold Plates
Cooling Rib
Figure 2. Raytheon, in collaboration with its team members, is taking a multifaceted approach
to eliminating thermal bottlenecks to allow maximum device performance. Illustrated are
representative thermal interfaces for a radar transmit/receive module.
Feature
Thermal Interfaces: In collaboration with
Georgia Institute of Technology and Purdue
University, Raytheon is developing nano thermal interface materials (nTIMs) based upon
metallically bonded, vertically aligned carbon
nanotubes (VACNTs), as shown in Figure 3.
These nTIMs provide the thermal performance
of a solder joint while maintaining the compliance typical of a low-conductivity filled epoxy
or grease. Results to date have achieved a
factor of three improvement in interfacial
resistance relative to state-of-the-art commercial materials.
Heat Spreading: In collaboration with
Georgia Institute of Technology Research
Institute, Purdue University and Thermacore
Incorporated, Raytheon is developing radio
frequency thermal ground plane (RFTGP) heat
spreader technology. RFTGPs use capillarydriven two-phase (liquid and vapor) flow to
achieve highly efficient heat spreading from
high-power devices in a low-profile, semiconductor thermal expansion-matched chip
carrier. RFTGPs are intended to replace solid
conductor substrates currently used in device packages, while providing greater than
three times the conductivity of copper. This
type of heat spreader can potentially reduce
device operating temperatures by tens of
degrees Celsius in a typical GaN-based radar,
improving system performance and reliability.
To achieve these goals, various engineered
micro and nanostructured thermal wicking
materials have been investigated for use in
the TGP, including copper-functionalized
CNTs (Figure 4). RFTGPs have demonstrated
effective thermal conductivities of greater
than 1,000 W/mK in form/fit/function interchangeable RF packaging geometries, paving
the way for technology insertion.
Heat Transport: Advanced heat transport
technology development efforts have focused
on implementing micro-scale features to enhance heat transfer via a variety of cooling
mediums. High efficiency and performance
air cooling was developed in Raytheon’s
Integrated Microchannel and Jet Impingement
Cooler (IMJC) program. Raytheon has demonstrated robust, distributed two-phase
microchannel cooling suitable for servicing
future naval sensors and effectors on the
U.S. Navy’s Advanced Naval Cooling System
(ANCS) program. Both efforts seek three-fold
improvements in efficiency over current stateof-the-art air and liquid cooling approaches
with a two to four times improvement in
200 nm
Heat
Heat
Semiconductor Chip/Device
Cu
Foil
Vertically
Aligned
CNT
Film
Chip Carrier
Heat
Heat
Figure 3. Nano thermal interface materials (nTIMs) employ metallic bonding of vertically
aligned carbon nanotubes grown on metallic foils to reduce interfacial thermal resistance by
greater than three times relative to state-of-the-art epoxy TIMs.
Low CTE Composite
Construction
CNTs
Nano-functionalized
Grid Patterned
Evaporator
heat sink
Condenser
condensed
liquid
Vapor Space
Evaporator
with CNT
Functionalized
Patterned Wick
chip
Figure 4. Radio frequency thermal ground planes (RFTGPs) are constructed with nanomaterial-enhanced thermal wicking structures that have low thermal coefficients of expansion, close
to that of the semiconductors that are mounted on them.
thermal performance. The improved heat
transport afforded by IMJC technology
enables the implementation of air-cooling,
which was previously not feasible. Twophase microchannel cooling promises to
substantially reduce the size, weight and
power consumption associated with cooling next-generation high-power electronics
systems.
As the demand for system performance
grows, it stresses the thermal limits of
semiconductor devices. Raytheon and its
partners are leaders in the development
and integration of new materials (synthetic
diamond and carbon nanotubes) and new
structures (2-phase microchannel heat
spreaders and heat transport devices) that
will extend device performance through improved thermal management. •
David Altman
The views expressed are those of the author and do not
reflect the official policy or position of the Department
of Defense or the U.S. Government. This is in accordance with DoDI 5230.29, January 8, 2009. Distribution
Statement “A” (Approved for Public Release,
Distribution Unlimited as per DISTAR case 19086).
19
Feature
Providing Thermal
Management for
Power Semiconductors
N
Diamond Manufacturing
Process
1800
1600
1400
1200
Raytheon Optical
Quality Diamond (OQD)
2000
Thermal Management
Grade CVD Diamond
1000
800
600
400
200
(W/mK)
0.2 17 29.3
223 237
149 170
395 428
nd
mo
Dia
r
ve
Sil er
pp
Co inum e
m
xid
Alu m O ride
liu Nit
ryl
Be um
n
mi
Alu n
ide
Ox
ico
Sil num
mi
Alu r
va
Ko ide
m
lyi
Po
Raytheon is an acknowledged leader in the growth
and fabrication of diamond
in sheet form. At Raytheon,
diamond is synthesized
by the CVD process from
methane and hydrogen
gases in the presence of a
microwave plasma. The microwave plasma CVD process
(MPCVD) produces the highest quality diamond; other
methods, such as hot filament CVD, tend to produce
lower quality, less thermally
conductive material due to
the incorporation of impurities from the hot filament.
2000
Thermal Conductivity
Raytheon’s
Diamond
Technology
ext-generation radar, communications and electronic warfare systems,
especially those employing high-power gallium nitride (GaN) based
radio frequency (RF) devices, will benefit from advanced methods of
thermal management to remove the large quantities of heat generated in these
systems. Figure 1 compares the thermal conductivity of materials commonly
used in the semiconductor industry. Diamond, especially the high optical quality material produced at Raytheon using the chemical vapor deposition (CVD)
process, has considerably higher conductivity than the other conventional
materials.
Figure 1. The thermal conductivity of commonly
used materials in the semiconductor industry.
Diamond’s thermal conductivity is more than
three times greater than silver.
Figure 2 illustrates a microwave plasma CVD reactor employed at Raytheon to
produce high quality diamond. The microwave plasma, created by exciting
hydrogen gas with microwave radiation, decomposes the methane gas into
several different carbon species that react/combine with hydrogen in the gas.
Diamond growth takes place on a metallic substrate onto which diamond particles have been added. These particles or diamond “seeds” act as nucleating
sites for the diamond wafer growth. The atomic hydrogen formed in the
plasma plays a critical role by etching away any graphitic or non-diamond
material that might deposit along with diamond. Rotation of the metal disk
ensures diamond thickness uniformity.
Raytheon’s diamond deposition reactors are capable of growing up to 5-inch
diameter diamond parts. In Figure 3, one can see the various sizes and shapes
of diamond material produced at Raytheon.
Feature
Figure 2. A schematic of the MPCVD diamond reactor is shown on the left. The substrate is rotated to ensure diamond uniformity. On the right
are photos of Raytheon’s high-power diamond reactors in action.
Figure 3. Various shapes and sizes of diamond made at Raytheon. Diameters up to five inches have been demonstrated, with laser cutting used to
fabricate the desired sizes and shapes.
Diamond Heat Transfer Technology
The primary use for diamond at Raytheon
is thermal management, specifically the
dissipation of the large heat flux that is generated by high-power devices such as GaN
HEMTs (high electron mobility transistors).
High junction temperatures degrade RF
performance and decrease reliability. A
common approach to reduce temperatures
is to space transistor gate fingers further
apart and reduce the operating power
density. However, this increases monolithic
microwave integrated circuit (MMIC) size
and cost and reduces output power.
A novel solution that is being developed at
Raytheon to remove heat from high-power
devices and enable them to realibly achieve
full performance, is to integrate diamond
directly into the device structure as illustrated in Figure 4. Thermal modeling has
shown that this technology can improve
thermal transport through the substrate so
that power handling can be significantly
increased relative to the current state-ofthe-art of GaN-on-SiC (silicon carbide)
technology. Diamond attached to the
bottom of the GaN efficiently spreads the
extraordinarily high heat fluxes
(0.1–1 kW/mm2) typical of GaN device
junctions with minimal substrate temperature drop. Although additional heat
spreading is expected by incorporating thin
film diamond on top of the device, thermal
simulations indicate that the majority of
the benefit is achieved with the bottom
diamond; hence there is little additional
benefit to be gained by incorporating diamond coatings in these device structures.
Raytheon’s CVD diamond technology
produces very high thermal conductivity
material. By combining the extraordinary
Diamond
Coating
AlGaN
epi
S
G
D
GaN epi
Bottom Diamond Substrate
Area of
heat
generation
Figure 4. High electron mobility transistor
(HEMT) schematic showing incorporation of
diamond both below and on top of the device
structure. S, G and D are source, gate and
drain. The red dot indicates approximate
location of the source of heat generation.
thermal conductivity of this material with
a fully integrated GaN-diamond device
architecture, Raytheon seeks to advance our industry-leading GaN device
technology to even higher power and
performance levels. •
Ralph Korenstein
Feature
C
urrently, applications for infrared
(IR) imaging devices are limited by
the need for costly, slow, bulky
components that require cooling. These
components include high-magnification sensors that require large lenses and telescope
configurations, noisy mechanical shutters
that limit the usefulness of many imaging
systems in covert applications, electronics required to mitigate focal plane array
(FPA) saturation effects (i.e., blooming) in
all-weather applications, and filters that improve imaging contrast at dusk and in haze.
The drive to reduce system size, weight and
power consumption, while increasing the
resolution and format of IR imaging systems,
presents many new challenges. Current efforts to develop lightweight, fast components
A
B
have been focused on established micro-electromechanical systems (MEMS) approaches;
however, reliable MEMS-based technologies
are processing intensive and still not cost
effective. Raytheon, in collaboration with
the University of California at Santa Barbara
(UCSB), has developed new polymers to address these challenges. Polymers, with their
infinite customizability and low production
costs, offer a novel solution.
Biological Inspiration
While investigating the use of polymers
for IR imaging, Raytheon looked to nature
and the world’s oceans for inspiration.
Cephalopods (e.g., octopus, squid and
cuttlefish) manipulate light for camouflage
and inter-individual signaling using their
ability to selectively scatter light with both
D
protein platelet, 1.34<n<1.36
extracellular space, n=1.34
cell membrane
C
Non-reflecting
Red
Green/Gold
Blue
Figure 1. A) Dynamically tunable protein (polymer)-based elements can reflect any color, as
seen in the iridescent skin of the squid, Loligo Pealeii. B) Schematic showing the components of
the intracellular Bragg reflector. C) Transmission electron micrographs of subcellular reflectincontaining platelets, composing the Bragg reflectors, as a function of progressive changes in
reflectance. D) Temporal progression of neurotransmitter-induced changes in squid skin, corresponding to the light micrograph in A) and the subcellular changes in C). (Illustrations courtesy
of UCSB Institute for Collaborative Biotechnologies and Army-sponsored publications from
Morse’s laboratory [A, B and D] and Hanlon’s laboratory1 [C].)
1
Hanlon, Cell Tissue Res (1990) 259:15-24
pigmentation and reflection. The reflectors
responsible for the dynamic iridescence of
the cephalopod’s skin (Figure 1A) are composed of proteins called reflectins. These
are organized within stacks of intracellular,
membrane-enclosed Bragg reflectors that
in some contexts act as filters but in other
contexts act as reflectors (Figure 1B & C).
Professor Dan Morse’s laboratory at UCSB
has recently discovered that the catalytic
phosphorylation* of specific amino acids in
the reflectin protein drives a conformational
change in the protein that activates its hierarchical assembly, simultaneously tuning
the spacing, thickness and density (refractive
index) of the thin protein layers and quickly
promoting change in the transmission of light
across the entire visible range (Figure 1D).
The biopolymer’s inherent elasticity and
conformability; its quick, reversible assembly; and the synergistic effects it provides by
being able to alter both density and thickness
are remarkable and unique. Biology shows
us that these exquisitely finely tuned lightweight polymers (proteins), when spatially
constrained as single thin layers, can tune
and deliver all the optical functionalities conventionally provided by heavy, bulky, noisy
and power-hungry devices. Inspired by this
biological effect, Raytheon and UCSB have
begun a close collaboration to develop thin
films of synthetic polymeric materials that exhibit electrically driven simultaneous changes
in morphology and refractive index. This has
led to further development with the Army
* The introduction of a phosphate group into an
organic molecule by means of a catalyst.
Feature
Army Research Labs
IR Shutter
Technology
Research Labs to incorporate tunable organic
layers into optical devices.
Optical Device Development
Initial designs based on poly (3-hexyl thiophene) (P3HT) exhibit a sharp transition
from highly transparent to opaque in the
medium wave infrared (MWIR) band (Figure
3-1), with the difference in transmission (on
versus off) at a specified wavelength being
a key metric for denoting optical contrast.
Improved designs leveraging customized
polymer design and fabrication increased
switching speed, as illustrated in Figure
3-2. Further polymer customization led to a
polymer chain that contained more complex
elements, promoting ion diffusion and leading to faster switching with better device
stability (Figure 3-3). This is illustrated by the
repeatability of device absorption versus time
with no change between cycles as the device
is switched on and off.
Device geometries have been investigated,
and separations between active areas as
small as 25 µm have been demonstrated,
allowing for the very close mating of optical elements (e.g., rings in an aperture).
Aperture devices have been fabricated from
Bio-inspired
Neutral Density
Filter, Shutter
Aperture
Coded Apertures
Figure 2. Bio-inspiration drives development of a neutral density filter/shutter that can be patterned to realize a dynamic aperture or coded aperture for IR imaging applications.
Absorption (a.u.)
0.40
2. P(OOT-BT)
0.35
S
0.30
0.25
C8H17
n
0.20
O
C8H17
O
N
S
0.15
n
S
0.10
0.05
0
500
1000
1500
Time (s)
2000
2500
3000
Absorption (a.u.)
0.12
0.09
0.06
0.03
C8H17
N
0.12
0.09
40
60
80
Time (s)
100
120
140
0.04
0.02
C8H17
O
O
3a. R a=H
3b. R b=C-O-C12-H 25
R
R
S
O
0.06
N
0.03
0.00
0.06
Time (s)
0.15
0.15
0.08
60 80 100 120 140 160 180 200 220 240
3. P(EDOT-BT-Cz)
0.18
20
N
0.10
Absorption (a.u.)
1. P3HT
0.45
Absorption (a.u.)
Conjugated polymers are solution processable semiconducting materials that,
upon electrochemical activation, exhibit
changes in refractive index coupled with
changes in morphology (due to ion diffusion). This results in distinct transformations
in absorption and reflection over the
entire electromagnetic spectrum. As the
polymer-based materials transition from
semiconducting to conducting, free carriers
and conformational changes absorb and
scatter wide bands of infrared radiation.
The resulting change in refractive index
from the simultaneous production of absorbing species and their increased density
closely parallels the synergistic simultaneous changes in the reflectin-based Bragg
layers that provide the high gain exhibited
by the biological system. The basic device
is a uniform layer that functions as a neutral density filter (NDF) or shutter, and that
can be extended with spatial patterning to
act as a solid-state dynamic shutter or as a
coded aperture (Figure 2).
0.00
O
2
4
6
8
10 12 14 16 18 20 22
Time (s)
N
O
S
n
Figure 3. Polymer structures and corresponding temporal plots of absorption are shown as the
device is actuated. Polymer customization has enabled improvements in performance from
commercial-off-the-shelf devices with poor temporal and contrast stability (1) to devices with
much faster actuation and much greater stability (2 and 3, respectively).
these polymer layers in
an array of 1,000 µm
active regions with
25 µm spacing (Figure
4). These devices can be
actuated with a 0–3V
signal. The transmission
has been captured as a
Figure 4. Prototype aperture with seven actuating sections, one
function of time using
fixed opaque section and one fixed transparent section.
a Raytheon short wave
infrared (SWIR) camera
Raytheon and UCSB are collaborating to
system. Two frames are presented in
leverage research in cephalopod biology
Figure 4: one with 0V bias applied (left
and the mechanisms by which cephaloimage) and one with 3V bias applied (right
pods change skin color with the objective
image). The device consists of a 3x3 array
of reducing the size, weight and power
of pixels, with one pixel fixed at 3V bias (left
consumption of infrared imaging systems.
column, center row) and one pixel unbiased
Aperture devices with dimensions of 25 µm
(center of array). The change in contrast beand with sub-second switching times have
tween the two frames is apparent with the
been demonstrated, showing a viable path to
darkening of the remaining pixels between
bio-inspired shutters and coded apertures. •
the two frames, demonstrating that a shutAndreas Hampp, Amanda Holt,
ter and a coded aperture are feasible.
Dan Morse, Justin Wehner
Feature
Realizing the Potential of
Metamaterials
T
he subject of metamaterials has
gained popularity over the past decade with regard to the benefits they
may provide to various radio frequency (RF)
and electro-optic (EO) applications employing antennas, lenses, guiding structures and
electro-optic components. The term was introduced by Dr. Rodger Walser, formerly of
the University of Texas, Austin, who offered
the following definition: “Metamaterials
are macroscopic composites having a
man-made, three-dimensional periodic
cellular architecture designed to produce
an optimized combination, not available
in nature, of two or more responses to
specific excitation.” (See Figure 1.) An alternate definition (adopted by the Air Force
Research Lab) states that metamaterials are
a class of engineered materials exhibiting
highly beneficial electromagnetic properties,
which are neither naturally occurring nor
common synthetic materials, that exhibit
structure-dependent properties not obeying
the “rule of mixtures” for composite materials. The rule of mixtures is a method used to
estimate a composite material’s properties
assuming that these properties are a simple
volume-weighted average of the properties
of the matrix and dispersed phases. Several
features of these metamaterials definitions
are worth noting. An engineered material
can be a combination of different types of
materials and/or structures used to obtain
desired material properties. Examples of
this are the use of periodic or aperiodic grid
surfaces and/or the use of different applications of materials in a suitable combination.
Synthetic materials can include ways of
introducing vias, voids or cavities into a conventional dielectric with the voids/cavities
potentially filled to include dielectric and/
or magnetic materials with properties different from the surrounding bulk medium.
Layering of such composite materials can
then be adopted to yield a bulk material
with the desired material properties.
The study of metamaterials was initiated with
a scholarly article in 1968 by Vesalgo,1 who
was studying electromagnetic transmission
properties through a hypothetical medium
with a refractive index that was assumed to
be negative. Vesalgo predicted that some
unusual wave mechanisms would emerge
in such a medium, like refraction, wherein
a light ray is bent in a negative direction as
compared to the conventional bending of
a ray in the positive direction for a positive
index medium. Vesalago did not claim that
such a material could be realized, however.
The work remained dormant until about
1996 when Pendry et al.2 demonstrated
that through the clever use of periodic
structures one could obtain a medium
having negative permittivity. The use of
split-ring resonators in a periodic grid was
shown to offer a negative index of refraction, and with the additional work of Smith
et al.,3 who demonstrated simultaneous
negative permittivity and permeability
through the use of periodic structures, a
flood gate of extensive research opened up
the possibility of using a variety of periodic
surfaces as a way to provide unique material
properties. It should be noted that, although these properties were demonstrated
with periodic structures, periodicity is not
required to create a metamaterial.
While headlining applications — such as
cloaking and invisibility — gain much public
fanfare, there are many practical but often
overlooked challenges in applying metamaterials to real-world applications. Due to
the resonant nature of most metamaterial
solutions, the approaches for achieving
broadband effective properties are challenging. The principle of loss, or dissipation
of the electromagnetic energy through its
interaction with the material, presents a
significant barrier for applications requiring
transparency or high-efficiency transmission.
Additionally, the creation of manufacturable bulk materials, beyond a few stacked
surfaces, can be a significant challenge for
Metamaterial is an arrangement of artificial structured elements, designed
to achieve advantageous and unusual electromagnetic properties.
µετα = meta = beyond (Greek)
A natural material
with its atoms
A metamaterial
with artificially
structured “atoms”
Figure 1. Conventional materials derive their electromagnetic properties from their atomic
structure, where atoms are the basic building blocks (left). The electromagnetic properties of
metamaterials are derived from uniquely configured building blocks (right) each composed of
many atoms. These building blocks are typically structures with dimensions on the order of a
wavelength at the frequencies for which they are designed to operate.
Feature
ENGINEERING PROFILE
Srinivasiengar
Govind
materials and manufacturing engineers.
The difficulty of this process is amplified as
metamaterial features are pushed down
into the nano-scale required for optical
frequencies. Ultimately, the success of
metamaterials requires an emphasis on the
ability to model, design and manufacture
them for system applications.
Raytheon has a long legacy of expertise in
employing electromagnetic technologies to
meet the mission needs of our customers
and the warfighter. A significant number of
our products involve either the transmission
or the sensing of electromagnetic radiation.
This includes radar, electro-optic and infrared (IR) surveillance, missile seekers, global
positioning systems (GPS), lasers, directed
energy, command and control, communications and remote sensing. Because of this,
Raytheon is pursuing metamaterial technology, both internally and with our academic
and industry partners. There are several
ongoing developments that promise to add
capability and reduce the size of our products from the RF through the visible part of
the electromagnetic spectrum.
RF Developments
With reduced availability of real estate for
antennas on aircraft, there is a demand for
conformal structures with multi-function
capability offering broad bandwidths,
dual polarization and wide scan angles.
Metallic
Loop Array
Conventional technologies offer either
broad-bandwidth capability over a narrow
scan angle or wide-angle scanning capability with limited bandwidth. Metamaterials
offer a new paradigm for synthesizing
suitable structures for dual-band or broadband array applications. Unique conceptual
metamaterial structures are currently being
investigated to provide alternate solutions to
the challenging problem of providing broad
bandwidth, or multiple frequency bands,
along with a wide scan angle.
Microstrip patch antenna arrays are a
popular choice for conformal applications.
Broadband, wide-angle scanning can be
achieved with the use of low-dielectricconstant substrates, as they delay the
generation of surface waves in the spatial
and frequency domains. When dealing with
certain applications where a low dielectric
constant is not an option, the use of higher
dielectric constant substrates results in an
inherent trade between realizable bandwidth and scan angle performance of the
array. Electronic bandgap structures (made
up of periodic cells with grounded vias)
offer the ability to suppress the surface
waves that limit scan angle performance,
and when integrated with the microstrip
patch elements, these structures offer
improved array bandwidth and scan
angle performance.
Biased Loops (red)
Vias
Thin
Dielectric
Sheets
Vbias
Two-layer
Inductive Wire Grid
Ground Loops (black)
Figure 2. Composite skin with varactor diodes embedded in unit cells to control transmissivity.
Senior Program
Manager,
SAS
As a senior program manager
with the Special
Programs group
of Advanced
Concepts &
Technology, part
of Raytheon Space
and Airborne Systems, Dr. Srinivasiengar
Govind is involved in the development of
specialized low-band and broadband antennas. This includes work on the advancement
of structurally embedded antennas. During
his career, Govind has conducted studies
on broadband multi-function antennas,
radomes and radar cross-section studies. He
has also worked on multi-beam antennas for
satellites and electromagnetic pulse interaction effects studies for aircraft and missiles.
With 35 years of work experience, including
12 years with Raytheon, his early research in
applying electromagnetics to antenna and
scattering applications led him to his current
career path. What excites him about his job
is, “the constant learning I get by interfacing
with the team members of many projects. I
am not afraid to ask a fresh graduate to teach
me things that I may not necessarily know, as
well as share with them the application side
to which I have been exposed over the years.”
Govind understands the importance of
maintaining a good rapport with his customers. He understands that keeping the
customer abreast of all new developments
on a program can lead to future research
and development. “I was very fortunate to
be involved in the development of specialized aircraft during my earlier days with a
previous employer, at a time when major
development of the special technology was
ongoing,” Govind relates. “I was also very
fortunate to have a supportive manager
who believed in the importance of applied
research to meet customers’ needs.”
ENGINEERING PROFILE
Kelly Dodds
EO Sensors Design
Section Manager,
SAS
Kelly Dodds has
been newly assigned
to the position of
section manager
with the Electrooptical (EO)
Sensors Design
department of
Raytheon Space and
Airborne Systems. His former assignment
as the Mechanical, Materials and Structures
Technology Area director for Raytheon
Corporate Research and Technology gave
him the opportunity to continue fostering
his passion for creating business value from
technological innovation and for providing
leadership within the Raytheon technical
community.
Dodds coordinated technology development
across the company, ensuring competitive
positioning for mechanical/materials contracted research and development (CRAD)
opportunities and alignment with customer
science and technology road maps. He was
responsible for managing the Mechanical/
Materials IDEA (innovation) project
portfolio, and he played a key role in planning company research in electromagnetic
metamaterials.
“Our company has a network of top-notch
technologists unlike anything I’ve seen in
a single company,” Dodds explains. “As
a diverse technology company of 71,000
employees, the technical depth and breadth
of our engineering and scientific expertise
is staggering, and my time working for
Corporate Technology and Research only
reinforced that for me.”
Prior to his technology area director role,
Dodds worked for Raytheon Vision Systems
as a supplier quality manager and mechanical
design lead. He supported infrared and visible focal plane technology, including tactical
ground, airborne systems and space systems.
Metamaterials
Feature
The development of composite skins (Figure
2) that control surface reflectivity is an ongoing effort in collaboration with the
University of Michigan. The composite skin
uses a periodic array of metallic surface patterns (loops) with embedded varactor
(voltage variable capacitance) diodes connected between them. Transmission as a
function of frequency through the periodic
frequency selective surface (FSS) is controlled by altering the voltage across
varactor diodes. Alternatives to the use of
varactor diodes, including thin films and
ferromagnetic materials, are also being
investigated.
Raytheon, in collaboration with the
University of South Florida, is developing
antennas that incorporate metamaterials for
reduced-size dual-band GPS antenna applications. Most of the demonstrated benefits
of metamaterial structures for antenna size
reduction have been for narrowband applications. However, with proper design of the
unit cell structure, dual-band applications
are feasible. Due to the close proximity of
antenna elements in an array, techniques
are required to improve electrical isolation
between elements. An example of a dualband GPS antenna element is shown in
Figure 3.
EO Developments
For EO applications, such as lenses,
dielectric-based micro- and nanostructure
designs are being investigated for the development of low-loss optical polaritonic
metamaterials. Polaritonic metamaterials
are compounds of at least two materials
with very different values of dielectric
permittivity (e).
The design approach is different from conventional plasmonic design, which is based
on metal patterns on a dielectric or semiconductor substrate — no metals are used
in the polaritonic structure. This significantly
reduces the dissipation (loss) associated
with conductivity current. Dissipation is one
of the key mechanisms of optical loss in
Capacitive element
Coax Feed
Vias
Figure 3. GPS antenna unit cell test structure. Dual-band antenna elements are being
realized via the judicious application of
metamaterials principles.
plasmonic metamaterial, reaching levels
of 10–100 dB/unit wavelength (l). Such a
huge loss makes even micrometer (mm)thick metamaterial layers fully opaque and
precludes many interesting practical applications for plasmonic materials.
In the polaritonic design, resonant electromagnetic oscillations, which are needed to
change the refractive index of a material
via an induced strong spectral dispersion,
are supported by the displacement current
of dielectric re-polarization. Displacement
current oscillates as a mode pattern of a
dielectric cavity formed by an elementary
cell. This replaces the conductivity current
oscillation mode in the electrical circuit of a
plasmonic cell.
Dielectric metamaterials can be created in
several different ways. Fine-patterning of
a crystalline silicon carbide (SiC):4H wafer
was selected as the manufacturing process
of choice. This material is the only option
among a family of high-e materials for
which a transparency window covers a significant portion of the visible/IR spectrum
(0.5 to 5 microns); i.e., the region where
most applications are expected.
Raytheon, in partnership with Purdue
University, is focused on modeling and
designing optimal cell patterns of dielectric
compounds and developing the processes
required for producing such compounds. In
Feature
parallel, a new method for characterizing
metamaterial layers by using reflection spectra for a few different incidence angles is
also being developed.
On the manufacturing side, Raytheon
upgraded and optimized SiC patterning
technology to produce micron-level feature
sizes, providing a significant improvement
over previous technologies (Figure 4). This
advancement enables the production of SiC
optical metamaterials for the mid-IR spectral
range. The work continues with a goal of
reaching even finer spatial resolution to access future IR and visible spectral ranges.
Nano- and micro-patterned materials can
be deliberately made to exhibit controlled
spatial gradients of refractive index (n). This
ability offers the potential for realizing novel
ultra-light optical components. The idea is
similar to creating gradient-index (GRIN)
optics. However, a low-loss metamaterial
layer provides a very high amplitude range
in the index; about Dn ~ 1 compared to
Dn ~ .01, which is typical for GRIN optics.
Instead of using optical glass, an optical
component (such as a lens) can be made
into an extremely thin layer, or even a coating, while still providing a large optical path
difference.
Figure 5 shows the results of a study by
Purdue University to evaluate the potential for applying Raytheon’s SiC-based
polaritonic metamaterial layer to create a
micro-lens. The left portion of Figure 5 is
a schematic of a metamaterial micro-lens
design, a set of parallel groves etched into
a SiC wafer surface (“cylindrical” version of
the lens is shown). The grooves are specified by their depth, width and separation.
The right portion of Figure 5 demonstrates
that this fine pattern, which is less than 100
microns in overall size, provides a strong focusing effect at a distance of 100 microns.
Light is incident from the bottom of Figure
5. A dielectric metamaterial is deliberately
used to minimize insertion loss. Such focusing ability cannot be obtained without the
metamaterial-based micro-lens
array.
There are several advantages
to such a micro-lens. First, from
a packaging perspective, it is
thinner and lighter, and it can
also be written directly on a
substrate of a detector or emitter matrix to reduce the number
of parts for imaging arrays and
displays. Second, it can add
new functionality features because such a lens can be made
spectrally selective to focus
radiation for a specific narrow
wavelength band, passing the
rest of the background spectra unfocused. Third, it can
improve device
performance by
increasing both
the detector’s signal-to-noise ratio
and the fill factor
for a micro-lens
array.
Figure 4. Example of a micrometer (mm)-scale pattern on
SiC.
In addition to
the work noted
above, Raytheon
Figure 5. A schematic of a metamaterial micro-lens made of 23.3 mmis a partner in the thick silicon carbide SiC (left). The design consists of a set of parallel
grooves etched on the SiC surface. This fine pattern, which is less than
newly formed
100 mm in length, provides a strong focusing effect at 100 microns from
National Science
the surface for light, at a wavelength of 12.35 mm, incident at the bottom
Foundation
(right).
(NSF)-backed
I/UCRC (Industry
& University
applying metamaterials to provide
Cooperative Research Center) Program
significant gain over the state of the art,
led by the City University of New York
striving to advance system capabilities for
(CUNY), and is supported by partner uniour customers. •
versities including Clarkson University, the
Srinivasiengar Govind
University of North Carolina and Western
Carolina University. Technologists from
1V. G. Veselago, The electrodynamics of substances with simultaacross the corporation are engaging with
neously negative values of e and m, Sov. Phys. Uspekhi, vol. 10,
no. 4, pp. 509–514, 1968.
the metamaterials community, which
2J. B. Pendry, et al., Low frequency plasmons in thin wire strucincludes industry partners, academia, govtures, J. Phys. Condens. Matter, vol. 10, pp. 4785–4809, 1998.
3D. R. Smith, et al., Composite medium with simultaneously negaernment and Federally Funded Research and
tive permeability and permittivity, Phys. Rev. Letter, vol. 84, no.
Development Centers, with the intent of
18, pp. 4184–4187, May 2000.
Feature
Detection and
Identification of
Radiological
Sources
Materials Challenges
R
aytheon is developing a suite of
tools to inspect cargo and freight for
weapons of mass destruction or disruption. This began with the development
of the Advanced Spectroscopic Portal (ASP)
inspection system, which was sponsored by
the Department of Homeland Security (DHS)
Domestic Nuclear Detection Office (DNDO).
Originally designed as a stationary nuclear
materials portal, ASP was intended to be located at border crossings, bridges and other
sites where vehicles and cargo containers
pass through. The system contains several
gamma ray- and neutron-sensitive detectors that can identify the location and type
of radioactive isotopes in a moving vehicle.
An ASP variant, shown in Figure 1, which
contains a smaller number of radiation
detectors, was next developed as a mobile
detection system to search for and identify
types of radiological materials as it drives by
suspect objects.
In contrast to the ASP systems, the DNDOsponsored Stand Off Radiation Detection
System (SORDS) (Figure 2) has been developed to seek out radiological materials
being transported on a moving platform at
larger stand-off distances (greater than 100
meters). SORDS is designed as an imaging
system, and it is more adept at identifying
low levels of radiation such as those generated by lightly shielded point sources. Its
objective is to detect small radiation threatgenerated gamma ray signatures embedded
in a sea of confusing background radiation.
At the heart of these radiation inspection
systems is a network of specialized ionizing
radiation detectors called scintillation detectors that have unique material properties,
enabling them to discriminate and identify
the type of radioactive isotopes being detected. These radiation detectors consist of
a scintillating material that generates a burst
of light when excited by radiation and an
appropriately attached light detector such
as a photomultiplier tube to quantify generated light levels.
Identifying the isotope type is critical since a
host of naturally occurring radioisotopes is
found in foods (such as potassium-40 in bananas) and in other common materials such
as kitty litter. The system must differentiate these from potential threat materials.
Isotope typing is best addressed by identifying uniquely emitted gamma ray spectral
“fingerprints.” To detect and identify these
spectral fingerprints, the radiation detector
must have good energy resolution.
Good energy resolution enables the
identification of a particular radioactive
isotope gamma emission among closely
spaced characteristic spectral emission
lines produced by a large number of other
radioactive isotopes. Under some circumstances high energy resolution is needed.
The gamma ray detector behaves as a
spectrometer, discriminating closely spaced
spectral lines from a composite spectrum.
Fundamentally, energy resolution is directly
related to light output that is ideally proportional to incoming photon energy.
Scintillation detectors are constructed from
either organic or inorganic materials, with
inorganic-based scintillators being preferred
for spectroscopic applications. Recent efforts
in the search for new inorganic scintillation
crystals have led to the discovery of several crystals with light output approaching
100,000 photons/MeV. This is comparable
Feature
High-resolution detectors are required to
find the elusive needle in a haystack: the
presence of a real threat imbedded in a
complex spectra derived from a mixture of
innocuous radioactive isotopes. As shown
in Figure 3, germanium identifies fine-line
structures, differentiating between closely
spaced spectral lines with unmatched resolution and high efficiency. The germanium
detector is recognized as the gold standard
for all gamma ray detectors. However, these
same detectors are operationally difficult to
handle since they must be cooled to liquid
nitrogen temperatures and are very costly
for large-area imaging applications.
In general, semiconductors inherently
outperform scintillators, in terms of resolution, because their narrow bandgaps
create greater numbers of electron-hole
pairs from absorbed gamma ray energy.
Semiconductor-based detectors are limited
in size and for a variety of reasons, including cost, this makes them impractical for
the large-area applications previously discussed. The challenge is to develop low-cost
scintillator materials that closely match the
resolving power of germanium without the
large cost and complexity.
Specialized Scintillating Materials
There have been two recent developments
in scintillation detectors. The first is a
Raytheon development geared toward fabricating large-area gamma ray detectors. This
has the potential to fill the need for improved passive- and active-based inspection
systems to detect and identify concealed
nuclear materials. The second development
is an innovation in the evolution of a new
material, Cs2LiYCl6 (CLYC), which has the
unique ability to detect both gamma rays
and neutrons. This material has the
Figure 1. The Advanced Spectroscopic Portal (ASP) mobile inspection system.
potential to impact
many applications,
such as the detection
of fissile material
where neutrons may
be the dominant
telltale signature
as opposed to the
more easily detectable shielded
gamma rays.
Large Area
Yttrium Aluminum
Garnet (YAG)
Figure 2. Raytheon’s Trimodal Imager was developed for the Stand Off
Radiation Detection System (SORDS) program being conducted by the
Domestic Nuclear Detection Office of the Dept. of Homeland Security.
1.E+07
Gamma-Ray Spectra of Natural Background
Plastic Scintillator
High Purity Germanium
Raytheon is develop(no resolution)
(excellent efficiency and resolution)
1.E+07
ing a large-area
scintillation detector
1.E+07
by utilizing two of
1.E+07
our key technoloSodium Iodide (Nal:Tl)
1.E+07
gies: (1) world-class
(poor resolution)
ceramic YAG laser
1.E+07
gain material
1.E+07
fabrication and (2)
1.E+07
edge bonding, used
0
500
1000
1500
2000
2500
3000
Energy (keV)
to manufacture
large-scale, high-per- Figure 3. Energy resolution of commonly used radiation detectors.
formance scintillator Note: vertical scale constructed from arbitrary units. (Image courtesy
of ORTEC-AMETEK.)
panels. Ceriumactivated yttrium
Ceramic YAG:Ce scintillator panels made
aluminum garnet (YAG:Ce) scintillators offer
from bonded tiles are an enabling technolmoderate luminosity (>15,000 photons/
ogy for nuclear radiation detection. Ceramic
MeV), fast decay time (<70ns), good (relative
YAG:Ce tiles can be produced as substanto NaI:Tl) energy resolution (<7 percent at
tially larger tiles (e.g., 25 cm x 25 cm) than
662 keV), and are non-toxic and non-hygrois possible with single-crystal boules due to
scopic. Ceramic YAG:Ce has excellent
the inherent size limitations of typical
chemical resistance and environmental stabilsingle-crystal YAG:Ce growth (limited
ity, as well as the mechanical strength
to ~10 cm dia). Ceramic YAG:Ce panels
necessary to produce large-scale scintillator
25 cm x 25 cm having performance equivapanels (~1m x 1m).
lent to or better than a single crystal are
Counts
to the light output of commonly used thallium-doped sodium iodide (NaI:Tl) (roughly
40,000 photons/MeV). Figure 3 shows
spectrometer resolution from several different types of commercial radiation detectors.
Among the group is the NaI:Tl scintillator. Its
resolution, though significantly better than
that shown for organic plastic scintillators,
is inferior to semiconductors such as the
costly, high-purity germanium detector.
Feature
Radiation Detection
currently within Raytheon’s processing capability. Furthermore, unlike single crystals,
ceramic YAG:Ce has negligible stress and
excellent dopant uniformity. Large YAG:Ce
scintillation panels lower manufacturing cost
and improve the nuclear detection capability through their large surface area. This
material promises to meet the demanding
needs of the DHS and the Defense Threat
Reduction Agency (DTRA) requirements for
large-area radiation detection applications.
Cs2LiYCl6 (CLYC)
To meet the demands for a material that
can detect and quantify both gamma rays
and neutrons, one of Raytheon’s collaborating partners, Radiation Monitoring Devices
(RMD), is developing a new material, CLYC,
which belongs to the elpasolite crystal
family. Due to their outstanding overall
properties, CLYC scintillators can be used
as gamma ray detectors, neutron detectors,
or both. The energy resolution of CLYC
crystals has been found to be better than 5
percent full width, half maximum (FWHM)
at 662 keV, representing an improvement
over the typical value of 6 to 7 percent
FWHM measured for NaI:Tl. A comparison
of 137Cs energy spectra measured for both
scintillators is shown in Figure 4. This energy
response. The level of discrimination using
this method has been recently estimated to
be at least 10-6. In terms of stopping power,
a 1 cm thick crystal of 6Li enriched CLYC
can capture a majority of thermal neutrons,
providing 80 percent detection efficiency.
Summary
Figure 4. Comparison of energy spectra and
resolution between CLYC and NaI:Tl crystals. CLYC has almost twice the resolution of
NaI:Tl, providing greater ability to discriminate between closely spaced spectral lines.
resolution is a result of excellent proportionality; i.e., linear response of a scintillator
to particles of various energies. The fact
that Cs2LiYCl6 also incorporates Li (6Li) ions
enables it to detect thermal neutrons. Li,
interacting with thermal neutrons, produces
charged particles that in turn create a scintillation pulse. Generated in this way, gamma
ray energy is equivalent to about 3.3 MeV.
This is higher than the energy of gamma
rays emitted by the most common radioisotopes, which in turn gives CLYC the ability
to automatically discriminate all gamma
ray energies below ~3 MeV. CLYC can also
discriminate between gamma rays and neutrons based on the shape of its temporal
The discovery of new materials, as well as
the optimization of existing, established
scintillating materials is proceeding at a
rapid pace, being driven by the demands
of various applications such as medical
imaging, nuclear physics, nuclear nonproliferation monitoring, materials research,
well-logging, non-destructive evaluation
and other related fields. While requirements
for these applications may be different,
many desired features are common. These
include high light output, high proportionality, high-energy resolution, reasonably fast
response and low cost. Raytheon, through
the development of enabling material
technologies and its experience in applying
these technologies to radiation inspection
systems, is playing a leading role in advancing the state of the art and improving our
nation’s level of security in response to
nuclear threats. •
Bernard Harris, Raytheon and Kanai Shah,
Radiation Monitoring Devices, Inc.
Scintillation
is a form of luminescence that occurs when ionizing radiation travels into a material and loses some
or all of its energy, promoting the emission of a short flash of light that emerges from the absorbing material. The scintillation process begins when ionizing radiation, such as gamma radiation, enters the material and interacts with it through photo absorption,
Compton scattering, or the production of electron-positron pairs.
Each of these processes generates quantities of secondary electrons proportional to the energy deposited from the ionizing radiation.
These secondary electrons continually lose energy as they collide with atoms in the material. They interact with individual atoms exciting electrons into the conduction band, thereby creating electron-hole pairs. Electrons excited to the conduction band eventually
return to the valence band with some emitting light.
The most commonly found gamma ray detector in use today is the thallium activator doped sodium iodide scintillation detector
(NaI:Tl). Optically coupled photomultiplier tubes are typically used to convert the emitted light into electrical pulses. NaI:Tl is a very
efficient gamma ray detector, due to its large crystal sizes. However, it is hygroscopic and must be packaged in a hermetically sealed
container. Its spectral resolution is also relatively poor, opening the field for the development of more suitable scintillating materials
for applications requiring higher resolution.
Feature
S
pecific requirements for acoustic
transducers are driven by the
application. Sometimes they are a
combined reciprocal device; i.e., the same
element is used to both transmit and receive
with the appropriate switching. More often,
separate projectors and hydrophones are
used. This allows the designer more freedom to choose materials optimized for
either transmitting or receiving and to
design the physical configuration for the
desired acoustic response. In this article,
we will focus on underwater transmit,
i.e., projector, applications.
titanate ceramics were discovered; and in
the early 1950s, polarized lead zirconate
titanate (PZT) ceramics were introduced.
These piezoelectric ceramics initiated the
modern era of acoustic transducers. At that
time, single PZT crystals of any significant
size could not be grown. However, these
new ceramics quickly replaced the earlier
single quartz crystal materials because of
the higher amount of piezoelectric activity or the coupling factor that could be
achieved through ceramics. Sixty years later,
PZT ceramics are still being used in most underwater transducers.1
Most underwater projectors today use
piezoelectric materials; i.e., materials that
change shape in response to an electric
field. The type of piezoelectric material
used is a key selection criterion when trying
to achieve high-power undersea acoustic
performance. Quartz crystals and Rochelle
salts were some of the first piezoelectric
materials used for undersea sonar applications during World War I. These materials
were chosen, in part, because the preferred
single-crystal form is easy to produce.
However, neither quartz nor Rochelle salts
possess the acoustic coupling factor of more
modern material, and they therefore provide limited acoustic power output.
Over the past decade, developers have
demonstrated the ability to grow large PZT
single crystals with performance that is significantly better than that of conventional
PZT ceramic.2 This single-crystal material
has gained acceptance in specific medical
ultrasound and high-strain actuator applications in which only small quantities of
high-power material are required. However,
due to their high cost and process limitations, these PZT single-crystal structures
have not been widely used for underwater
sonar applications.
Late in World War II, improved materials such as permanently polarized barium
Raytheon has been collaborating with the
Penn State University Materials Research
Laboratory to develop and evaluate new
transducer materials for sonar applications.
A new “textured” ceramic material promises
to achieve near single-crystal performance at
a fraction of the cost. Similar to single crystal, the low sound speed of textured ceramic
results in a smaller projector for a given
frequency. In addition, the higher electroacoustic activity of textured ceramic provides
greater acoustic output and bandwidth,
even from the smaller device. Applications
range from shipboard sonar (frequencies
less than 10 KHz) to medical ultrasonics
(frequencies greater than 1 MHz). To better
understand the advantages of this newer
textured ceramic material, it is helpful to understand how ceramic piezoelectric materials
are made.
Traditional Ceramic. The manufacturing
of traditional ceramics begins with the mixing of powders of the various constituent
elements in specific, usually proprietary,
proportions. The resulting powder mix is
then combined with a binder and heated
in a furnace. The temperature profile of
the furnace is set so the particles adhere to
one another but do not melt. This process
is called sintering. As the ceramic cools, a
dense polycrystalline structure is created and
adjoining crystals form domains. Although
these individual domains have a net dipole
moment, the bulk material does not
Feature
Sonar Transducers
because the domains are randomly oriented
relative to each other. This inert ceramic is
transformed into a useful transducer material during the subsequent application of a
high-DC electric field within the poling process. During poling, the domains that are
most closely aligned with the electric field
lengthen and become permanently oriented
with the electric field. When the high-DC
electric field is removed, these lengthened
domains produce a voltage when tension
or compression is applied. It is important to
note, however, that not all domains become
aligned. Some become partially aligned, and
some are not aligned at all.
Single Crystal. One can see that the
performance of the piezoelectric material
could be improved if a larger number of
domains were aligned. To accomplish this,
new manufacturing methods and ceramic
formulations were devised. In the Bridgman
method, a newer ceramic formulation —
e.g., lead magnesium niobate-lead titanate
(PMN-PT) — is grown in a platinum crucible. A seed crystal is located in the bottom
(cooler end) of the crucible and partially
melted. Crucibles vary in size, but a typical
laboratory crucible is approximately 15 cm
in length with diameters ranging from
1 to 2.5 cm. A temperature gradient is
then applied to melt the ceramic and grow
the crystal from the seed. Unidirectional
heating and subsequent solidification are
slurry
accomplished by translation of the crucible through the temperature gradient.
Translation rates of 0.8 mm per hour are
typical, and the temperature gradient maximum is about 1,400 degrees Celsius. After
growth, crystal is slowly cooled to room
temperature to prevent cracking. The total
time to cool is generally 100 hours. A crucible cannot be reused because it is cut away
to remove the grown crystal.3
When a poling voltage is applied to the
preferred crystallographic direction of a
single crystal, the number of domains that
are aligned with the electric field is greatly
increased. The resulting single-crystal ceramic has a much higher coupling factor.
The primary disadvantage of this singlecrystal structure is the inability to grow large
crystals at a reasonable cost. As discussed
above, growing crystals is a slow process.
Additionally, single-crystal ceramic vendors
are still learning how to grow large crystals
with uniform properties, and this lack of
uniformity seriously affects the yield and the
resulting cost.
Tape Casting and Templated Grain
Growth. Tape casting is a method to create
uniform sheets of material. It has been in
use since the 1950s to create dielectric tape
for the capacitor industry. A slurry of the
raw ceramic and special additives is placed
in a chamber and extruded through a small
gap onto a conveyor belt (Figure 1). The gap
and resulting tape thickness are controlled
raw ceramic and
special additives
doctor blade
slurry
container
carrier
film
drying
flexible tape
dry tape
peeling
Figure 1 . Tape Casting Pictorial. A slurry of the raw ceramic and special additives is placed in
a chamber and extruded through a small gap under the doctor blade onto a conveyor belt.
Feature
Figure 2 . Textured Material. This scanning electron microscope (SEM) photograph shows good
alignment and dispersion of templated particles (small black grains).
(Courtesy of Stephen Poterala, Penn State University Materials Research Laboratory.)
using a “doctor blade.” The conveyor belt
can be covered with a non-stick polymer or
sacrificial paper that is burned in the sintering process. Tape casting has been used
to produce conventional thick-film piezoceramics in the past. It has recently been
combined with the process called templated
grain growth (TGG) to produce textured
PMN-PT ceramics. This breakthrough,
known as “textured material” (TM), was
accomplished at the Penn State University
Materials Research Laboratory.
The key to achieving improved properties is
to mechanically align (texture) the jumbled
crystal domains rather than align them by
crystal growth. Texturing polycrystalline ceramic causes its properties to become more
anisotropic, yielding performance gains in
certain directions. A small fraction of template particles or grains is added to a slurry
containing a much finer equiaxed matrix
powder. The slurry is then shear-formed
using the tape casting method described
above to align the anisotropic particles in
the direction of least resistance to flow. An
electron microscope photograph of the textured result is shown in Figure 2.
TGG is a cost-effective alternative to
Bridgman-grown single crystals. Textured
PMN-PT obtained through this process not
only shows better piezoelectric properties than random ceramic PMN-PT, but
it can approach Bridgman single-crystal
performance.4 The tape casting process,
combined with TGG, can be used to make
flat plates and other shapes. Wrapping
the tape around a mandrel produces a
ring-shaped ceramic with domains aligned
primarily in the radial direction. A photo of
a Raytheon fabricated cylindrical transducer
is shown in Figure 3.
Traditional ceramic, single crystal, and
template grain growth material may be
compared by way of their electromechanical
coupling coefficients k, a unit-less parameter between 0 and 1 (higher is better).
Performance and cost comparisons of three
modern materials, as used in 33-mode, are
shown in Table 1. The 33 subscript refers to
the mode where the dominant output strain
is along the same axis as the applied electric
field. (The 33-mode parameters are typically
used as a power comparison because 33 is
the most effective transmitting mode.) The
Table 1. Properties of Three Piezoelectric Materials
Figure 3 . Cylindrical transducer using
textured material allows evaluation of the
material as an underwater sound source.
31-mode excitation is relevant to cylindrical transducer geometries. The “28” in the
“Materials” column description indicates
that the lead titanate (PT) is 28 percent of
the mixture, by volume.
The cost comparison in the table, while
showing nearly an order of magnitude
lower cost, is approximate because the
TM material has not yet been produced
in a factory setting (only in laboratories).
Nevertheless, the TM material exhibits
performance comparable to that of a
single crystal.
The scaling of laboratory processes to
repeatable commercial production has yet
to be accomplished. However, early indications are that combining the well known
commercial tape casting process with TGG
enables the production of high-performance
flat plates and cylindrical shapes at a fraction of the cost of a single crystal. Textured
material promises to be a significant part
of the unfolding piezoelectric ceramic
technology revolution. •
Michael Janik, William Marshall
1Sherman,
k33 Material
Coupling
Relative Power Relative Cost
Density (dB)
per Volume
k31
Coupling
PZT-8
0.71 0
1.0
0.31
Textured PMN-28PT
0.83
3.38
1.1–1.3
0.45
Single Crystal PMN-28PT
0.91
6.76
8–10
0.44
Textured material achieves near single crystal performance at a fraction of the cost of single
crystal PMN-28PT.
Charles and Butler, Jack: Transducers and Arrays for
Underwater Sound, 2007, Springer Science + Business Media, LLC.
2Oakley, Clyde and Zipparo, Michel: Single Crystal Piezoelectrics:
A Revolutionary Development for Transducers, Proceedings of the
IEEE Ultrasonic Symposium, October 2000, Pages 1157–1167.
3Zawilski, Kevin T. et al, Segregation during the vertical Bridgman
growth of lead magnesium niobate–lead titanate single crystals,
Journal of Crystal Growth, Volume 258, Issues 3–4, November
2003, Pages 353–367.
4Kristen H. Brosnan, Stephen F. Poterala, Richard J. Meyer, Scott
Misture, and Gary L. Messing, Templated Grain Growth of <001>
Textured PMN-28PT Using SrTiO3 Templates, J. Am. Ceram.
Soc., 92 [S1] S133–S139 (2009).
Feature
W
ith the recent Department of
Defense pledge to increase military
effectiveness by using a greater
portfolio of renewable energy, the DoD and
Department of Energy are forging closer
working relationships to bring new technology to market. Specifically, the inaugural
edition of the DoD Operational Energy
Strategy1 states that the Department will
concentrate its operational energy investments in the three profiled areas: demand,
supply, and future force planning. This
focus has manifested as new solicitations
and organizational structures on the part of
the U.S. Navy, Air Force and Army to support this vision.
Large-scale energy storage (LSES) is an enabling technology that frequently enters
the decision space in systems that promote
renewable energy, fuel savings and energy
security. New advances in materials research and prototyping are enabling LSES
to provide cost-effective solutions in several
compelling ways. The use of LSES maximizes
the value of renewable resources in a system by compensating for their intermittent
power-producing profiles. Power is provided
when the renewable source is inactive; and
likewise, excess generated power can be
stored. LSES supplies peak demands, allowing for a smaller and more efficient power
system. LSES can also significantly improve
fuel utilization by allowing tactical generators to operate at maximum efficiency.
Furthermore, to accomplish the objective
of operating solely from renewable sources
(i.e., zero net energy consumption), LSES
must be an integral component of the system solution.
With this emergence of new energy and
storage technologies, the hybrid power system paradigm is evolving to meet the need
for multiple system configurations and value
propositions. Figure 1 shows how storage
integrates into a power system that utilizes
a combination of multiple loads and energy
sources. Power can come from multiple
origins: AC sources of power (such as the
electric grid, generators and wind) and DC
sources of power (such as fuel cells and
solar photovoltaics [PV]). The AC/DC and
DC/DC power conversion electronics are
needed when routing power to the loads or
to the energy storage system.
Power
Control
AC Power
(e.g.,
Wind, Grid,
EngineGenerator)
In the following two articles, Raytheon highlights two promising areas of development:
zinc-bromine flow batteries and liquid
metal batteries. •
Gami Maislin, Peter Morico
Load 1
Load 2
Load N
Storage
Medium
Balance of Plant
Energy Storage
System
DC/AC & DC/DC
Power Conversion
and Charging
System
DC Power
(e.g.,
Fuel Cells,
Solar Photovoltaics)
Intelligent Power and
Energy Controller
Figure 1 . Multi-source/multi-load power system employing renewables, large-scale energy
storage, and an intelligent power and energy management system.
1Energy
AC/DC & DC/AC
Power Conversion
and Charging
System
The power system in Figure 1 is flexible and
reconfigurable, designed to meet changing
supply and load demand scenarios through
algorithms resident in the intelligent power
and energy controller (the bottom of the
figure). The power system can be optimized
for efficiency, maximum continuous and/
or peak power, minimal fuel consumption,
lowest cost operation, maximum run-time,
intelligent load shedding, silent watch (silent auxiliary power), volt-ampere reactive
(var) compensation or other scenarios as
required. Large-scale energy storage is a
key enabler for this efficient smart system’s
operation.
for the Warfighter: OPERATIONAL ENERGY STRATEGY, May 2011. http://energy.defense.gov/OES_report_to_congress.pdf
Feature
Zinc-Bromine Flow Battery Technology for Energy Security
E
nergy security and reduced fuel consumption are key strategic objectives
of the Department of Defense. Energy
security for the DoD means having assured
access to reliable supplies of energy to meet
operational and mission needs. A properly
integrated energy storage system (ESS) can
improve the energy security of an installation by allowing “islanding” of a facility. This
means that critical operations can be maintained during natural or manmade power
interruptions, cyber attack or other unintended power outage situations associated
with the commercial power grid. Zincbromine (Zn-Br) flow battery technology is
an attractive energy storage technology for
use in energy security applications because
of its low cost, desirable energy storage capacity, transportability, cycle life, system
lifetime and safety features.
Raytheon was recently selected for a government contract as the system integrator to
manage renewable energy and energy security for a military installation. This involves
integrating a Zn-Br battery and Raytheon
Intelligent Energy Command and Control
technology to provide emergency backup
power and a secure islanding capability.
catholyte. Anolyte and catholyte are separated by a micro-porous cell membrane that
allows ions to readily pass through, but prevents bulk mixing of anolyte and catholyte.
The actual electrodes in the system do not
participate in the chemical reaction, but in
fact just act as a substrate for the reaction
(Figure 1).
While at a zero-potential state, the electrolyte is a homogeneous aqueous solution
of zinc bromide (ZnBr2) and various salts.
As the system is charged, however, zinc
ions (Zn2+) in solution are reduced (absorbs
two electrons [2e–]) to zinc metal (Zn) on
the anode, essentially plating metallic zinc
across the electrode surface (Figure 2 top).
–
Anode Micro-porous Cathode
Electrode Membrane Electrode
Figure 1 . Schematic of a zinc bromine cell.
Charging
+ Source −
Zinc-Bromine Technology
While the chemistry behind the Zn-Br cells has
been employed as an energy storage technology for many years, the ability to scale up a
Zn-Br system to utility-scale power levels is
where much of the latest development has
occurred. This innovation enables Zn-Br to be
an appealing large-scale energy storage technology for applications requiring modest
power output (hundreds of kilowatts to
several megawatts) and large energy storage
capacity (>2 MWh) at an affordable cost
when compared to competing technologies.
Moreover, Zn-Br based energy storage systems
can be designed to work in parallel to accommodate higher power and energy loads.
In one instantiation of a Zn-Br ESS, electrolyte is pumped from two electrolyte
reservoirs through a battery stack in two circuits, one for anode half-cells and the other
for cathode half-cells. The electrolyte in the
anode loop is commonly called anolyte; the
electrolyte in the cathode loop is called the
+
ZnBr2
ZnBr2
2e−
2e−
Zn
–
Anolyte
Reservoir
2e−
Anode
Electrode
Zn2+
ZnBr2
Br2
Br−
Br−
2e−
+
Catholyte
Reservoir
Cathode
Electrode
Micro-porous
Membrane
Load
2e−
2e−
Zn
Anolyte
Reservoir
–
2e−
Anode
Electrode
Zn2+
ZnBr2
Br2
Br−
Br−
2e−
+
Catholyte
Reservoir
Cathode
Electrode
Micro-porous
Membrane
Figure 2 . Zinc bromine cell charging on the
top and discharging on the bottom.
Concurrently, bromide ions (Br –) travel
across the micro-porous membrane toward
the cathode and are oxidized (release two
electrons [2e–]) into molecular bromine at
the electrode within the aqueous solution.
The anolyte and catholyte gradually develop
different compositions, which correspondingly changes the color of the electrolyte
tanks. Elemental bromine (Br2) produced
in the cathode half-cells combines with
an oil and forms a polybromide complex
with quaternary salts in the catholyte. The
polybromide complex separates from the
catholyte aqueous phase as a high-density
oily liquid. This is collected in the bottom
of the catholyte reservoir. Thus, the energy
stored in the system is the chemical potential energy of the zinc metal plated across
the anode and the polybromide complex
that settles within the catholyte reservoir.
As more zinc is plated across the anode
and more polybromide complex is created, the total amount of energy stored in
the system increases. The system is always
ready for instantaneous power delivery by
maintaining fresh electrolyte in the half cells
at all times. Full power can be provided
even in a standby mode when the pumps
are off. Enough electrolyte is introduced
intermittently to keep quality reactant present, enabling full power discharge when
pumps are started. Once the pumps are
started, they flow electrolyte for continuous
operation.
During discharge these processes are reversed (Figure 2 bottom). When a load is
applied to the cell, the zinc metal plated
across the anode oxidizes, reforming the
zinc ion (Zn2+); and bromine is reduced to
bromide ion (Br –) at the cathode. Upon full
discharge, both the anolyte and catholyte
tanks are returned to a homogeneous aqueous solution of zinc bromide. The pumping
system circulates the anolyte and catholyte,
allowing the polybromide complex settled
at the bottom of the catholyte reservoir to
flow across the cathode to sustain appropriate concentrations of polybromide complex
to maintain the reaction. This is what gives
Zn-Br flow batteries their long-discharge
capabilities.
Feature
Zn-Br
The essential reactions in the zinc-bromine
energy storage system are:
Anode:
Zn(s) Zn2+(aq) + 2e–
Cathode: Br2(aq) +
2e–
-0.76V vs SHE
2Br –
(aq) +1.087V vs SHE
Overall: Zn(s) + Br2(aq) Zn2+(aq) + 2Br –(aq)
+1.067V vs SHE (standard hydrogen electrode)
Arranging multiple Zn-Br cell stacks in series,
forming them into battery strings, and arranging them in parallel determine the power
rating of the ESS. One of the most desirable
characteristics of flow batteries is that the
amount of energy (watt hours) that the system can store is scalable by the volume of
electrolyte available and the space available
within the system to plate zinc (Figure 3).
Figure 3. A Zn-Br system, packaged into a
trailer, which can deliver 500 kW of power
and 2.8 MWh of energy storage.
Larger tank systems provide more energy
storage, though the larger systems can be
more complex to balance and maintain.
Zn-Br companies have developed innovative
methods for scaling up by using advanced
safety measures, and developing sophisticated charging algorithms and control
systems to give their batteries a long safe
life and manage their power levels. Current
Zn-Br systems are capable of megawatt hours
of energy storage at moderate power levels
(up to 500 kW) at a price point of $440–
$485/kWh1. The low cost, desirable energy
storage capacity, transportability, system lifetime and safety are the key features that
caused Raytheon to select Zn-Br technology
as the energy storage component in a secure,
renewable, intelligently managed energy
solution for our customer. •
Ryan Faries
Contributors: Philip Carrigan, Alf Carroll,
Gami Maislin, Peter Morico
1Electricity Energy Storage Technology Options - A White Paper
Primer on Applications, Costs and Benefits. (2010)
Palo Alto: Electric Power Research Institute.
Innovation in Applying Materials Technology
to Large-Scale Energy Storage
A
s in many emerging technology
domains, large-scale energy
storage technologies are ever
changing and evolving, with market
needs driving the demand for completely new and novel technologies.
The liquid metal battery (LMB) is a
game-changing, innovative energy
storage technology that meets the
needs of fixed installations that require
utility-scale energy storage to enhance
grid stability, security and reliability,
while contending with the increasing
impact resulting from renewable
energy insertion.
LMB technology owes its origin to reFigure 1. Cross section of an LMB cell showing
search performed at the Massachusetts
the separated electrode materials at room
temperature.
Institute of Technology (MIT) by
Prof. Donald Sadoway (John F. Elliott
Professor of Materials Chemistry at
MIT) and Dr. David Bradwell, who completed his doctoral research on liquid metal batteries in the Sadoway laboratory. Its inception was a result of calculated efforts to utilize
economies of scale and to develop a large-scale, yet inexpensive battery made out of
earth-abundant materials, as opposed to ignoring such factors and simply hoping to chase
down the cost curve regardless of the specific chemistry.
Using the aluminum smelting industry and the Hall-Héroult process for the production of
aluminum as inspiration, the liquid metal battery concept was born. A modern aluminum
smelter is a perfect example of a giant current sink requiring a very large current density
to produce aluminum, yet the aluminum is produced at a very low net cost. If this well
established process could be reversed, then a large battery cell providing a very high current density output could be created out of relatively inexpensive materials. Turning an
aluminum smelter into a battery posed a unique challenge. Electrolysis of aluminum oxide
(Al2O3) causes carbon monoxide (COgas) and carbon dioxide (CO2,gas) to be produced at
the anode, and these outgas and leave the system, thus creating an irreversible process.
Researchers at MIT solved this problem by choosing liquid metals for both electrodes,
which are regenerated upon charging of the battery. Furthermore, earth abundant materials constitute the electrodes, as well as the molten salt electrolyte.
This research led to a first-generation battery with electrodes composed of a magnesium
(Mgliq) anode, an antimony (Sbliq) cathode and an electrolyte composed of molten salts
(MgCl2-KCl-NaCl) (Figure 1). The cell operates around 700°C in order for the components to stay in a molten liquid state. At operating temperature, the anode, cathode and
electrolyte naturally self-segregate based on their densities (similar to oil and vinegar),
forming the battery. This feature is unique because it requires no barrier membranes or
Feature
materials to separate the
components, thereby
eliminating internal
stresses in the electrodes
and allowing for faster
ion transfer as compared
to traditional solid-state
batteries.
2e
charging
Mg Sb
−
Mg
Mg2+
Mgsb
2e
−
Mgliq (-)
molten salt
2e−
Mg
discharging
Mg2+
Mgsb
(Mg-Sb)liq (+)
2e
−
Figure 2. Schematic of a Mg||Sb liquid metal battery.
The LMB electrochemical reaction functions by using an alloying mechanism (Figure 2).
Upon charging the battery, the liquid metal cathode (Mg-Sbliq) releases two electrons
(2e-), forming a positive ion (Mg2+) that travels through the molten electrolyte, where it
recombines with electrons, forming more of the liquid anode material (Mgliq). Upon discharging, the process is reversed — the liquid anode (Mgliq) releases two electrons (2e-),
forming the ion (Mg2+) that travels through the electrolyte, where it recombines with
two electrons to form more of the liquid cathode (Mg-Sbliq).
MIT was one of the first-round recipients of a contract award by the newly created
Advanced Research Projects Agency – Energy (ARPA-E) in 2009 to advance LMB technology from basic research and to scale-up design to the fabrication of 200Ah battery
prototypes. MIT is scheduled to finish development of a five-cell 720 Wh (200 Ah) Alpha
unit by the end of 2012. In the process of developing the technology, MIT researchers have discovered new electrode couples that have twice the cell voltage, operate at
significantly lower temperature and use materials with lower overall cost. During early
stages of development, Raytheon began collaborating with the core MIT researchers and
is now providing systems engineering expertise to MIT as part of their ARPA-E contract.
This aligns with Raytheon’s collaboration strategy, and it can be cited as a good example
of how new partnerships enable our engineers and supply chain to provide “affordable
and innovative solutions” to our customers.
As the LMB technology readiness level advanced beyond university research, a new spinout company was formed, Liquid Metal Battery Corporation (LMBC), to commercialize
LMB and bring it forward to the market. The Raytheon and LMBC teams actively collaborate and engage military customers to explore demonstration opportunities in support
of very challenging but important DoD energy goals.
After the development of the initial
200 Wh prototypes, LMBC is setting
their sights on larger cells, about
the size of a coffee table. These
cells would be stacked into battery
modules (Figure 3). The goal is to
generate a battery system capable of
delivering hours of utility-scale power,
yet stay within the size constraint of a
shipping container. •
Alf Carroll, Ryan Faries
Contributors: Gami Maislin,
Peter Morico
Figure 3. Battery module concept.
Stack of 200 Ah LMB cells with cross sections
showing the different layers of the top cell.
Figures 1 and 2 source: Bradwell, D. J., Kim, H., & Sadoway, D. R. (2011). Magnesium−Antimony Liquid Metal
Battery for Stationary Energy Storage. Journal of the American Chemical Society.
Figure 3 source: MIT GroupSadoway.
Feature
Material Restrictions and Reporting:
Raytheon Prepares for the Future
Many of the materials that manufacturers rely on are facing increasing restrictions due to international regulation and decreased availability. New restrictions
are being introduced at a rapid pace, and they are challenging the ability of
manufacturers to adapt while avoiding related supply and product risks.
E
merging material restriction and
reporting requirements include the
Registration, Evaluation, Authorization
and Restriction of Chemicals regulation,
known as “REACH”; the Restriction of
Hazardous Substances, or “RoHS” regulations; rare earth materials/minerals supply
constraints; the Department of Defense
restriction of hexavalent chromium; and
conflict minerals reporting requirements.
A common approach for reducing risks
is to replace the regulated or constrained
materials with alternatives. However, the
replacement of legacy materials that meet
product performance requirements is not
a trivial matter, and it often requires extensive research, engineering development
and qualification. Complex risk trade-offs
have to be made among performance,
compliance costs and supply continuity risk.
Material substitutions in legacy applications
must be carefully controlled, assessed for
impact and communicated accordingly.
Raytheon has established an integrated and
cross-functional Global Substances Program
to address the risks to our products and
programs. Through this program, Raytheon
ensures alignment with solutions to address
materials restrictions issues across the company, as well as with the U.S. and European
aerospace and defense industry, government stakeholders and academia.
sector, many of which use pure tin finishes
that are susceptible to the spontaneous
growth of metallic filaments called tin whiskers. Tin whiskers can induce failures in
electronic assemblies. Commercial off-theshelf products and the increased volume of
aerospace industry products that Raytheon
relies on are now being assembled with
Pb-free solder.
One area being addressed through the
Global Substances Program is the development of technologies to improve product
reliability and reduce performance risk
associated with the use of lead (Pb)-free
materials. Another is the development of
suitable replacements for hexavalent chromium in corrosion-resistant coatings.
Raytheon is a lead participant in several
industry working groups and consortia focused on obtaining performance/reliability
data to understand the impacts of using
such materials, as well as generating strategies and methodologies to address the risks,
which include:
Reducing the Risk of Pb-free
Electronics
• Tin whiskers (from Pb-free finishes)
compromising functional performance
(Figure 1).
The global movement toward Pb-free
electronics has completely transformed
the commercial sector. The aerospace and
defense industry relies heavily on Pb-free
components borrowed from the commercial
• Performance/reliability degradation of
Pb-free interconnections; i.e., some
Pb-free materials are inferior to Pb materials in tolerating thermal cycling, vibration and mechanical shock (Figure 2).
Feature
Figure 1. Tin whiskers on an oscillator contact. These can lead to electrical shorting,
arcing and foreign debris. (Photo source: NASA.)
60
One approach to risk mitigation is to
replace the tin finish with a tin-lead finish.
This can be accomplished through either of
two methods:
2)Re-dipping – Dip component leads in
liquid tin-lead solder to a specific dip
height criterion2.
Figure 3 illustrates a metric developed by
Raytheon to evaluate the self-mitigation
process. Raytheon has also collaborated
with the University of Maryland Center for
Advanced Life-Cycle Engineering (CALCE)
and other industry partners in performing an Office of Naval Research-sponsored
study to qualify a robotic process for the
solder dipping of parts.
Another approach to risk mitigation is to
conformally coat tin-plated parts for retention and tin whisker bridging prevention.
conintued on page 40
Fail
Pass
50
Vertical Length (mils)
1)Self-mitigation – Cover the tin with
lead-rich solder. This is normally accomplished during the surface mount
solder reflow attachment with eutectic
tin-lead solder1.
Figure 2. A Pb-free solder joint can fail earlier than a tin-lead (SnPb) solder joint when
subjected to mechanical vibration or shock.
(Courtesy University of Maryland-CALCE.)
40
30
20
10
0
0
10
20
30
40
50
60
70
Horizontal Length (mils)
Vertical
Lead
Height
Horizontal Lead Length
Horizontal
Lead Length
Vertical
Lead
Height
Figure 3. The relationship between component termination geometry and complete “self-mitigation” by surface mount technology attachment was studied, and a new general metric was
identified as “height+length,” which can now be used to predict results.
Feature
Materials Restrictions
The conformal coat acts as a barrier to
prevent a tin whisker from causing an arc
or short circuit. The coating is designed to
“stretch” over a growing whisker to form a
tent-shaped barrier. Raytheon is partnering
with CALCE and other industry participants
to model the relationship between the
physical properties of coatings and whisker
retention (Figure 4).
Raytheon’s use of advanced computational
materials engineering (CME) techniques
to describe the basic process of whisker
formation at the atomic level has led to the
development of a new theory of whisker
growth and inhibition. This new theory has
been welcomed by CALCE members because it unites many observations that other
theories cannot reconcile. These theories
are leading to a better understanding of the
role of lead content and microstructure on
whisker inhibition.
Raytheon is a contributor to the NASA-DoD
Lead-Free Electronics Project, launched in
2006, to build on the results from the 2005
Joint Council on Aging Aircraft/Joint Group
on Pollution Prevention (JCAA/JG-PP) LeadFree Solder Project. The program includes
the evaluation of test vehicles under vibration, mechanical shock, thermal cycling,
vibration/thermal cycle combinations and
other stringent conditions. Raytheon’s role
within the group is to perform the combined environment test to determine the
operation and endurance limits of the solder
alloys by subjecting the test vehicles to accelerated environments.
As a member of the Aerospace Industries
Association (AIA) Pb-free Electronics
Risk Mitigation (PERM) consortium,
Raytheon personnel have taken lead roles
in several teams chartered with generating
standards to support the development of
risk mitigation approaches for aerospace/
defense companies affected by the
integration of Pb-free materials in their
global supply chain.
Figure 4. Notional tin whisker (left) pressing upward on a conformal coat as modeled to define
the relationship between coating properties and “tenting” behavior. On the right, a test probe
can be seen pushing upward on a conformal coating, which exhibits the desired “tenting”
behavior, as predicted in the modeling.
Addressing the Risks Posed by the
Restriction of Hexavalent Chromium
Hexavalent chromium compounds are
particularly effective in protecting a variety
of metals from corrosion. Because of this,
they have been widely used in military
and aerospace equipment for decades.
Unfortunately, these compounds have been
identified as carcinogens and are subject to
increasing restrictions on their use and disposal. Raytheon has reduced its dependence
on these compounds without compromising
product lifecycle performance through the
evaluation and implementation of existing
alternatives, and through the development
of new materials technologies.
Work has been done across Raytheon to
evaluate and qualify non-chromium-bearing
paint primers in a variety of applications.
The testing of paint systems for general
use on aluminum and ferrous surfaces
was completed years ago, and alternatives
are already in place. Several major manufacturing sites have eliminated all uses of
hexavalent-chromium-bearing paints and
primers. Testing on special applications,
like fastener sealing, has also been completed, and alternatives for these will soon
be implemented. As a result of these measures, significant reductions in the use of
hexavalent chromium have been achieved.
Unfortunately, there remains a limited
number of challenging applications where
no suitable alternatives currently exist.
One such application involves the adhesive
bonding of complex assemblies for use in
undersea sensors. These applications have
been identified as focus areas for further
research and development.
Raytheon has performed an extensive
evaluation of a safe trivalent chromium
alternative for the widely used hexavalent
chromium conversion coatings on aluminum. Trivalent alternatives for corrosion
protection on aluminum are now being
implemented in applications where qualification has been achieved.
Additional testing is currently in progress
by the NASA/DoD Technology Evaluation
for Environmental Risk Mitigation (TEERM)
consortium, of which Raytheon is an active
member. It is anticipated that current research will lead to an expansion of qualified
surface applications, further reducing the use
of hexavalent chromium conversion coatings.
The evaluation of impacts due to material
restrictions, and the development and execution of measures to avoid related risks are
on-going. Given the magnitude of the problems faced, Raytheon’s collaboration with
academia, industry and the government
through the company’s Global Substances
Program has proven to be effective in developing the right solutions and mitigations to
safeguard our environment and address the
needs of our customers. •
Dave Pinsky, Tony Rafanelli, Tim Sheehan
Contributors: Cynthia Garcia, Bill Rollins
1T.
Hester, presentation to the Space Parts Working Group
meeting, April 2011.
report of the TMTI Robotic Hot Solder Dip project, Office of
Naval Research, 2006.
2Final
Feature
Responding to the
Counterfeit Threat
When counterfeit electronic components, materials and mechanical
parts enter the supply chain, they can jeopardize product quality
and reliability, threatening overall mission success.
I
n the broadest sense, counterfeiting is
the deliberate misrepresentation of an
item with the intent to deceive a customer or an end user. Counterfeiters have
found discarded commercial electrical and
electronic products to be a good source of
raw material for their illegal activities. By
modifying external markings, for example,
counterfeiters can “manufacture” practically any part and sell it to unsuspecting
customers through oftentimes deceptive
and misleading advertisements/websites.
However, the parts sold can be used or
damaged, be incorrect or even be functionally different. Customers are lured
into buying these counterfeits when they
attempt to acquire parts that are in short
supply, are obsolete or are no longer available with the required package type or
materials from the original component manufacturer (OCM) or authorized distributors.
A U.S. Department of Commerce study
released in January 20101 reported that
the number of documented counterfeit
incidents has risen dramatically, more than
doubling from 3,369 incidents in 2005
to 8,644 incidents in 2008. In this study,
an incident consisting of at least a single
encounter with a suspected/confirmed
counterfeit could have involved just one
part or thousands of parts. The increase in
incidents can be attributed not only to the
growth in the number of counterfeit parts
but also to better detection methods and/or
improved tracking of counterfeit incidents.
The study indicates that counterfeit activity reported by manufacturers of discrete
components is highest for electromechanical devices and high-power semiconductors.
Manufacturers of microcircuits cited microprocessors as the most prevalent counterfeit
part. Asia was identified by OCMs as the
predominant regional source.
From 2005 to 2008, most counterfeit activity was concentrated on parts selling
from a few pennies to hundreds of dollars;
however, there has been a steady increase
in the number of counterfeits in the $500
to $10,000 range. Figure 1 shows the exponential growth of counterfeit incidents
involving microcircuits, with “used product
re-marked as higher grade” representing
the largest growth area.
5,500
4,400
3,300
2005
2006
2007
2008
2,200
1,100
0
Working
Used
“Seconds” Invalid part
New
Fake
copies of product
from
marking product
(nonoriginal sold as new scrap performance re-marked working)
design (not remarked)
unknown as higher
OCM
grade
product
Used
product
re-marked
as higher
grade
Figure 1. Counterfeit Incidents by Type of Problem - Microcircuits (2005-2008).
(Source: U.S. Department of Commerce, Office of Technology Evaluation, Counterfeit
Electronics Survey, November 2009.)
Feature
Counterfeit Parts
Threat
Counterfeiting can have a major impact on end
product reliability and overall mission assurance.
Incorrect or inferior parts fraudulently represented
as quality products can not only cause system
malfunction, but can also damage other components in the system, resulting in costly diagnostics
and repair, injury to employees, and/or mission
failure. Relabeled components can mask electrical performance or design changes made by the
OCM, resulting in intermittent performance issues
or hard-to-find functional errors. Most troubling is
the latent damage to components that may occur
when using unsophisticated methods for removal,
cleaning and re-marking. For example, cleaning
chemicals used to remove markings can also penetrate the package and damage the semiconductor
structures, inducing faults that may affect device
functionality later in life. Improper handling by the
counterfeiter can damage a part through electrostatic discharge (ESD), or it can damage fragile
leads or interconnect structures. Components are
often exposed to excessive temperatures when
being removed from a circuit card assembly, significantly reducing reliability and life expectancy.
Counterfeit Detection
The simplest form of counterfeiting is relabeling
an item by physically removing the original marking and re-marking by using a method similar
to that of the original part manufacturer (such
as laser etching or ink stamp printing). In some
cases, tampering can be detected during highmagnification visual inspection, revealing faint
remnant scratches in the part’s surface or irregular
patterns around the edges of the part, which are
formed when the original markings are removed
by the counterfeiter. By simply coating the surface, original part markings can be masked, then
re-marked with new part numbers, date codes or
higher functional speed coding (Figure 2).
In some cases, the marking techniques used
by the counterfeiter appear so authentic that
more in-depth analysis methods are required to
determine part authenticity. X-ray radiographic
imaging often reveals differences in the metal
lead frame pattern and die size within the assembly lot (Figure 3). This may not constitute
absolute evidence of the parts being counterfeit;
Figure 2. Counterfeiters use a black top coat to hide the original device marking. However,
the top coat is removed by using an acetone-soaked cotton swab to reveal the concealed
device markings.
Figure 3. X-ray imaging reveals two different metal lead frames used within
the same date code and assembly lot.
however, it does raise suspicion as to
their authenticity since it is unusual for
a manufacturer to introduce significant
design changes within a single production lot.
In some situations, the only way to determine if a part is authentic is to disassemble
a sample and expose the semiconductor
device surface to uncover its die markings.
These markings are then compared to
the external package marking to identify
discrepancies.
There are reports of counterfeiters modifying authentic devices to comply with
customer requirements. In Figure 4, a
modification was made to the leads of a
packaged semiconductor in order to meet
the customer’s lead length requirement,
and it was misrepresented as new material.2 Upon further inspection and analysis,
it was determined that the leads were not
homogeneous. The standard Kovar® lead
material ended midway along the lead
length and then transitioned to a low carbon steel lead.
Raytheon’s Response
Raytheon is addressing the threat of
counterfeit hardware through strict
management and control over the acquisition process and by using only original
component manufacturers (OCM) and
authorized distributors whenever possible. Because parts become obsolete, it
is sometimes necessary to purchase parts
from sources other than an OCM and
authorized distributors. In this case, a
comprehensive series of authenticity tests
are employed based on industry standards such as SAE AS5553 (Counterfeit
Electronic Parts: Avoidance, Detection,
Mitigation, and Disposition.)3 A counterfeit part detection plan may include any
or all of the following non-destructive or
destructive test methods.
Feature
• Perform x-ray fluorescence (XRF) assessment of external lead plating material and
make comparisons to part requirements.
• Perform functional electrical testing (ambient and rated temperature) if the authenticity is still in question and no other
option is available.
Destructive test methods:
Figure 4. The Kovar lead exiting the package is welded to a low-carbon steel lead. The
Kovar portion is tin-lead over nickel plated,
and the steel portion of the lead is tin-lead
over copper plated.
Non-destructive test methods:
• Review documentation for inconsistencies
and incorrect data.
• Visually inspect for package defects such
as sanding marks and top coating.
• Record digital imaging documentation of
package and external markings for reference purposes and compare to a known
reliable device if available.
• Chemically cleanse the part’s surface to
look for evidence of surface top coating.
• Measure mechanical dimensions and
compare them to the manufacturer’s
specifications to determine if the part has
been physically altered.
• Perform an x-ray examination of the lead
frame, bond wire and die configuration,
and make comparisons to known reliable
devices if available.
• Perform scan acoustic microscopy to detect delamination from excessive heating
during the board removal process.
• Perform DC electrical pin-to-pin testing
to verify continuity with comparison to a
known reliable device and to detect evidence of ESD damage.
• Decapsulate and perform an internal
inspection of die markings and workmanship and make comparisons to the part’s
external surface markings for discrepancies.
• Perform scanning electron microscope
inspection of bond and die surface as well
as material identification and comparison
to known reliable device if available.
No single test can detect all forms of counterfeiting; however, applying non-destructive
inspection methods such as real-time x-ray
and high-magnification optical inspection
is a good first step in determining if a part
is counterfeit. Discrepancies in markings,
documentation and historical data raise
suspicion and require additional investigation. Reviewing part history and data from
external reporting services, such as the
Government and Industry Data Exchange
Program (GIDEP), provides additional information on possible counterfeiting history.
In some cases, materials and construction
analysis are required.
The Need for Continued Vigilance
As detection and avoidance methods improve, counterfeiters adapt and become
more sophisticated. Information exchange
and training across government, industry,
academia and standards organizations are
essential to combat this threat.
Raytheon has established the Enterprise
Counterfeit Material Avoidance team to
develop policy and procedural requirements
and maintain constant vigilance to ensure
supply chain integrity. This team of experts
is involved with industry committees on the
subject of counterfeit product detection and
prevention and has developed a Counterfeit
Product Risk Mitigation and Prevention
Policy4 with requirements to address counterfeit product avoidance and mitigate the
risk of purchasing and introducing counterfeit material into Raytheon products.
The team has also developed a product information database as the central repository
for information related to the investigation,
analysis, reporting and corrective actions associated with counterfeit product incidents.
Engineering plays a key role in combating
counterfeit parts by designing out obsolete
components, managing parts obsolescence,
and ensuring robust product life-cycle plans
are developed and executed. Buying only
from OCMs or authorized distributors helps
to secure the supply chain from the introduction of counterfeit parts.
Counterfeiting is an ongoing issue requiring
continued vigilance and knowledge sharing,
both internal and external to Raytheon, to
address the ever-evolving threat. •
Ken Rispoli
1Defense
Industrial Base Assessment: Counterfeit Electronics, U.S.
Department of Commerce Bureau of Industry and Security Office
of Technology Evaluation, January 2010.
2GIDEP Alert C5G-A-11-01, Suspect Counterfeit Linear Microcircuit,
08 June 2011.
3ASM Aerospace, Counterfeit Electronic Parts: Avoidance,
Detection, Mitigation, and Disposition, AS5553.
4Raytheon Policy 000000243-RP Counterfeit Products Risk
Mitigation and Prevention.
Congressional Hearing
2011 was a dynamic year on the counterfeit electronic parts front at Raytheon. In addition to finalizing and releasing a comprehensive enterprise policy regarding counterfeit product risk mitigation and prevention, Raytheon supported a dozen
information requests as part of an investigation by the U.S. Senate Armed Services Committee (SASC).
The SASC effort was focused on investigating the risk of counterfeit electronic parts within a select group of companies that support Department of
Defense programs. Raytheon’s support of the SASC effort culminated in November during a formal hearing in Washington, D.C. Raytheon was asked
to participate in the hearing given our company’s experience in dealing with counterfeit electronic parts, and for our proactive response to the overall
threat. The SASC hearings resulted in legislation regarding counterfeit electronic part prevention as part of the 2012 National Defense Authorization
Act, signed into Law by President Obama in late December.
In parallel, Raytheon has enacted counterfeit prevention procedures; updated supply base requirements, terms and conditions; evaluated and downselected an exclusive group of electronic parts brokers; and participated in several industry forums regarding counterfeit electronic parts. Raytheon
will continue to improve its processes and risk mitigation strategy to address the growing threat of counterfeits and to maintain our company's position as one of the leaders in this area.
LEADERS CORNER
Jim Wade
Vice President, Mission Assurance
As vice president of Mission Assurance, Dr. Wade is responsible for leading
end-to-end Mission Assurance, Performance Excellence, Records
Management and Raytheon Six Sigma™ enterprisewide. He is focused on
driving operational excellence and improvements across Raytheon’s full spectrum of programs to achieve mission success for our customers. With more
than 19 years of experience in the public, private and government sectors,
Wade’s diverse experience is well suited to address Mission Assurance. Prior
to joining Raytheon, Wade led the MIT Lincoln Laboratory Safety and
Mission Assurance Office. He also held several leadership and management
positions at NASA, including manager for International Space Station Safety
and Mission Assurance/Program Risk Office. Wade holds a bachelor’s degree
in physics, and master’s degrees in aeronautical and astronautical engineering, space science and business administration. He earned his doctorate in
aerospace engineering sciences from the University of Colorado, Boulder.
T
echnology Today recently spoke with
Wade about his priorities and strategies for Raytheon Mission Assurance.
TT: Given your background in both the
private and government sectors, what
attracted you to Raytheon?
JW: I was attracted to Raytheon because of
its focus on technical excellence, its involvement in a wide range of programs and
for its commitment to customer success.
The performance of our systems is key;
our nation’s strategic and security interests often lie in the balance. Having been
involved with human spaceflight safety and
mission assurance at NASA, Raytheon’s
expectation for rigorous and thorough
mission assurance is familiar territory. In
contrast, when the concept of mission
assurance was introduced at MIT Lincoln
Laboratory, an FFRDC (federally funded
research and development center) environment, the elements for mission assurance
were identified and the approach tailored
for each program, depending on that
program’s risk tolerance.
Raytheon Mission Assurance uses the best
of both approaches, bringing Raytheon’s
vast resources to bear: diverse and talented
people, rigorous processes, and a culture
of excellence focusing on customer success. Raytheon offers a great opportunity
to collaborate across the enterprise with
outstanding teams to ensure the best solutions for our customers, and a culture of
continuous improvement through Raytheon
Six Sigma.
TT: What does Mission Assurance mean to
you? Why is it important? How does it fit
into the development process?
JW: Mission Assurance means delivering
a solution that meets or exceeds customer
expectations in terms of performance, reliability, safety, affordability and delivery
time. It is a team effort requiring coordination and communication across the
enterprise, across all functions and with the
customer. All team members must know
their responsibilities, execute flawlessly
and be personally accountable. Our collective commitment solidifies our customers’
confidence that our products will perform
reliably. Mission Assurance is the cumulative
result of all of our efforts.
We employ checks and balances to
ensure our processes and products operate correctly. We pay attention to detail
throughout the program life cycle from
initial design through fielding and support. We use the same approach with our
suppliers.
Our commitment to Mission Assurance is
demonstrated at every step in the product development process. Raytheon’s
Integrated Product Development System
(IPDS) integrates the work of engineering
disciplines and organizational functions
into one process framework. IPDS leverages
Mission Assurance, driving proper development, production and support of products
to deliver greater value and predictability.
TT: What Mission Assurance advancements
have you initiated, and what are your goals
for the future?
JW: Consolidating best practices across the
company, four new policies were recently
released that affect product requalification;
failure reporting, analysis and corrective
action; failure review boards; and counterfeit parts mitigation and prevention.
A Raytheon Mission Assurance guide
is under development with the goal of
providing common understanding and
expectations, and to clarify and coordinate
the key process elements that should be
applied to programs based on risk tolerance. This guide will reinforce existing IPDS
processes, and serve as a road map for continuous improvement.
We also launched an initiative to improve
the level of performance of the Mission
Assurance function to better support programs across the enterprise. This involves
defining a career path for the Mission
Assurance professional with major roles
identified. Specific skills will be assessed
through Raytheon’s Talent and Career
Explorer (TACE) system. Skills will be developed through a combination of formal
training programs and work assignment,
including business-specific experience
and training.
TT: Tell us more about plans for Raytheon
Six Sigma, and how it affects functional and
program performance?
JW: Raytheon Six Sigma is our culture
of continuous improvement. Recently we
identified three goals as we focus on our
R6s® program across the enterprise.
First, as an effort to re-engage everyone
in R6s, we set an enterprisewide target of
95 percent R6s Specialist qualifications by
the end of 2014. This timing allows participants to identify and complete meaningful
projects with business impact. In 2011
approximately 2,000 employees attained
R6s Specialist qualification. Understanding
the language of continuous improvement is
the first step of Raytheon Six Sigma.
Second, upon review of employee survey
results, focus group feedback and other
inputs, we are initiating R6s program
changes that will streamline project execution, focus on our changing markets with
affordability initiatives, and improve our
utilization of external six sigma experience.
Third, through improved R6s leadership
engagement, we are achieving our goal to
increase program performance, impacting
our businesses positively from growth and
productivity aspects.
Our R6s program is poised to reach new
heights. Early indicators for 2012 include
elevated requests for R6s Expert certification and a greater demand for R6s Experts
from our businesses.
TT: From a career perspective, how would
engineers become involved with Mission
Assurance? What is the nature of the work,
and what career opportunities are available?
JW: Raytheon’s Mission Assurance organization plays a vital role in ensuring that
the products and services we provide to
our customers always meet or exceed their
requirements. This is enabled by ongoing
initiatives in the areas of quality, supplier
quality and Raytheon Six Sigma. We have
opportunities for highly motivated and
innovative people to evolve our processes
and policies and apply six sigma for continuous improvement as we move forward and
address future challenges.
Raytheon’s commitment to Mission
Assurance is clear. When program issues
arise, we systematically investigate and
verify root causes, and contain potential
issues which may occur in related systems.
We proactively prevent issues and failures
by learning from other programs through
common failure reporting and lessons
learned systems.
If you are interested in helping programs
succeed by ensuring robust designs, understanding and addressing weaknesses in a
system, and performing forensics on program issues, you may want to explore a
career in Mission Assurance.
TT: From a Mission Assurance perspective,
what are the significant parts and materials
challenges faced by our industry, and how is
Raytheon addressing them?
JW: Two challenges related to parts and
materials are obsolescence management
and counterfeit products. Diminishing
sources of supply for the aerospace and
defense (A&D) industry, along with changes
in worldwide commercial requirements and
demands, have created greater challenges
in procuring parts and materials. Original
equipment manufacturers continue to shift
their resources away from our industry to
support higher volume and more profitable
commercial products. That action, coupled
with legislation such as Restrictions on
Hazardous Substances (RoHS) in Europe and
Asia, which encourage the use of lead-free
solders by many suppliers, makes it more
difficult to identify sources of supply for
parts and materials we need to support our
products and customers.
The effects of these process and requirements changes may not be apparent with
commercial products, which have short
product life cycles. For A&D systems,
however, these changes have longer lasting effects. Raytheon’s IPDS provides our
programs with planning and management
guidance for mitigating the risks associated
with obsolescence.
Counterfeit products are an increasing
challenge for our industry. The diminishing
supply of original equipment manufacturer
parts and materials contributes to the
demand. E-waste recycling provides counterfeiters with the supply to illegally satisfy
that demand, and the Internet provides an
easy marketplace and distribution channel.
Counterfeit electronic parts marked as military grade are being discovered by Raytheon
and our industry partners at an increasing rate. Raytheon’s policy on counterfeit
products risk mitigation and prevention
documents the extensive processes we follow to safeguard our supply chain, and
the measures we take to detect and eliminate counterfeit products before they can
become a risk to the systems we
manufacture and deliver. •
on
M A NU F AC T U RI N G
T E C HN OL OGY
N ET WORK
The Manufacturing Technology
Network (MTN) was recently created
to promote the development, optimization
and proliferation of Raytheon manufacturing technologies and to facilitate
communication between all disciplines that
support manufacturing across Raytheon.
The MTN works in conjunction with the
other five engineering technology networks to focus and enhance the sharing
of internal and external manufacturing
technology best practices across Raytheon,
to improve alignment with cross-functional
teammates and to raise the level of manufacturing presence within the technical
community.
The MTN supports Raytheon technology
strategies by:
1) Developing enterprise manufacturing
technology strategies that are competitive discriminators and position Raytheon for growth.
2) Providing input to Raytheon’s technology planning process and exploring,
advocating and promoting promising
technologies, thus strengthening Raytheon’s competitive position.
3) Connecting Operations with Engineering, our customers and industry to
develop integrated technology road
maps and plans for the maturation and
application of sustaining and disruptive
technologies.
One example of an MTN focus area is to
expand the use of model based systems
engineering, including traditional physicsbased modeling simulations, early in the
manufacturing process. This enhances
Raytheon’s ability to provide more predictable manufacturing performance — and
reduce cycle time and cost — by better
integrating product and manufacturing
critical performance parameters. •
Chad Spalt
Technology
Crew Comm:
The World’s First Multi-level Secure
Real-Time Voice over Internet Protocol
(VoIP) Mission Crew Collaboration System
I
nsurgents have increasingly adopted quickstrike attacks to surprise Coalition forces
and cause critical mission delays. To counter
these threats, and even to prevent them,
requires real-time voice collaboration —
often spanning continents — among intelligence, surveillance and reconnaissance (ISR)
crew members and soldiers in hostile environments. Raytheon’s Crew Comm (short
for Crew Communications), provides such
a collaboration capability, enabling users
to connect from different communications
networks, to exchange information among
themselves, to identify friendly forces in the
area, and to coordinate sensor and shooter
resources within the theater.
Crew Comm in Action
The Figure illustrates the use of Crew Comm
to enable voice communication and coordination among team members during a
troops-in-contact event.
A convoy bound for a remote forward operating base deep inside contested territory
travels a familiar route, but at a heightened
state of alert because of increased enemy
activity. As the convoy enters a valley,
insurgents attack from the steep hills above
and from the road ahead. The convoy
commander orders his troops to establish
a defensive posture and calls the area
command post for ISR and close air
support (CAS).
Moments later, the Combined Air Operations
Center (CAOC) in theater receives a call
from the command post. ISR and CAS support are needed for the convoy’s troops in
contact with insurgents.
To task a surveillance asset, the CAOC
coordinates with the Air Force Distributed
Common Ground System (AF DCGS).
Currently composed of multiple geographically separated, networked sites,
the AF DCGS is an enterprise intelligence,
surveillance and reconnaissance system.
The DCGS produces intelligence information
collected by various sensor assets. DCGS
hosts the Crew Comm voice communications capability.
The Predator Operations Center (POC) is
tasked, by the CAOC, to redirect a nearby
drone to the battle location. When the
drone reaches line of sight with the convoy,
a secure virtual communications network
enabled by Crew Comm is established
among the convoy commander, AF DCGS
and the POC.
Supporting the convoy through voice communications with the convoy commander,
the drone’s pilot and the asset operator maneuver the drone into position and focus
the sensor to locate enemy locations.
While analyzing the drone’s sensor data,
The AF DCGS ISR mission commander and
imagery analysts monitor the discussion between the convoy commander and the POC.
It is determined that the distribution and
positioning of enemy forces would be vulnerable to an A-10 attack. This is quickly
coordinated with the CAOC and, within
minutes, the tasked A-10 roars above and
precisely strikes enemy’s positions. The
drone, which carries Hellfire missiles, joins
the battle.
Through persistent reconnaissance, AF
DCGS analysts immediately conduct a battle
damage assessment. They confirm that the
threat has been eliminated and the convoy
Mission Systems Integration
GLOBAL NETWORK
Air Force
Distributed
Common Ground
System
(DCGS)
workstation environments. Visual indicators
provide the operator with real-time security
level awareness of the connections.
Crew Comm Host
THEATER OPERATIONS
CONTINENTAL U.S.
Combined
Air Operations
Center
Area
Command
Post
photo courtesy U.S. Air Force
by Tech. Sgt. Demetrius Lester
Predator
Operations
Center
CREW
COMMENABLED
VOICE
COMMUNICATIONS
photo courtesy U.S. Air Force
Master Sgt. Steven Horton
FIELD OPERATIONS
A-10/pilot
close air support
Predator Drone
Convoy
During an attack, a secure communications network must be formed quickly. Crew Comm
enables personnel and resources from diverse areas to perform as a seamless team in spite of
geographic separation. Crew Comm is hosted at the Air Force Distributed Common Ground
System node.
can proceed. Later that night, with continued overwatch support from AF DCGS
and the POC, the convoy arrives safely at
the base.
Collaboration on Demand
At the heart of AF DCGS ISR centers is the
Crew Comm enterprise system which, as
illustrated in the scenario, enables AF DCGS
crew members to collaborate securely in
real time among themselves as well as, and
more importantly, with other warfighters
in the theater. Crew Comm’s enterprise
architecture is highly scalable and extendable which allows direct station-to-station
operation without the need of centralized
services.
Built on commercial communication Voice
over Internet Protocol (VoIP) standards and
off-the-shelf hardware and software, Crew
Comm provides simultaneous bi-directional
and uni-directional connections between
end-points. In addition, crew members can
establish multiple conference calls while
maintaining the point-to-point calls. These
calls can be at the same security classification level, or span across multiple levels. This
is achieved through the use of a controlled
voice communications interface. Crew
Comm provides a comprehensive call capability that allows connections to be made
anywhere in the enterprise. The system features a Web services graphical user interface
(GUI) to support a variety of host
As a mission enabler in AF DCGS, Crew
Comm links a variety of mission support
entities and allows them to perform as a
single integrated team from sensor to
shooter. It leverages COTS technologies and
a defense-in-depth security approach to
provide improved situational awareness,
knowledge sharing and exchange.
Crew Comm demonstrates how Raytheon
has leveraged its experience and expertise in
mission systems integration to combine
COTS, government off-the-shelf practices,
procedures and tools to enable geographically diverse participants to collaborate
seamlessly for mission success. Crew Comm
is a Director of Central Intelligence Directive
(DCID) 6/3 Protection Level 4 (PL4) accredited enterprise system and has been fielded
and operational since September 2009.
“PL4” means that the system provides services with the following characteristics: high
confidentiality (information is not shared
with unauthorized entities), high integrity
(information is protected and not modifiable
by unauthorized entities) and medium availability (the system is usable when needed).1
Crew Comm is a mission-proven technology. As the warfighter’s mission has grown,
so have Crew Comm’s capabilities. It is readily adaptable to a variety of mission
applications. In recognition of its successes,
Crew Comm was named in the top five of
the C4ISR Journal’s 2010 technology awards
for networked systems. •
John Masiyowski,
Contributor: Monica Bal
1Level
4 describes a system that controls data up to and
including that having top secret classification and appropriately compartmentalizes and protects that data from
unauthorized access.
on
Technology
Focus Center Research Program
and Raytheon
T
he Focus Center Research Program,
sponsored by the Defense Advanced
Research Projects Agency (DARPA) and
the Semiconductor Industry Association,
is a university research consortium originally established to perform research to
extend silicon CMOS (complementary
metal oxide semiconductor) to its ultimate
limits — keeping the United States and its
industries at the forefront of microelectronics technology. Raytheon joined the FCRP
in 2009. Since then, the FCRP mission has
evolved and now includes exploration of
new material systems and devices to extend
and enhance CMOS technology, as well as
explore circuit, subsystems and systems architectures enabled by the advancements in
device and material technologies. The FCRP
consists of six centers covering research
ranging from fundamental electronic materials and device physics through multiscale
systems (Figure 1). Each center is led by a
world renowned researcher and staffed by
faculty experts from multiple universities.
The six centers and their mission
statements are:
1.FENA (Functional Engineered NanoArchitronics): Create and investigate new
nano-engineered functional materials
and devices, and novel structural and
computational architectures for new
information processing systems and sensors beyond the limits of conventional
CMOS technology.
2.MSD (Materials, Structures and Devices):
Explore paths that overcome the limits
of Si CMOS scaling in the continuing evolution of electronics through CMOS-extension: new device materials, structures
and operating principles to overcome
power-performance limitations of scaled
transistors in future CMOS circuits; and
CMOS Plus: system performance enhancement and functional diversification
pursued via heterogeneous device integration with CMOS.
FCRP
Centers
Technology Areas
Multi-scale Systems
MuSyC
Microsystems
GSRC
Hardware/Software
Raytheon Technology Interests
Model Based Systems Engineering
Distributed Sense & Control Systems
Multi-core Processor Optimization
Cognitive Radio-on-a-chip
Platform/Architecture
C2S2
IFC
Design
High Performance Mixed Signal & Analog (RF) Circuits
Circuits
Ultra Low-power Electronics
Devices/Interconnects
FENA MSD
Carbon Based Electronics
Components
High Q, On-chip Tunable Filters
Materials
Thermal Management Materials
Physics
Physics of Failure/Reliability
Figure 1. FCRP Centers, technology areas and relevance to Raytheon.
3.IFC (Interconnect Focus Center): Discover
and invent new electrical, optical, wireless
and thermal connectivity solutions (create
new technological options) that will meet
or exceed semiconductor technology road
map projections and enable hyper-integration of heterogeneous components
for future tera-scale systems.
4.C2S2 (Center for Circuit and System
Solutions): Invent and demonstrate the
circuit-level topologies and design techniques necessary to deliver working designs from a base platform that includes
scaled devices that are increasingly difficult to predict and control, as well as
other devices that may be non-scalable
but bring additional functionality.
5.GSRC (GigaScale Research Center):
Address the research challenges in the
design (hardware and software) and utilization (programming and interfacing)
of information system platforms for consumer/enterprise/defense applications, to
be deployed in the late- and post-silicon
era, so as to achieve orders of magnitude
improvement in cost (design and related
non-recurring engineering, programming)
and quality (lower power, higher functional performance, increased reliability,
increased usability).
6.MuSyC (Multiscale System Research
Center): Create comprehensive and systematic solutions to the distributed multiscale system design challenge, including
development of “energy-smart” distributed systems that are deeply aware of the
balance between energy availability and
demand, and adjust behavior through dynamic and adaptive optimization through
all scales of design hierarchy.
Each center is performing research of direct
relevance to the future needs of the five
major Raytheon businesses.
Since Raytheon joined the FCRP there
have been a wide range of interactions
between FCRP faculty and students and
Raytheon staff. This includes participation
in center annual reviews, attendance at
weekly e-seminars, and more importantly,
one-on-one meetings with faculty (both at
Raytheon and at the universities) in order to
leverage FCRP research to meet Raytheon
needs as well as pursue contract research
and development opportunities. The following are some examples of FCRP research
that is aligned with Raytheon near- and
long-term needs.
Carbon Electronics
The FCRP has a large, multidisiplinary effort exploring the unique electronic and
thermal properties of carbon (either carbon
nano-tubes or graphene) for use as digital
and analog/RF devices, thermal interface
materials, transparent electrodes, interconnects and energy storage. For example,
Prof. Alexander Balandin of University of
California, Riverside, is investigating novel
RF circuits based on graphene transistors for
frequency doublers, RF mixers and phase
detectors (Figure 2). Prof. Bruce Dunn of
UCLA is researching carbon nanotube-based
electrodes and sol-gel electrolytes to create
high-density capacitors that can be directly
integrated onto semiconductor chips. This
technology would provide on-chip energy
storage and lead to more compact, lightweight multichip assemblies for use in
transceivers and imaging focal plane arrays.
THz Quantum Cascade Lasers
Raytheon is working with Prof. Ben Williams
of UCLA to develop concepts for THz imaging at atmospheric transmission windows
in the 1–5 THz frequency range suitable
for explosive detection. This work is based
on the FENA (Functional Engineered Nano
Architectonics) developed quantum cascade
lasers (QCL) fabricated from GaAs (gallium arsenide) with a standard SMB (silicon
microbolometer) camera. Near-term development would combine advanced GaAs
QCLs with higher power, operating close
to the 1.5 THz window, with optimized
uncooled SMB imaging arrays using an
optimized absorbing antenna. The longerterm plan is to exploit advanced gallium
nitride (GaN) materials technology developed at Raytheon to increase power and
laser operating temperatures.
On-chip High Q Resonators for
On-chip Filters
Prof. Dana Weinstein of MIT is performing research on semiconductor-based bulk
acoustic wave (BAW) resonators that can
be realized as part of the device/circuit
fabrication process. The work is currently
on silicon-based structures. These are inherently small (transistor size) structures
Figure 3. Scanning electron microscope
image of a resonant body transistor (RBT).
known as resonant body transistors (RBTs)
(Figure 3) that can be arrayed to form filter banks. Raytheon has begun work with
Prof. Weinstein to extend this work to GaN,
which from simulations is a better material
due to its strong piezoelectric properties
(again leveraging Raytheon’s GaN technology). The long-term objective is to exploit
these devices to develop tunable filters/
reconfigurable circuits. Long-term, on-chip
resonators/filters would be of benefit to a
wide range of Raytheon systems (for example Digital Receiver Exciter (DREX) and
Intermediate Frequency chains are limited by
the size of existing filter technology).
Low Loss Passive Components and
3D Integration
Figure 2. A novel phase detector based on the unique ambipolar electronic properties of
graphene transistors.
Prof. Paul Kohl of Georgia Tech is performing research on novel materials to create
“air cavities” in multilayer dielectric structures. This will enable Raytheon to create
compact multi-layer structures without
dielectrically loading RF transistors, transmission lines and passive components and
it creates a path to compact (3D) RF and
mixed-signal circuits. Raytheon has been
interacting with Prof. Kohl to integrate and
characterize these “ultra-low” k dielectrics
into monolithic microwave integrated circuit
(MMIC) structures for transceivers.
Technology
Prof. Dave Perrault of MIT is leading a
team of researchers on the development
of components and circuits for compact,
high-efficiency power supplies. This research
includes Si IC compatible, nano-composite
magnetic materials for inductors and
transformers, novel high Q (>100) toroidal structures (Prof. Charles Sullivan at
Dartmouth), and high temperature/high
frequency/high efficiency GaN switching
transistors integrated with Si CMOS (Prof.
Tomas Palacios at MIT). We have recently
partnered with Prof. Palacios on a successful
DARPA program for GaN–Si CMOS integration for transceiver applications.
Novel Antenna
Prof. Manos Tentzeris of Georgia Tech is
developing ink-jet-printable, high-gain
antennas on flexible substrates (including
paper!) with good performance up to 150
GHz (Figure 4). This research offers great
potential to Raytheon for conformal arrays
and “wearable” electronics.
Figure 4. Examples of ink-jet-printable
conformal, flexible antennas.
Novel Circuit Concepts
Another group of faculty is investigating
novel Si CMOS-based circuit architectures
for cognitive radios. These include: architectures for low-power-spectrum sensing
(Prof. Borivoje Nikolic of UC Berkeley and
Prof. Ramesh Harjani of the University of
Minnesota); adjacent channel rejection
(Prof. Asad Abidi of UCLA); wideband tunable receiver front-end (Prof. Nikolic of UC
Berkeley); flexible digital baseband
(Prof. Dejan Markovic of UCLA); and UWB
250 µm
-5
20
Vout
-10
18
-15
16
-20
14
-25
12
Vin
- 30
-8
-6
-4
-2
0
2
4
Conversion Loss (dB)
Compact (on-chip) Power
Conditioning Circuits
200 µm
Pout (dBm) @ 244 GHz
on
10
6
Pin (dBm) @ 122 GHz
Figure 5. Prototype of a CMOS frequency multiplier.
Transceivers for Ranging & Localization
(Prof. Jeyanandh Paramesh of Carnegie
Mellon University).
Frequency sources are a key building block
in all RF systems. Prof. Ehsan Afshari of
Cornell is developing novel, Si CMOS-based,
traveling wave circuits to achieve harmonic
power generation/combining at millimeter
wave and submillimeter frequencies (Figure
5). We have initiated collaboration with
Prof. Afshari to develop a GaN version of his
oscillator design to provide higher power
and dynamic range, once again exploiting
Raytheon’s advanced GaN technology.
Research is also being performed in selfverifying/self-healing circuit architectures
by Profs. Larry Pileggi and Gary Fedder of
Carnegie Mellon University; and in self synthesizing converter circuits by Prof. Michael
Flynn of the University of Michigan. These
types of circuits and algorithms are key
building blocks for “intelligent ICs” that
can self-adapt to their mission and selfcompensate for environmental factors such
as temperature and, as a result, can have a
large impact on future Raytheon systems.
Wireless Interconnects
(body area networks)
A group of faculty led by Prof. Anantha
Chandrakasan of MIT is developing components, circuit architectures and secure data
transmission techniques/algorithms to enable
“wireless” body area networks (BAN).
The team has a rather impressive test-bed
demo that simulates a BAN monitoring heart
rate and securely transmitting the data.
While their immediate objective is
for “remote” health care monitoring and
medical diagnostics, this research has direct
applicability to distributed wireless sensor
networks.
Model Based Systems Engineering and
Distributed Sense and Control Systems
Prof. Alberto Sangiovanni-Vincentelli of UC
Berkeley is renowned for his work in the
development of several systems engineering concepts that are being advanced by
DARPA in its META project and the Office of
the Assistant Secretary of Defense (Research
and Engineering) in its Systems 2020 initiative. These concepts include model-based
engineering (MBE), platform-based engineering (PBE) and contract-based design
(CBD), which enables the development of
composable systems. His team has created
an automated tool called Metropolis, which
allows for the integration of functional
models and architecture models to perform
abstract, static/descriptive and dynamic
modeling and predict the behavior of
complex systems. We have begun closer interactions with Prof. Sangiovanni-Vincentelli
to apply his techniques to complex systems
of interest to Raytheon and our customers.
Interacting with the FCRP
The above examples are the tip of the iceberg. There is much more FCRP research
that can have an impact on Raytheon products. Therefore, Raytheon personnel are
encouraged to explore collaborations with
FCRP faculty. The first step is to visit the
FCRP website (http://www.src.org/program/
fcrp) and learn more. •
Thomas Kazior
Events
MathMovesU® Day at the
University of Arizona
R
aytheon Missile Systems (RMS) and the 62 members of
Raytheon’s Engineering Leadership Development Program’s
(ELDP) Class of 2013 hosted its sixth annual MathMovesU
(MMU) Day at the University of Arizona (UA) Student Union Grand
Ballroom in February. More than 200 high school students were
in attendance at this year’s event from Desert View High School,
Flowing Wells High School, Pueblo Magnet High School, Sahuarita
High School and Santa Rita High School.
MMU Day was supported by volunteers from the National Optical
Astronomy Observatory and the Tucson Amateur Astronomy
Association, as well as the University of Arizona’s Early Academic
Outreach and Mathematics, Engineering and Science Achievement
(MESA) programs.
The volunteers came together to teach high school students about
Galileo, astronomy and optics by having the students build their
very own Galileoscopes. Galileoscopes are mass-produced, personal
use, refractor telescopes modeled after the one Galileo used nearly
400 years ago. During the past few years, middle and high school
students in the Tucson area have built over 1,000 Galileoscopes for
MMU Day.
Building the Galileoscope
Raytheon engineers assisted the students as they built their
Galileoscopes with components that included lenses and other
optics, O-rings, focusing tubes, glare shields and eyepieces. After
assembly, the students learned to aim and then focus their instruments. By the end of the assembly process they were eagerly testing
out their new Galileoscopes by focusing on objects in the Student
Union Grand Ballroom.
Students enjoyed this opportunity to build and keep their own highquality Galileoscopes and tripods. While learning about optics and
astronomy, the students also had an early exposure to proper assembly, integration and test disciplines, based on some of the basic
manufacturing principles practiced at Raytheon.
Panel Discussion
After the students finished building and testing their Galileoscopes,
Raytheon Missile Systems’ retired Vice President of Engineering, Bob
Lepore, led a panel discussion on the topic of preparing for a career
in science or engineering.
The panel included UA Dean of the College of Engineering Jeff
Goldberg, UA Dean of the College of Science Joaquin Ruiz, RMS
Systems Engineer Chelsie Morales, RMS Engineer Braaden Schmidt,
UA Civil Engineering student (senior) Monica Soto and UA Civil
Engineering student (junior) Jose Alberto Aguilar.
The panel emphasized the importance of proper preparation in high
school to be ready for college, as well as proper preparation while
in college to pursue a career as an engineer. They asserted that any
student interested in pursuing their science and engineering interest in college can make it happen, but that the transition can be
challenging. When asked how to best prepare for college, UA Dean
Jeff Goldberg advice was to take the best math and science courses
offered in their schools. UA senior class Engineering student Monica
Soto encouraged the group to contact members of the panel or the
Raytheon engineers they met at the event for further advice in pursuing their goals.
MathMovesU Day is just one of the many ways Raytheon pours its
resources back into the community. These events engage middle
and high school students, motivating them to pursue college after
high school. Many students have become intrigued with science,
technology, engineering and mathematics (STEM) fields and are
pursuing careers in math, science and engineering as a result of the
efforts of MathMovesU, sponsored by Raytheon. •
Anupama Gunupudi
Contributors: De’Shea Bennett, Travis Dean
Events
2011 Raytheon Excellence in
Engineering and Technology
Awards
N
inety-five Raytheon engineers and technologists
were recognized for their outstanding contributions to innovation at a prestigious awards
ceremony at the Smithsonian National Air and Space
Museum in Washington, D.C., in March 2012.
Raytheon’s 2011 Excellence in Engineering and
Technology Awards represent Raytheon’s highest technical honor, recognizing individuals and teams whose
innovations, processes or products significantly impact
the company’s success and the success of its customers.
The dinner event took place in the museum’s Milestones
of Flight Gallery. Twenty-two awards were presented:
15 team awards; two “One Company” awards,
representing multiple businesses; one Information
Technology team award; and four awards to individuals.
Retired Marine Corps General John R. Dailey, director
of the Smithsonian National Air and Space Museum,
opened the event and observed with pride that the
awards program has been held at the museum for
many years.
In his opening remarks, Mark E. Russell, Raytheon vice
president of Engineering, Technology and Mission
Assurance, compared Raytheon’s accomplished innovators of today to Michelangelo, the great innovator of
the Renaissance period, who, often against significant
odds, created enduring masterpieces. “You should be
proud to know that you represent a select group of
Raytheon’s exceptional engineers and technologists.
You have demonstrated your drive to overcome constraints and excel for the success of Raytheon and for
our customer.”
After dinner, Raytheon Chairman and CEO William
H. Swanson thanked and congratulated the award
recipients for their achievements by noting: “In our
fast-paced world, we tend to forget how amazing our
work is. But take some time to marvel at what you have
achieved, and truly appreciate all that you have accomplished for our company and our customers.”
Swanson was joined onstage by Russell and business
leaders as the winning projects were described and
the winners received their awards and were personally
congratulated.
Raytheon congratulates all winners of the 2011
Excellence in Engineering and Technology Awards. •
Events
2011 Raytheon Excellence in Engineering and Technology Award Winners
One Company Awards
Redclaw Secure Processing Team
Michael Coleman (MS), Richard McCord (MS), Bryan Cotta (SAS), Mark
Gardner (MS), Mark Henshaw (MS), David Manz (SAS), Wayland Seto (SAS)
For increasing yields more than 15x to meet multiple program schedules across
multiple product lines’ production requirements.
Sensing Enterprise Campaign Systems Engineering, Integration and
Test (SEI&T) Team
Boris Abramov (NCS), John Altman (TS), Shane Blair (IDS), Michael Fallica (IDS),
Essex Fowlks V (IDS), Mark Petschek (IDS), Lawrence Stolz (IDS)
For integrating and testing new technologies that will reduce cost by five to 10x.
Integrated Defense Systems
Individual Award
Paul Lanzkron
For providing both the leadership and technical decision making necessary to recover
the fire control radar schedule, leading a 24-7 technical effort to isolate and correct
fire control radar problems.
AN/TPY-2 Flight Test Team
Dave Cushing, Brian Harkins, Henry Ng, Rick Smith, Bud Thayer
For successfully supporting all Mission Readiness Reviews for flawless execution on
FTT-12 and providing subject matter expertise to the Missile Defense Agency.
Digital Beamforming and Signal Processing (DBF/SP) Using
Affordable Radar Backend (ARBE) Team
Sandra Clifford, Russell Dube, Delvis Gomez, Sean Price, Prescott Turner
For developing a solution that reduced digital beamforming and signal
processing costs.
UAE Patriot GEM-T GL Flight Mission Team
Joel Harris, John Mara, Neil Mushaweh, Gary Sannicandro, Steve Wakefield
For producing a new, highly complex GEM-T missile in less than 30 months, which
flawlessly performed in front of the customer during the live shot.
Intelligence & Information Systems
Individual Award
Darrell Young
For developing an automated metric capable of producing human-like image
interpretability ratings, Video National Imagery Interpretability Scale (VNIIRS).
Law Enforcement National Data Exchange (N-DEx) Team
Indrani Dey, Willard Gray, Erich Reiter, Dana Shum, Chan Yee
For working together with the FBI’s Criminal Justice Information Services division to
establish a first of its kind secure platform for national criminal justice information
sharing.
Raytheon Information Overlay Technology Content Management
Framework (RIOT/CMF) Team
Patrick Mao, Ruben Quintero, Brian Urch
For an innovative software framework for integrating analytics with heterogeneous
distributed data sources.
Missile Systems
AMRAAM EPIP Target Acquisition Team
Kurt Koenig, John Mincer, Daniel Mosier, James Prudhomme, Vincent Soto
For providing the U.S. warfighter with enhanced capability against advanced threats
(a classified software upgrade program).
Quiet Eyes Laser Turret Assembly (QELTA) Development Team
Charles Bersbach, Paul Chinnock, Jim Hicks, Don Hunt, Nick Trail
Network Centric Systems
Individual Award
Jagannath Chirravuri
For leveraging Raytheon’s civil communications expertise for a growing number of
police departments, fire departments and civil communities.
Communications Electronic Attack with Surveillance and
Reconnaissance (CEASAR) Team
Tom Broski , Garry Ingram, Jeff Jackson, Mark Phipps, John Smith
For developing the CEASAR system for the Army Rapid Equipping Force working
with Naval Surface Warfare Center-Crane.
Information in a Photon (INPHO) Team
Jian Chen, Zachary Dutton, Saikat Guha , Jonathan Habif, Richard Lazarus
For implementing a new optical communications receiver capable of beating the
standard quantum limit.
Low Cost Thermal Imager — Manufacturing (ICTI-M) Team
Stephen Black, Adam Kennedy, Thomas Kocian, Matthew Kuiken, Richard Wyles
For developing a revolutionary imaging solution whose size was reduced by 50x,
weight by 15x, power by 3x and, most importantly, unit cost by 17x, resulting in a
significantly decreased camera size that will be integrated into a smart phone.
Signal Chain Demonstration (SCD) Team
Raymond Boe (NCS), Stephen Herbst (SAS), Bruce Lewis (NCS),
Philip Mayner (NCS), Paul Storaasli (SAS)
For defineing NuVision milestones while meeting all customer objectives in
19 months — two months ahead of schedule.
Space and Airborne Systems
Individual Award
Robert Byren
For his 36 years at Raytheon — he has developed a highly diverse background in
solid-state lasers, passive imaging and focal plane arrays, sensor architecture and
line-of-sight control, EO/IR high energy lasers and beam control technologies.
LSC-79 Shipboard Active Electronic Scan Array (AESA) Radar Team
Kevin Bell, Claudio Howard, Nader Khatib, Hong Kwong, Richard Ritch
For demonstrating modified radar modes for the APG-79 to show its potential to
transition an airborne radar to a maritime surface radar application.
Submerged Ram Air Turbine Speed Control Team
Pablo Cabrera, Matthew Hughes, Scott Johnson, Brendan Robinson, John Yook
For conceiving and implementing a power generation/control system that exceeded
the required maneuver envelope, positioning Raytheon to capture the next generation jammer market.
Technical Services
Integrated Fire Control System — Kingdom of Saudi Arabia Team
Uldis Duselis, Clark Griffin, Justin Ray, Anthony Welch
For designing and developing a prototype fire control system for the KSA M60A3
main battle tank, successfully replacing the existing 105mm cannon with a new
120mm gun in less than six months.
Information Technology
SureView — Active Malware Protection (AMP) Team
Joseph Bell (Corp IT), Jimmie Daily (Corp IT), Paul Escobedo (Corp IT),
Morgan Greenwood (Oakley Systems), Earl Kellner (Corp IT)
For leveraging the SureView endpoint protection product for detecting outside
threats to include the advanced persistent threat and thus expanding the
marketability of an existing Raytheon product.
For providing the customer with the first-ever quantum cascade laser-based IR countermeasure system for near-operational performance testing, in only eight months.
SM-3 Block IB System Integration Test Team
Michelle East, Nino Garcia, Chris McManus, Ryan Rasmussen, Ken Schmidt
For developing an entirely new kinetic warhead (KW) based on new throttle rocket
motor technology for divert attitude control.
Events
MMSTN
Symposium
2011 Raytheon Power and
Energy Technology Symposium
ore than 350 engineers, technologists,
customers and suppliers from across the country
gathered near Los Angeles in
October 2011 for the 14th
Mechanical, Materials and
Structures Technology
Network (MMSTN)
Symposium. The event
provided an opportunity for
Raytheon employees to come
together to share their expertise and learn about
engineering challenges and
breakthroughs from all businesses within Raytheon. This
annual forum encourages collaboration across the enterprise.
Collaborating on Innovative Solutions to
Meet the Energy Needs of our Customer
M
A
ll six Raytheon businesses and several U.S. Army and Navy customers participated in the Power and Energy Technology
Symposium in December 2011 at the Raytheon Marlborough,
Mass. facility. The symposium participants included a targeted group of
50 chief engineers, technical directors and subject matter experts who are
charged with inserting new power technology into Raytheon products.
The honored guest speaker was Lt. Damian Blazy, who is currently serving
in the Pentagon as military aide to Rear Admiral Philip Cullom, Director
of the Navy Task Force Energy; and, as energy security analyst in the Navy
Energy Coordination Office. Blazy gave a compelling “call to arms” talk
about our civilization’s over-reliance on non-renewable resources — such as
fossil fuels for energy and rare earth elements for commodities — and how
that reliance affects energy security and acquisition cost. He spoke to the
Navy’s initiatives on energy efficient acquisition, increasing existing fleet efficiencies, diversifying energy resources, and culture and behavior change.
Papers and posters by Raytheon
authors on core subject areas
of materials, design, analysis
and manufacturing were presented over three days and
interspersed with interactive
workshops on themes such as
counterfeit avoidance and military energy needs. University
professors talked about current
research on battery technology
and low-observable materials,
and business leaders and customers shared messages about
strategic thinking, business
transformation and Mission
Assurance.
The day inspired much information sharing and idea generation, with engaging discussions during the 10 presentations. The dialogue continued
and new connections were made while gathered around the 14 poster
presentations. Of particular interest were the Intelligent Power and Energy
Management (IPEM) power system modeling and optimization tool, and
the Intelligent Energy Command and Control (IEC2) software package.
These tools enable a system to be run and optimized for efficiency, maximum continuous and/or peak power, minimal fuel consumption, lowest
cost operation, maximum run-time, intelligent load shedding, silent watch
or other scenarios as required. Another highlight was the demonstration
of a prototype portable/wearable fuel cell battery replacement for soldier
power applications.
The success of this event was evident by the immediate opportunities
generated and the cross-pollination of ideas for technology insertion into
existing products and new pursuits. •
In addition to supporting excellence in core design disciplines, the MMSTN also plays a critical role in advancing
Raytheon’s position in the rapidly evolving materials and
structures technology areas. Focus areas of advanced
electromagnetic materials; rapid development, prototyping, and manufacturing; novel power systems; and next
generation electronic packaging are the themes around
which many of the network’s workshops and special
projects were organized. Experts from the network lead
Raytheon’s research and development in these areas. •
Lauren Crews
Events
2011 Raytheon Energy Summit
Promotes Energy Conservation
and Sustainability
M
ore than 100 Raytheon employees, industry experts,
and Massachusetts Institute of Technology (MIT) faculty and students participated in the 2011 Raytheon
Energy Summit held at the MIT Faculty Club and MIT Museum in
Cambridge, Mass., July 21–22. MIT hosted Raytheon on behalf of
the company’s unique partnership as a member of the MIT Industrial
Liaison Program. Raytheon and MIT share a common history as institutions focused on science and research. The summit reinforced
their shared objectives to reduce energy consumption and identify
methods to embrace environmental sustainability.
Sponsored by the Raytheon Operations Council, the two-day
program focused on sharing best practices that enable large corporations to reduce carbon footprints. Technologies focused on the
private and public sectors’ commitment to energy savings, sustainability initiatives and green building design and operations.
“Raytheon is determined to set additional sustainability and energy
goals that reduce our carbon footprint as well as identify methods to achieve these goals,” said Luis Izquierdo, vice president of
Corporate Operations. “Sustainability and energy efficiency are valued by Raytheon enterprisewide, and we are engaged at all levels of
the company to continuously strive to improve.”
The summit commenced with a day of learning about advanced,
energy-saving and sustainability technologies; alternative power
generation and storage capabilities; Leadership in Energy and
Environmental Design (LEED); federal energy policies; U.S.
Department of Energy (DOE) energy-saving programs and renewable energy project strategies. The second day encouraged
participants to apply the technologies and capabilities in an interactive Raytheon Six Sigma™ session.
Included among the notable speakers: Dr. Robert C. Armstrong
from MIT; Paul Scheihing of the U.S. DOE Industrial Technologies
Program; Elizabeth J. Heider, chair elect of constructor of buildings,
U.S. Green Building Council; and corporate speakers from General
Motors Corporation, Staples, Inc., and Constellation Energy Group,
Inc. Raytheon attendees represented many functions: Engineering,
Technology and Mission Assurance; Legal; Communications;
Operations; Facilities Management; Real Estate; and Environmental,
Health and Safety. •
People
Leaders for Global Operations Program
The Leaders for Global Operations
LGO Graduate Profile
(LGO) program is a two-year, full-time
grateful for the opportunities
Raytheon has given me and
I’m please to be part of the
strong LGO network at the
company.”
graduate program at the Massachusetts
Institute of Technology (MIT) focusing
on operations, manufacturing and the
supply chain. Started in 1988 to address
the competitive challenges faced by
American industry, the LGO program has
Chouinard is currently the
Whole Life Engineering lead
for Taiwan Patriot, managing
the total life cycle for the $3+
billion program. The “global”
aspect of the LGO program
was particularly helpful in
preparing her for her current role, which involves a
significant amount of time on
site in Taiwan. “I apply lessons learned from LGO every
since developed into a more global role,
focusing on solving the challenges of
operations and manufacturing companies
worldwide. LGO is a joint partnership
between academia and industry, partially
supported and operated by industrial
partners, including Raytheon. Raytheon
has been involved with the program since
2001. LGO students earn two degrees:
an MBA from the MIT Sloan School of
Management and a master’s in engineering from MIT’s School of Engineering.
The mix of business and engineering
content allows engineers and others with
technical backgrounds to build technical
expertise while developing the management skills necessary to become business
leaders. Sustained leadership courses
and the experience obtained through
this program further develop students’
management skills and prepare them for
future roles in industry.
A crucial part of the LGO program is a
seven-month internship conducted on
site with a partner company, typically
focusing on high-level projects such as
inventory management, new product
introductions, workforce modeling and
factory layouts. Raytheon has sponsored
over 20 of these internships in recent
years. Past projects have focused on
reducing manufacturing energy consumption, bringing lean to engineering
processes and increasing shop floor
throughput.
As an undergraduate at MIT, Natalie
Chouinard was so impressed by the LGO
fellows she collaborated with that she made
it a goal to attend the program herself.
After serving as an officer in the U.S. Navy,
Chouinard joined Raytheon in 2005. She
achieved her LGO goal in 2007, becoming a fellow through Raytheon’s Advanced
Scholars program. She graduated from the
program in 2009 with a Master of Science
in Mechanical Engineering and an MBA
focusing on global strategy. Chouinard is
the Raytheon representative on the LGO
Operating Committee and supports Luis
Izquierdo, vice president of Corporate
Operations, in his role on the Raytheon LGO
Governing Board. She notes that, “I am
day,” she says, “Application
of operations principles, such
as lean/Six Sigma, material
management, and optimization transfer successfully from
the classrooms at MIT to reallife global operations.” She
also stresses the importance
of the technology component of her dual
degree. “I’m a hands-on manager,” she explains. “I lead my teams in problem solving,
where the ability to properly understand
technical documentation is critical. With
my efforts focused on fielded equipment,
I also understand the importance of a reliable, supportable and affordable design.”
The global and diverse team also reinforced
leadership lessons learned from case studies
in organizational design. “Collective intelligence from diversity empirically creates
better solutions. This has changed my view
on how I interact with teams and share
solutions.”
People
LGO Graduate Profile
Raytheon employees who have gradu-
Lincoln Sise first joined
ated from the LGO program and now
Raytheon in the summer of
2002 as a seven-month LGO
intern, working process improvement in the space-cable
assembly shop. For Sise, “this
was a challenging area —
having both high-mix product
content and a highly variable
workload,” but he was able
to successfully apply certain
lean principles, particularly
around worker empowerment. He provided visual
indicators throughout the
shop, enabling operators to
have a greater degree of freedom in communicating with
other functions and determining how product moved
through the shop. These
experiences were similar to
approaches he had seen during a ten-day LGO plant trek
through various partner company sites the previous year.
Sise subsequently joined Raytheon as an
industrial engineer supporting the Advanced
Targeting Forward Looking Infra-Red
(ATFLIR) program, both in capacity planning
and in designing a new “flexible” factory
for McKinney, Texas. After that role, Sise
worked as the program operations lead for
a broad mix of global positioning system
(GPS) programs. His role included providing
up-front cost modeling and producibility for
early-stage engineering and manufacturing
design programs, as well as transforming
the production strategy of mature programs
into long-term supplier relationships that
yield significant cost reductions. Currently,
Sise leads a 250-person manufacturing
organization in El Segundo, Calif., with a
broad portfolio of products including optical, space, electronic and classified sensors.
serve in roles ranging from operations
and supply chain managers to integrated product team leads:
Sise continues to apply the knowledge
gained from his LGO experience at
Raytheon — particularly in the area of employee empowerment. “We always have
cost pressures. Programs rightfully expect us
to improve and do more with less. The most
efficient way to achieve this is by motivating our people to identify opportunities that
they see every day, and then to implement
them. We recently adopted Raytheon’s
Total Employee Engagement (TEE) strategy
to capture and implement employee ideas,
and it has been terrific. It is a system where
we encourage, enable and recognize all the
$1 ideas people have, versus focusing on
just the $1 million ideas. These ideas are
easier and faster to implement, and we are
already seeing improvements in efficiency.
Roughly half of my department’s cost savings for programs in 2011 came from TEE.”
ClassBusiness
Brad Koetje 1991
SAS
Elaine Cooper
1995
SAS
Kevin Stewart
1997 RTSC
Annabel Flores
2003
SAS
Lincoln Sise 2003
SAS
Brett Balazs
2004
SAS
Yuliya Rovner 2004
SAS
Padma Vanka
2004
IIS
Chris Caballero
2005
SAS
Amber (Dudley) Newell
2005
SAS
Josh Simmons
2007
IDS
Natalie Chouinard 2009
IDS
Akiva Holzer 2009
IDS
Brian Masse
2011
IDS
Kuldip Sandhu
2011
SAS
Steve Smith 2011
SAS
Trevor Schwartz
2012
IDS
Sarah Clarke
2013
IDS
Chouinard and Sise agree that collective
improvement is core to the LGO program — and it starts the very first day of
school when students are grouped into
teams where members are encouraged to
leverage off of each other. Both Sise and
Chouinard continue to maintain strong
connections with their classmates, bouncing ideas off of them, informally and
through regular knowledge reviews held
on the MIT campus. It is this type of collaborative environment that continues to
strengthen both LGO and partner
companies. For more information about
the program, visit http://lgo.mit.edu •
Akiva Holzer, Brian Masse
Resources
Unleashing the Power of Raytheon Manufacturing
Through PRISM
P
rocess Re-invention Integrating
Systems for Manufacturing (PRISM)
is the operations and logistics component of Raytheon’s enterprise resource
planning (ERP) solution. The solution is built
upon a set of common business processes,
which are enabled by an SAP® software
tool. PRISM accelerates and simplifies the
manufacturing life cycle from planning to
execution by integrating our supply chain,
operations and quality data, processes
and workflows into a single business solution. PRISM is also integrated with APEX
(Achieving Process Excellence), Raytheon’s
financial instantiation of the SAP tool, and
will be integrated with Common Product
Data Management (PDM), Raytheon’s tool
for managing engineering product data, to
ensure a tight coupling of our design, operational and financial data and processes.
the work center level. This capability will
optimize factory schedules and improve production flow. By providing early visibility into
areas of concern, capacity planning will enable us to respond to production peaks and
valleys, resulting in shorter lead and cycle
times and improvements in overall program
schedule performance.
By integrating business processes — and
the related data — into a single business
solution coupled with other enterprisewide
business tools, PRISM facilitates the flow
of information across the product life cycle
(Figure 1). The tighter integration of design,
execution and management functions enables increased productivity, which drives
greater affordability into the solutions we
deliver to our customers.
Because it is a common solution being deployed domestically across the company,
PRISM is a key component of Raytheon’s
Design Anywhere, Build Anywhere, Support
Anywhere vision. This strategic vision aims
to create an environment that is geography
and business agnostic: where an innovative,
affordable solution can easily be designed
on one coast, manufactured on another,
and supported anywhere because the company is using common processes and tools.
This enterprise alignment allows the company to expand its resource surge capability
to meet workforce demands created by new
business opportunities.
In addition, PRISM provides leading-edge
capabilities that help us plan and execute
with more precision. For example, PRISM
provides increased visibility into our material
needs across the company, allowing us to
aggregate requirements and achieve greater
buying efficiency. When deployed, PRISM’s
capacity planning functionality will provide
an automated method for measuring our
ability to meet requirements by comparing
the available capacity — labor and machine
run time — to the planned load, down to
“PRISM is a powerful enabler for our company,” says Luis Izquierdo, vice president of
Corporate Operations and chair of the
PRISM Executive Steering Committee. “The
enhanced planning and execution capabilities it provides places Raytheon at the
forefront of operational excellence, and
positions us well for the future.”
A Key Building Block in the Design
Anywhere, Build Anywhere,
Support Anywhere Vision
Benefits to Our People, Our Company
and Our Customers
PRISM provides employees with an integrated toolset and best-in-class processes
for completing tasks efficiently and effectively. It helps employees find data
quickly and share information easily. It also
enhances employees’ professional growth
by arming them with transferable skills
to support programs and organizations
throughout the company without additional
training, making job rotations easier. In
addition, because PRISM collects information about our products from design to
manufacturing to field support, it provides
the platform for more effective collaboration across the product life cycle, enabling
employees to better understand the up- and
downstream impacts of their actions and
decisions.
For example, once deployed, PRISM’s integration with Common PDM, Raytheon’s
companywide tool for managing product
data, performing initial releases and maintaining product configurations will help
ensure a stronger partnership between engineering and manufacturing. Common PDM
and PRISM’s ability to pass data back and
forth seamlessly in near real time will help
ensure the engineering bill of materials and
manufacturing bill of materials remain in
synch when changes are made either on
the design or production side. This real-time
visibility into design changes will greatly
reduce rework and reinforce the need to
design for producibility.
PRISM improves our overall execution by
providing processes and tools that enable
more predictable performance. PRISM’s
integration of data ensures access to information in near real time, no matter where
the data may have originated. PRISM continually checks data in one part of the system
against others, ensuring referential integrity
and resulting in greater accuracy. The availability of accurate, timely data allows early
identification of issues, enabling proactive
measures to mitigate risk. Accurate and
Resources
APEX (Achieving Process Excellence)
Contract
Administration
Support Labor
Accounting
Project
Administration
Billing
Administration
Contract
Accounting
Delivery (DD250)
Administration
Accounts
Payable
Direct Labor
Accounting
PRISM
Long-Term
Planning
Purchasing
Bill of
Materials (BOM)
Maintenance
Material
Planning
Inventory
Management
Capacity
Planning
Grouping,
Pegging,
Distribution
Plant
Maintenance
Production
Planning
Warehouse
Management
Initial Release
Shipping/
Traffic
Quality
Shop Floor
Execution
Reporting
EHS
Depot
Product Configuration
Common Product Data Management (PDM)
Figure 1. Process Re-invention Integrating Systems for Manufacturing (PRISM) provides improved capabilities and integrates seamlessly with
other Raytheon processes to provide a total business solution.
timely data, along with better planning,
scheduling and workflow management
tools, allows more effective utilization of
enterprise resource capacity, reduces lead
times and minimizes waste.
improved traceability and more efficient use
of resources. This enhances our ability to
meet customer expectations regarding quality, delivery and cost.
A Vision for the Future
The automation, process discipline and data
transparency provided by PRISM reduce time
spent on data collection, consolidation and
coordination. Resources are better focused
on meeting customers’ needs. The process
discipline provided by PRISM equates to
reduced variability, improved data accuracy,
PRISM is just one element of the larger
Design Anywhere, Build Anywhere, Support
Anywhere vision that is being brought to
life to help employees share data seamlessly,
find information quickly and collaborate
effectively across the product life cycle. Its
value will be maximized when it is tightly integrated with the other enterprise solutions
being put in place across Raytheon, such as
APEX and Common PDM, to optimize the
transparency, control, management and
predictability of our performance. As the
PRISM journey continues, additional capabilities will be added to the solution’s current
suite that align with the company’s Vision,
Strategy, Goals and Values. •
Heather Bonarrigo
U.S. Patents
Issued to Raytheon
At Raytheon, we encourage people to work on
technological challenges that keep America
strong and develop innovative commercial
products. Part of that process is identifying and
protecting our intellectual property. Once again,
the U.S. Patent Office has recognized our
engineers and technologists for their contributions in their fields of interest. We compliment
our inventors who were awarded patents
from June through December 2011.
luke m flaherty, randal e knar
tiffanie randall,
7956114 water immiscible rosin mildly activated flux
brien ross, peter rozitis
7957072 method and apparatus for moving a component in an
optical sight
anthony t mcdowell, daniel roth
7957453 rake receiver and method for operation
david a corder, kevin w elsberry
7958780 wind tunnel testing technique
shek m cheung, thomas lee,
gregory e longerich
7958825 system and method for integrated stage separation
frederick a ahrens, kenneth w brown,
jeff l vollin
7961133 system and method for diverting a guided missile
marc a brown, edward gaboriault jr,
david giroux, frank hitzke, christopher
mello, emily j pikor, david a sharp,
douglas veilleux ii, thomas s wiggin
7963242 anchor containing a self deploying mooring system and
method of automatically deploying the mooring system from the
anchor
robert cavalleri, thomas a olden
7964830 large cross-section interceptor vehicle and method
kapriel v krikorian, mary krikorian,
robert a rosen
7965226 agile beam pulse to pulse interleaved radar modes
howard s nussbaum, clifton quan
7965235 multi-channel thinned T/R module architecture
eran marcus, nathaniel wyckoff
7965890 target recognition system and method
dache' p barnhart, william t jennings
7966147 generating images according to points of intersection for
integer multiples of a sample-time distance
richard d loehr
7966805 hydroxyl amine based staged combustion hybrid
rocket motor
stephen dolfini, thomas g gardner,
james n head, gregory v hoppa,, karleen g
seybold, tomas svitek, karen i tsetsenekos
7967255 autonomous space flight system and planetary lander
for executing a discrete landing sequence to remove unknown
navigation error, perform hazard avoidance and relocate the lander
and method
nathan m mintz, mark r skidmore
7967257 space object deployment system and method
steven d bernstein, william e hoke,
ralph korenstein, jeffrey r laroche
7968865 boron aluminum boron nitride diamond heterostructure
michael g adlerstein, francois y colomb
7968978 microwave integrated circuit package and method for
forming such package
andrew k brown, kenneth w brown
7969245 millimeter-wave monolithic integrated circuit amplifier
with opposite direction signal paths and method for amplifying
millimeter-wave signals
theagenis j abatzoglou, johan enmanuel
gonzalez
7969345 fast implementation of a maximum likelihood algorithm
for the estimation of target motion parameters
vernon r goodman, timothy r holzheimer
7969349 system and method for suppressing close clutter in a
radar system
brandon w blackburn, bernard harris,
michael v hynes, john e mcelroy
7970103 interrogating hidden contents of a container
alan curtis, paul j remington, istvan ver
7970148 simultaneous enhancement of transmission loss and
absorption coefficient using activated cavities
kenneth d carey, gregory leedberg,
george spencer jr
7970814 method and apparatus for providing a synchronous
interface for an asynchronous service
bryan berlin, bradley m biggs, travis p walter
7971533 methods and apparatus for weapon fuze
kim l christianson, henri y kim,
travis p walter
7971535 high-lethality low collateral damage fragmentation
warhead
kapriel v krikorian, mary krikorian,
robert a rosen
7973699 dismount harmonic acceleration matching filtering for
enhanced detection and discrimination
herbert landau, ethan phelps
7974814 multiple sensor fusion engine
michael j hirsch, claudio meneses,
panos pardalos, mauricio resende
7974816 sensor registration by global optimization procedures
andrew j hinsdale, arthur schneider
7975593 methods for inductively transferring data and power
to a plurality of guided projectiles to provide a lock-on-before
launch capability
qingce bian, jeffrey decker, bradley huang,
giles d jones, william price, christopher a
tomlinson, peter wallrich
7976309 method and apparatus for simulating weapon explosions
inside a chamber
andy chu, elena sherman, thomas stanford,
weldon williamson
7976924 active garment materials
billy d ables, john ehmke, roland gooch
7977208 method and apparatus for packaging circuit devices
leonard p chen, micky harris, kenton veeder
7978115 system and method for analog-to-digital conversion
daniel d gee, min s hong, charles f kaminski,
juan f lam, harold b rounds, robert shuman,
scott d whittle
7978123 system and method for operating a radar system in a
continuous wave mode for data communication
scott e adcook, carl d cook,
mena j ghebranious
7978124 method and system for motion compensation for hand
held MTI radar sensor
sean j costello, mark s hauhe, clifton quan,
jim a vaught
7978145 reconfigurable fluidic shutter for selectively shielding an
antenna array
timothy g brauer, richard cesari,
kenneth colson, mitchell b haeri,
michael c menefee, hector reyes jr
7978330 detecting a target using an optical augmentation sensor
david a rockwell, vladimir v shkunov,
joshua n wentlandt
7978943 monolithic pump coupler for high-aspect ratio solid-state
gain media
billy d ables, s rajendran
7979144 system for forming patterns on a multi-curved surface
scott t caldwell, andrew b facciano,
robert t moore, kelly sinnock
7980057 integral composite rocket motor dome/nozzle structure
joseph a frassa, albert zampiello
7980189 methods and apparatus for a scuttle mechanism
micah s koons, scott j martin,
mark a taylor, don r tolbert
7982476 conduction-cooled accelerated test fixture
john g heston, jon mooney
7982544 method and system for amplifying a signal using a
transformer matched transistor
gary a frazier
7982653 radar disruption device
james s wilson
7983042 thermal management system and method for thin
membrane type antennas
alexander a betin, david a rockwell,
vladimir v shkunov
7983312 method and apparatus for generation and amplification
of light in a semi-guiding high aspect ratio core fiber
richard j conz, nickolia l coombs,
lisa a fillebrown, william kelberlau,
richard b moe, bruce c munro
7983941 analyzing system performance, operational performance
and costs of a surveillance system
gregory p armendariz, robert w bowne,
frank p griffith, lee r venable
7984052 system and method for integration of data records
having differing data types to a geographical information system
delmar l barker, william richard owens,
ross d rosenwald
7985965 quantum computing device and method including qubit
arrays of entangled states using negative refractive index lenses
evgeny n holmansky, boris s jacobson
7986535 methods and apparatus for a cascade converter using
series resonant cells with zero voltage switching
steven d bernstein, ralph korenstein,
stephen j pereira
7989261 fabricating a gallium nitride device with a diamond layer
robert s brinkerhoff, james m cook,
richard d loehr, michael j mahnken
7989743 system and method for attitude control of a flight vehicle
using pitch-over thrusters
michael d do, andrew b facciano,
gregg j hlavacek, robert t moore
7989744 methods and apparatus for transferring a fluid
frank birdsong jr, lloyd kinsey jr
7990308 mirror image target detection and recognition
jason blind, mark pauli
7990311 adaptive clutter filter for maritime surface search radar
christopher monti
7990632 optical element and stress athermalized hard
contact mount
justin bergfield, randy w hill, abram young
7991289 high bandwidth communication system and method
michael r johnson, bruce e peoples
7991608 multilingual data querying
chris e geswender, shawn b harline,
nicholas e kosinski
7994458 projectile having fins with spiracles
john p bettencourt, valery s kaper,
jeffrey r laroche, kamal tabatabaie
7994550 semiconductor structures having both elemental and
compound semiconductor devices on a common substrate
michael rakijas
7994982 method and apparatus for bounded time delay estimation
jar j lee, stan w livingston, dennis t nagata
7994997 wide band long slot array antenna using simple
balun-less feed elements
robert w byren, david sumida,
michael ushinsky
7995631 solid-state laser with spatially-tailored active ion concentration using valence conversion with surface masking and method
robert f cromp, gilad suberri
7996465 incident command system
jeremy c danforth, kevin r greenwood,
james d streeter, timothy alan yoder
7997205 base drag reduction fairing
stephen jacobsen, marc olivier, fraser m
smith, shayne zurn
7999471 multi-cell electronic circuit array and method of
manufacturing
donald p bruyere, robert t cock,
david a faulkner, ralph f guertin,
ralph t tadaki, john b treece
7999726 antenna pointing bias estimation using radar imaging
alexander a betin, kalin spariosu
8000362 solid-state suspension laser generation utilizing separate
excitation and extraction
mark j kocan, dwight schwarz
8001826 methods and apparatus for high frequency impact testing
christopher hirschi, stephen jacobsen,
brian maclean, ralph pensel
8002365 conformable track assembly for a robotic crawler
stephen jacobsen, david marceau
8002716 method for manufacturing a complex structure
peter r drake, peter l hoover, eric g rolfe
8004452 methods and apparatus for coordinating ADS-B with
mode S SSR and/or having single link communication
f williams, andrew vall
8004453 elevation null command generator for monopulse radar
airborne missile guidance systems
mark a owens
8004463 systems and methods for determining direction-of-arrival
gary a frazier
8004747 multilayer light modulator
michael l forsman, james j mays,
michael l williams
8005956 system for allocating resources in a distributed
computing system
james h dupont, henri y kim, travis p walter
8006623 dual-mass forward and side firing fragmentation warhead
terry m sanderson
8007705 method of manufacture of one-piece composite parts
using a two-piece form including a shaped polymer that does not
draw with a rigid insert designed to draw
mark s hauhe, clifton quan
8009114 switchable 0/180 degree phase shifter on flexible
coplanar strip transmission line
keith guinn
8009439 metal foil interconnection of electrical devices
howard c choe, james guillochon,
deepak khosla
8010658 information processing system for classification and/or
tracking an object
eric e-lee chang, terrance eck, richard l scott
8011130 gun sight mounting device
robert e walsh
8012373 anti-corrosion threadcompound for seawater environment
michael a born, keith c buerger,
darryn a johnnie, sung i park, colleen m
touchard, tyler j ulinskas
8014279 communication scheduling of network nodes
scott t johnson, david a rockwell,
vladimir v shkunov
8014426 optical device and method of controlling a refractive
index profile in the optical device
lowell a bellis, robert c hon
8015831 cryocooler split flexure suspension system and method
david r sar, terry m sanderson
8016249 shape-changing structure member with embedded
spring
martin hendlin, glenn c messick,
jay meyer, carl nardell
8016438 spherical mirror mount
steven cotton, benjamin dolgin,
michael shore
8018382 positioning system and method
jeffrey e carmella, thomas f papale
8020769 handheld automatic target acquisition system
john carcone
8022857 radar reflector
andreas hampp, justin gordon wehner
8023168 organic layers for tunable optical filters and absorbers
lacy g cook
8023183 all-reflective wide-field-of-view telescope with beneficial
distortion correction
laura a cuthbert, william fossey jr,
joseph a sarcione
8025752 method of fabricating conductive composites
stephen jacobsen, david marceau, david
markus, david payton, shayne zurn
8026447 electrical microfilament to circuit interface
delmar l barker, william richard owens
8026496 acoustic crystal sonoluminescent cavitation devices and
IR/THZ sources
vinh adams, wesley dwelly
8026840 biometric radar system and method for identifying
persons and positional states of persons
mark s hauhe, clifton quan, mark e stading,
adam c von, chaim warzman,
richard d young
8026863 transmit/receive module communication and control
architecture for active array
william c strauss
8029295 connector for an electrical circuit embedded in a
composite structure
patrick w cunningham
8031126 dual polarized antenna
michael r benoit, steven r collins,
robert d oshea, daniel p resler
8031319 hermetic liquid crystal cell and sealing technique
george weber
8032685 data modifying bus buffer
jeffrey c edwards
8033221 system and method for sensing proximity
william j davis, ward g fillmore,
scott macdonald
8035219 method for packaging semiconductors at a wafer level
timothy e adams, jerry m grimm,
christopher moshenrose, james a pruett,
mark scott
8035545 vehicular surveillance system using a synthetic sperture radar
gary a frazier, timothy j imholt
8037775 passive hit locator system and method
david a lance, steven t siddens
8037798 methods and apparatus for communications between a
fire control system and an effector
gary f wahlquist
8037804 dynamic armor
mark c dietrich
8037821 methods and apparatus for reducing the transmission of
mechanical waves
e. russ althof, william hawkins, henri y kim
8037822 warhead booster explosive lens
robert a bailey, brady a plummer,
robert w plummer
8037824 explosion foil initiator actuated cartridge
thomas h bootes, george d budy, wayne lee,
richard k polly, jason m shire, jesse t waddell
8037829 reactive shaped charge, reactive liner, and method for
target penetration using a reactive shaped charge
richard j kenefic
8038062 methods and apparatus for path planning for guided
munitions
8038795 epitaxial growth and cloning of a precursor chiral
nanotube
reza tayrani, mary a teshiba
8039880 high performance microwave switching devices and circuits
ethan s heinrich, samuel d tonomura
8039957 system for improving flip chip performance
william d farwell
8040157 digital circuits with adaptive resistance to single event upset
tamrat akale, james a carr
8040199 low profile and compact surface mount circulator on ball
grid array (BGA)
jerry m grimm, raymond samaniego,
william f skalenda, john l tomich
8040273 interferometric synthetic aperture radar for imaging of
buildings
keith a kerns
8042403 apparatus to control a linearly decreasing force
stephen jacobsen
8042630 serpentine robotic crawler
oleg efimov, david hammon
8043087 methods and apparatus for thermal development of
large area solids
hee kyung kim, derek pruden, clifton quan,
alberto f viscarra, fangchou yang
8043464 systems and methods for assembling lightweight RF
antenna structures
stephen h black, robert c gibbons,
richard n mullins
8044355 a system and method for viewing an area using an
optical system positioned inside of a DEWAR
jeong-gyun shin
8044833 high speed serializer
kevin w chen, patrick w cunningham,
william p harokopus
8045329 thermal dissipation mechanism for an antenna
joseph scates
8046253 method and apparatus for critical infrastructure protection
piali de
8046320 domain-independent architecture in a command and
control system
anthony k tyree
8047070 fast response projectile roll estimator
joseph a creonte, gordon o salmela
8047332 direct grease injection for large open gearing
andrew b facciano, gregg j hlavacek,
robert t moore, craig seasly
8049148 missile airframe and structure comprising piezoelectric
fibers and method for active structural
matthew eisenbacher, jason j fink,
chris e geswender, james d streeter,
matthew a zamora
8049149 methods and apparatus for air brake retention and
deployment
kenneth w brown
8049173 dual use RF directed energy weapon and imager
james l fulcomer
8049529 fault triggered automatic redundancy scrubber
mark frank, devin b pratt, marty k rupp
8049663 hardware compensating pulse compression filter system
and method
dwight l denney, daniel j mosier, john yoon
8049870 a semi-active optical tracking system
eric c fest
8049889 switchable imaging polarimeter and method
james whitty
8049974 method and apparatus for accurately aligning optical
components
alexander a betin, wei liu, michael locascio,
kalin spariosu
8050303 lasers based on quantum dot activated media with forster resonant energy transfer excitation
dan varon
8050807 methods and apparatus for vertical motion detector for
air traffic control
philip c theriault
8051666 microporous graphite foam and process for producing
same
stephen jacobsen, marc olivier
8051764 fluid control system having selective recruitable actuators
robert a bailey, david howard
8051776 self-cleaning cartridge actuated and propellant actuated
devices
sarah graber, roy p mcmahon
8052444 latching release system for connector assembly
thomas k dougherty, john j drab
8053251 temperature-compensated ferroelectric capacitor device,
and its fabrication
david chang, jar j lee, terence de lyon,
michael a gritz, deborah kirby, metin mangir,
jeffery j puschell, james schaffner
8053734 nano-antenna for wideband coherent conformal IR
detector arrays
ivan s ashcraft, donald p bruyere,
john b treece
8054217 radar imaging system and method using gradient
magnitude second moment spatial variance detection
david r bishop, brian w johansen, james a
pruett, gary f wahlquist, kuang-yuh wu
8054239 honeycomb-backed armored radome
frank n cheung, richard chin,
hector q gonzalez
8054344 imaging system and method with intelligent digital
zoom
william g wyatt
8055453 sensing and estimating in-leakage air in a subambient
cooling system
terry chacon, allan r topp
8055521 optimized component selection for project completion
jon d johnson, scott r oksanen,
brian n smith
8055970 system and method for parallel processing of data
integrity algorithms
john r staley
8056281 device with multiple sights for respective different
munitions
stephen jacobsen, tomasz j petelenz
8056391 digital wound detection system
david e bossert, ray sampson, jeffrey n zerbe
8056461 methods and apparatus for marine deployment
bryan berlin, kim l christianson
8056478 methods and apparatus for high-impulse fuze booster
for insensitive munitions
rudy a eisentraut, brian j gowler
terry m sanderson
8056853 reconfigurable wing and method of use
wing cheng, frederick b koehler
8056858 device and method for providing radiation occlusion and
aero-thermal protection
frederick t davidson, carlos e garcia,
james small
8056860 method and apparatus for inflight refueling of
unmanned aerial vehicles
frederick b koehler, ward d lyman,
terry m sanderson
8058595 collapsible shape memory alloy (SMA) nose cones for air
vehicles, method of manufacture and use
james m cook, lloyd kinsey jr
8058596 method of controlling missile flight using attitude control
thrusters
chris e geswender
8058597 low cost deployment system and method for airborne object
john witzel
8058875 detection of ground-laid wire using ultraviolet c-band
radiation
lawrence w tiffin
8058946 circuit module with non-contacting microwave interlayer
interconnect
james irion ii, brian w johansen
8058957 magnetic interconnection device
Clifton Quan, Fangchou Yang
8059049 dual band active array antenna
john bedinger, james mason, s rajendran
8059057 reduced inductance interconnect for enhanced
microwave and millineter-wave systems
michael r benoit, robert d oshea
8059254 transparent heatsink/structure/interconnect for tiling
space based optical components
douglas brown, geoff harris, daniel mitchell
8059338 variation-tolerant designs for dome coating
david g manzi
8059695 spread carrier self correcting codes
marion p hensley
8060006 counter-intelligence signal enabled communication device
stephen jacobsen
8061261 antagonistic fluid control system for active and passive
actuator operation
christopher gintz, graham gintz, jerry m
grimm, timothy j imholt, james a pruett
8062554 system and methods of dispersion of nanostructures in
composite materials
bruce w chignola, david j katz, dennis r
kling, jorge m marcial, leonard schaper
8067833 low noise high thermal conductivity mixed signal
package background of the invention
qin jiang
8068385 system and method for enhancing weak target signals
for a sensor array
edgar r melkers
8069790 methods and apparatus for attachment adapter for a
projectile
larinn hilgemann, david g jenkins, daniel r
melonis, michael p schaub
8071927 methods and systems for wave guides
chris e geswender, shawn b harline,
nicholas e kosinski
8071928 projectile with filler material between fins and fuselage
jacqueline m bourgeois, boris s jacobson
8072093 intelligent power system
steven cotton, benjamin dolgin, luis giraldo,
john ishibashi, kenneth d kuck, craig e matter
8072220 positioning, detection and communication system and
method
david d crouch
8072380 wireless power transmission system and method
adam cherrill, quenten e duden, andrew b
facciano, brian j gowler, james l kinzie,
blake r tennison
8074516 methods and apparatus for non-axisymmetric radome
timothy j imholt, michael noland,
alexander st. claire
8074552 flyer plate armor systems and methods
richard dryer
8076623 projectile control device
boris s jacobson
8076967 integrated smart power switch
kenneth w brown, james r gallivan,
reid f lowell
8077087 methods and apparatus for a phased array
raphael welsh
8077112 collapsible tri-axial frame antenna
inuka d dissanayake, donald m hughes
8080085 methods and apparatus for an ionizer
kenton veeder
8080775 differential source follower source leader pixel readout
ronald azuma, timothy clausner
8081088 method and apparatus for apportioning attention to
status indicators
david d crouch, william e dolash
8081115 wideband power-combining multi-port patch antenna
kaichiang chang, sharon a elsworth,
marvin i fredberg, dean m pichon, michael g
sarcione, richard warnock
8081137 air-supported sandwich radome
delmar l barker, kenneth l moore,
william richard owens
8082844 acoustic crystal explosives
david a adang, andrew b facciano,
nigel b flahart, gregg j hlavacek
8082848 missile with system for separating subvehicles
kenneth gerber, robert ginn
8084288 method of construction of cte matching structure with
wafer processing and resulting structure
r. glenn brosch, thomas m crawford,
kent p pflibsen, darin s williams
8084724 enhanced multiple kill vehicle (mkv) interceptor for intercepting exo and endo-atmospheric targets
richard dryer
8084725 methods and apparatus for fast action impulse thrusters
bryan w kean, john l vampola
8084730 dual mode source follower for low and high sensitivity
applications
charles bradley ii
8085937 system and method for securing calls between endpoints
william h davis, lee a mcmillan,
john h vanpatten
8086187 developing and analyzing a communication system
International
Patents Issued to Raytheon
Titles are those on the U.S.-filed patents; actual titles
on foreign counterparts are sometimes modified and
not recorded. While we strive to list current international patents, many foreign patents issue much later
than corresponding U.S. patents and may not yet be
reflected.
australia
2008206296 apparatus and method for controlling transmission
through a photonic bandgap crystal
neal m conrardy, richard dryer
2006338042 methods and apparatus for selectable velocity projectile system
patric m mcguire
2008287308 methods and apparatus for selecting a target from
radar tracking data
kenneth j mcphillips, arnold w novick
2007259330 methods and systems for passive range and depth
localization
russell berg, kenneth w brown, david j canich
2007344661 multifunctional radio frequency directed energy
system
michael r johnson, bruce e peoples
2007240937 multilingual data querying
charles anthony ashcroft, colin law
2006272431 trustworthy optomechanical switch
australia, japan
randy c barnhart, craig s kloosterman,
melinda c milani, donald v schnaidt,
steven talcott
data handling in a distributed communication network
belgium, germany, uk
phillip a cox, james florence
1774250 electronic sight for firearm, and method of operating same
brazil
roy p mcmahon
0206573-8 electrical cable having an organized signal placement
and its preparation
canada
george bortnyk
2398057 combining signal images in accordance with signal-tonoise ratios
kwang cho, leo h hui
2606113 efficient autofocus method for swath SAR
james florence, clay e towery
2591009 method and apparatus for safe operation of an
electronic firearm sight
james florence, clay e towery
2591001 method and apparatus for safe operation of an electronic
firearm sight depending upon the detection of a selected color
roderick bergstedt, lee a mcmillan,
robert streeter
2399096 microelectromechanical micro-relay with liquid metal
contacts
khiem cai, samuel kent iii, lloyd linder
2500533 mixed technology mems/sige bicmos digitizing analog
front end with direct RF sampling
ira r feldman, paul moosie, brian e patno
2555275 mobile enforcement reader
frederick frodyma, michelle estaphan owen,
guy railey, daniel viccione
2508206 sonar array system
shannon davidson, anthony richoux
2503777 system and method for topology-aware job scheduling
and backfilling in an hpc environment
aryeh platzker, douglas teeter
2376767 transistor amplifier having reduced parasitic oscillations
romulo j broas, william henderson,
robert t lewis, ralston s robertson
2573893 transverse device array radiator ESA
canada, france, germany, netherlands,
sweden, uk
james l langston, james martin
2307778, 1826920, wireless communication using an airborne
switching node
china
boris s jacobson
200680010862.6 integrated smart power switch
john bedinger, james mason, s rajendran
200680020042.5 reduced inductance interconnect for enhanced
microwave and millimeter-wave systems
fernando beltran, joseph p biondi,
ronni j cavener, robert cummings,
james mcguinnis, thomas v sikina,
keith d trott, erden yurteri
200480019899.6 wideband phased array radiator
czech republic, france, germany, italy, spain, uk
eli brookner, jian wang
2078213 a moving target detector for radar systems
denmark, france, germany, italy, netherlands,
spain, sweden, uk
lloyd linder
1604458 mixed technology mems/bicmos lc bandpass sigma-delta
for direct RF sampling
france, germany, italy, japan, uk
boris s jacobson
2013956 regenerative gate drive circuit for power mosfet
france, germany, italy, spain, uk
george f barson, jim haws, richard m weber
1599081 thermal management system and method for electronic
equipment mounted on coldplates
france, germany, italy, uk
bruce w chignola, christopher cotton,
dennis r kling
1123565 embedded capacitor multi-chip modules
edward i holmes, prisco tammaro
1957837 radiation limiting opening for a structure
david j knapp, dean marshall
2018572 refractive compact range
stephen jacobsen
2099672 tracked robotic crawler having a moveable arm
ernest c faccini, richard m lloyd
1502075 warhead with aligned projectiles
kenneth w brown, reid f lowell,
alan rattray, a-lan v reynolds
1922522 weapon having lethal and non-lethal directed-energy
portions
anthony s carrara, paul a danello,
joseph mirabile
1471813 wedgelock system
france, germany, singapore, uk
timothy j glahn, robert kurtz jr
2033502, 148472 passive conductive cooling module
france, germany, spain, sweden, uk
tahir hussain, mary montes
1464079 ion-implantation and shallow etching to produce effective
edge termination in high-voltage heterojunction biploar transistors
france, germany, uk
ronald richardson, kuang-yuh wu
1796210 broadband ballistic resistant radome
lacy g cook, howard de ruyter, eric m moskun
2244076, 2244077, 2205951 calibration source infrared assembly
for an infrared detector
brian a adams, thomas l parker,
timothy d smith, matthew r yeager
2206030 checklist administration system for a vehicle
lee j huniu
1488632 display uniformity calibration system and method for a
staring forward looking infrared sensor
angel crespo, james mason,
rafael r quintero, joseph a robson,
jonathan j schmidt, james s wilson
2084484 hermetic covering system for a missile radome
robert c gibbons
2073191 imaging system
mark s hauhe, clifton quan, rohn sauer,
gregg m tanakaya, fangchou yang
2230715 light weight stowable phased array lens antenna assembly
michael g adlerstein, thomas e kazior,
steven m lardizabal,
christopher p mccarroll, jerome h pozgay
1902467 mmic back-side multi-layer signal routing
david d crouch, william e dolash,
michael j sotelo
1776737 multiple-port patch antenna
john bedinger, robert b hallock,
michael a moore, kamal tabatabaie
2118926 passivation layer for a circuit device and method of
manufacture
gerald l ehlers, charles lepple, aaron watts
1728192 personal authentication device
billy d ables, s rajendran
2209582 system for forming a conductive pattern on a multidimensional surface
patrick hogan, ralph korenstein, john mccloy
2176195 treatment method for optically transmissive body
germany
john crockett, timothy d keesey,
colleen tallman, james treinen,
david t winslow
1649551 offset connector with compressible conductor
india
michael brennan, benjamin dolgin,
luis giraldo, john hill iii, david koch,
mark lombardo, joram shenhar
249089 drilling apparatus, method, and system
israel
john cangeme, david manoogian,
gerald m pitstick
188409 a method of generating accurate estimates of azimuth
and elevation angles of a target for a phased-phased array
rotating radar
boris s jacobson
184796 integrated smart power switch
richard m lloyd
167145 kinetic energy rod warhead with isotropic firing of the
projectiles
gary a frazier
175991 method and apparatus for detecting radiation at one
wavelength using a detector for a different wavelength
christopher fletcher, andrew g toth
184208 method for fabricating a high performance pin focal plane
structure using three handle wafers
daniel chasman, andrew b facciano,
stephen d haight
166981 missile control system and method
george a blaha, chris e geswender,
shawn b harline
169563 missile with odd symmetry tail fins
michael l wells
168405 modern thermal sensor upgrade for existing missile system
alexander a betin, kalin spariosu
180485 solid-state suspension laser generation utilizing separate
excitation and extraction
paul h grobert
179593 system and method for dynamic weight processing
john s anderson, chungte chen
185162 two f-number, two-color sensor system
israel, south korea
anthony o lee, christopher roth,
philip c theriault
182529, 10-1099825 adjustable optical mounting
stephen hershey, william su
172680, 10-1050037 distributed dynamic channel selection in a
communication network
japan
carl kirkconnell, kenneth price
4824256 apparatus and method for achieving temperature
stability in a two-stage cryocooler
michael j delcheccolo, delbert lippert,
herman van rees, mark e russell ,
walter g woodington
4855647 docking information system for boats
frank n cheung
4838120 efficient memory controller
john mosca, william e hoke
4875701 gallium nitride high electron mobility transistor structure
mary oneil
4773038 method and apparatus for aircraft protection against
missile threats
robert e leoni
4804477 optical link
thomas w miller, christopher reed
4855633 phase stabilization in adaptive arrays
william croft, carl kirkconnell,
kenneth price, alberto e schroth
4741484 pulse tube expander having a porous plug phase shifter
gerald cox, mark s hauhe,
stan w livingston, clifton quan,
anita l reinehr, colleen tallman,
yanmin zhang
4787248 radiator structures
katherine j herrick
4856078 reflect antenna
kenneth w brown, james r gallivan
4782690 selective layer millimeter-wave surface-heated system
and method
4856173 smith-purcell radiation source using negative-index
metamaterial
james ballew, shannon davidson,
anthony richoux
4833965 system and method for cluster management based on
HPC architecture
thomas w miller, christopher reed
4790986 system and method for subband beamforming using
adaptive weight normalization
kenneth w brown, vincent giancola
4886071 systems and methods for waveguides
michael a moore, james s wilson
4871597 thermal management system and method for
electronic assemblies
steven g buczek, stuart coppedge,
alec ekmekji, shahrokh hashemi-yeganeh,
william milroy
4856164 true-time-delay feed network for cts array
charles stallard, william h wellman
4824548 window mounting for optical sensor
mexico
daniel floyd, douglas hall
287648 method and apparatuses for squelch break signaling
device to provide session initiation protocol
steven cotton, benjamin dolgin,
michael shore
287742 positioning system and method
norway
timothy clausner, phillip kellman,
evan palmer
330836 system and method for representation of aircraft altitude
using spatial size and other natural perceptual cues
south korea
john m bergeron, carl e buczala,
shelley rosenbaum lipman,
jonathan t longley, stephen v olizarowicz,
kjetil sevre, vidar skjelstad, joseph c spicer,
corrine st jean
10-1094426 computting vehicle with integrated operator workspace
martin cohen, namir w habboosh
10-1088060 digital switching power amplifier
marwan krunz, phillip rosengard
10-1100005 encapsulating packets into a frame for a network
robert p enzmann, fritz steudel,
george thome
10-1088053 system and method for coherently combining a
plurality of radars
reza tayrani
10-1058994 two stage microwave class e power amplifier
taiwan
boris s jacobson, john mcginty,
paul c thomas
347071 method and apparatus for a power system phased array
radar
john selin
350651 quadrature offset power amplifier
united kingdom
monty d mcdougal, jason e ostermann,
william e sterns
2456868 configurable data access application for highly secure
systems
monty d mcdougal, jason e ostermann,
william e sterns
2453888 method and system for controlling the release of data for
multiple-level security systems
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